Method, device and equipment for controlling semiconductor process and storage medium

Abstract

The present disclosure provides a semiconductor process control method, device, equipment and storage medium. The method comprises: analyzing wafer batch information to determine a current product batch of a current product; obtaining historical measurement data within a set period; in a case where it is determined that the historical measurement data does not include first measurement data of the current product batch, if it is determined according to preset configuration information that the historical measurement data includes second measurement data of a target product batch, determining target control data according to the preset configuration information and the second measurement data; and controlling a production parameter of the current product according to the target control data. In the present disclosure, when the historical measurement data does not include the first measurement data of the current product batch, the target control data can be determined according to the second measurement data of other products, and then the production parameter of the current product is controlled according to the target control data, so as to improve the intelligence of the entire control method and improve the production capacity to a certain extent.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of semiconductor technology, and in particular, to a control method, device and equipment of semiconductor process and a storage medium. BACKGROUND

[0002] Run-to-run control (or R2R control for short) is a kind of feedback control in semiconductor process. Run-to-Run (RtR, R2R) control is an optimization control method for batch process, which updates the process model and adjusts the process scheme according to the feedback evaluation and analysis of historical batch information, so as to reduce the product difference between batches. SUMMARY

[0003] The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of protection of the claims.

[0004] The present disclosure provides a control method, device and equipment of semiconductor process and a storage medium.

[0005] According to a first aspect of some embodiments of the present disclosure, a control method of semiconductor process is provided, the method comprising:

[0006] analyzing wafer batch information to determine a current product batch of a current product;

[0007] obtaining historical measurement data within a set period;

[0008] if it is determined that the historical measurement data does not include first measurement data of the current product batch, and according to preset configuration information, it is determined that the historical measurement data includes second measurement data of a target product batch, then determining target control data according to the preset configuration information and the second measurement data;

[0009] controlling production parameters of the current product according to the target control data.

[0010] According to some embodiments of the present disclosure, in the preset configuration information, the current product batch corresponds to at least one reference product batch,

[0011] The determination that the historical measurement data includes second measurement data of a target product batch according to preset configuration information comprises:

[0012] According to the priority of each reference product batch in the at least one reference product batch, the measurement data of the reference product batch is sequentially searched from the historical measurement data;

[0013] The searched measurement data of the reference product batch is determined as the second measurement data of the target product batch.

[0014] According to some embodiments of the present disclosure, when each of the at least one reference product batch corresponds to one offset data, the offset data represents a conversion relationship between the reference control data of the reference product batch corresponding thereto and the target control data.

[0015] The determining of the target control data according to the preset configuration information and the second measurement data comprises:

[0016] The reference control data is determined according to the second measurement data.

[0017] The offset data corresponding to the target product batch in the preset configuration information is determined as the target offset data.

[0018] The target control data is determined according to the target offset data and the reference control data.

[0019] According to some embodiments of the present disclosure, when each of the at least one reference product batch corresponds to at least one sensor lifecycle range, and each sensor lifecycle range corresponds to one offset data, the offset data represents a conversion relationship between the reference control data of the reference product batch corresponding thereto and the target control data.

[0020] The determining of the target control data according to the preset configuration information and the second measurement data comprises:

[0021] The current sensor lifecycle of the sensor of the semiconductor production equipment is obtained.

[0022] The sensor lifecycle range to which the current sensor lifecycle belongs is determined as the current lifecycle range.

[0023] The offset data corresponding to both the target product batch and the current lifecycle range in the preset configuration information is determined as the target offset data.

[0024] The reference control data is determined according to the second measurement data.

[0025] The target control data is determined according to the target offset data and the reference control data.

[0026] According to some embodiments of the present disclosure, the obtaining of the historical measurement data in the set period comprises:

[0027] The current control layer of the current product is determined.

[0028] The historical measurement data in the set period corresponding to the current control layer is obtained.

[0029] According to some embodiments of the present disclosure, in a case where it is determined that the historical metrology data does not include the first metrology data of the current product batch, the method further comprises:

[0030] If it is determined according to the preset configuration information that the historical metrology data does not include the second metrology data of the target product batch, the current control layer of the current product is prohibited from being processed.

[0031] According to some embodiments of the present disclosure, the priority of each reference product batch in the at least one reference product batch is determined by:

[0032] Obtaining historical control data of the current control layer;

[0033] According to the amount of control data of each reference product batch in the at least one reference product batch in the historical control data, the priority of each reference product batch in the at least one reference product batch is determined.

[0034] According to some embodiments of the present disclosure, the historical control data includes a plurality of first sub-control data of the current product batch and a plurality of second sub-control data of each reference product batch in the at least one reference product batch,

[0035] The method further comprises:

[0036] According to the plurality of first sub-control data and the plurality of second sub-control data, the offset data corresponding to each reference product batch in the at least one reference product batch is determined in a set manner.

[0037] According to some embodiments of the present disclosure, the plurality of first sub-control data is a plurality of first sub-control data corresponding to a plurality of sensor life cycles within a set life cycle range, the plurality of second sub-control data is a plurality of second sub-control data corresponding to the plurality of sensor life cycles, and the plurality of first sub-control data, the plurality of second sub-control data and the plurality of sensor life cycles correspond one-to-one.

[0038] The determination of the offset data corresponding to each reference product batch in the at least one reference product batch according to the plurality of first sub-control data and the plurality of second sub-control data in a set manner comprises:

[0039] Determining sub-offset data corresponding to each sensor life cycle in the plurality of sensor life cycles, the sub-offset data representing a conversion relationship between the first sub-control data and the second sub-control data corresponding to the each sensor life cycle;

[0040] The mode of the plurality of sub-offset data corresponding to the plurality of sensor lifecycles is determined as offset data corresponding to each reference product batch in the at least one reference product batch.

[0041] A second aspect of the present disclosure provides a semiconductor process control device, the device comprising:

[0042] A first determination module configured to parse wafer batch information and determine a current product batch of a current product.

[0043] A first acquisition module configured to acquire historical measurement data within a set period.

[0044] The first determination module is further configured to, in a case where the historical measurement data does not include first measurement data of the current product batch, if it is determined according to preset configuration information that the historical measurement data includes second measurement data of a target product batch, determine target control data according to the preset configuration information and the second measurement data.

[0045] A control module configured to control a production parameter of the current product according to the target control data.

[0046] According to some embodiments of the present disclosure, in the preset configuration information, the current product batch corresponds to at least one reference product batch, and the first determination module is further configured to:

[0047] According to a priority of each reference product batch in the at least one reference product batch, measurement data of a reference product batch is sequentially searched from the historical measurement data.

[0048] The searched measurement data of the reference product batch is determined as the second measurement data of the target product batch.

[0049] According to some embodiments of the present disclosure, when each reference product batch in the at least one reference product batch corresponds to an offset data, the offset data represents a conversion relationship between reference control data of the reference product batch corresponding thereto and the target control data.

[0050] The first determination module is further configured to:

[0051] determine reference control data according to the second measurement data;

[0052] determine, as target offset data, offset data corresponding to the target product batch in the preset configuration information;

[0053] determine the target control data according to the target offset data and the reference control data.

[0054] According to some embodiments of the present disclosure, when each of the at least one reference product batch corresponds to at least one sensor life cycle range, and each sensor life cycle range corresponds to one offset data, the offset data represents a conversion relationship between the reference control data of the reference product batch corresponding thereto and the target control data.

[0055] The first obtaining module is further configured to obtain a current sensor life cycle of a sensor of the semiconductor manufacturing equipment.

[0056] The first determining module is further configured to:

[0057] determine a sensor life cycle range to which the current sensor life cycle belongs as a current life cycle range;

[0058] determine, as the target offset data, offset data in the preset configuration information that corresponds to both the target product batch and the current life cycle range.

[0059] determine reference control data according to the second measurement data;

[0060] determine the target control data according to the target offset data and the reference control data.

[0061] According to some embodiments of the present disclosure, the first determining module is further configured to determine a current control layer of the current product.

[0062] The first obtaining module is further configured to obtain historical measurement data within a set period corresponding to the current control layer.

[0063] According to some embodiments of the present disclosure, in a case where it is determined that the historical measurement data does not include first measurement data of a current product batch, the control module is further configured to, if it is determined according to the preset configuration information that the historical measurement data does not include second measurement data of a target product batch, prohibit processing of the current control layer of the current product.

[0064] According to some embodiments of the present disclosure, the priority of each of the at least one reference product batch is determined by the following device:

[0065] The second obtaining module is configured to obtain historical control data of the current control layer.

[0066] The second determining module is configured to determine the priority of each of the at least one reference product batch according to a quantity of control data of each of the at least one reference product batch in the historical control data.

[0067] According to some embodiments of the present disclosure, the historical regulation data comprises a plurality of first sub-regulation data of the current product batch, and a plurality of second sub-regulation data of each of the at least one reference product batch,

[0068] The second determining module is further configured to determine the offset data corresponding to each of the at least one reference product batch in a set manner according to the plurality of first sub-regulation data and the plurality of second sub-regulation data.

[0069] According to some embodiments of the present disclosure, the plurality of first sub-regulation data is first sub-regulation data corresponding to a plurality of sensor lifecycles in a set lifecycle range, the plurality of second sub-regulation data is second sub-regulation data corresponding to the plurality of sensor lifecycles, and the plurality of first sub-regulation data, the plurality of second sub-regulation data, and the plurality of sensor lifecycles correspond one-to-one.

[0070] The second determining module is further configured to:

[0071] determine sub-offset data corresponding to each of the plurality of sensor lifecycles, the sub-offset data representing a conversion relationship between the first sub-regulation data and the second sub-regulation data corresponding to the each of the plurality of sensor lifecycles;

[0072] determine a mode of the plurality of sub-offset data corresponding to the plurality of sensor lifecycles as the offset data corresponding to each of the at least one reference product batch.

[0073] A third aspect of the present disclosure provides a semiconductor production equipment, comprising:

[0074] a processor;

[0075] a memory configured to store processor-executable instructions;

[0076] wherein the processor is configured to perform the method of the first aspect.

[0077] According to a fourth aspect of the embodiments of the present disclosure, a non-transitory computer-readable storage medium is provided, when instructions in the storage medium are executed by a processor of a semiconductor production equipment, the semiconductor production equipment is enabled to perform the method of the first aspect.

[0078] In the method, device, equipment and storage medium for controlling semiconductor process provided by the embodiments of the present disclosure, in a semiconductor process (for example, R2R), when the historical measurement data does not include the first measurement data of the current product batch (that is, the historical measurement data does not include the first measurement data of the same product as the current product batch), the target control data can be determined according to the second measurement data of other products, and then the production parameter of the current product is controlled according to the target control data, so as to improve the intelligence of the whole control method and improve the production capacity to a certain extent.

[0079] Other aspects can become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating the embodiments of the disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0080] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the embodiments of the present disclosure. In these drawings, like reference numerals are intended to represent similar or identical elements. The drawings below describe some embodiments of the present disclosure, rather than all the embodiments. Other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0081] Figure 1 is a flowchart of a method for controlling a semiconductor process according to an example embodiment;

[0082] Figure 2 is a flowchart of a method for controlling a semiconductor process according to an example embodiment;

[0083] Figure 2a is a line graph of control data corresponding to a control layer A and a sensor life cycle according to an example embodiment;

[0084] Figure 2b is a line graph of control data corresponding to a control layer B and a sensor life cycle according to an example embodiment;

[0085] Figure 3 is a block diagram of a device for controlling a semiconductor process according to an example embodiment;

[0086] Figure 4 is a block diagram of a semiconductor production equipment according to an example embodiment. DETAILED DESCRIPTION

[0087] To make the purposes, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments will be described clearly and completely below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present disclosure. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be combined with each other in any manner without conflict.

[0088] In the field of integrated circuits, as the critical dimension is continuously scaled down, the feedback control technology of R2R control (lot control) becomes more and more important. R2R control must calculate the production parameters of the next batch of products by using the measurement data of the previous batch (or batches) of the same product. Because the semiconductor production equipment (such as a measurement machine) is limited, and the number of measured products also affects the production capacity, a certain proportion of measurements of different products is allocated, resulting in that in the R2R control process, the previous batch (or batches) often has no measurement data of the same product available, and the production needs to be temporarily stopped for further intervention by engineers, which has a poor degree of automation and seriously affects the efficiency of the entire control process.

[0089] The present disclosure provides a control method of a semiconductor process. In the method, when historical measurement data does not include first measurement data of a current product batch (i.e., the historical measurement data does not include first measurement data of the same product as the current product batch) in a semiconductor process (such as R2R), target control data can be determined according to second measurement data of other products, and then the production parameters of the current product are controlled according to the target control data, so as to improve the intelligence of the entire control method and improve the production capacity to a certain extent.

[0090] In an exemplary embodiment of the present disclosure, a control method of a semiconductor process is provided. Referring to FIG. 1, the method can include: Figure 1

[0091] S110, analyzing wafer batch information to determine a current product batch of a current product;

[0092] S120, obtaining historical measurement data within a set period;

[0093] S130, in a case where it is determined that the historical measurement data does not include first measurement data of the current product batch, if it is determined according to preset configuration information that the historical measurement data includes second measurement data of a target product batch, target control data is determined according to the preset configuration information and the second measurement data;

[0094] S140, controlling the production parameters of the current product according to the target control data.

[0095] ​In step S110, in the production process of the wafer, due to the existence of different wafer manufacturers, different wafer foundries, different packaging and testing factories, although the design drawings, software, raw materials and processes are the same, the products produced by each batch of raw materials are generally different in quality and performance. Generally, the same batch of products has the same parameters, the same production process, the same assembly factory, the same welding process, etc., which can ensure the high consistency of the wafer. It is generally believed that the same batch of products belongs to the same product.

[0096] In this step, the wafer batch information can be obtained by analyzing the wafer batch information, and the batch information of the current product is determined, which is recorded as the current product batch.

[0097] Wherein, the wafer can be a semiconductor wafer with basic semiconductor, compound semiconductor, alloy semiconductor or any combination thereof. In addition, as the process proceeds, the wafer can have a complete or partial semiconductor component structure formed thereon.

[0098] In step S120, the setting period can be a period (such as a time length) set by the semiconductor production equipment before leaving the factory, or a period set by the user himself afterwards. During the use of the semiconductor production equipment, the user can also modify the setting period.

[0099] In addition, it should be noted that batch control is mainly the control between different batches of the same unit operation. If multiple wafers are processed in each batch, the multiple wafers are called a lot (Lot), and in this case, the configuration form of batch control is Lot-to-Lot (L2L). If a single wafer is processed in each batch, the configuration form of batch control in this case is Wafer-to-Wafer (W2W). Therefore, the above-mentioned period can be the period of producing a batch of wafers, or the period of producing a wafer. In addition, the setting period can be the previous period (T-1), the previous two periods (T-2) or the previous three periods (T-3) of the current period (T).

[0100] In this step, the historical measurement data can be measurement data stored during the use of the currently used semiconductor production equipment, or measurement data downloaded from the network end. When the historical measurement data is measurement data downloaded from the network end, the measurement data refers to the measurement data stored during the use of the same batch of equipment as the above-mentioned semiconductor production equipment.

[0101] The measurement data can include the measurement value of the film thickness of the wafer and the measurement value of the etching depth after etching.

[0102] In step S130, it is first determined whether the historical measurement data includes the first measurement data of the current product batch. The first measurement data of the current product batch refers to the measurement data of the product belonging to the current product batch.

[0103] In the case where it is determined that the historical measurement data includes the first measurement data of the current product batch, the target control data is determined directly according to the first measurement data in the historical measurement data.

[0104] In the case where it is determined that the historical measurement data does not include the first measurement data, it is determined according to the preset configuration information whether the historical measurement data includes the second measurement data of the target product batch. The second measurement data of the target product batch refers to the measurement data of the product belonging to the target product batch.

[0105] If it is determined that the historical measurement data includes the second measurement data, the target control data for controlling the production parameters of the current product can be determined according to the preset configuration information and the second measurement data.

[0106] In step S140, the production parameters of the current product can be controlled according to the target control data determined in step S130. That is, the production parameters of the semiconductor production equipment when processing the current product are controlled according to the target control data.

[0107] It should be noted that in the case where it is determined that the historical measurement data does not include the first measurement data of the current product batch, if it is determined according to the preset configuration information that the historical measurement data does not include the second measurement data of the target product batch, the current processing process can be stopped.

[0108] In the method, when the historical measurement data does not include the first measurement data of the current product batch (i.e., the historical measurement data does not include the first measurement data of the product of the same batch as the current product batch), the target control data can be determined according to the second measurement data of other products, and then the production parameters of the current product are controlled according to the target control data, so as to improve the intelligence of the entire control method and avoid the stop of production caused by the excessive intervention of engineers in the semiconductor process, thereby improving the production efficiency and capacity to a certain extent.

[0109] In the exemplary embodiments of the present disclosure, a semiconductor process control method is provided. In the method, in the preset configuration information, the current product batch can correspond to at least one reference product batch, and the at least one reference product batch can be divided into priority levels.

[0110] For example, the current product batch corresponds to three reference product batches, that is, the preset configuration information includes three reference product batches and corresponding three priorities. Each reference product batch corresponds to a priority, reference product batch L1 corresponds to the first level I, reference product batch L2 corresponds to the second level II, and reference product batch L3 corresponds to the third level III, wherein the first level I is better than the second level II, and the second level II is better than the third level III.

[0111] For another example, the current product batch only corresponds to one reference product batch, that is, the preset configuration information includes one reference product batch and one corresponding priority. The reference product batch can be recorded as L1, and the corresponding priority can be recorded as the first level.

[0112] In the method, the historical measurement data including the second measurement data of the target product batch can include:

[0113] S210, according to the priority of each reference product batch in the at least one reference product batch, the measurement data of the reference product batch is sequentially searched from the historical measurement data;

[0114] S220, the searched measurement data of the reference product batch is determined as the second measurement data of the target product batch.

[0115] In the method, according to the priority of each reference product batch in the at least one reference product batch, the measurement data of the reference product batch is sequentially searched from the historical measurement data from the priority level high priority to the priority level low priority. The measurement data of the reference product batch refers to the measurement data of the product belonging to the reference product batch.

[0116] In the process of searching for the measurement data of the reference product batch, the measurement data of the reference product batch with higher priority is searched first. If the measurement data of the reference product batch with higher priority is found from the historical measurement data, the search is not continued, and the measurement data of the reference product batch with higher priority is directly determined as the second measurement data of the target product batch. That is, the reference product batch with higher priority is directly determined as the target product batch, and the measurement data is determined as the second measurement data.

[0117] If the measurement data of the reference product batch with higher priority is not found from the historical measurement data, the measurement data of the reference product batch with the next lower priority is searched from the historical measurement data. Until the measurement data of one of the reference product batches is found, and then the searched measurement data of the reference product batch is determined as the measurement data of the target product batch.

[0118] It should be noted that if the measurement data of any one reference product batch is not found from the historical measurement data, it is determined that the second measurement data of the target product batch is not included in the historical measurement data according to the preset configuration information, and then the current processing process can be stopped.

[0119] Example 1,

[0120] In the preset configuration information, the current product batch corresponds to three reference product batches. The reference product batch L1 corresponds to the first level, the reference product batch L2 corresponds to the second level, and the reference product batch L3 corresponds to the third level. The first level is better than the second level, and the second level is better than the third level.

[0121] When searching for the measurement data of the reference product batch, the measurement data of the reference product batch L1 corresponding to the first level is searched from the historical measurement data first. If the measurement data of the reference product batch L1 is found from the historical measurement data, the reference product batch L1 is determined as the target product batch, and the found measurement data of the reference product batch L1 is determined as the second measurement data to control the production parameters of the current product.

[0122] If the measurement data of the reference product batch L1 is not found from the historical measurement data, the measurement data of the reference product batch L2 corresponding to the second level is searched from the historical measurement data. If the measurement data of the reference product batch L2 is found from the historical measurement data, the reference product batch L2 is determined as the target product batch, and the found measurement data of the reference product batch L2 is determined as the second measurement data to control the production parameters of the current product.

[0123] If the measurement data of the reference product batch L2 is not found from the historical measurement data, the measurement data of the reference product batch L3 corresponding to the second level is searched from the historical measurement data. If the measurement data of the reference product batch L3 is found from the historical measurement data, the reference product batch L3 is determined as the target product batch, and the found measurement data of the reference product batch L3 is determined as the second measurement data to control the production parameters of the current product.

[0124] If the measurement data of the reference product batch L3 is not found from the historical measurement data, it is determined that the second measurement data of the target product batch is not included in the historical measurement data, and then the current processing process can be stopped.

[0125] In the method, the second measurement data of the target product batch is searched from the historical measurement data according to the priority of each reference product batch in the at least one reference product batch, avoiding disordered searching and improving the efficiency of determining the second measurement data, so as to improve the efficiency of the semiconductor process and improve the production capacity.

[0126] It should be noted that in the method, the measurement data of all reference product batches can also be sequentially searched from the historical measurement data according to the priority of each reference product batch in the at least one reference product batch, and the searching is completed for all reference product batches.

[0127] If the measurement data of any reference product batch is not searched from the historical measurement data, it is determined that the second measurement data of the target product batch is not included in the historical measurement data, and the current processing process can be stopped.

[0128] If the measurement data of a reference product batch is searched from the historical measurement data, the searched reference product batch can be directly determined as the target product batch, and the searched measurement data can be determined as the second measurement data.

[0129] If the measurement data of more than one reference product batch is searched from the historical measurement data, the reference product batch with the highest priority among them is determined as the target product batch, and the searched measurement data of the target product batch is determined as the second measurement data.

[0130] In the method, the second measurement data of the target product batch is sequentially searched from the historical measurement data according to the priority of each reference product batch in the at least one reference product batch, which improves the efficiency of determining the second measurement data, and thus can improve the efficiency of the semiconductor process and improve the production capacity to a certain extent.

[0131] In an exemplary embodiment of the present disclosure, a semiconductor process control method is provided. In the method, target control data is determined according to preset configuration information and second measurement data, which can include:

[0132] S310, determining reference control data according to the second measurement data;

[0133] S320, determining target offset data as offset data corresponding to the target product batch in the preset configuration information;

[0134] S330, determining target control data according to the target offset data and the reference control data.

[0135] In step S310, the second measurement data is processed to obtain reference control parameters for controlling the production of reference products.

[0136] In step S320, each reference product batch in the at least one reference product batch in the preset configuration information can correspond to an offset data, and the offset data can represent the conversion relationship between the reference control data of the reference product batch corresponding thereto and the target control data.

[0137] That is, the offset data can represent the offset between the reference control data and the target control data of the reference product batch corresponding thereto. The reference control data and the target control data each include data of a plurality of production parameters, and thus the offset data can include offset values of the plurality of production parameters.

[0138] After determining the reference product batch as the target product batch, in this step, the offset data corresponding to the reference product batch (i.e., the reference product batch as the target product batch) can be searched from the preset configuration information, and then the searched offset data is determined as the target offset data.

[0139] Example 1,

[0140] In the preset configuration information, the current product batch corresponds to three reference product batches. The reference product batch L1 corresponds to the offset data P1, the reference product batch L2 corresponds to the offset data P2, and the reference product batch L3 corresponds to the offset data P3.

[0141] In the case of determining the reference product batch L1 as the target product batch, the offset data P1 corresponding to the reference product batch L1 is determined as the target offset data.

[0142] Example 2,

[0143] In the preset configuration information, the current product batch corresponds to one reference product batch, which is denoted as the reference product batch L1, and the reference product batch L1 corresponds to the offset data P1. In the case of determining the reference product batch L1 as the target product batch, the offset data P1 corresponding to the reference product batch L1 is determined as the target offset data.

[0144] In step S330, the target offset data can be used to adjust the reference control data, and then the target control data is determined.

[0145] For example, the reference control data is a control value 4.5, and the target offset data is an offset amount +1.6, and then the target control data is a control value 4.5+1.6=6.1.

[0146] For another example, the reference control data is a control value 2.3, and the target offset data is an offset amount -1.2, and then the target control data is a control value 2.3-1.3=1.1.

[0147] In the method, in the preset configuration information, each reference product batch of the at least one reference product batch corresponds to an offset data, and the offset data represents a conversion relationship between reference control data of the reference product batch and target control data of the current product batch, so that the target control data (i.e., the target control data of the current product) of the current product batch can be accurately determined according to the measurement data of the reference product batch, and the production parameters of the current product can be controlled to ensure normal production of the current product and improve production efficiency and capacity.

[0148] In the example embodiment of the present disclosure, a semiconductor process control method is provided. In the method, in the preset configuration information, each reference product batch of the at least one reference product batch can correspond to at least one sensor life cycle range, and each sensor life cycle range can correspond to an offset data, and the offset data represents a conversion relationship between reference control data of the reference product batch corresponding thereto and target control data.

[0149] That is, in the method, each reference product batch can correspond to only one reference control data. In the at least one reference product batch of the preset configuration information, each reference product batch can correspond to at least one sensor life cycle range, and each sensor life cycle range can correspond to an offset data, that is, each reference product batch can correspond to at least one offset data.

[0150] In the method, determining the target control data according to the preset configuration information and the second measurement data can include:

[0151] S410, acquiring a current sensor life cycle of a semiconductor production equipment;

[0152] S420, determining a sensor life cycle range to which the current sensor life cycle belongs as a current life cycle range;

[0153] S430, determining, as target offset data, an offset data in the preset configuration information that corresponds to both the target product batch and the current life cycle range;

[0154] S440, determining reference control data according to the second measurement data;

[0155] S450, determining target control data according to the target offset data and the reference control data.

[0156] In step S410, the semiconductor production equipment can include a plurality of sensors for measuring or detecting the product being produced, and the detection results of the sensors will be affected to a certain extent as the sensors are used.

[0157] The current sensor life cycle can refer to the current measurement times of the sensor. The sensor detects once, and it is recorded as one life cycle, which also means that the semiconductor production equipment generates one measurement data.

[0158] In this step, the measurement times in the measurement record in the semiconductor production equipment can be directly obtained, and the measurement times are taken as the current sensor life cycle.

[0159] In step S420, the sensor life cycle range to which the current sensor life cycle belongs is searched from the preset configuration information, and the searched sensor life cycle range is taken as the current life cycle range.

[0160] In step S430, the offset data corresponding to the current life cycle range and the target product batch is searched from the preset configuration information, and the searched offset data is determined as the target offset data.

[0161] Example 1,

[0162] In the preset configuration information, the current product batch corresponds to three reference product batches, which are respectively referred to as reference product batch L1, reference product batch L2 and reference product batch L3. Each reference product batch corresponds to two sensor life cycle ranges, which are respectively referred to as sensor life cycle range C1 and sensor life cycle range C2.

[0163] In the reference product batch L1, the sensor life cycle range C1 corresponds to the offset data P1-1, and the sensor life cycle range C2 corresponds to the offset data P1-2. In the reference product batch L2, the sensor life cycle range C1 corresponds to the offset data P2-1, and the sensor life cycle range C2 corresponds to the offset data P2-2. In the reference product batch L3, the sensor life cycle range C1 corresponds to the offset data P3-1, and the sensor life cycle range C2 corresponds to the offset data P3-2.

[0164] The current sensor life cycle belongs to the sensor life cycle range C1, and the reference product batch L1 is the target product batch. At this time, the offset data P1-1 in the preset configuration information can be determined as the target offset data.

[0165] In step S440, the second measurement data is processed to obtain the reference control parameter for controlling the production of the reference product. The detailed method can refer to step S310 in the above exemplary embodiment.

[0166] In step S450, the target offset data can be used to adjust the reference control data, and then the target control data is determined. The detailed method can refer to step S330 in the above exemplary embodiment.

[0167] In the method, it is considered that part of the offset data can be affected by the sensor life cycle, for the part of the offset data, at least one reference product batch in the preset configuration information, each reference product batch corresponds to at least one sensor life cycle range, and each sensor life cycle range corresponds to an offset data, so that the target control data of the current product batch (i.e. the target control data of the current product) can be accurately determined according to the measurement data of the reference product batch, and the production parameters of the current product can be controlled to ensure the normal production of the current product and improve the production efficiency and capacity.

[0168] It should be noted that when the sensor life cycle range has no effect on the offset data, only one sensor life cycle range including all sensor life cycles can be set in the preset configuration information, or no sensor life cycle range can be set.

[0169] In an exemplary embodiment of the present disclosure, a semiconductor process control method is provided. In the method, historical measurement data in a set period is obtained, which can include:

[0170] S510, determining a current control layer of a current product;

[0171] S520, obtaining historical measurement data in a set period corresponding to the current control layer.

[0172] In step S510, the current control layer refers to a semiconductor layer that needs to be processed by the current product.

[0173] Different production parameters need to be set for different control layers processed by the semiconductor production equipment, therefore, the current control layer needs to be determined first.

[0174] The current control layer can be determined by analyzing wafer batch information. That is, when analyzing the wafer batch information, not only the current product batch of the current product can be determined, but also the current control layer of the current product can be determined.

[0175] In step S520, after determining the current control layer, the historical measurement data in the set period corresponding to the current control layer is obtained. That is, from the measurement data in the set period, the measurement data when processing the current control layer (including the measurement data of the products belonging to the current product batch and the measurement data of other products) is found.

[0176] In the method, in a case that it is determined that the historical measurement data does not include the first measurement data of the current product batch, if it is determined according to the preset configuration information that the historical measurement data includes the second measurement data of the target product batch, target control data is determined according to the preset configuration information and the second measurement data, and then the production parameter of the current control layer of the current product is controlled according to the target control data to process the current control layer of the current product. If it is determined according to the preset configuration information that the historical measurement data does not include the second measurement data of the target product batch, the current control layer of the current product is prohibited to be processed.

[0177] In the method, the historical measurement data of the current control layer is acquired in a targeted manner, which can reduce the data processing amount to a certain extent, improve the data processing efficiency, and further improve the production efficiency.

[0178] In the example embodiment of the present disclosure, a semiconductor process control method is provided. In the method, the priority of each reference product batch in the at least one reference product batch of the preset configuration information is determined by the following method:

[0179] S610, historical control data of the current control layer is acquired;

[0180] S620, the priority of each reference product batch in the at least one reference product batch is determined according to the control data amount of each reference product batch in the at least one reference product batch in the historical control data.

[0181] In step S610, the historical control data and the historical measurement data do not have a certain correlation relationship, and the acquisition methods of the two can be the same or different.

[0182] In this step, the historical control data of the current control layer can be acquired from the control record of the semiconductor production equipment, or the historical control data of the same type of semiconductor production equipment when producing the current control layer can be downloaded from the network side.

[0183] In step S620, the reference product batch corresponding to the control data with a larger control data amount can be determined as a higher priority.

[0184] The larger the control data amount of the control data is, the higher the reliability of the target control data determined according to the control data is. Therefore, the reference product batch corresponding to the control data with a larger control data amount is determined as a higher priority, which can improve the reliability of the determined target control data to a certain extent.

[0185] Example 1,

[0186] The historical regulation data of the current regulation layer includes regulation data of three reference product batches. The reference product batch L1 corresponds to the first regulation data, the reference product batch L2 corresponds to the second regulation data, and the reference product batch L3 corresponds to the third regulation data. The regulation data amount of the first regulation data is a, the regulation data amount of the second regulation data is b, and the regulation data amount of the third regulation data is c. a is greater than b, and b is greater than c.

[0187] The three reference product batches are set in the preset configuration information. The priority of the reference product batch L1 is set to the first level, the priority of the reference product batch L2 is set to the second level, and the priority of the reference product batch L3 is set to the third level. The first level is better than the second level, and the second level is better than the third level.

[0188] In the method, the priority of each reference product batch in the preset configuration information is determined according to the regulation data amount. The reference product batch corresponding to the regulation data with a larger regulation data amount can be set to a higher priority. Therefore, the target regulation data can be determined more reliably, and more appropriate production parameters can be set to improve the product yield.

[0189] In an exemplary embodiment of the present disclosure, a semiconductor process control method is provided. In the method, the historical regulation data can include a plurality of first sub-regulation data of a current product batch and a plurality of second sub-regulation data of each reference product batch in at least one reference product batch,

[0190] The method can further include:

[0191] According to the plurality of first sub-regulation data and the plurality of second sub-regulation data, the offset data corresponding to each reference product batch in the at least one reference product batch is determined in a set manner.

[0192] It should be noted that the larger the data amount of the first sub-regulation data and the second sub-regulation data, the higher the reliability of the offset data obtained therefrom. Therefore, the method can obtain as much first sub-regulation data and second sub-regulation data as possible, that is, as much historical regulation data as possible. For example, the historical regulation data of the current regulation layer is obtained from the regulation record of the currently used semiconductor production equipment, and the historical regulation data of the same type of semiconductor production equipment when producing the current regulation layer is downloaded from the network side, so as to increase the data amount of the historical regulation data and improve the reliability of the determined offset data.

[0193] According to the plurality of first sub-regulation data and the plurality of second sub-regulation data, the offset data corresponding to each reference product batch in the at least one reference product batch is determined in a set manner.

[0194] S610, determine a plurality of sensor life cycles, each sensor life cycle corresponding to a sub-offset data;

[0195] S620, determine the mode of a plurality of sub-offset data corresponding to a plurality of sensor life cycles as the offset data corresponding to each reference product batch in at least one reference product batch.

[0196] In step S610, the plurality of first sub-control data can be the first sub-control data corresponding to the plurality of sensor life cycles in the set life cycle range, the plurality of second sub-control data can be the second sub-control data corresponding to the plurality of sensor life cycles, and the plurality of first sub-control data, the plurality of second sub-control data and the plurality of sensor life cycles are one-to-one correspondence.

[0197] Example 1,

[0198] The set life cycle range is 1-3, and the historical control data includes the first sub-control data and the second sub-control data when the sensor life cycle is 1, the first sub-control data and the second sub-control data when the sensor life cycle is 2, and the first sub-control data and the second sub-control data when the sensor life cycle is 1.

[0199] In addition, in this step, the sub-offset data represents the conversion relationship between the first sub-control data and the second sub-control data corresponding to each sensor life cycle.

[0200] Example 2,

[0201] The set life cycle range is 1-3, the sub-offset data when the sensor life cycle is 1 is denoted as P1, the sub-offset data when the sensor life cycle is 2 is denoted as P2, and the sub-offset data when the sensor life cycle is 2 is denoted as P3.

[0202] Wherein, the sub-offset data P1 represents the conversion relationship between the first sub-control data and the second sub-control data when the sensor life cycle is 1. The sub-offset data P2 represents the conversion relationship between the first sub-control data and the second sub-control data when the sensor life cycle is 2. The sub-offset data P3 represents the conversion relationship between the first sub-control data and the second sub-control data when the sensor life cycle is 3.

[0203] In step S620, the mode (Mode) refers to the value with obvious central tendency point in statistical distribution, which represents the general level of data. The mode can be generally understood as the value with the most occurrences in a set of data.

[0204] For example, in the plurality of sub-offset data corresponding to a plurality of sensor life cycles of the reference product batch C1, the sub-offset data P1 with the most occurrences is determined as the offset data corresponding to the reference product batch C1.

[0205] In the method, the mode value is used to determine the offset data of each reference product batch, which can better reflect the conversion relationship between the control data of the reference product batch and the control data of the current product batch, so as to more accurately determine the target control data and determine more reliable production parameters, thereby improving production efficiency and capacity.

[0206] It should be noted that, in addition to the above mode value setting method for determining the offset data of the reference product batch, the offset data of the reference product batch can also be determined by other methods.

[0207] For example, the average value of the sub-offset data corresponding to the sensor life cycle within the set life cycle range of the reference product batch can be determined as the offset data of the reference product batch within the set life cycle range.

[0208] For another example, since the linear relationship between the control data and the sensor life cycle within the set life cycle range of each product batch is similar, the linear function relationship between the control data and the sensor life cycle within the set life cycle range of the reference product batch can be determined first, for example, y=ax+b, and then the linear function relationship between the control data and the sensor life cycle within the set life cycle range of the current product batch can be determined, for example, y=ax+c, and then the offset data of the reference product batch within the set life cycle range is determined as c-b according to the above two linear function relationships.

[0209] An example embodiment of the present disclosure provides a semiconductor process control method. Referring to Figure 2 The method can include:

[0210] S710, acquiring a current sensor life cycle of a semiconductor production equipment;

[0211] S720, determining a sensor life cycle range to which the current sensor life cycle belongs as a current life cycle range;

[0212] S730, parsing wafer batch information to determine a current product batch of a current product and a current control layer;

[0213] S740, acquiring historical measurement data within a set period corresponding to the current control layer;

[0214] S750, determining that the historical measurement data does not include first measurement data of the current product batch;

[0215] S760, sequentially searching for measurement data of each reference product batch from the historical measurement data according to a priority of each reference product batch in at least one reference product batch; if the measurement data is found, proceeding to step S770; otherwise, proceeding to step S7120;

[0216] S770. The measurement data of the reference product batch found is determined as the second measurement data of the target product batch.

[0217] S780. Determine the reference control data based on the second measurement data;

[0218] S790. Determine the offset data in the preset configuration information that corresponds to both the target product batch and the current lifecycle range as the target offset data.

[0219] S7100. Determine the target control data based on the target offset data and the reference control data;

[0220] S7110. Control the production parameters of the current product according to the target control data.

[0221] S7120, Prohibit the processing of the current product at the current control layer.

[0222] In this method, steps S730 to S780 can be executed simultaneously during the execution of steps S710 and S720. Furthermore, in this method, the preset configuration information can be determined by the computer itself through processing and analyzing the corresponding data using a preset algorithm, or it can be determined by an engineer through analysis of the corresponding data.

[0223] Additionally, it should be noted that in this method, if it is determined that the historical measurement data includes the first measurement data of the current product batch, the target control data is directly determined based on the first measurement data, and then the production parameters are controlled.

[0224] Example 1,

[0225] Offset data table of control layer A

[0226]

[0227] Offset data table of control layer B

[0228]

[0229] Preset configuration information table

[0230]

[0231] refer to Figure 2 , Figure 2a as well as Figure 2b As shown, historical control data is processed to determine the control data (e.g., control values) for three product batches and the line graph of the sensor lifecycle. Among them, Figure 2a This is a line graph corresponding to control layer A. Figure 2b This is a line graph corresponding to control layer B.

[0232] For the regulation layer A, the difference of the regulation data of any two product batches is not affected by the sensor life cycle, i.e., the offset data representing the conversion relationship of the regulation data of any two product batches is not affected by the sensor life cycle. Thus, according to the mode of the mode, the offset data table between any two product batches for the regulation layer A can be determined, which is recorded as the offset data table of the regulation layer A.

[0233] For the regulation layer B, the difference of the regulation data of any two product batches is affected by the sensor life cycle, i.e., the offset data representing the conversion relationship of the regulation data of any two product batches is affected by the sensor life cycle. Thus, according to the mode of the mode, the offset data table between any two product batches for the regulation layer B can be determined, which is recorded as the offset data table of the regulation layer B.

[0234] According to the offset data table of the regulation layer A and the offset data table of the regulation layer B, the preset configuration information determined is the preset configuration information table.

[0235] Wherein, sensor(L) represents the minimum value of the sensor life cycle range, sensor(UP) represents the maximum value of the sensor life cycle range, and NA can also be recorded as N / A (Not Available), which can be understood as unnecessary, unnecessary, i.e., there is no corresponding numerical value, which is mainly to make the above table look more uniform. Three product batches are recorded as L1, L2 and L3 respectively. Two regulation layers are recorded as A and B respectively. The priority of two levels is recorded as I and II respectively.

[0236] It can be known from the above table that the offset data of the regulation layer A is not affected by the sensor life cycle range. When the current product is L1, the current regulation layer is A, and the target product batch is L2, the target offset data corresponding to any sensor life cycle is 1.16. When the current product is L2, the current regulation layer is A, and the target product batch is L3, the target offset data corresponding to any sensor life cycle is 1.33.

[0237] The offset data of control layer B has different effects on the sensor lifecycle ranges of 0-225 and 226-500. When the current product is L1, the current control layer is B, the target product batch is L2, and the sensor lifecycle range is 0-225, the target offset data is 0. When the current product is L1, the current control layer is B, the target product batch is L2, and the sensor lifecycle range is 226-500, the target offset data is -0.76. When the current product is L2, the current control layer is B, the target product batch is L3, and the sensor lifecycle range is 0-225, the target offset data is 0. When the current product is L2, the current control layer is B, the target product batch is L3, and the sensor lifecycle range is 226-500, the target offset data is -0.78.

[0238] In this method, in semiconductor manufacturing processes (e.g., R2R), when historical measurement data does not include the first measurement data of the current product batch (i.e., historical measurement data does not include the first measurement data of the same product as the current product batch), the target control data can be determined based on the second measurement data of other products. Then, the production parameters of the current product are controlled based on the target control data to improve the intelligence of the entire control method and increase production capacity to a certain extent.

[0239] It is important to note that in this method, the amount of historical control data available gradually increases over time. Therefore, new historical control data can be acquired in real time, and new preset configuration information can be determined based on the updated historical control data. Alternatively, a preset configuration information update cycle can be set; for example, new historical control data can be acquired every set interval (e.g., once a week or once a month), and new preset configuration information can be determined based on the updated historical control data.

[0240] This method, by updating the preset configuration information in real time or periodically, can better determine appropriate production parameters and further improve production efficiency and capacity.

[0241] This disclosure provides an exemplary embodiment of a semiconductor manufacturing process control device. This device is used to implement the method described above. (See reference...) Figure 3 As shown, the device may include a first determining module 101, a first acquiring module 102, and a control module 103. During the implementation of the above method, the device...

[0242] The first determining module 101 is configured to parse wafer batch information and determine the current product batch of the current product.

[0243] The first acquisition module 102 is configured to acquire historical measurement data within a set period.

[0244] The first determination module 101 is further configured to, in a case where it is determined that the historical measurement data does not include the first measurement data of the current product batch, if it is determined according to the preset configuration information that the historical measurement data includes second measurement data of a target product batch, determine target control data according to the preset configuration information and the second measurement data.

[0245] The control module 103 is configured to control a production parameter of the current product according to the target control data.

[0246] An example embodiment of the present disclosure provides a semiconductor process control device. Referring to FIG. 1, the device includes a first determination module 101, a second determination module 102, and a control module 103. Figure 3 The first determination module 101 is further configured to:

[0247] According to a priority of each of the at least one reference product batch, sequentially search for measurement data of the reference product batch from the historical measurement data;

[0248] Determine the searched measurement data of the reference product batch as the second measurement data of the target product batch.

[0249] An example embodiment of the present disclosure provides a semiconductor process control device. Referring to FIG. 1, the device includes a first determination module 101, a second determination module 102, and a control module 103. Figure 3 When each of the at least one reference product batch corresponds to an offset data, the offset data represents a conversion relationship between reference control data of the reference product batch corresponding to the offset data and target control data.

[0250] The first determination module 101 is further configured to:

[0251] Determine reference control data according to the second measurement data;

[0252] Determine, as target offset data, the offset data corresponding to the target product batch in the preset configuration information;

[0253] Determine the target control data according to the target offset data and the reference control data.

[0254] An example embodiment of the present disclosure provides a semiconductor process control device. Referring to FIG. 1, the device includes a first determination module 101, a second determination module 102, and a control module 103. Figure 3 When each of the at least one reference product batch corresponds to at least one sensor life cycle range, and each sensor life cycle range corresponds to an offset data, the offset data represents a conversion relationship between reference control data of the reference product batch corresponding to the offset data and target control data.

[0255] The first acquisition module 102 is further configured to acquire a current sensor life cycle of a sensor of a semiconductor production device.

[0256] The first determination module 101 is further configured to:

[0257] determine a sensor life cycle range to which the current sensor life cycle belongs as a current life cycle range;

[0258] determine, as target offset data, offset data in the preset configuration information that corresponds to the target product batch and the current life cycle range at the same time;

[0259] determine reference control data according to the second measurement data;

[0260] determine target control data according to the target offset data and the reference control data.

[0261] In an exemplary embodiment of the present disclosure, a semiconductor process control device is provided. As shown in the figure, Figure 3 The first determination module 101 is further configured to determine a current control layer of the current product.

[0262] The first acquisition module 102 is further configured to acquire historical measurement data in a set period corresponding to the current control layer.

[0263] In an exemplary embodiment of the present disclosure, a semiconductor process control device is provided. As shown in the figure, Figure 3 The control module 103 is further configured to, in a case where it is determined that the historical measurement data does not include the first measurement data of the target product batch according to the preset configuration information, prohibit processing of the current control layer of the current product.

[0264] In an exemplary embodiment of the present disclosure, a semiconductor process control device is provided. As shown in the figure, Figure 3 The priority of each reference product batch in the at least one reference product batch is determined by the following device:

[0265] The second acquisition module 202 is configured to acquire historical control data of the current control layer;

[0266] The second determination module 201 is configured to determine the priority of each reference product batch in the at least one reference product batch according to the amount of control data of each reference product batch in the historical control data.

[0267] In an exemplary embodiment of the present disclosure, a semiconductor process control device is provided. As shown in the figure, Figure 3 The historical control data includes a plurality of first sub-control data of the current product batch and a plurality of second sub-control data of each reference product batch in the at least one reference product batch.

[0268] The second determining module 201 is further configured to determine the offset data corresponding to each of the at least one reference product batch in a set manner according to the plurality of first sub-control data and the plurality of second sub-control data.

[0269] In the example embodiment of the present disclosure, a semiconductor process control device is provided. Referring to Figure 3 As shown, in the device, the plurality of first sub-control data are first sub-control data corresponding to a plurality of sensor lifecycles in a set life cycle range, the plurality of second sub-control data are second sub-control data corresponding to the plurality of sensor lifecycles, and the plurality of first sub-control data, the plurality of second sub-control data and the plurality of sensor lifecycles correspond one by one.

[0270] The second determining module 201 is further configured to:

[0271] determine sub-offset data corresponding to each of the plurality of sensor lifecycles, the sub-offset data representing a conversion relationship between the first sub-control data and the second sub-control data corresponding to each of the plurality of sensor lifecycles;

[0272] determine a mode of the plurality of sub-offset data corresponding to the plurality of sensor lifecycles as the offset data corresponding to each of the at least one reference product batch.

[0273] In the example embodiment of the present disclosure, a semiconductor production equipment is provided. Referring to Figure 4 As shown, the semiconductor production equipment 400 can be provided as a terminal device. The semiconductor production equipment 400 can include a processor 401, the number of which can be set to one or more as needed. The semiconductor production equipment 400 can further include a memory 402 configured to store instructions executable by the processor 401, such as an application program. The number of memories can be set to one or more as needed. The stored application program can be one or more. The processor 401 is configured to execute the instructions to perform the above method.

[0274] Those skilled in the art will appreciate that embodiments of the present disclosure can be provided as methods, apparatus (devices), or computer program products. Accordingly, the present disclosure can take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present disclosure can take the form of a computer program product on one or more computer-usable storage media (including volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data) embodying computer readable instructions, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be configured to store the desired information and which can accessed by a computer. Further, as will be appreciated by one skilled in the art, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media.

[0275] In an example embodiment, a non-transitory computer readable storage medium including instructions is provided, referring to Figure 4 As shown, for example, the non-transitory computer readable storage medium can include a memory 402 storing instructions which can be executed by a processor 401 of the semiconductor production equipment 400 to complete the above method. For example, the non-transitory computer readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0276] For example, a non-transitory computer readable storage medium, when the instructions in the storage medium are executed by a processor of a semiconductor production equipment, enables the semiconductor production equipment to perform:

[0277] parsing wafer batch information to determine a current product batch of a current product;

[0278] obtaining historical measurement data within a set period;

[0279] In a case where it is determined that the historical measurement data does not include first measurement data of the current product batch, if it is determined according to preset configuration information that the historical measurement data includes second measurement data of a target product batch, determining target control data according to the preset configuration information and the second measurement data;

[0280] controlling a production parameter of the current product according to the target control data.

[0281] This disclosure is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (devices), and computer program products according to embodiments of this disclosure. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, are configured to implement the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0282] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0283] These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable apparatus to be configured to implement a process. Figure 1 One or more processes and / or boxes Figure 1 Figure 1 The steps of the function specified in one or more boxes.

[0284] In this disclosure, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase “comprising…” does not exclude the presence of additional identical elements in the article or device that includes said element.

[0285] Although preferred embodiments of the present disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

[0286] It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the spirit or scope of the disclosure. Thus, it is intended that the present disclosure cover the modifications and variations of this disclosure provided they come within the scope of the appended claims and their equivalents.

Claims

1. A method for controlling a semiconductor manufacturing process, characterized in that, The method includes: Analyze wafer batch information to determine the current product batch for the current product; Acquire historical measurement data within a specified period; If it is determined that the historical measurement data does not include the first measurement data of the current product batch, and if it is determined according to the preset configuration information that the historical measurement data includes the second measurement data of the target product batch, then the target control data is determined according to the preset configuration information and the second measurement data. Control the production parameters of the current product according to the target control data; In the preset configuration information, the current product batch corresponds to at least one reference product batch. The step of determining, based on preset configuration information, that the historical measurement data includes second measurement data of the target product batch includes: Based on the priority of each reference product batch in the at least one reference product batch, the measurement data of the reference product batch is sequentially retrieved from the historical measurement data; The measurement data of the reference product batch found is determined as the second measurement data of the target product batch.

2. The method as described in claim 1, characterized in that, When each reference product batch in the at least one reference product batch corresponds to an offset data, the offset data represents the conversion relationship between the reference control data and the target control data of its corresponding reference product batch. The step of determining the target control data based on the preset configuration information and the second measurement data includes: The reference control data is determined based on the second measurement data; The offset data corresponding to the target product batch in the preset configuration information is determined as the target offset data; The target control data is determined based on the target offset data and the reference control data.

3. The method as described in claim 1, characterized in that, When each of the at least one reference product batches corresponds to at least one sensor lifecycle range, and each sensor lifecycle range corresponds to an offset data, the offset data represents the conversion relationship between the reference control data and the target control data of the corresponding reference product batch. The step of determining the target control data based on the preset configuration information and the second measurement data includes: Obtain the current sensor lifecycle of the sensors in the semiconductor manufacturing equipment; The sensor lifecycle range to which the current sensor lifecycle belongs is determined as the current lifecycle range; The offset data in the preset configuration information that corresponds to both the target product batch and the current lifecycle range is determined as the target offset data; The reference control data is determined based on the second measurement data; The target control data is determined based on the target offset data and the reference control data.

4. The method as described in claim 2 or 3, characterized in that, The acquisition of historical measurement data within a set period includes: Determine the current control layer of the current product; Obtain historical measurement data within a set period corresponding to the current control layer.

5. The method as described in claim 4, characterized in that, If it is determined that the historical measurement data does not include the first measurement data of the current product batch, the method further includes: If, based on the preset configuration information, it is determined that the historical measurement data does not include the second measurement data of the target product batch, then processing of the current control layer of the current product is prohibited.

6. The method as described in claim 4, characterized in that, The priority of each reference product batch in the at least one reference product batch is determined by the following method: Obtain the historical control data of the current control layer; Based on the amount of control data for each reference product batch in the at least one reference product batch from the historical control data, the priority of each reference product batch in the at least one reference product batch is determined.

7. The method as described in claim 6, characterized in that, The historical control data includes multiple first sub-control data for the current product batch, and multiple second sub-control data for each reference product batch in the at least one reference product batch. The method further includes: Based on the plurality of first sub-control data and the plurality of second sub-control data, offset data corresponding to each reference product batch in the at least one reference product batch is determined in a set manner.

8. The method as described in claim 7, characterized in that, The plurality of first sub-control data are first sub-control data corresponding to the life cycles of multiple sensors within a set life cycle range, and the plurality of second sub-control data are second sub-control data corresponding to the life cycles of the multiple sensors. The plurality of first sub-control data, the plurality of second sub-control data and the life cycles of the multiple sensors correspond one-to-one. The step of determining the offset data corresponding to each reference product batch in the at least one reference product batch in a predetermined manner based on the plurality of first sub-control data and the plurality of second sub-control data includes: Determine the sub-offset data corresponding to each sensor lifecycle in the multiple sensor lifecycles, wherein the sub-offset data characterizes the conversion relationship between the first sub-control data and the second sub-control data corresponding to each sensor lifecycle; The mode of the multiple sub-offset data corresponding to the lifecycle of the multiple sensors is determined as the offset data corresponding to each reference product batch in the at least one reference product batch.

9. A control device for a semiconductor manufacturing process, characterized in that, The device includes: The first determining module is configured to parse wafer batch information and determine the current product batch of the current product. The first acquisition module is configured to acquire historical measurement data within a set period. The first determining module is further configured to, if it is determined that the historical measurement data does not include the first measurement data of the current product batch, and if it is determined according to preset configuration information that the historical measurement data includes the second measurement data of the target product batch, then determine the target control data according to the preset configuration information and the second measurement data. The control module is configured to control the production parameters of the current product based on the target control data; In the preset configuration information, the current product batch corresponds to at least one reference product batch, and the first determining module is further configured to: Based on the priority of each reference product batch in the at least one reference product batch, the measurement data of the reference product batch is sequentially retrieved from the historical measurement data; The measurement data of the reference product batch found is determined as the second measurement data of the target product batch.

10. The apparatus as claimed in claim 9, characterized in that, When each reference product batch in the at least one reference product batch corresponds to an offset data, the offset data represents the conversion relationship between the reference control data and the target control data of its corresponding reference product batch. The first determining module is further configured to: The reference control data is determined based on the second measurement data; The offset data corresponding to the target product batch in the preset configuration information is determined as the target offset data; The target control data is determined based on the target offset data and the reference control data.

11. The apparatus as claimed in claim 10, characterized in that, When each of the at least one reference product batches corresponds to at least one sensor lifecycle range, and each sensor lifecycle range corresponds to an offset data, the offset data represents the conversion relationship between the reference control data and the target control data of the corresponding reference product batch. The first acquisition module is further configured to acquire the current sensor lifecycle of the sensors of the semiconductor manufacturing equipment; The first determining module is further configured to: The sensor lifecycle range to which the current sensor lifecycle belongs is determined as the current lifecycle range; The offset data in the preset configuration information that corresponds to both the target product batch and the current lifecycle range is determined as the target offset data; The reference control data is determined based on the second measurement data; The target control data is determined based on the target offset data and the reference control data.

12. The apparatus as claimed in claim 10 or 11, characterized in that, The first determining module is further configured to determine the current control layer of the current product; The first acquisition module is further configured to acquire historical measurement data within a set period corresponding to the current control layer.

13. The apparatus as claimed in claim 12, characterized in that, If it is determined that the historical measurement data does not include the first measurement data of the current product batch, the control module is further configured to prohibit the processing of the current control layer of the current product if it is determined, according to the preset configuration information, that the historical measurement data does not include the second measurement data of the target product batch.

14. The apparatus as claimed in claim 12, characterized in that, The priority of each reference product batch in the at least one reference product batch is determined by the following means: The second acquisition module is configured to acquire historical control data of the current control layer; The second determining module is configured to determine the priority of each reference product batch in the at least one reference product batch based on the amount of control data of each reference product batch in the historical control data.

15. The apparatus as claimed in claim 14, characterized in that, The historical control data includes multiple first sub-control data for the current product batch, and multiple second sub-control data for each reference product batch in the at least one reference product batch. The second determining module is further configured to determine, in a predetermined manner, the offset data corresponding to each reference product batch in the at least one reference product batch based on the plurality of first sub-control data and the plurality of second sub-control data.

16. The apparatus as claimed in claim 15, characterized in that, The plurality of first sub-control data are first sub-control data corresponding to the life cycles of multiple sensors within a set life cycle range, and the plurality of second sub-control data are second sub-control data corresponding to the life cycles of the multiple sensors. The plurality of first sub-control data, the plurality of second sub-control data and the life cycles of the multiple sensors correspond one-to-one. The second determining module is further configured to: Determine the sub-offset data corresponding to each sensor lifecycle in the multiple sensor lifecycles, wherein the sub-offset data characterizes the conversion relationship between the first sub-control data and the second sub-control data corresponding to each sensor lifecycle; The mode of the multiple sub-offset data corresponding to the lifecycle of the multiple sensors is determined as the offset data corresponding to each reference product batch in the at least one reference product batch.

17. A semiconductor manufacturing apparatus, characterized in that, The semiconductor manufacturing equipment includes: processor; Memory configured to store processor-executable instructions; The processor is configured to perform the method as described in any one of claims 1-8.

18. A non-transitory computer-readable storage medium, characterized in that, When the instructions in the storage medium are executed by the processor of the device, the device is able to perform the method as described in any one of claims 1-8.

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