Semiconductor cleaning apparatus and wafer flipping device thereof

Abstract

Embodiments of the present application provide a semiconductor cleaning equipment and a wafer flipping device thereof. In the wafer flipping device, a flipping mechanism is connected with a flipping support, first and second clamping mechanisms are symmetrically arranged at two ends of the flipping support, the flipping mechanism is used to drive the flipping support to flip, and the first and second clamping mechanisms are both used to selectively clamp or release a wafer; when the first clamping mechanism is located at a first position and the second clamping mechanism is located at a second position, the first clamping mechanism can clamp the wafer from a front mechanical hand, and a rear mechanical hand can take the wafer away from the second clamping mechanism; when the first clamping mechanism is located at the second position and the second clamping mechanism is located at the first position, the rear mechanical hand can take the wafer away from the first clamping mechanism, and the second clamping mechanism can clamp the wafer from the front mechanical hand. Embodiments of the present application realize the cooperation with the front and rear mechanical hands at the same time, thereby greatly shortening the wafer flipping and transmission time.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and more specifically, to a semiconductor cleaning device and a wafer flipping apparatus thereof. Background Technology

[0002] Currently, single-wafer cleaning is used in semiconductor processing. Compared with tank cleaning machines, single-wafer cleaning machines clean individual wafers, resulting in better cleaning effects, but lower efficiency. This requires single-wafer cleaning machines to shorten cycle time as much as possible to increase equipment efficiency. Since single-wafer cleaning machines need to clean the back side of the wafer, they need to flip the wafer 180 degrees. However, the long flipping and transfer time of existing single-wafer cleaning machines seriously affects work efficiency.

[0003] In existing technology, wafer flipping mechanisms consist of a flipping robot and a carrier platform. The flipping robot comprises a base, a 45-degree rotation module, a 180-degree rotation module, and a gripping arm. The process flow of the wafer flipping mechanism is as follows: First, the front robot removes the wafer from the wafer cassette and places it on the carrier platform. At this time, the gripping arm clamps the wafer from both sides, and the 45-degree rotation module drives the gripping arm to rise to avoid the carrier platform. Then, the 180-degree rotation module flips the gripping arm and the wafer 180 degrees. Next, the 45-degree rotation module lowers to place the wafer on the carrier platform, and then rises again to lift the gripping arm. Finally, the rear robot removes the wafer from the carrier platform and transfers it to the process chamber for processing. Because existing flipping mechanisms only allow one of the front or rear robots to handle wafer handling, and the flipping mechanism structure results in numerous flipping steps, the working efficiency of the single-wafer cleaning machine is reduced. Summary of the Invention

[0004] This application addresses the shortcomings of existing methods by proposing a semiconductor cleaning device and its wafer flipping mechanism to solve the technical problem of low working efficiency in the prior art.

[0005] In one aspect, embodiments of this application provide a wafer flipping device for a semiconductor cleaning equipment, disposed between a front-end robotic arm and a rear-end robotic arm of the semiconductor cleaning equipment, for the front-end robotic arm and the rear-end robotic arm to pick up and place wafers and flip the wafers, including: a flipping mechanism, a flipping support, a first clamping mechanism, and a second clamping mechanism; the flipping mechanism is connected to the flipping support, and the first clamping mechanism and the second clamping mechanism are symmetrically disposed at both ends of the flipping support, the flipping mechanism being used to drive the flipping support to flip, thereby driving the first clamping mechanism and the second clamping mechanism to a first position. The first and second clamping mechanisms are used to selectively clamp or release the wafer when the first clamping mechanism is in the first position and the second clamping mechanism is in the second position. When the first clamping mechanism is in the first position and the second clamping mechanism is in the second position, the first clamping mechanism can clamp the wafer from the front robotic arm, and the rear robotic arm can remove the wafer from the second clamping mechanism. When the first clamping mechanism is in the second position and the second clamping mechanism is in the first position, the rear robotic arm can remove the wafer from the first clamping mechanism, and the second clamping mechanism can clamp the wafer from the front robotic arm.

[0006] In one embodiment of this application, both the first clamping mechanism and the second clamping mechanism include a mounting shell, a driving component, and a clamping component. A plurality of clamping components are evenly arranged circumferentially along the mounting shell and extend radially along the mounting shell. The driving component is disposed on the mounting shell and is used to drive the plurality of clamping components to move simultaneously relative to the mounting shell to clamp or release the wafer. The gap between any two adjacent clamping components is used for the front robotic arm or the rear robotic arm to reach in and pick up or place the wafer.

[0007] In one embodiment of this application, the clamping assembly is pivotally connected to the mounting housing, and the clamping assembly is oscillating relative to the mounting housing in a first direction to clamp the wafer; the clamping assembly is oscillating relative to the mounting housing in a second direction to release the wafer; the first direction and the second direction are both circumferential directions of the mounting housing, and the first direction and the second direction are opposite.

[0008] In one embodiment of this application, the clamping assembly includes a swing arm and a clamping post; a first end of the swing arm extends into the mounting housing, and a second end of the swing arm is provided with the clamping post, which is used to contact the edge of the wafer to clamp the wafer; a pivot hole is provided on the swing arm near the first end; a pivot shaft is provided inside the mounting housing that can pass through the pivot hole, and the swing arm is pivotally connected to the mounting housing through the pivot shaft.

[0009] In one embodiment of this application, the driving assembly includes a first driving member, a second driving member, and a driver. The first driving member is disposed within the mounting housing and is used to simultaneously drive the swing arm to swing along a first direction. The second driving member is disposed within the mounting housing, and the driver is disposed on the mounting housing. The driver is connected to the first end of the plurality of swing arms through the second driving member and is used to drive the swing arm to swing along a second direction through the second driving member.

[0010] In one embodiment of this application, the first driving member includes a plurality of elastic components, each of which is correspondingly disposed with a plurality of swing arms. The plurality of elastic components are located on the same side of the plurality of swing arms along the circumference of the mounting shell. One end of each elastic component is connected to the mounting shell, and the other end is connected to the swing arm at a position between the pivot hole and the second end, for providing an elastic force to drive the swing arm to swing in a first direction.

[0011] In one embodiment of this application, connecting posts are provided both inside the mounting housing and on the swing arm, and the two ends of the elastic member are respectively connected to the connecting posts inside the mounting housing and on the swing arm.

[0012] In one embodiment of this application, the driver is disposed on the top of the mounting housing, and the output shaft of the driver extends into the mounting housing; the second driving member is located inside the mounting housing, the top of the second driving member is connected to the output shaft, and the bottom of the second driving member contacts the first end of the plurality of swing arms, for abutting the first end to drive the swing arms to swing in a second direction.

[0013] In one embodiment of this application, the second driving member includes a transmission disk and rolling components. The transmission disk is coaxially arranged with the output shaft. Multiple rolling components are evenly distributed on the side of the transmission disk away from the driver. The multiple rolling components are arranged in a one-to-one correspondence with the multiple swing arms. The rolling components and the elastic component are located on opposite sides of the swing arms. The rolling components can rotate when they abut against the first end.

[0014] In one embodiment of this application, the rolling component includes a mounting shaft and a bearing, the mounting shaft being fixedly connected to the transmission disk, and the bearing being sleeved on the mounting shaft.

[0015] In one embodiment of this application, the mounting shell includes a top plate, columns, and a bottom plate. A plurality of columns are located between the top plate and the bottom plate and are evenly and spaced apart along the circumference of the top plate and the bottom plate. The gap between any two columns is used for the first end of the swing arm to extend into. The drive assembly is mounted on the top plate.

[0016] In one embodiment of this application, one end of the clamping post is connected to the second end, and the axial direction of the clamping post is perpendicular to the axial direction of the swing arm; the other end of the clamping post has a limiting groove for accommodating the edge of the wafer.

[0017] In one embodiment of this application, the flipping mechanism includes a drive unit and a connecting shaft. The drive unit is fixedly disposed, and the rotation shaft of the drive unit is connected to the flipping support through the connecting shaft.

[0018] In one embodiment of this application, the flip support includes a semi-annular rotating support and a connecting support. The rotating support and the connecting support cooperate to form a sleeve-shaped flip support. The flipping mechanism is connected to the rotating support, and portions of the first clamping mechanism and the second clamping mechanism are located inside the flip support.

[0019] Secondly, embodiments of this application provide a semiconductor cleaning apparatus, including a front robotic arm, a rear robotic arm, a process chamber, and a wafer flipping device as provided in the first aspect. The front robotic arm is used to transfer wafers in a wafer cassette to the first clamping mechanism or the second clamping mechanism, and the rear robotic arm is used to transfer wafers on the first clamping mechanism or the second clamping mechanism to the process chamber.

[0020] The beneficial technical effects of the technical solutions provided in this application are:

[0021] This embodiment of the application symmetrically arranges a first clamping mechanism and a second clamping mechanism at both ends of the flipping support, and drives the two to flip at a first position and a second position through a driving mechanism. In actual use, while the first clamping mechanism cooperates with the front robotic arm to pick up and place wafers, the second clamping mechanism can cooperate with the rear robotic arm to pick up and place wafers. That is, when one clamping mechanism cooperates with the front robotic arm to pick up and place wafers, the other clamping mechanism can cooperate with the rear robotic arm to pick up and place wafers, realizing simultaneous cooperation with the front and rear robotic arms. This embodiment of the application significantly shortens the wafer flipping and transfer time while realizing wafer flipping, thereby greatly improving the working efficiency of the wafer transfer process, and thus greatly improving the working efficiency of the semiconductor cleaning equipment.

[0022] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0023] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0024] Figure 1A This is a schematic diagram of a wafer flipping device for holding a wafer, provided in an embodiment of this application.

[0025] Figure 1B This is an exploded view of a wafer flipping device provided in an embodiment of this application;

[0026] Figure 2 A schematic diagram of the structure of a first clamping mechanism and a second clamping mechanism provided in the embodiments of this application;

[0027] Figure 3 An exploded view of a first clamping mechanism and a second clamping mechanism provided in an embodiment of this application;

[0028] Figure 4 This is a schematic diagram of the structure of a clamping assembly provided in an embodiment of this application;

[0029] Figure 5 A partial structural diagram of a mounting shell provided in an embodiment of this application;

[0030] Figure 6 A three-dimensional schematic diagram of a second driving component in a top view, provided for an embodiment of this application;

[0031] Figure 7 A perspective view of a second driving component in the form of an embodiment of this application;

[0032] Figure 8A This is a partially enlarged schematic diagram of a first clamping mechanism and a second clamping mechanism, with some parts omitted, provided in an embodiment of this application.

[0033] Figure 8B A top view schematic diagram of a first clamping mechanism and a second clamping mechanism for clamping a wafer, provided in an embodiment of this application;

[0034] Figure 9 This is a schematic diagram of the structure of a semiconductor cleaning device provided in an embodiment of this application. Detailed Implementation

[0035] This application is described in detail below. Examples of embodiments of this application are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Furthermore, detailed descriptions of known technologies that are unnecessary for the features of this application are omitted. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0036] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0037] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments.

[0038] This application provides a wafer flipping device for a semiconductor cleaning equipment, disposed between a front-end robotic arm and a rear-end robotic arm of the semiconductor cleaning equipment. It is used for the front-end and rear-end robotic arms to pick up and place wafers and to flip the wafers. A schematic diagram of the wafer flipping device is shown below. Figure 1A and Figure 1B As shown, it includes: a flipping mechanism 1, a flipping support 2, a first clamping mechanism 3, and a second clamping mechanism 4; the flipping mechanism 1 is connected to the flipping support 2, and the first clamping mechanism 3 and the second clamping mechanism 4 are symmetrically arranged at both ends of the flipping support 2. The flipping mechanism 1 drives the flipping support 2 to flip, thereby causing the first clamping mechanism 3 and the second clamping mechanism 4 to flip between a first position and a second position. Both the first clamping mechanism 3 and the second clamping mechanism 4 are used to selectively clamp or release the wafer 100; when the first clamping mechanism 3 is in the first position and the second clamping mechanism 4 is in the second position, the first clamping mechanism 3 can clamp the wafer 100 from the front robotic arm (not shown in the figure), and the rear robotic arm (not shown in the figure) can remove the wafer 100 from the second clamping mechanism 4; when the first clamping mechanism 3 is in the second position and the second clamping mechanism 4 is in the first position, the rear robotic arm can remove the wafer 100 from the first clamping mechanism 3, and the second clamping mechanism 4 can clamp the wafer 100 from the front robotic arm.

[0039] like Figure 1A and Figure 1BAs shown, the semiconductor cleaning equipment can specifically be a single-wafer cleaning machine used to perform cleaning processes on wafers. The wafer flipping device can be set between the front and rear robotic arms (not shown in the figure) of the semiconductor cleaning equipment to flip the wafers. However, this embodiment is not limited to this, and those skilled in the art can adjust the settings according to actual conditions. The flipping mechanism 1 can specifically be a rotary cylinder used to drive the flipping support 2 to flip, which is not only precise in control but also low in cost. The flipping mechanism 1 can be fixedly set on a platform by a bracket 11, but it can also be directly set on a platform. Therefore, this embodiment is not limited to this. The flipping support 2 can, for example, adopt a sleeve structure. The outer periphery of the flipping support 2 is connected to the flipping mechanism 1, and a first clamping mechanism 3 and a second clamping mechanism 4 are respectively installed at both ends. When the first clamping mechanism 3 is in the first position and the second clamping structure 4 is in the second position, the first clamping mechanism 3 is located at the bottom end of the flip support 2, while the second clamping mechanism 4 can be located at the top end of the flip support 2. Conversely, when the first clamping mechanism 3 is in the second position and the second clamping structure 4 is in the first position, the second clamping mechanism 4 is located at the bottom end of the flip support 2, while the first clamping mechanism 3 is located at the top end of the flip support 2. The flipping mechanism 1 drives the flip support 2 to rotate 180 degrees, thereby causing the first clamping mechanism 3 and the second clamping mechanism 4 to rotate, so that both can rotate between the first position and the second position. In practical applications, the first clamping mechanism 3 is located at the bottom end of the flip support 2, and the second clamping mechanism 4 is located at the bottom end of the flip support 2. That is, when the first clamping mechanism 3 is in the first position and the second clamping mechanism 4 is in the second position, the front robot can transfer the wafer 100 to the first clamping mechanism 3, and the first clamping mechanism 3 clamps the wafer 100. The flipping mechanism 1 drives the flip support 2 to rotate 180 degrees, so as to drive the first clamping mechanism 3 to rotate to the second position, and at the same time drive the second clamping mechanism 4 to rotate to the first position. At this time, the rear robot can take the wafer 100 from the first clamping mechanism 3, and the front robot can simultaneously transfer the wafer 100 to the second clamping mechanism 4, and the second clamping mechanism 4 clamps the wafer 100. At this time, the flipping mechanism 1 can drive the first clamping mechanism 3 and the second clamping mechanism 4 to rotate again so that their positions are interchanged, and so on.

[0040] This embodiment of the application symmetrically arranges a first clamping mechanism and a second clamping mechanism at both ends of the flipping support, and drives the two to flip at a first position and a second position through a driving mechanism. In actual use, while the first clamping mechanism cooperates with the front robotic arm to pick up and place wafers, the second clamping mechanism can cooperate with the rear robotic arm to pick up and place wafers. That is, when one clamping mechanism cooperates with the front robotic arm to pick up and place wafers, the other clamping mechanism can cooperate with the rear robotic arm to pick up and place wafers, realizing simultaneous cooperation with the front and rear robotic arms. This embodiment of the application significantly shortens the wafer flipping and transfer time while realizing wafer flipping, thereby greatly improving the working efficiency of the wafer transfer process, and thus greatly improving the working efficiency of the semiconductor cleaning equipment.

[0041] In one embodiment of this application, as Figures 1A to 2 As shown, both the first clamping mechanism 3 and the second clamping mechanism 4 include a mounting shell 51, clamping components 52 and a driving component 53. Multiple clamping components 52 are evenly arranged along the circumference of the mounting shell 51 and extend radially along the mounting shell 41. The driving component 53 is disposed on the mounting shell 51 and is used to drive multiple clamping components 52 to move simultaneously relative to the mounting shell 51 to clamp or release the wafer 100. The gap between any two adjacent clamping components 52 is used for a front-mounted robot or a rear-mounted robot to reach in and pick up or put down the wafer 100.

[0042] like Figures 1A to 2As shown, the first clamping mechanism 3 and the second clamping mechanism 4 can adopt the same structure to meet the needs of the front and rear robotic arms for picking up and placing wafers 100. However, the embodiments of this application are not limited to this, and for example, they can also adopt different structures. Both the first clamping mechanism 3 and the second clamping mechanism 4 can include a mounting shell 51 and clamping components 52. The mounting shell 51 can adopt a cylindrical structure. The entire mounting shell 51 can be set on the end of the flip support 2, and the mounting shell 51 has an accommodating space 514 for mounting multiple clamping components 52. The specific number of clamping components 52 can be three. The three clamping components 52 can be evenly distributed along the circumference of the mounting shell 51, and one end extends into the accommodating space 514 of the mounting shell 51, while the other end is set away from the mounting shell 51 along the radial direction of the mounting shell 51. That is, the multiple clamping components 52 are radially distributed along the radial direction of the mounting shell 51. Furthermore, there is a gap between any two adjacent clamping components 52. Since three clamping components 52 are used, there is a 120-degree gap between any two adjacent clamping components 52, allowing the front and rear robotic arms to extend into the gap to pick up and place the wafer 100. However, this embodiment does not limit the specific number of clamping components 52; for example, the number of clamping components 52 can be three or more. A driving component 53 is disposed on the mounting housing 51 and is used to drive the multiple clamping components 52 to move simultaneously relative to the mounting housing 51. In practical applications, the multiple clamping components 52 move simultaneously relative to the mounting housing 51 under the drive of the driving component 53 to selectively clamp or release the wafer 100. The above design makes the structure of this application simple to implement and avoids mechanical interference with the front and rear robotic arms, thereby significantly improving the application and maintenance costs of this embodiment.

[0043] It should be noted that the embodiments of this application do not limit the movement mode between the multiple clamping components 52 and the mounting shell 51. For example, the driving component 53 can drive the multiple clamping components 52 to extend, retract, or swing relative to the mounting shell 51 simultaneously, thereby achieving clamping or releasing of the wafer 100. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0044] In one embodiment of this application, as Figure 2 As shown, the clamping assembly 52 is pivotally connected to the mounting housing 51. The clamping assembly 52 can swing relative to the mounting housing 51 in a first direction to clamp the wafer; and the clamping assembly 52 can swing relative to the mounting housing 51 in a second direction to release the wafer; the first direction and the second direction are both circumferential directions of the mounting housing 51, and the first direction and the second direction are opposite.

[0045] like Figure 2As shown, multiple clamping components 52 are pivotally connected to the mounting housing 51, and a driving component 53 drives the multiple clamping components 52 to swing relative to the mounting housing 51 in a first direction, such as a clockwise direction, so that the end of the clamping component 52 away from the mounting housing 51 simultaneously moves closer to the mounting housing 51, thereby clamping the wafer. The driving component 53 drives the multiple clamping components 52 to swing relative to the mounting housing 51 in a second direction, such as a counterclockwise direction, so that the end of the clamping component 52 away from the mounting housing 51 simultaneously moves away from the mounting housing 51, thereby releasing the wafer. With the above design, since multiple clamping components 52 swing simultaneously in the first direction to clamp the wafer, and multiple clamping components 52 swing simultaneously in the second direction to release the wafer, not only can the efficiency of clamping the wafer be improved, but the structural complexity of the embodiments of this application can also be significantly reduced, thereby significantly reducing application and maintenance costs.

[0046] It should be noted that the embodiments of this application do not limit the specific directions of the first and second directions. For example, the first direction may be counterclockwise and the second direction may be clockwise, which can also achieve the above-mentioned technical effects. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0047] In one embodiment of this application, as Figures 2 to 5 As shown, the clamping assembly 52 includes a swing arm 521 and a clamping post 522; the first end 524 of the swing arm 521 extends into the mounting housing 51, and the second end 525 of the swing arm 521 is provided with a clamping post 522, which is used to contact the edge of the wafer to clamp the wafer; a pivot hole 526 is provided on the swing arm 521 near the first end 524; a pivot shaft 523 is provided in the mounting housing 51 that can pass through the pivot hole 526, and the swing arm 521 is pivotally connected to the mounting housing 51 through the pivot shaft 523.

[0048] like Figures 2 to 5As shown, the swing arm 521 can specifically be a rod-shaped structure made of metal. The first end 524 of the swing arm 521 extends into the mounting housing 51, and the second end 525 extends radially along the mounting housing 51. A clamping post 522 can be provided at the bottom of the second end 525. Multiple clamping posts 522 on the swing arms 521 cooperate with each other to clamp the edge of the wafer. A pivot shaft 523 passes through a pivot hole 526 in the swing arm 521, and the pivot hole 526 is located near the first end 524. The pivot shaft 523 is fixedly connected to the mounting housing 51 to achieve a pivotal connection between the swing arm 521 and the mounting housing 51. The pivot shaft 523 can be located near the first end 524 of the swing arm 521 so that the first end 524 extends into the mounting housing 51. It should be noted that the specific number of pivot shafts 523 in this embodiment is not limited, as long as they correspond one-to-one with the swing arms 521. The above design makes the structure of the embodiments of this application simple and easy to implement, thereby greatly reducing application and maintenance costs.

[0049] In one embodiment of this application, as Figures 2 to 4 As shown, the drive assembly 53 includes a first drive member 6, a second drive member 7, and a driver 8. The first drive member 6 is disposed inside the mounting housing 51 and is used to simultaneously drive the swing arm 521 to swing in a first direction. The second drive member 7 is disposed inside the mounting housing 51, and the driver 8 is disposed on the mounting housing 51. The driver 8 is connected to the first end 524 of the plurality of swing arms 521 through the second drive member 7 and is used to drive the swing arm 521 to swing in a second direction through the second drive member 7.

[0050] like Figures 2 to 4 As shown, the drive assembly 53 includes a first drive member 6, a second drive member 7, and a driver 8. The first drive member 6 is disposed within the mounting housing 51 and is used to drive multiple swing arms 521 to swing simultaneously along a first direction. The second drive member 7 is disposed within the mounting housing 51, and the driver 8 is disposed on the mounting housing 51. The driver 8 is connected to the first end 524 of the multiple swing arms 521 via the second drive member 7 and is used to drive the multiple swing arms 521 to swing simultaneously along a second direction. With the above design, since the first drive member 6 and the second drive member 7 drive the swing arms 521 to swing along the first and second directions respectively, the swing direction of the swing arms 521 can be controlled separately in this embodiment. This not only significantly reduces the response time and improves the control efficiency of this embodiment, but also allows multiple swing arms 521 to be controlled simultaneously, thereby significantly improving the control accuracy.

[0051] It should be noted that the embodiments of this application do not limit the drive assembly 53 to include two drive members. For example, the drive assembly 53 may also include only the second drive member 7, and the driver 8 drives the multiple swing arms 521 to swing along the first direction or the second direction through the second drive member 7. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0052] In one embodiment of this application, as Figures 2 to 4 As shown, the first driving member 6 includes multiple elastic components 61, each corresponding to a plurality of swing arms 521. All elastic components 61 are located on the same side of the swing arms 521 along the circumference of the mounting housing 51. One end of each elastic component 61 is connected to the mounting housing 51, and the other end is connected to the swing arm 521 between the pivot hole 526 and the second end 525, providing an elastic force (e.g., elastic restoring force) to drive the swing arm 521 to swing in a first direction. Specifically, three elastic components 61 are arranged in a one-to-one correspondence with three swing arms 521, and all three elastic components 61 are located on one side of the swing arm 521 in a clockwise direction; that is, multiple elastic components 61 are located on the same side of the swing arms 521 along the circumference of the mounting housing 51. One end of each elastic component 61 is connected to the interior of the mounting housing 51, and the other end is connected to the position between the pivot hole 526 and the second end 525, and connected to the swing arm 521. By applying a preload to the elastic component 61, the elastic component 61 continuously applies an elastic restoring force to the swing arm 521, causing the swing arm 521 to swing continuously along the first direction. Since multiple elastic components 61 are all located on one side of the swing arm 521 in the clockwise direction, the first direction is clockwise. Using the above design, multiple swing arms 521 can swing simultaneously along the first direction with a relatively simple structure, which not only reduces manufacturing difficulty but also significantly reduces application and maintenance costs.

[0053] It should be noted that the specific location of the elastic member 61 is not limited in the embodiments of this application. For example, the elastic member 61 can also be disposed on the side of the swing arm 521 in the counterclockwise direction, so that the first direction is counterclockwise. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the setting according to the actual situation.

[0054] In one embodiment of this application, as Figures 2 to 5As shown, connecting posts 62 are provided inside the mounting housing 51 and on the swing arm 521. The two ends of the elastic component 61 are connected to the connecting posts 62 inside the mounting housing 51 and on the swing arm 521, respectively. Specifically, the elastic component 61 can be a coiled spring. The two connecting posts 62 are respectively located inside the mounting housing 51 and on the swing arm 521. The connecting post 62 on the swing arm 521 is located between the pivot hole 526 and the second end 525, and is positioned on the same side as the clamping post 522. Both ends of the elastic component 61 are connected to the mounting housing 51 and the swing arm 521 via the connecting posts 62. The elastic restoring force of the elastic component 61 can drive the swing arm 521 to swing in the first direction, so that the clamping post 522 located at the second end 525 clamps the wafer. Because the wafer is clamped using the elastic restoring force of the elastic component 61, the wafer experiences less force, and damage to the wafer due to excessive clamping force is avoided. The above design not only makes the structure of the embodiments of this application simple and reasonable, but also significantly reduces application and maintenance costs. However, the embodiments of this application do not limit the specific implementation of the elastic component 61. For example, the elastic component 61 can also adopt other types of elastic structures. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can make adjustments according to the actual situation.

[0055] In one embodiment of this application, as Figures 2 to 5 As shown, the driver 8 is disposed on the top of the mounting housing 51, and the output shaft of the driver 8 extends into the mounting housing 51; the second drive member 7 is disposed in the mounting housing 51, the top of the second drive member 7 is connected to the output shaft, and the bottom contacts the first end 524 of the plurality of swing arms 521, for abutting the first end 524 to drive the swing arms 521 to swing in the second direction.

[0056] like Figures 2 to 5 As shown, the driver 8 can be a stepper motor or a servo motor. The driver 8 can be located on the top of the mounting housing 51, and the output shaft of the driver 8 extends into the receiving space 514 of the mounting housing 51. The second driving member 7 is located in the receiving space 514 of the mounting housing 51 and is coaxially arranged with the mounting housing 51. The top of the second driving member 7 is fixedly connected to the output shaft of the driver 8 at its central position, and its bottom contacts the first ends 524 of the multiple swing arms 521 respectively. In practical applications, the driver 8 drives the second driving member 7 to rotate. The second driving member 7 pushes against the first ends 524 of the multiple swing arms 521, so that the multiple swing arms 521 can overcome the elastic restoring force of the first driving member 6 and swing in the second direction, so that the multiple clamping posts 522 release the wafer. With the above design, since the second driving member 7 contacts the first end 524 of the multiple swing arms 521 and overcomes the elastic restoring force of the first driving member 6, the multiple swing arms 521 swing simultaneously in the second direction to release the wafer, making the control logic of this application embodiment simple and improving safety and stability.

[0057] It should be noted that the embodiments of this application do not limit the contact method between the second driving member 7 and the first ends 524 of the plurality of swing arms 521. For example, the contact can be achieved by a pivot connection between the second driving member 7 and the plurality of swing arms 521. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0058] In one embodiment of this application, as Figures 2 to 7 As shown, the second driving component 7 includes a transmission disk 71 and rolling components 72. The transmission disk 71 is coaxially arranged with the output shaft. Multiple rolling components 72 are evenly distributed on the side of the transmission disk 71 away from the driver 8. The multiple rolling components 72 are arranged in a one-to-one correspondence with multiple swing arms 521. The rolling components 72 and the elastic component 61 are located on opposite sides of the swing arm 521. The rolling components 72 can rotate when they abut against the first end 524.

[0059] like Figures 2 to 7 As shown, the transmission disk 71 can be a circular plate structure made of metal. The top surface of the transmission disk 71 is centrally connected to the output shaft of the driver 8, and multiple rolling components 72 are evenly distributed on the bottom surface, that is, multiple rolling components 72 are evenly distributed on the side of the transmission disk 71 away from the driver 8. The number of multiple rolling components 72 corresponds to the number of swing arms 521, for example, three are provided, that is, multiple rolling components 72 are one-to-one with multiple swing arms 521. Furthermore, the rolling components 72 and the elastic component 61 are respectively located on opposite sides of the first end 524 of the swing arm 521, that is, multiple rolling components 72 are all located on one side of the multiple swing arms 521 in the counterclockwise direction, so as to cooperate with the elastic component 61 to drive the swing arm 521 to swing. In practical applications, the driver 8 drives multiple rolling components 72 to move simultaneously via the transmission disk 71. These rolling components 72 simultaneously abut against the first end 524 of the swing arm 521, causing the swing arm 521 to swing simultaneously in the second direction. Simultaneously, the rolling components 72 rotate to reduce impurities generated by friction with the first end 524, thereby preventing impurity contamination of the wafer. With this design, since the multiple rolling components 72 are all located on one side of the swing arm 521, the structure of this embodiment is simple, significantly improving disassembly and maintenance efficiency, and further enhancing the working efficiency of this embodiment.

[0060] It should be noted that the embodiments of this application do not limit the arrangement of the multiple rolling components 72. For example, the rolling component 72 can be located on one side of the swing arm 521 in the clockwise direction, that is, the positions of the rolling component 72 and the elastic component 61 can be interchanged. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the arrangement according to the actual situation.

[0061] In one embodiment of this application, as Figures 2 to 7As shown, the rolling component 72 includes a mounting shaft 73 and a bearing 74. The mounting shaft 73 is fixedly connected to the transmission disk 71, and the bearing 74 is sleeved on the mounting shaft 73. Specifically, three mounting shafts 73 are all disposed on the bottom surface of the transmission disk 71 and are evenly and spaced along the circumference of the transmission disk 71. Three bearings 74 are respectively disposed on the mounting shafts 73, and the outer periphery of the bearings 74 is used to achieve rolling contact with the first end 524 of the swing arm 521. The above design makes the application and maintenance costs of this embodiment low, thereby improving work efficiency and economic benefits. However, this embodiment does not limit the specific implementation of the rolling component 72. For example, the rolling component 72 may only include one bearing 74, the inner ring of which is disposed on the transmission disk 71. Therefore, this embodiment is not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0062] In one embodiment of this application, as Figures 2 to 7 As shown, the mounting housing 51 includes a top plate 511, columns 512 and a bottom plate 513. Multiple columns 512 are located between the top plate 511 and the bottom plate 513 and are evenly and spaced apart along the circumference of the top plate 511 and the bottom plate 513. The gap between any two columns 512 is used for the first end 524 of the swing arm 521 to extend into. A drive assembly 53 is mounted on the top plate 511.

[0063] like Figures 2 to 7 As shown, both the top plate 511 and the bottom plate 513 can be circular plate structures made of metal. The columns 512 can be integrally formed on the top surface of the bottom plate 513, and multiple columns 512 are evenly and spaced along the circumference of the bottom plate 513. The top plate 511 can be disposed above the bottom plate 513 and fixedly connected to the multiple columns 512 by multiple fasteners to form an accommodating space 514 with the bottom plate 513. The top surface of the top plate 511 can be used to install the driver 8 of the drive assembly 53. Since there are three swing arms 521, there can be three columns 512, so that a gap is formed between any two adjacent columns 512, allowing the first end 524 of the swing arm 521 to extend into the accommodating space 514 of the mounting housing 51. This gap can be used to install the pivot shaft 523 of the swing arm 521 and the connecting column 62 of the elastic component 61. However, this application embodiment does not limit the specific number of columns 512. The specific number of connecting columns 62 can be set to correspond to the number of swing arms 521. Therefore, this application embodiment is not limited thereto, and those skilled in the art can adjust the setting according to the actual situation. The above design makes this application embodiment easy to disassemble and maintain, that is, easy to install the second drive component 7 and the driver 8, thereby further improving the efficiency of disassembly and maintenance.

[0064] It should be noted that the embodiments of this application do not limit the specific implementation of the mounting shell 51. For example, multiple columns 512 and the base plate 513 may adopt a split structure. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0065] In one embodiment of this application, as Figure 4 As shown, one end of the clamping post 522 is connected to the second end 525 of the swing arm 521, and the axial direction of the clamping post 522 is perpendicular to the axial direction of the swing arm 521. The other end of the clamping post 522 has a limiting groove 527 for accommodating the edge of the wafer. Specifically, the axial direction of the clamping post 522 can be perpendicular to the axial direction of the swing arm 521, so that the swing arm 521 can clamp or release the wafer when swinging. The top end of the clamping post 522 is connected to the second end 525 of the swing arm 521, for example, by a screw connection; however, this application does not limit the specific connection method. The bottom of the clamping post 522 can have an annular limiting groove 527. When multiple clamping posts 522 cooperate to clamp the wafer, the limiting groove 527 can accommodate the edge of the wafer to limit its movement and prevent it from falling off, thereby significantly improving the stability and safety of the embodiments of this application, and thus improving the wafer's process yield. However, the embodiments of this application do not limit the specific structure of the clamping column 522, and those skilled in the art can adjust the settings according to the actual situation.

[0066] In one embodiment of this application, as Figure 1A and Figure 1B As shown, the flipping mechanism 1 includes a drive unit 12 and a connecting shaft 13. The drive unit 12 is fixedly installed, and its rotation shaft is connected to the flipping support 2 via the connecting shaft 13. Specifically, the drive unit 12 can be a rotary cylinder, which has the advantages of precise and simple control, facilitating the direct flipping of the first clamping mechanism 3 and the second clamping mechanism 4 into position in one go, thereby significantly improving the flipping efficiency of this embodiment. One end of the connecting shaft 13 is connected to the rotation shaft of the drive unit 12, and the other end is connected to the flipping support 2. Since the first clamping mechanism 3 and the second clamping mechanism 4 are respectively provided at both ends of the flipping support 2, the connecting shaft 13 allows the two clamping mechanisms to have a certain distance from the flipping mechanism 1, avoiding mechanical interference between the two clamping mechanisms and the flipping mechanism 1 during the flipping process. This makes the structural design of this embodiment reasonable, thereby significantly reducing the failure rate and increasing the service life. It should be noted that this embodiment does not limit the specific implementation of the flipping mechanism 1. For example, the drive unit 12 can be a stepper motor or a servo motor. Therefore, this embodiment is not limited to this, and those skilled in the art can adjust the settings according to the actual situation.

[0067] To further illustrate the working principle of the embodiments of this application, the following description is in conjunction with the appendix. Figures 1A to 8BA specific embodiment of this application is described below. Specifically, when the first clamping mechanism 3 picks up the wafer 100 from the front-mounted robotic arm, the first clamping mechanism 3 is in a first position and the second clamping mechanism 4 is in a second position. The driver 8 of the first clamping mechanism 3 drives the second driving member 7 to rotate clockwise. The rolling member 72 abuts against the first end 524 of the plurality of swing arms 521, so that the second end 525 of the plurality of swing arms 521 swings in a second direction, thereby increasing the diameter of the circle formed by the clamping posts 522 on the plurality of swing arms 521. For details, please refer to... Figure 8A and Figure 8B As shown, the front-mounted robotic arm can transport the wafer 100 to the area below the first clamping mechanism 3. The driver 8 drives the second driving member 7 to rotate counter-clockwise, causing the rolling member 72 to no longer press against the first end 524 of the swing arm 521. Under the tension of the elastic restoring force of the elastic member 61, the swing arm 521 swings in the first direction, reducing the diameter of the circle formed by the clamping posts 522 on the multiple swing arms 521, thereby clamping the wafer 100. Then, the flipping mechanism 1 can drive the first clamping mechanism 3 to flip to the second position and the second clamping mechanism 4 to flip to the first position. The driver 8 of the first clamping mechanism 3 again drives the second driving member 7 to rotate clockwise, causing the second end 525 of the multiple swing arms 521 to swing in the second direction, thereby increasing the diameter of the circle formed by the clamping posts 522 on the multiple swing arms 521, so that the clamped wafer 100 can be placed on the rear-mounted robotic arm. It should be noted that the working principle of the second clamping mechanism 4 is the same as that of the first clamping mechanism 3, and will not be described again here.

[0068] In one embodiment of this application, as Figures 1A to 3 As shown, the flip support 2 includes a semi-circular rotating support 21 and a connecting support 22. The rotating support 21 and the connecting support 22 cooperate to form a sleeve-shaped flip support 2. The flip mechanism 1 is connected to the rotating support 21. The first clamping mechanism 3 and the second clamping mechanism 4 are located inside the flip support 2.

[0069] like Figures 1A to 3As shown, both the flip support 2 and the connecting support 22 can be semi-annular sleeve structures made of metal, and they can be fixedly connected by fasteners. The outer periphery of the rotating support 21 has a rectangular boss, and the end of the connecting shaft 13 can be connected to the rectangular boss on the rotating support 21 using multiple fasteners; while the connecting support 22 can be fixedly mounted on one side of the rotating support 21 using fasteners. The top plate 511 of the first clamping mechanism 3 can be connected to the bottom end of the flip support 2, and the driver 8 of the first clamping mechanism 3 can be located inside the flip support 2, while the second clamping mechanism 4 can be symmetrically arranged at the top of the flip support 2. Furthermore, the rotating support 21 and the connecting support 22 can cooperate to engage the first clamping mechanism 3 and the second clamping mechanism 4 onto the flip support 2, thereby significantly improving the efficiency of disassembly and maintenance. With the above design, since parts of the first clamping mechanism 3 and the second clamping mechanism 4 can be located inside the flip support 2, the space occupied by this application embodiment can be greatly saved. Furthermore, since the flip support 2 adopts a split structure, the structure of this application embodiment is simple, thereby greatly improving the efficiency of disassembly and maintenance.

[0070] It should be noted that the embodiments of this application do not limit the specific structure of the flip support 2. For example, the flip support 2 can also be made in one piece. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0071] Based on the same inventive concept, this application provides a semiconductor cleaning device, the structure of which is illustrated in the schematic diagram. Figure 9 As shown, the system includes: a front robotic arm 201, a rear robotic arm 202, a process chamber 203, and a wafer flipping device 204 as provided in the above embodiments. The front robotic arm 201 is used to transfer wafers in the wafer cassette 205 to the first clamping mechanism 3 or the second clamping mechanism 4. The rear robotic arm 202 is used to transfer wafers on the first clamping mechanism 3 or the second clamping mechanism 4 to the process chamber 203. Specifically, the multiple process chambers 203 can be arranged in two rows, and two wafer cassettes 205 are spaced apart from one end of the two rows of process chambers 203. The front robotic arm 201 is positioned close to the two wafer cassettes 205, the rear robotic arm 202 is positioned between the ends of the two rows of process chambers 203, and the wafer flipping device 204 is positioned between the front robotic arm 201 and the rear robotic arm 202. With the above design, since the first clamping mechanism 3 cooperates with the front robotic arm 201 to pick up and place wafers, while the second clamping mechanism 4 cooperates with the rear robotic arm 202 to pick up and place wafers, the transfer efficiency of the semiconductor cleaning equipment is greatly improved, thereby significantly improving the working efficiency of the semiconductor cleaning equipment. However, it should be noted that the embodiments of this application do not limit the specific number of process chambers 203 and wafer cassettes 205, and those skilled in the art can adjust the settings according to the actual situation.

[0072] By applying the embodiments of this application, at least the following beneficial effects can be achieved:

[0073] This embodiment of the application symmetrically arranges a first clamping mechanism and a second clamping mechanism at both ends of the flipping support, and drives the two to flip at a first position and a second position through a driving mechanism. In actual use, while the first clamping mechanism cooperates with the front robotic arm to pick up and place wafers, the second clamping mechanism can cooperate with the rear robotic arm to pick up and place wafers. That is, when one clamping mechanism cooperates with the front robotic arm to pick up and place wafers, the other clamping mechanism can cooperate with the rear robotic arm to pick up and place wafers, realizing simultaneous cooperation with the front and rear robotic arms. This embodiment of the application significantly shortens the wafer flipping and transfer time while realizing wafer flipping, thereby greatly improving the working efficiency of the wafer transfer process, and thus greatly improving the working efficiency of the semiconductor cleaning equipment.

[0074] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

[0075] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0076] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0077] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0078] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0079] The above description is only a partial embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A wafer flipping device for a semiconductor cleaning equipment, disposed between a front-end robotic arm and a rear-end robotic arm of the semiconductor cleaning equipment, for the front-end robotic arm and the rear-end robotic arm to pick up and place wafers and to flip the wafers, characterized in that... include: A flipping mechanism, a flipping support, a first clamping mechanism, and a second clamping mechanism; The flipping mechanism is connected to the flipping support. The first clamping mechanism and the second clamping mechanism are symmetrically arranged at both ends of the flipping support, and the first clamping mechanism and the second clamping mechanism face opposite directions. The flipping mechanism is used to drive the flipping support to flip, so as to drive the first clamping mechanism and the second clamping mechanism to flip between the first position and the second position. Both the first clamping mechanism and the second clamping mechanism are used to selectively clamp or release the wafer. When the first clamping mechanism is in the first position and the second clamping mechanism is in the second position, the first clamping mechanism can clamp the wafer from the front robotic arm, and the rear robotic arm can remove the wafer from the second clamping mechanism; when the first clamping mechanism is in the second position and the second clamping mechanism is in the first position, the rear robotic arm can remove the wafer from the first clamping mechanism, and the second clamping mechanism can clamp the wafer from the front robotic arm.

2. The wafer flipping device as described in claim 1, characterized in that, Both the first clamping mechanism and the second clamping mechanism include a mounting shell, a driving assembly, and a clamping assembly. The plurality of clamping assemblies are evenly arranged along the circumference of the mounting shell and extend radially along the mounting shell. The driving assembly is disposed on the mounting shell and is used to drive the plurality of clamping assemblies to move simultaneously relative to the mounting shell to clamp or release the wafer. The gap between any two adjacent clamping assemblies is used for the front robotic arm or the rear robotic arm to reach in and pick up or place the wafer.

3. The wafer flipping device as described in claim 2, characterized in that, The clamping assembly is pivotally connected to the mounting housing, and the clamping assembly is oscillating relative to the mounting housing in a first direction to clamp the wafer; the clamping assembly is oscillating relative to the mounting housing in a second direction to release the wafer; Both the first direction and the second direction are circumferential directions of the mounting shell, and the first direction is opposite to the second direction.

4. The wafer flipping device as described in claim 3, characterized in that, The clamping assembly includes a swing arm and a clamping post; a first end of the swing arm extends into the mounting housing, and a second end of the swing arm is provided with the clamping post, which is used to contact the edge of the wafer to clamp the wafer; a pivot hole is provided on the swing arm near the first end; a pivot shaft is provided inside the mounting housing that can pass through the pivot hole, and the swing arm is pivotally connected to the mounting housing through the pivot shaft.

5. The wafer flipping device as described in claim 4, characterized in that, The driving assembly includes a first driving member, a second driving member, and a driver. The first driving member is disposed inside the mounting housing and is used to simultaneously drive the swing arm to swing in a first direction. The second driving member is disposed inside the mounting housing, and the driver is disposed on the mounting housing. The driver is connected to the first end of the plurality of swing arms through the second driving member and is used to drive the swing arm to swing in a second direction through the second driving member.

6. The wafer flipping apparatus as described in claim 5, characterized in that, The first driving component includes a plurality of elastic components, each of which is correspondingly disposed with a plurality of swing arms. The plurality of elastic components are located on the same side of the plurality of swing arms along the circumference of the mounting shell. One end of each elastic component is connected to the mounting shell, and the other end is connected to the swing arm at a position between the pivot hole and the second end, for providing an elastic force to drive the swing arm to swing in a first direction.

7. The wafer flipping apparatus as described in claim 6, characterized in that, Connecting posts are provided inside the mounting housing and on the swing arm. The two ends of the elastic component are respectively connected to the connecting posts inside the mounting housing and on the swing arm.

8. The wafer flipping apparatus as described in claim 6, characterized in that, The driver is disposed on the top of the mounting housing, and the output shaft of the driver extends into the mounting housing; the second driving member is located inside the mounting housing, the top of the second driving member is connected to the output shaft, and the bottom of the second driving member contacts the first end of the plurality of swing arms, for abutting the first end to drive the swing arms to swing in the second direction.

9. The wafer flipping apparatus as described in claim 8, characterized in that, The second driving component includes a transmission disk and rolling components. The transmission disk is coaxially arranged with the output shaft. Multiple rolling components are evenly distributed on the side of the transmission disk away from the driver. The multiple rolling components are arranged in a one-to-one correspondence with the multiple swing arms. The rolling components and the elastic component are located on opposite sides of the swing arms. The rolling components can rotate when they abut against the first end.

10. The wafer flipping apparatus as described in claim 9, characterized in that, The rolling component includes a mounting shaft and a bearing. The mounting shaft is fixedly connected to the transmission disk, and the bearing is sleeved on the mounting shaft.

11. The wafer flipping device as described in claim 4, characterized in that, The mounting housing includes a top plate, columns, and a bottom plate. A plurality of columns are located between the top plate and the bottom plate and are evenly and spaced apart along the circumference of the top plate and the bottom plate. The gap between any two columns is used for the first end of the swing arm to extend into. The drive assembly is mounted on the top plate.

12. The wafer flipping apparatus as described in claim 4, characterized in that, One end of the clamping post is connected to the second end, and the axial direction of the clamping post is perpendicular to the axial direction of the swing arm; the other end of the clamping post has a limiting groove for accommodating the edge of the wafer.

13. The wafer flipping apparatus according to any one of claims 1 to 12, characterized in that, The flipping mechanism includes a drive unit and a connecting shaft. The drive unit is fixedly installed, and the rotation shaft of the drive unit is connected to the flipping support through the connecting shaft.

14. The wafer flipping apparatus according to any one of claims 1 to 12, characterized in that, The flip support includes a semi-circular rotating support and a connecting support. The rotating support and the connecting support cooperate to form a sleeve-shaped flip support. The flipping mechanism is connected to the rotating support. The first clamping mechanism and a portion of the second clamping mechanism are located inside the flip support.

15. A semiconductor cleaning device, characterized in that, The device includes a front robotic arm, a rear robotic arm, a process chamber, and a wafer flipping device as described in any one of claims 1 to 14. The front robotic arm is used to transfer wafers in a wafer cassette to the first clamping mechanism or the second clamping mechanism, and the rear robotic arm is used to transfer wafers on the first clamping mechanism or the second clamping mechanism to the process chamber.

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