A flexible board and a method for manufacturing the flexible board.

Abstract

This invention discloses a flexible board and a method for manufacturing the flexible board. The flexible board includes a film and a flexible circuit board, with the film adhered to the surface of the circuit board. The manufacturing method includes the following steps: covering the outer wall of a cylindrical mold with a first release film; rolling the circuit board with adhesive-prepared adhesive around the outer side of the cylindrical mold, connecting the circuit board to a positioning component; covering the surface of the circuit board with a second release film; rolling an inflatable pressing component around the outer side of the cylindrical mold, connecting the inflatable pressing component to the positioning component, and covering the surface of the second release film; inflating the inflatable pressing component, causing it to bulge and apply uniform pressure to the circuit board; after the film is pressed and cured on the surface of the circuit board, removing the inflatable pressing component and taking out the manufactured flexible board.

Description

Technical Field

[0001] This invention relates to the field of flexible board manufacturing technology, and in particular to a flexible board and a method for manufacturing a flexible board. Background Technology

[0002] During the production of flexible boards, including FPCs, thermosetting adhesive films need to be bonded to the flexible circuit boards, and pressure is applied to the flexible circuit boards to ensure that the thermosetting adhesive films adhere to the circuit boards and are thermoset in a high-temperature environment.

[0003] Currently, the commonly used pressure application method is mechanical extrusion. The thermosetting adhesive film is attached to the surface of the flexible circuit board, and a pressure plate applies pressure to the surface of the circuit board. Some manufacturers add a soft buffer layer to the pressure plate in order to make full contact between the pressure plate and the surface of the circuit board, but this still cannot solve the problem of uneven pressure on the surface of the circuit board, affecting the bonding effect between the thermosetting adhesive film and the circuit board. Summary of the Invention

[0004] The embodiments of the present invention aim to solve at least one of the problems of the prior art. To this end, the embodiments of the present invention provide a flexible board and a method for manufacturing the flexible board.

[0005] In the manufacturing process of the flexible board provided by the present invention, the flexible board to be manufactured is rolled onto a cylindrical mold, and the flexible board is pressed together by an inflatable pressing component. The flexible board includes a film and a flexible circuit board, and the film is attached to the surface of the circuit board.

[0006] In some embodiments of the present invention, the flexible plate is rolled into a cylindrical shape, and the two ends of the flexible plate are bonded and fixed.

[0007] In some embodiments of the present invention, the flexible plate is provided with a positioning connection hole, which penetrates the flexible plate.

[0008] In some embodiments of the present invention, the side edge of the flexible plate along the length direction has a waste area to be cut, and the positioning connection hole is located in the waste area.

[0009] The flexible board manufacturing method provided by this invention uses an auxiliary fixture to press a film and a flexible circuit board. The auxiliary fixture includes a cylindrical mold and an inflatable pressing component, and a positioning component is provided on the outer wall of the cylindrical mold. The manufacturing method includes the following steps: covering the outer wall of the cylindrical mold with a first release film; rolling the circuit board, prepared with adhesive, around the outer side of the cylindrical mold, connecting the circuit board to the positioning component; covering the surface of the circuit board with a second release film; rolling the inflatable pressing component around the outer side of the cylindrical mold, connecting the inflatable pressing component to the positioning component, and covering the surface of the second release film; inflating the inflatable pressing component, causing it to bulge and apply uniform pressure to the circuit board; after the film is pressed and cured on the surface of the circuit board, disassembling the inflatable pressing component and removing the manufactured flexible board.

[0010] In some embodiments of the present invention, after the flexible board is baked and formed, the waste areas where the positioning connection holes are located on both sides of the flexible board are cut off.

[0011] In some embodiments of the present invention, when the circuit board is rolled up on the outside of the cylindrical mold, the two ends of the circuit board are bonded together.

[0012] In some embodiments of the present invention, the film is a thermosetting film, which is bonded to the surface of the circuit board by baking and curing.

[0013] In some embodiments of the present invention, the positioning component is telescopic on the cylindrical mold, and the positioning component is retracted into the outer wall of the cylindrical mold before the flexible plate is removed from the cylindrical mold.

[0014] In some embodiments of the present invention, the flexible plate is moved axially along the cylindrical mold and removed.

[0015] The embodiments of the present invention have at least the following beneficial effects: during the manufacturing process of the flexible board, the inflatable pressing component is attached to the surface of the flexible board. After the inflatable pressing component is inflated, it can apply pressure evenly to the flexible board so that the film and the circuit board are evenly bonded, thereby improving the bonding effect of the flexible board.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows. Some will thus become apparent from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings.

[0018] Figure 1 This is a schematic diagram of the structure of a columnar mold in some embodiments of the present invention.

[0019] Figure 2 This is a schematic diagram of the structure of the air-pressurized component in some embodiments of the present invention.

[0020] Figure 3 This is a schematic diagram of the structure in some embodiments of the present invention, showing the positioning component installed on the outer wall of the columnar mold.

[0021] Figure 4 This is a schematic diagram of the structure of the guide groove on the inner wall of the mounting hole in some embodiments of the present invention.

[0022] Figure 5 This is a schematic diagram of the structure of the flexible board obtained after baking in some embodiments of the present invention. The dashed line in the figure represents the boundary between the finished product area and the waste area. It should be noted that the actual product of the flexible board may not have this dashed line.

[0023] Figure 6 This is a schematic diagram of the structure of the flexible plate after the waste area is cut off in some embodiments of the present invention.

[0024] Figure 7 This is a schematic diagram of the unfolded circuit board structure in some embodiments of the present invention.

[0025] Figure 8 This is a schematic diagram of the structure in which the first release film, circuit board, film, second release film, and air-pressing component are arranged on the outside of the columnar mold during the flexible board manufacturing process.

[0026] Figure 9 This is one implementation method for manufacturing flexible boards. Detailed Implementation

[0027] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. The technical solutions between the various embodiments of the present invention can be combined with each other based on the ability of those skilled in the art to implement them.

[0028] In this invention, terms such as "first" or "second" are used for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. "A plurality of" means at least two. In the description of this invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," and "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention.

[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0030] This invention relates to a method for manufacturing a flexible board. The method uses an auxiliary fixture to press a film 311 and a flexible circuit board 312. The flexible board is rolled up in the auxiliary fixture, and the auxiliary fixture uses air pressure to press the flexible board so that the surface of the flexible board is uniformly pressed.

[0031] The auxiliary fixture includes a cylindrical mold 110 and an inflatable pressing component 120. The flexible plate is rolled around the outer peripheral sidewall of the cylindrical mold 110, and the inflatable pressing component 120 is attached to the surface of the flexible plate. The inflatable pressing component 120 is inflated and bulges out, and the inflatable pressing component 120 applies pressure evenly to the flexible plate.

[0032] The outer wall of the cylindrical mold 110 is made into a smooth surface to avoid damaging or sticking to the flexible sheet. Referring to the attached diagram, the cylindrical mold 110 is cylindrical, and the flexible sheet produced can be cylindrical. Alternatively, depending on the desired cylindrical shape of the flexible sheet, the cross-section of the cylindrical mold 110 can also be elliptical, triangular, rectangular, rhomboid, sector-shaped, regular polygonal, or irregular polygonal.

[0033] The outer wall of the cylindrical mold 110 is provided with a positioning component 111, which is used to position the connecting flexible plate. Referring to the attached figure, positioning components 111 are respectively provided at both ends of the outer wall of the cylindrical mold 110. Specifically, the positioning component 111 is configured as a positioning column.

[0034] The inflatable pressing component 120 is provided with a pressing connection hole 121, which penetrates the inflatable pressing component 120. The pressing connection hole 121 corresponds to the position of the positioning component 111. The pressing connection hole 121 is sleeved on the corresponding positioning component 111 so that the inflatable pressing component 120 is connected to the positioning component 111.

[0035] The inflatable pressing component 120 is made of elastic material, forming a compressible pressure bag. The inflatable pressing component 120 is rolled up around the outside of the cylindrical mold 110. Inflating the inflatable pressing component 120 is done by an air pressure generator. The inflated inflatable pressing component 120 adheres to the outside of the cylindrical mold 110, thereby applying uniform pressure to the flexible plate.

[0036] The pressure generator is equipped with a display screen to read the amount of gas supplied to the inflation and pressing component 120, thereby obtaining the pressure exerted by the inflation and pressing component 120 on the flexible plate. It is understood that the amount of gas supplied by the pressure generator to the inflation and pressing component 120 is adjustable, thereby adjusting the pressure exerted by the inflation and pressing component 120 on the flexible plate.

[0037] The inflatable pressing component 120 has a connecting part 122 at each end. The connecting part 122 allows the inflatable pressing component 120 to be detachably rolled around the outside of the cylindrical mold 110, and the two connecting parts 122 are detachably connected.

[0038] Referring to the accompanying drawings, one end of the inflatable pressing component 120 is provided with a pressing connection hole 121. After the inflatable pressing component 120 is positioned on the outer wall of the columnar mold 110 and rolled up, the two ends are connected by the joint 122 so that the inflatable pressing component 120 is pre-pressed on the surface of the flexible plate.

[0039] The two connecting parts 122 are connected by Velcro for easy assembly and disassembly. Of course, as an alternative, the connection between the two connecting parts 122 can also be set as one of the following: snap fastener, lock, or hook.

[0040] The positioning component 111 is extendable on the outer wall of the cylindrical mold 110. Specifically, the outer wall of the cylindrical mold 110 is provided with a mounting hole 112 for mounting the positioning component 111, and a compression elastic element 113 is provided in the mounting hole 112. One end of the compression elastic element 113 abuts against the bottom of the positioning component 111. When the positioning component 111 is pressed, the compression elastic element 113 contracts, and under the action of the compression elastic element 113, the positioning component 111 can extend out of the mounting hole 112. In some examples, the compression elastic element 113 is set as a compression spring.

[0041] It is understood that the port of the mounting hole 112 is provided with a first limiting part, which is set as the shoulder of the inner wall of the mounting hole 112. The outer wall of the positioning member 111 is provided with a second limiting part, which protrudes from the outer wall of the positioning member 111. The first limiting part abuts against the second limiting part to prevent the positioning member 111 from falling out of the mounting hole 112.

[0042] Pressing the positioning component 111 once retracts it into the mounting hole 112. Pressing it a second time causes it to extend out of the mounting hole 112, thus facilitating the attachment and detachment of the flexible plate and the inflatable pressing component 120 from the cylindrical mold 110. This action is described in detail in related art. One implementation method will be described below. It should be noted that the following description is merely illustrative and not a specific limitation of the invention.

[0043] The inner wall of the mounting hole 112 is provided with a guide groove 114, and the positioning component 111 is provided with a protruding structure that moves within the guide groove 114. Referring to the attached drawings, a guide block 115 is provided within the guide groove 114, positioned near the lower end of the guide groove 114. The guide block 115 has a guide surface 116 and a guide recess area 117. A guide protrusion 118 is provided on the inner wall of the lower end of the guide groove 114, and the guide protrusion 118 is positioned opposite to the guide recess area 117, with the sharp corner of the guide protrusion 118 offset from the sharp corner of the guide recess area 117.

[0044] This invention relates to a flexible board. In the process of manufacturing the flexible board, the flexible board to be manufactured is rolled up on a cylindrical mold 110, and the flexible board is pressed by an inflatable pressing component 120 to make the flexible board uniformly pressurized.

[0045] Understandably, the flexible board includes a film 311 and a flexible circuit board 312. During the manufacturing process, the film 311 is cured to adhere to the surface of the circuit board 312. In some examples, the circuit board 312 is configured as an F-PCB board.

[0046] In one implementation, the film 311 is configured as a thermosetting film. It is understood that the film 311 is heat-prepared on the surface of the circuit board 312, the circuit board 312 is rolled around the outside of the cylindrical mold 110, the inflatable pressing component 120 presses the circuit board 312, and the product and auxiliary fixture are baked to thermoset the film 311.

[0047] During the manufacturing process, to ensure accurate alignment of the flexible plate, a positioning connection hole 322 is provided on the flexible plate, which penetrates through the flexible plate. According to the position of the positioning component 111 on the columnar mold 110, a corresponding positioning connection hole 322 is provided on the flexible plate so that when the flexible plate is rolled up on the outer wall of the columnar mold 110, the positioning connection hole 322 is fitted onto the positioning component 111.

[0048] Specifically, the circuit board 312 and the film 311 each have positioning connection holes 322 at corresponding positions. When the film 311 is glued to the surface of the circuit board 312, the positioning connection holes 322 of the two correspond to each other.

[0049] It is understandable that the flexible plate has positioning connection holes 322 at both ends. Referring to the attached figure, the flexible plate has two positioning connection holes 322 at each end, and the four positioning connection holes 322 on the flexible plate are located diagonally.

[0050] In this case, when the flexible plate is rolled around the outer wall of the columnar mold 110, the two positioning connection holes 322 at one end are respectively fitted onto the two positioning components 111. After the flexible plate is rolled around, the two positioning connection holes 322 at the other end are also respectively fitted onto the two positioning components 111.

[0051] The flexible plate on the outside of the cylindrical mold 110 is baked and fixed in shape, and then rolled into a cylindrical shape to form a three-dimensional product. Furthermore, the two ends of the flexible plate are glued and fixed to maintain the three-dimensional product shape.

[0052] Specifically, the circuit board 312 has bonding areas 324 on its two sides. The bonding areas 324 are provided along the side edges of the circuit board 312 in the width direction. When the circuit board 312 is rolled up around the outside of the columnar mold 110, the bonding areas 324 are glued together to connect the two ends of the circuit board 312. It can be understood that the bonding area 324 at one end of the circuit board 312 is located on the front side of the flexible board, and the bonding area 324 at the other end is located on the back side of the circuit board 312.

[0053] It should be noted that the width direction of the circuit board 312 or the flexible board refers to the direction along the axial direction of the columnar mold 110 when the circuit board 312 is rolled up on the outer wall of the columnar mold 110, and the length direction of the circuit board 312 or the flexible board refers to the side extension direction of the flexible board as it is rolled up along the circumference of the outer wall of the columnar mold 110.

[0054] Furthermore, at the same end of the circuit board 312, the distance between the two ends of the bonding area 324 is less than the minimum distance between the two positioning connection holes 322 on the circuit board 312, so that the bonding area 324 avoids the positioning connection holes 322. It should be noted that the minimum distance between the two positioning connection holes 322 refers to the minimum distance between the edges of the two positioning connection holes 322.

[0055] Referring to the attached diagram, the side edges of the flexible board have a waste area 321 to be cut off, and the positioning connection hole 322 is located in the waste area 321. After the flexible board is manufactured, the waste areas 321 on both sides are cut off and removed, and the positioning connection hole 322 is also cut off accordingly, leaving the complete finished area 323 in the middle of the flexible board.

[0056] It is understandable that the cutting of the waste area 321 can be completed either when the baked flexible board is rolled onto the columnar mold 110, or after the flexible board is removed from the columnar mold 110.

[0057] To ensure that the finished product area 323 of the flexible board can be fully bonded and fixed at both ends, the adhesive area 324 for the backing adhesive should cover the width of the finished product area 323 at the ends of the flexible board. Furthermore, considering that there are waste areas 321 to be cut on both sides of the flexible board, the size of the adhesive area 324 is larger than the size of the finished product area 323 along the width direction of the flexible board. Referring to the attached drawings, both ends of the adhesive area 324 extend into the waste areas 321.

[0058] Based on the structure of the aforementioned auxiliary fixture and flexible sheet, the manufacturing method of the flexible sheet will be described below. Specifically, the manufacturing method includes the following steps.

[0059] Step S10: The first release film 201 is applied to the outer wall of the cylindrical mold 110.

[0060] In step S20, the circuit board 312 with the prepared adhesive is rolled around the outside of the cylindrical mold 110, and the circuit board 312 is connected to the positioning component 111.

[0061] Step S30: Apply the second release film 202 to the surface of the circuit board 312.

[0062] In step S40, an inflatable pressing component 120 is rolled up on the outside of the cylindrical mold 110. The inflatable pressing component 120 is connected to the positioning component 111, and the inflatable pressing component 120 is covered on the surface of the second release film 202.

[0063] In step S50, air is injected into the inflation and pressing component 120, causing the inflation and pressing component 120 to bulge and apply uniform pressure to the circuit board 312.

[0064] In step S60, after the film 311 is pressed and cured on the surface of the circuit board 312, the inflatable pressing component 120 is disassembled and the resulting flexible board is taken out.

[0065] It is understandable that in the above manufacturing method, setting the first release film 201 can prevent the circuit board 312 from sticking to the cylindrical mold 110, and setting the second release film 202 can prevent the film 311 from sticking to the inflatable pressing component 120.

[0066] In one implementation, the film 311 is a thermosetting film, which is bonded to the surface of the circuit board 312 by baking and curing. Specifically, after the inflatable pressing component 120 is inflated, the air pressure generator is removed, and the auxiliary fixture with the flexible plate is placed in an oven for baking. The baking temperature is set to 150°C, and the baking time is set to 60 minutes.

[0067] Understandably, after the film 311 is baked and cured, it adheres to the circuit board 312, allowing the flexible board to maintain its shape according to the outer periphery of the columnar mold 110, thus obtaining a three-dimensional columnar product form. Therefore, the cross-sectional shape of the columnar mold 110 is designed based on the desired columnar shape of the flexible board.

[0068] In one implementation, the positioning member 111 is telescopic on the cylindrical mold 110 so that it can be retracted into the outer wall of the cylindrical mold 110 before the flexible plate is removed from the cylindrical mold 110, thus preventing the positioning member 111 from obstructing the flexible plate. It is understood that the positioning member 111 needs to extend from the outer wall of the cylindrical mold 110 before the first release film 201 is applied or before the circuit board 312 is wound, serving a positioning and connection function.

[0069] Specifically, after the film 311 has cured and bonded, the pressure of the inflatable pressing component 120 is released, and the joint 122 of the inflatable pressing component 120 is separated, and the inflatable pressing component 120 is removed. The positioning component 111 is pressed down and retracted, and the flexible plate is moved along the axial direction of the cylindrical mold 110 and taken out, so as to avoid damaging the three-dimensional shape formed by the flexible plate.

[0070] Furthermore, in order to obtain a three-dimensional product form with the flexible board fixed, when the circuit board 312 is rolled up on the side of the columnar mold 110, the two ends of the circuit board 312 are bonded together so that the two ends of the baked flexible board are bonded and fixed.

[0071] After the flexible board is baked and formed, the waste area 321 containing the positioning connection holes 322 on both sides of the flexible board is cut off to obtain a flexible board with a finished product area 323. Specifically, cutting is performed using a specific mold and cutter, or laser cutting is used. In some examples, the waste area 321 is cut off after the flexible board is removed from the columnar mold 110. In some examples, the waste area 321 is cut off when the flexible board is rolled up outside the columnar mold 110.

[0072] It should be noted that when the flexible plate is in the form of a three-dimensional product, the side where the waste area 321 is located is the side that is rolled along the outer wall of the columnar mold 110.

[0073] In the description of this specification, the use of terms such as "an embodiment," "some examples," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" indicates that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0074] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A method for manufacturing a flexible board, characterized in that: The manufacturing method employs an auxiliary fixture for pressing a film (311) and a flexible circuit board (312). The auxiliary fixture includes a cylindrical mold (110) and an inflatable pressing component (120). A positioning component (111) is provided on the outer wall of the cylindrical mold (110). The manufacturing method includes... The first release film (201) is applied to the outer wall of the cylindrical mold (110); The circuit board (312) with the prepared glue is rolled up and wrapped around the outside of the cylindrical mold (110), and the circuit board (312) is connected to the positioning component (111); The second release film (202) is applied to the surface of the circuit board (312); An inflatable pressing component (120) is rolled up on the outside of the columnar mold (110). The inflatable pressing component (120) is connected to the positioning component (111). The inflatable pressing component (120) is covered on the surface of the second release film (202). Inflate the inflatable pressing component (120), causing the inflatable pressing component (120) to bulge and apply uniform pressure to the circuit board (312); After the film (311) is pressed and cured on the surface of the circuit board (312), the inflatable pressing component (120) is disassembled and the resulting flexible board is taken out.

2. The method for manufacturing a flexible board according to claim 1, characterized in that: After the flexible board is baked and formed, the waste area (321) where the positioning connection holes (322) are located on both sides of the flexible board is cut off.

3. The method for manufacturing a flexible board according to claim 1 or 2, characterized in that: When the circuit board (312) is rolled up on the outside of the cylindrical mold (110), the two ends of the circuit board (312) are bonded together.

4. The method for manufacturing a flexible board according to claim 1, characterized in that: The film (311) is a thermosetting film, which is bonded to the surface of the circuit board (312) by baking and curing.

5. The method for manufacturing a flexible board according to claim 1 or 2, characterized in that: The positioning component (111) is telescopic on the cylindrical mold (110). Before removing the flexible plate from the cylindrical mold (110), the positioning component (111) is retracted into the outer wall of the cylindrical mold (110).

6. The method for manufacturing a flexible board according to claim 5, characterized in that: The flexible plate is removed by moving it along the axial direction of the cylindrical mold (110).

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