Speaker modules and electronic devices

Abstract

The present application discloses a speaker module and an electronic device. The speaker module includes: a speaker body, provided with a first sound outlet; a speaker housing, including a bottom plate, a side plate, a cover plate and a partition plate, wherein the bottom plate, the side plate and the cover plate are arranged to form a speaker cavity, the partition plate divides the speaker cavity into at least two independent sub-cavities, the speaker body is arranged in one of the sub-cavities, the partition plate is provided with a first connecting port connecting the sub-cavities, one side of the first sound outlet of the speaker body is attached to the cover plate, and the cover plate is provided with a second sound outlet directly opposite to the first sound outlet. In the above manner, the sound performance of the speaker body can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of loudspeakers, and in particular to a loudspeaker module and an electronic device. Background Art

[0002] Electronic devices produce sound through the vibration of speakers (also known as horns). When a speaker produces sound, the side of the sound outlet and the side away from the sound outlet produce sound waves of equal magnitude and 180 degrees of phase difference. The sound waves emitted from the side of the sound outlet are beneficial (ultimately transmitted through the electronic device for the user to hear), and the sound waves generated from the side away from the sound outlet are useless.

[0003] The existing solution to the sound waves away from the sound outlet is to set a speaker cavity in the inner cavity of the electronic device (i.e., the device cavity mentioned below) to absorb the energy of the sound waves generated on the side away from the sound outlet. If the volume of the speaker cavity is too large, it will take up too much space; but if the volume of the speaker cavity is too small, it will affect the sound performance of the speaker. Summary of the invention

[0004] The present application provides a speaker module and an electronic device, which can solve the problem of poor sound performance of the speaker.

[0005] In order to solve the above technical problems, a technical solution adopted by the present application is to provide a speaker module. The speaker module includes: a speaker body, provided with a first sound outlet; a speaker housing, including a bottom plate, a side plate, a cover plate and a partition plate, the bottom plate, the side plate and the cover plate are arranged to form a speaker cavity, the partition plate divides the speaker cavity into at least two independent sub-cavities, the speaker body is arranged in one of the sub-cavities, the partition plate is provided with a first connecting port connecting the sub-cavities, one side of the first sound outlet of the speaker body is attached to the cover plate, and the cover plate is provided with a second sound outlet directly opposite to the first sound outlet.

[0006] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide an electronic device, which includes a device housing and a speaker module as mentioned above, and the speaker module is arranged in the device cavity of the device housing.

[0007] In the above manner, the present application uses a partition to divide the inner cavity of the speaker into at least two independent sub-cavities, and the partition is provided with a first connecting port connecting the sub-cavities, so that the sound waves in the inner cavity of the speaker can propagate to different sub-cavities through the first connecting port. Among them, when the sound waves pass through the first connecting port, a thermoviscous effect is formed, so that the energy of the sound waves is consumed / absorbed. Therefore, the present application can improve the sound performance of the speaker body without increasing the volume of the rear cavity of the speaker. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1It is a structural schematic diagram of an embodiment of a speaker module of the present application;

[0009] Figure 2 yes Figure 1 A schematic diagram of the exploded structure of an embodiment of a speaker module;

[0010] Figure 3 yes Figure 1 A schematic diagram of the cross-sectional structure of an embodiment of the middle speaker module along the y1-y2 direction;

[0011] Figure 4 yes Figure 1 A schematic diagram of the cross-sectional structure of an embodiment of the middle speaker module along the z1-z2 direction;

[0012] Figure 5 It is a schematic diagram of the misalignment of the first communication ports provided on adjacent partitions;

[0013] Figure 6 is another schematic diagram of the misalignment of the first communication ports provided on adjacent partitions;

[0014] Figure 7 is another schematic diagram of the misalignment of the first communication ports provided on adjacent partitions;

[0015] Figure 8 is another schematic diagram of the misalignment of the first communication ports provided on adjacent partitions;

[0016] Fig. 9 yes Figure 1 A schematic diagram of the exploded structure of another embodiment of the speaker module;

[0017] Fig.10 yes Figure 1 A schematic diagram of the cross-sectional structure of another embodiment of the middle speaker module along the z1-z2 direction;

[0018] Fig.11 is another schematic diagram of the misalignment of the first communication openings provided on adjacent partitions;

[0019] Fig.12 is another schematic diagram of the misalignment of the first communication openings provided on adjacent partitions;

[0020] Fig.13 It is a structural schematic diagram of an embodiment of the electronic device of the present application;

[0021] Fig.14 yes Fig.13 A schematic diagram of the cross-sectional structure of the electronic device along the y1-y2 direction;

[0022] Fig.15 yes Fig.13 Schematic diagram of the internal structure of the electronic equipment;

[0023] Fig.16 This is a test result graph of the speaker's sound performance. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0025] The terms "first", "second", and "third" in this application are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0026] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments without conflict.

[0027] It should be noted that all directional indications in this application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0028] Embodiment 1

[0029] Combined with reference Figure 1-4 , Figure 1 is a structural schematic diagram of an embodiment of a speaker module of the present application, Figure 2 yes Figure 1 A schematic diagram of the exploded structure of an embodiment of a speaker module, Figure 3 yes Figure 1 A schematic diagram of the cross-sectional structure of an embodiment of the middle speaker module along the y1-y2 direction, Figure 4 yes Figure 1 A schematic diagram of the cross-sectional structure of an embodiment of the middle speaker module along the z1-z2 direction.

[0030] like Figure 1-4As shown, the speaker module 10 includes a speaker body 11 and a speaker housing 12 .

[0031] The speaker body 11 is provided with a first sound outlet 111. When the speaker body 11 emits sound, one side of the first sound outlet 111 and the side away from the first sound outlet 111 of the speaker body 11 can generate sound waves of equal magnitude and 180 degrees out of phase.

[0032] The speaker housing 12 includes a bottom plate 121, a side plate 122, a cover plate 123 and a partition plate 124. The bottom plate 121, the side plate 122 and the cover plate 123 are arranged to form a speaker cavity 125. The partition plate 124 divides the speaker cavity 125 into at least two independent sub-cavities (not shown), and the partition plate 124 is in contact with both the cover plate 123 and the bottom plate 121, and the speaker body 11 is arranged in one of the sub-cavities. The partition plate 124 is provided with a first connecting port 1241 connecting the sub-cavities, that is, in at least two independent sub-cavities, two adjacent sub-cavities are connected through the first connecting port 1241. Thereby, the sound waves emitted from the side of the speaker body 11 away from the first sound outlet 111 can be transmitted to different sub-cavities through the first connecting port 1241.

[0033] The number of the partitions 124 can be 1, 2, 3, etc., and can be specifically set according to the sound absorption requirements. This embodiment is described with the number of partitions 124 being 2. In this case, at least two independent sub-cavities include a first sub-cavity 1251, a second sub-cavity 1252, and a third sub-cavity 1253. The first sub-cavity 1251 and the second sub-cavity 1252, as well as the second sub-cavity 1252 and the third sub-cavity 1253 are connected through the first connecting port 1241. The speaker body 11 is disposed in the first sub-cavity 1251, so that the sound waves emitted from the side of the speaker body 11 away from the first sound outlet 111 can pass through the first sub-cavity 1251, the second sub-cavity 1252, and the third sub-cavity 1253 in sequence through the first connecting port 1241.

[0034] When the sound wave on the side of the speaker body 11 away from the first sound outlet 111 passes through the first connecting port 1241, the air rubs against the boundary of the first connecting port 1241 to generate air viscosity resistance, so that the surrounding air of the first connecting port 1241 and the boundary of the first connecting port 1241 form a thermoviscous effect due to heat conduction. That is, the movement speed of the surrounding air molecules near the boundary of the first connecting port 1241 is very slow, and the movement speed of the air molecules on the boundary of the first connecting port 1241 is close to 0, and the air molecules away from the boundary of the first connecting port 1241 move at the standard acoustic speed according to the Euler equation. Therefore, under the thermoviscous effect, the air molecules are "stuck" to the boundary of the first connecting port 1241, the speed of the air molecules within the boundary of the first connecting port 1241 is close to 0, and the speed of the air molecules near the boundary of the first connecting port 1241 is also slowed down, so that the overall energy of the sound wave is consumed (sound absorption), that is, part of the sound energy is converted into heat energy.

[0035] Furthermore, the partition 124 is a closed structure connected end to end, and the closed structure can be arranged in a rectangular shape, a circular shape, etc. If the number of the partitions 124 is greater than 1, one of the two adjacent partitions 124 is arranged around the other. In addition, the adjacent partitions 124 can be arranged in parallel or in a non-parallel manner. Taking the partition 124 as a closed structure arranged in a rectangular shape and the adjacent partitions 124 being parallel as an example, the propagation of sound waves in the speaker cavity 125 is described. Figure 4 As shown, the speaker body 11 is disposed in the first sub-cavity 1251 , so that the sound waves emitted by the speaker body 11 away from the first sound outlet 111 can pass through the first sub-cavity 1251 , the second sub-cavity 1252 and the third sub-cavity 1253 in sequence (arrows indicate propagation directions).

[0036] Furthermore, if the number of the partitions 124 is greater than 1, the first communication openings 1241 provided on adjacent partitions 124 are staggered.

[0037] There are two cases where the first communication openings 1241 of adjacent partitions 124 are misaligned. The first case is that the area 1 of one partition 124 with the first communication opening 1241 is partially or completely opposite to the area 2 of the other partition 124 with the first communication opening 1241, but the first communication opening 1241 on area 1 is not opposite to / misaligned with the first communication opening 1241 on area 2. Figure 5 To explain, Figure 5 As shown, the partition 124 is a closed structure arranged in a rectangular shape. Among two adjacent partitions 124, the surface a of one partition 124 is opposite to the surface A of the other partition 124, that is, surface a and surface A are located on the same side of the bottom plate 121, and the three first connecting ports 1241 provided on surface A are staggered with the three first connecting ports 1241 provided on surface a.

[0038] The second situation is that the area where the first communication opening 1241 is provided on one partition 124 is completely misaligned with the area where the first communication opening 1241 is provided on another partition 124, so that the first communication openings 1241 provided on adjacent partitions are misaligned. Figure 6-8 For explanation. Figure 6-8 As shown, the partition 124 is a closed structure arranged in a rectangular shape, wherein one partition 124 includes surfaces a to d, and the other partition 124 includes surfaces A to D, a is opposite to A, that is, a and A are located on the same side of the bottom plate 121, a is completely misaligned with B to D, that is, a and B to D are located on different sides of the bottom plate 121; b is opposite to B (b is completely misaligned with A, C, and D); c is opposite to C (c is completely misaligned with A, B, and D); d is opposite to D (d is completely misaligned with A to C). Figure 6 A and c are provided with a first communication port 1241. Figure 7 A, B, c, d are provided with a first communication port 1241, Figure 8 A, b, c, and d are provided with a first communication port 1241 .

[0039] The dislocation arrangement forms one or more parallel resonant sound-absorbing structures (Helmholtz resonance cavities) between two adjacent side panels 122 and partitions 124, producing a resonant sound-absorbing effect. Thus, when the frequency of the sound wave is consistent with the natural frequency (Helmholtz resonance frequency) of the resonant sound-absorbing structure 127, resonance occurs and the amplitude reaches the maximum, thereby consuming the energy of the sound wave. In other words, under the resonant sound-absorbing effect, after the sound wave enters the first connecting port 1241, it excites the vibration of air molecules in the speaker cavity 125, which can further consume the energy of the sound wave during the propagation of the sound wave in the speaker cavity 125.

[0040] Furthermore, when the regions where the first connecting openings 1241 are provided on two adjacent partitions 124 are completely misaligned, the propagation path of the sound waves in the speaker cavity 125 increases, so that the sound wave energy is further consumed during the propagation of the sound waves in the speaker cavity 125 .

[0041] Furthermore, a porous material is provided on one side of the partition 124 close to the speaker body 11. If the areas where the first communication openings 1241 are provided on two adjacent partitions 124 are completely misaligned, when sound waves are incident on the porous material on the partitions 124, a thermoviscous effect will also be generated, so that the sound wave energy is further consumed during the propagation of the sound wave in the speaker cavity 125. Please refer to the previous description for the relevant introduction to the thermoviscous effect, which will not be repeated here.

[0042] Furthermore, the side panel 122 is provided with a second connecting port 1221. The speaker cavity 125 can be connected to the device cavity (not shown) where the speaker cavity 125 is located through the second connecting port 1221. The second connecting port 1221 can be regarded as an exhaust hole or an air pressure balance hole between the speaker cavity 125 and the device cavity. After the sound wave passes through the last sub-cavity (the third sub-cavity 1253) on its propagation path, it can be transmitted out of the speaker cavity 125 through the second connecting port 1221, that is, enter the device cavity. Thereby, the volume of the speaker cavity 125 is increased in disguise, that is, the device cavity is regarded as an extension of the speaker cavity 125. In addition, the second connecting port 1221 provided on the side panel 122 and the first connecting port 1241 provided on the adjacent partition 124 are misaligned, so as not to affect the formation of the Helmholtz resonance cavity between the side panel 122 and the adjacent partition 124. Furthermore, the sound waves can also form a thermal viscosity effect when passing through the second communication port 1221, thereby further absorbing the sound wave energy.

[0043] Furthermore, the size of the first connecting port 1241 can be set based on at least one of the caliber and power of the speaker body 11. Moreover, for different speaker bodies 11, the sound absorption coefficient can be modified by adjusting the diameter of the first connecting port 1241, the width of the sound absorption band can be modified by adjusting the gap between different first connecting ports 1241 set on the same partition 124, and the position of the resonance sound absorption peak can be modified by adjusting the distance between the first connecting port 1241 on the current partition 124 and the next partition 124 / side plate 122 on the sound wave propagation path, so as to achieve the effect of slowing down the sound attenuation and reducing the output volume without affecting the propagation of the sound wave.

[0044] Under the resonant sound absorption effect, the acoustic impedance ratio can be calculated by the following formula:

[0045] z=r+jωm

[0046]

[0047]

[0048] Wherein, z is the acoustic impedance ratio, r is the acoustic resistance, jωm is the acoustic reactance, m is the acoustic mass, t is the thickness of the partition 124 provided with the first communication port 1241 , and d is the diameter of the first communication port 1241 .

[0049] The Helmholtz resonance frequency can be calculated by the following formula:

[0050]

[0051] Wherein, f0 is the Helmholtz resonance frequency, c is the speed of sound, S is the cross-sectional area of ​​the first connecting port 1241, d is the diameter of the first connecting port 1241, l is the distance between the two plates (adjacent partition plates 124 / side plates 122) in the resonant sound absorbing structure, and V is the volume of the Helmholtz resonance cavity.

[0052] Furthermore, a porous material is provided on one side of the side panel 122 close to the speaker body 11. If the second communication opening 1221 provided on the side panel 122 is completely misaligned with the area of ​​the first communication opening 1241 provided on the adjacent partition 124, when the sound wave is incident on the porous material on the side panel 122, a thermoviscous effect will be generated, so that the sound wave energy is further consumed during the propagation process in the speaker cavity 125. Please refer to the previous description for the relevant introduction of the thermoviscous effect, which will not be repeated here.

[0053] Furthermore, the speaker body 11 is attached to the cover plate 123 on one side of the first sound outlet 111, and the cover plate 123 is provided with a second sound outlet 1231 directly opposite to the first sound outlet 111, and the size of the second sound outlet 1231 is greater than or equal to the first sound outlet 111. Therefore, the sound waves emitted by the speaker body 11 through the first sound outlet 111 can be transmitted to the outside of the speaker housing 12 through the second sound outlet 1231.

[0054] The technical effects that can be achieved by this embodiment are as follows:

[0055] It is understandable that (Scheme 1) the method of setting a speaker cavity in the device cavity to absorb sound wave energy will affect the sound performance of the speaker body because the volume of the speaker cavity set in the device cavity is too small; the volume of the speaker cavity set in the device cavity is too large, which will occupy too much space in the device cavity. (Scheme 2) The speaker cavity is connected to the device cavity, so that the device cavity is used as an extension of the speaker cavity and the volume of the speaker cavity is expanded in disguise. When the sound wave enters the device cavity through the speaker cavity, it will produce abnormal sound and echo, that is, when the sound wave causes other components in the device cavity to vibrate, it will produce abnormal sound; when the sound wave is transmitted to the microphone in the device cavity, it will produce echo, thereby affecting the sound performance of the speaker.

[0056] To this end, the present application uses a partition to divide the inner cavity of the speaker into at least two independent sub-cavities, and the partition is provided with a first communication port connecting the sub-cavities, so that the sound wave can propagate to different sub-cavities through the first communication port. When the sound wave passes through the first communication port, a thermoviscous effect is formed, so that the sound wave energy is consumed / absorbed.

[0057] Furthermore, if the first connecting openings provided on adjacent partitions are misaligned, the partitions and the side panels can form a Helmholtz resonance cavity, and the resonance cavity can form a resonant sound absorption effect, so that the energy of the sound waves can be further consumed during the propagation of the sound waves in the speaker cavity. Furthermore, if the areas where the first connecting openings are provided on adjacent partitions are completely misaligned, the propagation path of the sound waves in the speaker cavity can be increased, so that the energy of the sound waves can be further consumed during the propagation of the sound waves in the speaker cavity. Furthermore, if a porous material is provided on one side of the partition 124 close to the speaker body 11, the energy of the sound waves can be further consumed during the propagation of the sound waves in the speaker cavity. Therefore, compared to Scheme 1, the present application can improve the sound performance of the speaker body without increasing the volume of the speaker back cavity.

[0058] Secondly, the present application further provides a second connecting port on the side panel to connect the inner cavity of the speaker and the inner cavity of the device. The second connecting port balances the air pressure inside and outside the inner cavity of the speaker, thereby increasing the volume of the rear cavity of the speaker in disguise. If a porous material is provided on the side of the side panel close to the speaker body, and the second connecting port provided on the side panel is completely misaligned with the area where the first connecting port is provided on the adjacent partition, then when the sound wave propagates in the inner cavity of the speaker, the energy of the sound wave is further consumed. And because the energy of the sound wave has been absorbed to a large extent when the sound wave propagates in the inner cavity of the speaker, the sound wave cannot form effective vibration when passing through the inner cavity of the speaker and entering the inner cavity of the device, reducing the risk of abnormal sound and echo. Therefore, compared with scheme two, the sound performance of the speaker body can be improved.

[0059] Embodiment 2

[0060] The same parts as those in the first embodiment are not described in detail in this embodiment. The difference from the first embodiment is that the partition 124 in this embodiment is a non-enclosed structure. The non-enclosed structure can be arranged in a line segment, an arc, etc. Adjacent partitions 124 can be arranged in parallel or non-parallel. This embodiment is described by taking the adjacent partitions 124 as a non-enclosed structure arranged in a straight line segment and the adjacent partitions 124 are parallel as an example.

[0061] Combined with reference Figure 9-10 , Fig. 9 yes Figure 1 A schematic diagram of the exploded structure of another embodiment of the speaker module, Fig.10 yes Figure 1 A schematic diagram of the cross-sectional structure of another embodiment of the middle speaker module along the z1-z2 direction.

[0062] like Figure 9-10As shown, the bottom plate 121, the side plate 122 and the cover plate 123 are arranged to form a speaker cavity 125. The partition 124 divides the speaker cavity 125 into at least two independent sub-cavities (not shown). The number of partitions 124 can be 1, 2, 3, etc., and this embodiment is described with the number of partitions 124 being 3. The at least two independent sub-cavities include a first sub-cavity 1251, a second sub-cavity 1252, a third sub-cavity 1253 and a fourth sub-cavity 1254.

[0063] The partition 124 is provided with a first communication port 1241 for connecting the sub-cavities. When there are multiple partitions 124, the first communication ports 1241 provided on adjacent partitions 124 are misaligned. The misalignment of the first communication ports 1241 provided on adjacent partitions 124 can be divided into two situations. The first situation is that the entire surface of the adjacent partitions 124 is provided with a first communication port 1241, but the first communication port 1241 on one partition 124 is not aligned / misaligned with the first communication port 1241 on the other partition 124. Fig.11 To explain, Fig.11 As shown, among two adjacent partitions 124 , the three first communication openings 1241 provided on one partition 124 are offset from the three first communication openings 1241 provided on the other partition 124 .

[0064] The second situation is that the area f where the first communication opening 1241 is provided on one partition 124 is completely misaligned with the area F where the first communication opening 1241 is provided on another partition 124, so that the first communication openings 1241 provided on adjacent partitions are misaligned. Fig.12 To explain, Fig.12 As shown, one of the partitions 124 includes regions M and N, and the other partition 124 includes regions m and n. M and m are completely opposite (M and n are completely misaligned), and N and n are completely opposite (N and m are completely misaligned). A first communication port 1241 is provided on M and n.

[0065] Furthermore, the side plate 122 is provided with a second communication opening 1221 , and the second communication opening 1221 provided on the side plate 122 is offset from the second communication opening 1221 provided on the adjacent partition plate 124 .

[0066] like Fig.10As shown, the speaker housing 12 includes 3 baffles 124, and the three baffles 124 are non-enclosed structures arranged in straight line segments, and adjacent baffles 124 are parallel. The three baffles 124 divide the speaker cavity 125 into four independent sub-cavities (the first sub-cavity 1251, the second sub-cavity 1252, the third sub-cavity 1253 and the fourth sub-cavity 1254). The speaker body 11 is arranged in the first sub-cavity 1251, so that the sound waves emitted by the speaker body 11 away from the first sound outlet 111 can pass through the first sub-cavity 1251, the second sub-cavity 1252, the third sub-cavity 1253 and the fourth sub-cavity 1254 in sequence (arrows indicate the propagation direction) to propagate outside the speaker cavity 125.

[0067] Embodiment 3

[0068] Combined with reference Figure 13-14 , Fig.13 is a schematic diagram of the structure of an embodiment of the electronic device of the present application, Fig.14 yes Fig.13 The cross-sectional structure diagram of the electronic device along the y1-y2 direction. The electronic device 1 involved in the present application may be a mobile phone, a walkie-talkie, a smart watch, etc. Fig.13 As shown, the electronic device 1 includes a speaker module 10 and a device housing 20. The speaker module 10 is disposed in a device inner cavity 21 of the device housing 20.

[0069] For the relevant description of the speaker module 10 , please refer to the previous embodiment, which will not be repeated here.

[0070] The speaker module 10 is provided with a second sound outlet 1231. One side of the second sound outlet 1231 of the speaker module 10 is attached to the device housing 20, and the device housing 20 is provided with a third sound outlet 22 directly opposite the second sound outlet 1231. The size of the third sound outlet 22 is greater than or equal to the size of the second sound outlet 1231, so that the sound waves emitted by the second sound outlet 1231 of the speaker module 10 can be further transmitted to the electronic device 1 through the third sound outlet 22 for the user to hear.

[0071] When the sound waves emitted from the side of the speaker module 10 away from the second sound outlet 1231 enter the device inner cavity 21 , the device inner cavity 21 is regarded as an extended part of the speaker inner cavity.

[0072] In addition, the device cavity 21 may also be provided with a microphone (receiver) 30. In this case, in conjunction with reference to Fig.15 , Fig.15 yes Fig.13 Schematic diagram of the internal structure of the electronic equipment. Fig.15As shown, the electronic device 1 includes a speaker module 10, a device housing 20 and a microphone 30. The device housing 20 is provided with a device inner cavity 21, and the speaker module 10 includes a speaker body 11 and a speaker housing 12, and the speaker body 11 is arranged in a speaker inner cavity 125 provided in the speaker housing 12.

[0073] Fig.16 This is a test result graph of the speaker's sound performance. Fig.16 I is the voice signal diagram of the speaker body under the existing speaker module (including the speaker body with a specification of 20*40mm), and II is the voice signal diagram of the speaker body under the speaker module of the present application (including the speaker body with a specification of 13*38). The test results show that when the speaker body with smaller specifications is replaced, II has an average improvement of 4~6dB compared with I, among which the low frequency is improved by 5~10dB.

[0074] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A speaker module, characterized in that: include: The speaker body is provided with a first sound outlet; A speaker housing comprises a bottom plate, a side plate, a cover plate and a partition plate, wherein the bottom plate, the side plate and the cover plate enclose an inner cavity of the speaker, the partition plate divides the inner cavity of the speaker into at least two independent sub-cavities, the speaker body is arranged in one of the sub-cavities, the partition plate is provided with a first connecting port connected to the sub-cavity, one side of the first sound outlet of the speaker body is attached to the cover plate, the cover plate is provided with a second sound outlet opposite to the first sound outlet, the side plate is provided with a second connecting port, the second connecting port provided on the side plate is offset from the first connecting port provided on the adjacent partition plate, and the sound wave can be transmitted out of the speaker cavity through the second connecting port after passing through the last sub-cavity.

2. The speaker module according to claim 1, characterized in that: The first communication openings provided on adjacent partitions are staggered.

3. The speaker module according to claim 1, characterized in that: The first communication opening and the second communication opening are holes or grooves.

4. The speaker module according to claim 1, characterized in that: The partition is a closed structure connected end to end, and one of two adjacent partitions is arranged around the other.

5. The speaker module according to claim 4, characterized in that: The closed structure is arranged in a rectangular shape.

6. The speaker module according to claim 1, characterized in that: The adjacent partitions are arranged in parallel.

7. The speaker module according to claim 1, characterized in that: A porous material is provided on a side of at least one of the side plate and the partition plate close to the speaker body.

8. An electronic device, characterized in that: include: Equipment housing; The speaker module as described in any one of claims 1-7, wherein the speaker module is arranged in the device inner cavity of the device housing.

9. The electronic device according to claim 8, characterized in that: The speaker module is provided with a second sound outlet, a side of the speaker module facing away from the second sound outlet is attached to the device housing, and the device housing is provided with a third sound outlet directly facing the second sound outlet.

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