Current sensor and method for manufacturing the same

Abstract

The present invention provides a current sensor and a manufacturing method thereof, comprising a shell, on which a first groove is provided, wherein a first mounting groove is provided on the side of the first groove away from the opening, and a notch is provided on the first mounting groove; a shell cover is provided on the opening side of the first groove, wherein a first clamping member is provided on the side of the shell cover facing the first groove to fix the chip; a glue filling area is provided on the side of the first groove away from the shell cover, wherein the depth of the glue filling area is lower than the notch of the first mounting groove; when the iron core and the chip are installed in the first groove, glue is filled in the glue filling area so that the glue can surround the surface of the iron core without contacting the chip, thereby realizing local glue filling, thereby avoiding stress on the chip caused by heat of the glue. The current sensor provided by the present invention has the characteristics of integration, miniaturization and high stability.

Description

Technical Field

[0001] The present invention belongs to the technical field of sensors, and in particular relates to a current sensor and a manufacturing method thereof. Background Art

[0002] Current detection is an important function of the electronic control system of new energy vehicles, and its performance is directly related to the stability and reliability of electric vehicles. The current detection method based on Hall current sensor has the advantages of low loss, stable performance, self-isolation, and strong overload capacity, and has gradually become the mainstream solution for current detection in new energy vehicles. With the vigorous development of the new energy vehicle industry, the market's requirements for the integration, miniaturization, and stability of current sensors are constantly increasing.

[0003] In order to improve the integration and miniaturization of the current sensor, the patent document CN202815058U discloses a "current sensor", which includes a magnetic core, a magnetic core bracket, a shell, and a chip arranged on the shell, and the chip is located just above the air gap of the magnetic core; the current sensor uses the chip to replace the PCBA part, reduces the volume of the current sensor, and omits the SMT and manual welding process in the prior art. At the same time, the magnetic core, the magnetic core bracket, the chip and the shell of the current sensor are integrally formed, the structure is compact, the volume is reduced, the curing time of the shell and the potting glue is reduced, the production cycle is shortened, the production efficiency is improved, and the production cost is reduced. However, the current sensor has the following problems: first, the potting glue will produce greater stress on the chip due to temperature changes, and the water absorption rate of the potting glue is relatively high compared to the chip, forcing the chip to be in a wet state, thereby causing abnormal performance of the current sensor; second, the chip pin spacing is fixed and cannot be adjusted according to changes in the external interface spacing; third, the air gap of the iron core is prone to deformation under vibration and falling conditions, making the size of the air gap unstable, resulting in reduced accuracy of the current sensor; fourth, the magnetic core and the shell are integrally formed by an integral injection molding process, and the thermal expansion coefficient of the plastic shell and the ferromagnetic body is greatly different, which is prone to high stress and causes the shell to crack.

[0004] In view of the above problems, patent document CN208459468U discloses a "Hall current sensor" which includes a skeleton, a Hall assembly, an iron core assembly, and a packaging shell; the Hall assembly includes a Hall element, a PCB board, pins, and a packaging shell, the Hall element and the pins are respectively welded on the PCB board, and the Hall packaging shell is formed by injection molding outside the PCB board; specifically, the pins of the chip are welded on the PCB board through surface mounting technology (SMT), the PCB pins are welded on the PCB board through surface mounting technology (SMT), and the PCB board with the chip and PCB pins welded is injection molded The Hall component is encapsulated to form a Hall assembly; the Hall component is fixed on the mounting groove, and one end with a pin passes through the mounting groove, and the other end passes through the air gap of the iron core assembly and is supported on the packaging shell; the skeleton is fixed on the iron core assembly, and the Hall component is fixed by fixing the skeleton and the packaging shell together; the scheme forms a Hall assembly by performing secondary plastic sealing on the chip and the PCB board, and fixes it to the mounting groove in the packaging shell by plugging, avoiding the problems of the chip being in a wet state and generating stress with temperature changes due to the overall glue filling method, and the gap adjustment of the chip pins is achieved through the internal circuit setting of the PCB board.

[0005] However, the Hall current sensor solution has the following problems: first, the chip, PCB and PCB pins need to be integrally molded and packaged after assembly. The high temperature and high pressure during molding will produce greater stress on the chip and PCB, affecting the performance of the chip; second, the packaged PCB chip needs to be baked, and the baking time is more than four hours, which reduces the mass production efficiency; third, the core assembly is fixed by riveting with a bracket, but the riveting fatigue is low and the strength is poor. Summary of the invention

[0006] The purpose of the present invention is to solve the above problems in the prior art and to provide a current sensor which is integrated, miniaturized and highly stable.

[0007] The object of the present invention can be achieved by the following technical solutions: a current sensor, including an iron core and a chip, and further comprising:

[0008] A housing having a first groove formed thereon, wherein a first mounting groove is formed on a side of the first groove away from the opening, and a notch is formed on the first mounting groove;

[0009] A shell cover is arranged at the opening side of the first groove, wherein a first pressing member is arranged on a side of the shell cover facing the first groove to fix the chip;

[0010] The glue filling area is arranged on the side of the first groove away from the shell cover, wherein the depth of the glue filling area is lower than the gap of the first mounting groove; when the iron core and the chip are installed in the first groove, the glue filling area is filled with glue so that the glue can surround the surface of the iron core without contacting the chip, thereby realizing local glue filling, thereby avoiding stress on the chip caused by heat of the glue.

[0011] In the above-mentioned current sensor, the first installation slot is hollow, one end of which passes through the shell, and the other end extends toward a side close to the shell cover, and the notch is provided at the extended end of the first installation slot.

[0012] In the above-mentioned current sensor, the notch and the first groove have a height difference away from the shell cover, wherein the height difference is greater than the depth of the glue filling area to achieve isolation between the notch and the glue filling area.

[0013] In the above-mentioned current sensor, the first mounting groove forms a plug-in fit with the chip, wherein the chip includes a pin end inserted into the first mounting groove through the notch away from the shell cover, and a plastic end connected to the pin end and forming a snap fit with the notch, so as to isolate the chip from the glue filling area.

[0014] In the above-mentioned current sensor, a second mounting groove is provided on the side of the first mounting groove away from the notch, wherein a first limiting block is provided in the second mounting groove, and a side of the plastic part end close to the pin end is snap-connected with the first limiting block.

[0015] In the above-mentioned current sensor, two first limit blocks are provided, and a sliding groove is formed between the two first limit blocks. A third mounting groove is provided on a side of the sliding groove away from the notch.

[0016] In the above-mentioned current sensor, a limiting groove and a pin bending member clamped with the limiting groove are provided in the third installation groove, wherein the pin bending member includes a sliding block connected to the sliding groove and a second limiting block clamped with the limiting groove.

[0017] In the above-mentioned current sensor, a pin positioning portion is provided on the side of the pin bending member close to the notch, wherein the pin positioning portion extends in a direction away from the notch to form a pin guiding portion to achieve pin spacing adjustment.

[0018] In the above-mentioned current sensor, the first pressing member is arranged at a position where the shell cover is opposite to the notch and extends toward a side of the shell cover close to the first groove. When the chip is inserted into the first mounting groove, the first pressing member abuts against the chip.

[0019] The present invention also aims to provide a method for manufacturing a current sensor, based on the above-mentioned current sensor, comprising the steps of:

[0020] S1: injection molding the housing to provide a first groove and a second groove, and providing a first mounting groove in the first groove;

[0021] S2: a notch is provided on the first installation groove, and a space below the notch of the first groove is set as a glue filling area;

[0022] S3: sequentially arranging a second mounting groove and a third mounting groove in the first mounting groove to achieve compatibility with the first mounting groove, wherein the second mounting groove forms a longitudinal positioning for the chip;

[0023] S4: manufacturing a pin bending part by injection molding, and clamping the pin bending part with the third mounting groove;

[0024] S5: an iron core with a special-shaped structure is manufactured by a winding process, and an air gap is provided on the iron core, and an iron core fixing sheet is provided at the air gap;

[0025] S6: placing the iron core into the second groove, and filling the filling area with glue, so that the glue surrounds the surface of the iron core and does not contact the chip, thereby achieving local filling;

[0026] S7: injection molding the shell cover, and disposing a first pressing member and a second pressing member on a side of the shell cover facing the first groove, wherein the first pressing member abuts against the core chip, and the second pressing member abuts against the iron core;

[0027] S8: The shell and the shell cover are connected by providing a clamping block on the shell and a buckle on the shell cover.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] (1) A current sensor provided by the present invention realizes local glue filling by setting a glue filling area so that the glue filling area does not contact the chip, thereby avoiding stress generated by the chip due to heat of the glue, and effectively ensuring the performance of the chip.

[0030] (2) The current sensor provided by the present invention has a core that is in contact with the colloid by local glue injection, thereby avoiding the shell cracking caused by high stress generated by the difference in thermal expansion coefficients between the core and the shell during overall injection molding, thereby effectively improving the service life of the sensor.

[0031] (3) A current sensor provided by the present invention has a notch provided on the first mounting groove, and the area from the bottom of the first groove to below the notch is set as a glue filling area, thereby realizing positioning of the glue filling area.

[0032] (4) A current sensor provided by the present invention forms a height difference between the notch and the first groove away from the shell cover, and the height difference is greater than the depth of the glue potting area, thereby isolating the notch from the glue potting area and preventing the chip from being affected by the potting glue.

[0033] (5) A current sensor provided by the present invention has a pin bending member, and a pin positioning portion and a pin guiding portion are provided on the pin bending member, so that the chip pins are deformed along a predetermined trajectory, thereby adjusting the pin gap.

[0034] (6) The current sensor provided by the present invention can also pre-bend the chip pins through a pin bending process to achieve pin gap adjustment.

[0035] (7) A current sensor provided by the present invention sequentially arranges a second mounting groove and a third mounting groove in a first mounting groove, so that both a chip with bent pins and a chip with unbent pins can be installed in the first mounting groove, thereby improving the compatibility of the first mounting groove.

[0036] (8) A current sensor provided by the present invention realizes chip positioning by providing a second mounting groove and allowing the plastic end of the chip to be clamped on the second mounting groove.

[0037] (9) A current sensor provided by the present invention has a first pressing member, so that after the shell cover is connected to the shell body, the first pressing member and the chip are in contact with each other, thereby fixing the chip and preventing the chip from loosening after installation.

[0038] (10) A current sensor provided by the present invention is provided with a second pressing piece so that after the shell cover is connected to the shell body, the second pressing piece and the iron core are in contact with each other, thereby fixing the iron core and further ensuring the stability of the iron core.

[0039] (11) The current sensor provided by the present invention realizes the integration and miniaturization of the current sensor by setting the chip in the sensor. By setting the first clamping member and the second clamping member, the chip and the iron core can be stably fixed in the sensor, thereby effectively improving the stability of the current sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 The exploded diagram of a current sensor of the present invention.

[0041] Figure 2 It is a schematic structural diagram of the housing of the present invention.

[0042] Figure 3 for Figure 2 Schematic diagram of the structure from another perspective.

[0043] Figure 4 for Figure 3 Section view AA is shown.

[0044] Figure 5 It is a schematic structural diagram of the shell cover of the present invention.

[0045] Figure 6 It is a schematic structural diagram of the pin bending part of the present invention.

[0046] Figure 7 The figure is a schematic diagram of the structure of a current sensor of the present invention.

[0047] Figure 8 This is a process flow chart of the pin bending process of the present invention.

[0048] Fig. 9 It is a schematic diagram of the pin bending of the present invention.

[0049] Fig.10 It is a step diagram of the manufacturing method of the present invention.

[0050] In the figure, 1, housing; 100, first groove; 101, fixing block; 110, first mounting groove; 111, second mounting groove; 112, third mounting groove; 113, notch; 114, first stopper; 115, sliding groove; 116, stopper groove; 117, rectangular groove; 120, second groove; 130, glue filling area; 140, pin bending member; 141, slider; 142, second stopper; 143, pin positioning part; 144, pin Foot guide portion; 145, first curvature; 146, second curvature; 150, block; 160, first through hole; 161, protrusion; 162, crush rib; 170, bending fulcrum; 171, bending rod; 2, shell cover; 200, first clamping member; 210, second clamping member; 220, second through hole; 230, buckle; 3, iron core; 300, air gap; 310, iron core fixing plate; 4, chip; 400, pin end; 410, plastic part end. DETAILED DESCRIPTION

[0051] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0052] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0053] like Figures 1 to 9As shown, a current sensor provided by the present invention includes an iron core 3 and a chip 4, and also includes a shell 1, on which a first groove 100 is provided, wherein a first mounting groove 110 is provided on the first groove 100 away from the opening side, and a notch 113 is provided on the first mounting groove 110; a shell cover 2 is provided on the opening side of the first groove 100, wherein a first pressing member 200 is provided on the side of the shell cover 2 facing the first groove 100, for fixing the chip 4; a glue filling area 130 is provided on the side of the first groove 100 away from the shell cover 2, wherein the depth of the glue filling area 130 is lower than the notch 113 of the first mounting groove 110; when the iron core 3 and the chip 4 are installed in the first groove 100, the glue filling area 130 is glued so that the glue can surround the surface of the iron core 3 without contacting the chip 4, thereby realizing local glue filling, thereby avoiding stress generated by the chip 4 due to the heat of the glue.

[0054] Specifically, the shell 1 is rectangular and is provided with a first groove 100 and a second groove 120, wherein the second groove 120 is arranged in the first groove 100 and extends toward a side away from the shell cover 2, and the size of the second groove 120 is adapted to the core 3 for installing the core 3 and realizing the positioning of the core 3.

[0055] Furthermore, a first through hole 160 is provided at the center of the shell 1, which is circular and passes through the shell 1, wherein a protrusion 161 is provided at the first through hole 160, and the protrusion 161 is ring-shaped and extends along the side of the first through hole 160 close to the shell cover 2, and is provided with a plurality of compression ribs 162, which are distributed around the side of the protrusion 161 close to the iron core 3. Preferably, four compression ribs 162 are provided, which form abutment with the inner side of the iron core 3 to fix the iron core 3.

[0056] Furthermore, a fixing block 101 is provided in the first groove 100. The fixing block 101 is provided in the first groove 100 near the second groove 120. Preferably, four fixing blocks 101 are provided, surrounding the second groove 120 and contacting the outer side of the core 3 to fix the core 3 and prevent the core 3 from being loosened due to impact.

[0057] Furthermore, the iron core 3 is annular and is provided with an air gap opening 300, and the air gap opening 300 is provided with an iron core fixing plate 310, which is L-shaped and contacts the air gap opening 300. The iron core 3 is made by a winding process. In order to prevent the iron core 3 from being deformed by the air gap opening 300 due to collision or the influence of the temperature of the potting glue, the iron core fixing plate 310 is clamped between the air gap openings 300 and welded to the air gap openings 300, thereby improving the stability of the iron core 3.

[0058] Furthermore, the iron core 3 is disposed in the second groove 120 and sleeved on the protrusion 161 to form abutment with the compression rib 162 to achieve installation of the iron core 3 .

[0059] Furthermore, the first mounting groove 110 is arranged on a side of the first groove 100 close to the air gap opening 300 of the iron core 3, and the first mounting groove 110 is vertically arranged with the protrusion 161, wherein one end of the first mounting groove 110 is connected to the protrusion 161, and the other end extends to a side of the shell 1 away from the protrusion 161.

[0060] Furthermore, the first mounting groove 110 is hollow and is provided with a rectangular groove 117. One end of the rectangular groove 117 passes through the shell 1 and the other end extends toward the side close to the shell cover 2. The width of the rectangular groove 117 is adapted to the thickness of the chip 4 to prevent the chip 4 from shaking left and right in the first mounting groove 110.

[0061] Furthermore, the notch 113 is provided at the extended end of the first installation groove 110 , and the notch 113 is in an I-shape, wherein the area from the first groove 100 to below the notch 113 is a glue filling area 130 , thereby realizing the division of the local glue filling area 130 .

[0062] Furthermore, there is a height difference between the notch 113 and the side of the first groove 100 away from the shell cover 2 , wherein the height difference is greater than the depth of the glue filling area 130 , so as to isolate the notch 113 from the glue filling area 130 .

[0063] Furthermore, the chip 4 includes a pin end 400 and a plastic end 410 connected to the pin end 400 , wherein the pin end 400 of the chip 4 is provided with a plurality of pins, preferably, four pins, all of which are electrically connected to the plastic end 410 .

[0064] Furthermore, the first mounting groove 110 forms a plug-in fit with the chip 4, wherein the pin end 400 of the chip 4 is inserted into the first mounting groove 110 away from the shell cover 2 through the notch 113, and the plastic end 410 of the chip 4 forms a snap-fitted plastic end 410 with the notch 113 to isolate the chip 4 from the glue filling area 130.

[0065] Furthermore, a second mounting groove 111 is provided on the side of the first mounting groove 110 away from the notch 113, wherein a first limiting block 114 is provided in the second mounting groove 111, and a step is formed between the first limiting block 114 and the notch 113, wherein a side of the plastic part end 410 close to the pin end 400 is snap-connected with the first limiting block 114 to realize the longitudinal positioning of the chip 4.

[0066] Furthermore, there are two first limit blocks 114 in a trapezoidal shape, both of which are in contact with the inner wall of the second mounting groove 111, wherein there is a certain distance between the two first limit blocks 114 to form a sliding groove 115, and a third mounting groove 112 is provided on the side of the sliding groove 115 away from the notch 113, and a limit groove 116 is provided in the third mounting groove 112 to achieve positioning of the chip 4.

[0067] Further preferably, a pin bending member 140 is provided in the third mounting groove 112 and is engaged with the limiting groove 116 , wherein the pin bending member 140 includes a sliding block 141 connected to the sliding groove 115 and a second limiting block 142 engaged with the limiting groove 116 .

[0068] Furthermore, the pin bending member 140 is T-shaped, and two second limit blocks 142 are provided, which are respectively clamped with the limit grooves 116, wherein the slider 141 is provided on the side of the pin bending member 140 close to the first limit block 114, and its size is adapted to the sliding groove 115.

[0069] Further preferably, in order to achieve the gap adjustment of the pins of the chip 4, the pin bending part 140 is provided with a pin positioning portion 143 on the side away from the slider 141, and the pin positioning portion 143 is a pin positioning groove, and the number of the pin positioning grooves is adapted to the number of the pins of the chip 4. Preferably, four pin positioning grooves are provided.

[0070] Furthermore, the pin positioning groove is provided on a side of the pin bending member 140 close to the notch 113 , wherein the pin positioning groove extends in a direction away from the notch 113 to form a pin guiding portion 144 to achieve pin spacing adjustment.

[0071] Furthermore, the pin guide portion 144 is a pin guide groove, which is curved and includes a first curvature 145 and a second curvature 146, wherein the first curvature 145 is arranged at the junction of the pin guide groove and the pin positioning groove, and the second curvature 146 is arranged on the side of the first curvature 145 away from the notch 113, so as to realize the initial bending and secondary bending of the pins of the chip 4, thereby realizing the pin spacing adjustment.

[0072] Furthermore, the first curvature 145 and the second curvature 146 are both rounded to avoid stress concentration at the first curvature 145 and the second curvature 146 that may reduce the pin strength or scratch the coating.

[0073] Furthermore, through the integration of the pin positioning portion 143 and the pin guiding portion 144 , after the chip 4 is inserted into the pin bending member 140 , its pins can be deformed along the pin positioning portion 143 and the pin guiding portion 144 , thereby achieving adjustment of the pin spacing.

[0074] Further preferably, in order to achieve the gap adjustment of the pins of the chip 4, the chip 4 can also be made by a pin bending process, and the steps of the pin bending process are: first, the pins of the chip 4 are initially cut, and then the pins on both sides and the middle pins are bent initially and twice in turn, and then fine-cut to a fixed length, and finally, blanking is performed; in this pin bending process, the plastic package of the chip 4 is in an air-avoiding state as a whole to avoid damage caused by mechanical force.

[0075] Furthermore, by performing primary bending and secondary bending on the pins of the chip 4 , the pin spacing adjustment is achieved.

[0076] Further preferably, in the pin bending process, the bending fulcrum 170 is designed with a rounded corner to avoid stress concentration at the bending fulcrum 170 which may cause reduction in pin strength or scratches on the coating.

[0077] Further preferably, in the pin bending process, the bending rod 171 used to bend the pins of the chip 4 is cylindrical and made of Teflon or nylon material to avoid damage to the pins of the chip 4.

[0078] Furthermore, the chip 4 processed by the pin bending process is inserted into the second mounting groove 111 through the first mounting groove 110, wherein the plastic end 410 of the chip 4 contacts the first limit block 114 of the second mounting groove 111 to achieve the longitudinal positioning of the chip 4, and the pin end 400 of the chip 4 passes through the second mounting groove 111 and protrudes to the side of the shell 1 away from the notch 113.

[0079] Furthermore, the shell cover 2 is rectangular, and its size is adapted to that of the shell 1 so as to form a seal with the shell 1 .

[0080] Furthermore, the shell cover 2 is provided with a second through hole 220 . The second through hole 220 is circular and passes through the shell cover 2 . The size of the second through hole 220 is adapted to that of the first through hole 160 .

[0081] Further preferably, the first clamping member 200 is arranged at a relative position between the shell cover 2 and the notch 113, is irregular in shape, and extends toward the side of the shell cover 2 close to the first groove 100. When the chip 4 is inserted into the first mounting groove 110, the first clamping member 200 abuts against the chip 4 to fix the chip 4 and prevent the chip 4 from loosening when it is collided.

[0082] Furthermore, the shell cover 2 is provided with a second clamping member 210 on the side facing the shell 1. The second clamping member 210 is cylindrical and is provided with four pieces. It surrounds the second through hole 220 and extends toward the side close to the shell 1 to form abutment with the iron core 3, thereby fixing the iron core 3.

[0083] Furthermore, a buckle 230 is provided on the outer side of the shell cover 2. The buckle 230 surrounds the shell cover 2 and extends toward the side close to the shell 1. It is rectangular and hollow. Preferably, there are five buckles 230 that are snap-fitted with the shell 1 to fix the shell cover 2 to the shell 1.

[0084] Furthermore, a clamping block 150 corresponding to the buckle 230 is provided on a side of the shell 1 away from the first groove 100 , and the clamping block 150 extends toward the side away from the first groove 100 and is clamped with the buckle 230 to fix the shell cover 2 to the shell 1 .

[0085] like Figures 1 to 10 As shown, the present invention also provides a method for manufacturing a current sensor, comprising the steps of:

[0086] S1: Injection-molding the housing 1 to provide a first groove 100 and a second groove 120 , and providing a first mounting groove 110 in the first groove 100 ;

[0087] S2: a notch 113 is provided on the first installation groove 110 , and a space below the notch 113 of the first groove 100 is set as a glue filling area 130 ;

[0088] S3: sequentially arrange the second installation groove 111 and the third installation groove 112 in the first installation groove 110 to achieve compatibility with the first installation groove 110, wherein the second installation groove 111 forms a longitudinal positioning for the chip 4;

[0089] S4: manufacturing the pin bending member 140 by injection molding, and engaging the pin bending member 140 with the third mounting groove 112;

[0090] S5: manufacturing an iron core 3 with a special-shaped structure through a winding process, and setting an air gap 300 on the iron core 3, and at the same time, welding a fixing plate structure of the iron core 3 at the air gap 300;

[0091] S6: placing the iron core 3 into the second groove 120, and filling the filling area 130 with glue, so that the glue surrounds the surface of the iron core 3 and does not contact the chip 4, thereby achieving local filling;

[0092] S7: injection molding the shell cover 2, and disposing a first pressing member 200 and a second pressing member 210 on a side of the shell cover 2 facing the first groove 100, wherein the first pressing member 200 abuts against the core 4, and the second pressing member 210 abuts against the iron core 3;

[0093] S8: The housing 1 is connected to the housing cover 2 by providing a clamping block 150 on the housing 1 and a buckle 230 on the housing cover 2 .

[0094] In general, during the manufacturing of a current sensor provided by the present invention, the iron core 3 is first placed in the second groove 120, so that the fixing block 101 is in contact with the iron core 3, and the potting glue is injected into the potting area 130 so that the potting glue covers the bottom of the first groove 100. When the depth of the potting glue is close to the notch 113, the potting glue injection is stopped to complete the fixing of the iron core 3. Then, the pin bending member 140 is installed in the first installation groove 110 so that the pin bending member 140 is snap-fitted with the third groove. Then, the chip 4 is installed in the pin bending member 140 via the first installation groove 110 so that the pins of the chip 4 are bent along the pin guide portion 144. Then, the shell cover 2 is placed on the opening side of the shell 1 so that the first clamping member 200 is abutted against the plastic end 410 of the chip 4, and the second clamping member 210 is abutted against the iron core 3. Finally, the clamping block 150 is snapped into the corresponding buckle 230 to complete the manufacturing of the current sensor.

[0095] It is worth noting that after the chip 4 has been processed by the chip 4 pin bending process, it can be directly inserted into the first mounting groove 110 and formed with the second mounting groove 111 to form a snap connection. There is no need to install the pin bending member 140 separately to achieve the adjustment of the spacing of the chip 4 pins.

[0096] It should be noted that in the present invention, descriptions such as "first", "second", "one", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. The terms "connected", "fixed", etc. should be understood in a broad sense. For example, "fixed" can be a fixed connection, a detachable connection, or an integral whole; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0097] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0098] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A current sensor, comprising an iron core (3) and a chip (4), characterized in that: include: A housing (1) having a first groove (100) provided thereon, wherein a first installation groove (110) is provided on a side of the first groove (100) away from the opening, and a notch (113) is provided on the first installation groove (110); A shell cover (2) is arranged on the opening side of the first groove (100), wherein a first pressing member (200) is provided on a side of the shell cover (2) facing the first groove (100) for fixing the chip (4); The glue filling area (130) is arranged on a side of the first groove (100) away from the shell cover (2), wherein the depth of the glue filling area (130) is lower than the notch (113) of the first installation groove (110); when the iron core (3) and the chip (4) are installed in the first groove (100), the glue filling area (130) is filled with glue so that the glue can surround the surface of the iron core (3) and does not contact the chip (4), thereby achieving local glue filling, thereby avoiding stress on the chip (4) caused by heat from the glue; A second mounting groove (111) is provided on a side of the first mounting groove (110) away from the notch (113), wherein a first limiting block (114) is provided in the second mounting groove (111); Two first limit blocks (114) are provided, and a sliding groove (115) is formed between the two first limit blocks (114); a third mounting groove (112) is provided on a side of the sliding groove (115) away from the notch (113); The third installation groove (112) is provided with a limiting groove (116) and a pin bending member (140) that is clamped with the limiting groove (116), wherein the pin bending member (140) comprises a sliding block (141) connected to the sliding groove (115) and a second limiting block (142) that is clamped with the limiting groove (116); A pin positioning portion (143) is provided on a side of the pin bending piece (140) close to the notch (113), wherein the pin positioning portion (143) extends in a direction away from the notch (113) to form a pin guiding portion (144) to achieve pin spacing adjustment.

2. A current sensor according to claim 1, characterized in that: The first installation groove (110) is hollow, with one end penetrating the housing (1) and the other end extending toward a side close to the housing cover (2), and the notch (113) is provided at the extended end of the first installation groove (110).

3. A current sensor according to claim 2, characterized in that: There is a height difference between the notch (113) and the side of the first groove (100) away from the shell cover (2), wherein the height difference is greater than the depth of the glue injection area (130), so as to achieve isolation between the notch (113) and the glue injection area (130).

4. A current sensor according to claim 3, characterized in that: The first mounting groove (110) and the chip (4) form a plug-in fit, wherein the chip (4) comprises a pin end (400) inserted into the first mounting groove (110) through the notch (113) on the side away from the shell cover (2), and a plastic part end (410) connected to the pin end (400) and snap-fitted with the notch (113), so as to isolate the chip (4) from the glue injection area (130).

5. A current sensor according to claim 4, characterized in that: A side of the plastic part end (410) close to the pin end (400) is snap-fitted to the first limiting block (114).

6. A current sensor according to claim 1, characterized in that: The first pressing member (200) is disposed at a position of the shell cover (2) relative to the notch (113) and extends toward a side of the shell cover (2) close to the first groove (100); when the chip (4) is inserted into the first mounting groove (110), the first pressing member (200) abuts against the chip (4).

7. A method for manufacturing a current sensor, characterized in that: A current sensor according to any one of claims 1 to 6, comprising the steps of: S1: injection molding the housing (1), providing a first groove (100) and a second groove (120), and providing a first installation groove (110) in the first groove (100); S2: a notch (113) is provided on the first installation groove (110), and a space below the notch (113) of the first groove (100) is set as a glue filling area (130); S3: sequentially arranging a second mounting groove (111) and a third mounting groove (112) in the first mounting groove (110) to achieve compatibility with the first mounting groove (110), wherein the second mounting groove (111) forms a longitudinal positioning for the chip (4); S4: manufacturing a pin bending piece (140) by injection molding, and clamping the pin bending piece (140) with the third mounting groove (112); S5: an iron core (3) having a special-shaped structure is manufactured through a winding process, and an air gap opening (300) is provided on the iron core (3), and at the same time, an iron core (3) fixing plate is provided at the air gap opening (300); S6: placing the iron core (3) into the second groove (120), and filling the filling area (130) with glue, so that the glue surrounds the surface of the iron core (3) and does not contact the chip (4), thereby achieving local filling; S7: injection molding the shell cover (2), and arranging a first pressing member (200) and a second pressing member (210) on a side of the shell cover (2) facing the first groove (100), wherein the first pressing member (200) abuts against the chip (4), and the second pressing member (210) abuts against the iron core (3); S8: The housing (1) and the housing cover (2) are connected by providing a clamping block (150) on the housing (1) and a buckle (230) on the housing cover (2).

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