Off-axis light-emitting element and image acquisition module using the same

Abstract

The present invention provides an off-axis light-emitting element and an image extraction module using the same. The off-axis light-emitting element includes a carrier, a light-emitting chip and an optical component. The carrier has an assembly surface, and the light-emitting chip is used to generate a light beam and has a light-emitting surface. The light-emitting chip is arranged on the assembly surface. The optical component is arranged on the assembly surface and has a dome. The dome is located on the light path of the light beam and extends along a first direction to be in the shape of an elongated strip. The dome has a first reference surface, and the first reference surface is offset in a second direction relative to the geometric center of the light-emitting surface, so that the light beam passes through the dome to form an off-axis projection light. Thereby, the light field formed by the off-axis projection light is distributed asymmetrically, so that the light energy can be confined to a specific area, stray light is suppressed and the efficiency of light energy use is improved.

Description

Technical Field

[0001] The present invention relates to a light emitting element and an image capturing module using the same, and in particular to an off-axis light emitting element and an image capturing module using the same. Background Art

[0002] Light emitting diodes (LEDs) have been widely used in lighting in recent years due to their advantages of energy saving and long life. In addition, light emitting diodes (LEDs) can be used in conjunction with cameras or video cameras to increase lighting as a supplementary light source.

[0003] The bright areas projected by the existing LED light sources are all circular. Fig. 22 , showing the far-field light distribution diagram generated by multiple existing LEDs. When multiple LEDs cooperate with the camera to capture images, the brightness distribution of the image captured by the camera will be less uniform. That is, in the captured image, the brightness in the middle area (the area where the light fields of multiple LEDs overlap) is higher, while the brightness in the corner area (the area where the light fields of multiple LEDs do not overlap) is lower. If only bright areas with a specific illumination or above are used for imaging, although the brightness uniformity of the image can be improved, part of the light energy generated by the LED will be wasted and cannot be fully used.

[0004] If the LED is tilted at a specific angle in order to supplement the light field, it will not only increase the complexity of the mechanism and circuit design, but also increase the difficulty of production. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide an off-axis light emitting element and an image extraction module using the same. The off-axis light emitting element can generate off-axis projection light so that the light energy can be confined to a specific area. In this way, the image extracted by the image extraction module can have a more uniform brightness distribution, and the light use efficiency can also be improved.

[0006] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide an off-axis light-emitting element, which includes a carrier, a light-emitting chip and an optical component. The carrier has an assembly surface, and the light-emitting chip is used to generate a light beam and has a light-emitting surface. The light-emitting chip is arranged on the assembly surface. The optical component is arranged on the assembly surface and has a dome. The dome is located on the light path of the light beam and extends along a first direction to be in the shape of an elongated strip. The dome has a first reference surface passing through two opposite ends of the dome, and the first reference surface is offset in the second direction relative to the geometric center of the light-emitting surface, so that the light beam passes through the dome to form an off-axis projection light.

[0007] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide an image capture module. The image capture module includes a circuit substrate, an image sensing element and a light-emitting component. The image sensing element is arranged on the circuit substrate. The light-emitting component includes a positive axis light-emitting element and two off-axis light-emitting elements. The positive axis light-emitting element is arranged on the circuit substrate and is used to generate a positive axis projection light. The two off-axis light-emitting elements are arranged on the circuit substrate and are located around the image sensing element. The two off-axis light-emitting elements are configured to generate off-axis projection lights with two different projection directions.

[0008] The beneficial effects of the present invention are that the off-axis light-emitting element and the image capture module using the off-axis light-emitting element provided by the present invention can limit the light energy to a specific area through "the dome is located on the light path of the light beam and extends along the first direction to be in the shape of an elongated strip", "the dome has a first reference surface passing through two opposite ends of the dome, and the first reference surface is offset in the second direction relative to a geometric center of the light-emitting chip, so that the light beam passes through the dome to form an off-axis projection light" and "the light-emitting component includes a positive axis light-emitting element and two off-axis light-emitting elements, the two off-axis light-emitting elements are arranged on the circuit substrate and are located around the image sensing element. The two off-axis light-emitting elements are configured to generate off-axis projection lights in two different projection directions". In this way, the picture extracted by the image capture module can have a more uniform brightness distribution, and the light utilization efficiency can also be improved.

[0009] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic perspective exploded diagram of an off-axis light emitting element according to an embodiment of the present invention.

[0011] Figure 2 FIG. 4 is a schematic three-dimensional diagram of an off-axis light emitting element according to an embodiment of the present invention.

[0012] Figure 3 FIG. 1 is a schematic three-dimensional diagram of an off-axis light emitting element according to an embodiment of the present invention at another angle.

[0013] Figure 4 FIG. 4 is a schematic top view of an off-axis light emitting element according to an embodiment of the present invention.

[0014] Figure 5 for Figure 2 Schematic diagram of the cross section along line VV.

[0015] Figure 6 FIG. 4 is a schematic side view of an off-axis light emitting element according to an embodiment of the present invention.

[0016] Figure 7 FIG. 4 is a partial side view of an off-axis light emitting element according to another embodiment of the present invention.

[0017] Figure 8 FIG. 4 is a schematic diagram of a light beam projection of an off-axis light emitting element according to an embodiment of the present invention.

[0018] Fig. 9 FIG. 4 is a light distribution curve of an off-axis light emitting element according to an embodiment of the present invention.

[0019] Fig.10 FIG. 4 is a far-field light distribution diagram of an off-axis light-emitting element according to an embodiment of the present invention.

[0020] Fig.11 FIG. 4 is a schematic diagram of a light beam projection of an off-axis light emitting element according to another embodiment of the present invention.

[0021] Fig.12 FIG. 4 is a schematic three-dimensional diagram of an image capture module according to the first embodiment of the present invention.

[0022] Fig.13 FIG. 4 is a schematic top view of an image capture module according to a first embodiment of the present invention.

[0023] Fig.14 FIG. 4 is a functional block diagram of an image extraction module according to an embodiment of the present invention.

[0024] Fig.15 FIG. 4 is a schematic top view of an image capture module according to a second embodiment of the present invention.

[0025] Fig.16 FIG. 4 is a side view of an image capture module according to a second embodiment of the present invention.

[0026] Fig.17 FIG. 4 is a far-field light distribution diagram of the image extraction module according to the second embodiment of the present invention.

[0027] Fig.18 FIG. 4 is a schematic side view of an image capture module according to a third embodiment of the present invention.

[0028] Fig.19 FIG. 4 is a schematic top view of an image capture module according to a fourth embodiment of the present invention.

[0029] Fig. 20 FIG. 4 is a schematic top view of an image capture module according to a fifth embodiment of the present invention.

[0030] Fig.21 FIG. 4 is a schematic top view of an image capture module according to a sixth embodiment of the present invention.

[0031] Fig. 22 This is the far-field light distribution diagram generated by utilizing multiple existing LEDs. DETAILED DESCRIPTION

[0032] The following is an explanation of the implementation methods of the "off-axis light-emitting element and the image extraction module using the same" disclosed in the present invention through specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted in actual size. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0033] Please refer to Figures 1 to 3 . Figure 1 is a schematic three-dimensional exploded view of an off-axis light emitting element according to an embodiment of the present invention, Figure 2 and Figure 3 Schematic diagrams of the off-axis light emitting device at different angles according to the embodiment of the present invention. The off-axis light emitting device Z1 provided by the embodiment of the present invention can generate an asymmetric light field. Specifically, the off-axis light emitting device Z1 includes a carrier board 1 , a light emitting chip 2 and an optical element 3 .

[0034] like Figure 1 and Figure 2 As shown, the carrier 1 has an assembly surface 1a and a bottom surface 1b opposite to the assembly surface 1a. The carrier 1 also has a chip setting area R1 located on the assembly surface 1a, and the chip setting area R1 is recessed relative to the assembly surface 1a, but the present invention is not limited thereto. In another embodiment, the chip setting area R1 can also be a flat area.

[0035] Please refer to Figure 1 , the carrier 1 may include a first electrode portion 11 and a second electrode portion 12, and the first electrode portion 11 and the second electrode portion 12 are separated from each other and embedded in the carrier 1. Further, the first electrode portion 11 and the second electrode portion 12 may be separated from each other by an insulating material of the carrier 1. Figure 1 As shown in FIG. 1 , a portion of the first electrode portion 11 and a portion of the second electrode portion 12 are exposed at the bottom of the chip setting region R1. Figure 3 As shown, the first electrode portion 11 and the second electrode portion 12 are partially exposed on the bottom surface 1b of the carrier 1. The portions of the first electrode portion 11 and the second electrode portion 12 exposed on the bottom surface 1b of the carrier 1 can be used as electrical contacts so that the off-axis light-emitting element Z1 can be electrically connected to an external circuit (e.g., a circuit substrate).

[0036] Please refer to Figure 1 and Figure 2 The light emitting chip 2 is used to generate a light beam and has a light emitting surface 2a. In this embodiment, the light beam generated by the light emitting chip 2 is exemplified as infrared light. In addition, the light emitting chip 2 is disposed on the carrier 1 and is located in the chip setting area R1. In detail, the light emitting chip 2 is disposed on the portion of the first electrode portion 11 exposed in the chip setting area R1.

[0037] In this embodiment, the light emitting chip 2 is a vertical light emitting chip. That is, the two electrodes (not numbered) of the light emitting chip 2 are respectively located at the light emitting surface 2a and the bottom of the light emitting chip 2. Accordingly, when the light emitting chip 2 is disposed in the chip arrangement region R1, it can be electrically connected to the first electrode portion 11 through the electrode located at the bottom. In addition, the other electrode of the light emitting chip 2 can be electrically connected to the second electrode portion 12 exposed in the chip arrangement region R1 through the wire 4.

[0038] Please refer to Figure 1 and Figure 2 , the optical component 3 is arranged on the carrier 1 and covers the light emitting chip 2. Further, the optical component 3 of the embodiment of the present invention can be a packaging lens, which is composed of an optical material to allow the light beam generated by the light emitting chip 2 to pass through. The aforementioned optical material is, for example, polymethyl methacrylate (PMMA) or polycarbonate (PC). In one embodiment, the optical component 3 that directly covers the light emitting chip 2 and the wire 4 can be formed by a molding process. In this way, there will be basically no gap between the optical component 3 and the light emitting surface 2a of the light emitting chip 2. In another embodiment, the optical component 3 can also be formed in advance, and then the optical component 3 is arranged on the carrier 1 by optical glue to cover the light emitting chip 2.

[0039] like Figure 1 and Figure 2 As shown, the optical element 3 includes a bottom 30 and a dome 31. In this embodiment, the bottom 30 completely covers the assembly surface 1a of the carrier 1, but the present invention is not limited thereto. In another embodiment, the bottom 30 may only cover a partial area of ​​the assembly surface 1a, such as the chip setting area R1.

[0040] The dome 31 protrudes from the bottom 30, extends along the first direction D1 and is in the shape of a long strip, and is located on the light path of the light beam generated by the light emitting chip 2. In detail, the dome 31 of the present embodiment includes two side end surfaces 310 and a column 311 connected between the two side end surfaces 310. In the present embodiment, the cross-sectional width of the column 311 in the second direction D2 is consistent from one side end surface 310 to the other side end surface 310. In addition, the column 311 has an arc-shaped light-emitting surface 311S. In some embodiments, the radius of curvature of the arc-shaped light-emitting surface 311S in the second direction D2 is between 0.35 mm and 2.5 mm. In a preferred embodiment, the radius of curvature of the arc-shaped light-emitting surface 311S in the second direction D2 is 1.37 mm.

[0041] Please refer to Figure 4 as well as Figure 5 , respectively, are a top view and a cross-sectional view of an off-axis light emitting element according to an embodiment of the present invention. A first reference plane PA is first defined, which is equivalent to the cross section corresponding to the long axis centerline of the dome 31. The first reference plane PA extends along the first direction D1 and passes through the two side end surfaces 310 of the dome 31, and is perpendicular to the assembly surface 1a. In this embodiment, the shapes of the dome 31 on both sides of the first reference plane PA are roughly symmetrical.

[0042] like Figure 4 As shown, in this embodiment, the first reference plane PA is offset relative to the geometric center C2 of the light emitting chip 2 in the second direction D2, so that the light beam forms an off-axis projection light through the dome 31. In other words, by offsetting the first reference plane PA of the dome 31 from the geometric center C2 of the light emitting chip 2, most of the light beam generated by the light emitting chip 2 will be guided to one side of the first reference plane PA after passing through the arc-shaped light emitting surface 311S, and deviate from the optical axis of the optical element 3.

[0043] Specifically, the first reference plane PA of the dome 31 has a relative offset distance a3 relative to the geometric center C2 of the light emitting chip 2 in the second direction D2. It should be noted that in this embodiment, the assembly surface 1a of the carrier 1 has a first length L1 in the first direction D1 and a second length L2 in the second direction D2. In one embodiment, the ratio of the relative offset distance a3 to the second length L2 is less than 0.6, but not 0, so as to suppress stray light of the light field distribution of the off-axis projection light. In addition, please refer to Figure 5 , the dome 31 has a width W in the second direction D2. In some embodiments, the ratio of the relative offset distance a3 to the width W of the dome 31 in the second direction D2 is less than 0.8, but cannot be zero.

[0044] Please refer to Figure 4In this embodiment, the first reference plane PA and the geometric center C1 of the assembly surface 1a may be offset from each other in the second direction D2. That is, the first reference plane PA of the dome 31 may not be aligned with the geometric center C1 of the assembly surface 1a, but the present invention is not limited thereto. Accordingly, in one embodiment, the ratio of the first offset distance a1 between the first reference plane PA and the geometric center C1 of the assembly surface 1a in the second direction D2 to the second length L2 ranges from 0 to 0.3.

[0045] In addition, in this embodiment, the light emitting chip 2 may be offset relative to the geometric center C1 of the assembly surface 1a. In other words, the light emitting chip 2 may not be disposed in the center of the carrier 1, and the geometric center C2 of the light emitting chip 2 may be offset from the geometric center C1 of the assembly surface 1a in the second direction D2, but the present invention is not limited thereto. In one embodiment, the geometric center C2 of the light emitting chip 2 may have a second offset distance a2 from the geometric center C1 of the assembly surface 1a in the second direction D2, and the ratio of the second offset distance a2 to the second length L2 of the assembly surface 1a ranges from 0 to 0.3.

[0046] Based on the above, in the present invention, the geometric center C2 of the light-emitting chip 2 and the first reference plane PA of the dome 31 must be misaligned with each other to achieve the effect of off-axis emission of the light beam. However, only one of the geometric center C2 of the light-emitting chip 2 and the first reference plane PA of the dome 31 can be offset relative to the geometric center C1 of the assembly surface 1a, while the other is aligned with the geometric center C1 of the assembly surface 1a.

[0047] exist Figure 4 In the embodiment of FIG. 1 , the light emitting chip 2 and the dome 31 are both offset relative to the geometric center C1 of the assembly surface 1a. However, the light emitting chip 2 and the dome 31 are offset in opposite directions relative to the geometric center C1 of the assembly surface 1a. In this way, the aforementioned relative offset distance a3 can be made large enough to meet the condition of generating off-axis projection light without increasing the size of the carrier 1.

[0048] Further, the assembly surface 1a has a first side edge E1 and a second side edge E2 extending along the first direction D1 and respectively located at two opposite sides of the carrier 1. In this embodiment, the first reference plane PA is closer to the first side edge E1 and farther from the second side edge E2. In addition, the light-emitting chip 2 is closer to the second side edge E2 and farther from the first side edge E1. Accordingly, the first offset distance a1 between the first reference plane PA and the geometric center C1 of the assembly surface 1a in the second direction D2 is smaller than the relative offset distance a3.

[0049] In addition, if Figure 4As shown, the arc-shaped light-emitting surface 311S of the dome 31 can be divided into a first area 311Sa and a second area 311Sb by the first reference plane PA, and the light-emitting chip 2 is disposed directly below the first area 311Sa. In other words, the vertical projection of the first area 311Sa on the assembly surface 1a overlaps with the light-emitting chip 2, while the vertical projection of the second area 311Sb on the assembly surface 1a does not overlap with the light-emitting chip 2 at all.

[0050] However, in other embodiments, when the geometric center C2 of the light emitting chip 2 overlaps with the geometric center of the assembly surface 1a, but is offset from the first reference plane PA of the dome 31, the vertical projection of the second area 311Sb on the assembly surface 1a may also partially overlap the light emitting chip 2. Based on the above, the vertical projection of the second area 311Sb of the arc-shaped light emitting surface 311S on the assembly surface 1a only partially overlaps with the light emitting chip 2 or does not overlap at all.

[0051] Also, please refer to Figure 5 , the dome 31 has a height H relative to the bottom 30. The ratio between the height H of the dome 31 and the width W of the dome 31 in the second direction D2 affects the light shape of the off-axis light emitting element Z1. In one embodiment, the aspect ratio (height H: width W) of the dome 31 is 1:1 to 1:3, preferably 1:2. That is, the ratio between the height H of the dome 31 and the width W of the dome 31 in the second direction D2 can range from 0.3 to 1. When the ratio between the height H of the dome 31 and the width W of the dome 31 in the second direction D2 is too large (H>W), the radius of curvature of the arc-shaped light-emitting surface 311S in the second direction D2 becomes smaller, resulting in the light shape of the off-axis light emitting element Z1 being too concentrated. In addition, when the ratio between the height H of the dome 31 and the width W of the dome 31 in the second direction D2 is too small, the radius of curvature of the arc-shaped light-emitting surface 311S in the second direction D2 becomes larger, resulting in the light shape of the off-axis light emitting element Z1 being too divergent.

[0052] like Figure 5 As shown, in this embodiment, the depth d1 of the chip placement area R1 is less than or equal to the height h of the light emitting chip 2 to avoid affecting the light path of the light beam generated by the light emitting chip 2 and increasing stray light.

[0053] Please refer to Figure 6 , which is a side view schematic diagram of an off-axis light emitting element according to an embodiment of the present invention. A second reference plane PB is defined, and the second reference plane PB crosses the column 311 of the dome 31, but does not pass through the two side end surfaces 310 of the dome 31. Further, the second reference plane PB is parallel to the plane defined by the second direction D2 and the height direction of the dome 31. In this embodiment, the shape of the dome 31 on both sides of the second reference plane PB is substantially symmetrical.

[0054] The arc-shaped light-emitting surface 311S has a top axis 311L passing through its highest point, and the top axis 311L extends along the first direction D1. In addition, the radius of curvature of the top axis 311L in the first direction D1 is greater than 10 mm, and can even be infinite. In other words, the top axis 311L can be a straight line. When the arc-shaped light-emitting surface 311S has a radius of curvature greater than 10 mm, or even a straight top axis 311L, when observed from the direction facing the first reference plane PA, the light beam generated by the light-emitting chip 2 will not be deflected toward the second reference plane PB and converged when passing through the top axis 311L. Therefore, the light field of the off-axis projected light can be expanded in the first direction D1.

[0055] In addition, a reference plane PR is defined which passes through the highest point of one side end surface 310 and the geometric center C1 of the assembly surface 1a. It is worth mentioning that the angle γ between the reference plane PR and the second reference plane PB is smaller than a total reflection angle of the dome 31. In this way, the total internal reflection of the light beam of the light-emitting chip 2 in the dome 31 can be reduced, thereby reducing the light output intensity. For example, assuming that the refractive index of the material constituting the dome 31 is 1.54, and the critical angle for the total internal reflection of the light beam in the dome 31 is 40.5 degrees, then the angle γ between the aforementioned reference plane PR and the second reference plane PB will be less than 40.5 degrees to avoid reducing the light output intensity, but the present invention is not limited thereto. In other embodiments, when the material constituting the dome 31 is changed and has a different refractive index, the angle γ between the aforementioned reference plane PR and the second reference plane PB will also be adjusted accordingly.

[0056] In addition, please refer to Figure 6 In this embodiment, the side surface 310 of the dome 31 has a first inclined portion 310a and a second inclined portion 310b, and the first inclined portion 310a surrounds the second inclined portion 310b. Further, the first inclined portion 310a is connected between the arc-shaped light-emitting surface 311S and the second inclined portion 310b. The first inclined portion 310a is inclined relative to a vertical reference plane to form a first acute angle θ1. The aforementioned vertical reference plane extends along the second direction D2 and is perpendicular to the carrier 1. In addition, a second acute angle θ2 is formed between the second inclined portion 310b and the vertical reference plane, and the first acute angle θ1 is greater than the second acute angle θ2.

[0057] Furthermore, in the embodiment of the present invention, the two side end surfaces 310 of the dome 31 can also assist in adjusting the light pattern. When a portion of the light beam generated by the light emitting chip 2 is emitted through the first inclined portion 310a, it can be refracted into a specific range. In other words, the two side end surfaces 310 can concentrate the light beam into a specific area as much as possible, thereby suppressing the generation of stray light.

[0058] The first acute angle θ1 can be 0 to 20 degrees, which can be adjusted according to the size of the light-emitting chip 2. The second acute angle θ2 can be 0 to 8 degrees, which can reduce the length of the dome 31 in the first direction D1 to minimize the overall size of the off-axis light-emitting element Z1. In this embodiment, the highest point of the second inclined portion 310b has a height H1 relative to the bottom 30, and the height H1 is 0.3 to 0.5 times the height H of the optical element 3. In this way, most of the light beam projected onto the side end surface 310 can be emitted by the first inclined portion 310a, thereby improving the light collection effect.

[0059] However, the present invention is not limited to this example. Without considering the size of the off-axis light emitting element Z1, the side end surface 310 of the dome portion 31 may also have only one inclined portion. Figure 7 In the present embodiment, an acute angle θ is formed between the inclined portion and a vertical reference plane perpendicular to the carrier 1, and the range of the acute angle θ can be the same as the aforementioned first acute angle θ1, that is, from 0 to 20 degrees, so as to achieve the effect of converging and concentrating the light beam and suppressing the generation of stray light.

[0060] Please refer to Figures 8 to 10 . Figure 8 is a schematic diagram of light beam projection of an off-axis light emitting element according to an embodiment of the present invention, Fig. 9 and Fig.10 Display separately Figure 8 By offsetting the first reference plane PA of the dome 31 relative to the geometric center C2 of the light emitting chip 2, the off-axis projection light F1 generated by the off-axis light emitting element Z1 provided in the embodiment of the present invention will deviate from the first reference plane PA and concentrate on one side of the first reference plane PA.

[0061] Furthermore, if Figure 8 As shown, most of the light beams generated by the light emitting chip 2 are emitted from the second area 311Sb of the arc-shaped light emitting surface 311S. Fig. 9 , defines a vertical axis perpendicular to the assembly surface 1a and passing through the geometric center C1. Curve X1 represents the radiant intensity of the off-axis light-emitting element Z1 measured at various angles between the vertical axis and the line XX', and curve Y1 represents the radiant intensity measured at various angles between the vertical axis and the line YY'. Fig. 9 The radiation intensity in has been normalized. In this embodiment, the vertical axis is defined as 0 degrees, the angle formed between the vertical axis and the line C1-X' is a positive angle, and the angle formed between the vertical axis and C1-X is a negative angle. Similarly, the angle formed between the vertical axis and the line C1-Y' is defined as a positive angle, and the angle formed between the vertical axis and C1-Y is defined as a negative angle.

[0062] like Fig. 9 As shown in the curve X1, the radiation intensity is relatively large at the position with an angle of -50 to -70 degrees relative to the vertical axis (located above the second area 311Sb of the arc-shaped light-emitting surface 311S). At the position with an angle of +20 to +60 degrees relative to the vertical axis (located above the first area 311Sa of the arc-shaped light-emitting surface 311S), the measured radiation intensity does not exceed 50% of the maximum radiation intensity.

[0063] like Fig. 9 As shown in the curve Y1, the light energy distribution between the vertical axis and the line YY' is relatively symmetrical, but since the off-axis projection light F1 is concentrated above the second area 311Sb, there is a relatively high radiation intensity only at the position with an angle of -40 degrees to +40 degrees relative to the vertical axis.

[0064] Please refer to Fig.10 The off-axis projection light F1 is projected onto a reference plane to form an asymmetric light field distribution area. The reference plane is parallel to the assembly surface 1a and is separated from the off-axis light emitting element Z1 by a predetermined distance. Fig.10 As shown, the angle of the longitudinal axis is relative to the vertical axis Figure 8 The angle of inclination of the line Y-Y' is the angle of the horizontal axis relative to the vertical axis. Figure 8 The angle at which the line X-X' is inclined. Fig.10 The asymmetric light field distribution area presented covers a range of 140 degrees * 80 degrees. In the asymmetric light field distribution area, the area where the radiation intensity exceeds 50% of the maximum radiation intensity is concentrated on one side of the reference plane and away from the middle area of ​​the reference plane. Fig.10 As shown, in this embodiment, the light intensity of the asymmetric light field distribution area increases gradually from one side of the reference plane to the other side (ie, from the direction of X' to X).

[0065] Based on the above, the off-axis light emitting element Z1 provided in the embodiment of the present invention can indeed generate an asymmetric light field distribution area and can be applied to specific fields. Fig. 9 and Fig.10 In the asymmetric light field distribution area generated by the off-axis light emitting element Z1 provided in the embodiment of the present invention, no excessive stray light is generated.

[0066] Please refer to Fig.11, which is a schematic diagram of the light beam projection of an off-axis light-emitting element of another embodiment of the present invention. The same elements as those in the previous embodiment have the same reference numerals, and the same parts are not repeated. In the off-axis light-emitting element Z1' of the present embodiment, the first reference plane PA is offset in a second direction relative to a geometric center C2 of the light-emitting chip 2. However, in the present embodiment, the geometric center C2 of the light-emitting chip 2 coincides with the geometric center C1 of the assembly surface 1a. In the present embodiment, the vertical projection of the second area 311Sb of the arc-shaped light-emitting surface 311S on the assembly surface 1a partially overlaps the light-emitting chip 2. However, the overlapping area between the vertical projection of the second area 311Sb on the assembly surface 1a and the light-emitting chip 2 is smaller than the overlapping area between the vertical projection of the first area 311Sa on the assembly surface 1a and the light-emitting chip 2.

[0067] Please refer to Fig.12 , which is a three-dimensional schematic diagram of an image capture module according to a first embodiment of the present invention. The image capture module M1 includes a circuit substrate M10, an image sensing element M11 and a light emitting component MA.

[0068] The image sensing element M11 is disposed on the circuit substrate M10 to capture an image. The image sensing element M11 is, for example, a camera lens, which may include components such as a lens, a circuit board, a fixture, a filter, a sensor, and a data processor.

[0069] The light emitting element MA is also disposed on the circuit substrate M10 to cooperate with the image sensing element M11 to operate. Specifically, the light emitting element MA may include at least one positive-axis light emitting element M12 and at least two off-axis light emitting elements M13 and M14.

[0070] The positive-axis light emitting element M12 is used to generate a positive-axis projection light. The off-axis light emitting elements M13 and M14 can be Figure 2 or Fig.11 The off-axis light emitting elements Z1, Z1' are shown to generate off-axis projection light F1. In this embodiment, the structure of each off-axis light emitting element M13, M14 is the same as Figure 2 The structure of the off-axis light emitting element Z1 shown is the same, so it will not be described in detail.

[0071] In this embodiment, the positive axis projection light and the two off-axis projection lights F1 are exemplified as infrared light. The positive axis light emitting element M12 and the two off-axis light emitting elements M13, M14 can be arranged around the image sensing element M11 according to actual needs. It is worth mentioning that the two off-axis light emitting elements M13, M14 are configured so that the off-axis projection lights F1 generated by them have different projection directions A1, A2.

[0072] For details, please refer to Fig.13, is a top view schematic diagram of the image capture module of the first embodiment of the present invention. The projection direction A1 of the off-axis projection light F1 generated by one off-axis light emitting element M13 is different from the projection direction A2 of the off-axis projection light F1 generated by another off-axis light emitting element M14. Further, an angle α is formed between the projection direction A1 and the projection direction A2. The angle α can be changed according to the light type required by the customer and the number of off-axis light emitting elements.

[0073] By configuring two off-axis light-emitting elements M13 and M14 to generate off-axis projection light F1 with different projection directions A1 and A2, and then cooperating with the on-axis projection light generated by the on-axis light-emitting element M12, the uniformity of the far-field light distribution can be improved. Accordingly, when the light-emitting component MA assists the image sensing element M11 in extracting an image, the uneven distribution of light intensity in the picture can be avoided. In other words, the off-axis projection light F1 generated by the two off-axis light-emitting elements M13 and M14 can make up for the area that the on-axis projection light cannot illuminate. In this way, in addition to improving the brightness uniformity of the image, the light energy utilization efficiency of the light-emitting component MA can also be improved.

[0074] Please refer to Fig.14 , which is a functional block diagram of the image capture module of the embodiment of the present invention. The image capture module M1 of the embodiment of the present invention may also include a processing unit M15, which is electrically connected to the image sensing element M11 and the light emitting component MA. It should be noted that a circuit (not shown) is provided in the circuit substrate M10 so that each component disposed on the circuit substrate M10 can be electrically connected to the processing unit.

[0075] The image captured by the image sensing element M11 can be transmitted to the processing unit M15 for processing and outputting the image. In addition, the processing unit M15 is electrically connected to the positive axis light emitting element M12 and the two off-axis light emitting elements M13 and M14 to individually control the on and off of the positive axis light emitting element M12 and the two off-axis light emitting elements Z1. Accordingly, the light source light type generated by the light emitting component MA can be controlled and adjusted according to actual needs.

[0076] For example, when the two off-axis light-emitting elements M13, M14 and the positive-axis light-emitting element M12 are turned on, the light source generated by the light-emitting component MA can generate a uniformly distributed light field after being projected onto a reference plane. In addition, when the positive-axis light-emitting element M12 and one of the off-axis light-emitting elements M13 are turned off by the processing unit M15, and only the other off-axis light-emitting element M14 is turned on, after the light source generated by the light-emitting component MA is projected onto the reference plane, only the area within the projection range of the off-axis projection light F1 corresponding to the off-axis light-emitting element M14 will have a higher brightness. Accordingly, it is allowed to turn on only a portion of the light-emitting elements in the light-emitting component MA for a specific area to be illuminated, which can save energy.

[0077] Please refer to Fig.15 as well as Fig.16 , which are respectively a top view and a side view of the image extraction module of the second embodiment of the present invention. The components of the image extraction module M2 of this embodiment that are the same as those of the image extraction module M1 of the previous embodiment have the same reference numerals and are not repeated here. In this embodiment, the two off-axis light-emitting elements Z1 are configured so that the two off-axis projection lights F1 have completely opposite projection directions A1 and A2. That is, in this embodiment, the angle α between the projection directions A1 and A2 is 180 degrees.

[0078] Please refer to Fig.16 In this embodiment, in any off-axis light emitting element M13, M14, the arc-shaped light emitting surface 311S is divided into a first area 311Sa and a second area 311Sb by the first reference plane PA, and the light emitting chip 2 is disposed below the first area 311Sa. In this embodiment, the two off-axis light emitting elements M13, M14 are disposed opposite to each other with their first areas 311Sa, so that the off-axis projection light F1 generated by the off-axis light emitting elements M13, M14 has opposite projection directions A1, A2.

[0079] In addition, the positive axis projection light F2 generated by the positive axis light emitting element M12 is projected in a direction away from the circuit substrate M10. The two off-axis projection lights F1 cooperate with the positive axis projection light F2. Fig.17 , which is a far-field light distribution diagram of the image extraction module of the second embodiment of the present invention. The light field distribution formed by the light source generated by the light emitting component MA on the reference plane is more uniform. It should be noted that Fig.17 In the figure, the radiation intensity values ​​marked in each area have been standardized. Fig.17 As shown, further, when actually testing the far-field light distribution of the light source of the light-emitting assembly MA, the difference percentage between the radiation intensity value in the middle area (99.3%) and the radiation intensity value in the corner area (82.6% to 82.8%) may be less than 20%.

[0080] However, the present invention is not limited to this example. Fig.18 , which is a side view schematic diagram of the image capture module of the third embodiment of the present invention. The components of the image capture module M3 of this embodiment that are the same as those of the image capture module M1 of the previous embodiment have the same reference numerals and are not described in detail. In this embodiment, the two off-axis light emitting elements Z1 are configured to make the two off-axis projection lights F1 have completely opposite projection directions A1, A2.

[0081] However, in this embodiment, the two off-axis light emitting elements M13, M14 are disposed with their second regions 311Sb facing each other, so that the off-axis projection light F1 generated by the off-axis light emitting elements M13, M14 has opposite projection directions A1, A2. In other words, the two off-axis light emitting elements M13, M14 are disposed with their two first regions 311Sa facing away from each other.

[0082] It should be noted that, despite the exchange of the configuration orientations of the two off-axis light emitting elements M13 and M14, compared with the light emitting components used in existing cameras, the light field distribution formed by the light source generated by the light emitting component MA provided in the embodiment of the present invention on the reference plane is more uniform.

[0083] Please refer to Fig.19 , Fig.19 It is a top view schematic diagram of the image extraction module of the fourth embodiment of the present invention. The light-emitting assembly MA includes a positive-axis light-emitting element M12 and a plurality of off-axis light-emitting elements M13, M14. In the light-emitting element MA of the present embodiment, four off-axis light-emitting elements M13, M14 that project in different directions are used, but the present invention is not limited to this. It should be noted that the number of the plurality of off-axis light-emitting elements M13, M14 is greater than or equal to 2, and can be an odd number or an even number. In other words, the number of the plurality of off-axis light-emitting elements M13, M14 can be 2n or 2n+1, where n≧1.

[0084] In addition, in this embodiment, the angle α between the projection directions A1 and A2 of any two adjacent off-axis light emitting elements M13 and M14 is 90 degrees, but the present invention is not limited thereto. Fig. 20 and Fig.21 , which are top views of the image capture modules of the fifth and sixth embodiments of the present invention respectively. Fig. 20 In the embodiment shown, the angle α between the projection directions A1 and A2 of any two adjacent off-axis light emitting elements M13 and M14 is 60 degrees. Fig.21 In the illustrated embodiment, the angle α between the projection directions A1 , A2 of any two adjacent off-axis light emitting elements M13 , M14 is 45 degrees.

[0085] Accordingly, as long as the angle between the projection directions A1 and A2 of two of the plurality of off-axis light emitting elements M13 and M14 is 180 degrees, the present invention does not limit the configuration orientations of the other off-axis light emitting elements M13 and M14.

[0086] [Beneficial Effects of Embodiments]

[0087] The beneficial effects of the present invention are that the off-axis light-emitting element and the image extraction module using the off-axis light-emitting element provided by the present invention can limit the light energy to a specific area by virtue of "the dome 31 being located on the light path of the light beam and extending along the first direction D1 to be in the shape of an elongated strip" and "the dome 31 having a first reference surface PA passing through two opposite ends of the dome 31, and the first reference surface PA being offset in the second direction D2 relative to a geometric center of the light-emitting chip 2, so that the light beam passes through the dome 31 to form an off-axis projection light F1".

[0088] In addition, in the image extraction module M1-M3 of the embodiment of the present invention, by "the light-emitting component MA includes a positive-axis light-emitting element M12 and two off-axis light-emitting elements M13, M14, the two off-axis light-emitting elements M13, M14 are arranged on the circuit substrate M10, and are located around the image sensing element M11. The two off-axis light-emitting elements M13, M14 are configured to generate off-axis projection light F1 with two different projection directions", the picture extracted by the image extraction module M1 can have a more uniform brightness distribution, and the light utilization efficiency can also be improved.

[0089] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. An off-axis light emitting element, It is characterized in that The off-axis light emitting element comprises: A carrier having an assembly surface; a light emitting chip disposed on the assembly surface and used to generate a light beam; and an optical component, which is disposed on the assembly surface and has a dome, wherein the dome is located on the light path of the light beam and extends along a first direction to be in a long strip shape, and the dome has a first reference surface passing through two opposite ends of the dome, and the first reference surface is offset in a second direction relative to a geometric center of the light emitting chip, so that the light beam passes through the dome to form an off-axis projection light; The first reference plane is parallel to the first direction and perpendicular to the second direction, the dome includes a first area and a second area, a radiation intensity in a first measurement area located above the first area is lower than a radiation intensity in a second measurement area located above the second area, and the light emitting chip is located below the first area and not below the second area; The first reference plane is equivalent to the cross section corresponding to the long axis center line of the dome, and the dome is symmetrical in shape on both sides of the first reference plane.

2. The off-axis light emitting element according to claim 1, It is characterized in that One of the geometric center of the light-emitting chip and the first reference plane is offset relative to the geometric center of the assembly surface, and the other is aligned with the geometric center of the assembly surface.

3. The off-axis light emitting element according to claim 1, It is characterized in that The assembly surface has a first length and a second length in the first direction and the second direction respectively, and there is a first offset distance between the first reference surface and the geometric center of the assembly surface in the second direction, and the ratio of the first offset distance to the second length ranges from 0 to 0.

3.

4. The off-axis light emitting element according to claim 1, It is characterized in that The assembly surface has a first length and a second length in the first direction and the second direction respectively, and the geometric center of the light-emitting chip has a second offset distance between the geometric center of the assembly surface in the second direction, and the ratio of the second offset distance to the second length of the assembly surface ranges from 0 to 0.

3.

5. The off-axis light emitting element according to claim 1, It is characterized in that The first reference surface has a relative offset distance from the geometric center of the light emitting chip in the second direction, and a ratio of the relative offset distance to a width of the dome in the second direction is less than 0.8 but not equal to 0.

6. The off-axis light emitting element according to claim 1, It is characterized in that The first reference surface has a relative offset distance from the geometric center of the light-emitting chip in the second direction, and the first reference surface has a first offset distance from the geometric center of the assembly surface in the second direction, and the first offset distance is smaller than the relative offset distance.

7. The off-axis light emitting element according to claim 1, It is characterized in that One end surface of the dome portion has an inclined portion, and an acute angle is formed between the inclined portion and a vertical reference plane perpendicular to the carrier plate, and the acute angle is 0 to 25 degrees.

8. The off-axis light emitting element according to claim 1, It is characterized in that One side end surface of the dome has a first inclined portion and a second inclined portion, the first inclined portion surrounds the second inclined portion, a first acute angle is formed between the first inclined portion and a vertical reference plane perpendicular to the carrier, a second acute angle is formed between the second inclined portion and the vertical reference plane, and the first acute angle is greater than the second acute angle.

9. The off-axis light emitting element according to claim 8, It is characterized in that The optical member further has a bottom, and the highest point of the second inclined portion has a height relative to the bottom, and the height is 0.3 to 0.5 times the height of the optical member.

10. The off-axis light emitting element according to claim 1, It is characterized in that The dome has an arc-shaped light-emitting surface, and the arc-shaped light-emitting surface has a top axis passing through its highest point. The top axis extends along the first direction and is a straight line or has a curvature radius equal to or greater than 10 mm in the first direction.

11. The off-axis light emitting element according to claim 1, It is characterized in that The dome portion has an arc-shaped light-emitting surface, and the arc-shaped light-emitting surface is divided into a first area and a second area by a first reference surface of the dome portion.

12. The off-axis light emitting element according to claim 1, It is characterized in that The dome has two opposite side end surfaces, and the dome has a second reference plane parallel to the second direction, wherein a reference plane passing through the highest point of one of the side end surfaces and the geometric center of the assembly surface is defined, and the angle between the reference plane and the second reference plane is smaller than a total reflection angle of the dome.

13. The off-axis light emitting element according to claim 1, It is characterized in that The assembly surface has a first side edge and a second side edge extending along the first direction and respectively located at two opposite sides of the carrier board. The first reference surface is closer to the first side edge and farther from the second side edge.

14. The off-axis light emitting element according to claim 1, It is characterized in that The dome portion has two opposite side end surfaces and a column connected between the two side end surfaces, and a width of the column in the second direction is consistent from one of the side end surfaces to the other side end surface.

15. The off-axis light emitting element according to claim 1, It is characterized in that The aspect ratio of the dome is 1:1 to 1:3.

Images