Spaceborne Highly Integrated Laminated Multibeam Feed Array Heat Dissipation Device and Design Simulation Method

Abstract

A heat dissipation device for a spaceborne highly integrated laminated multi-beam feed array and its design and simulation method are disclosed. The method involves thermal control design of the feed array plate, obtaining a heat dissipation device including the feed array plate and heat dissipation structure, and performing equivalent meshing processing on the feed array plate within the heat dissipation device. Parameters of the processed equivalent two-dimensional mesh are set. The equivalent thermal conductivity between the feed array plates is calculated to convert to heat transfer coefficient, the equivalent thermal resistance between the feed array plates is calculated to convert to heat transfer coefficient, and the equivalent heat capacity of the feed array plate is calculated to convert to corrected density. Based on the calculation results, simulation analysis of the feed array plate is performed to achieve temperature control and simulation analysis of the feed array plate in an alternating environment. This method solves the problem of high difficulty in temperature control and simulation analysis of spacecraft external components such as spaceborne highly integrated laminated multi-beam feed arrays in alternating environments.

Description

Technical Field

[0001] This invention relates to a spaceborne highly integrated laminated multi-beam feed array heat dissipation device and its design simulation method, belonging to the field of aerospace equipment design and simulation. Background Technology

[0002] The laminated multi-beam feed array uses multiple slotted array plates clamped together with screws to form internal electromagnetic channels. Compared with traditional feeds, it has extremely high integration, a highly compact structure, and heat transfer paths that are asymmetrically distributed in multiple dimensions. At the same time, the electromagnetic seal places extremely high demands on the clamping of the plate interfaces. Specifically, the pre-tightening at room temperature must be able to meet both extremely high and extremely low temperature environments in orbit, and must have excellent resistance to thermal fatigue.

[0003] As an external component of spacecraft, laminated multibeam feed arrays experience significant heat dissipation. During on-orbit operation, variations in the angle of sunlight cause localized high temperatures when exposed to sunlight and low temperatures when in shadow due to radiation from cold air. This alternating temperature variation over time negatively impacts the component's performance and lifespan, particularly affecting the array's fit accuracy. Significant temperature variations leading to thermal deformation can severely affect critical dimensions, potentially causing fatal impacts on functionality. For such complex feed array structures, where heat transfer paths are unclear and difficult to decompose, traditional thermal analysis methods typically employ cubic meshes to accurately represent all heat transfer characteristics. This approach results in a massive mesh size, demanding high computational resources and inefficient calculations, making it completely unsuitable for the rapid iterative design of electrical, structural, mechanical, and thermal systems.

[0004] For high-heat-dissipation, complex products like spaceborne highly integrated laminated multibeam feed arrays, a more reliable thermal control method needs to be designed, and an efficient thermal simulation analysis method needs to be redesigned to evaluate the on-orbit temperature of the laminated multibeam feed array. Summary of the Invention

[0005] The technical problem solved by this invention is: addressing the difficulty in performing thermal analysis and simulation analysis on traditional laminated multi-beam feed arrays in the existing technology, this invention proposes a heat dissipation device and design simulation method for a spaceborne highly integrated laminated multi-beam feed array.

[0006] The present invention solves the above-mentioned technical problem through the following technical solution:

[0007] A spaceborne highly integrated laminated multi-beam feed array heat dissipation device includes a feed array plate and a heat dissipation structure. The feed array plate is in the form of an equivalent grid. Heat dissipation structures are provided at the top and bottom of the feed array plate. The heat generated by the feed array plate is conducted to the top or bottom heat dissipation structure and dissipated outward through the heat dissipation structure. The feed array plate adopts a radiation heat insulation design with respect to the space environment, and a heat conduction design is adopted between the feed array plate and the top or bottom heat dissipation structure.

[0008] The equivalent mesh form of the feed array board is an equivalent two-dimensional surface mesh, and the mesh thickness value is set to the thickness of the feed array board substrate.

[0009] The equivalent two-dimensional surface mesh obtained after the equivalent mesh processing of the feed array plate is used to calculate the equivalent thermal conductivity between the feed array plates, the equivalent thermal resistance between the feed array plates, and the equivalent heat capacity of the feed array plate. The simulation analysis of the feed array plate is then realized based on the calculation results.

[0010] A design and simulation method for a multi-beam feed array heat dissipation device includes:

[0011] Thermal control design is performed on the feed array board to obtain a heat dissipation device;

[0012] The feed array board in the heat dissipation device is subjected to equivalent meshing.

[0013] Set the parameters of the processed equivalent two-dimensional surface mesh;

[0014] Calculate the equivalent thermal conductivity between feed array plates to convert to heat transfer coefficient, the equivalent thermal resistance between feed array plates to convert to heat transfer coefficient, and the equivalent heat capacity of feed array plates to convert to corrected density.

[0015] Based on the calculation results, a simulation analysis of the feed array board is performed to achieve temperature control and simulation analysis of the feed array board in an alternating environment.

[0016] The thermal control design of the feed array board is as follows:

[0017] A heat dissipation device is formed by using a feed array plate and a heat dissipation structure. Heat dissipation structures are set at the top and bottom of the feed array plate. The heat generated by the feed array plate is conducted to the top or bottom heat dissipation structure and dissipated to the outside through the heat dissipation structure. The feed array plate adopts a radiation heat insulation design with respect to the space environment, and a heat conduction design is adopted between the feed array plate and the top or bottom heat dissipation structure.

[0018] The feed array board in the heat dissipation device is subjected to equivalent meshing, and the feed array board is equivalent to an equivalent two-dimensional surface mesh. The mesh thickness value is set to the thickness of the feed array board substrate.

[0019] The specific method for calculating the equivalent thermal conductivity of the feed array plates into the heat transfer coefficient is as follows:

[0020]

[0021] In the formula, H1 is the heat transfer coefficient calculated from the equivalent thermal resistance between the feed array plates, δ1 is the channel height of array plate 1 in two adjacent feed array plates, and λ1 is the thermal conductivity of the material of array plate 1. δ1 is the ratio of the channel cross-sectional area of ​​array plate 1 to the substrate area, δ2 is the channel height of array plate 2, and λ2 is the thermal conductivity of the material of array plate 2. It is the ratio of the cross-sectional area of ​​the channel of array board 2 to the area of ​​the substrate.

[0022] The specific method for calculating the equivalent heat transfer coefficient between the feed array plates, which is calculated based on the thermal resistance, is as follows:

[0023]

[0024] In the formula, α is the screw clamping coefficient and H0 is the interfacial heat transfer coefficient.

[0025] The specific method for calculating the equivalent heat capacity correction density of the feed array plate is as follows:

[0026]

[0027] In the formula, ρ1 is the corrected density after modeling array plate 1, ρ0 is the original material density of array plate 1, V0 is the original volume of array plate 1 before modeling, and V1 is the equivalent volume of array plate 1 after modeling with surface mesh.

[0028] The specific steps for simulation analysis of the feed array board based on the calculation results are as follows:

[0029] The two-dimensional surface mesh model corresponding to each feed array substrate is determined, and the material properties of the two-dimensional surface mesh model are set. Thermal coupling correlation is added between any two adjacent feed array substrates, the coupling coefficient is set, and transient simulation analysis is performed to obtain the real-time temperature distribution and temperature change trend of the feed array board in orbit, thus completing the simulation analysis.

[0030] The advantages of this invention compared to the prior art are:

[0031] (1) The present invention provides a heat dissipation device and design simulation method for a spaceborne high-integration laminated multi-beam feed array. Through structural improvement, the feed array plate and heat dissipation structure are the main components. The heat generated by the feed array plate is conducted to the heat dissipation structure at the top or bottom to achieve heat dissipation. At the same time, the feed array plate adopts a radiation heat insulation design with the space environment, and the feed array plate adopts a heat conduction design with the heat dissipation structure at the top or bottom. This improves the thermal control of the spacecraft cabin-exterior laminated multi-beam feed and obtains a more reliable thermal control method.

[0032] (2) This invention adopts the form of converting the feed array plate into an equivalent two-dimensional surface mesh, sets the mesh thickness value as the thickness of the feed array plate substrate, and calculates the equivalent thermal conductivity between feed array plates, the equivalent thermal resistance between feed array plates, and the equivalent heat capacity of feed array plates required for simulation, respectively, to realize the simulation analysis of the feed array plate. At the same time, it solves the problem of high temperature control and simulation analysis of spacecraft external components such as spaceborne high-integration laminated multi-beam feed arrays in alternating environments. Attached Figure Description

[0033] Figure 1 A schematic diagram of the heat transfer path for the feed array heat design provided for the invention;

[0034] Figure 2 A schematic diagram of the feed array grid provided for the invention;

[0035] Figure 3 A simulation diagram of the thermal resistance between the feed array plates provided for the invention.

[0036] Figure 4 A schematic diagram of the feed array thermal design structure provided for the invention;

[0037] Figure 5 A schematic diagram of the thermal analysis results of the feed array provided for the invention; Detailed Implementation

[0038] The paper presents a heat dissipation device and design simulation method for a spaceborne highly integrated laminated multi-beam feed array. By proposing a thermal control structure for the spaceborne highly integrated laminated multi-beam feed array and the corresponding design and simulation methods, it can effectively solve the thermal fatigue problem caused by the spatial alternation of feed temperature. At the same time, it solves the problem of high temperature control and simulation analysis of spacecraft external components such as spaceborne highly integrated laminated multi-beam feed arrays in alternating environments.

[0039] The specific process of designing and simulating a heat dissipation device for a multi-beam feed array is as follows:

[0040] Thermal control design is performed on the feed array board to obtain a heat dissipation device;

[0041] The feed array board in the heat dissipation device is subjected to equivalent meshing.

[0042] Set the parameters of the processed equivalent two-dimensional surface mesh;

[0043] Calculate the equivalent thermal conductivity between feed array plates to convert to heat transfer coefficient, the equivalent thermal resistance between feed array plates to convert to heat transfer coefficient, and the equivalent heat capacity of feed array plates to convert to corrected density.

[0044] Based on the calculation results, a simulation analysis of the feed array board is performed to achieve temperature control and simulation analysis of the feed array board in an alternating environment.

[0045] The feed array board is designed with thermal control, and heat dissipation structures are set at the top and bottom of the feed array board. The heat generated by the feed array board is conducted to the heat dissipation structure at the top or bottom and dissipated to the outside through the heat dissipation structure. The feed array board adopts a radiation heat insulation design with the space environment, and a heat conduction design is adopted between the feed array board and the heat dissipation structure at the top or bottom.

[0046] The feed array plate in the heat dissipation device is subjected to equivalent meshing, and the feed array plate is equivalent to an equivalent two-dimensional surface mesh. The mesh thickness value is set to the thickness of the feed array plate substrate.

[0047] Simulation analysis of the feed array board was performed based on the calculation results.

[0048] The following description, in conjunction with the accompanying drawings and preferred embodiments, provides further details:

[0049] In the current embodiment, the thermal control design of the heat dissipation device is achieved through a feed array plate and a heat dissipation structure. The feed array plate is in the form of an equivalent grid. Heat dissipation structures are provided at the top and bottom of the feed array plate. The heat generated by the feed array plate is conducted to the heat dissipation structure at the top or bottom and dissipated outward through the heat dissipation structure. The feed array plate adopts a radiation heat insulation design with respect to the space environment. The feed array plate adopts a heat conduction design with respect to the heat dissipation structure at the top or bottom. At the same time, the equivalent grid form of the feed array plate is an equivalent two-dimensional surface grid, and the grid thickness value is set to the thickness of the feed array plate substrate.

[0050] The equivalent two-dimensional surface mesh obtained after the equivalent mesh processing of the feed array plate is used to calculate the equivalent thermal conductivity between the feed array plates, the equivalent thermal resistance between the feed array plates, and the equivalent heat capacity of the feed array plate. The simulation analysis of the feed array plate is then realized based on the calculation results.

[0051] Specifically:

[0052] The feed array board and the top or bottom heat dissipation structure adopt a thermally conductive design, and the feed array board and the space environment adopt a thermal radiation isolation design.

[0053] The specific method for calculating the equivalent thermal conductivity between feed array plates to convert it into heat transfer coefficient is as follows:

[0054]

[0055] In the formula, H1 is the heat transfer coefficient calculated from the equivalent thermal resistance between the feed array plates, δ1 is the channel height of array plate 1 in two adjacent feed array plates, and λ1 is the thermal conductivity of the material of array plate 1. δ1 is the ratio of the channel cross-sectional area of ​​array plate 1 to the substrate area, δ2 is the channel height of array plate 2, and λ2 is the thermal conductivity of the material of array plate 2. This is the ratio of the cross-sectional area of ​​the channel in array board 2 to the area of ​​the substrate;

[0056] The specific method for calculating the equivalent heat transfer coefficient between feed array plates, based on thermal resistance, is as follows:

[0057]

[0058] In the formula, α is the screw clamping coefficient, which can be taken as 0.8 when the screw torque is less than 2 Nm, 1.0 when the screw torque is 2 to 3 Nm, and 1.2 when the screw torque is greater than 3 Nm; H0 is the interfacial heat transfer coefficient, which can be taken as 200 to 400 W / m when the interface is in direct contact. 2 K -1 When adding thermally conductive fillers such as thermal grease or thermal pads between interfaces, a value of 800–1000 W / m can be used. 2 K -1 ;

[0059] The specific calculation method for the equivalent heat capacity correction density of the feed array plate is as follows:

[0060]

[0061] In the formula, ρ1 is the corrected density after modeling array plate 1, ρ0 is the original material density of array plate 1, V0 is the original volume of array plate 1 before modeling, and V1 is the equivalent volume of array plate 1 after modeling with surface mesh.

[0062] The feed array board design and simulation analysis method proposed in this embodiment can achieve reliable thermal control and efficient simulation design of highly integrated laminated multi-beam feed arrays in the field of spacecraft design or spaceborne communication missions. First, it solves the problem of uneven thermal stress distribution and thermal fatigue caused by the alternating thermal environment in space, which leads to the degradation of product dimensional accuracy and performance of laminated multi-beam feed arrays. Second, it solves the problem of high difficulty, high computational resource requirements and long time consumption in thermal control simulation analysis for predicting the on-orbit temperature of complex feed arrays.

[0063] like Figure 1 The diagram illustrates the heat transfer path in the feed array thermal design method provided by this invention: the feed array plate is thermally connected to the top or bottom heat dissipation structure. The feed array plate first conducts heat to the top or bottom heat dissipation structure, and then the heat is dissipated outward by the heat dissipation structure. The feed array plate is insulated from the environment using thermal radiation isolation measures, thereby ensuring that the feed array plate does not directly participate in environmental thermal radiation.

[0064] like Figure 2As shown, in the feed array thermal simulation analysis method provided by this invention, the feed array mesh form is: a three-dimensional complex structure of a laminated feed array is equivalent to a two-dimensional planar mesh array;

[0065] like Figure 3 As shown, in the thermal simulation analysis method of the feed array provided by the present invention, the thermal resistance between feed array plates is: the thermal resistance of any two adjacent array plates is composed of the thermal resistance of the array plates themselves and the thermal resistance of the interface between the plates. The thermal resistance of the adjacent array plates can be converted into the heat transfer coefficient H1, and the thermal resistance of the interface between the adjacent array plates can be converted into the heat transfer coefficient H2.

[0066] like Figure 4 As shown, the feed array thermal design scheme provided in this embodiment of the invention includes: a heat dissipation structure installed on the top of the feed array, and the support at the bottom of the feed array can also serve as a heat dissipation structure. The surfaces of these two heat dissipation structures are coated with white paint to achieve heat dissipation from the cold air in the space environment. Except for the mounting surfaces of the top and bottom heat dissipation structures, the entire feed array is covered with multiple layers of thermal insulation, and does not directly exchange thermal radiation energy with the space environment.

[0067] like Figure 5 The diagram shown is a schematic representation of the thermal analysis results of the feed array provided in an embodiment of the present invention. Figure 5 It can be seen that the calculation results of the thermal simulation analysis method provided in this embodiment of the invention are in excellent agreement with the simulation results of the three-dimensional model, with an error of less than 10%, which can meet the needs of engineering applications. Under the same computing resources, the calculation time required can be reduced by more than 90%.

[0068] The specific steps for simulation analysis of the feed array plate based on the calculation results are as follows: 1) Using the substrate of each feed array plate as a geometric model, after extracting the mid-surface, the mid-surface is meshed using a meshing program to obtain the two-dimensional surface mesh model of each feed array plate required for finite element calculation; 2) Setting material properties for the two-dimensional mesh surface model, including substrate thickness and equivalent correction density; 3) Adding thermal coupling correlation between the two-dimensional surface meshes of any two adjacent array plates, setting the coupling coefficient to the heat transfer coefficient H1 calculated from the equivalent thermal resistance and the heat transfer coefficient H2 calculated from the equivalent thermal resistance; 4) Inserting the above mesh model into the orbital environment solver program for transient simulation analysis to obtain the real-time temperature distribution and temperature change trend of the feed array plate in orbit.

[0069] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

[0070] The contents not described in detail in this specification are common knowledge to those skilled in the art.

Claims

1. A spaceborne highly integrated laminated multi-beam feed array heat dissipation device, characterized in that: It includes a feed array plate and a heat dissipation structure. The feed array plate is in the form of an equivalent grid. Heat dissipation structures are provided at the top and bottom of the feed array plate. The heat generated by the feed array plate is conducted to the heat dissipation structure at the top or bottom and dissipated to the outside through the heat dissipation structure. The feed array plate adopts a radiation heat insulation design with respect to the space environment, and a heat conduction design is adopted between the feed array plate and the heat dissipation structure at the top or bottom. The equivalent mesh form of the feed array board is an equivalent two-dimensional surface mesh, and the mesh thickness value is set to the thickness of the feed array board substrate. The equivalent two-dimensional surface mesh obtained after the equivalent mesh processing of the feed array plate is used to calculate the equivalent thermal conductivity between the feed array plates to convert the heat transfer coefficient, the equivalent thermal resistance between the feed array plates to convert the heat transfer coefficient, and the equivalent heat capacity of the feed array plate to convert the corrected density. The simulation analysis of the feed array plate is then realized based on the calculation results. The specific method for calculating the equivalent thermal conductivity of the feed array plates into the heat transfer coefficient is as follows: In the formula, The heat transfer coefficient is calculated based on the equivalent thermal resistance between the feed array plates. The slot height of array board 1 in two adjacent feed array boards. Let be the thermal conductivity of the material of array plate 1. This is the ratio of the cross-sectional area of ​​the channel in array board 1 to the area of ​​the substrate. The height of the slot in array board 2. The thermal conductivity of array plate 2 is the material of the array plate. This is the ratio of the cross-sectional area of ​​the channel in array board 2 to the area of ​​the substrate; The specific method for calculating the equivalent heat transfer coefficient between the feed array plates, which is calculated based on the thermal resistance, is as follows: In the formula, α This is the screw clamping coefficient. H 0 represents the interfacial heat transfer coefficient; The specific method for calculating the equivalent heat capacity correction density of the feed array plate is as follows: In the formula, ρ 1 represents the corrected density after modeling array board 1. ρ 0 represents the original material density of array plate 1. V 0 represents the original volume of array plate 1 before modeling. V 1 represents the equivalent volume of array plate 1 after it is modeled using a surface mesh.

2. The heat dissipation device for a spaceborne highly integrated laminated multi-beam feed array according to claim 1, characterized in that: The thermal control design of the feed array board is as follows: A heat dissipation device is formed by using a feed array plate and a heat dissipation structure. Heat dissipation structures are set at the top and bottom of the feed array plate. The heat generated by the feed array plate is conducted to the top or bottom heat dissipation structure and dissipated to the outside through the heat dissipation structure. The feed array plate adopts a radiation heat insulation design with respect to the space environment, and a heat conduction design is adopted between the feed array plate and the top or bottom heat dissipation structure.

3. The heat dissipation device for a spaceborne highly integrated laminated multi-beam feed array according to claim 2, characterized in that: The feed array board in the heat dissipation device is subjected to equivalent meshing, and the feed array board is equivalent to an equivalent two-dimensional surface mesh. The mesh thickness value is set to the thickness of the feed array board substrate.

4. The heat dissipation device for a spaceborne highly integrated laminated multi-beam feed array according to claim 1, characterized in that: The specific steps for simulation analysis of the feed array board based on the calculation results are as follows: The two-dimensional surface mesh model corresponding to each feed array substrate is determined, and the material properties of the two-dimensional surface mesh model are set. Thermal coupling correlation is added between any two adjacent feed array substrates, the coupling coefficient is set, and transient simulation analysis is performed to obtain the real-time temperature distribution and temperature change trend of the feed array board in orbit, thus completing the simulation analysis.

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