A high-speed camera with forward heat dissipation for image sensor chip

Abstract

A high-speed camera with forward-facing heat dissipation for its image sensor chip includes a CMOS chip with a photosensitive area at its front end and a PCB board adapted to it at its rear end; a camera front housing with a fan; and a TEC (Transient Temperature Coefficient) cooler, with its cold side attached to the non-photosensitive area of ​​the CMOS chip and its hot side attached to the camera front housing, and a filter integrated in the hot side of the TEC. The space between the photosensitive area of ​​the CMOS chip, the TEC, and the filter is evacuated to form a vacuum region. This invention creates a vacuum region by evacuating the narrow space between the photosensitive area of ​​the CMOS chip, the TEC, and the filter. This not only avoids condensation caused by the low temperature of the CMOS chip but also reduces the size of the vacuum area, thus simplifying the manufacturing process.

Description

Technical Field

[0001] This invention belongs to the field of industrial camera cooling technology, and specifically relates to a high-speed camera with forward heat dissipation for image sensor chips. Background Technology

[0002] Industrial cameras are a key component of machine vision systems, and their most fundamental function is to convert light signals into ordered electrical signals. Choosing the right camera is also a crucial aspect of machine vision system design. The camera selection directly determines not only the resolution and quality of the acquired images but also the overall operating mode of the system.

[0003] In the field of industrial cameras, in order to obtain clear images, some applications require the CMOS image sensor in the camera to have a low signal noise output. We know that in a low-temperature environment, the output signal noise of the CMOS image sensor in the camera will be greatly reduced, which requires cooling of the CMOS image sensor. However, in a normal environment, cooling to below 0°C will cause frost formation due to the large temperature difference between the inside and outside, which will affect the use of the detector. Existing camera cooling technologies mostly involve creating a sealed and dry environment by evacuating the entire space, including the PCB board. The area that needs to be evacuated is large, and the process is complex and difficult to implement. Summary of the Invention

[0004] This invention addresses the shortcomings of existing technologies by providing a high-speed camera with forward-facing heat dissipation for the image sensor chip. The specific technical solution is as follows:

[0005] A high-speed camera with forward heat dissipation for the image sensor chip, the high-speed camera comprising:

[0006] A CMOS chip, wherein a photosensitive area is provided at the front end of the CMOS chip, and a PCB board adapted to the rear end of the CMOS chip is attached thereto.

[0007] A camera front housing, on which a fan is provided;

[0008] The TEC cooling element has its cold side attached to the non-photosensitive area of ​​the CMOS chip, and its hot side attached to the front housing of the camera. A filter is integrated into the hot side of the TEC cooling element. The space structure formed by the photosensitive area of ​​the CMOS chip, the TEC cooling element, and the filter is evacuated to a vacuum area.

[0009] Furthermore, the PCB board is connected to a flexible circuit board via a first gold finger, and the outer end of the flexible circuit board is connected to a CMOS driver board.

[0010] Furthermore, the outer end of the flexible circuit board is connected to the CMOS driver board via a second gold finger.

[0011] Furthermore, the back of the PCB board is sealed with conformal coating.

[0012] The beneficial effects of this invention are:

[0013] This invention utilizes the non-photosensitive area of ​​a CMOS chip for front-end cooling. A filter is integrated into a TEC cooling chip, with the hot side of the TEC cooling chip directly conducting heat away through the front housing of the camera. The cold side of the TEC cooling chip contacts and seals the non-photosensitive area on the front of the CMOS chip. Simultaneously, a vacuum is created by evacuating the narrow space between the photosensitive area of ​​the CMOS chip, the TEC cooling chip, and the filter. This not only avoids condensation caused by the low temperature of the CMOS chip but also reduces the area requiring vacuuming, thus simplifying the manufacturing process. Attached Figure Description

[0014] Figure 1 A schematic diagram of the overall structure of the present invention is shown;

[0015] Figure 2 A partial three-dimensional structural schematic diagram (I) of the present invention is shown;

[0016] Figure 3 A partial three-dimensional structural schematic diagram (II) of the present invention is shown.

[0017] The diagram shows: 1. CMOS chip; 11. Photosensitive area; 12. Vacuum area; 2. TEC cooling chip; 21. Cold side; 22. Hot side; 23. Filter; 3. Camera front shell; 31. Fan; 4. PCB board; 41. Conformal coating; 42. First gold finger; 5. Flexible circuit board; 51. Second gold finger; 6. CMOS driver board. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0019] CMOS image sensors are a typical type of solid-state imaging sensor, sharing a common historical origin with CCDs. A CMOS image sensor typically consists of several parts, including a pixel array, row drivers, column drivers, timing control logic, an analog-to-digital converter (AD converter), a data bus output interface, and a control interface. These parts are usually integrated onto a single silicon chip. Its operation generally involves reset, photoelectric conversion, integration, and readout. Other digital signal processing circuits, such as AD converters, automatic exposure control, non-uniformity compensation, white balance processing, black level control, and gamma correction, can also be integrated onto the CMOS image sensor chip. For rapid computation, programmable DSP devices can even be integrated with the CMOS device to form a single-chip digital camera and image processing system.

[0020] On memory modules and graphics cards, we can see a row of golden conductive contacts, which are called "gold fingers". In the PCB design and manufacturing industry, gold fingers (or edge connectors) serve as the board's external network outlet through the insertion of connectors.

[0021] We know that high-speed cameras have many pins, a large amount of data, and high internal heat (at the back of the CMOS chip) compared to low heat at the front. Therefore, forward-facing heat dissipation is more effective at dissipating heat.

[0022] like Figures 1-3 As shown, a high-speed camera with forward heat dissipation for the image sensor chip is disclosed. The high-speed camera includes:

[0023] CMOS chip 1, with a photosensitive area 11 at the front end and a PCB board 4 adapted to the rear end of the CMOS chip 1.

[0024] Camera front housing 3, on which a fan 31 is provided;

[0025] The TEC cooling chip 2 has its cold side 21 attached to the non-photosensitive area of ​​the CMOS chip 1, and its hot side 22 attached to the front housing 3 of the camera. A filter 23 is integrated in the hot side 22 of the TEC cooling chip 2. The space structure formed by the photosensitive area 11 of the CMOS chip 1, the TEC cooling chip 2, and the filter 23 is converted into a vacuum area 12.

[0026] By adopting the above technical solution, the high-speed camera utilizes the non-photosensitive area of ​​the CMOS chip 1 for front-end cooling. The TEC cooling chip 2 integrates a filter 23, and the hot side 22 of the TEC cooling chip 2 conducts heat directly through the front shell 3 of the camera. The cold side 21 of the TEC cooling chip 2 contacts the non-photosensitive area on the front of the sealed CMOS chip 1. At the same time, a vacuum process is performed to form a vacuum area 12 in the narrow space between the photosensitive area 11 of the CMOS chip 1, the TEC cooling chip 2, and the filter 23. This not only avoids water vapor condensation caused by the low temperature of the CMOS chip 1, but also reduces the area that needs to be vacuumed, thus reducing the complexity and difficulty of the process.

[0027] like Figure 1 As shown, the PCB board 4 is connected to a flexible circuit board 5 via a first gold finger 42, and the outer end of the flexible circuit board 5 is connected to a CMOS driver board 6.

[0028] By adopting the above technical solution, the PCB board 4 and the CMOS driver board 6 are connected by a flexible circuit board 5. In this way, the PCB board 4 traces are transitioned to other rigid boards through the combination of flexible and rigid boards. The thin copper foil and slow heat conduction of the flexible circuit board 5 are used to provide thermal isolation between the PCB board 4 and the CMOS driver board 6. At the same time, the absence of metal pads on the surface of the flexible circuit board 5 can play a role in waterproofing.

[0029] like Figure 3 As shown, the outer end of the flexible circuit board 5 is connected to the CMOS driver board 6 via a second gold finger 51.

[0030] By adopting the above technical solution, the CMOS driver board 6 can be plugged in and unplugged, and the flexible circuit board 5 and the CMOS driver board 6 become modular, making disassembly and replacement more convenient.

[0031] like Figures 1-3 As shown, the back of the PCB board 4 is sealed with conformal coating 41.

[0032] By adopting the above technical solution, after the CMOS chip 1 is mounted onto the PCB board 4, it is sealed from the back of the PCB board 4 with conformal coating, which can prevent moisture condensation from damaging the circuit board.

[0033] In the implementation of this invention, the CMOS chip 1 itself generates heat, which is cooled by the cold side end 21 of the TEC cooling chip 2 being attached to the non-photosensitive area of ​​the CMOS chip 1. This is the first step of forward heat dissipation. The hot side end 22 of the TEC cooling chip 2 is attached to the front shell 3 of the camera, and the heat is dissipated through the front shell 3 of the camera, thus achieving forward heat dissipation.

[0034] The space structure formed by the photosensitive area 11 of the CMOS chip 1, the TEC cooling chip 2, and the filter 23 is set as a vacuum area 12 to avoid water vapor condensation caused by the low temperature of the CMOS chip 1; the filter 23 is integrated in the hot side 22 of the TEC cooling chip 2, and the water vapor condensation is also avoided due to the influence of the hot side 22.

[0035] After the CMOS chip 1 is mounted on the PCB board 4, the low temperature of the CMOS chip 1 will conduct heat to the PCB board 4, which may cause moisture condensation on the back of the PCB board 4 and lead to a short circuit. The back of the PCB board 4 is sealed with conformal coating 41, so even if there is moisture condensation, the PCB board 4 will not be affected.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-speed camera with forward heat dissipation for the image sensor chip, characterized in that, The high-speed camera includes: A CMOS chip (1) is provided with a photosensitive area (11) at the front end of the CMOS chip (1) and a PCB board (4) adapted to it is attached to the rear end of the CMOS chip (1). Camera front housing (3), on which a fan (31) is provided; A TEC cooling chip (2) is provided, wherein the cold side (21) of the TEC cooling chip (2) is attached to the non-photosensitive area of ​​the CMOS chip (1), and the hot side (22) of the TEC cooling chip (2) is attached to the front shell (3) of the camera. A filter (23) is integrated in the hot side (22) of the TEC cooling chip (2). The space structure formed by the photosensitive area (11) of the CMOS chip (1), the TEC cooling chip (2), and the filter (23) is set as a vacuum area (12). The PCB board (4) is connected to a flexible circuit board (5) by means of a first gold finger (42), and the outer end of the flexible circuit board (5) is connected to a CMOS driver board (6). The outer end of the flexible circuit board (5) is connected to the CMOS driver board (6) through a second gold finger (51).

2. A high-speed camera with forward heat dissipation for an image sensor chip according to claim 1, characterized in that: The back of the PCB board (4) is sealed with conformal coating (41).

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