Pin-bent QFN package structure and manufacturing method thereof

Abstract

The present invention provides a pin-bending QFN package structure and a manufacturing method thereof, wherein the package structure comprises a lead frame, a chip and a plastic encapsulation layer, wherein the lead frame comprises a base island and a plurality of pins located on the periphery of the base island, wherein the chip is arranged on the base island and electrically connected to the pins, wherein the plastic encapsulation layer covers the chip, the base island and part of the pins, wherein the pins are bent downward and extend out from the lower surface of the plastic encapsulation layer, wherein the ends of part of the pins exposed outside the plastic encapsulation layer are bent to form a straight outer pin segment, wherein the outer pin segment is located below the plastic encapsulation layer; wherein the plastic encapsulation layer is provided with a metal shielding layer at least on its side wall surface. A certain distance is spaced between the plastic encapsulation layer and the outer pin segment, thereby greatly reducing the risk of short circuit between the metal shielding layer plated on the side wall of the plastic encapsulation layer and the pins, and the exposed pins can adjust the length to increase the bonding area between the package structure and the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging, and in particular to a pin-bent QFN packaging structure and a manufacturing method thereof. Background Art

[0002] The QFN (Quad Flat No-leads) package structure has a pin side wall that is flush with the plastic package layer side wall and exposed to the plastic package body side wall. This causes a short circuit between the metal shielding layer and the exposed pins to occur easily when the metal shielding layer is plated on the outside of the QFN package structure, thereby causing failure of the package structure. Therefore, in order to form an electromagnetic shielding layer on the QFN package structure, complex additional processing steps such as pre-plating glue coating and grinding of excess plating are required, resulting in low production efficiency and poor reliability. Summary of the invention

[0003] The object of the present invention is to provide a pin-bent QFN packaging structure and a manufacturing method thereof.

[0004] The present invention provides a pin-bent QFN packaging structure, comprising a lead frame, a chip and a plastic encapsulation layer, wherein the lead frame comprises a base island and a plurality of pins located around the base island, the chip is arranged on the base island and electrically connected to the pins, the plastic encapsulation layer covers the chip, the base island and part of the pins, the pins are bent downward and extend out from the lower surface of the plastic encapsulation layer, and the ends of the part of the pins exposed outside the plastic encapsulation layer are bent to form a straight outer pin segment, and the outer pin segment is located below the plastic encapsulation layer;

[0005] The plastic sealing layer is provided with a metal shielding layer at least on its side wall surface.

[0006] As a further improvement of the present invention, the outer lead segment is a straight segment, and an upper surface of the outer lead segment is spaced a certain distance from a lower surface of the plastic packaging layer.

[0007] As a further improvement of the present invention, the pins are divided into an inner pin segment, a middle pin segment and an outer pin segment in sequence from the side facing the base island to the outside, the chip is electrically connected to the inner pin segment, the outer pin segment is straight and is located below the inner pin segment and the base island, the plastic encapsulation layer exposes the outer pin segment and at least partially exposes the middle pin segment connected to the outer pin segment, and the middle pin segment protrudes from the lower surface of the plastic encapsulation layer.

[0008] As a further improvement of the present invention, the inner pin segment is straight, and its lower surface is flush with the lower surface of the base island.

[0009] As a further improvement of the present invention, the middle pin is a straight segment, and the angle between it and the inner pin segment is a , 90°≤a <180°.

[0010] As a further improvement of the present invention, the plastic encapsulation layer completely exposes the middle lead segment, and exposes the inner lead segment and the lower surface of the base island.

[0011] As a further improvement of the present invention, it also includes a ground pin, which is flush with the inner pin segment, exposed to the side wall surface of the plastic packaging layer, and electrically connected to the metal shielding layer.

[0012] As a further improvement of the present invention, a heat dissipation structure is provided on the lower surface of the base island.

[0013] The present invention also provides a method for manufacturing a pin-bent QFN packaging structure, comprising the steps of:

[0014] Bending the lead frame pins to form an inner pin segment, a middle pin segment and an outer pin segment in sequence from the side facing the lead frame base island outward, and making the outer pin segment located below the inner pin segment;

[0015] Placing the lead frame on a pad fitted therewith, placing a chip on the lead frame base island, and bonding wires between the chip and the inner lead segments;

[0016] Plastic encapsulate the lead frame base island, the chip, the inner lead segment and the middle lead segment, and expose the outer lead segment, wherein the middle lead segment extends out from the lower surface of the plastic encapsulation layer;

[0017] A metal shielding layer is plated at least on the outer side of the plastic sealing layer.

[0018] As a further improvement of the present invention, “bending the lead frame pins to form inner pin segments, middle pin segments and outer pin segments in sequence from the side facing the base island outward” specifically includes:

[0019] Bend some of the pins downward b° , forming the intermediate lead segment, 0< b ≤90;

[0020] Then bend part of the middle pin upwards b° , forming the outer pin segment.

[0021] As a further improvement of the present invention, the plastic encapsulation layer completely exposes the middle lead segment, and exposes the inner lead segment and the lower surface of the base island.

[0022] As a further improvement of the present invention, “plastic encapsulating the base island, the chip, the inner lead segment and the middle lead segment, and exposing the outer lead segment” specifically includes:

[0023] The lead frame is placed in a plastic encapsulation mold, and the outer lead segments are buried in grooves on the mold that match the shapes of the outer lead segments, and the middle lead segments and the base island are placed against the protrusions of the mold;

[0024] Plastic-sealing the lead frame and the chip;

[0025] Cutting the excess plastic layer outside the middle pin.

[0026] As a further improvement of the present invention, “plastic encapsulating the base island, the chip, the inner lead segment and the middle lead segment, and exposing the outer lead segment” specifically includes:

[0027] Placing the lead frame in a plastic encapsulation mold, and inserting a spacer above a location of the middle lead segment;

[0028] The lead frame and the chip are plastic-sealed above the spacer.

[0029] As a further improvement of the present invention, the steps are also included:

[0030] Retain at least one pin without bending to form a ground pin, or weld at least one ground pin on the lead frame;

[0031] The ground pin is plastic-sealed and exposed at a side of the plastic-sealing layer.

[0032] As a further improvement of the present invention, the steps are also included:

[0033] A heat dissipation structure is arranged on the lower surface of the base island.

[0034] The beneficial effects of the present invention are: by bending the pins to form an inner pin segment, an intermediate pin segment and an outer pin segment that are angled with each other in sequence, and completely covering the inner pin segment with a plastic encapsulation layer, exposing the outer pin segment and at least part of the outer pin segment, so that a certain distance is spaced between the plastic encapsulation layer and the outer pin segment, the risk of short circuit between the metal shielding layer plated on the side wall of the plastic encapsulation layer and the pins can be greatly reduced, and the length of the exposed pins can be adjusted to increase the bonding area between the packaging structure and the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of a pin-bent QFN package structure in one embodiment of the present invention.

[0036] Figure 2 It is a schematic diagram of a method flow of a method for manufacturing a pin-bent QFN packaging structure in one embodiment of the present invention.

[0037] Figures 3 to 7It is a schematic diagram of the steps of a method for manufacturing a pin-bent QFN package structure in one embodiment of the present invention. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in combination with the specific implementation methods of this application and the corresponding drawings. Obviously, the described implementation methods are only part of the implementation methods of this application, not all of the implementation methods. Based on the implementation methods in this application, all other implementation methods obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0039] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0040] For ease of explanation, this document uses terms that represent relative positions in space for description, such as "above", "below", "back", "front", etc., to describe the relationship of one unit or feature shown in the drawings relative to another unit or feature. Terms of relative positions in space can include different orientations of the device in use or operation other than the orientation shown in the figure. For example, if the device in the figure is turned over, the unit described as being "below" or "above" other units or features will be located "below" or "above" the other units or features. Therefore, the exemplary term "below" can encompass both the spatial orientations of below and above.

[0041] like Figure 1 As shown, the present invention provides a pin-bent QFN packaging structure, including a lead frame 1, at least one chip 2 and a plastic packaging layer 3, the lead frame 1 includes at least one base island 11 and a plurality of pins 12 located around the base island 11, the chip 2 is arranged on the base island 11 and electrically connected to the pins 12.

[0042] The plastic layer 3 covers the chip 2, the base island 11 and part of the pins 12. The pins 12 are bent downward and extend out from the lower surface of the plastic layer 3. The ends of the part of the pins 12 exposed to the outside of the plastic layer 3 are bent to form a straight outer pin segment 123. The outer pin segment 123 is located below the plastic layer 3.

[0043] The outer lead segment 123 is a straight segment, and its upper surface can be in contact with or spaced a certain distance from the lower surface of the plastic packaging layer 3 . In this embodiment, the upper surface of the outer lead segment 123 and the lower surface of the plastic packaging layer 3 are spaced a certain distance apart.

[0044] Specifically, the pin 12 is divided into an inner pin segment 121, a middle pin segment 122 and an outer pin segment 123 from the side facing the base island 11 to the outside. The chip 2 is electrically connected to the inner pin segment 121 through a metal lead. The outer pin segment 123 is straight and is located below the inner pin segment 121 and the base island 11, that is, it is bent at least twice so that the outer pin segment 123, which is the electrical output end of the packaging structure, and the inner pin segment 121 are not in the same plane, and are lower than the inner pin segment 121 and the base island 11.

[0045] The inner pin segment 121, the middle pin segment 122 and the outer pin segment 123 mentioned here are just a general term for the three parts of the pin 12. The inner pin segment 121 is the part of the pin 12 used to form an electrical connection with the chip 2, the outer pin segment 123 is the part of the pin 12 that serves as the electrical output port of the QFN packaging structure, and the middle pin segment 122 is the part of the pin 12 that connects the inner pin segment 121 and the outer pin segment 123. It can include more sophisticated structures according to design requirements, or a bending structure can be formed in each part, and the present invention does not make specific restrictions on this.

[0046] Furthermore, the inner lead segment 121 is straight, and its lower surface is flush with the lower surface of the base island 11 . Since the outer lead segment 123 is located below the inner lead segment 121 , a certain space can be formed below the base island 11 .

[0047] Furthermore, in this embodiment, the middle lead segment 122 is a straight segment, and the angle between it and the inner lead segment 121 is a°, 90≤a<180, that is, through two bends, the lead frame 1, which was originally a planar structure, forms a three-dimensional step-type structure, and its structure can be regarded as similar to the L-shaped lead 12 in the traditional QFP (Quad Flat Package, square flat packaging technology) structure to a certain extent, but in the present invention, the step-type lead 12 is formed by bending the planar lead frame 1 in the QFN packaging structure. Controlling the angle between the middle lead segment 122 and the inner lead segment 121 to be greater than 90° is convenient for implementation in the manufacturing process, and is convenient for forming a plastic encapsulation layer 3 structure that exposes part of the lead 12 segment during the plastic encapsulation process.

[0048] It is understandable that, since the outer pin segment 123 and the inner pin segment 121 are both straight, that is, parallel to each other, the angle between the middle pin segment 122 and the inner pin segment 121 is the angle between the middle pin segment 122 and the outer pin segment 123 .

[0049] The plastic encapsulation layer 3 covers the base island 11, the chip 2, and the inner lead segment 121, and exposes the outer lead segment 123, and at least exposes a portion of the middle lead segment 122 connected to the outer lead segment 123, and the portion of the middle lead segment 122 exposed to the plastic encapsulation layer 3 extends out from the lower surface of the plastic encapsulation layer 3, and the outer lead segment 123 is spaced a certain distance from the plastic encapsulation layer 3. Thus, the plastic encapsulation layer 3 can be spaced from the outer lead segment 123 while covering the base island 11 and the chip 2, and the middle lead segment 122 extends out from the lower surface of the plastic encapsulation layer 3, so that when the metal shielding layer 4 is arranged on the side wall of the plastic encapsulation layer 3, there is no risk of short-circuiting with the lead 12, and the production yield and the reliability of the packaging structure can be significantly improved.

[0050] The main material of the plastic encapsulation layer 3 can be a polymer composite material with fillers such as epoxy resin, polyimide, dry film, etc., which also includes functional components such as curing agent, filler, accelerator, release agent, coupling agent, etc. The plastic encapsulation layer 3 covers the lead frame 1 and the chip 2 to play a protective role and provide physical support for the packaging structure. The plastic encapsulation layer 3 is provided with a metal shielding layer 4 at least on its side wall surface.

[0051] And because the pin 12 is extended outward and exposed to the plastic layer 3, the warping and other problems generated by the plastic layer 3 itself during the manufacturing process will not affect the shape of the pin 12, thereby improving the accuracy of the upper plate welding of the QFN package structure, and reducing the problem of abnormal electrical connection caused by the warping of the large-size QFN package structure. In addition, because the outer pin segment 123 is spaced a certain distance from the plastic layer 3, when the metal shielding layer 4 is formed on the side wall surface of the plastic layer 3, the outer pin segment 123 is extended outward to exceed the side wall surface of the plastic layer 3 and will not short-circuit with the metal shielding layer 4, so the length of the outer pin segment 123 can be adjusted as needed to increase the bonding area between the package structure and the circuit board. In addition, because the pin 12 exposed to the plastic layer 3 forms an "L"-shaped structure, it has a certain elasticity and can easily absorb a certain external force applied to the package structure without damaging the internal structure of the plastic layer 3.

[0052] Preferably, in this embodiment, the plastic encapsulation layer 3 completely exposes the middle lead segment 122, and exposes the inner lead segment 121 and the lower surface of the base island 11, so as to form a cavity at the bottom of the base island 11 that can accommodate other objects, and a heat dissipation structure can be arranged in the cavity and on the lower surface of the base island 11 to improve the heat dissipation capacity of the packaging structure. Alternatively, other chips or passive components can be arranged in the cavity to form a 3D packaging structure to improve the integration of the packaging structure.

[0053] The plastic packaging layer 3 is provided with a metal shielding layer 4 at least on its side wall surface.

[0054] The metal shielding layer 4 is a continuous thin film coating, which is used to reduce the electromagnetic interference to the chip 2 and other optional electronic components. The electromagnetic shielding layer can be a sputtered sandwich metal film material such as copper, stainless steel, titanium, or a conductive composite material such as a conductive resin containing high-density metal fillers such as silver / copper, or a combination of at least two of the above materials, which can play a role in shielding or absorbing electromagnetic waves.

[0055] Specifically, in this embodiment, the metal shielding layer 4 completely covers the side walls and the upper surface of the plastic layer 3. Since the plastic layer 3 is spaced a certain distance from the outer pin segment 123 and the middle pin segment 122 extends from the lower surface of the plastic layer 3, the metal shielding layer 4 will not pose a risk of short circuit with the pin 12, thereby forming a full covering structure for the side and top surfaces of the chip 2, which has a good electromagnetic shielding effect.

[0056] Furthermore, the pin 12 also includes a ground pin 13 connected to the metal shielding layer 4, the lower surface of the ground pin 13 is higher than the upper surface of the outer pin segment 123, exposed to the side wall of the plastic layer 3, and electrically connected to the metal shielding layer 4. Specifically, in this embodiment, the ground pin 13 is flush with the inner pin segment 121. Since the outer pin segment 123 extends downward, it is simpler and more efficient to set the ground pin 13 connected to the metal shielding layer 4 in the pin 12.

[0057] In addition, in the present invention, the lead frame 1 structure formed by sequential bending in the manufacturing process is easier to fit with the pad 5 arranged thereunder during the wire bonding process, compared with the traditional half-etched QFN lead frame 1, thereby improving the supporting effect of the pad 5 on the lead frame 1 and solving the problem of unstable wire bonding caused by the excessive length of the pins 12 of the QFN package lead frame 1.

[0058] like Figure 2 As shown, the present invention also provides a method for manufacturing a pin-bent QFN package structure, comprising the steps of:

[0059] S1: Figure 3 As shown, the lead 12 of the lead frame 1 is bent to form an inner lead segment 121 , a middle lead segment 122 and an outer lead segment 123 in sequence from the side facing the base island 11 outward, and the outer lead segment 123 is located below the inner lead segment 121 .

[0060] Specifically, part of the pins 12 are bent downward by b° to form a middle pin segment 122 , 0<b≤90; then part of the middle pin segment 122 is bent upward by b° to form an outer pin segment 123 .

[0061] Furthermore, step S1 also includes the steps of: leaving at least one pin 12 unbent to form a ground pin 13 , or welding an additional pin 12 to the lead frame 1 to form a ground pin 13 after bending the pin 12 .

[0062] S2: Figure 4 As shown, the lead frame 1 is placed on the pad 5 that is bonded thereto, the chip 2 is placed on the base island 11 of the lead frame 1, and wire bonding is performed between the chip 2 and the inner lead segment 121 .

[0063] The shape of the upper surface of the pad 5 matches the shape of the bent lead 12 , and the lead frame 1 fits thereon when placed thereon, thereby obtaining good support and avoiding the problem of unstable wire bonding.

[0064] S3: plastic-encapsulate the base island 11 , the chip 2 , the inner lead segment 121 and the middle lead segment 122 , and expose the outer lead segment 123 , wherein the middle lead segment 122 extends out from the lower surface of the plastic-encapsulation layer 3 .

[0065] Furthermore, at least a portion of the middle lead segment 122 connected to the outer lead segment 123 is exposed.

[0066] Preferably, the plastic encapsulation layer 3 completely exposes the middle lead segment 122 , and exposes the inner lead segment 121 and the lower surface of the base island 11 .

[0067] Specifically, Figure 5 As shown, in one embodiment of the present invention, step S3 includes:

[0068] The lead frame 1 is placed in a plastic encapsulation mold 6, and the outer lead segment 123 is buried in a groove on the mold 6 that matches its shape, and the middle lead segment 122 and the base island 11 are placed against the raised portion of the mold 6, so that the raised portion of the mold 6 completely fills the cavity under the base island 11 to prevent it from being filled with plastic encapsulation material;

[0069] Plastic-sealing the lead frame 1 and the chip 2;

[0070] The redundant plastic packaging layer 3 outside the middle pin 12 is cut by laser.

[0071] like Figure 6 As shown, in one embodiment of the present invention, step S3 includes:

[0072] The lead frame 1 is placed in a plastic encapsulation mold 6, and a spacer 7 is inserted above a location of the middle lead segment 122 to form a barrier layer through the spacer 7;

[0073] The lead frame 1 and the chip 2 are plastic-sealed above the spacer 7 .

[0074] S4: Figure 7 As shown, at least the outer side of the plastic sealing layer 3 is plated with a metal shielding layer 4 .

[0075] Specifically, in this embodiment, the metal shielding layer 4 is sputtered on the plastic packaging layer 3 to completely cover the four sidewall surfaces and the upper surface thereof.

[0076] Furthermore, in some embodiments of the present invention, the method further comprises the steps of:

[0077] A heat dissipation structure is disposed on the lower surface of the base island 11 .

[0078] To summarize, the present invention bends the pins to form an inner pin segment, a middle pin segment and an outer pin segment that are angled with each other in sequence, and completely covers the inner pin segment with a plastic layer, exposing the outer pin segment and at least a portion of the outer pin segment, so that a certain distance is maintained between the plastic layer and the outer pin segment. This can greatly reduce the risk of short circuit between the metal shielding layer plated on the side wall of the plastic layer and the pins, and the length of the exposed pins can be adjusted to increase the bonding area between the packaging structure and the circuit board.

[0079] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0080] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention and are not intended to limit the scope of protection of the present invention. All equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A pin-bent QFN packaging structure, comprising a lead frame, a chip and a plastic packaging layer, wherein the lead frame comprises a base island and a plurality of pins located around the base island, the chip is arranged on the base island and electrically connected to the pins, characterized in that: The plastic encapsulation layer covers the chip, the base island and part of the pins, the pins are bent downward and extend out from the lower surface of the plastic encapsulation layer, and the ends of the pins exposed outside the plastic encapsulation layer are bent to form straight outer pin segments, and the outer pin segments are located below the plastic encapsulation layer and are spaced a certain distance from the plastic encapsulation layer; The pins are formed by a bending process, and are divided into an inner pin segment, a middle pin segment and an outer pin segment from the side facing the base island outward in sequence, the chip is electrically connected to the inner pin segment, the outer pin segment is located below the inner pin segment and the base island, the plastic encapsulation layer exposes the outer pin segment, the plastic encapsulation layer completely exposes the middle pin segment, and exposes the lower surface of the inner pin segment and the base island, and the middle pin segment protrudes from the lower surface of the plastic encapsulation layer; The plastic sealing layer is provided with a metal shielding layer at least on its side wall surface.

2. The pin-bent QFN package structure according to claim 1, characterized in that: The outer lead segment is a straight segment, and a certain distance is between the upper surface of the outer lead segment and the lower surface of the plastic packaging layer.

3. The pin-bent QFN package structure according to claim 1, characterized in that: The inner lead segment is straight, and a lower surface thereof is flush with a lower surface of the base island.

4. The pin-bent QFN package structure according to claim 3, characterized in that: The middle pin is a straight segment, and the angle between it and the inner pin segment is a , 90°≤ a <180°.

5. The pin-bent QFN package structure according to claim 4, characterized in that: It also includes a ground pin, which is flush with the inner pin segment, exposed on the side wall of the plastic packaging layer, and electrically connected to the metal shielding layer.

6. The pin-bent QFN package structure according to claim 5, characterized in that: A heat dissipation structure is provided on the lower surface of the base island.

7. A method for manufacturing a pin-bent QFN package structure, characterized in that: Includes steps: Bending the lead frame pins to form an inner pin segment, a middle pin segment and an outer pin segment in sequence from the side facing the lead frame base island outward, and making the outer pin segment located below the inner pin segment; Placing the lead frame on a pad fitted therewith, placing a chip on the lead frame base island, and bonding wires between the chip and the inner lead segments; Plastic encapsulate the lead frame base island, the chip, the inner lead segment and the middle lead segment, and expose the outer lead segment, the middle lead segment, the inner lead segment and the lower surface of the base island, wherein the middle lead segment protrudes from the lower surface of the plastic encapsulation layer; A metal shielding layer is plated at least on the outer side of the plastic sealing layer.

8. The method for manufacturing a pin-bent QFN package structure according to claim 7, characterized in that: “Bending the lead frame pins to form inner pin segments, middle pin segments and outer pin segments in sequence from the side facing the base island outward” specifically includes: Bend some of the pins downward b° , forming the intermediate lead segment, 0< b ≤90; Then bend part of the middle pin upwards b° , forming the outer pin segment.

9. The method for manufacturing a pin-bent QFN package structure according to claim 8, characterized in that: “Plastic encapsulating the base island, the chip, the inner lead segment and the middle lead segment, and exposing the outer lead segment” specifically includes: The lead frame is placed in a plastic encapsulation mold, and the outer lead segments are buried in grooves on the mold that match the shapes thereof, and the middle lead segments and the base island are placed against the protrusions of the mold; Plastic-sealing the lead frame and the chip; Cutting the excess plastic layer outside the middle pin.

10. The method for manufacturing a QFN package structure with bent pins according to claim 7, characterized in that: “Plastic encapsulating the base island, the chip, the inner lead segment and the middle lead segment, and exposing the outer lead segment” specifically includes: Placing the lead frame in a plastic encapsulation mold, and inserting a spacer above a location of the middle lead segment; The lead frame and the chip are plastic-sealed above the spacer.

11. The method for manufacturing a pin-bent QFN package structure according to claim 7, characterized in that: Also includes the steps: Retain at least one pin without bending to form a ground pin, or weld at least one ground pin on the lead frame; The ground pin is plastic-sealed and exposed at a side of the plastic-sealing layer.

12. The method for manufacturing a QFN package structure with bent pins according to claim 7, characterized in that: Also includes the steps: A heat dissipation structure is arranged on the lower surface of the base island.

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