Processing device and processing method

Abstract

The processing device of the present invention comprises: a first stage system, which has a platform (12) for carrying a workpiece (W) and moves the workpiece held on the platform; a light beam irradiation system (500), which includes a focusing optical system (530) for emitting a light beam (LB); and a control device, which controls the first stage system and the irradiation system; while moving the platform and the light beam from the focusing optical system relative to each other, a target part of the workpiece is processed, and at least one of the intensity distribution of the light beam on the first surface (MP) on the emission side of the focusing optical system and the intensity distribution of the light beam on the second surface whose position in the direction of the optical axis (AX) of the focusing optical system is different from that of the first surface can be changed.

Description

[0001] The present invention is a divisional application of the invention patent application with application number 201880037290.3 (PCT application number: PCT / JP2018 / 016986, invention name: Processing device and processing method, application date: April 26, 2018). Technical Field

[0002] The present invention relates to a processing device and a processing method, and more particularly, to a processing device and a processing method for processing a workpiece by irradiating a light beam. Background Art

[0003] In the field of machine tools for manufacturing machinery, there is a strong demand for processing devices using lasers or the like (see, for example, Patent Document 1) to improve the convenience and performance of machine tools.

[0004] [Prior Art Literature]

[0005] [Patent Document]

[0006] [Patent Document 1] U.S. Patent Application Publication No. 2002 / 0017509 Summary of the Invention

[0007] According to the first aspect of the present invention, there is provided a processing device for processing a workpiece by irradiating a light beam, and the device comprises: a first holding system having a first holding member for carrying the workpiece and moving the workpiece held by the first holding member; a light beam irradiation system including a focusing optical system for emitting the light beam; and a control device; while the first holding member and the light beam from the focusing optical system are moved relative to each other, a target portion of the workpiece is processed, and at least one of the intensity distribution of the light beam on the first surface on the emission side of the focusing optical system and the intensity distribution of the light beam on the second surface whose position in the optical axis direction of the focusing optical system is different from that of the first surface can be changed.

[0008] Here, the first surface may also be an imaginary surface that should be aligned with the target portion of the workpiece during processing. For example, the first surface may also be a surface perpendicular to the optical axis of the focusing optical system. The first surface may also be the image plane of the focusing optical system or a surface near it, or the rear focal plane or a surface near it.

[0009] According to the second aspect of the present invention, there is provided a processing device for processing a workpiece by irradiating a light beam, comprising: a first holding system having a first holding member for carrying the workpiece and moving the workpiece held by the first holding member; a light beam irradiation system including a focusing optical system for emitting the light beam; and a control device; while the light beam irradiated from the focusing optical system to the first surface is moved relative to the first holding member, a target portion of the workpiece is processed, and the light beam irradiation system has an optical element that can change the cross-sectional intensity distribution of the light beam emitted from the focusing optical system on the pupil plane of the focusing optical system.

[0010] According to the third aspect of the present invention, there is provided a processing device for processing a workpiece by irradiating a light beam, comprising: a first holding system having a first holding member for carrying the workpiece and moving the workpiece held by the first holding member; a light beam irradiation system including a focusing optical system for emitting the light beam; and a control device; while the first holding member and the light beam from the focusing optical system are moved relative to each other, a target portion of the workpiece is processed, and the intensity distribution of the light beam on a surface perpendicular to the optical axis of the focusing optical system on the emission surface side of the focusing optical system can be changed.

[0011] According to the fourth aspect of the present invention, there is provided a processing device for processing a workpiece by irradiating a light beam, comprising: a first holding system having a first holding member for carrying the workpiece and moving the workpiece held by the first holding member; a light beam irradiation system including a focusing optical system for emitting the light beam; and a control device; while the light beam irradiated from the focusing optical system to the first surface is moved relative to the first holding member, a target portion of the workpiece is processed, and the intensity distribution on the cross section of the light beam emitted from the focusing optical system is rotationally symmetric once.

[0012] According to the fifth aspect of the present invention, there is provided a processing method for processing a workpiece by irradiating a light beam, which comprises: holding the workpiece on a first holding member; and processing a target portion of the workpiece while causing a light beam emitted from a light beam irradiation portion including a focusing optical system to move relative to the first holding member holding the workpiece; and during the processing, changing at least one of the intensity distribution of the light beam on the first surface on the emission surface side of the focusing optical system and the intensity distribution of the light beam on the second surface whose position in the optical axis direction of the focusing optical system is different from that of the first surface.

[0013] According to the sixth aspect of the present invention, a processing method is provided, which is a processing method for processing a workpiece by irradiating a light beam, comprising: holding the workpiece on a first holding member; and processing a target portion of the workpiece while causing a light beam irradiated from a light beam irradiation portion including a focusing optical system to irradiate the first surface relative to the first holding member holding the workpiece; and during the processing, changing the intensity distribution of the light beam emitted from the focusing optical system on the pupil plane of the focusing optical system.

[0014] According to the 7th aspect of the present invention, a processing method is provided, which is a processing method for processing a workpiece by irradiating a light beam, comprising: holding the workpiece on a first holding member; and processing a target portion of the workpiece while causing the light beam irradiated to the first surface from a light beam irradiation portion including a focusing optical system to move relative to the first holding member holding the workpiece; and the intensity distribution on the cross section of the light beam emitted from the focusing optical system is rotationally symmetrical once.

[0015] According to the 8th aspect of the present invention, there is provided a processing method for processing a workpiece by irradiating a light beam, which comprises: holding the workpiece on a first holding member; and processing a target portion of the workpiece while causing a light beam emitted from a light beam irradiation portion including a focusing optical system to move relative to the first holding member holding the workpiece; and during the processing, changing the intensity distribution of the light beam on a surface perpendicular to the optical axis of the focusing optical system on the side of the emission surface of the focusing optical system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a block diagram showing the overall structure of a processing device according to one embodiment.

[0017] Figure 2 This is a diagram schematically showing the configuration of the first stage system together with the measurement system.

[0018] Figure 3 It is a perspective view showing the first stage system on which a workpiece is mounted.

[0019] Figure 4 This diagram shows the beam irradiation system together with a mask stage on which a mask is installed and a platform on which a workpiece is mounted.

[0020] Figure 5 A top view of the photomask.

[0021] Figure 6 A diagram showing an example of the configuration of a light source system included in the light beam irradiation system.

[0022] Figure 7This figure shows a situation where a parallel beam from the light source system is irradiated onto the second mirror array, and a reflected beam from each of a plurality of mirror elements is incident on the first partial illumination optical system.

[0023] Figure 8 This figure shows a state in which a parallel beam from the first partial illumination optical system is incident on the first mirror array, and a reflected beam from each of a plurality of mirror elements is incident on the condensing optical system.

[0024] Figure 9 (A) is an enlarged view showing the vicinity of the target surface of the workpiece when a light beam is irradiated from a focusing optical system to a target portion of the workpiece to form a slit-shaped irradiation area. Figure 9 (B) in the table represents Figure 9 FIG. 1 is a diagram showing the relationship between the slit-shaped irradiation area shown in (A) and the scanning direction.

[0025] Figure 10 (A) is an explanatory diagram of an example of a processing mode that can be set in the processing device of this embodiment. Figure 10 (B) in the figure is used to illustrate the processing diagrams of the light knife using mode 1, mode 2, mode 3 and mode 4 respectively. Figure 10 (C) in the figure is used to illustrate the processing diagram using the light knife of mode 5 and mode 6 respectively.

[0026] Figure 11 This is a diagram showing the arrangement of the measuring devices on the platform.

[0027] Figure 12 This figure shows the components of the measuring device that are placed inside the platform together with the measuring members.

[0028] Figure 13 (A) is an optical configuration diagram showing the measurement of the intensity distribution of a light beam on the image plane of the focusing optical system. Figure 13 (B) in FIG. 1 is a diagram showing an optical arrangement when measuring the intensity distribution of a light beam on a pupil plane.

[0029] Figure 14 This is a block diagram showing the input-output relationship of a control device that constitutes the core of the control system of a processing device.

[0030] Figure 15 This is a flowchart corresponding to a series of processing algorithms of the control device.

[0031] Figure 16 To express Figure 6 Flowchart of an example of the subroutine of step S10.

[0032] Figure 17The diagram shows the correspondence between the contents of various processes that can be performed by a processing device and existing machine tools for performing each process.

[0033] Figure 18 A diagram showing an example of a measuring device for measuring the intensity distribution of a light beam on a processing surface.

[0034] Figure 19 (A) to (D) are explanatory diagrams showing other examples of lighting shapes that can be set in the processing apparatus of one embodiment.

[0035] Figure 20 This is a diagram showing an example of using a plurality of stage plates in a processing apparatus according to one embodiment.

[0036] Figure 21 This is a diagram showing an example of a stage moving from below one of a measuring system and a beam irradiation system to below the other in a processing apparatus according to one embodiment. DETAILED DESCRIPTION

[0037] The following, according to Figures 1-21 , an embodiment is described. Figure 1 , the overall structure of a processing device 100 according to one embodiment is shown in a block diagram.

[0038] The processing device 100 irradiates a processing target object (also referred to as a workpiece) with a light beam (usually a laser beam) to perform various processing including removal processing (equivalent to cutting processing, grinding processing, etc. performed as machining).

[0039] The processing device 100 includes a first stage system 200A, a second stage system 200B, a transport system 300, a measuring system 400, and a light beam irradiation system 500, and a control device 600 for controlling the entire processing device 100 including these five systems. The transport system 300, the measuring system 400, and the light beam irradiation system 500 are arranged to be separated from each other in a predetermined direction. In the following description, for convenience, it is assumed that the transport system 300, the measuring system 400, and the light beam irradiation system 500 are arranged in the following X-axis direction (refer to Figure 2 ) are configured separately from each other.

[0040] At Figure 2 In FIG. 4 , the structure of the first stage system 200A is schematically shown together with the measurement system 400. Figure 3 In FIG. 1 , a perspective view is shown of the first stage system 200A carrying the workpiece W. Figure 2The left-right direction within the paper is set as the Y-axis direction, the direction perpendicular to the paper is set as the X-axis direction, the direction perpendicular to the X-axis and Y-axis is set as the Z-axis direction, and the rotation (tilt) directions around the X-axis, Y-axis and Z-axis are set as θx, θy and θz directions respectively for explanation.

[0041] The first stage system 200A changes the position and posture of the workpiece W. Specifically, the position of the workpiece W in the six degrees of freedom (DOF) directions (X-axis, Y-axis, Z-axis, θx, θy, and θz) is changed by moving the platform described below, which carries the workpiece W. In this specification, the position of the platform or workpiece in three DOF directions (θx, θy, and θz) is collectively referred to as "posture," and the position of the remaining three DOF directions (X-axis, Y-axis, and Z-axis) is collectively referred to as "position."

[0042] The first carrier system 200A has a Stewart platform type 6-degree-of-freedom parallel linkage mechanism as an example of a driving mechanism for changing the position and posture of the platform. The Stewart platform is a robot that supports a plane (component, such as a top plate) by 6 actuators and controls the position and slope of the top plate. The top plate constitutes the end effector. The top plate is supported at 3 locations, each of which is supported by 2 actuators. Each actuator can control its length and angle. The top plate has 6 degrees of freedom. Since the Stewart platform can control the top plate with 6 degrees of freedom, it is also called a 6-axis platform, a 6DOF platform, a 6-degree-of-freedom parallel linkage mechanism, etc. Furthermore, the first carrier system 200A is neither limited to being able to move the platform in 6 degrees of freedom directions nor limited to a parallel linkage mechanism.

[0043] like Figure 2 As shown, the first stage system 200A (but not including the stator of the planar motor described below) is arranged on a base BS which is placed on the floor F in such a manner that its upper surface is substantially parallel to the XY plane. Furthermore, a vibration isolation device may be arranged between the floor F and the base BS. Figure 3 As shown, the first stage system 200A includes a slider 10 having a regular hexagonal shape when viewed from above, which constitutes a base platform, a platform 12 constituting an end effector, six retractable rods (connecting rods) 141-146 connecting the slider 10 and the platform 12, and retractable mechanisms 161-166 (in FIG. 1 ) which are respectively provided on the rods 141-146 and cause the rods to retract. Figure 3 Not shown in the figure, refer to Figure 14First stage system 200A is structured to control the movement of platform 12 with six degrees of freedom in three-dimensional space by independently adjusting the lengths of rods 141-146 using telescopic mechanisms 161-166. Because first stage system 200A utilizes a Stewart platform-type six-degree-of-freedom parallel linkage mechanism as the drive mechanism for platform 12, it offers high precision, high rigidity, high support force, and ease of inverse kinematics calculation.

[0044] In the processing apparatus 100 of this embodiment, the position and posture of the workpiece W (stage 12) are controlled relative to the light beam irradiation system 500, more specifically, the light beam from the illumination optical system described below, to achieve the desired processing of the workpiece. In principle, this can be reversed, and the light beam from the illumination optical system can be moved, or both the light beam and the workpiece (stage) can be moved. Since the light beam irradiation system 500 has a complex structure as described below, this makes workpiece movement more convenient.

[0045] Here, the platform 12 is composed of a plate member having a shape obtained by cutting off the vertices of an equilateral triangle. A workpiece W to be processed is placed on the upper surface of the platform 12. A chuck mechanism 13 (in the platform 12) is provided to fix the workpiece W. Figure 3 Not shown in the figure, refer to Figure 4 、 Figure 14 As the chuck mechanism 13, for example, a mechanical chuck or a vacuum chuck is used. In addition, a Figure 3 The measuring device 110 (see FIG. Figure 11 、 Figure 12 ). The measuring device 110 will be described in detail below. Figure 3 The shape shown can also be any shape such as a rectangular plate, a disk, etc.

[0046] In this case, according to Figure 3 As can be clearly seen, the ends of each of the rods 141-146 are connected to the slider 10 and the platform 12, respectively, via the universal joint 18. Furthermore, rods 141 and 142 are connected near one vertex of the triangle of the platform 12, and the slider 10 and these rods 141 and 142 form a roughly triangular arrangement. Similarly, rods 143, 144, and rods 145 and 146 are connected near the remaining vertices of the triangle of the platform 12, and the slider 10 and rods 143, 144, and rods 145 and 146 form a roughly triangular arrangement.

[0047] like Figure 3As represented by the rod 141, these rods 141-146 respectively have a first shaft member 20 and a second shaft member 22 that can move relative to each other in their axial directions. One end (lower end) of the first shaft member 20 is mounted on the slider 10 through a universal joint 18, and the other end (upper end) of the second shaft member 22 is mounted on the platform 12 through a universal joint.

[0048] A cylindrical hollow portion with a step is formed inside the first shaft member 20. A bellows-type air cylinder, for example, is housed at the lower end of the hollow portion. A pneumatic circuit and an air pressure source (not shown) are connected to the cylinder. Furthermore, the internal pressure of the cylinder is controlled by controlling the pressure of the compressed air supplied from the air pressure source through the pneumatic circuit, thereby causing the piston in the cylinder to reciprocate in the axial direction. Furthermore, the movement of the piston can also utilize the force of gravity acting on the piston.

[0049] Furthermore, an armature unit (not shown) composed of a plurality of armature coils arranged in the axial direction is arranged on the upper end side in the hollow portion of the first shaft member 20 .

[0050] On the other hand, one end portion (lower end portion) of the second shaft member 22 is inserted into the hollow portion of the first shaft member 20. A small diameter portion having a smaller diameter than the other portions is formed at one end portion of the second shaft member 22, and a tubular rotor yoke composed of a magnetic member is provided around the small diameter portion. A hollow cylindrical, i.e., cylindrical, magnet body composed of a plurality of permanent magnets of the same size is provided on the outer periphery of the rotor yoke. In this case, a hollow cylindrical magnet unit is formed by the rotor yoke and the magnet body. In this embodiment, a shaft motor as a type of electromagnetic linear motor is formed by the armature unit and the magnet unit. In the shaft motor constructed in this manner, a sinusoidal drive current of a predetermined period and predetermined amplitude is supplied to each coil of the armature unit serving as the stator, thereby utilizing the Lorentz force (driving force) generated by the electromagnetic interaction between the magnet unit and the armature unit, which is a kind of electromagnetic interaction, to cause the second shaft component 22 to move relative to the first shaft component 20 in the axial direction.

[0051] That is, in this embodiment, the first shaft member 20 and the second shaft member 22 are driven relative to each other in the axial direction by the cylinder and the shaft motor, thereby forming the telescopic mechanisms 161-166 (see FIG. 1 ) for respectively extending and retracting the rods 141-146. Figure 14 ).

[0052] Furthermore, the magnet unit serving as the rotor of the shaft motor is supported in a non-contact manner with respect to the armature unit serving as the stator via an air cushion provided on the inner peripheral surface of the first shaft member 20 .

[0053] Moreover, although Figure 3Although not shown in the figure, the rods 141-146 are provided with absolute linear encoders 241-246 for detecting the axial position of the second shaft member 22 with respect to the first shaft member 20, and the outputs of the linear encoders 241-246 are supplied to the control device 600 (refer to FIG. Figure 14 The axial position of the second shaft member 22 detected by the linear encoders 241 to 246 corresponds to the length of each of the rods 141 to 146 .

[0054] The control device 600 controls the telescopic mechanisms 161-166 (see Figure 14 ). The detailed structure of the parallel linkage mechanism similar to the first stage system 200A of the present embodiment is disclosed in, for example, the specification of U.S. Patent No. 6,940,582. The control device 600 controls the position and posture of the platform 12 through the telescopic mechanisms 161-166 using inverse kinematics calculations in the same manner as disclosed in the specification of the aforementioned U.S. Patent.

[0055] In the first stage system 200A, the telescopic mechanisms 161-166, respectively attached to rods 141-146, comprise pneumatic cylinders and axial motors, a type of electromagnetic linear motor, arranged in series (or parallel). Therefore, the control device 600 can control the air pressure in the pneumatic cylinders to achieve coarse and large movements of the stage 12, while also using the axial motors to achieve fine and minute movements. As a result, the position (i.e., position and posture) of the stage 12 in all six degrees of freedom can be accurately controlled in a short period of time.

[0056] Furthermore, since the rods 141-146 respectively have air cushions that support the magnet unit of the rotor of the shaft motor relative to the armature unit of the stator in a non-contact manner, friction that becomes a non-linear component when the control rod is extended and retracted through the telescopic mechanism can be avoided, thereby enabling the position and posture of the platform 12 to be controlled with higher precision.

[0057] Furthermore, in this embodiment, an axial motor is used as an electromagnetic linear motor constituting the telescopic mechanism 161-166. In the axial motor, a magnet unit is used on the rotor side. The magnet unit uses a cylindrical magnet, so that a magnetic flux (magnetic field) can be generated in the entire radiation direction of the magnet. The magnetic flux in the entire direction helps to generate a Lorentz force (driving force) by utilizing the mutual interaction of electromagnetics, and can generate a thrust that is significantly larger than that of a conventional linear motor, thereby being easier to miniaturize than a hydraulic cylinder.

[0058] Therefore, the first stage system 200A in which each rod includes a shaft motor can simultaneously achieve compactness, weight reduction, and improved output, and can be preferably applied to the processing device 100.

[0059] Furthermore, the control device 600 can damp low-frequency vibrations by controlling the air pressure of the air cylinders that constitute the telescopic mechanism, and can insulate high-frequency vibrations by controlling the current of the shaft motor.

[0060] The first stage system 200A further includes a planar motor 26 (see Figure 14 ). On the bottom surface of the slider 10, a rotor of a planar motor 26 composed of a magnet unit (or a coil unit) is provided, and correspondingly, inside the base BS, a stator of a planar motor 26 composed of a coil unit (or a magnet unit) is accommodated. On the bottom surface of the slider 10, a plurality of air bearings (air static pressure bearings) are provided to surround the rotor, and through the plurality of air bearings, the slider 10 is suspended and supported on the upper surface (guide surface) of the base BS that is finely processed to a high degree of flatness across a predetermined gap (interval or gap). By utilizing the electromagnetic force (Lorentz force) generated by the electromagnetic interaction between the stator and the rotor of the planar motor 26, the slider 10 moves in a non-contact manner in the XY plane relative to the upper surface of the base BS. In this embodiment, as Figure 1 As shown, the first stage system 200A can move the platform 12 freely between the configuration positions of the measurement system 400, the beam irradiation system 500, and the conveying system 300. Furthermore, the first stage system 200A can also include a plurality of platforms 12 on each of which a workpiece W is mounted. For example, Figure 20 As shown, there are two platforms (12a, 12b) (at Figure 20 In the figure, the sensor unit 38 shown below represents the measurement system 400, and the focusing optical system 530 shown below represents the light beam irradiation system 500. For example, while a workpiece held by one of the multiple platforms is being processed using the light beam irradiation system 500, measurement using the measurement system 400 can be performed on a workpiece held by another platform. In this case, each platform can freely move between the positions where the measurement system 400, the light beam irradiation system 500, and the conveying system 300 are arranged. Alternatively, in a configuration in which a platform is provided specifically to hold the workpiece during measurement using the measurement system 400, and a platform is provided specifically to hold the workpiece during processing using the light beam irradiation system 500, and the workpiece can be moved in and out of these two platforms using a workpiece conveying system, etc., each slider 10 can be fixed to the base BS. Even when multiple platforms 12 are provided, each platform 12 can move in six degrees of freedom, and its position in these six degrees of freedom can be controlled.

[0061] Furthermore, the planar motor 26 is not limited to an air-levitation type; a magnetic-levitation type planar motor may also be used. In the latter case, there is no need to provide an air bearing on the slider 10. Furthermore, the planar motor 26 may be either a moving magnet type or a moving coil type.

[0062] The control device 600 can freely move the slider 10 in the X and Y two-dimensional directions on the base BS by controlling at least one of the magnitude and direction of the current supplied to each coil of the coil unit constituting the planar motor 26 .

[0063] In this embodiment, the first stage system 200A includes a position measuring system 28 (see FIG. 28 ) for measuring position information of the slider 10 in the X-axis direction and the Y-axis direction. Figure 14 ). As the position measurement system 28, a two-dimensional absolute encoder can be used. Specifically, a two-dimensional scale having a strip-shaped absolute code of a predetermined width extending over the entire length in the X-axis direction is provided on the upper surface of the base BS. Correspondingly, a light source such as a light-emitting element, an X-head including a one-dimensional array of light-receiving elements arranged in the X-axis direction, and a Y-head including a one-dimensional array of light-receiving elements arranged in the Y-axis direction are provided on the bottom surface of the slider 10. These one-dimensional arrays of light-receiving elements respectively receive the reflected light from the two-dimensional scale illuminated by the light beam emitted by the light source. Furthermore, the two-dimensional scale can also be provided on the bottom surface of the slider 10, and the encoder head can be provided on the base BS. As a two-dimensional scale, for example, a plurality of square reflective parts (marks) are two-dimensionally arranged at a certain period along two directions (X-axis direction and Y-axis direction) orthogonal to each other on a non-reflective substrate (reflectivity 0%), and the reflective characteristics (reflectivity) of the reflective parts have a gradation according to a predetermined rule. For example, a two-dimensional absolute encoder similar to that disclosed in U.S. Patent Application Publication No. 2014 / 0070073 can be used. This absolute two-dimensional encoder, with the same structure as that disclosed in U.S. Patent Application Publication No. 2014 / 0070073, can measure two-dimensional position information with the same high accuracy as conventional incremental encoders. Because it is an absolute encoder, unlike incremental encoders, it does not require origin detection. Measurement information from the position measurement system 28 is transmitted to the control device 600.

[0064] In this embodiment, as described below, the measuring system 400 measures the position information (in this embodiment, shape information) in three-dimensional space of at least a portion of a target surface (e.g., the top surface) of a workpiece W mounted on the platform 12, and after this measurement, the workpiece W is processed. Here, the target surface refers to the surface on which the target portion to be processed is located. Therefore, when measuring the shape information of at least a portion of the target surface of the workpiece W, the control device 600 can associate the position and posture of the target portion on the target surface of the workpiece W mounted on the platform 12 with the reference coordinate system of the processing device 100 (hereinafter referred to as the platform coordinate system) by associating the measurement results with the measurement results of the linear encoders 241-246 mounted on the rods 141-146 and the measurement results of the position measurement system 28 during the measurement. Thus, by controlling the position of the stage 12 in the six degrees of freedom directions based on the measurement results of the linear encoders 241-246 and the position measurement system 28, the position of the target portion (target surface) on the workpiece W in the six degrees of freedom directions can be controlled relative to the target value. In this embodiment, since absolute encoders are used as the linear encoders 241-246 and the position measurement system 28, an origin search is unnecessary, making resetting easy. Furthermore, the position information in the three-dimensional space measured by the measurement system 400 to control the position of the target portion of the workpiece W in the six degrees of freedom directions relative to the target value by controlling the position of the stage 12 in the six degrees of freedom directions is not limited to the shape; three-dimensional position information of at least three points corresponding to the shape of the target surface is sufficient.

[0065] Furthermore, in this embodiment, the planar motor 26 is described as a drive device for moving the slider 10 within the XY plane. However, a linear motor may be used in place of the planar motor 26. In this case, an absolute linear encoder may be used in place of the two-dimensional absolute encoder to form a position measurement system for measuring the position information of the slider 10. Furthermore, the position measurement system for measuring the position information of the slider 10 is not limited to one using an encoder; an interferometer system may also be used.

[0066] Furthermore, in this embodiment, a case where a planar motor that moves a slider within the XY plane and a Stewart platform-type 6-DOF parallel linkage mechanism in which the slider forms a base platform are used to form the mechanism for moving the platform is exemplified. However, the present invention is not limited to this, and other types of parallel linkage mechanisms or mechanisms other than parallel linkage mechanisms may also be used to form the mechanism for moving the platform. For example, a slider that moves within the XY plane and a Z-tilt drive mechanism that moves the platform 12 in the Z-axis direction and in an inclined direction relative to the XY plane on the slider may also be used. As an example of such a Z-tilt drive mechanism, a mechanism that supports the platform 12 from below at each vertex of a triangle via a joint other than a universal joint, for example, and includes three actuators (such as voice coil motors) that can independently drive each support point in the Z-axis direction can be cited. However, the configuration of the mechanism for moving the platform of the first stage system 200A is not limited to these. Any configuration is sufficient as long as the platform (movable member) on which the workpiece is placed can be moved in at least five directions of freedom: three degrees of freedom within the XY plane, the Z-axis direction, and an angle relative to the XY plane. A slider that moves within the XY plane is not required. For example, the first stage system can be composed of a platform and a robot (e.g., a multi-jointed robot) that moves the platform. Regardless of the configuration, as long as a measurement system that measures the position of the platform is constructed using a combination of absolute linear encoders, or a combination of such linear encoders and absolute rotary encoders, resetting can be facilitated.

[0067] Alternatively, the first stage system 200A may be replaced with a system capable of moving the platform 12 in at least five degrees of freedom: three degrees of freedom within the XY plane (including the θz direction), the Z-axis direction, and an angle relative to the XY plane (θx or θy). In this case, the platform 12 itself can be suspended (non-contact supported) above the surface of a support member such as a base BS, separated by a predetermined gap (interval or clearance) using air or magnetic levitation. This configuration allows the platform to move non-contact with respect to the supporting member, significantly improving positioning accuracy and significantly contributing to improved processing precision.

[0068] The measuring system 400 measures the three-dimensional position information of the workpiece, for example, the shape, in order to associate the position and posture of the workpiece mounted on the stage 12 with the stage coordinate system. Figure 2 As shown, the measurement system 400 includes a laser non-contact three-dimensional measuring machine 401. The three-dimensional measuring machine 401 includes a frame 30 mounted on a base BS, a head 32 attached to the frame 30, a Z-axis member 34 attached to the head 32, a rotation mechanism 36 provided at the lower end of the Z-axis member 34, and a sensor unit 38 connected to the lower end of the rotation mechanism 36.

[0069] The frame 30 is composed of a horizontal member (first supporting member) 40 extending in the Y-axis direction and a pair of column members (second supporting members) 42 supporting the horizontal member 40 from below at both ends in the Y-axis direction.

[0070] The head 32 is mounted to the horizontal member 40 of the frame 30 .

[0071] Furthermore, a vibration isolation device may be provided between the base BS and the column member 42. Also, a vibration isolation device may be provided between the column member 42 and the horizontal member 40. Also, a vibration isolation device may be provided between the horizontal member 40 and the head 32.

[0072] The Z-axis member 34 is mounted on the head 32 so as to be movable in the Z-axis direction. Figure 2 Not shown in the figure, refer to Figure 14 ) and moves in the Z-axis direction. The Z-axis position (or displacement from the reference position) of the Z-axis member 34 is determined by the Z encoder 46 (at Figure 2 Not shown in the figure, refer to Figure 14 ) and measure.

[0073] The rotation mechanism 36 can rotate the sensor portion 38 continuously (or in steps of a predetermined angle) within a predetermined angular range (e.g., a range of 90 degrees (π / 2) or 180 degrees (π)) around a rotation center axis parallel to the Z axis relative to the head portion 32 (Z-axis member 34). In the present embodiment, the rotation center axis of the sensor portion 38 passing through the rotation mechanism 36 coincides with the center axis of the linear light irradiated from the irradiation portion described below constituting the sensor portion 38, but may not coincide with the center axis of the linear light irradiated from the irradiation portion described below constituting the sensor portion 38. The rotation angle of the sensor portion 38 passing through the rotation mechanism 36 from the reference position (or the position of the sensor portion 38 in the θz direction) is determined, for example, by a rotation angle sensor 48 (e.g., a rotary encoder) or the like. Figure 2 Not shown in the figure, refer to Figure 14 ) and measure.

[0074] The sensor unit 38 has a sensor for detecting the object to be detected placed on the platform 12 ( Figure 2 The irradiation unit 50 irradiates the workpiece (W) with a line light for optical cutting, and the detection unit 52 detects the surface of the object to be detected where an optical cutting plane (line) appears due to the irradiation of the line light. In addition, the sensor unit 38 is connected to a calculation processing unit 610 for determining the shape of the object to be detected based on the image data detected by the detection unit 52. In this embodiment, the calculation processing unit 610 is included in the control device 600 (see FIG. 1 ) for comprehensively controlling the various components of the processing device 100. Figure 1 and Figure 14 ).

[0075] The irradiation unit 50 is composed of a cylindrical lens (not shown) and a slit plate with a relatively thin strip-shaped notch, and receives illumination light from a light source to generate line light 50a. As the light source, an LED, a laser light source, or an SLD (superluminescent diode) can be used. When an LED is used, the light source can be formed economically. Furthermore, when a laser light source is used, since it is a point light source, it can generate line light with less aberration, excellent wavelength stability, and a small half-value width. Since a filter with a small half-value width can be used to cut off stray light, the influence of interference can be reduced. Furthermore, when an SLD is used, in addition to the characteristics of a laser light source, since its coherence is lower than that of laser light, the generation of spots on the surface of the object to be inspected can be suppressed. The detection unit 52 is used to capture the line light 50a projected onto the surface of the object to be inspected (workpiece W) from a direction different from the light irradiation direction of the irradiation unit 50. The detection unit 52 is comprised of an imaging lens or CCD (not shown). As described below, the stage 12 is moved to scan the object to be inspected (workpiece W) with line light 50a, thereby capturing an image of the object to be inspected (workpiece W). Furthermore, the positions of the irradiation unit 50 and the detection unit 52 are determined so that the direction of incidence of the line light 50a on the surface of the object to be inspected (workpiece W) relative to the detection unit 52 forms a predetermined angle θ with the direction of light irradiation from the irradiation unit 50. In this embodiment, the predetermined angle θ is set to, for example, 45 degrees, but this angle may be other than 45 degrees.

[0076] Image data of the object to be inspected (workpiece W) captured by the inspection unit 52 is transmitted to the processing unit 610, where predetermined image processing is performed to calculate the surface height of the object to be inspected (workpiece W) (e.g., the position of multiple locations on the surface of the object to be inspected (workpiece W) in the Z-axis direction), thereby determining the three-dimensional shape (surface shape) of the object to be inspected (workpiece W). The processing unit 610 calculates the height of the surface of the object to be inspected (workpiece W) from a reference plane based on the position information of the optical cross-section (line) produced by the line light 50a, which is deformed by the unevenness of the object to be inspected (workpiece W), in the image of the object to be inspected (workpiece W). The processing unit 610 uses the principle of triangulation for each pixel in the longitudinal direction of the optical cross-section (line) (line light 50a), thereby determining the three-dimensional shape of the object to be inspected (workpiece W).

[0077] In this embodiment, the control device 600 causes the platform 12 to scan the surface of the object to be inspected (workpiece W) by moving the platform 12 in a direction intersecting the longitudinal direction of the line light 50a projected onto the object to be inspected (workpiece W), for example, in the Y-axis direction, which is approximately perpendicular to the longitudinal direction of the line light 50a. The control device 600 detects the rotation angle of the sensor unit 38 using the rotation angle sensor 48 and, based on the detection result, moves the platform 12 in the Y-axis direction, which is approximately perpendicular to the longitudinal direction of the line light 50a. In this manner, in this embodiment, the platform 12 is moved when measuring the shape of the object to be inspected (workpiece W). Based on this, the position and posture (position in the six degrees of freedom directions) of the platform 12 are always set to a predetermined reference state while the workpiece W is moved below the sensor unit 38 of the measurement system 400. The reference state is, for example, a state in which the rods 141-146 are all at a length corresponding to the neutral point of their telescopic stroke range (or minimum length). In this state, the positions of the platform 12 in the Z-axis, θx, θy, and θz directions are (Z, θx, θy, θz) = (Z0, 0, 0, 0). Furthermore, in this reference state, the position (X, Y) of the platform 12 in the XY plane coincides with the X, Y position of the slider 10 measured by the position measurement system 28.

[0078] Subsequently, the aforementioned measurement of the object to be inspected (workpiece W) begins. During this measurement, the position of the stage 12 in the six degrees of freedom is managed on the stage coordinate system by the control device 600. Specifically, the control device 600 controls the planar motor 26 based on measurement information from the position measurement system 28 and the telescopic mechanisms 161-166 based on the measurement values ​​of the linear encoders 241-246, thereby controlling the position of the stage 12 in the six degrees of freedom.

[0079] When the light section method is used in the three-dimensional measuring machine 401 of this embodiment, it is preferable to arrange the line light 50a emitted from the irradiation unit 50 of the sensor unit 38 to the object to be inspected (workpiece W) in a direction perpendicular to the relative movement direction of the sensor unit 38 and the stage 12 (the object to be inspected (workpiece W)). Figure 2 In the example, when the relative movement direction between the sensor unit 38 and the object to be inspected (workpiece W) is set to the Y-axis, it is ideal to arrange the line light 50a along the X-axis. This allows the entire area of ​​the line light 50a to be effectively utilized during measurement, allowing for optimal shape measurement of the object to be inspected (workpiece W). The rotation mechanism 36 is provided to ensure that the orientation of the line light 50a is always perpendicular to the relative movement direction.

[0080] The three-dimensional measuring machine 401 is constructed similarly to the shape measurement device disclosed in U.S. Patent Application Publication No. 2012 / 0105867. However, unlike the device described in U.S. Patent Application Publication No. 2012 / 0105867, which scans the object under test with linear light in directions parallel to the X and Y planes by moving the sensor unit, this embodiment differs in that it does so by moving the platform 12. Furthermore, in this embodiment, when scanning the object under test with linear light in a direction parallel to the Z axis, either the Z-axis member 34 or the platform 12 may be moved.

[0081] In the measurement method using the three-dimensional measuring device 401 of this embodiment, a linear projection pattern consisting of a single line of light is projected onto the surface of the object being measured using the light section method. Each time the linear projection pattern is scanned across the entire surface of the object being measured, the linear projection pattern projected onto the object being measured is captured from an angle different from the projection direction. Subsequently, based on the captured image of the object's surface, the height of the object's surface from a reference plane is calculated using triangulation principles, etc., for each pixel in the longitudinal direction of the linear projection pattern, thereby determining the three-dimensional shape of the object's surface.

[0082] Furthermore, as a three-dimensional measuring device constituting measurement system 400, a device having a configuration similar to that of an optical probe disclosed in U.S. Patent No. 7,009,717 may be used. This optical probe is composed of two or more optical groups, each including two or more viewing directions and two or more projection directions. Each optical group includes one or more viewing directions and one or more projection directions, with at least one viewing direction and at least one projection direction differing between optical groups. Data obtained based on a viewing direction is generated solely from patterns projected from the projection directions of the same optical group.

[0083] The measuring system 400 may also include a mark detection system 56 (see FIG. 5 ) for optically detecting alignment marks instead of the three-dimensional measuring machine 401. Figure 14 ), or a mark detection system 56 (see Figure 14 ). The mark detection system 56 can detect, for example, an alignment mark formed on the workpiece. The control device 600 calculates the position and posture of the workpiece (or platform 12) by using the mark detection system 56 to accurately detect the center positions (three-dimensional coordinates) of at least three alignment marks respectively. The mark detection system 56 can be composed of, for example, a stereo camera. Furthermore, the mark detection system 56 can be used to detect, in addition to detecting the alignment mark of the workpiece, an alignment mark provided on the platform 12 holding the workpiece, or to detect an alignment mark provided on the platform 12 holding the workpiece instead of detecting the alignment mark of the workpiece.

[0084] In this embodiment, the control device 600 uses the three-dimensional measuring machine 401 to scan the surface (target surface) of the workpiece W in the manner described above, and obtains its surface shape data. Subsequently, the control device 600 uses the surface shape data to perform least squares processing, and associates the three-dimensional position and posture of the target surface on the workpiece with respect to the platform coordinate system. Here, in the measurement of the object to be detected (workpiece W), the position of the platform 12 in the six degrees of freedom directions is managed by the control device 600 on the platform coordinate system. Therefore, after the three-dimensional position and posture of the workpiece are associated with the platform coordinate system, including during processing, the control of the position (i.e., position and posture) of the workpiece W in the six degrees of freedom directions can be performed by controlling the platform 12 according to the platform coordinate system.

[0085] At Figure 4 , the beam irradiation system 500 is shown together with the mask stage 15 as a holding member for holding the mask M and the stage 12 on which the workpiece W is mounted.

[0086] A mask M as an opening member having a plurality of openings (opening pattern) is held on the mask carrier 15 constituting a part of the second carrier system 200B. Furthermore, a mask having a through hole as an opening may be used, and a mask may be formed by vapor-depositing a light-shielding material such as chromium on the upper or lower surface of a substrate (synthetic quartz, etc.) through which a light beam can pass, so as to form an opening. In this embodiment, the mask M is permanently provided on the mask carrier 15, but a structure in which the mask on the mask carrier 15 is replaceable may also be adopted. The second carrier system 200B can change the position of the mask M relative to the focusing optical system 530 as described below by moving the mask carrier 15. Specifically, by utilizing the mask carrier drive system 17 (at Figure 4 Not shown in the figure, refer to Figure 14 ) moves the mask stage 15 on which the mask M is permanently mounted in the four degrees of freedom directions (the X-axis, Y-axis, Z-axis, and θz directions) to change the position of the mask M in the four degrees of freedom directions. The position information of the mask stage 15 in the X-axis direction, the Y-axis direction, the θz direction, and the Z-axis direction is obtained by, for example, a mask stage position measurement system 19 (in Figure 4 Not shown in the figure, refer to Figure 14 ), for example, with a resolution of about 0.25-1 nm. The photomask stage position measurement system 19 may also be constituted by sensors other than the encoder system.

[0087] The mask stage drive system 17 is comprised of, for example, a magnetically levitated planar motor. It is not limited to a planar motor; for example, a linear motor system capable of moving the mask stage 15 not only in the X- and Y-axis directions but also in the Z-axis direction can also be used. Furthermore, the mask stage drive system 17 enables the mask stage 15 to move in four degrees of freedom, but it can also enable the mask stage 15 to move in six degrees of freedom. If the aperture can be modified, the mask stage 15 can also be configured to move only in the X- or Y-axis directions.

[0088] In this embodiment, a film-shaped or plate-shaped mask is used as the mask M. A template mask can also be used as the mask M. The mask M can also be formed of a material with low thermal expansion. Figure 4 As shown in the middle cross-sectional view, a through hole 15a in the vertical direction (Z-axis direction) is formed on the mask stage 15 to serve as a path for the light beam, and the mask M is arranged on the upper part of the through hole 15a. Figure 5 , a top view of the mask M is shown. Figure 5 As shown, on the mask M, there are formed a plurality of (4 as one example) slit-shaped openings extending in the X-axis direction with the same line width (for example, 10 μm) and different lengths in the X-axis direction, a plurality of (4 as one example) slit-shaped openings extending in the Y-axis direction with the same line width (for example, 10 μm) and different lengths in the Y-axis direction, a plurality of (4 as one example) circular openings (pinhole-shaped openings) with different diameters, and a plurality of (4 as one example) square openings with different side lengths. Figure 5 The openings PAa and PAb shown are slit-shaped openings with a line width of 10 mm and a length of 10 mm, respectively. Furthermore, the opening Pac is a pinhole-shaped opening with a diameter of 10 μm, as an example. Furthermore, the shape of the opening is of course not limited to slits, circles, or squares. It can be other shapes such as rectangles and polygons, and it is also possible not to have at least one of a slit-shaped opening, a circular opening, or a square opening. Furthermore, the number (type) of openings of each shape is not limited to four. For example, the number of circular openings can be one, and the number of square openings can be three.

[0089] like Figure 4 As shown, the light beam irradiation system 500 includes a light source system 510 , an illumination optical system 520 for irradiating the mask M with a light beam emitted from the light source system, and a focusing optical system 530 for focusing the light beam passing through the mask M on a target surface of the workpiece W.

[0090] like Figure 6 As shown, the light source system 510 includes a light source unit 60 , an optical fiber 62 connected to the light source unit 60 , a double fly-eye optical system 64 arranged on the emission side of the optical fiber 62 , and a condenser lens system 66 .

[0091] The light source unit 60 includes a housing 68 and a plurality of laser units 70 housed within the housing 68 and arranged in parallel in a matrix. Laser units 70 can use various lasers that operate in pulsed or continuous wave oscillation, such as carbon dioxide lasers, Nd:YAG lasers, fiber lasers, or GaN semiconductor lasers. Furthermore, the lasers used in the laser units 70 can be nanosecond lasers, picosecond lasers, or femtosecond lasers.

[0092] The optical fiber 62 is a bundle formed by randomly bundling multiple bare optical fibers. It includes multiple inlets 62a, each connected to the emission ends of multiple laser units 70, and an emission portion 62b having a greater number of emission ports than the inlets 62a. The optical fiber 62 receives multiple laser beams (hereinafter referred to as "beams") emitted from each of the multiple laser units 70 through each inlet 62a and distributes them equally to the multiple emission ports, allowing at least a portion of each laser beam to be emitted from a common emission port. In this way, the optical fiber 62 mixes the beams emitted from the multiple laser units 70 and emits them. This allows the total output to be increased in proportion to the number of laser units 70, compared to using a single laser unit. However, if a single laser unit can achieve sufficient output, multiple laser units may not be used.

[0093] Here, the emission portion 62b has a cross-sectional shape similar to the overall shape of the incident end of the first fly-eye lens system, which constitutes the incident end of the double fly-eye optical system 64 (described below), and the emission ports are arranged in a substantially even pattern within this cross-sectional shape. Therefore, the optical fiber 62 also functions as a shaping optical system that shapes the light beams mixed in the above manner to have a shape similar to the overall shape of the incident end of the first fly-eye lens system. Furthermore, the emission portion 62b can be positioned away from the incident surface of the first fly-eye lens system 72 in the optical axis direction of the illumination optical system 520. In this case, the light intensity distribution formed on the incident surface of the first fly-eye lens system 72 becomes gentle, thereby improving the uniformity of the illumination distribution on the mask M. In this case, if the emitting portion 62b is too far away from the incident surface of the first fly-eye lens system 72 in the optical axis direction of the illumination optical system 520, there is a risk of light loss. Therefore, the distance between the emitting portion 62b and the incident surface of the first fly-eye lens system 72 in the optical axis direction can also be determined in view of the balance between illumination uniformity and light loss.

[0094] The double fly-eye optical system 64 is used to make the cross-sectional intensity distribution of the light beam (illumination light) uniform, and comprises a first fly-eye lens system 72, a lens system 74, and a second fly-eye lens system 76, which are sequentially arranged on the beam path (optical path) of the laser beam behind the optical fiber 62. Furthermore, an aperture is provided around the second fly-eye lens system 76.

[0095] In this case, the incident plane of the first fly-eye lens system 72 and the incident plane of the second fly-eye lens system 76 are set to be optically conjugate with each other. Furthermore, the exit-side focal plane of the first fly-eye lens system 72 (where a surface light source described below is formed), the exit-side focal plane of the second fly-eye lens system 76 (where a surface light source described below is formed), and the pupil plane (entrance pupil) PP2 of the converging optical system 530 are set to be optically conjugate with each other.

[0096] The light beams mixed by the optical fiber 62 are incident on the first fly-eye lens system 72 of the double fly-eye optical system 64. As a result, a surface light source, that is, a secondary light source composed of multiple light source images (point light sources), is formed on the exit-side focal plane of the first fly-eye lens system 72. Laser light from each of these multiple point light sources passes through the lens system 74 and is incident on the second fly-eye lens system 76. As a result, a surface light source (tertiary light source) is formed on the exit-side focal plane of the second fly-eye lens system 76, in which multiple tiny light source images are evenly distributed within a predetermined shape. Furthermore, to reduce the possibility of damage to the first fly-eye lens system 72 by the light beam, the exit-side focal plane of the first fly-eye lens system 72 may be a surface that is spaced away from the exit surface of the first fly-eye lens system 72 toward the light beam exit side. In this case, the secondary light source obtained by the first fly-eye lens system 72 is formed at a position offset from the exit surface of the first fly-eye lens system 72. Similarly, the emission-side focal plane of the second fly-eye lens system 76 may be a plane away from the emission surface of the second fly-eye lens system 76 toward the light beam emission side. In this case, the tertiary light source obtained by the second fly-eye lens system 76 is formed at a position offset from the emission surface of the second fly-eye lens system 76.

[0097] The condenser lens system 66 has a front focal point located at or near the exit surface of the second fly-eye lens system 76 , and emits the laser light emitted from the tertiary light source as a beam with uniform illumination distribution.

[0098] Furthermore, by optimizing the area of ​​the incident end of the second fly-eye lens system 76, the focal length of the condenser lens system 66, and the like, the light beam emitted from the condenser lens system 66 can be regarded as a parallel light beam.

[0099] The light source system 510 of this embodiment includes an illumination uniformization optical system comprising an optical fiber 62, a double-fly-eye optical system 64, and a condenser lens system 66. This illumination uniformization optical system is used to combine the light beams emitted from the plurality of laser units 70 to generate a parallel light beam having a uniform cross-sectional illumination distribution. Furthermore, uniformizing the cross-sectional illumination distribution may include achieving a state in which the illumination distribution on the beam cross section of the light beam emitted from the illumination uniformization optical system is closer to uniformity than the illumination distribution on the beam cross section of the light beam incident on the illumination uniformization optical system.

[0100] The illumination uniformization optical system is not limited to the above configuration, and may be configured using a rod integrator, a collimating lens system, or the like.

[0101] The light source unit 60 of the light source system 510 is connected to the control device 600 (see Figure 14 ), and the control device 600 individually controls the switching of the multiple laser units 70 constituting the light source unit 60. This adjusts the light intensity (laser output) of the laser beam transmitted from the focusing optical system 530 through the illumination optical system 520 (and the mask M) and irradiated onto the workpiece W (the target surface thereon). Furthermore, the light intensity (energy) of the laser beam irradiated onto the workpiece W (the target surface thereon) can be adjusted by adjusting the laser output of each of the multiple laser units 70. Alternatively, an adjustable attenuator can be disposed in the optical path between the multiple laser units 70 and the mask M to change the light intensity (energy) of the laser beam passing through the attenuator.

[0102] like Figure 4 As shown, the illumination optical system 520 includes an optical element 78 , a first partial illumination optical system 79 , a mirror array 80 , and a second partial illumination optical system 82 , which are sequentially arranged on the optical path of the parallel light beam from the light source system 510 (condenser lens system 66 ).

[0103] The optical element 78 can change the cross-sectional intensity distribution of the parallel light beam from the light source system 510 (condenser lens system 66). In this embodiment, the optical element 78 is composed of a mirror array that is a type of spatial light modulator (SLM). Here, the so-called spatial light modulator is a general term for elements that spatially modulate the amplitude (intensity), phase or polarization state of light traveling in a predetermined direction. Hereinafter, the optical element 78 is also referred to as the second mirror array 78. The second mirror array 78 can change the cross-sectional intensity distribution (illumination shape) of the parallel light beam from the light source system 510 in the pupil plane PP1 of the illumination optical system 520. Furthermore, in order to distinguish it from the second mirror array 78, the mirror array 80 is referred to as the first mirror array 80 (also referred to as the optical element 80).

[0104] like Figure 7 As shown, the second mirror array 78 includes: a base member 78A having a surface (hereinafter referred to as a reference surface for convenience) that is 45 degrees (π / 4) relative to the XY plane and the XZ plane; and K (=I×J) mirror elements 81. i，j (i=1-I, j=1-J), which are arranged in a matrix of, for example, I columns and J rows on the reference surface of the base member 78A; and the driving portion 78B (at Figure 7 Not shown in the figure, refer to Figure 14 ), which includes making each mirror element 81 i，j K actuators (not shown) that move individually.

[0105] Each mirror element 81 of the second mirror array 78 i，j The mirror element is configured to be rotatable about its rotation axis, and the inclination angle of its reflection surface relative to the reference surface can be set to any angle within a predetermined angle range. The angle of the reflection surface of each mirror element is detected by a sensor that detects the rotation angle of the rotation axis, such as a rotary encoder 83. i，j (At Figure 7 Not shown in the figure, refer to Figure 14 ) measurement. Furthermore, the mirror element 81 may also be provided i，j The at least one radiometer measures light and receives reflected light to optically detect a rotation angle of the at least one mirror surface measured by the radiometer.

[0106] The driving unit 78B includes, for example, an electromagnet or a voice coil motor as an actuator, and each mirror element 81 i，j Moves with very high response through actuator movement.

[0107] The plurality of mirror elements 81 constituting the second mirror array 78 i，j Each of the light sources is illuminated by a parallel beam from the light source system 510, and a plurality of reflected beams (parallel beams) LB are emitted in a direction corresponding to the inclination angle of the reflecting surface, and these reflected beams are incident on the first partial illumination optical system 79 (refer to Figure 7 ). The first partial illumination optical system 79 includes a plurality of lenses including relay lenses, and for example, has a pupil plane PP1 of the illumination optical system 520 therein. The first partial illumination optical system 79 includes a partial optical system 791 between the second mirror array 18 and the pupil plane PP1. The partial optical system 791 is configured such that its front focal position is located on or near the surface where the second mirror array 78 is configured and its rear focal position is located on or near the pupil plane PP1, and the plurality of reflected light beams LB from the second mirror array 78 are distributed on the pupil plane PP1 in accordance with the traveling directions of the plurality of reflected light beams LB. That is, the second mirror array 78 can be configured such that the plurality of mirror elements 81 are adjusted.i，j The cross-sectional intensity distribution of the light beam in the pupil plane PP1 is determined or changed by adjusting the inclination angle of each of the reflection surfaces of the second mirror array 78. i，j The cross-sectional shape (also referred to as the illumination shape) of the light beam on pupil plane PP1 is set or changed by adjusting the inclination angle of each of the reflection surfaces. Here, pupil plane PP1 is a conjugate plane of the pupil plane (incident pupil plane) PP2 of the converging optical system 530. Furthermore, the front focal position of the partial optical system 791 may not be located on or near the surface where the second mirror array 78 is arranged. Furthermore, the rear focal position of the partial optical system 791 may not be located on or near the pupil plane PP1.

[0108] Furthermore, the partial optical system 791 can also be regarded as an optical system that converts the angle of the incident light beam into the position of the emission side. Moreover, it is not limited to the spatial light modulator such as the mirror array, and the optical element 78 can also be formed by, for example, forming a plurality of aperture diaphragms on a rotatable disk component and replacing the plurality of aperture diaphragms on the optical path of the light beam, such as an illumination system aperture diaphragm plate. The illumination system aperture diaphragm plate can be arranged at or near the pupil plane PP1 in the first partial illumination optical system 79, or at or near the pupil plane PP2 of the focusing optical system 530. In this case, the optical element 78 may not be provided. Furthermore, since the second mirror array 78 can also be located at or near the image plane (processing plane MP (refer to Figure 4 、 Figure 9 (A))) or its vicinity, and prevents a portion of the parallel light beam from the light source system 510 (e.g., the parallel light beam from a portion of the mirror element (also referred to as a mirror surface, as appropriate)) from entering the illumination optical system 520. This allows adjustment of the intensity or intensity distribution of the processing light beam on the image plane (processing plane MP) of the converging optical system 530. For example, the intensity distribution within the irradiation area of ​​the processing light beam from the converging optical system 530 on the image plane (processing plane MP) of the converging optical system 530 can be adjusted.

[0109] In this embodiment, the parallel light beams passing through the optical element (for example, the second mirror array) 78 are transmitted through the first partial illumination optical system 79, the first mirror array 80, and the second partial illumination optical system 82 as described below, and are incident on the mask M. The parallel light beams are then incident on the focusing optical system 530 through the opening of the mask M. By changing the cross-sectional intensity distribution of the parallel light beams from the light source system 510 using the optical element (for example, the second mirror array) 78, the intensity distribution of the light beams in the pupil plane PP1 of the illumination optical system 520 and the pupil plane (entrance pupil) PP2 of the focusing optical system 530, that is, the cross-sectional shape of the light beams, can be changed.

[0110] Furthermore, because the optical element 78 is positioned conjugate with or near the image plane (processing plane MP) of the focusing optical system 530, the optical element 78 is used to transform the cross-sectional intensity distribution of the parallel light beam emitted from the light source system 510, thereby substantially changing the intensity distribution of the light beam emitted from the focusing optical system 530 on the image plane of the focusing optical system 530. For example, by setting the tilt angle of some of the mirrors of the second mirror array 78 so that the light beam reflected by these mirrors does not enter the illumination optical system 520, the intensity distribution within the illumination area of ​​the light beam on the image plane (processing plane MP) can be changed. Furthermore, because the optical element 78 is positioned conjugate with or near the surface where the opening of the mask M is located, the optical element 78 is used to transform the cross-sectional intensity distribution of the parallel light beam emitted from the light source system 510, thereby substantially changing or adjusting the intensity distribution of the light beam on the mask M. For example, a non-uniform intensity distribution can be imparted to the light beam entering the opening of the mask M.

[0111] Each mirror element 81 of the second mirror array 78 i，j The plurality of reflected light beams (parallel light beams) LB emitted in the direction corresponding to the inclination angle of the reflecting surface are incident on the pupil plane PP1 of the illumination optical system 520, and the cross-sectional intensity distribution (i.e., cross-sectional shape, illumination shape) in the pupil plane PP1 is the same as that of each mirror element 81 of the second mirror array 78. i，j The first partial illumination optical system 79 irradiates the first mirror array 80 disposed at a position conjugate with or near the pupil plane PP1 of the illumination optical system 520 with a light beam having the set cross-sectional intensity distribution.

[0112] like Figure 8 As shown, the first mirror array 80 includes: a base member 80A having a surface (hereinafter referred to as a reference surface for convenience) at an angle of 45 degrees (π / 4) relative to the XY plane and the XZ plane; for example, M (=P×Q) mirror elements 81 p，q (p=1-P, q=1-Q), which are arranged in a matrix of, for example, P columns and Q rows on the reference surface of the base member 80A; and the driving portion 80B (at Figure 4 Not shown in the figure, refer to Figure 14 ), which includes making each mirror element 81 p，q M actuators (not shown) move individually; and the first mirror array 80 and the second mirror array 78 are similarly constructed although facing left and right oppositely.

[0113] Among the plurality of mirror elements constituting the first mirror array 80, the mirror element 81 illuminated by the parallel light beam from the first partial illumination optical system 79 p，qEach of the mirror arrays 520 emits multiple reflected light beams (parallel light beams) LB in a direction corresponding to the inclination angle of its reflecting surface. These reflected light beams are then incident on the second partial illumination optical system 82, allowing the light beams emitted from the second partial illumination optical system 82 to be focused onto the mask M in any size and shape (e.g., a point or slit shape). The second partial illumination optical system 82 has its front focal point located at or near the position of the first mirror array 80, and its rear focal point located at or near the position of the mask M (e.g., the surface where the opening of the mask M is located). Therefore, in this embodiment, by adjusting the position of the mask M in the XY plane, it is possible to illuminate only a portion of the mask M, including any opening. Therefore, in this embodiment, the light beam from the illumination optical system 520 can be efficiently transmitted through the mask M and incident on the focusing optical system 530. Furthermore, as long as the light beam can be illuminated onto the opening of the mask M, the first mirror array 80 is not necessarily required. Furthermore, the front focus position of the second partial illumination optical system 82 may not be located at or near the first mirror array 80. Furthermore, the rear focus position of the second partial illumination optical system 82 may not be located at or near the mask M.

[0114] In this embodiment, the focusing optical system 530 is a high NA and low aberration optical system having a numerical aperture NA of, for example, 0.5 or greater, preferably 0.6 or greater. In this embodiment, a reduction projection lens having an NA of 0.75, a projection magnification of 1 / 10, and a maximum field of view of 1 mm square is used as the focusing optical system 530.

[0115] In this embodiment, the focusing optical system 530 has a large aperture, low aberration, and a high NA. Therefore, it can focus multiple light beams emitted from the first mirror array 80, transmitted through the second partial illumination optical system 82, onto the mask M, and then through a single opening in the mask M, onto at least one position or area on the image plane. Details will be described below, but in this embodiment, the light beam irradiation system 500 can focus the light beams emitted from the focusing optical system 530 into, for example, a point shape or a slit shape corresponding to the shape of the opening in the mask M. In this embodiment, the focusing optical system 530 can also be said to be able to reduce and project the opening pattern on the mask M onto the image plane, thereby forming a reduced image of the opening pattern on the image plane. Furthermore, on the image plane of the focusing optical system 530, the image of the opening (the area illuminated by the light beam) can be formed on the optical axis of the focusing optical system 530 or at a position offset from the optical axis. In this case, the opening of the mask M used for processing may be arranged at a position deviated from the optical axis of the condensing optical system 530 , and the light beam from the first mirror array 80 may be irradiated onto the opening.

[0116] Furthermore, by moving the mask carrier 15 and changing the opening used for processing, the size and shape of the irradiation area of ​​the light beam in the image plane (processing surface MP) of the focusing optical system 530 can be changed. Therefore, the mask carrier 15 can also be regarded as a part of the mechanism for changing the intensity distribution of the light beam in the image plane (processing surface MP) of the focusing optical system 530.

[0117] Furthermore, the focusing optical system 530 has one or more lenses ( Figure 4 、 Figure 8 The optical system 530 of this embodiment focuses the light onto the processing surface MP with a high energy density, which is directly related to improving the processing accuracy of the workpiece.

[0118] In this embodiment, the following case is described: by moving the stage 12 in a scanning direction parallel to the XY plane (at Figure 4 The light beam and the workpiece W are moved in the scanning direction (for example, the Y-axis direction) to set the processing target surface (also referred to as the target surface) TAS of the workpiece W provided with the target portion parallel to or perpendicular to the XY plane, and the light beam and the workpiece W are scanned relative to each other in the scanning direction while processing (processing) is performed. Furthermore, during processing, while the stage 12 moves in the Y-axis direction, it is also possible to move in at least one of the X-axis direction, the Z-axis direction, the θx direction, the θy direction, and the θz direction.

[0119] In the processing apparatus 100 of this embodiment, in order to realize high-throughput processing by making the best use of the greatly improved total laser output (laser power) by the method described above, the slit-shaped opening on the mask M, for example, the image of the slit-shaped opening PAa or PAb, that is, the irradiation area of ​​the slit-shaped light beam (see Figure 9 The symbol LS in (B) is formed on the image plane (hereinafter referred to as the processing plane) MP of the focusing optical system 530 (for example, refer to Figure 4 and Figure 9 The beam forming the irradiation area LS is scanned in a direction perpendicular to the longitudinal direction (Y-axis direction) relative to the workpiece W while performing the desired processing (e.g., removal processing). This allows processing, such as removal processing, to be performed simultaneously on a significantly larger area (e.g., an area several to several dozen times larger) than when the workpiece is scanned with a point-like beam.

[0120] Furthermore, Figure 4 、 Figure 9In FIG. 1 , an example of a removal process of a workpiece W is shown, and the position of the workpiece W is controlled so that the processing surface MP is consistent with the processed surface of the workpiece W (the surface after a part of the workpiece W is removed by the beam). In this case, according to Figure 4 、 Figure 9 It is clear that the unprocessed surface (target surface TAS) of the workpiece W is offset by ΔZ in the +Z direction from the image plane (processed surface MP). This ΔZ can also be determined by at least one of the intensity of the light beam, the material of the workpiece W, and the relative scanning speed between the light beam and the workpiece.

[0121] Furthermore, as long as the desired removal process is possible, the processed surface MP may not coincide with the processed surface of the workpiece W. For example, the position of the workpiece W may be controlled so that the target surface TAS of the workpiece W and the processed surface MP substantially coincide with each other.

[0122] In the processing device 100 of the present embodiment, by using the second mirror array 78 to set the cross-sectional intensity distribution of the pupil plane PP1 of the illumination optical system 520 of the parallel light beam from the light source system 510 (the cross-sectional intensity distribution in the pupil plane PP2 of the focusing optical system 530) and the opening on the mask M, the three-dimensional intensity distribution of the light beam on the first surface on the emission surface side of the focusing optical system 530 and its vicinity can be changed. This will be described in detail below. In the present embodiment, the so-called first surface on the emission surface side of the focusing optical system 530 is a surface for forming an image of the opening on the mask M, and refers to the processing surface MP when, for example, a part of the surface of the workpiece is removed by the light beam from the focusing optical system 530. In the present embodiment, the processing surface MP is the image plane of the focusing optical system 530 (for example, refer to Figure 4 and Figure 9 (A) in FIG, but the processing surface MP may also be a surface near the image plane. Furthermore, in this embodiment, the processing surface MP is perpendicular to the optical axis AX on the emission side of the focusing optical system 530, but it does not need to be perpendicular. Furthermore, in this embodiment, the light beam LB irradiated onto the processing surface MP can be said to function similarly to a tool used when performing cutting processing on the workpiece W. Therefore, in this specification, the front end of this light beam is also referred to as a light knife.

[0123] At Figure 10 In (A), an explanatory diagram of an example of the processing mode that can be set in the processing device 100 of this embodiment is shown. Here, six modes from mode 1 to mode 6 are explained. Figure 10 In (A) of FIG. 1 , in the diagram of “illumination shape”, a single-dot chain line represents an imaginary axis perpendicular to the center (optical axis) of the pupil plane. Figure 10In (A), the “illumination shape” is the cross-sectional intensity distribution (cross-sectional shape) of the light beam in the pupil plane PP1 of the illumination optical system 520 , but can also be referred to as the cross-sectional intensity distribution (cross-sectional shape) of the light beam in the pupil plane PP2 of the condensing optical system 530 .

[0124] Furthermore, Figure 10 In (A), the "front view" and "side view" of the tip of the light beam (light knife) show the shape of the tip of the light beam (light knife) between the imaginary plane perpendicular to the optical axis between the focusing optical system 530 and the image plane (processing surface MP) and the image plane (processing surface MP). In addition, when using a laser beam in a non-visible wavelength range, it can also be assumed to be visible and used. Figure 10 (A) in the figure is used for explanation.

[0125] Mode 1 is a processing mode in which a circular illumination shape centered on the optical axis is set with a uniform intensity distribution (also referred to as normal illumination) and a slit-shaped opening with a line width of 10 μm and a length of 10 mm, namely, the aforementioned opening PAa or PAb, is selected as the opening on the mask M. In this specification, the term "selected opening" includes the following: using the first mirror array 80, an illumination field (illumination area) of the illumination light is formed (set) only on a portion of the mask M containing the selected opening. Here, using the first mirror array 80 to form an illumination field only on a portion of the mask M containing the selected opening is intended to minimize laser power loss by concentrating the entire light beam emitted from the light source system 510 on the selected pattern portion.

[0126] In mode 1, if Figure 10 As shown in (A) in FIG, the shape of the light knife is an inverted isosceles trapezoid when viewed from the front, and the length of the blade tip is 1 mm. When viewed from the side, it is an inverted isosceles triangle with a blade tip size of 1 μm. Figure 10 In (A), the directions indicated by the coordinate axes shown in the front and side views of the light knife represent the scanning direction of the workpiece being processed. In Mode 1, when aperture PAa is selected, the scanning direction is the X-axis direction, and when aperture PAb is selected, the scanning direction is the Y-axis direction.

[0127] Mode 2 is a processing mode in which the slit-shaped opening PAa or PAb is selected as the opening on the mask M and a semicircular illumination shape having a straight portion corresponding to the length direction of the selected opening is set. Figure 10The light beam is distributed along the edge of an imaginary axis extending horizontally on the paper in (A). On the pupil plane, the light beam is distributed to one side of the two regions divided by this imaginary axis. The semicircular illumination pattern in Mode 2 can be described as having single rotational symmetry with respect to the center (optical axis) of the pupil plane. In Mode 2, the imaginary axis extending horizontally on the paper corresponds to a direction orthogonal to the scanning direction of the workpiece in the image plane (XY plane).

[0128] In mode 2, if Figure 10 As shown in (A) in FIG, the shape of the light knife, when viewed from the front, is an inverted isosceles trapezoid, similar to Mode 1, with a tip length of 1 mm. When viewed from the side, it is a right triangle formed by halving the inverted isosceles triangle in Mode 1. In Mode 2, when aperture PAa is selected, the scanning direction is the X-axis direction, and when aperture PAb is selected, the scanning direction is the Y-axis direction. In Mode 2, as shown in the side view, the light knife (the tip of the light beam) has an outer edge substantially contained within a plane parallel to the optical axis of the focusing optical system 530 on the side of the light knife's direction of travel (opposite to the workpiece scanning direction), and the workpiece and the light knife move relative to each other in a direction approximately orthogonal to the plane containing this outer edge (parallel to the scanning direction). Furthermore, in the illumination shape of mode 2, there is an edge along an imaginary axis extending in the left-right direction of the paper, and on the pupil plane, the light beam is distributed in the area on one side (the lower side) of the two areas divided by the imaginary axis. However, there may be another mode in which the light beam is distributed in the area on the other side (the upper side).

[0129] Mode 3 is a processing mode in which the slit-shaped opening PAa or PAb is selected as the opening on the mask M and a semicircular illumination shape having a straight line portion in a direction perpendicular to the longitudinal direction of the selected opening is set. The illumination shape of Mode 3 has a semicircular shape along Figure 10 The edge of the imaginary axis extending in the vertical direction of the paper in (A) is distributed on the pupil plane in one area of ​​the two areas divided by the imaginary axis. The semicircular illumination shape in this mode 3 can be called an illumination shape with one rotational symmetry relative to the center (optical axis) of the pupil plane. In mode 3, the imaginary axis extending in the vertical direction of the paper corresponds to the scanning direction of the workpiece in the image plane (XY plane). In mode 3, as Figure 10As shown in (A), the shape of the light knife, when viewed from the front, is a trapezoidal shape obtained by cutting off the right-angled triangle portion of the isosceles trapezoid in mode 1 that is upside down, with one waist perpendicular to the upper and lower bases, and the length of the blade tip is 1 mm, the same as in modes 1 and 2. When viewed from the side, it is the same isosceles triangle shape as in mode 1, and the size of its blade tip becomes 1 μm. In mode 3, when opening PAa is selected, the scanning direction becomes the X-axis direction, and when opening PAb is selected, the scanning direction becomes the Y-axis direction. In mode 3, as shown in the front view, the light knife (the front end of the light beam) has an outer edge substantially contained in a plane parallel to the optical axis of the focusing optical system 530, and the workpiece and the light knife move relative to each other in a direction parallel to the plane containing the outer edge (a direction parallel to the scanning direction). Furthermore, in the illumination shape of mode 3, along the edge of an imaginary axis extending in the vertical direction on the paper, on the pupil plane, the light beam is distributed in the area on one side (the left side) of the two areas divided by the imaginary axis, but there may also be another mode in which the light beam is distributed in the area on the other side (the right side).

[0130] Mode 4 is a processing mode in which the slit-shaped opening PAa or PAb is selected as the opening on the mask M and a quarter-circular illumination shape having two straight portions in the longitudinal direction and the direction perpendicular to the longitudinal direction of the selected opening is set. The illumination shape of Mode 4 has a shape along Figure 10 In (A), the edge of the imaginary axis extending in the horizontal direction of the paper and the edge of the imaginary axis extending in the vertical direction of the paper are arranged. On the pupil plane, the light beam is distributed in one of the four areas divided by the two imaginary axes. In mode 4, as Figure 10As shown in (A) in the figure, the shape of the light knife is a trapezoidal shape similar to that of mode 3 when viewed from the front, and a right triangle shape similar to that of mode 2 when viewed from the side. In mode 4, when pattern PAa is selected, the scanning direction becomes the X-axis direction, and when pattern PAb is selected, the scanning direction becomes the Y-axis direction. The quarter-circular illumination shape in mode 4 can be called an illumination shape that is rotationally symmetric with respect to the center (optical axis) of the pupil plane. In mode 4, as in mode 2, the light knife (the front end of the light beam) has a first outer edge substantially contained in a plane parallel to the optical axis of the focusing optical system 530 on the side of the light knife's travel direction (the opposite direction to the scanning direction of the workpiece), and the workpiece and the light knife move relative to each other in a direction approximately orthogonal to the plane containing the first outer edge (a direction parallel to the scanning direction). Furthermore, in Mode 4, similar to Mode 3, the optical knife (the tip of the light beam) has a second outer edge substantially contained within a plane parallel to the optical axis of the focusing optical system 530, and the workpiece and the optical knife move relative to each other in a direction approximately parallel to the plane containing the second outer edge (parallel to the scanning direction). Furthermore, the illumination shape of Mode 4 includes an edge along an imaginary axis extending horizontally on the paper and an edge along an imaginary axis extending vertically on the paper. On the pupil plane, the light beam is distributed in one region (the third quadrant) of the four regions (quadrants) divided by these two imaginary axes. However, other modes may exist in which the light beam is distributed in another of the four regions (quadrants), such as the first quadrant.

[0131] Mode 5 is a processing mode in which a circular illumination shape with a small diameter centered on the optical axis is set at the center of the pupil plane (also called small σ illumination) and a pinhole-shaped opening PAc with a diameter of 10 μm is selected as the opening on the selective mask M. In Mode 5, as shown in FIG. Figure 10 As shown in (A), the shape of the optical knife is a straight line with a diameter of 1 μm extending vertically (in the Z-axis direction) when viewed from the front or side. In this case, the optical knife is a rod with a circular cross-section, and when viewed from the side, it is a straight line with a diameter of 1 μm extending vertically (in the Z-axis direction) from any direction. Therefore, in Mode 5, the scanning direction can be set to any direction.

[0132] Mode 6 is a processing mode in which normal illumination is set as the illumination shape and a pinhole-shaped opening PAc with a diameter of 10 μm is selected as the opening on the mask M. In Mode 6, as shown in FIG. Figure 10 As shown in (A) in FIG, the shape of the light knife, viewed from either the front or side, is an inverted isosceles triangle, similar to the side view of Mode 1. In this case, the light knife is conical with a circular cross-section, and when viewed from the side, it maintains the same inverted isosceles triangle shape from any direction. Therefore, in Mode 6, the scanning direction can be set to any direction.

[0133] Furthermore, the same mask M aperture and illumination pattern as in Mode 2 can be used to relatively move the workpiece and light beam in a direction intersecting the X-axis and Y-axis within the image plane (XY plane). Similarly, the same mask M aperture and illumination pattern as in Mode 3 can be used to relatively move the workpiece and light beam in a direction intersecting the X-axis and Y-axis within the image plane (XY plane). Similarly, the same mask M aperture and illumination pattern as in Mode 4 can be used to relatively move the workpiece and light beam in a direction intersecting the X-axis and Y-axis within the image plane (XY plane).

[0134] Furthermore, a combination of any of the illumination shapes of modes 2, 3, and 4 and the aperture PAc (pinhole) may be set.

[0135] Also, you can Figure 19 (A) Figure 19 As shown in (B) in FIG. 1 , an illumination shape is set in which the straight edge does not lie along the imaginary axis (is not parallel to the imaginary axis).

[0136] Also, you can Figure 19 As shown in (B) in FIG. 1 , the lighting shape is set to cover three of the four regions (quadrants).

[0137] Also, you can Figure 19 (C) Figure 19 As shown in (D) in FIG, the illumination shape is set so that the light beam does not pass through the area including the center (optical axis) of the pupil plane. In the case of this illumination shape, it can also be as follows Figure 19 (A) Figure 19 As shown in (B) in FIG. 1 , the straight edge does not lie along the imaginary axis.

[0138] Furthermore, the change from one of modes 1, 2, 3, and 4 to another is only a change in the lighting shape.

[0139] Furthermore, the change from one of Modes 5 and 6 to the other also involves only a change in the lighting shape.

[0140] Furthermore, the change from one of Modes 1 and 6 to the other involves only a change in the opening shape.

[0141] Furthermore, the change from one of Modes 1, 2, 3, and 4 to Mode 5, or the change from Mode 5 to one of Modes 1, 2, 3, and 4 involves changing the lighting shape and the opening shape.

[0142] Furthermore, the change from one of Modes 2, 3, and 4 to Mode 6, or the change from Mode 6 to one of Modes 2, 3, and 4 involves a change in the lighting shape and the opening shape.

[0143] At Figure 10In (B), examples of target parts of workpieces suitable for processing using light knives in modes 1, 2, 3 and 4 are shown. Figure 10 (C) shows examples of target parts of a workpiece suitable for machining using the light knives of Mode 5 and Mode 6, respectively.

[0144] Mode 1 light knife, for example Figure 10 The front view and side view of the light knife in (A), and Figure 10 As shown in (B), it is particularly suitable for removing the surface of the workpiece. In addition, the light knife of each of Mode 2, Mode 3 and Mode 4 is as follows. Figure 10 The front view and side view of the light knife in (A), and Figure 10 As shown in (B), it is particularly suitable for removing the side surface of a groove portion when forming a groove portion of a predetermined depth on the surface of a workpiece. In particular, mode 4 is suitable for removing the corner portion of the groove portion.

[0145] Again, for example, according to Figure 10 The front view and side view of the light knife in (A) clearly show that the light knife in mode 5 is suitable for cutting a plate-like member into an arbitrary curved or straight shape, for example. Figure 10 The "mode 5" in (C) indicates that the plate-like member is cut by the light knife of mode 5, resulting in a gourd-shaped workpiece, and the side surface of the workpiece is the cut surface obtained by the light knife of mode 5.

[0146] Again, according to Figure 10 (A) The front view and side view of the light knife and Figure 10 The optical knife in (C) which can clearly define mode 6 is particularly suitable for forming fine groove patterns of arbitrary shapes on the surface of a workpiece, such as fine patterns such as flow channels on a biochip.

[0147] In addition, the processing device 100 is provided with a liquid supply device 540 (see Figure 14 ). The liquid supply device 540 can be used, for example, for quenching processing using the light beam from the focusing optical system 530. The liquid supply device 540 has a supply port for supplying a coolant (cooling water) and supplies the coolant to the cooling object. The liquid supply device 540 is connected to the control device 600 (refer to Figure 14 During quenching, the control device 600 controls the light source unit 60 to adjust the thermal energy of the light beam from the focusing optical system 530 irradiating the workpiece to a value suitable for quenching. Subsequently, after irradiating the light beam onto the surface of the workpiece held on the stage 12 to a high temperature, the control device 600 sprays coolant from the liquid supply device 540 onto the high-temperature portion while the workpiece is held on the stage 12 to rapidly cool the portion, thereby performing quenching.

[0148] The processing device 100 of this embodiment is provided with a measuring device 110 (see FIG. 1 ) which receives the light beam from the focusing optical system 530 and performs measurement processing. Figure 11 For example, the measuring device 110 receives the light beam from the converging optical system 530 and can measure the optical characteristics of the light beam. In this embodiment, the measuring device 110 can be used, for example, to manage the intensity distribution of the light beam. In this embodiment, the measuring device 110 can measure at least one of the intensity distribution of the light beam on the image plane of the converging optical system 530 (which corresponds to the processing plane MP in this embodiment) and the intensity distribution of the light beam on the pupil plane PP2 of the converging optical system 530. Furthermore, the intensity distribution of the light beam on the pupil plane PP2 of the converging optical system 530 can also be considered as the angular intensity distribution of the light beam on the image plane of the converging optical system 530.

[0149] like Figure 11 As shown, the measuring device 110 includes a measuring member 92 constituting a portion of the upper surface of the platform 12 and the remaining components housed inside the platform 12 .

[0150] At Figure 12 In FIG. 1 , a portion of the measuring device 110 and a component disposed inside the platform 12 are shown together with the measuring member 92 in a three-dimensional diagram. Figure 12 As shown, the measuring device 110 includes a measuring member 92 , a first optical system 94 , an optical system unit 95 , and a light receiver 96 .

[0151] The measuring member 92 is arranged in a circular opening formed on the upper surface of the platform 12 so that its upper surface is flush with the rest of the platform 12. The measuring member 92 has a substrate formed of, for example, synthetic quartz, through which the light beam from the focusing optical system 530 can pass. A light-shielding film that also serves as a reflective film is formed on the surface of the substrate by vapor deposition of a metal such as chromium, and a circular opening 92a is formed in the center of the light-shielding film. Therefore, the upper surface of the measuring member 92 includes the surface of the light-shielding film and the surface of the substrate within the opening 92a. The light-shielding film is formed very thinly, and in the following description, the surface of the light-shielding film and the surface of the substrate within the opening 92a are assumed to be flush with each other. Although the light-shielding film may not be formed, by forming the light-shielding film, it is expected that the effects of flare and the like can be suppressed during measurement.

[0152] The first optical system 94 is disposed below the measuring member 92. The light beam passing through the opening 92a of the measuring member 92 enters the first optical system 94. In this embodiment, the first optical system 94 is a collimator optical system, but it does not need to be a collimator optical system.

[0153] The optical system unit 95 has a circular rotating plate 101 with a rotating shaft 101a provided at the center. On the rotating plate 101, an opening 97 and a lens (second optical system) 98 are arranged with the rotating shaft 101a as the center and at predetermined angular intervals. By rotating the rotating shaft 101a, that is, rotating the rotating plate 101, either the opening 97 or the lens 98 can be selectively arranged on the optical path of the light passing through the first optical system 94 (corresponding to the position of the optical axis AX1). The rotation of the rotating shaft 101a is controlled by the driving device 102 (at the control unit 600) under the instruction of the control unit 600. Figure 12 Not shown in the figure, refer to Figure 14 ) and proceed.

[0154] The opening 97 allows the parallel light emitted from the first optical system 94 to pass directly through it. By placing the opening 97 on the optical path of the light beam passing through the converging optical system 530 and moving the first optical system 94 or at least one optical element constituting the first optical system 94, the intensity distribution of the light beam in the pupil plane (entrance pupil) of the converging optical system 530 can be measured using the light receiver 96. Furthermore, the measuring device 110 may not be able to measure the intensity distribution in the pupil plane (entrance pupil) of the converging optical system 530. In this case, the lens 98 may be fixed.

[0155] The lens 98 constitutes a relay optical system together with the first optical system 94 , and optically conjugates the upper surface of the measuring member 92 in which the opening 92 a is formed and the light receiving surface of a light receiving element (described below) of the light receiver 96 .

[0156] The light receiver 96 includes a light receiving element (hereinafter referred to as "CCD") 96a composed of a two-dimensional CCD or the like, and a circuit 96b such as a charge transfer control circuit. Of course, a CMOS image sensor can also be used as the light receiving element 96a. The light receiving result (light receiving data) of the light receiver 96 is output to the control device 600 (see Figure 14 ). CCD96a has an area sufficient to receive all parallel light that is incident on the first optical system 94 through the opening 92a and is emitted from the first optical system 94 and passes through the opening portion 97. In addition, the light-receiving surface of CCD96a is optically conjugated with the upper surface of the measuring component 92 (the forming surface of the opening 92a) through the relay optical system including the first optical system 94 and the lens 98. In addition, each pixel of CCD96a has a size that includes multiple pixels within the irradiation area of ​​the light beam converged through the relay optical system. In CCD96a, one or more reference pixels are specified, and the positional relationship between the reference pixel and the reference point of the platform 12, such as the center point, is known. Therefore, the control device 600 can grasp the positional relationship between the light beam incident on CCD96a and the reference pixel based on the output of the light receiver 96, thereby obtaining the position information of the light beam in the platform coordinate system (such as the focusing position information of the light beam).

[0157] Furthermore, the light-receiving surface of CCD96a is conjugate with the pupil plane of the focusing optical system 530 when the upper surface (substrate surface) of the measuring component 92 is consistent with the image plane (processing surface MP) of the focusing optical system 530 and the opening portion 97 is arranged on the optical path of the light beam passing through the opening 92a and the first optical system 94.

[0158] Alternatively, an optical system (optical member) may be disposed on the rotating plate 101 instead of the opening 97, so that the light-receiving surface of the CCD 96a and the pupil plane of the light-collecting optical system 530 are conjugate. Furthermore, during measurement, the upper surface of the measuring member 92 may be disposed at a position offset from the image plane of the light-collecting optical system 530 in the direction of the optical axis AX.

[0159] Furthermore, the optical system unit 95 is not limited to the one described above. For example, instead of using the rotating plate 101, the lens 98 may be held by a movable member, and the lens 98 may be inserted or removed by moving the movable member in a direction perpendicular to the optical axis (e.g., along the X-axis).

[0160] It is clear from the above description that in this embodiment, the measuring device 110 including the measuring component 92 is arranged on a platform 12 that can move freely in six degrees of freedom. Therefore, the measuring component 92 that functions as the light receiving part of the measuring device 110 can move in at least one direction of the Z-axis direction of the optical axis AX parallel to the emission surface side of the focusing optical system 530 and the X-axis and Y-axis directions perpendicular to the optical axis AX while receiving the light beam from the focusing optical system 530.

[0161] Here, although the order of description is reversed, the measurement using the measuring device 110 will be described. The intensity distribution of the light beam on the image plane of the condensing optical system 530 and its vicinity (the vicinity in the Z-axis direction) is measured, for example, as follows.

[0162] First, the control device 600 controls the planar motor 26 and the telescopic mechanism 161-166 to move the platform 12 based on the measurement values ​​of the position measurement system 28 and the linear encoders 241-246 and according to known target values ​​(design information, etc.), and positions the opening 92a of the measuring component 92 at a position on the optical axis AX of the focusing optical system 530.

[0163] Furthermore, the control device 600 rotates the plate 101 through the driving device 102, and places the lens 98 on the optical path of the light beam passing through the opening 92a and the first optical system 94. Then, in this state, the light beam is focused on the light receiving surface of the CCD 96a through the lens 98, that is, the light receiving data (referred to as LRD1, refer to Figure 14 ) and measure the intensity distribution of the light beam on the image plane of the focusing optical system 530.

[0164] At Figure 13 In (A), the optical arrangement for measuring the intensity distribution of the light beam on the image plane of the focusing optical system 530 is shown along the optical axis AX1 of the measuring device 110 and the optical axis AX of the focusing optical system 530 (the portion upstream of the focusing optical system 530 is omitted from the illustration). When measuring the intensity distribution of the light beam, for example, the positioning of the mask M in any of the above-mentioned modes 1 to 6 and the positioning of each mirror element 81 of the second mirror array 78 are performed. i，j The setting of the reflecting surface, further, each mirror element 81 of the first mirror array 80 p，q The reflecting surface is set to a design angle such as that for obtaining the intensity distribution of the desired light beam on the mask M (the shape, size, position, etc. of the irradiation area of ​​the light beam).

[0165] Under the above mentioned conditions, Figure 13 In the optical arrangement shown in (A), if the control device 600 oscillates the laser beam from at least one laser unit 70 of the light source unit 60 and emits a parallel beam from the light source system 510, the parallel beam passes through the second mirror array 78 and the first partial illumination optical system 79 and is irradiated to the first mirror array 80, and is then reflected by the plurality of mirror elements 81 of the first mirror array 80. p，q The light beams are reflected and transformed into a plurality of parallel light beams, which are then transmitted through the second partial illumination optical system 82 and irradiated onto a large area surrounding the selected opening of the mask M. The plurality of light beams that pass through the opening of the mask M and enter the condensing optical system 530 are condensed onto the image plane by the condensing optical system 530 and enter the opening 92a located on or near the image plane.

[0166] The light passing through the opening 92a is focused on the light receiving surface of the CCD 96a, which is the optical conjugate surface of the measuring member 92, by the relay optical system composed of the first optical system 94 and the lens 98. Therefore, the intensity distribution of the light receiving surface of the CCD 96a becomes the intensity distribution of the light beam on the upper surface of the measuring member 92. The light beam having this intensity distribution is received by the CCD 96a, and the light receiving data LRD1 obtained by photoelectric conversion is transmitted from the light receiver 96 (circuit 96b) to the control device 600 (see Figure 14 ).

[0167] Therefore, the control device 600 steps the stage 12 in the Z-axis direction via the telescopic mechanisms 161-166 based on the measured values ​​of the linear encoders 241-246 while acquiring the light reception data LRD1. Based on this acquired light reception data LRD1, the control device 600 identifies the position in the Z-axis where the area of ​​the light beam irradiated on the light receiving surface of the CCD 96a is minimized. The area of ​​the light beam irradiated on the light receiving surface of the CCD 96a is minimized when the upper surface of the measuring member 92 and the image plane of the focusing optical system 530 coincide with each other, forming the brightest light beam irradiated area within the opening 92a. Therefore, based on the light reception data LRD1 from the light receiver 96, the control device 600 can determine the Z position of the stage 12 where the number of pixels receiving the light beam is minimized as the Z position where the upper surface of the measuring member 92 and the image plane coincide with each other. In the present embodiment, since the image plane is set as the processing plane MP, the control device 600 can obtain the intensity distribution of the light beam in the processing plane MP (the shape, size, position, etc. of the irradiation area of ​​the light beam) based on the light receiving data LRD1 of the Z position. In the present embodiment, the control device 600 can obtain the three-dimensional intensity distribution of the light beam between the image plane (processing plane MP) and the surface (the above-mentioned imaginary surface) near it (+Z side) based on the light receiving data LRD1 taken in at each step position in the Z-axis direction in the process of obtaining the Z position of the platform 12 in which the upper surface of the measuring component 92 coincides with the image plane. Obtaining the three-dimensional intensity distribution of the light beam can also be said to be determining the shape of the light knife. Therefore, when the three-dimensional intensity distribution of the light beam (for example, the cross-sectional intensity distribution on the surface on the +Z side near the image plane) is different from the desired state, the control device 600, for example, adjusts the multiple mirror elements 81 of the second mirror array 78. i，j The three-dimensional intensity distribution of the light beam is adjusted to a desired state by adjusting the angle of at least a portion of the light beam. Adjustment of the three-dimensional intensity distribution of the light beam can also be said to be adjustment of the shape of the light knife.

[0168] Furthermore, the control device 600 may also adjust the intensity distribution of the light beam on the processing surface MP (the shape, size, position, etc. of the irradiation area of ​​the light beam) to a desired state by considering only the measurement result of the intensity distribution of the light beam on the image plane (processing surface MP) without considering the three-dimensional intensity distribution of the light beam. Furthermore, since the first mirror array 80 is arranged at a position conjugate with the pupil plane PP2 of the focusing optical system 530 or at a position near it, it is also possible to adjust the mirror element 81 i，j The three-dimensional intensity distribution of the light beam is adjusted by adjusting the angle of at least a portion of the light beam.

[0169] When the intensity distribution of the light beam on the image plane (processing surface MP) of the focusing optical system 530 is different from the desired state, the control device 600 adjusts the position of the mask M (opening), the plurality of mirror elements 81 of the second mirror array 78, and the like. i，jAt least one of the angles of at least a portion of the adjustment.

[0170] Furthermore, the mask M (aperture) may be deformed to change the intensity distribution of the light beam on the image plane (processing surface MP) of the focusing optical system 530. Furthermore, the focusing optical system 530 may be adjusted (for example, by moving a portion of the optical elements of the focusing optical system 530) to change the size of the aperture image or to deform the aperture image.

[0171] In addition, based on the intensity distribution of the light beam on the light-receiving surface of CCD96a when the upper surface of the measuring component 92 is consistent with the image plane of the focusing optical system 530 and the positional relationship between one or more reference pixels, the position of the irradiation area of ​​the light beam in the processing surface MP (the image plane of the focusing optical system 530) on the platform coordinate system can be calculated.

[0172] In this embodiment, the control device 600 measures at least one of the intensity distribution of the light beam on the processing surface MP (the shape, size, and position of the light beam's irradiation area) and the intensity distribution of the light beam on a nearby surface, and then measures the intensity distribution of the light beam on the pupil plane (entrance pupil) PP2 of the converging optical system 530, which will be described below. Furthermore, the intensity distribution of the light beam on the pupil plane PP2 may be measured before the intensity distribution of the light beam on the image plane (processing surface MP). Furthermore, the intensity distribution of the light beam on the pupil plane PP2 and the intensity distribution of the light beam on the image plane (processing surface MP) may be measured discontinuously.

[0173] The intensity distribution of the light beam in the pupil plane (entrance pupil) of the condensing optical system 530 is measured, for example, as follows.

[0174] After the measurement of the intensity distribution of the light beam on the processing surface MP is completed, the control device 600 maintains the position of the stage 12 at a position where the upper surface of the measuring member 92 (the surface forming the opening 92a) is on the optical axis AX of the focusing optical system 530 and at the same height as the processing surface MP. Then, the control device 600 rotates the rotating plate 101 via the drive device 102, thereby positioning the opening 97 on the optical path of the light beam passing through the opening 92a and the first optical system 94. In this state, the intensity distribution of the light beam on pupil plane PP2 is measured. The measurement of the intensity distribution of the light beam on pupil plane PP2 of the focusing optical system 530 can also be referred to as the measurement of the cross-sectional shape of the light beam on pupil plane PP2. Furthermore, since the pupil plane PP1 of the illumination optical system 520 is conjugate with the pupil plane PP2 of the focusing optical system 530, the measurement of the intensity distribution on pupil plane PP2 can also be referred to as the measurement of the intensity distribution on pupil plane PP1. The measurement of the intensity distribution on the pupil plane PP1 of the illumination optical system 520 can also be referred to as the measurement of the cross-sectional shape (illumination shape) of the light beam on the pupil plane PP1.

[0175] At Figure 13 In (B), the optical arrangement for measuring the intensity distribution of the light beam on the pupil plane is shown along the optical axis AX1 of the measuring device 110 and the optical axis AX of the focusing optical system 530 (the portion upstream of the focusing optical system 530 is omitted). Figure 13 As shown in (B) in FIG. 5 , in this state, an opening 97 is arranged on the optical path of the light beam, so that the parallel light passing through the first optical system 94 directly enters the CCD 96a constituting the light receiver 96. In this case, the light receiving surface of the CCD 96a can be regarded as being arranged at a position conjugate with the pupil plane of the focusing optical system 530, and can receive a light beam corresponding to the intensity distribution of the light beam on the pupil plane. Therefore, the control device 600 takes in the light receiving data of the light receiver 96 (referred to as LRD2, refer to FIG. Figure 14 ), and the intensity distribution of the light beam on the pupil plane is obtained based on the light receiving data LRD2. Then, the obtained intensity distribution data is stored in the memory.

[0176] The control device 600 can adjust the intensity distribution of the light beam on the pupil plane, for example, the plurality of mirror elements 81 of the second mirror array 78. i，j Furthermore, the intensity distribution of the light beam on the image plane (processing plane MP) and the intensity distribution of the light beam on the pupil plane PP2 can also be regarded as a three-dimensional intensity distribution of the light beam. That is, the three-dimensional intensity distribution of the light beam (the shape of the light knife) can be obtained based on the intensity distribution of the light beam on the image plane (processing plane MP) and the intensity distribution of the light beam on the pupil plane PP2 measured using the measuring device 110. Based on the results, for example, the angle of at least one portion of at least one of the first mirror array 80 and the second mirror array 78 can be adjusted.

[0177] Back to Figure 1 The control device 600 includes a host system cooperation unit 620 and a recipe creation unit 630 that are connected online to a host system including a host computer through, for example, a local area network (LAN). The host system cooperation unit 620 obtains the CAD data of the workpiece before and after processing from the host system online according to the operator's instructions. The recipe creation unit 630 creates recipe data (control information for each part of the processing device 100 during processing and information indicating a series of sequences) for use in the processing performed by the processing device 100 based on the CAD data of the workpiece before and after processing obtained by the host system cooperation unit 620. That is, in the processing device 100, the recipe for use in the processing performed by the processing device 100 can be obtained only by the operator instructing the creation of recipe data (hereinafter, appropriately referred to as a recipe).

[0178] At Figure 14, a block diagram showing the input and output relationship of the control device 600 which constitutes the core of the control system of the processing device 100 is shown. The control device 600 includes a workstation (or microcomputer) and the like, and comprehensively controls the components of the processing device 100.

[0179] The processing device 100 of this embodiment, configured as described above, can perform various processes on a processing object (workpiece) using the light beam from the focusing optical system 530, such as removal processing to remove a portion of the workpiece and cutting processing to cut the workpiece. The workpiece is loaded into the processing device 100 and unloaded from the processing device 100 after processing. The series of operations performed by the processing device 100 are automated, and the supply of workpieces is performed by batching a certain amount of workpieces collected on a pallet.

[0180] At Figure 15 , a flowchart corresponding to a series of processing algorithms of the control device 600 is shown. The processing (including determination) of each step in the following flowchart is performed by the control device 600. Hereinafter, the description of the control device 600 will be omitted unless particularly necessary.

[0181] As a prerequisite, at least one recipe is created in advance by the upper system cooperation unit 620 and the recipe creation unit 630 of the control device 600 according to the operator's recipe creation instruction, and the recipe is stored in a memory device (not shown) as a recipe database. Moreover, if the operator instructs the control device 600 to select the desired recipe, the process starts according to the recipe. Figure 15 Flowchart processing.

[0182] First, in step S2 , the count value n of the counter indicating the number of workpieces in the lot is initialized (n←1).

[0183] In the next step S4, a pallet (not shown) carrying a batch of workpieces before processing is moved from the outside to a predetermined loading and unloading position in the processing device 100. The loading is performed by a loading and unloading device (not shown) according to the instruction of the control device 600. Here, a batch is, for example, i×j pieces, and the i×j workpieces are mounted on the pallet in a matrix configuration of i columns and j rows. That is, on the upper surface of the pallet, the loading position (loading position) of the workpiece is specified in a matrix configuration of i columns and j rows, and a workpiece is mounted (loaded) at each loading position. For example, a mark is marked on each loading position, and the position of each mark on the pallet is known. In the following, a batch of 4×5=20 pieces is set as an example, and marks are marked on the upper surface of the pallet in a matrix configuration of 4 columns and 5 rows, and a workpiece is mounted on each mark. For example, the 1st to 5th workpieces in a batch are respectively arranged at positions of 1 column and 1 row to 1 column and 5 rows, the 6th to 10th workpieces are respectively arranged at positions of 2 columns and 1 row to 2 columns and 5 rows, the 11th to 15th workpieces are respectively arranged at positions of 3 columns and 1 row to 3 columns and 5 rows, and the 16th to 20th workpieces are respectively arranged at positions of 4 columns and 1 row to 4 columns and 5 rows.

[0184] In the next step S6, the nth workpiece in the batch is removed from the pallet and placed on the platform 12. At this time, the first stage system 200A is located at the loading / unloading position within the processing apparatus 100, which is located near the position where the conveying system 300 is installed. Furthermore, at this time, the platform 12 is in the reference state (Z, θx, θy, θz) = (Z0, 0, 0, 0), and its XY position coincides with the X and Y position of the slide 10 measured by the position measurement system 28.

[0185] Specifically, the control device 600 refers to the count value n, determines the position (i, j) on the pallet of the workpiece to be removed, and instructs the transport system 300 to remove the workpiece located at the predetermined position (i, j). In response to this instruction, the transport system 300 removes the workpiece from the pallet and places it on the platform 12. For example, when n = 1, the workpiece located at the first row and first column on the pallet is removed and placed on the platform 12.

[0186] Next, in step S7, the platform 12 carrying the workpiece is moved below the measurement system 400 (sensor unit 38). The platform 12 is moved by the control device 600 controlling the planar motor 26 based on measurement information from the position measurement system 28, thereby moving the first stage system 200A in the X-axis direction (and the Y-axis direction) on the base BS. During this movement, the platform 12 maintains the aforementioned reference state.

[0187] In the next step S8, the measurement system 400 is used to measure the positional information (in this embodiment, the three-dimensional shape information) in three-dimensional space of at least a portion of the target surface of the workpiece mounted on the stage 12 in the reference state. Based on the measurement results, the position of the target surface on the workpiece in the six degrees of freedom directions can be managed by controlling the stage coordinate system (reference coordinate system).

[0188] In the next step S9, as Figure 21 As shown, by moving the slider 10 on the base BS, the stage 12 carrying the workpiece on which the position information (shape information) of at least a portion of the target surface has been measured is moved to the bottom of the beam irradiation system 500. Figure 21 In FIG. 4 , the sensor unit 38 is shown to represent the measurement system 400 , and the focusing optical system 530 is shown to represent the light beam irradiation system 500 .

[0189] In the next subroutine of step S10, the workpiece on the platform 12 is processed according to the recipe. In order to simplify the description, the processing in the same processing mode is set to be performed only once for the same recipe.

[0190] In the subroutine of step S10, if Figure 16 As shown, first, in step S102, the selected recipe is used to perform the predetermined settings corresponding to the next designated processing mode (the first designated processing mode), namely, the setting of the illumination shape and the selection of the opening on the mask M. Here, it is assumed that one of the above-mentioned modes 1 to 6 is designated. For example, when mode 1 is initially designated, normal illumination is set as the illumination shape, and the opening specified in the recipe is selected. As an example, a slit-shaped opening PAa is selected.

[0191] In the following step S104, the three-dimensional intensity distribution of the light beam (the shape of the optical knife) on the processing surface MP and its vicinity is measured in the aforementioned order, and adjustments are made based on the measurement results. This adjustment, for example, includes at least one of adjusting the angle of at least a portion of the mirror elements of the first mirror array 80, adjusting the angle of at least a portion of the mirror elements of the second mirror array 78, adjusting the focusing optical system 530 (including adjusting the position and tilt of some lenses), and adjusting the position of the mask M (opening). Of course, adjustments based on the measurement of the three-dimensional intensity distribution of the light beam (the shape of the optical knife) are only performed when necessary. Furthermore, based on the measurement results in step S104, the position of the processing surface MP and the positional relationship between the processing surface MP and the stage 12 can be determined.

[0192] In the following step S106, the intensity distribution of the light beam on pupil plane PP2 of the converging optical system 530 is measured (also known as the illumination shape measurement), and adjustments are made based on the measurement results. This adjustment, for example, includes adjusting at least one of the angles of at least a portion of the mirror elements of the first mirror array 80 and the angles of at least a portion of the mirror elements of the second mirror array 78. In this case, adjustments based on the measured intensity distribution of the light beam on pupil plane PP2 are naturally performed only when necessary. This completes the necessary preparatory work. Furthermore, at least one of steps S104 and S106 may be omitted.

[0193] In the next step S108, in order to process the workpiece W, the first stage system 200A and the beam irradiation system 500 are controlled, and according to the recipe, the workpiece is processed while scanning the platform 12 in the scanning direction relative to the beam (for example, in the case of mode 1, the surface is removed by the light knife of mode 1). The relative movement speed of the workpiece and the beam (in this case, the movement speed of the platform 12) is controlled by the control device 600. The relative speed can also be determined according to the material of the workpiece W, the type of processing, etc. Furthermore, the relative movement speed can also be determined based on the intensity distribution (intensity) in the processing surface MP measured previously. Here, the control of the position and posture of the object surface (and the target part) on the workpiece being processed is performed by considering the position information of the object surface measured by the measurement system 400 previously (shape information in this embodiment). For example, the object surface TAS of the workpiece W obtained by the measurement system 400 (refer to Figure 9 The position information (shape information) in (A)) is to make the target part TA on the target surface TAS of the workpiece W (refer to Figure 9 (A)) in the figure is used by relatively moving the irradiation area of ​​the light beam on the processing surface MP in a desired positional relationship.

[0194] In the following step S110, a determination is made as to whether any patterns specified by the recipe remain and have not been completed. If this determination is negative, i.e., if any patterns remain that have not been completed, the routine returns to step S102. Thereafter, the loop of steps S102 → S104 → S106 → S108 → S110 (including the determination) is repeated until the determination in step S110 is affirmative. In this manner, the workpiece is processed sequentially according to the recipe in all processing patterns specified by the recipe. If all processing specified by the recipe is completed, the determination in step S110 is affirmative, and the routine returns to step S12 of the main routine. Furthermore, even if the determination in step S110 is negative, at least one of steps S104 and S106 following step S102 may be omitted.

[0195] Furthermore, let's assume the following situation: a workpiece having an inclined surface that is inclined at a predetermined angle relative to the upper surface of the platform 12 (e.g., a surface parallel to the XY plane) when mounted on the platform 12 is used as the workpiece, and this inclined surface is set as the target surface, and a removal process, for example, is required. However, the processing device 100 of this embodiment includes a first stage system 200A that can arbitrarily set the position of the platform 12 on which the workpiece is mounted in the six degrees of freedom. Therefore, in this case, the control device 600 can easily align the target surface (inclined surface) of the workpiece with the processing surface MP by controlling the first stage system 200A based on the three-dimensional shape of the workpiece measured by the measurement system 400. Of course, the inclined surface described above can also be easily formed on a workpiece of any shape mounted on the platform 12.

[0196] In step S12 , the platform 12 carrying the processed workpiece is moved to the loading / unloading position.

[0197] In the following step S14, the nth workpiece in the processed batch, mounted on the platform 12, is returned to the pallet. Specifically, the control device 600 refers to the count value n, determines the position on the pallet, and instructs the transport system 300 to return the workpiece to the predetermined position on the pallet. Based on this instruction, the transport system 300 removes the processed workpiece from the platform 12 and returns it to the predetermined position on the pallet.

[0198] After the processing of step S14 is executed, the process proceeds to step S16. At this point in time, no workpiece exists on the stage 12. In step S16, the count value n of the counter is incremented by 1 (n←n+1).

[0199] In the next step S18, it is determined whether the count value n exceeds N (N is the number of workpieces in one batch, and in this embodiment, N=20). Then, when the judgment in step S18 is denied, that is, when there are workpieces in the batch that have not been processed, return to step S6, and repeat the processing of steps S6-S18 (including judgment) until the judgment in step S18 is affirmative. Thus, the above series of processing (including judgment) is performed on the workpieces after the second workpiece in the batch. Then, if the processing of all workpieces in the batch is completed and the judgment in step S18 is affirmative, enter step S20, instruct the unillustrated loading and unloading device to move the pallet carrying the processed workpieces out of the device, and then end the series of processing of this routine.

[0200] Furthermore, when the processing apparatus has a plurality of platforms as described above, each platform is used in steps S6 to S18. Figure 20As shown, when the processing device has two platforms, the odd-numbered workpieces including the first workpiece are held on platform 12a, and the even-numbered workpieces including the second workpiece are held on platform 12b, and platforms 12a and 12b are used alternately in steps S6-step 18.

[0201] Furthermore, in the subroutine of step S10, the measurement of the light beam intensity distribution on the pupil plane is performed after the measurement of the light beam's three-dimensional intensity distribution. However, this is not limiting. The light beam intensity distribution on the pupil plane may be measured before the light beam intensity distribution on the image plane (processing plane MP) is measured. Furthermore, the measurement of the three-dimensional light beam intensity distribution and the measurement of the light beam intensity distribution on the pupil plane may be performed discontinuously. Furthermore, the frequency of the measurement of the three-dimensional light beam intensity distribution and the frequency of the measurement of the light beam intensity distribution on the image plane (processing plane MP) may be different.

[0202] Furthermore, when there is a possibility that at least one of the intensity distribution of the light beam in the processing surface MP (image plane) and the three-dimensional intensity distribution of the light beam may change as a result of adjustments based on the measurement results of the intensity distribution of the light beam on the above-mentioned pupil plane, the control device 600 can measure the intensity distribution of the light beam in the processing surface MP and the three-dimensional intensity distribution again, and can also make adjustments based on the results.

[0203] Furthermore, the above-mentioned steps S104 and S106 are set to be performed each time each mode is set when any one of modes 1 to 6 is set, but are not limited to this. It is also possible to set the processing of steps S104 and S106 to be performed only for a part of modes 1 to 6.

[0204] Furthermore, in the above description, after processing of the workpiece W is completed, the platform 12 carrying the processed workpiece W is moved to the loading / unloading position in order to return the processed workpiece to the pallet. However, after processing of the workpiece is completed, the platform 12 carrying the processed workpiece W is moved below the measurement system 400, and the shape of the workpiece on the platform 12 is inspected using the three-dimensional measuring machine 401 of the measurement system 400. For example, the dimensional error of the processed part can be calculated based on the measured shape information (a type of three-dimensional position information). In this case, the dimensional error can also be used to determine the pass / fail of the processing. For workpieces that are judged as unqualified as a result of the pass / fail judgment and have a positive dimensional error (a workpiece that can be corrected by removal processing, etc.), the beam irradiation system 500 can also perform the required correction processing based on the dimensional error while the workpiece is placed on the platform 12 (held on the platform 12 by the chuck mechanism 13). Alternatively, after machining of the workpiece is completed, the platform 12 carrying the machined workpiece W may be moved below the measuring system 400, and the shape of the workpiece on the platform 12 may be inspected using the three-dimensional measuring machine 401 of the measuring system 400. Regardless of the inspection results, no corrective machining is performed, and the platform 12 is moved to the loading / unloading position to return the machined workpiece to the pallet. In this case, the shape inspection result data is transmitted to an external device, such as a host device, via the control device 600.

[0205] Furthermore, the processed workpiece on the platform 12 can also be cleaned. For example, foreign matter generated by processing can also be removed from the processed workpiece by cleaning. For example, at least one fluid supply port for supplying fluid (liquid or gas) can be configured as a cleaning mechanism, and while moving the fluid supply port or the platform 12, or both the fluid supply port and the platform 12, the fluid from the fluid supply port is supplied to at least a portion of the surface of the processed workpiece. When such a cleaning mechanism is provided, it can also be set to check the shape of the workpiece on the platform 12 using the three-dimensional measuring machine 401 of the measuring system 400 as described above after cleaning the processed workpiece.

[0206] Furthermore, when the processing apparatus has a plurality of platforms as described above, it is possible to perform measurement of processed workpieces on other platforms in parallel with processing of a portion of the workpiece on one platform. Figure 20 When the processing device shown has two platforms, the measurement of the processed workpiece W on one platform (12a) can be performed in parallel with a portion of the processing of the workpiece W on the other platform (12b).

[0207] As described in detail above, according to the processing apparatus 100 of this embodiment and the processing method executed by the processing apparatus 100, the three-dimensional intensity distribution of the light beam near the image plane on the exit side of the focusing optical system 530 can be changed by combining the cross-sectional intensity distribution of the light beam on the pupil plane PP2 of the focusing optical system 530 (the cross-sectional intensity distribution on the pupil plane of the illumination optical system 520 (illumination shape)) with the intensity distribution of the light beam on the processing plane MP (image plane) (the openings on the mask M). In other words, the shape of the light blade can be changed. Therefore, as described previously with respect to Modes 1 to 6, workpieces can be processed using light blades of various shapes. Furthermore, Modes 1 to 6 are merely examples, and the processing apparatus 100 can set a variety of processing modes. By increasing the number of openings on the mask M or the number of illumination shapes to be set, an even greater variety of processing modes can be set. In this case, adjustment based on the measurement results can be performed for each mode representatively for a selected opening or for each opening.

[0208] At Figure 17 , the contents of various processes that can be performed by the processing apparatus 100 are shown in correspondence with existing machine tools for performing the various processes.

[0209] The types of processing that can be handled by the processing device 100 include three types: removal processing, heat treatment, and measurement. Among them, the main function of the processing device 100 is removal processing that changes the shape of the workpiece by processing. This removal processing can be classified into plane cutting, plane grinding, cylinder cutting, cylinder grinding, hole cutting, hole grinding, plane grinding, cutting, engraving of characters or patterns, engraving, free shape transfer using a metal mold, fine shape generation, etc. For various processing, the current use Figure 17 The working machinery listed in the column of existing working machinery.

[0210] Thus, the processing device 100 of this embodiment can handle all processing tasks, including surface processing (grinding, cutting, etc.) for removing the object being processed, groove processing (cutting during groove formation, surface grinding after formation, etc.), cutting into arbitrary shapes, and forming fine machined patterns, all with a single machine. Furthermore, while the processing device 100 may face limitations in the depth it can handle when processing holes, cylinders, and grooves, it can still perform each process with high precision. In particular, for patterning fine patterns on biochip flow paths, microreactors, and the like, it can achieve processing that is significantly different from existing machine tools in terms of the thickness of the line width that can be formed, the positional accuracy, and the degree of freedom of the pattern shape that can be formed. Furthermore, by directly processing the workpiece without the need for development, etching, or layer separation, it can achieve the generation of fine shapes that can be achieved using existing low-end exposure equipment. Furthermore, it can also handle three-dimensional shapes. Furthermore, the processing device 100 can also handle surface modification processes such as quenching and three-dimensional shape inspection of objects.

[0211] Furthermore, although Figure 17 Although not described in the specification, it is also possible to use the light beam from the focusing optical system 530 to correspond to joining processes such as welding, and it is also possible to use the light beam from the focusing optical system 530 to perform additional processing (three-dimensional shaping processing). In this case, the processing device 100 may also have a device for supplying materials for joining processing or additional processing to the vicinity of the image plane. In the case where additional processing can be performed, additional processing can be performed on the surface of the workpiece after removal processing, and removal processing (processing to remove at least a portion of the additional portion) can also be performed on the surface of the workpiece after additional processing. In addition, when performing joining processing or additional processing, it is only necessary to set the optimal combination of the intensity distribution of the light beam on the pupil plane and the intensity distribution of the light beam on the image plane (the opening of the mask).

[0212] Furthermore, the material of the workpiece processed by the processing device 100 may be metal or resin.

[0213] Furthermore, according to the processing apparatus 100 of this embodiment, the reaction force associated with processing is essentially nonexistent. Therefore, unlike a machine tool such as a cutting machine, where the workpiece's fixed state is directly related to processing accuracy or degree of finishing, there is no need to firmly secure the workpiece to the platform 12. Furthermore, because the processing apparatus 100 includes the measuring system 400, even if the workpiece is only roughly loaded onto the platform 12 by the conveying system 300, the measuring system 400 can later re-determine its position relative to the coordinate system, thus posing no problem. Because the measuring system 400 performs three-dimensional shape measurement (a form of three-dimensional alignment), the series of operations, including loading the workpiece onto the platform 12 by the conveying system 300 and removing the processed workpiece from the platform 12, can be automated, enabling highly efficient production.

[0214] Furthermore, according to the processing apparatus 100 and the processing method executed by the processing apparatus 100 of this embodiment, the position of the workpiece (stage 12) relative to the light beam is controlled based on the target position during the workpiece processing. However, in order to minimize positional errors relative to the target position caused by the control response characteristics and control accuracy of the stage 12, the mask M (mask stage 15) can be controlled to follow the workpiece W in at least one of the X-axis, Y-axis, and Z-axis directions based on the position information of the stage 12 and the measurement information of the mask stage position measurement system 19. This allows the relative positional relationship between the target portion of the workpiece W and the irradiation area of ​​the light beam transmitted through the opening of the mask M to be accurately controlled. Therefore, even if the positional control accuracy of the stage 12 is at or above the micron level, sub-micron or finer processing can be achieved.

[0215] Furthermore, according to the processing apparatus 100 of this embodiment, the light source system 510 included in the beam irradiation system 500 combines the multiple laser beams output from the multiple laser units 70 into a large-diameter parallel beam, which is then emitted toward the illumination optical system 520. This allows the total power to be increased without damaging components such as lenses.

[0216] Furthermore, according to the processing apparatus 100 of this embodiment, during processing, the first mirror array 80 is used to form (set) the illumination field (the irradiation area) of the irradiated light beam (illumination light) only on a portion of the mask M containing the selected pattern, thereby concentrating the entire light beam emitted from the light source system 510 on the selected pattern portion, thereby minimizing power loss. Furthermore, the light beam that has passed through the selected opening of the mask M is then directed toward the workpiece via a focusing optical system 530 composed of a large-NA reduction projection lens. Consequently, the field of view on the target surface of the workpiece can be expanded to approximately 1 mm while maintaining a high energy density. This significantly expands the range that can be processed per unit time compared to conventional laser processing apparatuses that use spot beams with a diameter of approximately 10 μm. Furthermore, by using a short-wavelength pulsed laser, a beam with a small spot size and high energy density can be generated on the target surface, thereby ensuring a high absorption rate for metal.

[0217] Furthermore, according to the processing apparatus 100 of this embodiment, a robust chuck that withstands reaction forces need not be installed on the platform 12. Furthermore, with a workpiece placed on the platform 12, the measurement system 400 measures the workpiece's shape and controls its position based on the measurement results, eliminating the need for jigs to determine the workpiece's position or dedicated jigs for maintenance. Furthermore, according to the processing apparatus 100, the control device 600 automatically generates recipes based on CAD data before and after processing the workpiece, eliminating the need for technicians to program CAD recipes based on schematics. Furthermore, during processing, the operator simply indicates the selection of a pre-created recipe, eliminating the need for the operator to manually input tool trajectory instructions in front of the apparatus.

[0218] According to the processing apparatus 100 and the processing method executed by the processing apparatus 100 of this embodiment, the three-dimensional shape of the target surface of the workpiece can be measured by the measuring system 400 while the workpiece is being processed and remains mounted on the platform 12 without being removed from the platform 12. Therefore, based on the measurement results, it is possible to determine whether the processed shape is acceptable (OK / NG), for example. Moreover, in the case of an unacceptable shape, correction processing can be performed directly using the light beam irradiation system 500 while the workpiece is mounted on the platform 12, which is extremely efficient.

[0219] Furthermore, in the process of mass-producing parts, manufacturing parts and then performing dimensional inspections on the spot is extremely effective in controlling quality. This is because, due to various factors, there is a deviation in the accuracy of the device. By performing on-site inspections, the control device 600 can sense the tendency of this deviation and provide feedback on the processing accuracy based on the results. That is, the control device 600 can determine the tendency of the device to deviate during processing based on the position information (shape information) of the target surface of the workpiece obtained using the measurement system 400, and adjust at least one of the measurement system 400, the beam irradiation system 500, and the first stage system 200A based on the obtained results, thereby suppressing dimensional changes and improving yield and quality deviations.

[0220] Furthermore, the control device 600 is not limited to determining the tendency of device deviation during processing. It can also adjust at least one of the measurement system 400, the beam irradiation system 500, and the first stage system 200A based on the position information (shape information) of the target surface of the workpiece obtained by the measurement system 400. The workpiece in this case includes either a workpiece after processing or a workpiece after correction processing. Adjustment of the beam irradiation system also includes adjustment of the intensity distribution of the beam on the processing surface MP.

[0221] Furthermore, the above description relates to a case where multiple light beams are transmitted through the mask M and incident on the focusing optical system 530, and the multiple light beams are focused on the image plane (processing surface MP) by the focusing optical system 530 (forming an image of the opening of the mask M on the image plane (processing surface MP)). However, the use of the mask M is not essential in the processing apparatus 100.

[0222] The reason is that as a method of setting or changing the intensity distribution of the light beam on the processing surface MP (for example, the method of forming a slit-shaped illumination area on the processing surface MP as described above), the focusing position or focusing area of ​​the light beam on the object surface of the focusing optical system 530 can be controlled, for example, through the first mirror array 80.

[0223] Furthermore, a light-converging optical system may be configured such that the pupil plane (entrance pupil) coincides with the front focal plane, or such that the pupil plane (entrance pupil) is located near the front focal plane. In this case, a mask (aperture) may not be used, and instead, for example, a first mirror array 80 may be used to accurately and simply control the focusing position of each of the plurality of parallel light beams on the rear focal plane by changing the angle of incidence of the plurality of parallel light beams incident on the light-converging optical system. When using a light-converging optical system having this configuration, the rear focal plane of the light-converging optical system may be set as the processing plane MP. When using this type of light-converging optical system, the measuring device 110 may be used to measure the intensity distribution of the light beam on at least one of the rear focal plane (processing plane MP), a surface near the rear focal plane, the pupil plane, and a surface near the pupil plane.

[0224] Furthermore, in this embodiment, a slit-shaped or spot-shaped irradiation area is formed only by light passing through the same focusing optical system 530. Therefore, a higher-quality beam spot can be formed compared to the case where light passing through different optical systems is focused on the same area to form a beam spot (laser spot).

[0225] Furthermore, in this embodiment, the control device 600 uses the rotary encoder to detect the state of each mirror element (here, the inclination angle of the reflecting surface), thereby monitoring the state of each mirror element in real time, so that the inclination angle of the reflecting surface of each mirror element of the mirror array 78, 80 can be accurately controlled.

[0226] In the processing apparatus 100 of this embodiment, the control device 600 uses the measuring device 110 to measure the three-dimensional intensity distribution of the light beam, the intensity distribution of the light beam within the processing surface MP, and the like at an appropriate frequency using the above-described method, thereby enabling necessary calibration. For example, the control device 600 can adjust the three-dimensional intensity distribution of the light beam, the intensity distribution of the light beam within the processing surface MP, and the like based on the measurement results obtained using the measuring device 110.

[0227] Furthermore, the control device 600 may use the measuring device 110 to measure at least one of the intensity distribution of the light beam within the processing surface MP and the intensity distribution of the light beam on a surface different from the processing surface MP, for example, before processing a workpiece, and adjust at least one of the light beam irradiation system 500 and the first stage system 200A based on the measurement results during processing. The surface different from the processing surface MP (image surface) includes a surface near the processing surface MP (image surface) or the pupil plane (PP2).

[0228] As an example of adjustment (control) of the first stage system 200A in this case, position control of the surface plate 12 is representatively mentioned.

[0229] In addition, the content of adjustment (control) of the light beam irradiation system 500 includes all the contents of the various control contents of the light beam irradiation system described above as methods for setting or changing the intensity distribution of the light beam on the processing surface, such as the shape, size, position, etc. of the irradiation area of ​​the light beam formed on the processing surface.

[0230] Furthermore, in situations where it is impossible to perform a single measurement of the intensity distribution of the light beam in the processing surface MP by the light receiver 96 while the platform 12 is stationary, for example, particularly when the configuration range of the irradiation area of ​​the light beam in the processing surface MP is large when the mask M is not used, the intensity distribution of the light beam in the processing surface MP is measured while the platform 12 (the opening 92a of the measuring component 92) is moved in at least one of the X-axis direction and the Y-axis direction within the XY plane.

[0231] Furthermore, in the processing device 100 of this embodiment, all components of the measuring device 110 are arranged on the platform 12, but this is not limited to this. As long as the optical conjugate relationship between the light-receiving surface of the CCD96a and the forming surface of the opening 92a of the measuring component 92 that functions as the light-receiving part can be maintained, the components of the measuring device 110 other than the measuring component 92 can also be arranged outside the platform 12.

[0232] Furthermore, a movable component that is equipped with the same sensor device as the measuring device 110 and can move independently of the platform 12 can also be provided separately from the platform 12. In this case, the movable component only needs to be movable in the three-axis directions of X, Y, and Z, and the control device 600 can also adopt a structure that can control (manage) the position of the movable component and the sensor on the platform coordinate system. Using the sensor device, the control device 600 can measure the intensity distribution of the light beam. Furthermore, in this case, the control device 600 can also adjust at least one of the light beam irradiation system 500 and the first stage system 200A during the processing according to the intensity distribution of the light beam measured using the sensor device. In addition, the control device 600 can use the sensor device to measure the intensity distribution of the above-mentioned light beam in parallel with using the measuring system 400 to measure the workpiece on the platform 12.

[0233] Furthermore, as is apparent from the above description, the measuring device 110 can also be used as a non-uniformity sensor that detects non-uniformity (intensity distribution) of the intensity of the light beam within the irradiation area.

[0234] Furthermore, the measuring device 110 may be used to measure aberrations of the light-converging optical system 530, such as wavefront aberrations. Figure 12 The vacant area of ​​the rotating plate 101 shown, for example Figure 12 The area within the circle indicated by the imaginary line (two-point chain line) in FIG. is configured with a microlens array formed by a matrix of multiple microlenses arranged so that the surface forming the opening 92a and the light-receiving surface of the CCD 96a are optically conjugated. In this case, by rotating the rotating plate 101 so that the microlens array is positioned on the optical path of the parallel light emitted from the first optical system 94, and by selecting a pinhole pattern in the mask M, the light beam is focused onto the pinhole pattern through the second partial illumination optical system 82, thereby forming a Shack-Hartmann wavefront aberration measuring device capable of measuring the wavefront aberration of the converging optical system 530. When employing a configuration capable of wavefront aberration measurement, even if the position of the image plane of the converging optical system 530 changes, the position of the image plane of the converging optical system 530 after the change can be measured based on the wavefront aberration measurement results. Based on this, the position of the processed surface MP can be changed, or the position of the upper surface of the measuring member 92 can be adjusted during measurement processing by the measuring device 110. Furthermore, when wavefront aberration measurement is enabled, a configuration can be employed that also adjusts the optical characteristics of the converging optical system 530. For example, the converging optical system 530 can be configured with multiple lenses, and a driving element such as a piezoelectric element can be used to move some of the lenses in the direction of the optical axis AX and in a tilt direction relative to a plane perpendicular to the optical axis AX (tilt direction). In this case, the optical characteristics of the converging optical system 530 can be adjusted by moving the movable lenses in at least one of the direction of the axis AX and the tilt direction.

[0235] In addition, the measuring device 110 may be replaced by Figure 18 As shown, the light receiver 96 is arranged on the upper surface of the platform 12 so that the light-receiving surface of the CCD 96a is coplanar (same surface) with the rest of the platform 12, or conjugate with the rest of the platform 12. Furthermore, the light receiver 96 can be used to measure, for example, the intensity distribution of the light beam on the processing surface MP. In this case, not only can measurements be performed with the platform 12 stationary, but also scanning measurements can be performed while the platform 12 is moving. This eliminates the influence of the limited number of pixels in the CCD or mirror array, and allows accurate measurement results to be obtained. By measuring the intensity distribution of the light beam using a sensor that receives the light beam from the focusing optical system 530 in this manner, it is possible to manage the intensity distribution of the light beam while taking into account factors such as thermal aberration of the focusing optical system 530. Furthermore, by making adjustments based on the results, the intensity distribution of the light beam on the processing surface MP (image plane, etc.) of the focusing optical system 530 can be accurately set to a desired state.

[0236] Furthermore, for example, a slit scanning type spatial image measuring device disclosed in US Patent Application Publication No. 2002 / 0041377 may be used as the measuring device 110 .

[0237] As described above, the major feature of the processing apparatus 100 of this embodiment is that it provides a solution that meets multiple convenience requirements and actual requirements of a manufacturing site (processing site) for parts, etc., compared to a machine tool using a conventional tool.

[0238] Furthermore, in the above embodiment, the following scenario is described as an example: a certain amount of workpieces collected on a pallet is defined as a batch, and workpieces are processed in batches. However, this is not limiting, and workpieces can also be processed one by one. In this scenario, the transport system 300 loads pre-processed workpieces received from an external transport system onto the platform 12, and unloads processed workpieces from the platform and delivers them to the external transport system.

[0239] Furthermore, in the above embodiment, a case where a transmissive mask having a plurality of openings is used as the mask M has been described, but a reflective mask may be used instead.

[0240] Furthermore, in the above embodiment, the mask M is moved using the mask stage 15 so that the light beam from the illumination optical system 520 is irradiated onto at least one of the multiple openings in the mask M. However, the first mirror array 80 can also be used to control the mask M so that at least one of the multiple openings in the mask M is irradiated. In this case, the mask M can be fixed in position or movable. In this case, by changing the opening used for processing, the size and shape of the irradiation area of ​​the light beam on the image plane (processing surface MP) of the focusing optical system 530 can be changed. Therefore, the first mirror array 80 can also be considered as part of the mechanism for changing the intensity distribution of the light beam on the image plane (processing surface MP) of the focusing optical system 530.

[0241] Furthermore, when using multiple openings on the mask M (for example, when forming multiple light beam irradiation areas on the image plane (processing surface MP), in other words, when forming images of multiple openings on the image plane (processing surface MP)), it is also possible to irradiate only a portion of the area including the multiple openings with the light beam. In this case, it is also possible to irradiate multiple areas on the mask M that are separated from each other with the light beam.

[0242] Furthermore, in the above embodiment, a light beam generator having a wavelength in the visible region to the infrared region is used as the light source unit 60, but an ultraviolet light source such as an excimer laser that generates a light beam having a wavelength in the ultraviolet region, or an X-ray light source that generates a light beam having a wavelength in the extreme ultraviolet region may be used instead.

[0243] Furthermore, in the above embodiment, the first and second mirror arrays 80 and 78 are described as being used as spatial light modulators. However, a large-area digital mirror device (DMD) fabricated using MEMS technology and arranged in a matrix can be used instead. In this case, it is difficult to measure the state (e.g., tilt angle) of each mirror element using an encoder or the like. In this case, a detection system can be used that irradiates the surface of the large-area digital mirror device with detection light, receives reflected light from the multiple mirror elements that comprise the digital mirror device, and detects the state of each mirror element based on the intensity distribution. In this case, the detection system can also detect the state of each mirror element based on image information obtained by capturing an image formed by the digital mirror device using imaging means. Furthermore, an adaptive mirror that can actively change the surface shape of the reflecting surface can be used instead of the first and second mirror arrays 80 and 78, or a transmissive optical component that can locally and actively change the refractive index can be used instead of the first and second mirror arrays 80 and 78.

[0244] Furthermore, in the above embodiment, the first mirror array 80 is arranged at or near the pupil position of the illumination optical system 520. However, the first mirror array 80 may also be arranged at or near a position conjugate with the illuminated surface of the illumination optical system (the surface on which the mask M is arranged). Furthermore, in the above embodiment, the second mirror array 78 is arranged at or near a position conjugate with the illuminated surface of the illumination optical system (the surface on which the mask M is arranged). However, the second mirror array may also be arranged at or near the pupil position of the illumination optical system.

[0245] Furthermore, in the above embodiment, the case where the light path is bent 90 degrees through the first and second mirror arrays 80 and 78 is described, but the bending angle of the light path through the first and second mirror arrays 80 and 78 is not limited to 90 degrees. For example, it can be set to any angle such as 110-175 degrees (the incident light and the outgoing light form an acute angle of 5-80 degrees), or 5-80 degrees (the incident light and the outgoing light form an obtuse angle of 120-175 degrees).

[0246] Furthermore, in the above-described embodiment, a detector may be provided to detect the intensity of the light beam from the light source unit 60. For example, a portion of the light beam may be branched upstream of the focusing optical system 530, and the branched light beam that does not enter the focusing optical system 530 may be received by a detector. For example, the intensity (energy) of the light beam entering the focusing optical system 530 can be determined based on the output of the detector. Therefore, the output from the detector may be used to estimate the Z-axis position of the light beam directed toward the processing surface MP (the position on the Z-axis of the image plane). Furthermore, the estimation result may be used to control the focusing optical system 530 so that the light-converging position (the position on the Z-axis of the image plane) becomes a desired position.

[0247] Furthermore, in the processing device 100 of the above embodiment, for example, the rotary encoder 83 may be used. p，q Use together Figure 14 As the detection system 89, a detection light is irradiated on the surface of the first mirror array 80 to receive the detection light from the plurality of mirror elements 81 constituting the first mirror array 80. p，q The reflected light of each mirror element 81 is detected according to its intensity distribution p，q As a detection system, for example, a system with the same structure as that disclosed in the specification of US Patent No. 8,456,624 can be used. It can also be used with the rotary encoder 83 i，j A detection system 89 is used in conjunction with the above.

[0248] Furthermore, in the above embodiment, the mirror elements 81 can be changed. i，j or 81 p，qThe examples of the mirror arrays 78 and 80 of the type that can change the inclination angle of the reflecting surface relative to the reference plane are given, but the present invention is not limited thereto. Each mirror element may also be a mirror array of a structure that can be tilted relative to the reference plane and can be displaced in a direction perpendicular to the reference plane. Furthermore, each mirror element may not necessarily be tilted relative to the reference plane. In this way, a mirror array that can be displaced in a direction perpendicular to the reference plane is provided in, for example, U.S. Patent No. 8,456,624. In addition, each mirror element may also be a mirror array of a type that can rotate around two mutually perpendicular axes parallel to the reference plane (i.e., the inclination angle in two orthogonal directions can be changed). In this way, a mirror array that can change the inclination angle in two orthogonal directions is provided in, for example, U.S. Patent No. 6,737,662. In these cases, the detection system provided in the aforementioned U.S. Patent No. 8,456,624 can also be used to detect the status of each mirror element.

[0249] Furthermore, it is also possible to use a method of irradiating the surface of the mirror array 78 or 80 with detection light and receiving light from the plurality of mirror elements 81 constituting the mirror arrays 78 and 80. i，j or 81 p，q Alternatively, a sensor that individually detects the tilt angle and spacing of each mirror element relative to the reference plane (base) may be provided as a detection system on the mirror array (optical element).

[0250] Furthermore, it is also possible that all the incident angles of the multiple light beams incident on the focusing optical system 530 cannot be controlled (changed). Therefore, when using a mirror array as in the above embodiment, it is also possible that not all mirror elements can change the state of the reflective surface (at least one of the position and tilt angle of the reflective surface). Alternatively, the mirror array can change the state of the reflective surface of multiple mirror elements individually, or can change the state of the reflective surface of the mirror elements group by group. The former also includes the situation where the control device 600 changes the state of the reflective surface of the mirror array group by group.

[0251] Furthermore, a spatial light modulator (non-luminescent image display element) described below can be used in place of the mirror array of the above embodiment. Examples of transmissive spatial light modulators include transmissive liquid crystal displays (LCDs) and electronic color displays (ECDs). Furthermore, examples of reflective spatial light modulators include reflective liquid crystal displays, electrophoretic displays (EPDs), electronic paper (or electronic ink), grating light valves, and diffractive optical elements, in addition to the aforementioned micromirror arrays.

[0252] Furthermore, in the above-described embodiment, the cross-sectional intensity distribution of the light beam can be a binary intensity distribution, but it can also be a multi-valued intensity distribution with three or more values. Furthermore, the intensity distribution of the light beam, the cross-sectional shape of the light beam (e.g., the illumination shape), etc. can also be specified within a range of intensity effective for machining a workpiece in the cross section.

[0253] Furthermore, in the above embodiment, the case where the illuminance distribution of the light beam irradiated to the opening of the mask M is made uniform has been described. However, the illuminance distribution of the light beam irradiated to the opening of the mask M may be non-uniform.

[0254] As mentioned above, while the focusing optical system 530 is preferably large-diameter, a focusing optical system with a numerical aperture (NA) of less than 0.5 may also be used. Furthermore, liquid immersion processing may be performed, where the space between the focusing optical system 530 and the workpiece is completely immersed in liquid. In this case, the numerical aperture (NA) of the focusing optical system may be greater than 1.0. Furthermore, the environment between the focusing optical system 530 and the workpiece may be a vacuum.

[0255] Furthermore, in the above-described embodiment, the aberration of the converging optical system 530 may not be completely reduced to zero, but a predetermined amount of aberration may remain.

[0256] Furthermore, in the above embodiment, the control device 600 controls the components of the first stage system 200A, the second stage system 200B, the transport system 300, the measurement system 400, and the light beam irradiation system 500 as an example. However, the present invention is not limited to this embodiment. The control device of the processing system can also be configured by multiple hardware components each including a processing device such as a microprocessor. In this case, each of the first stage system 200A, the second stage system 200B, the transport system 300, the measurement system 400, and the light beam irradiation system 500 can include a processing device. Alternatively, the control device can be a combination of a first processing device that controls at least two of the first stage system 200A, the second stage system 200B, the transport system 300, the measurement system 400, and the light beam irradiation system 500, and a second processing device that controls the remaining systems. Alternatively, the control device can be a combination of a first processing device that controls three of the five systems, and second and third processing devices that control the remaining two systems, respectively. In either case, each processing device assumes a portion of the functions of the control device 600. Alternatively, the control device of the machining system may be constituted by a plurality of processing devices such as microprocessors and a host computer that manages these processing devices in an overall manner.

[0257] Furthermore, the processing apparatus 100 may not include the measuring system 400 .

[0258] Furthermore, in each of the above embodiments, a gas may be supplied to the portion of the workpiece that is irradiated with the laser beam during processing. The gas may be air, oxygen, or nitrogen.

[0259] The plurality of components of the above-mentioned embodiment can be combined as appropriate. Therefore, some of the plurality of components may not be used.

[0260] Industrial applicability

[0261] As described above, the processing apparatus and processing method of the present invention are suitable for processing a workpiece.

[0262] Explanation of symbols

[0263] 10: Slider

[0264] 12: Platform

[0265] 13: Chuck mechanism

[0266] 15: Mask carrier

[0267] 161-166: Telescopic mechanism

[0268] 17: Mask stage drive system

[0269] 19: Mask carrier position measurement system

[0270] 241-246: Linear encoder

[0271] 26: Planar motor

[0272] 28: Position measurement system

[0273] 62: Optical fiber

[0274] 64: Double compound eye optical system

[0275] 70: Laser unit

[0276] 78: Second mirror array

[0277] 80: 1st mirror array

[0278] 80 p,q :Mirror element

[0279] 83 p，q : Rotary encoder

[0280] 89: Detection System

[0281] 92: Measuring components

[0282] 92a: Opening

[0283] 100: Processing equipment

[0284] 96: Photoreceiver

[0285] 110: Measuring device

[0286] 200A: 1st stage system

[0287] 200B: Second stage system

[0288] 300: Transport system

[0289] 400: Measurement system

[0290] 401: Three-dimensional measuring machine

[0291] 500: Beam Irradiation System

[0292] 520: Illumination Optical System

[0293] 530: Focusing optical system

[0294] 600: Control device

[0295] BS: Base

[0296] LB: Beam

[0297] M: Mask

[0298] MP: machining surface

[0299] PAa-PAc: Opening pattern

[0300] TA: target area

[0301] W: workpiece

Claims

1. A processing device for processing a workpiece by irradiating the workpiece with a light beam while relatively moving the workpiece and the light beam, the processing device comprising: a light beam irradiation system comprising a focusing optical system for emitting the light beam; The light beam irradiation system includes an optical element capable of changing the intensity distribution of the light beam on the processing surface on the emission surface side of the condensing optical system and the cross-sectional intensity distribution of the light beam on the pupil plane of the condensing optical system; The change of the cross-sectional intensity distribution of the light beam on the pupil plane by the optical element includes a change of the cross-sectional shape of the light beam on the pupil plane; The cross-sectional shape of the light beam on the pupil plane has a straight edge in at least a portion and can be changed to: a first shape in which a portion of the linear edge follows at least one of a first imaginary axis passing through the center of the pupil plane on the pupil plane and a second imaginary axis passing through the center of the pupil plane on the pupil plane and being orthogonal to the first imaginary axis; and The linear edge is a second shape that does not follow either the first imaginary axis or the second imaginary axis.

2. A processing device for processing a workpiece by irradiating the workpiece with a light beam while moving the workpiece relative to the light beam, the processing device comprising: a light beam irradiation system comprising a focusing optical system for emitting the light beam; The light beam irradiation system includes an optical element capable of changing the intensity distribution of the light beam on the processing surface on the emission surface side of the condensing optical system and the cross-sectional intensity distribution of the light beam on the pupil plane of the condensing optical system; The change of the cross-sectional intensity distribution of the light beam on the pupil plane by the optical element includes a change of the cross-sectional shape of the light beam on the pupil plane; The cross-sectional shape of the light beam on the pupil plane has a straight edge in at least a portion and can be changed to: A first shape in which a portion of the linear edge follows at least one of a first imaginary axis passing through the center of the pupil plane on the pupil plane and a second imaginary axis orthogonal to the first imaginary axis; and The linear edge and any one of the first imaginary axis and the second imaginary axis are non-parallel to each other in a second shape.

3. The processing device according to claim 1 or 2, wherein: The cross-sectional shape of the light beam on the pupil plane may be changed to a third shape in which the light beam does not pass through a region including the center of the pupil plane.

4. The processing device according to claim 1 or 2, wherein: In the pupil plane, the light beam having the first or second cross-sectional shape does not pass through a region including the center of the pupil plane.

5. The processing device according to claim 3, wherein: The region including the center is a region centered on the optical axis in the pupil plane.

6. The processing device according to claim 3, wherein: In the third shape, the edge of the cross-sectional shape includes an arc defining a region including the center.

7. A processing device for processing a workpiece by irradiating the workpiece with a light beam while moving the workpiece relative to the light beam, the processing device comprising: a light beam irradiation system comprising a focusing optical system for emitting the light beam; The light beam irradiation system includes an optical element capable of changing the intensity distribution of the light beam on the processing surface on the emission surface side of the condensing optical system and the cross-sectional intensity distribution of the light beam on the pupil plane of the condensing optical system; The change of the cross-sectional intensity distribution of the light beam on the pupil plane by the optical element includes a change of the cross-sectional shape of the light beam on the pupil plane; The cross-sectional shape of the light beam on the pupil plane has a straight edge in at least a portion and can be changed to: A first shape in which a portion of the linear edge follows at least one of a first imaginary axis passing through the center of the pupil plane on the pupil plane and a second imaginary axis orthogonal to the first imaginary axis; and The light beam does not pass through a third shape in a region including the center of the pupil plane.

8. The processing device according to any one of claims 1, 2 and 7, wherein: The first imaginary axis or the second imaginary axis corresponds to a scanning direction of the workpiece.

9. The processing device according to any one of claims 1, 2 and 7, wherein: In the first shape, the linear edge includes a portion that coincides with at least a portion of the first imaginary axis and a portion that coincides with at least a portion of the second imaginary axis.

10. The processing device according to any one of claims 1, 2 and 7, wherein: The cross section of the light beam on the pupil plane is defined within one quadrant of four quadrants divided by the first imaginary axis and the second imaginary axis.

11. The processing device according to any one of claims 1, 2 and 7, wherein: The cross section of the light beam on the pupil plane can be defined in a plurality of quadrants among four quadrants divided by the first imaginary axis and the second imaginary axis.

12. The processing device according to any one of claims 1, 2 and 7, wherein: The cross-sectional shape may be set to at least one of a circle, a semicircle, and a quarter circle centered on the optical axis on the pupil plane.

13. The processing device according to claim 12, wherein: The straight edge is a diameter portion of the semicircle or a radius portion of the quarter circle.

14. The processing device according to any one of claims 1, 2 and 7, wherein: The cross-sectional shape of the light beam on the pupil plane can be changed to a fourth shape which is a circular area centered on the optical axis on the pupil plane.

15. A processing device for processing a workpiece by irradiating the workpiece with a light beam while relatively moving the workpiece and the light beam, the processing device comprising: a light beam irradiation system comprising a focusing optical system for emitting the light beam; The light beam irradiation system includes an optical element capable of changing the intensity distribution of the light beam on the processing surface on the emission surface side of the condensing optical system and the cross-sectional intensity distribution of the light beam on the pupil plane of the condensing optical system; The change of the cross-sectional intensity distribution of the light beam on the pupil plane by the optical element includes a change of the cross-sectional shape of the light beam on the pupil plane; The cross-sectional shape of the light beam on the pupil plane has a straight edge in at least a portion and can be changed to: a second shape in which a portion of the linear edge does not follow either a first imaginary axis passing through the center of the pupil plane or a second imaginary axis orthogonal to the first imaginary axis; and The light beam does not pass through a third shape in a region including the center of the pupil plane.

16. A processing device for processing a workpiece by irradiating the workpiece with a light beam while relatively moving the workpiece and the light beam, the processing device comprising: a light beam irradiation system comprising a focusing optical system for emitting the light beam; The light beam irradiation system includes an optical element capable of changing the intensity distribution of the light beam on the processing surface on the emission surface side of the condensing optical system and the cross-sectional intensity distribution of the light beam on the pupil plane of the condensing optical system; The change of the cross-sectional intensity distribution of the light beam on the pupil plane by the optical element includes a change of the cross-sectional shape of the light beam on the pupil plane; The cross-sectional shape of the light beam on the pupil plane has a straight edge in at least a portion and can be changed to: a second shape in which a portion of the linear edge is non-parallel to either a first imaginary axis passing through the center of the pupil plane on the pupil plane or a second imaginary axis orthogonal to the first imaginary axis; and The light beam does not pass through a third shape in a region including the center of the pupil plane.

17. A processing method for processing a workpiece by irradiating the workpiece with a light beam while moving the workpiece relative to the light beam, the processing method comprising: an action of processing a target portion of the workpiece using the light beam emitted from the focusing optical system; and An operation of changing the intensity distribution of the light beam on the processing surface on the emission surface side of the converging optical system and the cross-sectional intensity distribution of the light beam on the pupil plane of the converging optical system; The change in the cross-sectional intensity distribution of the light beam on the pupil plane includes a change in the cross-sectional shape of the light beam on the pupil plane; The cross-sectional shape of the light beam on the pupil plane has a straight edge in at least a portion and can be changed to: A first shape in which a portion of the linear edge follows at least one of a first imaginary axis passing through the center of the pupil plane on the pupil plane and a second imaginary axis orthogonal to the first imaginary axis; and The linear edge is a second shape that does not follow either the first imaginary axis or the second imaginary axis.

18. A processing method for processing a workpiece by irradiating the workpiece with a light beam while moving the workpiece relative to the light beam, the processing method comprising: an action of processing a target portion of the workpiece using the light beam emitted from the focusing optical system; and An operation of changing the intensity distribution of the light beam on the processing surface on the emission surface side of the converging optical system and the cross-sectional intensity distribution of the light beam on the pupil plane of the converging optical system; The change in the cross-sectional intensity distribution of the light beam on the pupil plane includes a change in the cross-sectional shape of the light beam on the pupil plane; The cross-sectional shape of the light beam on the pupil plane has a straight edge in at least a portion and can be changed to: A first shape in which a portion of the linear edge follows at least one of a first imaginary axis passing through the center of the pupil plane on the pupil plane and a second imaginary axis orthogonal to the first imaginary axis; and The linear edge and any one of the first imaginary axis and the second imaginary axis are non-parallel to each other in a second shape.

19. A processing method for processing a workpiece by irradiating the workpiece with a light beam while moving the workpiece relative to the light beam, the processing method comprising: an action of processing a target portion of the workpiece using the light beam emitted from the focusing optical system; and An operation of changing the intensity distribution of the light beam on the processing surface on the emission surface side of the converging optical system and the cross-sectional intensity distribution of the light beam on the pupil plane of the converging optical system; The change in the cross-sectional intensity distribution of the light beam on the pupil plane includes a change in the cross-sectional shape of the light beam on the pupil plane; The cross-sectional shape of the light beam on the pupil plane has a straight edge in at least a portion and can be changed to: A first shape in which a portion of the linear edge follows at least one of a first imaginary axis passing through the center of the pupil plane on the pupil plane and a second imaginary axis orthogonal to the first imaginary axis; and The light beam does not pass through a third shape in a region including the center of the pupil plane.

20. A processing method for processing a workpiece by irradiating the workpiece with a light beam while moving the workpiece relative to the light beam, the processing method comprising: an action of processing a target portion of the workpiece using the light beam emitted from the focusing optical system; and An operation of changing the intensity distribution of the light beam on the processing surface on the emission surface side of the converging optical system and the cross-sectional intensity distribution of the light beam on the pupil plane of the converging optical system; The change in the cross-sectional intensity distribution of the light beam on the pupil plane includes a change in the cross-sectional shape of the light beam on the pupil plane; The cross-sectional shape of the light beam on the pupil plane has a straight edge in at least a portion and can be changed to: a second shape in which a portion of the linear edge does not follow either a first imaginary axis passing through the center of the pupil plane or a second imaginary axis orthogonal to the first imaginary axis; and The light beam does not pass through a third shape in a region including the center of the pupil plane.

21. A processing method for processing a workpiece by irradiating the workpiece with a light beam while moving the workpiece relative to the light beam, the processing method comprising: an action of processing a target portion of the workpiece using the light beam emitted from the focusing optical system; and An operation of changing the intensity distribution of the light beam on the processing surface on the emission surface side of the converging optical system and the cross-sectional intensity distribution of the light beam on the pupil plane of the converging optical system; The change in the cross-sectional intensity distribution of the light beam on the pupil plane includes a change in the cross-sectional shape of the light beam on the pupil plane; The cross-sectional shape of the light beam on the pupil plane has a straight edge in at least a portion and can be changed to: a second shape in which a portion of the linear edge is non-parallel to either a first imaginary axis passing through the center of the pupil plane on the pupil plane or a second imaginary axis orthogonal to the first imaginary axis; and The light beam does not pass through a third shape in a region including the center of the pupil plane.

Images