Integrated full-automatic ball planting machine

Abstract

The application relates to a full-automatic integrated ball planting machine, which comprises a ball planting machine body, the ball planting machine body comprises a whole-plate feeding port, a whole-plate carrier platform and a whole-plate discharging port, the whole-plate carrier platform comprises a lifting jig, a whole-plate steel mesh and a tin scraping mechanism, the whole-plate steel mesh is arranged at the center of the whole-plate carrier platform, the lifting jig is arranged at the bottom of the whole-plate carrier platform, the tin scraping mechanism is arranged at the top of the whole-plate carrier platform, a scraper driving mechanism is mounted on the side of the whole-plate carrier platform, and a ball feeding mechanism is mounted on the scraper driving mechanism; the lifting jig comprises a jig main body and a lifting cylinder, the jig main body is embedded in a transmission mold, and the two sides of the transmission mold are connected with slide rails on the ball planting machine body in a sliding mode, the slide rails penetrate through the whole-plate feeding port, the whole-plate carrier platform and the whole-plate discharging port; an iron plate heating device is further mounted on the whole-plate discharging port. The application effectively improves the ball planting quality and efficiency and greatly reduces the high labor cost.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to an integrated fully automatic ball-planting machine. Background Technology

[0002] A wafer-level ball-mounting machine is a high-end semiconductor device used to precisely place solder balls onto a wafer that has been printed with flux. Currently, the solder balls used in wafer-level ball-mounting machines are generally in the range of 75μm-300μm, and one of its core technologies is the ball-mounting method.

[0003] To achieve precise implantation of solder balls into wafers, existing wafer-level ball-mounting equipment primarily employs manual methods. For example, patent CN103606527A involves an operator using a plastic scraper to scrape the balls back and forth on a stencil several times, inserting them into the mesh openings. The mesh openings are pre-aligned with the PAD points on the wafer, with one solder ball falling into each mesh opening. This manual method of implanting solder balls onto the PAD points on the wafer requires professional operation. In mass production at factories, the quality of ball placement may be affected by manual operation, and the ball placement efficiency is low while labor costs are high. Summary of the Invention

[0004] In order to overcome the problems existing in the prior art, this application provides an integrated fully automatic ball planting machine.

[0005] The integrated fully automatic ball-planting machine provided in this application adopts the following technical solution:

[0006] An integrated fully automatic ball-planting machine includes a ball-planting machine body, which comprises a whole-board inlet, a whole-board carrier platform, and a whole-board outlet. The whole-board carrier platform includes a lifting fixture, a whole-board steel mesh, and a solder scraping mechanism. The whole-board steel mesh is located at the center of the whole-board carrier platform, the lifting fixture is located at the bottom of the whole-board carrier platform, and the solder scraping mechanism is located at the top of the whole-board carrier platform. A scraper drive mechanism is installed on the side of the whole-board carrier platform, and a ball-feeding mechanism is installed on the scraper drive mechanism. The lifting fixture includes a fixture body and a lifting cylinder. The fixture body is embedded in a transfer mold, and the grooves on both sides of the transfer mold are slidably connected to the slide rails on the ball-planting machine body. The slide rails pass through the whole-board inlet, the whole-board carrier platform, and the whole-board outlet. An iron plate heating device is also installed on the whole-board outlet.

[0007] By adopting the above technical solution, the transfer mold in the ball-mounting machine is slidably connected to the slide rail on the main body of the ball-mounting machine through a groove at the bottom. The movement of the transfer mold on the slide rail can be controlled by pushing it with a telescopic rod. The transfer mold can carry the main body of the jig containing the wafer into the whole board feed port, pass through the ball-mounting process on the whole board carrier platform, and then go to the iron plate heating device on the whole board discharge port to melt and cool the implanted solder balls. Finally, it is discharged from the whole board discharge port, realizing a fully automatic ball-mounting process. Among them, the lifting jig in the whole board platform can raise the jig body from the transfer mold to the bottom surface of the whole board stencil through the lifting cylinder, and fit it with the whole board stencil. This allows the wafer in the lifting jig to be aligned with the mesh of the whole board stencil. The scraper drive mechanism drives the solder scraping mechanism to scrape the solder balls on the whole board stencil, thereby filling the solder balls onto the wafer. The ball supply mechanism on the scraper drive mechanism is responsible for supplying solder balls to the solder scraping mechanism.

[0008] Preferably, the scraper drive mechanism includes a frame, an adjusting screw running transversely through the frame, a geared motor installed at the end of the adjusting screw, a moving part mounted on the adjusting screw, a solder scraping mechanism installed at the end of the moving part, and a counterweight block provided at the end of the moving part away from the solder scraping mechanism.

[0009] By adopting the above technical solution, the scraper drive mechanism drives the adjusting screw to rotate through the reduction motor, thereby adjusting the sliding part mounted on the screw to slide within the frame, thereby controlling the reciprocating motion of the scraping mechanism installed on the sliding part, thus achieving the purpose of scraping and ball placement. Furthermore, a counterweight is provided at the end of the sliding part away from the scraping mechanism, which can prevent the scraping mechanism and the sliding part connected to the scraping mechanism from being too heavy, thus ensuring the stability and flatness of the solder ball placement area.

[0010] Preferably, the bottom of the solder scraping mechanism is provided with a scraper, and solder ball guide tubes are installed on both sides of the scraper. The outlet end of the solder ball guide tube adopts a strip-shaped outlet, and the inlet end of the solder ball guide tube is connected to the solder ball storage box at the top of the solder scraping mechanism. The left and right sides of the scraper are respectively provided with a left valve and a right valve at the connection between the solder ball guide tube and the solder ball storage box.

[0011] By adopting the above technical solution, the scraper at the bottom of the solder scraping mechanism is used to scrape solder balls onto the wafer at the bottom of the stencil. Solder ball guide tubes installed on both sides of the scraper are responsible for supplying solder balls to the scraper, and the strip-shaped outlet can cooperate with the long strip-shaped scraper. The solder ball guide tubes are connected to the solder ball storage and provide a stable supply of solder balls. The left and right guide tubes on the left and right sides of the scraper are equipped with left and right valves respectively at the connection points with the solder ball storage box, which can automatically open and close the two valves according to the direction of the solder ball placement by the solder scraping mechanism.

[0012] Preferably, the cross-section of the scraper is rhomboid, and the contact end between the scraper and the whole steel mesh is provided with an arc-shaped scraping end. The length of the scraper is slightly longer than the width of the whole steel mesh. Arc-shaped receiving plates are provided at both ends of the scraper, and a solder ball adsorption device is connected to the outer wall of the arc-shaped receiving plate.

[0013] By adopting the above technical solution, the cross-section of the scraper is rhomboid, allowing excess solder balls to be guided to both sides along the two inclined edges of the scraping surface during the solder ball scraping process. Furthermore, the scraper, designed to be longer than the entire stencil, collects excess solder balls at both ends via arc-shaped receiving plates. Solder ball adsorption devices connected to the outer arms of the arc-shaped receiving plates can suck up these excess solder balls for subsequent reuse, thus preventing excess solder balls from scattering on the stencil and causing waste. Moreover, the arc-shaped scraping end at the contact point between the scraper and the stencil applies force to the solder balls as they pass through the stencil through a surface more inclined than the scraper. The arc-shaped scraping end design, compared to the flat surface, makes it less likely for the solder balls to pop out after being squeezed at an angle, and the arc-shaped inward-curving angle facilitates the transfer of the solder balls to the side, achieving a safer and easier solder ball collection effect.

[0014] Preferably, the input end of the solder ball adsorption device is connected to the outer wall of the arc-shaped receiving plate, the output end of the solder ball adsorption device is connected to the solder ball collecting box, the adsorption motor is installed on the outer wall of the solder ball collecting box, the solder ball collecting box is located on top of the solder ball storage box, and a dust filter box is provided between the two.

[0015] By adopting the above technical solution, the input end of the solder ball adsorption device absorbs solder balls from the arc-shaped receiving plate, and the adsorption motor on the side wall of the solder ball collection box guides the collected solder balls into the solder ball collection box. Furthermore, a dust filter box is provided between the solder ball collection box and the solder ball storage box, which can filter the dust sucked in when the solder ball collection box collects excess solder balls, preventing dusty solder balls from entering the subsequent ball placement, effectively saving the amount of solder balls used and improving the quality of ball placement.

[0016] Preferably, the dust filter box is provided with an arc-shaped guide pipe, and the wall of the arc-shaped guide pipe adopts a dust filter screen structure, and a dust collection box is provided at the bottom of the dust filter box, wherein the top of the dust collection box is threadedly sealed to the dust filter box.

[0017] By adopting the above technical solution, the dust filter box uses an arc-shaped guide pipe with the pipe wall as a filter screen. The solder balls in the solder ball collection box located at the top of the solder ball storage box are drawn into the solder ball storage box by gravity along the arc-shaped pipe. When the solder balls move in the arc-shaped pipe wall, they collide with the pipe wall, shaking out the dust mixed in with them. The dust is discharged into the dust collection box through the arc-shaped guide pipe with the dust filter screen structure. The threaded connection design between the dust collection box and the dust collection bin allows for convenient periodic emptying of the dust without disassembling the dust collection box.

[0018] Preferably, the ball supply mechanism is mounted on the scraper drive mechanism, and a spiral guide tube is provided at the outlet of the ball supply mechanism. The outlet of the spiral guide tube is connected to the top of the solder ball storage box through a corrugated hose. A solder ball quantity monitoring block is installed on the side wall of the solder ball storage box.

[0019] By adopting the above technical solution, the ball supply mechanism is installed on the scraper drive mechanism and does not move left or right with the solder scraping mechanism. The supply and demand mechanism uses information from the solder ball level monitoring block in the solder ball storage box. When the number of solder balls in the storage box is insufficient, the supply and demand device exports the solder balls through the threaded guide tube at its outlet and guides them into the solder ball storage box through a corrugated hose, thereby replenishing the solder ball quantity in the storage box. This design avoids storing a large number of solder balls in the storage box, preventing significant changes in the weight of the storage box placed on the solder scraping mechanism after continuous consumption, which could lead to changes in the scraper tilt angle and a decrease in ball placement quality.

[0020] Preferably, the main body of the fixture is embedded in the transfer mold, wherein the transfer mold adopts a frame structure, and a groove for accommodating the main body of the fixture is provided on the inner side of the frame. Limiting perforations are distributed in a ring around the edge of the main body of the fixture, and the limiting perforations are adapted to the limiting slide rods on the groove.

[0021] By adopting the above technical solution, the main body of the jig is embedded in the transfer mold. The position of the jig is fixed by the groove on the inner side of the transfer mold, and the limiting slide rod on the transfer mold is fixed to the limiting through hole on the jig, thereby further limiting the lifting and lowering of the jig.

[0022] Preferably, the lifting cylinder is located at the bottom of the jig body, and the lifting cylinder passes through the central through hole of the transfer mold and abuts against the bottom of the jig body, and the top of the limiting slide rod on the trough is on the same horizontal plane as the bottom of the whole plate steel mesh.

[0023] By adopting the above technical solution, the lifting cylinder is set at the bottom of the jig body, which can penetrate through the center of the transfer mold and abut against the jig body. The jig body is then abutted against the bottom of the whole plate steel mesh along the limiting slide bar, allowing the wafers on the jig body to be ball-planted through the whole plate steel mesh. After the ball-planting is completed, the wafers can also descend along the limiting slide bar and continue to enter the iron plate heating device for heating along with the transfer mold.

[0024] Preferably, the iron plate heating device includes a heating iron plate and a fume hood, wherein the heating iron plate is disposed at the bottom of the transfer mold and a lifting mechanism is provided at the bottom of the heating iron plate, and the fume hood is installed on the top of the heating iron plate symmetrically relative to the transfer mold.

[0025] By adopting the above technical solution, the heating iron plate in the iron plate heating device is raised to fit against the bottom of the jig body for heating through a lifting mechanism. The gas and dust generated by heating are discharged through the exhaust hood at the top to prevent them from falling onto the wafer surface and affecting the quality of the wafer ball placement.

[0026] In summary, this application includes at least one of the following beneficial technical effects:

[0027] 1. The scraper drive mechanism controls the scraping mechanism installed on the moving part to perform reciprocating motion, thereby achieving the purpose of sweeping and placing the solder balls. A counterweight is provided at the end of the moving part away from the scraping mechanism to prevent the scraping mechanism and the moving part connected to the scraping mechanism from being too heavy, which would cause the part of the solder ball to be placed to be unstable and flat, ensuring the level of the scraper used for placing the balls and ensuring the stability of the ball placement quality.

[0028] 2. The scraper guides the excess solder balls to both sides along the two beveled edges on the scraper surface. The scraper, which is longer than the whole plate of steel mesh, collects the excess solder balls at both ends through the arc-shaped receiving plate. The solder ball adsorption device connected to the outer arm of the arc-shaped receiving plate can suck up these excess solder balls for subsequent reuse, thus preventing the excess solder balls from being scattered on the whole plate of steel mesh and causing waste.

[0029] 3. The integrated fully automatic ball-planting machine completes everything from solder ball supply and placement to the heating, melting, and cooling of the solder balls. It eliminates the need for frequent solder ball additions, effectively improving ball-planting quality and efficiency, and significantly reducing labor costs. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of an integrated fully automatic ball-planting machine;

[0031] Figure 2 yes Figure 1 Enlarged view of point A in the middle;

[0032] Figure 3 This is a structural diagram of an integrated fully automatic ball-planting machine, excluding the ball-planting machine body and the whole-board carrier platform.

[0033] Explanation of reference numerals in the attached drawings: 1. Ball-forming machine body; 2. Whole board feed inlet; 3. Whole board carrier platform; 31. Lifting jig; 311. Jig body; 3111. Limiting perforation; 312. Lifting cylinder; 32. Whole board steel mesh; 33. Solder scraping mechanism; 331. Scraper; 3311. Arc-shaped scraper end; 3312. Arc-shaped receiving plate; 332. Solder ball guide tube; 3321. Left valve; 3322. Right valve; 333. Solder ball storage box; 3331. Solder ball inventory monitoring block; 4. Whole board discharge outlet; 41. Iron plate heating. Device; 411, Heating iron plate; 4111, Lifting mechanism; 412, Smoke hood; 5, Scraper drive mechanism; 51, Frame; 52, Adjusting screw; 53, Gear motor; 54, Moving part; 55, Counterweight; 6, Ball supply mechanism; 61, Spiral guide pipe; 62, Corrugated hose; 7, Transfer mold; 71, Groove; 72, Slide rail; 73, Limiting slide bar; 8, Solder ball adsorption device; 81, Solder ball collection box; 82, Adsorption motor; 9, Dust filter box; 91, Arc-shaped guide pipe; 92, Dust collection box. Detailed Implementation

[0034] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.

[0035] This application discloses an integrated fully automatic ball-planting machine.

[0036] Reference Figure 1 , Figure 2 and Figure 3An integrated fully automatic ball-planting machine includes a ball-planting machine body 1. The ball-planting machine body 1 includes a whole plate feed inlet 2, a whole plate carrier platform 3, and a whole plate discharge outlet 4. The whole plate carrier platform 3 includes a lifting fixture 31, a whole plate steel mesh 32, and a tin scraping mechanism 33. The whole plate steel mesh 32 is located at the center of the whole plate carrier platform 3. The lifting fixture 31 is located at the bottom of the whole plate carrier platform 3. The tin scraping mechanism 33 is located at the top of the whole plate carrier platform 3. A scraper drive mechanism 5 is installed on the side of the whole plate carrier platform 3. A ball supply mechanism 6 is installed on the scraper drive mechanism 5. The lifting fixture 31 includes a fixture body 311 and a lifting cylinder 312. The fixture body 311 is embedded in a transfer mold 7. The grooves 71 on both sides of the transfer mold 7 are slidably connected to the slide rails 72 on the ball-planting machine body 1. The slide rails 72 pass through the whole plate feed inlet 2, the whole plate carrier platform 3, and the whole plate discharge outlet 4. An iron plate heating device 41 is also installed on the whole plate discharge outlet 4. In the ball-planting machine, the transfer mold 7 is slidably connected to the slide rail 72 on the ball-planting machine body 1 through the groove 71 at the bottom. The movement of the transfer mold 7 on the slide rail 72 can be controlled by pushing it with a telescopic rod. The transfer mold 7 can carry the jig body 311 containing the wafer into the whole board feed port 2, pass through the ball-planting process on the whole board carrier platform 3, and then go to the iron plate heating device 41 on the whole board discharge port 4 to melt and cool the implanted solder balls. Finally, it is discharged from the whole board discharge port 4, realizing a fully automatic ball-planting process. In the whole board platform, the lifting jig 31 can lift the jig body 311 from the transfer mold 7 to the bottom surface of the whole board steel mesh 32 through the lifting cylinder 312, so that it fits with the whole board steel mesh 32. This allows the wafer in the lifting jig 31 to be aligned with the mesh on the whole board steel mesh 32. The scraper drive mechanism 5 drives the solder scraping mechanism 33 to scrape the solder balls on the whole board steel mesh 32, thereby filling the wafer with solder balls. The ball supply mechanism 6 on the scraper drive mechanism 5 is responsible for providing solder balls to the solder scraping mechanism 33.

[0037] Reference Figure 1 and Figure 2 The scraper drive mechanism 5 includes a frame 51, with an adjusting screw 52 extending transversely through the frame 51. A reduction motor 53 is mounted on the end of the adjusting screw 52, ​​and a moving part 54 is fitted onto the adjusting screw 52. A solder scraping mechanism 33 is mounted on the end of the moving part 54, and a counterweight 55 is provided at the end of the moving part 54 away from the solder scraping mechanism 33. The scraper drive mechanism 5 uses the reduction motor 53 to drive the adjusting screw 52 to rotate, thereby adjusting the sliding of the moving part 54 mounted on the screw within the frame 51. This controls the reciprocating motion of the solder scraping mechanism 33 mounted on the moving part 54, achieving the purpose of ball sweeping and placement. The counterweight at the end of the moving part 54 away from the solder scraping mechanism 33 prevents the solder scraping mechanism 33 and the part connecting the moving part 54 from becoming too heavy, thus ensuring the stability and flatness of the solder ball placement.

[0038] Reference Figure 1 and Figure 2 The bottom of the solder scraping mechanism 33 is equipped with a scraper 331, and solder ball guide tubes 332 are installed on both sides of the scraper 331. The outlet end of the solder ball guide tube 332 adopts a strip-shaped outlet, and the inlet end of the solder ball guide tube 332 is connected to the solder ball storage box 333 at the top of the solder scraping mechanism 33. A left valve 3321 and a right valve 3322 are respectively provided at the connection between the solder ball guide tubes 332 on the left and right sides of the scraper 331 and the solder ball storage box 333. The scraper 331 at the bottom of the solder scraping mechanism 33 is used to scrape the solder balls onto the wafer at the bottom of the stencil 32. The solder ball guide tubes 332 installed on both sides of the scraper 331 are responsible for supplying solder balls to the scraper 331. The strip-shaped outlet can cooperate with the long strip scraper 331, and the solder ball to the tubes and the solder ball storage are connected to provide a stable supply of solder balls. The guide tubes on the left and right sides of the scraper 331 are respectively equipped with a left valve 3321 and a right valve 3322 at the connection points with the solder ball storage box 333. The two valves can be automatically opened and closed according to the direction of the solder scraping mechanism 33 for placing the balls.

[0039] Reference Figure 1 , Figure 2 and Figure 3 The scraper 331 has a rhomboid cross-section, and the contact end between the scraper 331 and the whole steel mesh 32 is provided with an arc-shaped scraping end 3311. The length of the scraper 331 is slightly longer than the width of the whole steel mesh 32. Arc-shaped receiving plates 3312 are provided at both ends of the scraper 331, and solder ball adsorption devices 8 are connected to the outer side of the arc-shaped receiving plate 3312. The rhomboid cross-section of the scraper 331 allows the scraper 331 to guide excess solder balls to both sides along the two inclined sides of the scraping surface during the scraping process. The scraper 331, which is longer than the whole steel mesh 32, collects excess solder balls at both ends through the arc-shaped receiving plate 3312. The solder ball adsorption device 8 connected to the outer side of the arc-shaped receiving plate 3312 can absorb these excess solder balls for subsequent reuse, thus preventing excess solder balls from being scattered on the whole steel mesh 32 and wasting them. Furthermore, the arc-shaped scraper end 3311 at the contact end between the scraper 331 and the whole plate steel mesh 32 can apply force to the solder ball through the whole plate steel mesh 32 for ball placement by a surface that is more inclined relative to the scraper 331. In addition, the design of the arc-shaped scraper end 3311 makes it less likely to pop out after being squeezed at an angle relative to the plane, and it is easy to transfer the solder ball to the side with the arc-shaped angle of the inward groove 71, achieving a safer and easier solder ball collection effect.

[0040] Reference Figure 1 and Figure 2The input end of the solder ball adsorption device 8 is connected to the outer wall of the arc-shaped receiving plate 3312, and the output end of the solder ball adsorption device 8 is connected to the solder ball collection box 81. The adsorption motor 82 is installed on the outer wall of the solder ball collection box 81, which is located on top of the solder ball storage box 333, with a dust filter box 9 between them. The input end of the solder ball adsorption device 8 absorbs the solder balls in the arc-shaped receiving plate 3312, and the adsorption motor 82 on the side wall of the solder ball collection box 81 guides the collected solder balls into the solder ball collection box 81. The dust filter box 9 between the solder ball collection box 81 and the solder ball storage box 333 filters the dust sucked in when the solder ball collection box 81 collects excess solder balls, preventing dusty solder balls from entering the subsequent ball placement process, effectively saving the amount of solder balls used and improving the quality of ball placement.

[0041] Reference Figure 1 and Figure 2 The dust filter box 9 is equipped with an arc-shaped guide pipe 91, the wall of which is a dust filter screen. A dust collection box 92 is located at the bottom of the dust filter box 9, with its top threadedly sealed to the dust filter box 9. The arc-shaped guide pipe 91, with its filter screen wall, allows solder balls from the solder ball collection box 81 located at the top of the solder ball storage box 333 to enter the storage box 333 under gravity. As the solder balls move within the arc-shaped pipe, they collide with the pipe wall, dislodging dust that is trapped within them. This dust is then discharged through the arc-shaped guide pipe 91 into the dust collection box 92. The threaded connection between the dust collection box 92 and the dust filter box 81 facilitates periodic emptying of the dust without disassembling the dust collection box 92.

[0042] Reference Figure 1 , Figure 2 and Figure 3The ball supply mechanism 6 is mounted on the scraper drive mechanism 5, and a spiral guide tube 61 is provided at the outlet of the ball supply mechanism 6. The outlet of the spiral guide tube 61 is connected to the top of the solder ball storage box 333 via a corrugated hose 62. A solder ball quantity monitoring block 3331 is installed on the side wall of the solder ball storage box 333. The ball supply mechanism 6 is mounted on the scraper drive mechanism 5 and does not move left or right with the solder scraping mechanism 33. The supply and demand mechanism uses the information fed back by the solder ball quantity monitoring block 3331 in the solder ball storage box 333. When the number of solder balls in the solder ball storage box 333 is insufficient, the supply and demand device exports the solder balls through the spiral guide tube at its outlet and guides them into the solder ball storage box 333 through the corrugated hose 62 to replenish the amount of solder balls in the solder ball storage box 333. This design is intended to avoid storing a large number of solder balls in the solder ball storage box 333, and to prevent the weight of the solder ball storage box 333 placed on the solder scraping mechanism 33 from changing significantly after the solder balls are continuously consumed, which would cause a change in the tilt angle of the scraper 331 and result in a decrease in the quality of the solder ball placement.

[0043] Reference Figure 1 , Figure 2 and Figure 3 The main body of the fixture 311 is embedded in the transfer mold 7. The transfer mold 7 adopts a frame structure, and a groove is formed on the inner side of the frame to accommodate the main body of the fixture 311. Limiting holes 3111 are distributed in a ring around the edge of the main body of the fixture 311, and the limiting holes 3111 are adapted to the limiting slide rods 73 on the groove. The main body of the fixture 311 is embedded in the transfer mold 7, and the position of the main body of the fixture 311 is fixed by the groove on the inner side of the transfer mold 7. The limiting slide rods 73 on the transfer mold 7 are fixed by the limiting holes 3111 on the main body of the fixture 311, thereby further limiting the lifting and lowering of the main body of the fixture 311.

[0044] Reference Figure 1 , Figure 2 and Figure 3 The lifting cylinder 312 is located at the bottom of the jig body 311, and the lifting cylinder 312 passes through the center hole of the transfer mold 7 and abuts against the bottom of the jig body 311. The top of the limiting slide rod 73 on the groove is on the same horizontal plane as the bottom of the whole plate steel mesh 32. The lifting cylinder 312 is located at the bottom of the jig body 311, and can pass through the center of the transfer mold 7 to abut against the jig body 311. It also moves the jig body 311 along the limiting slide rod 73 to abut against the bottom of the whole plate steel mesh 32, so that the wafers on the jig body 311 can be ball-planted through the whole plate steel mesh 32. After the ball-planting is completed, it can also descend along the limiting slide rod 73 and continue to enter the iron plate heating device 41 for heating along with the transfer mold 7.

[0045] Reference Figure 1 , Figure 2 and Figure 3 The iron plate heating device 41 includes a heating iron plate 411 and a fume hood 412. The heating iron plate 411 is located at the bottom of the transfer mold 7, and a lifting mechanism 4111 is provided at the bottom of the heating iron plate 411. The fume hood 412 is installed on the top of the heating iron plate 411, symmetrically positioned relative to the transfer mold 7. In the iron plate heating device 41, the lifting mechanism 411 raises the heating iron plate 411 to a position where it is in contact with the bottom of the jig body 311 for heating. The gas and dust generated during heating are discharged through the fume hood 412 at the top, preventing them from cooling and falling onto the wafer surface and affecting the quality of the wafer ball placement.

[0046] Working principle: The main body 311 containing the wafer is placed into the groove 71 on the transfer mold 7. The limiting holes 3111 around the main body 311 are fitted onto the limiting slide rod 73. At this time, the transfer mold 7 is placed into the slide rail 72 from the whole board feed port 2, and the transfer mold 7 is driven into the whole board carrier platform 3. The lifting cylinder 312 on the whole board carrier platform 3 lifts the main body 311, allowing the main body 311 to move along the limiting slide rod 73 and finally abut against the bottom surface of the whole board stencil 32. At this time, the scraper drive mechanism 5 adjusts the position of the drive adjustment moving part 54 through the reduction motor 53. The solder scraping mechanism 33 on the moving part 54 moves to one end of the whole board stencil 32, and the solder balls are loaded from one end to the other end by the drive of the reduction motor 53. The solder ball guide tube 332 set at the front end of the scraper 331 in the direction of movement supplies solder balls. During the ball-planting process, the scraper 331 guides excess solder balls to both sides along the two beveled edges of the scraper surface. The scraper 331, designed to be longer than the entire steel mesh 32, collects the excess solder balls at both ends via an arc-shaped receiving plate 3312. A solder ball adsorption device 8 connected to the outer arm of the arc-shaped receiving plate 3312 sucks away these excess solder balls. After entering the solder ball collection box 81, the solder balls are filtered through the arc-shaped guide pipe 91 in the dust filter. The filtered solder balls then enter the solder ball storage box 333 to continue providing raw solder balls for ball-planting. The completed die body 311 continues to enter the iron plate heating device 41 along with the transfer mold 7. The lifting mechanism 4111 drives the heating iron plate 411 to contact and heat the bottom of the die body 311. The water vapor and dust generated during heating are collected by the exhaust hood 412 located above it. After the heated wafer has cooled, it is removed.

[0047] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An integrated fully automatic ball-planting machine, comprising a ball-planting machine body (1), characterized in that: The ball-planting machine body (1) includes a whole plate feed inlet (2), a whole plate carrier platform (3), and a whole plate discharge outlet (4). The whole plate carrier platform (3) includes a lifting fixture (31), a whole plate steel mesh (32), and a tin scraping mechanism (33). The whole plate steel mesh (32) is located at the center of the whole plate carrier platform (3). The lifting fixture (31) is located at the bottom of the whole plate carrier platform (3). The tin scraping mechanism (33) is located at the top of the whole plate carrier platform (3). A scraper drive mechanism (5) is installed on the side of the whole plate carrier platform (3). A ball supply mechanism (6) is installed on the scraper drive mechanism (5). The lifting fixture (31) includes a fixture body (311) and a lifting air... The cylinder (312) has a main body (311) embedded in a transfer mold (7), and the grooves (71) on both sides of the transfer mold (7) are slidably connected to the slide rails (72) on the ball-planting machine body (1). The slide rails (72) pass through the whole plate feed port (2), the whole plate carrier platform (3), and the whole plate discharge port (4). The whole plate discharge port (4) is also equipped with an iron plate heating device (41). The scraper drive mechanism (5) includes a frame (51), an adjusting screw (52) is transversely passed through the frame (51), a reduction motor (53) is installed at the end of the adjusting screw (52), and a moving part (54) is fitted on the adjusting screw (52). The tin scraping mechanism (33) Installed at the end of the moving part (54), the end of the moving part (54) away from the solder scraping mechanism (33) is also provided with a counterweight (55); the bottom of the solder scraping mechanism (33) is provided with a scraper (331), and solder ball guide tubes (332) are installed on both sides of the scraper (331), wherein the outlet end of the solder ball guide tube (332) adopts a strip-shaped outlet, the inlet end of the solder ball guide tube (332) is connected to the solder ball storage box (333) at the top of the solder scraping mechanism (33), and the left and right sides of the scraper (331) are respectively provided with a left valve (3321) and a right valve (3322) at the connection between the solder ball guide tube (332) and the solder ball storage box (333); the scraper (331) The cross-section of the scraper (331) is rhomboid, and the contact end of the scraper (331) and the whole plate steel mesh (32) is provided with an arc-shaped scraper end (3311). The scraper (331) is provided with an arc-shaped receiving plate (3312) at both ends, and a solder ball adsorption device (8) is connected to the outer wall of the arc-shaped receiving plate (3312). The input end of the solder ball adsorption device (8) is connected to the outer wall of the arc-shaped receiving plate (3312), and the output end of the solder ball adsorption device (8) is connected to the solder ball collection box (81). The adsorption motor (82) is installed on the outer wall of the solder ball collection box (81). The solder ball collection box (81) is set on the top of the solder ball storage box (333), and a dust filter box (9) is provided between the two.The dust filter box (9) is provided with an arc-shaped guide pipe (91), and the pipe wall of the arc-shaped guide pipe (91) adopts a dust filter screen structure. A dust collection box (92) is provided at the bottom of the dust filter box (9), and the top of the dust collection box (92) is threadedly sealed to the dust filter box (9). The ball supply mechanism (6) is installed on the scraper drive mechanism (5), and a spiral guide pipe (61) is provided at the outlet of the ball supply mechanism (6). The outlet of the spiral guide pipe (61) is connected to the top of the solder ball storage box (333) through a corrugated hose (62). A solder ball storage monitoring block (3331) is installed on the side wall of the solder ball storage box (333).

2. The integrated fully automatic ball-planting machine according to claim 1, characterized in that: The main body of the tooling (311) is embedded in the transfer mold (7), wherein the transfer mold (7) adopts a frame structure and a groove for accommodating the main body of the tooling (311) is provided on the inner side of the frame. Limiting holes (3111) are distributed in a ring at the edge of the main body of the tooling (311), and the limiting holes (3111) are adapted to the limiting slide rod (73) on the groove.

3. The integrated fully automatic ball-planting machine according to claim 2, characterized in that: The lifting cylinder (312) is located at the bottom of the jig body (311), and the lifting cylinder (312) passes through the center hole of the transfer mold (7) and abuts against the bottom of the jig body (311). The top of the limiting slide rod (73) on the groove is on the same horizontal plane as the bottom of the whole plate steel mesh (32).

4. The integrated fully automatic ball-planting machine according to claim 1, characterized in that: The iron plate heating device (41) includes a heating iron plate (411) and a smoke exhaust hood (412). The heating iron plate (411) is located at the bottom of the transfer mold (7), and a lifting mechanism (4111) is provided at the bottom of the heating iron plate (411). The smoke exhaust hood (412) is installed on the top of the heating iron plate (411) symmetrically relative to the transfer mold (7).

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