Adsorption mechanism, article manufacturing apparatus, semiconductor manufacturing apparatus

Abstract

Provided is an adsorption mechanism including: a tool (21) capable of adsorbing a workpiece (11) by suction; a tool holder (22) having a suction path (116); and a positioning portion (117) that aligns a relative position of the tool (21) with respect to the tool holder (22) in a case where the tool holder (22) holds the tool (21). The positioning portion (117) includes at least one protrusion (102) disposed on one of the tool (21) and the tool holder (22) and formed of an elastic material and having a tapered surface (107), and at least one recess (112) disposed on the other of the tool (21) and the tool holder (22) and capable of fitting with the protrusion (102).

Description

Technical Field

[0001] The present invention relates to apparatus and methods for mounting, for example, semiconductor chips on lead frames, etc. Background Technology

[0002] Various forms of electronic devices exist, many of which include, for example, semiconductor packages in which semiconductor chips are mounted on lead frames, or circuit packages in which electronic components such as semiconductor chips are mounted on circuit boards. Semiconductor packages and circuit packages are manufactured through processes such as the following: First, a large number of integrated circuits are formed on a semiconductor wafer. In a slicing step, the semiconductor wafer is cut into semiconductor chips (bare chips). Then, in a mounting step, electronic components such as semiconductor chips (bare chips) are mounted onto lead frames or circuit boards. The apparatus used in this mounting step is a chip mounting apparatus, i.e., a so-called chip mounter. A chip mounter is an apparatus that mounts electronic components onto lead frames or substrates using mounting materials such as solder, gold, or resin. However, in some cases, a chip mounter can also be used to mount electronic components onto another mounted electronic component and mount it onto that component.

[0003] For example, in the case of mounting electronic components onto the surface of a substrate or the like using a chip mounter, a suction nozzle called a chuck is used to pick up and hold the electronic components and transport them to a predetermined position for mounting. Then, mounting is performed by heating the mounting material. The chuck can be used solely for picking up and transporting the electronic components, or it can be used to apply pressure to the electronic components during mounting. A chuck is a holder that includes suction holes and holds the electronic components by drawing in air; chucks suitable for the size and shape of the electronic components to be held are used.

[0004] In such chip mounting machines, when the type of electronic component to be mounted changes, the chuck needs to be replaced with a chuck whose size and shape are suitable for the changed electronic component. Furthermore, even when continuously mounting the same type of electronic component, it is necessary to replace the chuck periodically to prevent wear and damage to the surface of the electronic component, or to prevent contamination from adhering to the chuck and polluting the surface of the electronic component. Therefore, in the field of chip mounting machines, a device configured to replace tools such as chucks is known.

[0005] For example, Patent Document 1 discloses a mounting head in which the chuck is detachably held by being fitted to a chuck holder. A through slit (through opening) is formed in the chuck holder, to which a retaining pin is attached. The chuck is locked to the chuck holder by engaging the retaining pin with a locking groove of the chuck.

[0006] Furthermore, Patent Document 2 discloses a semiconductor manufacturing apparatus including a chuck replacement section for changing chucks, wherein the chuck replacement section includes an opening / closing arm having a claw structure and a chuck holding section. In this apparatus, a chuck holder includes a claw release section, and the chuck is attached to or detached from the chuck holder by controlling the opening / closing arm.

[0007] Furthermore, Patent Document 3 discloses a mounting apparatus in which a mounting tool is detachably held by being adsorbed by a mounting head. A method is described in which a suction device for adsorbing the mounting tool is provided on the lower end face of a tool holder, and in response to adsorbing the tool during tool replacement, the tool holder and the tool housing move horizontally relative to each other to correct the adsorption position of the mounting tool.

[0008] Citation List

[0009] Patent documents

[0010] Patent Document 1: JP H10-135251A

[0011] Patent Document 2: JP 2018-206843 A

[0012] Patent Document 3: JP 2004-200443 A Summary of the Invention

[0013] Technical issues

[0014] To pick up and hold electronic components, transport them while holding them, and apply sufficient pressure during placement, the chuck needs to exert enough suction to hold the components during operation. If air leaks in the suction path leading to the suction port, insufficient suction cannot be achieved. However, in conventional chip placement machines, air leaks may occur when changing chucks, potentially reducing suction power.

[0015] For example, in the mounting head described in Patent Document 1, the suction path is formed by assembling a rigid chuck and chuck holder. During assembly, if the chuck and chuck holder are attempted to assemble without proper alignment, the assembly surface may come into contact with the non-assembly surface and be damaged, or the corners and smooth surfaces of the assembly structure may come into contact with each other, causing damage to each assembly part. Furthermore, if the machining accuracy of the corners and assembly surfaces included in the assembly part is insufficient, damage due to contact may occur during the assembly operation. Therefore, when replacing the chuck, the airtightness of the assembly surface may be insufficient, air leakage may occur, and the mounting operation may not be performed well.

[0016] Furthermore, the semiconductor manufacturing apparatus described in Patent Document 2 has similar problems. Specifically, if an attempt is made to assemble the chuck and chuck holder by operating the opening and closing arms while the chuck is not properly aligned, the assembly surface may come into contact with and be damaged by the non-assembly surface, or the corners and smooth surfaces of the assembly structure may come into contact with each other, damaging the assembly parts. Moreover, if the machining accuracy of the corners and assembly surfaces included in the assembly part is insufficient, damage due to contact may occur during the assembly operation. Therefore, when replacing the chuck, the airtightness of the assembly surface may be insufficient, air leakage may occur, and the placement operation may not be performed well.

[0017] Furthermore, although the mounting apparatus described in Patent Document 3 holds the mounting tool by adsorption, air leakage may occur from tiny gaps if the machining accuracy of the lower end face of the tool holder and the upper surface of the tool is insufficient. Therefore, when changing tools, repeated tool attachment adjustments are required, and mounting operations may not be performed well until a holding orientation with less air leakage is determined.

[0018] Furthermore, in chip mounting machines, the lead frame, which serves as the target for mounting electronic components, can be held in place by a lead frame holder using magnetic attraction. When the type of lead frame changes, the lead frame holder needs to be replaced; however, in this case, similar to the replacement of the chuck described above, air leakage may occur.

[0019] Therefore, there is a need for a chip mounting machine in which, when changing the tool for adsorbing the workpiece (e.g., a chuck or lead frame holder), the tool can be attached in a leak-free state without excessive burden for alignment operations.

[0020] Solution to the problem

[0021] One aspect of the present invention is an adsorption mechanism comprising a tool configured to adsorb a workpiece by suction, a tool holder including a suction path, and a positioning portion that positions the tool relative to the tool holder while the tool holder holds the tool, wherein the positioning portion includes at least one protrusion disposed on one of the tool and the tool holder and at least one recess disposed on the other of the tool and the tool holder and configured to mate with the protrusion, the at least one protrusion being formed of an elastic material and including a tapered surface.

[0022] Another aspect of the invention is an adsorption mechanism comprising a tool configured to adsorb a workpiece by suction, a tool holder including a suction path, a holding device such that the tool holder detachably holds the tool by magnetic force, and a flexible member configured to hermetically connect the tool and the suction path when the tool holder holds the tool by magnetic force.

[0023] Beneficial effects of the invention

[0024] According to the present invention, a chip mounting machine can be provided in which, when the tool for adsorbing the workpiece (e.g., a chuck or lead frame holder) is changed, the tool can be attached in a leak-free state during attachment without excessive burden for alignment operations.

[0025] Other features and advantages of the invention will become apparent from the following description with reference to the accompanying drawings. Note that in the drawings, the same or similar constructions are indicated by the same reference numerals. Attached Figure Description

[0026] Figure 1 This is a schematic perspective view of a chip mounting machine according to one embodiment.

[0027] Figure 2 This is a schematic cross-sectional view showing the lead frame holding mechanism of a chip mounting machine according to the first embodiment.

[0028] Figure 3 This is a perspective view of the adsorption mechanism according to the first embodiment.

[0029] Figure 4 This is a cross-sectional view of the adsorption mechanism according to the first embodiment.

[0030] Figure 5A This is a cross-sectional view showing the state of the chuck in the adsorption mechanism according to the first embodiment before it is attached to the chuck holder.

[0031] Figure 5B This is a cross-sectional view showing the state in which the chuck is attached to the chuck holder (held by the chuck holder) in the adsorption mechanism according to the first embodiment.

[0032] Figure 5C This is a cross-sectional view showing the state in which the chuck adsorbs a semiconductor chip in the adsorption mechanism according to the first embodiment.

[0033] Figure 6 This is a top view of the chuck and chuck retainer according to the first embodiment, viewed from the Z direction.

[0034] Figure 7A This is a view of the chuck moving above the semiconductor chip.

[0035] Figure 7B This is a view of the chuck holding the semiconductor chip.

[0036] Figure 7C This is a view of the chuck picking up a semiconductor chip.

[0037] Figure 8A This is a top view of one of the assembly parts, viewed from the Z direction.

[0038] Figure 8B It is a cross-sectional view showing the state before the convex and concave parts are assembled together.

[0039] Figure 9A It is a cross-sectional view showing the state before assembly.

[0040] Figure 9B This is a view showing the state in which the chuck (protrusion) and the position control unit are in contact.

[0041] Figure 9C This is a view showing the chuck (protrusion) and chuck retainer (recess) in a close proximity.

[0042] Figure 9D This is a view showing the state in which the chuck (protrusion) and the chuck retainer (recess) are in contact with each other.

[0043] Figure 9E This is a view showing the state after assembly is complete.

[0044] Figure 10 This is a top view of the chuck and chuck holder according to the first variant of the first embodiment, viewed from the Z direction.

[0045] Figure 11A This is a cross-sectional view showing the state before assembly in a second variant of the first embodiment.

[0046] Figure 11B This is a view showing the state in which the chuck (protrusion) and the chuck holder (recess) are in contact with each other in a second variant of the first embodiment.

[0047] Figure 11C This is a view showing the completed assembly state in a second variant of the first embodiment.

[0048] Figure 12A This is a cross-sectional view showing the state before assembly in a third variant of the first embodiment.

[0049] Figure 12B This is a view showing the state in which the chuck (protrusion) and the chuck holder (recess) are in contact with each other in a third variation of the first embodiment.

[0050] Figure 12C This is a view showing the completed assembly state in a third variant of the first embodiment.

[0051] Figure 13A This is a cross-sectional view showing the state before assembly in the fourth variant of the first embodiment.

[0052] Figure 13B This is a view showing the state in which the chuck (protrusion) and the chuck holder (recess) are in contact with each other in the fourth variant of the first embodiment.

[0053] Figure 13C This is a view showing the completed assembly state in the fourth variant of the first embodiment.

[0054] Figure 13D This is a plan view of the protrusion in the fourth variant of the first embodiment.

[0055] Figure 14 This is a schematic plan view showing the lead frame holding mechanism according to the second embodiment.

[0056] Figure 15 This is a schematic cross-sectional view showing the lead frame holding mechanism according to the second embodiment.

[0057] Figure 16 This is a top view of the chuck and chuck holder of the fifth variant according to the first embodiment, viewed from the Z direction.

[0058] Figure 17 This is a top view of the chuck and chuck holder of the sixth variant according to the first embodiment, viewed from the Z direction.

[0059] Figure 18 This is a top view of the chuck and chuck holder of the seventh variant according to the first embodiment, viewed from the Z direction.

[0060] Figure 19 This is a top view of the chuck and chuck holder of the eighth variant according to the first embodiment, viewed from the Z direction.

[0061] Figure 20 This is a top view of the chuck and chuck holder of the ninth variant according to the first embodiment, viewed from the Z direction.

[0062] Figure 21 This is a top view of the chuck and chuck holder according to the tenth variation of the first embodiment, viewed from the Z direction.

[0063] Figure 22 This is a perspective view of the adsorption mechanism according to the third embodiment.

[0064] Figure 23 This is a cross-sectional view of the adsorption mechanism according to the third embodiment.

[0065] Figure 24A This is a cross-sectional view showing the state of the chuck in the adsorption mechanism according to the third embodiment before it is attached to the chuck holder.

[0066] Figure 24B This is a cross-sectional view showing the state in which the chuck is attached to the chuck holder (held by the chuck holder) in the adsorption mechanism according to the third embodiment.

[0067] Figure 24C This is a cross-sectional view showing the state in which the chuck adsorbs a semiconductor chip in the adsorption mechanism according to the third embodiment.

[0068] Figure 25 This is a top view of the chuck and chuck retainer according to the third embodiment, viewed from the Z direction.

[0069] Figure 26 This is a schematic plan view showing the lead frame holding mechanism according to the fourth embodiment.

[0070] Figure 27 This is a schematic cross-sectional view showing the lead frame holding mechanism according to the fourth embodiment. Detailed Implementation

[0071] An adsorption mechanism, an article manufacturing apparatus, a semiconductor manufacturing apparatus, etc., according to embodiments of the present invention will be described with reference to the accompanying drawings.

[0072] Note that in the accompanying drawings referenced in the following description of the embodiments, unless otherwise stated, elements indicated by the same reference numerals have the same or similar functions.

[0073] [First Embodiment]

[0074] Figure 1 This is a schematic perspective view used to describe a chip mounting machine according to one embodiment. The chip mounting machine 100, as a semiconductor manufacturing apparatus, is a device that picks up a semiconductor chip 11 (bare chip) as a workpiece, transfers the semiconductor chip to an island 42 provided on a lead frame 41 as a mounting target component, places the semiconductor chip, and performs mounting. Note that... Figure 1 This is a schematic diagram obtained by removing a portion of the chip mounting machine 100 for the purpose of describing the present invention. Certain mechanical and electrical components, such as housing, mounting base, power supply, etc., provided for functioning as an actual device are not shown.

[0075] (Structure of a chip mounting machine)

[0076] The chip placement machine 100 includes a wafer support device 14, a chuck 21, a chuck holder 22, a placement arm 23, a conveyor 24, a supply camera 31, an island camera 32, and a control unit 200.

[0077] The control unit 200 is a computer used to control the operation of the chip placement machine 100. Internally, it includes a central processing unit (CPU), read-only memory (ROM), random access memory (RAM), I / O ports, etc.

[0078] Programs for performing various types of processing according to this embodiment can be stored in ROM along with other programs, but can also be loaded into RAM from an external source via a network. Alternatively, the programs can be loaded into RAM via a recording medium on which they are recorded.

[0079] The I / O ports connect to external devices or networks and can input or output data, such as data required for chip placement, from an external computer. Furthermore, the I / O ports connect to a monitor or input device (not shown) and can display the chip placement machine's operating status information to the operator or receive commands from the operator.

[0080] The control unit 200 is connected to the components, including the mounting arm 23, the conveyor 24, the supply camera 31, and the island camera 32, and controls these components via control signals.

[0081] The wafer support device 14 is a device that supports semiconductor wafers 13 that have been diced (divided) into a large number of semiconductor chips 11. In the wafer support device 14, a predetermined area on which the semiconductor wafers 13 are placed is called a supply section 12, from which semiconductor chips 11 for chip mounting are supplied.

[0082] The chuck 21 (tool) includes an adsorption section configured to adsorb the semiconductor chip 11 (workpiece). Specifically, an adsorption hole configured to perform vacuum suction is provided on the lower end face of the chuck 21. The semiconductor chip 11 can be adsorbed by bringing the lower end face close to or in contact with the semiconductor chip 11 and drawing the semiconductor chip 11 from the adsorption hole. Furthermore, if the vacuum suction is released after adsorption, the adsorbed semiconductor chip 11 can be released.

[0083] The chuck holder 22 (tool holder) is a retaining mechanism that detachably holds the chuck 21 (tool). The chuck 21, which is adapted to the size and shape of the semiconductor chip 11 to be attached, is attached to the chuck holder 22. As will be described in detail below, in the chip placement machine 100 of this embodiment, the chuck 21 is held by the chuck holder 22 by magnetic force.

[0084] The chuck holder 22 includes a suction path, and when the chuck 21 is held by the chuck holder 22, the suction port of the chuck 21 is connected to the suction path of the chuck holder 22. By supplying negative pressure from a vacuum pump or the like to the suction port of the chuck 21 via the suction path, the chuck 21 can adsorb the semiconductor chip 11. As will be described in detail below, the chip placement machine 100 of this embodiment includes a flexible member for hermetically connecting the suction port of the chuck 21 and the suction path of the chuck holder 22 when the chuck 21 is held by magnetic force.

[0085] The chuck holder 22 is connected to the mounting arm 23, which includes a movable mechanism for adjusting the position and orientation of the chuck holder 22. For example, to pick up a semiconductor chip 11 from the supply section 12, the mounting arm 23 adjusts the height of the chuck holder 22 so that the lower end face of the chuck 21 approaches or contacts the semiconductor chip 11 to be picked up. Furthermore, to mount the semiconductor chip 11 onto the island 42 of the lead frame 41, the mounting arm 23 adjusts the position and orientation of the chuck holder 22 so that the semiconductor chip 11 held by the chuck 21 approaches or contacts the island 42. Additionally, the position and orientation of the chuck holder 22 can be adjusted so that the semiconductor chip 11 is pressed against the island 42 using appropriate force.

[0086] The placement arm 23 is connected to the transport section 24, which allows the placement arm 23 to move, enabling the chuck 21 to move freely between the supply section 12 of the wafer support device 14 and the island section 42 of the lead frame 41. The transport section 24 allows the placement arm 23 to move along each of the X, Y, and Z directions, as well as in the θ direction about the Z-axis.

[0087] The supply unit camera 31 is configured to image the area surrounding the supply unit 12. To view the position and orientation of the semiconductor chip 11 placed on the supply unit 12, and to view the position and orientation of the chuck 21 used to pick up the semiconductor chip 11, the supply unit camera 31 sends image data to the control unit 200. To perform a pick-up operation via the chip mounter 100, the control unit 200 uses the image data sent from the supply unit camera 31 to control the position and orientation of the chuck 21.

[0088] The island camera 32 is a camera configured to image the vicinity of the island 42 of the lead frame 41. To view the position and orientation of the island 42 or the position and orientation of the chuck 21 used for mounting the semiconductor chip 11, the island camera 32 sends image data to the control unit 200. To perform the mounting operation via the chip mounter 100, the control unit 200 uses the image data sent from the island camera 32 to control the position and orientation of the chuck 21.

[0089] (Chip mounting method)

[0090] Before describing each part of the chip mounter 100 in more detail, an outline of the chip mounting method using the chip mounter 100 will be described.

[0091] First, as preparation for chip mounting, the semiconductor chip 11, which serves as the workpiece, is placed on the supply section 12. Furthermore, a lead frame 41, which serves as the mounting target component, is provided on the lead frame holding body 40, which serves as the mounting target component holding section (see below). Figure 2 (Description)

[0092] Then, the control unit 200 of the chip placement machine 100 causes the supply unit camera 31 to image the semiconductor chip 11 to be picked up, to view the position and orientation of the semiconductor chip 11, and drives the transfer unit 24 and the placement arm 23 to move the chuck 21.

[0093] In such Figure 7A After positioning the chuck 21 above the semiconductor chip 11, as shown... Figure 7B The chuck 21 is lowered to bring its lower end face close to or in contact with the semiconductor chip 11, and the semiconductor chip 11 is adsorbed by suction through the adsorption hole. Then, as shown... Figure 7C As shown, the chuck 21 is raised to pick up the semiconductor chip 11. At this time, the control unit 200 can perform feedback control on the operation of the transfer unit 24, the mounting arm 23, the suction mechanism, etc., based on the image data obtained by imaging through the supply unit camera 31.

[0094] Furthermore, the control unit 200 causes the island camera 32 to image the island 42 (at a predetermined position) to be mounted, and to view the position and orientation of the island. Then, the drive unit 24 and the mounting arm 23 are activated, causing the chuck 21 that holds the semiconductor chip 11 to move above the island 42 (e.g., along...). Figure 1 (The route indicated by the arrow in the image).

[0095] Then, by lowering the chuck 21 to bring the semiconductor chip 11 into contact with or near the island 42 and stopping the suction, the semiconductor chip 11 can be placed on the island 42. Afterwards, the mounting material is heated, thereby mounting the semiconductor chip 11 onto the lead frame 41. Note that the control unit 200 can control the mounting arm 23 so that the chuck 21 presses the semiconductor chip 11 against the lead frame 41 during mounting. At this time, the control unit 200 can perform feedback control on the operation of the transport unit 24, the mounting arm 23, the suction mechanism, the heating mechanism, etc., based on image data obtained by imaging through the island camera 32.

[0096] After mounting one semiconductor chip using the above procedure, the chip mounter 100 sequentially picks up another semiconductor chip and mounts it onto a predetermined island. Note that the target for chip mounting is not limited to the island of the lead frame; for example, the first semiconductor chip can be mounted onto a second semiconductor chip mounted on the lead frame.

[0097] (Leader frame holding mechanism)

[0098] Next, the mechanism for holding the lead frame 41, which is the target component for installation, will be described. Figure 2 It is along Figure 1 A schematic cross-sectional view of the retaining mechanism taken along the YZ plane.

[0099] like Figure 2 As shown, the lead frame 41 is held by the lead frame holding body 40. The lead frame holding body 40 includes a track portion 40b surrounding the lead frame 41 and a receiving portion 40a supporting the bottom surface of the lead frame 41, and detachably holds the lead frame 41.

[0100] The track section 40b is a position control section that controls the position of the lead frame 41 on the horizontal plane, ensuring that the position falls within a predetermined range. For example, in order to control the position of the lead frame 41 in a certain area ( Figure 1 (Not shown in the image) The lead frame 41 is placed in the lead frame holding body 40 and the lead frame 41 is moved to... Figure 1 The position shown controls the position of the lead frame 41 so that the island 42 does not deviate from the dimensions of the semiconductor chip 11. Specifically, for example, in the Y direction, the position and shape of the track portion 40b are determined such that a gap of approximately 0.5 mm is maintained even when the lead frame is at its maximum size within the dimensional tolerance.

[0101] (Adsorption mechanism)

[0102] Next, we will refer to Figures 3 to 6 , Figure 8A and Figure 8B , Figure 9A and Figure 9B The adsorption mechanism for picking up the semiconductor chip 11 as a workpiece is described. Note that in the chip placement machine of this embodiment, a dedicated chuck is prepared for each type of workpiece (semiconductor chip), and the chuck corresponding to the workpiece to be placed is selected and attached to the chuck holder to form the adsorption mechanism.

[0103] Figure 3 This is a perspective view of the adsorption mechanism, which includes a clamp 21, a clamp holder 22, and a mounting arm 23. The clamp holder 22 detachably holds the clamp 21. Figure 3The image shows the state of the chuck 21 after it has been removed from the chuck holder 22.

[0104] The mounting arm 23 includes a Z-direction actuator 121 for moving the chuck 21 and chuck holder 22 in the Z-direction. The Z-direction actuator 121 can perform Z-direction movement operations and press load feedback control for mounting under the control of the control unit 200. To perform operations such as picking up, placing, and mounting the semiconductor chip 11, the Z-direction actuator 121 is operated to raise and lower the chuck. At this time, the operation of the Z-direction actuator is controlled by press load feedback so that no force equal to or greater than a predetermined load is applied and the semiconductor chip 11 is not deformed or damaged.

[0105] Figure 4 By along Figure 3 The schematic cross-sectional view obtained by cutting through the chuck 21 and chuck holder 22 along the curved line BB (i.e., the route through the protrusion 102c, the suction path 108 and the protrusion 102a). Figure 6 This is a top view of the chuck 21 and chuck retainer 22 as viewed from the Z direction.

[0106] The chuck 21 includes a chuck base 103, protrusions 102a, 102b, and 102c, support surfaces 104a, 104b, and 104c, position control units 117a, 117b, and 117c, and a workpiece adsorption unit 106 as components, which are integrated into one unit. The chuck 21 includes a suction path 108 that penetrates the interior, and a suction hole 109 for adsorbing the semiconductor chip 11 is arranged at the lower end of the suction path 108.

[0107] The chuck retainer 22 includes recesses 112a, 112b, and 112c, a magnet 113, and support surfaces 114a, 114b, and 114c as components, which are integrated into one unit. The chuck retainer 22 includes a suction path 116 that extends through its interior, and the suction path 116 is connected to a negative pressure application mechanism (vacuum pump, control valve, etc.) (not shown).

[0108] The magnet 113 of the chuck holder 22 and the chuck base 103 are arranged facing each other, and the chuck base 103 is formed of a ferromagnetic material. To attach the chuck 21 to the chuck holder 22, the magnetic force of the magnet 113 attracts the chuck base 103, and the chuck holder 22 detachably holds the chuck 21. Note that in this embodiment, the mechanism for detachably holding the chuck using magnetic force is not limited to this construction; for example, a magnet may be included in the chuck, and the chuck holder may be formed of a ferromagnetic material.

[0109] Alternatively, a first magnet may be included in one of the chuck and the chuck holder, and a second magnet may be included in the other, with the first and second magnets arranged such that their opposite magnetic poles face each other.

[0110] The holding force used to hold the chuck by the chuck holder is set to a level that can stably hold the chuck during a series of placement operations without requiring excessive external force to remove it, and a magnet with a magnetic force set accordingly is used. This is to make attaching and removing the chuck easier and to prevent accidental damage due to excessive external force.

[0111] like Figure 6 As shown, magnets 113 are arranged symmetrically around the suction path 116, so that the necessary holding force is applied evenly to each part of the chuck and chuck holder. However, other methods can be used to arrange the magnets as long as the necessary holding force can be applied evenly. Note that permanent magnets are used as magnets 113, but electromagnets can also be used as long as they can be installed.

[0112] In the adsorption mechanism of this embodiment, a flexible member 115 capable of elastic deformation is arranged between the clamp 21 and the clamp holder 22. Figure 4 In the example, the flexible member 115 is fixed to the recess of the chuck retainer 22, but it can also be fixed to the chuck 21, or it can be clamped between the chuck retainer 22 and the chuck 21 without being fixed to the chuck retainer 22 or the chuck 21.

[0113] like Figure 6 As shown, the flexible member 115 is an annular member and, when viewed from above in the Z direction, has a circular shape surrounding the suction path 108 of the chuck 21 and the suction path 116 of the chuck holder 22. Note that the shape of the ring when viewed from above is not limited to a circle and can also be other shapes, but a symmetrical shape is preferred from the perspective of stability and reproducibility of elastic deformation, and in particular, a circle is preferred.

[0114] When the chuck 21 is held by the chuck holder 22 with a holding force sufficient to remove it without requiring excessive external force, the flexible member 115 elastically deforms to make close contact with both the upper end face of the chuck 21 and the lower end face of the chuck holder 22. In other words, the flexible member 115 is formed of a material that can easily elastically deform using the aforementioned holding force, and can airtightly connect the suction path 108 and the suction path 116 (connecting them to seal off the atmosphere). Therefore, the flexible member 115 can comprise any of materials such as rubber, porous resin, or magnetic fluid. Preferably, the annular flexible member 115 is arranged concentrically around the suction path 116. This is because even with a weaker suction force, the flexible member 115 can elastically deform uniformly along the suction direction.

[0115] (Method for attaching clamps)

[0116] Next, we will refer to Figures 5A to 5C as well as Figure 6 The method for attaching the chuck 21 to the chuck retainer 22 is described.

[0117] Figures 5A to 5C By along Figure 3 The schematic cross-sectional view obtained by cutting through the chuck 21 and chuck holder 22 along the curved line BB (i.e., the route through protrusion 102c, suction path 108, and protrusion 102a). For ease of illustration, the dimensions and shapes of the parts are shown non-scale.

[0118] Figure 5A This shows the state before the chuck 21 is attached to the chuck holder 22. Figure 5B The state in which the chuck 21 is attached to the chuck retainer 22 (held by the chuck retainer 22) is shown. Figure 5C The state in which the chuck 21 held by the chuck holder 22 holds the semiconductor chip 11 is shown.

[0119] The protrusions 102a, 102b, and 102c of the chuck 21 and the recesses 112a, 112b, and 112c of the chuck holder 22 serve as positioning mechanisms capable of mutual assembly. That is, as... Figure 5B As shown, the chuck retainer 22 can hold the chuck 21 without wobbling because the chuck retainer 22 and the chuck 21 are assembled and mutually restrained to hold the chuck 21. In this embodiment, three pairs of assembly parts are provided, each pair including a pair of protrusions and recesses, but an appropriate number of pairs can be set considering positioning accuracy, mechanical strength, space allowance, manufacturing cost, etc. However, in order to ensure stable orientation during holding, the positioning mechanism is ideally arranged symmetrically around the suction path.

[0120] The magnet 113 (magnet) included in the chuck holder 22 and the chuck base 103 (ferromagnetic material) included in the chuck 21 serve as a holding device to detachably hold the chuck in the chuck holder by magnetic force. That is, in response to aligning and bringing the chuck 21 closer to the chuck holder 22, the magnetic force of the magnet 113 attracts the chuck base 103, and the chuck holder 22 holds the chuck 21. To replace the chuck, it can be removed from the chuck holder by applying an external force greater than the attraction force of the magnet (the holding force of the holding device).

[0121] The magnet's attraction (the holding force of the holding device) needs to be set to a sufficiently strong level to prevent the chuck from responding to suction, pickup, and transfer as... Figure 5C The semiconductor chip 11 (workpiece) shown may become loose due to weight or inertial force. However, the attraction of the magnet (the holding force of the holding device) is not necessarily better the stronger it is; it is preferable to set the attraction within a range that does not require excessive external force to remove the chuck from the chuck base.

[0122] like Figure 5B As shown, the positional relationship between the magnet 113 and the chuck base 103 is ideally set such that when the chuck holder 22 holds the chuck 21, the magnet 113 and the chuck base 103 face each other with a small gap between them. This is because if the magnet 113 and the chuck base 103 were in a position of mutual contact, the magnet 113 might wear down in response to the attachment and removal of the chuck.

[0123] Therefore, when a chuck is attached, such as Figure 5B As shown, the lower surface of the chuck holder 22 and the upper surface of the chuck base 103 are separated by a distance L2. By ensuring that the distance L2 serves as a gap, a positional relationship can be achieved where the magnet 113 and the chuck base 103 do not contact each other. To ensure the distance L2, support surfaces 104a, 104b, and 104c of the chuck 21 are provided at a position higher than the upper surface of the chuck base 103. During attachment, the support surfaces 104a, 104b, and 104c of the chuck 21 are brought into contact with the support surfaces 114a, 114b, and 114c of the chuck holder 22.

[0124] Note that in this embodiment, as Figure 3 and Figure 6As shown, three pairs of chuck-side support surfaces and chuck retainer-side support surfaces are arranged around the suction path at equal angles and distances. However, embodiments of the present invention are not limited to this; appropriate numbers and shapes of chuck-side support surfaces and chuck retainer-side support surfaces can be provided, taking into account positioning accuracy, mechanical strength, space allowance, manufacturing cost, etc. Furthermore, to ensure distance L2, in this embodiment, support surfaces 104a to 104c protrude from the upper surface of the chuck base 103, but support surfaces 114a to 114c of the chuck retainer 22 can protrude from the lower surface of the chuck retainer 22. Moreover, the support surfaces do not necessarily need to be installed near the positioning mechanism (protrusions 102a to 102c, recesses 112a to 112c); they can be arranged at a more distant position.

[0125] Next, the flexible member 115 will be described. The flexible member 115 is a member for airtightly connecting the suction hole 109 (suction path 108) of the chuck 21 to the suction path 116 of the chuck holder 22 when the chuck 21 is held by magnetic force by the chuck holder 22.

[0126] The flexible member 115 in this embodiment includes a base and an annular inclined surface. The base is fitted with an annular groove provided in the chuck retainer 22. One end of the annular inclined surface is connected to the base (protruding from the base) in an inclined manner relative to the Z direction. The inclination direction of the annular inclined surface is set such that the end of the circle opens toward the chuck, i.e., as shown... Figure 5B As shown, the inner diameter D1 (circle diameter) on the side in contact with the chuck is larger than the inner diameter D2 (circle diameter) on the side of the chuck holder. In other words, the annular inclined surface is inclined in the following direction: the side connected to the base ( Figure 5B In the example, the inner diameter D2 of the chuck base side is smaller, and the inner diameter D1 of the opposite end side (not connected to the base) is larger.

[0127] If the chuck is not attached to the chuck holder 22, such as Figure 5A As shown, the flexible member 115 protrudes L1 from the lower surface of the gripper 22 along the Z direction. Here, L1 is set to be larger than L2 as described above.

[0128] In response to attaching the chuck 21 to the chuck holder 22, such as Figure 5B As shown, the flexible member 115 elastically deforms due to the holding force of the retaining device. That is, the inclined surface protrudes L2 from the lower surface of the chuck holder 22 along the Z direction, and its lower end deforms to make close contact with the upper surface of the chuck base 103. Furthermore, the holding force of the retaining device ensures that the upper surface of the flexible member 115 is in close contact with the chuck holder 22. Due to the elastic deformation, the inclination of the inclined surface relative to the Z direction is greater, and the inner diameter D1 is larger than the inner diameter of the chuck 21 before it is attached.

[0129] A flexible member 115 that is in close contact with both the chuck retainer 22 and the chuck 21 forms an airtight connection. This airtight connection connects the suction path 116 (suction hole 109) of the chuck 21 and the suction path 116 of the chuck retainer 22 to seal the atmosphere out.

[0130] like Figure 5C As shown, in order to hold the semiconductor chip 11 (workpiece) using the chuck 21, a vacuum is drawn into the suction path, and adsorption is performed at the suction hole 109. In this embodiment, the airtightness of the suction path is excellent because a flexible member 115 that can be elastically deformed is inserted. In conventional methods where rigid chucks and chuck holders are in direct contact to connect the suction path, air leakage may occur from small gaps, and repeated attachment adjustments are required to attach the chuck. On the other hand, in this embodiment, the flexible member 115 is elastically deformed by the holding force of the magnetic holding mechanism, and the flexible member is in close contact with both the chuck and the chuck holder to connect the suction path, so repeated attachment adjustments of the chuck are not required. Moreover, in this embodiment, since the relative position of the chuck and the chuck holder is fixed by the positioning mechanism described above, no undesirable twisting occurs in the flexible member 115 after the chuck is attached, which could lead to leakage. Furthermore, according to this embodiment, a small and lightweight structure can be used to prevent leakage. The small and lightweight structure enables advanced position control.

[0131] Note that, for example, a donut-shaped flexible member with a circular cut surface can also be used to implement the present invention. However, in this embodiment, since the flexible member 115 includes the base and inclined surface as described above, the sealing performance during vacuuming of the suction path can be particularly excellent. That is, due to the pressure difference between the inside and outside generated during vacuuming of the suction path, the upper surface and side surface of the base are pressed more forcefully against the groove of the chuck retainer, and the end of the inclined surface opposite to the base is pressed more forcefully against the upper surface of the chuck. As described above, in the flexible member of this embodiment, not only is the flexible member in close contact by the holding force of magnetic force, but atmospheric pressure also plays a role in further improving the airtightness, thus resulting in particularly excellent sealing performance during vacuuming.

[0132] (Assembly Department)

[0133] In this embodiment, the assembly mechanism, including protrusions 102a to 102c and recesses 112a to 112c, is configured such that when performing the operation of attaching the chuck to the chuck holder... Figure 5A The alignment precision required for this stage can be relaxed. Furthermore, such as... Figure 6As shown, the arrangement of position control units 117a to 117c is designed to ensure the alignment accuracy required by the assembly mechanism. (Refer to...) Figure 8A and Figure 8B , Figures 9A to 9E This will be described in more detail below. Note that in the following description, when describing the common features of each of the protrusions 102a to 102c, these protrusions may be collectively referred to as protrusion 102. Similarly, when it is not necessary to distinguish each of the recesses 112a to 112c individually, these recesses may be collectively referred to as recess 112. Similarly, when it is not necessary to distinguish each of the position control units 117a to 117c individually, these position control units may be collectively referred to as position control unit 117.

[0134] Figure 8A This is a top view of one of the three assembly mechanisms (i.e., the protrusion 102c, the recess 112c, and the position control unit 117c) viewed from the Z direction before assembly. Figure 8B This is a cross-sectional view showing the state before the protrusion 102c and the recess 112c are assembled together. Note that, as Figure 3 As shown, the other two assembly mechanisms are located at different positions on the chuck base, but the shapes of the protrusions, recesses, and position control parts included in the assembly mechanisms are different from those of the other two. Figure 8A and Figure 8B The shapes shown are similar.

[0135] like Figure 8B As shown, the protrusion 102 has a pin shape, which has a maximum outer diameter d2 when the protrusion is not assembled. The protrusion 102 includes a slit 105 (slit 105c in the case of protrusion 102c) having a predetermined depth from its end toward the base. When the pin-shaped protrusion 102 is viewed from the distal portion toward the base, the pin-shaped protrusion 102 includes a distal end (a flat surface with a diameter d1), a tapered surface 107 connected to the flat surface, a body portion having a maximum outer diameter, and a base whose outer diameter is smaller than that of the body portion. Note that, in order to properly allow the elastic deformation described below, the depth of the slit 105 is ideally at least the depth from the distal portion to the body portion. Figure 8B The example shows an instance where this depth extends further to the base through the main body.

[0136] Recess 112 is a through hole, and when viewed from the Z direction, the recess has a shape where a semicircle connects to both ends of a rectangle, as shown below. Figure 8A As shown. When viewed from the Z direction, with the longitudinal length of the recess 112 being L and the transverse length being D, the protrusion 102 and the recess 112 are formed to satisfy the relationship of Formula 1 below.

[0137] d1<D<d2<L…(Equation 1)

[0138] As described above, the convex portion 102 has a pin shape including a slit at the center, and since the convex portion 102 is formed of an elastic material, the convex portion 102 can be elastically deformed in a direction where the maximum outer diameter is less than d2 to be fitted with the concave portion 112 having an inner diameter D in the lateral direction.

[0139] As shown in Figure 8A , the position control portions 117 are arranged on the chuck 21 to face each other across the chuck holder 22 along the longitudinal direction of the concave portion 112. In Figure 8A the example, the length of the position control portion is approximately the same as the length L of the concave portion 112 in the longitudinal direction. The dimension of the position control portion 117 in the Z direction may be greater than or less than the dimension of the convex portion 102 in the Z direction.

[0140] With reference to Figures 9A to 9E , an assembly process using the convex portion 102c and the concave portion 112c as examples will be described. As shown in Figure 9A , it is assumed that before the assembly is started, the center of the convex portion 102c and the center of the concave portion 112c are deviated by ΔX2 (misalignment).

[0141] As shown in Figure 9B , when the assembly operation is started and the chuck 21 and the chuck holder 22 are relatively moved in the Z direction so as to approach each other, the tapered surface 118 of the position control portion 117c comes into contact with the outer edge of the chuck holder 22 because the center of the convex portion 102c and the center of the concave portion 112c are misaligned. When the chuck 21 is further moved closer to the chuck holder 22, a force acts in the direction (horizontal direction) in which the center of the convex portion 102c corresponds to the center of the concave portion 112c while the tapered surface 118 slides on the outer edge, and the chuck holder 22 is inserted into the position control portion 117.

[0142] As shown in Figure 9C , the assembly operation is continued to relatively move the chuck 21 and the chuck holder 22 in the Z direction so as to approach each other. Then, since the centers of the convex portion 102c and the concave portion 112c are misaligned, the tapered surface 107 of the convex portion 102c comes into contact with the opening edge of the concave portion 112c, as shown in Figure 9D .

[0143] When the chuck is further moved closer to the chuck holder, a force acts in the direction (horizontal direction) in which the center of the convex portion 102c corresponds to the center of the concave portion 112c while the tapered surface 107 slides on the opening edge, and the convex portion 102c is inserted into the concave portion 112c.

[0144] Then, as shown in Figure 9EAs shown, the protruding portion 102c is elastically deformed, so that the maximum outer diameter of the main body part of the protruding portion 102c is equal to the inner diameter of the recessed portion 112c, misalignment is eliminated, and assembly is completed.

[0145] In the present embodiment, since d1 < D is set as expressed in Formula 1, and the tapered surface 107 connected to the flat surface at the distal end of the protruding portion 102 is provided, positional deviation between the protruding portion 102 and the recessed portion 112 can be absorbed.

[0146] Here, in a case where the allowable amount of absorbable positional deviation is ΔX, ΔX can be expressed by the following Formula 2.

[0147] ΔX=D-d1...(Formula 2)

[0148] Since the tapered surface 118 connected to the flat surface at the distal end is also provided in the position control portion 117, positional deviation between the position control portion 117 and the collet holder 22 can be absorbed. Here, in a case where the allowable amount of absorbable positional deviation between the position control portion 117 and the collet holder 22 is ΔX2, ΔX2 can be expressed by the following Formula 3.

[0149] ΔX2=Wo-W...(Formula 3)

[0150] By setting the values of Wo and W such that ΔX2 is larger than ΔX, the allowable amount of positional deviation that can be absorbed by the provided position control portion 117 can be increased.

[0151] Furthermore, by setting D < d2 as expressed in Formula 1, the protruding portion 102 can be elastically deformed, and the protruding portion 102 can be assembled into the recessed portion 112 without play.

[0152] Furthermore, by setting d2 < L as expressed in Formula 1, there is a margin (clearance) in the X direction, and thus, for example, in Figure 8A , even if the protruding portion 102c and the recessed portion 112c are misaligned in the X direction, the assembly operation can be performed without any problem. That is, in the case of the protruding portion 102c and the recessed portion 112c, regarding the X direction in which the slit 105c extends in a plan view, if the misalignment amount is equal to or less than ΔY expressed by the following Formula 4, the protruding portion and the recessed portion can be smoothly assembled.

[0153] ΔY<L-d2...(Formula 4)

[0154] As Figure 9C shown, in a state where assembly is completed, the deformation amount M in the assembled state where the protruding portion 102 is elastically deformed is expressed by the following Formula 5.

[0155] M=d2-D...(Formula 5)

[0156] Here, assuming that the elastic coefficient in the case of elastic deformation on both sides of the slit is k, the relationship among the force F in the elastic deformation direction (the Y direction in the case of the convex portion 102c), the elastic coefficient k, and the deformation amount M in the assembled state is expressed by the following Formula 6.

[0157] F=k*M...(Formula 6)

[0158] To make the assembly mechanism highly rigid, the elastic coefficient k can be increased or the deformation amount M in the assembled state can be increased. However, d2, D, and the elastic coefficient k may change due to machining errors during manufacturing. It is necessary to determine d2 and D in consideration of these factors, and then determine the deformation amount M in the assembled state. In addition, it is ideal to comprehensively determine the elastic coefficient k and the deformation amount M in the assembled state in consideration of frictional resistance and the like during the assembly operation.

[0159] Since the convex portion 102 is formed of an elastically deformable member, when the deformation amount is equal to or greater than a specific value, the shape cannot be restored by elastic deformation, and the function of the assembly mechanism is impaired. The relationship between the maximum allowable deformation amount N of the convex portion 102 that maintains the assembly function of the convex portion 102 and the deformation amount M in the assembled state is expressed by the following Formula 7.

[0160] M<N...(Formula 7)

[0161] Here, in a state where the collet 21 and the collet holder 22 are positioned, when an external force acts on the collet holder 22, the convex portion 102 is deformed by more than the deformation amount M in the assembled state. Considering that the position control unit 117 controls the relative positions of the collet 21 and the collet holder 22, the movement amount L by which the convex portion 102 can move in a state where the collet 21 and the collet holder 22 are positioned is expressed by the following Formula 8.

[0162] L=Wi-W...(Formula 8)

[0163] If the movement amount L is less than the maximum deformation amount N, the deformation amount of the convex portion 102 falls within the elastically deformable range of the convex portion 102, so that even if an unexpected external force acts on the convex portion 102, damage to the assembly function can be prevented. That is, it is ideal to determine the dimensions of W1 and W so as to satisfy the relationship expressed by the following Formula 9.

[0164] Wi-W<N...(Formula 9)

[0165] In the present embodiment, as Figure 6 shown, three sets of assembly mechanisms including the convex portions 102a to 102c, the concave portions 112a to 112c, and the position control portions 117a to 117c are arranged at equal angles around the magnet 113, the flexible member 115, and the suction path 116.

[0166] In this assembly, protrusions 102a and 102b are arranged along the Y direction, and slits 105a and 105b are also oriented along the Y direction. Corresponding recesses 112a and 112b are also arranged along the Y direction and oriented such that the longitudinal direction of each elongated hole is along the Y direction. Furthermore, corresponding position control parts 117a and 117b are also arranged along the Y direction and oriented such that their respective position control surfaces are along the Y direction. That is, in both assembly structures, the position control force acts in the same direction. Additionally, protrusion 102c and the corresponding recess 112c are arranged such that the longitudinal direction of slit 105c and the elongated hole is along the X direction. Furthermore, protrusion 102c and the corresponding position control part 117c are arranged such that the control surface of slit 105c and the position control part is along the X direction. That is, the direction of the position control force is orthogonal to the direction of the position control force in the previous two assembly structures.

[0167] Using this arrangement, the positions in the X direction and the rotational direction around the Z-axis are determined by the protrusion 102a, the recess 112a, the position control part 117a, the protrusion 102b, the recess 112b, and the position control part 117b, while the position in the Y direction is determined by the protrusion 102c, the recess 112c, and the position control part 117c. As described above, in the assembly mechanism at the three positions, the positions in the X, Y, and rotational directions around the Z-axis can be determined globally by aligning each elongated hole in the transverse direction through the sliding and elastic deformation of the tapered surface.

[0168] As described above, according to this embodiment, even if the positions of the protrusion and the recess are slightly misaligned, they can be automatically aligned by the action of the assembly mechanism. Therefore, the chuck can be attached to the chuck holder without requiring excessive effort in the alignment operation. Since the assembly mechanism of this embodiment is not part of the airtight sealing surface of the suction path, even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the recess, no leakage will occur in the suction path. Furthermore, even if an unexpected external force is applied to the chuck while it is attached to the chuck holder, the function of the position control unit can prevent the elastically deformable member performing the alignment from deforming beyond its elastic deformation limit.

[0169] (First variant example)

[0170] Next, we will refer to Figure 10 A first variation of the first embodiment is described. The first variation and references... Figure 6 The difference in the basic form of the first embodiment described is that the convex portion 102a, convex portion 102b, concave portion 112a, concave portion 112b, position control portion 117a, and position control portion 117b are arranged in the plan view from the Z direction.

[0171] That is, in the basic form, the slits 105a of the protrusion 102a and 105b of the protrusion 102b are both arranged along the Y direction. The longitudinal direction of the recess 112a and the longitudinal direction of the recess 112b are both arranged along the Y direction.

[0172] On the other hand, in the first variant, the slits 105a and 105b of the protrusion 102a and 102b are arranged in directions 120 degrees apart. The longitudinal directions of the recesses 112a and 112b are also arranged in directions 120 degrees apart. That is, slits 105a, 105b, and 105c are arranged around the connecting hole at 120-degree intervals. Similarly, the longitudinal directions of the recesses 112a, 112b, and 112c are arranged around the connecting hole at 120-degree intervals. Similarly, the longitudinal directions of the position control units 117a, 117b, and 117c are arranged around the connecting hole at 120-degree intervals.

[0173] Similarly, in this variant, even if the positions of the protrusion and concave are slightly misaligned, they can be automatically aligned through the sliding of the tapered surface and the elastic deformation of the assembly mechanism. Therefore, the chuck can be attached to the chuck holder without excessive strain on the alignment operation. Before attaching the chuck to the chuck holder, the assembly mechanism of this variant can easily align it in cases where positional deviation is likely to occur in the rotational direction around the Z-axis. Since the assembly mechanism of this variant is not part of the hermetically sealed surface of the suction path, no leakage will occur in the suction path even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the concave during assembly. Furthermore, even if an unexpected external force is applied to the chuck while it is attached to the chuck holder, the elastically deformable member performing the alignment can be prevented from deforming beyond the elastic deformation limit.

[0174] (Second variant example)

[0175] Next, we will refer to Figures 11A to 11C A second variation of the first embodiment is described. In the second variation, as... Figure 11A As shown, the inner diameter of the recess 112 changes according to its position in the Z direction. That is, W1 < W2 is set, and the relationship with the maximum outer diameter of the protrusion 102 is set to W2 < d2.

[0176] Similarly, in this variant example, when the protrusion 102 and the recess 112 are not aligned, such as Figure 11B As shown, the tapered surface 107 slides on the inner edge of the recess 112, and the protrusion 102 and the recess 112 move relative to each other in the direction of eliminating misalignment.

[0177] During assembly, the main body portion of the protrusion 102 with the largest outer diameter elastically deforms to correspond to the inner diameter W1 of the recess, and as... Figure 11C When the assembly is completed as shown, the main body portion of the protrusion 102 with the largest outer diameter reaches the portion with the inner diameter W2, and the elastic deformation of the protrusion 102 is reduced.

[0178] Similarly, in this variant, even if the positions of the protrusion and the concave are slightly misaligned, they can be automatically aligned by the sliding of the tapered surface and the elastic deformation of the assembly mechanism. Therefore, the collet can be attached to the collet holder without excessive burden during the alignment operation.

[0179] Furthermore, in this variant, if an unexpected external force is applied to the direction in which the chuck is to be removed after the chuck is attached to the chuck holder, the tapered surface 107R of the lower part of the protrusion 102 comes into contact with the stepped portion of the inner diameter of the recess 112, and the elastic force of the protrusion 102 acts in the direction of maintaining the assembly. That is, it can be said that a limiting portion that restricts the main body portion of the protrusion is provided on the inner surface of the recess. In this way, since the assembly mechanism acts in the direction of assisting in holding the chuck by magnetic force, the stability of holding the chuck by the chuck holder during the chip mounting operation is improved. Since the assembly mechanism of this variant is not part of the hermetically sealed surface of the suction path, even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the recess during assembly, no leakage will occur in the suction path. In addition, even if an unexpected external force is applied to the chuck while the chuck is attached to the chuck holder, the function of the position control unit can prevent the elastically deformable member performing the alignment from deforming beyond the elastic deformation limit.

[0180] (Third variant example)

[0181] Next, we will refer to Figures 12A to 12C A third variation of the first embodiment is described. In this third variation, the protrusion 102 does not include a slit, and the protrusion 102 is formed using an elastic material with a lower elastic modulus than that of the basic form. Similarly, in this variation, the maximum outer diameter of the main body portion of the protrusion 102 is set to be greater than the inner diameter of the recess 112.

[0182] Similarly, in this variant example, when the protrusion 102 and the recess 112 are not aligned, such as Figure 12B As shown, the tapered surface 107 slides on the inner edge of the recess 112, and the protrusion 102 and the recess 112 move relative to each other in the direction of eliminating misalignment.

[0183] In such Figure 12C When the assembly is completed as shown, the main body of the protrusion 102 is compressed in the radial direction, and the outer diameter of the protrusion 102 is equal to the inner diameter of the recess 112.

[0184] Similarly, in this variant, even if the protrusion and concave parts are slightly misaligned, they can be automatically aligned through the sliding of the tapered surface and the elastic deformation of the assembly mechanism. Therefore, the chuck can be attached to the chuck holder without excessive strain on the alignment operation. Since the assembly mechanism of this variant is not part of the airtight sealing surface of the suction path, even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the concave part during assembly, no leakage will occur in the suction path. Furthermore, even if an unexpected external force is applied to the chuck while it is attached to the chuck holder, the function of the position control unit can prevent the elastically deformable member performing the alignment from deforming beyond the elastic deformation limit.

[0185] (Fourth variant example)

[0186] Next, we will refer to Figures 13A to 13D A fourth variation of the first embodiment is described. In the fourth variation, the shape of the protrusion 102 is changed, and a biasing portion for elastically biasing and restricting the protrusion 102 during assembly is provided in the recess 112.

[0187] like Figure 13A Side view and Figure 13D As shown in the plan view, the protrusion 102 of this variant is a so-called D-shaped protrusion obtained by cutting off a portion of a circle into a D-shape in the plan view. A groove 105k is formed on the flat side surface of the protrusion 102. A gap is provided on the inner surface of the recess 112, and a rigid ball 202 is arranged to protrude from the gap. The rigid ball 202 is biased toward the gap side by a leaf spring 201. When the protrusion 102 is assembled, the rigid ball 202 biased by the leaf spring 201 engages with the groove 105k and serves as a restraining part.

[0188] Similarly, in this variant example, when the protrusion 102 and the recess 112 are not aligned, such as Figure 13B As shown, the tapered surface 107 slides on the inner edge of the recess 112, and the protrusion 102 and the recess 112 move relative to each other in the direction of eliminating misalignment.

[0189] In such Figure 13C In the completed assembly shown, the rigid ball 202 included in the recess 112 engages with the groove 105k, and the protrusion 102 is restricted by the recess 112.

[0190] Similarly, in this variant, even if the protrusion and concave parts are slightly misaligned, they can be automatically aligned through the sliding of the tapered surface and the elastic deformation of the assembly mechanism. Therefore, the chuck can be attached to the chuck holder without excessive strain on the alignment operation. Since the assembly mechanism of this variant is not part of the airtight sealing surface of the suction path, even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the concave part during assembly, no leakage will occur in the suction path. Furthermore, even if an unexpected external force is applied to the chuck while it is attached to the chuck holder, the elastically deformable member performing the alignment can be prevented from deforming beyond its elastic deformation limit.

[0191] (Fifth variant example)

[0192] Next, we will refer to Figure 16 A fifth variation of the first embodiment is described. In this fifth variation, the number of position control units 117 is reduced to two.

[0193] like Figure 16 As shown, the position control unit 117 of this variant includes two positions: a position control unit 117a corresponding to the convex portion 102a and the concave portion 112a; and a position control unit 117c corresponding to the convex portion 102c and the concave portion 112c.

[0194] Since the position control unit 117a can control the position in the X direction, it can prevent the elastic deformation members of the protrusions 102a and 102b from deforming beyond their elastic deformation limit. Furthermore, during assembly operations, the protrusions 102a and 112a, as well as the protrusions 102b and 112b, can be assembled after the position control unit 117a absorbs positional deviations in the X direction. Since the position control unit 117c can control the position in the Y direction, it can prevent the elastic deformation member of the protrusion 102c from deforming beyond its elastic deformation limit. Furthermore, during assembly operations, the protrusions 102c and 112c can be assembled after the position control unit 117c absorbs positional deviations in the Y direction.

[0195] Similarly, in this variant, even if the protrusion and concave parts are slightly misaligned, they can be automatically aligned through the sliding of the tapered surface and the elastic deformation of the assembly mechanism. Therefore, the chuck can be attached to the chuck holder without excessive strain on the alignment operation. Since the assembly mechanism of this variant is not part of the airtight sealing surface of the suction path, even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the concave part during assembly, no leakage will occur in the suction path. Furthermore, even if an unexpected external force is applied to the chuck while it is attached to the chuck holder, the elastically deformable member performing the alignment can be prevented from deforming beyond its elastic deformation limit.

[0196] (Sixth variant example)

[0197] Next, we will refer to Figure 17 A sixth variation of the first embodiment is described. In the sixth variation, the number of position control units 117 is reduced to two.

[0198] like Figure 17 As shown, the position control unit 117 of this variant includes two position control units: a position control unit 117a corresponding to the protrusion 102a and the recess 112a; and a position control unit 117c corresponding to the protrusion 102c and the recess 112c. The position control unit 117a is arranged at a position away from the protrusion 102a and the recess 112a.

[0199] Since the position control unit 117a can control the position in the X direction, it can prevent the elastic deformation members of the protrusions 102a and 102b from deforming beyond their elastic deformation limit. Furthermore, during assembly operations, the protrusions 102a and 112a, as well as the protrusions 102b and 112b, can be assembled after the position control unit 117a absorbs positional deviations in the X direction. Since the position control unit 117c can control the position in the Y direction, it can prevent the elastic deformation member of the protrusion 102c from deforming beyond its elastic deformation limit. Furthermore, during assembly operations, the protrusions 102c and 112c can be assembled after the position control unit 117c absorbs positional deviations in the Y direction.

[0200] Similarly, in this variant, even if the protrusion and concave parts are slightly misaligned, they can be automatically aligned through the sliding of the tapered surface and the elastic deformation of the assembly mechanism. Therefore, the chuck can be attached to the chuck holder without excessive strain on the alignment operation. Since the assembly mechanism of this variant is not part of the airtight sealing surface of the suction path, even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the concave part during assembly, no leakage will occur in the suction path. Furthermore, even if an unexpected external force is applied to the chuck while it is attached to the chuck holder, the elastically deformable member performing the alignment can be prevented from deforming beyond its elastic deformation limit.

[0201] (Seventh variant example)

[0202] Next, we will refer to Figure 18 A seventh variation of the first embodiment is described. In the seventh variation, the number of position control units 117 is reduced to two.

[0203] like Figure 18As shown, the position control unit 117 of this variant includes two position control units: a position control unit 117a corresponding to the convex portion 102a and the concave portion 112a; and a position control unit 117c corresponding to the convex portion 102c and the concave portion 112c. The position control unit 117a is arranged at a position away from the convex portion 102a and the concave portion 112a.

[0204] Since the position control unit 117a can control the position in the X direction, it can prevent the elastic deformation members of the protrusions 102a and 102b from deforming beyond their elastic deformation limit. Furthermore, during assembly operations, the protrusions 102a and 112a, as well as the protrusions 102b and 112b, can be assembled after the position control unit 117a absorbs positional deviations in the X direction. Since the position control unit 117c can control the position in the Y direction, it can prevent the elastic deformation member of the protrusion 102c from deforming beyond its elastic deformation limit. Furthermore, during assembly operations, the protrusions 102c and 112c can be assembled after the position control unit 117c absorbs positional deviations in the Y direction.

[0205] Similarly, in this variant, even if the protrusion and concave parts are slightly misaligned, they can be automatically aligned through the sliding of the tapered surface and the elastic deformation of the assembly mechanism. Therefore, the chuck can be attached to the chuck holder without excessive strain on the alignment operation. Since the assembly mechanism of this variant is not part of the airtight sealing surface of the suction path, even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the concave part during assembly, no leakage will occur in the suction path. Furthermore, even if an unexpected external force is applied to the chuck while it is attached to the chuck holder, the elastically deformable member performing the alignment can be prevented from deforming beyond its elastic deformation limit.

[0206] (Eighth variant example)

[0207] Next, we will refer to Figure 19 The eighth variation of the first embodiment is described. In the eighth variation, the position control unit 117 is configured to correspond to the recess 112 with a biasing unit shown in the fourth variation.

[0208] like Figure 19 As shown, the position control unit 117 of this variant is provided in three positions: position control unit 117a corresponding to the protrusion 102a and the recess 112a; position control unit 117b corresponding to the protrusion 102b and the recess 112b; and position control unit 117c corresponding to the protrusion 102c and the recess 112c. However, since the elastic deformation direction of each biasing part is in the same direction in the assembled state, the position control unit 117 is arranged to control the deformation in the direction corresponding to the deformation direction of the biasing part.

[0209] Since position control units 117a and 117b can control the position in the X direction, they can prevent the elastic deformation members of recesses 112a and 112b from deforming beyond the elastic deformation limit. Since position control unit 117c can control the position in the Y direction, it can prevent the elastic deformation members of recess 112c from deforming beyond the elastic deformation limit.

[0210] Similarly, in this variant, even if the protrusion and concave parts are slightly misaligned, they can be automatically aligned through the sliding of the tapered surface and the elastic deformation of the assembly mechanism. Therefore, the chuck can be attached to the chuck holder without excessive strain on the alignment operation. Since the assembly mechanism of this variant is not part of the airtight sealing surface of the suction path, even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the concave part during assembly, no leakage will occur in the suction path. Furthermore, even if an unexpected external force is applied to the chuck while it is attached to the chuck holder, the elastically deformable member performing the alignment can be prevented from deforming beyond its elastic deformation limit.

[0211] (Ninth variant example)

[0212] Next, we will refer to Figure 20 A ninth variation of the first embodiment is described. In the ninth variation, the number of position control units 117 is reduced to two.

[0213] like Figure 20 As shown, the position control unit 117 of this variant includes two position control units: position control unit 117a and position control unit 117c. Position control unit 117a is arranged away from the protrusion 102a and the recess 112a, and position control unit 117c is arranged away from the protrusion 102c and the recess 112c.

[0214] Since the position control unit 117a can control the position in the X direction, it can prevent the elastic deformation members of the protrusions 102a and 102b from deforming beyond their elastic deformation limit. Furthermore, during assembly operations, the protrusions 102a and 112a, as well as the protrusions 102b and 112b, can be assembled after the position control unit 117a absorbs positional deviations in the X direction. Since the position control unit 117c can control the position in the Y direction, it can prevent the elastic deformation member of the protrusion 102c from deforming beyond its elastic deformation limit. Furthermore, during assembly operations, the protrusions 102c and 112c can be assembled after the position control unit 117c absorbs positional deviations in the Y direction.

[0215] Similarly, in this variant, even if the protrusion and concave parts are slightly misaligned, they can be automatically aligned through the sliding of the tapered surface and the elastic deformation of the assembly mechanism. Therefore, the chuck can be attached to the chuck holder without excessive strain on the alignment operation. Since the assembly mechanism of this variant is not part of the airtight sealing surface of the suction path, even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the concave part during assembly, no leakage will occur in the suction path. Furthermore, even if an unexpected external force is applied to the chuck while it is attached to the chuck holder, the elastically deformable member performing the alignment can be prevented from deforming beyond its elastic deformation limit.

[0216] (Tenth Variation Example)

[0217] Next, we will refer to Figure 21 A tenth variation of the first embodiment is described. In the tenth variation, a position control unit 117 is provided at a location considering the deformation direction of the recess 112 having the bias portion shown in the fourth variation.

[0218] like Figure 21 As shown, in the position control unit 117 of this variant, a protruding shape is provided in the chuck 21 to control deformation in one direction corresponding to the deformation direction of the biasing part. The elastic fitting part of the protruding shape is arranged away from the chuck retainer 22 at a distance less than or equal to the elastic deformation limit.

[0219] Since the position control unit 117 can control the position in the X direction, it can prevent the elastic deformation member of the recess 112 from deforming beyond the elastic deformation limit. Since the position control unit 117 can control the position in the Y direction, it can prevent the elastic deformation member of the recess 112 from deforming beyond the elastic deformation limit.

[0220] Similarly, in this variant, even if the protrusion and concave are slightly misaligned, they can be automatically aligned through the sliding of the tapered surface and the elastic deformation of the assembly mechanism. Therefore, the chuck can be attached to the chuck holder without excessive strain on the alignment operation. Since the assembly mechanism of this variant is not part of the airtight sealing surface of the suction path, even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the concave during assembly, no leakage will occur in the suction path. Furthermore, even if an accidental external force is applied to the chuck while it is attached to the chuck holder, deformation of the elastically deformable member performing the alignment beyond its elastic deformation limit can be prevented. Note that in Figure 21 In this context, the protruding shape is cylindrical, but it doesn't have to be cylindrical; it can also be any three-dimensional shape such as a cuboid. Furthermore, in... Figure 21In this context, the chuck retainer 22 includes a cutout shape corresponding to the protruding shape, but this shape is not always necessary.

[0221] [Second Embodiment]

[0222] The second embodiment of the present invention will now be described with reference to the accompanying drawings. However, detailed descriptions of parts common to the first embodiment will be omitted whenever possible.

[0223] like Figure 1 As shown, the chip placement machine according to the second embodiment also includes components such as a wafer support device, a chuck, a chuck holder, a placement arm, a transport section, a supply section camera, an island section camera, and a control unit. In the chip placement machine according to the second embodiment, the adsorption mechanism for picking up semiconductor chips may have a similar or different structure than that in the first embodiment, but the lead frame holding mechanism for holding the lead frame has a different structure than that in the first embodiment.

[0224] The lead frame holding mechanism in the first embodiment (reference) Figure 2 In this configuration, the lead frame retaining body 40 includes the track portion 40b to control the position of the lead frame 41. However, considering the dimensional tolerances of the lead frame, a certain degree of clearance needs to be ensured, so the position of the lead frame 41 may fluctuate slightly.

[0225] Therefore, in the second embodiment, the lead frame is adsorbed through a suction hole provided in the lead frame holding body, thereby enabling easy and stable holding of the lead frame. Furthermore, the lead frame holding body is held magnetically by a holding body retainer, and the suction path of the lead frame holding body and the suction path of the holding body retainer are connected by a flexible member capable of airtight connection. To replace the lead frame holding body according to the type of lead frame to be processed, the lead frame holding body can be attached to the holding body retainer while eliminating leakage, without requiring excessive attachment adjustment work.

[0226] In other words, the chip mounting machine according to the second embodiment is a semiconductor manufacturing apparatus, wherein a holding body holder (tool holder) magnetically holds a lead frame holding body (tool) configured to adsorb lead frame (workpiece), and the semiconductor manufacturing apparatus includes a flexible member through which the suction path can be hermetically connected.

[0227] In the chip placement machine according to the second embodiment, a dedicated leadframe holding body is prepared for each type of leadframe. For placement, a leadframe holding body corresponding to the type of leadframe is selected and attached to a holding body holder to form a leadframe holding mechanism.

[0228] Figure 14This is a schematic plan view illustrating that the holding body holder of the chip mounting machine according to the second embodiment can hold various types of lead frame holding bodies. Figure 15 The diagram schematically shows a cross-section of the lead frame holding mechanism of the second embodiment, which is along the path through... Figure 14 The YZ sectional view of the protrusions 71a and 71c shown.

[0229] Figure 14 The large leadframe 51 and small leadframe 61 processed by the chip mounter of this embodiment are schematically shown. Leadframe holders 50 dedicated to the large leadframe 51 and 61 dedicated to the small leadframe 61 are prepared in advance. For chip mounting operations, the leadframe holder corresponding to the leadframe is selected and attached to the holder holder 70. Note that, for ease of description, in... Figure 14 Only two types of lead frame holding bodies, lead frame holding body 50 and lead frame holding body 60, are shown in the diagram, but lead frame holding bodies that can be attached to the chip mounter are not limited to these two types.

[0230] Figure 15 The diagram shows the lead frame retainer 50 attached to the retainer holder 70 and the lead frame 51 magnetically attached to the lead frame retainer 50. Note that numerous islands 52 for mounting semiconductor components are arranged on the lead frame 51.

[0231] The lead frame retaining body 50 includes a suction path 53, recesses 72a, 72b, and 72c for holding the lead frame 51, which are formed in a substrate made of ferromagnetic material. The suction path 53 penetrates the substrate along the Z direction, and the upper end of the suction path 53 is a suction hole for holding the lead frame 51.

[0232] The main body retainer 70 includes protrusions 71a, 71b, and 71c, a magnet 74, and a position control unit 77 integrated into one unit. The main body retainer 70 includes a suction path 73 that extends through the interior, and the suction path 73 is connected to a negative pressure application mechanism (vacuum pump, control valve, etc.) (not shown).

[0233] The recesses 72a, 72b, and 72c of the lead frame retainer body 50 and the protrusions 71a, 71b, and 71c of the retainer body 70 serve as positioning mechanisms that can be assembled with each other. That is, as Figure 15As shown, when the lead frame retaining body 50 is held by the retaining body retainer 70, the retaining body retainer 70 can hold the lead frame retaining body 50 without wobbling because the retaining body retainer 70 and the lead frame retaining body 50 are mutually constrained by their mutual assembly. In this embodiment, three sets of protrusions, recesses, and position control parts are provided, but an appropriate number of sets can be provided at appropriate locations, taking into account positioning accuracy, mechanical strength, space margin, manufacturing cost, etc.

[0234] In this embodiment, the protrusions 71a to 71c, the recesses 72a to 72c, and the position control portions 77a to 77c form an assembly mechanism similar to that of the protrusions 102a to 102c, the recesses 112a to 112c, and the position control portions 117a to 117c in the first embodiment.

[0235] In other words, the tops of the protrusions 71a to 71c are connected to the tapered surface, and the maximum outer diameter of the main body portion of the protrusions 71a to 71c in the unassembled state is set to be greater than the inner diameter of the recesses 72a to 72c. Furthermore, since the position control unit 77 is also provided with a tapered surface 78 connected to the flat surface at the end, it can absorb positional deviations between the position control unit 77 and the lead frame holding body 50.

[0236] Therefore, even if the positions of the protrusion and the recess are slightly misaligned when the lead frame retainer 50 is attached to the retainer 70, they can be automatically aligned by the action of the assembly mechanism. Thus, attachment can be performed without excessive effort in alignment. Furthermore, the deformation of the protrusion 71 falls within the range of elastic deformation of the protrusion 71 by the position control unit 77. Therefore, even if an accidental external force is applied to the protrusion 71, damage to the assembly function can be prevented.

[0237] When the lead frame holding body 50 is attached to the holding body holder 70, the base of the lead frame holding body 50 is attracted by the magnetic force of the magnet 74, and the lead frame holding body 50 is detachably held by the holding body holder 70. Note that in this embodiment, the mechanism for detachably holding by magnetic force is not limited to this construction. For example, a magnet may be included in the lead frame holding body, and the holding body holder may be formed of a ferromagnetic material. Alternatively, a first magnet may be included in one of the lead frame holding body and the holding body holder, and a second magnet may be included in the other, and the first and second magnets may be arranged such that their opposite magnetic poles face each other.

[0238] The holding force of the retainer 70 used to hold the lead frame retainer 50 is set to a level that allows the lead frame retainer 50 to be stably held during mounting operations, but does not require excessive external force when removing the lead frame retainer 50. Furthermore, a magnet with a magnetic force set accordingly is used. This is to facilitate attachment and removal operations for replacing the lead frame retainer 50 and to prevent accidental damage due to excessive external force. Note that a permanent magnet 74 is used, but an electromagnet can also be used if installation is possible.

[0239] like Figure 15 As shown, in the lead frame holding mechanism of this embodiment, a flexible member 75 made of elastic material is arranged between the lead frame holding body 50 and the holding body retainer 70. Figure 15 In the example, the flexible member 75 is fixed to the recess of the retaining body retainer 70, but it can also be fixed to the lead frame retaining body 50, or it can be clamped between the retaining body retainer 70 and the lead frame retaining body 50 without being fixed to the retaining body retainer 70 or the lead frame retaining body 50.

[0240] The flexible member 75 is an annular member and has a circular shape in a plan view from the Z direction, surrounding the suction path 53 of the lead frame retainer 50 and the suction path 73 of the retainer 70. Note that the shape of the ring in the plan view is not limited to a circle and can also be other shapes, but a circle is preferred from the perspective of stability and reproducibility of elastic deformation.

[0241] When the lead frame retaining body 50 is held by the retaining body retainer 70 using the aforementioned holding force, the flexible member 75 elastically deforms to make close contact with both the lower end face of the lead frame retaining body 50 and the upper end face of the retaining body retainer 70. In other words, the flexible member 75 is formed of an elastic material that can easily elastically deform using the aforementioned holding force, and can hermetically connect the suction path 53 and the suction path 73 (connecting the two to seal off the atmosphere). The flexible member 75 may include any of the following materials: rubber, porous resin, or magnetic fluid.

[0242] like Figure 15As shown, in order to hold the lead frame (workpiece) using the lead frame holding body 50, a vacuum is drawn into the suction path, and adsorption is performed at the suction hole. In this embodiment, the airtightness of the suction path is excellent because a flexible member 75 that can be elastically deformed is inserted. In this embodiment, the flexible member 75 is elastically deformed by the holding force of the magnetic holding mechanism, and the flexible member is in close contact with both the lead frame holding body and the holding body holder to connect the suction path, so there is no need to repeatedly adjust the attachment of the lead frame holding body. Moreover, in this embodiment, since the relative position of the lead frame holding body and the holding body holder is fixed by the positioning mechanism described above, no undesirable twisting will occur in the flexible member 75 after the lead frame holding body is attached, which would lead to leakage. If a flexible member is used as in this embodiment, the airtightness during vacuuming can be particularly excellent.

[0243] As described above, according to this embodiment, even if the protrusions and recesses of the assembly mechanism are slightly misaligned, they can be automatically aligned. Therefore, the lead frame retainer can be attached to the retainer without requiring excessive alignment operations. Since the assembly mechanism of this variant is not part of the hermetic sealing surface of the suction path, no leakage will occur in the suction path even if the tapered surface of the protrusion slides and wears on the edge or inner surface of the recess during assembly. Furthermore, even if an unexpected external force is applied, the elastic deformation function, which is important for positioning, will not be impaired.

[0244] [Third Embodiment]

[0245] (Adsorption mechanism)

[0246] Next, we will refer to Figures 22 to 25 This describes an adsorption mechanism for picking up semiconductor chips as workpieces. Note that in the chip placement machine of this embodiment, a dedicated chuck is prepared for each type of workpiece (semiconductor chip), and a chuck corresponding to the workpiece to be placed is selected and attached to a chuck holder to form an adsorption mechanism. Note that detailed descriptions of parts common to the first embodiment will be omitted as much as possible.

[0247] Figure 22 This is a perspective view of the adsorption mechanism, which includes a chuck 921, a chuck retainer 922, and a mounting arm 923. The chuck retainer 922 detachably holds the chuck 921. Figure 22 The image shows the state of the chuck 921 after it has been removed from the chuck holder 922.

[0248] The mounting arm 923 includes a Z-direction actuator 9121 for moving the chuck 921 and chuck holder 922 in the Z-direction. The Z-direction actuator 9121 can perform movement operations in the Z-direction and press load feedback control for mounting under the control of a control unit. To perform operations such as picking up, placing, and mounting semiconductor chips 911, the Z-direction actuator 9121 is operated to raise and lower the chuck. At this time, the operation of the Z-direction actuator is controlled by press load feedback so that no force equal to or greater than a predetermined load is applied and the semiconductor chip 911 is not deformed or damaged.

[0249] Figure 23 By along Figure 22 The schematic cross-sectional view obtained by cutting through the chuck 921 and chuck retainer 922 via the curved line BB (i.e., the route through the protrusion 9102c, the suction path 9108 and the protrusion 9102a). Figure 25 This is a top view of the chuck 921 and chuck retainer 922 as viewed from the Z direction.

[0250] The chuck 921 includes a chuck base 9103, protrusions 9102a, 9102b, and 9102c, support surfaces 9104a, 9104b, and 9104c, and a workpiece adsorption part 9106 as components, which are integrated into one unit. The chuck 921 includes a suction path 9108 that penetrates the interior, and a suction hole 9109 for adsorbing the semiconductor chip 911 is arranged at the lower end of the suction path 9108.

[0251] The chuck retainer 922 includes recesses 9112a, 9112b, and 9112c, a magnet 9113, and support surfaces 9114a, 9114b, and 9114c as components, which are integrated into one unit. The chuck retainer 922 includes a suction path 9116 that extends through its interior, and the suction path 9116 is connected to a negative pressure application mechanism (vacuum pump, control valve, etc.) (not shown).

[0252] The magnet 9113 of the chuck holder 922 and the chuck base 9103 are arranged facing each other, and the chuck base 9103 is formed of a ferromagnetic material. To attach the chuck 921 to the chuck holder 922, the magnetic force of the magnet 9113 attracts the chuck base 9103, and the chuck holder 922 detachably holds the chuck 921. Note that in this embodiment, the mechanism for detachably holding the chuck using magnetic force is not limited to this configuration. For example, a magnet may be included in the chuck, and the chuck holder may be formed of a ferromagnetic material. Alternatively, a first magnet may be included in one of the chuck and the chuck holder, and a second magnet may be included in the other, and the first and second magnets may be arranged such that opposite magnetic poles face each other.

[0253] The holding force used to hold the chuck by the chuck holder is set to a level that allows the chuck to be held stably during a series of placement operations without requiring excessive external force to remove it, and a magnet with a magnetic force set accordingly is used. This is to make attaching and removing the chuck easier and to prevent accidental damage due to excessive external force.

[0254] like Figure 25 As shown, magnets 9113 are arranged symmetrically around the suction path 9116, so that the necessary holding force is applied evenly to each part of the chuck and chuck holder. However, other methods can be used to arrange the magnets as long as the necessary holding force can be applied evenly. Note that permanent magnets are used as magnets 9113, but electromagnets can also be used as long as they can be installed.

[0255] In the adsorption mechanism of this embodiment, a flexible member 9115 capable of elastic deformation is arranged between the gripper 921 and the gripper retainer 922. Figure 23 In the example, the flexible member 9115 is fixed to the recess of the chuck retainer 922, but it can also be fixed to the chuck 921, or it can be clamped between the chuck retainer 922 and the chuck 921 without being fixed to the chuck retainer 922 or the chuck 921.

[0256] like Figure 25 As shown, the flexible member 9115 is an annular member and has a circular shape in a plan view from the Z direction, surrounding the suction path 9108 of the chuck 921 and the suction path 9116 of the chuck holder 922. Note that the shape of the ring in the plan view is not limited to a circle and can also be other shapes, but a symmetrical shape is preferred from the perspective of stability and reproducibility of elastic deformation, and in particular, a circle is preferred.

[0257] When the chuck 921 is held by the chuck holder 922 with a holding force that does not require excessive external force to remove, the flexible member 9115 elastically deforms to make close contact with both the upper end face of the chuck 921 and the lower end face of the chuck holder 922. In other words, the flexible member 9115 is formed of a material that can easily elastically deform using the aforementioned holding force, and can airtightly connect the suction paths 9108 and 9116 (connecting them to seal off the atmosphere). Therefore, the flexible member 9115 can comprise any of materials such as rubber, porous resin, or magnetic fluid. Preferably, the annular flexible member 9115 is arranged concentrically around the suction path 9116. This is because even with a weaker suction force, the flexible member 9115 can elastically deform uniformly along the suction direction.

[0258] (Method for attaching clamps)

[0259] Next, we will refer to Figures 24A to 24C as well as Figure 25 A method for attaching a chuck 921 to a chuck retainer 922 is described.

[0260] Figures 24A to 24C By along Figure 22 The schematic cross-sectional view obtained by cutting through the chuck 921 and chuck retainer 922 along the curved line BB (i.e., the route through protrusion 102c, suction path 9108, and protrusion 9102a). For ease of illustration, the dimensions and shapes of the parts are shown non-scale.

[0261] Figure 24A This shows the state before the chuck 921 is attached to the chuck holder 922. Figure 24B This shows the state in which the chuck 921 is attached to the chuck retainer 922 (held by the chuck retainer 922). Figure 24C The state of the semiconductor chip 911 held by the chuck 921 by the chuck holder 922 is shown.

[0262] The protrusions 9102a, 9102b, and 9102c of the chuck 921, and the recesses 9112a, 9112b, and 9112c of the chuck holder 922, serve as positioning mechanisms capable of mutual assembly. That is, as... Figure 24B As shown, the chuck retainer 922 can hold the chuck 921 without wobbling because the chuck retainer 922 and the chuck 921 are assembled and mutually restrained to hold the chuck 921. In this embodiment, three pairs of protrusions and recesses are provided, but an appropriate number of pairs can be provided considering positioning accuracy, mechanical strength, space allowance, manufacturing cost, etc. However, in order to ensure stable orientation during holding, the positioning mechanism is ideally arranged symmetrically around the suction path.

[0263] The magnet 9113 (magnet) included in the chuck holder 922 and the chuck base 9103 (ferromagnetic material) included in the chuck 921 serve as a holding device for detachably holding the chuck in the chuck holder by magnetic force. That is, in response to aligning and bringing the chuck 921 closer to the chuck holder 922, the magnetic force of the magnet 9113 attracts the chuck base 9103, and the chuck 921 is held by the chuck holder 922. To replace the chuck, it can be removed from the chuck holder by applying an external force greater than the attraction force of the magnet (the holding force of the holding device).

[0264] The magnet's attraction (the holding force of the holding device) needs to be set to a sufficiently strong level to prevent the chuck from responding to suction, pickup, and transfer as... Figure 24CThe semiconductor chip 911 (workpiece) shown wobbles due to its weight or inertial force. However, the attraction of the magnet (the holding force of the holding device) is not necessarily better the stronger it is; it is preferable to set the attraction within a range that does not require excessive external force to remove the chuck from the chuck base.

[0265] like Figure 24B As shown, the positional relationship between magnet 9113 and chuck base 9103 is ideally set such that, with chuck holder 922 holding chuck 921, magnet 9113 and chuck base 9103 face each other with a small gap between them. This is because if magnet 9113 and chuck base 9103 were in a position of mutual contact, magnet 9113 might wear down in response to the attachment and removal of the chuck.

[0266] Therefore, when a chuck is attached, such as Figure 24B As shown, the lower surface of the chuck holder 922 and the upper surface of the chuck base 9103 are separated by a distance L2. By ensuring that the distance L2 serves as a gap, a positional relationship in which the magnet 9113 and the chuck base 9103 do not contact each other can be achieved. To ensure the distance L2, support surfaces 9104a, 9104b, and 9104c of the chuck 921 are provided at a position higher than the upper surface of the chuck base 9103. During attachment, the support surfaces 9104a, 9104b, and 9104c of the chuck 921 are brought into contact with the support surfaces 9114a, 9114b, and 9114c of the chuck holder 922.

[0267] Note that in this embodiment, as Figure 22 and Figure 25 As shown, three pairs of chuck-side support surfaces and chuck retainer-side support surfaces are arranged around the suction path at equal angles and intervals. However, embodiments of the present invention are not limited to this; appropriate numbers and shapes of chuck-side support surfaces and chuck retainer-side support surfaces can be provided, taking into account positioning accuracy, mechanical strength, space allowance, manufacturing cost, etc. Furthermore, to ensure distance L2, in this embodiment, support surfaces 9104a to 9104c protrude from the upper surface of the chuck base 9103, but support surfaces 9114a to 9114c of the chuck retainer 922 can protrude from the lower surface of the chuck retainer 922. Moreover, the support surfaces do not necessarily need to be installed near the positioning mechanism (protrusions 9102a to 9102c, recesses 9112a to 9112c); they can be arranged at a more distant position.

[0268] Next, the flexible member 9115 will be described. The flexible member 9115 is a member for airtightly connecting the suction hole 9109 (suction path 9108) of the chuck 921 to the suction path 9116 of the chuck holder 922 while the chuck 921 is held by magnetic force by the chuck holder 922.

[0269] The flexible member 9115 in this embodiment includes a base and an annular inclined surface. The base is fitted with an annular groove provided in the chuck retainer 922. One end of the annular inclined surface is connected to the base in an inclined manner relative to the Z direction. The inclination direction of the annular inclined surface is set such that the end of the circle opens toward the chuck, i.e., as shown... Figure 24B As shown, the inner diameter D1 (circle diameter) on the side in contact with the chuck is larger than the inner diameter D2 (circle diameter) on the side of the chuck holder. In other words, the annular inclined surface is inclined in the following direction: the side connected to the base ( Figure 24B In the example, the inner diameter D2 of the chuck base side is smaller, and the inner diameter D1 of the opposite end side (not connected to the base) is larger.

[0270] If the chuck is not attached to the chuck retainer 922, such as Figure 24A As shown, the chuck 921 protrudes L1 from the lower surface of the chuck holder 922 along the Z direction. Here, L1 is set to be larger than L2 as described above.

[0271] In response to attaching the chuck 921 to the chuck retainer 922, such as Figure 24B As shown, the flexible member 9115 elastically deforms due to the holding force of the retaining device. That is, the inclined surface protrudes L2 from the lower surface of the chuck holder 922 along the Z direction, and its lower end deforms to make close contact with the upper surface of the chuck base 9103. Furthermore, the holding force of the retaining device ensures that the upper surface of the flexible member 9115 is in close contact with the chuck holder 922. Due to the elastic deformation, the inclination of the inclined surface relative to the Z direction is greater, and the inner diameter D1 is larger than the inner diameter of the chuck 921 before it is attached.

[0272] A flexible member 9115 that is in close contact with both the chuck retainer 922 and the chuck 921 forms an airtight connection. This airtight connection connects the suction path 9116 (suction hole 9109) of the chuck 921 and the suction path 9116 of the chuck retainer 922 to seal the atmosphere outward.

[0273] like Figure 24CAs shown, in order to hold the semiconductor chip 911 (workpiece) using the chuck 921, a vacuum is drawn into the suction path, and adsorption is performed at the suction hole 9109. In this embodiment, the airtightness of the suction path is excellent because a flexible member 9115 that can be elastically deformed is inserted. In conventional methods where rigid chucks and chuck holders are in direct contact to connect the suction path, air leakage may occur from small gaps, and repeated attachment adjustments are required to attach the chuck. On the other hand, in this embodiment, the flexible member 9115 is elastically deformed by the holding force of the magnetic holding mechanism, and the flexible member is in close contact with both the chuck and the chuck holder to connect the suction path, so repeated attachment adjustments of the chuck are not required. Moreover, in this embodiment, since the relative position of the chuck and the chuck holder is fixed by the positioning mechanism described above, no undesirable twisting occurs in the flexible member 9115 after the chuck is attached, which could lead to leakage. Furthermore, according to this embodiment, a small and lightweight structure can be used to prevent leakage. Its small and lightweight structure enables advanced position control.

[0274] Note that, for example, a donut-shaped flexible member with a circular cut surface can also be used to implement the present invention. However, in this embodiment, since the flexible member 9115 includes the base and inclined surface as described above, the sealing performance during vacuuming of the suction path can be particularly excellent. That is, due to the pressure difference between the inside and outside generated during vacuuming of the suction path, the upper surface and side surface of the base are pressed more forcefully against the groove of the chuck retainer, and the end of the inclined surface opposite to the base is pressed more forcefully against the upper surface of the chuck. As described above, in the flexible member of this embodiment, not only is the flexible member in close contact by the holding force of magnetic force, but atmospheric pressure also plays a role in further improving the airtightness, thus resulting in particularly excellent sealing performance during vacuuming.

[0275] [Fourth Embodiment]

[0276] The fourth embodiment of the present invention will now be described with reference to the accompanying drawings. However, detailed descriptions of parts common to the third embodiment will be omitted whenever possible.

[0277] The chip placement machine according to the fourth embodiment also includes components such as a wafer support device, a chuck, a chuck holder, a placement arm, a transport section, a supply section camera, an island section camera, and a control unit. In the chip placement machine according to the fourth embodiment, the adsorption mechanism for picking up semiconductor chips may have a similar or different structure than that in the third embodiment, but the lead frame holding mechanism for holding the lead frame has a different structure than that in the third embodiment.

[0278] In the lead frame holding mechanism of the third embodiment, the lead frame holding body 940 includes a track portion 940b to control the position of the lead frame 941. However, since the dimensional tolerances of the lead frame need to ensure a certain degree of clearance, the position of the lead frame 941 may fluctuate slightly.

[0279] Therefore, in the fourth embodiment, the lead frame is adsorbed by a suction hole provided in the lead frame holding body, thereby enabling easy and stable holding of the lead frame. Furthermore, the lead frame holding body is held magnetically by a holding body retainer, and the suction path of the lead frame holding body and the suction path of the holding body retainer are connected by a flexible member capable of airtight connection. To replace the lead frame holding body according to the type of lead frame to be processed, the lead frame holding body can be attached to the holding body retainer while eliminating leakage, without requiring excessive attachment adjustment work.

[0280] In other words, the chip mounting machine according to the fourth embodiment is a semiconductor manufacturing apparatus, wherein a holding body holder (tool holder) magnetically holds a lead frame holding body (tool) configured to adsorb a lead frame (workpiece), and the semiconductor manufacturing apparatus includes a flexible member through which the suction path can be hermetically connected.

[0281] In the chip placement machine according to the fourth embodiment, a dedicated leadframe holding body is prepared for each type of leadframe. For placement, a leadframe holding body corresponding to the type of leadframe is selected and attached to a holding body holder to form a leadframe holding mechanism.

[0282] Figure 26 This is a schematic plan view illustrating the ability of a holding body holder of a chip mounting machine according to the fourth embodiment to hold various types of lead frame holding bodies. Figure 27 The diagram schematically shows a cross-section of the lead frame holding mechanism of the fourth embodiment, which is along the path through... Figure 26 The YZ sectional view of the protrusions 971a and 971c shown.

[0283] Figure 26 The large leadframe 951 and small leadframe 961 processed by the chip mounter of this embodiment are schematically shown. A leadframe holder 950 dedicated to the large leadframe 951 and a leadframe holder 960 dedicated to the small leadframe 961 are prepared in advance. For chip mounting operations, a leadframe holder corresponding to the leadframe is selected and attached to the holder holder 970. Note that, for ease of description, in... Figure 26Only two types of lead frame holding bodies, lead frame holding body 950 and lead frame holding body 960, are shown in the figure, but lead frame holding bodies that can be attached to the chip mounter are not limited to these two types.

[0284] Figure 27 The diagram shows a state where the lead frame retainer 950 is attached to the retainer holder 970 and the lead frame 951 is attracted to the lead frame retainer 950. Note that a number of islands 952 for mounting semiconductor devices are arranged on the lead frame 951.

[0285] The lead frame retaining body 950 includes a suction path 953, recesses 972a, 972b, and 972c for holding the lead frame 951, which are formed in a substrate made of ferromagnetic material. The suction path 953 penetrates the substrate along the Z direction, and the upper end of the suction path 953 is a suction hole for holding the lead frame 951.

[0286] The retainer 970 includes protrusions 971a, 971b, and 971c integrated into one piece, and a magnet 974. The retainer 970 includes a suction path 973 that extends through the interior, and the suction path 973 is connected to a negative pressure application mechanism (vacuum pump, control valve, etc.) (not shown).

[0287] The recesses 972a, 972b, and 972c of the lead frame retainer body 950 and the protrusions 971a, 971b, and 971c of the retainer body holder 970 serve as positioning mechanisms that can be assembled with each other. That is, as Figure 27 As shown, when the lead frame retaining body 950 is held by the retaining body retainer 970, the retaining body retainer 970 can hold the lead frame retaining body 950 without wobbling because the retaining body retainer 970 and the lead frame retaining body 950 are mutually restrained by their mutual assembly. In this embodiment, three pairs of protrusions and recesses are provided, but an appropriate number of pairs can be provided in appropriate positions, taking into account positioning accuracy, mechanical strength, space allowance, manufacturing cost, etc.

[0288] When the lead frame holding body 950 is attached to the holding body holder 970, the base of the lead frame holding body 950 is attracted by the magnetic force of the magnet 974, and the lead frame holding body 950 is detachably held by the holding body holder 970. Note that in this embodiment, the mechanism for detachably holding by magnetic force is not limited to this construction. For example, a magnet may be included in the lead frame holding body, and the holding body holder may be formed of a ferromagnetic material. Alternatively, a first magnet may be included in one of the lead frame holding body and the holding body holder, and a second magnet may be included in the other, and the first and second magnets may be arranged such that their opposite magnetic poles face each other.

[0289] The holding force of the retainer 970 used to hold the lead frame retainer 950 is set to a level that allows the lead frame retainer 950 to be stably held during mounting operations, but does not require excessive external force when removing the lead frame retainer 950. Furthermore, a magnet with a magnetic force set accordingly is used. This is to facilitate attachment and removal operations for replacing the lead frame retainer 950 and to prevent accidental damage due to excessive external force. Note that a permanent magnet 974 is used, but an electromagnet can also be used if installation is possible.

[0290] like Figure 27 As shown, in the lead frame holding mechanism of this embodiment, a flexible member 975 made of elastic material is arranged between the lead frame holding body 950 and the holding body retainer 970. Figure 27 In the example, the flexible member 975 is fixed to the recess of the retaining body retainer 970, but may be fixed to the lead frame retaining body 950, or may be clamped between the retaining body retainer 970 and the lead frame retaining body 950 without being fixed to the retaining body retainer 970 or the lead frame retaining body 950.

[0291] The flexible member 975 is an annular member and has a circular shape in a plan view from the Z direction, surrounding the suction path 953 of the lead frame retainer 950 and the suction path 973 of the retainer 970. Note that the shape of the ring in the plan view is not limited to a circle and can also be other shapes, but a circle is preferred from the perspective of stability and reproducibility of elastic deformation.

[0292] When the lead frame retaining body 950 is held by the retaining body retainer 970 using the aforementioned holding force, the flexible member 975 elastically deforms to make close contact with both the lower end face of the lead frame retaining body 950 and the upper end face of the retaining body retainer 970. In other words, the flexible member 975 is formed of an elastic material that can easily elastically deform using the aforementioned holding force, and can hermetically connect the suction path 953 and the suction path 973 (connecting the two to seal off the atmosphere). The flexible member 975 may include any of the following materials: rubber, porous resin, or magnetic fluid.

[0293] like Figure 27 As shown, in order to hold the lead frame (workpiece) using the lead frame holding body 950, a vacuum is evacuated along the suction path, and adsorption is performed at the suction hole. In this embodiment, the airtightness of the suction path is excellent because a flexible member 975 that can be elastically deformed is inserted. In this embodiment, the flexible member 975 is elastically deformed by the holding force of the magnetic holding mechanism, and the flexible member is in close contact with both the lead frame holding body and the holding body holder to connect the suction path, so there is no need to repeatedly adjust the attachment of the lead frame holding body. Moreover, in this embodiment, since the relative position of the lead frame holding body and the holding body holder is fixed by the positioning mechanism described above, no undesirable twisting will occur in the flexible member 975 after the lead frame holding body is attached, which would lead to leakage. If a flexible member is used as in this embodiment, the airtightness during vacuuming can be particularly excellent.

[0294] [Other Embodiments]

[0295] Note that the present invention is not limited to the above embodiments and variations, and various modifications can be made within the scope of the inventive concept. Furthermore, the effects described in the embodiments are merely examples of the most suitable effects produced by the present invention, and the effects of the present invention are not limited to those described in the embodiments.

[0296] For example, a chip mounting machine may include both a semiconductor element adsorption mechanism as in the first embodiment and a lead frame adsorption mechanism as in the second embodiment. Furthermore, for example, a chip mounting machine may include both a semiconductor element adsorption mechanism as in the third embodiment and a lead frame adsorption mechanism as in the fourth embodiment.

[0297] Furthermore, in the first embodiment, as a positioning mechanism defining the relative position of the chuck and the chuck holder, the chuck includes a protrusion and the chuck holder includes a recess; however, conversely, the chuck may include a recess and the chuck holder may include a protrusion. Alternatively, both the protrusion and the recess may be arranged on the chuck and the chuck holder. Depending on the arrangement of the protrusion and the recess, the position control unit may be arranged on any one or both of the chuck and the chuck holder.

[0298] In the second embodiment, as a positioning mechanism defining the relative position of the lead frame holding body and the holding body retainer, the holding body retainer includes a protrusion, and the lead frame holding body includes a recess. However, conversely, the holding body retainer may include a recess, and the lead frame holding body may include a protrusion. Alternatively, both the protrusion and the recess may be arranged on the lead frame holding body and the holding body retainer. Depending on the arrangement of the protrusion and the recess, the position control unit may be arranged on any one or both of the lead frame holding body and the holding body retainer.

[0299] Furthermore, in the embodiments, the tapered surface is included in the protrusion formed of an elastic material, but the tapered surface may also be included in the recess. That is, as long as a sliding surface that functions in the direction of eliminating misalignment when the protrusion is inserted into the recess can be formed, the tapered surface may be included only in the protrusion, only in the recess, or in both the protrusion and the recess.

[0300] Furthermore, in the third embodiment, as a positioning mechanism defining the relative position of the chuck and the chuck holder, the chuck includes a protrusion and the chuck holder includes a recess, but conversely, the chuck may include a recess and the chuck holder may include a protrusion.

[0301] In addition, in the fourth embodiment, as a positioning mechanism that defines the relative position of the lead frame holding body and the holding body holder, the holding body holder includes a protrusion and the lead frame holding body includes a recess. However, conversely, the holding body holder may include a recess and the lead frame holding body may include a protrusion.

[0302] Furthermore, the workpieces adsorbed by the chuck are not limited to semiconductor elements (semiconductor chips), but can be electronic components such as resistors or capacitors. In addition to methods for manufacturing semiconductors that perform chip mounting on semiconductor chips, the chip mounting machine according to the present invention can also be widely applied to methods for manufacturing articles on which electronic components are mounted on circuit boards, etc.

[0303] Industrial applicability

[0304] This invention can be widely applied to devices for chip mounting of semiconductor chips, devices for mounting electronic components on circuit boards, etc.

[0305] This invention is not limited to the embodiments described above, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, in order to disclose the scope of the invention, the following claims are appended.

[0306] List of reference numerals

[0307] 11 Semiconductor chips

[0308] 14. Wafer support device

[0309] 21 Chuck

[0310] 22. Clamp Retainer

[0311] 24. Teleportation Department

[0312] 40 Leadframe retains the main body

[0313] 41 Lead Frame

[0314] 50 Leadframe retains the main body

[0315] 51 Lead Frame

[0316] 53 Suction Path

[0317] 60 Leadframe retains the main body

[0318] 61 Lead Frame

[0319] 70 Main body retainer

[0320] 71a, 71b, 71c convex parts

[0321] 72a, 72b, 72c recessed parts

[0322] 73 Suction Path

[0323] 74 Magnets

[0324] 75 Flexible components

[0325] 77 Location Control Department

[0326] 100 Chip Placement Machine

[0327] 102a, 102b, 102c convex parts

[0328] 103 Chuck Base

[0329] 105a, 105b, 105c slits

[0330] 105k groove

[0331] 107 Conical Surface

[0332] 108 Suction Path

[0333] 109 suction holes

[0334] 112a, 112b, 112c recessed parts

[0335] 113 Magnets

[0336] 115 Flexible components

[0337] 116 Suction Path

[0338] Location Control Department of 117a, 117b, and 117c

[0339] 118 Conical Surface

[0340] 200 control unit

Claims

1. An adsorption mechanism, comprising: Includes a tool-side suction path and is configured to adsorb workpieces through suction; Including the tool retainer for the suction path on the retainer side; A retaining device that magnetically holds the tool holder detachably. as well as A flexible member configured to hermetically connect the tool-side suction path and the retainer-side suction path when the tool is held in place by the magnetic force. The flexible member includes a base and an inclined surface at one end connected to the base. The retaining device is positioned between the retainer-side suction path and the flexible member, and In the case where the tool holder holds the tool by the magnetic force, the flexible member elastically deforms by the holding force of the holding device to make close contact with both the tool and the tool holder, thereby airtightly connecting the tool-side suction path and the holder-side suction path.

2. The adsorption mechanism according to claim 1 further includes: The positioning unit positions the tool relative to the tool holder when the tool is held in the holder. The positioning part includes: At least one protrusion disposed on one of the tool and the tool holder, the at least one protrusion being formed of an elastic material and including a tapered surface; and At least one recess is disposed on the other of the tool and the tool holder and configured to mate with the protrusion.

3. The adsorption mechanism according to claim 2, in, A slit extending from the top to a predetermined depth is formed in the protrusion, and In the plan view, the length of the recess along the direction extending from the slit is greater than the length of the recess in the direction orthogonal to the slit.

4. The adsorption mechanism according to claim 3, in, For a direction orthogonal to the direction of the slit extension in the plan view, when the protrusion is not fitted into the recess, the length of the protrusion is greater than the length of the recess, and When the protrusion is fitted into the recess, the length of the protrusion is equal to the length of the recess.

5. The adsorption mechanism according to claim 3, in, The positioning portion includes a plurality of the protrusions and a plurality of the recesses, and the protrusions include a plurality of protrusions that extend in the same direction in the plan view of the slit.

6. The adsorption mechanism according to any one of claims 2 to 5 further includes a position control unit disposed on one of the tool and the tool holder and controlling the deformation of the protrusion.

7. The adsorption mechanism according to any one of claims 2 to 5, in, The recess includes a limiting portion that, when the recess is assembled with the protrusion, limits the protrusion.

8. The adsorption mechanism according to any one of claims 2 to 5, in, The positioning part is arranged in at least three positions.

9. The adsorption mechanism according to any one of claims 1 to 5, in, The inclined surface described in the plan view is annular and inclined in one direction, such that the diameter of the circle on the side connected to the base is smaller and the diameter of the circle on the side not connected to the base is larger.

10. The adsorption mechanism according to any one of claims 1 to 5, in, The flexible component includes any one of rubber, porous resin, or magnetic fluid.

11. The adsorption mechanism according to any one of claims 1 to 5, in, The retaining device includes a magnet fixed to one of the tool and the tool holder, and a ferromagnetic object fixed to the other of the tool and the tool holder.

12. The adsorption mechanism according to any one of claims 1 to 5, in, The holding device includes a first magnet fixed to one of the tool and the tool holder, and a second magnet fixed to the other of the tool and the tool holder, wherein the first magnet and the second magnet are arranged such that their different magnetic poles face each other.

13. The adsorption mechanism according to any one of claims 1 to 5, wherein, The workpiece is an electronic component, and the tool is a chuck.

14. The adsorption mechanism according to any one of claims 1 to 5, in, The workpiece is a lead frame, and the tool is a lead frame holding body.

15. An article manufacturing apparatus, comprising: The adsorption mechanism according to claim 13; as well as Maintain the installation target component holding part. The clamp adsorbs the electronic component and places it at a predetermined position on the mounting target component.

16. A semiconductor manufacturing apparatus, comprising: The adsorption mechanism according to claim 13; as well as The lead frame retains the main body. The clamp adsorbs the first semiconductor chip, places the first semiconductor chip on the lead frame or on a second semiconductor chip mounted on the lead frame, and then mounts it.

17. A semiconductor manufacturing apparatus, comprising: The adsorption mechanism according to claim 14; as well as The transport unit that transmits the first semiconductor chip. The conveying unit conveys the first semiconductor chip, places the first semiconductor chip on the lead frame held by the lead frame holding body or on a second semiconductor chip mounted on the lead frame, and performs mounting.

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