Printed circuit board assembly including interposer circuit

Abstract

A printed circuit board assembly according to an embodiment may comprise: a first printed circuit board; a second printed circuit board; a first interposer circuit at least partially surrounding a first space between the first printed circuit board and the second printed circuit board; and a thermally conductive material disposed in the first space. The first interposer circuit may form a first ventilation path through which air can move from the first space to the outside of the printed circuit board assembly when the thermally conductive material is injected into the first space through a first hole formed through the first printed circuit board. The first ventilation path may connect a first end portion formed on the outside of a first portion of the first interposer circuit facing the outside to a second end portion formed on the inside of the first portion facing the first space. The length of the first ventilation path may be greater than the width of a portion of the first interposer circuit in which the first ventilation path is formed.

Description

Printed circuit board assembly including an interposer circuit

[0001] The present disclosure relates to a printed circuit board assembly comprising an interposer circuit.

[0002] As technology advances, the number of electronic components installed inside electronic devices is increasing, and devices are becoming smaller and slimmer. Accordingly, the technology for arranging multiple electronic components inside electronic devices is becoming important, and the technology for stacking multiple circuit boards containing multiple electronic components using interposers is developing.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] A printed circuit board assembly according to one embodiment of the present disclosure may include a first printed circuit board, a second printed circuit board, a first interposer circuit that at least partially surrounds a first space between the first printed circuit board and the second printed circuit board, and a thermally conductive material disposed within the first space. The first interposer circuit may form a first ventilation path through which air can move from the first space to the outside of the printed circuit board assembly when the thermally conductive material is injected into the first space through a first inlet formed in the first printed circuit board. The first ventilation path may connect a first end formed on the outer side facing the outside of the first part of the first interposer circuit and a second end formed on the inner side facing the first space of the first part. The length of the first ventilation path may be greater than the width of the part of the first interposer circuit where the first ventilation path is formed.

[0005] A printed circuit board assembly according to one embodiment of the present disclosure may include a first printed circuit board having a first opening, a second printed circuit board, an interposer circuit disposed to at least partially surround the space between the first printed circuit board and the second printed circuit board, and a thermally conductive material injected into the space. The interposer may include a recess formed on the inner side of a first portion of the interposer circuit in a direction facing the outside of the printed circuit board assembly. The first opening of the first printed circuit board may be formed at a position corresponding to the recess of the interposer circuit. A ventilation path through which air can move from the space to the outside of the printed circuit board assembly may be formed by the recess and the first opening.

[0006] FIG. 1 is an exploded perspective view of an electronic device according to one embodiment.

[0007] FIG. 2 is an exploded perspective view of a printed circuit board assembly according to one embodiment.

[0008] FIG. 3 is a perspective view of a printed circuit board assembly according to one embodiment.

[0009] FIG. 4 is a cross-sectional view of the cross section (A-A') of FIG. 3 according to one embodiment.

[0010] FIG. 5 is a drawing showing the positions of the first end and the second end of the first ventilation path according to one embodiment.

[0011] FIG. 6 is a drawing illustrating the shape of a first ventilation path according to one embodiment.

[0012] FIG. 7 is a drawing illustrating an example of a first kit formed by combining a first interposer circuit according to one embodiment with a first bridge portion.

[0013] FIG. 8 is a drawing illustrating an example of a first interposer circuit with a first bridge portion cut off according to one embodiment.

[0014] FIG. 9 is a drawing illustrating an example in which a first interposer circuit is coupled to a second printed circuit board coupled to a second bridge portion according to one embodiment.

[0015] FIG. 10 is a drawing illustrating an example in which a second bridge portion is cut off while the first interposer circuit is coupled to the second printed circuit board of FIG. 9 according to one embodiment.

[0016] FIG. 11 is a drawing illustrating an example of a plurality of conductors formed in a first interposer circuit according to one embodiment.

[0017] FIG. 12 is a drawing illustrating an example of a grounding pad composed of a plurality of conductors according to one embodiment.

[0018] FIG. 13 is a cross-sectional view of the cross section (B-B') of FIG. 12 according to one embodiment.

[0019] FIG. 14 is a drawing illustrating an example of a pipe connected to a first ventilation path according to one embodiment.

[0020] FIG. 15 is a drawing illustrating an example of a second air passage formed in the third part of a first interposer circuit according to one embodiment.

[0021] FIG. 16 is a drawing illustrating an example of a first ventilation path formed by a first groove and a second groove according to one embodiment.

[0022] FIG. 17 is a diagram illustrating an example of a third air passage formed in a second interposer circuit according to one embodiment.

[0023] FIG. 18 is a drawing illustrating an example of a first ventilation path according to one embodiment.

[0024] FIG. 19 is a drawing illustrating an example of a first interposer circuit including a recess according to one embodiment.

[0025] FIG. 20 is a block diagram of an electronic device in a network environment according to one embodiment.

[0026] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0027] The following description, with reference to the accompanying drawings, is provided to enable a more comprehensive understanding of the various embodiments defined by the claims of the present invention and their equivalents. The following description includes various specific details to aid understanding, but these may be merely illustrative. Accordingly, those skilled in the art will recognize that the various embodiments described herein may be changed or modified without departing from the scope and spirit of the present invention. Additionally, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0028] The terms and words used in the following description and claims are not limited to their dictionary meanings and may have been defined and used at the inventor's discretion to ensure a clear and consistent understanding of the content of the present invention. Accordingly, a person skilled in the art will understand that the following description of the embodiments of the present invention is for illustrative purposes only and is not intended to limit the present invention as defined by the appended claims and their equivalents.

[0029] The singular forms “a,” “an,” and “the” may be understood to include plural objects unless the context clearly indicates otherwise. For example, “a component surface” may be interpreted as including one or more component surfaces.

[0030] It can be understood that the blocks of each flowchart and combinations of flowcharts may be executed by one or more computer programs containing instructions. The entirety of one or more computer programs may be stored in a single memory device, or one or more computer programs may be divided and stored in multiple different memory devices.

[0031] It is understood that the functions or operations described below may be performed by a single processor or a combination of multiple processors. A single processor or a combination of multiple processors is composed of circuits that perform processing and may be composed of circuits including an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural network processing unit (NPU, e.g., an artificial intelligence (AI) chip), a wireless communication chip (Wi-Fi chip), a Bluetooth® chip, a global positioning system (GPS) chip, a near-field communication (NFC) chip, a connectivity chip, a sensor controller, a touch controller, a fingerprint sensor controller, a display driver integrated circuit (IC), an audio CODEC chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system-on-chip (SoC), and other ICs.

[0032] FIG. 1 is an exploded perspective view of an electronic device according to one embodiment.

[0033] Referring to FIG. 1, the electronic device (100) may include a plate (110) (e.g., a side bezel structure), a first support member (111) (e.g., a bracket or support structure), a front plate (120) (e.g., a front cover), a display (130), a substrate (140) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (150), a second support member (160) (e.g., a rear case), an antenna (170), and a rear plate (180) (e.g., a rear cover). In some embodiments, the electronic device (100) may omit at least one of the components (e.g., the first support member (111) or the second support member (160)) or additionally include other components.

[0034] The first support member (111) may be disposed inside the electronic device (100) and connected to the plate (110), or may be formed integrally with the plate (110). The first support member (111) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. The first support member (111) may have a display (130) attached to one side and a substrate (140) attached to the other side. The substrate (140) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0035] Memory may include, for example, volatile memory or non-volatile memory.

[0036] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (100) to an external electronic device and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0037] The battery (150) is a device for supplying power to at least one component of the electronic device (100) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (150) may be disposed substantially coplanar with, for example, the substrate (140). The battery (150) may be integrally disposed inside the electronic device (100). In another embodiment, the battery (150) may be disposed detachably from the electronic device (100).

[0038] An antenna (170) may be positioned between the rear plate (180) and the battery (150). The antenna (170) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (170) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In other embodiments, the antenna structure may be formed by a part or combination thereof of the side bezel structure (110) and / or the first support member (111).

[0039] FIG. 2 is an exploded perspective view of a printed circuit board assembly according to one embodiment. FIG. 3 is a perspective view of a printed circuit board assembly according to one embodiment.

[0040] According to one embodiment of the present disclosure, a printed circuit board assembly (200) may include a first printed circuit board (210), a second printed circuit board (220), and a first interposer circuit (230). For example, the printed circuit board assembly (200) may be placed inside the electronic device (100) of FIG. 1. For example, the printed circuit board assembly (200) may be placed between the plate (110) of FIG. 1 and the second support member (160) of FIG. 1. For example, the printed circuit board assembly (200) may be placed between the first support member (111) of FIG. 1 and the second support member (160) of FIG. 1. For example, the first printed circuit board (210) and the second printed circuit board (220) may be included in the substrate (140) of FIG. 1.

[0041] According to one embodiment of the present disclosure, referring to FIG. 2, a first interposer circuit (230) may be disposed between a first printed circuit board (210) and a second printed circuit board. For example, the first interposer circuit (230) may be disposed to at least partially surround the space between the first printed circuit board (210) and the second printed circuit board (220). For example, the first interposer circuit (230) may form a side of the printed circuit board assembly (200). For example, an internal space of the printed circuit board assembly (200) (e.g., the first space (310) of FIG. 4) may be formed by the first interposer circuit (230), the first printed circuit board (210), and the second printed circuit board (220). For example, the first interposer circuit (230) may support the first printed circuit board (210) and the second printed circuit board (220).

[0042] According to one embodiment of the present disclosure, with reference to FIG. 2, a first printed circuit board (210) and a second printed circuit board (220) may be combined with a first interposer circuit (230). For example, the first printed circuit board (210) may be attached to one side of the first interposer circuit (230) facing the +z-axis direction. For example, one side of the first interposer circuit (230) may be attached to the first printed circuit board (210) along the edge portion of the first printed circuit board (210). For example, the second printed circuit board (220) may be attached to the other side of the first interposer circuit (230) facing the -z-axis direction. For example, the other side of the first interposer circuit (230) may be attached to the second printed circuit board (220) along the edge portion of the second printed circuit board (220).

[0043] According to one embodiment of the present disclosure, the first interposer circuit (230) can electrically connect the first printed circuit board (210) and the second printed circuit board (220). For example, it can electrically connect electronic components placed on the first printed circuit board (210) and electronic components placed on the second printed circuit board (220). For example, the first interposer circuit (230) can transmit signals between electronic components of the first printed circuit board (210) and electronic components of the second printed circuit board (220). For example, the first interposer circuit (230) can serve as a grounding part to prevent residual current, leakage current, electrostatic discharge, noise, and / or electromagnetic interference (EMI) generated by the first printed circuit board (210) and / or the second printed circuit board (220).

[0044] According to one embodiment of the present disclosure, the first interposer circuit (230) can shield electromagnetic waves. For example, the first interposer circuit (230) can shield electromagnetic waves so that an electronic component placed inside the printed circuit board assembly (200) is not interfered with by electromagnetic waves generated by an electronic component placed outside the printed circuit board assembly (200). For example, the first interposer circuit (230) can shield noise so that noise generated by an electronic component inside the printed circuit board assembly (200) does not affect an electronic component outside the printed circuit board assembly (200).

[0045] According to one embodiment of the present disclosure, the first interposer circuit (230) may be formed of a material capable of conducting heat generated from a plurality of electronic components inside the printed circuit board assembly (200) to the outside of the printed circuit board assembly (200). According to one embodiment, heat inside the printed circuit board assembly (200) may be dissipated to the outside of the printed circuit board assembly (200) by a heat-conducting material (320) injected into the inside of the printed circuit board assembly (200) of FIG. 4, which will be described later.

[0046] FIG. 4 is a cross-sectional view of the cross section (A-A') of FIG. 3 according to one embodiment. For example, FIG. 4 may be a drawing showing a heat-conducting material (320) injected into the interior of a printed circuit board assembly (200).

[0047] According to one embodiment of the present disclosure, with reference to FIG. 4, a heat-conducting material (320) may be injected into a first space (310) of a printed circuit board assembly (200) through a first injection port (300). For example, the heat-conducting material (320) may be injected into the first space (310) through the first injection port (300) and placed within the first space (310). For example, the first injection port (300) may be formed in a second printed circuit board (220). For example, the first injection port (300) may be formed to penetrate one surface facing the +z-axis direction of the second printed circuit board (220) and another surface opposite to said surface. For example, the first injection port (300) may be formed in a portion that does not overlap with the first interposer circuit (230) of the second printed circuit board (220) when the second printed circuit board (220) is viewed from a direction perpendicular to one side facing the +z-axis direction of the second printed circuit board (220).

[0048] According to one embodiment of the present disclosure, the first space (310) may be an internal space of a printed circuit board assembly (200). For example, the first space (310) may be a space surrounded by a first printed circuit board (210), a second printed circuit board (220), and a first interposer circuit (230). For example, the first space (310) may be formed by arranging the first interposer circuit (230) to at least partially surround the space between the first printed circuit board (210) and the second printed circuit board (220).

[0049] According to one embodiment of the present disclosure, a heat-conducting material (320) may be filled within the first space (310). For example, the heat-conducting material (320) may cause heat generated by an electronic component mounted inside the first space (310), heat generated by an electronic component placed on the first printed circuit board (210), or / and heat generated by an electronic component placed on the second printed circuit board (220) to be dispersed within the first space (310). For example, by filling the first space (310) with the heat-conducting material (320), the heat-conducting material (320) may support the first printed circuit board (210) and the second printed circuit board (220) or prevent foreign matter from entering the first space (310). For example, the thermal conductive material (320) can improve the stability of signal transmission between electronic components inside the first space (310) or prevent the electronic components inside the first space (310) from being interfered with by electromagnetic waves outside the first space (310).

[0050] According to one embodiment of the present disclosure, for example, the thermal conductive material (320) may be a liquid filler. For example, as the liquid thermal conductive material (320) is injected into the first space (310), the pressure of the air within the first space (310) may increase. For example, as the pressure of the air within the first space (310) increases, electronic components within the first space (310) may be damaged. According to one embodiment, a ventilation path (e.g., the first ventilation path (400) of FIG. 5) that can discharge the air within the first space (310) to the outside of the first space (310) so as not to increase the pressure of the air within the first space (310) by the liquid thermal conductive material (320) may be formed in the printed circuit board assembly (200). The ventilation path (e.g., the first ventilation path (400) of FIG. 5) will be described in detail in FIG. 5, which will be described later.

[0051] FIG. 5 is a drawing showing the positions of the first end and the second end of the first ventilation path according to one embodiment.

[0052] According to one embodiment of the present disclosure, a printed circuit board assembly (200) may include a first ventilation path (400) formed to allow fluid in a first space (310) to move to the outside of the printed circuit board assembly (200). For example, while a liquid thermal conductive material (320) is injected into the first space (310), air in the first space (310) moves to the outside of the printed circuit board assembly (200) through the first ventilation path (400), and the pressure of the air in the first space (310) may not increase.

[0053] According to one embodiment of the present disclosure, when the first ventilation path (400) is formed in at least one of the first printed circuit board (210) or the second printed circuit board (220), the first ventilation path (400) must be formed at a location as far as possible from the first inlet (300); however, since electronic components are mounted on the first printed circuit board (210) and the second printed circuit board (220), there are limitations in determining the location of the first ventilation path (400). In order to form a path through which air within the first space (310) can be discharged at a location far from the first inlet (300) regardless of the location of the mounted electronic components, the first ventilation path (400) may be formed in the first interposer circuit (230).

[0054] According to one embodiment of the present disclosure, a first air passage (400) may be formed in any one of a plurality of parts of the first interposer circuit (230). For example, the first air passage (400) may be formed in a first part (510) of the first interposer circuit (230). For example, the first air passage (400) may be formed in a first part (510) located furthest from the first inlet (300) among the plurality of parts of the first interposer circuit (230). For example, the first part (510) may include a segment that separates the first part (510) into two parts. For example, the first air passage (400) may be formed by at least a portion of the gap formed in the segment being covered by the first printed circuit board (210) and the second printed circuit board (220). According to one embodiment, a plurality of parts of the first interposer circuit (230) may be referred to as a plurality of sides, and the first part (510) may be referred to as the first side.

[0055] According to one embodiment of the present disclosure, the first ventilation path (400) may include a first end (410) and a second end (420). For example, the first ventilation path (400) may connect the first end (410) and the second end (420). For example, the first end (410) may be formed on the outside of the first part (510). For example, the outside of the first part (510) may face the outside of the printed circuit board assembly (200). For example, the first end (410) may be formed on the outer surface of the first interposer circuit (230). For example, the second end (420) may be formed on the inside of the first part (510). For example, the inside of the first part (510) may face the inside of the printed circuit board assembly (200). For example, the inner side of the first part (510) may face the first space (310). For example, the second end (420) may be formed on the inner surface of the first interposer circuit (230).

[0056] According to one embodiment of the present disclosure, a first ventilation path (400) connecting a first end (410) and a second end (420) may be formed in a shape for shielding noise generated by electronic components placed in a first space (310) of a printed circuit board assembly (200) or for shielding electromagnetic waves generated by electronic components outside the printed circuit board assembly (200). The shape of the first ventilation path (400) will be described in detail in FIG. 6, which will be described later.

[0057] According to one embodiment of the present disclosure, the location where the fluid of the first space (310) is discharged to the first end (410) and the location where the fluid flows into the second end (420) may be different from each other. For example, when viewing the first ventilation path (400) from the +z-axis direction, the center axis of the first end (410) and the center axis of the second end (420) may not overlap each other. For example, when viewing the first ventilation path (400) from the +z-axis direction, the center axis of the first end (410) and the center axis of the second end (420) may be formed parallel to each other.

[0058] According to one embodiment of the present disclosure, the first interposer circuit (230) may include a second part (520) that extends from a first part (510) and is substantially perpendicular to the first part (510). The first part (510) may include one end that extends in a first direction (e.g., x-axis direction). The second part (520) may be formed by extending from one end of the first part (510) in a second direction (e.g., y-axis direction) different from the first direction. In FIG. 5, the direction in which the first part (510) extends and the direction in which the second part (520) extends are depicted as being substantially perpendicular, but are not limited thereto. According to one embodiment, the distance (d1) between one end of the second part (520) and the first end (410) may be different from the distance (d2) between one end of the second part (520) and the second end (420). For example, the distance (d1) between one end of the second part (520) and the first end (410) may be smaller than the distance (d2) between one end of the second part (520) and the second end (420). However, this is not limited to FIG. 5, and d1 and d2 may be appropriately modified and designed.

[0059] According to one embodiment of the present disclosure, the length of the first ventilation path (400) connecting the first end (410) and the second end (420) may be greater than the width of a portion of the first interposer circuit (230) where the first ventilation path (400) is formed. For example, the widths of a plurality of portions of the first interposer circuit (230) may be formed differently from one another, but the width of the portion of the first interposer circuit (230) where the first ventilation path (400) is formed may be smaller than the length of the first ventilation path (400).

[0060] According to one embodiment of the present disclosure, a first end (410) may be formed in a first part (510) of a first interposer circuit (230) toward a first axis (e.g., -y-axis) toward the outside of a printed circuit board assembly (200). According to one embodiment, a second end (420) may be formed in a first part (510) of the first interposer circuit (230) toward a first space (310). For example, the position of the first end (410) on a second axis (e.g., +x-axis) substantially perpendicular to the first axis and the position of the second end (420) on the second axis may be different from each other.

[0061] According to one embodiment of the present disclosure, a first ventilation path (400) connecting a first end (410) and a second end (420) may be formed so as not to be perpendicular to the first part (510). For example, the first ventilation path (400) may be formed so as not to be parallel to the second part (520). For example, by forming the first ventilation path (400) so as not to be parallel to the second part (520), electromagnetic waves may be shielded by the first ventilation path (400).

[0062] FIG. 6 is a drawing illustrating the shape of a first ventilation path according to one embodiment.

[0063] According to one embodiment of the present disclosure, the first ventilation path (400) may be formed to include at least one bend portion to shield electromagnetic waves flowing into the interior of the first ventilation path (400). For example, the first ventilation path (400) may include a first portion (610), a second portion (620), a third portion (630), a first bend portion (640), and a second bend portion (650).

[0064] According to one embodiment of the present disclosure, referring to FIG. 6, the first portion (610) may be a portion extending in a third direction from the first end portion (410) to the first bend portion (640). For example, the third direction may be a direction toward the first space (310). For example, the third direction may be a direction substantially parallel to the +y-axis. According to one embodiment, the first bend portion (640) may be located between the first portion (610) and the second portion (620). For example, the first bend portion (640) may be a portion connecting the first portion (610) and the second portion (620). For example, the first bend portion (640) may include a curved portion. For example, the first part (610) may extend from one side of the first bend (640), and the second part (620) may extend from the other side of the first bend (640).

[0065] According to one embodiment of the present disclosure, with reference to FIG. 6, the second portion (620) may be a portion extending in a fourth direction from the first bend portion (640) to the second bend portion (650). For example, the fourth direction may be a direction perpendicular to the second portion (610). For example, the fourth direction may be a direction parallel to the +x axis. According to one embodiment, the second bend portion (650) may be located between the second portion (620) and the third portion (630). For example, the second bend portion (650) may be a portion connecting the second portion (620) and the third portion (630). For example, the second bend portion (650) may include a curved portion. For example, the second part (620) is connected to one side of the second bend (650), and the third part (630) may extend from the other side of the second bend (650).

[0066] According to one embodiment of the present disclosure, with reference to FIG. 6, the third portion (630) may be a portion extending in a fifth direction from the second bend portion (650) to the second end portion (420). For example, the fifth direction may be a direction perpendicular to the fourth direction. For example, the fifth direction may be a direction toward the first space (310). For example, the fifth direction may be a direction parallel to the +y-axis. The shape of the first bend portion (640) and the second bend portion (650) is not limited to a curved shape, and the first bend portion (640) may be deformed within a range for connecting the first portion (610) and the second portion (620), and the second bend portion (650) may be deformed within a range for connecting the second portion (620) and the third portion (630).

[0067] FIG. 7 is a drawing illustrating an example of a first kit formed by combining a first interposer circuit according to one embodiment with a first bridge portion. FIG. 8 is a drawing illustrating an example of a first interposer circuit with the first bridge portion cut off according to one embodiment.

[0068] According to one embodiment of the present disclosure, with reference to FIG. 7, the first kit (710) may include a first interposer circuit (230) and a first bridge portion (720). For example, the first interposer circuit (230) may be manufactured in a state connected to the first bridge portion (720) during the manufacturing process of the printed circuit board assembly (200). For example, with reference to FIG. 8, the first bridge portion (720) of the first kit (710) may be cut to form a single part of the first interposer circuit (230).

[0069] According to one embodiment of the present disclosure, referring to FIG. 8, before the first interposer circuit (230) is placed between the first printed circuit board (210) and the second printed circuit board (220), the first interposer circuit (230) may include a connection portion (730). For example, the connection portion (730) may be part of the first bridge portion (720). For example, the connection portion (730) may be located between the first ventilation path (400) and the first bridge portion (720). For example, the connection portion (730) may be a portion surrounding the first end (410) of the first ventilation path (400).

[0070] According to one embodiment of the present disclosure, for example, a portion of the first part (510) of the first interposer circuit (230) and the remaining portion may be formed to be separated by a first ventilation path (400). For example, when a connecting portion (730) formed to surround the first end (410) of the first ventilation path (400) is cut during the process of forming a single part of the first interposer circuit (230), the first part (510) of the first interposer circuit (230) may be bent or damaged. For example, the connecting portion (730) may guide the attachment position of the first interposer circuit (230) during the process of attaching the first interposer circuit (230) to the second printed circuit board (220).

[0071] FIG. 9 is a drawing illustrating an example in which a first interposer circuit is coupled to a second printed circuit board coupled to a second bridge portion according to one embodiment. FIG. 10 is a drawing illustrating an example in which the second bridge portion is cut off while the first interposer circuit is coupled to the second printed circuit board of FIG. 9 according to one embodiment.

[0072] According to one embodiment of the present disclosure, with reference to FIG. 9, the second kit (810) may include a second printed circuit board (220) and a second bridge portion (820). For example, the second printed circuit board (220) may be manufactured in a state connected to the second bridge portion (820) during the manufacturing process of the printed circuit board assembly (200). For example, with reference to FIG. 10, the second bridge portion (820) of the second kit (810) may be cut to form the printed circuit board assembly (200) while the first interposer circuit (230) is attached to the second printed circuit board (220).

[0073] According to one embodiment of the present disclosure, with reference to FIG. 9, a connection portion (730) of the first interposer circuit (230) may be arranged to overlap with the second bridge portion (820) of the second kit (810). For example, the connection portion (730) may guide the first interposer circuit (230) to be attached to the second printed circuit board (220). For example, the connection portion (730) may be formed to wrap around a portion of the first air passage (400) of the first interposer circuit (230) so that the first portion (510) of the first interposer circuit (230) is not bent or damaged by the first air passage (400) during the process of attaching the first interposer circuit (230) to the second printed circuit board (220).

[0074] According to one embodiment of the present disclosure, with reference to FIG. 10, with the first interposer circuit (230) attached to the second printed circuit board (220), the connection portion (730) can be cut together with the second bridge portion (820). With the connection portion (730) and the second bridge portion (820) cut, the first printed circuit board (210) can be attached to the first interposer circuit (230) to produce a printed circuit board assembly (200).

[0075] FIG. 11 is a drawing illustrating an example of a plurality of conductors formed in a first interposer circuit according to one embodiment. FIG. 12 is a drawing illustrating an example of a grounding pad composed of a plurality of conductors according to one embodiment. FIG. 13 is a cross-sectional view of the cross section (B-B') of FIG. 12 according to one embodiment.

[0076] According to one embodiment of the present disclosure, with reference to FIG. 11, the first interposer circuit (230) may include a plurality of conductors (900). For example, some of the plurality of conductors (900) may be disposed on one plane facing the +z-axis direction of the first interposer circuit (230). For example, the remaining portion of the plurality of conductors (900) may be disposed on the other plane facing the -z-axis direction of the first interposer circuit (230).

[0077] According to one embodiment of the present disclosure, for example, some of the plurality of conductors (900) may transmit and receive signals between electronic components disposed on a first printed circuit board (210) and electronic components disposed on a second printed circuit board (220). For example, the printed circuit board assembly (200) may include a ground portion, and other portions of the plurality of conductors (900) may transmit residual current, or / and static electricity generated in the printed circuit board assembly (200), to the ground portion.

[0078] According to one embodiment of the present disclosure, referring to FIG. 11, some of the plurality of conductors (900) may be positioned adjacent to the first ventilation path (400). For example, some of the plurality of conductors (900) may be positioned around the first ventilation path (400). For example, some of the plurality of conductors (900) may be positioned on the first interposer (230) along the first ventilation path. For example, by positioning some of the plurality of conductors (900) along the first ventilation path (400), some of the plurality of conductors (900) can effectively transfer static electricity flowing into the first ventilation path (400) to the ground. For example, the conductors among the plurality of conductors (900) positioned around the first ventilation path (400) may be electrically connected to the ground of the first printed circuit board (210) and / or the second printed circuit board (220). For example, noise generated inside the first space (310) of the first interposer circuit (230) or / and noise generated outside the printed circuit board assembly (200) can be grounded through the ground portion of the first printed circuit board (210) and / or the second printed circuit board (220) by conductors disposed around the first ventilation path (400).

[0079] According to one embodiment of the present disclosure, referring to FIG. 12, a printed circuit board assembly (200) may include a plurality of ground pads comprising at least one conductor among a plurality of conductors (900). For example, the plurality of ground pads may include a first ground pad (910), a second ground pad (920), a third ground pad (930), and a fourth ground pad (940). According to one embodiment, the plurality of ground pads may be disposed on a first interposer (230) along a first ventilation path (400). For example, when viewed from above (e.g., in the z-axis direction) of the printed circuit board assembly (200), the first ground pad (910) may be disposed between the outside of a first part (510) of the first interposer circuit (230) and a second part (620) of the first ventilation path (400). For example, when viewed from above (e.g., in the z-axis direction) of the printed circuit board assembly (200), the second ground pad (920) may be positioned between the second part (620) of the first air passage (400) and the inner side of the first part (510) of the first interposer circuit (230). For example, when viewed from above (e.g., in the z-axis direction) of the printed circuit board assembly (200), the first part (610) of the first air passage (400) may be located between the first ground pad (910) and the third ground pad (930). For example, when viewed from above (e.g., in the z-axis direction) of the printed circuit board assembly (200), the third part (630) of the first air passage (400) may be located between the second ground pad (920) and the fourth ground pad (940).

[0080] According to one embodiment of the present disclosure, electromagnetic waves flowing into the first ventilation path (400) through the second end (420) can be transmitted to the ground portion of the printed circuit board assembly (200) by a first battery pad (910), a second ground pad (920), a third ground pad (930), or / and a fourth ground pad (940) arranged along the first ventilation path (400) among a plurality of signal pads. For example, by arranging a plurality of signal pads at a location adjacent to the first ventilation path (400), noise emitted from the first space (310) to the outside of the printed circuit board assembly (200) can be transmitted to the ground portion.

[0081] According to one embodiment of the present disclosure, with reference to FIG. 13, a plurality of ground pads may further include a fifth ground pad (950) and a sixth ground pad (960). According to one embodiment, the first ground pad (910) and the second ground pad (920) may be disposed between one side facing the +z-axis direction of the first printed circuit board (210) and the first interposer circuit (230). For example, the first ground pad (910) and the second ground pad (920) may transmit signals generated by electronic components provided on the first printed circuit board (210) to the ground portion of the printed circuit board assembly (200). According to one embodiment, the fifth ground pad (950) and the sixth ground pad (960) may be disposed between the other side facing the -z-axis direction of the second printed circuit board (220) and the first interposer circuit (230). For example, the fifth ground pad (950) and the sixth ground pad (960) can transmit signals generated by electronic components provided on the second printed circuit board (220) to the ground portion of the printed circuit board assembly (200).

[0082] According to one embodiment of the present disclosure, the first ground pad (910) and the fifth ground pad (950) may be electrically connected through a conductive via formed within the first interposer circuit (230). According to one embodiment, the second ground pad (920) and the sixth ground pad (960) may be electrically connected through a conductive via formed within the first interposer circuit (230).

[0083] FIG. 14 is a drawing illustrating an example of a pipe connected to a first ventilation path according to one embodiment.

[0084] According to one embodiment of the present disclosure, a pipe (1000) may be connected to a first ventilation path (400) of a printed circuit board assembly (200). For example, if a vacuum pipe (1000) is connected to the first ventilation path (400), air in a first space (310), which has a relatively higher pressure than inside the pipe (1000), may move along the pipe (1000) to the outside of the printed circuit board assembly (200). According to one embodiment, as air in the first space (310) inside the printed circuit board assembly (200) moves along the pipe (1000) to the outside of the printed circuit board assembly (200), a liquid heat-conducting material (320) may be effectively filled into the first space (310) through the first inlet (300).

[0085] FIG. 15 is a drawing illustrating an example of a second air passage formed in the third part of a first interposer circuit according to one embodiment.

[0086] According to one embodiment of the present disclosure, a plurality of parts of the first interposer circuit (230) may further include a third part (1110). For example, the third part (1110) may be a part that extends from the second part (520) and is perpendicular to the second part (520). For example, the third part (1110) may be a part opposite to the first part (510). For example, the third part (1110) may be a part formed parallel to the first part (510). According to one embodiment, the third part (1110) may be referred to as a third side.

[0087] According to one embodiment of the present disclosure, the printed circuit board assembly (200) may further include a second ventilation path (1100). For example, the second ventilation path (1100) may be formed in a third part (1110) of the first interposer circuit (230). For example, the second ventilation path (1100) may be formed in the same way as the first ventilation path (400) of FIGS. 5 to 14. According to one embodiment, when the second ventilation path (1100) is formed in the first interposer circuit (230) together with the first ventilation path (400), the air inside the printed circuit board assembly (200) can be discharged more effectively to the outside of the printed circuit board assembly (200) than when only the first ventilation path (400) is formed in the first interposer circuit (230).

[0088] According to one embodiment of the present disclosure, with reference to FIG. 15, a first inlet (300) may be formed on a second printed circuit board (220) such that the distance from the first ventilation path (400) and the second ventilation path (1100) is the same. For example, if the first inlet (300) is formed closer to the second ventilation path (1100) than to the first ventilation path (400), the liquid heat-conducting material (320) filled into the first space (310) through the first inlet (300) may be discharged to the outside of the printed circuit board assembly (200) through the second ventilation path (1100) before the first space (310) is completely filled. For example, if the position of the first inlet (300) is designed such that the distance between the first inlet (300) and the first ventilation path (400) and the distance between the first inlet (300) and the second ventilation path (1100) are the same, the heat-conducting material (320) can be filled to be evenly distributed in the first space (310).

[0089] FIG. 16 is a drawing illustrating an example of a first ventilation path formed by a first groove and a second groove according to one embodiment.

[0090] According to one embodiment of the present disclosure, the first interposer circuit (230) may include a first groove (1210) and a second groove (1220). For example, the first groove (1210) may be formed on one side facing the +z-axis direction of the first part (510). For example, the first groove (1210) may include a recess formed in the -z-axis direction. For example, the second groove (1220) may be formed on the other side facing the -z-axis direction of the first part (510). For example, the second groove (1220) may include a recess formed in the +z-axis direction.

[0091] According to one embodiment of the present disclosure, the first air passage (400) may be divided into two paths by the first groove (1210) and the second groove (1220). For example, one air passage may be formed by the first groove (1210) and a second printed circuit board (220) positioned to cover the first groove (1210), and another air passage may be formed by the second groove (1220) and a first printed circuit board (210) positioned to cover the second groove (1220). According to one embodiment, as the first air passage (400) is divided into two paths, the size of the first end (410) and the second end (420) is reduced, so that the speed of air traveling through the two paths can be increased.

[0092] FIG. 17 is a diagram illustrating an example of a third air passage formed in a second interposer circuit according to one embodiment.

[0093] According to one embodiment of the present disclosure, the printed circuit board assembly (200) may further include a third printed circuit board (1310) and a second interposer circuit (1320). For example, the second interposer circuit (1320) may be laminated on the second printed circuit board (220). For example, the second interposer circuit (1320) may be positioned to at least partially surround the space between the second printed circuit board (220) and the third printed circuit board (1310).

[0094] According to one embodiment of the present disclosure, the printed circuit board assembly (200) may further include a third air passage (1330). For example, the third air passage (1330) may be surrounded by a second printed circuit board (220), a third printed circuit board (1310), and a second interposer circuit (1320). The shape and / or position of the third air passage (1330) may correspond to, but is not limited to, the first air passage (400) of FIGS. 5 through 14.

[0095] According to one embodiment of the present disclosure, a second injection port (1300) may be formed in a third printed circuit board (1310). For example, a thermal conductive material (320) may be injected into the interior of a printed circuit board assembly (200) through the second injection port (1300). According to one embodiment, the second injection port (1300) may be formed at a position corresponding to the first injection port (300), but is not limited thereto. For example, the thermal conductive material (320) injected through the second injection port (1300) may fill the space surrounded by the second printed circuit board (220), the third printed circuit board (1310), and the second interposer circuit (1320) after the first space (310) is completely filled through the first injection port (300).

[0096] According to one embodiment of the present disclosure, while the heat-conducting material (320) is filled inside the printed circuit board assembly (200), the air inside the printed circuit board assembly (200) can be discharged to the outside of the printed circuit board assembly (200) through the first ventilation path (400) and the third ventilation path (1300).

[0097] FIG. 18 is a drawing illustrating an example of a first ventilation path according to one embodiment.

[0098] According to one embodiment of the present disclosure, the first air passage (400) of the printed circuit board assembly (200) may not include at least one bend. For example, the first air passage (400) may be formed perpendicular to the first portion (510). For example, the first air passage (400) may be formed parallel to the second portion (520). For example, the distance (d1) between the first end (410) and the second portion (520) of the first interposer circuit (230) and the distance (d2) between the second end (420) and the second portion (520) may be the same.

[0099] According to one embodiment of the present disclosure, when the first ventilation path (400) does not include at least one bend, the fluid in the first space (310) of the printed circuit board assembly (200) can be discharged more easily to the outside of the printed circuit board assembly (200) through the first ventilation path (400) than when the first ventilation path (400) includes at least one bend.

[0100] FIG. 19 is a drawing illustrating an example of a first interposer circuit including a recess according to one embodiment.

[0101] According to one embodiment of the present disclosure, the first interposer circuit (230) may include a recess (1510). For example, the recess (1510) may be formed in a first portion (510) of the first interposer circuit (230). For example, the recess (1510) may be formed on the inside of the first portion (510). For example, the recess (1510) may be formed concavely in a direction facing the outside of the printed circuit board assembly (200). For example, the recess (1510) may be formed by removing a portion of the first portion (510).

[0102] According to one embodiment of the present disclosure, the second printed circuit board (220) may include a third opening (1520). For example, the third opening (1520) may be formed to penetrate the second printed circuit board (220). For example, the third opening (1520) may be formed at a position corresponding to the recess (1510) of the first interposer circuit (230). For example, when the second printed circuit board (220) is placed on the first interposer circuit (230), the third opening (1520) may be aligned with the recess (1510).

[0103] According to one embodiment of the present disclosure, the recess (1510) and the third opening (1520) may form a ventilation path. For example, fluid inside the printed circuit board assembly (200) may be discharged to the outside of the printed circuit board assembly (200) through the recess (1510) and the third opening (1520). For example, while a heat-conducting material (320) is injected into the interior of the printed circuit board assembly (200) through the first inlet (300), fluid inside the printed circuit board assembly (200) may be discharged to the outside of the printed circuit board assembly (200) through the recess (1510) and the third opening (1520).

[0104] FIG. 20 is a block diagram of an electronic device (2001) in a network environment (2000) according to one embodiment. Referring to FIG. 20, in the network environment (2000), the electronic device (2001) may communicate with an electronic device (2002) through a first network (2098) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (2004) or a server (2008) through a second network (2099) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (2001) may communicate with the electronic device (2004) through the server (2008). According to one embodiment, the electronic device (2001) may include a processor (2020), memory (2030), input module (2050), sound output module (2055), display module (2060), audio module (2070), sensor module (2076), interface (2077), connection terminal (2078), haptic module (2079), camera module (2080), power management module (2088), battery (2089), communication module (2090), subscriber identification module (2096), or antenna module (2097). In some embodiments, at least one of these components (e.g., connection terminal (2078)) may be omitted from the electronic device (2001), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (2076), camera module (2080), or antenna module (2097)) may be integrated into a single component (e.g., display module (2060)).

[0105] The processor (2020) can, for example, execute software (e.g., program (2040)) to control at least one other component (e.g., hardware or software component) of the electronic device (2001) connected to the processor (2020) and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (2020) can store commands or data received from other components (e.g., sensor module (2076) or communication module (2090)) in volatile memory (2032), process the commands or data stored in volatile memory (2032), and store the resulting data in non-volatile memory (2034). According to one embodiment, the processor (2020) may include a main processor (2021) (e.g., a central processing unit or an application processor) or an auxiliary processor (2023) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (2001) includes a main processor (2021) and an auxiliary processor (2023), the auxiliary processor (2023) may be configured to use less power than the main processor (2021) or to be specialized for a specified function. The auxiliary processor (2023) may be implemented separately from the main processor (2021) or as part thereof.

[0106] The auxiliary processor (2023) may control at least some of the functions or states associated with at least one component of the electronic device (2001) (e.g., display module (2060), sensor module (2076), or communication module (2090)) on behalf of the main processor (2021) while the main processor (2021) is in an inactive (e.g., sleep) state, or together with the main processor (2021) while the main processor (2021) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (2023) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (2080) or communication module (2090)). According to one embodiment, the auxiliary processor (2023) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (2001) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (2008)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0107] The memory (2030) can store various data used by at least one component of the electronic device (2001) (e.g., a processor (2020) or a sensor module (2076)). The data may include, for example, input data or output data for software (e.g., a program (2040)) and related commands. The memory (2030) may include volatile memory (2032) or non-volatile memory (2034).

[0108] The program (2040) may be stored as software in memory (2030) and may include, for example, an operating system (2042), middleware (2044), or an application (2046).

[0109] The input module (2050) can receive commands or data to be used for a component of the electronic device (2001) (e.g., processor (2020)) from outside the electronic device (2001) (e.g., user). The input module (2050) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0110] The sound output module (2055) can output a sound signal to the outside of the electronic device (2001). The sound output module (2055) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0111] The display module (2060) can visually provide information to an external (e.g., user) of the electronic device (2001). The display module (2060) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (2060) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0112] The audio module (2070) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (2070) can acquire sound through the input module (2050) or output sound through the sound output module (2055) or an external electronic device (e.g., electronic device (2002)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (2001).

[0113] The sensor module (2076) can detect the operating state of the electronic device (2001) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (2076) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0114] The interface (2077) may support one or more specified protocols that can be used for the electronic device (2001) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (2002)). According to one embodiment, the interface (2077) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0115] The connection terminal (2078) may include a connector through which the electronic device (2001) can be physically connected to an external electronic device (e.g., electronic device (2002)). According to one embodiment, the connection terminal (2078) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0116] The haptic module (2079) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (2079) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0117] The camera module (2080) can capture still images and video. According to one embodiment, the camera module (2080) may include one or more lenses, image sensors, image signal processors, or flashes.

[0118] The power management module (2088) can manage the power supplied to the electronic device (2001). According to one embodiment, the power management module (2088) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0119] The battery (2089) can supply power to at least one component of the electronic device (2001). According to one embodiment, the battery (2089) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0120] The communication module (2090) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (2001) and an external electronic device (e.g., electronic device (2002), electronic device (2004), or server (2008)), and the performance of communication through the established communication channel. The communication module (2090) may include one or more communication processors that operate independently of the processor (2020) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (2090) may include a wireless communication module (2092) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (2094) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (2004) through a first network (2098) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (2099) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (2092) can identify or authenticate the electronic device (2001) within a communication network such as the first network (2098) or the second network (2099) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (2096).

[0121] The wireless communication module (2092) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (2092) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (2092) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (2092) can support various requirements specified in the electronic device (2001), external electronic device (e.g., electronic device (2004)), or network system (e.g., second network (2099)). According to one embodiment, the wireless communication module (2092) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0122] The antenna module (2097) can transmit a signal or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module (2097) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (2097) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (2098) or a second network (2099), may be selected from the plurality of antennas, for example, by a communication module (2090). The signal or power may be transmitted or received between the communication module (2090) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (2097).

[0123] According to various embodiments, the antenna module (2097) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0124] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0125] According to one embodiment, commands or data may be transmitted or received between an electronic device (2001) and an external electronic device (2004) through a server (2008) connected to a second network (2099). Each of the external electronic devices (2002, or 2004) may be the same or a different type of device as the electronic device (2001). According to one embodiment, all or part of the operations performed on the electronic device (2001) may be performed on one or more of the external electronic devices (2002, 2004, or 2008). For example, if the electronic device (2001) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (2001) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (2001). The electronic device (2001) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (2001) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (2004) may include an Internet of Things (IoT) device. The server (2008) may be an intelligent server using machine learning and / or neural networks.According to one embodiment, an external electronic device (2004) or server (2008) may be included within the second network (2099). The electronic device (2001) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0126] The problem to be solved according to one embodiment of the present disclosure may be as follows.

[0127] According to one embodiment of the present disclosure, a printed circuit board assembly may be provided that includes a ventilation path formed on the side of the interposer so as not to increase the pressure inside the interposer due to a heat-conducting material introduced into the interposer.

[0128] According to one embodiment of the present disclosure, a printed circuit board assembly may be provided that includes a ventilation path formed with a fold portion capable of shielding electromagnetic waves generated by an electronic component provided inside an interposer.

[0129] According to one embodiment of the present disclosure, a printed circuit board assembly may include a first printed circuit board, a second printed circuit board, a first interposer circuit that at least partially surrounds a first space between the first printed circuit board and the second printed circuit board, and a thermally conductive material disposed within the first space. The first interposer circuit may form a first ventilation path through which air can move from the first space to the outside of the printed circuit board assembly when the thermally conductive material is injected into the first space through a first inlet (a first hole) formed in the first printed circuit board. The first ventilation path may connect a first end formed on the outer side facing the outside of the first part of the first interposer circuit and a second end formed on the inner side facing the first space of the first part. The length of the first ventilation path may be greater than the width of the part of the first interposer circuit where the first ventilation path is formed.

[0130] According to one embodiment of the present disclosure, the first end and the second end may not overlap when viewed from a direction perpendicular to the outer side of the first portion forming the first end.

[0131] According to one embodiment of the present disclosure, the first ventilation path may include at least one bend.

[0132] According to one embodiment of the present disclosure, the at least one bend may include a first bend and a second bend. The first ventilation path may include a first portion extending in a third direction from the first end to the first bend, a second portion extending in a fourth direction different from the third direction from the first bend to the second bend, and a third portion extending in a fifth direction different from the fourth direction from the second bend to the second end.

[0133] According to one embodiment of the present disclosure, the fourth direction may be substantially perpendicular to the third direction, and the fifth direction may be substantially parallel to the third direction.

[0134] According to one embodiment of the present disclosure, the first air passage of the first interposer circuit may be surrounded by the first printed circuit board and the second printed circuit board.

[0135] According to one embodiment of the present disclosure, the first interposer circuit may further include a plurality of ground pads disposed around the first air path to reduce a noise signal transmitted through the first air path.

[0136] According to one embodiment of the present disclosure, each of the plurality of grounding pads may include at least one conductor.

[0137] According to one embodiment of the present disclosure, the printed circuit board assembly may further include a ground portion. The plurality of ground pads may be electrically connected to the ground portion.

[0138] According to one embodiment of the present disclosure, the plurality of ground pads may include a first ground pad disposed between the first printed circuit board and the first interposer circuit and a second ground pad disposed between the second printed circuit board and the first interposer circuit.

[0139] According to one embodiment of the present disclosure, the first interposer circuit may include a conductive via formed to penetrate the first interposer circuit. The first ground pad and the second ground pad may be electrically connected through the conductive via.

[0140] According to one embodiment of the present disclosure, the printed circuit board assembly may further include a pipe connected to the first end. The air inside the first space can be discharged to the outside of the first interposer circuit through the pipe.

[0141] According to one embodiment of the present disclosure, a printed circuit board assembly may further include a second interposer circuit that at least partially surrounds a second space between a third printed circuit board and the second printed circuit board and the third printed circuit board. The second interposer circuit may form a second ventilation path through which air can move from the second space to the outside of the printed circuit board assembly when the thermal conductive material is injected into the second space through the first inlet formed in the first printed circuit board and the second inlet formed in the second printed circuit board. The second ventilation path may connect a third end formed on the outer side facing the outside of a fourth part of the second interposer circuit and a fourth end formed on the inner side facing the second space of the fourth part. The length of the second ventilation path may be greater than the width of the part of the second interposer circuit where the second ventilation path is formed.

[0142] According to one embodiment of the present disclosure, the second injection port may be formed at a position corresponding to the first injection port.

[0143] According to one embodiment of the present disclosure, the first interposer circuit may include a third ventilation path through which air can move from the first space to the outside of the printed circuit board assembly. The third ventilation path may be formed in a third portion of the first interposer circuit opposite to the first portion.

[0144] According to one embodiment of the present disclosure, the first part may include a segmenting part that separates the first part into two parts. The first ventilation path may be formed by the segmenting part.

[0145] According to one embodiment of the present disclosure, the first ventilation path may be formed by a first groove formed on one surface of a first part of the first interposer circuit.

[0146] According to one embodiment of the present disclosure, the first interposer circuit may include a fourth air passage formed by a second groove formed on the other side opposite to the one side of the first part.

[0147] According to one embodiment of the present disclosure, the first groove may be surrounded by the first printed circuit board. The second groove may be surrounded by the second printed circuit board.

[0148] According to one embodiment of the present disclosure, a printed circuit board assembly may include a first printed circuit board having a first opening, a second printed circuit board, an interposer circuit disposed to at least partially surround the space between the first printed circuit board and the second printed circuit board, and a thermally conductive material injected into the space. The interposer circuit may include a recess formed on the inner side of a first portion of the interposer circuit in a direction facing the outside of the printed circuit board assembly. The first opening of the first printed circuit board may be formed at a position corresponding to the recess of the interposer circuit. A ventilation path through which air can move from the space to the outside of the printed circuit board assembly may be formed by the recess and the first opening.

[0149] According to one embodiment of the present disclosure, the first printed circuit board may include a second opening. The thermally conductive material may be injected through the second opening.

[0150] The effects of the invention according to one embodiment of the present disclosure are as follows.

[0151] According to one embodiment of the present disclosure, by forming a vent separate from an injection port into which a heat-conducting material can be injected in a side portion of the interposer, a printed circuit board assembly can be provided in which a fluid inside the interposer can be effectively discharged through the vent without the heat-conducting material being discharged through the vent.

[0152] According to one embodiment of the present disclosure, a printed circuit board assembly can be provided in which an electromagnetic wave generated by an electronic component inside the interposer can be shielded by the bend portion, by including at least one bend portion in a ventilation path through which a fluid inside the interposer can move.

[0153] In addition, various effects identified directly or indirectly through the present disclosure may be provided.

[0154] Methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0155] When implemented in software, a computer-readable storage medium may be provided for storing one or more programs (software modules). One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to the claims or embodiments described in the specification of this disclosure.

[0156] Such programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, ROM (read-only memory), electrically erasable programmable read-only memory (EEPROM), magnetic disc storage devices, compact disc-ROMs (CD-ROMs), digital versatile discs (DVDs), or other forms of optical storage devices, magnetic cassettes. Alternatively, they may be stored in memory composed of some or all of these. Additionally, each constituent memory may include multiple units.

[0157] Additionally, the above program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, Intranet, LAN (local area network), WLAN (wide LAN), or SAN (storage area network), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present disclosure.

[0158] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0159] Additionally, in the present disclosure, terms such as “part,” “module,” etc. may be a hardware component, such as a processor or circuit, and / or a software component executed by a hardware component, such as a processor.

[0160] "Parts" and "modules" may be implemented by a program that is stored on an addressable storage medium and can be executed by a processor. For example, "parts" and "modules" may be implemented by components such as software components, object-oriented software components, class components, and task components, as well as by processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables.

[0161] The specific embodiments described in this disclosure are merely examples and do not limit the scope of this disclosure in any way. For the sake of brevity, descriptions of prior electronic configurations, control systems, software, and other functional aspects of said systems may be omitted.

[0162] Additionally, in the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, comprising only b, comprising only c, comprising a and b, comprising b and c, comprising a and c, or comprising all of a, b, and c.”

[0163] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof.

Claims

1. In a printed circuit board assembly, First printed circuit board; Second printed circuit board; A first interposer circuit that at least partially surrounds a first space between the first printed circuit board and the second printed circuit board; and It includes a heat-conducting material disposed within the first space, and The first interposer circuit includes a first ventilation path through which air can move from the first space to the outside of the printed circuit board assembly when the thermal conductive material is injected into the first space through a first injection port (a first hole) formed in the first printed circuit board. The first ventilation path above connects a first end formed on the outer side facing the outside of the first part of the first interposer circuit and a second end formed on the inner side facing the first space of the first part, and A printed circuit board assembly in which the length of the first ventilation path is greater than the width of the part of the first interposer circuit in which the first ventilation path is formed.

2. In Paragraph 1, A printed circuit board assembly in which the first end and the second end do not overlap when viewed from a direction perpendicular to the outer side of the first part forming the first end.

3. In Paragraph 1, A printed circuit board assembly in which the first ventilation path comprises at least one bend portion.

4. In Paragraph 2, The above at least one bend portion includes a first bend portion and a second bend portion, and The above-mentioned first ventilation path is, A first portion extending in a third direction from the first end to the first bend portion; A second portion extending from the first bend portion to the second bend portion in a fourth direction different from the third direction; and A printed circuit board assembly comprising a third portion extending from the second bend portion to the second end portion in a fifth direction different from the fourth direction.

5. In Paragraph 1, A printed circuit board assembly in which the first air passage of the first interposer circuit is surrounded by the first printed circuit board and the second printed circuit board.

6. In Paragraph 1, A printed circuit board assembly, wherein the first interposer circuit further comprises a plurality of ground pads disposed around the first air path to reduce a noise signal transmitted through the first air path.

7. In Paragraph 6, A printed circuit board assembly, wherein each of the plurality of ground pads comprises at least one conductor.

8. In Paragraph 6, The above printed circuit board assembly further includes a ground portion, and A printed circuit board assembly in which the plurality of ground pads are electrically connected to the ground portion.

9. In Paragraph 6, A printed circuit board assembly comprising a plurality of ground pads, the plurality of ground pads including a first ground pad disposed between the first printed circuit board and the first interposer circuit and a second ground pad disposed between the second printed circuit board and the first interposer circuit.

10. In Paragraph 1, The above printed circuit board assembly further includes a pipe connected to the first end, and A printed circuit board assembly in which the air inside the first space is discharged to the outside of the first interposer circuit through the piping.

11. In Paragraph 1, A third printed circuit board; and It further includes a second interposer circuit that at least partially surrounds the second space between the second printed circuit board and the third printed circuit board, and The second interposer circuit forms a second ventilation path through which air can move from the second space to the outside of the printed circuit board assembly when the heat-conducting material is injected into the second space through the first injection port formed in the first printed circuit board and the second injection port formed in the second printed circuit board. The second ventilation path connects a third end formed on the outer side facing the outside of the fourth part of the second interposer circuit and a fourth end formed on the inner side facing the second space of the fourth part, and A printed circuit board assembly in which the length of the second air passage is greater than the width of the part of the second interposer circuit in which the second air passage is formed.

12. In Paragraph 1, The first interposer circuit includes a third ventilation path through which air can move from the first space to the outside of the printed circuit board assembly, and The above third ventilation path is formed in a third part opposite to the first part, in a printed circuit board assembly.

13. In Paragraph 1, The above-mentioned first part includes a segmentation portion that separates the above-mentioned first part into two parts, and A printed circuit board assembly in which the first ventilation path is formed by the segment.

14. In Paragraph 1, A printed circuit board assembly in which the first ventilation path is formed by a first groove formed on one side of a first part of the first interposer circuit.

15. In a printed circuit board assembly, A first printed circuit board including a first opening; Second printed circuit board; An interposer circuit disposed to at least partially surround the space between the first printed circuit board and the second printed circuit board; and It includes a heat-conducting material injected into the above space, and The above interposer includes a recess formed on the inner side of a first portion of the interposer circuit in a direction facing the outside of the printed circuit board assembly, and The first opening of the first printed circuit board is formed at a position corresponding to the recess of the interposer circuit, and A printed circuit board assembly in which a ventilation path is formed through the above recess and the above first opening, allowing air to move from the space to the outside of the printed circuit board assembly.

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