A heat dissipation structure based on TEC

Abstract

The present invention proposes a heat dissipation structure based on TEC, including a heat dissipation cover, a TEC module, a graphene component, a heating part and a driving member, wherein the heat dissipation cover is arranged above the TEC module, the TEC module is arranged between the heat dissipation cover and the graphene component, the heating part is arranged below the graphene component, and the driving member is arranged below the heating part; the graphene component is arranged in a disc shape with a downward depression in the middle, the driving rod of the driving member passes through the heating part and is fixed to the edge of the graphene component, and the graphene component includes a heat conduction state abutting against the heat dissipation cover and a non-heat conduction state separated from the heat dissipation cover. The present invention adopts a heat dissipation method of flexible graphene plus TEC, and adopts different heat conduction methods under different ambient temperatures throughout the year, so that the TEC heat sink does not need to work for most of the year on average, and only needs passive heat dissipation, which saves power consumption on the one hand, and reduces the working time of TEC on the other hand, and prolongs the working life of TEC.

Description

Technical Field

[0001] The present invention relates to the technical field of TEC heat dissipation, and in particular to a heat dissipation structure based on TEC. Background Art

[0002] In the application field of low-power electronic equipment, there is a type of application that does not allow the use of fans as a heat dissipation measure, such as outdoor transportation applications and vehicle-mounted applications. The power consumption of this type is around 15W-30W, and the box size cannot be made into large heat sink fins due to usage requirements. In the case of high ambient temperature requirements, such as the working environment temperature needs to be above 70 degrees, ordinary industrial-grade chips can no longer meet the chip heat dissipation requirements under passive heat dissipation.

[0003] At present, in this type of application, the existing technology has adopted a solution of adding TEC (thermoelectric cooler, which is a device based on the Peltier effect, which usually includes two materials and transfers heat from one side of the device to the other side while forcing a direct current to pass) semiconductor cooling sheet, such as the following patent: CN202210152303.X. For the above solution, its main disadvantage is that the semiconductor cooling sheet needs to consume energy for cooling and has low cooling efficiency. For example, a 15W chip meets the requirements of high ambient temperature through cooling, and its power consumption is at least 15W. With the efficiency loss, the power consumption of the whole machine is at least 40W from the original 15W device. Since the thermal conductivity of TEC is very low when it is not powered on, even if the ambient temperature is very low, the TEC chip needs to be powered on to work, so that the 15W power consumption of the chip is dissipated, which causes the whole system power consumption to be at least twice that of the actual chip, and the corresponding external power supply also needs to provide more than 1 times the power consumption actually used by the chip. Summary of the invention

[0004] Aiming at the problem that common industrial-grade chips cannot meet the chip heat dissipation requirements under passive heat dissipation, the present invention proposes a heat dissipation structure based on TEC.

[0005] The present invention proposes a heat dissipation structure based on TEC, including a heat dissipation upper cover, a TEC module, a graphene component, a heat generating part and a driving member, wherein the heat dissipation upper cover is arranged above the TEC module, the TEC module is arranged between the heat dissipation upper cover and the graphene component, the heat generating part is arranged below the graphene component, and the driving member is arranged below the heat generating part; the graphene component is arranged in a disc shape with a downward depression in the middle, a driving rod of the driving member passes through the heat generating part and is fixed to the edge of the graphene component, and the graphene component includes a heat conducting state abutting against the heat dissipation upper cover and a heat non-conducting state separated from the heat dissipation upper cover.

[0006] Preferably, the driving member can drive the edge of the graphene component to move downward through the driving rod to separate the graphene component from the heat dissipation upper cover.

[0007] Preferably, the graphene component comprises, from top to bottom, an upper metal ring, an upper metal heat sink, a graphene sheet, a lower metal heat sink, a lower metal ring and a spring assembly, the spring assembly being used to fix the upper metal ring, the upper metal heat sink, the graphene sheet, the lower metal heat sink and the lower metal ring, and the end of the driving rod of the driving member is connected to the spring assembly.

[0008] Preferably, the spring assembly includes a spring body, a limiting washer and a hollow nut, the spring body is sleeved on the hollow nut, one end of the spring body abuts against the lower metal ring, the other end of the spring body abuts against the hollow nut, the hollow nut passes through the lower metal ring and the upper metal ring, the limiting washer is fixed to the hollow nut and the lower end face of the limiting washer abuts against the upper metal ring.

[0009] Preferably, the spring body can give an upward force to the graphene component to make the upper metal ring abut against the heat dissipation cover, and the driving member can drive the upper metal ring to move downward through the driving rod and the spring component to separate the upper metal ring from the heat dissipation cover.

[0010] Preferably, the TEC module and the graphene component are connected and fixed by thermally conductive adhesive.

[0011] Preferably, the driving member is configured as a reduction motor.

[0012] Preferably, the upper end surface of the heat dissipation upper cover is provided with heat dissipation fins.

[0013] Preferably, the driving rod of the driving member is configured as a threaded rod, and the hollow nut is rotationally connected to the threaded rod.

[0014] Preferably, the upper metal ring or the lower metal ring is provided with a limiting groove, the hollow nut passes through the limiting groove and the limiting groove can limit the rotation of the hollow nut.

[0015] When the TEC module is needed to work, the upper metal ring that contacts the heat dissipation cover moves downward through the motion mechanism, i.e. the drive component, so that only the TEC module contacts the heat dissipation surface to ensure the cooling effect. When the TEC module is not needed to work, the upper metal ring contacts the heat dissipation cover to dissipate heat through the graphene contacting the heat dissipation surface, thus realizing the switching between the two modes.

[0016] The beneficial effects of the present invention are:

[0017] 1. The flexible graphene plus TEC heat dissipation method in the structure adopted by the present invention adopts different heat conduction methods under different ambient temperatures throughout the year, so that the TEC heat sink does not need to work on average for most of the year, and only passive heat dissipation is required. This saves power consumption on the one hand, and reduces the working time of TEC on the other hand, thereby extending the working life of TEC.

[0018] 2. In the structure adopted by the present invention, the switching part of the whole machine adopts the switching scheme of the reduction motor, which has passive heat dissipation. Compared with the heat exchange design of the fan, it has low noise, high reliability and saves power consumption.

[0019] 3. In the structure adopted by the present invention, the heat dissipation contact separation part adopts the method of reducing motor plus spring, which ensures the appropriate pressure of the connection between the heat sink and the casing and ensures the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solution of the present invention, the accompanying drawings required for use in the description will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the exploded structure of the TEC-based heat dissipation structure described in the present invention.

[0022] Figure 2 It is a cross-sectional view of the heat dissipation structure based on TEC described in the present invention.

[0023] Figure 3 It is a schematic diagram of the three-dimensional structure of the graphene component described in the present invention.

[0024] Figure 4 It is a schematic diagram of the exploded structure of the graphene component described in the present invention.

[0025] Figure 5 It is a schematic diagram of the three-dimensional structure of the spring assembly of the present invention.

[0026] In the figure: 1. heat dissipation cover, 2. TEC module, 3. graphene component, 31. upper metal ring, 32. upper metal heat sink, 33. graphene sheet, 34. lower metal heat sink, 35. lower metal ring, 4. heating part, 5. driving part, 6. spring body, 7. limiting washer, 8. hollow nut. DETAILED DESCRIPTION

[0027] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical scheme of the present invention will be clearly and completely described below in conjunction with the drawings in this specific embodiment. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of them. Based on the embodiments in this patent, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this patent.

[0028] Based on the problems raised in the background technology, the following considerations are drawn: the power consumption of the device chip is 15W. Under normal circumstances, if TEC is not used for heat dissipation, most of the ambient temperature can be 55 degrees through passive heat dissipation. The actual working ambient temperature range of TEC is an ambient temperature above 55 degrees. When the ambient temperature is below 55 degrees, passive heat dissipation is used, and TEC is actually not needed to play a role. It is only because of the low thermal conductivity of TEC that TEC is needed to work for active heat dissipation. In actual use, such as outdoors, in the four seasons of the year, only during a period of time during the day in summer will the ambient temperature in the outdoor chassis reach above 55 degrees (in practice, it may reach above 60 degrees), and most of the time (ambient temperature is lower than 55 degrees, such as at night, in other seasons except summer) TEC is actually not needed. Therefore, if passive heat dissipation can be satisfied, if TEC can be bypassed for heat dissipation, in this way, only passive heat dissipation is needed for most of the working time throughout the year. When the temperature exceeds 55 degrees, TEC heat dissipation is used, which combines the advantages of the two solutions and can make the annual average power of the entire device close to the chip power consumption. Therefore, the focus is on how to make TEC perform good passive heat dissipation of the chip when it is not working.

[0029] When considering air cooling, that is, installing a fan in the box, this solution can reduce power consumption requirements, but it cannot meet the fanless clauses in many bidding requirements; on the other hand, the use of fans still increases power consumption and heat dissipation pressure, because the fan inside the box itself has power consumption, about 3-4W, and this part of the increased power consumption also needs to be dissipated passively.

[0030] After multiple considerations, a new heat dissipation method can be adopted to achieve the above effect by making the two heat-conducting surfaces contact or separate through the motor. At the same time, for cost considerations, this solution adopts the more widely used graphene (widely used in the mobile phone industry) acceleration and deceleration motor solution. The graphene heat sink itself has a thermal conductivity of 150-1500W / mK in the plane, which is equivalent to the thermal conductivity of metal. It is also a flexible material and can be deformed.

[0031] Therefore, based on the above considerations, the present invention proposes a heat dissipation structure based on TEC, such as Figures 1 to 5As shown, in this embodiment, it specifically includes a heat dissipation cover 1, a TEC module 2, a graphene component 3, a heating part 4 and a driving member 5. The heat dissipation cover 1 is arranged above the TEC module 2, the TEC module 2 is arranged between the heat dissipation cover 1 and the graphene component 3, the heating part 4 is arranged below the graphene component 3, and the driving member 5 is arranged below the heating part 4; the graphene component 3 is arranged in a disc shape with a downward depression in the middle, and the driving rod of the driving member 5 passes through the heating part 4 and is fixed to the edge of the graphene component 3. The graphene component 3 includes a heat-conducting state abutting against the heat dissipation cover 1 and a non-heat-conducting state separated from the heat dissipation cover 1. The non-heat-conducting state is mainly achieved by the driving member 5 driving the edge of the graphene component 3 to move downward through the driving rod to separate the graphene component 3 from the heat dissipation cover 1.

[0032] The heat dissipation cover 1 is mainly used for overall heat dissipation, and the upper end surface of the heat dissipation cover 1 is provided with heat dissipation fins. Passive heat dissipation is achieved through the heat dissipation fins at the upper end; the TEC module 2 is the main component of refrigeration, through the external voltage (the wire is not drawn, it is led out through the graphene opening, because it is not involved, it is not drawn); the heat generating part is the heat generating part of the chip; the driving part 5 is the part that drives the graphene component 3 to move up and down.

[0033] Specifically, Figure 3 to Figure 4 As shown, the graphene assembly 3 includes an upper metal ring 31, an upper metal heat sink 32, a graphene sheet 33, a lower metal heat sink 34, a lower metal ring 35 and a spring assembly from top to bottom. The spring assembly is used to fix the upper metal ring 31, the upper metal heat sink 32, the graphene sheet 33, the lower metal heat sink 34 and the lower metal ring 35. The end of the driving rod of the driving member 5 is connected to the spring assembly. Figure 5 As shown, the spring assembly includes a spring body 6, a limiting washer 7 and a hollow nut 8. The spring body 6 is sleeved on the hollow nut 8. One end of the spring body 6 abuts against the lower metal ring 35, and the other end of the spring body 6 abuts against the hollow nut 8. The hollow nut 8 passes through the lower metal ring 35 and the upper metal ring 31. The limiting washer 7 is fixed to the hollow nut 8 and the lower end surface of the limiting washer 7 abuts against the upper metal ring 31.

[0034] The spring body 6 can give an upward force to the graphene assembly 3 to make the upper metal ring 31 abut against the heat dissipation cover 1, and the driving member 5 can drive the upper metal ring 31 to move downward through the driving rod and the spring assembly to separate the upper metal ring 31 from the heat dissipation cover 1.

[0035] Among them, the graphene component 3 is a flexible component, the middle part is pressed with the TEC module 2, and heat conductive glue is added in the middle to conduct heat. When the TEC module 2 is not needed to work and dissipate heat, the heat in the middle is transferred to the metal rings around it through the high thermal conductivity of graphene. Since the metal rings are pressed onto the heat dissipation cover 1 through the spring assembly, the heat is conducted to the heat dissipation cover 1 through the metal rings, thereby dissipating heat. When the TEC module 2 is needed to work, the driving member 5 moves downward with the outer upper metal ring 31 and the lower metal ring 35. Since the graphene is flexible, the upper metal sheet 31 is separated from the heat dissipation cover 1, thereby cutting off the heat conduction path, so that the heat conduction channel is mainly completed through the TEC module 2. Through the above steps, the choice of whether the main heat conduction channel is through the TEC module 2 or the graphene component 3 is realized.

[0036] The upper metal ring 31, the lower metal ring 35, the middle graphene sheet 33 and the metal heat sink are all fixed by spring assemblies, wherein the limit washer 7 is used to ensure that when the hollow nut 8 moves downward, the upper metal ring 31 can be pulled down, and the spring body 6 is used to push upward with elastic force to ensure that it can be pressed tightly without overloading the driving part 5, and there is a certain margin.

[0037] The TEC module 2 and the graphene component 3 are connected and fixed by thermally conductive adhesive.

[0038] The driving member 5 is configured as a reduction motor, and the driving rod of the driving member 5 is configured as a threaded rod, and the hollow nut 8 is rotatably connected to the threaded rod. This part is the part that drives the graphene component 3 to move. The reduction motor extends a long threaded rod, and the driving hollow nut 8 changes from rotating to moving up and down, which is used to move the graphene component 3 up and down. The upper metal ring 31 or the lower metal ring 35 is provided with a limiting groove, and the hollow nut 8 passes through the limiting groove and the limiting groove can limit the rotation of the hollow nut 8. The limiting groove can ensure that the hollow nut 8 will not rotate with the rotation of the reduction motor, and only the hollow nut 8 drives the graphene component 3 to move up and down.

[0039] The working principle of the TEC-based heat dissipation structure is:

[0040] When the TEC module 2 is required to work, the upper metal ring 31 in contact with the heat dissipation upper cover 1 is moved downward by the motion mechanism, i.e., the driving member 5, so that only the TEC module 2 contacts the heat dissipation surface to ensure the cooling effect. When the TEC module 2 is not required to work, when the upper metal ring 31 contacts the heat dissipation upper cover 1, heat is dissipated by contacting the heat dissipation surface through the graphene, thereby realizing the switching between the two modes.

[0041] It can be seen from the above embodiments that the beneficial effects of the present invention are:

[0042] 1. The flexible graphene plus TEC heat dissipation method in the structure adopted by the present invention adopts different heat conduction methods under different ambient temperatures throughout the year, so that the TEC heat sink does not need to work on average for most of the year, and only passive heat dissipation is required. This saves power consumption on the one hand, and reduces the working time of TEC on the other hand, thereby extending the working life of TEC.

[0043] 2. In the structure adopted by the present invention, the switching part of the whole machine adopts the switching scheme of the reduction motor, which has passive heat dissipation. Compared with the heat exchange design of the fan, it has low noise, high reliability and saves power consumption.

[0044] 3. In the structure adopted by the present invention, the heat dissipation contact separation part adopts the method of reducing motor plus spring, which ensures the appropriate pressure of the connection between the heat sink and the casing and ensures the heat dissipation effect.

[0045] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation structure based on TEC, It is characterized in that The invention comprises a heat dissipation upper cover, a TEC module, a graphene component, a heat generating part and a driving member, wherein the heat dissipation upper cover is arranged above the TEC module, the TEC module is arranged between the heat dissipation upper cover and the graphene component, the heat generating part is arranged below the graphene component, and the driving member is arranged below the heat generating part; the graphene component is arranged in a disc shape with a downward depression in the middle, a driving rod of the driving member passes through the heat generating part and is fixed to the edge of the graphene component, and the graphene component comprises a heat conducting state abutting against the heat dissipation upper cover and a heat non-conducting state separated from the heat dissipation upper cover; The graphene assembly includes, from top to bottom, an upper metal ring, an upper metal heat sink, a graphene sheet, a lower metal heat sink, a lower metal ring and a spring assembly, wherein the spring assembly is used to fix the upper metal ring, the upper metal heat sink, the graphene sheet, the lower metal heat sink and the lower metal ring, and the end of the driving rod of the driving member is connected to the spring assembly; The spring assembly comprises a spring body, a limiting washer and a hollow nut, wherein the spring body is sleeved on the hollow nut, one end of the spring body abuts against the lower metal ring, and the other end of the spring body abuts against the hollow nut, the hollow nut passes through the lower metal ring and the upper metal ring, the limiting washer is fixed to the hollow nut and the lower end surface of the limiting washer abuts against the upper metal ring; The graphene component is a flexible component. The middle part is pressed together with the TEC module, and thermal conductive glue is added in the middle to conduct heat. When the TEC module is not needed to work and dissipate heat, the heat in the middle is transferred to the metal rings around it through the high thermal conductivity of graphene. Since the metal rings are pressed onto the heat dissipation cover by spring components, the heat is conducted to the heat dissipation cover through the metal rings, thereby dissipating heat. When the TEC module is needed to work, the driving part moves downward with the outer upper and lower metal rings to separate the upper metal sheet from the heat dissipation cover, thereby cutting off the heat conduction path, so that the heat conduction channel is mainly completed through the TEC module, and the heat conduction channel is switched between the TEC module and the graphene component. The spring body can give the graphene component an upward force to make the upper metal ring abut against the heat dissipation upper cover, and the driving member can drive the upper metal ring to move downward through the driving rod and the spring component to separate the upper metal ring from the heat dissipation upper cover.

2. The TEC-based heat dissipation structure according to claim 1, It is characterized in that The driving member can drive the edge of the graphene component to move downward through the driving rod to separate the graphene component from the heat dissipation upper cover.

3. The TEC-based heat dissipation structure according to claim 1, It is characterized in that The TEC module and the graphene component are connected and fixed by thermally conductive adhesive.

4. The TEC-based heat dissipation structure according to claim 1, It is characterized in that The driving member is configured as a reduction motor.

5. The TEC-based heat dissipation structure according to claim 1, It is characterized in that The upper end surface of the heat dissipation upper cover is provided with heat dissipation fins.

6. The TEC-based heat dissipation structure according to claim 1, It is characterized in that The driving rod of the driving member is configured as a threaded rod, and the hollow nut is rotatably connected to the threaded rod.

7. The TEC-based heat dissipation structure according to claim 6, It is characterized in that The upper metal ring or the lower metal ring is provided with a limiting groove, the hollow nut passes through the limiting groove and the limiting groove can limit the rotation of the hollow nut.

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