Chip-based secondary equipment integration device

Abstract

This invention provides a chip-based secondary device integration device. The chip-based secondary device integration device includes: a cabinet with multiple independent receiving cavities; multiple secondary device modules, each corresponding to a primary device, with each secondary device module housed within a receiving cavity in a one-to-one correspondence; each secondary device module includes a connector and at least one chip-based secondary device, the chip-based secondary device being electrically connected to the connector, and the primary device being electrically connected to the connector. Using this structure, the secondary device modules and primary devices are connected via connectors, enabling rapid connection and disconnection between the primary device and the chip-based secondary device, thus facilitating the assembly and disassembly of the primary device and the chip-based secondary device. Furthermore, housing multiple secondary device modules corresponding to multiple primary devices within the same cabinet improves the space utilization of the cabinet and reduces the space occupied by the chip-based secondary devices.

Description

Technical Field

[0001] This invention relates to the field of power system technology, and in particular to a chip-based secondary equipment integration device. Background Technology

[0002] In power systems, primary equipment typically corresponds to multiple chip-based secondary devices, including chip-based monitoring and control devices and chip-based protection devices. These secondary devices monitor, measure, control, protect, and regulate the primary equipment. In existing technologies, both primary and secondary chip-based devices have numerous connecting wires. The interconnection of these wires with the primary equipment results in a messy and complex wiring system. Furthermore, connecting or disconnecting these devices is complicated, leading to cumbersome maintenance and replacement work, and low efficiency. Summary of the Invention

[0003] Based on this, a chip-based secondary equipment integration device is provided, which facilitates the disassembly and assembly between primary equipment and chip-based secondary equipment.

[0004] This invention provides a chip-based secondary device integration device. The chip-based secondary device integration device includes: a cabinet with multiple independent receiving cavities inside the cabinet; multiple secondary device modules, each secondary device module corresponding to a primary device, the secondary device modules being disposed within the receiving cavities, and the secondary device modules and receiving cavities being configured in a one-to-one correspondence; each secondary device module includes a connector and at least one chip-based secondary device, the chip-based secondary device being electrically connected to the connector, and the connector being electrically connected to the primary device.

[0005] In one embodiment, the cabinet has a first side and a second side arranged opposite to each other. The first side of the cabinet is provided with a plurality of first openings, each of which corresponds to a receiving cavity and is connected to the receiving cavity. The second side of the cabinet is provided with a plurality of second openings, each of which corresponds to a receiving cavity and is connected to the receiving cavity. The chip-based secondary device is located near the first opening, and the connector is located near the second opening.

[0006] In one embodiment, the secondary device module further includes a housing having a first receiving cavity and a third opening, the first receiving cavity communicating with the third opening and the third opening corresponding to the first opening; a chip-based secondary device is disposed in the first receiving cavity; a connector is disposed on the outer wall of the housing and is electrically connected to the chip-based secondary device.

[0007] In one embodiment, the secondary device module further includes a motherboard, which is disposed on the outer wall of the housing. The chip-based secondary device is electrically connected to the motherboard, and the connector is electrically connected to the motherboard.

[0008] In one embodiment, the housing is provided with a second receiving cavity and a fourth opening. The second receiving cavity is independent of the first receiving cavity, and the fourth opening communicates with the second receiving cavity and is correspondingly arranged with the first opening. The secondary device module also includes: a panel, one side of which is rotatably connected to the side wall of the second receiving cavity, the panel being located inside the second receiving cavity and close to the fourth opening; a control button, which is disposed on the panel and electrically connected to the chip-based secondary device; a selector switch, which is disposed on the panel and electrically connected to the chip-based secondary device; and a protective pressure plate, which is disposed on the panel and electrically connected to the chip-based secondary device.

[0009] In one embodiment, the housing is further provided with a fifth opening, which communicates with the second receiving cavity and is located on the side wall of the housing.

[0010] In one embodiment, the housing is slidably connected within the receiving cavity.

[0011] In one embodiment, a first door is movably provided at the first opening for blocking the first opening, and a second door is movably provided at the second opening for blocking the second opening.

[0012] In one embodiment, a plurality of first support portions are provided on the first side of the cabinet, and the first support portions are provided in a one-to-one correspondence with the receiving cavity. The first support portions are located on one side of the receiving cavity and are provided with a first screen header. A plurality of second support portions are provided on the second side of the cabinet, and the second support portions are provided in a one-to-one correspondence with the receiving cavity. The second support portions are located on one side of the receiving cavity and are provided with a second screen header.

[0013] In one embodiment, multiple receiving cavities are arranged sequentially in a vertical direction.

[0014] In the aforementioned chip-based secondary device integration device, the cabinet contains multiple receiving cavities, and secondary device modules are housed within these cavities. Each secondary device module corresponds to one primary device, with a one-to-one correspondence between the receiving cavities and the secondary device modules. Each secondary device module includes a connector and at least one chip-based secondary device. The chip-based secondary device is electrically connected to the connector, and the primary device is also electrically connected to the connector. This structure, where one secondary device module corresponds to one primary device and includes at least one chip-based secondary device, allows for modular design of multiple secondary devices corresponding to a single primary device. This facilitates the spatial layout of the chip-based secondary devices and reduces the space occupied by them. The secondary device module includes both the chip-based secondary device and the connector. The chip-based secondary device is electrically connected to the connector, and the primary device is also electrically connected to the connector. This connection between the secondary device module and the primary device via the connector enables quick connection and disconnection between the primary device and the chip-based secondary device, facilitating assembly and disassembly. When replacement or repair of the primary device or chip-based secondary device is required, simply disconnecting the primary device from the connector is sufficient, making operation simple and convenient. Furthermore, in the above structure, the secondary equipment modules are set up one-to-one with the receiving cavity. This allows multiple secondary equipment modules corresponding to multiple primary devices to be set up in the same cabinet, which improves the space utilization of the cabinet, reduces the space occupied by the chip-based secondary equipment, and enables the chip-based secondary equipment integration device to have a high degree of integration. Attached Figure Description

[0015] Figure 1 A first-view structural schematic diagram of a chip-based secondary device integration apparatus provided in one embodiment;

[0016] Figure 2 A second-view structural schematic diagram of a chip-based secondary device integration apparatus provided in one embodiment;

[0017] Figure 3 A first-view structural schematic diagram of a secondary device module provided in one embodiment;

[0018] Figure 4 This is a schematic diagram from a second perspective of a secondary device module provided in one embodiment.

[0019] The above figures include the following reference numerals:

[0020] 10. Cabinet body; 11. First side of the cabinet body; 12. Second side of the cabinet body; 13. Receiving cavity; 14. First opening; 15. Second support part; 16. Second door body; 17. First support part;

[0021] 20. Secondary equipment module; 21. Chip-based secondary equipment; 22. Connector; 23. Housing; 231. First receiving cavity; 232. Third opening; 233. Second receiving cavity; 234. Fifth opening; 24. Main board; 25. Panel; 26. Control button; 27. Changeover switch. Detailed Implementation

[0022] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0025] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0026] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0028] See Figure 1 and Figure 2 An embodiment of the present invention provides a chip-based secondary equipment integration device, which includes a cabinet 10 and multiple secondary equipment modules 20. The cabinet 10 has multiple independent receiving cavities 13. Each secondary equipment module 20 corresponds to a primary equipment and is disposed within a receiving cavity 13, with a one-to-one correspondence between the secondary equipment module 20 and the receiving cavity 13. Each secondary equipment module 20 includes a connector 22 and at least one chip-based secondary device 21. The chip-based secondary device 21 is electrically connected to the connector 22, and the primary equipment is also electrically connected to the connector 22. The connector 22 can be a rectangular connector. The chip-based secondary device 21 is an auxiliary device for monitoring, measuring, controlling, protecting, and regulating primary equipment in a power system. The chip-based secondary device 21 can be a protection device or a measurement and control device. Generally, one primary equipment corresponds to multiple chip-based secondary devices 21, some of which are protection devices, and others are measurement and control devices. In actual operation, the chip-based secondary equipment and the primary equipment are electrically connected through a conversion device; that is, the primary equipment is electrically connected to the conversion device, and the conversion device is electrically connected to connector 22. The chip-based secondary equipment 21 generally includes chip-based measurement and control devices, chip-based protection devices, etc. The chip-based secondary equipment 21 is relatively small in size, so the housing cavity 13 can accommodate a large number of chip-based secondary equipment 21, and the overall size of the integrated chip-based secondary equipment device is also small.

[0029] In the above technical solution, the cabinet 10 is provided with multiple receiving cavities 13, one secondary equipment module 20 corresponds to one primary equipment, the secondary equipment module 20 is set in the receiving cavity 13, and the receiving cavity 13 and the secondary equipment module 20 are set in a one-to-one correspondence; the secondary equipment module 20 includes a connector 22 and at least one chip-based secondary equipment 21, the chip-based secondary equipment 21 is electrically connected to the connector 22, and the primary equipment is electrically connected to the connector 22. With the above structure, one secondary device module 20 corresponds to one primary device. Each secondary device module 20 includes at least one chip-based secondary device 21. This modular design of multiple chip-based secondary devices 21 corresponding to one primary device facilitates the spatial layout of the chip-based secondary devices 21 and reduces the space occupied by each chip-based secondary device 21. Each secondary device module 20 includes a chip-based secondary device 21 and a connector 22. The chip-based secondary device 21 is electrically connected to the connector 22, and the primary device is also electrically connected to the connector 22. This connection between the secondary device module 20 and the primary device via the connector 22 allows for quick connection and disconnection between the primary device and the chip-based secondary device. When replacing or repairing the primary device or secondary device module, simply disconnecting the primary device from the connector is sufficient, making operation simple and convenient. Furthermore, in the above structure, the secondary device modules 20 are arranged one-to-one with the receiving cavity 13. This allows multiple secondary device modules 20 corresponding to multiple primary devices to be housed within the cabinet 10, improving the space utilization of the cabinet, reducing the space occupied by the chip-based secondary devices, and enabling a high degree of integration of the chip-based secondary device integration device.

[0030] See Figure 1 and Figure 2 In one embodiment, the cabinet 10 has a first side and a second side arranged opposite to each other. The first side 11 of the cabinet has multiple first openings 14, each corresponding to a receiving cavity 13 and communicating with it. The second side 12 of the cabinet has multiple second openings, each corresponding to a receiving cavity 13 and communicating with it. A chip-based secondary device 21 is positioned corresponding to the first opening 14, and a connector 22 is positioned corresponding to the second opening. This arrangement allows operation of the chip-based secondary device 21 at the first opening 14 and operation of the connector 22 at the second opening, such as connecting a primary device and the connector 22 together at the second opening. This eliminates the need to remove the secondary device module 20 from the receiving cavity 13 for operation, improving work efficiency.

[0031] See Figure 1 and Figure 2In one embodiment, a first door is movably provided at the first opening 14 to block the first opening 14, and a second door 16 is movably provided at the second opening to block the second opening. Optionally, the first door can be made of a transparent material so that staff can observe the status of the chip-based secondary device 21 at any time through the first door. The provision of the first door and the second door 16 can prevent dust and other impurities from falling onto the secondary device module 20 and can protect the secondary device module 20.

[0032] See Figures 1 to 4 In one embodiment, the secondary device module 20 further includes a housing 23, which has a first receiving cavity 231 and a third opening 232. The first receiving cavity 231 communicates with the third opening 232, and the third opening 232 is correspondingly disposed with respect to the first opening 14. The chip-based secondary device 21 is disposed within the first receiving cavity 231. A connector 22 is disposed on the outer wall of the housing 23 and is electrically connected to the chip-based secondary device 21. The housing 23 is used to support the chip-based secondary device 21 and the connector. By providing the housing 23, the secondary device module 20 can be moved by moving the housing 23, which facilitates the movement of the secondary device module 20 within the receiving cavity 13, thereby facilitating the assembly of the chip-based secondary device integrated device or the replacement and maintenance of the secondary device module 20.

[0033] See Figure 1 In one embodiment, the housing 23 is slidably connected within the receiving cavity 13. This further facilitates the movement of the housing 23 within the receiving cavity 13. Optionally, sliders may be provided on both sides of the housing 23, and a slide rail may be provided on the inner wall of the receiving cavity 13, with the sliders slidably connected within the slide rail to facilitate the movement of the housing 23 within the receiving cavity 13.

[0034] See Figure 4 In one embodiment, the secondary device module 20 further includes a motherboard 24, which is disposed on the outer wall of the housing 23. The chip-based secondary device 21 is electrically connected to the motherboard 24, and the connector 22 is also electrically connected to the motherboard 24. The chip-based secondary device 21 is electrically connected to the connector 22 via the motherboard 24, which reduces the number of connecting wires between the chip-based secondary device 21 and the connector 22, thus reducing the overall size of the secondary device module 20. Furthermore, the motherboard 24 ensures a stable electrical connection between the chip-based secondary device 21 and the connector 22.

[0035] See Figure 1 and Figure 3In one embodiment, the housing 23 is provided with a second receiving cavity 233 and a fourth opening. The second receiving cavity 233 is independent of the first receiving cavity 231, and the fourth opening communicates with the second receiving cavity 233. The fourth opening is correspondingly arranged with the first opening 14. The secondary device module 20 also includes a panel 25, a control button 26, a selector switch 27, and a protective pressure plate. One side of the panel 25 is rotatably connected to the side wall of the second receiving cavity 233. The panel 25 is located inside the second receiving cavity 233 and is positioned close to the fourth opening. The control button 26 is disposed on the panel 25 and is electrically connected to the chip-based secondary device 21. The selector switch 27 is disposed on the panel 25 and is electrically connected to the chip-based secondary device 21. The protective pressure plate is disposed on the panel 25 and is electrically connected to the chip-based secondary device 21. In the above technical solution, the panel 25 is used to support the control button 26, the selector switch 27, and the protective pressure plate. Generally, the chip-based secondary device 21 is a protection device or a measurement and control device. The control button 26 is electrically connected to the protection device, the changeover switch 27 is electrically connected to the measurement and control device, and the protection device and / or the measurement and control device is electrically connected to the protection pressure plate. Using the above technical solution, the panel 25 is rotatably connected to the side wall of the second receiving cavity 233. By rotating the panel 25, its back face can be aligned with the fourth opening and the first opening 14, thus facilitating maintenance of the control button 26, changeover switch 27, and protection pressure plate on the panel 25. Optionally, the second receiving cavity 233 is located below the first receiving cavity 231, that is, the panel 25 is located below the chip-based secondary device 21. Optionally, the control button 26, changeover switch 27, and protection pressure plate can be electrically connected to the chip-based secondary device 21 via the main board 24.

[0036] In one embodiment, a fifth opening 234 is also provided on the housing 23, which communicates with the second receiving cavity 233 and is located on the side wall of the housing 23. Since the connecting wires of the control button 26, the changeover switch 27, and the protective pressure plate pass through the second receiving cavity 233 and are connected to the chip-based secondary device 21, the provision of the fifth opening 234 and its communication with the second receiving cavity 233 facilitates the connection of the secondary device to the control button 26, the changeover switch 27, and the protective pressure plate by the operator, and also facilitates the operator's maintenance and other operations on the control button 26, the changeover switch 27, and the protective pressure plate.

[0037] See Figure 1In one embodiment, a plurality of first support portions 17 are provided on the first side 11 of the cabinet, and each first support portion 17 corresponds to a receiving cavity 13. The first support portion 17 is located on one side of the receiving cavity 13, and a first screen header is provided on the first support portion 17. Generally, the first support portion 17 is located on the upper side of the receiving cavity 13. The first support portion 17 can be a support plate, and the first support portion 17 is fixedly connected to the cabinet 10. The first screen header is provided on the first support portion 17, and the first screen header is used to display information of the secondary equipment module 20 for easy identification by staff.

[0038] See Figure 2 In one embodiment, a plurality of second support portions 15 are provided on the second side 12 of the cabinet, and each second support portion 15 corresponds to a receiving cavity 13. The second support portion 15 is located on one side of the receiving cavity 13, and a second screen header is provided on the second support portion 15. Generally, the second support portion 15 is located on the upper side of the receiving cavity 13. The second support portion 15 can be a support plate, and the second support portion 15 is fixedly connected to the cabinet 10. The second screen header is provided on the second support portion 15, and the second screen header is used to display information of the secondary equipment module 20 for easy identification by staff.

[0039] See Figure 1 and Figure 2 In one embodiment, multiple receiving cavities 13 are arranged sequentially along a vertical direction. This results in the cabinet 10 having a vertical length direction, thus occupying less floor space. In other embodiments, the receiving cavities 13 can be arranged in an array. The receiving spaces of the multiple receiving cavities 13 can be the same or different, and the structural dimensions of the receiving cavities 13 can be determined according to the structural dimensions of the secondary equipment module 20.

[0040] See Figure 3 In one embodiment, multiple chip-based secondary devices 21 are spaced apart within the first receiving cavity 231 to prevent mutual interference between the multiple chip-based secondary devices 21 and to improve the heat dissipation of the chip-based secondary devices 21.

[0041] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0042] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A chipped secondary device integration apparatus, characterized by, The chipped secondary device integrated device comprises: a cabinet (10) having a plurality of independent accommodating cavities (13) arranged therein; a plurality of secondary device modules (20), each corresponding to a primary device, arranged in the accommodating cavities (13), and each secondary device module (20) corresponding to one accommodating cavity (13); each secondary device module (20) comprises a connector (22) and at least one chipped secondary device (21), wherein the chipped secondary device (21) is electrically connected to the connector (22), and the connector (22) is electrically connected to the primary device; the cabinet (10) has a first side and a second side arranged oppositely, the first side (11) of the cabinet is provided with a plurality of first openings (14) corresponding to the accommodating cavities (13), and the first openings (14) are in communication with the accommodating cavities (13); the second side (12) of the cabinet is provided with a plurality of second openings corresponding to the accommodating cavities (13), and the second openings are in communication with the accommodating cavities (13); the chipped secondary device (21) is arranged corresponding to the first opening (14), and the chipped secondary device (21) can be operated through the first opening (14); the connector (22) is arranged corresponding to the second opening, and the connector (22) can be operated through the second opening; the secondary device module (20) further comprises a box (23) having a first accommodating cavity (231) and a third opening (232), wherein the first accommodating cavity (231) is in communication with the third opening (232), and the third opening (232) is arranged corresponding to the first opening (14); the chipped secondary device (21) is arranged in the first accommodating cavity (231); the connector (22) is arranged on the outer side wall of the box (23), and the connector (22) is electrically connected to the chipped secondary device (21); the box (23) is provided with a second accommodating cavity (233) and a fourth opening, wherein the second accommodating cavity (233) is independent of the first accommodating cavity (231), the fourth opening is in communication with the second accommodating cavity (233), and the fourth opening is arranged corresponding to the first opening (14); the secondary device module (20) further comprises: a panel (25) rotatably connected to the side wall of the second accommodating cavity (233), arranged in the second accommodating cavity (233) and close to the fourth opening; a control button (26) arranged on the panel (25) and electrically connected to the chipped secondary device (21). A change-over switch (27) is arranged on the panel (25), and the change-over switch (27) is electrically connected with the chip secondary device (21). A protection pressing plate is arranged on the panel (25), and the protection pressing plate is electrically connected with the chip secondary device (21).

2. The chip-sized secondary device integrated apparatus according to claim 1, wherein The secondary device module (20) further comprises a main board (24) arranged on the outer sidewall of the box (23), the chip secondary device (21) is electrically connected with the main board (24), and the connector (22) is electrically connected with the main board (24).

3. The chip-sized secondary device integrated apparatus according to claim 1, wherein The box (23) is further provided with a fifth opening (234) in communication with the second accommodating cavity (233), and the fifth opening (234) is located on the sidewall of the box (23).

4. The chip-sized secondary device integrated apparatus according to claim 1, wherein The box (23) is slidably connected in the accommodating cavity (13).

5. The chip-sized secondary device integrated apparatus according to claim 1, wherein A first door body is movably arranged at the first opening (14), and the first door body is used for plugging the first opening (14); and a second door body (16) is movably arranged at the second opening, and the second door body (16) is used for plugging the second opening.

6. The chipped secondary device integrated apparatus of claim 1, wherein, A plurality of first supporting parts (17) are arranged on the first side (11) of the cabinet, the first supporting parts (17) are arranged one by one corresponding to the accommodating cavities (13), the first supporting parts (17) are located on one side of the accommodating cavities (13), and first screen brows are arranged on the first supporting parts (17). A plurality of second supporting parts (15) are arranged on the second side (12) of the cabinet, the second supporting parts (15) are arranged one by one corresponding to the accommodating cavities (13), the second supporting parts (15) are located on one side of the accommodating cavities (13), and second screen brows are arranged on the second supporting parts (15).

7. The chipped secondary device integrated apparatus of claim 1, wherein, The plurality of accommodating cavities (13) are arranged in sequence in the vertical direction.

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