Stacking system

Abstract

This invention provides a stacking system. The stacking system includes a circuit board, an integrated circuit, a voltage regulation module, and a heat dissipation module. The integrated circuit and the voltage regulation module are disposed opposite to each other on a first and a second surface of the circuit board. The heat dissipation module includes a first heat sink and a second heat sink, located on the top surface of the integrated circuit and the bottom surface of the voltage regulation module, respectively. The second heat sink includes a base and an extension arm. The base is in thermal contact with the bottom surface of the voltage regulation module, and the extension arm extends from the base to the first heat sink and is in thermal contact with the first heat sink.

Description

Technical Field

[0001] This invention relates to the field of power electronics technology, and more particularly to a stacking system having a heat dissipation structure that works in conjunction with vertical power supply, so as to improve the heat dissipation efficiency of the voltage regulation module in the stacking system in a limited space, while simplifying the assembly and manufacturing process and reducing costs. Background Technology

[0002] Modern power electronic devices, as a crucial component of power conversion, are widely used in the power, electronics, motor, and energy industries. With the development of power electronics technology, higher demands are being placed on the power rating, power density, and modularity of high-power switching power supplies. Furthermore, the modular layout of power electronic devices must simultaneously consider the requirements for high power density and efficient heat dissipation.

[0003] With the development of data centers, artificial intelligence, and semiconductor technology, the power supply current of integrated circuits such as GPUs, CPUs, and ASICs is increasing, reaching over 1000A. Traditional horizontal power supply, where the voltage regulator module and integrated circuit are located on the same side of the circuit board, can no longer meet application performance requirements. This is because the long distance from the voltage regulator to the integrated circuit and the resulting direct current resistance (DCR) exceed 100μΩ, impacting power supply efficiency by more than 10%. Vertical power supply, where the voltage regulator module and integrated circuit are located on opposite sides of the circuit board, significantly reduces the distance between them, thus greatly reducing the DCR and significantly improving power supply efficiency. However, because the voltage regulator module and integrated circuit are on opposite sides, the space on the circuit board containing the integrated circuit for a dedicated heatsink to meet its cooling requirements is limited, especially when the available height on the bottom of the circuit board is limited, making the voltage regulator module a bottleneck for heat dissipation. For example, when the circuit board containing the integrated circuit is mounted on the system motherboard via a socket, the integrated circuit and the voltage regulation module are respectively located on the first and second sides of the circuit board. Due to the height limitation of the socket on the bottom of the circuit board, there is not enough height between the circuit board and the system motherboard for the voltage regulation module to install a heat dissipation device.

[0004] Therefore, how to develop a stacked system with a heat dissipation structure that works in conjunction with vertical power supply to improve the heat dissipation efficiency of the voltage regulation module in the stacked system within a limited space, while simplifying the assembly and manufacturing process and reducing costs, is a pressing issue that needs to be addressed in this field. Summary of the Invention

[0005] The purpose of this invention is to provide a stacking system with a heat dissipation structure that complements vertical power supply, thereby improving the heat dissipation efficiency of the voltage regulation module in a limited space, while simplifying the assembly and manufacturing process and reducing costs. In the vertical power supply stacking system, the voltage regulation module and integrated circuit are located on opposite sides of a circuit board. The heat dissipation module includes two sets of heat sinks, which are in thermal contact with the top surface of the integrated circuit and the bottom surface of the voltage regulation module, respectively, forming a vertical stacking structure. Furthermore, the two sets of heat sinks abut against each other through an extension arm of one of the heat sinks to improve the heat dissipation efficiency of the stacking system. Moreover, the two sets of heat sinks of the heat dissipation module can be securely connected to the circuit board using, for example, a spring screw locking assembly. When forming the vertical stacking assembly, the two sets of heat sinks can effectively contact the top surface of the integrated circuit and the bottom surface of the voltage regulation module, respectively. A thermal interface material layer can be added between the heat dissipation module and the integrated circuit and voltage regulation module to further improve heat dissipation performance.

[0006] Another objective of this invention is to provide a stacking system. Since the space between the voltage regulation module and the system motherboard is limited when the stacking system interfaces with a system motherboard via a connector, the vertical stacking structure effectively solves the heat dissipation problem of the voltage heat dissipation module. The locking component for securing the heat dissipation module can simultaneously fix the stacking system to the system motherboard, further simplifying the heat dissipation assembly process, reducing module costs, and enhancing product competitiveness. Furthermore, in applications where the voltage regulation module is configured with a bus voltage converter, the interface distance between the stacking system and the system motherboard is reduced. The vertical stacking structure of the stacking system can prevent interference between the heat dissipation module and the system motherboard in the vertical direction through the accommodating openings in the system motherboard, further reducing the overall height of the assembled stacking system and system motherboard, effectively solving the heat dissipation problem within limited space.

[0007] To achieve the aforementioned objectives, the present invention provides a stacking system including a circuit board, an integrated circuit, a voltage regulation module, and a heat dissipation module. The circuit board includes a first surface and a second surface opposite to each other. The integrated circuit is disposed on the first surface of the circuit board. The voltage regulation module is disposed on the second surface of the circuit board, spatially relative to the integrated circuit. The heat dissipation module includes a first heat sink and a second heat sink, wherein the first heat sink is located on a top surface of the integrated circuit and is in thermal contact with the top surface of the integrated circuit, and the second heat sink includes a base and at least one extension arm. The base is located on a bottom surface of the voltage regulation module and is in thermal contact with the bottom surface of the voltage regulation module, and the at least one extension arm extends from the base along the direction from the voltage regulation module to the circuit board, and is in thermal contact with the first heat sink.

[0008] In one embodiment, the stacking system further includes a locking component comprising a first locking member and a second locking member, wherein the first locking member connects the first heat sink to the circuit board and pushes the first heat sink to adhere to the top surface of the integrated circuit and at least one extension arm of the second heat sink, wherein the second locking member connects the second heat sink to the circuit board and pushes the base of the second heat sink to adhere to the bottom surface of the voltage regulation module.

[0009] In one embodiment, the circuit board includes a first locking hole penetrating through a first surface and a second surface, and the first heat sink includes a first through hole spatially relative to the first locking hole, wherein the first locking fastener connects the circuit board and the first heat sink through the first locking hole and the first through hole.

[0010] In one embodiment, the circuit board includes a second locking hole that penetrates the first surface and the second surface, and the second heat sink includes a second through hole that is spatially opposite to the second locking hole, wherein the second locking fastener connects the circuit board and the second heat sink through the second locking hole and the second through hole.

[0011] In one embodiment, the stacking system further includes at least one connector disposed on the second side of the circuit board, wherein the stacking system connects to at least one socket of a system motherboard via the at least one connector, thereby electrically connecting the integrated circuit and the voltage regulation module to the system motherboard.

[0012] In one embodiment, at least one connector has two connectors, and the voltage regulation module is disposed between the two connectors.

[0013] In one embodiment, the stacking system further includes at least one plug portion disposed on the second side of the circuit board, wherein the stacking system mates with at least one socket of a system motherboard through the at least one plug portion, thereby electrically connecting the integrated circuit and the voltage regulation module to the system motherboard, and the system motherboard includes a mounting hole and a second through hole spatially relative to the second heat sink, wherein when the at least one plug portion of the stacking system mates with the at least one socket of the system motherboard, the second fastener connects the system motherboard, the second heat sink and the circuit board through the mounting hole, the second fastening hole and the second through hole.

[0014] In one embodiment, a bottom surface of the base of the second heat sink is located on a top surface of the system motherboard.

[0015] In one embodiment, the system motherboard includes a receiving opening spatially relative to the second heat sink, wherein when at least one connector of the stacked system mates with at least one socket of the system motherboard, the second heat sink is at least partially received within the receiving opening.

[0016] In one embodiment, the shape of the receiving opening matches the shape of the base of the second heat sink, and the base is at least partially exposed on a bottom surface of the system motherboard.

[0017] In one embodiment, the stacking system further includes a bus voltage converter electrically connected between the connector and the voltage regulation module.

[0018] In one embodiment, a bus voltage converter is disposed on a first side of the circuit board, and a top surface of the bus voltage converter is in thermal contact with the first heat sink.

[0019] In one embodiment, the stacking system further includes a thermal interface material layer disposed between the bus voltage converter and the first heat sink.

[0020] In one embodiment, the circuit board includes a groove recessed from the outer periphery inward and spatially relative to at least one extension arm of the second heat sink, wherein the at least one extension arm is in thermal contact with the first heat sink through the groove.

[0021] In one embodiment, one sidewall of the groove is flush with one sidewall of the voltage regulation module and one sidewall of the integrated circuit, and at least one extension arm is attached to the sidewall of the groove, the sidewall of the voltage regulation module and the sidewall of the integrated circuit.

[0022] In one embodiment, the second heat sink includes two extension arms that extend from the two opposite sides of the base along the direction from the voltage regulation module to the circuit board, and make thermal contact with the first heat sink through the two opposite sidewalls of the voltage regulation module, the circuit board, and the two opposite sidewalls of the integrated circuit.

[0023] In one embodiment, the base of the second heat sink and the two extension arms form a U-shaped cross-section.

[0024] In one embodiment, the first locking device and the second locking device are spring screws.

[0025] In one embodiment, the spring screw includes a screw rod, a nut, and a telescopic spring disposed on the screw rod.

[0026] In one embodiment, the locking assembly includes at least two first locking members and at least two second locking members, the at least two first locking members being located on opposite sides of at least one integrated circuit, and the at least two second locking members being located on opposite sides of the voltage regulation module.

[0027] In one embodiment, the stacking system further includes a thermal interface material layer disposed between the top surface of the integrated circuit and the first heat sink, and between the bottom surface of the voltage regulation module and the base of the second heat sink.

[0028] In one embodiment, the stacking system further includes a thermal interface material layer disposed between at least one extension arm of the first heat sink and the second heat sink.

[0029] In one embodiment, the first heat sink is a liquid-cooled radiator.

[0030] In one embodiment, the first heat sink includes an inlet pipe, an outlet pipe, and a liquid cooling cavity. The inlet pipe and the outlet pipe are connected to the liquid cooling cavity and are located on one side of the first heat sink.

[0031] In one embodiment, the integrated circuit is selected from the group consisting of a graphics processor chip, a central processing unit chip, an application-specific integrated circuit chip, and a field-programmable gate array chip.

[0032] The beneficial effects of the present invention are that the embodiments of the present invention provide a stacking system having a heat dissipation structure that is compatible with vertical power supply, so as to improve the heat dissipation efficiency of the voltage regulation module in the stacking system in a limited space, while simplifying the assembly and manufacturing process and reducing costs. Attached Figure Description

[0033] Figure 1 An exploded view of the stacking system according to a first embodiment of the present invention is shown schematically.

[0034] Figure 2 An exploded view of the stacking system of the first embodiment of the present invention is shown schematically from another perspective.

[0035] Figure 3 A schematic diagram of the three-dimensional structure of the stacking system according to the first embodiment of the present invention is shown.

[0036] Figure 4 The diagram schematically illustrates the transverse cross-sectional structure of the stacking system according to the first embodiment of the present invention.

[0037] Figure 5 An exploded view of the structure of the motherboard corresponding to the stacking system of the first embodiment of the present invention is shown schematically.

[0038] Figure 6 The diagram schematically illustrates a three-dimensional structure of the stacking system and the system motherboard of the first embodiment of the present invention.

[0039] Figure 7 for Figure 6 Side view.

[0040] Figure 8 An exploded view of the stacking system according to a second embodiment of the present invention is shown schematically.

[0041] Figure 9 An exploded view of the stacking system of the second embodiment of the present invention is shown schematically from another perspective.

[0042] Figure 10 A schematic diagram of the three-dimensional structure of the stacking system according to the second embodiment of the present invention is shown.

[0043] Figure 11 The diagram schematically illustrates the longitudinal cross-sectional structure of the stacking system according to a second embodiment of the present invention.

[0044] Figure 12 An exploded view of the structure of the motherboard corresponding to the stacking system of the second embodiment of the present invention is shown schematically.

[0045] Figure 13 The diagram schematically illustrates a three-dimensional structure of the stacking system and the system motherboard of the second embodiment of the present invention.

[0046] Figure 14 The diagram schematically illustrates a three-dimensional structural view of the stacking system and the system motherboard of the second embodiment of the present invention from another perspective.

[0047] Figure 15 for Figure 13 Side view. Detailed Implementation

[0048] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be varied in different ways without departing from its scope, and the descriptions and drawings herein are for illustrative purposes only and not for limiting the invention. For example, if the following description of a first feature disposed on or above a second feature indicates that it includes embodiments where the first and second features are in direct contact, and also includes embodiments where additional features may be disposed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, different embodiments in this disclosure may use repeated reference numerals and / or markings. These repetitions are for simplification and clarity and are not intended to limit the relationships between the various embodiments and / or the described appearance structures. Moreover, to facilitate the description of the relationship between one component or feature and another (plural) component or feature in the drawings, spatially related terms such as "below," "below," "lower," "above," "upper," and similar terms may be used. In addition to the orientations shown in the accompanying drawings, spatially relevant terms are used to cover different orientations of the device in use or operation. The device may also be otherwise positioned (e.g., rotated 90 degrees or located in other orientations), and the descriptions of the spatially relevant terms used will be interpreted accordingly. Furthermore, when a component is referred to as "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. Although the numerical ranges and parameters of the broad scope of this disclosure are approximate, values ​​are stated as precisely as possible in specific examples. Additionally, it is understood that while terms such as "first," "second," and "third" may be used in the claims to describe different components, these components should not be limited by these terms, and the components described accordingly in the embodiments are represented by different component symbols. These terms are used to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. The term "and / or" as thus used includes any or all combinations of one or more of the related listed items. Except in operational / working instances, or unless expressly stated otherwise, all numerical ranges, quantities, values, and percentages disclosed herein (e.g., angles, durations of time, temperatures, operating conditions, quantity ratios, and those percentages thereof) should be understood to be modified by the terms “approximately” or “substantially” in all embodiments. Accordingly, unless indicated to the contrary, the numerical parameters set forth in this disclosure and the appended claims are approximate values ​​that may vary as necessary. For example, each numerical parameter should be interpreted at least according to the number of significant figures stated and by applying ordinary rounding principles. Ranges may be expressed herein as from one endpoint to another or between two endpoints. All ranges disclosed herein include endpoints unless otherwise specified.

[0049] Figure 1 and Figure 2 An exploded view of the stacking system according to a first embodiment of the present invention is shown schematically. Figure 3 A schematic diagram of the three-dimensional structure of the stacking system according to the first embodiment of the present invention is shown. Figure 4 The diagram schematically illustrates the transverse cross-sectional structure of a stacking system according to a first embodiment of the present invention. The present invention provides a stacking system 1 to solve the heat dissipation problem during vertical power supply. In this embodiment, the stacking system 1 includes a circuit board 10, an integrated circuit 20, a voltage regulation module 30, a heat dissipation module 40, and a locking assembly. The circuit board 10 includes a first surface 11 and a second surface 12 opposite to each other. The integrated circuit 20 is disposed on the first surface 11 of the circuit board 10. The voltage regulation module 30 is disposed on the second surface 12 of the circuit board 10, spatially opposite to the integrated circuit 20. The heat dissipation module 40 includes a first heat sink 41 and a second heat sink 42. In this embodiment, the first heat sink 41 is disposed on a top surface 21 of the integrated circuit 20 and is in thermal contact with the integrated circuit 20. The second heat sink 42 includes a base 421 and two extension arms 422 and 423. The base 421 is disposed on a bottom surface 31 of the voltage regulation module 30 and is in thermal contact with the bottom surface 31. The two extension arms 422 and 423 extend from the base 421 along the direction from the voltage regulation module 30 to the circuit board 10 (i.e., the Z-axis direction) and are in thermal contact with the first heat sink 41. In this embodiment, the locking assembly includes a first locking member 50 and a second locking member 60. The first locking member 50 connects the first heat sink 41 and the circuit board 10, and pushes the first heat sink 41 to adhere to the top surface 21 of the integrated circuit 20 and the two extension arms 422 and 423 of the second heat sink 42. Additionally, the second fastener 60 connects the second heat sink 42 to the circuit board 10, pushing against the base 421 of the second heat sink 42 to adhere to the bottom surface 31 of the voltage regulation module 30. Thus, the second heat sink 42, voltage regulation module 30, circuit board 10, integrated circuit 20, and second heat sink 41 of the stacked system 1 form a stacked structure in, for example, the Z-axis direction, perpendicular to the first surface 11 and the second surface 12 of the circuit board 10. The heat generated by the integrated circuit 20 and the voltage regulation module 30 can be dissipated through the first heat sink 41 and the second heat sink 42, respectively.

[0050] In this embodiment, the first heat sink 41 is, for example, a liquid-cooled heat sink, including an inlet pipe 412, an outlet pipe 413, and a liquid-cooled cavity 414. The inlet pipe 412 and the outlet pipe 413 are connected to the liquid-cooled cavity 414 and are located on one side of the first heat sink 41, for example, facing the X-axis direction. The refrigerant liquid (not shown) in the liquid-cooled cavity 414 can circulate through the inlet pipe 412 and the outlet pipe 413 to achieve a cooling effect. In this embodiment, the heat generated by the integrated circuit 20 can be carried away by the refrigerant liquid in the liquid-cooled cavity 414. Of course, the present invention is not limited thereto. In this embodiment, the second heat sink 42 includes two extension arms 422 and 423, which extend from opposite sides of the base 421 along the direction from the voltage regulation module 30 to the circuit board 10 (i.e., the Z-axis direction), through opposite sidewalls 32 and 33 of the voltage regulation module 30, opposite sidewalls 16 and 17 of the circuit board 10, and opposite sidewalls 22 and 23 of the integrated circuit 20, and are attached to the first heat sink 41. The heat generated by the voltage regulation module 30 can be transferred to the first heat sink 41 through the base 421 and the two extension arms 422 and 423 of the second heat sink 42, and then carried away by the refrigerant in the liquid cooling cavity 414, thereby improving the heat dissipation efficiency of the voltage regulation module 30 and the overall heat dissipation efficiency of the stacked system 1. The thickness of the base 421 of the second heat sink 42 does not affect the heat dissipation path of the voltage regulation module 30 through the second heat sink 42 to the first heat sink 41; the thickness of the base 421 can be designed according to the height specifications of the stacked system.

[0051] On the other hand, in this embodiment, the circuit board 10 includes at least one recess 15, recessed inward from the outer periphery of the circuit board 10, spatially relative to at least one extension arm 422, 423 of the second heat sink 42. In this embodiment, the two recesses 15 are respectively recessed inward from two opposite sides of the circuit board 10, so that the two extension arms 422, 423 of the second heat sink 42 can directly contact the first heat sink 41 through the recess 15 from the base 421, thereby avoiding the lengthening of the heat dissipation path of the voltage regulation module 30 from the second heat sink 42 to the first heat sink 41. In other words, by setting the groove 15 structure, the two opposite sidewalls 32 and 33 of the voltage regulation module 30, the two opposite sidewalls 16 and 17 of the circuit board 10, and the two opposite sidewalls 22 and 23 of the integrated circuit 20 can be flush with each other. Then, the two extension arms 422 and 423 of the second heat sink 42 can fit against the two opposite sidewalls 32 and 33 of the voltage regulation module 30, the two opposite sidewalls 16 and 17 of the circuit board 10, and the two opposite sidewalls 22 and 23 of the integrated circuit 20 and connect to the first heat sink 41. The base 421 of the second heat sink 42 and the two extension arms 422 and 423 form a U-shaped cross-section, optimizing the heat dissipation path of the voltage regulation module 30. In other embodiments, the groove 15 is, for example, a through groove, directly penetrating the first surface 11 and the second surface 12 of the circuit board 10. Of course, the present invention is not limited to this, and further details will not be provided.

[0052] It is worth noting that, in this embodiment, the first locking member 50 and the second locking member 60 are, for example, spring screws. To fix the first heat sink 41 and the second heat sink 42 to the circuit board, the locking assembly includes at least two first locking members 50 and at least two second locking members 60. The at least two first locking members 50 are located on opposite sides of the integrated circuit 20. The at least two second locking members 60 are located on opposite sides of the voltage regulation module 30. In this embodiment, the locking assembly is described with four first locking members 50 and four second locking members 60. In other embodiments, the number and location of the first locking members 50 and the second locking members 60 may be varied depending on the actual application. This invention is not limited thereto.

[0053] In this embodiment, the first locking member 50 includes a screw 51, a nut 53, and a telescopic spring 52. The second locking member 60 includes a screw 61, a nut 63, and a telescopic spring 62. Corresponding to the first locking member 50, the circuit board 10 includes a first locking hole 13, penetrating the first surface 11 and the second surface 12. In addition, the first heat sink 41 includes a first through hole 411, spatially opposite to the first locking hole 13. The first locking member 50 connects the circuit board 10 and the first heat sink 41 through the first locking hole 13 and the first through hole 411. The circuit board 10 and the first heat sink 41 are confined between the screw 51 and the nut 53 of the first locking member 50, and the telescopic spring 52 provides elastic force between the screw 51 and the circuit board 10, so that the first heat sink 41 is attached to the top surface 21 of the integrated circuit 20. In this embodiment, corresponding to the second fastener 60, the circuit board 10 includes a second fastening hole 14, penetrating the first surface 11 and the second surface 12. The second heat sink 42 includes a second through hole 424, spatially opposite to the second fastening hole 14. The second fastener 60 connects the circuit board 10 and the second heat sink 42 through the second fastening hole 14 and the second through hole 424. The circuit board 10 and the second heat sink 42 are confined between the screw 61 and the nut 63 of the second fastener 60. The telescopic spring 62 provides elastic force between the screw 61 and the circuit board 10, causing the base 421 of the second heat sink 42 to adhere to the bottom surface 31 of the voltage regulating module 30, while the two extension arms 422 and 423 of the second heat sink 42 adhere to the first heat sink 41. It should be noted that the fixed connection method between the circuit board and the heat sink module is not limited to, for example, the fastening connection between the first fastener 50 and the second fastener 60, and the fastening sequence and direction can be adjusted according to actual application requirements. This invention is not limited thereto.

[0054] In this embodiment, the first locking member 50 and the second locking member 60 of the locking assembly are described using spring screws as an example, but the present invention is not limited thereto. In this embodiment, to reduce the influence of interfacial thermal resistance between components, the stacking system 1 further includes a first thermal interface material layer 71 disposed between the top surface 21 of the integrated circuit 20 and the first heat sink 41, a second thermal interface material layer 72 disposed between the bottom surface 31 of the voltage regulation module 30 and the base 421 of the second heat sink 42, and a third thermal interface material layer 73 disposed between the two extension arms 422 and 423 of the first heat sink 41 and the second heat sink 42. Thus, by providing the first thermal interface material layer 71, the second thermal interface material layer 72, and the third thermal interface material layer 73, the thermal resistance in the heat transfer path can be reduced, while the influence of dimensional tolerances can be improved. Furthermore, when the thermal interface material layer uses thermally conductive silicone or resin, the polymer's flexibility can provide a certain buffering effect when the heat sink module 40 and the circuit board 10 are pressed together during the fixed connection in the stacking system 1. Of course, this invention is not limited thereto.

[0055] In this embodiment, the integrated circuit 20 is selected from, for example, one of the following groups: a graphics processing unit (GPU) chip, a central processing unit (CPU) chip, an application-specific integrated circuit (ASIC) chip, and a field-programmable gate array (FPGA) chip. In this embodiment, the stacked system 1 including the integrated circuit 20 and the voltage regulation module 30 can also be connected to a system motherboard for assembly and application. Figure 5 An exploded view of the structure of the motherboard corresponding to the stacking system of the first embodiment of the present invention is shown schematically. Figure 6 The diagram schematically illustrates a three-dimensional structure of the stacking system and the system motherboard of the first embodiment of the present invention. Figure 7 for Figure 6 Side view. Reference Figures 1 to 7In this embodiment, the stacking system 1 further includes at least one connector 70 disposed on the second surface 12 of the circuit board 10. The stacking system 1 connects to at least one socket 81 of a system motherboard 80 via the at least one connector 70, electrically connecting the integrated circuit 20 and the voltage regulation module 30 to the system motherboard 80. In this embodiment, two connectors 70 are correspondingly disposed on the second surface 12 of the circuit board 10, and the voltage regulation module 30 is disposed between the two connectors 70. By connecting the two connectors 70 to the system motherboard 80, the power supply requirements and signal connections of the integrated circuit 20 can be met, enabling vertical input of power energy and facilitating signal transmission between the integrated circuit 20 and the system motherboard 80.

[0056] In this embodiment, the vertical height (Z-axis direction) of the stacked system 1 after assembly onto the system motherboard 80 is mainly limited by the height of the socket 81. The voltage regulation module 30 is disposed between the two plug-in portions 70, and after the stacked system 1 is assembled onto the system motherboard 80, it is located between the two sockets 81. Due to limitations such as the height of the socket 81, the vertical height of the base 421 of the second heat sink 42 can be designed according to the height difference between the socket 81 and the voltage regulation module 30 to solve the heat dissipation problem in the confined space. In other words, the heat dissipation problem of the integrated circuit 20 and the voltage heat dissipation module 30 under vertical power supply can be effectively solved by the vertically stacked stacked system 1. In this embodiment, the system motherboard 80 includes a mounting hole 82 and a second through hole 424 of the second heat sink 42. When the stacked system 1 mates with the two sockets 81 on the system motherboard 80 via the two plug-in portions 70 on the second side 12 of the circuit board 10, the second fastener 60 can connect the system motherboard 80, the second heat sink 42, and the circuit board 10, for example, through the mounting holes 82, the second through holes 424, and the second locking holes 14 on the system motherboard 80. Since the space between the stacked system 1 and the system motherboard 80 is limited, the second fastener 60 used to fix the second heat sink 42 can simultaneously fix the stacked system 1 to the system motherboard 80, further simplifying the heat dissipation assembly process, reducing module costs, and enhancing product competitiveness. In other embodiments, when the space between the stacked system 1 and the system motherboard 80 is sufficient, the second fastener 60 can connect only the second heat sink 42 and the circuit board 10. Of course, the present invention is not limited thereto.

[0057] Figure 8 and Figure 9 An exploded view of the stacking system according to a second embodiment of the present invention is shown schematically. Figure 10 A schematic diagram of the three-dimensional structure of the stacking system according to the second embodiment of the present invention is shown. Figure 11 The diagram schematically illustrates the longitudinal cross-sectional structure of a stacking system according to a second embodiment of the present invention. In this embodiment, the stacking system 1a and... Figures 1 to 7The stacked system 1 shown is similar, and the same component labels represent the same components, structures, and functions, which will not be described again here. In this embodiment, the stacked system 1a also includes a bus converter 74 disposed on the first side 11 of the circuit board 10 and electrically connected between the connector 70 and the voltage regulation module 30. Through the bus converter 74, the power supply voltage provided by the connector 70 can be converted from a high voltage to 6V or 12V to supply the voltage regulation module 30. The advantage of this is that the power supply to the connector 70 can be increased from a low voltage of 6V or 12V to a high voltage of 48V or 54V, thus significantly reducing the current carried by the connector 70, significantly reducing the losses of the connector 70, significantly reducing the number of power supply pins in the connector 70, and significantly reducing the size of the connector 70. As the size of the insertion portion 70 on the second surface 12 of the circuit board 10 decreases, the vertical height of the voltage regulation module 30 and the vertical height of the base 421 of the second heat sink 42 on the second surface of the circuit board 10 can be further reduced, so as to facilitate the stacking system 1a to be combined with the system motherboard 80 in the manner described in the aforementioned embodiment. Of course, the present invention is not limited thereto.

[0058] In this embodiment, heat dissipation for the bus voltage converter 74 can be achieved by attaching the first heat sink 41 to the bus voltage converter 74. Since the bus voltage converter 74 is disposed on the first surface 11 of the circuit board 10, when the first fastener 50 connects the circuit board 10 and the first heat sink 41, the first fastener 50 simultaneously pushes the first heat sink 41 to adhere to a top surface 76 of the bus voltage converter 74. In this embodiment, the stacking system 1a further includes a thermal interface material layer 75 disposed between the top surface 76 of the bus voltage converter 74 and the first heat sink 41, further improving heat dissipation efficiency and mitigating the impact of dimensional tolerances. Of course, the present invention is not limited thereto.

[0059] Figure 12 An exploded view of the structure of the motherboard corresponding to the stacking system of the second embodiment of the present invention is shown schematically. Figure 13 The diagram schematically illustrates a three-dimensional structure of the stacking system and the system motherboard of the second embodiment of the present invention. Figure 14 The diagram schematically illustrates a three-dimensional structural view of the stacking system and the system motherboard of the second embodiment of the present invention from another perspective. Figure 15 for Figure 13 Side view. Reference Figures 8 to 15In this embodiment, by combining the voltage regulation module 30 with the bus voltage converter 74, the size of the plug-in portion 70 and the socket 81 can be further reduced. In other words, the docking distance between the stacked system 1a and the system motherboard 80 is reduced. To avoid interference between the heat dissipation module 40 and the system motherboard 80 in the vertical direction (Z-axis direction), in this embodiment, the system motherboard 80 includes an accommodating opening 83, spatially relative to the second heat sink 42. When the plug-in portion 70 of the stacked system 1a docks with the socket 81 of the system motherboard 80, the second heat sink 42 is at least partially accommodated in the accommodating opening 83 or penetrates the system motherboard 80 through the accommodating opening 83. For example, the shape of the base 421 of the second heat sink 42 matches the shape of the accommodating opening 83, while partially exposed on a bottom surface of the system motherboard 80. Of course, the present invention is not limited thereto. In other embodiments, as the docking distance between the stacking system 1a and the system motherboard 80 is reduced, the stacking system 1a can further reduce the vertical height of the base 421 of the second heat sink 42, so that the sum of the vertical heights of the base 421 of the second heat sink 42 and the voltage regulation module 30 is less than the plug-in portion 71. Therefore, the system motherboard 80 can omit the accommodating opening 83, meaning that a bottom surface of the base 421 of the second heat sink 42 is located on a top surface of the system motherboard 80, increasing the robustness of the system motherboard 80 and the overall reliability of the system. Of course, the assembly form of the stacking system 1a and the system motherboard 80 can be varied according to actual application requirements; this invention is not limited thereto and will not be elaborated further.

[0060] In summary, embodiments of the present invention provide a stacking system with a heat dissipation structure that complements vertical power supply, thereby improving the heat dissipation efficiency of the voltage regulation module in the stacking system within a limited space, while simplifying the assembly and manufacturing process and reducing costs. For the voltage regulation module and integrated circuit located on opposite sides of a circuit board, the heat dissipation module of the present invention includes two sets of heat sinks, which are respectively secured to the circuit board containing the integrated circuit and the voltage regulation module by two sets of locking components, and respectively make thermal contact with the top surface of the integrated circuit and the bottom surface of the voltage regulation module, forming a vertically stacked combination structure. Furthermore, when the two sets of heat sinks are secured to the circuit board by the two sets of locking components, the two sets of heat sinks further abut against each other through extension arms, improving the heat dissipation efficiency of the stacking system. Moreover, the two sets of heat sinks of the heat dissipation module are mounted to the circuit board by locking components such as spring screws, and when forming a vertically stacked combination structure, the two sets of heat sinks can effectively make thermal contact with the top surface of the integrated circuit and the bottom surface of the voltage regulation module, respectively. In addition, a thermal interface material layer can be added between the heat dissipation module and the integrated circuit and the voltage regulation module to further improve heat dissipation efficiency. When a stacked system interfaces with a system motherboard via connectors, the space between the voltage regulation module and the motherboard is limited. A vertically stacked assembly effectively solves the heat dissipation problem of the voltage heat dissipation module. The locking components used to secure the heat dissipation module also fix the stacked system to the motherboard, further simplifying the heat dissipation assembly process, reducing module costs, and enhancing product competitiveness. Furthermore, in applications where the voltage regulation module is combined with a bus voltage converter, the interface distance between the stacked system and the motherboard is reduced. The vertical stacking structure of the system avoids vertical interference between the heat dissipation module and the motherboard through the accommodating openings in the motherboard, further reducing the overall height of the assembled stacked system and motherboard, effectively solving the heat dissipation problem within limited space.

[0061] This invention may be modified in various ways by those skilled in the art, but all such modifications shall not depart from the protection sought by the appended claims.

Claims

1. A stacking system, comprising: A circuit board, comprising a first side and a second side opposite to each other; An integrated circuit is disposed on the first side of the circuit board; A voltage regulation module is disposed on the second side of the circuit board, spatially relative to the integrated circuit; as well as A heat dissipation module includes a first heat sink and a second heat sink. The first heat sink is located on a top surface of an integrated circuit and is in thermal contact with the top surface of the integrated circuit. The second heat sink includes a base and at least one extension arm. The base is located on a bottom surface of a voltage regulation module and is in thermal contact with the bottom surface of the voltage regulation module. The at least one extension arm extends from the base along the direction from the voltage regulation module to the circuit board and is in thermal contact with the first heat sink.

2. The stacking system of claim 1 further includes a locking component, the locking component including a first locking member and a second locking member, wherein the first locking member connects the first heat sink to the circuit board and pushes the first heat sink to adhere to the top surface of the integrated circuit and the at least one extension arm of the second heat sink, wherein the second locking member connects the second heat sink to the circuit board and pushes the base of the second heat sink to adhere to the bottom surface of the voltage regulation module.

3. The stacking system of claim 2, wherein the circuit board includes a first locking hole penetrating the first surface and the second surface, the first heat sink includes a first through hole spatially relative to the first locking hole, wherein the first locking fastener connects the circuit board and the first heat sink through the first locking hole and the first through hole.

4. The stacking system of claim 2, wherein the circuit board includes a second locking hole penetrating the first surface and the second surface, the second heat sink includes a second through hole spatially relative to the second locking hole, wherein the second fastener connects the circuit board and the second heat sink through the second locking hole and the second through hole.

5. The stacking system of claim 1 further includes at least one connector disposed on the second side of the circuit board, wherein the stacking system is connected to at least one socket of a system motherboard via the at least one connector, thereby electrically connecting the integrated circuit and the voltage regulation module to the system motherboard.

6. The stacking system of claim 5, wherein the at least one connector has two connectors, and the voltage regulation module is disposed between the two connectors.

7. The stacking system of claim 4 further includes at least one plug-in portion disposed on the second side of the circuit board, wherein the stacking system is connected to at least one socket of a system motherboard via the at least one plug-in portion, so that the integrated circuit and the voltage regulation module are electrically connected to the system motherboard, and the system motherboard includes a mounting hole spatially relative to the second through hole of the second heat sink, wherein when the at least one plug-in portion of the stacking system is connected to the at least one socket of the system motherboard, the second fastener connects the system motherboard, the second heat sink and the circuit board through the mounting hole, the second fastening hole and the second through hole.

8. The stacking system of claim 5 or 7, wherein a bottom surface of the base of the second heat sink is located on a top surface of the system motherboard.

9. The stacking system of claim 5 or 7, wherein the system motherboard includes a receiving opening spatially relative to the second heat sink, wherein when the at least one plug of the stacking system mates with the at least one socket of the system motherboard, the second heat sink is at least partially received in the receiving opening.

10. The stacking system of claim 9, wherein the shape of the receiving opening matches the shape of the base of the second heat sink, and the base is at least partially exposed on a bottom surface of the system motherboard.

11. The stacking system of claim 5 or 7 further includes a bus voltage converter electrically connected between the connector and the voltage regulation module.

12. The stacking system of claim 11, wherein the bus voltage converter is disposed on the first side of the circuit board, and a top surface of the bus voltage converter is in thermal contact with the first heat sink.

13. The stacking system of claim 12 further includes a thermal interface material layer disposed between the bus voltage converter and the first heat sink.

14. The stacking system of claim 1, wherein the circuit board includes a recess recessed from the outer periphery and spatially relative to the at least one extension arm of the second heat sink, wherein the at least one extension arm is in thermal contact with the first heat sink through the recess.

15. The stacking system of claim 14, wherein one sidewall of the recess is flush with one sidewall of the voltage regulation module and one sidewall of the integrated circuit, and the at least one extension arm is attached to the sidewall of the recess, the sidewall of the voltage regulation module and the sidewall of the integrated circuit.

16. The stacking system of claim 1, wherein the second heat sink includes two extension arms that extend from two opposite sides of the base, along the direction from the voltage regulation module to the circuit board, through the two opposite sidewalls of the voltage regulation module, the circuit board, and the two opposite sidewalls of the integrated circuit, and make thermal contact with the first heat sink.

17. The stacking system of claim 16, wherein the base of the second heat sink and the two extension arms form a U-shaped cross-section.

18. The stacking system of claim 2, wherein the first locking member and the second locking member are spring screws.

19. The stacking system of claim 18, wherein the spring screw includes a screw, a nut, and a telescopic spring disposed on the screw.

20. The stacking system of claim 2, wherein the locking component includes at least two first locking members and at least two second locking members, the at least two first locking members being located on opposite sides of the integrated circuit, and the at least two second locking members being located on opposite sides of the voltage regulation module.

21. The stacking system of claim 1 further includes a thermal interface material layer disposed between the top surface of the integrated circuit and the first heat sink and between the bottom surface of the voltage regulation module and the base of the second heat sink.

22. The stacking system of claim 1, further comprising a thermal interface material layer disposed between the first heat sink and the at least one extension arm of the second heat sink.

23. The stacking system of claim 1, wherein the first heat sink is a liquid-cooled heat sink.

24. The stacking system of claim 23, wherein the first heat sink includes an inlet pipe, an outlet pipe, and a liquid cooling cavity, the inlet pipe and the outlet pipe communicating with the liquid cooling cavity and located on one side of the first heat sink.

25. The stacked system of claim 1, wherein the integrated circuit is selected from the group consisting of a graphics processing unit chip, a central processing unit chip, an application-specific integrated circuit chip, and a field-programmable gate array chip.

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