Brightness compensation method, device, equipment and storage medium

Abstract

The present application discloses a brightness compensation method, apparatus, device, and storage medium. The brightness compensation method includes: obtaining brightness data of a light-emitting element array to be transferred, the light-emitting element array to be transferred including a plurality of micro-LEDs; determining a micro-LED to be compensated from the plurality of micro-LEDs based on the brightness data, and determining a compensation value and position information of the micro-LED to be compensated; and sending the compensation value and position information of the micro-LED to be compensated to a compensation device of a display module, the display module including the micro-LED to be compensated. According to embodiments of the present application, the compensation time of a micro-LED display module can be shortened, thereby improving efficiency.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a brightness compensation method, device, equipment and storage medium. Background Art

[0002] Micro-LED (micro light-emitting diode) is a next-generation display technology that offers higher brightness and better luminous efficiency than existing OLED (organic light-emitting diode) technology, while consuming less power. Micro-LED technology utilizes thin-film, miniaturized, and arrayed LED structures, resulting in sizes ranging from 1 to 10 μm. Micro-LED's greatest advantage lies in its micron-level spacing, allowing each pixel to be addressed and driven to emit light, resulting in a long lifespan and a wide range of applications.

[0003] The bottlenecks restricting the development of Micro-LED display technology include not only mass transfer technology but also compensation technology for Micro-LED display modules. Related technologies have the problem that the compensation process for Micro-LED display modules takes a long time. Summary of the Invention

[0004] The embodiments of the present application provide a brightness compensation method, apparatus, device, and storage medium, which can shorten the compensation time of a micro light emitting diode display module and improve efficiency.

[0005] In a first aspect, an embodiment of the present application provides a brightness compensation method, comprising:

[0006] Acquiring brightness data of a light-emitting element array to be transferred, where the light-emitting element array to be transferred includes a plurality of micro light-emitting diodes;

[0007] Determine, based on the brightness data, a micro-LED to be compensated from a plurality of micro-LEDs, and determine a compensation value and position information of the micro-LED to be compensated;

[0008] The compensation value and position information of the micro-light emitting diode to be compensated are sent to a compensation device of a display module, and the display module includes the micro-light emitting diode to be compensated.

[0009] In a possible implementation of the first aspect, before determining the micro-LED to be compensated from the plurality of micro-LEDs based on the brightness data, the method further includes:

[0010] Acquiring physical morphology data of the light-emitting element array to be transferred;

[0011] According to the physical morphology data, a micro-light emitting diode to be repaired is determined from a plurality of micro-light emitting diodes, and position information of the micro-light emitting diode to be repaired is determined.

[0012] In this way, micro-LEDs with physical defects can be screened out to prevent the defective micro-LEDs from being transferred to the display module.

[0013] In a possible implementation of the first aspect, before determining the micro-LED to be compensated from the plurality of micro-LEDs based on the brightness data, the method further includes:

[0014] Acquiring spectrum data of the light emitting element array to be transferred;

[0015] According to the spectral data, a micro-light emitting diode to be repaired is determined from a plurality of micro-light emitting diodes, and position information of the micro-light emitting diode to be repaired is determined.

[0016] In this way, micro-LEDs with spectral defects can be screened out to prevent the defective micro-LEDs from being transferred to the display module.

[0017] In a possible implementation of the first aspect, the method further includes:

[0018] Repair of micro LEDs awaiting repair.

[0019] This way, there is no need to discard the micro-LEDs whose physical form can be repaired, or there is no need to discard the micro-LEDs whose spectrum can be repaired, thus saving costs.

[0020] In a possible implementation of the first aspect, before determining the micro-LED to be compensated from the plurality of micro-LEDs based on the brightness data, the method further includes:

[0021] Determine, based on the brightness data, the percentage of micro-LEDs that deviate from a preset target brightness;

[0022] According to the proportion of the number, the possibility of repairing the light-emitting element array to be transferred is determined.

[0023] In this way, the possibility of repairing the light-emitting element array to be transferred can be predicted in advance, and the difficulty of repair and the number of process iterations required for repair can be determined.

[0024] In a possible implementation of the first aspect, the method further includes:

[0025] Transferring a plurality of micro-LEDs of the light-emitting element array to be transferred to an array substrate to obtain a display module;

[0026] Preferably, transferring the plurality of micro-light emitting diodes to the array substrate comprises:

[0027] By using thin film rolling and bonding, multiple micro-LEDs are transferred to the array substrate. This allows a large number of micro-LEDs to be transferred in a relatively short time, further improving production efficiency.

[0028] Based on the same inventive concept, in a second aspect, an embodiment of the present application provides a brightness compensation device, comprising:

[0029] A data acquisition module is used to acquire brightness data of the light emitting element array to be transferred, where the light emitting element array to be transferred includes a plurality of micro light emitting diodes;

[0030] a compensation information determination module, configured to determine a micro-LED to be compensated from the plurality of micro-LEDs based on the brightness data, and to determine a compensation value and position information of the micro-LED to be compensated;

[0031] The data sending module is used to send the compensation value and position information of the micro-light emitting diode to be compensated to the compensation module of the display module, where the display module includes the micro-light emitting diode to be compensated.

[0032] In a possible implementation of the second aspect, the data acquisition module is further configured to acquire physical morphology data of the light emitting element array to be transferred;

[0033] The brightness compensation device further includes a morphology analysis module, which is used to determine the micro-LED to be repaired from the plurality of micro-LEDs based on the physical morphology data, and determine the position information of the micro-LED to be repaired;

[0034] Preferably, the data acquisition module is further used to acquire spectral data of the light emitting element array to be transferred;

[0035] The brightness compensation device further includes a spectrum analysis module, which is used to determine the micro-LED to be repaired from the plurality of micro-LEDs based on the spectrum data, and determine the position information of the micro-LED to be repaired;

[0036] Preferably, the brightness compensation device further includes a repair module, and the repair module is used to repair the micro light emitting diode to be repaired.

[0037] Based on the same inventive concept, in a third aspect, an embodiment of the present application provides an electronic device, including:

[0038] A processor and a memory storing computer program instructions, wherein when the processor executes the computer program instructions, the brightness compensation method of any one of the embodiments of the first aspect is implemented.

[0039] Based on the same inventive concept, in the fourth aspect, an embodiment of the present application provides a computer-readable storage medium, characterized in that a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, a brightness compensation method as in any one of the embodiments of the first aspect is implemented.

[0040] According to the brightness compensation method, device, equipment, and storage medium provided in the embodiments of the present application, brightness defects (e.g., mura) of the micro-LEDs are identified before transfer, and the compensation value and position information of the micro-LEDs to be compensated are determined. The determined compensation value and position information are then sent to the compensation device of the display module. In this way, the compensation device of the display module can conduct centralized inspections of the micro-LEDs at corresponding positions during the compensation process, eliminating the need to perform brightness data analysis on all micro-LEDs, thereby eliminating unnecessary data analysis steps, shortening the time required for the compensation process, and improving production efficiency. In addition, the compensation device of the display module can conduct centralized inspections of the micro-LEDs at corresponding positions during the compensation process, thereby improving the accuracy of compensation. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0042] Figure 1 A schematic diagram showing a flow chart of a brightness compensation method provided in an embodiment of the present application is shown;

[0043] Figure 2 A schematic diagram illustrating a scenario of the brightness compensation method provided by an embodiment of the present application;

[0044] Figure 3 Another schematic diagram showing a flow chart of a brightness compensation method provided in an embodiment of the present application;

[0045] Figures 4 to 7 A schematic diagram showing a flow chart of a brightness compensation method provided in some other embodiments of the present application;

[0046] Figure 8 A schematic structural diagram of a brightness compensation device provided in an embodiment of the present application is shown;

[0047] Figure 9 Another structural schematic diagram of the brightness compensation device provided in an embodiment of the present application is shown;

[0048] Figure 10 A schematic structural diagram of an electronic device provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0049] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0050] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0051] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0052] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0053] It will be apparent to those skilled in the art that various modifications and variations can be made in this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and variations of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the embodiments provided in the examples of this application can be combined with each other without contradiction.

[0054] Before describing the technical solutions provided by the embodiments of the present application, in order to facilitate understanding of the embodiments of the present application, the present application first specifically describes the problems existing in the related art:

[0055] For Micro-LED Display (micro light-emitting diode display module), Micro-LED devices can be first generated on a wafer to obtain a Micro-LED array. The driving circuits of each Micro-LED device can also be generated on the wafer. The Micro-LED array can include a certain number of unit blocks, and a unit block can be composed of n*n Micro-LED devices. The corresponding unit blocks can then be cut, transferred, transferred to the display backplane (display module bottom plate), and bound.

[0056] However, after extensive research, the inventors discovered that micro-LEDs exhibit brightness defects (e.g., mura) from the moment they are produced on a wafer. Conventional technology uses compensation devices within the display module to analyze the brightness data of all micro-LEDs in the display module after the micro-LEDs are transferred to and bonded to the display module substrate. This process requires a long process time and reduces production efficiency.

[0057] In response to the above technical problems, the embodiments of the present application provide a brightness compensation method, apparatus, device, and storage medium. The following describes various embodiments of the brightness compensation method, apparatus, device, and storage medium in conjunction with the accompanying drawings.

[0058] First, the brightness compensation method provided by the embodiment of the present application is introduced.

[0059] Figure 1 A schematic flow chart of the brightness compensation method provided in the embodiment of the present application is shown. Figure 1 As shown, the brightness compensation method provided in the embodiment of the present application may include S11 to S13.

[0060] S11, acquiring brightness data of a light-emitting element array to be transferred, where the light-emitting element array to be transferred includes a plurality of micro light-emitting diodes;

[0061] S12, determining a micro-LED to be compensated from the plurality of micro-LEDs according to the brightness data, and determining a compensation value and position information of the micro-LED to be compensated;

[0062] S13 , sending the compensation value and position information of the micro-LED to be compensated to a compensation device of a display module, where the display module includes the micro-LED to be compensated.

[0063] The specific implementation of each of the above steps will be described in detail below.

[0064] According to the brightness compensation method provided in the embodiments of the present application, brightness defects (e.g., mura) of the micro-LEDs are identified before transfer, and the compensation value and position information of the micro-LEDs to be compensated are determined. The determined compensation value and position information are then sent to the compensation device of the display module. In this way, the compensation device of the display module can conduct centralized inspections of the micro-LEDs at corresponding positions during the compensation process, eliminating the need to perform brightness data analysis on all micro-LEDs, thereby eliminating unnecessary data analysis steps, shortening the time required for the compensation process, and improving production efficiency. In addition, the compensation device of the display module can conduct centralized inspections of the micro-LEDs at corresponding positions during the compensation process, thereby improving the accuracy of compensation.

[0065] First, let me introduce the S11.

[0066] Exemplarily, the light emitting element array to be transferred can be understood as the light emitting element array to be transferred in a wafer state.

[0067] Before S11, Micro-LED (micro light-emitting diode) devices could be produced on wafers.

[0068] As an example, Micro-LED devices capable of emitting different colors of light can be produced on a wafer. These Micro-LED devices can each have a different color spectrum, and the different colors of light can be mixed to emit white light. Micro-LED devices emitting different colors of light can be formed on different wafers.

[0069] As another example, a single Micro-LED device produced on a wafer can have the entire visible spectrum and can emit multiple colors, such as white light.

[0070] like Figure 2 As shown, the light-emitting element array 20 to be transferred may include a plurality of micro-LEDs 21. The plurality of micro-LEDs 21 may be formed on a wafer. The plurality of micro-LEDs 21 may be arranged in an array. The light-emitting element array 20 to be transferred may include at least one unit block, each unit block including n*n micro-LEDs 21. During the transfer process, the transfer may be performed in units of unit blocks.

[0071] For example, the driving circuit of the micro-LED 21 ( Figure 2(not shown) can also be generated on the wafer. Before S11, each micro-LED 21 can be illuminated. In S11, a color camera 30 can be used to photograph the illuminated light-emitting element array 20 to be transferred, collecting brightness data of the light-emitting element array 20 to be transferred. The brightness data of the light-emitting element array 20 to be transferred may include the brightness of each micro-LED 21.

[0072] Next, let’s introduce S12.

[0073] As an example, the brightness of each micro-LED 21 can be compared with the target brightness. If the difference between the brightness of the micro-LED 21 and the target brightness does not meet the preset requirements, it can be considered that the micro-LED 21 needs brightness compensation, and the micro-LED 21 is the micro-LED 21 to be compensated.

[0074] As an example, the compensation value may include a brightness compensation value. For example, the brightness compensation value may be determined according to the difference between the brightness of the micro-LED 21 to be compensated and the target brightness.

[0075] As another example, the compensation value may include a data voltage compensation value. For example, if the difference between the brightness of the micro-LED 21 to be compensated and the target brightness does not meet a preset requirement at an initial data voltage, a target data voltage may be determined. If the difference between the brightness of the micro-LED 21 to be compensated and the target brightness meets a preset requirement at the target data voltage, a data voltage compensation value may be determined based on the difference between the initial data voltage and the target data voltage.

[0076] Of course, the compensation value may also be other numerical values. The above are just some examples and are not intended to limit the present application.

[0077] As an example, the brightness data of the light-emitting element array to be transferred obtained in S11 may include the brightness and position of each micro-LED 21 in the array, and the position information of the micro-LED 21 to be compensated may be directly recorded in S12. The position information may include the coordinates of the micro-LED 21 to be compensated in the light-emitting element array 20 to be transferred.

[0078] Next, let’s introduce S13.

[0079] After the micro-LEDs 21 to be compensated are transferred to the bottom plate of the display module to form the display module, the position information of the micro-LEDs 21 to be compensated may include the position information of the micro-LEDs 21 to be compensated in the display module.

[0080] It is understandable that the display module includes not only the micro-LEDs 21 to be compensated, but also other micro-LEDs 21 in the light emitting element array 20 to be transferred that do not require compensation.

[0081] During the process of the compensation device of the display module performing compensation on the display module, the compensation device can centrally inspect the micro-LEDs 21 at corresponding positions based on the compensation value and position information of the micro-LEDs 21 to be compensated, and thereby determine the final compensation value of the micro-LEDs 21 to be compensated. The final compensation value of the micro-LEDs 21 to be compensated can be equal to or different from the compensation value determined in S12.

[0082] From the moment Micro-LED devices are produced on wafers, brightness defects (e.g., mura) can occur. The inventors have discovered that these defects include mura caused by variations in brightness due to the photon efficiency of the Micro-LEDs, mura due to color spectrum shift, and surface mura due to changes in the physical form of the LEDs. These three types of mura can coexist in a single array of light-emitting elements 20 to be transferred.

[0083] In some optional embodiments, such as Figure 3 As shown, before S12, the brightness compensation method provided in the embodiment of the present application may further include S121 and S122.

[0084] S121, obtaining physical morphology data of the light emitting element array to be transferred;

[0085] S122, determining a micro-LED to be repaired from a plurality of micro-LEDs according to the physical morphology data, and determining position information of the micro-LED to be repaired.

[0086] Among them, S121 and S122 can be before S11 and S12. Figure 3 In the figure, S121 and S122 are shown before S11, but this is not intended to limit the present application.

[0087] For example, the array of light-emitting elements to be transferred 20 may be photographed to collect physical morphological data of each micro-LED 21 .

[0088] The physical form data may include the shape and size of the micro LED 21 .

[0089] In S122, the physical form of each micro-LED 21 can be compared with the target physical form. If the difference between the physical form of the micro-LED 21 and the target physical form is greater than a preset value, it can be considered that the physical form of the micro-LED 21 is defective and the micro-LED 21 can be determined to be a micro-LED to be repaired. Figure 2The micro-LED 21a in FIG. 2 is a micro-LED 21 to be repaired that has physical defects.

[0090] Illustratively, the target physical form may include the physical form of a normal micro-LED 21 , and the normal micro-LED 21 may include a micro-LED 21 without physical form defects.

[0091] Physical defects may affect the light-emitting characteristics of the micro-LED 21, resulting in brightness defects. In the embodiment of the present application, micro-LEDs 21 with physical defects may be screened out to prevent the defective micro-LEDs 21 from being transferred to the display module.

[0092] like Figure 3 As shown, after S122, the brightness compensation method provided in the embodiment of the present application may further include S123.

[0093] S123, repairing the micro light emitting diode to be repaired.

[0094] Based on the position information of the micro-LEDs 21 to be repaired, the micro-LEDs 21 to be repaired with physical morphology defects can be found among the multiple micro-LEDs 21 in the light-emitting element array 20 to be transferred, and the physical morphology of the micro-LEDs 21 to be repaired can be repaired. If the morphology of the repaired micro-LEDs 21 differs from the target physical morphology by less than or equal to a preset value, the repair is considered complete.

[0095] This application does not specifically limit the physical form of the repair method.

[0096] In the embodiment of the present application, it is not necessary to discard the micro-LED 21 whose physical form can be repaired, thus saving costs.

[0097] It is understandable that if the physical form of the micro-LED 21 is significantly different from the target physical form, it can be considered that the physical form of the micro-LED 21 cannot be repaired, and the micro-LED 21 can be removed to avoid transferring the micro-LED 21 with physical form defects to the display module.

[0098] Illustratively, S121 to S123 may be before S11.

[0099] In some optional embodiments, such as Figure 4 As shown, before S12, the brightness compensation method provided in the embodiment of the present application may further include S124 and S125.

[0100] S124, acquiring spectrum data of the light-emitting element array to be transferred;

[0101] S125 , determining a micro-LED to be repaired from the plurality of micro-LEDs based on the spectral data, and determining position information of the micro-LED to be repaired.

[0102] Among them, S124 and S125 can be placed before S11 and S12. Figure 4 In the figure, S121 and S122 are shown before S11, but this is not intended to limit the present application.

[0103] In S124 , the acquired spectral data may include spectral data of each micro-LED 21 in the light emitting element array 20 to be transferred.

[0104] For example, Figure 2 As shown, a spectrometer 40 can be used to collect spectrum data of each micro-LED 21 .

[0105] Each color of the micro-LED 21 may have its corresponding normal spectral range. In S125, if the spectrum of the collected micro-LED 21 is not within its corresponding spectral range, it can be considered that its spectrum is defective and the micro-LED 21 can be determined to be the micro-LED 21 to be repaired. Figure 2 The micro-LED 21b in FIG. 2 is a micro-LED 21 to be repaired that has a spectral defect.

[0106] For example, if the spectrum of each color of the micro-LED 21 is poor, the micro-LED 21 of each color cannot achieve white balance. In the embodiment of the present application, the micro-LED 21 with spectral defects can be screened out to prevent the defective micro-LED 21 from being transferred to the display module.

[0107] It can be understood that in the embodiment of the present application, the color camera 30 and the spectrometer 40 can be existing inspection equipment for inspecting the characteristics of the light-emitting element array 20 to be transferred, so that the inspection process of the light-emitting element array 20 to be transferred can be shared without adding additional equipment and processes.

[0108] like Figure 4 As shown, after S125, the brightness compensation method provided in the embodiment of the present application may further include the above-mentioned S123.

[0109] S123 may specifically include: repairing the spectrum of the micro-LED 21 to be repaired. If the spectrum of the repaired micro-LED 21 is within its corresponding spectrum range, the repair is considered complete.

[0110] Based on the position information of the micro-LED 21 to be repaired, the micro-LED 21 to be repaired with a spectral defect can be found among the multiple micro-LEDs in the light-emitting element array 20 to be transferred, and the spectrum of the micro-LED 21 to be repaired can be repaired. If the spectrum of the repaired micro-LED 21 is within the corresponding spectral range, the repair is considered complete.

[0111] This application does not specifically limit the method of repairing the spectrum.

[0112] In the embodiment of the present application, it is not necessary to discard the micro-LED 21 whose spectrum can be repaired, thus saving costs.

[0113] It is understandable that if the spectrum of the micro-LED 21 is significantly different from its corresponding spectral range, it can be considered that the spectrum of the micro-LED 21 cannot be repaired, and the micro-LED 21 can be removed to avoid transferring the micro-LED 21 with spectral defects to the display module.

[0114] Illustratively, S124, S125, and S123 may precede S11.

[0115] Exemplarily, S123 may be executed after S121 and S122, and then S124 and S125 may be executed, and then S123 may be executed again.

[0116] In some optional embodiments, such as Figure 5 As shown, before S12, the brightness compensation method provided in the embodiment of the present application may further include S126 and S127.

[0117] S126, determining a percentage of micro-LEDs that deviate from a preset target brightness based on the brightness data;

[0118] S127, determining the repair possibility of the light emitting element array to be transferred based on the quantity ratio.

[0119] In S126 , as an example, the preset target brightness may be the same brightness possessed by most of the micro-LEDs 21 in the light emitting element array 20 to be transferred.

[0120] For example, the light-emitting element array 20 to be transferred has 100 micro-LEDs 21, of which 70 micro-LEDs 21 have a brightness of 100 nit, and 30 micro-LEDs 21 have a brightness of 200 nit. The target brightness can be 100 nit, and the number of micro-LEDs 21 that deviate from the preset target brightness is 30, and the number ratio can be equal to 30 / 100, that is, the number ratio is 30%.

[0121] In S127, the number ratio can be compared with the target ratio. If the number ratio is greater than the target ratio, it can be considered that the number of micro-LEDs 21 with brightness defects in the light-emitting element array 20 to be transferred is large. In this case, the number of micro-LEDs 21 that need to be repaired is large, the repair difficulty is high, and the repair possibility of the light-emitting element array 20 to be transferred can be considered low. If the number ratio is less than or equal to the target ratio, it can be considered that the number of micro-LEDs 21 with brightness defects in the light-emitting element array 20 to be transferred is small. In this case, the number of micro-LEDs 21 that need to be repaired is small, the repair difficulty is relatively low, and the repair possibility of the light-emitting element array 20 to be transferred can be considered high.

[0122] According to the embodiments of the present application, the possibility of repairing the light emitting element array to be transferred can be predicted in advance, and the difficulty of repair and the number of process iterations required for repair can be determined. Figure 6 As shown, before S13, the brightness compensation method provided in the embodiment of the present application may further include S131.

[0123] S131, transferring a plurality of micro light emitting diodes of the light emitting element array to be transferred to an array substrate to obtain a display module.

[0124] The transferred micro-LEDs 21 may include the micro-LEDs 21 to be compensated determined in S12, may also include micro-LEDs 21 that do not require compensation, and may also include micro-LEDs 21 whose physical form and / or spectrum has been repaired.

[0125] In some optional embodiments, S131 may specifically include transferring the plurality of micro-LEDs 21 of the light-emitting element array 20 to be transferred to the array substrate by film rolling and bonding. This allows a large number of micro-LEDs 21 to be transferred in a relatively short time, further improving production efficiency.

[0126] As a specific example, Figure 7 As shown, the brightness compensation method provided in the embodiment of the present application may include S710 to S720.

[0127] At S710, optical data can be acquired for each micro-LED 21 (also referred to as a pixel) at each location in the array of light-emitting elements to be transferred 20. The optical data can include brightness data, color spectrum data, and morphological data that influences light-emitting characteristics. The location can be represented by coordinates, such as (x, y).

[0128] In S711, the morphology data may be analyzed first, where the morphology may include brightness morphology and physical morphology.

[0129] In S712, for the brightness morphology, the percentage of the defective morphology compared to the normal morphology can be calculated. The specific implementation of the brightness morphology can be as described in S126 and S127 above.

[0130] In S712, regarding the physical form, the specific implementation method may be as described in S121 and S122 above.

[0131] After S172, in S173, the micro-LED 21 whose physical form needs to be repaired can be identified, and in S174, the position coordinates of the micro-LED 21 whose physical form needs to be repaired can be sent to the repair module, so that the repair module can accurately and quickly find the micro-LED 21 whose physical form needs to be repaired and repair it.

[0132] After S172, in S175, the color spectrum data of each micro-LED 21 can be analyzed. For example, in S176, the degree of color spectrum shift of each micro-LED 21 can be calculated. The specific implementation of the color spectrum shift degree can be as described in S124 and S125 above.

[0133] In S173, the micro-LED 21 whose spectrum needs to be repaired can also be identified. In S174, the position coordinates of the micro-LED 21 whose spectrum needs to be repaired can be sent to the repair module, so that the repair module can accurately and quickly find the micro-LED 21 whose spectrum needs to be repaired and repair it.

[0134] In S177, the brightness data of each micro-LED 21 can be analyzed. Furthermore, in S178, the compensation value for the micro-LED 21 to be compensated is calculated. In S719, the compensation value and position information of the micro-LED 21 to be compensated can be sent to the compensation device of the display module, allowing the compensation device of the display module to accurately and quickly compensate the display module.

[0135] Based on the same inventive concept, the embodiment of the present application also provides a brightness compensation device. Figure 8 As shown, the brightness compensation device 800 may include a data acquisition module 801 , a compensation information determination module 802 and a data sending module 803 .

[0136] The data acquisition module 801 is used to acquire brightness data of the light emitting element array 20 to be transferred, where the light emitting element array 20 to be transferred includes a plurality of micro light emitting diodes 21;

[0137] The compensation information determining module 802 is configured to determine a micro-LED 21 to be compensated from the plurality of micro-LEDs 21 according to the brightness data, and to determine a compensation value and position information of the micro-LED 21 to be compensated;

[0138] The data sending module 803 is used to send the compensation value and position information of the micro-LED 21 to be compensated to the compensation module of the display module, where the display module includes the micro-LED 21 to be compensated.

[0139] According to the brightness compensation device provided in the embodiment of the present application, the brightness defects (e.g., mura) of the micro-LEDs 21 are identified before transfer, and the compensation value and position information of the micro-LEDs 21 to be compensated are determined. The determined compensation value and position information are then sent to the compensation device of the display module. In this way, the compensation device of the display module can conduct centralized inspections of the micro-LEDs 21 at corresponding positions during the compensation process, eliminating the need to perform brightness data analysis on all micro-LEDs 21, thereby eliminating unnecessary data analysis steps, shortening the time required for the compensation process, and improving production efficiency. In addition, the compensation device of the display module can conduct centralized inspections of the micro-LEDs 21 at corresponding positions during the compensation process, thereby improving the accuracy of compensation.

[0140] In some optional embodiments, the data acquisition module 801 is further configured to acquire physical morphology data of the light emitting element array 20 to be transferred;

[0141] like Figure 9 As shown, the brightness compensation device 800 may further include a morphology analysis module 804, which is used to determine the micro-LED 21 to be repaired from multiple micro-LEDs 21 based on physical morphology data, and determine the position information of the micro-LED 21 to be repaired.

[0142] In some optional embodiments, the data acquisition module 801 may also be used to acquire spectral data of the light emitting element array 20 to be transferred;

[0143] like Figure 9 As shown, the brightness compensation device 800 may further include a spectrum analysis module 805, which is used to determine the micro-LED 21 to be repaired from the multiple micro-LEDs 21 according to the spectrum data, and determine the position information of the micro-LED 21 to be repaired.

[0144] In some optional embodiments, such as Figure 9 As shown, the brightness compensation device 800 may further include a repair module 806 , which is used to repair the micro-LED 21 to be repaired.

[0145] In some optional embodiments, the morphology analysis module 804 may also be used to: determine, based on the brightness data, a percentage of the number of micro-LEDs 21 that deviate from a preset target brightness;

[0146] The repair possibility of the light emitting element array 20 to be transferred is determined based on the quantity ratio.

[0147] In some optional embodiments, the brightness compensation device 800 may further include a transfer module, which is used to transfer the plurality of micro-LEDs 21 of the light-emitting element array 20 to be transferred to the array substrate to obtain a display module;

[0148] In some optional embodiments, the transfer module can be specifically used to transfer the plurality of micro-LEDs 21 to the array substrate by thin film rolling and bonding.

[0149] The brightness compensation device in the embodiments of the present application can be a device, or a component, integrated circuit, or chip in a terminal. The device can be a mobile electronic device or a non-mobile electronic device. For example, the mobile electronic device can be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. The non-mobile electronic device can be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine (ATM), or a self-service machine, etc., and the embodiments of the present application do not specifically limit this.

[0150] The brightness compensation device provided in the embodiment of the present application can achieve Figure 1 To avoid repetition, each process in the embodiment of the brightness compensation method will not be described again here.

[0151] Figure 10 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application is shown.

[0152] The electronic device may include a processor 1001 and a memory 1002 storing computer program instructions.

[0153] Specifically, the processor 1001 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiment of the present invention.

[0154] The memory 1002 may include a large-capacity memory for data or instructions. By way of example and not limitation, the memory 1002 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory 1002 may include removable or non-removable (or fixed) media. Where appropriate, the memory 1002 may be inside or outside the integrated gateway disaster recovery device. In a specific embodiment, the memory 1002 is a non-volatile solid-state memory. In a specific embodiment, the memory 1002 includes a read-only memory (ROM). Where appropriate, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically rewritable ROM (EAROM), or a flash memory, or a combination of two or more of these. Exemplarily, the memory may include a non-volatile transient memory.

[0155] The processor 1001 reads and executes computer program instructions stored in the memory 1002 to implement any one of the brightness compensation methods in the above embodiments.

[0156] In one example, the electronic device may further include a communication interface 1003 and a bus 1010. Figure 8 As shown, the processor 1001, the memory 1002, and the communication interface 1003 are connected via a bus 1010 and communicate with each other.

[0157] The communication interface 1003 is mainly used to implement communication between various modules, devices, units and / or equipment in the embodiment of the present invention.

[0158] Bus 1010 comprises hardware, software or both, couples the parts of electronic equipment to each other.For example, and not limitation, bus can comprise accelerated graphics port (AGP) or other graphics bus, enhanced industry standard architecture (EISA) bus, front side bus (FSB), hypertransport (HT) interconnection, industry standard architecture (ISA) bus, infinite bandwidth interconnection, low pin count (LPC) bus, memory bus, micro channel architecture (MCA) bus, peripheral component interconnection (PCI) bus, PCI-Express (PCI-X) bus, serial advanced technology attachment (SATA) bus, video electronics standard association local (VLB) bus or other suitable bus or two or more of these combinations.In suitable cases, bus 1010 can comprise one or more buses.Although the embodiment of the present invention describes and shows specific bus, the present invention considers any suitable bus or interconnection.

[0159] The electronic device can execute the brightness compensation method in the embodiment of the present application, thereby realizing the combination Figure 1 and Figure 8 Described is a brightness compensation method and a brightness compensation device.

[0160] The present application also provides a computer-readable storage medium having a computer program stored thereon. When executed by a processor, the computer program implements the brightness compensation method described in the above embodiments and achieves the same technical effects. To avoid repetition, the above-described computer-readable storage medium may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, etc., without limitation herein.

[0161] The functional blocks shown in the above-described block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of the present application are programs or code segments that are used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or communication link via a data signal carried in a carrier wave. "Computer-readable medium" can include any medium capable of storing or transmitting information. Examples of computer-readable media include electronic circuits, semiconductor memory devices, ROMs, flash memories, erasable ROMs (EROMs), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0162] According to an embodiment of the present application, the computer-readable storage medium may be a non-transitory computer-readable storage medium.

[0163] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps. In other words, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0164] Aspects of the present application have been described above with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present application. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer or other programmable data processing device to produce a machine so that these instructions executed via the processor of the computer or other programmable data processing device enable the implementation of the function / action specified in one or more boxes of the flowchart and / or block diagram. This processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor or a field programmable logic circuit. It is also understood that each box in the block diagram and / or the flowchart and the combination of the boxes in the block diagram and / or the flowchart can also be implemented by the dedicated hardware that performs the specified function or action, or can be implemented by the combination of dedicated hardware and computer instructions.

[0165] While the embodiments described above are not exhaustive, they do not limit the present application to the specific embodiments described. Clearly, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present application, thereby enabling those skilled in the art to better utilize the present application and its modifications. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A brightness compensation method, characterized in that: include: Acquiring brightness data of a light-emitting element array to be transferred, wherein the light-emitting element array to be transferred includes a plurality of micro light-emitting diodes; Determining a micro-LED to be compensated from the plurality of micro-LEDs according to the brightness data, and determining a compensation value and position information of the micro-LED to be compensated; Sending the compensation value and position information of the micro-LED to be compensated to a compensation device of a display module, wherein the display module includes the micro-LED to be compensated; Before determining the micro-LED to be compensated from the plurality of micro-LEDs based on the brightness data, the method further includes: Determining, based on the brightness data, a percentage of the micro-LEDs that deviate from a preset target brightness; The repair possibility of the light emitting element array to be transferred is determined according to the quantity ratio.

2. The method according to claim 1, characterized in that Before determining the micro-LED to be compensated from the plurality of micro-LEDs based on the brightness data, the method further includes: Acquiring physical morphology data of the light-emitting element array to be transferred; According to the physical morphology data, a micro-LED to be repaired is determined from the plurality of micro-LEDs, and position information of the micro-LED to be repaired is determined.

3. The method according to claim 1, characterized in that Before determining the micro-LED to be compensated from the plurality of micro-LEDs based on the brightness data, the method further includes: Acquiring spectrum data of the light-emitting element array to be transferred; According to the spectral data, a micro-LED to be repaired is determined from the plurality of micro-LEDs, and position information of the micro-LED to be repaired is determined.

4. The method according to claim 2 or 3, characterized in that The method further comprises: Repairing the micro light emitting diode to be repaired.

5. The method according to claim 1, wherein The method further comprises: The plurality of micro-light emitting diodes of the light emitting element array to be transferred are transferred to an array substrate to obtain the display module.

6. The method according to claim 5, characterized in that The step of transferring the plurality of micro-LEDs of the light emitting element array to be transferred to an array substrate comprises: The plurality of micro light emitting diodes are transferred to the array substrate by means of film rolling and bonding.

7. A brightness compensation device, characterized in that: include: A data acquisition module, configured to acquire brightness data of a light-emitting element array to be transferred, wherein the light-emitting element array to be transferred comprises a plurality of micro light-emitting diodes; a compensation information determining module, configured to determine a micro-LED to be compensated from the plurality of micro-LEDs based on the brightness data, and determine a compensation value and position information of the micro-LED to be compensated; a data sending module, configured to send the compensation value and position information of the micro-LED to be compensated to a compensation module of a display module, wherein the display module includes the micro-LED to be compensated; The morphological analysis module is used to determine the percentage of the micro-LEDs that deviate from the preset target brightness based on the brightness data; and determine the possibility of repairing the light-emitting element array to be transferred based on the percentage of the number.

8. The brightness compensation device according to claim 7, wherein: include: The data acquisition module is further used to acquire physical morphology data of the light emitting element array to be transferred; The brightness compensation device further includes a morphology analysis module, which is used to determine the micro-LED to be repaired from the plurality of micro-LEDs based on the physical morphology data, and to determine position information of the micro-LED to be repaired.

9. The brightness compensation device according to claim 7, wherein: The data acquisition module is further used to acquire spectrum data of the light emitting element array to be transferred; The brightness compensation device further includes a spectrum analysis module, which is used to determine the micro-LED to be repaired from the plurality of micro-LEDs based on the spectrum data, and to determine position information of the micro-LED to be repaired.

10. The brightness compensation device according to claim 8 or 9, characterized in that: The brightness compensation device further includes a repair module, which is used to repair the micro-LED to be repaired.

11. An electronic device, characterized in that: include: A processor and a memory storing computer program instructions, wherein the processor implements the brightness compensation method according to any one of claims 1 to 6 when executing the computer program instructions.

12. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the brightness compensation method according to any one of claims 1 to 6 is implemented.

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