Organic light emitting diode

Abstract

Disclosed is an organic light emitting diode that suppresses external light reflection while reducing loss of light generated in an organic light emitting layer. The organic light emitting diode includes a substrate, an anode on the substrate, a bank on the anode and exposing a portion of the anode to define an emission area, an organic light emitting layer on the emission area and the bank, a cathode on the organic light emitting layer, a plurality of light-shielding patterns on the cathode and overlapping the bank, and a light loss inducing layer on the same plane as the plurality of light-shielding patterns and disposed between a pair of light-shielding patterns among the plurality of light-shielding patterns, the light loss inducing layer having a thickness identical to that of the plurality of light-shielding patterns and overlapping the emission area.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2021-0105230, filed on August 10, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to an organic light-emitting diode that suppresses external light reflection while reducing light loss generated in the organic light-emitting layer. Background Technology

[0004] Recently, as society has entered the information age, interest in information displays that process and display large amounts of information is increasing. Furthermore, with the growing demand for portable information media, various thin and light flat panel display devices have been developed and are attracting considerable attention.

[0005] Specifically, among various flat panel display devices, organic light-emitting diodes (OLEDs) are self-emissive devices, eliminating the need for backlights in liquid crystal displays (LCDs), which are non-self-emissive devices, thus enabling lightweight and thin designs.

[0006] In addition, organic light-emitting diodes (OLEDs) have the advantages of superior viewing angle and contrast compared to liquid crystal displays (LCDs), as well as lower power consumption. OLEDs are driven with low DC voltage, have a fast response speed, and are resistant to external shocks due to their robust internal components. They also have a wide operating temperature range.

[0007] Meanwhile, in typical organic light-emitting diodes, circular polarizers are located on the upper surface of the display panel to reduce reflections from various wirings or electrodes formed of metal.

[0008] A circular polarizer is configured with a delay plate and a linear polarizer. The delay plate is configured with a quarter-wave plate (QWP) having a phase delay value of 1 / 4λ, and the linear polarizer has a polarization axis and causes the light to be linearly polarized in the direction of the polarization axis.

[0009] When the circular polarizer is positioned such that the delay plate is on the upper surface of the display panel and the linear polarizer is above the delay plate, reflection occurs in the display panel due to external light. Furthermore, when the reflected light exits to the outside, it cannot pass through the linear polarizer, thus reducing the reflectivity of the external light.

[0010] However, as mentioned above, when the circular polarizer is located on the upper surface of the display panel, there is a problem that the overall brightness of the organic light-emitting diodes is also reduced. That is, the transmittance of the circular polarizer is about 40% to 50%, which causes the brightness of the light generated in the organic light-emitting layer to be reduced by 50% or more when passing through the circular polarizer.

[0011] Therefore, research is being actively conducted to reduce the external light reflectivity of organic light-emitting diodes while minimizing brightness loss without using circular polarizers. Summary of the Invention

[0012] The purpose of this disclosure is to provide an organic light-emitting diode that suppresses external light reflection while reducing light loss generated in the organic light-emitting layer.

[0013] The purpose of this disclosure is not limited to the purposes mentioned above, and other purposes not mentioned above will be clearly understood by those skilled in the art based on the following description.

[0014] To achieve the above objectives, according to one aspect of the present invention, an organic light-emitting diode (OLED) includes: a substrate; an anode on the substrate; a dam on the anode, the dam exposing a portion of the anode to define an emission region; an organic light-emitting layer on the emission region and the dam; a cathode on the organic light-emitting layer; a plurality of light-shielding patterns configured to absorb light incident on the plurality of light-shielding patterns, the plurality of light-shielding patterns being on the cathode and overlapping with the dam but not with the emission region; and a light loss inducing layer configured to reduce the emission of reflected external light, the light loss inducing layer overlapping with the emission region and being coplanar with the plurality of light-shielding patterns, such that the light loss inducing layer is disposed between a pair of light-shielding patterns among the plurality of light-shielding patterns, the light loss inducing layer having the same thickness as the plurality of light-shielding patterns.

[0015] In one embodiment, an organic light-emitting diode includes: a substrate; a plurality of light-shielding patterns on the substrate; a light loss inducing layer between the plurality of light-shielding patterns, such that the light loss inducing layer is disposed between a pair of light-shielding patterns in the plurality of light-shielding patterns; a first insulating layer in direct contact with a first surface of the light loss inducing layer; and a second insulating layer in direct contact with a second surface of the light loss inducing layer that is farther from the substrate than the first surface of the light loss inducing layer, wherein the refractive index of the light loss inducing layer is less than the refractive index of the first insulating layer and less than the refractive index of the second insulating layer.

[0016] In one embodiment, a method of manufacturing an organic light-emitting diode includes: forming an anode on a substrate; forming a dam on the anode, the dam exposing a portion of the anode to define an emission region; forming an organic light-emitting layer on the emission region and the dam; forming a cathode on the organic light-emitting layer; and forming a plurality of light-shielding patterns and a light loss inducing layer on the cathode, the plurality of light-shielding patterns being configured to absorb light incident on the plurality of light-shielding patterns, and the light loss inducing layer being configured to reduce the emission of reflected external light, wherein the plurality of light-shielding patterns overlap with the dam, and the light loss inducing layer overlaps with the emission region and is located in the same plane as the plurality of light-shielding patterns, such that the light loss inducing layer is disposed between a pair of light-shielding patterns among the plurality of light-shielding patterns, the light loss inducing layer having the same thickness as the plurality of light-shielding patterns.

[0017] As described above, the organic light-emitting diode according to this disclosure includes a light loss inducing layer located on the organic light-emitting layer and a light-shielding pattern adjacent to the light loss inducing layer, so as to suppress external light reflection while reducing the loss of light generated in the organic light-emitting layer.

[0018] Furthermore, the organic light-emitting diode according to this disclosure includes a touch electrode that overlaps with a light-shielding pattern to exhibit excellent touch performance while reducing the reduction in aperture ratio.

[0019] Furthermore, the organic light-emitting diode according to this disclosure includes a transmittance control layer or a color filter layer, which is positioned to correspond to the transmission direction of light emitted through the organic light-emitting layer, so that external light reflection can be suppressed without providing a separate circular polarizer. Attached Figure Description

[0020] The above and other aspects, features and other advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0021] Figure 1 This is a cross-sectional view showing the structure of a unit pixel including three sub-pixels in an organic light-emitting diode according to a first exemplary embodiment of the present disclosure;

[0022] Figure 2 It is magnification Figure 1 The green sub-pixel portion is shown, along with a cross-sectional view illustrating the reflected light and the path of light generation according to a first exemplary embodiment of this disclosure.

[0023] Figure 3 It is shown Figure 2 A graph showing the distribution of reflected and generated light at different angles;

[0024] Figure 4 It shows the basis Figure 2A graph showing the changes in the amount of light produced and the effect of reduced reflectivity caused by changes in distance D.

[0025] Figure 5 This illustrates a first exemplary embodiment according to the present disclosure. Figure 2 A cross-sectional view of the path through which light is generated;

[0026] Figure 6 This is a cross-sectional view showing the path of light generation according to a second exemplary embodiment of the present disclosure;

[0027] Figure 7 This illustrates a first exemplary embodiment according to the present disclosure. Figure 2 A cross-sectional view of the path of the reflected light;

[0028] Figure 8 This is a cross-sectional view showing the path of reflected light according to a third exemplary embodiment of the present disclosure;

[0029] Figure 9 This is a cross-sectional view of the green sub-pixel portion according to the fourth exemplary embodiment of this disclosure;

[0030] Figures 10 to 14 This is a cross-sectional view illustrating a method for manufacturing an organic light-emitting diode according to a first exemplary embodiment of the present disclosure; and

[0031] Figures 15 to 19 This is a cross-sectional view illustrating a method for manufacturing an organic light-emitting diode according to a third exemplary embodiment of the present disclosure. Detailed Implementation

[0032] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the following detailed description of exemplary embodiments and accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. Exemplary embodiments are provided by way of example only to enable those skilled in the art to fully understand the disclosure and scope of this disclosure. Therefore, this disclosure will be limited only by the scope of the appended claims.

[0033] The shapes, dimensions, ratios, angles, numbers, etc., shown in the accompanying drawings to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, the same reference numerals generally denote the same elements. Furthermore, in the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “including” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular also includes the plural.

[0034] Even without explicit explanation, components are interpreted as including the normal tolerance range.

[0035] When using terms such as “above,” “above,” “below,” and “near” to describe the positional relationship between two parts, one or more parts may be positioned between the two parts unless these terms are used in conjunction with the terms “immediately adjacent” or “directly.”

[0036] When a component or layer is placed "on" another component or layer, it can be placed directly on the other component or layer, or there can be an intermediate component or layer between them.

[0037] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component mentioned below can be the second component in the technical concept of this disclosure.

[0038] Throughout the specification, the same reference numerals generally denote the same elements.

[0039] For ease of description, the size and thickness of the various components shown in the accompanying drawings are illustrated, but this disclosure is not limited to the size and thickness of the components shown.

[0040] Features of various embodiments of this disclosure may be appended or combined with each other in whole or in part, and may be technically interlocked and operated in various ways, and the embodiments may be performed independently of each other or in relation to each other.

[0041] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0042] Figure 1 This is a cross-sectional view illustrating the structure of a unit pixel in an organic light-emitting diode comprising three sub-pixels RP, GP, and BP according to a first exemplary embodiment of the present disclosure. Figure 2 It is magnification Figure 1The green sub-pixel GP portion is shown, and a cross-sectional view of the paths of reflected light A and generated light B according to a first exemplary embodiment of the present disclosure is illustrated.

[0043] First, refer to Figure 1 An organic light-emitting diode according to a first exemplary embodiment of this disclosure may include a plurality of sub-pixels. Although in Figure 1 The diagram shows red subpixel RP, green subpixel GP, and blue subpixel BP, but this disclosure is not limited to these, and may also include white subpixels.

[0044] An organic light-emitting diode including multiple sub-pixels may include a substrate 101, a thin film transistor (TFT) layer 103, an anode 105, a dam 107, an organic light-emitting layer 109, a cathode 111, an encapsulation layer 120, a touch electrode 131, a touch protection layer 133, a light-shielding pattern 140, a light loss inducing layer 150, a transmittance control layer 160, and a capping layer 170.

[0045] The substrate 101 can be used to support components located above it. The substrate 101 can be formed of a solid glass material, but is not limited to it, and can also be formed of a flexible plastic such as polyimide.

[0046] TFT layer 103 may be located on substrate 101. TFT layer 103 may include multiple thin-film transistors driving multiple sub-pixels RP, GP, and BP. Each of the multiple thin-film transistors may include an active layer formed of polysilicon or oxide semiconductor, a gate electrode overlapping the active layer, and a source electrode and a drain electrode contacting both ends of the active layer. TFT layer may include switching thin-film transistors and driving thin-film transistors, and additionally includes compensating thin-film transistors for compensating for threshold voltage Vth and the mobility of the thin-film transistors.

[0047] Anode 105 may be located on TFT layer 103. Multiple anodes 105 may be located on TFT layer 103 and spaced apart from each other. Specifically, one anode 105 may be located in one sub-pixel. Therefore, there is a one-to-one correspondence between each anode 105 and each sub-pixel. Anode 105 may be electrically connected to a driving thin-film transistor located in TFT layer 103.

[0048] The anode 105 may be a reflective electrode. In one exemplary embodiment of this disclosure, the anode 105 may include silver (Ag) or aluminum (Al). In another exemplary embodiment of this disclosure, the anode 105 may be formed with a multilayer structure such as ITO / Ag / ITO or IZO / Al / IZO. The surface reflectivity of the anode 105 may be 95% or higher.

[0049] A dam 107 may be located on the anode 105. The dam 107 may expose a portion of the anode 105 to define an emission area. That is, the dam 107 may cover the edge of the anode 105. Specifically, the dam 107 is removed from the central portion of the anode 105 disposed in each of the red sub-pixel RP, green sub-pixel GP, and blue sub-pixel BP to form a red emission area, a green emission area, and a blue emission area.

[0050] The dam 107 may be formed of an organic material. In one exemplary embodiment of this disclosure, the dam 107 is formed of polyimide, but is not limited thereto, and is formed of an acrylic material. In another exemplary embodiment of this disclosure, the dam 107 may be formed of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx).

[0051] The embankment 107 may include an inclined surface positioned adjacent to the anode 105 and a flat surface located between two adjacent sub-pixels. The inclined surface of the embankment 107 has a positive conical shape, and the angle of the inclined surface of the embankment 107 may vary depending on the material of the embankment 107.

[0052] The organic light-emitting layer 109 can be located on the anode 105 and the embankment 107. The organic light-emitting layer 109 may include a red organic light-emitting layer 109R emitting red light, a green organic light-emitting layer 109G emitting green light, and a blue organic light-emitting layer 109B emitting blue light. The red organic light-emitting layer 109R, the green organic light-emitting layer 109G, and the blue organic light-emitting layer 109B can be located on the red sub-pixel RP, the green sub-pixel GP, and the blue sub-pixel BP, respectively. As described above, the organic light-emitting diode according to the exemplary embodiment of this disclosure can emit red, green, and blue light for each sub-pixel to achieve full color with high brightness.

[0053] The organic light-emitting layer 109 can be configured as a single layer including a light-emitting material, or as a multilayer configuration of a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer, and an electron injection layer to improve luminous efficiency. Even if not shown in the figure, the hole injection layer, hole transport layer, electron transport layer, and electron injection layer can be a common layer formed on the entire surface of the substrate 101.

[0054] The cathode 111 may be located on the organic light-emitting layer 109. The cathode 111 is typically formed over the entire surface of the substrate 101 to apply the same voltage to each sub-pixel. The cathode 111 may include at least one of magnesium (Mg), silver (Ag), and ytterbium (Yb). Specifically, the cathode 111 may be formed from a multilayer of Mg / Ag or Mg / Yb.

[0055] The cathode 111 can be formed of a transmission-reflection electrode. Specifically, the cathode 111 is formed of a thin metal film to allow a portion of the light incident on the cathode 111 to pass through and another portion of the incident light to be reflected.

[0056] When a predetermined voltage is applied to the anode 105 and the cathode 111, holes injected from the anode 105 and electrons supplied from the cathode 111 are transported to the organic light-emitting layer 109 to form excitons. When the excitons transition from the excited state to the ground state, light is generated and emitted in the form of visible light. The emitted light is emitted toward the cathode 111. That is, the organic light-emitting diode according to an exemplary embodiment of this disclosure can be a top-emitting type.

[0057] In an exemplary embodiment of this disclosure, the anode 105 is a reflective electrode and the cathode 111 is formed as a transmission-reflection electrode, such that the light generated in the organic light-emitting layer 109 (generated light B) resonates between the anode 105 and the cathode 111. The light resonating between the anode 105 and the cathode 111 causes constructive interference, and the half-width of the optical profile is shortened. Therefore, a large amount of generated light B emitted toward the cathode is emitted in front of the organic light-emitting diode, and the amount of light emitted toward the side surface of the organic light-emitting diode is reduced. In other words, the amount of generated light B increases in the direction perpendicular to the anode 105. Therefore, even if the light-shielding pattern 140 is located above the organic light-emitting layer 109, the loss of generated light B due to the light-shielding pattern 140 can be reduced.

[0058] An encapsulation layer 120 can be disposed on the cathode 111. The encapsulation layer 120 can be used to protect the organic light-emitting layer 109 from moisture and oxygen. The encapsulation layer 120 can be formed to cover the entire surface of the substrate 101.

[0059] The encapsulation layer 120 can be formed by sequentially laminating a first encapsulation layer 120a formed of an inorganic film, a second encapsulation layer 120b formed of an organic film, and a third encapsulation layer 120c formed of an inorganic film. Here, the second encapsulation layer 120b can perform a planarization function. Simultaneously, the first encapsulation layer 120a and the third encapsulation layer 120c are formed by chemical vapor deposition, and the second encapsulation layer 120b is formed by inkjet printing.

[0060] Touch electrode 131 may be formed on encapsulation layer 120. In one embodiment of this disclosure, touch electrode 131 may be formed directly on third encapsulation layer 120c. In another exemplary embodiment of this disclosure, touch buffer layer (not shown) may be further formed between touch electrode 131 and third encapsulation layer 120c.

[0061] Multiple touch electrodes 131 can be formed. Specifically, each of the multiple touch electrodes 131 can be located between adjacent sub-pixels. In an exemplary embodiment of this disclosure, each of the multiple touch electrodes 131 can be positioned to overlap with the flat surface of the embankment 107. That is, each of the multiple touch electrodes 131 may not overlap with the emission region.

[0062] A touch protection layer 133 may be located on the touch electrode 131. The touch protection layer 133 can protect the touch electrode 131 from the influence of components located above the touch electrode 131. The touch protection layer 133 may be formed of an insulating material. The touch protection layer 133 may be formed of an organic material such as resin or an inorganic material such as silicon oxide, but is not limited thereto.

[0063] A light-shielding pattern 140 may be located on the touch protective layer 133. The light-shielding pattern 140 is formed of a black material to absorb light incident on it. In an exemplary embodiment of this disclosure, the light-shielding pattern 140 may be formed to overlap with the touch electrode 131. Specifically, the light-shielding pattern 140 may completely cover the touch electrode 131. In other words, the touch electrode 131 may completely overlap with the light-shielding pattern 140. That is, the width of the cross-section of the light-shielding pattern 140 may be greater than the width of the cross-section of the touch electrode 131. Therefore, the touch electrode 131 is not visible from the outside of the organic light-emitting diode, and the reduction in aperture ratio caused by the touch electrode 131 can also be suppressed.

[0064] Multiple light-shielding patterns 140 can be formed. Specifically, each of the multiple light-shielding patterns 140 can be located between adjacent sub-pixels. In one exemplary embodiment of this disclosure, each of the multiple light-shielding patterns 140 can be positioned to overlap with the flat surface of the embankment 107. That is, each of the multiple light-shielding patterns 140 may not overlap with the emission region.

[0065] The light loss inducing layer 150 can be disposed between a plurality of light-shielding patterns 140, such that the light loss inducing layer is disposed between a pair of light-shielding patterns among the plurality of light-shielding patterns 140. Specifically, the light loss inducing layer 150 can be formed on the same plane as the plurality of light-shielding patterns 140. Therefore, both the light loss inducing layer 150 and the plurality of light-shielding patterns 140 are on the touch protection layer 133. Furthermore, the light loss inducing layer 150 can overlap with the emitting region. Furthermore, the light loss inducing layer 150 can overlap with the inclined surface of the embankment 107.

[0066] The light loss inducing layer 150 can be formed of a material with a low refractive index. For example, the light loss inducing layer 150 can be formed of transparent silicon oxide (SiOx). The refractive index of the light loss inducing layer 150 according to an exemplary embodiment of this disclosure can be from 1.2 to 1.4. Specifically, the refractive index of the light loss inducing layer 150 can be less than the refractive index of the touch protection layer 133 adjacent below it. Furthermore, the refractive index of the light loss inducing layer 150 can be less than the refractive index of the transmittance control layer 160 adjacent above it. The light loss inducing function of the light loss inducing layer 150 will now be described.

[0067] The transmittance control layer 160 may be located on the light-shielding pattern 140 and the light loss inducing layer 150. The lower surface of the transmittance control layer 160 according to an exemplary embodiment of this disclosure may contact both the light-shielding pattern 140 and the light loss inducing layer 150. Specifically, the transmittance control layer 160 may be formed on the entire surface of the substrate 101.

[0068] The transmittance control layer 160 can be formed of an insulating material. The transmittance control layer 160 is a component that replaces prior art circular polarizers and can be implemented using a film formed from a mixture of a transparent resin and a gray pigment. Here, the transparent resin can be formed from one or more resins selected from the group consisting of polyester, acrylic, polyurethane, melamine, polyvinyl alcohol, or oxazoline adhesive resins, and preferably from an acrylic adhesive resin. The refractive index of the transmittance control layer 160 can be 1.6.

[0069] A cover layer 170 may be located on the transmittance control layer 160. The cover layer 170 is formed over the entire surface of the substrate 101 to protect components beneath it from external impacts. The cover layer 170 may be formed of tempered glass or transparent plastic. The refractive index of the cover layer 170 may be 1.5. An air gap (not shown) may be located on the cover layer 170, and the refractive index of the air gap may be 1.0.

[0070] The transmittance of the transmittance control layer 160 can be set by adjusting the thickness of the transmittance control layer 160 or the concentration of the gray pigment included in the transmittance control layer 160. When the transmittance of the transmittance control layer 160 is set high, a large amount of generated light B is emitted to the outside, thus improving optical efficiency. However, simultaneously, a large amount of reflected light A, incident from the outside and reflected by the anode 105, is also emitted to the outside, reducing the visibility of the image displayed in the organic light-emitting diode (OLED). Conversely, when the transmittance of the transmittance control layer 160 is set low, less generated light B is emitted to the outside, reducing optical efficiency. However, simultaneously, less reflected light A, incident from the outside and reflected by the anode 105, is emitted to the outside, improving the visibility of the image displayed in the OLED. In other words, there is a trade-off between the transmittance of the transmittance control layer 160 and the image visibility of the OLED. Therefore, by appropriately setting the transmittance of the transmittance control layer 160, it is difficult to satisfy both the optical efficiency and image visibility of the OLED.

[0071] Therefore, an organic light-emitting diode according to an exemplary embodiment of the present disclosure includes a light loss inducing layer 150 to suppress the emission of reflected light A while reducing the loss of generated light B.

[0072] Reflected light A is external light reflected by anode 105 and emitted again to the outside. Reflected light A undergoes substantially Lambertian reflection on the surface of anode 105. That is, external light incident on the surface of anode 105 is diffused substantially uniformly in all directions from the surface of anode 105 and emitted again to the outside. Therefore, reflected light A has a uniform amount of light regardless of the viewing angle. Figure 2 In the diagram, the thickness of the arrow indicating reflected light A is used to show the amount of reflected light A, and it can be confirmed that the thickness of the arrow indicating reflected light A is the same regardless of the viewing angle.

[0073] When reflected light A is reflected from the surface of the anode 105, etc., and then emitted to the outside again, the reflected light encounters the light loss inducing layer 150. The refractive index of the light loss inducing layer 150 is less than that of the touch protection layer 133 below it, causing the reflected light A to be refracted toward the light-shielding pattern 140 at the interface between the light loss inducing layer 150 and the touch protection layer 133. Therefore, not only the reflected light A directly incident on the light-shielding pattern 140, but also the reflected light A incident on the light loss inducing layer 150 adjacent to the light-shielding pattern 140 is absorbed by the light-shielding pattern 140. In other words, the amount of reflected light A emitted to the outside is reduced to a predetermined level by the light-shielding pattern 140 and the light loss inducing layer 150.

[0074] When light B is generated in the organic light-emitting layer 109 and then emitted to the outside, light B also encounters the light loss inducing layer 150. The refractive index of the light loss inducing layer 150 is lower than that of the touch protection layer 133 below it, causing light B to be refracted toward the light-shielding pattern 140 at the interface between the light loss inducing layer 150 and the touch protection layer 133. Therefore, not only light B directly incident on the light-shielding pattern 140, but also light B incident on the light loss inducing layer 150 adjacent to the light-shielding pattern 140 is absorbed by the light-shielding pattern 140.

[0075] However, as mentioned above, unlike reflected light A, the amount of generated light B can vary depending on the viewing angle. Figure 2 In the diagram, the thickness of the arrow indicating the generated light B shows the amount of generated light B, and it is confirmed that the thickness of the arrow indicating the generated light B varies according to the viewing angle. Therefore, a large amount of generated light B is emitted in front of the organic light-emitting diode, and the amount of emitted light decreases towards the side surface of the organic light-emitting diode.

[0076] Therefore, the amount of generated light B directly incident on the light-shielding pattern 140 and the amount of generated light B incident on the light loss inducing layer 150 adjacent to the light-shielding pattern 140 and then incident on the light-shielding pattern 140 can be much smaller than the amount of generated light B not incident on the light-shielding pattern 140. In other words, the amount of generated light B absorbed by the light-shielding pattern 140 can be negligible compared to the total amount of generated light B.

[0077] As described above, it is assumed that the amount of reflected light A immediately following reflection from the anode 105 is equal to the amount of generated light B immediately following generation in the organic light-emitting layer 109. Under this assumption, the amount of reflected light A incident on the light-shielding pattern 140 through the light loss inducing layer 150 can be greater than the amount of generated light B incident on the light-shielding pattern 140 through the light loss inducing layer 150. That is, the emission of reflected light A can be suppressed by the light loss inducing layer 150, while reducing the loss of generated light B.

[0078] At this point, the amount of light loss generated (B) and the amount of light blocking reflected (A) can be set by adjusting the distance (distance D) between the edge of the emission area and the side surface of the light-blocking pattern 140 adjacent to the edge of the emission area. (Refer to...) Figure 3 and Figure 4 This will be described in detail.

[0079] Figure 3 It is shown Figure 2 The curves showing the light distribution of reflected light A and generated light B at various angles. Figure 4 It shows the basis Figure 2 The graph shows the changes in the amount of light B produced by the change in distance D and the effect of reduced reflectivity. Figure 3 and Figure 4 In this process, the refractive index of the light loss inducing layer 150 is 1.3.

[0080] exist Figure 3 In the diagram, the horizontal and vertical axes indicate relative light intensity, and the numbers on the circumference of the outermost semicircle indicate angles (view angles). Here, angle 0 refers to the direction perpendicular to the surface of anode 105, and angles 90 and -90 refer to the directions parallel to the surface of anode 105. Red, green, and blue represent the generated light B emitted from red sub-pixel RP, green sub-pixel GP, and blue sub-pixel BP, respectively, and Lambertian represents the reflected light A reflected from anode 105, etc.

[0081] quilt Figure 2 The light-blocking pattern 140 absorbs but does not emit light to the outside. Figure 3 Light below the imaginary line (line C in the following text). For example, from... Figure 3 The intensity of the generated light B and reflected light A at the contact of the straight line C is observed. The amount of obstruction of reflected light A is relatively greater than the amount of loss of generated light B caused by the light-blocking pattern 140. The amount of loss of generated light B and the amount of obstruction of reflected light A can be set to the desired values ​​by adjusting the distance D. For example, as the distance D increases, Figure 3 The straight line C slopes downwards, reducing the loss of light B and the amount of shading of reflected light A. As another example, when the distance D decreases, Figure 3 The straight line C slopes upward, which increases the loss of light B and the amount of shading of reflected light A.

[0082] However, the amount of loss of generated light B and the amount of obstruction of reflected light A are different depending on the distance D. Figure 4 The horizontal axis represents the change in distance D, the left vertical axis represents the intensity of the generated light B, and the right vertical axis represents the effect of reducing the reflectivity of the reflected light A. Red, green, and blue represent the generated light B emitted from the red sub-pixel RP, green sub-pixel GP, and blue sub-pixel BP, respectively, and the reduced reflectivity represents the effect of reducing the reflectivity of the reflected light A.

[0083] like Figure 4 As shown, the smaller the distance D, the greater the loss of generated light B and the greater the amount of obstruction of reflected light A. However, when the distance D is reduced by a predetermined level, the amount of obstructed reflected light A is greater than the amount of generated light B lost when the distance D is reduced by the predetermined level. In other words, the effect of reducing the reflectivity of reflected light A by reducing the distance D is greater than the loss of generated light B.

[0084] The following table 1 shows... Figure 4 The experimental results.

[0085] [Table 1]

[0086]

[0087] When x+y<100, there is no effect of suppressing the emission of reflected light A while reducing the loss of generated light B, and when x+y>100, the emission of reflected light A can be suppressed while reducing the loss of generated light B. As can be seen from Table 1, when the distance D is from 0μm to 3μm, x+y>100, which makes it possible to suppress the emission of reflected light A while reducing the loss of generated light B.

[0088] In an exemplary embodiment of this disclosure, the distance D can be 3 μm or less. In this case, the reflectivity reduction effect of reflected light A can be 0.4% without loss of generated light B.

[0089] In another exemplary embodiment of this disclosure, the distance D can be 0 μm. In this case, the end portion of the emitting region and the side surface of the light-shielding pattern 140 adjacent to the end portion of the emitting region are on the same plane. At this time, approximately 6 a.u. to 7 a.u. of generated light B is lost, but the reflectivity reduction effect of reflected light A is 10.2%, making it possible to set the distance D to 0 μm in organic light-emitting diodes that are frequently exposed to external light.

[0090] Next, a second exemplary implementation of the present disclosure will be described. Figure 5 It is shown Figure 2 A cross-sectional view of the path through which light B is generated. Figure 6 This is a cross-sectional view showing the path of light B' generated according to another exemplary embodiment of the present disclosure.

[0091] First, refer to Figure 5In the organic light-emitting diode according to a first exemplary embodiment of the present disclosure, a portion of the generated light B incident on the light loss inducing layer 150 adjacent to the light-shielding pattern 140 (hereinafter, generated light B1) is refracted at the interface between the light loss inducing layer 150 and the touch protection layer 133 in a direction parallel to the substrate 101 so as to be absorbed by the light-shielding pattern 140. However, in the first exemplary embodiment of the present disclosure, another portion of the generated light B incident on the light loss inducing layer 150 adjacent to the light-shielding pattern 140 (hereinafter, generated light B2) is refracted at the interface between the light loss inducing layer 150 and the touch protection layer 133 in a direction parallel to the substrate 101. However, the generated light B2 is not absorbed by the light-shielding pattern 140, but can be emitted above the light-shielding pattern 140. However, the generated light B2 is refracted at the interface between the light loss inducing layer 150 and the touch protection layer 133 in a direction parallel to the substrate 101, making it highly likely that the generated light B2 will undergo total internal reflection at the interface between the capping layer 170 and the air layer (not shown). In other words, the generated light B2, which needs to be emitted to the outside to be visible to the user of the organic light-emitting diode, is reflected inward from the upper surface of the cover layer 170, which may cause light loss.

[0092] To solve this problem, such as Figure 6 As shown, the light-emitting inducing layer 180 may be further located on the light-shielding pattern 140 and the light-loss inducing layer 150. The light-emitting inducing layer 180 may be formed on the entire surface of the substrate 101. Specifically, the light-emitting inducing layer 180 may be in contact with the upper surface of the light-shielding pattern 140 and the upper surface of the light-loss inducing layer 150, and may be in contact with the lower surface of the transmittance control layer 160. Therefore, the light-emitting inducing layer 180 is located between the transmittance control layer 160 and the light-shielding pattern 140 and the light-loss inducing layer 150.

[0093] The light-emitting induction layer 180 can be formed of a material with a high refractive index. For example, the light-emitting induction layer 180 can be formed of a transparent silicon nitride, SiNx. The refractive index of the light-emitting induction layer 180 according to an exemplary embodiment of this disclosure can be from 1.7 to 1.9. Specifically, the refractive index of the light-emitting induction layer 180 can be greater than the refractive index of the light loss induction layer 150 adjacent below it. Furthermore, the refractive index of the light-emitting induction layer 180 can be greater than the refractive index of the transmittance control layer 160 adjacent above it.

[0094] As described above, when the light-emitting inducing layer 180 is located on the light-loss inducing layer 150, at the interface between the light-loss inducing layer 150 and the light-emitting inducing layer 180, the light is refracted below the light-loss inducing layer 150 in a direction perpendicular to the substrate 101. Figure 5The generated light B2 has the same path as the generated light B2'. Therefore, the generated light B2' is highly likely to be emitted to the outside without being totally reflected from the upper surface of the cover layer 170. That is, the light-emitting induction layer 180 is additionally configured to increase the amount emitted to the outside while suppressing total internal reflection of light generated in the organic light-emitting layer 109.

[0095] Next, a third exemplary embodiment of the present disclosure will be described. Figure 7 It is shown Figure 2 A cross-sectional view of the path of the reflected light A. Figure 8 This is a cross-sectional view showing the path of reflected light A' according to a third exemplary embodiment of this disclosure.

[0096] First, refer to Figure 7 In the organic light-emitting diode according to a first exemplary embodiment of the present disclosure, a portion of the reflected light A1 incident on the light loss inducing layer 150 adjacent to the light-shielding pattern 140 (hereinafter referred to as reflected light A1) is refracted at the interface between the light loss inducing layer 150 and the touch protection layer 133 in a direction parallel to the substrate 101, so as to be absorbed by the light-shielding pattern 140. However, in the first exemplary embodiment of the present disclosure, another portion of the reflected light A2 incident on the light loss inducing layer 150 adjacent to the light-shielding pattern 140 (hereinafter referred to as reflected light A2) is refracted at the interface between the light loss inducing layer 150 and the touch protection layer 133 in a direction parallel to the substrate 101. However, the reflected light A2 is not absorbed by the light-shielding pattern 140, but can be emitted above the light-shielding pattern 140.

[0097] According to the third exemplary embodiment of this disclosure, the organic light-emitting diode can form the light-shielding pattern 141 as having such Figure 8 The inverted conical cross-sectional shape shown not only suppresses Figure 7 The external emission of reflected light A1 is suppressed, and the external emission of reflected light A2 is also suppressed. Furthermore, the light loss inducing layer 151 can be formed with a positive conical cross-sectional shape. That is, in the organic light-emitting diode according to the third exemplary embodiment of this disclosure, the inverted conical side surface of the light-shielding pattern 141 is located in the emission path of reflected light A2' to block a greater amount of reflected light A1' and A2'.

[0098] Next, a fourth exemplary embodiment of the present disclosure will be described. Figure 9 This is a cross-sectional view of the green sub-pixel portion according to the fourth exemplary embodiment of this disclosure.

[0099] Reference Figure 9 A color filter layer 190 can be set up to replace... Figure 2The transmittance control layer 160. The color filter layer 190 may include, but is not limited to, a red color filter 190R, a green color filter 190G, and a blue color filter 190B formed of an insulating material. Like the transmittance control layer 160, the color filter layer 190 increases the color purity of the generated light B emitted from the organic light-emitting layer 109 and reduces the external emission of the reflected light A. The refractive index of the color filter layer 190 may be 1.5 to 1.6, and is higher than the refractive index of the light loss inducing layer 150. That is, similar to the first exemplary embodiment of this disclosure, the refractive index of the light loss inducing layer 150 is lower than the refractive index of the insulating layers located above and below it, such that light incident on the light loss inducing layer 150 is refracted in a direction parallel to the substrate 101. Therefore, light incident on the light loss inducing layer 150 adjacent to the light-shielding pattern 140 is incident on the light-shielding pattern 140 and absorbed by the light-shielding pattern 140.

[0100] Next, we will refer to Figures 10 to 14 A method for manufacturing an organic light-emitting diode according to a first exemplary embodiment of the present disclosure is described.

[0101] First, refer to Figure 10 The substrate 101, TFT layer 103, anode 105, dam 107, organic light-emitting layer 109, cathode 111, encapsulation layer 120, touch electrode 131, and touch protective layer 133 are sequentially laminated. Then, a photosensitive light-shielding material 140a is coated onto the entire touch protective layer 133 to have a first thickness t1. Here, the photosensitive light-shielding material 140a can be a black material with positive photoresist properties.

[0102] Next, refer to Figure 11 The fully coated photosensitive light-shielding material 140a is partially exposed and developed to form a patterned photosensitive light-shielding material 140b in the area overlapping with the touch electrode 131. At this time, the thickness of the patterned photosensitive light-shielding material 140b can remain as the first thickness t1.

[0103] Next, refer to Figure 12 A photosensitive light loss inducing material 150a is coated onto the entire patterned photosensitive light-shielding material 140b to have a second thickness t2. Here, the photosensitive light loss inducing material 150a can also be a transparent material with positive photoresist properties. The refractive index of the photosensitive light loss inducing material 150a can be 1.2 to 1.4. In this case, the second thickness t2 can be greater than the first thickness t1. Therefore, the photosensitive light loss inducing material 150a can completely cover the patterned photosensitive light-shielding material 140b.

[0104] Next, when Figure 13When performing full exposure and development as shown, the patterned photosensitive light-blocking material 140b and the photosensitive light loss inducing material 150a can be patterned simultaneously. Specifically, the upper portion of the photosensitive light loss inducing material 150a and the upper portion of the patterned photosensitive light-blocking material 140b are removed simultaneously by the developer used for development. By doing so, a light-blocking pattern 140 and a light loss inducing layer 150 having a third thickness t3 less than the first thickness t1 can be formed simultaneously.

[0105] Next, as Figure 14 As shown, a transmittance control layer 160 and a cover layer 170 can be sequentially formed on the light-shielding pattern 140 and the light loss inducing layer 150.

[0106] As described above, the light-shielding pattern 140 and the light loss inducing layer 150 are formed simultaneously using only the exposure and development processes without the etching process. Therefore, particles caused by the etching process are suppressed, and the thickness adjustment and alignment of the light-shielding pattern 140 and the light loss inducing layer 150 can be easily performed.

[0107] Next, we will refer to Figures 15 to 19 A method for manufacturing an organic light-emitting diode according to a third exemplary embodiment of the present disclosure is described.

[0108] First, refer to Figure 15 The substrate 101, TFT layer 103, anode 105, barrier 107, organic light-emitting layer 109, cathode 111, encapsulation layer 120, touch electrode 131, and touch protective layer 133 are sequentially laminated. Then, a photosensitive light loss inducing material 151a is coated onto the entire touch protective layer 133 to have a fourth thickness t4. Here, the photosensitive light loss inducing material 151a can be a transparent material with positive photoresist properties. The refractive index of the photosensitive light loss inducing material 151a can be from 1.2 to 1.4.

[0109] Next, refer to Figure 16 The fully coated photosensitive light loss inducing material 151a is partially exposed and developed to form an opening OP at the location overlapping with the touch electrode 131. At this time, the thickness of the photosensitive light loss inducing material 151b in which the opening OP is formed can be a fourth thickness t4.

[0110] Next, refer to Figure 17 A photosensitive light-blocking material 141a is coated onto the entire photosensitive light loss inducing material 151b in which the opening OP is formed, to have a fifth thickness t5. At this time, the fifth thickness t5 is greater than the fourth thickness t4, such that the opening OP is filled with the photosensitive light-blocking material 141a. This photosensitive light-blocking material 141a can be a black material with positive photoresist properties.

[0111] Next, when Figure 18 When performing full exposure and development as shown, the photosensitive light-blocking material 141a and the photosensitive light loss inducing material 151b in which the opening OP is formed can be patterned simultaneously. Specifically, the upper portion of the photosensitive light loss inducing material 151b in which the opening OP is formed and the upper portion of the photosensitive light-blocking material 141b are removed simultaneously by the developer used for development. By doing so, a light-blocking pattern 141 having a sixth thickness t6 less than a fourth thickness t4 and a light loss inducing layer 151 can be formed simultaneously. Here, the side cross-section of the light-blocking pattern 141 has an inverted conical shape, and the side cross-section of the light loss inducing layer 151 has a positive conical shape corresponding to the side cross-section of the light-blocking pattern 141.

[0112] Next, as Figure 19 As shown, a transmittance control layer 160 and a cover layer 170 can be sequentially formed on the light-shielding pattern 141 and the light loss inducing layer 151.

[0113] As described above, the light-shielding pattern 141 and the light loss inducing layer 151 are formed simultaneously using only the exposure and development processes without the etching process. Therefore, particles caused by the etching process are suppressed, and the thickness and side section taper of the light-shielding pattern 141 and the light loss inducing layer 151 can be easily adjusted.

[0114] As described above, the organic light-emitting diode according to this disclosure includes a light loss inducing layer 150 located on the organic light-emitting layer 109 and a light-shielding pattern 140 adjacent to the light loss inducing layer 150. By doing so, external light reflection can be suppressed while reducing the loss of light generated in the organic light-emitting layer 109.

[0115] Furthermore, the organic light-emitting diode according to this disclosure includes a touch electrode 131 overlapping with the light-shielding pattern 140 to exhibit excellent touch performance without reducing the aperture ratio.

[0116] Furthermore, the organic light-emitting diode according to this disclosure includes a transmittance control layer 160 or a color filter layer 190, which is positioned to correspond to the transmission direction of light emitted through the organic light-emitting layer 109, so that external light reflection can be suppressed without providing a separate circular polarizer.

[0117] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be embodied in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the appended claims, and all technical concepts within the scope of their equivalents should be interpreted as falling within the scope of the present disclosure.

Claims

1. An organic light-emitting diode, comprising: substrate; Anode on the substrate; A dam on the anode, the dam exposing a portion of the anode to define an emission area; An organic light-emitting layer on the emission area and the embankment; The cathode on the organic light-emitting layer; Multiple touch electrodes on the cathode, Touch protection layer on the plurality of touch electrodes, Multiple light-shielding patterns are configured to absorb light incident on the multiple light-shielding patterns, the multiple light-shielding patterns being on the touch protective layer and overlapping with the embankment but not overlapping with the emitting area; as well as A light loss inducing layer, configured to reduce the emission of reflected external light, overlaps with the emission region and is coplanar with the plurality of light-shielding patterns, such that the light loss inducing layer is disposed between a pair of light-shielding patterns, and the light loss inducing layer has the same thickness as the plurality of light-shielding patterns. The refractive index of the light loss inducing layer is less than that of the touch protection layer.

2. The organic light-emitting diode according to claim 1, wherein, The light loss inducing layer overlaps with the inclined surface of the embankment adjacent to the emission area.

3. The organic light-emitting diode according to claim 1, wherein, The refractive index of the light loss inducing layer is 1.2 to 1.

4.

4. The organic light-emitting diode according to claim 1, further comprising: The encapsulation layer between the cathode and the plurality of touch electrodes The plurality of touch electrodes are located on the encapsulation layer, such that the plurality of touch electrodes are positioned between the encapsulation layer and the plurality of light-shielding patterns. Each of the plurality of touch electrodes overlaps with the corresponding light-shielding pattern in the plurality of light-shielding patterns.

5. The organic light-emitting diode according to claim 4, wherein, The width of at least one of the plurality of touch electrodes is smaller than the width of at least one of the plurality of light-shielding patterns.

6. The organic light-emitting diode according to claim 1, wherein, The anode is reflective, the cathode is transmissive-reflective, and the light generated in the organic light-emitting layer is emitted toward the cathode.

7. The organic light-emitting diode according to claim 1, wherein, The distance between the end portion of the emission area and the side surface of the light-shielding pattern closest to the end portion of the emission area among the plurality of light-shielding patterns is less than 3 μm.

8. The organic light-emitting diode according to claim 7, wherein, The end portion of the emission area is located on the same plane as the side surface of the light-shielding pattern.

9. The organic light-emitting diode according to claim 1, wherein, At least one of the plurality of light-shielding patterns has an inverted conical cross-sectional shape, such that the first surface of the light-shielding pattern is wider than the second surface of the light-shielding pattern that overlaps with the first surface, and the first surface is farther from the substrate than the second surface.

10. An organic light-emitting diode, comprising: substrate; Anode on the substrate; A dam on the anode, the dam exposing a portion of the anode to define an emission area; An organic light-emitting layer on the emission area and the embankment; The cathode on the organic light-emitting layer; Multiple light-shielding patterns are configured to absorb light incident on the multiple light-shielding patterns, the multiple light-shielding patterns being on the cathode and overlapping the embankment but not overlapping the emission region; A light loss inducing layer is configured to reduce the emission of reflected external light. The light loss inducing layer overlaps with the emission region and is coplanar with the plurality of light-shielding patterns, such that the light loss inducing layer is disposed between a pair of light-shielding patterns in the plurality of light-shielding patterns, and the light loss inducing layer has the same thickness as the plurality of light-shielding patterns. as well as A transmittance control layer on the plurality of light-shielding patterns and the light loss inducing layer, The refractive index of the light loss inducing layer is less than that of the transmittance control layer.

11. The organic light-emitting diode according to claim 10, further comprising: A cover layer on the transmittance control layer.

12. The organic light-emitting diode according to claim 10, further comprising: A light-emitting induction layer between the light loss induction layer and the transmittance control layer. The refractive index of the light-emitting inducing layer is greater than that of the light-loss inducing layer and the refractive index of the transmittance control layer.

13. An organic light-emitting diode, comprising: substrate; Anode on the substrate; A dam on the anode, the dam exposing a portion of the anode to define an emission area; An organic light-emitting layer on the emission area and the embankment; The cathode on the organic light-emitting layer; Multiple light-shielding patterns are configured to absorb light incident on the multiple light-shielding patterns, the multiple light-shielding patterns being on the cathode and overlapping the embankment but not overlapping the emission region; A light loss inducing layer is configured to reduce the emission of reflected external light. The light loss inducing layer overlaps with the emission region and is coplanar with the plurality of light-shielding patterns, such that the light loss inducing layer is disposed between a pair of light-shielding patterns in the plurality of light-shielding patterns, and the light loss inducing layer has the same thickness as the plurality of light-shielding patterns. as well as A color filter layer on the plurality of light-shielding patterns and the light-loss-inducing layer, The refractive index of the light loss inducing layer is less than that of the color filter layer.

14. The organic light-emitting diode according to claim 13, further comprising: A cover layer on the color filter layer.

15. An organic light-emitting diode, comprising: substrate; Multiple light-shielding patterns on the substrate; A light loss inducing layer is provided between the plurality of light-shielding patterns, such that the light loss inducing layer is disposed between a pair of light-shielding patterns in the plurality of light-shielding patterns; A first insulating layer is in direct contact with the first surface of the light loss inducing layer; as well as A second insulating layer is in direct contact with the second surface of the light loss inducing layer, and this second surface is farther from the substrate than the first surface of the light loss inducing layer. The refractive index of the light loss inducing layer is less than that of the first insulating layer and less than that of the second insulating layer.

16. The organic light-emitting diode according to claim 15, further comprising: A reflective anode is located between the substrate and the light loss inducing layer, and the reflective anode overlaps with the light loss inducing layer. An organic light-emitting layer between the reflective anode and the light loss inducing layer; as well as A transmission-reflection cathode between the organic light-emitting layer and the light loss-inducing layer.

17. The organic light-emitting diode according to claim 16, further comprising: A touch electrode is located between the plurality of light-shielding patterns and the transmissive-reflective cathode, the entire width of which overlaps with at least one of the plurality of light-shielding patterns.

18. The organic light-emitting diode according to claim 15, wherein, The plurality of light-shielding patterns are configured to absorb light incident on the plurality of light-shielding patterns, and the light loss inducing layer is configured to reduce the emission of reflected external light.

19. A method for manufacturing an organic light-emitting diode, comprising: An anode is formed on the substrate; A dam is formed on the anode, the dam exposing a portion of the anode to define an emission area; An organic light-emitting layer is formed on the emission area and the embankment; A cathode is formed on the organic light-emitting layer; Multiple touch electrodes are formed on the cathode; A touch protective layer is formed on the plurality of touch electrodes; as well as Multiple light-shielding patterns and a light loss inducing layer are formed on the touch protection layer. The multiple light-shielding patterns are configured to absorb light incident on the multiple light-shielding patterns, and the light loss inducing layer is configured to reduce the emission of reflected external light. The plurality of light-shielding patterns overlap with the embankment, and the light loss inducing layer overlaps with the emission area and is located on the same plane as the plurality of light-shielding patterns, such that the light loss inducing layer is disposed between a pair of light-shielding patterns among the plurality of light-shielding patterns, and the light loss inducing layer has the same thickness as the plurality of light-shielding patterns. The refractive index of the light loss inducing layer is less than that of the touch protection layer.

20. The method for manufacturing an organic light-emitting diode according to claim 19, wherein, Forming the plurality of light-shielding patterns and the light loss-inducing layer on the cathode includes: The photosensitive light-shielding material is patterned by partially exposing and developing the photosensitive light-shielding material after coating it onto the entire cathode; and After coating the photosensitive light loss inducing material onto the entire patterned photosensitive light-shielding material, the photosensitive light loss inducing material is fully exposed and developed, thereby simultaneously forming the plurality of light-shielding patterns and the light loss inducing layer.

21. The method for manufacturing an organic light-emitting diode according to claim 19, wherein, Forming the plurality of light-shielding patterns and the light loss-inducing layer on the cathode includes: After coating the entire cathode with a photosensitive light loss inducing material, the photosensitive light loss inducing material is partially exposed and developed to form an opening in the area overlapping the embankment; and After coating the photosensitive light-blocking material onto the entire photosensitive light loss inducing material having the openings formed, the photosensitive light-blocking material is fully exposed and developed, thereby forming the plurality of light-blocking patterns and the light loss inducing layer.

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