Display panel and display device

Abstract

Embodiments of the present application provide a display panel and a display device. The display panel includes: a substrate layer, a metal layer, an inkjet printing layer, and one or more isolation pillars. Among them, the isolation pillar has one or more partition grooves extending downward from the upper surface of the isolation pillar. The upper surface of the metal layer includes a first region and a second region. The metal layer is disposed on the upper surface of the substrate layer, the inkjet printing layer is disposed on the first region of the upper surface of the metal layer, and one or more isolation pillars are disposed on the second region of the upper surface of the metal layer. The embodiments of the present application adopt a partition groove design to form a groove in the isolation pillar, increase the contact area of the CVD inorganic encapsulation, achieve the effect of strengthening the encapsulation, and prevent the ink of the IJP layer from overflowing.

Description

Technical Field

[0001] This application relates to the field of OLED display technology, and particularly to a display panel and a display device. Background Art

[0002] With the development of OLED (Organic Light-Emitting Diode) display technology, the performance of OLED display panels is getting better and their quality is getting higher. In the production process of OLED display panels, inkjet printing (IJP) technology is used. However, affected by the border compression of the display screen, the isolation column BANK is getting narrower and narrower. The increasingly narrow BANK is difficult to block the ink overflow of the IJP layer, weakening the encapsulation effect of chemical vapor deposition (CVD) inorganic encapsulation. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide a display panel and a display device, which increase the contact area of CVD inorganic encapsulation, strengthen the encapsulation effect, and prevent IJP overflow. The specific technical solutions are as follows:

[0004] In a first aspect, this application provides a display panel, which includes a substrate layer, a metal layer, an inkjet printing layer, and one or more isolation columns. Among them,

[0005] The isolation column has one or more partition grooves extending downward from the upper surface of the isolation column. The upper surface of the metal layer includes a first region and a second region.

[0006] The metal layer is disposed on the upper surface of the substrate layer. The inkjet printing layer is disposed in the first region of the upper surface of the metal layer. The one or more isolation columns are disposed in the second region of the upper surface of the metal layer.

[0007] In a possible implementation manner, the isolation column includes a flat layer, a through-hole layer, and a pixel definition layer. Among them,

[0008] The flat layer is disposed in the second region of the upper surface of the metal layer. The through-hole layer is disposed on the upper surface of the flat layer. The pixel definition layer is disposed on the upper surface of the through-hole layer.

[0009] In a possible implementation manner, when the isolation column has one partition groove,

[0010] The flat layer is divided into a first flat layer and a second flat layer by the partition groove;

[0011] The through - hole layer is divided by the partition groove into a first through - hole layer and a second through - hole layer;

[0012] The pixel - defining layer is divided by the partition groove into a first pixel - defining layer and a second pixel - defining layer.

[0013] In a possible implementation, when the isolation pillar has multiple partition grooves, the multiple partition grooves are evenly distributed in the isolation pillar and are not connected to each other.

[0014] In a possible implementation, the substrate layer includes: a first substrate, a second substrate, and a first buffer layer, where,

[0015] The first buffer layer is disposed on the upper surface of the first substrate, and the second substrate is disposed on the upper surface of the first buffer layer.

[0016] In a possible implementation, the first substrate is a polyimide film.

[0017] In a possible implementation, the display panel further includes a passivation layer, where,

[0018] The passivation layer is disposed on the upper surface of the metal layer.

[0019] In a possible implementation, the isolation pillar is an isolation - pillar structure that is narrower at the top and wider at the bottom.

[0020] In a possible implementation, the partition groove is a partition - groove structure that is narrower at the top and wider at the bottom.

[0021] In a second aspect, the present application further provides a display device, including:

[0022] The display panel described in the first aspect or any item of the first aspect above.

[0023] The display panel provided in the embodiments of the present application. The display panel includes: a substrate layer, a metal layer, an ink - jet printing layer, and one or more isolation pillars. Among them, the isolation pillar has one or more partition grooves extending downward from the upper surface of the isolation pillar. The upper surface of the metal layer includes a first region and a second region. The metal layer is disposed on the upper surface of the substrate layer. The ink - jet printing layer is disposed in the first region of the upper surface of the metal layer. One or more isolation pillars are disposed in the second region of the upper surface of the metal layer. The embodiments of the present application adopt the partition - groove design to form grooves in the isolation - pillar BANK structure, increase the contact area of chemical vapor deposition (CVD) inorganic encapsulation, achieve the effect of strengthening the encapsulation, prevent color mixing and mura phenomena caused by ink overflow of the ink - jet printing (IJP) layer, and improve the display effect of the display panel. Description of the Drawings

[0024] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0025] Figure 1 It shows a schematic structural diagram of a display panel provided by an embodiment of the present application;

[0026] Figure 2 It shows a schematic structural diagram of another display panel provided by an embodiment of the present application;

[0027] Figure 3 It shows a schematic structural diagram of yet another display panel provided by an embodiment of the present application;

[0028] Figure 4 It shows a schematic structural diagram of a display panel encapsulation provided by an embodiment of the present application;

[0029] Figure 5 It shows a schematic structural diagram of another display panel encapsulation provided by an embodiment of the present application;

[0030] Figure 6 It shows a schematic structural diagram of a spacer provided by an embodiment of the present application;

[0031] Figure 7 It shows a schematic structural diagram of another spacer provided by an embodiment of the present application;

[0032] Figure 8 It shows a top view of a spacer provided by an embodiment of the present application;

[0033] Figure 9 It shows a schematic structural diagram of yet another spacer provided by an embodiment of the present application;

[0034] Figure 10 It shows a schematic structural diagram of a substrate layer provided by an embodiment of the present application. Detailed implementation manners

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, rather than all, of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0036] This application will be described in detail with reference to the schematic diagrams. When describing the embodiments of this application, for the convenience of explanation, the cross-sectional views showing the device structure will be enlarged locally in a non-general proportion, and the schematic diagrams are only examples and should not limit the scope of protection of this application herein. In addition, in actual production, three-dimensional spatial dimensions of length, width, and depth should be included.

[0037] First, some terms that may appear in the embodiments of this application will be explained.

[0038] Mura phenomenon: It refers to the phenomenon of uneven brightness of the display, resulting in various traces. The main reason for the generation of mura is that there are different frequency responses to the perceived light source visually, resulting in color differences.

[0039] Printing technology: The most common printing technologies are inkjet printing (IJP) and screen printing. Among them, inkjet printing has many advantages, such as relatively high resolution, flexibility, low cost, and compatibility with almost all types of substrates.

[0040] Chemical Vapor Deposition (CVD) is a chemical engineering technology. This technology mainly uses one or several gaseous compounds or elemental substances containing thin film elements to carry out chemical reactions on the substrate surface to form a thin film.

[0041] Polyimide Film: The best-performing thin film insulation material in the world, which is formed by polycondensation of pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strongly polar solvent, followed by casting into a film and then imidization.

[0042] OLED display devices are considered emerging application technologies for the next generation of displays because they have the advantages of self-luminescence, no need for a backlight source, high contrast ratio, thin thickness, wide viewing angle, fast response speed, and can be used for flexible panels, etc. With the development of OLED display technology, the performance of OLED display panels is getting better and their quality is getting higher. In the production and manufacturing process of OLED display panels, inkjet printing technology will be used. However, affected by the compression of the display screen border, the isolation column BANK becomes narrower and narrower. It is difficult for the increasingly narrow isolation column BANK to block the ink overflow of the inkjet printing IJP layer, weakening the encapsulation effect of the chemical vapor deposition CVD inorganic encapsulation and easily causing color mixing and mura phenomena.

[0043] In the embodiments of this application, a partition groove design is adopted on the isolation column BANK to make the isolation column BANK have a partition groove, thereby increasing the contact area of the chemical vapor deposition CVD inorganic encapsulation and achieving the effect of strengthening the encapsulation.

[0044] Please refer to Figure 1 , which shows a schematic structural diagram of a display panel provided by an embodiment of the present application. The display panel of the embodiment of the present application includes: a substrate layer 101, a metal layer 102, an inkjet printing layer 103, and an isolation column 104. Among them, the isolation column 104 has a partition groove extending downward from the upper surface of the isolation column 104. The upper surface of the metal layer 102 includes a first region 1021 and a second region 1022. The metal layer 102 is disposed on the upper surface of the substrate layer 101. The inkjet printing layer 103 is disposed in the first region 1021 on the upper surface of the metal layer 102. An isolation column 104 is disposed in the second region 1022 on the upper surface of the metal layer 102.

[0045] In the embodiment of the present application, an isolation column with a partition groove is adopted, which can prevent the ink of the inkjet printing IJP layer from overflowing. Even if the ink of the inkjet printing layer overflows, the overflowed ink will flow into the partition groove, thereby increasing the contact area of chemical vapor deposition CVD inorganic encapsulation, achieving the effect of strengthening the encapsulation, and not causing color mixing and mura phenomena, improving the display effect of the display panel.

[0046] In the embodiment of the present application, a mask layer is formed on the initial isolation column, and the initial isolation column provided with the mask layer is subjected to exposure, development, and etching treatments to obtain an isolation column having one or more partition grooves. The initial isolation column is an isolation column without a partition groove.

[0047] Please refer to Figure 2 , which shows a schematic structural diagram of another display panel provided by an embodiment of the present application. The display panel of the embodiment of the present application includes: a substrate layer 101, a metal layer 102, an inkjet printing layer 103, and an isolation column 104. Among them, the isolation column 104 has a plurality of partition grooves extending downward from the upper surface of the isolation column 104. The upper surface of the metal layer 102 includes a first region 1021 and a second region 1022. The metal layer 102 is disposed on the upper surface of the substrate layer 101. The inkjet printing layer 103 is disposed in the first region 1021 on the upper surface of the metal layer 102. An isolation column 104 is disposed in the second region 1022 on the upper surface of the metal layer 102.

[0048] In a possible implementation manner, when the isolation column has a plurality of partition grooves, the plurality of partition grooves are evenly distributed and not connected to each other in the isolation column.

[0049] Please refer to Figure 3, showing a schematic structural diagram of another display panel provided by an embodiment of the present application. The display panel of the embodiment of the present application includes: a substrate layer 101, a metal layer 102, an inkjet printing layer 103, and a plurality of isolation pillars. Among them, the plurality of isolation pillars include a first isolation pillar 1041 and a second isolation pillar 1042. The isolation pillar has a partition groove extending downward from the upper surface of the isolation pillar. The upper surface of the metal layer 102 includes a first region 1021 and a second region 1022. The metal layer 102 is disposed on the upper surface of the substrate layer 101. The inkjet printing layer 103 is disposed on the first region 1021 of the upper surface of the metal layer 102. One isolation pillar 104 is disposed on the second region 1022 of the upper surface of the metal layer 102.

[0050] That is, the display panel of the embodiment of the present application includes: a substrate layer 101, a metal layer 102, an inkjet printing layer 103, and one or more isolation pillars 104. Among them, the isolation pillar 104 has one or more partition grooves extending downward from the upper surface of the isolation pillar 104. The upper surface of the metal layer 102 includes a first region 1021 and a second region 1022. The metal layer 102 is disposed on the upper surface of the substrate layer 101. The inkjet printing layer 103 is disposed on the first region 1021 of the upper surface of the metal layer 102. One or more isolation pillars 104 are disposed on the second region 1022 of the upper surface of the metal layer 102.

[0051] The display panel of the embodiment of the present application may further include a passivation layer. Among them, the passivation layer is disposed on the upper surface of the metal layer 102 to increase the adhesion between the metal layer 102 and the inkjet printing layer 103 and between the metal layer 102 and one or more isolation pillars 104.

[0052] Please refer to Figure 4 , showing a schematic structural diagram of a display panel package provided by an embodiment of the present application. The display panel of the embodiment of the present application further includes a first encapsulation layer 105. Among them, the first encapsulation layer 105 is disposed on the upper surface of the inkjet printing layer 103 and the upper surface of one or more isolation pillars 104. It can be seen that the embodiment of the present application adopts an isolation pillar with a partition groove, which can increase the contact area of chemical vapor deposition (CVD) inorganic encapsulation and achieve the effect of strengthening the encapsulation.

[0053] Please refer to Figure 5 , showing a schematic structural diagram of another display panel package provided by an embodiment of the present application. The display panel of the embodiment of the present application further includes a second encapsulation layer 106. Among them, the second encapsulation layer 106 is disposed on the lower surface of the inkjet printing layer 103 and the upper surface of one or more isolation pillars 104.

[0054] Please refer to Figure 6, which shows a schematic structural diagram of an isolation column provided by an embodiment of the present application. The isolation column includes: a flat layer 201, a through-hole layer 202, and a pixel definition layer 203. Among them, the flat layer 201 is disposed in the second region 1022 on the upper surface of the metal layer 102, the through-hole layer 202 is disposed on the upper surface of the flat layer 201, and the pixel definition layer 203 is disposed on the upper surface of the through-hole layer 202.

[0055] Please refer to Figure 7 , which shows a schematic structural diagram of another isolation column provided by an embodiment of the present application. Please refer to Figure 8 , which shows a top view of an isolation column provided by an embodiment of the present application. When the isolation column has a partition groove,

[0056] The flat layer 201 is divided into a first flat layer 2011 and a second flat layer 2012 by the partition groove;

[0057] The through-hole layer 202 is divided into a first through-hole layer 2021 and a second through-hole layer 2022 by the partition groove;

[0058] The pixel definition layer 203 is divided into a first pixel definition layer 2031 and a second pixel definition layer 2032 by the partition groove.

[0059] It should be noted that the depth of the partition groove can be selected by those skilled in the art according to actual scenario requirements, and the embodiments of the present application do not make any limitations.

[0060] Please refer to Figure 9 , which shows a schematic structural diagram of another isolation column provided by an embodiment of the present application. The isolation column has a structure that is narrower at the top and wider at the bottom, and the partition groove has a structure that is narrower at the top and wider at the bottom. It should be noted that the specific shapes of the isolation column and the partition groove can be selected by those skilled in the art according to actual scenario requirements, and the embodiments of the present application do not make any limitations.

[0061] Please refer to Figure 10 , which shows a schematic structural diagram of a substrate layer provided by an embodiment of the present application. The substrate layer 101 includes: a first substrate 301, a second substrate 303, and a first buffer layer 302. Among them,

[0062] The first buffer layer 302 is disposed on the upper surface of the first substrate 301, and the second substrate 303 is disposed on the upper surface of the first buffer layer 302.

[0063] By disposing the first buffer layer 302 between the first substrate 301 and the second substrate 303, the adhesion between the first substrate 301 and the second substrate 303 can be increased.

[0064] In a possible implementation, the display panel of the embodiments of the present application further includes a second buffer layer, and the second buffer layer is disposed on the upper surface of the substrate layer 101, that is, the second buffer layer is disposed between the substrate layer 101 and the metal layer 102 to increase the adhesion between the substrate layer 101 and the metal layer 102.

[0065] In the embodiments of the present application, the first substrate 301 can be made of, but is not limited to, the following materials: polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, glass or quartz. The second substrate 303 can be made of, but is not limited to, the following materials: polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, glass or quartz. It should be noted that the specific materials of the first substrate 301 and the second substrate 303 can be selected by those skilled in the art according to actual scenarios, and the embodiments of the present application do not make any limitations.

[0066] In the embodiments of the present application, the display panel includes: a substrate layer, a metal layer, an inkjet printing layer, and one or more isolation columns. The isolation column has one or more partition grooves extending downward from the upper surface of the isolation column. The upper surface of the metal layer includes a first region and a second region. The metal layer is disposed on the upper surface of the substrate layer. The inkjet printing layer is disposed on the first region of the upper surface of the metal layer. One or more isolation columns are disposed on the second region of the upper surface of the metal layer. The embodiments of the present application adopt the partition groove design to form grooves in the isolation column BANK structure, increase the contact area of chemical vapor deposition (CVD) inorganic encapsulation, achieve the effect of strengthening the encapsulation, prevent color mixing and mura phenomena caused by ink overflow of the inkjet printing (IJP) layer, and improve the display effect of the display panel.

[0067] Next, a method for manufacturing a display panel provided by the embodiments of the present application will be introduced. The method at least includes the following steps:

[0068] S1, providing a substrate layer 101;

[0069] S2, forming a metal layer 102 on the substrate layer 101;

[0070] S3, forming an isolation column 104 having one or more partition grooves in the second region 1022 of the upper surface of the metal layer 102;

[0071] S4, forming an inkjet printing layer 103 in the first region 1021 of the upper surface of the metal layer 102.

[0072] In the embodiments of the present application, a possible implementation of S3 for forming an isolation column 104 having one or more partition grooves in the second region 1022 of the upper surface of the metal layer 102 includes:

[0073] Forming a planar layer 201 in the second region;

[0074] Form a via hole layer 202 on the flat layer 201;

[0075] Form a pixel definition layer 203 on the via hole layer 202 to obtain an initial isolation column;

[0076] Process the initial isolation column by exposure, development, and etching processes to obtain an isolation column 104 having one or more partition grooves.

[0077] Among them, a possible implementation of processing the initial isolation column by exposure, development, and etching processes to obtain an isolation column 104 having one or more partition grooves includes:

[0078] Form a mask layer on the initial isolation column;

[0079] Perform exposure, development, and etching processes on the initial isolation column provided with the mask layer to obtain an isolation column 104 having one or more partition grooves.

[0080] First, form a mask layer on the initial isolation column and place the light-transmitting channel of the mask layer at the corresponding position above the position where the isolation column having one or more partition grooves needs to be formed, so that the light passing through the light-transmitting channel can enter the initial isolation column. Then, perform steps such as exposure, development, and etching on the initial isolation column provided with the mask layer. The initial isolation column corresponding to the exposure area undergoes crosslinking and is insoluble in the developer, while the exposed part is soluble in the developer and is easily dissolved and removed. Thus, after etching, the exposed part of the initial isolation column is removed, and an isolation column having one or more partition grooves is formed on the metal layer.

[0081] Next, a display device provided in an embodiment of the present application is introduced. The display device includes any one of the above display panels.

[0082] In an embodiment of the present application, the display panel includes: a substrate layer, a metal layer, an inkjet printing layer, and one or more isolation columns. Among them, the isolation column has one or more partition grooves extending downward from the upper surface of the isolation column. The upper surface of the metal layer includes a first region and a second region. The metal layer is disposed on the upper surface of the substrate layer, the inkjet printing layer is disposed on the first region of the upper surface of the metal layer, and one or more isolation columns are disposed on the second region of the upper surface of the metal layer. The embodiment of the present application adopts a partition groove design to form a groove in the isolation column BANK structure, increasing the contact area of chemical vapor deposition (CVD) inorganic encapsulation, achieving the effect of strengthening the encapsulation, preventing color mixing and mura phenomena caused by ink overflow of the inkjet printing (IJP) layer, and improving the display effect of the display panel.

[0083] It should be noted that for the same or similar parts between the embodiments, reference can be made to each other. For method embodiments and system embodiments, since they are basically similar to device embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the device embodiments.

[0084] For the foregoing embodiments, for the sake of simple description, they are all expressed as a series of action combinations. However, those skilled in the art should know that this application is not limited by the described action sequence, because according to this application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0085] Finally, it should also be noted that in this text, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0086] The above description of the disclosed embodiments enables those skilled in the art to implement or use this application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0087] The above is only the preferred embodiment of this application. It should be noted that for those of ordinary skill in the art, without departing from the principle of this application, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of this application.

Claims

1. A display panel, characterized in that: The display panel includes: a substrate layer, a metal layer, an inkjet printing layer and one or more spacer columns, wherein: The isolation column has one or more isolation grooves extending downward from the upper surface of the isolation column, and the upper surface of the metal layer includes a first area and a second area. The metal layer is disposed on the upper surface of the substrate layer, the inkjet printed layer is disposed in a first region of the upper surface of the metal layer, and the one or more spacer columns are disposed in a second region of the upper surface of the metal layer; The isolation column includes: a planar layer, a through-hole layer and a pixel definition layer, wherein: The planar layer is disposed on the second region of the upper surface of the metal layer, the through-hole layer is disposed on the upper surface of the planar layer, and the pixel definition layer is disposed on the upper surface of the through-hole layer; When the isolation column has a partition groove, The flat layer is divided into a first flat layer and a second flat layer by the partition groove; The through-hole layer is divided into a first through-hole layer and a second through-hole layer by the partition groove; The pixel definition layer is divided into a first pixel definition layer and a second pixel definition layer by the partition groove.

2. The display panel according to claim 1, wherein: When the isolation column has a plurality of isolation grooves, the plurality of isolation grooves are evenly distributed in the isolation column and are not connected to each other.

3. The display panel according to claim 1, wherein: The substrate layer includes: a first substrate, a second substrate and a first buffer layer, wherein: The first buffer layer is disposed on an upper surface of the first substrate, and the second substrate is disposed on an upper surface of the first buffer layer.

4. The display panel according to claim 3, wherein: The first substrate is a polyimide film.

5. The display panel according to claim 1, wherein: The display panel further includes a passivation layer, wherein: The passivation layer is arranged on the upper surface of the metal layer.

6. The display panel according to claim 1, wherein: The isolation column is an isolation column structure that is narrow at the top and wide at the bottom.

7. The display panel according to claim 1, wherein: The partition groove is a partition groove structure that is narrow at the top and wide at the bottom.

8. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 7.

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