Display device and method of manufacturing the same

Abstract

A display device and its manufacturing method are disclosed. The display device includes a flexible circuit substrate, a plurality of light-emitting elements, a first encapsulation layer, a second encapsulation layer, a first stretchable protective film, and a second stretchable protective film. The flexible circuit substrate has a plurality of through-holes. The plurality of light-emitting elements are disposed on and electrically connected to the flexible circuit substrate. The first encapsulation layer fills the plurality of through-holes in the flexible circuit substrate. The second encapsulation layer covers the plurality of light-emitting elements and the first encapsulation layer. The first stretchable protective film is disposed on the surface of the flexible circuit substrate and at least a portion of the first encapsulation layer. The second stretchable protective film is disposed on the second encapsulation layer.

Description

Technical Field

[0001] This invention relates to an optoelectronic device and a method for manufacturing the same, and more particularly to a display device and a method for manufacturing the same. Background Technology

[0002] With the rapid development of display technology, display products are constantly being innovated. To enable display products to be applied in various fields, the characteristics of stretchability, thinness, and unrestricted shape are increasingly valued. In other words, display products are increasingly required to have different shapes depending on different applications and environments; therefore, display products need to be stretchable.

[0003] Generally, in the manufacturing process of stretchable display products, a flexible circuit board is first formed on a rigid substrate. Then, light-emitting elements are formed on the flexible circuit board and covered with an encapsulation layer. However, the encapsulation layer covering the light-emitting elements fills the through-holes of the flexible circuit board and sticks to the rigid substrate, making it difficult to separate the flexible circuit board from the rigid substrate and affecting the yield of stretchable display products. Summary of the Invention

[0004] The present invention provides a method for manufacturing a display device, which enables the main structure to be easily removed from a rigid substrate, thereby improving the yield of the display device.

[0005] This invention provides a display device with excellent performance.

[0006] This invention provides another display device with superior performance.

[0007] The manufacturing method of the display device of the present invention includes the following steps: providing a rigid substrate; forming a flexible circuit substrate on the rigid substrate, wherein the flexible circuit substrate has a plurality of through holes exposing the rigid substrate; transferring a plurality of light-emitting elements onto the flexible circuit substrate and electrically connecting them to the flexible circuit substrate; forming a first encapsulation layer, wherein the first encapsulation layer fills the plurality of through holes of the flexible circuit substrate to contact the rigid substrate; forming a second encapsulation layer to cover the plurality of light-emitting elements and the first encapsulation layer, wherein the adhesion of the first encapsulation layer to the rigid substrate is lower than the adhesion of the second encapsulation layer to the rigid substrate, and the flexible circuit substrate, the plurality of light-emitting elements, the first encapsulation layer and the second encapsulation layer form a main structure; separating the main structure from the rigid substrate to expose the surface of the flexible circuit substrate and at least a portion of the first encapsulation layer disposed in the plurality of through holes of the flexible circuit substrate; forming a first stretchable protective film on the surface of the flexible circuit substrate and at least a portion of the first encapsulation layer; and forming a second stretchable protective film on the second encapsulation layer.

[0008] A display device according to an embodiment of the present invention includes a flexible circuit substrate, a plurality of light-emitting elements, a first encapsulation layer, a second encapsulation layer, a first stretchable protective film, and a second stretchable protective film. The flexible circuit substrate has a plurality of through-holes. The plurality of light-emitting elements are disposed on and electrically connected to the flexible circuit substrate. The first encapsulation layer fills the plurality of through-holes in the flexible circuit substrate. The second encapsulation layer covers the plurality of light-emitting elements and the first encapsulation layer. The adhesion of the first encapsulation layer to a rigid substrate is lower than the adhesion of the second encapsulation layer to a rigid substrate. The first stretchable protective film is disposed on the surface of the flexible circuit substrate and at least a portion of the first encapsulation layer. The second stretchable protective film is disposed on the second encapsulation layer.

[0009] A display device according to an embodiment of the present invention includes a flexible circuit substrate, a plurality of light-emitting elements, a first encapsulation layer, a second encapsulation layer, a first stretchable protective film, and a second stretchable protective film. The flexible circuit substrate has a plurality of through-holes. The plurality of light-emitting elements are disposed on and electrically connected to the flexible circuit substrate. The first encapsulation layer fills the plurality of through-holes in the flexible circuit substrate. The second encapsulation layer covers the plurality of light-emitting elements and the first encapsulation layer. The light transmittance of the first encapsulation layer is lower than that of the second encapsulation layer. The first stretchable protective film is disposed on the surface of the flexible circuit substrate and at least a portion of the first encapsulation layer. The second stretchable protective film is disposed on the second encapsulation layer. Attached Figure Description

[0010] Figures 1A to 1G This is a cross-sectional schematic diagram of the manufacturing process of a display device according to an embodiment of the present invention.

[0011] Figure 2 This is a top view of a flexible circuit board according to an embodiment of the present invention.

[0012] Figure 3 The first encapsulation layer of an embodiment of the present invention is shown.

[0013] Figure 4 The encapsulation structure of the first encapsulation layer according to an embodiment of the present invention is shown.

[0014] Figure 5 The relationship between the displacement of the first encapsulation layer and the peel force between the first encapsulation layer and the rigid substrate is shown, as well as the relationship between the displacement of the second encapsulation layer and the peel force between the second encapsulation layer and the rigid substrate.

[0015] Figure 6 The encapsulation structure of the first encapsulation layer according to another embodiment of the present invention is shown.

[0016] Figures 7A to 7E This is a cross-sectional schematic diagram of the manufacturing process of a display device according to another embodiment of the present invention.

[0017] Figure 8 This is a cross-sectional schematic diagram of a display device according to another embodiment of the present invention.

[0018] Figure 9 This is a cross-sectional schematic diagram of a display device according to another embodiment of the present invention.

[0019] Explanation of reference numerals in the attached figures:

[0020] 10, 10B, 10C, 10D: Display devices

[0021] 110: Rigid substrate

[0022] 112: First Surface

[0023] 114: Second Surface

[0024] 120: Flexible circuit board

[0025] 120a: Through hole

[0026] 120a-1: First through hole

[0027] 120a-2: Second through hole

[0028] 120s: Surface

[0029] 122: Flexible substrate

[0030] 122b: Bridge

[0031] 122i: Island

[0032] 124: Drive circuit layer

[0033] 130, 130B: First encapsulation layer

[0034] 130': First encapsulation material

[0035] 130'-1: Part 1

[0036] 130'-2: Part Two

[0037] 132, 132A: Package structure

[0038] 132-1: First package structure

[0039] 132-2: Second Packaging Structure

[0040] 140: Light-emitting element

[0041] 150: Second encapsulation layer

[0042] 160: First stretchable protective film

[0043] 170: Second stretchable protective film

[0044] 180: Color Filter Pattern

[0045] 190: Light-blocking pattern layer

[0046] D1: Direction of first through hole extension

[0047] D2: Direction of the second through hole extension

[0048] H: Height

[0049] L: Curing beam

[0050] l: wire

[0051] OC-1, OC-2: Curves

[0052] PC: Pixel driving circuit

[0053] S: Main Structure

[0054] SPC: Subpixel driving circuit

[0055] W: Width

[0056] x: First direction

[0057] y: Second direction

[0058] z: Third-party direction Detailed Implementation

[0059] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0060] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or an intermediate element may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate element is present. As used herein, "connection" can refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may involve the presence of other elements between the two elements.

[0061] As used herein, “about,” “approximately,” or “substantially” includes the value and the average value within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurement under discussion and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the use of “about,” “approximately,” or “substantially” herein may be chosen based on the optical, etched, or other properties to select a more acceptable range of deviations or standard deviations, and may not require a single standard deviation to apply to all properties.

[0062] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and this invention, and will not be interpreted as having idealized or overly formal meanings unless expressly defined herein.

[0063] Figures 1A to 1G This is a cross-sectional schematic diagram of the manufacturing process of a display device according to an embodiment of the present invention. Figure 2 This is a top view of a flexible circuit board according to an embodiment of the present invention.

[0064] Please refer to Figure 1A First, a rigid substrate 110 is provided. In this embodiment, the rigid substrate 110 is light-transmitting. For example, in this embodiment, the rigid substrate 110 may be made of glass, quartz, or other suitable materials. However, the invention is not limited thereto, and in other embodiments, the rigid substrate 110 may be opaque.

[0065] Please refer to Figure 1ANext, a flexible circuit substrate 120 is formed on the rigid substrate 110, wherein the flexible circuit substrate 120 has a plurality of through holes 120a exposing the rigid substrate 110. Specifically, the rigid substrate 110 has opposing first surfaces 112 and second surfaces 114, and the flexible circuit substrate 120 includes a flexible substrate 122 disposed on the first surface 112 of the rigid substrate 110 and a driving circuit layer 124 disposed on the flexible substrate 122. The flexible substrate 122 comprises a flexible material. For example, in this embodiment, the material of the flexible substrate 122 may be an organic polymer, such as polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonates (PC), polyether sulfone (PES), or polyarylate, other suitable materials, or combinations of at least two of the aforementioned materials.

[0066] Please refer to Figure 1A and Figure 2 In this embodiment, the flexible substrate 122 has a plurality of through holes 120a, which include a plurality of first through holes 120a-1 and a plurality of second through holes 120a-2. Each first through hole 120a-1 has a first through hole extension direction D1, and each second through hole 120a-2 has a second through hole extension direction D2. The first through hole extension direction D1 and the second through hole extension direction D2 are different. The plurality of first through holes 120a-1 and the plurality of second through holes 120a-2 are alternately arranged in a first direction x and a second direction y to define a plurality of islands 122i and a plurality of bridges 122b of the flexible substrate 122. The first direction x and the second direction y are interleaved, the first direction x is interleaved with the first through hole extension direction D1, and the second direction y is interleaved with the second through hole extension direction D2.

[0067] The driving circuit layer 124 includes multiple pixel driving circuits PC, which are respectively disposed on multiple islands 122i of the flexible substrate 122. In this embodiment, each pixel driving circuit PC may include multiple light-emitting elements 140 (labeled as follows) for driving multiple light-emitting elements 140. Figure 1D The invention comprises multiple sub-pixel driving circuits (SPCs). For example, in this embodiment, each sub-pixel driving circuit (SPC) may include a first transistor (not shown), a second transistor (not shown), and a capacitor (not shown), wherein the second terminal of the first transistor is electrically connected to the control terminal of the second transistor, and the capacitor is electrically connected to the second terminal of the first transistor and the first terminal of the second transistor, but the invention is not limited thereto.

[0068] The driving circuit layer 124 also includes multiple wires l disposed on multiple bridges 122b of the flexible substrate 122. The multiple wires l are electrically connected to multiple pixel driving circuits PC located on different islands 122i. For example, in this embodiment, the multiple wires l may include a data line electrically connected to a first terminal of a first transistor of a pixel driving circuit PC, a gate line electrically connected to a control terminal of a first transistor of a pixel driving circuit PC, and a power line electrically connected to a first terminal of a second transistor of a pixel driving circuit PC, but the present invention is not limited thereto.

[0069] Please refer to Figure 1B and Figure 1C Next, a first encapsulation layer 130 is formed, wherein the first encapsulation layer 130 fills a plurality of through holes 120a of the flexible circuit board 120 to contact the rigid substrate 110. Please refer to... Figure 1B In detail, in this embodiment, a first encapsulation material 130' is first formed on the first surface 112 of the rigid substrate 110 to fill the plurality of through holes 120a of the flexible circuit substrate 120 and cover the driving circuit layer 124 of the flexible circuit substrate 120. The first encapsulation material 130' includes a first portion 130'-1 disposed in the plurality of through holes 120a and a second portion 130'-2 disposed on the driving circuit layer 124. Then, a curing beam L is irradiated from the second surface 114 of the rigid substrate 110 to cure the first portion 130'-1 of the first encapsulation material 130'. The driving circuit layer 124 blocks the curing beam L from irradiating the second portion 130'-2 of the first encapsulation material 130', and the second portion 130'-2 of the first encapsulation material 130' is not cured. Then, the second portion 130'-2 of the uncured first encapsulation material 130' is removed, while the first portion 130'-1 of the first encapsulation material 130' is retained to form the first encapsulation layer 130.

[0070] Figure 3 This illustrates a first encapsulation layer according to an embodiment of the present invention. Please refer to... Figure 1C , Figure 2 and Figure 3 In this embodiment, the first encapsulation layer 130 may include a plurality of encapsulation structures 132 disposed in a plurality of through holes 120a of the flexible circuit substrate 120 and protruding from the flexible circuit substrate 120. More specifically, in this embodiment, the plurality of encapsulation structures 132 may include a first encapsulation structure 132-1 and a second encapsulation structure 132-2, wherein the first encapsulation structure 132-1 is disposed in a first through hole 120a-1 of the flexible circuit substrate 120, and the second encapsulation structure 132-2 is disposed in a second through hole 120a-2 of the flexible circuit substrate 120.

[0071] Please refer to Figure 1C , Figure 2 and Figure 3 In this embodiment, the first encapsulation layer 130 substantially overlaps with the plurality of through holes 120a of the flexible circuit substrate 120. More specifically, in this embodiment, the plurality of first encapsulation structures 132-1 of the first encapsulation layer 130 overlap with the plurality of first through holes 120a-1 of the flexible circuit substrate 120, and the plurality of second encapsulation structures 132-2 of the first encapsulation layer 130 overlap with the plurality of second through holes 120a-2 of the flexible circuit substrate 120.

[0072] Figure 4 This illustrates the packaging structure of the first packaging layer according to an embodiment of the present invention. Please refer to... Figure 4 The packaging structure 132 has a width W in the first direction x. In this embodiment, the width W may gradually increase with distance from the flexible circuit board 120. In other words, in this embodiment, the packaging structure 132 may be a structure that is wider at the top and narrower at the bottom, but the present invention is not limited thereto. Please refer to... Figure 2 and Figure 4 The third direction z is perpendicular to the first direction x and the second direction y, and the packaging structure 132 has a height H in the third direction z. For example, in this embodiment, the height H of the packaging structure 132 can be 40.1 μm, and the width W of the packaging structure 132 within the through hole 120a can be 15.5 μm, but the present invention is not limited thereto.

[0073] Please refer to Figure 1D Next, multiple light-emitting elements 140 are transferred onto the flexible circuit board 120 and electrically connected to it. Please refer to... Figure 1D and Figure 2 For example, in this embodiment, the first electrode (not shown) of each light-emitting element 140 is electrically connected to the second terminal of the second transistor of a corresponding sub-pixel driving circuit SPC, and the second electrode (not shown) of each light-emitting element 140 is electrically connected to a common line in the wire l. In this embodiment, the light-emitting element 140 is, for example, a micro light-emitting diode (μLED). Multiple light-emitting elements 140 located on the same island 122i and electrically connected to multiple sub-pixel driving circuits SPC can respectively emit different first color light, second color light, and third color light. In this embodiment, the first color light, second color light, and third color light are, for example, red light, green light, and blue light, but the invention is not limited thereto.

[0074] Please refer to Figure 1ENext, a second encapsulation layer 150 is formed to cover the plurality of light-emitting elements 140 and the first encapsulation layer 130, wherein the adhesion of the first encapsulation layer 130 to the rigid substrate 110 is lower than that of the second encapsulation layer 150 to the rigid substrate 110. The flexible circuit board 120, the plurality of light-emitting elements 140, the first encapsulation layer 130 and the second encapsulation layer 150 form the main structure S.

[0075] Please refer to Figure 1E and Figure 1F Next, the main structure S is separated from the rigid substrate 110 to expose the surface 120s of the flexible circuit board 120 and at least a portion of the first encapsulation layer 130 disposed in a plurality of through holes 120a of the flexible circuit board 120. It is worth mentioning that the first encapsulation layer 130, which has lower adhesion, is in contact with the rigid substrate 110, rather than the second encapsulation layer 150, which has higher adhesion. Therefore, when separating the main structure S from the rigid substrate 110, the main structure S can be easily removed from the rigid substrate 110.

[0076] Figure 5 This diagram illustrates the relationship between the displacement of the first encapsulation layer and the peeling force between the first encapsulation layer and the rigid substrate, as well as the relationship between the displacement of the second encapsulation layer and the peeling force between the second encapsulation layer and the rigid substrate. Curve OC-1 represents the relationship between the displacement of the first encapsulation layer 130 and the peeling force between the first encapsulation layer 130 and the rigid substrate 110. Curve OC-2 represents the relationship between the displacement of the second encapsulation layer 150 and the peeling force between the second encapsulation layer 150 and the rigid substrate 110. Figure 5 The curve OC-1 refers to the data obtained when the first encapsulation layer 130 fills the through-hole 120a of the flexible circuit board 120 and covers the driving circuit layer 124 of the flexible circuit board 120. Figure 5 The curve OC-2 refers to the data obtained when the second encapsulation layer 150 fills the through-hole 120a of the flexible circuit board 120 and covers the driving circuit layer 124 of the flexible circuit board 120. Figure 5 Data shows that setting a first encapsulation layer 130 with low adhesion in the through hole 120a of the flexible circuit board 120 can significantly reduce the peel force between the first encapsulation layer 130 and the rigid substrate 110, so that the main structure S can be easily removed from the rigid substrate 110.

[0077] Please refer to Figure 1FFurthermore, in this embodiment, the light transmittance of the first encapsulation layer 130 is lower than that of the second encapsulation layer 150. For example, in this embodiment, the first encapsulation layer 130 may be a white adhesive material containing scattering particles, and the second encapsulation layer 150 may be a transparent adhesive material; the first encapsulation layer 130 may surround the light-emitting element 140, thereby improving light extraction efficiency and reducing the halo effect. In another embodiment, the first encapsulation layer 130 may also be a black adhesive material containing black carbon particles to reduce the high transmittance caused by the multiple through-holes 120a of the flexible circuit board 120 and to reduce the halo effect.

[0078] Please refer to Figure 1F and Figure 1G Next, a first stretchable protective film 160 is formed on the surface 120s of the flexible circuit board 120 and at least a portion of the first encapsulation layer 130, and a second stretchable protective film 170 is formed on the second encapsulation layer 150. Thus, the display device 10 of this embodiment is completed.

[0079] It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals used to represent the same or similar components, and descriptions of the same technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0080] Figure 6 The encapsulation structure of the first encapsulation layer according to another embodiment of the present invention is shown. Figure 6 The 132A packaging structure and Figure 4 The packaging structure is similar to 132, the difference between the two is: Figure 6 In one embodiment, the width W of the portion of the packaging structure 132A above the flexible circuit board 120 gradually decreases as it moves away from the flexible circuit board 120.

[0081] Figures 7A to 7E This is a cross-sectional schematic diagram of the manufacturing process of a display device according to another embodiment of the present invention.

[0082] Figures 7A to 7E The manufacturing process of the display device 10B and Figures 1A to 1G The manufacturing process of the display device 10 is similar, but the differences lie in the following: the methods of forming the first encapsulation layers 130 and 130B are different; and the timing of the transposition of the light-emitting element 140 is different; the following combinations Figures 7A to 7E Let me explain.

[0083] Please refer to Figure 7AFirst, a rigid substrate 110 is provided. Next, a flexible circuit substrate 120 is formed on the rigid substrate 110, wherein the flexible circuit substrate 120 has a plurality of through holes 120a that expose the rigid substrate 110.

[0084] Please refer to Figure 7A and Figure 7B ,and Figures 1A to 1G Unlike the previous embodiment, in this embodiment, before forming the first encapsulation layer 130B, a plurality of light-emitting elements 140 are transferred onto the flexible circuit substrate 120 and electrically connected to the flexible circuit substrate 120.

[0085] Please refer to Figure 7B After the multiple light-emitting elements 140 are transferred to the flexible circuit board 120, a first encapsulation layer 130B is formed by an inkjet printing process. The first encapsulation layer 130B fills the multiple through holes 120a of the flexible circuit board 120, covers a portion of the driving circuit layer 124 of the flexible circuit board 120, and exposes the multiple light-emitting elements 140.

[0086] Please refer to Figure 7C Next, a second encapsulation layer 150 is formed to cover a plurality of light-emitting elements 140 and a first encapsulation layer 130B, wherein the adhesion of the first encapsulation layer 130B to the rigid substrate 110 is lower than that of the second encapsulation layer 150 to the rigid substrate 110, and the flexible circuit board 120, the plurality of light-emitting elements 140, the first encapsulation layer 130B and the second encapsulation layer 150 form the main structure S.

[0087] Please refer to Figure 7C and Figure 7D Next, the main structure S is separated from the rigid substrate 110 to expose the surface 120s of the flexible circuit substrate 120 and at least a portion of the first encapsulation layer 130B disposed in a plurality of through holes 120a of the flexible circuit substrate 120.

[0088] Please refer to Figure 7D and Figure 7E Next, a first stretchable protective film 160 is formed on the surface 120s of the flexible circuit board 120 and at least a portion of the first encapsulation layer 130B, and a second stretchable protective film 170 is formed on the second encapsulation layer 150. This completes the display device 10B of this embodiment. Figure 7E The display device 10B has the same characteristics as the aforementioned Figure 1G The similar technical effects and advantages of the display device 10 will not be repeated here.

[0089] Figure 8 This is a cross-sectional schematic diagram of a display device according to another embodiment of the present invention. Figure 8 The display device 10C and Figure 1G The display device 10 is similar, the difference being that: Figure 8 In some embodiments, the display device 10C further includes a plurality of color filter patterns 180 disposed corresponding to a plurality of light-emitting elements 140 and a light-shielding pattern layer 190 that shields the gaps between the plurality of light-emitting elements 140 and the encapsulation structure 132.

[0090] Figure 9 This is a cross-sectional schematic diagram of a display device according to another embodiment of the present invention. Figure 9 The display device 10D and Figure 7E The display device 10B is similar, the difference being that: Figure 9 In some embodiments, the display device 10D further includes a plurality of color filter patterns 180 disposed corresponding to a plurality of light-emitting elements 140 and a light-shielding pattern layer 190 that shields the first encapsulation layer 130B.

Claims

1. A method for manufacturing a display device, comprising: Provide a rigid substrate; A flexible circuit board is formed on the rigid substrate, wherein the flexible circuit board has a plurality of through holes that expose the rigid substrate. Multiple light-emitting elements are transferred onto the flexible circuit board and electrically connected to the flexible circuit board. A first encapsulation layer is formed, wherein the first encapsulation layer fills the through holes of the flexible circuit board to contact the rigid substrate; A second encapsulation layer is formed to cover the light-emitting elements and the first encapsulation layer, wherein the adhesion of the first encapsulation layer to the rigid substrate is lower than that of the second encapsulation layer to the rigid substrate, wherein the second encapsulation layer does not contact the rigid substrate, and the flexible circuit board, the light-emitting elements, the first encapsulation layer and the second encapsulation layer form a main structure. Separate the main structure from the rigid substrate to expose a surface of the flexible circuit board and at least a portion of the first encapsulation layer disposed in the through holes of the flexible circuit board; as well as A first stretchable protective film is formed on the surface of the flexible circuit board and on at least a portion of the first encapsulation layer; as well as A second stretchable protective film is formed on the second encapsulation layer. The flexible circuit board includes a flexible substrate disposed on a first surface of the rigid substrate and a driving circuit layer disposed on the flexible substrate. The driving circuit layer includes multiple pixel driving circuits, which are respectively disposed on multiple islands of the flexible substrate. Each of these pixel driving circuits includes a plurality of sub-pixel driving circuits for driving the light-emitting elements. The first encapsulation layer covers a portion of the driving circuit layer of the flexible circuit board.

2. The method for manufacturing a display device as claimed in claim 1, wherein the rigid substrate has a second surface opposite to the first surface, and the step of forming the first encapsulation layer includes: Before the light-emitting elements are transferred to the flexible circuit substrate, a first encapsulation material is formed on the first surface of the rigid substrate to fill the through holes of the flexible circuit substrate and cover the driving circuit layer of the flexible circuit substrate. The first encapsulation material includes a first portion disposed in the through holes and a second portion disposed on the driving circuit layer. as well as A curing beam is directed from the second surface of the rigid substrate to irradiate the first encapsulation material to cure the first portion of the first encapsulation material, wherein the driving circuit layer blocks the curing beam from irradiating the second portion of the first encapsulation material; as well as Remove the second portion of the uncured first encapsulation material and retain the first portion of the first encapsulation material to form the first encapsulation layer.

3. The method for manufacturing a display device as claimed in claim 1, wherein the rigid substrate has a second surface opposite to the first surface, and the step of forming the first encapsulation layer includes: After the light-emitting elements are transferred to the flexible circuit board, the first encapsulation layer is formed by an inkjet printing process. The first encapsulation layer fills the through holes of the flexible circuit board, covers a portion of the driving circuit layer of the flexible circuit board, and exposes the light-emitting elements.

4. The method for manufacturing a display device as claimed in claim 1, wherein the light transmittance of the first encapsulation layer is lower than that of the second encapsulation layer.

5. A display device, comprising: A flexible circuit board with multiple through holes; Multiple light-emitting elements are disposed on the flexible circuit board and electrically connected to the flexible circuit board; A first encapsulation layer is used to fill the through-holes of the flexible circuit board; A second encapsulation layer covers the light-emitting elements and the first encapsulation layer, wherein the adhesion of the first encapsulation layer to a rigid substrate is lower than the adhesion of the second encapsulation layer to the rigid substrate, and wherein the second encapsulation layer does not contact the rigid substrate. A first stretchable protective film is disposed on a surface of the flexible circuit board and at least a portion of the first encapsulation layer; and A second stretchable protective film is disposed on the second encapsulation layer. The flexible circuit board includes a flexible substrate disposed on a first surface of the rigid substrate and a driving circuit layer disposed on the flexible substrate. The driving circuit layer includes multiple pixel driving circuits, which are respectively disposed on multiple islands of the flexible substrate. Each of these pixel driving circuits includes a plurality of sub-pixel driving circuits for driving the light-emitting elements. The first encapsulation layer covers a portion of the driving circuit layer of the flexible circuit board.

6. The display device of claim 5, wherein the first encapsulation layer substantially overlaps with the through-holes of the flexible circuit board.

7. The display device of claim 5, wherein the vias of the flexible circuit board include a plurality of first vias and a plurality of second vias, each first via having a first via extension direction, each second via having a second via extension direction, and the first via extension direction being different from the second via extension direction. The first through-holes and the second through-holes are alternately arranged in a first direction and a second direction, the first direction and the second direction being staggered, the first direction being staggered with the extension direction of the first through-holes, and the second direction being staggered with the extension direction of the second through-holes; the first encapsulation layer includes: Multiple first packaging structures are disposed in the first through holes of the flexible circuit board; as well as Multiple second packaging structures are disposed in the second through holes of the flexible circuit board.

8. The display device of claim 5, wherein the first encapsulation layer fills the through-holes of the flexible circuit substrate, covers a portion of the driving circuit layer of the flexible circuit substrate, and exposes the light-emitting elements.

9. The display device of claim 5, wherein the light transmittance of the first encapsulation layer is lower than that of the second encapsulation layer.

Images