A semiconductor laser with adjustable monitoring current and packaging method

Abstract

The present invention relates to a semiconductor laser with adjustable monitoring current and a packaging method, belonging to the field of semiconductor laser packaging technology. The invention comprises a laser and a PD chip, wherein the PD chip is provided within the laser, and the PD chip receives light leakage from the rear cavity surface of the laser chip, and generates a monitoring current by light sensing. The present invention installs a PD chip within the semiconductor laser, and receives light leakage from the rear cavity surface of the laser chip by the PD chip, and generates a monitoring current by light sensing. The change in the output power of the semiconductor laser is confirmed based on the magnitude of the monitoring current, and the magnitude of the monitoring current can be adjusted to ensure the monitoring effect while ensuring the normal use of the semiconductor laser.

Description

Technical Field

[0001] The invention relates to a semiconductor laser with adjustable monitoring current and a packaging method, belonging to the technical field of semiconductor laser packaging. Background Art

[0002] Compared with other forms of lasers such as solid, gas, and liquid, semiconductor laser technology has developed rapidly since its birth. With its many advantages such as small size, high efficiency, simple structure, and good reliability, it has gradually emerged in many fields such as process processing, communication interconnection, sensor measurement, consumer entertainment, and gradually entered people's daily lives. In many application scenarios, semiconductor lasers are required to work for a long time and output stable optical power. Therefore, it is necessary to monitor the optical power of the semiconductor laser to ensure the long-term and continuous stable output of the semiconductor laser. For this purpose, the present invention is proposed, in which a photosensitive diode (i.e., PD chip) is installed inside the semiconductor laser. The PD chip receives light leakage from the rear cavity surface of the laser chip, generates a monitoring current through light sensing, and confirms the change in the optical power of the semiconductor laser according to the size of the monitoring current.

[0003] In order to cooperate with the semiconductor laser driving circuit, it is necessary to limit the size of the monitoring current at the rated power. If the monitoring current is too high, it will impact the semiconductor laser driving circuit and damage the semiconductor laser. If the monitoring current is too low, it cannot be used and the changes in the semiconductor laser output power cannot be monitored. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the present invention provides a semiconductor laser with adjustable monitoring current. A PD chip is installed inside the semiconductor laser. The PD chip receives light leakage from the rear cavity surface of the laser chip and generates a monitoring current through light sensing. The change in the output light power of the semiconductor laser is confirmed based on the size of the monitoring current. The size of the monitoring current can be adjusted to ensure the monitoring effect while ensuring the normal use of the semiconductor laser.

[0005] The present invention also provides a packaging method for the semiconductor laser with adjustable monitoring current.

[0006] The technical solutions of the present invention are as follows:

[0007] A semiconductor laser with adjustable monitoring current includes a laser and a PD chip. The PD chip is arranged in the laser and receives light leakage from the rear cavity surface of the laser chip through the PD chip to generate a monitoring current through light sensing.

[0008] Preferably, the laser includes a tube base, a laser chip, and a transition heat sink. The tube base is provided with a tube tongue, the tube tongue is provided with a transition heat sink, the laser chip is sintered on the transition heat sink, the laser chip has a light-emitting surface facing upward and a rear cavity facing downward, a PD chip is provided on the tube base below the laser chip, and both the PD chip and the laser chip are connected to an external drive circuit via gold wires. The monitoring current information of the PD chip is received via the external drive circuit.

[0009] Further preferably, an adjustment cap is provided on the tube holder, and the light leakage from the rear cavity surface of the laser chip is shielded by the adjustment cap, thereby adjusting the light leakage area received by the PD chip and further adjusting the monitoring current.

[0010] Preferably, the regulating cap includes a cap body and a shielding piece. The cap body is an annular cylinder. The shielding piece is provided on the cap body. The cap body is sleeved on the tube tongue.

[0011] Further preferably, an arc-shaped positioning protrusion is provided on the tube seat on the opposite side of the tube tongue, and the cap body is positioned by the tube tongue and the arc-shaped positioning protrusion to prevent the cap body from shaking.

[0012] Preferably, two grooves are provided on the cap body. When in use, the two grooves are always located between the three notches on the tube seat. By limiting the cap body, interference between the shielding sheet and the laser chip, transition heat sink or gold wire is avoided.

[0013] Preferably, the shielding sheet is an arc-shaped sheet or a cone-shaped sheet, and is used to shield light leakage from the rear cavity surface of the laser chip.

[0014] Preferably, the height of the cap body is smaller than the height of the laser chip, so that the shielding sheet is located between the laser chip and the PD chip.

[0015] The packaging method of the semiconductor laser with adjustable monitoring current has the following steps:

[0016] (1) Place the adjustment cap on the tube tongue and connect the semiconductor laser to the drive circuit;

[0017] (2) Rotate the adjustment cap to adjust the light leakage shielding area of the shielding plate on the rear cavity surface of the laser chip. When the shielding area increases, the light leakage on the rear cavity surface of the laser chip received by the PD chip decreases, and the monitoring current decreases. When the shielding area decreases, the light leakage on the rear cavity surface of the laser chip received by the PD chip increases, and the monitoring current increases.

[0018] (3) After adjusting the monitoring current to the set value, fix the adjustment cap to the tube holder by energy storage welding or laser welding to complete the packaging.

[0019] The beneficial effects of the present invention are:

[0020] 1. The present invention installs a PD chip inside the semiconductor laser, receives light leakage from the rear cavity surface of the laser chip through the PD chip, generates a monitoring current through photosensitivity, confirms the change of the semiconductor laser's optical power according to the size of the monitoring current, and can adjust the size of the monitoring current to ensure the monitoring effect while ensuring the normal use of the semiconductor laser.

[0021] 2. The present invention adjusts the monitoring current by adjusting the cap, thereby reducing the monitoring current difference of the semiconductor laser and improving the parameter consistency.

[0022] 3. The present invention has a simple structure, low cost, and can be quickly promoted and applied to production. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the present invention;

[0024] Figure 2 This is a schematic diagram of the PD chip installation of the present invention;

[0025] Figure 3 Schematic diagram of the structure of the regulating cap of the present invention;

[0026] Figure 4 It is the installation process diagram of the present invention;

[0027] Figure 5 This is a schematic diagram of the light shielding of the adjustment cap of the present invention;

[0028] Figure 6 A schematic diagram of the rotation of the adjusting cap of the present invention;

[0029] Among them: 1. Laser; 2. Adjustment cap; 3. Tube base; 4. Laser chip; 5. Transition heat sink; 6. PD chip; 7. Gold wire; 8. Tube tongue; 9. Arc-shaped positioning protrusion; 10. Groove; 11. Shielding piece; 12. Cap body; 13. Notch; 14. Light leakage. DETAILED DESCRIPTION

[0030] The present invention will be further described below with reference to embodiments and accompanying drawings, but is not limited thereto.

[0031] Example 1:

[0032] like Figure 1-6 As shown, this embodiment provides a semiconductor laser with adjustable monitoring current, including a laser 1 and a PD chip 6. The PD chip 6 is provided in the laser 1, and the PD chip receives light leakage from the rear cavity surface of the laser chip and generates a monitoring current through light sensing.

[0033] The laser 1 includes a tube base 3, a laser chip 4, and a transition heat sink 5. A tube tongue 8 is provided on the tube base 3, and a transition heat sink 5 is provided on the tube tongue 8. The laser chip 4 is sintered on the transition heat sink 5, with the light-emitting surface of the laser chip 4 facing upward and the back cavity surface facing downward. A PD chip 6 is provided on the tube base 3 below the laser chip 4. The PD chip 6 and the laser chip 4 are both connected to an external drive circuit via a gold wire 7. The monitoring current information of the PD chip is received through the external drive circuit.

[0034] An adjustment cap 2 is provided on the tube base 3 to block the light leakage from the rear cavity surface of the laser chip by adjusting the cap 2, thereby adjusting the light leakage area 14 received by the PD chip and further adjusting the monitoring current.

[0035] The regulating cap 2 includes a cap body 12 and a shielding piece 11 . The cap body 12 is an annular cylinder. The shielding piece 11 is provided on the cap body 12 . The cap body is sleeved on the tube tongue.

[0036] The shielding sheet 11 is an arc-shaped sheet that blocks light leakage from the rear cavity surface of the laser chip.

[0037] The packaging method of the semiconductor laser with adjustable monitoring current has the following steps:

[0038] (1) Place the adjustment cap on the tube tongue and connect the semiconductor laser to the drive circuit;

[0039] (2) Rotate the adjustment cap to adjust the light leakage shielding area of the shielding plate on the rear cavity surface of the laser chip. When the shielding area increases, the light leakage on the rear cavity surface of the laser chip received by the PD chip decreases, and the monitoring current decreases. When the shielding area decreases, the light leakage on the rear cavity surface of the laser chip received by the PD chip increases, and the monitoring current increases.

[0040] (3) After adjusting the monitoring current to the set value, fix the adjustment cap to the tube holder by energy storage welding or laser welding to complete the packaging.

[0041] Example 2:

[0042] A semiconductor laser with adjustable monitoring current has a structure as described in Example 1, except that an arc-shaped positioning protrusion 9 is provided on the tube base 3 on the opposite side of the tube tongue 8, and the tube tongue 8 and the arc-shaped positioning protrusion 9 are used to position the cap body 12 to prevent the cap body from shaking.

[0043] Example 3:

[0044] A semiconductor laser with adjustable monitoring current has a structure as described in Example 1, except that two grooves 10 are provided on the cap body 12. When in use, the two grooves 10 are always located between the three notches 13 on the tube seat 3. By limiting the cap body, interference between the shielding sheet and the laser chip, transition heat sink or gold wire is avoided.

[0045] Example 4:

[0046] A semiconductor laser with adjustable monitoring current has the same structure as that described in Example 1, except that the shielding plate 11 is a conical plate, which blocks light leakage from the rear cavity surface of the laser chip.

[0047] The height of the cap body 12 is smaller than that of the laser chip 4 , so that the shielding sheet is located between the laser chip and the PD chip.

Claims

1. A method for packaging a semiconductor laser with adjustable monitoring current, characterized in that: The semiconductor laser includes a laser and a PD chip. The PD chip is set inside the laser. The PD chip receives the light leakage from the rear cavity surface of the laser chip and generates a monitoring current through the light. The laser includes a tube base, a laser chip and a transition heat sink. A tube tongue is provided on the tube base, a transition heat sink is provided on the tube tongue, a laser chip is sintered on the transition heat sink, the light-emitting surface of the laser chip faces upward and the back cavity faces downward. A PD chip is provided on the tube base below the laser chip. Both the PD chip and the laser chip are connected to an external drive circuit through gold wires. An adjustment cap is provided on the tube base. The adjustment cap includes a cap body and a shielding piece. The cap body is an annular cylinder with a shielding piece provided on the cap body. The cap body is sleeved on the tube tongue. The packaging method of the semiconductor laser with adjustable monitoring current has the following steps: (1) Place the adjustment cap on the tube tongue and connect the semiconductor laser to the drive circuit; (2) Rotate the adjustment cap to adjust the light leakage shielding area of the shielding plate on the rear cavity surface of the laser chip. When the shielding area increases, the light leakage on the rear cavity surface of the laser chip received by the PD chip decreases, and the monitoring current decreases. When the shielding area decreases, the light leakage on the rear cavity surface of the laser chip received by the PD chip increases, and the monitoring current increases. (3) After adjusting the monitoring current to the set value, fix the adjustment cap to the tube holder by energy storage welding or laser welding to complete the packaging.

2. The packaging method of a semiconductor laser with adjustable monitoring current according to claim 1, wherein: An arc-shaped positioning protrusion is provided on the tube seat on the opposite side of the tube tongue.

3. The packaging method of a semiconductor laser with adjustable monitoring current according to claim 1, wherein: Two grooves are provided on the cap body.

4. The packaging method of a semiconductor laser with adjustable monitoring current according to claim 1, wherein: The shielding piece is an arc-shaped piece or a cone-shaped piece.

5. The packaging method of a semiconductor laser with adjustable monitoring current according to claim 1, wherein: The height of the cap body is smaller than the height of the laser chip.

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