Chip glue removing device and glue removing method

Abstract

The present application relates to a kind of chip glue removal device and glue removal method, its device includes sander, bottom plate, rotating platform and be used for clamping chip clamping linkage mechanism, sander is installed at the one end of the upper surface of bottom plate, rotating platform is slidably arranged at the other end of the upper surface of bottom plate, clamping linkage mechanism is arranged on rotating platform, and can rotate with rotating platform, and clamping linkage mechanism can slide with rotating platform on bottom plate, to approach or away from sander, sander can be polished to the glue of the edge of chip clamped on clamping linkage mechanism remains.By clamping linkage mechanism, chip can be clamped, and the polishing range of chip to sander is adjusted by the sliding of rotating platform to polish, the orientation of chip is adjusted by the rotation of rotating platform, so that the glue on the surface of chip can be removed conveniently by once clamping, simple structure, easy and safe to operate, greatly improve glue removal efficiency, avoid chip damage.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to a chip adhesive removal device and method. Background Technology

[0002] In the AWG product assembly process, adhesive is used to bond the chip to the glass cover. However, adhesive overflow can occur, where the adhesive spills over to the edges and hardens. Due to the nature of the product, this overflow can cause defects. Current technology involves manually scraping away the hardened adhesive from the edges with a blade. The problem is that the blade is too sharp and may damage the chip and the glass cover. Since both ends need cleaning, the small size of the chip makes this operation difficult and inefficient. Existing technologies also use grinders, but this involves holding the chip close to the grinder to remove the adhesive. This method is not only unsafe and extremely labor-intensive, but also makes it difficult to precisely hold the chip, compromising grinding accuracy and potentially damaging the chip itself. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a chip adhesive removal device and method to address the shortcomings of the prior art.

[0004] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: A chip adhesive removal device includes a polishing machine, a base plate, a rotating platform, and a clamping linkage mechanism for clamping the chip. The polishing machine is mounted on one end of the upper surface of the base plate via a bracket. The rotating platform is slidably disposed on the other end of the upper surface of the base plate. The clamping linkage mechanism is disposed on the rotating platform and can rotate horizontally circumferentially with the rotating platform. The clamping linkage mechanism can slide on the base plate with the rotating platform to move closer to or away from the polishing machine. The polishing machine can polish the adhesive residue on the edge of the chip clamped on the clamping linkage mechanism.

[0005] The beneficial effects of the present invention are as follows: The chip adhesive removal device of the present invention can clamp the chip through the clamping linkage mechanism, and adjust the chip to the grinding range of the grinding machine by sliding the rotating platform. The rotating platform can drive the clamping linkage mechanism to rotate, thereby adjusting the position of the chip. In this way, the adhesive on the chip surface can be removed in one clamping operation. The structure is simple, the operation is convenient and safe, the adhesive removal efficiency is greatly improved, and chip damage is avoided.

[0006] Based on the above technical solution, the present invention can be further improved as follows:

[0007] Furthermore, a slide rail is provided at the other end of the upper surface of the base plate, and a slide block is slidably disposed on the slide rail. The rotating platform is disposed on the slide block, and the slide block can drive the rotating platform to slide along the slide rail to move closer to or further away from the grinding machine.

[0008] The beneficial effect of the above-mentioned further solution is that by setting the slide and slide rail, the position of the rotating platform can be moved easily, thereby making it easier to adjust the relative position between the chip on the clamping linkage mechanism and the grinding machine, and improving the convenience of operation.

[0009] Furthermore, limit blocks are provided at both ends of the slide rail.

[0010] The beneficial effect of the above-mentioned further solution is that by setting the limiting block, the stroke range of the slider can be easily limited, preventing the slide block from sliding off the slide rail, thereby ensuring the continuity and stability of the entire device.

[0011] Furthermore, the chip adhesive removal device further includes a positioning mechanism, which is disposed on the base plate and engages with the rotating platform to fix the rotating platform and the slide block on the slide rail.

[0012] The beneficial effect of the above-mentioned further solution is that by setting the positioning mechanism, the rotating platform can be fixed on the slide rail, avoiding the rotating platform from moving on the slide rail during the polishing process, which would cause chip displacement, resulting in inaccurate polishing or even chip damage.

[0013] Further: The positioning mechanism includes a positioning plate and a plunger. The positioning plate is installed on one side of the base plate and has mounting holes. The plunger is installed in the mounting holes on the positioning plate. The side wall of the rotating platform has multiple positioning holes that are adapted to the plunger. When the plunger is aligned with the positioning hole, the plunger is released, and the end of the plunger is precisely inserted into the corresponding positioning hole to fix the rotating platform and the slide block on the slide rail.

[0014] The beneficial effects of the above-mentioned further solution are: the positioning plate can provide stable support for the plunger, and the cooperation between the plunger and the positioning hole can realize the displacement and rotation fixation of the rotating platform, that is, the rotating platform cannot slide back and forth on the slide rail, nor can it rotate horizontally, which facilitates grinding and helps to improve the accuracy of grinding and removing glue.

[0015] Further: The rotating platform includes a fixed part, a rotating part, and a cover plate. The fixed part is mounted on the slide. A frustum is provided in the middle of the fixed part. An annular latch adapted to the frustum is provided in the middle of the rotating part. The frustum engages with the latch and the two can rotate relative to each other. The positioning hole is provided on the side wall of the rotating part. When the end of the plunger extends into the corresponding positioning hole, the rotating part is locked relative to the fixed part. The cover plate is disposed on the rotating part, and the clamping linkage mechanism is disposed on the cover plate.

[0016] The beneficial effects of the above-mentioned further solution are: by fixing the fixed part to the slider, and by using the plunger, the rotating part can be kept fixed to the fixed part, thereby ensuring that the rotating part will not rotate and the slider connected to the fixed part will not slide on the slide rail. This ensures that the position of the chip relative to the grinding machine remains unchanged during grinding, thus achieving precise grinding and adhesive removal.

[0017] Further: The clamping linkage mechanism includes a connecting block, a worktable, a fixed base, a slider, a first connecting rod, and a second connecting rod. The lower end of the connecting block is fixedly connected to the middle of the rotating platform, and the upper end of the connecting block is fixedly connected to the lower surface of the worktable. The fixed base is mounted on the rotating platform and located on one side of the connecting block. The two ends of the worktable are respectively provided with through holes through which the first connecting rod and the second connecting rod pass. The slider is slidably mounted on the fixed base. The lower ends of the first connecting rod and the second connecting rod are respectively connected to the slider, and the upper ends of the first connecting rod and the second connecting rod pass through the corresponding through holes. The upper ends of the first connecting rod and the second connecting rod are respectively provided with a first clamping block and a second clamping block. When the slider slides on the fixed base, the first connecting rod and the second connecting rod respectively drive the first clamping block and the second clamping block to move closer together to clamp the chip to the middle of the upper surface of the worktable, or the first connecting rod and the second connecting rod respectively drive the first clamping block and the second clamping block to move away from each other and release the clamped chip.

[0018] The beneficial effects of the above-mentioned further solution are: the worktable is supported and fixed by the connecting block, and the slider is slidably mounted on the fixed seat. This allows the slider to be pulled, and at the same time, the first connecting rod and the second connecting rod drive the first clamping block and the second clamping block to move closer together to clamp the chip to the middle of the upper surface of the worktable, or the first connecting rod and the second connecting rod drive the first clamping block and the second clamping block to move away from each other and release the clamped chip. The operation is simple, convenient and safe, and can be completed with one hand.

[0019] Further: The lower end of the first connecting rod is connected to the slider, the first clamping block is located on the upper surface of the worktable, the lower part of the second connecting rod is provided with an oval hole, the slider is provided with a fixing post, the fixing post is engaged in the oval hole, the upper part of the second connecting rod is rotatably connected to the two side walls of the corresponding through hole on the worktable through a rotating shaft, a torsion spring is sleeved on the rotating shaft, and the two torsion feet of the torsion spring respectively abut against the worktable and the second clamping block. When the slider slides on the fixed seat, the slider drives the first connecting rod to drive the first clamping block to slide along the upper surface of the worktable to clamp or release the corresponding side of the chip. At the same time, the block drives the lower end of the second connecting rod to rotate around the fixing post, so that the upper end of the second connecting rod drives the second clamping block to press or release the corresponding side of the chip, and press or release the torsion spring.

[0020] The beneficial effects of the above-mentioned further solution are as follows: by connecting the lower end of the first connecting rod to the slider, the slider can move horizontally on the surface of the worktable by means of the first connecting rod when it slides. The lower part of the second connecting rod is provided with an oval hole, so the lower end of the second connecting rod can rotate around the fixed column when the slider slides. This can drive the second connecting rod to drive the second clamping block to press or release the corresponding side of the chip. At the same time, the torsion spring can realize automatic reset, achieving a linkage effect and making the operation simple.

[0021] Furthermore, the clamping linkage mechanism also includes an operating part, which is connected to the first connecting rod.

[0022] The beneficial effect of the above-mentioned further solution is that by setting the operating part, it is convenient for hand operation and the ease of operation is improved.

[0023] The present invention also provides a method for removing adhesive from a chip, using the aforementioned chip adhesive removal device, the method comprising the following steps:

[0024] Pull the operating part and drive the slider to slide along the fixed seat. The slider drives the first connecting rod to drive the first clamping block to slide along the upper surface of the worktable, and simultaneously drives the upper end of the second connecting rod to drive the second clamping block to rotate away from the first clamping block, and compress the torsion spring.

[0025] The chip is placed on the worktable and positioned between the first clamping block and the second clamping block;

[0026] When the operating part is released, the torsion spring drives the upper end of the second connecting rod to rotate the second clamping block toward the chip side. At the same time, the second connecting rod drives the slider to slide the first clamping block at the upper end of the first connecting rod toward the chip side. The first clamping block and the second clamping block cooperate to clamp the chip.

[0027] Adjust the slide so that the chip is within the range of the grinding head of the grinder, and pull the plunger so that the end of the plunger is inserted into the positioning hole and locked.

[0028] Turn on the polishing machine and polish the glue on one side of the chip surface edge until the glue on one side of the chip surface edge is completely removed.

[0029] Pull the plunger so that the end of the plunger is completely removed from the positioning hole. Rotate the rotating platform 180 degrees, then pull the plunger again so that the end of the plunger is inserted into the positioning hole and locked. Polish the glue on the edge of the other side of the chip until the glue on the edge of the other side of the chip is completely removed.

[0030] Pulling the operating unit drives the slider to simultaneously loosen the chip and remove it from the first and second clamping blocks.

[0031] The chip adhesive removal method of the present invention can clamp the chip through the clamping linkage mechanism, and adjust the chip to the grinding range of the grinding machine by sliding the rotating platform. The rotating platform can drive the clamping linkage mechanism to rotate, thereby adjusting the position of the chip. In this way, the adhesive on the chip surface can be removed in one clamping operation. The structure is simple, the operation is convenient and safe, and the adhesive removal efficiency is greatly improved, avoiding chip damage. Attached Figure Description

[0032] Figure 1 This is a schematic front view of a chip adhesive removal device according to an embodiment of the present invention. Figure 1 ;

[0033] Figure 2 This is a schematic front view of a chip adhesive removal device according to an embodiment of the present invention. Figure 2 ;

[0034] Figure 3 This is a schematic diagram of the cooperation between the fixing part and the rotating part according to an embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of the clamping linkage mechanism according to an embodiment of the present invention;

[0036] Figure 5 This is an exploded structural diagram of a workbench according to an embodiment of the present invention.

[0037] The attached diagram lists the components represented by each number as follows:

[0038] 1. Grinding machine; 2. Base plate; 3. Rotating platform; 4. Support; 5. Slide rail; 6. Slide seat; 7. Positioning plate; 8. Piston; 9. Connecting block; 10. Worktable; 11. Fixed seat; 12. Slider; 13. First connecting rod; 14. Second connecting rod; 15. First clamping block; 16. Second clamping block; 17. Fixed column; 18. Operating part; 19. Limiting block; 20. Torsion spring; 21. Chip; 22. Fixed part; 23. Rotating part; 24. Cover plate. Detailed Implementation

[0039] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0040] like Figure 1 and Figure 2 As shown, a chip adhesive removal device includes a polishing machine 1, a base plate 2, a rotating platform 3, and a clamping linkage mechanism for clamping a chip 21. The polishing machine 1 is mounted on one end of the upper surface of the base plate 2 via a bracket 4. The rotating platform 3 is slidably disposed on the other end of the upper surface of the base plate 2. The clamping linkage mechanism is disposed on the rotating platform 3 and can rotate horizontally circumferentially with the rotating platform 3. The clamping linkage mechanism can also slide on the base plate 2 with the rotating platform 3 to move closer to or away from the polishing machine 1. The polishing machine 1 can polish the adhesive residue on the edge of the chip 21 clamped on the clamping linkage mechanism.

[0041] The chip 21 adhesive removal device of the present invention can clamp the chip 21 through the clamping linkage mechanism, and adjust the chip 21 to the grinding range of the grinding machine 1 by sliding the rotating platform 3. The rotating platform 3 can drive the clamping linkage mechanism to rotate, thereby adjusting the position of the chip. In this way, the adhesive on the chip surface can be removed in one clamping operation. The structure is simple, the operation is convenient and safe, and the adhesive removal efficiency is greatly improved, avoiding chip damage.

[0042] In one or more embodiments of the present invention, a slide rail 5 is provided at the other end of the upper surface of the base plate 2, and a slide block 6 is slidably disposed on the slide rail 5. The rotating platform 3 is disposed on the slide block 6, and the slide block 6 can drive the rotating platform 3 to slide along the slide rail 5 to move closer to or further away from the polishing machine 1. By providing the slide block 6 and the slide rail 5, the position of the rotating platform 3 can be easily moved, thereby making it easier to adjust the relative position between the chip on the clamping linkage mechanism and the polishing machine 1, improving the convenience of operation.

[0043] Optionally, in one or more embodiments of the present invention, limit blocks 19 are respectively provided at both ends of the slide rail 5. By providing the limit blocks 19, the stroke range of the slider 6 can be conveniently limited, preventing the slide block 6 from sliding off the slide rail 5, thereby ensuring the continuity and stability of the entire device.

[0044] In one or more embodiments of the present invention, the chip 21 adhesive removal device further includes a positioning mechanism, which is disposed on the base plate 2 and engages with the rotating platform 3 to fix the rotating platform 3 and the slide block 6 on the slide rail 5. By providing the positioning mechanism, the rotating platform 3 can be fixed on the slide rail 5, preventing the rotating platform 3 from moving on the slide rail 5 during the polishing process, which could cause the chip 21 to move abnormally, resulting in inaccurate polishing or even damage to the chip 21.

[0045] Specifically, in one or more embodiments of the present invention, the positioning mechanism includes a positioning plate 7 and a plunger 8. The positioning plate 7 is mounted on one side of the base plate 2 and has mounting holes. The plunger 8 is mounted in the mounting holes on the positioning plate. The side wall of the rotating platform 3 has multiple positioning holes adapted to the plunger 8. When the plunger 8 is aligned with the positioning holes, the plunger 8 is released, and the end of the plunger 8 is precisely inserted into the corresponding positioning hole to fix the rotating platform 3 and the slide block 6 on the slide rail 5. The positioning plate 7 provides stable support for the plunger 8, and the cooperation between the plunger 8 and the positioning holes enables the displacement and rotation of the rotating platform 3 to be fixed. That is, the rotating platform 3 cannot slide back and forth on the slide rail 5, nor can it rotate horizontally. This facilitates grinding and improves the accuracy of grinding and removing adhesive.

[0046] like Figure 3As shown, in one or more embodiments of the present invention, the rotating platform 3 includes a fixed part 22, a rotating part 23, and a cover plate 24. The fixed part 22 is mounted on the slide block 6. A frustum is provided in the middle of the fixed part 22. An annular slot adapted to the frustum is provided in the middle of the rotating part 23. The frustum engages with the annular slot, and the two can rotate relative to each other. The positioning hole is provided on the side wall of the rotating part 23. When the end of the plunger 8 extends into the corresponding positioning hole, the rotating part 23 is locked relative to the fixed part 22. The cover plate 24 is disposed on the rotating part 23, and the clamping linkage mechanism is disposed on the cover plate 24. The fixed part 22 is fixed to the slide block 6, and the plunger 8 can keep the rotating part 23 fixed to the fixed part 22, thereby ensuring that the rotating part 23 will not rotate and the slide block 6 connected to the fixed part 22 will not slide on the slide rail 5. This ensures that the position of the chip 21 remains unchanged relative to the polishing machine 1 during polishing, achieving precise polishing and adhesive removal.

[0047] like Figure 4 and 5As shown, in one or more embodiments of the present invention, the clamping linkage mechanism includes a connecting block 9, a worktable 10, a fixed base 11, a slider 12, a first connecting rod 13, and a second connecting rod 14. The lower end of the connecting block 9 is fixedly connected to the middle of the rotating platform 3, and the upper end of the connecting block 9 is fixedly connected to the lower surface of the worktable 10. The fixed base 11 is mounted on the rotating platform 3 and located on one side of the connecting block 9. The two ends of the worktable are respectively provided with through holes through which the first connecting rod 13 and the second connecting rod 14 pass. The slider 12 is slidably mounted on the fixed base 11. The lower ends of the first connecting rod 13 and the second connecting rod 14 are respectively... The first connecting rod 13 and the second connecting rod 14 are not connected to the slider 12. The upper ends of the first connecting rod 13 and the second connecting rod 14 pass through the corresponding through holes. The upper ends of the first connecting rod 13 and the second connecting rod 14 are respectively provided with a first clamping block 15 and a second clamping block 16. When the slider 12 slides on the fixed seat 11, the first connecting rod 13 and the second connecting rod 14 respectively drive the first clamping block 15 and the second clamping block 16 to move closer to each other to clamp the chip 21 to the middle of the upper surface of the worktable 10. Alternatively, the first connecting rod 13 and the second connecting rod 14 respectively drive the first clamping block 15 and the second clamping block 16 to move away from each other and release the clamped chip 21. The worktable 10 is supported and fixed by the connecting block 9, and the slider 12 is slidably mounted on the fixed base 11. By pulling the slider 12, the first clamping block 15 and the second clamping block 16 are driven to move closer together by the first connecting rod 13 and the second connecting rod 14 respectively, so as to clamp the chip 21 to the middle of the upper surface of the worktable 10. Alternatively, the first connecting rod 13 and the second connecting rod 14 can drive the first clamping block 15 and the second clamping block 16 away from each other, and release the clamped chip 21. The operation is simple, convenient and safe, and can be completed with one hand.

[0048] Specifically, in one or more embodiments of the present invention, the lower end of the first connecting rod 13 is connected to the slider 12, the first clamping block 15 is located on the upper surface of the worktable 10, the lower part of the second connecting rod 14 is provided with an oblong hole, the slider 12 is provided with a fixing post 17, the fixing post 17 is engaged in the oblong hole, the upper part of the second connecting rod 14 is rotatably connected to the two side walls of the corresponding through hole on the worktable 10 through a rotating shaft, the rotating shaft is fitted with a torsion spring 20, and the two torsion feet of the torsion spring 20 are respectively When the slider 12 slides on the fixed base 11, it abuts against the worktable 10 and the second clamping block 16. The slider 12 drives the first connecting rod 13 to drive the first clamping block 15 to slide along the upper surface of the worktable 10, so as to clamp or release the corresponding side of the chip 21. At the same time, the block 12 drives the lower end of the second connecting rod 14 to rotate around the fixed post 17, so that the upper end of the second connecting rod 14 drives the second clamping block 16 to press or release the corresponding side of the chip 21, and press or release the torsion spring 20. By connecting the lower end of the first connecting rod 13 to the slider 12, the slider 12 can move horizontally on the surface of the worktable 10 via the first connecting rod 13 when it slides. The lower part of the second connecting rod 14 is provided with an oval hole, so the lower end of the second connecting rod 14 can rotate around the fixed column 17 when the slider 12 slides. This drives the second connecting rod 14 to move the second clamping block 16 to press or release the corresponding side of the chip 21. At the same time, the torsion spring 20 can achieve automatic reset, achieving a linkage effect. The operation is simple.

[0049] Optionally, in one or more embodiments of the present invention, the clamping linkage mechanism further includes an operating part 18, which is connected to the first connecting rod 13. The operating part 18 facilitates hand operation and improves ease of use.

[0050] In practice, the operating part 18 is a hand-tightening nut, which is connected to the slider 12 by a threaded connection, which is convenient to operate and can also play a role in preventing slippage.

[0051] The present invention also provides a method for removing adhesive from a chip, using the aforementioned chip 21 adhesive removal device, the method comprising the following steps:

[0052] Pull the operating part 18 and drive the slider 12 to slide along the fixed seat 11. The slider 12 drives the first connecting rod 13 to drive the first clamping block 15 to slide along the upper surface of the worktable 10, and simultaneously drives the upper end of the second connecting rod 14 to drive the second clamping block 16 to rotate away from the first clamping block 15, and compress the torsion spring 20.

[0053] The chip 21 is placed on the worktable 10 and positioned between the first clamping block 15 and the second clamping block 16;

[0054] When the operating part 18 is released, the torsion spring 20 drives the upper end of the second connecting rod 14 to rotate the second clamping block 16 toward the chip 21. At the same time, the second connecting rod 14 drives the slider 12 to slide the first clamping block 15 at the upper end of the first connecting rod 13 toward the chip 21. The first clamping block 15 and the second clamping block 16 cooperate to clamp the chip 21.

[0055] Adjust the slide block 6 so that the chip is within the range of the grinding head of the grinder 1, and pull the plunger 8 so that the end of the plunger 8 is inserted into the positioning hole and locked.

[0056] Turn on the polishing machine 1 and polish the glue on one side of the surface edge of the chip 21 until the glue on one side of the surface edge of the chip 21 is completely removed.

[0057] Pull the plunger 8 so that the end of the plunger 8 is completely withdrawn from the positioning hole. Rotate the rotating platform 3 180 degrees, then pull the plunger 8 again so that the end of the plunger 8 is inserted into the positioning hole and locked. Polish the glue on the edge of the other side of the chip 21 until the glue on the edge of the other side of the chip 21 is completely removed.

[0058] Pulling the operating part 18 drives the slider 12 to simultaneously loosen the first clamping block 15 and the second clamping block 16 and remove the chip 21.

[0059] The chip adhesive removal method of the present invention can clamp the chip 21 through the clamping linkage mechanism, and adjust the chip 21 to the grinding range of the grinding machine 1 by sliding the rotating platform 3. The rotating platform 3 can drive the clamping linkage mechanism to rotate, thereby adjusting the position of the chip. In this way, the adhesive on the chip surface can be removed in one clamping operation. The structure is simple, the operation is convenient and safe, and the adhesive removal efficiency is greatly improved, avoiding chip damage.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip adhesive removal device, characterized in that: The device includes a polishing machine (1), a base plate (2), a rotating platform (3), and a clamping linkage mechanism for clamping a chip (21). The polishing machine (1) is mounted on one end of the upper surface of the base plate (2) via a bracket (4). The rotating platform (3) is slidably disposed on the other end of the upper surface of the base plate (2). The clamping linkage mechanism is disposed on the rotating platform (3) and can rotate horizontally with the rotating platform (3). The clamping linkage mechanism can slide on the base plate (2) with the rotating platform (3) to move closer to or away from the polishing machine (1). The polishing machine (1) can polish the glue residue on the edge of the chip (21) clamped on the clamping linkage mechanism. The clamping linkage mechanism includes a connecting block (9), a worktable (10), a fixed seat (11), a slider (12), a first connecting rod (13), and a second connecting rod (14). The lower end of the connecting block (9) is connected and fixed to the middle of the rotating platform (3), and the upper end of the connecting block (9) is connected and fixed to the lower surface of the worktable (10). The fixed seat (11) is installed on the rotating platform (3) and located on one side of the connecting block (9). The two ends of the worktable are respectively provided with through holes through which the first connecting rod (13) and the second connecting rod (14) pass. The slider (12) is slidably disposed on the fixed seat (11). The lower ends of the first connecting rod (13) and the second connecting rod (14) are respectively connected to the slider (12). The upper ends of the first connecting rod (13) and the second connecting rod (14) pass through corresponding through holes, and the upper ends of the first connecting rod (13) and the second connecting rod (14) are respectively provided with a first clamping block (15) and a second clamping block (16). When the slider (12) slides on the fixed seat (11), the first connecting rod (13) and the second connecting rod (14) drive the first clamping block (15) and the second clamping block (16) to move closer to each other to clamp the chip (21) to the middle of the upper surface of the worktable (10), or the first connecting rod (13) and the second connecting rod (14) drive the first clamping block (15) and the second clamping block (16) to move away from each other and release the clamped chip (21). The lower end of the first connecting rod (13) is connected to the slider (12), the first clamping block (15) is located on the upper surface of the workbench (10), the lower part of the second connecting rod (14) is provided with an oval hole, the slider (12) is provided with a fixing post (17), the fixing post (17) is engaged in the oval hole, the upper part of the second connecting rod (14) is rotatably connected to the two side walls of the corresponding through hole on the workbench (10) through a rotating shaft, the rotating shaft is fitted with a torsion spring (20), and the two torsion feet of the torsion spring (20) respectively abut against the workbench (10) and the second clamping block (16).

2. The chip adhesive removal device according to claim 1, characterized in that: A slide rail (5) is provided at the other end of the upper surface of the base plate (2). A slide block (6) is slidably provided on the slide rail (5). The rotating platform (3) is provided on the slide block (6), and the slide block (6) can drive the rotating platform (3) to slide along the slide rail (5) to get closer to or away from the grinder (1).

3. The chip adhesive removal device according to claim 2, characterized in that: Limiting blocks (19) are respectively provided at both ends of the slide rail (5).

4. The chip adhesive removal device according to claim 2, characterized in that: It also includes a positioning mechanism, which is disposed on the base plate (2) and engages with the rotating platform (3) to fix the rotating platform (3) and the slide (6) on the slide rail (5).

5. The chip adhesive removal device according to claim 4, characterized in that: The positioning mechanism includes a positioning plate (7) and a plunger (8). The positioning plate (7) is installed on one side of the base plate (2) and has mounting holes. The plunger (8) is installed in the mounting holes on the positioning plate. The side wall of the rotating platform (3) has multiple positioning holes that are compatible with the plunger (8). When the plunger (8) is aligned with the positioning hole, the plunger (8) is released and the end of the plunger (8) is just inserted into the corresponding positioning hole to fix the rotating platform (3) and the slide (6) on the slide rail (5).

6. The chip adhesive removal device according to claim 5, characterized in that: The rotating platform (3) includes a fixed part (22), a rotating part (23), and a cover plate (24). The fixed part (22) is mounted on the slide (6). A frustum is provided in the middle of the fixed part (22). An annular slot adapted to the frustum is provided in the middle of the rotating part (23). The frustum is engaged with the annular slot and the two can rotate relative to each other. The positioning hole is provided on the side wall of the rotating part (23). When the end of the plunger (8) extends into the corresponding positioning hole, the rotating part (23) is locked relative to the fixed part (22). The cover plate (24) is provided on the rotating part (23). The clamping linkage mechanism is provided on the cover plate (24).

7. The chip adhesive removal device according to claim 1, characterized in that: When the slider (12) slides on the fixed base (11), the slider (12) drives the first connecting rod (13) to drive the first clamping block (15) to slide along the upper surface of the worktable (10) to clamp or release the chip (21) on the corresponding side. At the same time, the slider (12) drives the lower end of the second connecting rod (14) to rotate around the fixed post (17), so that the upper end of the second connecting rod (14) drives the second clamping block (16) to press or release the chip (21) on the corresponding side, and press or release the torsion spring (20).

8. The chip adhesive removal device according to claim 1, characterized in that: The clamping linkage mechanism also includes an operating part (18), which is connected to the first connecting rod (13).

9. A method for removing adhesive from a chip, characterized in that, The chip adhesive removal apparatus according to any one of claims 1-8 comprises the following steps: Pull the operating part (18) and drive the slider (12) to slide along the fixed seat (11). The slider (12) drives the first connecting rod (13) to drive the first clamping block (15) to slide along the upper surface of the worktable (10), and simultaneously drives the upper end of the second connecting rod (14) to drive the second clamping block (16) to rotate away from the first clamping block (15), and compress the torsion spring (20). Place the chip (21) on the worktable (10) and between the first clamping block (15) and the second clamping block (16); When the operating part (18) is released, the torsion spring (20) drives the upper end of the second connecting rod (14) to rotate the second clamping block (16) toward the chip (21). At the same time, the second connecting rod (14) drives the slider (12) to slide the first clamping block (15) at the upper end of the first connecting rod (13) toward the chip (21). The first clamping block (15) and the second clamping block (16) cooperate to clamp the chip (21). Adjust the slide (6) so that the chip is within the range of the grinding head of the grinder (1), and pull the plunger (8) so that the end of the plunger (8) is inserted into the positioning hole and locked. Turn on the polisher (1) and polish the glue on the edge of one side of the chip (21) until the glue on the edge of one side of the chip (21) is completely removed; Pull the plunger (8) so that the end of the plunger (8) is completely removed from the positioning hole. Rotate the rotating platform (3) 180 degrees, and then pull the plunger (8) so that the end of the plunger (8) is inserted into the positioning hole and locked. Polish the glue on the other side edge of the chip (21) until the glue on the other side edge of the chip (21) is completely removed. Pulling the operating part (18) drives the slider (12) to simultaneously release the chip (21) and remove the chip (21) from the first clamping block (15) and the second clamping block (16).

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