Test socket and method of manufacturing the same

Abstract

A test socket and a manufacturing method thereof are disclosed. The test socket includes a first block including a first base member of a conductive material and a first insulating member of an insulating material, a second block including a second base member of a conductive material and a second insulating member of an insulating material, a gap member of an insulating material interposed between the first block and the second block, a first probe supported in contact with the first base member and not in contact with the second base member, a second probe supported not in contact with the first base member and in contact with the second base member, and an electronic component disposed in the gap member and placed on a conductive path electrically connecting the first base member and the second base member.

Description

Technical Field

[0001] This disclosure relates to a test socket for testing the electrical properties of an object under test. Background Technology

[0002] During the manufacturing process, semiconductor wafers with intricate and highly integrated electronic circuits are tested to determine the functionality of each circuit. To test the semiconductor wafer, contact probes for semiconductor testing are used, which connect the terminals of the semiconductor wafer to contact points (pads) on a test board used to apply test signals. Generally, the terminals of semiconductor wafers have very fine patterns. Therefore, contact probes of a very fine size should be integrated and supported in a probe support to contact and test the terminals with their intricate patterns. Shortening the power path of the test socket used to test the semiconductor wafer is desirable. Korean Patent No. 10-1552552 discloses a technique for placing a printed circuit board (PCB) with mounted electronic components in a test socket.

[0003] In traditional test sockets, a PCB is sandwiched between an upper support for the probe and a lower support for the conductor, and two terminals of the electronic components mounted on the PCB are connected to the probe and the conductor. However, because the very fine conductive patterns are formed with fine pitches and the PCB needs to be designed to contact the probe and conductor, it is difficult to manufacture such traditional test sockets, and the complex structure of the test sockets increases manufacturing costs. Summary of the Invention

[0004] Technical issues

[0005] One embodiment of this disclosure aims to provide a test socket with a simple structure and excellent power integrity.

[0006] Another embodiment of this disclosure aims to provide a test socket with excellent heat dissipation and increased current capacity.

[0007] Technical means

[0008] According to embodiments of this disclosure, a test fixture is provided. The test fixture includes: a first block comprising a first base component made of conductive material and a first insulating component made of insulating material; a second block comprising a second base component made of conductive material and a second insulating component made of insulating material; a gap member made of insulating material sandwiched between the first block and the second block; a first probe supported in contact with the first base component but not with the second base component; a second probe supported in contact with the second base component but not with the first base component; and an electronic component disposed in the gap member and placed on a conductive path that electrically connects the first base component and the second base component.

[0009] The gap member may include a component receiving hole in which the first terminal and the second terminal of the electronic component are received and exposed.

[0010] The first base component and the second base component may include a first groove and a second groove at positions corresponding to the exposed first terminal and the exposed second terminal, respectively.

[0011] The test socket may further include a first terminal contact portion and a second terminal contact portion, the first terminal contact portion and the second terminal contact portion being respectively disposed in the first groove and the second groove, and respectively enabling the first base component and the second base component to be electrically connected to the exposed first terminal and the exposed second terminal.

[0012] The first terminal contact portion and the second terminal contact portion may respectively include a first conductive elastic member and a second conductive elastic member.

[0013] The test socket may further include springs disposed in the first groove and the second groove, respectively, and connecting the first base component and the second base component to the exposed first terminal and the exposed second terminal, respectively.

[0014] The first base component may include a first probe receiving hole for accommodating the first probe under non-contact conditions and a second probe receiving hole for accommodating the second probe under contact conditions, and the second base component includes a first probe receiving hole for accommodating the first probe under contact conditions and a second probe receiving hole for accommodating the second probe under non-contact conditions.

[0015] According to another embodiment of this disclosure, a test fixture is provided. The test fixture includes: a first block comprising a first base component made of conductive material and a first insulating component made of insulating material; a second block comprising a second base component made of conductive material and a second insulating component made of insulating material; a gap component made of insulating material sandwiched between the first block and the second block; a first probe supported so as not to contact the first base component but to contact the second base component; a second probe supported so as to contact the first base component but not to contact the second base component; and an electronic component disposed in the gap component and placed on a conductive path that electrically connects the first base component and the second base component.

[0016] According to another embodiment of this disclosure, a method for manufacturing a test socket supports a first probe and a second probe that are retractable in a longitudinal direction. The method includes: forming a plate-shaped first block by bonding a first base member made of a conductive material to a first insulating member made of an insulating material; forming a plate-shaped second block by bonding a second base member made of a conductive material to a second insulating member made of an insulating material; forming a first probe hole and a second probe hole in the first block to support a first side of the first probe under non-contact conditions and a first side of the second probe under contact conditions; forming a third probe hole and a fourth probe hole in the second block to support a second side of the first probe under contact conditions and a second side of the second probe under non-contact conditions; and forming a first probe hole in the first block to support a second side of the first probe under contact conditions and a second side of the second probe under non-contact conditions. A fifth probe hole and a sixth probe hole are formed in the gap member to accommodate and support the middle portions of the first probe and the second probe, and a component receiving hole is formed in the gap member, which is made of insulating material, to accommodate electronic components whose first and second terminals are exposed; and the first probe is inserted into the first probe hole, the third probe hole and the fifth probe hole, the second probe is inserted into the second probe hole, the fourth probe hole and the sixth probe hole, and the first block and the second block are coupled while the gap member is present between the first block and the second block, with the electronic component inserted into the component receiving hole.

[0017] Invention Technology Efficacy

[0018] The method for manufacturing a test socket according to an embodiment of the present invention can reduce the power application path to a simple structure.

[0019] In addition, the test socket of the present invention can increase heat dissipation and current capacity by allowing the upper and lower brass blocks to directly contact the electronic components. Attached Figure Description

[0020] Figure 1This is a perspective view of the test stand according to the first embodiment of this disclosure.

[0021] Figure 2 It is viewed from above. Figure 1 An exploded perspective view of the test fixture shown.

[0022] Figure 3 It is viewed from below. Figure 1 An exploded perspective view of the test fixture shown.

[0023] Figure 4 It is the section AA along the line. Figure 1 The test stand shown is a cross-sectional view.

[0024] Figure 5 yes Figure 1 The diagram shows a cross-sectional view of the socket block.

[0025] Figures 6 to 9 It shows the manufacturing process. Figure 1 A diagram illustrating the method of using the test fixture shown.

[0026] Figure 10 This is a diagram showing a test fixture according to a second embodiment of the present disclosure.

[0027] Figure 11 This is a graph showing a comparison of Z-impedance between a conventional coaxial test socket and a test socket according to an embodiment of the present disclosure.

[0028] Figure 12 This is a diagram showing a test fixture according to a third embodiment of the present disclosure. Detailed Implementation

[0029] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0030] Figure 1 This is a perspective view of the test stand 1 according to the first embodiment of this disclosure. Figure 2 It is viewed from above. Figure 1 The exploded perspective view of test fixture 1 is shown, and Figure 3 It is viewed from below. Figure 1 An exploded perspective view of test fixture 1 is shown.

[0031] Reference Figures 1 to 3 The test socket 1 may include a socket block 2; multiple probes, such as a power probe 3, a ground probe 4, a signal probe or a radio frequency (RF) probe (hereinafter referred to as "signal probe") 5; and electronic components 6.

[0032] The seat block 2 may include an upper block 21, a lower block 22, and a gap member 23 sandwiched between the upper block 21 and the lower block 22.

[0033] The upper block 21 can be formed by integrally bonding the first insulating member 212 to one side of the first base member 211.

[0034] The upper block 21 may include a first power probe hole 213, a first ground probe hole 214 and a first signal probe hole 215 to respectively accommodate and support the upper portions of the power probe 3, the ground probe 4 and the signal probe 5.

[0035] The first base component 211 may be made of a conductive material (e.g., brass or the like). The first base component 211 may be formed by applying the conductive material to an insulating material. The first base component 211 may accommodate a power probe 3 under contact conditions, a ground probe 4 under non-contact conditions, and a signal probe 5 under non-contact conditions.

[0036] The first base component 211 may include a first groove 2111 recessed on its bottom side and surrounding the first power probe hole 213, the first ground probe hole 214 and the first signal probe hole 215, and a first elastic component 2112 filled in the first groove 2111.

[0037] The first elastic member 2112 may be made of a conductive material that electrically connects the first terminal of the electronic component 6 to the upper block 21. When the upper block 21, lower block 22, and gap member 23 are coupled, the first elastic member 2112 can prevent damage to the first terminal of the electronic component 6. The first elastic member 2112 may be implemented, for example, by means of a flat spring, a coil spring, or the like made of a conductive material.

[0038] The first insulating member 212 may be made of an insulating material (e.g., engineering plastic or the like). The first insulating member 212 may support the first end portions of the power probe 3, the ground probe 4, and the signal probe 5.

[0039] The lower block 22 can be formed by integrally bonding the second insulating member 222 to one side of the second base member 221. The lower block 22 may include a second power probe hole 223, a second ground probe hole 224 and a second signal probe hole 225 to respectively accommodate and support the lower portions of the power probe 3, the ground probe 4 and the signal probe 5.

[0040] The second base component 221 may be made of a conductive material (e.g., brass or the like). The second base component 221 may be formed by applying the conductive material to an insulating material. The second base component 221 may accommodate the power probe 3 under non-contact conditions, the ground probe 4 under contact conditions, and the signal probe 5 under non-contact conditions.

[0041] The second base member 221 may include a second groove 2211 recessed on its top side and surrounding the second power probe hole 223, the second ground probe hole 224 and the second signal probe hole 225, and a second elastic member 2212 filled in the second groove 2211.

[0042] The second elastic member 2212 may be made of a conductive material that electrically connects the second terminal of the electronic component 6 to the lower block 22. When the upper block 21, the lower block 22, and the gap member 23 are coupled, the second elastic member 2212 can prevent damage to the second terminal of the electronic component 6. The second elastic member 2212 may be implemented, for example, by a leaf spring, a coil spring, or the like made of a conductive material.

[0043] The second insulating member 222 may be made of an insulating material (e.g., engineering plastic or the like). The second insulating member 222 may support the second end portions of the power probe 3, the ground probe 4, and the signal probe 5.

[0044] The gap member 23 may be made of an insulating material (e.g., engineering plastic).

[0045] The gap member 23 may include a third power probe hole 233, a third ground probe hole 234 and a third signal probe hole 235. The third power probe hole 233, the third ground probe hole 234 and the third signal probe hole 235 have diameters corresponding to the outer diameters of the power probe 3, the ground probe 4 and the signal probe 5, respectively, and respectively accommodate the middle portions of the power probe 3, the ground probe 4 and the signal probe 5.

[0046] The gap member 23 may include a component receiving hole 231, which is permeably formed around the third power probe hole 233, the third ground probe hole 234, and the third signal probe hole 235, and is formed at positions corresponding to the first groove 2111 of the first base member 211 and the second groove 2211 of the second base member 221. The component receiving hole 231 is formed to have a diameter corresponding to the outer diameter of the electronic component 6, and to receive the electronic component 6.

[0047] When the upper block 21 is coupled to the lower block 22, the gap member 23 can correct the alignment error of multiple probes 3, 4 and 5.

[0048] Figure 4 It is the section AA along the line. Figure 1 The cross-sectional view of test fixture 1 is shown.

[0049] Reference Figure 4The power probe 3 can be positioned to not contact the first base member 211 but to contact the second base member 221, and includes a first end portion supported on the first insulating member 212 and a second end portion supported on the second insulating member 222. Therefore, the second base member 221 can maintain positive polarity via the power probe 3. The power probe 3 may include a cylinder 31, a first plunger 32, a second plunger 33, and a spring (not shown). The first plunger 32 and the second plunger 33, with the spring between them, can retract longitudinally and partially protrude from the top and bottom sides of the seat block 2, thereby electrically connecting the power contact point of the object under test to the power contact point of the test circuit.

[0050] The grounding probe 4 can be supported in contact with the first base member 211 but not with the second base member 221, and includes two end portions supported on the first insulating member 212 and the second insulating member 222. Therefore, the first base member 211 can maintain negative polarity through the grounding probe 4. The grounding probe 4 may include a cylinder 41, a first plunger 42, a second plunger 43, and a spring (not shown). The first plunger 42 and the second plunger 43 can retract longitudinally with the spring between them, and partially protrude from the top and bottom sides of the seat block 2, thereby electrically connecting the grounding contact point of the object under test to the grounding contact point of the test circuit.

[0051] The signal probe 5 can be housed so as not to contact the first base member 211 and the second base member 221, and includes a first end portion supported on the first insulating member 212 and a second end portion supported on the second insulating member 222. The signal probe 5 may include a cylinder 51, a first plunger 52, a second plunger 53, and a spring (not shown). The first plunger 52 and the second plunger 53 are retractable in the longitudinal direction with the spring between them, and partially protrude from the top and bottom sides of the seat block 2, thereby electrically connecting the signal contact point of the object under test to the signal contact point of the test circuit.

[0052] The power probe 3, ground probe 4, and signal probe 5 are not limited to the aforementioned pogo type, but can be any probe as long as it is retractable.

[0053] Electronic component 6 can be placed on a conductive path that electrically connects the first base member 211 and the second base member 221. Electronic component 6 may include various components, such as capacitors, resistors, integrated circuits (ICs), etc. Below, an example will illustrate that electronic component 6 is a capacitor. The capacitor is positioned between the positively polarized first base member 211 and the negatively polarized second base member 221, alternating between charging and discharging when the object under test is tested. In other words, the current charging in the multiple capacitors disposed inside the test socket 1 can be used to supply power to the object under test. Thus, test power is supplied through the built-in capacitors of the test socket 1, thereby shortening the power supply path and minimizing power loss.

[0054] Figure 5 yes Figure 1 The cross-sectional view of seat block 2 shown.

[0055] Reference Figure 5 The upper block 21 may include a first power probe hole 213, a first ground probe hole 214 and a first signal probe hole 215. The first power probe hole 213, the first ground probe hole 214 and the first signal probe hole 215 respectively accommodate and support the upper part of the power probe 3 under non-contact conditions, accommodate and support the upper part of the ground probe 4 under contact conditions and accommodate and support the upper part of the signal probe 5 under non-contact conditions.

[0056] The first power probe hole 213 may include a first power probe receiving hole 2131 formed in the first base member 211 and a first power probe support hole 2132 formed in the first insulating member 212. The first power probe receiving hole 2131 is formed to have a diameter larger than that of the cylinder 31 of the power probe 3, thereby receiving the power probe 3 without contact. The first power probe support hole 2132 can support the first end of the cylinder 31 of the power probe 3.

[0057] The first grounding probe hole 214 may include a first grounding probe receiving hole 2141 formed in the first base member 211 and a first grounding probe support hole 2142 formed in the first insulating member 212. The first grounding probe receiving hole 2141 is formed to have the same diameter as the cylinder 41 of the grounding probe 4, thereby receiving the grounding probe 4 under contact conditions. The first grounding probe support hole 2142 may support the first end of the cylinder 41 of the grounding probe 4.

[0058] The first signal probe hole 215 may include a first signal probe receiving hole 2151 formed in the first base member 211 and a first signal probe support hole 2152 formed in the first insulating member 212. The first signal probe receiving hole 2151 is formed to have a diameter larger than that of the cylinder 51 of the signal probe 5, thereby receiving the signal probe 5 without contact. The first signal probe support hole 2152 may support the first end of the cylinder 51 of the signal probe 5.

[0059] The lower block 22 may include a second power probe hole 223, a second ground probe hole 224 and a second signal probe hole 225, to accommodate and support the lower portion of the power probe 3 under contact conditions, accommodate and support the lower portion of the ground probe 4 under non-contact conditions and accommodate and support the lower portion of the signal probe 5 under non-contact conditions, respectively.

[0060] The second power probe hole 223 may include a second power probe receiving hole 2231 formed in the second base member 221 and a second power probe support hole 2232 formed in the second insulating member 222. The second power probe receiving hole 2231 is formed to have the same diameter as the cylinder 31 of the power probe 3, thereby receiving the power probe 3 under contact conditions. The second power probe support hole 2232 can support the second end of the cylinder 31 of the power probe 3.

[0061] The second grounding probe hole 224 may include a second grounding probe receiving hole 2241 formed in the second base member 221 and a second grounding probe support hole 2242 formed in the second insulating member 222. The second grounding probe receiving hole 2241 is formed to have a diameter larger than that of the cylinder 41 of the grounding probe 4, thereby receiving the grounding probe 4 without contact. The second grounding probe support hole 2242 can support the second end of the cylinder 41 of the grounding probe 4.

[0062] The second signal probe hole 225 may include a second signal probe receiving hole 2251 formed in the second base member 221 and a second signal probe support hole 2252 formed in the second insulating member 222. The second signal probe receiving hole 2251 is formed to have a diameter larger than that of the cylinder 51 of the signal probe 5, thereby receiving the signal probe 5 without contact. The second signal probe support hole 2252 can support the second end of the cylinder 51 of the signal probe 5.

[0063] The gap member 23 may include a third power probe hole 233, a third ground probe hole 234 and a third signal probe hole 235. The third power probe hole 233, the third ground probe hole 234 and the third signal probe hole 235 respectively accommodate and support the middle part of the power probe 3, the ground probe 4 and the signal probe 5 under contact conditions.

[0064] The third power probe hole 233 is formed to have the same diameter as the cylinder 31 of the power probe 3, thereby accommodating the power probe 3 under contact conditions.

[0065] The third grounding probe hole 234 is formed to have the same diameter as the cylinder 41 of the grounding probe 4, thereby accommodating the grounding probe 4 under contact conditions.

[0066] The third signal probe hole 235 is formed to have the same diameter as the cylinder 51 of the signal probe 5, thereby accommodating the signal probe 5 under contact conditions.

[0067] The first base member 211 may include a first groove 2111 on its bottom side (i.e., on the surface to which the gap member 23 is coupled) that is shaped like a quadrangular band and accommodates the first elastic member 2112.

[0068] The second base member 221 may include a second groove 2211 on its top side (i.e., on the surface to which the gap member 23 is coupled) that is shaped like a quadrilateral band and accommodates the second elastic member 2212.

[0069] The gap member 23 may include a component receiving hole 231 to receive the electronic component 6. The component receiving hole 231 is formed to have the same diameter as the electronic component 6, thereby firmly supporting the electronic component 6.

[0070] Figures 6 to 9 It shows the manufacturing process. Figure 1 The diagram shows the method of test stand 1.

[0071] like Figure 6 As shown, the first insulating member 212 is bonded to the top side of the first base member 211, thereby forming the upper block 21. Similarly, the second insulating member 222 is bonded to the bottom side of the second base member 221, thereby forming the lower block 22. Here, the bonding can be performed, for example, using a thermosetting adhesive sheet 7 or by insert injection molding.

[0072] like Figure 7 As shown, a first power probe hole 213, a first ground probe hole 214, and a first signal probe hole 215 can be formed on the upper block 21, for example, using a drill, and a second power probe hole 223, a second ground probe hole 224, and a second signal probe hole 225 can be formed on the lower block 22. Furthermore, the first groove 2111 and the second groove 2211 are formed such that the first elastic member 2112 and the second elastic member 2212 are respectively inserted into the upper block 21 and the lower block 22.

[0073] like Figure 8As shown, a component receiving hole 231 for accommodating and supporting the electronic component 6 and a third power probe hole 233, a third ground probe hole 234 and a third signal probe hole 235 for accommodating and supporting the middle portions of the power probe 3, the ground probe 4 and the signal probe 5 respectively can be formed by drilling, for example, in the gap member 23.

[0074] like Figure 9 As shown, power probe 3, ground probe 4, signal probe 5, and electronic component 6 are respectively inserted into the first power probe hole to the third power probe hole 213, 223, and 233, the first ground probe hole to the third ground probe hole 214, 224, and 234, the first signal probe hole to the third signal probe hole 215, 225, and 235, and the component receiving hole 231. The first elastic member 2112 and the second elastic member 2212 are respectively inserted into the first groove 2111 and the second groove 2211, and then the upper block 21 and the lower block 22 are coupled under the condition that there is a gap member 23 between the upper block 21 and the lower block 22.

[0075] As described above, with the first base member 211 coupled to the first insulating member 212, the first power probe hole 213, the first ground probe hole 214, and the first signal probe hole 215 are drilled in the upper block 21 in one go. With the second base member 221 coupled to the second insulating member 222, the second power probe hole 223, the second ground probe hole 224, and the second signal probe hole 225 are drilled in the lower block 22 in one go. This reduces errors caused by machining and alignment, even when multiple probe holes are formed in the test socket 1. Therefore, the signal probe 5 can be supported aligned with the central axis of the first to third signal probe holes 215, 225, and 235, thus improving insertion loss, return loss, crosstalk or isolation, Z-impedance, inductance, and similar characteristics.

[0076] Figure 10 This is a diagram showing the test fixture 2 according to a second embodiment of the present disclosure.

[0077] Reference Figure 10 The power probe 3 can be supported in the upper block 21 when in contact and in the lower block 22 when not in contact. Similarly, the ground probe 4 can be supported in the upper block 21 when not in contact and in the lower block 22 when in contact. Therefore, during testing, the upper block 21 maintains a positive polarity and the lower block 22 maintains a negative polarity, allowing the capacitor placed on the conductive path that electrically connects the upper block 21 and the lower block 22 to alternate between charging and discharging.

[0078] Figure 11 This is a graph showing a comparison of the Z-impedance between a conventional coaxial test socket and a test socket according to an embodiment of the present disclosure.

[0079] In test socket 1, it is desirable to have the lowest possible Z-impedance. (Refer to...) Figure 11 A conventional coaxial test socket has a Z impedance of 1.83 ohms at a frequency of 1 GHz, while the test socket according to the embodiments of this disclosure has a Z impedance of 0.86 ohms at a frequency of 1 GHz, which is only half of the conventional Z impedance.

[0080] Figure 12 This is a diagram showing the test fixture 1 according to a third embodiment of the present disclosure. Below, [the diagram is] related to... Figure 4 The same components as those in the test socket 1 of the first embodiment shown will be given the same reference numerals and will not be described again.

[0081] Reference Figure 12 The upper block 21 may include a first groove 2111 recessed on the bottom side of the first base member 211 and a spring 2113 placed in the first groove 2111.

[0082] The lower block 22 may include a contact member 2214 made of conductive material and filled in a through hole 2213 that penetrates the first groove 2111 at the corresponding location.

[0083] The contact member 2214 includes a lower end portion that contacts the top side of the test circuit board (not shown).

[0084] When numerous electronic components 6 are present, multiple springs 2113 apply very high pressure. If a recess is formed instead of a through hole, the high pressure is applied to the lower block 22, resulting in the decoupling of the upper block 21 from the lower block 22 or widening of the gap between the upper block 21 and the lower block 22. Therefore, a contact member 2214 is inserted into the through hole 2213 so that the pressure applied to the springs 2113 can be applied to the test circuit board that contacts the contact member 2214.

[0085] According to embodiments of this disclosure, a method for manufacturing a test socket shortens the power supply path using a simple structure.

[0086] Furthermore, since the upper and lower brass blocks are in direct contact with the electronic components, the test socket according to the embodiment improves heat dissipation and current capacity.

[0087] In the foregoing description, the advantages of this disclosure have been illustrated with reference to specific embodiments. However, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the scope of the disclosure as defined in the appended claims. Therefore, the description and drawings should be interpreted as examples of this disclosure, and not as limitations thereof. All such possible modifications should be made within the scope of this disclosure.

Claims

1. A test socket, comprising: The first component includes a first base component made of conductive material and a first insulating component made of insulating material; The second part includes a second base component made of conductive material and a second insulating component made of insulating material; The gap member, made of insulating material, is sandwiched between the first block and the second block; The first probe is supported so as to contact the first base component but not the second base component; The second probe is supported so as not to contact the first base component but to contact the second base component; as well as An electronic component is disposed within the gap member and placed on a conductive path that electrically connects the first base member and the second base member. The gap member includes a component receiving hole, and the electronic component is received in the component receiving hole.

2. The test socket according to claim 1, wherein the first terminal and the second terminal of the electronic component are received in the component receiving hole to be exposed.

3. The test fixture according to claim 2, wherein the first base member and the second base member include a first groove and a second groove at positions corresponding to the exposed first terminal and the exposed second terminal, respectively.

4. The test socket according to claim 3 further includes a first terminal contact portion and a second terminal contact portion, the first terminal contact portion and the second terminal contact portion being respectively disposed in the first groove and the second groove, and respectively enabling the first base component and the second base component to be electrically connected to the exposed first terminal and the exposed second terminal.

5. The test socket according to claim 4, wherein the first terminal contact portion and the second terminal contact portion respectively include a first conductive elastic member and a second conductive elastic member.

6. The test holder according to claim 3 further includes springs, the springs being disposed in the first groove and the second groove respectively, and respectively connecting the first base member and the second base member to the exposed first terminal and the exposed second terminal.

7. The test fixture according to claim 1, wherein... The first base component includes a first probe receiving hole for accommodating the first probe under non-contact conditions and a second probe receiving hole for accommodating the second probe under contact conditions, and The second base component includes a first probe receiving hole for receiving the first probe under contact conditions and a second probe receiving hole for receiving the second probe under non-contact conditions.

8. A test socket, comprising: The first component includes a first base component made of conductive material and a first insulating component made of insulating material; The second part includes a second base component made of conductive material and a second insulating component made of insulating material; The gap member, made of insulating material, is sandwiched between the first block and the second block; The first probe is supported so as not to contact the first base component but to contact the second base component; The second probe is supported so that it contacts the first base component but does not contact the second base component; as well as An electronic component is disposed within the gap member and placed on a conductive path that electrically connects the first base member and the second base member. The gap member includes a component receiving hole, and the electronic component is received in the component receiving hole.

9. A method of manufacturing a test socket, the test socket supporting a first probe and a second probe retractable in a longitudinal direction, the method comprising: A first block having a plate shape is formed by bonding a first base component made of conductive material to a first insulating component made of insulating material. A second plate-shaped block is formed by bonding a second base component made of conductive material to a second insulating component made of insulating material. A first probe hole and a second probe hole are formed in the first block to support the first side of the first probe under non-contact conditions and support the first side of the second probe under contact conditions. A third probe hole and a fourth probe hole are formed in the second block to support the second side of the first probe under contact conditions and to support the second side of the second probe under non-contact conditions. A fifth probe hole and a sixth probe hole are formed in a gap member that is an insulating material to accommodate and support the middle portions of the first probe and the second probe, and a component receiving hole is formed in the gap member that is an insulating material to accommodate electronic components whose first and second terminals are exposed. as well as The first probe is inserted into the first probe hole, the third probe hole, and the fifth probe hole, and the second probe is inserted into the second probe hole, the fourth probe hole, and the sixth probe hole. With the electronic component inserted into the component receiving hole, the first block and the second block are coupled together with the gap member between the first block and the second block.

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