Electrochromic module, cover plate assembly, and electronic device

Abstract

The application relates to an electrochromic module, a cover plate assembly and an electronic device. The electrochromic module comprises a metal layer, a first dielectric layer, a first conductive layer, a color-changing material layer and a second conductive layer which are sequentially stacked. At least one side of the metal layer is used to arrange an antenna radiator and is spaced apart from the antenna radiator. The metal layer is grounded. When the antenna radiator is arranged on at least one side of the metal layer, the metal layer in the electrochromic module can be used to isolate the first conductive layer and the second conductive layer from the absorption of electromagnetic waves generated by the antenna radiator. The induced current generated on the metal layer can be introduced into the ground terminal. The interval between the electrochromic module and the middle frame can be further reduced under the premise that the radiation performance of the antenna radiator is not affected. The appearance decoration effect of the rear shell is further improved, and the appearance performance of the rear shell is improved.

Description

Technical Field

[0001] This application relates to the field of antenna technology, and in particular to an electrochromic module, cover plate assembly, and electronic device. Background Technology

[0002] Electrochromic films are a type of color-changing shielding film commonly used in building exterior glass and car rearview mirrors. With the increasingly similar designs of electronic devices (such as mobile phones, tablets, and smartwatches), electrochromic films can bring a new characteristic of changing the appearance of these devices. Taking mobile phones as an example, they primarily use slotted antennas on the frame of the phone casing. When electrochromic films are used on the phone casing, the conductive layer within the electrochromic film absorbs energy, leading to a decrease in the performance of the surrounding antennas. Summary of the Invention

[0003] This application provides an electrochromic module, a cover plate assembly, and an electronic device, which can improve the appearance and decorative effect of the back cover while ensuring that the radiation performance of the antenna radiator is not affected, thereby enhancing the appearance of the back cover.

[0004] An electrochromic module includes: a metal layer, a first dielectric layer, a first conductive layer, a color-changing material layer, and a second conductive layer, which are sequentially stacked.

[0005] At least one side of the metal layer is used to assemble an antenna radiator, and the metal layer is spaced apart from the antenna radiator. The metal layer is provided with a grounding point, and the metal layer is grounded through the grounding point.

[0006] The aforementioned electrochromic module includes a metal layer, a first dielectric layer, a first conductive layer, a color-changing material layer, and a second conductive layer stacked sequentially. When an antenna radiator is located at at least one end of the metal layer, the metal layer in the electrochromic module can isolate the absorption of electromagnetic waves generated by the antenna radiator by the first and second conductive layers. This avoids the energy absorption effect caused by the high sheet resistance of the first and second conductive layers, which could lead to a decrease in the antenna performance of surrounding antenna radiators. Furthermore, by grounding the metal layer, the induced current generated on the metal layer can be directed to the ground, thus preventing the induced current on the metal layer (which is opposite to the current on the antenna radiator) from suppressing the radiation formation of the antenna radiator at the corresponding location. By adding a grounded metal layer to the electrochromic module, the distance between the electrochromic module and the frame can be further reduced while ensuring that the radiation performance of the antenna radiator is not affected, thereby improving the appearance and aesthetics of the back cover.

[0007] A cover plate assembly, comprising:

[0008] An electrochromic module includes a metal layer, a first dielectric layer, a first conductive layer, a color-changing material layer, and a second conductive layer stacked sequentially, wherein the metal layer is provided with a grounding point for grounding.

[0009] The back cover has its inner side connected to the second conductive layer.

[0010] An electronic device, comprising:

[0011] A mid-frame, on which an antenna radiator is disposed; and

[0012] As described above, in the cover assembly, the rear cover is connected to the middle frame, and the electrochromic module is spaced apart from the middle frame.

[0013] In the aforementioned cover assembly and electronic device, when the cover assembly is applied to an electronic device including a mid-frame (e.g., an antenna radiator for radiating radio frequency signals is disposed on the mid-frame), the electrochromic module in the cover assembly can be fitted to the color-changing area of ​​the rear cover. The metal layer in the electrochromic module can isolate the absorption effects of the first and second conductive layers, thereby preventing a decrease in the antenna performance of the surrounding antenna radiators due to the absorption effect of the conductive layers. Furthermore, by grounding the metal layer, the induced current generated on the metal layer can be directed to the ground, thus preventing the induced current on the metal layer (which is opposite to the current on the antenna radiator) from suppressing the radiation formation of the antenna radiator at the corresponding location. By adding a grounded metal layer to the electrochromic module, the gap between the electrochromic module and the frame can be further reduced while ensuring that the radiation performance of the antenna radiator is not affected, thereby further improving the aesthetic appearance of the rear cover and enhancing its overall visual appeal. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a front view of an electronic device in one embodiment;

[0016] Figure 2 for Figure 1 Left view of the electronic device shown;

[0017] Figure 3 for Figure 1Rear view of the electronic device shown;

[0018] Figure 4 This is a rear view of the cover plate assembly in one embodiment;

[0019] Figure 5 This is a cross-sectional view of an electrochromic module in one embodiment;

[0020] Figure 6 A cross-sectional view of the electrochromic module in another embodiment;

[0021] Figure 7 This is a top view of the metal layer in an electrochromic module in one embodiment;

[0022] Figure 8 This is a top view of the metal layer in the electrochromic module in another embodiment;

[0023] Figure 9 This is a top view of the metal layer in the electrochromic module in another embodiment;

[0024] Figure 10 This is a cross-sectional view of the electrochromic module in yet another embodiment;

[0025] Figure 11 This is a schematic diagram of the structure of an electronic device in one embodiment. Detailed Implementation

[0026] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0030] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0032] The electrochromic module described in this application can be applied to electronic devices with wireless communication capabilities. These electronic devices can be handheld devices, in-vehicle devices, wearable devices, computing devices, or other processing devices connected to a wireless modem, as well as various forms of user equipment (UE) (e.g., mobile phones), mobile stations (MS), etc. For ease of description, the devices mentioned above are collectively referred to as electronic devices.

[0033] refer to Figures 1-3In one embodiment, a mobile phone is used as an example for description. The electronic device includes a display assembly 11, a frame 12, and a cover assembly 13. The display assembly 11 includes a display screen 111, which can be an OLED (Organic Light-Emitting Diode) screen or an LCD (Liquid Crystal Display) screen. The display screen 11 can be used to display information and provide an interactive interface for the user. The shape of the display screen 111 can be rectangular or rounded rectangle. A rounded rectangle is sometimes also called a rounded rectangle, meaning that the four corners of the rectangle are rounded, and the four sides of the rectangle are approximately straight lines.

[0034] The bezel 12 can be made of a metal material such as aluminum alloy, magnesium alloy, or stainless steel. The bezel 12 is located on the outer periphery of the display assembly 11 to support and protect the display assembly 11. The bezel 12 can further extend into the electronic device to form a middle plate. The integrally molded middle plate and bezel 12 are sometimes referred to as a mid-frame. The display assembly 11 can be fixedly connected to the bezel 12 or the middle plate using processes such as dispensing.

[0035] The cover plate assembly 13 is located on the side facing away from the display area of ​​the display screen 111 and is connected to the bezel 12. Furthermore, the display screen assembly 11 and the cover plate assembly 13 are located on opposite sides of the middle plate. (See also...) Figure 5An installation space can be formed between the cover plate assembly 13 and the display screen 111 for mounting electronic components such as batteries, motherboards, and camera modules of electronic devices. The motherboard can integrate electronic components such as processors, storage units, power management modules, and baseband chips. The motherboard is located on the side facing away from the display area of ​​the display screen 111 and can be fixed to the mid-frame using screws or other structural components. The motherboard can be a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit). Radio frequency (RF) circuitry for processing RF signals can be integrated onto this substrate, as can controllers for controlling the operation of electronic devices. The RF circuitry includes, but is not limited to, antenna components, at least one amplifier, transceiver, coupler, low-noise amplifier (LNA), and duplexer. Furthermore, the RF circuitry can communicate wirelessly with networks and other devices. The aforementioned wireless communications may use any communication standard or protocol, including but not limited to Global System for Mobile communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0036] refer to Figure 3 The middle frame 12 is generally rectangular, including a top frame 123 and a bottom frame 125 facing away from each other, and a first side frame 127 and a second side frame 129 connecting the top frame 123 and the bottom frame 125. The first side frame 127 and the second side frame 129 are facing away from each other, and the top frame 123, the first side frame 127, the bottom frame 125, and the second side frame 129 are connected end to end and located on the outer periphery of the middle plate. Specifically, the connections between the frames can be right-angle connections or rounded transition connections. Furthermore, when the frame is a metal frame, the frame 12 can be provided with an antenna radiator for radiating radio frequency signals of different frequency bands. Specifically, the antenna radiator can be formed by a slit provided on the frame.

[0037] The cover assembly 13 includes a back cover 131 and an electrochromic module 132. The electrochromic module 132 is disposed on the inner side of the back cover 131. The inner side can be understood as the side of the cover assembly 13 facing the display area of ​​the screen 111. The back cover 131 forms the external outline of the electronic device 10 and can serve as the rear shell of the electronic device 10. The back cover 131 can be integrally molded. During the molding process of the back cover 131, structures such as a rear camera hole, a fingerprint recognition module, and an antenna assembly mounting hole 15 can be formed on the back cover 131. The back cover 131 can be made of a transparent material, such as a transparent plastic back cover 131 or a transparent glass back cover 131.

[0038] refer to Figure 4 and Figure 5 The back cover 131 includes a first region 1311 and a second region 1312, with the second region 1312 disposed along the periphery of the first region 1311. The second region 1312 allows the electrochromic module 132 to be spaced apart from the mid-frame 12 of the electronic device, thereby achieving insulation between the electrochromic module 132 and the mid-frame 12. The four edges of the back cover 131 are connected to the mid-frame 12.

[0039] The electrochromic module 132 includes a metal layer 1321, a first dielectric layer 1322, a first conductive layer 1323, a color-changing material layer 1324, and a second conductive layer 1325, which are stacked sequentially. The electrochromic module 132 is disposed in a first region 1311 of the back cover 131. Specifically, the second conductive layer 1325 is located in the first region 1311 near the electrochromic module 132. When the color of the electrochromic module 132 changes, the color of the first region 1311 of the back cover 131 can also change. The first region 1311 can be used as the electrochromic area of ​​the electronic device, improving the aesthetic appearance of the back cover and thus enhancing its visual appeal.

[0040] It should be noted that, in this embodiment of the application, the electrochromic module 132 may cover all or part of the first region 1311. For example, when the electrochromic module 132 partially covers the first region, the electrochromic module 132 may be correspondingly disposed in a portion of the first region 1311, such as in the middle region of the first region, or in a region other than the camera module region.

[0041] The first dielectric layer 1322 can be a light-transmitting dielectric layer. The first dielectric layer 1322 can be a glass dielectric layer or a resin plastic dielectric layer. Specifically, the material of the first dielectric layer 1322 can be polyester resin (Polyethylene terephthalate, PET or PEIT), polymethyl methacrylate (PMMA), polycarbonate (PC), polyimide (PI), etc. The first conductive layer 1323 and the second conductive layer 1325 can be made of transparent conductive materials. Furthermore, the first dielectric layer 1322 can be a flexible light-transmitting dielectric layer, thus making the overall structure of the electrochromic module 132 a flexible and bendable structure. The first dielectric layer 1322 serves to support and protect the internal structure.

[0042] In one embodiment, the first dielectric layer 1322 may further include a color auxiliary layer for assisting the color-changing functional layer composed of the first conductive layer 1323, the color-changing material layer 1324, and the second conductive layer 1325 for realizing the color-changing function.

[0043] The first conductive layer 1323 and the second conductive layer 1325 can be transparent conductive layers. The materials of the first conductive layer 1323 and the second conductive layer 1325 can be indium tin oxide (ITO), zinc aluminum oxide (AZO), fluorine-doped tin oxide (FTO), or graphene film, etc.

[0044] refer to Figure 6 The color-changing material layer 1324 includes an electrochromic layer 13241, a dielectric layer 13242, and an ion storage layer 13243, which are sandwiched between the first conductive layer 1323 and the second conductive layer 1325 and stacked sequentially. Optionally, the material of the electrochromic layer 13241 may include inorganic electrochromic materials (e.g., transition metal oxides or their derivatives, such as tungsten trioxide), organic electrochromic materials (e.g., polythiophene compounds and their derivatives, violet compounds, tetrathiofulvalene, metal phthalocyanine compounds, etc.).

[0045] Specifically, by applying a certain voltage between the first conductive layer 1323 and the second conductive layer 1325, the electrochromic material in the electrochromic layer 13241, which contains active material, undergoes a redox reaction under the voltage, thereby gaining or losing electrons, changing the energy level of the electrochromic material, and thus changing its color. The electrolyte layer is composed of a special conductive material, such as a solution or solid electrolyte material containing lithium perchlorate, sodium perchlorate, etc. The ion storage layer stores the corresponding counterions when the electrochromic material undergoes a redox reaction, maintaining the charge balance of the entire system. The ion storage layer can also be an electrochromic material with the opposite color-changing properties to the previous electrochromic material, thus achieving color superposition or complementarity. For example, the electrochromic layer 13241 material can be an anodic oxidation color-changing material, and the ion storage layer can be a cathodic reduction color-changing material. Therefore, when the first conductive layer 1323 and the second conductive layer 1325 are energized, the electrochromic layer 13241 can change color, so that the color of the back cover 131 can be adjusted according to the user's needs.

[0046] A metal layer 1321 is disposed on the side of the first dielectric layer 1322 away from the first conductive layer 1323. At least one side of this metal layer 1321 can be used to house an antenna radiator. When an antenna radiator is disposed on at least one side of the electrochromic module 132, the metal layer 1321 in the electrochromic module 132 can be used to isolate the absorption of electromagnetic waves generated by the antenna radiator by the first conductive layer 1323 and the second conductive layer 1325. This avoids the situation where the first conductive layer 1323 and the second conductive layer 1325, due to their large sheet resistance, would absorb energy, leading to a decrease in the antenna performance of surrounding antenna radiators. Furthermore, by grounding the metal layer, the induced current generated on the metal layer can be guided to the ground, thus preventing the induced current on the metal layer (which is opposite to the current on the antenna radiator) from suppressing the radiation formation of the antenna radiator at the corresponding location. By setting a grounded metal layer 1321 in the electrochromic module 132, the gap between the electrochromic module 132 and the frame can be further reduced while ensuring that the radiation performance of the antenna radiator is not affected, so as to further improve the appearance decoration effect of the back cover and thus improve the appearance of the back cover.

[0047] In this embodiment, when the cover assembly 13 is applied to an electronic device including a mid-frame 12 (e.g., an antenna radiator for radiating radio frequency signals is disposed on the mid-frame 12), the electrochromic module 132 in the cover assembly 13 can be attached to the first region 1311 of the rear cover 131. The metal layer 1321 in the electrochromic module 132 can isolate the absorption effects of the first conductive layer 1323 and the second conductive layer 1325, thereby preventing a decrease in the antenna performance of the surrounding antenna radiator due to the absorption effect of the conductive layer. By adding a metal layer 1321 to the electrochromic module 132, the distance between the electrochromic module 132 and the mid-frame 12 in the second region (e.g., the second region 1312) can be further reduced while ensuring that the radiation performance of the antenna radiator is not affected, thereby further improving the appearance and decorative effect of the rear cover and enhancing its aesthetic appeal.

[0048] Please continue to refer to this. Figure 2 In one embodiment, when the cover plate assembly 13 is applied to an electronic device including the mid-frame 12, the end face of the antenna radiator at the same relative position in the thickness direction of the electronic device is located on the side of the first dielectric layer 1322 away from the first conductive layer 1323.

[0049] Furthermore, in the thickness direction of the electronic device, the end face of the antenna radiator is located on the side of the metal layer 1321 away from the first dielectric layer 1322 at the same relative position. The projections of the antenna radiators at the same relative position overlap in the thickness direction. The end face of the antenna radiator can be understood as the side of the middle frame 12 near the cover plate 131, with the end face of its antenna radiator perpendicular to the thickness direction.

[0050] In this embodiment of the application, by setting the end face of the antenna radiator at the same relative position in the thickness direction of the electronic device to be located on the side of the first dielectric layer 1322 away from the first conductive layer 1323, the distance between the antenna radiator and the metal layer 1321 in the thickness direction of the electronic device can be increased, which can further reduce the influence of the electrochromic module 132 on the radiation performance of the antenna radiator.

[0051] It should be noted that at the same location, it can be understood that the projections of the antenna radiator, metal layer 1321, and first dielectric layer 1322, which are located at the same relative position in the thickness direction of the electronic device, overlap in the thickness direction.

[0052] In one embodiment, the metal layer 1321 can be made of copper foil, conductive silver paste, conductive metal compound, etc. The conductive metal compound can include conductive gold paste or a conductive metal compound formed by mixing at least two conductive metal materials. The thickness of the conductive gold paste or the conductive metal compound formed by mixing at least two conductive metal materials can be less than the thickness of the copper foil, which can greatly reduce the thickness of the electrochromic module 132, saving space occupied by the electrochromic module 132, thus facilitating the miniaturization design of the product. It should be noted that, in this embodiment, the material of the metal layer 1321 is not limited to the examples described above, and can also be other metal materials.

[0053] refer to Figure 7 In one embodiment, the metal layer 1321 of the electrochromic module 132 is provided with a plurality of grounding points (e.g., G1, G2, G3, G4), and the metal layer 1321 is grounded through the grounding points.

[0054] Furthermore, the motherboard in the electronic device may be provided with a ground plane, wherein the ground plane can provide a reference ground for the metal layer 1321. That is, the grounding point of the metal layer 1321 can be electrically connected to the ground plane on the motherboard through a wire, so as to guide the induced current generated on the metal layer 1321 to the ground plane of the motherboard.

[0055] In this embodiment, a plurality of grounding points are provided on the metal layer 1321 for grounding, which can guide the induced current generated on the metal layer 1321 to the ground terminal. This can avoid the situation where the size of the metal layer 1321 and the induced current on the metal layer 1321 (which is opposite to the current on the antenna radiator) suppress the radiation formation of the antenna radiator at the corresponding position.

[0056] It should be noted that the location and number of grounding points on the metal layer 1321 can be set according to the shape and size of the metal layer 1321 and the distribution of the antenna radiators formed on the middle frame 12. The shape of the metal layer 1321 can be rectangular, rounded rectangle, circular, elliptical or irregular (e.g., L-shaped, F-shaped, etc.).

[0057] In one embodiment, the metal layer 1321 has multiple grounding points, which can be evenly distributed on the metal layer 1321 or non-uniformly distributed. Please continue to refer to... Figure 7In one embodiment, the orthographic projection of the metal layer 1321 onto the reference plane completely overlaps with the orthographic projection of the target conductive layer 1323 onto the reference plane, wherein the reference plane is a plane perpendicular to the thickness direction of the cover plate assembly. The target conductive layer is either the first conductive layer 1323 or the second conductive layer 1325. Further, the metal layer 1321 may be located on the side of the first dielectric layer 1322 away from the first conductive layer 1323. The outer edge of the metal layer 1321 may be approximately flush with the outer edge of the first conductive layer 1323, that is, the outer edge of the metal layer 1321 may be approximately flush with the outer edge of the first region 1311, thereby preventing the metal layer 1321 from extending into the spacing region, ensuring sufficient antenna clearance area, and reducing the impact on the performance of the antenna radiator.

[0058] In this embodiment of the application, the grounding points distributed on the metal layer 1321 are described using the example of the metal layer 1321 being rectangular or curved.

[0059] The number of grounding points is four, and the four grounding points G1, G2, G3, and G4 are distributed in the four vertices of the metal layer 1321. By evenly distributing the four grounding points in the four vertices of a rectangle or rounded rectangle, the induced current generated on the metal layer 1321 can be uniformly and quickly guided to the ground, thereby avoiding any impact on the performance of the antenna radiator.

[0060] refer to Figure 8 Furthermore, the edge region includes a first edge and a third edge arranged opposite to each other, and a second edge and a fourth edge connecting the first edge and the third edge, wherein the second edge and the fourth edge are arranged opposite to each other. The number of grounding points can be increased; for example, nine grounding points G1, G2, G3, G4, G5, G6, G7, G8, and G9 can be provided. Four grounding points G1, G2, G3, and G4 are distributed at the four corners of the metal layer 1321, and four grounding points G5, G6, G7, and G8 are respectively located at the center of the first edge, the second edge, the third edge, and the fourth edge. The remaining grounding point G9 can be located at the geometric center of the metal layer 1321.

[0061] In this embodiment, by setting nine grounding points, the induced current generated on the metal layer 1321 can be uniformly and quickly guided to the ground to avoid the formation of a cavity, which would affect the performance of the antenna radiator.

[0062] In one embodiment, the orthographic projection of the metal layer 1321 onto the reference plane partially overlaps with the orthographic projection of the target conductive layer 1323 onto the reference plane. For example, the metal layer 1321 may be attached to a portion of the first region 1311 of the back cover 131, such as the middle region of the back cover.

[0063] refer to Figure 9 In one embodiment, specifically, the metal layer 1321 includes a first metal sheet and a second metal sheet 132b spaced apart from the first metal sheet 132a, wherein the area of ​​the second metal sheet 132b is smaller than that of the first metal sheet 132a, and the first metal sheet 132a is provided with a grounding point for grounding.

[0064] Furthermore, the length L of the second metal sheet 132b can be less than one-quarter of the operating frequency wavelength of the antenna radiator located close to the metal sheet. This prevents the generation of an induced current of the same frequency on the second metal sheet 132b (which is opposite to the current on the antenna radiator located close to the metal sheet), further reducing the impact of the induced current on the performance of the antenna radiator. The length dimension can be understood as the extension direction of the second metal sheet 132b, that is, the extension direction is parallel to the extension direction of the antenna radiator located close to the metal sheet.

[0065] In this embodiment, by providing two sizes of metal sheets, with the larger first metal sheet 132a having a grounding point, the induced current generated on the first metal sheet 132a can be guided to the ground, thereby reducing the impact on the performance of the antenna radiator. The first metal sheet 132a and the second metal sheet 132b can also further improve the performance of the electronic device's back cover 131 while isolating the absorption effect of the conductive layers in the electrochromic module 132.

[0066] In one embodiment, the number of first metal sheets 132a can be multiple, and the number of second metal sheets 132b can also be multiple. That is, the metal layer 1321 may include one first metal sheet 132a and multiple second metal sheets 132b, or it may include multiple first metal sheets 132a and one second metal sheet 132b, or it may include multiple first metal sheets 132a and multiple second metal sheets 132b. It should be noted that, in the embodiments of this application, when the number of first metal sheets 132a is multiple, the shape and area of ​​the multiple first metal sheets 132a may be the same or different. Correspondingly, when the number of second metal sheets 132b is multiple, the shape and area of ​​the multiple second metal sheets 132b may be the same or different.

[0067] In one embodiment, when there are multiple second metal sheets 132b, a grounding point can be provided on at least one of the multiple second metal sheets 132b to further guide the induced current generated on the second metal sheet 131a to the ground.

[0068] In one embodiment, any two adjacent metal sheets are spaced apart. The first spacing between two adjacent first metal sheets is greater than or equal to the second spacing between two adjacent second metal sheets.

[0069] Please continue to refer to this. Figure 9 For example, the number of first metal plates 132a and second metal plates 132b can each be two. It should be noted that, in this embodiment, the size, relative position, and number and position of grounding points G on the first metal plate 132a and second metal plates 132b can be determined based on the operating frequency band of the antenna radiator on the middle frame 12 and the size of the conductive layer in the electrochromic module 132. This ensures that the metal layer 1321 can isolate the absorption effect of each conductive layer in the electrochromic module 132, while further improving the radiation performance of the antenna radiator and the product performance of the electronic device back cover 131. In one embodiment, the middle frame 12 can have multiple antenna radiators arranged through slots. Specifically, the middle frame 12 is provided with a mid-to-high frequency antenna radiator for radiating mid-to-high frequency signals and a low-frequency antenna radiator for radiating low-frequency signals; wherein the first metal plate 132a is disposed close to the mid-to-high frequency antenna radiator, and the second metal plate 132b is disposed close to the low-frequency antenna radiator.

[0070] Please continue to refer to this. Figure 9 Specifically, the top frame 123 is provided with a first radiator F1 for radiating mid-to-high frequency signals, the first side frame 127 is provided with a second radiator F2 for radiating low-frequency signals, the bottom frame 125 is provided with a third radiator F3 for radiating mid-to-high frequency signals, and a fourth radiator F4 for radiating low-frequency signals. The mid-to-high frequency signals may include intermediate frequency signals and high frequency signals from 4G Long Term Evolution (LTE) signals and / or 5G New Radio (NR) signals, such as mid-to-high frequency signals from the B1 (N1) and B40 (N40) frequency bands. The low-frequency signals may also include low-frequency signals from 4G LTE signals and / or 5G NR signals, such as those from the B5 (N5) and B8 (N8) frequency bands.

[0071] Please continue to refer to this. Figure 9The metal layer 1321 includes two first metal sheets 132a and two second metal sheets 132b. One first metal sheet 132a is disposed near the first radiator F1, and the other first metal sheet 132a is disposed near the third radiator F3. The two second radiators F2 are disposed near the first side frame.

[0072] Furthermore, the first antenna radiator F1, located on the top bezel 123, radiates intermediate frequency and high frequency signals. A first metal plate 132a can be positioned near the top bezel 123, with its length extending to the edge of the first region 1311. Specifically, the first metal plate 132a is L-shaped, and the grounding point G on it can be positioned close to the second side bezel 129 and near the periphery of the rear camera. Additionally, the third antenna radiator F3, located on the bottom bezel 125, radiates intermediate frequency and high frequency signals, and the fourth radiator F4 radiates low frequency signals. Another first metal plate 132a can be positioned near the bottom bezel, with its length extending to the edge of the first region 1311. Specifically, the first metal plate 132a can be rectangular, and the grounding point G on it can be positioned close to the bottom bezel 125. The distance D1 between the two first metal plates 132a is greater than or equal to 2 mm.

[0073] The second antenna radiator F2, located on the first side frame 127, radiates low-frequency signals. Two second metal plates 132b can be positioned near the first side frame 127 to optimize the performance of the antenna radiator through small, fragmented pieces of metal plates 132b. Specifically, the two second metal plates 132b are suspended and not grounded, with a spacing D2 between them greater than or equal to 2 mm. Furthermore, the shape of the second metal plates 132b can be rectangular. When the electronic device is a mobile phone, the dimensions of the second metal plates 132b can be set to 25 mm (length) * 14 mm (width). It should be noted that the spacing between the metal plates, as well as the shape and size of the metal plates, are limited to the examples described above and can be adapted to actual needs.

[0074] Based on such Figure 9 The electronic device shown can test the active performance of the antenna radiator. The specific test results are shown in Table 1.

[0075] Table 1 shows the power reduction of the antenna radiator in the four frequency bands LTE B1, LTE B40, LTE B5, and LTE B8 when a metal layer 1321 is added to the electrochromic module 132 and when a metal layer 1321 is not added.

[0076]

[0077] The original electrochromic performance degradation refers to the reduction in total radiated power (TRP) of the antenna performance caused by the original electrochromic module 132 (without the metal layer 1321). The performance degradation in this application is the total radiated power of the antenna performance caused by using the electrochromic module 132 in this embodiment. The performance improvement is the difference between the second reduction in radiated power and the first reduction in radiated power.

[0078] As shown in Table 1, by placing a metal layer 1321 below the conductive layer and grounding the metal layer 1321, the impact of the conductive layer material in the electrochromic module 132 on the performance of the antenna radiator can be reduced. Simultaneously, the impact of the metal layer 1321 on the performance of the antenna radiator is also reduced. This not only improves the radiation performance of the antenna radiator but also shortens the size of the second region 1312 between the antenna radiator and the first region 1311, further enhancing the product performance of the back cover 131. In other words, while maintaining the same width of the second region 1312, by placing a metal layer 1321 below the conductive layer and grounding the metal layer 1321, the overall radiation performance of the antenna radiator can be improved.

[0079] refer to Figure 10 In one embodiment, the electrochromic module 132 further includes a second dielectric layer 1326 disposed between the second conductive layer 1325 and the cover plate. The second dielectric layer 1326 can be a light-transmitting dielectric layer; specifically, it can be a glass dielectric layer or a resin plastic dielectric layer. The second dielectric layer 1326 also protects the color-changing material layer 1324 and each conductive layer. Furthermore, the second dielectric layer 1326 can be a flexible light-transmitting dielectric layer, thus making the overall structure of the electrochromic module 132 a flexible and bendable structure.

[0080] like Figure 11 As shown, further explanation will be given using mobile phone 10 as an example. Specifically, as... Figure 11As shown, the mobile phone 10 may include a memory 21 (which optionally includes one or more computer-readable storage media), a processor 22, control circuitry 23, and an input / output (I / O) subsystem 24. These components optionally communicate via one or more communication buses or signal lines 29. Those skilled in the art will understand that... Figure 11 The mobile phone 10 shown does not constitute a limitation on the mobile phone and may include more or fewer components than shown, or combine certain components, or have different component arrangements. Figure 11 The various components shown are implemented in hardware, software, or a combination of both, including one or more signal processing and / or application-specific integrated circuits.

[0081] Memory 21 optionally includes high-speed random access memory, and also optionally includes non-volatile memory, such as one or more disk storage devices, flash memory devices, or other non-volatile solid-state memory devices. Exemplary examples include software components stored in memory 21 such as an operating system 211, a communication module (or instruction set) 212, a global positioning system (GPS) module (or instruction set) 213, etc.

[0082] The processor 22 and other control circuits 23 can be used to control the operation of the mobile phone 10. The processor 22 can be based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application-specific integrated circuits, etc.

[0083] The control circuit 23 is coupled to the electrochromic module 132 of the cover plate assembly 13. The control circuit 23 receives control commands to control the electrochromic module 132 to change color. Specifically, the control circuit 23 receives control commands input through the input / output (I / O) subsystem 24 and controls the operating state of the electrochromic module 132 according to the control commands. The operating state of the electrochromic module 132 includes controlling the change of its voltage or current signal state to achieve the purpose of controlling the color-changing state of the electrochromic module 132. Specifically, the control circuit 23 controls the electrochromic module 132 to change its transparent state. It can also be combined with structures such as an appearance film and a substrate color layer to enable the electronic device to present a color-changing appearance effect.

[0084] The I / O subsystem 24 couples input / output peripherals on the mobile phone 10, such as the keypad and other input control devices, to the peripheral interface 23. The I / O subsystem 24 optionally includes a touchscreen, buttons, a tone generator, an accelerometer (motion sensor), an ambient light sensor and other sensors, LEDs and other status indicators, data ports, etc. For example, a user can control the operation of the mobile phone 10 by supplying commands via the I / O subsystem 24, and can use the output resources of the I / O subsystem 24 to receive status information and other outputs from the mobile phone 10. For example, a user can press button 241 to turn the phone on or off.

[0085] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A cover assembly, characterized by The application relates to a cover plate assembly. The electrochromic module comprises a metal layer, a first dielectric layer, a first conductive layer, a color-changing material layer and a second conductive layer which are sequentially stacked; at least one side of the metal layer is used for arranging an antenna radiator and is spaced apart from the antenna radiator; the metal layer is used for isolating the first conductive layer and the second conductive layer from absorbing electromagnetic waves generated by the antenna radiator; a plurality of grounding points are arranged on the metal layer and are used for grounding; and the induced current generated on the metal layer is led to the ground end so as to avoid the radiation of the induced current on the metal layer from inhibiting the radiation of the antenna radiator at the corresponding position. The back cover is connected with the second conductive layer on the inner side; wherein The metal layer is partially overlapped with the target conductive layer in the projection on the reference plane, the reference plane is a plane perpendicular to the thickness direction of the cover plate assembly, the target conductive layer is the first conductive layer or the second conductive layer; the metal layer comprises a first metal sheet and a second metal sheet which is spaced apart from the first metal sheet, the area of the second metal sheet is smaller than that of the first metal sheet, and the first metal sheet is provided with a grounding point for grounding.

2. The cover plate assembly of claim 1, wherein, The metal layer is a copper foil layer.

3. The cover plate assembly of claim 1, wherein, The electrochromic module further comprises a second dielectric layer arranged between the second conductive layer and the back cover.

4. An electronic device, comprising: The application relates to a cover plate assembly. The middle frame is provided with an antenna radiator; The back cover is connected with the middle frame, and the electrochromic module is spaced apart from the middle frame. The end surface of the antenna radiator is located on the side of the metal layer away from the first dielectric layer at the same position in the thickness direction of the electronic device.

5. The electronic device of claim 4, wherein, The number of the first metal sheets is plural, and / or the number of the second metal sheets is plural.

6. The electronic device of claim 4, wherein, At least one of the second metal sheets is provided with a grounding point.

7. The electronic device of claim 6, wherein, The first interval between two adjacent first metal sheets is greater than or equal to the second interval between two adjacent second metal sheets.

8. The electronic device of claim 6, wherein, The middle frame is provided with a middle-high-frequency antenna radiator for radiating a middle-high-frequency signal and a low-frequency antenna radiator for radiating a low-frequency signal; the first metal sheet is arranged close to the middle-high-frequency antenna radiator, and the second metal sheet is arranged close to the low-frequency antenna radiator.

9. The electronic device of claim 4, wherein, The middle frame comprises a top edge frame, a bottom edge frame, a first side edge frame and a second side edge frame which are arranged opposite to each other and are connected between the top edge frame and the bottom edge frame; wherein 10. The electronic device of claim 9, wherein, The top edge frame is provided with a first radiator for radiating the middle-high-frequency signal, the first side edge frame is provided with a second radiator for radiating the low-frequency signal, the bottom edge frame is provided with a third radiator for radiating the middle-high-frequency signal and a fourth radiator for radiating the low-frequency signal. ​ The metal layer comprises two first metal sheets and two second metal sheets, one of the first metal sheets is arranged close to the first radiator, the other first metal sheet is arranged close to the third radiator, and the two second metal sheets are arranged close to the second radiator.

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