A microphone

Abstract

This application discloses a microphone, comprising: a housing structure and a vibration pickup unit, the vibration pickup unit generating vibration in response to vibration of the housing structure; a vibration transmission unit configured to transmit the vibration generated by the vibration pickup unit; and an acoustic-to-electrical conversion element configured to receive the vibration transmitted by the vibration transmission unit and generate an electrical signal; wherein the vibration pickup unit and the vibration transmission unit form a vacuum cavity, and the acoustic-to-electrical conversion element is located in the vacuum cavity. The microphone in this specification places the acoustic-to-electrical conversion element in the vacuum cavity formed by the vibration pickup unit and the vibration transmission unit, avoiding contact between the acoustic-to-electrical conversion element and the air in the acoustic cavity, effectively reducing the microphone's noise floor, and simultaneously preventing the acoustic-to-electrical conversion element from rubbing against the gas during vibration, thereby reducing the air damping inside the microphone's vacuum cavity and improving the microphone's Q value.

Description

Technical Field

[0001] This application relates to the field of sound transmission device technology, and in particular to a microphone. Background Technology

[0002] A microphone is a transducer that converts sound signals into electrical signals. Taking an air-conduction microphone as an example, external sound signals enter the acoustic cavity of the microphone through holes in the housing and are transmitted to the acoustic-to-electrical conversion element. The acoustic-to-electrical conversion element vibrates based on the sound signal and converts the vibration signal into an electrical signal for output. The acoustic cavity of the microphone contains a gas (e.g., air) at a certain pressure, which causes significant noise to be generated during the transmission of the sound signal from the acoustic cavity to the acoustic-to-electrical conversion element, reducing the sound quality of the microphone output. On the other hand, during the vibration of the acoustic-to-electrical conversion element upon receiving the sound signal, the element rubs against the gas in the acoustic cavity, increasing the air damping of the acoustic cavity and thus reducing the microphone's Q value.

[0003] Therefore, it is desirable to provide a microphone with low noise floor and high Q value. Summary of the Invention

[0004] This application provides a microphone, which includes: a housing structure and a vibration pickup unit, the vibration pickup unit generating vibration in response to vibration of the housing structure; a vibration transmission unit configured to transmit the vibration generated by the vibration pickup unit; and an acoustic-to-electrical conversion element configured to receive the vibration transmitted by the vibration transmission unit and generate an electrical signal; wherein the vibration pickup unit and the vibration transmission unit form a vacuum cavity, and the acoustic-to-electrical conversion element is located in the vacuum cavity.

[0005] Compared to existing technologies, the beneficial effects of the microphone provided in the embodiments of this specification are as follows: the acoustic-to-electric conversion element in the microphone is located in the vacuum cavity formed by the vibration pickup section and the vibration transmission section. External sound signals enter the acoustic cavity of the shell structure through the aperture, causing the air in the acoustic cavity to vibrate. The vibration pickup section and the vibration transmission section transmit the vibration to the acoustic-to-electric conversion element located in the vacuum cavity, avoiding contact between the acoustic-to-electric conversion element and the air in the acoustic cavity. This solves the problem of the air vibration in the acoustic cavity during the acoustic-to-electric conversion process, that is, it solves the problem of high microphone background noise. On the other hand, the acoustic-to-electric conversion element being located in the vacuum cavity can avoid friction between the acoustic-to-electric conversion element and the gas during vibration, thereby reducing the air damping inside the vacuum cavity of the microphone and improving the Q value of the microphone. Attached Figure Description

[0006] This application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0007] Figure 1 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0008] Figure 2 This is a schematic diagram of the structure of another microphone according to some embodiments of this application;

[0009] Figure 3 This is a schematic diagram of a spring-mass-damping system for an electroacoustic conversion element according to some embodiments of this application;

[0010] Figure 4 This is an exemplary normalized schematic diagram of the displacement resonance curve of a spring-mass-damped system according to some embodiments of this application;

[0011] Figure 5 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0012] Figure 6 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0013] Figure 7 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0014] Figure 8A yes Figure 5 A schematic diagram of the cross-section of the microphone along the AA direction;

[0015] Figure 8B yes Figure 5 A schematic diagram of the cross-section of the microphone along the direction perpendicular to AA;

[0016] Figure 9A This is a schematic diagram of the cantilever beam structure distribution according to some embodiments of this application;

[0017] Figure 9B This is a schematic diagram of the cantilever beam structure distribution according to some embodiments of this application;

[0018] Figure 10 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0019] Figure 11 This is a schematic diagram of the frequency response curve of a microphone according to some embodiments of this application;

[0020] Figure 12This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0021] Figure 13 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0022] Figure 14 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0023] Figure 15 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0024] Figure 16 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0025] Figure 17 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0026] Figure 18A This is a schematic cross-sectional view of a microphone according to some embodiments of this application;

[0027] Figure 18B This is a schematic cross-sectional view of a microphone according to some embodiments of this application;

[0028] Figure 19A This is a schematic cross-sectional view of a microphone according to some embodiments of this application;

[0029] Figure 19B This is a schematic cross-sectional view of a microphone according to some embodiments of this application;

[0030] Figure 20 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0031] Figure 21 This is a schematic diagram of the structure of a microphone according to some embodiments of this application;

[0032] Figure 22 This is a schematic diagram of the structure of a microphone according to some embodiments of this application. Detailed Implementation

[0033] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0034] This specification describes a microphone. A microphone is a transducer that converts sound signals into electrical signals. In some embodiments, the microphone may be a moving-coil microphone, a ribbon microphone, a condenser microphone, a piezoelectric microphone, an electret microphone, an electromagnetic microphone, a carbon microphone, or any combination thereof. In some embodiments, microphones may be distinguished by the method of sound acquisition, including bone conduction microphones and air conduction microphones. The microphone described in the embodiments of this specification may include a housing structure, a vibration pickup section, a vibration transmission section, and an acoustic-to-electrical conversion element. The housing structure may be configured to support the vibration pickup section, the vibration transmission section, and the acoustic-to-electrical conversion element. In some embodiments, the housing structure may be a hollow structure, and the housing structure may independently form an acoustic cavity, within which the vibration pickup section, the vibration transmission section, and the acoustic-to-electrical conversion element may be located. In some embodiments, the vibration pickup section may be connected to the sidewall of the housing structure, and the vibration pickup section may vibrate in response to external sound signals transmitted to the housing structure. In some embodiments, the vibration transmission unit can be connected to the vibration pickup unit. The vibration transmission unit can receive the vibrations from the vibration pickup unit and transmit the vibration signal to the acoustic-to-electric conversion element, which converts the vibration signal into an electrical signal. In some embodiments, a vacuum cavity can be formed between the vibration transmission unit and a portion of the structure of the vibration pickup unit (e.g., a fixing part), and the acoustic-to-electric conversion element is located in the vacuum cavity. In the microphone provided in the embodiments of this specification, the acoustic-to-electric conversion element is located in the vacuum cavity formed by the vibration pickup unit and the vibration transmission unit. External sound signals enter the acoustic cavity of the housing structure through the aperture, causing the air in the acoustic cavity to vibrate. The vibration pickup unit and the vibration transmission unit transmit the vibration to the acoustic-to-electric conversion element located in the vacuum cavity, avoiding contact between the acoustic-to-electric conversion element and the air in the acoustic cavity. This solves the problem of the acoustic-to-electric conversion element being affected by the air vibration in the acoustic cavity during the acoustic-to-electric conversion process, that is, it solves the problem of high background noise in the microphone. On the other hand, the sound-to-electric conversion element is located in a vacuum cavity, which can prevent the sound-to-electric conversion element from rubbing against the gas during vibration, thereby reducing the air damping inside the vacuum cavity of the microphone and improving the Q value of the microphone.

[0035] Figure 1 This is a schematic diagram of the structure of a microphone according to some embodiments of this application. For example... Figure 1As shown, microphone 100 may include a housing structure 110, an acoustic-to-electrical conversion element 120, and a processor 130. Microphone 100 may generate deformation and / or displacement based on external signals, such as sound signals (e.g., sound waves), mechanical vibration signals, etc. The deformation and / or displacement may be further converted into electrical signals by the acoustic-to-electrical conversion element 120 of microphone 100. In some embodiments, microphone 100 may be an air conduction microphone or a bone conduction microphone, etc. An air conduction microphone is a microphone in which sound waves are conducted through the air. A bone conduction microphone is a microphone in which sound waves are conducted through a solid (e.g., bone) in a mechanical vibration manner.

[0036] The housing structure 110 can be a hollow structure, and can independently form an acoustic cavity 140, within which the acoustic-to-electric conversion element 120 and processor 130 are located. In some embodiments, the material of the housing structure 110 may include, but is not limited to, one or more of metals, alloys, and polymers (e.g., acrylonitrile-butadiene-styrene copolymer, polyvinyl chloride, polycarbonate, polypropylene, etc.). In some embodiments, one or more holes 111 may be provided on the sidewall of the housing structure 110, which can guide external sound signals into the acoustic cavity 140. In some embodiments, external sound signals can enter the acoustic cavity 140 of the microphone 100 through the holes 111, causing the air inside the acoustic cavity 140 to vibrate. The acoustic-to-electric conversion element 120 can receive the vibration signal and convert it into an electrical signal for output.

[0037] The acoustic-to-electric conversion element 120 is used to convert external signals into target signals. In some embodiments, the acoustic-to-electric conversion element 120 can be a stacked structure. In some embodiments, at least a portion of the stacked structure is physically connected to the shell structure. The "connection" described in this application can be understood as the connection between different parts of the same structure, or after different components or structures are fabricated separately, the independent components or structures are fixedly connected by welding, riveting, snap-fitting, bolting, adhesive bonding, etc., or during the fabrication process, the first component or structure is deposited on the second component or structure by physical deposition (e.g., physical vapor deposition) or chemical deposition (e.g., chemical vapor deposition). In some embodiments, at least a portion of the stacked structure can be fixed to the sidewall of the shell structure. For example, the stacked structure can be a cantilever beam, which can be a plate-like structure, with one end of the cantilever beam connected to the sidewall where the cavity of the shell structure is located, and the other end of the cantilever beam not connected to or in contact with the base structure, so that the other end of the cantilever beam is suspended in the cavity of the shell structure. For example, the microphone may include a diaphragm layer (also called a vibration pickup section), which is fixedly connected to the housing structure, and a laminated structure is disposed on the upper or lower surface of the vibration pickup section structure. It should be noted that the terms "located in the cavity" or "suspended in the cavity" in this application can mean suspended inside, below, or above the cavity. In some embodiments, the acoustic-to-electric conversion element 120 may also be connected to the housing structure 110 via other components (e.g., the vibration pickup section, the vibration transmission section).

[0038] In some embodiments, the laminated structure may include a vibrating unit and an acoustic transducer. A vibrating unit refers to the portion of the laminated structure that is easily deformed by external forces, and it can be used to transmit the deformation caused by external forces to the acoustic transducer. An acoustic transducer is the portion of the laminated structure that converts the deformation of the vibrating unit into an electrical signal. Specifically, an external sound signal enters the acoustic cavity 140 through the sound inlet 111, causing the air inside the acoustic cavity 140 to vibrate. The vibrating unit deforms in response to the vibration of the air inside the acoustic cavity 140; the acoustic transducer generates an electrical signal based on the deformation of the vibrating unit. It should be noted that the description of the vibrating unit and the acoustic transducer here is only for the purpose of conveniently introducing the working principle of the laminated structure and does not limit the actual composition and structure of the laminated structure. In fact, the vibrating unit is not necessary; its function can be fully realized by the acoustic transducer. For example, by making certain changes to the structure of the acoustic transducer, the acoustic transducer can directly generate an electrical signal in response to the vibration of the base structure.

[0039] In some embodiments, the vibrating unit and the acoustic transducer unit overlap to form a stacked structure. The acoustic transducer unit may be located in the upper layer of the vibrating unit or in the lower layer of the vibrating unit.

[0040] In some embodiments, the acoustic transducer may include two electrode layers (e.g., a first electrode layer and a second electrode layer) and a piezoelectric layer, wherein the piezoelectric layer may be located between the first electrode layer and the second electrode layer. A piezoelectric layer is a structure that can generate a voltage at its two end faces when subjected to external force. In some embodiments, the piezoelectric layer can generate a voltage under the deformation stress of the vibrating unit, and the first and second electrode layers can collect this voltage (electrical signal).

[0041] The processor 130 can acquire electrical signals from the acoustic-to-electric conversion element 120 and perform signal processing. In some embodiments, the processor 130 can be directly connected to the acoustic-to-electric conversion element 120 via a wire 150 (e.g., gold wire, copper wire, aluminum wire, etc.). In some embodiments, the signal processing may include frequency modulation processing, amplitude modulation processing, filtering processing, noise reduction processing, etc. In some embodiments, the processor 130 may include, but is not limited to, a microcontroller, microprocessor, application-specific integrated circuit (ASIC), application-specific instruction set processor (ASIP), central processing unit (CPU), physical processing unit (PPU), digital signal processor (DSP), field-programmable gate array (FPGA), advanced reduced instruction set computer (ARM), programmable logic device (PLD), or other types of processing circuits or processors.

[0042] In some embodiments, when the microphone 100 functions as an air-conducting microphone (e.g., an air-conducting microphone), the acoustic cavity 140 can be acoustically connected to the outside of the microphone 100 through the aperture 111, allowing the acoustic cavity 140 to contain a gas (e.g., air) at a certain pressure. The gas inside the acoustic cavity 140 causes the air inside the acoustic cavity 140 to vibrate during the transmission of a sound signal from the aperture 111 through the acoustic cavity 140 to the acoustic-to-electric conversion element 120. This vibration, acting on the acoustic-to-electric conversion element 120, introduces a significant background noise into the microphone 100. Furthermore, during the vibration of the acoustic-to-electric conversion element 120 upon receiving a sound signal, the acoustic-to-electric conversion element 120 rubs against the gas inside the acoustic cavity 140, increasing the air damping within the acoustic cavity 140 and thus reducing the Q value of the microphone 100. To address the above problems, embodiments of this application provide a microphone; details regarding the microphone can be found below.

[0043] Figure 2 This is a schematic diagram of the structure of a microphone according to some embodiments of this application. For example... Figure 2 As shown, the microphone 200 may include a housing structure 210, an acoustic-to-electrical conversion element 220, and a processor 230. Figure 2 The microphone 200 shown can be used with Figure 1The microphone 100 shown is the same as or similar to the microphone 200. For example, the housing structure 210 of the microphone 200 is the same as or similar to the housing structure 110 of the microphone 100. As another example, the acoustic-to-electrical conversion element 220 of the microphone 200 is the same as or similar to the acoustic-to-electrical conversion element 120 of the microphone 100. Further details regarding the structure of the microphone 200 (e.g., processor 230, wires 270, etc.) can be found in [reference needed]. Figure 1 And its related descriptions.

[0044] In some embodiments, the microphone 200 differs from the microphone 100 in that the microphone 200 may further include a vibration pickup unit 260. The vibration pickup unit 260 is located within the acoustic cavity of the housing structure 210, and its periphery may be connected to the sidewall of the housing structure 210, thereby dividing the acoustic cavity into a first acoustic cavity 240 and a second acoustic cavity 250. In some embodiments, the microphone 200 may include one or more apertures 211, which may be located on the sidewall of the housing structure 210 corresponding to the first acoustic cavity 240, allowing communication between the first acoustic cavity 240 and the outside of the microphone 200. External sound signals can enter the first acoustic cavity 240 through the apertures 211, causing the air within the first acoustic cavity 240 to vibrate. The vibration pickup unit 260 can pick up the air vibration within the first acoustic cavity 240 and transmit the vibration signal to the acoustic-to-electrical conversion element 220. The sound-to-electric conversion element 220 receives the vibration signal from the vibration pickup unit 260 and converts the vibration signal into an electrical signal.

[0045] In some embodiments, the material of the vibration pickup unit 260 may be one or more selected from semiconductor materials, metallic materials, metal alloys, and organic materials. In some embodiments, semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, and silicon carbide. In some embodiments, metallic materials may include, but are not limited to, copper, aluminum, chromium, titanium, and gold. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, and aluminum alloys. In some embodiments, organic materials may include, but are not limited to, polyimide, phenylene oxide, PDMS, silicone gel, and silicone. In some embodiments, the structure of the vibration pickup unit 260 may be a plate-like structure, a columnar structure, or the like.

[0046] In some embodiments, the acoustic-to-electric conversion element 220 and the processor 230 may be located within the second acoustic cavity 250. The second acoustic cavity 250 is a vacuum cavity. In some embodiments, the acoustic-to-electric conversion element 220 being located within the second acoustic cavity 250 avoids contact between the acoustic-to-electric conversion element 220 and the air within the second acoustic cavity 250, thereby solving the problem of high background noise in the microphone 200 caused by air vibration during the acoustic-to-electric conversion process. Furthermore, the location of the acoustic-to-electric conversion element 220 within the second acoustic cavity 250 prevents friction between the acoustic-to-electric conversion element 220 and the air within the second acoustic cavity 250 during vibration, thereby reducing air damping within the second acoustic cavity 250 and improving the Q value of the microphone 200. In some embodiments, the vacuum level inside the second acoustic cavity 250 may be less than 100 Pa. In some embodiments, the vacuum level inside the second acoustic cavity 250 may be 10 Pa. - 6 Pa-100Pa. In some embodiments, the vacuum level inside the second acoustic cavity 250 can be 10 Pa. -7 Pa-100Pa.

[0047] To facilitate understanding of the acoustic-to-electric conversion element, in some embodiments, the acoustic-to-electric conversion element of the microphone can be approximately equivalent to a spring-mass-damped system. When the microphone is operating, the spring-mass-damped system may vibrate under the action of an excitation source (e.g., vibration of the vibration pickup unit). Figure 3 This is a schematic diagram of a spring-mass-damping system for a sound-to-electric conversion element according to some embodiments of this application. For example... Figure 3 As shown, the spring-mass-damped system can be moved according to the differential equation (1):

[0048]

[0049] Where M represents the mass of the spring-mass-damping system, x represents the displacement of the spring-mass-damping system, R represents the damping of the spring-mass-damping system, K represents the spring-mass-damping coefficient, F represents the amplitude of the driving force, and ω represents the circular frequency of the external force.

[0050] The differential equation (1) can be solved to obtain the displacement under steady state (2):

[0051] x = x a cos(ωt-θ), (2)

[0052] Where x represents the value of the output electrical signal when the deformation of the spring-mass-damping system is equal to the value of the output electrical signal during microphone operation. Chinese xa Z represents the output displacement, Z represents the mechanical impedance, and θ represents the oscillation phase.

[0053] The normalization of the ratio of displacement amplitudes A can be described by equation (3):

[0054]

[0055] in, Chinese x a0 This represents the displacement amplitude under steady-state conditions (or the displacement amplitude when ω = 0). middle In the ratio of the external force frequency to the natural frequency, ω0 = K / M represents the circumferential frequency of the vibration. China Q m This represents the mechanical quality factor.

[0056] Figure 4 This is an exemplary normalized schematic diagram of the displacement resonance curve of a spring-mass-damped system according to some embodiments of this application. The horizontal axis can represent the ratio of the actual vibration frequency of the spring-mass-damped system to its natural frequency, and the vertical axis can represent the normalized displacement of the spring-mass-damped system. It is understood that... Figure 4 The curves in the diagram can represent the displacement resonance curves of spring-mass-damped systems with different parameters. In some embodiments, the microphone can generate an electrical signal based on the relative displacement between the acoustic-to-electric conversion element and the housing structure. For example, an electret microphone can generate an electrical signal based on the change in distance between the deformed diaphragm and the substrate. As another example, a cantilever beam bone conduction microphone can generate an electrical signal based on the inverse piezoelectric effect caused by the deformed cantilever beam structure. In some embodiments, the greater the displacement of the cantilever beam structure deformation, the larger the electrical signal output by the microphone. Figure 4 As shown, when the actual vibration frequency of the spring-mass-damped system is the same as or approximately the same as its natural frequency (i.e., the ratio ω / ω0 of the actual vibration frequency of the spring-mass-damped system to its natural frequency is equal to or approximately equal to 1), the larger the normalized displacement of the spring-mass-damped system, the narrower the 3dB bandwidth of the resonance peak in the displacement resonance curve (which can be understood as the resonant frequency range). Combining the above equation (3), it can be seen that the larger the normalized displacement of the spring-mass-damped system, the larger the Q value of the microphone.

[0057] Figure 5 This is a schematic diagram of the structure of a microphone according to some embodiments of this application. For example... Figure 5As shown, the microphone 500 may include a housing structure 510, an acoustic-to-electrical conversion element 520, a vibration pickup unit 522, and a vibration transmission unit 523. The housing structure 510 may be configured to support the vibration pickup unit 522, the vibration transmission unit 523, and the acoustic-to-electrical conversion element 520. In some embodiments, the housing structure 510 may be a regular structure such as a cuboid, cylinder, or frustum, or other irregular structures. In some embodiments, the housing structure 510 is a hollow structure, and the housing structure 510 may independently form an acoustic cavity, within which the vibration pickup unit 522, the vibration transmission unit 523, and the acoustic-to-electrical conversion element 520 may be located. In some embodiments, the material of the housing structure 510 may include, but is not limited to, one or more of the following: metals, alloys, and polymers (e.g., acrylonitrile-butadiene-styrene copolymer, polyvinyl chloride, polycarbonate, polypropylene, etc.). In some embodiments, the periphery of the vibration pickup unit 522 may be connected to the sidewall of the housing structure 510, thereby dividing the acoustic cavity formed by the housing structure 510 into multiple cavities, including a first acoustic cavity 530 and a second acoustic cavity 540.

[0058] In some embodiments, one or more holes 511 may be provided on the sidewall of the housing structure 510 corresponding to the first acoustic cavity 530. These holes 511 may be located in the first acoustic cavity 530 and guide external sound signals into it. In some embodiments, external sound signals may enter the first acoustic cavity 530 of the microphone 500 through the holes 511 and cause the air inside the first acoustic cavity 530 to vibrate. The vibration pickup unit 522 may pick up the air vibration signal and transmit it to the acoustic-to-electrical conversion element 520, which receives the vibration signal and converts it into an electrical signal for output.

[0059] In some embodiments, the vibration pickup unit 522 may include a first vibration pickup unit 5221 and a second vibration pickup unit 5222 arranged sequentially from top to bottom. The first vibration pickup unit 5221 and the second vibration pickup unit 5222 can be connected to the housing structure 510 through their peripheral sides, and a portion of the structure of the first vibration pickup unit 5221 and the second vibration pickup unit 5222 can vibrate in response to a sound signal entering the microphone 500 through the aperture 511. In some embodiments, the material of the vibration pickup unit 522 may include, but is not limited to, one or more of semiconductor materials, metallic materials, metal alloys, and organic materials. In some embodiments, semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, and silicon carbide. In some embodiments, metallic materials may include, but are not limited to, copper, aluminum, chromium, titanium, and gold. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, and aluminum alloys. In some embodiments, organic materials may include, but are not limited to, polyimide, phenylene oxide, PDMS, silicone gel, and silicone. In some embodiments, the structure of the vibration pickup unit 522 may be a plate-like structure, a columnar structure, or the like.

[0060] In some embodiments, the vibration pickup unit 522 may include an elastic portion and a fixing portion. This is merely an example. Figure 6 This is a schematic diagram of the structure of a microphone according to some embodiments of this application. For example... Figure 6 As shown, the first vibration pickup unit 5221 may include a first elastic part 52211 and a first fixed part 52212. One end of the first elastic part 52211 is connected to the side wall of the housing structure 510, and the other end of the first elastic part 52211 is connected to the first fixed part 52212, such that the first elastic part 52211 is connected between the first fixed part 52212 and the inner wall of the housing structure 510. The second vibration pickup unit 5222 may include a second elastic part 52221 and a second fixed part 52222. One end of the second elastic part 52221 is connected to the side wall of the housing structure 510, and the other end of the second elastic part 52221 is connected to the second fixed part 52222, such that the second elastic part 52221 is connected between the second fixed part 52222 and the inner wall of the housing structure 510.

[0061] In some embodiments, the vibration transmission part 523 may be located between the first vibration pickup part 5221 and the second vibration pickup part 5222. The upper surface of the vibration transmission part 523 is connected to the lower surface of the first vibration pickup part 5221, and the lower surface of the vibration transmission part 523 is connected to the upper surface of the second vibration pickup part 5222. Specifically, a vacuum cavity 550 may be formed between the vibration transmission part 523, the first fixing part 52212 of the first vibration pickup part 5221, and the second fixing part 52222 of the second vibration pickup part 5222, and the acoustic-electric conversion element 520 may be located within the vacuum cavity 550. Specifically, one end of the acoustic-electric conversion element 520 may be connected to the inner wall of the vibration transmission part 523, and the other end of the acoustic-electric conversion element 520 may be suspended in the vacuum cavity 550. In some embodiments, vibrations picked up by the vibration pickup unit 522 (e.g., the first elastic portion 52211 of the first vibration pickup unit 5221 and the second elastic portion 52221 of the second vibration pickup unit 5222) can be transmitted to the acoustic-electric conversion element 520 via the vibration transmission unit 523. In some embodiments, the material of the vibration transmission unit 523 may include, but is not limited to, one or more of semiconductor materials, metallic materials, metal alloys, and organic materials. In some embodiments, the material of the vibration transmission unit 523 may be the same as or different from the material of the vibration pickup unit 522. In some embodiments, the vibration transmission unit 523 and the vibration pickup unit 522 may be an integrally formed structure. In some embodiments, the vibration transmission unit 523 and the vibration pickup unit 522 may also be relatively independent structures. In some embodiments, the vibration transmission unit 523 may be a tubular structure, a ring structure, a quadrilateral, a pentagon, or other regular and / or irregular polygonal structure.

[0062] The acoustic-to-electric conversion element 520 is disposed within the vacuum cavity 550, which prevents the acoustic-to-electric conversion element 520 from contacting the air inside the vacuum cavity 550. This solves the problem of air vibration inside the vacuum cavity 550 during the vibration of the acoustic-to-electric conversion element 520, thereby resolving the issue of high background noise in the microphone 500. Furthermore, the location of the acoustic-to-electric conversion element 520 within the vacuum cavity 550 prevents friction between the acoustic-to-electric conversion element 520 and the air inside the vacuum cavity 550, thereby reducing air damping inside the vacuum cavity 550 and improving the Q value of the microphone 500. To improve the output performance of the microphone 500, in some embodiments, the vacuum level inside the vacuum cavity 550 can be less than 100 Pa. In some embodiments, the vacuum level inside the vacuum cavity 550 can be 10 Pa. -6 Pa-100Pa. In some embodiments, the vacuum level inside the vacuum chamber 550 can be 10 Pa. -7 Pa-100Pa.

[0063] In some embodiments, the materials of the first fixing portion 52212 and the second fixing portion 52222 may be different from the materials of the first elastic portion 52211 and the second elastic portion 52221. For example, in some embodiments, the stiffness of the fixing portion of the vibration pickup portion 522 may be greater than the stiffness of the elastic portion, that is, the stiffness of the first fixing portion 52212 may be greater than the stiffness of the first elastic portion 52211 and / or the stiffness of the second fixing portion 52222 may be greater than the stiffness of the second elastic portion 52221. The first elastic portion 52211 and / or the second elastic portion 52221 may generate vibration in response to an external sound signal and transmit the vibration signal to the acoustic-to-electrical conversion element 520. The first fixing portion 52212 and the second fixing portion 52222 have greater stiffness to ensure that the vacuum cavity 550 formed by the first fixing portion 52212, the second fixing portion 52222, and the vibration transmission portion 523 is not affected by external air pressure. In some embodiments, to ensure that the vacuum chamber 550 is unaffected by external air pressure, the Young's modulus of the fixing portion (e.g., the first fixing portion 52212 and the second fixing portion 52222) of the vibration pickup portion 522 can be greater than 60 GPa. In some embodiments, the Young's modulus of the fixing portion (e.g., the first fixing portion 52212 and the second fixing portion 52222) of the vibration pickup portion 522 can be greater than 50 GPa. In some embodiments, the Young's modulus of the fixing portion (e.g., the first fixing portion 52212 and the second fixing portion 52222) of the vibration pickup portion 522 can be greater than 40 GPa.

[0064] In some embodiments, to ensure that the vacuum cavity is unaffected by external air pressure, the microphone may further include a reinforcing member. This reinforcing member may be located on the upper or lower surface of the vibration pickup portion corresponding to the vacuum cavity, thereby increasing the stiffness of the corresponding vibration pickup portion. This is merely an example. Figure 7 This is a schematic diagram of the structure of a microphone according to some embodiments of this application. For example... Figure 7 As shown, the microphone 500 may further include a reinforcing member 560. The reinforcing member 560 may be located on the upper or lower surface of the vibration pickup section 522 corresponding to the vacuum cavity 550. Specifically, the reinforcing member 560 may be located on the lower surface of the first vibration pickup section 5221 and the upper surface of the second vibration pickup section 5222, respectively, and the periphery of the reinforcing member 560 is connected to the inner wall of the vibration transmission section 523. In some embodiments, the structure of the reinforcing member 560 may be a plate-like structure, a columnar structure, etc., and the structure of the reinforcing member 560 can be adaptively adjusted according to the shape and structure of the vibration transmission section 523. It should be noted that the position of the reinforcing member 560 is not limited to... Figure 7The interior of the vacuum cavity 550 shown can also be located in other positions. For example, the reinforcement 560 can also be located outside the vacuum cavity 550. Specifically, the reinforcement 560 can be located on the upper surface of the first vibration pickup unit 5221 and the lower surface of the second vibration pickup unit 5222. As another example, the reinforcement 560 can also be located both inside and outside the vacuum cavity 550. Specifically, the reinforcement member 560 can be located on the upper surface of the first vibration pickup unit 5221 and the upper surface of the second vibration pickup unit 5222, or the reinforcement member 560 can be located on the upper surface of the first vibration pickup unit 5221 and the lower surface of the second vibration pickup unit 5222, or the reinforcement member 560 can be located on the lower surface of the first vibration pickup unit 5221 and the lower surface of the second vibration pickup unit 5222, or the reinforcement member 560 can be located on the lower surface of the first vibration pickup unit 5221 and the upper surface of the second vibration pickup unit 5222, or the reinforcement member 560 can be located on both the upper and lower surfaces of the first vibration pickup unit 5221 and the upper and lower surfaces of the second vibration pickup unit 5222. The location of the reinforcement member 560 is not limited to the above description; any function that ensures the vacuum chamber is not affected by external air pressure is within the scope of this specification.

[0065] In some embodiments, to ensure that the vacuum chamber 550 is unaffected by external air pressure, the stiffness of the reinforcement 560 is greater than the stiffness of the vibration pickup part 522. In some embodiments, the Young's modulus of the reinforcement 560 may be greater than 60 GPa. In some embodiments, the Young's modulus of the reinforcement 560 may be greater than 50 GPa. In some embodiments, the Young's modulus of the reinforcement 560 may be greater than 40 GPa. In some embodiments, the material of the reinforcement 560 may include, but is not limited to, one or more of semiconductor materials, metallic materials, metal alloys, and organic materials. In some embodiments, semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, and silicon carbide. In some embodiments, metallic materials may include, but are not limited to, copper, aluminum, chromium, titanium, and gold. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, and aluminum alloys. In some embodiments, organic materials may include, but are not limited to, polyimide, phenylene oxide, PDMS, silicone gel, and silicone.

[0066] The internal air pressure of the vacuum chamber 550 is much lower than the external air pressure. By providing reinforcement members 560 at the first vibration pickup section 5221 and / or the second vibration pickup section 5222 corresponding to the vacuum chamber 550, the vacuum chamber 550 can be ensured to be unaffected by the external air pressure. This can also be understood as the reinforcement members 560 increasing the rigidity of the first and second vibration pickup sections 5221 and 5222 corresponding to the vacuum chamber 550, thus preventing deformation of the vibration pickup section 522 under the pressure difference between the external air pressure and the internal air pressure of the vacuum chamber 550. This ensures that the volume of the vacuum chamber 550 remains essentially constant when the microphone 500 is working, thereby ensuring the normal operation of the acoustic-to-electrical conversion element 520 inside the vacuum chamber 550. It should be noted that each component of the microphone 500 (e.g., the first vibration pickup unit 5221, the second vibration pickup unit 5222, the vibration transmission unit 523, and the acoustic-electric conversion element 520) requires the packaging equipment to provide the required vacuum level during the production process so that the vacuum level inside the vacuum chamber 550 is within the required range.

[0067] It should be noted that, in alternative embodiments, the vibration pickup unit 522 may only include a first vibration pickup unit 5221, which is connected to the housing structure 510 via its periphery. The acoustic-to-electrical conversion element 520 may be directly or indirectly connected to the first vibration pickup unit 5221. For example, the acoustic-to-electrical conversion element 520 may be located on the upper or lower surface of the first vibration pickup unit 5221. Alternatively, the acoustic-to-electrical conversion element 520 may be connected to the first vibration pickup unit 5221 via other structures (e.g., vibration transmission unit 523). The first vibration pickup unit 5221 may vibrate in response to a sound signal entering the microphone 500 through the aperture 511, and the acoustic-to-electrical conversion element 520 may convert the vibration of the first vibration pickup unit 5221 or the vibration transmission unit 523 into an electrical signal.

[0068] In some embodiments, the acoustic-to-electric conversion element 520 may include one or more acoustic-to-electric conversion elements. In some embodiments, a plurality of acoustic-to-electric conversion elements 520 may be spaced apart on the inner wall of the vibration transmission portion 523. It should be noted that the spaced distribution here may refer to the horizontal direction (perpendicular to) Figure 5 (as shown in the AA direction) or vertical direction ( Figure 5 (As shown in the AA direction). For example, when the vibration transmission section 523 is an annular tubular structure, multiple acoustic-electric conversion elements 520 can be distributed sequentially from top to bottom in the vertical direction. Figure 8A yes Figure 5 A schematic diagram of the cross-section of the microphone along the AA direction. (See diagram below.) Figure 8AAs shown, multiple acoustic-electric conversion elements 520 can be sequentially and spaced apart on the inner wall of the vibration transmission section 523, and in the horizontal direction, the multiple acoustic-electric conversion elements 520 spaced apart are on the same plane or approximately parallel. Figure 8B yes Figure 5 A schematic diagram of the microphone's cross-section perpendicular to the AA direction. (See diagram below.) Figure 8B As shown, in the horizontal direction, the fixed ends of each acoustic-electric conversion element 520 and the vibration transmission section 530 can be spaced apart on the annular inner wall of the vibration transmission section 523. The fixed ends of the acoustic-electric conversion elements 520 and the vibration transmission section 523 can be approximately perpendicular. The other end (also referred to as the free end) of the acoustic-electric conversion element 520 extends towards the center of the vibration transmission section 523 and is suspended in the vacuum cavity 550, so that the acoustic-electric conversion elements 520 are arranged in a ring in the horizontal direction. In some embodiments, when the vibration transmission section 523 is a polygonal tubular structure (e.g., triangular, pentagonal, hexagonal, etc.), in the horizontal direction, the fixed ends of the plurality of acoustic-electric conversion elements 520 can also be spaced apart along the side walls of the vibration transmission section 523. Figure 9A This is a schematic diagram showing the horizontal distribution of the acoustic-electric conversion elements according to some embodiments of this application. For example... Figure 9A As shown, the vibration transmission section 523 has a quadrilateral structure, and multiple acoustic-electric conversion elements 520 can be alternately distributed on the four side walls of the vibration transmission section 523. Figure 9B This is a schematic diagram showing the distribution of sound-to-electric conversion elements according to some embodiments of this application. For example... Figure 9B As shown, the vibration transmission section 523 has a hexagonal structure, and multiple acoustic-to-electric conversion elements 520 can be alternately distributed on the six side walls of the vibration transmission section 523. In some embodiments, the multiple acoustic-to-electric conversion elements 520 are spaced apart on the inner wall of the vibration transmission section 523, which can improve the utilization rate of the vacuum cavity 550 space, thereby reducing the overall volume of the microphone 500.

[0069] It should be noted that, in the horizontal or vertical direction, the multiple acoustic-electric conversion elements 520 are not limited to being distributed at intervals on all inner walls of the vibration transmission part 523. The multiple acoustic-electric conversion elements 520 can also be disposed on one or part of the side walls of the vibration transmission part 523, or on the same horizontal plane. For example, if the vibration transmission part 523 has a cuboid structure, the multiple acoustic-electric conversion elements 520 can be simultaneously disposed on one side wall, two opposite or adjacent side walls, or any three side walls of the cuboid structure. The distribution of the multiple acoustic-electric conversion elements 520 can be adaptively adjusted according to their number or the size of the vacuum cavity 550, and is not further limited here.

[0070] In some embodiments, the acoustic-electric conversion element 520 may include a cantilever beam structure, one end of which may be connected to the inner wall of the vibration transmission part 523, and the other end of which may be suspended in the vacuum cavity 550.

[0071] In some embodiments, the cantilever beam structure may include a first electrode layer, a piezoelectric layer, a second electrode layer, an elastic layer, and a base layer. The first electrode layer, piezoelectric layer, and second electrode layer may be arranged sequentially from top to bottom. The elastic layer may be located on the upper surface of the first electrode layer or the lower surface of the second electrode layer, and the base layer may be located on the upper surface or the lower surface of the elastic layer. In some embodiments, an external sound signal enters the first acoustic cavity 530 of the microphone 500 through the aperture 511, causing the air within the first acoustic cavity 530 to vibrate. The vibration pickup unit 522 (e.g., the first elastic part 52211) can pick up the air vibration signal and transmit it to the acoustic-to-electric conversion element 520 (e.g., the cantilever beam structure) through the vibration transmission unit 523, thereby causing the elastic layer in the cantilever beam structure to deform under the action of the vibration signal. In some embodiments, the piezoelectric layer can generate an electrical signal based on the deformation of the elastic layer, and the first and second electrode layers can collect this electrical signal. In some embodiments, the piezoelectric layer can generate a voltage (potential difference) under the deformation stress of the elastic layer based on the piezoelectric effect, and the first electrode layer and the second electrode layer can extract this voltage (electrical signal).

[0072] In some embodiments, the cantilever beam structure may also include one or more elastic layers, electrode layers, and piezoelectric layers, wherein the elastic layer may be located on the surface of the electrode layer, and the electrode layer may be located on the upper or lower surface of the piezoelectric layer. In some embodiments, the electrode layer may include a first electrode and a second electrode. The first electrode and the second electrode may be bent into a first comb-like structure, which may include multiple comb-like structures. There is a certain spacing between adjacent comb-like structures of the first comb-like structure and between adjacent comb-like structures of the first comb-like structure, and this spacing may be the same or different. The first comb-like structure and the second comb-like structure cooperate to form the electrode layer. Further, the comb-like structures of the first comb-like structure may extend into the spacing of the second comb-like structure, and the comb-like structures of the second comb-like structure may extend into the spacing of the first comb-like structure, thereby cooperating to form the electrode layer. The first comb-like structure and the second comb-like structure cooperate to make the first electrode and the second electrode arranged compactly but not intersecting. In some embodiments, the first comb-like structure and the second comb-like structure extend along the length direction of the cantilever arm (e.g., from the fixed end to the free end).

[0073] In some embodiments, the elastic layer can be a film-like structure or a bulk structure supported by one or more semiconductor materials. In some embodiments, the semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, gallium nitride, zinc oxide, and silicon carbide. In some embodiments, the piezoelectric layer material may include piezoelectric crystal materials and piezoelectric ceramic materials. Piezoelectric crystal materials refer to piezoelectric single crystals. In some embodiments, piezoelectric crystal materials may include quartz, zincblende, borate, tourmaline, zinc ore, GaAs, barium titanate and its derived crystal structures, KH2PO4, NaKC4H4O6·4H2O (Roxi salt), etc., or any combination thereof. Piezoelectric ceramic materials refer to piezoelectric polycrystalline materials formed by the random aggregation of fine grains obtained through solid-state reactions and sintering between different material powders. In some embodiments, piezoelectric ceramic materials may include barium titanate (BT), lead zirconate titanate (PZT), lithium lead barium niobate (PBLN), modified lead titanate (PT), aluminum nitride (AlN), zinc oxide (ZnO), etc., or any combination thereof. In some embodiments, the piezoelectric layer material may also be a piezoelectric polymer material, such as polyvinylidene fluoride (PVDF). In some embodiments, the first electrode layer and the second electrode layer may be conductive material structures. Exemplary conductive materials may include metals, alloy materials, metal oxide materials, graphene, etc., or any combination thereof. In some embodiments, metals and alloy materials may include nickel, iron, lead, platinum, titanium, copper, molybdenum, zinc, or any combination thereof. In some embodiments, alloy materials may include copper-zinc alloys, copper-tin alloys, copper-nickel-silicon alloys, copper-chromium alloys, copper-silver alloys, etc., or any combination thereof. In some embodiments, metal oxide materials may include RuO2, MnO2, PbO2, NiO, etc., or any combination thereof.

[0074] In some embodiments, the cantilever beam structure may further include a wire-binding electrode layer (PAD layer), which may be located on the first electrode layer and the second electrode layer. The first and second electrode layers are connected to an external circuit via external wires (e.g., gold wire, aluminum wire, etc.), thereby leading the voltage signal between the first and second electrode layers to the back-end processing circuit. In some embodiments, the material of the wire-binding electrode layer may include copper foil, titanium, copper, etc. In some embodiments, the material of the wire-binding electrode layer may be the same as that of the first electrode layer (or the second electrode layer). In some embodiments, the material of the wire-binding electrode layer may be different from that of the first electrode layer (or the second electrode layer).

[0075] In some embodiments, by setting parameters of the cantilever beam structure (e.g., length, width, height, material, etc.), different cantilever beam structures can have different resonant frequencies, thereby generating different frequency responses to the vibration signal of the vibration transmission unit 523. For example, by setting cantilever beam structures of different lengths, different resonant frequencies can be achieved. The multiple resonant frequencies corresponding to cantilever beam structures of different lengths can be in the range of 100Hz-12000Hz. Since the cantilever beam structure is sensitive to vibrations near its resonant frequency, it can be considered that the cantilever beam structure has frequency selectivity for vibration signals. That is, the cantilever beam structure will mainly convert the sub-band vibration signals near its resonant frequency into electrical signals. Therefore, in some embodiments, by setting different lengths, different cantilever beam structures can have different resonant frequencies, thereby forming sub-bands near each resonant frequency. For example, 11 sub-bands can be set within the human voice frequency range using multiple cantilever beam structures. The resonant frequencies of the cantilever beam structures corresponding to these 11 sub-bands can be located at 500Hz-700Hz, 700Hz-1000Hz, 1000Hz-1300Hz, 1300Hz-1700Hz, 1700Hz-2200Hz, 2200Hz-3000Hz, 3000Hz-3800Hz, 3800Hz-4700Hz, 4700Hz-5700Hz, 5700Hz-7000Hz, and 7000Hz-12000Hz, respectively. It should be noted that the number of sub-bands set within the human voice frequency range using the cantilever beam structures can be adjusted according to the application scenario of the microphone 500, and no further limitations are made here.

[0076] Figure 10 This is a schematic diagram of a microphone structure according to some embodiments of this application. For example... Figure 10 As shown, the microphone 1000 may include a housing structure 1010, an acoustic-to-electrical conversion element 1020, a vibration pickup unit 1022, and a vibration transmission unit 1023. Figure 10 The microphone 1000 shown can be used with Figure 5 and Figure 6The microphone 500 shown is the same as or similar to the microphone 500. For example, the housing structure 1010 of the microphone 1000 may be the same as or similar to the housing structure 510 of the microphone 500. As another example, the first acoustic cavity 1030, the second acoustic cavity 1040, and the vacuum cavity 1050 of the microphone 1000 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the vacuum cavity 550 of the microphone 500, respectively. For example, the vibration pickup unit 1022 of the microphone 1000 (e.g., the first vibration pickup unit 10221 (e.g., the first elastic part 102211, the first fixed part 102212), and the second vibration pickup unit 10222 (e.g., the second elastic part 102221, the second fixed part 102222)) can be the same as or similar to the vibration pickup unit 522 of the microphone 500 (e.g., the first vibration pickup unit 5221 (e.g., the first elastic part 52211, the first fixed part 52212), and the second vibration pickup unit 5222 (e.g., the second elastic part 52221, the second fixed part 52222)). More details about the structure of the microphone 1000 (e.g., the aperture 1011, the vibration transmission unit 1023, etc.) can be found in [reference needed]. Figure 5 and Figure 6 And its related descriptions.

[0077] In some embodiments, Figure 10 The microphone 1000 shown is Figure 5The main difference in the microphone 500 shown is that the acoustic-to-electric conversion element 1020 of the microphone 1000 may include a first cantilever beam structure 10211 and a second cantilever beam structure 10212, which are positioned relative to two electrode plates. The fixed ends of the first cantilever beam structure 10211 and the second cantilever beam structure 10212 corresponding to the acoustic-to-electric conversion element 1020 can be connected to the inner wall of the vibration transmission part 1023, while the other ends (also called free ends) of the first cantilever beam structure 10211 and the second cantilever beam structure 10212 are suspended in the vacuum cavity 1050. In some embodiments, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 can be arranged opposite each other, and the first cantilever beam structure 10211 and the second cantilever beam structure 10212 have facing areas. In some embodiments, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 are arranged vertically. In this case, the facing area can be understood as the area of ​​the lower surface of the first cantilever beam structure 10211 and the upper surface of the second cantilever beam structure 10212 opposite to each other. In some embodiments, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 may have a first distance d1. After receiving the vibration signal from the vibration transmission unit 1023, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 may respectively undergo different degrees of deformation in their vibration direction (the extension direction of the first distance d1), thereby causing a change in the first distance d1. Based on the change in the first distance d1, the first cantilever beam structure 10211 and the second cantilever beam structure 10212 can convert the received vibration signal from the vibration transmission unit 1023 into an electrical signal.

[0078] To ensure that the first cantilever beam structure 10211 and the second cantilever beam structure 10212 deform to different degrees in their vibration directions, in some embodiments, the stiffness of the first cantilever beam structure 10211 and the stiffness of the second cantilever beam structure 10212 may be different. Under the action of the vibration signal of the vibration transmission unit 1023, the cantilever beam structure with lower stiffness can produce a certain degree of deformation, while the cantilever beam structure with higher stiffness can be approximately considered to produce no deformation or less deformation than that produced by the cantilever beam structure with lower stiffness. In some embodiments, when the microphone 1000 is in the working state, the cantilever beam structure with lower stiffness (e.g., the second cantilever beam structure 10212) can deform in response to the vibration of the vibration transmission unit 1023, while the cantilever beam structure with higher stiffness (e.g., the first cantilever beam structure 10211) can vibrate together with the vibration transmission unit 1023 without deformation, causing the first gap d1 to change.

[0079] In some embodiments, the resonant frequency of the cantilever beam structure with lower stiffness in the acoustic-electric conversion element 1020 can be located within the frequency range of human hearing (e.g., within 12000 Hz). In some embodiments, the resonant frequency of the cantilever beam structure with higher stiffness in the acoustic-electric conversion element 1020 can be located within the frequency range in which the human ear is not sensitive (e.g., greater than 12000 Hz). In some embodiments, the stiffness of the first cantilever beam structure 10211 (or the second cantilever beam structure 10212) in the acoustic-electric conversion element 1020 can be achieved by adjusting the material, length, width, or thickness of the first cantilever beam structure 10211 (or the second cantilever beam structure 10212). In some embodiments, different frequency responses corresponding to different resonant frequencies are obtained by adjusting the parameters of each group of cantilever beam structures corresponding to the acoustic-electric conversion element 1020 (e.g., the material, thickness, length, width, etc. of the cantilever beam structure).

[0080] Figure 11 This is a schematic diagram of the frequency response curve of a microphone according to some embodiments of this application. For example... Figure 11 As shown, the horizontal axis represents frequency in Hz, and the vertical axis represents the frequency response of the sound signal output by the microphone in dB. The microphone here can refer to microphones such as 500, 1000, 1200, 1300, 1500, 1600, 1700, 2000, 2100, and 2200. Figure 11 The dashed lines in the diagram represent the frequency response curves corresponding to the various acoustic-to-electrical conversion elements of the microphone. According to... Figure 11 As can be seen from the frequency response curves, each acoustic-to-electric conversion element has its own resonant frequency (for example, the resonant frequency of frequency response curve 1120 is approximately 350Hz, and the resonant frequency of frequency response curve 1130 is approximately 1500Hz). When an external sound signal is transmitted to the microphone, each acoustic-to-electric conversion element is more sensitive to vibration signals near its own resonant frequency. Therefore, the electrical signal output by each acoustic-to-electric conversion element mainly includes the sub-band signal corresponding to its resonant frequency. In some embodiments, the output at the resonant peak of each acoustic-to-electric conversion element is much larger than its output in the flat region. By selecting the frequency band close to the resonant peak in the frequency response curve of each acoustic-to-electric conversion element, sub-band frequency division of the full-band signal corresponding to the sound signal can be achieved. In some embodiments, Figure 11 By fusing the frequency response curves, a higher signal-to-noise ratio and flatter frequency response curve for the microphone can be obtained (1110). Furthermore, by setting different acoustic-to-electric conversion elements (cantilever beam structure), resonance peaks in different frequency ranges can be added to the microphone system, improving the microphone's sensitivity near multiple resonance peaks, and thus enhancing the microphone's sensitivity across the entire bandwidth.

[0081] By setting multiple acoustic-to-electric conversion elements in the microphone and utilizing the different resonant frequencies of these elements (e.g., cantilever beam structures), filtering and frequency band decomposition of vibration signals can be achieved. This avoids the complexity of filtering circuits in microphones and the problems of high computational resource consumption, signal distortion, and noise introduction caused by software algorithms, thereby reducing the complexity and production cost of microphones.

[0082] Figure 12 This is a schematic diagram of a microphone structure according to some embodiments of this application. For example... Figure 12 As shown, the microphone 1200 may include a housing structure 1210, an acoustic-to-electrical conversion element 1220, a vibration transmission unit 1223, and a vibration pickup unit 1222. Figure 12 The microphone 1200 shown can be used with Figure 5 and Figure 6 The microphone 500 shown is the same as or similar to the microphone 500. For example, the housing structure 1210 of the microphone 1200 may be the same as or similar to the housing structure 510 of the microphone 500. As another example, the first acoustic cavity 1230, the second acoustic cavity 1240, and the vacuum cavity 1250 of the microphone 1200 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the vacuum cavity 550 of the microphone 500, respectively. For example, the vibration pickup section 1222 of the microphone 1200 (e.g., the first vibration pickup section 12221 (e.g., the first elastic section 122211, the first fixed section 122212), and the second vibration pickup section 12222 (e.g., the second elastic section 122221, the second fixed section 122222)) can be the same as or similar to the vibration pickup section 522 of the microphone 500 (e.g., the first vibration pickup section 5221 (e.g., the first elastic section 52211, the first fixed section 52212), and the second vibration pickup section 5222 (e.g., the second elastic section 52221, the second fixed section 52222)). Further details regarding the structure of the microphone 1200 (e.g., the aperture 1211, the vibration transmission section 1223, the acoustic-to-electrical conversion element 1220, etc.) can be found in [reference needed]. Figure 5 and Figure 6 And its related descriptions.

[0083] In some embodiments, Figure 12 The microphone 1200 shown is Figure 5The main difference in the microphone 500 shown is that the microphone 1200 may also include one or more diaphragm structures 1260. In some embodiments, the diaphragm structure 1260 may be located on the upper and / or lower surface of the acoustic-electric conversion element 1220. For example, the diaphragm structure 1260 may be a single-layer diaphragm structure, located on either the upper or lower surface of the acoustic-electric conversion element 1220. Alternatively, the diaphragm structure 1260 may be a double-layer diaphragm, comprising a first diaphragm structure and a second diaphragm structure, the first diaphragm structure located on the upper surface of the acoustic-electric conversion element 1220 and the second diaphragm structure located on the lower surface of the acoustic-electric conversion element 1220. By providing the diaphragm structure 1260 on the surface of the acoustic-electric conversion element 1220, the resonant frequency of the acoustic-electric conversion element 1220 can be adjusted. In some embodiments, the resonant frequency of the acoustic-electric conversion element 1220 can be affected by adjusting the material, dimensions (e.g., length, width), thickness, etc., of the diaphragm structure 1260. On the one hand, by adjusting the parameters of the membrane structure 1260 (e.g., material, size, thickness, etc.) and the acoustic-to-electric conversion element 1220 (e.g., cantilever beam structure), each acoustic-to-electric conversion element 1220 can resonate within the desired frequency range. On the other hand, by providing the membrane structure 1260 on the surface of the acoustic-to-electric conversion element 1220, damage to the acoustic-to-electric conversion element 1220 caused by the microphone 1200 under overload conditions can be avoided, thereby improving the reliability of the microphone 1200.

[0084] In some embodiments, the membrane structure 1260 may cover all or part of the upper and / or lower surfaces of the acoustic-electric conversion element 1220. For example, the upper or lower surface of each acoustic-electric conversion element 1220 may be covered by a corresponding membrane structure 1260. The membrane structure 1260 may completely cover the upper or lower surface of the corresponding acoustic-electric conversion element 1220, or it may partially cover the upper or lower surface of the corresponding acoustic-electric conversion element 1220. For another example, when multiple acoustic-electric conversion elements 1220 are simultaneously located on the same horizontal plane, a membrane structure 1260 may simultaneously cover all the upper or lower surfaces of multiple acoustic-electric conversion elements 1220 on the same horizontal plane. For instance, here the membrane structure 1260 is connected to the inner wall of the vibration transmission section 1223 through its periphery, thereby dividing the vacuum cavity 1250 into two independent upper and lower vacuum cavities. For example, the shape of the membrane structure 1260 can be the same as the cross-sectional shape of the vibration transmission part 1223. The membrane structure 1260 is connected to the inner wall of the vibration transmission part 1223 through its periphery. The middle part of the membrane structure 1260 may include a hole. Figure 12 (Not shown in the image), the membrane structure 1260 can simultaneously and partially cover the upper or lower surfaces of multiple acoustic-electric conversion elements 1220 on the same horizontal plane, and the vacuum cavity 1250 can be divided into two interconnected vacuum cavities by the membrane structure 1260.

[0085] In some embodiments, the material of the membrane structure 1260 may be one or more of semiconductor materials, metallic materials, metal alloys, and organic materials, including but not limited to. In some embodiments, semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, and silicon carbide. In some embodiments, metallic materials may include, but are not limited to, copper, aluminum, chromium, titanium, and gold. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, and aluminum alloys. In some embodiments, organic materials may include, but are not limited to, polyimide, phenylene oxide, PDMS, silicone gel, and silicone.

[0086] Figure 13 This is a schematic diagram of the structure of a microphone according to some embodiments of this application. Figure 13 The microphone 1300 shown can be used with Figure 10 The microphone 1000 shown is the same as or similar to the microphone 1300. For example, the first acoustic cavity 1330, the second acoustic cavity 1340, and the vacuum cavity 1350 of the microphone 1300 may be the same as or similar to the first acoustic cavity 1030, the second acoustic cavity 1040, and the vacuum cavity 1050 of the microphone 1000, respectively. For example, the vibration pickup section 1322 of the microphone 1300 (e.g., the first vibration pickup section 13221 (e.g., the first elastic section 132211, the first fixed section 132212), and the second vibration pickup section 13222 (e.g., the second elastic section 132221, the second fixed section 132222)) can be the same as or similar to the vibration pickup section 1022 of the microphone 1000 (e.g., the first vibration pickup section 10221 (e.g., the first elastic section 102211, the first fixed section 102212), and the second vibration pickup section 10222 (e.g., the second elastic section 102221, the second fixed section 102222)). Further details regarding the structure of the microphone 1300 (e.g., the housing structure 1310, the aperture 1311, the vibration transmission section 1323, the acoustic-to-electrical conversion element 1320, etc.) can be found in [reference needed]. Figure 10 And its related descriptions.

[0087] In some embodiments, Figure 13 The microphone 1300 shown is Figure 10The main difference between the illustrated microphone 1200 and the microphone 1300 is that the microphone 1300 may also include one or more diaphragm structures 1360. In some embodiments, the diaphragm structure 1360 may be located on the upper and / or lower surface of a cantilever beam structure (e.g., a second cantilever beam structure 13212) with relatively low stiffness of the acoustic-electric conversion element 1320. For example, the diaphragm structure 1360 may be a single-layer diaphragm structure, located on either the upper or lower surface of the second cantilever beam structure 13212. Alternatively, the diaphragm structure 1360 may be a double-layer diaphragm, comprising a first diaphragm structure and a second diaphragm structure, the first diaphragm structure located on the upper surface of the second cantilever beam structure 13212, and the second diaphragm structure located on the lower surface of the second cantilever beam structure 13212. In some embodiments, the diaphragm structure 1360 may completely or partially cover the upper and / or lower surface of the second cantilever beam structure 13212. For example, the upper or lower surface of each second cantilever beam structure 13212 is covered with a corresponding membrane structure 1360. The membrane structure 1360 may completely cover the upper or lower surface of the corresponding second cantilever beam structure 13212, or it may partially cover the upper or lower surface of the corresponding second cantilever beam structure 13212. More information regarding the membrane structure 1360 completely or partially covering the upper and lower surfaces of the second cantilever beam structure 13212 can be found in [reference needed]. Figure 12 And its related descriptions.

[0088] In some embodiments, the membrane structure 1360 may also be located on the upper and / or lower surface of the cantilever beam structure (e.g., the first cantilever beam structure 13211) of the acoustic-electric conversion element 1320, which has greater stiffness. The manner in which the membrane structure 1360 is located on the upper and / or lower surface of the first cantilever beam structure 13211 is similar to the manner in which the membrane structure 1360 is located on the upper and / or lower surface of the second cantilever beam structure 13212, and will not be described in detail here.

[0089] In some embodiments, the membrane structure 1360 may also be located simultaneously on the upper and / or lower surface of the cantilever beam structure with lower stiffness (e.g., the second cantilever beam structure 13212) and the upper and / or lower surface of the cantilever beam structure with higher stiffness (e.g., the first cantilever beam structure 13211) of the acoustic-electric conversion element 1320. For example, Figure 14 These are schematic diagrams of the microphone structure shown in some embodiments of this application, such as... Figure 14As shown, the membrane structure 1360 is located on the upper surface of the first cantilever beam structure 13211 and the lower surface of the second cantilever beam structure 13212. In some embodiments, by providing the membrane structure 1360 on the upper and / or lower surface of a cantilever beam structure with greater stiffness (e.g., the first cantilever beam structure 13211), the cantilever beam structure with greater stiffness can remain undeformed relative to the vibration transmission part 1323, thereby improving the sensitivity of the microphone 1300.

[0090] It should be noted that, Figure 10 The microphone 1000 shown Figure 12 The microphone 1200 shown and Figure 13 and Figure 14 The vibration pickup units in the microphone 1300 shown are not limited to ensuring the stability of the vacuum cavity by setting fixed parts and elastic parts with different stiffnesses. In some embodiments, the stability of the vacuum cavity can also be ensured by setting reinforcement members at the vibration pickup units corresponding to the vacuum cavity. For a description of the fixing members, please refer to [reference needed]. Figure 7 The relevant content will not be elaborated here.

[0091] Figure 15 This is a schematic diagram of a microphone structure according to some embodiments of this application. For example... Figure 15 As shown, the microphone 1500 may include a housing structure 1510, an acoustic-to-electrical conversion element 1520, a vibration pickup unit 1522, and a vibration transmission unit 1523. Figure 15 The microphone 1500 shown can be used with Figure 5 The microphone 500 shown is the same as or similar to the microphone 1500. For example, the first acoustic cavity 1530, the second acoustic cavity 1540, and the vacuum cavity 1550 of the microphone 1500 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the vacuum cavity 550 of the microphone 500, respectively. Further details regarding the structure of the microphone 1500 (e.g., housing structure 1510, aperture 1511, vibration transmission section 1523, sound-to-electric conversion element 1520, etc.) can be found in [reference needed]. Figure 5 And its related descriptions.

[0092] In some embodiments, Figure 15 The microphone 1500 shown is Figure 5The main difference in the microphone 500 shown is the vibration pickup unit 1522. In some embodiments, the vibration pickup unit 1522 may include a first vibration pickup unit 15221, a second vibration pickup unit 15222, and a third vibration pickup unit 15223. In some embodiments, the first vibration pickup unit 15221 and the second vibration pickup unit 15222 are arranged vertically opposite each other with respect to the vibration transmission unit 1523, such that the vibration transmission unit 1523 is located between the first vibration pickup unit 15221 and the second vibration pickup unit 15222. Specifically, the lower surface of the first vibration pickup unit 15221 is connected to the upper surface of the vibration transmission unit 1523, and the upper surface of the second vibration pickup unit 15222 is connected to the lower surface of the vibration transmission unit 1523. In some embodiments, a vacuum cavity 1550 may be formed between the first vibration pickup unit 15221, the second vibration pickup unit 15222, and the vibration transmission unit 1523, and the acoustic-to-electrical conversion element 1520 is located in the vacuum cavity 1550. In some embodiments, the third vibration pickup unit 15223 is connected between the vibration transmission unit 1523 and the inner wall of the housing structure 1510. When the microphone 1500 is working, the sound signal can enter the first acoustic cavity 1530 through the hole 1511 and act on the vibration pickup unit 1522, causing the third vibration pickup unit 15223 to vibrate. The third vibration pickup unit 15223 transmits the vibration to the sound-to-electric conversion element 1520 through the vibration transmission unit 1523.

[0093] In some embodiments, the third vibration pickup unit 15223 may include one or more thin film structures adapted to the vibration transmission unit 1523 and the housing structure 1510. For example, when both the housing structure 1510 and the vibration transmission unit 1523 are cylindrical structures, the third vibration pickup unit 15223 may be an annular thin film structure, with its outer wall connected to the housing structure 1510 and its inner wall connected to the vibration transmission unit 1523. As another example, when the housing structure 1510 is cylindrical and the vibration transmission unit 1523 is cuboid, the third vibration pickup unit 15223 may be a circular thin film structure with a rectangular hole in its center, with its outer wall connected to the housing structure 1510 and its inner wall connected to the vibration transmission unit 1523. It should be noted that the shape of the third vibration pickup unit 15223 is not limited to the aforementioned annular and rectangular shapes, but can also be other shapes of thin film structures, such as regular and / or irregular shapes such as pentagons and hexagons. The shape and structure of the third vibration pickup unit 15223 can be adaptively adjusted according to the shape of the housing structure 1510 and the vibration transmission unit 1523.

[0094] In some embodiments, the material of the third vibration pickup unit 15223 may include, but is not limited to, one or more of semiconductor materials, metallic materials, metal alloys, and organic materials. In some embodiments, semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, and silicon carbide. In some embodiments, metallic materials may include, but are not limited to, copper, aluminum, chromium, titanium, and gold. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, and aluminum alloys. In some embodiments, organic materials may include, but are not limited to, polyimide, phenylene oxide, PDMS, silicone gel, and silicone.

[0095] In some embodiments, the materials of the first vibration pickup unit 15221 and the second vibration pickup unit 15222 are different from the material of the third vibration pickup unit 15223. For example, in some embodiments, the stiffness of the first vibration pickup unit 15221 and the second vibration pickup unit 15222 may be greater than the stiffness of the third vibration pickup unit 15223. In some embodiments, the third vibration pickup unit 15223 may generate vibration in response to an external sound signal and transmit the vibration signal to the acoustic-to-electrical conversion element 1520. The first vibration pickup unit 15221 and the second vibration pickup unit 15222 have high stiffness to ensure that the vacuum cavity 1550 formed by the first vibration pickup unit 15221, the second vibration pickup unit 15222, and the vibration transmission unit 1523 is not affected by external air pressure. In some embodiments, to ensure that the vacuum cavity 1550 is not affected by external air pressure, the Young's modulus of the first vibration pickup unit 15221 and the second vibration pickup unit 15222 may be greater than 60 GPa. In some embodiments, the Young's modulus of the first vibration pickup unit 15221 and the second vibration pickup unit 15222 may be greater than 50 GPa. In some embodiments, the Young's modulus of the first vibration pickup unit 15221 and the second vibration pickup unit 15222 may be greater than 40 GPa.

[0096] In some embodiments, to ensure that the vacuum cavity 1550 is unaffected by external air pressure, the microphone 1500 may further include a reinforcing member (not shown in the figure). The reinforcing member may be located on the upper or lower surface of the vibration pickup section 1522 (e.g., the first vibration pickup section 15221 and the second vibration pickup section 15222) corresponding to the vacuum cavity 1550. Specifically, the reinforcing member may be located on the lower surface of the first vibration pickup section 15221 and the upper surface of the second vibration pickup section 15222, respectively, and the periphery of the reinforcing member is connected to the inner wall of the vibration transmission section 1523. For details regarding the structure, location, material, etc., of the reinforcing member, please refer to [reference needed]. Figure 7 And its related description. Additionally, the reinforcement element can also be used in other embodiments of this specification, for example, Figure 16 The microphone 1600 shown Figure 17 The microphone 1700 shown Figure 20 The microphone 2000 shown Figure 21 The microphone 2100 shown Figure 22 The microphone 2200 shown is shown.

[0097] In some embodiments, the microphone 1500 may further include one or more diaphragm structures (not shown in the figures), which may be located on the upper and / or lower surface of the acoustic-to-electrical conversion element 1520. For details regarding diaphragm structures, please refer to [reference needed]. Figure 12 The details and related descriptions will not be elaborated here.

[0098] Figure 16 This is a schematic diagram of a microphone structure according to some embodiments of this application. For example... Figure 16 As shown, the microphone 1600 may include a housing structure 1610, an acoustic-to-electrical conversion element 1620, a vibration pickup unit 1622, and a vibration transmission unit 1623. Figure 16 The microphone 1600 shown can be used with Figure 10 The microphone 1000 shown is the same as or similar to the microphone 1000. For example, the first acoustic cavity 1630, the second acoustic cavity 1640, and the vacuum cavity 1650 of the microphone 1600 can be the same as or similar to the first acoustic cavity 1030, the second acoustic cavity 1040, and the vacuum cavity 1050 of the microphone 1000, respectively. Further details regarding the structure of the microphone 1600 (e.g., housing structure 1610, aperture 1611, vibration transmission section 1623, sound-to-electric conversion element 1620, etc.) can be found in [reference needed]. Figure 10 And its related descriptions.

[0099] In some embodiments, Figure 16 The microphone 1600 shown is Figure 10 The main difference in the microphone 1000 shown is the vibration pickup unit 1622. In some embodiments, the vibration pickup unit 1622 may include a first vibration pickup unit 16221, a second vibration pickup unit 16222, and a third vibration pickup unit 16223. In some embodiments, the first vibration pickup unit 16221 and the second vibration pickup unit 16222 may be arranged vertically opposite each other with respect to the vibration transmission unit 1623, such that the vibration transmission unit 1623 is located between the first vibration pickup unit 16221 and the second vibration pickup unit 16222. Specifically, the lower surface of the first vibration pickup unit 16221 is connected to the upper surface of the vibration transmission unit 1623, and the upper surface of the second vibration pickup unit 16222 is connected to the lower surface of the vibration transmission unit 1623. In some embodiments, a vacuum cavity 1650 may be formed between the first vibration pickup unit 16221, the second vibration pickup unit 16222, and the vibration transmission unit 1623, and the acoustic-electric conversion element 1620 (e.g., the first cantilever beam structure 16211 and the second cantilever beam structure 16212) is located in the vacuum cavity 1650.

[0100] In some embodiments, the third vibration pickup unit 16223 is connected between the vibration transmission unit 1623 and the inner wall of the housing structure 1610. When the microphone 1600 is working, the sound signal can enter the first acoustic cavity 1630 through the hole 1611 and act on the third vibration pickup unit 16223 to cause vibration. The third vibration pickup unit 16223 transmits the vibration to the acoustic-to-electrical conversion element 1620 through the vibration transmission unit 1623. For details about the third vibration pickup unit 16223, please refer to [link to relevant documentation]. Figure 15 The details and related descriptions will not be elaborated here.

[0101] In some embodiments, the microphone 1600 may further include one or more diaphragm structures (not shown in the figures), which may be located on the upper and / or lower surface of the acoustic-to-electrical conversion element 1620. For details regarding diaphragm structures, please refer to [reference needed]. Figures 12-14 The details and related descriptions will not be elaborated here.

[0102] Figure 17 This is a schematic diagram of a microphone structure according to some embodiments of this application. For example... Figure 17 As shown, the microphone 1700 may include a housing structure 1710, an acoustic-to-electrical conversion element 1720, a vibration pickup unit 1722, and a vibration transmission unit 1723. Figure 17 The microphone 1700 shown can be used with Figure 15 The microphone 1500 shown is the same as or similar to the microphone 1500. For example, the first acoustic cavity 1730, the second acoustic cavity 1740, and the vacuum cavity 1750 of the microphone 1700 may be the same as or similar to the first acoustic cavity 1530, the second acoustic cavity 1540, and the cavity 1550 of the microphone 1500, respectively. As another example, the vibration pickup unit 1722 of the microphone 1700 (e.g., the first vibration pickup unit 17221, the second vibration pickup unit 17222, and the third vibration pickup unit 17223) may be the same as or similar to the vibration pickup unit 1522 of the microphone 1500 (e.g., the first vibration pickup unit 15221, the second vibration pickup unit 15222, and the third vibration pickup unit 15223). For more information on the structure of the microphone 1700 (e.g., housing structure 1710, aperture 1711, vibration transmission part 1723, sound-to-electric conversion element 1720, etc.), please refer to [reference needed]. Figure 15 And its related descriptions.

[0103] In some embodiments, Figure 17 The microphone 1700 shown is Figure 15The main difference between the microphone 1500 and the microphone 1700 shown is that the microphone 1700 may also include one or more support structures 1760. In some embodiments, the support structure 1760 may be disposed in a vacuum cavity 1750, the upper surface of the support structure 1760 may be connected to the lower surface of the first vibration pickup unit 17221, and the lower surface of the support structure 1760 may be connected to the upper surface of the second vibration pickup unit 17222. On the one hand, by providing a support structure 1760 in the vacuum cavity 1750, and connecting the support structure 1760 to the first vibration pickup unit 17221 and the second vibration pickup unit 17222 respectively, the rigidity of the first vibration pickup unit 17221 and the second vibration pickup unit 17222 is further improved, so that the first vibration pickup unit 17221 and the second vibration pickup unit 17222 are not affected by the air vibration in the first acoustic cavity 1730 and thus the deformation is reduced, thereby reducing the vibration modes of the internal components of the microphone 1700 (such as the first vibration pickup unit 17221 and the second vibration pickup unit 17222). Meanwhile, the support structure 1760 increases the stiffness of the first vibration pickup unit 17221 and the second vibration pickup unit 17222, which can further ensure that the volume of the vacuum cavity 1750 remains basically constant, thereby keeping the vacuum level inside the vacuum cavity 1750 within the required range (e.g., less than 100 Pa), thereby reducing the impact of air damping inside the vacuum cavity 1750 on the acoustic-electric conversion element 1720 and improving the Q value of the microphone 1700. On the other hand, the support structure 1760 is connected to the first vibration pickup unit 17221 and the second vibration pickup unit 17222 respectively, which can also improve the reliability of the microphone 1700 under overload conditions.

[0104] In some embodiments, the shape of the support structure 1760 can be a plate-like structure, cylinder, frustum, cuboid, pyramid, hexahedron, or other regular and / or irregular structure. In some embodiments, the material of the support structure 1760 can be one or more of semiconductor materials, metallic materials, metal alloys, and organic materials, including but not limited to. In some embodiments, semiconductor materials can be, but not limited to, silicon, silicon dioxide, silicon nitride, and silicon carbide. In some embodiments, metallic materials can be, but not limited to, copper, aluminum, chromium, titanium, and gold. In some embodiments, metal alloys can be, but not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, and aluminum alloys. In some embodiments, organic materials can be, but not limited to, polyimide, phenylene oxide, PDMS, silicone gel, and silicone.

[0105] Reference Figure 17In some embodiments, the second distance d2 between the free end of the acoustic-electric conversion element 1720 (i.e., the end suspended in the vacuum cavity 1750) and the support structure 1760 is not less than 2 μm to prevent the acoustic-electric conversion element 1720 from colliding with the support structure 1760 during vibration. Simultaneously, when the second distance d2 is small (e.g., the second distance d2 is not greater than 20 μm), the overall volume of the microphone 1700 can be effectively reduced. In some embodiments, the second distance d2 between the free ends of different acoustic-electric conversion elements 1720 (e.g., cantilever beam structures of different lengths) and the support structure 1760 can be different. In some embodiments, by designing support structures 1760 of different shapes and sizes and adjusting the position of the support structure 1760, multiple acoustic-electric conversion elements 1720 (e.g., cantilever beam structures) can be closely arranged in the vacuum cavity 1750, thereby making the microphone 1700 have a smaller overall size. Figure 18A and Figure 18B These are schematic cross-sectional views of a microphone in different directions, as shown in some embodiments of this application. Figure 18A and Figure 18B As shown, when the support structure 1760 is an elliptical cylinder, the support structure 1760, the vibration transmission part 1723 and the vibration pickup part 1722 form a ring or similar ring cavity in the vacuum cavity 1750. Multiple acoustic-electric conversion elements 1720 are located in the cavity and are distributed at intervals along the periphery of the support structure 1760.

[0106] In some embodiments, the support structure 1760 may be located at the center of the vacuum cavity 1750. For example, Figure 19A This is a cross-sectional schematic diagram of a microphone according to some embodiments of this application, such as... Figure 19A As shown, the support structure 1760 is located at the center of the vacuum cavity 1750. This center location can be the geometric center of the vacuum cavity 1750. In some embodiments, the support structure 1760 may also be located within the vacuum cavity 1750 near either end of the vibration transmission section 1723. For example, Figure 19B This is a cross-sectional schematic diagram of a microphone according to some embodiments of this application, such as... Figure 19B As shown, the support structure 1760 is located in the vacuum cavity 1750 near the side wall L of the vibration transmission part 1723. It should be noted that the shape, arrangement, position, and material of the support structure 1750 can be adapted to the length, number, and distribution of the acoustic-electric conversion element 1720, and no further limitations are made here.

[0107] In some embodiments, the microphone 1700 may further include one or more membrane structures (not shown in the figures), which may be disposed on the upper and / or lower surfaces of the acoustic-electric conversion element 1720. In some embodiments, a hole may be provided at the middle position of the membrane structure for the support structure 1760 to pass through, and the hole may have the same or different cross-sectional shape as the support structure. In some embodiments, the peripheral sidewall of the support structure 1760 may be connected to the peripheral portion of the hole in the membrane structure, or may not be connected to the peripheral portion of the hole in the membrane structure. Further descriptions of the shape, material, structure, etc., of the membrane structure can be found in [reference needed]. Figure 12 And its related descriptions.

[0108] It should be noted that the support structure can also be applied to microphones in other embodiments, for example, it can be applied to... Figure 5 The microphone 500 shown Figure 10 The microphone 1000 shown Figure 12 The microphone 1200 shown Figure 13 The microphone 1300 shown Figure 14 In the microphone 1200 shown, when the support structure is applied to other microphones, the shape, position, and material of the support structure can be adaptively adjusted according to the specific circumstances.

[0109] Figure 20 This is a schematic diagram of a microphone structure according to some embodiments of this application. For example... Figure 20 As shown, the microphone 2000 may include a housing structure 2010, an acoustic-to-electrical conversion element 2020, a vibration pickup unit 2022, and a vibration transmission unit 2023. Figure 20 The microphone 2000 shown can be used with Figure 16 The microphone 1600 shown is the same as or similar to the microphone 1600. For example, the first acoustic cavity 2030, the second acoustic cavity 2040, and the vacuum cavity 2050 of the microphone 2000 can be the same as or similar to the first acoustic cavity 1630, the second acoustic cavity 1640, and the vacuum cavity 1650 of the microphone 1600, respectively. As another example, the vibration pickup unit 2022 of the microphone 2000 (e.g., the first vibration pickup unit 20221, the second vibration pickup unit 20222, and the third vibration pickup unit 20223) can be the same as or similar to the vibration pickup unit 1622 of the microphone 1600 (e.g., the first vibration pickup unit 16221, the second vibration pickup unit 16222, and the third vibration pickup unit 16223). For more information on the structure of the microphone 2000 (e.g., housing structure 2010, aperture 2011, vibration transmission part 2023, sound-to-electric conversion element 2020, etc.), please refer to [reference needed]. Figure 16 And its related descriptions.

[0110] In some embodiments, Figure 20 The microphone 2000 shown is Figure 16 The main difference between the microphone 1600 and the microphone 2000 shown is that the microphone 2000 may also include a support structure 2060. In some embodiments, the upper surface of the support structure 2060 may be connected to the lower surface of the first vibration pickup unit 20221, and the lower surface of the support structure 2060 may be connected to the upper surface of the second vibration pickup unit 20222. In some embodiments, the free end (i.e., the end suspended in the vacuum cavity 2050) of the acoustic-electric conversion element 2020 (e.g., the first cantilever beam structure 20211, the second cantilever beam structure 20212) may have a second distance d2 with the support structure 2060. Further description of the support structure 2060 can be found in [reference needed]. Figure 17 And its related descriptions.

[0111] In some embodiments, the microphone 2000 may further include one or more diaphragm structures (not shown in the figures). A detailed description of the diaphragm structure of the microphone 2000, including the support structure 2060, can be found in [reference needed]. Figure 13 , Figure 14 , Figure 17 And its related descriptions.

[0112] Figure 21 This is a schematic diagram of a microphone structure according to some embodiments of this application. In some embodiments, the microphone may be a bone conduction microphone, such as... Figure 21 As shown, the bone conduction microphone 2100 may include a housing structure 2110, an acoustic-to-electrical conversion element 2120, a vibration pickup unit 2122, and a vibration transmission unit 2123. Figure 21 The components of the bone conduction microphone 2100 shown can be used with Figure 17 The components of the microphone 1700 shown are the same or similar, such as the acoustic-to-electric conversion element 2120, the first acoustic cavity 2130, the second acoustic cavity 2140, the vacuum cavity 2150, the vibration pickup unit 2122 (e.g., the first vibration pickup unit 21221 and the second vibration pickup unit 21222), the vibration transmission unit 2123, the support structure 2160, etc.

[0113] In some embodiments, the bone conduction microphone 2100 and Figure 17The difference between the microphones 1700 and 2100 lies in their vibration pickup methods. The vibration pickup unit 1722 (e.g., the third vibration pickup unit 17223) of the microphone 1700 picks up vibration signals transmitted through the aperture 1711 to the air within the first acoustic cavity 1730. In contrast, the housing structure 2110 of the bone conduction microphone 2100 does not include the aperture. The bone conduction microphone 2100 generates vibration signals in response to the vibration of the housing structure 2110 via the vibration pickup unit 2122 (e.g., the third vibration pickup unit 21223). Specifically, the housing structure 2110 can generate vibrations based on external sound signals, and the third vibration pickup unit 21223 can generate vibration signals in response to the vibration of the housing structure 2110. These vibration signals are then transmitted through the vibration transmission unit 2123 to the acoustic-to-electrical conversion element 2120, which converts the vibration signals into electrical signals and outputs them.

[0114] Figure 22 This is a schematic diagram of a microphone structure according to some embodiments of this application. For example... Figure 22 As shown, the bone conduction microphone 2200 may include a housing structure 2210, an electroacoustic conversion element 2220, a vibration pickup unit 2222, and a vibration transmission unit 2223. Figure 22 The components of the bone conduction microphone 2200 shown can be used with Figure 20 The components of the microphone 2000 shown are the same or similar, such as the acoustic-to-electric conversion element 2220, the first acoustic cavity 2230, the second acoustic cavity 2240, the vacuum cavity 2250, the vibration pickup unit 2222 (e.g., the first vibration pickup unit 22221, the second vibration pickup unit 22222), the vibration transmission unit 2223, the support structure 2260, etc.

[0115] In some embodiments, the bone conduction microphone 2200 and Figure 20 The difference between the microphones 2000 shown lies in their vibration pickup methods. The vibration pickup unit 2022 (e.g., the third vibration pickup unit 20223) of the microphone 2000 picks up the vibration signal of the air transmitted to the first acoustic cavity 2030 through the hole 2011. In contrast, the housing structure 2210 of the bone conduction microphone 2200 does not include the hole. The bone conduction microphone 2200 generates a vibration signal in response to the vibration of the housing structure 2210 through the vibration pickup unit 2222 (e.g., the third vibration pickup unit 22223). In some embodiments, the housing structure 2210 can generate vibration based on external sound signals, and the third vibration pickup unit 22223 can generate a vibration signal in response to the vibration of the housing structure 2210, and transmit the vibration signal to the acoustic-electric conversion element 2220 (e.g., the first cantilever beam structure 22211, the second cantilever beam structure 22212) through the vibration transmission unit 2223. The acoustic-electric conversion element 2220 converts the vibration signal into an electrical signal and outputs it.

[0116] It is important to note that Figure 5 The microphone 500 shown Figure 10 The microphone 1000 shown Figure 12 The microphone 1200 shown Figure 13 The microphone 1300 shown can also be used as a bone conduction microphone. For example, the microphone here may not have a hole. The housing structure can vibrate based on an external sound signal. The first vibration pickup unit or the second vibration pickup unit can generate a vibration signal in response to the vibration of the housing structure and transmit the vibration to the acoustic-electric conversion element through the vibration transmission unit. The acoustic-electric conversion element converts the vibration signal into an electrical signal and outputs it.

[0117] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

Claims

1. A microphone, characterized in that, include: A shell structure that forms an acoustic cavity; A vibration pickup unit is located within the acoustic cavity and vibrates in response to external sound signals transmitted to the housing structure. A vibration transmission unit is configured to transmit the vibration generated by the vibration pickup unit; and An electroacoustic conversion element is configured to receive vibrations transmitted by the vibration transmission unit and generate an electrical signal; The vibration pickup unit and the vibration transmission unit form a vacuum cavity, and the acoustic-electric conversion element is located in the vacuum cavity; The vibration pickup unit includes a first vibration pickup unit and a second vibration pickup unit arranged sequentially from top to bottom. A tubular vibration transmission unit is provided between the first vibration pickup unit and the second vibration pickup unit. The vibration transmission unit, the first vibration pickup unit, and the second vibration pickup unit form the vacuum cavity. The first vibration pickup unit and the second vibration pickup unit are connected to the shell structure through their peripheries, so that the vibration transmission unit is suspended in the acoustic cavity formed by the shell structure. The first vibration pickup unit and the second vibration pickup unit vibrate in response to external sound signals transmitted to the shell structure; or, the vibration pickup unit... The pickup unit includes a first vibration pickup unit, a second vibration pickup unit, and a third vibration pickup unit. The first vibration pickup unit and the second vibration pickup unit are arranged vertically opposite each other. A tubular vibration transmission unit is provided between the first vibration pickup unit and the second vibration pickup unit. The vibration transmission unit, the first vibration pickup unit, and the second vibration pickup unit form the vacuum cavity. The third vibration pickup unit is connected between the vibration transmission unit and the inner wall of the shell structure, so that the vibration transmission unit is suspended in the acoustic cavity formed by the shell structure. The third vibration pickup unit vibrates in response to external sound signals transmitted to the shell structure.

2. The microphone according to claim 1, characterized in that, The vacuum level inside the vacuum chamber is less than 100 Pa.

3. The microphone according to claim 1, characterized in that, The vacuum level inside the vacuum chamber is 10. -6 Pa-100 Pa.

4. The microphone according to claim 1, characterized in that, The vibration pickup unit divides the acoustic cavity formed by the housing structure into multiple cavities, including a first acoustic cavity; the housing structure includes a hole located on the side wall of the housing structure corresponding to the first acoustic cavity, and the hole connects the first acoustic cavity to the outside; wherein, the vibration pickup unit vibrates in response to the external sound signal transmitted through the hole, and the acoustic-to-electrical conversion element receives the vibration of the vibration pickup unit and generates an electrical signal.

5. The microphone according to claim 1, characterized in that, When the vibration transmission part is connected to the housing structure through the first vibration pickup part and the second vibration pickup part, the first vibration pickup part or the second vibration pickup part includes an elastic part and a fixed part. The fixed part of the first vibration pickup part and the fixed part of the second vibration pickup part and the vibration transmission part form the vacuum cavity. The elastic part is connected between the fixed part and the inner wall of the housing structure. The elastic part vibrates in response to the external sound signal.

6. The microphone according to claim 5, characterized in that, The stiffness of the fixed part is greater than that of the elastic part.

7. The microphone according to claim 6, characterized in that, The Young's modulus of the fixed part is greater than 50 GPa.

8. The microphone according to claim 1, characterized in that, When the vibration transmission unit is connected to the housing structure through the first vibration pickup unit and the second vibration pickup unit, the microphone also includes a reinforcement member located on the upper or lower surface of the first vibration pickup unit and the second vibration pickup unit corresponding to the vacuum cavity.

9. The microphone according to claim 1, characterized in that, When the vibration transmission unit is connected to the housing structure through the third vibration pickup unit, the stiffness of the first vibration pickup unit and the second vibration pickup unit is greater than the stiffness of the third vibration pickup unit.

10. The microphone according to claim 9, characterized in that, The Young's modulus of the first vibration pickup unit and the second vibration pickup unit is greater than 50 GPa.

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