Photosensitive assembly, camera module and electronic device

Abstract

Disclosed are a photosensitive assembly, a camera module, and an electronic device. The photosensitive assembly comprises a photosensitive chip and a circuit board assembly, the circuit board assembly comprises a circuit board main body and an adjustment layer, the photosensitive chip is arranged on the circuit board main body and is electrically connected to the circuit board main body, and the adjustment layer is formed on the lower surface of the circuit board main body and has a structural configuration for adjusting the bending degree of the circuit board main body to adjust the bending degree of the photosensitive chip. In this way, the bending degree of the photosensitive chip is adjusted by the adjustment layer to adapt to the field curvature of the optical lens.

Description

Technical Field

[0001] This application relates to camera modules, and more particularly to photosensitive components, camera modules, and electronic devices. Background Technology

[0002] With the widespread adoption of mobile devices, the technology behind camera modules used in these devices to help users acquire images (such as videos or photos) has developed rapidly. As consumers' demands for video recording increase, the functions of camera modules on mobile devices have become more diverse and powerful, including features such as wide-angle, telephoto, and zoom capabilities. To achieve these functions, image sensors are increasingly moving towards higher pixel counts and larger sensor sizes.

[0003] Because large-sized photosensitive chips have a large area and small thickness, they are more prone to bending under external forces or temperature changes during assembly or reliability testing, leading to a decrease in the image quality of the camera module. To optimize the image quality of the camera module, existing technologies aim to minimize the bending of the photosensitive chip. For example, this can be achieved by strengthening the bending strength and / or stiffness of the circuit board (e.g., attaching a reinforcing plate to the back of the circuit board) to prevent bending and thus reduce the bending of the photosensitive chip.

[0004] However, in practice, the inventors of this application have found that: on the one hand, even if the bending degree of the photosensitive chip is reduced to the lowest possible level by using a reinforcing plate, the actual imaging quality of the camera module is not significantly optimized and the consistency of the actual imaging quality is relatively poor; on the other hand, the use of the reinforcing plate also brings some new technical problems, such as poor grounding performance and poor heat dissipation performance.

[0005] Therefore, the phenomenon of image sensor bending needs to be re-examined in order to obtain a camera module with better performance. Summary of the Invention

[0006] One advantage of this application is that it provides a photosensitive component, a camera module, and an electronic device, wherein the photosensitive component has an adjustment layer disposed below the circuit board for adjusting the curvature of the photosensitive chip, so that the curvature of the photosensitive chip is adapted to the field curvature of the optical lens through the structural configuration of the adjustment layer. In this way, the camera module has more optimized imaging quality and relatively higher consistency in actual imaging quality.

[0007] Another advantage of this application is that it provides a photosensitive component, a camera module, and an electronic device, wherein the curvature of the photosensitive chip can be adjusted by the structural configuration of the adjustment layer so that the field curvature of the photosensitive chip corresponds to the field curvature of the optical lens. In other words, in the embodiments of this application, the curvature of the photosensitive chip is an effective variable for optimizing the actual imaging quality of the camera module.

[0008] Another advantage of this application is that it provides a photosensitive component, a camera module, and an electronic device, wherein the curvature of the photosensitive chip can be adjusted and adapted by the adjustment layer, so that multiple optical lenses with different field curvature values ​​can also produce a camera module with good field curvature consistency. That is, in the embodiments of this application, the inconsistency of the field curvature values ​​of the optical lenses can be adapted by adjusting the curvature of the photosensitive chip, thereby improving the effective utilization rate of the optical lenses.

[0009] Another advantage of this application is that it provides a photosensitive component, a camera module, and an electronic device, wherein, in one embodiment of this application, the adjustment layer has a slot extending through the adjustment layer to expose at least a portion of a conductive layer for grounding formed on the lower surface of the circuit board, thereby improving the grounding performance of the camera module.

[0010] Another advantage of this application is that it provides a photosensitive component, a camera module, and an electronic device, wherein, in one embodiment of this application, the adjustment layer has a slot extending through the adjustment layer to expose at least a portion of the lower surface of the circuit board, thereby improving the heat dissipation performance of the camera module.

[0011] Another advantage of this application is that it provides a photosensitive component, a camera module, and an electronic device, wherein the adjustment layer covers the first type of conductive vias for communication within the circuit board body to protect the first type of conductive vias from damage during the manufacturing, transportation, and use of the camera module.

[0012] Other advantages and features of this application will become apparent from the following description and can be realized by means and combinations particularly pointed out in the claims.

[0013] To achieve at least one of the above objectives or advantages, this application provides a photosensitive component comprising:

[0014] Image sensor; and

[0015] A circuit board assembly includes a circuit board body and an adjustment layer, wherein a photosensitive chip is disposed on and electrically connected to the circuit board body, and the adjustment layer has a structural configuration for adjusting the curvature of the photosensitive chip.

[0016] In the photosensitive assembly according to this application, the adjustment layer is formed on the lower surface of the circuit board body, and the structural configuration of the adjustment layer is configured to adjust the curvature of the circuit board to adjust the curvature of the photosensitive chip.

[0017] In the photosensitive component according to this application, the structural configuration includes a difference between the coefficient of thermal expansion of the adjustment layer and the coefficient of thermal expansion of the circuit board body.

[0018] In the photosensitive component according to this application, the structural configuration includes an adjustment layer with a thickness ranging from 0.1 mm to 0.4 mm.

[0019] In the photosensitive component according to this application, the thickness of the adjustment layer ranges from 0.1 mm to 0.2 mm.

[0020] In the photosensitive assembly according to this application, the structural configuration includes the adjustment layer having a thickness dimension less than or equal to 120% of the thickness dimension of the circuit board body.

[0021] In the photosensitive assembly according to this application, the thickness of the adjustment layer is less than or equal to 110% of the thickness of the circuit board body.

[0022] In the photosensitive component according to this application, the thickness of the adjustment layer is less than or equal to the thickness of the circuit board body.

[0023] In the photosensitive assembly according to this application, the structural configuration includes the adjustment layer having at least one slot recessed on its lower surface.

[0024] In the photosensitive component according to this application, the depth dimension of the at least one slot is less than or equal to the thickness of the adjustment layer.

[0025] In the photosensitive component according to this application, the slot is provided on the central axis of the circuit board body.

[0026] In the photosensitive component according to this application, the at least one slot includes at least two slots, wherein the at least two slots are symmetrically distributed with respect to a central axis set about the circuit board body.

[0027] In the photosensitive component according to this application, the at least one slot includes at least two slots, wherein the at least two slots are arranged uniformly and at intervals along the circumference of the adjustment layer relative to a central axis set by the circuit board body.

[0028] In the photosensitive assembly according to this application, the distance between the outermost edge of the slot and the periphery of the adjustment layer is greater than or equal to 0.1 mm.

[0029] In the photosensitive assembly according to this application, the distance between the outermost edge of the slot and the periphery of the adjustment layer is greater than or equal to 0.3 mm.

[0030] In the photosensitive component according to this application, the adjustment layer is integrally formed on the lower surface of the circuit board.

[0031] In the photosensitive component according to this application, the adjustment layer is made of a resin material.

[0032] In the photosensitive component according to this application, the curvature of the circuit board body is such that the height difference between the peripheral area of ​​the circuit board and the middle area of ​​the circuit board body ranges from -25µm to 25µm.

[0033] In the photosensitive component according to this application, the degree of curvature of the photosensitive chip is such that the height difference between the edge region of the photosensitive chip and the middle region of the photosensitive chip ranges from -5µm to 5µm.

[0034] In the photosensitive component according to this application, the curvature of the circuit board body is such that the height difference between the peripheral area of ​​the circuit board and the middle area of ​​the circuit board body ranges from -100µm to 100µm.

[0035] In the photosensitive component according to this application, the degree of curvature of the photosensitive chip is such that the height difference between the edge region of the photosensitive chip and the middle region of the photosensitive chip ranges from -30µm to 30µm.

[0036] In the photosensitive component according to this application, at least one of the at least one slot extends through the adjustment layer to expose at least a portion of the lower surface of the circuit board.

[0037] In the photosensitive assembly according to this application, the circuit board body includes a conductive layer formed on the lower surface of the circuit board for grounding, and the slot penetrating the adjustment layer exposes at least a portion of the conductive layer.

[0038] In the photosensitive component according to this application, the slot penetrating the adjustment layer is formed in the edge region of the adjustment layer.

[0039] In the photosensitive assembly according to this application, the circuit board body includes multiple wiring layers formed between its upper surface and its lower surface, the multiple wiring layers being communicatively connected through first-type conductive vias, wherein the area of ​​the adjustment layer covering the lower surface of the circuit board body includes at least a portion of the first-type conductive vias corresponding to the area of ​​the lower surface of the circuit board body.

[0040] In the photosensitive assembly according to this application, the circuit board assembly further includes a second conductive layer electrically connected to the conductive layer.

[0041] In the photosensitive component according to this application, the second conductive layer is formed within the slot that extends through the adjustment layer.

[0042] In the photosensitive component according to this application, the second conductive layer is further formed on the lower surface of the adjustment layer.

[0043] In the photosensitive assembly according to this application, the sidewall of the slot penetrating the adjustment layer is inclined to the lower surface of the circuit board body.

[0044] In the photosensitive assembly according to this application, the circuit board assembly further includes a flexible connecting plate electrically connected to the circuit board body and a connector connected to the flexible connecting plate, wherein there is a certain gap between the adjustment layer and the flexible connecting plate.

[0045] According to another aspect of this application, a camera module is further provided, comprising:

[0046] Optical lenses; and

[0047] In the photosensitive assembly described above, the optical lens is positioned along the photosensitive path of the photosensitive assembly.

[0048] In the camera module according to this application, the field curvature of the optical lens is adapted to the curvature of the photosensitive chip.

[0049] According to another aspect of this application, an electronic device is also provided, comprising:

[0050] The main body of the electronic device; and

[0051] A camera module assembled in the main body of the electronic device includes an optical lens and a photosensitive component as described above, wherein the optical lens is positioned on the photosensitive path of the photosensitive component.

[0052] In the electronic device according to this application, the electronic device body includes a ground wire having an electrical connection terminal, the electrical connection terminal of the ground wire being electrically connected to the conductive layer.

[0053] In the electronic device according to this application, the main body of the electronic device includes a ground wire having an electrical connection terminal, the electrical connection terminal of the ground wire being electrically connected to the second conductive layer.

[0054] The further objectives and advantages of this application will become fully apparent from the following description and accompanying drawings.

[0055] These and other objects, features and advantages of this application are fully apparent from the following detailed description, the accompanying drawings and the claims. Attached Figure Description

[0056] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0057] Figure 1 The illustration shows a schematic diagram of a camera module according to an embodiment of this application.

[0058] Figure 2 The illustration shows a schematic diagram of the photosensitive component of the camera module according to an embodiment of this application.

[0059] Figure 3 The illustration shows a bending schematic of the circuit board assembly of the photosensitive component according to an embodiment of this application.

[0060] Figure 4 The illustration shows a bending schematic of the circuit board assembly and the photosensitive chip of the photosensitive component according to an embodiment of this application.

[0061] Figure 5A The illustration shows a schematic diagram of one arrangement of the slot position of the adjustment layer according to an embodiment of this application.

[0062] Figure 5B The illustration shows another configuration of the slot position of the adjustment layer according to an embodiment of this application.

[0063] Figure 5C The illustration shows another arrangement of the slot position of the adjustment layer according to an embodiment of this application.

[0064] Figure 5D The illustration shows another arrangement of the slot position of the adjustment layer according to an embodiment of this application.

[0065] Figure 6 The illustration shows yet another schematic diagram of the slotted position in the adjustment layer according to an embodiment of this application.

[0066] Figure 7 The illustration shows a schematic diagram of the setting position of the adjustment layer according to an embodiment of this application.

[0067] Figure 8 The illustration shows a schematic diagram of a modified embodiment of the photosensitive component according to an embodiment of this application.

[0068] Figure 9 The illustration shows a schematic diagram of another modified embodiment of the photosensitive component according to an embodiment of this application.

[0069] Figure 10 The illustration shows a schematic diagram of the circuit board body of the photosensitive component according to an embodiment of this application.

[0070] Figure 11 The illustration shows a schematic diagram of the relative positional relationship between the adjustment layer and the circuit board body according to an embodiment of this application.

[0071] Figure 12 The illustration shows a schematic diagram of the electrical connection between the camera module and the main body of the electronic device according to an embodiment of this application.

[0072] Figure 13A The illustration shows a schematic diagram of yet another modified embodiment of the photosensitive component according to an embodiment of this application.

[0073] Figure 13B The illustration shows a schematic diagram of yet another modified embodiment of the photosensitive component according to an embodiment of this application.

[0074] Figure 13C The illustration shows a schematic diagram of yet another modified embodiment of the photosensitive component according to an embodiment of this application.

[0075] Figure 13D The illustration shows a schematic diagram of yet another modified embodiment of the photosensitive component according to an embodiment of this application.

[0076] Figure 13E The illustration shows a schematic diagram of yet another modified embodiment of the photosensitive component according to an embodiment of this application.

[0077] Figure 13F The diagram shows... Figure 13E The diagram shows an enlarged layout of a modified implementation of the photosensitive component.

[0078] Figure 14 The illustration shows a schematic diagram of an electronic device according to an embodiment of this application. Detailed Implementation

[0079] Hereinafter, exemplary embodiments according to this application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments of this application. It should be understood that this application is not limited to the exemplary embodiments described herein.

[0080] Application Overview

[0081] As mentioned earlier, due to the large area and thinness of large-sized photosensitive chips, they are more prone to bending under external forces or temperature changes during assembly or reliability testing, leading to a decrease in the imaging quality of the camera module. To optimize the imaging quality of the camera module, existing technical approaches focus on minimizing the bending degree of the photosensitive chip. For example, this can be achieved by strengthening the bending strength and / or stiffness of the circuit board (e.g., attaching a reinforcing plate to the back of the circuit board) to prevent bending and thus reduce the bending degree of the photosensitive chip.

[0082] However, in practice, the inventors of this application found that: on the one hand, even if the bending degree of the photosensitive chip is reduced to the lowest possible level by using a reinforcing plate, the actual imaging quality of the camera module is not significantly optimized and the consistency of the actual imaging quality is relatively poor; on the other hand, the use of the reinforcing plate also brings some new technical problems, such as poor grounding performance and poor heat dissipation performance.

[0083] The inventors of this application discovered that the imaging quality of a camera module is affected not only by the curvature of the photosensitive chip (which affects its field curvature) but also by the field curvature of the optical lens. The key to improving the imaging quality of a camera module lies in ensuring that the field curvature of the optical lens matches that of the photosensitive chip. In other words, the curvature of the photosensitive chip itself is neither a necessary nor sufficient condition for the imaging quality of the camera module. Therefore, the existing technical approach of "reducing the curvature of the photosensitive chip as much as possible" does not necessarily improve the imaging quality of the camera module. Or, to put it another way, the curvature of the photosensitive chip is not necessarily a negative factor causing a decrease in the imaging quality of the camera module.

[0084] Furthermore, the inventors of this application discovered in actual production that different optical lenses often have different field curvature values. If the field curvature value of an optical lens is too large, it will be considered a defective product and scrapped in actual production, resulting in low effective utilization of the optical lens. The inventors of this application realized that the field curvature value of an optical lens is a relative concept, and whether it is too large depends on the field curvature value of the image sensor. In other words, the field curvature value of the image sensor can be adjusted to match the field curvature value of the optical lens, so that optical lenses that were originally considered defective can also be used effectively.

[0085] Based on the aforementioned changes in understanding, the basic concept of this application is to regard the curvature of the photosensitive chip as an effective variable affecting the imaging quality of the camera module, and to adjust the curvature of the photosensitive chip through structural configuration to adapt it to the field curvature value of the optical lens, thereby improving the imaging quality and the consistency of the imaging quality.

[0086] Based on this, this application provides a photosensitive component, a camera module, and an electronic device. The photosensitive component includes a photosensitive chip and a circuit board assembly. The circuit board assembly includes a circuit board body and an adjustment layer. The photosensitive chip is disposed on and electrically connected to the circuit board body. The adjustment layer is formed on the lower surface of the circuit board body and has a structural configuration for adjusting the curvature of the circuit board body to adjust the curvature of the photosensitive chip. Thus, the curvature of the photosensitive chip is adjusted by the adjustment layer to adapt to the field curvature of the optical lens.

[0087] After introducing the basic principles of this application, various non-limiting embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0088] Exemplary camera module and photosensitive component

[0089] like Figure 1 As shown, a camera module according to an embodiment of this application is illustrated, wherein the camera module 30 includes: a photosensitive component 20 and an optical lens 10 held on the photosensitive path of the photosensitive component 20. Here, in the case of Figure 1 In the illustrated camera module 30, the camera module 30 is implemented as a fixed-focus camera module 30, that is, the relative positional relationship between the optical lens 10 and the photosensitive component 20 remains constant.

[0090] Those skilled in the art will understand that the type of camera module 30 in the embodiments of this application is not limited to this application. For example, in other examples of this application, the camera module 30 can also be implemented as a dynamic focus camera module, that is, the camera module 30 further includes a driving element (not shown in the figure) disposed on the optical lens 10 and the photosensitive component 20, wherein the driving element is used to carry and drive the optical lens 10 to move along the photosensitive path, so as to change the relative positional relationship between the optical lens 10 and the photosensitive component 20. Furthermore, the camera module 30 can also be implemented as a stabilized camera module, that is, the camera module 30 further includes a stabilization motor disposed on the optical lens 10 and the photosensitive component 20, so as to achieve stabilization function through the stabilization motor. As another example, the camera module 30 can also include components such as prisms to form a periscope camera module.

[0091] Figure 2 The illustration shows a schematic diagram of the photosensitive component 20 according to an embodiment of this application, as follows: Figure 2 As shown in the embodiment of this application, the photosensitive component 20 includes: a circuit board assembly 21, a photosensitive chip 22, a package 23, a filter element 24, and at least one electronic component 25. Wherein, in... Figure 2In the illustrated photosensitive assembly 20, the photosensitive chip 22 is disposed on the circuit board assembly 21 and electrically connected to the circuit board assembly 21 via an electrical connection medium such as a lead wire; the at least one electronic component 25 is electrically connected to the circuit board assembly 21 and is located in the area surrounding the photosensitive chip 22; the encapsulation portion 23 encapsulates the at least one electronic component 25 and the photosensitive chip 22 on the circuit board assembly 21, and the encapsulation portion 23 has a light window through which light passing through the optical lens 10 can enter the photosensitive area of ​​the photosensitive chip 22; the filter element 24 is disposed on the photosensitive path of the photosensitive chip 22 to filter the light incident on the photosensitive chip 22.

[0092] like Figure 2 As shown in the embodiment of this application, the circuit board assembly 21 includes a circuit board body 211, the photosensitive chip 22 is attached to the upper surface of the circuit board body 211 by an adhesive, and the encapsulation part 23 is mounted on the upper surface of the circuit board body 211 to encapsulate the at least one electronic component 25 and the photosensitive chip 22 onto the circuit board body 211. Specifically, in cases such as Figure 2 In the illustrated photosensitive component 20, the encapsulation portion 23 is implemented as a support with an independent structure, which can be attached to the upper surface of the circuit board body 211 by an adhesive. It should be understood that in other embodiments of this application, the encapsulation portion 23 can also be formed on the upper surface of the circuit board body 211 in other ways, for example, it can be integrally formed on the upper surface of the circuit board body 211 by transfer molding, injection molding, compression molding, or other molding processes. This is not limited to the present application.

[0093] In particular, such as Figure 2 As shown in this embodiment, the circuit board assembly 21 further includes an adjustment layer 212, wherein the adjustment layer 212 can act on the circuit board body 211 to change the curvature of the circuit board body 211, thereby controllably adjusting the curvature of the photosensitive chip 22. It should be understood that the curvature of the photosensitive chip 22 affects its field curvature value. Accordingly, when the field curvature value of the photosensitive chip 22 is adjusted to match the field curvature value of the optical lens 10, the camera module 30 has a more optimized and consistent imaging quality.

[0094] Furthermore, such as Figure 2As shown, in this embodiment, the adjustment layer 212 is formed on the lower surface of the circuit board body 211, so that the adjustment layer 212 and the circuit board body 211 are structurally associated. For example, in one possible implementation of this application, the adjustment layer 212 is integrally bonded to the lower surface of the circuit board body 211 by processes such as injection molding, transfer molding, or compression molding, so that the adjustment layer 212 can change the stress distribution on the circuit board body 211 to adjust the degree of curvature of the circuit board body 211. In particular, in this embodiment, the adjustment layer 212 has a structural configuration for adjusting the degree of curvature of the circuit board body 211 to adjust the degree of curvature of the photosensitive chip 22.

[0095] Specifically, in this embodiment, the structural configuration of the adjustment layer 212 firstly includes a difference between the thermal expansion coefficient of the adjustment layer 212 and the thermal expansion coefficient of the circuit board body 211. It should be understood that when there is a difference between the thermal expansion coefficient (or flexural modulus) of the material used to manufacture the adjustment layer 212 and the thermal expansion coefficient (or flexural modulus) of the circuit board body 211, temperature changes can cause the adjustment layer 212 and the circuit board body 211 to bend to different degrees, thereby causing the circuit board body 211 to bend downwards, thus causing the photosensitive chip 22 to bend downwards. Experimental tests have shown that in this embodiment, by controlling the difference between the thermal expansion coefficients of the adjustment layer 212 and the circuit board body 211, the degree of bending of the circuit board body 211 can be controlled such that the height difference between the peripheral area of ​​the circuit board and the middle area of ​​the circuit board body 211 ranges from -25µm to 25µm. Figure 3 As shown, the curvature of the photosensitive chip 22 can be controlled such that the height difference between the edge region and the middle region of the photosensitive chip 22 ranges from -5µm to 5µm. Figure 4 As shown.

[0096] Further, in this embodiment, the structural configuration of the adjustment layer 212 further includes the thickness of the adjustment layer 212, and more specifically, the relationship between the thickness of the adjustment layer 212 and the thickness of the circuit board body 211. Specifically, in this embodiment, the thickness of the adjustment layer 212 can be set to be less than or equal to 120% of the thickness of the circuit board body 211, or the thickness of the adjustment layer 212 can be set to be less than or equal to 110% of the thickness of the circuit board body 211, or the thickness of the adjustment layer 212 can be set to be less than or equal to the thickness of the circuit board body 211. In particular, in this embodiment, the thickness of the adjustment layer 212 can range from 0.1 mm to 0.4 mm, preferably from 0.1 mm to 0.2 mm.

[0097] Furthermore, in this embodiment, the structural configuration of the adjustment layer 212 further includes at least one slot 213 recessed on its lower surface. It should be understood that the adjustment layer 212 has different thicknesses at the slot 213 and outside the slot 213, such that the adjustment layer 212 is bent to different degrees at the slot 213 and outside the slot 213, thereby increasing the degree of bending of the circuit board body 211. Experimental testing revealed that, in this embodiment, by controlling the configuration of the slot 213, the curvature of the circuit board body 211 can be controlled such that the height difference between the peripheral area of ​​the circuit board and the middle area of ​​the circuit board body 211 ranges from -100µm to 100µm. In other words, in this embodiment, by setting the parameters of the slot 213, the height difference between the peripheral area of ​​the circuit board body 211 and the middle area of ​​the circuit board body 211 can be controlled to any value between -100µm and 100µm. Furthermore, the photosensitive element can be controlled... The degree of curvature of the chip 22 is such that the height difference between the edge region of the photosensitive chip 22 and the middle region of the photosensitive chip 22 is in the range of -30um to 30um. That is, in this embodiment of the application, by setting the parameters of the slot 213, the height difference between the edge region of the photosensitive chip 22 and the middle region of the photosensitive chip 22 can be controlled to be any value of -30um to 30um (or, it can be controlled to be between -25um and 25um; or, it can be controlled to be between -20um and 20um; or, it can be controlled to be between -15um and 15um).

[0098] It is worth mentioning that when the adjustable range of the curvature of the photosensitive chip 22 is expanded to such a large extent, the photosensitive chip 22 can be adapted to more optical lenses 10 with different field curvature values. That is, optical lenses 10 with different field curvature values ​​can be used to produce camera modules 30 with qualified imaging quality, thereby improving the utilization rate of the optical lenses 10 and reducing costs. Furthermore, multiple batches of optical lenses 10 with different field curvature values ​​can produce camera modules 30 with good field curvature consistency.

[0099] Furthermore, in this embodiment of the application, in order to obtain a better adjustment effect, the configuration of the slot 213 is limited. That is, in this embodiment of the application, the structural configuration of the adjustment layer 212 further includes the configuration of the slot 213.

[0100] Specifically, in the embodiments of this application, the depth of the at least one slot 213 is less than or equal to the thickness of the circuit board body 211; the shape of the slot 213 is not limited to the present application, and it can be a rectangular, circular, ring-shaped symmetrical shape, or other suitable asymmetrical shape; the number of slots 213 is also not limited to the present application, and it can be singular or plural.

[0101] Specifically, in this embodiment, the location of the slot 213 is defined. Specifically, when the number of slots 213 exceeds two (i.e., the at least one slot 213 includes at least two slots 213), preferably, the at least two slots 213 are symmetrically distributed with respect to the central axis of the circuit board body 211. It should be understood that when the at least two slots 213 are symmetrically distributed with respect to the central axis of the circuit board body 211, the circuit board body 211 can bend more uniformly and evenly towards its central axis, thereby allowing the photosensitive chip 22 to also bend more uniformly and evenly towards its central region. When the at least one slot 213 includes only one slot 213, preferably, the slot 213 is located on the central axis of the circuit board body 211.

[0102] Similarly, in order to control the bending effect of the photosensitive chip 22, in other examples of this application, when the number of slots 213 exceeds two (i.e., the at least one slot 213 includes at least two slots 213), the at least two slots 213 are arranged uniformly and spaced apart relative to a center set by the adjustment layer 212 along the circumference of the adjustment layer 212. For example, when the at least two slots 213 are implemented as three slots 213, they are arranged uniformly and spaced apart at 120° relative to a center set by the adjustment layer 212 along the circumference of the adjustment layer 212.

[0103] Figures 5A to 5D The illustration shows a specific example of the position setting of the slot 213 according to an embodiment of this application. For example... Figures 5A to 5C As shown, in these examples, the adjustment layer 212 is provided with at least one indicator line for indicating the set position of the slot 213, specifically, in Figures 5A to 5C In the illustrated example, the adjustment layer 212 uses its two diagonals and two axially symmetrical lines as indicator lines. Specifically, in... Figure 5A In the illustrated example, the at least one slot 213 includes four slots 213, which are respectively disposed on two diagonals of the adjustment layer 212 and the four slots 213 are symmetrically distributed with respect to the two axes of symmetry of the adjustment layer 212. Figure 5B In the illustrated example, the at least one slot 213 includes two slots 213, which are respectively disposed on both sides of the transverse axis of symmetry of the adjustment layer 212 and the two slots 213 are symmetrically distributed with respect to the longitudinal axis of symmetry of the adjustment layer 212 (similarly, the two slots 213 are symmetrically distributed with respect to the transverse axis of symmetry of the adjustment layer 212). In such... Figure 5C In the illustrated example, the at least one slot 213 includes four interconnected slots 213 forming a cross shape, which are respectively disposed on two axes of symmetry of the adjustment layer 212 and the four slots 213 are symmetrically distributed with respect to the two axes of symmetry of the adjustment layer 212. Figure 5D In the illustrated example, the at least one slot 213 includes only one slot 213, which is disposed in the central region of the adjustment layer 212 and the slot 213 is symmetrically distributed with respect to the two axes of symmetry of the adjustment layer 212.

[0104] It should be understood that in other examples of this application, the indicator lines of the adjustment layer 212 can also be determined in other ways, such as using the two diagonals, two axially symmetric lines, or an eighth line of the adjustment layer 212 as indicator lines. This is not limited to this application. Similarly, in other examples of this application, the position of the at least one slot 213 can also be arranged in other ways. This is not limited to this application.

[0105] It is worth mentioning that, such as Figure 6 As shown, when a portion of the at least one slot 213 is located adjacent to the edge of the adjustment layer 212, preferably, in order to prevent the edge of the slot 213 from breaking, the distance c between the outermost edge of the slot 213 located adjacent to the edge of the adjustment layer 212 and the periphery of the adjustment layer 212 is greater than or equal to 0.1 mm, preferably, the distance c is greater than or equal to 0.3 mm.

[0106] It is also worth mentioning that, such as Figure 7 As shown in this embodiment, the circuit board assembly 21 further includes a flexible connecting plate 214 electrically connected to the circuit board body 211 and a connector 215 connected to the flexible connecting plate 214. To ensure sufficient strength and rigidity between the circuit board body 211 and the flexible connecting plate 214, preferably, in this embodiment, a gap is left on one side of the circuit board body 211 and the flexible connecting plate 214, wherein this gap is not provided in the adjustment layer 212 nor in the encapsulation portion 23. That is, to ensure sufficient strength and rigidity between the circuit board body 211 and the flexible connecting plate 214, in this embodiment, there is a certain gap between the adjustment layer 212 and the flexible connecting plate 214, so that the flexible connecting plate 214 and the circuit board body 211 have sufficient bonding space to improve the bonding strength and rigidity between them.

[0107] Furthermore, in specific implementation, the inventors of this application have discovered that when the adjustment layer 212 completely covers the conductive layer 2115 for grounding formed on the lower surface of the circuit board body 211 (for example, the depth of all the slots 213 is less than the thickness of the adjustment layer 212, that is, all the slots 213 are grooves), the grounding performance of the camera module 30 is poor, which can easily cause excessively high voltage at local locations, damaging the device and posing a safety hazard. At the same time, it may also affect the imaging performance of the camera module 30.

[0108] Specifically, such as Figure 10 As shown in this embodiment, the circuit board body 211 includes multiple wiring layers 2111 and multiple insulating layers 2112 formed between its upper and lower surfaces. The multiple wiring layers 2111 and multiple insulating layers 2112 are interleaved and laminated together. The portion of the multiple wiring layers 2111 formed on the lower surface of the circuit board body 211 is the conductive layer 2115 (more specifically, in this embodiment, the conductive layer 2115 is a copper layer). The multiple wiring layers 2111 are connected and communicated through conductive vias. More specifically, in the circuit board body 211, the conductive vias include two types: a first type of conductive via 2113 for signal connection (i.e., to achieve communicative connection between the multiple wiring layers 2111), and a second type of conductive via 2114 for electromagnetic shielding, heat dissipation, and grounding.

[0109] To enhance the grounding performance of the photosensitive component 20, such as Figure 8As shown, in a modified embodiment of this application, at least one slot 213 penetrates through the adjustment layer 212 to expose at least a portion of the lower surface of the circuit board. That is, in this modified embodiment, at least one through slot exists in the slot 213. In particular, the slot 213 penetrating the adjustment layer 212 is formed at a location corresponding to the conductive layer 2115, so that at least a portion of the conductive layer 2115 is exposed. In this way, not only is the grounding performance of the camera module 30 enhanced, but also its heat dissipation performance is improved. Figure 12 The illustration shows a schematic diagram of the electrical connection between the camera module 30 and the electronic device body 101 according to an embodiment of this application, as follows: Figure 12 As shown, the ground wire 102 of the electronic device body has an electrical connection terminal 103, which is electrically connected to the portion of the conductive layer 2115 exposed in the slot 213, thereby connecting the camera module 30 to the ground wire 102 of the electronic device. Preferably, in this embodiment, the shape of the electrical connection terminal 103 is adapted to the shape of the slot 213.

[0110] Figure 9 The illustration shows a schematic diagram of another modified embodiment of the photosensitive component 20 according to an embodiment of this application. Figure 9 In the illustrated modified embodiment, the slot 213 (the through slot) penetrating the adjustment layer 212 is formed in the edge region of the adjustment layer 212, that is, the through slot is an edge slot.

[0111] To improve the grounding and heat dissipation performance of the camera module 30, in this embodiment, the circuit board assembly 21 further includes a second conductive layer 216 electrically connected to the conductive layer 2115, such as... Figure 13A As shown. Accordingly, the camera module 30 can be grounded through the second conductive layer 216.

[0112] In such Figure 13A In the illustrated modified embodiment, the second conductive layer 216 is formed within the slot 213 penetrating the adjustment layer 212. For example, the second conductive layer 216 can be disposed within the slot 213 penetrating the adjustment layer 212 by means of spraying, printing, welding, coating, lamination, etc. In specific implementations, the second conductive layer 216 includes, but is not limited to: conductive adhesive, conductive silver paste, conductive ink, metal sheet, metal film, conductive film, etc., wherein the thickness of the second conductive layer 216 can be set to 2um-30um, preferably 4um-20um.

[0113] Furthermore, in such Figure 13AIn the illustrated modified embodiment, the second conductive layer 216 covers the sidewall of the slot 213 penetrating the adjustment layer 212, the conductive layer 2115 is exposed in the area within the slot 213, and the lower surface of the adjustment layer 212. That is, in such a modified embodiment... Figure 13A In the illustrated modified embodiment, the second conductive layer 216 covers the entire back surface of the adjustment layer 212. Furthermore, the thickness of the second conductive layer 216 at each location can be uniform or non-uniform, and this is not limited to the present application.

[0114] Figure 13B The illustration shows a schematic diagram of yet another modified embodiment of the photosensitive component 20 according to an embodiment of this application. In such a way... Figure 13B In the illustrated modified implementation, the second conductive layer 216 covers a portion of the conductive layer 2115 exposed within the slot 213 and a portion of the sidewall of the slot 213.

[0115] Figure 13C The illustration shows a schematic diagram of yet another modified embodiment of the photosensitive component 20 according to an embodiment of this application. In such a way... Figure 13C In the illustrated modified implementation, the second conductive layer 216 fills the slot 213 that penetrates the adjustment layer 212.

[0116] Figure 13D The illustration shows a schematic diagram of yet another modified embodiment of the photosensitive component 20 according to an embodiment of this application. In such a way... Figure 13D In a modified embodiment shown, the circuit board assembly 21 further includes a conductive element 217 disposed between the conductive layer 2115 and the second conductive layer 216. Specifically, in this modified embodiment, the conductive element 217 may be implemented as a thin metal sheet, the shape and size of which are adapted to the slot 213.

[0117] Figure 13E The illustration shows a schematic diagram of yet another modified embodiment of the photosensitive component 20 according to an embodiment of this application. Figure 13F The diagram shows... Figure 13E A partially enlarged schematic diagram of a modified embodiment of the photosensitive component 20 is shown. Figure 13E and Figure 13FAs shown, in this modified embodiment, in order to reduce the difficulty of laying the second conductive layer 216 and improve the bonding strength between the second conductive layer 216 and the adjustment layer 212, in this modified embodiment, the sidewall of the slot 213 penetrating the adjustment layer 212 is inclined to the lower surface of the circuit board body 211, and there is an inclination angle between the sidewall of the slot 213 and the lower surface of the circuit board body 211. In this modified embodiment, the inclination angle can be set between 3° and 80°, further, it can be between 5° and 60°, 5° and 30°, or other reasonable ranges, which are not limited to this application.

[0118] As previously described, in this embodiment, the circuit board body 211 includes two types of conductive vias: a first type of conductive via 2113 for signal connection and a second type of conductive via 2114 for electromagnetic shielding, heat dissipation, and grounding. Furthermore, it should be understood that when the adjustment layer 212 is integrally bonded to the lower surface of the circuit board body 211 through processes such as injection molding, transfer molding, or compression molding, the slots 213 of the adjustment layer 212 are pressed by the pressure head of the molding die so that the corresponding positions are not covered by the material used to manufacture the adjustment layer 212. Preferably, during the manufacturing process, the pressure head of the molding die should avoid the first type of conductive via 2113 as much as possible (e.g., ...). Figure 9 As shown in the figure, this is to prevent the first type of conductive via 2113 from being damaged by the pressure head, thereby compromising the conductivity of the circuit board. That is, preferably, in this embodiment of the application, the area of ​​the adjustment layer 212 covering the lower surface of the circuit board body 211 includes at least a portion of the area of ​​the first type of conductive via 2113 corresponding to the lower surface of the circuit board body 211.

[0119] In summary, the camera module 30 and its photosensitive component 20 based on the embodiments of this application are explained. By configuring an adjustment layer 212 below the circuit board for adjusting the curvature of the photosensitive chip 22, the curvature of the photosensitive chip 22 is adapted to the field curvature of the optical lens 10 through the structural configuration of the adjustment layer 212. In this way, the camera module 30 has more optimized imaging quality and relatively higher consistency in actual imaging quality.

[0120] Furthermore, in this embodiment, the curvature of the photosensitive chip 22 can be adjusted by the structural configuration of the adjustment layer 212, so that the field curvature of the photosensitive chip 22 corresponds to the field curvature of the optical lens 10. In other words, in this embodiment, the curvature of the photosensitive chip 22 is an effective variable for optimizing the actual imaging quality of the camera module 30.

[0121] Furthermore, in this embodiment, the curvature of the photosensitive chip 22 can be adjusted and adapted by the adjustment layer 212, so that multiple optical lenses 10 with different field curvature values ​​can also produce a camera module 30 with good field curvature consistency. That is to say, in this embodiment, the inconsistency in the field curvature values ​​of the optical lenses 10 can be adapted by adjusting the curvature of the photosensitive chip 22, thereby improving the effective utilization rate of the optical lenses 10.

[0122] Furthermore, in one embodiment of this application, the adjustment layer 212 has a slot 213 extending through the adjustment layer 212 to expose at least a portion of the conductive layer 2115 for grounding formed on the lower surface of the circuit board, thereby improving the grounding performance of the camera module 30.

[0123] Furthermore, in one embodiment of this application, the adjustment layer 212 has a slot 213 extending through the adjustment layer 212 to expose at least a portion of the lower surface of the circuit board, thereby improving the heat dissipation performance of the camera module 30.

[0124] Indicative electronic devices

[0125] According to another aspect of this application, an electronic device is also provided. Figure 14 The illustration shows a schematic diagram of an electronic device according to an embodiment of this application, such as... Figure 14 As shown, the electronic device 100 includes an electronic device body 101 and a camera module 30 assembled on the electronic device body 101. Specifically, the camera module 30 is installed on the front side of the electronic device body 101 as a front-facing camera module 30; or it is installed on the rear side of the electronic device body 101 as a rear-facing camera module 30. This is not limited to the present application.

[0126] like Figure 12 As shown, in this embodiment of the application, the electronic device body 101 includes a ground wire 102 with an electrical connection terminal 103. The electrical connection terminal 103 is electrically connected to the portion of the conductive layer 2115 exposed in the slot 213, thereby connecting the camera module 30 to the ground wire 102 of the electronic device 100. Preferably, in this embodiment of the application, the shape of the electrical connection terminal 103 is adapted to the shape of the slot 213. It should be understood that in other examples of this application, the electrical connection terminal 103 of the ground wire 102 may also be electrically connected to the second conductive layer 216 to connect the camera module 30 to the ground wire 102 of the electronic device 100.

[0127] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and any variations or modifications may be made to the implementation of the present invention without departing from the stated principles.

Claims

1. A photosensitive component, characterized in that, include: Photosensitive chip; A circuit board assembly includes a circuit board body and an adjustment layer, wherein a photosensitive chip is disposed on and electrically connected to the circuit board body, and the adjustment layer has a structural configuration for adjusting the curvature of the photosensitive chip. The adjustment layer is integrally bonded to the lower surface of the circuit board body by injection molding, transfer molding, or compression molding. The structural configuration of the adjustment layer is configured to adjust the curvature of the circuit board to adjust the curvature of the photosensitive chip, and the structural configuration includes at least one slot recessed in the lower surface of the adjustment layer. The packaging section encapsulates the photosensitive chip onto the circuit board assembly, and the packaging section has a light window that allows light to enter the photosensitive area of ​​the photosensitive chip through the light window. Wherein, at least one of the at least one slots penetrates through the adjustment layer, the circuit board body includes a conductive layer formed on the lower surface of the circuit board for grounding, and the slot penetrating the adjustment layer exposes at least a portion of the conductive layer.

2. The photosensitive component according to claim 1, wherein, The encapsulation part is a bracket mounted on the upper surface of the circuit board body.

3. The photosensitive component according to claim 1, wherein, The structural configuration includes a difference between the coefficient of thermal expansion of the adjustment layer and the coefficient of thermal expansion of the circuit board body.

4. The photosensitive component according to claim 1, wherein, The structural configuration includes an adjustment layer with a thickness ranging from 0.1 mm to 0.4 mm.

5. The photosensitive component according to claim 4, wherein, The thickness of the adjustment layer ranges from 0.1 mm to 0.2 mm.

6. The photosensitive component according to claim 4, wherein, The structural configuration includes an adjustment layer thickness that is less than or equal to 120% of the thickness of the circuit board body.

7. The photosensitive component according to claim 6, wherein, The thickness of the adjustment layer is less than or equal to 110% of the thickness of the circuit board body.

8. The photosensitive component according to claim 7, wherein, The thickness of the adjustment layer is less than or equal to the thickness of the circuit board body.

9. The photosensitive component according to claim 1, wherein, The encapsulation part is integrally formed on the upper surface of the circuit board body through a molding process.

10. The photosensitive component according to claim 1, wherein, The depth of the at least one slot is less than or equal to the thickness of the adjustment layer.

11. The photosensitive component according to claim 1, wherein, The slot is set on the central axis of the circuit board body.

12. The photosensitive component according to claim 1, wherein, The at least one slot includes at least two slots, wherein the at least two slots are symmetrically distributed with respect to a central axis set about the circuit board body.

13. The photosensitive component according to claim 1, wherein, The at least one slot includes at least two slots, wherein the at least two slots are arranged uniformly and at intervals along the circumference of the adjustment layer relative to the central axis set by the circuit board body.

14. The photosensitive component according to claim 1, wherein, The distance between the outermost edge of the slot and the periphery of the adjustment layer is greater than or equal to 0.1 mm.

15. The photosensitive component according to claim 14, wherein, The distance between the outermost edge of the slot and the periphery of the adjustment layer is greater than or equal to 0.3 mm.

16. The photosensitive component according to claim 1, wherein, The adjustment layer is made of resin material.

17. The photosensitive component according to claim 3, wherein, The curvature of the circuit board body is such that the height difference between the peripheral area of ​​the circuit board and the middle area of ​​the circuit board body ranges from -25um to 25um.

18. The photosensitive component according to claim 17, wherein, The curvature of the photosensitive chip is such that the height difference between the edge region and the middle region of the photosensitive chip ranges from -5µm to 5µm.

19. The photosensitive component according to claim 1, wherein, The curvature of the circuit board body is such that the height difference between the peripheral area of ​​the circuit board and the middle area of ​​the circuit board body ranges from -100um to 100um.

20. The photosensitive component according to claim 19, wherein, The degree of curvature of the photosensitive chip is such that the height difference between the edge region and the middle region of the photosensitive chip ranges from -30µm to 30µm.

21. The photosensitive component according to claim 1, wherein, The slot that penetrates the adjustment layer is formed in the edge region of the adjustment layer.

22. The photosensitive component according to claim 1, wherein, The circuit board body includes multiple wiring layers formed between its upper and lower surfaces, and the multiple wiring layers are communicatively connected through first-type conductive vias, wherein the area of ​​the adjustment layer covering the lower surface of the circuit board body includes at least a portion of the area of ​​the lower surface of the circuit board body corresponding to the first-type conductive via.

23. The photosensitive component according to claim 1, further comprising a second conductive layer electrically connected to the conductive layer.

24. The photosensitive component according to claim 23, wherein, The second conductive layer is formed within the slot that extends through the adjustment layer.

25. The photosensitive component according to claim 24, wherein, The second conductive layer is further formed on the lower surface of the adjustment layer.

26. The photosensitive component according to claim 23, wherein, The sidewall of the slot that runs through the adjustment layer is inclined to the lower surface of the circuit board body.

27. The photosensitive component according to claim 1, wherein, The circuit board assembly further includes a flexible connecting plate electrically connected to the circuit board body and a connector connected to the flexible connecting plate, wherein there is a certain gap between the adjustment layer and the flexible connecting plate.

28. A camera module, characterized in that, include: Optical lens; as well as According to any one of claims 1-27, the optical lens is held on the light-sensing path of the photosensitive component.

29. The camera module according to claim 28, wherein, The field curvature of the optical lens is adapted to the curvature of the photosensitive chip.

30. An electronic device, characterized in that, include: The main body of the electronic device; as well as A camera module assembled in the body of the electronic device includes an optical lens and a photosensitive component according to any one of claims 1-27, wherein the optical lens is positioned on the photosensitive path of the photosensitive component.

31. The electronic device according to claim 30, wherein, The main body of the electronic device includes a ground wire with an electrical connection terminal, the electrical connection terminal of which is electrically connected to a conductive layer.

32. The electronic device according to claim 30, wherein, The main body of the electronic device includes a ground wire with an electrical connection terminal, the electrical connection terminal of which is electrically connected to a second conductive layer.

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