Sensor glue injection device
By designing a glue injection device for the blood oxygen sensor emission head, the existing injection molding process has been solved, and efficient and low-cost injection molding production has been achieved.
Patent Information
- Application Number
- CN202211144282.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-09-20
- Publication Date
- 2025-05-20
- Estimated Expiration
- 2042-09-20
AI Technical Summary
The injection molding process of existing blood oxygen sensor transmitters is low in efficiency, high defect rate, and the cost of purchasing complete sets of injection molding equipment is high, and the preliminary investment requirements for the project are high.
A sensor glue injection device is designed, including a base, bracket, lower mold, upper mold and drive member. The upper mold is driven by manual dispensing and using the drive member to drive the upper mold and press down until the glue solidifies, and the emitter head is taken out. The temperature adjustment is combined with the thermostat, heating element and temperature sensing element to improve the glue curing efficiency.
It realizes efficient production of sensor glue injection, reduces defective rate, and has low equipment cost, which is suitable for early investment in small projects.
Smart Images

Figure CN115625835B_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the field of sensor dispensing equipment, and particularly relates to a sensor injection device. Background Art
[0002] At present, for a blood oxygen sensor, its emitter needs to be injection molded (the blood oxygen chip inside the emitter has been welded with a cable before injection molding). Currently, a small mold is used for manual dispensing one by one, that is, it consists of an upper mold and a lower mold. After placing the emitter of the sensor in the cavity of the lower mold, glue is dispensed and the upper mold is covered. After the glue is cured, the upper mold is removed and the emitter is taken out. However, its processing efficiency is low, and the product defective rate is high (once the emitter is displaced or deflected in the cavity, the blood oxygen chip will be displaced). Although purchasing a complete set of injection molding equipment has high production efficiency, its equipment cost and mold opening cost are relatively high, and the requirements for the early investment of the project are high. Summary of the Invention
[0003] In order to solve the above technical problems, the purpose of the present invention is to provide a sensor injection device with a simple structure, convenient use, and high production efficiency.
[0004] In order to achieve the above purpose, the technical solution of the present invention is as follows: A sensor injection device includes a base, a bracket, a lower mold, an upper mold, and a driving member. The base is horizontally arranged. The lower mold is horizontally installed at the upper end of the base in the left-right direction. A plurality of cavities spaced apart in the left-right direction are recessed in the upper end of the lower mold. The cavities are used to place sensor blank parts. The bracket is installed at the upper end of the base. The upper mold is horizontally placed above the lower mold in the left-right direction. The driving member is installed on the base or the bracket. The driving end of the driving member is in transmission connection with the upper mold. The driving member is used to drive the upper mold to move downward to press on the upper end of the lower mold, or to move upward to reset.
[0005] The beneficial effect of the above technical solution is as follows: In this way, the blood oxygen chip with a cable can be neatly placed in the cavity, and then glue can be manually dispensed into the cavity by using a syringe. Then, the driving member drives the upper mold to press down on the upper end of the lower mold, and by the upper mold, until the glue is cured in the cavity. Then, the driving member drives the upper mold to move upward to reset. At this time, the injection-molded emitter can be taken away. It can inject multiple blood oxygen chips by one person at a time. It has a simple structure, high injection efficiency, and low preparation cost.
[0006] The above technical solution further includes a thermostat installed on the base. A heating element and a temperature sensing element are installed on the lower mold. The heating element and the temperature sensing element are both electrically connected to the thermostat. The heating element is used to heat the lower mold.
[0007] The beneficial effects of the above technical solution are as follows: In this way, the thermostat, the temperature sensing element, and the heating element can cooperate to adjust the temperature of the lower mold, so that the temperature of the lower mold is in a relatively constant state. At the same time, when the injected glue is silica gel, heating can accelerate the curing of the silica gel, thereby further improving production efficiency.
[0008] The above technical solution further includes a proximity switch, which is installed on the base and is located on the side of the lower mold. The proximity switch is electrically connected to the thermostat. When the proximity switch senses that the upper mold presses down on the upper end of the lower mold, the heating element is controlled by the thermostat to heat.
[0009] The beneficial effects of the above technical solution are as follows: By setting the proximity switch, when the upper mold presses down on the lower mold, the heating element can heat automatically at this time, thereby improving its automation.
[0010] In the above technical solution, a wire groove penetrating through the front end of the lower mold is provided at the front end of each cavity, and the wire groove is used for the cable of the sensor blank to pass through.
[0011] The beneficial effects of the above technical solution are as follows: In this way, when the blood oxygen chip is placed in the cavity, the cable can pass through the wire groove, so that the cable will not be damaged when the upper mold presses on the upper end of the lower mold.
[0012] In the above technical solution, the driving member is installed on the bracket, and the driving member is a quick clamp, a telescopic cylinder or a screw lifting mechanism.
[0013] The beneficial effects of the above technical solution are as follows: Its structure is simple.
[0014] The above technical solution further includes at least two sliding rods, which are vertically arranged on the upper end of the base and / or the lower mold, and the upper mold is slidably connected to the sliding rods.
[0015] The beneficial effects of the above technical solution are as follows: In this way, the upper mold can move up and down stably under the drive of the driving member.
[0016] The above technical solution further includes a pressing mechanism, which is installed on the bracket and is located above the upper mold. A plurality of through holes are provided on the upper mold at intervals in the left-right direction, and the plurality of through holes correspond to the plurality of cavities one by one. Each through hole is vertically aligned with the corresponding cavity. The pressing mechanism has a plurality of pressing rods that are spaced apart in the left-right direction and can move up and down. The plurality of pressing rods correspond to the plurality of through holes one by one. Each pressing rod is aligned with the corresponding through hole. The lower end of each pressing rod passes through the corresponding through hole, and each pressing rod can move downward until its lower end presses the sensor blank tightly in the corresponding cavity, or move upward to reset.
[0017] The beneficial effect of the above technical solution is that: its structure is simple, so that each lower pressing rod passes through the through hole on the upper mold and presses the corresponding blood oxygen chip into the corresponding cavity, which can prevent the blood oxygen chip from shifting in the cavity, thereby reducing the defective rate.
[0018] The pressing mechanism described in the above technical solution also includes a mounting plate, which is vertically mounted on the bracket along the left-right direction, and the mounting plate is located above the upper mold. A plurality of vertically penetrating mounting holes are provided on the mounting plate at intervals along the left-right direction, and a plurality of the mounting holes correspond one-to-one to a plurality of the pressing rods, and the mounting holes are aligned with the corresponding through holes up and down, and a sliding hole vertically penetrating the front side of the mounting plate is provided on the front side of each mounting hole, and each pressing rod vertically passes through the corresponding mounting hole, and each pressing rod is provided with a toggle handle extending to the front side of the mounting plate through the corresponding sliding hole, and the toggle handle is toggled upward to drive the pressing rod to move upward, or after the external force is removed, the pressing rod moves downward under the action of gravity.
[0019] The beneficial effect of the above technical solution is that: in this way, the lower pressure rod can move downward under the action of gravity and press the blood oxygen chip into the cavity, and manually pushing the toggle handle upward can drive the lower pressure rod to move upward so that the lower end of the lower pressure rod is separated from the blood oxygen chip.
[0020] The pressing mechanism in the above technical solution also includes a plurality of springs, and each pressing rod is provided with a spring sleeved on the upper end of the toggle handle, and the upper end of the spring is fixedly connected to the upper end of the mounting plate, or the upper end of the mounting hole is provided with an inner flange, and the upper end of the spring abuts against the inner flange, and the upper end of the pressing rod can extend through the inner hole of the inner flange, and the spring is used to drive the pressing rod to move downward.
[0021] The beneficial effect of the above technical solution is that the spring can always apply downward elastic force to the downward pressing rod, so that the downward pressure of the downward pressing rod is greater, thereby pressing the blood oxygen chip more stably in the cavity.
[0022] In the above technical solution, the front side of the mounting plate is provided with a notch that penetrates the mounting hole at one side or both side walls of the upper end of each sliding hole. When the toggle handle moves upward to the top of the notch under the action of external force, the toggle handle can be rotated to support the notch to limit the lower pressure rod above the lower mold.
[0023] The beneficial effect of the above technical solution is that when the toggle handle is toggled upward, the toggle handle is supported at the notch, so that the toggle handle can be released by hand without worrying about the downward movement of the push rod under the action of the spring and gravity. Brief Description of the Figures
[0024] Figure 1 is a vertical view of the sensor glue injection device according to an embodiment of the present invention;
[0025] Figure 2 is a vertical view of the lower mold according to an embodiment of the present invention;
[0026] Figure 3 It is an inner view of the side of the sensor glue injection device according to an embodiment of the present invention;
[0027] Figure 4 is a vertical view of the pressing mechanism described in the embodiment of the present invention;
[0028] Figure 5 is a schematic diagram of the assembly of a single down-pressing rod and a mounting plate in an embodiment of the present invention;
[0029] Figure 6 is another assembly diagram of a single down-pressing rod and a mounting plate in an embodiment of the present invention;
[0030] Figure 7 This is an electrical connection diagram of the temperature controller described in the embodiment of the present invention.
[0031] In the figure: 1 base, 11 slide bar, 2 bracket, 3 lower die, 31 cavity, 32 heating element, 33 temperature sensing element, 34 wire slot, 4 upper die, 41 through hole, 5 drive part, 6 proximity switch, 7 sensor blank, 71 cable, 8 temperature controller, 9 pressing mechanism, 91 pressing rod, 911 toggle handle, 92 mounting plate, 921 mounting hole, 922 sliding hole, 923 notch, 93 spring. Specific implementation method
[0032] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention. The present invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become clearer according to the following description and claims. It should be noted that the drawings are all in a very simplified form and are not in precise proportions, and are only used to facilitate and clearly assist in explaining the purpose of the embodiments of the present invention.
[0033] If Figure 1 and Figure 3As shown in the figure, this embodiment provides a sensor glue injection device, which includes a base 1, a bracket 2, a lower mold 3, an upper mold 4 and a driving member 5. The base 1 is horizontally arranged, the lower mold 3 is horizontally installed at the upper end of the base 1 in the left-right direction, and a plurality of cavities 31 spaced apart in the left-right direction are recessed in the upper end of the lower mold 3. The cavities 31 are used to place sensor blank parts 7. The bracket 2 is installed at the upper end of the base 1, the upper mold 4 is horizontally placed above the lower mold 3 in the left-right direction, the driving member 5 is installed on the base 1 or the bracket 2, and the driving end of the driving member 5 is in transmission connection with the upper mold 4. The driving member 5 is used to drive the upper mold 4 to move downward to press on the upper end of the lower mold 3, or to move upward to reset. In this way, the blood oxygen chip with a cable can be neatly placed in the cavity, and then glue can be injected into the cavity manually, for example, by using a syringe to inject glue into the cavity. Then, the driving member drives the upper mold to press down on the upper end of the lower mold, and by the upper mold, until the glue is cured in the cavity. Then, the driving member drives the upper mold to move upward to reset. At this time, the injection-molded emitter can be taken away. It can inject multiple blood oxygen chips by one person at a time, with a simple structure, high injection efficiency, and low preparation cost.
[0034] As Figure 7As shown, the above technical solution further includes a thermostat 8 installed on the base 1. A heating element 32 and a temperature sensing element 33 are installed on the lower mold 3. Both the heating element 32 and the temperature sensing element 33 are electrically connected to the thermostat 8. The heating element 32 is used to heat the lower mold 3. In this way, the thermostat, the temperature sensing element and the heating element can cooperate to adjust the temperature of the lower mold, so that the temperature of the lower mold is in a relatively constant state. At the same time, when the injected glue is silica gel, heating can accelerate the curing of the silica gel, thereby further improving the production efficiency. The base can be a cuboid box. The thermostat is installed on the front side wall of the base. The thermostat has a human-machine interaction module (input buttons and a display screen). During use, the working temperature of the lower mold is set through the human-machine interaction module. At this time, the thermostat controls the heating element to heat the lower mold. When the temperature sensing element senses that the temperature of the lower mold reaches the set working temperature value, the thermostat controls the heating element to stop heating. When the temperature of the lower mold is lower than the set temperature value, the thermostat controls the heating element to heat again, so that the temperature of the lower mold fluctuates at the set working temperature value (allowing for errors). The thermostat belongs to the prior art, such as Xiamen Yudian AI-7028 / 7038 / 7048 multi-channel intelligent thermostats. The temperature sensing element can be a temperature sensor embedded in the side wall or inside of the lower mold. The heating element is a heating tube or heating wire embedded in the lower mold. The thermostat is electrically connected to the power cord. A main power switch can also be provided on the side wall of the base. The power cord is electrically connected to the thermostat through the main power switch. After the power cord is powered on and the main power switch is turned on, the thermostat is in a powered state. Among them, the heating element only needs to operate under the control of the thermostat when the upper mold presses on the upper end of the lower mold.
[0035] The above technical solution further includes a proximity switch 6. The proximity switch 6 is installed on the base 1 and is located on the side of the lower mold 3. The proximity switch 6 is electrically connected to the thermostat 8. When the proximity switch 6 senses that the upper mold 4 presses down on the upper end of the lower mold 3, the thermostat 8 controls the heating element 32 to heat. By setting the proximity switch, the heating element can heat automatically when the upper mold presses down on the lower mold, thereby improving its automation. The proximity switch is close to the lower mold, and the proximity switch is also located below the upper mold, and the upper end of the proximity switch is not higher than the upper end of the lower mold. The sensing part of the proximity switch faces upward. When the upper mold moves downward to press on the upper end of the lower mold, the proximity switch senses the signal and sends the signal to the thermostat. The thermostat controls the heating element to heat the lower mold so that the temperature of the lower mold is at the set working temperature value. When the upper mold moves upward to reset, the proximity switch does not sense the signal at this time, so the thermostat controls the heating element not to operate.
[0036] Such asFigure 2 As shown in the above technical solution, the front end of each cavity 31 is provided with a wire groove 34 that passes through the front end of the lower mold 3. The wire groove 34 is used for the cable 71 of the sensor blank 7 to pass through. In this way, when the blood oxygen chip is placed in the cavity, the cable can pass through the wire groove, so that when the upper mold is pressed on the upper end of the lower mold, the cable will not be damaged. The wire groove just meets the cable passing, which can avoid glue leakage.
[0037] In the above technical solution, the driving member 5 is installed on the bracket 2, and the driving member 5 is a quick clamp, a telescopic cylinder (which can be a telescopic cylinder or a telescopic electric cylinder) or a screw lifting mechanism (which can be a manual screw lifting mechanism or an electric screw lifting mechanism), and its structure is simple.
[0038] The above technical solution also includes at least two slide bars 11, which are vertically arranged at the upper end of the base 1 and / or the lower mold 3, and the upper mold 4 is slidably connected to the slide bars 11, so that the upper mold can move up and down stably under the drive of the driving member. Preferably, there are four slide bars, two of which are respectively arranged at the two ends of the upper end of the lower mold, and the remaining two slide bars are arranged on the left and right sides of the rear upper end of the base. The four slide bars penetrate the upper mold and are slidably connected to the upper mold. At this time, the upper mold can slide up and down relative to the four slide bars.
[0039] If Figures 4 - 6 As shown in FIG. 1 , the technical solution further includes a pressing mechanism 9, which is mounted on the bracket 2 and located above the upper mold 4. The upper mold 4 is provided with a plurality of through holes 41 spaced apart along the left-right direction, and the plurality of through holes 41 correspond one-to-one to the plurality of cavities 31, and each of the through holes 41 is aligned with the corresponding cavity 31 up and down. The pressing mechanism 9 has a plurality of pressing rods 91 spaced apart along the left-right direction and movable up and down, and the plurality of pressing rods 91 correspond one-to-one to the plurality of through holes 41, and each of the pressing rods 91 is aligned with the corresponding through hole 41, and the lower end of the pressing rod 91 passes through the corresponding through hole 41, and each of the pressing rods 91 can move downward to its lower end to press the sensor blank into the corresponding cavity 31, or move upward to reset, and the structure is simple, so that each pressing rod passes through the through hole on the upper mold and presses the corresponding blood oxygen chip into the corresponding cavity, so that the blood oxygen chip can be prevented from shifting in the cavity, thereby reducing the defective rate.
[0040] For details, please see Figure 5 The pressing mechanism 9 in the above technical solution also includes a mounting plate 92, which is vertically mounted on the bracket 2 along the left-right direction, and the mounting plate 92 is located above the upper mold 4, and a plurality of vertically penetrating mounting holes 921 are arranged on the mounting plate 92 at intervals along the left-right direction, and a plurality of the mounting holes 921 correspond to a plurality of the pressing rods 91 one by one, and the mounting holes 921 are aligned with the corresponding through holes 41 up and down, and a sliding hole 922 vertically penetrating the front side of the mounting plate 92 is arranged on the front side of each of the mounting holes 921, and each of the pressing rods 91 vertically passes through the corresponding mounting hole 921, and each of the pressing rods 91 is provided with a rod extending through the corresponding sliding hole 922 to the front side of the mounting plate 92 The toggle handle 911 is toggled upward to drive the lower pressure rod 91 to move upward, or after the external force is removed, the lower pressure rod 91 moves downward under the action of gravity, so that the lower pressure rod can move downward under the action of gravity and press the blood oxygen chip into the cavity, and manually toggling the toggle handle upward can drive the lower pressure rod to move upward so that the lower end of the lower pressure rod is separated from the blood oxygen chip. At this time, the middle part of the lower pressure rod is located at the upper end of the toggle handle and can be expanded (the toggle handle is set at the expanded diameter) so that its expanded diameter matches the inner hole of the mounting hole. The lower pressure rod can move up and down in the mounting hole, and can also rotate. The lower pressure rod is limited on the mounting plate by the toggle handle, so that it cannot be separated from the mounting plate.
[0041] Preferred, see Figure 6 , the pressing mechanism 9 in the above technical solution also includes a plurality of springs 93, each of the pressing rods 91 is sleeved with a spring 93 at the upper end of the toggle handle 911, and the upper end of the spring 93 is fixedly connected to the upper end of the mounting plate 92, or the upper end of the mounting hole 921 is provided with an inner flange, and the upper end of the spring 93 abuts against the inner flange, and the upper end of the pressing rod 91 can extend through the inner hole of the inner flange, and the spring 93 is used to drive the pressing rod 91 to move downward, so that the spring can always apply a downward elastic force to the pressing rod, so that the downward pressure of the pressing rod is greater, thereby pressing the blood oxygen chip more stably in the cavity, at this time, the middle part of the pressing rod can be expanded, and the toggle handle is arranged at the upper end of the expanded diameter.
[0042] Further preferably, the front side of the mounting plate 92 in the above technical solution is provided with a notch 923 that penetrates the mounting hole 921 on one side or both side walls of the upper end of each of the sliding holes 922. When the toggle handle 911 moves upward to above the notch 923 under the action of an external force, the toggle handle 911 can be rotated to be supported on the notch 923 to limit the lower pressure rod 91 above the lower mold 3. In this way, when the toggle handle is toggled upward, the toggle handle can be supported on the notch, so that the toggle handle can be released by hand without worrying about the lower pressure rod moving downward under the action of the spring and gravity. Preferably, notches are provided on both sides of the upper end of each sliding hole, so that the corresponding toggle handle can be supported on the notch on any side thereof. In addition, the notches on the side close to each other of two adjacent sliding holes can penetrate each other (see 4 for details).
[0043] Wherein, the upper die 4, the lower die 3 and the lower pressing rod 91 in the above technical solution are all made of stainless steel components, which have good durability and are easy to maintain.
[0044] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any ordinary technician in the industry can smoothly implement the present invention as shown in the drawings and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the present invention using the technical content disclosed above are equivalent embodiments of the present invention. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the protection scope of the technical solution of the present invention.
Claims
1. A sensor glue injection device, characterized in that: The invention comprises a base (1), a bracket (2), a lower die (3), an upper die (4) and a driving member (5), wherein the base (1) is arranged horizontally, the lower die (3) is horizontally mounted on the upper end of the base (1) along the left-right direction, the upper end of the lower die (3) is concavely provided with a plurality of cavities (31) spaced apart along the left-right direction, the cavities (31) are used to place a sensor blank (7), the bracket (2) is mounted on the upper end of the base (1), the upper die (4) is horizontally arranged above the lower die (3) along the left-right direction, the driving member (5) is mounted on the base (1) or the bracket (2), the driving end of the driving member (5) is transmission-connected to the upper die (4), and the driving member (5) is used to drive the upper die (4) to move downward to press on the upper end of the lower die (3), or to move upward to reset; and further comprises a pressing mechanism (9) The pressing mechanism (9) is mounted on the bracket (2) and is located above the upper mold (4). The upper mold (4) is provided with a plurality of through holes (41) spaced apart along the left-right direction, and the plurality of through holes (41) correspond one-to-one to the plurality of cavities (31). Each of the through holes (41) is aligned vertically with the corresponding cavity (31). The pressing mechanism (9) has a plurality of pressing rods (91) spaced apart along the left-right direction and movable vertically. The plurality of pressing rods (91) correspond one-to-one to the plurality of through holes (41). Each of the pressing rods (91) is aligned with the corresponding through hole (41). The lower end of the pressing rod (91) passes through the corresponding through hole (41). Each of the pressing rods (91) can move downward to its lower end to press the sensor blank into the corresponding cavity (31), or move upward to reset.
2. The sensor glue injection device according to claim 1, characterized in that: It also includes a temperature controller (8) mounted on the base (1), and a heating element (32) and a temperature sensing element (33) are mounted on the lower mold (3), and the heating element (32) and the temperature sensing element (33) are both electrically connected to the temperature controller (8), and the heating element (32) is used to heat the lower mold (3).
3. The sensor glue injection device according to claim 2, characterized in that: It also includes a proximity switch (6), which is mounted on the base (1) and located on the side of the lower mold (3). The proximity switch (6) is electrically connected to the temperature controller (8). When the proximity switch (6) senses that the upper mold (4) is pressed down on the upper end of the lower mold (3), the temperature controller (8) controls the heating element (32) to heat.
4. The sensor glue injection device according to claim 1, characterized in that: A wire groove (34) penetrating the front end of the lower mold (3) is provided at the front end of each cavity (31), and the wire groove (34) is used for allowing a cable (71) of the sensor blank (7) to pass through.
5. The sensor glue injection device according to claim 1, characterized in that: The driving member (5) is mounted on the bracket (2), and the driving member (5) is a quick clamp, a telescopic cylinder or a screw lifting mechanism.
6. The sensor glue injection device according to claim 1, characterized in that: It also comprises at least two sliding rods (11), wherein the sliding rods (11) are vertically arranged at the upper end of the base (1) and / or the lower mold (3), and the upper mold (4) is slidably connected to the sliding rods (11).
7. The sensor glue injection device according to claim 1, characterized in that: The pressing mechanism (9) further comprises a mounting plate (92), wherein the mounting plate (92) is vertically mounted on the bracket (2) along the left-right direction, and the mounting plate (92) is located above the upper mold (4), and a plurality of vertically penetrating mounting holes (921) are provided on the mounting plate (92) at intervals along the left-right direction, wherein the plurality of mounting holes (921) correspond one-to-one to the plurality of pressing rods (91), and the mounting holes (921) are vertically aligned with the corresponding through holes (41), and each of the mounting holes (921) is aligned with the corresponding through holes (41). A sliding hole (922) vertically penetrating the front side of the mounting plate (92) is provided on the front side of the mounting plate (921); each of the push-down rods (91) vertically passes through the corresponding mounting hole (921); and each of the push-down rods (91) is provided with a toggle handle (911) extending through the corresponding sliding hole (922) to the front side of the mounting plate (92); when the toggle handle (911) is toggled upward, the push-down rod (91) is driven to move upward; or after the external force is removed, the push-down rod (91) moves downward under the action of gravity.
8. The sensor glue injection device according to claim 7, characterized in that: The pressing mechanism (9) further comprises a plurality of springs (93), each of the pressing rods (91) being provided with a spring (93) at the upper end of the toggle handle (911), and the upper end of the spring (93) being fixedly connected to the upper end of the mounting plate (92), or the upper end of the mounting hole (921) being provided with an inner flange, the upper end of the spring (93) being in contact with the inner flange, the upper end of the pressing rod (91) extending out through the inner hole of the inner flange, and the spring (93) being used to drive the pressing rod (91) to move downward.
9. The sensor glue injection device according to claim 7, characterized in that: The front side of the mounting plate (92) is provided with a notch (923) which is connected to the mounting hole (921) at one side or both side walls of the upper end of each of the sliding holes (922); when the toggle handle (911) moves upward to above the notch (923) under the action of an external force, the toggle handle (911) can be rotated to support the notch (923) to limit the lower pressing rod (91) above the lower mold (3).
Citation Information
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