Heat-conducting structure with liquid-gas shunting mechanism

Abstract

The application provides a heat conduction structure with liquid-gas flow separation mechanism, which comprises a shell, a capillary structure, a separation sheet and a working fluid. The shell has a cavity, which is divided into an evaporation chamber, a condensation chamber and a communication chamber formed between the evaporation chamber and the condensation chamber. The capillary structure is coated on the inner bottom wall of the cavity. The separation sheet is accommodated in the communication chamber and stacked above the capillary structure, and a gas flow channel is formed between the separation sheet and the inner top wall of the communication chamber. The working fluid is arranged in the cavity. In this way, the liquid working fluid and the gaseous working fluid are separated by the separation sheet, so as to improve the heat dissipation efficiency of the heat conduction structure.

Description

Technical Field

[0001] This invention relates to a heat spreader structure, and more particularly to a heat-conducting structure having a liquid-gas separation mechanism. Background Technology

[0002] As the instruction cycle of electronic components continues to increase, the heat they generate also increases. In order to effectively solve the problem of high heat generation, the industry has widely used vapor chambers with good thermal conductivity. However, there is still room for improvement in the thermal conductivity of existing vapor chambers.

[0003] Traditional heat spreaders mainly consist of an upper shell and a lower shell, with a capillary structure installed in the internal space of each shell. The upper and lower shells are then welded together, and working fluid is filled into them. Finally, degassing and sealing processes are applied to complete the process.

[0004] However, traditional vapor chambers have the following problems: when the vapor chamber is designed with a small cross-sectional area, the flow velocity of the gaseous working fluid will increase when it flows through the small cross-sectional area. This increased flow velocity will have a restraining effect on the returning liquid working fluid, blocking the returning liquid working fluid at the small cross-sectional area, which will cause the vapor chamber to burn dry and other adverse conditions. Summary of the Invention

[0005] This invention provides a heat-conducting structure with a liquid-gas separation mechanism, the purpose of which is to improve the heat dissipation efficiency of the heat-conducting structure by separating the liquid working fluid and the gaseous working fluid through a separator.

[0006] In an embodiment of the present invention, a heat-conducting structure with a liquid-gas separation mechanism is provided, comprising: a shell having a chamber, the chamber being divided into an evaporation chamber, a condensation chamber, and a connecting chamber formed between the evaporation chamber and the condensation chamber; a capillary structure covering the inner bottom wall of the chamber; a partition plate housed in the connecting chamber and stacked above the capillary structure, wherein an airflow channel is formed between the partition plate and the inner top wall of the connecting chamber; and a working fluid disposed inside the chamber.

[0007] Optionally, the inner periphery dimension of the communicating chamber is smaller than the inner periphery dimension of the evaporation chamber.

[0008] Optionally, the communicating chamber has an inner left wall and an inner right wall, with a gap between the inner left wall and the inner right wall, the gap gradually decreasing from the evaporation chamber toward the condensation chamber.

[0009] Optionally, the width of the partition gradually decreases from the evaporation chamber toward the condensation chamber, and the partition is a trapezoidal plate.

[0010] Optionally, the top view shape of the partition plate matches the cross-sectional shape of the interior of the connecting chamber, so that the partition plate completely covers the capillary structure of the connecting chamber.

[0011] Optionally, the separator is a copper foil or an aluminum foil.

[0012] Optionally, it also includes a plurality of heat dissipation fins, each of which is disposed outside the condensation chamber.

[0013] Optionally, the capillary structure is one of powder sintering, metal mesh, porous material, foam material, and groove structure.

[0014] Optionally, the housing includes an upper shell plate and a lower shell plate that are assembled together.

[0015] Optionally, there are several condensing chambers, connecting chambers, and partitions. Each condensing chamber is located around the evaporating chamber. Each connecting chamber is connected to the evaporating chamber and the condensing chamber. Each partition is housed in the connecting chamber and stacked on top of the capillary structure.

[0016] Based on the above, the liquid working fluid and the gaseous working fluid are separated by a separator, so that the liquid working fluid flows from the condenser to the evaporator along the capillary structure, and the gaseous working fluid flows from the evaporator to the condenser along the airflow channel. Therefore, the liquid working fluid is not disturbed by the gaseous working fluid and can return to the evaporator smoothly. At the same time, it avoids adverse conditions such as heat accumulation or dry burning of the heat-conducting structure, so that the heat-conducting structure has excellent heat dissipation efficiency.

[0017] Based on the above, when the inner periphery of the connecting chamber is smaller than that of the evaporation chamber, the gaseous working fluid will increase its flow velocity as it flows into the connecting chamber with a smaller cross-sectional area. However, the separator does separate the liquid working fluid from the gaseous working fluid, so the liquid working fluid will not be blocked by the accelerating gaseous working fluid and will smoothly return to the evaporation chamber, thus enhancing the heat dissipation efficiency of the heat conduction structure. Attached Figure Description

[0018] Figure 1 This is an exploded perspective view of the thermally conductive structure of the present invention.

[0019] Figure 2 This is a three-dimensional composite diagram of the heat-conducting structure of the present invention.

[0020] Figure 3 This is a cross-sectional schematic diagram of the heat-conducting structure of the present invention.

[0021] Figure 4 This is a cross-sectional schematic diagram of the heat-conducting structure of the present invention in use.

[0022] Figure 5 This is another cross-sectional schematic diagram of the heat-conducting structure of the present invention in use.

[0023] Figure 6 This is a cross-sectional schematic diagram of another embodiment of the heat-conducting structure of the present invention.

[0024] In the picture:

[0025] 10: Thermal conduction structure; 1: Shell; 11: Chamber; 111: Evaporation chamber; 112: Condensation chamber; 113: Connecting chamber; 114: Inner bottom wall; 115: Inner top wall; 116: Inner left wall; 117: Inner right wall; 12: Upper shell plate; 13: Lower shell plate; 2: Capillary structure; 3: Separator; 31: Trapezoidal plate; 4: Heat dissipation fins; h: Spacing; s: Airflow channel; w: Width; 100: Circuit board; 200: Heating element. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0027] Please refer to Figures 1 to 5 As shown, the present invention provides a heat-conducting structure with a liquid-gas separation mechanism. This heat-conducting structure 10 mainly includes a shell 1, a capillary structure 2, a separator 3, and a working fluid.

[0028] like Figures 1 to 5 As shown, the housing 1 has a chamber 11, which is divided into an evaporation chamber 111, a condensation chamber 112, and a connecting chamber 113 formed between the evaporation chamber 111 and the condensation chamber 112. The working fluid is disposed inside the chamber 11. This working fluid is a liquid that can produce a vapor-liquid phase change, such as pure water.

[0029] In addition, the inner periphery dimension of the connecting chamber 113 is smaller than the inner periphery dimension of the evaporation chamber 111, and the shell 1 includes an upper shell plate 12 and a lower shell plate 13 connected vertically.

[0030] The details are as follows: the interior of the connecting chamber 113 has an inner left wall 116 and an inner right wall 117 on the left and right sides. There is a distance h between the inner left wall 116 and the inner right wall 117. The distance h gradually decreases from the evaporation chamber 111 toward the condensation chamber 112.

[0031] like Figures 1 to 5As shown, the capillary structure 2 is covered on the inner bottom wall 114 of the bottom of the cavity 11. The capillary structure 2 is one of powder sintering, metal mesh, porous material, foam material and groove structure, so as to transport the liquid working fluid through its capillary adsorption force.

[0032] like Figures 1 to 5 As shown, the separator 3 is a metal foil such as a copper foil or an aluminum foil. The separator 3 is housed in the connecting chamber 113 and stacked above the capillary structure 2. An airflow channel s is formed between the separator 3 and the inner top wall 115 of the inner top of the connecting chamber 113.

[0033] Further explanation is as follows: the top view shape of the separator 3 matches the cross-sectional shape inside the connecting chamber 113, so that the separator 3 completely covers the capillary structure 2 of the connecting chamber 113, and the width w of the separator 3 gradually decreases from the evaporation chamber 111 towards the condensation chamber 112. In this embodiment, the separator 3 is a trapezoidal sheet 31, but this is not a limitation.

[0034] like Figures 4 to 5 As shown, the heat-conducting structure 10 of the present invention also includes a plurality of heat dissipation fins 4, which are disposed outside the condensation chamber 112.

[0035] The exterior of the evaporation chamber 111 is thermally bonded to the heating element 200 on the circuit board 100. The liquid working fluid in the evaporation chamber 111 absorbs the heat generated by the heating element 200 and becomes a gaseous working fluid. When the gaseous working fluid reaches the condensation chamber 112, it transfers heat to the heat sink fins 4 and becomes a liquid working fluid. The liquid working fluid then returns to the evaporation chamber 111 along the capillary structure 2, thus forming a thermal cycle.

[0036] like Figures 4 to 5 As shown, in the usage state of the heat-conducting structure 10 of the present invention, a separator 3 is housed in the connecting chamber 113 and stacked above the capillary structure 2. An airflow channel s is formed between the separator 3 and the inner top wall 115 of the connecting chamber 113, allowing the liquid working fluid to flow along the capillary structure 2 from the condensing chamber 112 to the evaporating chamber 111, and the gaseous working fluid to flow along the airflow channel s from the evaporating chamber 111 to the condensing chamber 112. In this way, the liquid and gaseous working fluids are separated by the separator 3, preventing the liquid working fluid from being disturbed by the gaseous working fluid, thus allowing it to smoothly return to the evaporating chamber 111. This also avoids heat accumulation or dry burning in the heat-conducting structure 10, resulting in excellent heat dissipation efficiency.

[0037] In addition, when the inner periphery of the connecting chamber 113 is smaller than the inner periphery of the evaporation chamber 111, the gaseous working fluid will increase its flow rate as it flows into the connecting chamber 113 with a smaller cross-sectional area. However, the partition 3 does separate the liquid working fluid from the gaseous working fluid, so the liquid working fluid will not be blocked by the accelerating gaseous working fluid and will smoothly return to the evaporation chamber 111, further enhancing the heat dissipation efficiency of the heat conduction structure 10.

[0038] Please refer to Figure 6 As shown, another embodiment of the heat-conducting structure 10 of the present invention is presented. Figure 6 Implementation examples and Figures 1 to 5 The embodiments are largely the same. Figure 6 Implementation examples and Figures 1 to 5 The difference in the embodiments is that the number of condensation chamber 112, connecting chamber 113, and partition 3 are respectively several.

[0039] The details are as follows: several heating elements 200 can be thermally attached to the outside of the evaporation chamber 111, several condensation chambers 112 are arranged around the evaporation chamber 111, and each connecting chamber 113 is connected to the evaporation chamber 111 and each condensation chamber 112 respectively. Each partition plate 3 is respectively housed in each connecting chamber 113 and stacked on top of the capillary structure 2, so that the heat generated by the heating elements 200 can be transferred from the evaporation chamber 111 to the multiple condensation chambers 112 for dissipation, thereby greatly increasing the heat dissipation efficiency of the heat-conducting structure 10.

[0040] The embodiments described above are merely preferred embodiments for fully illustrating the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A thermally conductive structure having a liquid-gas diversion mechanism, characterized by, The application relates to a heat pipe, comprising: a shell having a chamber, wherein the chamber is divided into an evaporation chamber, a condensation chamber and a communication chamber formed between the evaporation chamber and the condensation chamber; a capillary structure coated on the inner bottom wall of the chamber; a partition sheet accommodated in the communication chamber and stacked above the capillary structure, wherein an airflow passage is formed between the partition sheet and the inner top wall of the communication chamber; and a working fluid arranged in the chamber; wherein the left and right sides of the interior of the communication chamber have an inner left wall and an inner right wall, the inner left wall and the inner right wall have a spacing, the spacing gradually decreases from the evaporation chamber to the condensation chamber, the top view shape of the partition sheet matches the cross-sectional shape of the interior of the communication chamber, so that the partition sheet completely covers the capillary structure of the communication chamber, the width of the partition sheet is equal to the spacing between the inner left wall and the inner right wall, the width of the partition sheet gradually decreases from the evaporation chamber to the condensation chamber, and the partition sheet is a trapezoidal sheet.

2. The heat conducting structure with liquid-gas diversion mechanism of claim 1, wherein, The inner peripheral size of the communication chamber is smaller than the inner peripheral size of the evaporation chamber.

3. The heat conducting structure with liquid-gas diversion mechanism according to claim 1, wherein, The partition sheet is a copper foil or an aluminum foil.

4. The heat conducting structure with liquid-gas diversion mechanism of claim 1, wherein, The heat pipe further comprises a plurality of heat dissipation fins, and each heat dissipation fin is arranged outside the condensation chamber.

5. The heat conducting structure with liquid-gas diversion mechanism according to claim 1, wherein, The capillary structure is one of powder sintering, metal mesh, porous material, foamed material and groove structure.

6. The heat conducting structure with liquid-gas diversion mechanism according to claim 1, wherein, The shell comprises an upper shell plate and a lower shell plate which are assembled together.

7. The heat conducting structure with liquid-gas diversion mechanism according to claim 1, wherein, The number of condensation chambers, communication chambers and partition sheets is several, each condensation chamber is arranged outside the evaporation chamber, each communication chamber is communicated with the evaporation chamber and each condensation chamber, and each partition sheet is accommodated in each communication chamber and stacked above the capillary structure.

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