Power module and solid state transformer system

Abstract

The application provides a power module and a solid-state transformer system, the power module comprising: a circuit module having a voltage level; and a cabin body for covering the circuit module by bending or splicing, and the cabin body having a shielding structure, the shielding structure comprising: a first conductor layer located on a side close to the circuit module and connected to the circuit module in an equipotential manner; a second conductor layer spaced apart from the first conductor layer and located on a side away from the circuit module; and a solid insulation layer arranged between the first conductor layer and the second conductor layer and used for electrically isolating the first conductor layer from the second conductor layer. The power module provided by the application has good insulation performance and is easy to assemble.

Description

Technical Field

[0001] This invention relates to the field of power electronics technology, and more particularly to a power module and a solid-state transformer system. Background Technology

[0002] In recent years, with the development of distribution networks towards smart grids, high-power power electronic converters have been widely applied in power quality control, energy storage, electric transmission, and new energy fields including solar and wind power through modular strategies. This has also led to the development of medium-voltage converters on transmission lines of related power systems. The definition of medium voltage is broad, typically ranging from 2.4 to 69 kV, with typical values ​​of 10 kV, 13.8 kV, and 20 kV in China, the United States, and Europe, respectively.

[0003] Compared to conventional air insulation, solid insulation offers advantages such as high breakdown field strength, uniform electric field, and easy control of field strength. Using solid insulation saves insulation space between power modules, allowing power modules used in medium-voltage applications to maintain high power density. It also enhances insulation reliability and structural protection, and simplifies installation.

[0004] Current power modules use traditional epoxy resin casting to fabricate the insulating housing. However, the limited space in the pre-formed housing makes it difficult to improve installation accuracy, and the connection of various connectors (such as optical fibers) is also challenging. Furthermore, to increase the power density of the power module, the thickness of the insulating housing needs to be further reduced, but traditional epoxy resin casting processes cannot guarantee a good yield for thin insulating housings (thickness < 6mm).

[0005] Therefore, there is an urgent need to develop a power module whose housing structure possesses both the solid insulation properties of traditional epoxy resin and the ability to simplify installation steps and flexibly adapt to module shapes. Summary of the Invention

[0006] In view of the above problems, the purpose of this invention is to provide a power module and solid-state transformer system with good insulation performance and easy assembly.

[0007] A first aspect of the present invention provides a power module, the power module comprising: a circuit module having a voltage level; and a housing for covering the circuit module by bending or splicing, the housing having a shielding structure comprising: a first conductor layer located on the side close to the circuit module and equipotentially connected to the circuit module; a second conductor layer spaced apart from the first conductor layer and located on the side away from the circuit module; and a solid insulating layer disposed between the first conductor layer and the second conductor layer for electrically isolating the first conductor layer and the second conductor layer.

[0008] In some alternative implementations, the shielding structure is flexible.

[0009] In some alternative implementations, the shielding structure includes flexible shielding sections and rigid shielding sections, which are arranged alternately and connected end to end.

[0010] In some alternative implementations, at least one flexible shielding section is disposed on the outer corner between two adjacent outer wall surfaces of the circuit module.

[0011] In some alternative implementations, the shielding structure includes multiple shielding segments arranged circumferentially along the circuit module, and the shielding structure has an interface formed between two adjacent shielding segments.

[0012] In some alternative implementations, the interface is located on the outer corner between two adjacent outer walls of the circuit module.

[0013] In some alternative implementations, the power module also includes an insulating element that surrounds the circuit module and at least covers the interface, with the insulating element located on either side of the housing.

[0014] In some alternative embodiments, the cabin also has an insulating element disposed at the interface and connected between two adjacent shielding sections, the insulating element being integral with the solid insulating layer of the shielding structure.

[0015] In some alternative embodiments, the shielding structure further includes a plurality of third conductor layers spaced apart between the first conductor layer and the second conductor layer, wherein the ends of the first conductor layer, the ends of the plurality of third conductor layers, and the ends of the second conductor layer gradually extend from the side closer to the circuit module to the side farther away from the circuit module.

[0016] In some alternative implementations, the circuit module has a recess disposed opposite to the interface.

[0017] In some alternative embodiments, the shielding structure further includes a plurality of third conductor layers spaced apart, at least one of which is disposed on the outside of the shielding structure and configured as a signal transmission layer.

[0018] In some alternative embodiments, the first conductor layer is a metal layer, a semiconducting layer, or a composite structure of a metal layer and a semiconducting layer.

[0019] In some alternative embodiments, the second conductor layer is a metal layer, a semiconducting layer, or a composite structure of a metal layer and a semiconducting layer.

[0020] In some alternative implementations, the cabin is fabricated using a printed circuit board process.

[0021] A second aspect of the present invention provides a power module, comprising: a first circuit module having a first voltage level; a first housing for enclosing the first circuit module, the first housing having a first shielding structure, the first shielding structure being the shielding structure of the power module of the first aspect described above, and the first conductor layer of the first shielding structure being equipotentially connected to the first circuit module; and a second circuit module being arranged parallel to or surrounding the first circuit module, the second circuit module having a second voltage level lower than the first voltage level.

[0022] In some optional embodiments, the power module further includes a second housing for enclosing the second circuit module, and the second housing has a second shielding structure, wherein the second shielding structure includes: a fourth conductor layer located on the side close to the second circuit module and equipotentially connected to the second circuit module; a fifth conductor layer spaced apart from the fourth conductor layer and located on the side away from the second circuit module; and an insulating layer disposed between the fourth conductor layer and the fifth conductor layer for electrically isolating the fourth conductor layer and the fifth conductor layer.

[0023] In some alternative embodiments, the first and second hulls are arranged side by side, with a common section between them.

[0024] In some alternative embodiments, the common portion has a common conductor layer electrically coupled to a reference potential, the voltage of which is between a first voltage level and a second voltage level.

[0025] In some alternative implementations, the first shielding structure includes a plurality of first shielding segments, and the second shielding structure includes a plurality of second shielding segments.

[0026] In some alternative implementations, the common section is rigid and is connected between two flexible first shielding sections and between two flexible second shielding sections.

[0027] In some alternative embodiments, the two ends of the first compartment are coated with insulating adhesive and have ventilation holes, which are used to form air ducts within the first compartment.

[0028] In some alternative implementations, the power module further includes a heat sink disposed within the first compartment and exposed to airflow, with the first circuit module disposed around the heat sink.

[0029] A third aspect of the present invention provides a solid-state transformer system, which includes the power module described in the second aspect.

[0030] Compared with the prior art, the power module and solid-state transformer system provided in this embodiment of the invention have at least the following advantages: The power module includes a housing and a circuit module disposed within the housing. The housing has a shielding structure with a solid insulating layer to protect the circuit module. A first conductor layer is provided on the inner side of the solid insulating layer, electrically coupled to the circuit module, so that the circuit module within the housing is shielded by an equipotentially charged body and to prevent air breakdown and discharge within the circuit module. A second conductor layer is provided on the outer side of the solid insulating layer, which may, but is not limited to, grounding. Grounding improves the safety factor of the entire power module.

[0031] Furthermore, the enclosure can be used to cover the circuit modules through bending or splicing, meaning the enclosure is either a spliced ​​structure or bendable. This allows for greater flexibility in power module installation; the internal circuit modules can be installed first, and then the enclosure can be assembled and fixed to or wrapped around the outer wall of the circuit modules.

[0032] In addition to the technical problems solved by the embodiments of the present invention, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the power module and solid-state transformer system provided by the embodiments of the present invention, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific embodiments. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 1 ;

[0035] Figure 2 for Figure 1 A schematic diagram of the shielding structure;

[0036] Figure 3 for Figure 1 A schematic diagram of a flexible shielding structure.

[0037] Figure 4 for Figure 1 Schematic diagram of a shielding structure that includes both rigid and flexible shielding sections. Figure 1 ;

[0038] Figure 5 for Figure 1 Schematic diagram of a shielding structure that includes both rigid and flexible shielding sections. Figure 2 ;

[0039] Figure 6 for Figure 1 Schematic diagram of a shielding structure that includes both rigid and flexible shielding sections. Figure 3 ;

[0040] Figure 7 for Figure 1 Schematic diagram of a shielding structure comprising multiple shielding sections Figure 1 ;

[0041] Figure 8 for Figure 1 Schematic diagram of a shielding structure comprising multiple shielding sections Figure 2 ;

[0042] Figure 9 for Figure 1 Schematic diagram of a shielding structure comprising multiple shielding sections Figure 3 ;

[0043] Figure 10 for Figure 1 Schematic diagram of a shielding structure comprising multiple shielding sections Figure 4 ;

[0044] Figure 11 for Figure 1 Schematic diagram of a shielding structure comprising multiple shielding sections Figure 5 ;

[0045] Figure 12 for Figure 1 Schematic diagram of a shielding structure comprising multiple shielding sections Figure 6 ;

[0046] Figure 13 for Figure 1 Schematic diagram of a shielding structure comprising multiple shielding sections Figure 7 ;

[0047] Figure 14 for Figure 1 A schematic diagram of a shielding structure with multiple third conductor layers;

[0048] Figure 15 for Figure 1 A schematic diagram of the first and second conductor layers of the shielding structure;

[0049] Figure 16 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 2 ;

[0050] Figure 17 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 3 ;

[0051] Figure 18 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 4 ;

[0052] Figure 19 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 5 ;

[0053] Figure 20 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 6 ;

[0054] Figure 21 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 7 .

[0055] Figure label:

[0056] 1: Power module;

[0057] 10: Circuit module; 11: Recessed portion; 12: First circuit module; 13: Second circuit module; 14: High-voltage winding; 15: Low-voltage winding;

[0058] 20: Cabin;

[0059] 21: Shielding structure; 21a: First shielding structure; 21b: Second shielding structure; 21b1: Fourth conductor layer; 21b2: Fifth conductor layer; 21b3: Insulating layer; 22: Frame structure;

[0060] 210: First conductor layer; 220: Second conductor layer; 230: Solid insulating layer; 240: Third conductor layer; 211: Metal layer; 212: Semiconductor layer;

[0061] 201: Flexible shielding section; 202: Rigid shielding section; 203: Shielding section; 204: Interface; 205: Insulating component;

[0062] 20a: Common section; 20b: Common conductor layer;

[0063] 30: Air duct;

[0064] 40: Radiator. Detailed Implementation

[0065] To make the above-mentioned objectives, features, and advantages of the embodiments of the present invention more apparent and understandable, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0066] In existing technologies, the insulating housing of the power module is prefabricated, and the power module is assembled by installing components such as high-voltage circuit units, low-voltage circuit units, and high- and low-voltage coils into the insulating housing. However, the insulating housing is usually a long and narrow cylindrical structure, which makes the above approach inconvenient for the installation and positioning of the various components of the power module.

[0067] In view of this, the present application provides a power module, which includes a housing and a circuit module disposed in the housing. The housing is a spliced ​​structure or the housing is bendable, so that the housing can be fixed to the outer wall of the circuit module after the circuit module is assembled, which facilitates assembly.

[0068] Figure 1 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 1 . Figure 2 for Figure 1 A schematic diagram of the shielding structure. Figure 3 for Figure 1 A schematic diagram of the structure when the shielding structure is flexible. Figure 4 for Figure 1 Schematic diagram of a shielding structure that includes both rigid and flexible shielding sections. Figure 1 . Figure 5 for Figure 1 Schematic diagram of a shielding structure that includes both rigid and flexible shielding sections. Figure 2 . Figure 6 for Figure 1 Schematic diagram of a shielding structure that includes both rigid and flexible shielding sections. Figure 3 . Figure 7 for Figure 1 Schematic diagram of a shielding structure comprising multiple shielding sections Figure 1 . Figure 8 for Figure 1 Schematic diagram of a shielding structure comprising multiple shielding sections Figure 2 . Figure 9 for Figure 1 Schematic diagram of a shielding structure comprising multiple shielding sections Figure 3 . Figure 10 for Figure 1 Schematic diagram of a shielding structure comprising multiple shielding sections Figure 4 . Figure 11 for Figure 1 Schematic diagram of a shielding structure that includes multiple shielding sections Figure 5 . Figure 12 for Figure 1 Schematic diagram of a shielding structure that includes multiple shielding sections Figure 6 . Figure 13 for Figure 1 Schematic diagram of a shielding structure that includes multiple shielding sections Figure 7 .

[0069] Please see Figures 1 to 13 This invention provides a power module 1, which includes: a circuit module 10 having a voltage level; and a housing 20 for covering the circuit module 10 by bending or splicing, and the housing 20 having a shielding structure 21, the shielding structure 21 including: a first conductor layer 210 located on the side close to the circuit module 10 and connected at the same potential as the circuit module 10; a second conductor layer 220 spaced apart from the first conductor layer 210 and located on the side away from the circuit module 10; and a solid insulating layer 230 disposed between the first conductor layer 210 and the second conductor layer 220 for electrically isolating the first conductor layer 210 and the second conductor layer 220.

[0070] Specifically, power module 1 is applied to a solid-state transformer system for power transmission. Power module 1 includes a housing 20 and circuit module 10, transformer, etc., disposed within the housing 20. Circuit module 10 and transformer can be of types and structures well known to those skilled in the art, and this embodiment is not limited thereto.

[0071] The enclosure 20 surrounds the circuit module 10 to provide protection for it. The enclosure 20 includes a shielding structure 21 and a locking structure for fixing the shielding structure 21 to the outside of the circuit module 10. The locking structure can have different structures depending on how the shielding structure 21 is fixed.

[0072] For example, the shielding structure 21 can be fixed to the outer wall of the circuit module 10 using threaded fasteners. The locking structure can then be a sheet metal structure or similar structure located outside the circuit module 10. Alternatively, the locking structure can include a frame structure 22 surrounding the circuit module 10, connected to the circuit module 10 via threaded fasteners. The shielding structure 21 is fixed to the frame structure 22, creating a predetermined gap between the housing 20 and the circuit module 10. Of course, the shielding structure 21 can also be fixed to the circuit module 10 by welding, snap-fitting, or other methods; this embodiment does not impose any limitations.

[0073] The shielding structure 21 includes a solid insulating layer 230 and a first conductor layer 210 and a second conductor layer 220 respectively disposed on both sides of the solid insulating layer 230. The solid insulating layer 230 can be made of nylon, epoxy resin, silicone resin, polyurethane, polytetrafluoroethylene, silicone rubber, ceramic, etc., so that the solid insulating layer 230 can have good insulation performance. The first conductor layer 210 and the second conductor layer 220 are conductive materials, semi-conductive materials, or composite materials of conductive and semi-conductive materials.

[0074] The thickness of the solid insulating layer 230 can be limited according to the withstand voltage rating of the power module 1 and the material of the solid insulating layer 230; this embodiment does not impose such a limitation. The solid insulating layer 230 can be formed with the first conductor layer 210 and the second conductor layer 220 by means of high-temperature pressing, electroplating, sputtering, spraying, etc.

[0075] The first conductor layer 210 is disposed on the side of the solid insulation layer 230 closest to the circuit module 10 and is set at the same potential as the circuit module 10. Thus, the first conductor layer 210 can shield the electric field generated by the circuit module 10. Furthermore, the first conductor layer 210 is fixedly connected to the solid insulation layer 230, ensuring that all positions on the inner surface of the solid insulation layer 230 have the same potential, preventing discharge between the first conductor layer 210 and the solid insulation layer 230. The second conductor layer 220 is disposed on the side of the solid insulation layer 230 away from the circuit module 10. The potential of the second conductor layer 220 is lower; for example, if the second conductor layer 220 is grounded, even if personnel touch the power module 1, for example, during maintenance, personnel will not experience electric shock. The insulation performance of the cabin 20 is good, and the safety is high.

[0076] The shielding structure 21 can be either a modular structure or a bendable structure. When assembling the power module 1, please refer to [the relevant documentation / reference]. Figures 3 to 6 When the shielding structure 21 is a bendable structure, the flexible bendable portion deforms to cover and fix the shielding structure 21 to the outer wall of the circuit module 10; when the shielding structure 21 is a spliced ​​structure, please refer to [reference needed]. Figures 7 to 13 Different parts of the shielding structure 21 can be fixed to the outer wall of the circuit module 10 to protect the circuit module 10.

[0077] When assembling the power module 1, the circuit module 10 can be assembled first, and then the shielding structure 21 can be fixed to the outer wall of the circuit module 10. Compared with the prior art, which first pre-forms the insulating layer and then assembles the circuit module 10 in the insulating shell, the power module 1 provided in this embodiment is not limited by the size and stacking method of the power module, and is easy to assemble. At the same time, it can also reduce the dependence on complex molds when forming the housing 20, and reduce manufacturing costs.

[0078] Please see Figure 3 In some optional embodiments, the shielding structure 21 is flexible, that is, the shielding structure 21 as a whole is a flexible component that is easy to deform. In this way, when the shielding structure 21 covers the outer wall surface of the circuit module 10, the shielding structure 21 can bend and deform accordingly according to the structure of the circuit module 10 and the protrusions or depressions of the outer wall surface of the circuit module 10, which facilitates the assembly of the power module 1.

[0079] The flexible structure can be an integral structure, and it wraps around the circuit module 10 circumferentially. The two ends of the flexible shielding structure 21 are fixedly connected to achieve "insulation restoration", that is, the two ends of the first conductor layer 210 are welded together, the two ends of the second conductor layer 220 are welded together, and the two ends of the solid insulation layer 230 are fixedly connected by filling with glue.

[0080] Please see Figures 4 to 6 The shielding structure 21 can also be a combination of rigid and flexible structures. In some optional embodiments, the shielding structure 21 includes a flexible shielding section 201 and a rigid shielding section 202, which are arranged alternately and connected end to end. The rigid shielding section 202 and the flexible shielding section 201 can be integrally formed or fixedly connected by the above-mentioned "insulation restoration" connection method.

[0081] Among them, the rigid shielding section 202 has high strength and is not easily deformed. It can be used as a support structure to be fixedly connected to the circuit module 10, and the support stability is high. The flexible shielding section 201 is easy to deform. For example, the flexible shielding section 201 can cover the part of the circuit module 10 with a more complex outer wall surface to reduce the manufacturing difficulty of the cabin 20.

[0082] For example, please refer to Figure 4 The rigid shielding section 202 is disposed on the bottom side of the circuit module 10 as a support component to support the circuit module 10. The flexible shielding section 201 is disposed around other outer wall surfaces of the circuit module 10. This embodiment does not limit the extension length or distribution position of the rigid shielding section 202 and the flexible shielding section 201.

[0083] In other words, to reduce the manufacturing difficulty of hull 20, please refer to... Figure 5 and Figure 6 In some optional embodiments, at least one flexible shielding segment 201 is disposed on the outer corner between two adjacent outer wall surfaces of the circuit module 10, so that the flexible shielding segment 201 is surrounded by bending deformation at the location of the circuit module 10 with a more complex outer wall surface, such as the outer corner with concave and convex features. In this way, the rigid shielding segments 202 can all be relatively simple flat plate or bent plate structures.

[0084] When the shielding structure 21 is a spliced ​​structure, please refer to Figures 7 to 13 In some optional embodiments, the shielding structure 21 includes multiple shielding segments 203 arranged circumferentially along the circuit module 10, and the shielding structure 21 has an interface 204 formed between two adjacent shielding segments 203. After the circuit module 10 is assembled, the multiple shielding segments 203 can be sequentially fixed to different sidewalls of the circuit module 10 circumferentially, making assembly relatively convenient.

[0085] Since the multiple shielding segments 203 are independent of each other, after the shielding structure 21 is fixed on the circuit module 10, there is an interface 204 between any two adjacent shielding segments 203, that is, there is a gap between two adjacent shielding segments 203.

[0086] In order to reduce manufacturing costs, similar to the rigid shielding section 202 mentioned above, the shielding section 203 is usually a simple plate structure. Thus, the interface 204 is usually located on the outer corner between two adjacent outer walls of the circuit module 10.

[0087] To provide effective insulation protection for the circuit module 10, in some optional embodiments, the power module 1 further includes an insulating element 205, which surrounds the circuit module 10 and at least covers the interface 204, and the insulating element 205 is located on any side of the housing 20.

[0088] Among them, the insulating component 205 can be a sheet structure, which can be made of insulating materials such as plastic sheet or Mylar sheet, with good insulation performance and good withstand voltage performance.

[0089] The insulating component 205 can be disposed on the inner side of the shielding structure 21 near the circuit module 10, or on the outer side of the shielding structure 21 away from the circuit module 10. When the insulating component 205 is disposed on the inner side of the shielding structure 21 near the circuit module 10, it can be attached and fixed to the shielding structure 21 or fixed to the outer wall of the circuit module 10. In this case, there is a preset gap between the insulating component 205 and the shielding structure 21. That is, as long as the circumferential dimension of the insulating component 205 along the circuit module 10 is larger than the dimension of the interface 204 and covers the interface 204, the safety clearance at the interface 204 can be solved, and the creepage problem of the circuit module 10 at the interface 204 can be avoided. By splicing multiple shielding segments 203 and setting independent insulating components 204, the assembly difficulty of the power module 1 can be reduced.

[0090] Understandably, the circuit module 10 has multiple outer wall surfaces along its circumference. Correspondingly, multiple interfaces 204 can be formed between the multiple shielding sections 203. The number of insulating elements 205 can be the same as the number of interfaces 204, so that an insulating element 205 is provided at each notch position.

[0091] Of course, please see Figures 8 to 10 An insulating element 205 can also cover multiple interfaces 204 simultaneously. For example, the insulating element 205 can be a ring structure and is disposed between the circuit module 10 and the shielding section 203 or on the outside of the shielding section 203.

[0092] Two adjacent shielding sections 203 can be fixedly connected using an "insulation restoration" method. Please refer to [link / reference]. Figure 11 In some optional embodiments, the cabin 20 also includes an insulating element 205, disposed at the interface 204 and connected between two adjacent shielding sections 203. The insulating element 205 is integrally formed with the solid insulating layer 230 of the shielding structure 21. That is, at the interface 204 between two adjacent shielding sections 203, the first conductor layer 210 and the second conductor layer 220 are disconnected, and the solid insulating layer 230 is fixedly connected by the insulating element 205. At this time, if necessary, an independent insulating element 205 such as a plastic sheet or Mylar sheet can also be provided at the interface 204.

[0093] In this way, in this embodiment, the housing 20 can be fixed to the outer wall of the circuit module 10 after the circuit module 10 is assembled, which is convenient for assembly and has good insulation performance.

[0094] Figure 14 for Figure 1 A schematic diagram of a shielding structure with multiple third conductor layers. Please refer to [link / reference]. Figure 14 In some optional embodiments, the shielding structure 21 further includes a plurality of third conductor layers 240 spaced apart, the plurality of third conductor layers 240 being located between the first conductor layer 210 and the second conductor layer 220. The ends of the first conductor layer 210, the ends of the plurality of third conductor layers 240, and the ends of the second conductor layer 220 gradually extend from the side closer to the circuit module 10 to the side farther away from the circuit module 10. Thus, the first conductor layer 210, the plurality of third conductor layers 240, and the second conductor layer 220 can form a capacitive screen, improving the dielectric level of the solid insulating layer 230. Meanwhile, the ends of the first conductor layer 210, the ends of the plurality of third conductor layers 240, and the ends of the second conductor layer 220 gradually extend from the side closer to the circuit module 10 to the side farther away from the circuit module 10. That is, for each shielding section 203, the length of each conductor layer gradually increases from the side closer to the circuit module 10 to the side away from the circuit module 10, so as to uniform electric field, avoid electric field concentration at the ends of the first conductor layer 210 and the second conductor layer 220, and improve the withstand voltage level and service life of the solid insulation layer 230.

[0095] The third conductor layer 240 has at least two layers, which can be selected according to the withstand voltage level of the power module 1 and the material and thickness of the solid insulation layer 230.

[0096] In some alternative implementations, please refer to Figures 7 to 11 The circuit module 10 has a recess 11 that is disposed opposite to the interface 204 to avoid the shielding section 203 forming a local concentrated electric field at the interface 204, and to prevent partial discharge of the solid insulation layer 230 or the air at the interface 204. This arrangement can improve the overall partial discharge voltage level of the power module and extend the service life of the shielding structure 21.

[0097] In some alternative embodiments, the shielding structure 21 further includes a plurality of third conductor layers spaced apart, at least one of which is disposed on the outside of the shielding structure 21 and configured as a signal transmission layer (not shown).

[0098] In other words, the third conductor layer 240 can include two types. One type of third conductor layer 240 is disposed between the first conductor layer 210 and the second conductor layer 220, and together with the first conductor layer 210 and the second conductor layer 220, it forms the above-mentioned capacitive screen structure. The capacitive screen structure can uniformly distribute the electric field in the shielding structure 21, which is beneficial to improving the withstand voltage level of the power module housing and reducing the volume of the power module. The other type of third conductor layer is disposed on the outside of the second conductor layer 220 away from the circuit module 10 or on the outside of the first conductor layer 210 close to the circuit module 10, and is electrically connected to the circuit module to realize the transmission of electrical signals.

[0099] The signal transmission layer is located on the outside of the capacitive screen, and the capacitive screen can form an equipotential shield to protect the signal transmission layer, thus ensuring its high security.

[0100] In some alternative embodiments, the first conductor layer 210 is a metal layer, a semiconducting layer, or a composite structure of a metal layer and a semiconducting layer. See also... Figure 15 , Figure 15 for Figure 1 The schematic diagram of the first and second conductor layers of the shielding structure 21 shows that the first conductor layer 210 can be a composite structure of a metal layer 211 and a semiconducting layer 212. Of course, it is not limited to this; the first conductor layer 210 can be entirely composed of metal layers 211 or entirely composed of semiconducting layers 212.

[0101] The metal layer 211 can be made of copper, silver, nickel or tin, etc. The metal layer 211 is a conductive material, which can effectively shield the electric field of the circuit module 10 and improve the pressure resistance level of the cabin 20.

[0102] The semiconductive layer 212 can be made of carbon powder, carbon fiber, or a mixture of nickel-silver-copper powder and adhesive, which helps to homogenize the surface electric field on the inner surface of the shielding structure 21 and improve the pressure resistance level of the chamber 20. The material and ratio of the semiconductive layer 212 can be selected as needed.

[0103] Please continue reading. Figure 15 When the first conductor layer 210 is composed of a metal layer 211 and a semiconducting layer 212, the metal layer 211 and the semiconducting layer 212 are located in the same plane. Since the resistivity of the semiconducting layer 212 is greater than that of the metal layer 211, the semiconducting layer 212 can be located at a position corresponding to the transformer. In this way, when the alternating magnetic field of the transformer passes through the shielding structure 21, the presence of the semiconducting layer 212 helps to reduce eddy current losses.

[0104] In some alternative embodiments, the second conductor layer 220 is a metal layer 211, a semiconducting layer 212, or a composite structure of metal layer 211 and semiconducting layer 212. For example, the second conductor layer 220 may be entirely composed of metal layer 211, or entirely composed of semiconducting layer 212, or a composite structure of metal layer 211 and semiconducting layer 212.

[0105] The configuration of the second conductor layer 220 can be the same as or different from that of the first conductor layer 210; this embodiment does not impose any restrictions.

[0106] In some alternative embodiments, the cabin 20 is formed using a printed circuit board (PCB) process, whereby the first conductor layer 210 and the second conductor layer 220 are fixed to the solid insulating layer 230 through processes such as bonding or hot extrusion. This eliminates the need for casting mold design for the cabin 20, allowing for one-time molding and assembly line production. Compared to the pre-molded insulating cabins of the prior art, the cabin 20 in this embodiment is formed using a printed circuit board process, reducing manufacturing costs and the workload of workers.

[0107] In the prior art, the thickness of the insulating chamber formed by epoxy resin casting is 6mm-10mm. However, in this embodiment, the thickness of the chamber 20 prepared by PCB process can be 4mm-5mm. That is, by preparing the insulating chamber with conductor layers on both sides by printed circuit board process, the thickness of the chamber can be reduced.

[0108] When the shielding structure 21 of the enclosure 20 includes alternating rigid shielding sections 202 and flexible shielding sections 201 connected end to end, a one-piece, interface-free enclosure can be fabricated using PCB technology and directly fitted onto the outer wall of the circuit module. Alternatively, the enclosure 20 can also cover the outside of the circuit module 10, forming only one interface 204. This requires only insulation of this single interface 204, reducing labor intensity. Of course, a suitable enclosure structure and its installation method can be selected according to specific needs; this embodiment does not impose any limitations.

[0109] Figure 16 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 2 . Figure 17 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 3 . Figure 18 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 4 . Figure 19 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 5 . Figure 20 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 6 . Figure 21 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 7 .

[0110] Please see Figures 16 to 21 This invention provides a power module 1, which includes: a first circuit module 12 having a first voltage level; a first housing for covering the first circuit module 12, the first housing having a first shielding structure 21a, the first shielding structure 21a being the shielding structure 21 of the power module 1 described above, the first conductor layer 210 of the first shielding structure 21a being equipotentially connected to the first circuit module 12; and a second circuit module 13 arranged parallel to or surrounding the first circuit module 12, the second circuit module 13 having a second voltage level lower than the first voltage level.

[0111] In other words, the circuit module 10 includes a first circuit module 12 and a second circuit module 13. The first cabin surrounds the first circuit module 12. The first cabin includes a first shielding structure 21a. The structure and function of the first shielding structure 21a have been described in the above embodiments and will not be repeated in this embodiment.

[0112] Furthermore, the second voltage level is lower than the first voltage level; that is, the first circuit module 12 can be understood as a high-voltage circuit module, and the second circuit module 13 can be understood as a low-voltage circuit module. The enclosure 20 also includes an insulating portion surrounding the second circuit module 13. The insulating portion can be a structure well-known to those skilled in the art, such as a sheet metal enclosure structure.

[0113] Please see Figures 17 to 20 The first circuit module 12 and the second circuit module 13 are arranged side by side. The first cabin and the aforementioned insulating parts are also arranged side by side and respectively surround the first circuit module 12 and the second circuit module 13. Please continue reading. Figure 16 The second circuit module 13 surrounds the first circuit module 12. In this configuration, the first cabin is positioned between the first circuit module 12 and the second circuit module 13, with the aforementioned insulating portion surrounding the second circuit module 13. This embodiment does not impose any restrictions on the arrangement of the first circuit module 12 and the second circuit module 13.

[0114] Thus, the first circuit module 12 and the second circuit module 13 are isolated from each other at least by the aforementioned shielding structure 21, and the high-voltage winding 14 and the low-voltage winding 15 of the transformer are also isolated by the aforementioned shielding structure 21. It can be understood that the thickness of the shielding structure 21 between the first circuit module 12 and the second circuit module 13 is the insulation air gap of the transformer. Since the shielding structure 21 is fabricated using printed circuit board technology, this embodiment can control the insulation air gap of the transformer relatively precisely.

[0115] Simultaneously, the shielding structure allows for a more complex, tortuous design of the insulation interface between the high-voltage and low-voltage windings of the transformer. While maintaining compartmentalized isolation between the high-voltage and low-voltage circuit modules, this enables an alternating stacking arrangement of the high-voltage and low-voltage windings. The interface with multiple insulation structures between the high-voltage and low-voltage windings generates a distributed air gap, which helps reduce AC losses in the windings. Please refer to [link / reference]. Figure 20 The high-voltage winding 14 in the first circuit module 12 can protrude outwards from the outside of the first circuit module 12 and form a protrusion. Correspondingly, the low-voltage winding 15 of the second circuit module 13 forms a receiving portion to accommodate the protrusion. The first shielding structure 21a outside the first circuit module 12 can be as follows: Figure 6 or Figure 13 The shielding structure 21 in this embodiment is not limited. Therefore, the protrusion of the first circuit module 12 can be conveniently connected via, for example... Figure 6 The rigid shielding section 202 and the flexible shielding section 201 are arranged alternately and combined, or as follows: Figure 13The power module 1 is insulated by splicing multiple shielding sections 203, making it easy to assemble. At the same time, the high-voltage winding 14 and low-voltage winding 15 of the transformer, which are stacked in an interleaved manner, are still effectively isolated.

[0116] Of course, the first circuit module 12 and the first shielding structure 21a can also have other cross-sectional shapes, as can be found in [reference]. Figures 4 to 6 For example, the cross-sectional shape can be triangular, trapezoidal, etc., but this embodiment does not impose any restrictions.

[0117] In some optional embodiments, the power module 1 further includes a second housing for enclosing the second circuit module 13, and the second housing has a second shielding structure 21b, wherein the second shielding structure 21b includes: a fourth conductor layer 21b1, which is located on the side closer to the second circuit module 13 and is equipotentially connected to the second circuit module 13; a fifth conductor layer 21b2, which is spaced apart from the fourth conductor layer 21b1 and located on the side away from the second circuit module 13; and an insulating layer 21b3, which is disposed between the fourth conductor layer 21b1 and the fifth conductor layer 21b2 for electrically isolating the fourth conductor layer 21b1 and the fifth conductor layer 21b2.

[0118] That is, the second circuit module 13 is also insulated and protected by the second shielding structure 21b. The structure and function of the second shielding structure 21b are the same as those of the first shielding structure 21a, and will not be described again in this embodiment.

[0119] In some alternative implementations, the first shielding structure 21a includes a plurality of first shielding segments, and the second shielding structure 21b includes a plurality of second shielding segments.

[0120] That is, both the first shielding structure 21a and the second shielding structure 21b can be spliced ​​structures. Multiple first shielding segments surround the outside of the first circuit module 12, and the interface between two adjacent first shielding segments is insulated by an insulating component. Multiple second shielding segments surround the outside of the second circuit module 13, and the interface between two adjacent second shielding segments is insulated by an insulating component.

[0121] Alternatively, the first shielding structure 21a and the second shielding structure 21b can also be flexible components, or can be composed of alternating rigid shielding sections and flexible shielding sections. The structural composition of the first shielding structure 21a and the second shielding structure 21b can be the same or different, and this embodiment does not impose any restrictions.

[0122] In some alternative embodiments, the first and second hulls are arranged side by side, with a common section between them.

[0123] In some alternative embodiments, the first and second compartments arranged side-by-side may have a specific molding method. See also... Figure 18 The first shielding structure 21a and the second shielding structure 21b have a common portion 20a. Each end of the common portion 20a is connected to two flexible shielding segments 201. Two adjacent, mirror-image flexible shielding segments 201 can be Y-shaped and connected to the first shielding structure 21a and the second shielding structure 21b, respectively. In this case, the common portion 20a can be rigid, serving a supporting function, thus giving the entire power module's housing structure high stability. Furthermore, the second conductor layer 220 of the first shielding structure 21a and the second conductor layer 220 of the second shielding structure 21b can be connected to form a single, integral outer conductor layer.

[0124] In some alternative embodiments, the common portion may also have a common conductor layer, which may be electrically coupled to a reference potential whose voltage is between a first voltage level and a second voltage level. See also... Figure 19 A common conductor layer 20b is provided within the common section 20a, which can divide the shielding structure into two parts: a solid insulating layer 230 and an insulating layer 21b3 for voltage division. Furthermore, according to the dielectric breakdown theory, the smaller the thickness of the insulating medium, the higher its dielectric strength per unit thickness. That is, the solid insulating layer 230 and the insulating layer 21b3 have better insulation performance than a solid insulating layer without a common conductor layer. Therefore, the sum of the thicknesses of the solid insulating layer 230 and the insulating layer 21b3 is smaller than the thickness of the solid insulating layer without the common conductor layer 20b. This means the insulation thickness between the first circuit module 12 and the second circuit module 13 is reduced, resulting in a smaller overall weight of the power module 1's enclosure and a lighter power module 1. The reference potential of the common conductor layer 20b can be any value between the first voltage level and the second voltage level; for example, the voltage value of the reference potential can be equal to half the sum of the first voltage level and the second voltage level.

[0125] In some alternative embodiments, please continue to refer to Figure 19 The common conductor layer 20b can be connected to the outer conductor layer. The common conductor layer 20b and the outer conductor layer have the same potential. That is, the second conductor layer 220 of the first shielding structure 21a and the fifth conductor layer 21b2 of the second shielding structure 21b merge into the common conductor layer 20b when passing through the common part 20a.

[0126] In some alternative embodiments, the two ends of the first compartment are coated with insulating adhesive and have ventilation holes, which are used to form air ducts 30 within the first compartment.

[0127] The first compartment can be a cylindrical structure open at both ends. Except for the ventilation holes, the end spaces of the first compartment are filled with insulating cast iron. The ventilation holes are used to form air ducts within the first compartment. Please refer to [link / reference]. Figure 16 , Figure 17 and Figure 21 The first circuit module 12 is distributed along the circumference of the first compartment on the inner wall of the first compartment. Thus, the cavity enclosed by the first circuit module 12 is the air duct 30. Cold air can enter the air duct 30 from one end. After the cold air exchanges heat with the first circuit module 12 and is heated, it is discharged from the other end of the air duct 30, thus realizing the heat dissipation of the first circuit module 12.

[0128] To facilitate the circulation of cold air, cooling fans or similar devices can be installed at the ports of the air duct 30.

[0129] Understandably, since the first chamber is a cylindrical structure open at both ends, the first circuit module 12 is directly exposed at the openings at both ends of the first chamber, meaning the first circuit module 12 is flush with the end faces of the first chamber. In this embodiment, insulating adhesive is also poured at both end faces of the first chamber. In the prior art, the first circuit module 12 has a preset safety distance by increasing the length of the first chamber. In this embodiment, by pouring insulating adhesive, this safety distance can be saved, the length of the first chamber is smaller, and the power density of the power module 1 is larger.

[0130] In some alternative embodiments, annular baffles (not shown) are also provided at the port positions at both ends of the first compartment. The annular baffles extend circumferentially along the first compartment and are used to shield and cover the first circuit module 12. In this way, only the air duct 30 is exposed in the field of view along the extension direction of the air duct 30, which can also reduce the length of the first compartment and increase the power density of the power module 1.

[0131] In some alternative implementations, power module 1 also includes a heat sink 40; please refer to [link to relevant documentation]. Figure 21 The radiator 40 is disposed in the first compartment and exposed in the air duct 30, and the first circuit module 12 is disposed around the radiator 40.

[0132] The radiator 40 can be a heat sink fin, as is well known to those skilled in the art. The first circuit module 12 is surrounded on the outside of the heat sink fin. In this way, the contact area between the hot air inside the first circuit module 12 and the heat sink fin is large, which is conducive to heat exchange between the hot air and the heat sink fin, so as to effectively reduce the temperature of the first circuit module 12. Understandably, along the extension direction of the air duct 30, only the radiator 40 is exposed at the opening of the annular baffle.

[0133] To improve the insulation performance of the power module 1, the heat sink 40 can be made of non-conductive material or coated with a thermally conductive insulating material, such as thermally conductive silicone or thermally conductive grease, on the outer wall surface of the heat sink 40.

[0134] This invention provides a solid-state transformer system (not shown) that includes the power module 1 described above.

[0135] The structure and function of power module 1 have been described in the above embodiments, and will not be repeated in this embodiment.

[0136] By adopting the above-mentioned shielding structure, the power module 1 in the solid-state transformer system can provide good insulation protection for the circuit module 10. Furthermore, the shielding structure can be used to cover the circuit module 10 by bending or splicing, which is easy to assemble and reduces the manufacturing cost of the fixed transformer system.

[0137] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0138] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0139] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A power module, characterized in that, The power module includes: A circuit module having a voltage level; and A housing for enclosing the circuit module by bending or splicing, and the housing having a shielding structure, the shielding structure comprising: A first conductor layer is located on the side close to the circuit module and is equipotentially connected to the circuit module; A second conductor layer, spaced apart from the first conductor layer and located on the side away from the circuit module; and A solid insulating layer is disposed between the first conductor layer and the second conductor layer to electrically isolate the first conductor layer from the second conductor layer; The shielding structure also includes multiple third conductor layers spaced apart; The plurality of third conductor layers are located between the first conductor layer and the second conductor layer, and the ends of the first conductor layer, the plurality of third conductor layers, and the second conductor layer gradually extend from the side closer to the circuit module to the side farther away from the circuit module; or, The third conductor layer is disposed on the outer side of the second conductor layer away from the circuit module or on the outer side of the first conductor layer close to the circuit module, and is electrically connected to the circuit module.

2. The power module according to claim 1, characterized in that, The shielding structure is flexible.

3. The power module according to claim 1, characterized in that, The shielding structure includes a flexible shielding section and a rigid shielding section, which are arranged alternately and connected end to end.

4. The power module according to claim 3, characterized in that, At least one of the flexible shielding sections is disposed on the outer corner between two adjacent outer wall surfaces of the circuit module.

5. The power module according to claim 1, characterized in that, The shielding structure includes multiple shielding segments arranged circumferentially along the circuit module, and the shielding structure also has an interface formed between two adjacent shielding segments.

6. The power module according to claim 5, characterized in that, The interface is located on the outer corner between two adjacent outer walls of the circuit module.

7. The power module according to claim 5, characterized in that, The power module also includes an insulating element that surrounds the circuit module and at least covers the interface, and the insulating element is located on any side of the cabin.

8. The power module according to claim 5, characterized in that, The cabin also has an insulating component, which is disposed at the interface and connected between two adjacent shielding sections. The insulating component is integral with the solid insulating layer of the shielding structure.

9. The power module according to claim 6, characterized in that, The circuit module has a recess that is positioned opposite to the interface.

10. The power module according to claim 1, characterized in that, The shielding structure further includes a plurality of third conductor layers spaced apart, at least one of which is disposed on the outside of the shielding structure and configured as a signal transmission layer.

11. The power module according to claim 1, characterized in that, The first conductor layer is a metal layer, a semiconducting layer, or a composite structure of a metal layer and a semiconducting layer.

12. The power module according to claim 1, characterized in that, The second conductor layer is a metal layer, a semiconducting layer, or a composite structure of a metal layer and a semiconducting layer.

13. The power module according to claim 1, characterized in that, The cabin is formed using a printed circuit board process.

14. A power module, characterized in that, The power module includes: The first circuit module has a first voltage level; A first housing for enclosing the first circuit module, and the first housing having a first shielding structure, the first shielding structure being the shielding structure of the power module according to any one of claims 1-13, and the first conductor layer of the first shielding structure being equipotentially connected to the first circuit module; and The second circuit module is arranged parallel to or surrounding the first circuit module, and the second circuit module has a second voltage level, which is lower than the first voltage level.

15. The power module according to claim 14, characterized in that, The power module further includes a second housing for enclosing the second circuit module, and the second housing has a second shielding structure, wherein the second shielding structure includes: A fourth conductor layer is located on the side close to the second circuit module and is equipotentially connected to the second circuit module; A fifth conductor layer, which is spaced apart from the fourth conductor layer and located on the side away from the second circuit module; and An insulating layer is disposed between the fourth conductor layer and the fifth conductor layer to electrically isolate the fourth conductor layer from the fifth conductor layer.

16. The power module according to claim 15, characterized in that, The first compartment and the second compartment are arranged side by side, and there is a common part between the first compartment and the second compartment.

17. The power module according to claim 16, characterized in that, The common portion has a common conductor layer electrically coupled to a reference potential, the voltage of which is between the first voltage level and the second voltage level.

18. The power module according to claim 16, characterized in that, The first shielding structure includes multiple first shielding segments, and the second shielding structure includes multiple second shielding segments.

19. The power module according to claim 18, characterized in that, The common part is rigid and is connected between two flexible first shielding sections and between two flexible second shielding sections.

20. The power module according to claim 14, characterized in that, The first chamber has insulating glue poured at both ends and ventilation holes provided, which are used to form air ducts within the first chamber.

21. The power module according to claim 20, characterized in that, The power module also includes a heat sink disposed within the first chamber and exposed in the air duct, and the first circuit module is disposed around the heat sink.

22. A solid-state transformer system comprising a power module according to any one of claims 14-21.

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