Flexible display panel and manufacturing method thereof and electronic device

Abstract

The embodiment of the present application provides a flexible display panel and a method for manufacturing the same, and an electronic device. The flexible display panel includes a flexible substrate and a chip disposed on the flexible substrate; the chip has a first pin and a second pin, the first pin and the second pin are respectively located on opposite sides of the chip; a support portion is provided on a side of the flexible substrate close to the chip, the support portion is located between the first pin and the second pin.

Description

Technical Field

[0001] The present application belongs to the field of communication technology, and specifically relates to a flexible display panel, a preparation method thereof, and an electronic device. Background Art

[0002] With the continuous development of electronic equipment technology, the functions of electronic equipment hardware are increasing. Among them, display screen modules include flexible display panels, which have advantages such as good flexibility, durability and lightness, and are increasingly widely used in electronic equipment.

[0003] In the prior art, a flexible display panel includes a flexible substrate and an IC (Integrated Circuit) chip. The IC chip is provided with a first pin and a second pin spaced apart, and the flexible substrate is provided with a display screen circuit, and the first pin and the second pin are respectively electrically connected to the display screen circuit to realize signal transmission between the flexible substrate and the IC chip. However, the inventors found in the process of studying the prior art that since the first pin and the second pin of the IC chip are spaced apart from each other to form a gap, in the process of assembling the IC chip on the flexible substrate through a hot pressing process, the flexible substrate is easily sunken in the gap to form wrinkles, causing the flexible substrate to rupture and damage, seriously affecting the function of the flexible display panel. Summary of the invention

[0004] In view of the above problems, the present invention is proposed to provide a flexible display panel and a method for preparing the same, and an electronic device that overcome the above problems or at least partially solve the above problems.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a flexible display panel, comprising a flexible substrate and a chip disposed on the flexible substrate;

[0007] The chip has a first pin and a second pin, and the first pin and the second pin are respectively located at two opposite sides of the chip;

[0008] A support portion is provided on a side of the flexible substrate close to the chip, and the support portion is located between the first pin and the second pin.

[0009] In a second aspect, an embodiment of the present application provides an electronic device, which includes the flexible display panel.

[0010] In a third aspect, an embodiment of the present application provides a method for preparing a flexible display panel, which is used to prepare the flexible display panel. The method comprises:

[0011] Forming the support portion on the flexible substrate by injection molding or photomask process;

[0012] The chip is fixed on the flexible substrate through the first pin and the second pin, so that the supporting part is located between the first pin and the second pin.

[0013] In an embodiment of the present application, the flexible display panel includes a flexible substrate and a chip arranged on the flexible substrate; the chip has a first pin and a second pin, and the first pin and the second pin are respectively located on opposite sides of the chip; a support portion is provided on a side of the flexible substrate close to the chip, and the support portion is located between the first pin and the second pin. By providing a support portion on the flexible substrate, the gap formed between the first pin and the second pin arranged on opposite sides of the chip can support the flexible substrate through the support portion. This avoids the flexible substrate from being easily sunken in the gap to form wrinkles during the process of assembling the chip on the flexible substrate through a hot pressing process, thereby avoiding the flexible substrate from being broken and damaged. In addition, the technical solution adopted in the present application is simple and convenient, easy to operate and implement, highly feasible, and low in cost.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 This is one of the structural schematic diagrams of a flexible display panel described in an embodiment of the present application;

[0017] Figure 2 This is the second structural schematic diagram of a flexible display panel described in an embodiment of the present application;

[0018] Figure 3 is a schematic diagram of a cross-sectional structure of a flexible display panel according to an embodiment of the present application (wherein the arrow indicates the direction of heat pressing);

[0019] Figure 4 is a schematic diagram of a cross-sectional structure of a flexible substrate described in an embodiment of the present application;

[0020] Figure 5 This is one of the partial structural schematic diagrams of a flexible substrate described in an embodiment of the present application;

[0021] Figure 6 This is the second partial structural schematic diagram of a flexible substrate described in an embodiment of the present application;

[0022] Figure 7 It is a schematic diagram of a partial structure of a chip described in an embodiment of the present application;

[0023] Figure 8 It is one of the partial top views of a flexible substrate described in an embodiment of the present application;

[0024] Fig. 9 This is a second partial top view of a flexible substrate described in an embodiment of the present application;

[0025] Fig.10 This is a third partial top view of a flexible substrate described in an embodiment of the present application.

[0026] Reference numerals: 100 - flexible substrate; 200 - chip; 210 - first pin; 220 - second pin; 110 - wire structure; 130 - support portion; A - first direction; B - second direction; 120 - first pad; 140 - second pad. DETAILED DESCRIPTION

[0027] Embodiments of the present invention will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0028] The term "first" or "second" in the specification and claims of the present application may include one or more of the features explicitly or implicitly. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0029] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Reference Figures 1 to 10 , shows a schematic structural diagram of a flexible display panel according to an embodiment of the present application, which may specifically include: a flexible substrate 100 and a chip 200 disposed on the flexible substrate 100;

[0032] The chip 200 is provided with a first pin 210 and a second pin 220 arranged at intervals. The first pin 210 and the second pin 220 are respectively located at opposite sides of the chip 200 and at least partially protrude from the surface of the chip 200.

[0033] A support portion 130 is disposed on one side of the flexible substrate 100 close to the chip 200 . The support portion 130 is located between the first pin 210 and the second pin 220 .

[0034] In the embodiment of the present application, by providing a support portion 130 on the flexible substrate 100, the gap formed between the second pin 220 and the first pin 210 provided on opposite sides of the chip 200 can support the flexible substrate 100 through the support portion 130. This avoids the flexible substrate 100 from being easily sunken in the gap to form wrinkles during the process of assembling the chip 200 on the flexible substrate 100 through a hot pressing process, thereby avoiding the flexible substrate 100 from being broken or damaged. In addition, the technical solution adopted in the present application is simple and convenient, easy to operate and implement, highly feasible, and low in cost.

[0035] In the embodiment of the present application, the support portion 130 can be directly injection molded on the side of the flexible substrate 100 close to the chip 200. In addition, the side of the flexible substrate 100 close to the chip 200 can also be exposed, developed, and etched to form the support portion 130. Specifically, the remaining portion of the flexible substrate 100 except the support portion 130 can be thinned to obtain the support portion 130. The embodiment of the present application does not limit the specific formation method of the support portion 130.

[0036] Specifically, in the embodiment of the present application, the wire structure 110 may be embedded in the flexible substrate 100. Specifically, the wire structure 110 may include an input line and an output line, the output line is provided with an output line end, and the output line end is connected to the first pin 210 of the chip 200. The input line is provided with an input line end, and the input line end is connected to the second pin 220 of the chip 200.

[0037] In the embodiment of the present application, for example, there are multiple output circuits, and the multiple output circuits are spaced apart on the flexible substrate 100 along the first direction A, and there are multiple first pins 210, and the multiple first pins 210 are spaced apart on the chip 200 along the first direction A, wherein one output circuit is connected to one first pin 210. There are multiple input circuits, and the multiple input circuits are spaced apart on the flexible substrate 100 along the first direction A, and there are multiple second pins 220, and the multiple second pins 220 are spaced apart on the chip 200 along the first direction A, wherein one input circuit is connected to one second pin 220. Thus, a better circuit transmission effect is achieved between the chip 200 and the flexible substrate 100.

[0038] In the embodiment of the present application, the chip 200 is an IC (Integrated Circuit) chip 200. For example, the material of the first pin 210 and the second pin 220 on the chip 200 can be metal, such as copper, silver, etc., and the embodiment of the present application does not limit the specific material of the first pin 210 and the second pin 220.

[0039] Optionally, in the embodiments of the present application, Figure 5 and Figure 6 As shown, the flexible substrate 100 is provided with a first pad 120 corresponding to the first pin 210, and the first pad 120 is used to be soldered with the first pin 210. The flexible substrate 100 is also provided with a second pad 140 corresponding to the second pin 220, and the second pad 140 is used to be soldered with the second pin 220, so as to achieve electrical connection between the flexible substrate 100 and the chip 200.

[0040] Specifically, in the embodiment of the present application, a first protective layer is provided at one end of the flexible substrate 100, a second protective layer is provided at the other end of the flexible substrate 100, and the chip 200 is provided at a side of the other end of the flexible substrate 100 away from the second protective layer. The first protective layer and the second protective layer protect both ends of the flexible substrate 100.

[0041] In the embodiment of the present application, the flexible display panel may further include a protective layer, and the protective layer is connected to a side of the first protective layer away from the flexible substrate 100. When the flexible substrate 100 is assembled in a bent state, Figure 2 As shown by Figure 1 The central symmetry axis of the flexible substrate is rotated 180° counterclockwise to the left to obtain Figure 2 , the second protective layer is connected to the protective layer, that is, the protective layer is connected between the first protective layer and the second protective layer, so as to provide a buffer and protection effect to the first protective layer and the second protective layer, and avoid friction loss caused by direct contact between the first protective layer and the second protective layer. For example, the protective layer can be made of plastic foam or silica gel, and the specific material of the protective layer is not limited in the embodiment of the present application.

[0042] In some optional embodiments of the present application, a protective film, a glass cover plate or other structures may be provided on the side of the flexible substrate 100 away from the first protective layer to protect the flexible substrate 100, so that it has a better display effect and a longer service life. The present application embodiment may not limit this.

[0043] Optionally, in the embodiment of the present application, the support portion 130 protrudes from the flexible substrate 100, and the support portion 130 abuts against the chip 200. In this way, the protruding support portion 130 can provide a more stable support for the chip 200, thereby enhancing the structural strength of the flexible display panel.

[0044] In the embodiment of the present application, optionally, a plurality of spaced support portions 130 are provided on one side of the flexible substrate 100 close to the chip 200. In this way, the contact area between the support portion 130 and the chip 200 can be increased by the plurality of spaced support portions 130, thereby achieving a better support effect for the chip 200.

[0045] In some optional embodiments of the present application, the support portion 130 extends along the length direction of the chip 200; and / or, the support portion 130 is located between the first pin 210 and the second pin 220. In this way, the support portion 130 can have a variety of settings, enriching its layout style. The support portion 130 can extend along the length direction of the chip 200 to form a long strip support portion, which supports a continuous portion of the chip 200 over a larger range and improves its support stability. The support portion 130 can also be located between the first pin 210 and the second pin 220, and the support portion 130 supports the middle position of the first pin 210 and the second pin 220 on the chip 200, so that the support of the chip 200 is more symmetrical and has a better support effect. In some embodiments, the distance between the support portion 130 and the first pin 210 is equal to the distance between the support portion 130 and the second pin 220.

[0046] Optionally, in the embodiment of the present application, the support portion 130 includes a flexible material, a wire structure 110 or an electronic component is provided on the flexible substrate 100, and at least a portion of the wire structure 110 or the electronic component is located between the first pin 210 and the second pin 220. The flexible support portion 130 can buffer the wire structure 110 or the electronic component on the flexible substrate 100 during the hot pressing process, and protect the wire structure 110 or the electronic component from being compressed and damaged.

[0047] Specifically, in the embodiment of the present application, the support portion 130 can be offset against the wire structure 110, and the support portion 130 can be offset against the electronic component, so that the support portion 130 has a better protection effect on the wire structure 110 or the electronic component located between the first pin 210 and the second pin 220.

[0048] For example, the flexible material can be one of polyimide (PI) and polyethylene terephthalate (PET). The above material is flexible, so that the support part 130 can provide support for the chip 200 while also providing a good buffering effect for the chip 200. When the chip 200 is assembled on the flexible substrate 100 through a hot pressing process, the flexible support part 130 can undergo a certain deformation to provide a buffering effect, thereby preventing the pressure of the chip 200 from causing the wire structure 110 to break.

[0049] Optionally, in an embodiment of the present application, the support portion 130 is integrally provided with the flexible substrate 100; or, the support portion 130 is detachably connected to the flexible substrate 100, and the portion of the support portion 130 close to the flexible substrate 100 is made of flexible material. In this way, there can be a variety of connection methods between the support portion 130 and the flexible substrate 100, which enriches the setting method of the support portion 130. The support portion 130 is integrally provided with the flexible substrate 100, that is, the support portion 130 and the flexible substrate 100 are an integrally formed structure. The connection strength between the flexible substrate 100 and the support portion 130 can be made higher, and the material loss and manufacturing process can be reduced. The support portion 130 is detachably connected to the flexible substrate 100, that is, the support portion 130 and the flexible substrate 100 are a split structure, so that the connection method between the support portion 130 and the flexible substrate 100 is flexible and adjustable, easy to implement, and simple to operate. For example, the support portion 130 may be connected to the flexible substrate 100 by bonding or clamping, and the embodiment of the present application may not limit the specific connection method between the support portion 130 and the flexible substrate 100.

[0050] In the present application, the support portion 130 can provide a buffering effect in addition to providing support for the chip 200. Specifically, since the support portion 130 on the flexible substrate 100 is also flexible, when the chip 200 is assembled on the flexible substrate 100 through a hot pressing process, the flexible support portion 130 can be deformed to a certain extent to play a buffering role, thereby preventing the pressure of the chip 200 from causing the wire structure 110 to break. In an embodiment of the present application, optionally, the multiple support portions 130 are arranged at intervals along the first direction A, the support portion 130 extends along the second direction B, and the first direction A and the second direction B are arranged at an angle. In this way, the chip 200 can be supported in multiple directions by multiple support portions 130, and the material consumption of the support portion 130 can be reduced. At the same time, each support portion 130 extends along the second direction B, and the first direction A and the second direction B are arranged at an angle, which can increase the contact area between the support portion 130 and the chip 200, increase the force position of the support portion 130, and make the support portion 130 have a better support effect on the chip 200.

[0051] For example, in the embodiments of the present application, the angle between the first direction A and the second direction B can be 90°, or 60°, 75°, etc. The pump application embodiment does not limit the specific value of the angle between the first direction A and the second direction B.

[0052] Optionally, in the embodiment of the present application, the shape of the positive projection of the support portion 130 on the flexible substrate 100 includes at least one of a rectangle, a parallelogram, a trapezoid and a wave shape. In this way, the contact area between the support portion 130 and the chip 200 can be increased, so that the flexible substrate 100 is subjected to uniform force during the hot pressing process, the pressure on the flexible substrate 100 is reduced, and the risk of the flexible substrate 100 being easily wrinkled and broken is further reduced. In addition, the multiple support portions 130 can also include at least two of a rectangular support portion, a parallelogram support portion, a trapezoidal support portion and a wave-shaped support portion, thereby increasing the support of the multiple support portions of the flexible substrate for forces in various directions during the hot pressing process.

[0053] like Figure 8 , showing the case where the cross-sectional shape of the support portion 130 is a rectangle. Fig. 9 , shows the case where the cross-sectional shape of the support portion 130 is a parallelogram. That is, the support portion 130 is a parallelogram support column, so that the contact area between the support portion 130 and the chip 200 can be increased within a limited space, and the pressure on the surface of the flexible substrate 100 during the hot pressing process can be reduced. Moreover, under the condition of the same contact area, the extension length of the parallelogram support portion in the first direction is longer than that of the rectangle, which is beneficial to improving the support reliability of the support portion for the force in the first direction. For example, Fig. 9As shown, the setting area of ​​the parallelogram support column may include a first area and a second area, and the inclination direction of the parallelogram support column in the first area is different from the inclination direction of the parallelogram support column in the second area, further improving the supporting effect and enhancing the structural strength of the flexible display panel.

[0054] like Fig.10 , showing the case where the cross-sectional shape of the support portion 130 is wavy. That is, the support portion 130 is a wavy support column, and the center point of the wavy support column is on the perpendicular midline of the line connecting the first pin 210 and the second pin 220. In this way, the force problem at the center of the chip 200 can be optimized, so that the force on the flexible substrate 100 is uniform during the hot pressing process, and the force on the lateral side of the chip 200 is more uniform, further reducing the risk of the flexible substrate 100 being easily damaged by wrinkles.

[0055] For example, in the embodiment of the present application, among the plurality of support portions 130, the spacing between two adjacent support portions 130 is any value in the range of 0-200 microns. In this way, a suitable spacing can be provided between two adjacent support portions 130 to provide a better structural support effect for the chip 200. The spacing between two adjacent support portions 130 can be 80 microns, 100 microns, 150 microns or 200 microns, and the embodiment of the present application does not limit the specific spacing between two adjacent support portions 130.

[0056] For example, in the embodiment of the present application, the height of the support portion 130 protruding from the surface of the flexible substrate 100 is any value between 30 and 60 microns. This allows the support portion 130 to abut against the chip 200, providing a better support for the chip 200, and making the protruding height of the support portion 130 more appropriate. For example, the height of the support portion 130 protruding from the surface of the flexible substrate 100 is 30 microns, 45 microns, 50 microns or 60 microns. In practical applications, it can be set according to the distance between the surface of the chip 200 and the surface of the flexible substrate 100. The embodiment of the present application does not limit the specific height value of the support portion 130 protruding from the surface of the flexible substrate 100.

[0057] In summary, the flexible display panel described in the embodiments of the present application may at least include the following advantages:

[0058] In an embodiment of the present application, the flexible display panel includes a flexible substrate and a chip disposed on the flexible substrate; the chip has a first pin and a second pin, and the first pin and the second pin are respectively located on opposite sides of the chip; a support portion is provided on a side of the flexible substrate close to the chip, and the support portion is located between the first pin and the second pin. In this way, by providing a support portion on the flexible substrate, the gap formed between the first pin and the second pin disposed on opposite sides of the chip can support the flexible substrate through the support portion. This avoids the flexible substrate from being easily sunken in the gap to form wrinkles during the process of assembling the chip on the flexible substrate through a hot pressing process, thereby avoiding the flexible substrate from being broken and damaged. In addition, the technical solution adopted in the present application is simple and convenient, easy to operate and implement, highly feasible, and low in cost.

[0059] An embodiment of the present application provides an electronic device, which includes the flexible display panel.

[0060] In an embodiment of the present application, the electronic device may include but is not limited to any one of a mobile phone, a tablet computer and a wearable device, and can also be applied to scenarios such as folding screens. The embodiment of the present application may not limit the specific type of the electronic device.

[0061] The electronic device described in the embodiments of the present application may at least have the following advantages:

[0062] In an embodiment of the present application, the electronic device includes the flexible display panel, the flexible display panel includes a flexible substrate and a chip arranged on the flexible substrate; the chip has a first pin and a second pin, the first pin and the second pin are respectively located on opposite sides of the chip; the flexible substrate is provided with a support portion on one side close to the chip, the support portion is located between the first pin and the second pin. In this way, by providing a support portion on the flexible substrate, the gap formed between the first pin and the second pin arranged on opposite sides of the chip can support the flexible substrate through the support portion. This avoids the flexible substrate from being easily sunken in the gap to form wrinkles during the process of assembling the chip on the flexible substrate through a hot pressing process, and avoids the flexible substrate from being broken and damaged. In addition, the technical solution adopted in the present application is simple and convenient, easy to operate and implement, highly feasible, and low in cost.

[0063] The embodiment of the present application also proposes a method for preparing a flexible display panel, which is used to prepare the flexible display panel, and the method comprises: forming a support portion 130 on a flexible substrate 100 by injection molding or a photomask process; fixing a chip 200 on the flexible substrate 100 by a first pin 210 and a second pin 220, so that the support portion 130 is located between the first pin 210 and the second pin 220. In this way, the support portion 130 supports the area between the first pin 210 and the second pin 220 of the chip 200, enhances its structural strength, prevents the flexible substrate 100 from being easily sunken in the gap between the first pin 210 and the second pin 220 to form wrinkles, and prevents the flexible substrate 100 from being broken or damaged.

[0064] For example, in the embodiment of the present application, the flexible substrate 100 may be exposed by exposure, development, and etching, and then the position and shape of the support portion 130 may be developed, and the remaining portion of the flexible substrate 100 at the position of the support portion 130 may be removed by etching to obtain the flexible substrate 100 having the support portion 130. In this way, the support portion 130 may be obtained by thinning the remaining portion of the flexible substrate 100 at the position of the support portion 130. The height of the support portion 130 may generally be 50 microns, or may be 60 microns, 45 microns, and so on. In addition, after the flexible substrate 100 is packaged with a circuit, the support portion 130 may be injection molded on the surface of the flexible substrate 100 so that the support portion 130 may realize a structural function of supporting the chip 200.

[0065] In summary, the method for preparing the flexible display panel described in the embodiment of the present application has at least the following advantages:

[0066] In an embodiment of the present application, the method for preparing the flexible display panel is used to prepare the flexible display panel, and the method comprises: forming the support portion on the flexible substrate by injection molding or photomask process; fixing the chip on the flexible substrate through the first pin and the second pin, so that the support portion is located between the first pin and the second pin. In this way, by providing the support portion on the flexible substrate, the gap formed between the first pin and the second pin provided on the opposite sides of the chip can support the flexible substrate through the support portion. This avoids the flexible substrate from being easily sunken in the gap to form wrinkles during the process of assembling the chip on the flexible substrate through the hot pressing process, and avoids the flexible substrate from being broken and damaged. In addition, the technical solution adopted in the present application is simple and convenient, easy to operate and implement, highly feasible, and low in cost.

[0067] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0068] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A flexible display panel, characterized in that: It comprises a flexible substrate and a chip arranged on the flexible substrate; The chip has a first pin and a second pin, and the first pin and the second pin are respectively located at two opposite sides of the chip; A support portion is provided on a side of the flexible substrate close to the chip, and the support portion is located between the first pin and the second pin; The support portion protrudes from the flexible substrate, and the support portion abuts against the chip; The support portion comprises a flexible material, a conductor structure or an electronic component is arranged on the flexible substrate, the support portion abuts against the conductor structure, and the support portion abuts against the electronic component.

2. The flexible display panel according to claim 1, characterized in that: A plurality of support parts distributed at intervals are arranged on one side of the flexible substrate close to the chip.

3. The flexible display panel according to claim 1, characterized in that: The supporting portion extends along the length direction of the chip; and / or The supporting portion is located between the first pin and the second pin.

4. The flexible display panel according to claim 1, characterized in that: At least a portion of the conductor structure or the electronic component is located between the first pin and the second pin.

5. The flexible display panel according to claim 1, characterized in that: The support portion is integrally provided with the flexible substrate; or The support part is detachably connected to the flexible substrate, and a portion of the support part close to the flexible substrate is made of flexible material.

6. The flexible display panel according to claim 2, characterized in that: The plurality of support portions are arranged at intervals along a first direction, the support portion extends along a second direction, and the first direction and the second direction are arranged at an angle.

7. The flexible display panel according to claim 1, characterized in that: The shape of the orthographic projection of the support portion on the flexible substrate includes at least one of a rectangle, a parallelogram, a trapezoid and a wave.

8. An electronic device, characterized in that: The electronic device comprises the flexible display panel according to any one of claims 1 to 7.

9. A method for preparing a flexible display panel, characterized in that: For preparing a flexible display panel according to any one of claims 1 to 7, the preparation method comprising: Forming the support portion on the flexible substrate by injection molding or photomask process; The chip is fixed on the flexible substrate through the first pin and the second pin, so that the supporting part is located between the first pin and the second pin.

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