Laser processing device

Abstract

A laser processing apparatus includes a support section for supporting an object, a first laser processing head for irradiating the laser to the object supported by the support section, a camera for taking a picture of the object supported by the support section, a first moving mechanism for moving the support section in a first direction, a second moving mechanism for moving at least the first laser processing head in the first direction and a second direction, and a control section for moving the support section and the first laser processing head in opposite directions in the first direction by controlling the first moving mechanism and the second moving mechanism while the laser is output from the first laser processing head, and performing an irradiation process of irradiating the laser to the object in the line.

Description

Technical Field

[0001] This invention relates to a laser processing apparatus. Background Technology

[0002] Patent Document 1 describes a laser processing apparatus comprising: a holding mechanism for holding a workpiece; and a laser irradiation mechanism for irradiating the workpiece held in the holding mechanism with a laser. In the laser processing apparatus described in Patent Document 1, the laser irradiation mechanism with a condenser lens is fixed to a base, and the movement of the workpiece along a direction perpendicular to the optical axis of the condenser lens is carried out by the holding mechanism.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 5456510 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] Furthermore, in such a laser processing apparatus, it is desirable to increase the processing speed. Therefore, increasing the moving speed of the workpiece via the holding mechanism is considered. However, there is a limit to the increase in the moving speed of the workpiece via the holding mechanism. In contrast, for example, it is considered that while moving the workpiece via the holding mechanism, the laser irradiation mechanism is also moved in the opposite direction, thereby increasing the moving speed of the laser focusing point relative to the workpiece. However, as described above, in the laser processing apparatus described in Patent Document 1, since the laser irradiation mechanism is fixed to the base, it is not easy to move the laser irradiation mechanism. Therefore, in the laser processing apparatus described in Patent Document 1, it is even more difficult to increase the processing speed.

[0008] Therefore, the object of the present invention is to provide a laser processing apparatus that can increase processing speed.

[0009] Technical means to solve the problem

[0010] The laser processing apparatus of the present invention is used to irradiate an object with multiple lines extending along a first direction and arranged along a second direction intersecting the first direction with laser light, thereby forming a modified region on the object along the lines. The apparatus is characterized by comprising: a support for supporting the object; a first laser processing head for irradiating the object supported on the support with the laser light; a camera for photographing the object supported on the support; a first moving mechanism for moving the support along the first direction; a second moving mechanism for moving at least the first laser processing head along both the first and second directions; and a control unit for controlling the movement of the object along the lines. When the first laser processing head is outputting laser light, by controlling the first moving mechanism and the second moving mechanism, the support and the first laser processing head are moved in opposite directions along the first direction to perform irradiation processing of the object along a line using the laser. The second moving mechanism includes: a first moving part that extends along the first direction and is equipped with the first laser processing head for moving the first laser processing head along the first direction; and the second moving mechanism includes: a second moving part that extends along the second direction and is equipped with the first moving part for moving the first moving part along the second direction; and a camera that is mounted on the second moving part via a component different from the first moving part.

[0011] In this laser processing apparatus, a support for supporting an object is movable in at least a first direction via a first moving mechanism, and a first laser processing head for irradiating the object supported on the support with laser light is movable in both the first and second directions via a second moving mechanism. The first direction is the direction in which a predetermined processing line is set on the object, and the second direction is the direction in which the line is arranged. Therefore, in this laser processing apparatus, under the control of a control unit, irradiation processing can be performed by moving the support and the first laser processing head in opposite directions along the first direction while irradiating the object with laser light along that line. Thus, when laser irradiation is performed, the processing speed can be increased compared to the case where only the object side is moved.

[0012] In particular, in this laser processing apparatus, the camera used to photograph the object is mounted on the second moving part via a different component than the first moving part responsible for the movement of the first laser processing head in the first direction. Therefore, during irradiation processing, it does not follow the camera; only the first laser processing head (and its support) can move along the first direction. This allows for a further increase in the movement speed of the first laser processing head along the first direction, reliably increasing the processing speed.

[0013] Furthermore, in this laser processing apparatus, as described above, by moving the support and the first laser processing head in opposite directions during irradiation, the speed at which the laser focus point moves towards the object can be increased. In other words, the target's movement speed at the focus point is shared by both the support and the first laser processing head. Therefore, compared to the case where only one of the support or the first laser processing head moves, their respective movement speeds can be suppressed. As a result, the acceleration and deceleration time and distance of the support and the first laser processing head can be reduced.

[0014] Furthermore, according to the laser processing apparatus, the trajectory in the first direction can be reduced. That is, when only the support moves during irradiation, the distance the support moves is at least equal to or greater than the length of the line supporting the object. Additionally, as described above, when the support and the first laser processing head move in opposite directions during irradiation, the distance the support moves can be reduced until the length of the line minus the distance the support moves. In other words, in this case, the sum of the distance the support moves and the distance the first laser processing head moves is equal to or greater than the length of the line. Therefore, according to the laser processing apparatus, trajectory reduction in the first direction can be achieved.

[0015] In the laser processing apparatus of the present invention, the second moving mechanism may also include a pair of second moving parts arranged opposite to each other in the first direction.

[0016] The first moving part is mounted and supported by a pair of second moving parts. In this configuration, the first laser processing head can be reliably supported.

[0017] Here, the weight of the laser processing head is generally lighter than that of the support. Therefore, it is considered that when the focusing point is moved at the target's moving speed, the first laser processing head will move faster than the support (i.e., the speed burden on the first laser processing head will be relatively increased).

[0018] In contrast, in the laser processing apparatus of the present invention, the first laser processing head may also be connected to an optical fiber for guiding the laser output from the light source.

[0019] During the irradiation process, the control unit makes the speed of the first laser processing head along the first direction lower than the speed of the support unit along the first direction. In this way, when the first laser processing head is connected to an optical fiber for guiding laser light from the light source, regardless of the weight relationship between the first laser processing head and the support unit, the optical fiber can be protected by relatively slowing down the first laser processing head (i.e., relatively reducing the speed burden on the first laser processing head).

[0020] In the laser processing apparatus of the present invention, the second moving mechanism may also include a third moving part as a different component as described above. This third moving part extends along the first direction and is equipped with a camera for moving the camera along the first direction. In this case, the camera can move in both the first and second directions.

[0021] In the laser processing apparatus of the present invention, a second laser processing head may also be provided, which is used to irradiate an object supported on a support with laser light. The second moving mechanism includes: a fourth moving part extending along a first direction and on which the second laser processing head is mounted, for moving the second laser processing head along the first direction; the second moving part, on which the fourth moving part is mounted, has a function for moving the fourth moving part along a second direction. In the irradiation process, the control unit performs the first process and the second process in a manner that repeats at least a portion of the time. The first process irradiates one of a plurality of lines with laser light from the first laser processing head, and the second process irradiates the other lines of the plurality of lines with laser light from the second laser processing head. In the first process, the control unit controls the first moving mechanism and the second moving mechanism to move the support and the first laser processing head in opposite directions along the first direction. In the second process, the control unit controls the first moving mechanism and the second moving mechanism to move the support and the second laser processing head in opposite directions along the first direction. In this situation, output can be increased by coordinating the first and second laser processing heads at least for a portion of the time.

[0022] The effects of the invention

[0023] According to the present invention, a laser processing apparatus that can increase processing speed can be provided. Attached Figure Description

[0024] Figure 1 This is a top view of a laser processing apparatus according to one embodiment.

[0025] Figure 2 yes Figure 1 A side view of a portion of the laser processing apparatus shown.

[0026] Figure 3 yes Figure 1 The image shows a front view of the laser processing head of the laser processing apparatus.

[0027] Figure 4 yes Figure 3 The image shows a side view of the laser processing head.

[0028] Figure 5 yes Figure 3 The diagram shows the configuration of the optical system of the laser processing head.

[0029] Figure 6This is a schematic diagram of the optical system of a modified laser processing head.

[0030] Figure 7 This is a schematic diagram of the optical system of a modified laser processing head.

[0031] Figure 8 This is a schematic top view illustrating the operation of the laser processing device.

[0032] Figure 9 This is a schematic top view illustrating the operation of the laser processing device.

[0033] Figure 10 This is a schematic top view illustrating the operation of the laser processing device.

[0034] Figure 11 This is a schematic top view of a modified laser processing apparatus.

[0035] Figure 12 This is a schematic top view of a modified laser processing apparatus.

[0036] Figure 13 This is a schematic top view of a modified laser processing apparatus. Detailed Implementation

[0037] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in the various figures, the same or equivalent parts will be given the same symbols, and repeated descriptions will be omitted. Furthermore, in the various figures, there are cases where an orthogonal coordinate system defined by the X-axis, Y-axis, and Z-axis is shown. The X-direction is an example of a first direction, a first horizontal direction. The Y-direction is an example of a second direction intersecting the first direction, a second horizontal direction. The Z-direction is an example of a third direction intersecting both the first and second directions, a vertical direction.

[0038] [Structure of laser processing equipment]

[0039] like Figure 1 and Figure 2 As shown, the laser processing apparatus 1 includes: a moving mechanism 5 (first moving mechanism), a moving mechanism 6 (second moving mechanism), a support unit 7, a light source unit 8, a control unit 9, a laser processing head 10A (first laser processing head), a laser processing head 10B (second laser processing head), and a camera unit 10C.

[0040] The moving mechanism 5 includes a fixed part 51, a moving part 53, and a mounting part 55. The fixed part 51 is mounted on the device frame 1a. The moving part 53 is mounted on a track provided on the fixed part 51 and can move along the Y direction. The mounting part 55 is mounted on a track provided on the moving part 53 and can move along the X direction. The support part 7 is mounted on a rotation axis provided on the mounting part 55 and can rotate about an axis parallel to the Z direction. That is, the moving mechanism 5 has the function of moving the support part 7 along the X and Y directions and rotating about an axis along the Z direction.

[0041] The moving mechanism 6 includes: a Y-axis moving part (second moving part) 61; an X-axis moving part (first moving part) 62A; an X-axis moving part (fourth moving part) 62B; an X-axis moving part (third moving part) 62C; Z-axis moving parts 63, 64, and 68; and mounting parts 65, 66, 67A, 67B, 67C, and 69. A pair of Y-axis moving parts 61 are arranged opposite to each other in the X direction and extend along the Y direction (generally parallel). The X-axis moving part 62A extends along the X direction and is mounted at both ends in the X direction via mounting parts 67A on a track provided on the Y-axis moving part 61. That is, the X-axis moving part 62A is supported by a pair of Y-axis moving parts 61. Therefore, the X-axis moving part 62A can move along the Y direction via the Y-axis moving parts 61. In other words, the Y-axis moving part 61 has the function of moving the X-axis moving part 62A in the Y direction.

[0042] The Z-axis moving part 63 extends along the Z direction and is mounted on a track provided on the X-axis moving part 62A. Thus, the Z-axis moving part 63 can move along the X direction via the X-axis moving part 62A. A laser processing head 10A is mounted on the Z-axis moving part 63 via a mounting part 65. Therefore, the X-axis moving part 62A has the function of moving the entire Z-axis moving part 63 together with the laser processing head 10A along the X direction. The laser processing head 10A is mounted on a track provided on the Z-axis moving part 63 via the mounting part 65. Thus, the laser processing head 10A can move along the Z direction via the Z-axis moving part 63. That is, the Z-axis moving part 63 has the function of moving the laser processing head 10A along the Z direction. In this way, the moving mechanism 6 holds the laser processing head 10A so that it can move three-dimensionally along the X, Y, and Z directions.

[0043] The X-axis moving part 62B extends along the X direction and is mounted on a track provided on the Y-axis moving part 61 via mounting parts 67B at both ends in the X direction. That is, the X-axis moving part 62B is supported by a pair of Y-axis moving parts 61. Therefore, the X-axis moving part 62B can move along the Y direction via the Y-axis moving parts 61. In other words, the Y-axis moving parts 61 have the function of moving the X-axis moving part 62B in the Y direction.

[0044] The Z-axis moving part 64 extends along the Z direction and is mounted on a track provided on the X-axis moving part 62B. Thus, the Z-axis moving part 64 can move along the X direction via the X-axis moving part 62B. A laser processing head 10B is mounted on the Z-axis moving part 64 via a mounting part 66. Therefore, the X-axis moving part 62B has the function of moving the entire Z-axis moving part 64 together with the laser processing head 10B along the X direction. The laser processing head 10B is mounted on a track provided on the Z-axis moving part 64 via the mounting part 66. Thus, the laser processing head 10B can move along the Z direction via the Z-axis moving part 64. That is, the Z-axis moving part 64 has the function of moving the laser processing head 10A along the Z direction. In this way, the moving mechanism 6 holds the laser processing head 10B so that it can move three-dimensionally along the X, Y, and Z directions.

[0045] The X-axis moving part 62C extends along the X direction and is mounted on a track provided on the Y-axis moving part 61 via mounting parts 67C at both ends in the X direction. That is, the X-axis moving part 62C is supported by a pair of Y-axis moving parts 61. Therefore, the X-axis moving part 62C can move along the Y direction via the Y-axis moving parts 61. In other words, the Y-axis moving parts 61 have the function of moving the X-axis moving part 62C in the Y direction.

[0046] The Z-axis moving part 68 extends along the Z direction and is mounted on a track provided on the X-axis moving part 62C. Thus, the Z-axis moving part 68 can move along the X direction via the X-axis moving part 62C. A camera unit 10C is mounted on the Z-axis moving part 68 via a mounting part 69. Therefore, the X-axis moving part 62C has the function of moving the entire Z-axis moving part 68 together with the camera unit 10C along the X direction. The camera unit 10C is mounted on a track provided on the Z-axis moving part 68 via the mounting part 69. Thus, the camera unit 10C can move along the Z direction via the Z-axis moving part 68. That is, the Z-axis moving part 68 has the function of moving the camera unit 10C along the Z direction. In this way, the moving mechanism 6 holds the camera unit 10C so that it can move in three dimensions along the X, Y, and Z directions.

[0047] Here, the X-axis moving parts 62A, 62B, and 62C are arranged sequentially along the Y direction. Therefore, when viewed from the Z direction, the laser processing head 10A, laser processing head 10B, and camera unit 10C are also arranged sequentially along the Y direction. Thus, in the laser processing apparatus 1, the camera unit 10C is not positioned in the middle, and is moved in the Y direction to bring the laser processing head 10A and laser processing head 10B closer to each other.

[0048] As described above, the support part 7 is mounted on the rotation axis of the mounting part 55 provided in the moving mechanism 5, and can rotate about an axis parallel to the Z direction as its center line. That is, the support part 7 can move along the X and Y directions respectively, and can rotate about an axis parallel to the Z direction as its center line. The support part 7 is used to support the object 100 along the X and Y directions. The object 100 is, for example, a wafer.

[0049] When the laser processing head 10A is facing the support portion 7 in the Z direction, it irradiates the object 100 supported on the support portion 7 with laser L1. When the laser processing head 10B is facing the support portion 7 in the Z direction, it irradiates the object 100 supported on the support portion 7 with laser L2.

[0050] The camera unit 10C includes a pair of cameras AC. The pair of cameras AC have different magnifications and, in a Z-direction orientation opposite to the support 7, capture images of the object 100 supported on the support 7. For example, the cameras AC can use light transmitted through the object 100 to capture images of the device pattern, modified regions, and the formation of cracks extending from the modified regions of the object 100. The images obtained by the cameras AC are then used for aligning the lasers L1 and L2 at the irradiation positions of the object 100 and adjusting the irradiation conditions of the lasers L1 and L2.

[0051] The light source unit 8 has a pair of light sources 81 and 82. Light source 81 outputs laser L1. Laser L1 is emitted from the emission section 81a of light source 81 and guided to laser processing head 10A via optical fiber 2. That is, optical fiber 2 for guiding the laser L1 output from light source 81 is connected to laser processing head 10A. Light source 82 outputs laser L2. Laser L2 is emitted from the emission section 82a of light source 82 and guided to laser processing head 10B via other optical fibers 2. That is, optical fiber 2 for guiding the laser L2 output from light source 82 is connected to laser processing head 10B.

[0052] The control unit 9 controls various parts of the laser processing apparatus 1 (multiple moving mechanisms 5, 6, laser processing heads 10A, 10B, camera unit 10C, and light source unit 8, etc.). The control unit 9 is configured as a computer device including a processor, memory, storage, and communication devices. In the control unit 9, software (programs) loaded into the memory are executed by the processor, and the reading and writing of data in the memory and storage, as well as communication via the communication devices, are controlled by the processor. Thus, the control unit 9 can achieve various functions.

[0053] This section describes an example of processing performed using the laser processing apparatus 1 configured as described above. This example involves cutting a wafer 100 into multiple chips and forming modified regions within the wafer 100 along multiple lines arranged in a lattice pattern.

[0054] First, the moving mechanism 5 moves the support 7 along the X and Y directions respectively, so that the support 7 supporting the object 100 is opposite to the pair of laser processing heads 10A and 10B in the Z direction. Next, the moving mechanism 5 rotates the support 7 about an axis parallel to the Z direction as its center line, so that multiple lines extending in one direction on the object 100 are aligned along the X direction. Thus, multiple lines extending along the X direction and arranged along the Y direction are provided on the object 100 (e.g., ...). Figure 1 Line C is shown.

[0055] Then, the moving mechanism 6 moves the laser processing head 10A along the Y direction, so that the focusing point of laser L1 is located on a line extending in one direction. Additionally, to position the focusing point of laser L2 on another line extending in one direction, the moving mechanism 6 moves the laser processing head 10B along the Y direction. Then, the moving mechanism 6 moves the laser processing head 10A along the Z direction, so that the focusing point of laser L1 is located inside the object 100. Additionally, the moving mechanism 6 moves the laser processing head 10B along the Z direction, so that the focusing point of laser L2 is located inside the object 100.

[0056] Next, light source 81 outputs laser L1, and laser processing head 10A irradiates object 100 with laser L1; light source 82 outputs laser L2, and laser processing head 10B irradiates object 100 with laser L2. Simultaneously, moving mechanism 5 moves support 7 along the X direction, and moving mechanism 6 moves laser processing heads 10A and 10B along the X direction in the opposite direction to support 7. This causes the focusing point of laser L1 to move relative to each other along a line extending in one direction (laser L1 is scanned), and the focusing point of laser L2 to move relative to each other along other lines extending in one direction (laser L2 is scanned). Thus, the laser processing apparatus 1 forms a modified region within object 100, at least within object 100, along multiple lines extending in one direction.

[0057] Next, the moving mechanism 5 rotates the support 7 about an axis parallel to the Z direction as its centerline, causing multiple lines extending on the object 100 in another direction orthogonal to one direction to follow the X direction. Thus, on the object 100, multiple other lines (such as...) extending along the X direction and arranged along the Y direction are provided. Figure 1 Line C is shown.

[0058] Then, the moving mechanism 6 moves the laser processing head 10A along the Y direction, so that the focusing point of laser L1 is located on a line extending in the opposite direction. Additionally, to position the focusing point of laser L2 on another line extending in the opposite direction, the moving mechanism 6 moves the laser processing head 10B along the Y direction. Then, the moving mechanism 6 moves the laser processing head 10A along the Z direction, so that the focusing point of laser L1 is located inside the object 100. Additionally, the moving mechanism 6 moves the laser processing head 10B along the Z direction, so that the focusing point of laser L2 is located inside the object 100.

[0059] Next, light source 81 outputs laser L1, and laser processing head 10A irradiates object 100 with laser L1; light source 82 outputs laser L2, and laser processing head 10B irradiates object 100 with laser L2. Simultaneously, moving mechanism 5 moves support 7 along the X direction, and moving mechanism 6 moves laser processing heads 10A and 10B along the X direction in the opposite direction to support 7. This causes the focusing point of laser L1 to move relative to each other along a line extending in the opposite direction (laser L1 is scanned), and the focusing point of laser L2 to move relative to each other along other lines extending in the opposite direction (laser L2 is scanned). Thus, the laser processing apparatus 1 forms a modified region within object 100, at least within object 100, along multiple lines extending in a direction orthogonal to one direction.

[0060] Furthermore, in one example of the aforementioned processing, light source 81 outputs a transmissive laser L1 to the object 100 via, for example, pulse oscillation, and light source 82 outputs a transmissive laser L2 to the object 100 via, for example, pulse oscillation. If such laser light is focused inside the object 100, then in the portion corresponding to the laser's focusing point, particularly where the laser is absorbed, a modified region is formed inside the object 100. The modified region's density, refractive index, mechanical strength, and other physical properties differ from the surrounding unmodified region. Modified regions may include, for example, melt-processed regions, cracked regions, insulation-damaged regions, and regions with refractive index changes.

[0061] When a laser output via pulse oscillation is applied to an object 100, and the laser's focusing point moves relative to the object 100 along a line set on the object 100, multiple modified particles are formed and arranged in a row along the line. Each modified particle is formed by the irradiation of a single laser pulse. A row of modified regions is a collection of multiple modified particles arranged in a row. The relative movement speed of adjacent modified particles relative to the object 100 via the laser's focusing point and the laser's repetition frequency exist even when they are connected or separated.

[0062] [Structure of the laser processing head]

[0063] Next, the structure of the laser processing head will be explained in detail. For example... Figure 3 and Figure 4 As shown, the laser processing head 10A includes a frame 11, an incident section 12, a laser adjustment section 13, and a focusing section 14. The frame 11 has a first wall portion 21 and a second wall portion 22, a third wall portion 23 and a fourth wall portion 24, and a fifth wall portion 25 and a sixth wall portion 26. The first wall portion 21 and the second wall portion 22 are opposite to each other in the X direction. The third wall portion 23 and the fourth wall portion 24 are opposite to each other in the Y direction. The fifth wall portion 25 and the sixth wall portion 26 are opposite to each other in the Z direction.

[0064] The distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22. The distance between the first wall portion 21 and the second wall portion 22 is smaller than the distance between the fifth wall portion 25 and the sixth wall portion 26. Furthermore, the distance between the first wall portion 21 and the second wall portion 22 may be equal to or greater than the distance between the fifth wall portion 25 and the sixth wall portion 26.

[0065] In the laser processing head 10A, the first wall portion 21 is located on the opposite side of the Y-axis moving portion 61 of the moving mechanism 6, and the second wall portion 22 is located on the Y-axis moving portion 61 side. The third wall portion 23 is located on the mounting portion 65 side of the moving mechanism 6, and the fourth wall portion 24 is located on the opposite side of the mounting portion 65, i.e., on the laser processing head 10B side (see reference). Figure 2 That is, the fourth wall portion 24 is a opposing wall portion that is opposite to the frame (second frame) of the laser processing head 10B along the Y direction. The fifth wall portion 25 is located on the opposite side of the support portion 7, and the sixth wall portion 26 is located on the side of the support portion 7.

[0066] With the third wall portion 23 positioned on the mounting portion 65 side of the moving mechanism 6, the frame 11 is mounted on the mounting portion 65. Specifically, as described below, the mounting portion 65 has a base plate 65a and a mounting plate 65b. The base plate 65a is mounted on a track provided on the Z-axis moving portion 63 (see reference). Figure 2 Mounting plate 65b is erected at the end of the base plate 65a on the side of the laser processing head 10B (see reference). Figure 2 With the frame 11 in contact with the mounting plate 65b at the third wall portion 23, bolts 28 are screwed onto the mounting plate 65b via the base 27, thereby mounting it onto the mounting portion 65. The base 27 is provided at the first wall portion 21 and the second wall portion 22 respectively. The frame 11 can be attached to and detached from the mounting portion 65.

[0067] The incident portion 12 is mounted on the fifth wall portion 25. The incident portion 12 directs laser L1 into the frame 11. The incident portion 12 is offset towards the first wall portion 21 in the X direction and towards the fourth wall portion 24 in the Y direction. That is, the distance between the incident portion 12 and the first wall portion 21 in the X direction is smaller than the distance between the incident portion 12 and the second wall portion 22 in the X direction, and the distance between the incident portion 12 and the fourth wall portion 24 in the Y direction is smaller than the distance between the incident portion 12 and the third wall portion 23 in the X direction.

[0068] The incident portion 12 is connected to the exiting end 2a of the optical fiber 2. Specifically, the incident portion 12 includes a hole 25a formed in the fifth wall portion 25. A mounting portion 25b is provided in the fifth wall portion 25. The body portion 2b of the exiting end 2a is mounted to the mounting portion 25b by bolts or the like. In this state, the front end portion 2c of the exiting end 2a is inserted into the hole 25a. Thus, the exiting end 2a of the optical fiber 2 can be attached to and detached from the incident portion 12. A cover 25c is disposed between the fifth wall portion 25 and the body portion 2b. The cover 25c covers the gap formed between the hole 25a and the front end portion 2c. As an example, in the exiting end 2a, an isolator that suppresses returning light is disposed within the body portion 2b, and a collimating lens that collimates the laser L1 is disposed within the front end portion 2c. Furthermore, the incident portion 12 may also be a connector that can be connected to the exiting end 2a of the optical fiber 2.

[0069] A laser adjustment unit 13 is disposed within a frame 11. The laser adjustment unit 13 is used to adjust the laser L1 incident from the incident section 12. Within the frame 11, the laser adjustment unit 13 is disposed on the side of the fourth wall 24, opposite to the partition wall 29. The laser adjustment unit 13 is mounted on the partition wall 29. The partition wall 29 is provided within the frame 11, dividing the area within the frame 11 into an area on the side of the third wall 23 and an area on the side of the fourth wall 24. The partition wall 29 is constituted as part of the frame 11. The various structures of the laser adjustment unit 13 are mounted on the partition wall 29 on the side of the fourth wall 24. The partition wall 29 functions as an optical base supporting the various structures of the laser adjustment unit 13.

[0070] A focusing section 14 is mounted on the sixth wall portion 26. Specifically, the focusing section 14 is disposed on the sixth wall portion 26 with its insertion through the hole 26a formed therein. The focusing section 14 focuses the laser L1, which is adjusted by the laser adjustment section 13, and emits it outward toward the frame 11. The focusing section 14 is offset toward the second wall portion 22 in the X direction and toward the fourth wall portion 24 in the Y direction. That is, the distance between the focusing section 14 and the second wall portion 22 in the X direction is smaller than the distance between the focusing section 14 and the first wall portion 21 in the X direction, and the distance between the focusing section 14 and the fourth wall portion 24 in the Y direction is smaller than the distance between the focusing section 14 and the third wall portion 23 in the X direction.

[0071] like Figure 5 As shown, the laser adjustment unit 13 includes a reflecting part (first reflecting part) 31, an attenuator 32, and an optical axis adjustment unit 33. The reflecting part 31, the attenuator 32, and the optical axis adjustment unit 33 are arranged on a first straight line A1 extending along the X direction. The reflecting part 31 is opposite to the incident part 12 in the Z direction. That is, the reflecting part 31 is opposite to the emitting end 2a of the optical fiber 2 in the Z direction. The reflecting part 31 is used to reflect the laser L1 incident from the incident part 12 toward the second wall 22 side. The reflecting part 31 is, for example, a mirror or a prism. The attenuator 32 is used to adjust the output of the laser L1 reflected by the reflecting part 31. The optical axis adjustment unit 33 reflects the laser L1 after its output is adjusted by the attenuator 32 toward the sixth wall 26 side.

[0072] The optical axis adjustment unit 33 is used to adjust the optical axis of the laser L1 incident from the incident unit 12. In this embodiment, the optical axis adjustment unit 33 includes a first steering mirror 331, a reflecting member 332, and a second steering mirror 333.

[0073] The first steering mirror 331 is disposed on the first straight line A1. The first steering mirror 331 is constituted by a reflector 331a and a base 331b. The reflector 331a is mounted on the base 331b. The base 331b is mounted on the partition wall 29. The base 331b holds the reflector 331a in a manner that allows the direction of the reflector 331a to be adjusted. The first steering mirror 331 reflects the laser L1, after its output is adjusted by the attenuator 32, toward the sixth wall 26.

[0074] The reflecting member 332 reflects the laser L1 reflected by the first turning mirror 331 toward the second wall portion 22. The reflecting member 332 is, for example, a mirror or a prism.

[0075] The second steering mirror 333 is disposed on the second straight line A2. The second steering mirror 333 is constructed by a reflector 333a and a base 333b. The reflector 333a is mounted on the base 333b. The base 333b is mounted on the partition wall 29. The base 333b holds the reflector 333a in a manner that allows adjustment of the direction of the reflector 333a. The second steering mirror 333 reflects the laser L1 reflected by the reflecting member 332 toward the sixth wall 26.

[0076] As an example, the bases 331b and 333b can be connected via a tool with a cover-shaped opening (not shown) formed in the second wall portion 22. Thus, by operating the tool while observing the image obtained by the observation unit 17 (described later), the orientation of each reflector 331a and 333a can be adjusted so that the optical axis of the laser L1 incident on the focusing unit 14 is aligned with the optical axis of the focusing unit 14.

[0077] The laser adjustment unit 13 also includes a beam expander 34 and a reflector (second reflector) 35. The optical axis adjustment unit 33, the beam expander 34, and the reflector 35 are arranged on a second straight line A2 extending along the Z direction. The beam expander 34 enlarges the diameter of the laser L1 reflected by the optical axis adjustment unit 33. The reflector 35 is used to reflect the laser L1, whose diameter has been enlarged by the beam expander 34, toward the first wall portion 21 and the fifth wall portion 25. The reflector 35 is, for example, a mirror or a prism.

[0078] The laser adjustment unit 13 also includes a reflective spatial light modulator 36 and an imaging optical system 37. The reflective spatial light modulator 36, the imaging optical system 37, and the focusing unit 14 are arranged on a third straight line A3 extending along the Z direction. The reflective spatial light modulator 36 modulates the laser L1 reflected by the reflective unit 35 and reflects it toward the sixth wall 26. The reflective spatial light modulator 36 is, for example, a spatial light modulator (SLM) of reflective liquid crystal on silicon (LCOS). The imaging optical system 37 constitutes a bilateral telecentric optical system in which the reflecting surface 36a of the reflective spatial light modulator 36 and the entrance pupil surface 14a of the focusing unit 14 are in imaging relationship. The imaging optical system 37 is composed of three or more lenses.

[0079] The first straight line A1, the second straight line A2, and the third straight line A3 are located on a plane perpendicular to the Y direction. The second straight line A2 is located on the side of the second wall portion 22 relative to the third straight line A3. In the laser processing head 10A, the laser L1, which enters the frame 11 from the incident portion 12 along the Z direction, is reflected by the reflecting portion 31 and travels along the first straight line A1. The laser L1 traveling along the first straight line A1 is reflected by the optical axis adjustment portion 33, so that it travels along the second straight line A2. The laser L1 traveling along the second straight line A2 is reflected sequentially by the reflecting portion 35 and the reflective spatial light modulator 36, so that it travels along the third straight line A3. The laser L1 traveling along the third straight line A3 is emitted from the focusing portion 14 out of the frame 11 along the Z direction.

[0080] The laser processing head 10A also includes a beam splitter 15, a measuring unit 16, an observation unit 17, a driving unit 18, and a circuit unit 19.

[0081] Beam splitter 15 is disposed on the third straight line A3, between imaging optical system 37 and focusing section 14. That is, beam splitter 15 is disposed within frame 11, between laser adjustment section 13 and focusing section 14. Beam splitter 15 is mounted on partition wall section 29 on the fourth wall section 24 side. Beam splitter 15 allows laser L1 to pass through. From the viewpoint of suppressing astigmatism, beam splitter 15 can be, for example, cubic in shape, or it can be a two-plate type configured with a twisted relationship.

[0082] The measuring unit 16 is located within the frame 11, positioned on the side of the first wall portion 21, opposite to the third straight line A3. That is, the measuring unit 16 is positioned on the side of the first wall portion 21, opposite to the focusing unit 14 in the X direction. The measuring unit 16 is mounted on the partition wall portion 29 on the side of the fourth wall portion 24. The measuring unit 16 outputs measuring light L10 to measure the distance between the surface of the object 100 (e.g., the surface on the side where laser L1 is incident) and the focusing unit 14. The measuring light L10 reflected by the surface of the object 100 is detected via the focusing unit 14. In other words, the measuring light L10 output from the measuring unit 16 is irradiated onto the surface of the object 100 via the focusing unit 14, and the measuring light L10 reflected by the surface of the object 100 is detected by the measuring unit 16 via the focusing unit 14.

[0083] More specifically, the measurement light L10 output from the measurement unit 16 is reflected sequentially by the beam splitter 20 and the beam splitter 15 mounted on the partition wall 29 on the fourth wall 24 side, and then exits from the focusing unit 14 to the outside of the frame 11. The measurement light L10 reflected by the surface of the object 100 enters the frame 11 from the focusing unit 14, is then reflected sequentially by the beam splitter 15 and the beam splitter 20, and then enters the measurement unit 16 for detection.

[0084] The observation unit 17 is located within the frame 11, positioned on the side of the first wall portion 21, opposite to the third straight line A3. That is, the observation unit 17 is positioned on the side of the first wall portion 21, opposite to the focusing unit 14 in the X direction. The observation unit 17 is mounted on the partition wall portion 29 on the side of the fourth wall portion 24. The observation unit 17 outputs observation light L20 for observing the surface of the object 100 (e.g., the surface on the side where laser L1 is incident), and detects the measurement light L20 reflected by the surface of the object 100 via the focusing unit 14. In other words, the observation light L20 output from the observation unit 17 is irradiated onto the surface of the object 100 via the focusing unit 14, and the observation light L20 reflected by the surface of the object 100 is detected by the observation unit 17 via the focusing unit 14.

[0085] More specifically, the observation light L20 output from the observation unit 17 is reflected by the beam splitter 15 after passing through the beam splitter 20, and then exits from the focusing unit 14 to the outside of the frame 11. The observation light L20 reflected by the surface of the object 100 enters the frame 11 from the focusing unit 14, is reflected by the beam splitter 15, and then enters the observation unit 17 through the beam splitter 20 for detection. Furthermore, the wavelengths of the laser L1, the measuring light L10, and the observation light L20 are different from each other (at least their center wavelengths are offset from each other).

[0086] The drive unit 18 is mounted on the partition wall 29 on the side of the fourth wall 24. The drive unit 18 moves the focusing part 14 disposed on the sixth wall 26 along the Z direction by driving force, for example, a piezoelectric element.

[0087] The circuit section 19 is located within the frame 11, positioned on the side of the third wall 23 opposite to the partition wall 29. Specifically, the circuit section 19 is located within the frame 11 on the side of the third wall 23 opposite to the laser adjustment section 13, the measurement section 16, and the observation section 17. The circuit section 19 is separated from the partition wall 29. The circuit section 19 can be, for example, multiple circuit boards. The circuit section 19 processes signals output from the measurement section 16 and signals input to the reflective spatial light modulator 36. The circuit section 19 controls the drive section 18 based on the signals output from the measurement section 16. As an example, the circuit section 19 controls the drive section 18 based on the signals output from the measurement section 16 to maintain a constant distance between the surface of the object 100 and the focusing section 14 (i.e., the distance between the surface of the object 100 and the focusing point of the laser L1 is maintained constant).

[0088] Furthermore, the partition wall 29 has notches and holes (not shown) for wiring to pass through, allowing electrical connections between the respective measuring unit 16, observing unit 17, driving unit 18, and reflective spatial light modulator 36 and the circuit unit 19. Additionally, the frame 11 is provided with a connection for the control unit 9 of the circuit unit 19 (see reference). Figure 1 Connectors (not shown) for electrical wiring, etc.

[0089] Like the laser processing head 10A, the laser processing head 10B includes a frame 11, an incident section 12, a laser adjustment section 13, a focusing section 14, a beam splitter 15, a measuring section 16, an observation section 17, a driving section 18, and a circuit section 19. However, the structures of the laser processing head 10B are as follows: Figure 2 As shown, a virtual plane passing through the center point between a pair of mounting parts 65 and 66 and perpendicular to the Y direction is configured to have a face-symmetric relationship with each structure of the laser processing head 10A.

[0090] For example, the frame 11 of the laser processing head 10A is mounted on the mounting portion 65 with the fourth wall portion 24 and the third wall portion 23 located on the side of the laser processing head 10B, and the sixth wall portion 26 and the fifth wall portion 25 located on the side of the support portion 7. In contrast, the frame 11 of the laser processing head 10B is mounted on the mounting portion 66 with the fourth wall portion 24 and the third wall portion 23 located on the side of the laser processing head 10A, and the sixth wall portion 26 and the fifth wall portion 25 located on the side of the support portion 7.

[0091] The frame 11 of the laser processing head 10B is configured such that, with the third wall portion 23 positioned on the mounting portion 66 side, the frame 11 is mounted on the mounting portion 66. Specifically, as described below, the mounting portion 66 has a base plate 66a and a mounting plate 66b. The base plate 66a is mounted on a track provided on the Z-axis moving portion 63. The mounting plate 66b is erected at the end of the base plate 66a on the laser processing head 10A side. The frame 11 of the laser processing head 10B is mounted on the mounting portion 66 with the third wall portion 23 in contact with the mounting plate 66b. The frame 11 of the laser processing head 10B can be attached to and detached from the mounting portion 66.

[0092] [The function and effects of laser processing heads]

[0093] In the laser processing head 10A, an optical axis adjustment section 33 is provided on the optical path of the laser L1 from the incident section 12 to the focusing section 14 for adjusting the optical axis of the laser L1 incident from the incident section 12. Therefore, for example, when the emitting end 2a of the optical fiber 2 is removed from the frame 11 for maintenance or other purposes, and then reconnected to the incident section 12, the optical axis of the laser L1 incident on the focusing section 14 can be aligned with the optical axis of the focusing section 14. Furthermore, the incident section 12 is offset in the X direction towards the first wall portion 21 of the frame 11, and the focusing section 14 is offset in the X direction towards the second wall portion 22 of the frame 11. This suppresses the lengthening of the optical path of the laser L1 from the incident section 12 to the optical axis adjustment section 33, and consequently, it suppresses the offset of the optical axis of the laser L1 incident on the focusing section 14 from the optical axis of the focusing section 14. Therefore, if the laser processing head 10A is used, the laser L1 can be focused with good precision.

[0094] Furthermore, in the laser processing head 10A, the incident portion 12 is disposed on the fifth wall portion 25 of the frame 11, and in the laser adjustment portion 13, the optical axis adjustment portion 33 is disposed at the rear section (downstream side of the travel direction of the laser L1) of the reflector 31 and the attenuator 32, and at the front section (upstream side of the travel direction of the laser L1) of the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system 37. Therefore, since the optical axis of the laser L1 incident on the structure [beam expander 34, reflector 35, reflective spatial light modulator 36, imaging optical system 37, and focusing portion 14] that shapes the laser L1 can be adjusted, the laser L1 can be focused more accurately. Furthermore, the incident portion 12 is disposed on the fifth wall portion 25, and the attenuator 32 is disposed between the reflecting portion 31 and the optical axis adjusting portion 33 in the laser adjustment portion 13. Thus, the frame 11 can be enlarged due to the application of the attenuator 32.

[0095] Furthermore, in the laser processing head 10A, since the light source for outputting the laser L1 is not located within the frame 11, the frame 11 can be miniaturized. Moreover, in the frame 11, the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, and the focusing portion 14 disposed on the sixth wall portion 26 is offset towards the fourth wall portion 24 in the Y direction. Therefore, when the frame 11 is moved along the Y direction opposite to the third wall portion 23 and the fourth wall portion 24, even if other components (such as the laser processing head 10B) are present on the fourth wall portion 24 side, the focusing portion 14 can be brought closer to those other components. Furthermore, since the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, the space occupied by the frame 11 can be reduced when the frame 11 is moved along the Y direction, which is opposite to the third wall portion 23 and the fourth wall portion 24. Moreover, since the incident portion 12 and the focusing portion 14 are offset towards the fourth wall portion 24 in the Y direction, other components (such as the circuit portion 19) can be arranged in the area of ​​the laser adjustment portion 13 closer to the third wall portion 23 within the frame 11, and this area can be utilized effectively.

[0096] Furthermore, in the laser processing head 10A, the circuit section 19 is located within the frame 11, and the laser adjustment section 13 is disposed on the side of the third wall section 23. This allows for efficient utilization of the area within the frame 11 where the laser adjustment section 13 is located closer to the third wall section 23.

[0097] Furthermore, in the laser processing head 10A, the laser adjustment section 13 is located within the frame 11, with the partition wall 29 disposed on the side of the fourth wall 24, and the circuit section 19 is located within the frame 11, with the partition wall 29 disposed on the side of the third wall 23. Therefore, since the heat generated in the circuit section 19 is less likely to propagate to the laser adjustment section 13, strain in the laser adjustment section 13 caused by the heat generated in the circuit section 19 can be suppressed, and the laser L1 can be accurately adjusted. Moreover, by means of, air cooling or water cooling, the circuit section 19 can be efficiently cooled in the region within the frame 11 near the third wall 23.

[0098] Furthermore, in the laser processing head 10A, the laser adjustment section 13 is mounted on the partition wall section 29. Thus, the laser adjustment section 13 can be reliably and stably supported within the frame 11.

[0099] Furthermore, in the laser processing head 10A, the circuit section 19 is separated from the partition wall section 29. This allows for more reliable suppression of heat generated in the circuit section 19 from propagating to the laser adjustment section 13 via the partition wall section 29.

[0100] Furthermore, in the laser processing head 10A, the measuring unit 16 and the observing unit 17 are located in the region of the frame 11 near the first wall 21 of the focusing unit 14. The circuit unit 19 is located in the region of the frame 11 near the third wall 23 of the laser adjustment unit 13. The beam splitter 15 is located in the frame 11 between the laser adjustment unit 13 and the focusing unit 14. Thus, the region within the frame 11 can be utilized effectively. Moreover, in the laser processing apparatus 1, processing can be performed based on the measurement results of the distance between the surface of the object 100 and the focusing unit 14. Furthermore, in the laser processing apparatus 1, processing can be performed based on the observation results of the surface of the object 100.

[0101] Furthermore, in the laser processing head 10A, the circuit unit 19 controls the drive unit 18 based on the signal output by the self-measurement unit 16. Thus, the position of the focusing point of the laser L1 can be adjusted based on the measurement results of the distance between the surface of the object 100 and the focusing unit 14.

[0102] The same effects and functions can be achieved using the laser processing head 10B.

[0103] Furthermore, in the laser processing apparatus 1, since the laser L1 is well focused by the laser processing heads 10A and 10B, the object 100 can be processed efficiently and with good precision.

[0104] Furthermore, in the laser processing apparatus 1, a pair of mounting parts 65 and 66 can move along the Y and Z directions, respectively. This allows for more efficient processing of the object 100.

[0105] Furthermore, in the laser processing apparatus 1, the support 7 can move along the X and Y directions respectively, and rotate around an axis parallel to the Z direction as its centerline. This allows for more efficient processing of the object 100.

[0106] [Example of a modified laser processing head]

[0107] It is also possible to Figure 6 As shown, the incident part 12 is disposed on the first wall part 21 of the frame 11, and the laser adjustment part 13 and the optical axis adjustment part 33 are disposed at the rear section of the attenuator 32 and at the front section of the beam expander 34, the reflector 35, the reflective spatial light modulator 36 and the imaging optical system 37. Figure 6 The laser processing head 10A shown has an incident section 12, an attenuator 32, and an optical axis adjustment section 33 (specifically, the first steering mirror 331 of the optical axis adjustment section 33) arranged on the first straight line A1 (other structures are the same as those shown). Figure 5 (The laser processing head 10A shown is the same). In such... Figure 6The laser processing head 10A shown includes an attenuator 32 for adjusting the output of the laser L1 incident from the incident section 12. Therefore, since the optical axis of the laser L1 incident on the structure [beam expander 34, reflector 35, reflective spatial light modulator 36, imaging optics system 37, and focusing section 14] that shapes the laser L1 can be adjusted, the laser L1 can be focused more precisely. Furthermore, since the attenuator 32 is positioned between the incident section 12 and the optical axis adjustment section 33, the frame 11 can be enlarged due to the application of the attenuator 32. Moreover, miniaturization of the laser processing apparatus 1 is possible. The above structure can also be applied to the laser processing head 10B.

[0108] In addition, the laser processing head 10A can also be used as follows: Figure 7 As shown, the incident part 12 is disposed on the fifth wall portion 25 of the frame 11, and the laser adjustment part 13 and the optical axis adjustment part 33 are disposed in front of the attenuator 32, the reflector 31, the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system 37. Figure 7 The laser processing head 10A shown has an optical axis adjustment section 33 (specifically, the second steering mirror 333 of the optical axis adjustment section 33), an attenuator 32, and a reflector 31 arranged on the first straight line A1. The optical axis adjustment section 33 (specifically, the first steering mirror 331 of the optical axis adjustment section 33) is opposite to the incident section 12 in the Z direction, and the reflector 31 is opposite to the beam expander 34 in the Z direction (other structures are the same as those shown). Figure 5 (The laser processing head 10A shown is the same). In such... Figure 7 In the laser processing head 10A shown, the optical axis adjustment section 33 reflects the laser L1 incident from the incident section 12 toward the second wall portion 22 of the frame 11. The attenuator 32 adjusts the output of the laser L1 reflected by the optical axis adjustment section 33. The reflecting section 31 reflects the laser L1, after its output is adjusted by the attenuator 32, toward the sixth wall portion 26 of the frame 11. The beam expander 34 enlarges the diameter of the laser L1 reflected by the reflecting section 31. Therefore, since the optical axis of the laser L1 incident on the structure [beam expander 34, reflecting section 35, reflective spatial light modulator 36, imaging optical system 37, and focusing section 14] that shapes the laser L1 can be adjusted, the laser L1 can be focused more accurately. Furthermore, since the attenuator 32 is disposed between the optical axis adjustment section 33 and the reflecting section 31, the frame 11 can be enlarged due to the application of the attenuator 32. The above structure can also be applied to the laser processing head 10B.

[0109] In addition, Figure 5 and Figure 6 In each of the laser processing heads 10A shown, the attenuator 32 can also be configured between the optical axis adjustment section 33 and the beam expander 34. Furthermore, in Figure 7The laser processing head 10A shown may also have an attenuator 32 positioned between the reflector 31 and the beam expander 34. Furthermore, in... Figure 5 , Figure 6 and Figure 7 In the respective laser processing head 10A, the attenuator 32 can also be configured at the rear end of the beam expander 34 (e.g., between the reflector 35 and the reflective spatial light modulator 36). The above-described structures can also be applied to the laser processing head 10B.

[0110] Furthermore, the optical axis adjustment unit 33 is not limited to having a first steering mirror 331, a reflecting member 332, and a second steering mirror 333. The optical axis adjustment unit 33 may simply have a structure for adjusting the optical axis of the laser L1 incident from the incident unit 12. As an example, the optical axis adjustment unit 33 may also have: a first steering mirror 331 that reflects the laser L1 incident from the first wall portion 21 side toward the first wall portion 21 side and toward the fifth wall portion 25 side along the X direction; and a second steering mirror 333 that reflects the laser L1 reflected by the first steering mirror 331 toward the sixth wall portion 26 side along the Z direction. In addition, the first steering mirror 331 and the second steering mirror 333 may be electrically operated reflectors. In this case, the first steering mirror 331 and the second steering mirror 333 may also be reflectors that automatically adjust the direction of each of the reflectors 331a and 333a according to the image obtained through the observation unit 17.

[0111] Furthermore, with the frame 11 configured such that at least one of the first wall portion 21, the second wall portion 22, the third wall portion 23, and the fifth wall portion 25 is disposed on the mounting portion 65 (or mounting portion 66) side of the laser processing apparatus 1, the frame 11 can be mounted on the mounting portion 65 (or mounting portion 66).

[0112] Furthermore, the circuit section 19 is not limited to processing signals output from the measurement section 16 and / or signals input to the reflective spatial light modulator 36; it is sufficient to process some signals in the laser processing head.

[0113] Alternatively, the light source unit 8 may have only one light source. In this case, the light source unit 8 is configured to emit a portion of the laser light output from the single light source from the emission section 81a and emit the remaining portion of the laser light from the emission section 82a.

[0114] [The operation of the laser processing equipment, etc.]

[0115] Next, the operation of the laser processing device 1 will be explained. Figure 8 A schematic top view showing the operation of a laser processing device. Figure 1 The following figures show a schematic internal view of the laser processing heads 10A and 10B. (As shown in the figures below...) Figure 1 , 8As shown, the object 100 is supported in the support part 7. Furthermore, the reference numeral S in the figure, such as the measuring part 16 and the observation part 17 described above, represents an optical system other than the optical system used to display the irradiation of lasers L1 and L2 for forming the modified region.

[0116] As described above, object 100 has multiple lines C extending along the X direction and arranged along the Y direction. Lines C are imaginary lines, but can also be actually drawn lines. Furthermore, object 100 also has multiple lines extending along the Y direction and arranged along the X direction, but their illustrations are omitted.

[0117] Under the control of the control unit 9, the laser processing apparatus 1 performs irradiation processing along each line C. During the irradiation processing, the control unit 9 controls at least the movement of the support 7 via the moving mechanism 5, the movement of the laser processing heads 10A and 10B via the moving mechanism 6, and the irradiation by lasers L1 and L2 from the laser processing heads 10A and 10B. In the laser processing apparatus 1, the control unit 9 executes a first process and a second process as the irradiation process (the irradiation process includes both the first and second processes).

[0118] The first process involves scanning one of the multiple lines C with laser L1 from laser processing head 10A in the X direction. The second process involves scanning the other lines C with laser L2 from laser processing head 10B in the X direction.

[0119] The control unit 9 moves the focusing points of lasers L1 and L2 in the X direction by the following actions: First, the laser processing heads 10A and 10B are moved in the Y and Z directions by the Y-axis moving part 61 and the Z-axis moving parts 63 and 64 of the moving mechanism 6, so that the focusing points of lasers L1 and L2 are located on their respective lines C and inside the object 100. Furthermore, in this state, the support part is moved in the X direction by the moving mechanism 5, and the laser processing heads 10A and 10B are moved in the opposite direction to the support part 7 in the X direction by the X-axis moving parts 62A and 62B, thereby moving the focusing points of lasers L1 and L2 in the X direction along line C within the object 100.

[0120] In particular, the control unit 9 performs the first and second processes repeatedly for at least a portion of the time. That is, the control unit 9 simultaneously achieves a state where laser L1 is scanned along one line C and a state where laser L2 is scanned along other lines C. In other words, the control unit 9 causes laser processing head 10A and laser processing head 10B to operate simultaneously. As a result, compared to processing using a single laser processing head, a significant increase in output can be achieved.

[0121] If the control unit 9 completes the scanning of lasers L1 and L2 along one line C, it independently moves the laser processing heads 10A and 10B in the Y direction (or the Z direction if necessary) by a distance equivalent to the interval of line C, and then continues to scan along the next line C (i.e., the first process and the second process). The control unit 9 forms the modified region M along all lines C by continuously performing this operation, based on approximately the number of lines C.

[0122] At this time, the control unit 9 sequentially performs the first process from the line C located at one end of the object 100 in the Y direction towards the line C inside in the Y direction. Simultaneously, the control unit 9 sequentially performs the second process (referred to as the main processing) from the line C located at the other end of the object 100 in the Y direction towards the line C inside in the Y direction. The line C located at one end in the Y direction and the line C located at the other end in the Y direction have the same length relative to the X direction.

[0123] To explain this in more detail: In the main machining process, firstly, the control unit 9 moves the laser processing head 10A in the Y and Z directions by controlling the Y-axis movement unit 61 and the Z-axis movement unit 63. This positions the focusing point of laser L1 on line C, located at one end of the object 100 in the Y direction, and within the object 100. Simultaneously, the control unit 9 moves the laser processing head 10B in the Y and Z directions by controlling the Y-axis movement unit 61 and the Z-axis movement unit 64. This positions the focusing point of laser L2 on line C, located at the other end of the object 100 in the Y direction, and within the object 100. At this time, the X-direction position of the focusing point of laser L1 coincides, for example, with the X-direction position of the focusing point of laser L2.

[0124] In this state, the control unit 9 moves the support 7 along the X direction by controlling the moving part 53 of the moving mechanism 5. Furthermore, in this state, the control unit 9 moves the laser processing head 10A along the X direction in the opposite direction to the support 7 via the X-axis moving part 62A. Moreover, in this state, the control unit 9 moves the laser processing head 10B along the X direction in the opposite direction to the support 7 via the X-axis moving part 62B. Thus, within the object 100, the focusing points of lasers L1 and L2 are moved along their respective lines C in the X direction.

[0125] That is, the control unit 9, when outputting lasers L1 and L2 from the laser processing heads 10A and 10B, controls the moving mechanisms 5 and 6 to move the support unit 7 and the laser processing heads 10A and 10B in opposite directions along the X direction, and then irradiates the object 100 with lasers L1 and L2 along their respective lines C (performs irradiation processing).

[0126] Specifically, the control unit 9, as the first process, controls the moving mechanisms 5 and 6 (X-axis moving unit 62A) to move the support unit 7 and the laser processing head 10A in opposite directions along the X direction. As the second process, at the same time point as the first process, it controls the moving mechanisms 5 and 6 (X-axis moving unit 62B) to move the support unit 7 and the laser processing head 10B in opposite directions along the X direction. Thus, the first and second processes for their respective lines C begin and end simultaneously. That is, the first and second processes are repeated in their entirety. Consequently, along line C, a modified region M is formed inside the object 100.

[0127] Furthermore, the relationship between the speed at which the support 7 moves along the X direction and the speed at which the laser processing heads 10A and 10B move along the X direction can be arbitrarily set by the control unit 9 within a range that the sum of the speeds reaches the target value of the speed at which the focusing point moves. For example, here, the control unit 9 sets the speed of the laser processing heads 10A and 10B along the X direction to be smaller than the speed of the support 7 along the X direction. Furthermore, the speeds of the laser processing heads 10A and 10B can be made the same when the lengths of the opposing lines C irradiated by lasers L1 and L2 are the same. However, for example, when the lengths of the lines C irradiated by laser L1 and L2 are different, the speeds of the laser processing heads 10A and 10B can be made different.

[0128] Next, the control unit 9 moves the laser processing head 10A in the Y and Z directions by controlling the Y-axis movement unit 61. This positions the focusing point of laser L1 on a line C inside the object 100, extending from one end in the Y direction, and thus within the object 100. Simultaneously, the control unit 9 moves the laser processing head 10B by controlling the Y-axis movement unit 61. This positions the focusing point of laser L2 on a line C inside the object 100, extending from the other end in the Y direction, and thus within the object 100. At this time, the X-direction position of the focusing point of laser L1 coincides, for example, with the X-direction position of the focusing point of laser L2.

[0129] In this state, the control unit 9 controls the moving mechanisms 5 and 6 to move the support unit 7 and the laser processing heads 10A and 10B in opposite directions along the X direction. This causes the focusing points of lasers L1 and L2 to move along their respective lines C in the X direction within the object 100. Consequently, the first and second processing steps for each line C begin and end simultaneously. That is, the first and second processing steps are essentially repeated. By repeatedly performing this operation of the control unit 9 until reaching the innermost line C of the object 100, the laser processing heads 10A and 10B can operate simultaneously to perform laser processing without waste.

[0130] Furthermore, in each figure, the modified region M is shown as a solid line for illustrative purposes; however, it is not actually necessary for the modified region M to be visible from the surface of the object 100.

[0131] Here, as Figure 9 As shown, during the repeated execution of the above actions, in a region further inside the object 100, the positional relationship between the laser processing heads 10A and 10B may become such that the distance between them in the Y direction cannot be further reduced (e.g., they are about to touch), and in the area of ​​the object 100 corresponding to the distance D between their respective focusing sections 14, unprocessed lines C may remain. In this case, as described above, it is not easy to perform the first process and the second process simultaneously. Therefore, in this case, the control unit 9 performs the following post-processing.

[0132] That is, such as Figure 10 As shown, when the laser processing head 10A and laser processing head 10B are closest to each other in the Y direction as a result of the main processing, and a portion of line C remains in the area between their respective focusing sections 14 on the object 100, the control unit 9 performs a post-processing process by causing the laser processing head 10A to avoid that area of ​​the object 100 while scanning the portion of line C in the X direction with the laser L2 from the laser processing head 10B (performing the second process). Furthermore, the laser processing heads 10A and 10B can also be reversed.

[0133] Thus, laser processing is completed for all lines C. Then, as needed, the lines intersecting with line C can be set along the X direction by rotating the support 7, and the above actions can be repeated.

[0134] [The Function and Effects of Laser Processing Equipment]

[0135] As explained above, in the laser processing apparatus 1, the support portion 7 for supporting the object 100 can be moved in the X direction via the moving mechanism 5, and the laser processing head 10A for irradiating the object 100 supported on the support portion 7 with laser L1 can be moved in both the X and Y directions via the moving mechanism 6. Therefore, in this laser processing apparatus 1, under the control of the control unit 9, an irradiation process (first process) can be performed where the support portion 7 and the laser processing head 10A move in opposite directions along the X direction while irradiating the object 100 with laser L1 along line C. Therefore, when irradiating with laser L1, the processing speed can be increased compared to the case where only the object 100 side (support portion 7) is moved.

[0136] In particular, in this laser processing apparatus 1, the camera AC used to photograph the object 100 is mounted on the Y-axis moving part 61 via a different component (X-axis moving part 62C) than the X-axis moving part 62A which is responsible for the X-direction movement of the laser processing head 10A. Therefore, during irradiation processing, it does not follow the camera AC, and only the laser processing head 10A (and the support part 7) can move along the X-direction. Thus, the movement speed of the laser processing head 10A along the X-direction can be further increased, and the processing speed can be reliably improved.

[0137] Furthermore, in this laser processing apparatus 1, as described above, by moving the support 7 and the laser processing head 10A in opposite directions during irradiation, the moving speed of the focusing point of the laser L1 towards the object 100 can be increased. In other words, the moving speed of the focusing point is shared by both the support 7 and the laser processing head 10A. Therefore, compared to the case where only one of the support 7 and the laser processing head 10A moves, the maximum value of their respective moving speeds can be suppressed. As a result, the acceleration and deceleration time and distance of the support 7 and the laser processing head 10A can be reduced.

[0138] Alternatively, in the laser processing apparatus 1, the moving mechanism 6 may include a pair of Y-axis moving parts 61 arranged opposite each other in the X direction, with the X-axis moving part 62A mounted and supported on the pair of Y-axis moving parts 61. In this case, the laser processing head 10A can be reliably supported.

[0139] Here, the weight of the laser processing head 10A is generally lighter than that of the support 7. Therefore, it is considered that when the focusing point is moved at the target moving speed, the laser processing head 10A will move faster than the support 7 (that is, the speed burden on the laser processing head 10A will be relatively increased).

[0140] In contrast, in this laser processing apparatus 1, the control unit 9 sets the speed of the laser processing head 10A along the X direction to be lower than the speed of the support unit 7 along the X direction during irradiation. Thus, when the laser processing head 10A is connected to an optical fiber 2 for guiding laser L1 from the light source 81, regardless of the weight relationship between the laser processing head 10A and the support unit 7, by relatively slowing down the laser processing head 10A (i.e., relatively reducing the speed burden on the laser processing head 10A), the optical fiber 2 can be protected.

[0141] Furthermore, the laser processing apparatus 1 also includes a laser processing head 10B, which is used to irradiate the object 100 supported on the support portion 7 with laser L2. The moving mechanism 6 includes an X-axis moving portion 62B, which extends along the X direction and is equipped with the laser processing head 10B, for moving the laser processing head 10B along the X direction. That is, the Y-axis moving portion 61 is equipped with the X-axis moving portion 62B and has the function of moving the X-axis moving portion 62B in the Y direction. In addition, during the irradiation process, the control unit 9 performs a first process and a second process in a manner that repeats for at least a portion of the time. The first process irradiates one of the multiple lines C with laser L1 from the laser processing head 10A, and the second process irradiates the other lines C with laser L2 from the laser processing head 10B. In this way, by operating the laser processing head 10A and the laser processing head 10B simultaneously for at least a portion of the time, the output can be increased.

[0142] Furthermore, in the first process, the control unit 9 controls the moving mechanism 5 and the moving mechanism 6 (X-axis moving part 62A) to move the support part 7 and the laser processing head 10A in opposite directions along the X direction. In the second process, the control unit 9 controls the moving mechanism 5 and the moving mechanism 6 (X-axis moving part 62B) to move the support part 7 and the laser processing head 10B in opposite directions along the X direction.

[0143] [Modifications of laser processing equipment]

[0144] The above embodiments are used to describe one embodiment of the laser processing apparatus of the present invention. Therefore, the laser processing apparatus 1 described above can be arbitrarily modified.

[0145] For example, such as Figure 11As shown, the laser processing apparatus 1 may not include a laser processing head 10B. Furthermore, the moving mechanism 6 may also omit the X-axis moving part 62B and the Z-axis moving part 64 for moving the laser processing head 10B. Even in this case, during irradiation, by moving the support 7 and the laser processing head 10A in opposite directions while irradiating with laser L1, the processing speed can be increased. In particular, even in this case, when performing irradiation, it does not follow the camera AC; only the laser processing head 10A (and the support 7) can move along the X-direction. Therefore, the movement speed of the laser processing head 10A along the X-direction can be increased, allowing for a more reliable increase in processing speed. Furthermore, in Figures 11-13 The illustration of the mounting part 55 is omitted.

[0146] Alternatively, it can be like Figure 12 and Figure 13 As shown, in the laser processing apparatus 1, the camera AC and the laser processing head 10A are mounted together on the X-axis moving part 62A, which moves the laser processing head 10A along the X direction, and can be mounted on the Y-axis moving part 61 via the X-axis moving part 62A. Figure 12 For example, it does not have a laser processing head 10B, in Figure 13 For example, a laser processing head 10B is provided. In these cases, there is no need for a separate structure for mounting the camera AC on the Y-axis moving part 61, thus simplifying the device structure. For details, please refer to the appendix below.

[0147] Furthermore, in the above example, it is shown that the X-axis moving parts 62A, 62B, and 62C are supported on a pair of Y-axis moving parts 61. However, the moving mechanism 6 may also include a single Y-axis moving part 61, with the X-axis moving parts 62A, 62B, and 62C supported on this single Y-axis moving part 61 in a cantilevered state.

[0148] In addition, Figure 1 The example shows an instance where, in the Y direction, an X-axis moving part 62C is positioned outside adjacent X-axis moving parts 62A and 62B. That is, when viewed from the Z direction, the laser processing head 10A, laser processing head 10B, and camera AC are arranged in this order in the Y direction. However, the arrangement of the X-axis moving parts 62A-62C, the laser processing heads 10A and 10B, and the camera AC is not limited to this. That is, in the Y direction, the X-axis moving part 62C can also be positioned between X-axis moving parts 62A and 62B. In this case, when viewed from the Z direction, the laser processing head 10A, camera AC, and laser processing head 10B are arranged in this order in the Y direction.

[0149] Furthermore, in the above embodiment, the laser processing apparatus 1 (moving mechanism 5) may not have the function of moving the support 7 in the Y direction (moving part 53). In this case, by reducing the weight of the support 7, the distance required for the acceleration and deceleration of the support 7 can be reduced, and the speed of the support 7 can be increased. Thus, as described above, the processing speed can be increased by making the speed of the laser processing heads 10A and 10B lower than the speed of the support 7.

[0150] The above implementation methods are described in the following notes.

[0151] [Postscript 1]

[0152] A laser processing apparatus is used to irradiate an object with multiple lines extending along a first direction and arranged along a second direction intersecting the first direction, thereby forming a modified region on the object along the lines. The apparatus is characterized by comprising:

[0153] A support section, used to support the aforementioned object;

[0154] The first laser processing head is used to irradiate the object supported on the support portion with the laser.

[0155] A first moving mechanism is used to move the aforementioned support portion along a first direction;

[0156] The second moving mechanism moves at least the first laser processing head along the first direction and the second direction;

[0157] The control unit, while outputting laser light from the first laser processing head, controls the first and second moving mechanisms to move the support unit and the first laser processing head in opposite directions along the first direction, thereby performing an irradiation process where the laser light is applied to the object along the line.

[0158] The aforementioned second moving mechanism includes:

[0159] A first movable part, extending along the first direction and equipped with the first laser processing head, is used to move the first laser processing head along the first direction; and

[0160] A second movable part, which extends along the second direction and is equipped with the first movable part, is used to move the first movable part along the second direction.

[0161] The first laser processing head is connected to an optical fiber for introducing the laser output from the light source.

[0162] In the irradiation process, the control unit makes the speed of the first laser processing head along the first direction smaller than the speed of the support unit along the first direction.

[0163] [Postscript 2]

[0164] As in the laser processing apparatus described in Appendix 1 above, the second moving mechanism comprises a pair of second moving parts arranged opposite to each other in the first direction.

[0165] The first movable part is mounted and supported on a pair of the second movable parts.

[0166] [Postscript 3]

[0167] The laser processing apparatus described in Appendix 1 or 2 above further includes a camera for photographing the object supported on the support.

[0168] The camera is mounted on the second movable part via a component different from the first movable part.

[0169] [Postscript 4]

[0170] As in the laser processing apparatus described in Appendix 3 above, the second moving mechanism includes a third moving part that is a different component, the third moving part extending along the first direction and having the camera mounted thereon for moving the camera along the first direction.

[0171] [Postscript 5]

[0172] The laser processing apparatus as described in any of the appendices 1 to 4 above further includes a second laser processing head for irradiating the object supported on the support with a laser.

[0173] The second moving mechanism includes a fourth moving part that extends along the first direction and is equipped with the second laser processing head for moving the second laser processing head along the first direction.

[0174] The second moving part described above is equipped with the fourth moving part, and has the function of moving the fourth moving part along the second direction.

[0175] In the aforementioned irradiation process, the control unit performs the first process and the second process repeatedly for at least a portion of the time. The first process irradiates one of the plurality of lines with laser light from the first laser processing head, and the second process irradiates the other lines of the plurality of lines with laser light from the second laser processing head.

[0176] In the first process described above, the control unit controls the first moving mechanism and the second moving mechanism to move the support and the first laser processing head in opposite directions along the first direction.

[0177] In the second process described above, the control unit controls the first moving mechanism and the second moving mechanism to move the support and the second laser processing head in opposite directions along the first direction.

[0178] [Potential for Industrial Applications]

[0179] According to the present invention, a laser processing apparatus that can increase processing speed can be provided.

[0180] [Symbol Explanation]

[0181] 1…Laser processing device; 5…Moving mechanism (first moving mechanism); 6…Moving mechanism (second moving mechanism); 7…Support unit; 9…Control unit; 10A…Laser processing head (first laser processing head); 10B…Laser processing head (second laser processing head); 61…Y-axis moving part (second moving part); 62A…X-axis moving part (first moving part); 62B…X-axis moving part (fourth moving part); 62C…X-axis moving part (third moving part); 100…Object; AC…Camera.

Claims

1. A laser processing apparatus, wherein, A laser processing apparatus is used to form a modified region on an object by irradiating it with a laser along the lines of a plurality of lines extending along a first direction and arranged along a second direction intersecting the first direction, and thereby forming a modified region on the object along the lines. The apparatus comprises: A support portion, which is used to support the object; A first laser processing head is used to irradiate the object supported by the support with the laser. A camera for taking pictures of the object supported by the support; A first moving mechanism is used to move the support part along a first direction; A second moving mechanism is used to move the first laser processing head at least along the first direction and the second direction; and The control unit, while the laser is output from the first laser processing head, controls the first moving mechanism and the second moving mechanism to move the support and the first laser processing head in opposite directions along the first direction, thereby performing an irradiation process of irradiating the object with the laser along the line. The second moving mechanism includes: A first movable part, extending along the first direction and equipped with the first laser processing head, is used to move the first laser processing head along the first direction; and A second movable part, which extends along the second direction and is equipped with the first movable part, is used to move the first movable part along the second direction. The camera is mounted on the second moving part via a component different from that of the first moving part. The first laser processing head is connected to an optical fiber for guiding the laser output from the light source. During the irradiation process, the control unit makes the speed of the first laser processing head along the first direction smaller than the speed of the support unit along the first direction.

2. The laser processing apparatus according to claim 1, wherein, The second moving mechanism includes a pair of second moving parts arranged opposite to each other in the first direction. The first moving part is mounted on and supported by the pair of second moving parts.

3. The laser processing apparatus according to claim 1, wherein, The second moving mechanism includes a third moving part as a different component, the third moving part extending along the first direction and having the camera mounted thereon for moving the camera along the first direction.

4. The laser processing apparatus according to claim 2, wherein, The second moving mechanism includes a third moving part as a different component, the third moving part extending along the first direction and having the camera mounted thereon for moving the camera along the first direction.

5. The laser processing apparatus according to any one of claims 1 to 4, wherein, It includes: a second laser processing head for irradiating the object supported by the support with a laser. The second moving mechanism includes: a fourth moving part extending along the first direction and on which the second laser processing head is mounted, for moving the second laser processing head along the first direction. The second moving part is equipped with the fourth moving part and has the function of moving the fourth moving part along the second direction. The control unit performs a first process and a second process repeatedly for at least a portion of the time during the irradiation process. In the first process, one of the plurality of lines is irradiated with laser light from the first laser processing head. In the second process, the other lines of the plurality of lines are irradiated with laser light from the second laser processing head. In the first process, the control unit controls the first moving mechanism and the second moving mechanism in a manner that moves the support and the first laser processing head in opposite directions along the first direction. In the second process, the control unit controls the first moving mechanism and the second moving mechanism in such a way that the support and the second laser processing head move in opposite directions along the first direction.

Images