Direct immersion tin dipping low resistance ultrasonic single wave peak soldering equipment and wave peak soldering method thereof
By using a direct-dip molten soldering low-resistance ultrasonic single-wave soldering equipment, the problems of welding efficiency and solder climb height in ultrasonic spot spraying wave soldering and traditional single-wave soldering have been solved, achieving efficient and stable welding results and reducing flux costs.
Patent Information
- Application Number
- CN202211078428.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-09-05
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2042-09-05
AI Technical Summary
In existing wave soldering technologies, ultrasonic spot spray wave soldering suffers from problems such as poor soldering efficiency, high ultrasonic energy loss, short nozzle lifespan, and loose installation structure. Traditional single-peak wave soldering generally has a low soldering height and requires high flux, while dual-peak wave soldering suffers from flux oxidation and clogging, resulting in unstable soldering efficiency.
The direct-dip molten solder low-resistance ultrasonic single-wave peak soldering equipment is adopted. By forming a solder surge with ultrasonic kinetic energy through the long open opening of the solder surge, it directly acts on the ultrasonic intervention area, eliminating the need for a nozzle. The ultrasonic intervention device is not connected to the solder surge channel. The ultrasonic kinetic energy acts directly on the molten solder, forming a large-diameter solder surge, which improves the solder climbing height and yield.
It improves welding efficiency, reduces ultrasonic energy loss, extends equipment life, reduces flux requirements, increases solder climb height and welding yield, and is suitable for single-wave soldering processes with large wave openings.
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Figure CN115533244B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of wave soldering, in particular to a direct immersion molten tin type low-resistance ultrasonic single wave soldering equipment and a wave soldering method thereof. BACKGROUND
[0002] At present, in the field of PCB welding, wave soldering is a relatively traditional and mature technology. Wave soldering can make the welding surface of the PCB plug-in board directly contact with high-temperature liquid tin to achieve the purpose of welding. The high-temperature liquid tin maintains a convex curved surface structure, and the liquid tin forms a wave-like phenomenon by the spraying power device, so it is called "wave soldering".
[0003] The existing wave soldering process is: inserting components into the PCB plug-in board → loading the PCB plug-in board into the welding machine fixture → applying flux → preheating → wave soldering → cooling → taking out the PCB plug-in board (printed board).
[0004] In the production and application of the existing wave soldering process, the molten tin liquid under the action of flux and high temperature heat relies on physical action (such as the activity and wettability of the flux) to infiltrate into the plug-in hole of the PCB plug-in board, and the molten tin liquid flowing into the plug-in hole contacts the pins (pins) of the components and is accommodated in the plug-in hole. After cooling, solidification is completed to achieve the purpose of welding. There are many key factors affecting the stability of the above wave soldering tin soldering quality, such as conveying angle, chain speed, preheating temperature, flux variety and spraying amount, etc.
[0005] Therefore, there are some products on the market that increase ultrasonic vibration on the basis of traditional wave soldering technology to give the molten tin liquid an ultrasonic vibration effect when it surges upward, so that the molten tin liquid has ultrasonic vibration assistance in addition to the existing physical wetting (intermolecular wetting force) when it wets the plug-in hole, increasing the wetting power, ensuring the tin climbing height and yield.
[0006] It also needs to be specially pointed out that the conventional wave soldering equipment capable of performing wave soldering process is generally divided into three categories: single-peak wave soldering, double-peak wave soldering and point spray wave soldering, wherein the single-peak wave soldering is the most common, that is, a "tin flow" belt with a width of several centimeters is manufactured by the wave soldering equipment, and the PCB plug-in board is passed through the tin flow to realize the effect of tin soldering; and for double-peak wave soldering, as the name implies, in the case that the plug-in hole depth is deep, the flux effect is poor, and most importantly, the overall walking line speed can be improved to improve the welding efficiency, double-peak wave soldering is generally introduced, that is, the tin flow is walked twice in succession for the same welding area, but this process is prone to problems, because when the board is walked for the first time, the flux will be oxidized, resulting in poor tin soldering effect on the second tin flow. Finally, for point spray wave soldering, with the high precision requirement of PCB plug-in board welding and the scattered distribution of PCB plug-in board welding area, it has good welding effect, and with the maturity of point spray wave soldering technology, it is being more widely applied because of its better tin flow atomization effect and high welding precision.
[0007] Further, see Chinese patent applications CN202010931617.0 and CN201610199839.1, which are both point spray wave soldering, and an ultrasonic module is directly arranged on the spray head, which is vibrated by ultrasonic to transfer to the molten tin liquid, achieving the effect of giving the tin liquid a surge of energy and atomization.
[0008] However, the above-mentioned ultrasonic point spray wave soldering technology still has the following problems:
[0009] 1. Poor tin soldering efficiency, because point spray wave soldering adopts a partitioned module type tin soldering operation for PCB plug-in boards, and because the state of the tin liquid is mostly in the form of "atomized column", the welding area contacted by the PCB plug-in board per unit time is small.
[0010] 2. Because the ultrasonic is directly acting on the spray head, it cannot directly act on the tin liquid, resulting in the loss of ultrasonic energy when the spray head is self-vibrating, that is, the ultrasonic intervention resistance is large, and it also causes the problem of short service life of the spray head and frequent loosening of the spray head mounting structure. SUMMARY
[0011] The purpose of the present application is to overcome the shortcomings of the prior art, and to provide a straight immersion melting tin type low resistance ultrasonic single wave soldering equipment capable of performing large wave peak single wave soldering process, small ultrasonic intervention resistance, good tin climbing height and yield, and high tin soldering efficiency, and a wave soldering method thereof.
[0012] The purpose of the present application is achieved by the following technical solutions:
[0013] A straight immersion melting tin type low resistance ultrasonic single wave soldering equipment comprises:
[0014] The molten tin liquid supply device comprises a molten tin tank and a heating element, the heating element is arranged in the molten tin tank to heat the molten tin liquid in the molten tin tank;
[0015] The tin gushing device comprises a tin gushing channel and a pump body, the tin gushing channel is arranged on the molten tin tank, the tin gushing channel is provided with a single tin gushing channel, the single tin gushing channel is sequentially provided with a molten tin pumping area, an ultrasonic intervention area and a tin gushing long opening from bottom to top along the direction of tin gushing, the pump body is arranged on the molten tin pumping area, the molten tin in the molten tin tank is pressurized through the molten tin pumping area, then is intervened by ultrasonic vibration through the ultrasonic intervention area, and finally is sprayed out of the tin gushing long opening to form a long strip-shaped tin gushing, and contacts with an external PCB plug-in board to gush into a plug-in hole of the PCB plug-in board; and
[0016] The direct immersion low-resistance ultrasonic intervention device comprises a fixed beam, a U-shaped frame, an ultrasonic intervention conducting long plate, a vibrator transducer and an ultrasonic wave generator, the fixed beam is arranged on the molten tin tank, the U-shaped frame is connected with the fixed beam and the ultrasonic intervention conducting long plate respectively, the vibrator transducer is arranged on the U-shaped frame, the vibrator transducer is also connected with the ultrasonic wave generator, and the ultrasonic intervention conducting long plate is arranged in the ultrasonic intervention area.
[0017] In one embodiment, the U-shaped frame comprises an ultrasonic intervention part, a bent extension part and a connecting part which are sequentially connected, the ultrasonic intervention part is connected with the fixed beam, the vibrator transducer is arranged on the ultrasonic intervention part, one end of the bent extension part is connected with the ultrasonic intervention part, the connection position of the bent extension part and the ultrasonic intervention part is exposed outside the tin gushing long opening, the middle position of the bent extension part is bent and extends into the tin gushing long opening, and the connecting part is located in the ultrasonic intervention area and is also connected with the ultrasonic intervention conducting long plate.
[0018] In one embodiment, the middle position of the bent extension part is provided with a U-shaped bending area, and a distance is arranged between the inner wall of the U-shaped bending area and the top of the side wall of the tin gushing channel.
[0019] In one embodiment, the U-shaped frame comprises a plurality of U-shaped strips, each of the U-shaped strips comprises an ultrasonic intervention subpart, a bent extension subpart and a connecting subpart which are sequentially connected, the ultrasonic intervention subpart is connected with the fixed beam, and the connecting subpart is located in the ultrasonic intervention area and is connected with the ultrasonic intervention conducting long plate.
[0020] The vibrator transducer is multiple groups, and each group of the vibrator transducer is arranged on one ultrasonic intervention sub-portion.
[0021] In one embodiment, the single tin flow channel has a horn-shaped cavity structure with a narrow upper part and a wide lower part, and in the width of the single tin flow channel: the molten tin pumping area, the ultrasonic intervention area, and the tin flow long opening gradually decrease.
[0022] In one embodiment, the plane of the ultrasonic intervention conduction long plate is perpendicular to the flow direction of the tin flow.
[0023] In one embodiment, the ultrasonic intervention conduction long plate is provided with flow holes for the tin flow to pass through.
[0024] In one embodiment, the number of flow holes is multiple;
[0025] The multiple flow holes are divided into two groups by the central axis of the ultrasonic intervention conduction long plate, and the central axis of the ultrasonic intervention conduction long plate is consistent with the tin flow direction, and the multiple flow holes specifically include a first group of flow holes and a second group of flow holes.
[0026] In one embodiment, the extension directions of the flow holes in the first group of flow holes are consistent, and the extension directions of the flow holes in the second group of flow holes are consistent.
[0027] The extension directions of the flow holes in the first group of flow holes and the extension directions of the flow holes in the second group of flow holes form an included angle.
[0028] A direct immersion molten tin type low-resistance ultrasonic wave single wave peak welding method is performed by using the direct immersion molten tin type low-resistance ultrasonic wave single wave peak welding equipment of any one of the above embodiments.
[0029] Compared with the prior art, the present application has at least the following advantages:
[0030] 1. Compared with ultrasonic point spray wave peak welding, the above-mentioned direct immersion molten tin type low-resistance ultrasonic wave single wave peak welding equipment eliminates the nozzle, and the direct immersion low-resistance ultrasonic intervention device, as the core component of the ultrasonic intervention function, is not connected with the tin flow clamping groove, but directly acts on the ultrasonic intervention area, and immediately forms a tin flow with accompanying "ultrasonic kinetic energy" at the tin flow long opening. The ultrasonic utilization rate is higher, and the wave peak port is large, the wave peak welding efficiency is extremely high, and the ultrasonic kinetic energy is not lost due to the resistance of other structures. It is directly acted on the molten tin, directly makes the molten tin move, the low-resistance effect is better, and it also does not cause the service life of the tin flow clamping groove to change or the installation structure to loosen.
[0031] 2. Compared to traditional single-peak wave soldering: Single-peak wave soldering generally results in a lower solder surge climb height, especially with equipment using large wave openings, where the effect is even worse. This necessitates adjustments in two aspects: firstly, higher flux requirements, and secondly, longer solder surge contact time. This leads to inconsistent costs and efficiency for the soldering board. The aforementioned direct-dip soldering low-resistance ultrasonic single-peak wave soldering equipment directly applies ultrasonic kinetic energy to the ultrasonic intervention area, immediately forming a solder surge with "ultrasonic kinetic energy" at the long open end of the solder surge. This results in a higher solder surge climb height, and the solder surge itself possesses better kinetic energy, allowing it to better "drill" into the insertion holes of the PCB board. It is extremely suitable for performing single-peak wave soldering processes with large wave openings, and offers better solder surge climb height and yield.
[0032] 3. Compared to traditional dual-single-peak wave soldering: When conventional technicians found that single-peak wave soldering required too many factors to consider and the results were unstable, dual-peak wave soldering was introduced. That is, a small wave is introduced at the front end of the board and a large wave is introduced at the back end. When the PCB board passes through the small wave, the flux will oxidize and easily clog the insertion holes. Although the small wave can also provide solder surge, there are problems with short contact time and poor heat. Therefore, it is still impossible to provide a stable and efficient soldering board. The aforementioned direct-dip soldering low-resistance ultrasonic single-wave soldering equipment directly applies ultrasonic kinetic energy to the ultrasonic intervention area, immediately forming a solder surge with "ultrasonic kinetic energy" at the long open end of the solder surge. Only a single large wave peak needs to be maintained, which can effectively solve the problems of wave soldering technology. The process is simpler, easier to operate, and the soldering yield is improved. The flux requirements are reduced, and it is compatible with more fluxes. Flux is a material cost for surface mount soldering manufacturers, accounting for about 10%-20% of the cost. In traditional single-wave, especially traditional double-wave processes, the end-user of the finished board often specifies the brand and model of flux to prevent soldering quality problems. Therefore, they specify the brand and model of flux, which is often more expensive. Attached Figure Description
[0033] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0034] Figure 1 This is a schematic diagram of the structure of a direct-dip soldering type low-resistance ultrasonic single-wave peak soldering device according to an embodiment of the present invention.
[0035] Figure 2 This is a schematic diagram of the structure of a direct-dip soldering type low-resistance ultrasonic single-wave soldering device according to another embodiment of the present invention.
[0036] Figure 3 Structure diagram of a single peak wave soldering equipment with low resistance ultrasonic transducer of direct immersion and melting tin for another embodiment of the present application;
[0037] Figure 4 Structure diagram of an ultrasonic intervention transmission long plate for an embodiment of the present application. DETAILED DESCRIPTION
[0038] In order to facilitate the understanding of the present application, the present application will be described in more detail below with reference to the relevant drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more comprehensive and thorough.
[0039] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are only for the purpose of illustration and are not intended to be the only embodiment.
[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0041] The application provides a single-peak wave soldering equipment with direct immersion melting tin type low-resistance ultrasonic, which comprises a molten tin liquid supply device, a tin surge device and a direct immersion low-resistance ultrasonic intervention device, the molten tin liquid supply device comprises a molten tin box body and a heating element, the heating element is arranged in the molten tin box body to heat the molten tin liquid in the molten tin box body, the tin surge device comprises a tin surge clamping channel and a pump body, the tin surge clamping channel is arranged on the molten tin box body, the tin surge clamping channel is provided with a single tin surge channel, the single tin surge channel is provided with a molten tin pump-in area, an ultrasonic intervention area and a tin surge long opening in sequence from bottom to top along the direction of tin surge, the pump body is arranged on the molten tin pump-in area, the molten tin in the molten tin box body is pressurized through the molten tin pump-in area, then is intervened by ultrasonic vibration through the ultrasonic intervention area, finally is sprayed out through the tin surge long opening to form a long strip-shaped tin surge, and contacts with an external PCB plug-in board to surge into a plug-in hole of the PCB plug-in board, and the direct immersion low-resistance ultrasonic intervention device comprises a fixed beam, a U-shaped frame, an ultrasonic intervention conduction long plate, a vibrator transducer and an ultrasonic wave generator, the fixed beam is arranged on the molten tin box body, the U-shaped frame is connected with the fixed beam and the ultrasonic intervention conduction long plate respectively, the vibrator transducer is arranged on the U-shaped frame, the vibrator transducer is further connected with the ultrasonic wave generator, and the ultrasonic intervention conduction long plate is arranged in the ultrasonic intervention area.
[0042] In order to better understand the technical concept of the single-peak wave soldering equipment with direct immersion melting tin type low-resistance ultrasonic, the single-peak wave soldering equipment with direct immersion melting tin type low-resistance ultrasonic is further explained as follows:
[0043] Please refer to Figure 1 The single-peak wave soldering equipment with direct immersion melting tin type low-resistance ultrasonic 10 comprises a molten tin liquid supply device 100, a tin surge device 200 and a direct immersion low-resistance ultrasonic intervention device 300, the molten tin liquid supply device 100 can provide a high-heat environment inside to make the tin exist as molten tin liquid, the tin surge device 200 is used for forming a tin surge 30 in the form of local pressure and pumping out of the molten tin liquid, the tin surge 30 is similar to a wave peak or a wave, and the tin surge contacts with a PCB plug-in board 20, then the molten tin is infiltrated into a plug-in hole of the PCB plug-in board by physical action (activity and wetting of flux, etc.), and the molten tin liquid flowing into the plug-in hole contacts with a pin (a plug pin) of a component and is accommodated in the plug-in hole, and solidification is completed after cooling to achieve the purpose of soldering.
[0044] Please refer to Figure 1The molten tin liquid supply device 100 comprises a molten tin box body 110 and a heating element 120, the heating element 120 is arranged in the molten tin box body 110 to heat the molten tin liquid in the molten tin box body 110 in real time, so that the molten tin liquid can maintain a good flowing state, for example, the temperature of the molten tin liquid is 268 degrees Celsius. Further, the heating element 120 is an electric furnace wire, which has the advantage of good temperature control by using electric heating.
[0045] Please refer to Figure 1 The tin gushing device 200 comprises a tin gushing channel slot 210 and a pump body 220, the tin gushing channel slot 210 is arranged on the molten tin box body 110, the tin gushing channel slot 210 is provided with a single tin gushing channel 211, the single tin gushing channel 211 is sequentially provided with a molten tin pumping area 211a, an ultrasonic intervention area 211b and a tin gushing long opening 211c from bottom to top along the direction of tin gushing, and the pump body 220 is arranged on the molten tin pumping area 211a, specifically, the output end of the pump body 220 is arranged near the molten tin pumping area 211a, so as to ensure that the pump body 220 can provide power for the molten tin to form a tin gushing in the tin gushing channel slot 210.
[0046] Please refer to Figure 1 The molten tin in the molten tin box body 110 is pressurized through the molten tin pumping area 211a, and then is intervened by ultrasonic vibration through the ultrasonic intervention area 211b, so that the molten tin is endowed with ultrasonic vibration properties, that is, the kinetic energy of vibration is added to the molten tin, and finally the molten tin is sprayed out through the tin gushing long opening 211c to form a long strip-shaped tin gushing 30, which contacts the external PCB plug-in board 20. It needs to be particularly pointed out that the long strip-shaped tin gushing 30 formed by the single tin gushing channel 211 is the most prominent technical feature of the single-peak soldering, and the molten tin in the long strip-shaped tin gushing 30 can flow into the plug-in hole of the PCB plug-in board 20, and then based on the action of the flux, the peak soldering process can be completed.
[0047] Please refer to Figure 1 The straight immersion low-resistance ultrasonic intervention device 300 comprises a fixed beam 310, a U-shaped frame 320, an ultrasonic intervention transmission long plate 330, a vibrator transducer 340 and an ultrasonic generator (not shown in the figure), the fixed beam 310 is arranged on the molten tin box body 110, by arranging the fixed beam 310 as the main support structure of the straight immersion low-resistance ultrasonic intervention device 300 on the molten tin box body 110, based on the better structural strength of the molten tin box body 110, the fixed beam 310 is not easy to be loose with the molten tin box body 110, and other installation and use problems are avoided, but the tin gushing long opening 211c of the single-peak soldering device has the advantages of length and width, and the fixed beam 310 also has the advantage of better structural strength.
[0048] Please refer to Figure 1The U-shaped frame 320 is connected with the fixed beam 310 and the ultrasonic intervention conduction long plate 330 respectively, the vibrator transducer 340 is arranged on the U-shaped frame 320, the vibrator transducer 340 is also connected with the ultrasonic wave generator, and the ultrasonic intervention conduction long plate 330 is arranged in the ultrasonic intervention area 211b. Since the vibrator transducer 340 is arranged on the U-shaped frame 320 and is connected with the fixed beam 310 and the ultrasonic intervention conduction long plate 330 respectively, the fixed beam 310 is directly connected with the molten tin box body 110, and the structural strength and stability are relatively high. Therefore, the kinetic energy of the ultrasonic vibration of the vibrator transducer 340 acting on the U-shaped frame 320 is concentrated on the ultrasonic intervention conduction long plate 330 which is a movable free end. By arranging the U-shaped frame 320 as a U-shaped structure, the vibration amplitude of the end of the U-shaped frame 320, that is, the end connected with the conduction long plate 330 can be strengthened through the U-shaped bending part as a fulcrum. After the vibration is conducted through the U-shaped frame 320, the ultrasonic kinetic energy is released in the form of up-down vibration of the ultrasonic intervention conduction long plate 330 as much as possible. The tin flow direction of the single tin flow channel, that is, the reciprocating vibration direction is consistent with the tin flow direction. The ultrasonic disturbance of the ultrasonic intervention conduction long plate 330 can effectively improve the tin flow important parameter quality, that is, the tin climbing height and yield can be improved, that is, the disturbance amplitude can be further strengthened in the tin flow height direction. Further, since the tin flow strength of the present application is large, the U-shaped frame is provided with a tin blocking plate at the front end of the vibrator transducer 340, and the tin blocking plate does not contact the tin flow channel. In this way, the vibrator transducer can be better protected.
[0049] In one embodiment, the single tin flow channel has a cavity structure with a horn mouth that is narrow at the top and wide at the bottom. In the width of the single tin flow channel: the molten tin pumping area, the ultrasonic intervention area and the tin flow long opening gradually decrease. In this way, the tin flow is more concentrated and the flow rate is improved.
[0050] In one embodiment, the plane of the ultrasonic intervention conduction long plate is perpendicular to the flow direction of the tin flow. In this way, the tin flow can absorb the ultrasonic kinetic energy and act on the ability of the tin flow to move in the height direction.
[0051] Compared with the prior art, the present application has at least the following advantages:
[0052] 1. Compared with ultrasonic spot wave peak welding, the above-mentioned straight immersion molten tin type low resistance ultrasonic single wave peak welding equipment 10 is free of a nozzle, and the straight immersion low resistance ultrasonic intervention device 300, as the core component of ultrasonic intervention function, is not connected with the tin stream clamping groove 210, but directly acts on the ultrasonic intervention area 211b, and immediately forms a tin stream with "ultrasonic kinetic energy" on the tin stream long opening 211c, so that the ultrasonic utilization rate is higher, and it is a large-diameter wave peak opening, the wave peak welding efficiency is extremely high, and the ultrasonic kinetic energy is not lost due to the resistance of other structures, it is directly acting on the molten tin, directly making the molten tin move, the low resistance effect is better, and it also will not cause the service life change or installation structure loosening problem of the tin stream clamping groove 210.
[0053] 2. Compared with traditional single peak wave peak welding: due to the general tin stream climbing height of single peak wave peak welding, especially the single peak wave peak welding equipment with large wave peak opening, the effect is worse, so it is necessary to adjust two aspects, one is that the flux requirement needs to be higher, and the other is that the contact time of the tin stream needs to be longer, which leads to the instability of the cost and efficiency of the welding plate. The above-mentioned straight immersion molten tin type low resistance ultrasonic single wave peak welding equipment 10 directly acts ultrasonic kinetic energy on the ultrasonic intervention area 211b, and immediately forms a tin stream with "ultrasonic kinetic energy" on the tin stream long opening 211c, so that the tin stream climbing height is higher, and the tin stream itself has good kinetic energy, which can better "drill into" the plug-in hole of the PCB plug-in plate, and is extremely suitable for performing single wave peak welding process with large wave peak opening, and the tin stream climbing height and yield are good.
[0054] 3. Compared with traditional double single peak wave peak welding: when the conventional technical personnel find that single peak wave peak welding needs to consider too many factors and the effect is unstable, double wave peak is introduced, that is, a small wave peak is introduced at the front end of the plate, and a large wave peak is introduced at the rear end. When the PCB plug-in plate passes through the small wave peak, the flux and the like will be oxidized, which is easy to block the plug-in hole. Although the small wave peak can also provide a tin stream, there is a problem of short contact time and poor heat, so it is still unable to stably provide high-efficiency welding plate efficiency. The above-mentioned straight immersion molten tin type low resistance ultrasonic single wave peak welding equipment 10 directly acts ultrasonic kinetic energy on the ultrasonic intervention area 211b, and immediately forms a tin stream with "ultrasonic kinetic energy" on the tin stream long opening 211c, only the single large wave peak opening needs to be retained, which can better solve the wave peak welding technical problem, the process is simple, it is easier to operate, the welding yield is improved, the flux requirement is reduced, more fluxes are compatible, the flux is the material cost of the SMT welding manufacturer, accounting for about 10%-20% of the cost. The traditional single peak, especially the traditional double peak process, often specifies the brand and model of the flux at the terminal of the finished plate, for fear that the welding quality will be a problem, so the brand and model of the flux are specified, and the price is often higher.
[0055] Please refer to Figure 2 and Figure 3The U-shaped frame 320 comprises sequentially connected ultrasonic intervention part 321, bending extension part 322 and connecting part 323, the ultrasonic intervention part is connected with the fixed beam 310, and the vibrator transducer 340 is arranged on the ultrasonic intervention part 321, one end of the bending extension part is connected with the ultrasonic intervention part, and the connection part of the bending extension part exposed outside the tin flow long opening, the middle part of the bending extension part is bent and extended into the tin flow long opening, the connecting part is located in the ultrasonic intervention area and is also connected with the ultrasonic intervention conducting long plate, so that it can be further applied to perform single-peak welding process of large peak opening, so that the ultrasonic intervention resistance is smaller, the tin climbing height and yield are better.
[0056] Further, the middle part of the bending extension part is provided with a U-shaped bending area, a distance is provided between the inner wall of the U-shaped bending area and the top of the side wall of the tin flow channel, and the distance is used to prevent the U-shaped bending area from touching the top of the side wall of the tin flow channel when vibrating, so that the ultrasonic resistance can be further reduced, and the single-peak welding process of large peak opening can be further applied, so that the ultrasonic intervention resistance is smaller, the tin climbing height and yield are better.
[0057] Further, the U-shaped frame comprises a plurality of U-shaped strips, each of the U-shaped strips comprises sequentially connected ultrasonic intervention subpart, bending extension subpart and connecting subpart, the ultrasonic intervention subpart is connected with the fixed beam, the connecting subpart is located in the ultrasonic intervention area and is connected with the ultrasonic intervention conducting long plate; the vibrator transducer is a plurality of groups, each group of the vibrator transducer is arranged on one of the ultrasonic intervention subparts, so that through the ultrasonic intervention of a plurality of groups of subsequent resonance, the single-peak welding process of large peak opening can be further applied, so that the ultrasonic intervention resistance is smaller, the tin climbing height and yield are better.
[0058] Please refer to Figure 4 The ultrasonic intervention conducting long plate 330 is provided with a plurality of flow holes 331 for the tin flow to pass through; the plurality of flow holes can further solve the problem of flow resistance of the tin flow at the ultrasonic intervention conducting long plate 330, and the resistance is smaller, which is more beneficial to the rising of the tin flow.
[0059] In one embodiment, a plurality of the flow holes are divided into two groups by the central axis of the ultrasonic intervention conducting long plate, the central axis of the ultrasonic intervention conducting long plate is consistent with the flow direction of the tin flow, and the plurality of flow holes specifically comprises a first group of flow holes and a second group of flow holes, so that the flow resistance problem can be further solved.
[0060] Further, the extension directions of each of the flow holes in the first group are consistent, and the extension directions of each of the flow holes in the second group are consistent; wherein the extension direction of the flow hole in the first group and the extension direction of the flow hole in the second group form an included angle, it can be understood that the ultrasonic intervention conduction long plate is consistent with the tin flow direction, if it is a through type self-flowing hole, that is, the tin flow through the flow hole directly penetrates the ultrasonic intervention conduction long plate, which affects the ultrasonic intervention effect, but by changing the direction of the tin flow through the flow hole, so that it forms an included angle with the amplitude direction of the ultrasonic intervention conduction long plate, then in the case of ensuring the tin flow, it can further improve the ultrasonic intervention effect.
[0061] The application also provides a single-peak welding method of a direct immersion tin melting type low-resistance ultrasonic wave, which is executed by using the direct immersion tin melting type low-resistance ultrasonic wave single-peak welding equipment as described in any of the above embodiments. The method can have the technical effects of being suitable for executing a single-peak welding process of a large peak, having small ultrasonic intervention resistance, good tin climbing height and yield, and high tin welding efficiency. Further, the control included angle between the plug-in plate into the plate moving direction and the tin flow direction is 8-10 degrees.
[0062] The above embodiments only express several embodiments of the application, and the description is more specific and detailed, but it cannot be understood as limiting the scope of the patent. It should be noted that for ordinary skilled in the art, without departing from the concept of the application, several modifications and improvements can be made, which belong to the protection scope of the application. Therefore, the protection scope of the patent of the application should be subject to the appended claims.
Claims
1. A straight dip, fluxed, low resistance ultrasonic single-bead welding apparatus, characterized by, The application relates to a molten tin liquid supply device, a tin surge device and a straight immersion low-resistance ultrasonic intervention device. The molten tin liquid supply device comprises a molten tin tank and a heating element, the heating element is arranged in the molten tin tank to heat the molten tin liquid in the molten tin tank; the tin surge device comprises a tin surge channel and a pump body, the tin surge channel is arranged on the molten tin tank, the tin surge channel is provided with a single tin surge channel, the single tin surge channel is sequentially provided with a molten tin pump inlet area, an ultrasonic intervention area and a tin surge long opening from bottom to top along the direction of tin surge, the pump body is arranged on the molten tin pump inlet area, the molten tin in the molten tin tank is pressurized through the molten tin pump inlet area, then is intervened by ultrasonic vibration through the ultrasonic intervention area, and finally is sprayed out through the tin surge long opening to form a long strip-shaped tin surge and contact with an external PCB plug-in board to surge into the plug-in hole of the PCB plug-in board; and the straight immersion low-resistance ultrasonic intervention device comprises a fixed beam, a U-shaped frame, an ultrasonic intervention transmission long plate, a vibrator transducer and an ultrasonic generator, the fixed beam is arranged on the molten tin tank, the U-shaped frame is connected with the fixed beam and the ultrasonic intervention transmission long plate respectively, the vibrator transducer is arranged on the U-shaped frame, the vibrator transducer is also connected with the ultrasonic generator, and the ultrasonic intervention transmission long plate is arranged in the ultrasonic intervention area. The U-shaped frame is arranged in a U-shaped structure, the U-shaped frame takes the U-shaped bending part as a fulcrum, so that the vibration amplitude of the end of the U-shaped frame, i.e. the end connected with the transmission long plate, is strengthened, the direction of the single tin surge channel is consistent with the direction of reciprocating vibration, the U-shaped frame comprises an ultrasonic intervention part, a bending extension part and a connecting part which are sequentially connected, the ultrasonic intervention part is connected with the fixed beam, the vibrator transducer is arranged on the ultrasonic intervention part, one end of the bending extension part is connected with the ultrasonic intervention part, the connection part of the bending extension part and the ultrasonic intervention part is exposed outside the tin surge long opening, the middle part of the bending extension part is bent and extends into the tin surge long opening, and the connecting part is located in the ultrasonic intervention area and is also connected with the ultrasonic intervention transmission long plate. The middle part of the bending extension part is provided with a U-shaped bending area, and a distance is arranged between the inner wall of the U-shaped bending area and the top of the side wall of the tin surge channel. The plane of the ultrasonic intervention transmission long plate is perpendicular to the flowing direction of the tin surge. The ultrasonic intervention transmission long plate is provided with a plurality of flow holes for the tin surge to pass through, the plurality of flow holes are divided into two groups by the central axis of the ultrasonic intervention transmission long plate, the central axis of the ultrasonic intervention transmission long plate is consistent with the tin surge flowing direction, and the plurality of flow holes specifically comprise a first group of flow holes and a second group of flow holes; the extension directions of the flow holes in the first group of flow holes are consistent, and the extension directions of the flow holes in the second group of flow holes are consistent. The extension direction of the flow holes in the first group forms an angle with the extension direction of the flow holes in the second group, the ultrasonic intervention conduction long plate is consistent with the tin flow direction, by changing the tin flow direction through the flow holes, the angle between the tin flow direction and the amplitude direction of the ultrasonic intervention conduction long plate is formed, so as to ensure the tin flow and improve the ultrasonic intervention.
2. The straight dip fluxed low impedance ultrasonic single wave peak soldering apparatus of claim 1, wherein, The U-shaped frame comprises a plurality of U-shaped strips, each of which comprises an ultrasonic intervention sub-portion, a bent extension sub-portion and a connecting sub-portion connected in sequence, the ultrasonic intervention sub-portion is connected with the fixed beam, the connecting sub-portion is located in the ultrasonic intervention area and connected with the ultrasonic intervention conduction long plate. The vibrator transducer is in multiple groups, and each group of the vibrator transducer is arranged on one ultrasonic intervention sub-portion one by one.
3. The straight dip fluxed low impedance ultrasonic single wave peak soldering apparatus of claim 1, wherein, The single-tin-flow channel has a cavity structure of a horn mouth with a narrow upper part and a wide lower part, and in the width of the single-tin-flow channel: the molten tin pumping area, the ultrasonic intervention area and the tin flow long opening gradually decrease.
4. A single-bead, low-resistance, ultrasonic wave soldering method of the direct immersion molten tin type, characterized by, The equipment is executed by using the direct immersion molten tin type low-resistance ultrasonic single-wave peak welding equipment according to any one of claims 1-3. The extension direction of the flow holes in the first group forms an angle with the extension direction of the flow holes in the second group, the ultrasonic intervention conduction long plate is consistent with the tin flow direction, by changing the tin flow direction through the flow holes, the angle between the tin flow direction and the amplitude direction of the ultrasonic intervention conduction long plate is formed, so as to ensure the tin flow and improve the ultrasonic intervention.
Citation Information
Patent Citations
Method and equipment for ensuring Flux spraying uniformity of wide board of wave-soldering sprayer
CN105598550A
Wave-soldering spraying system equipment based on ultrasonic waves
CN112008189A
Wave-soldering interference cover plate and wave-soldering equipment
CN217142624U
Method of and apparatus for Soldering or Tinning
GB1158564A