Flexible circuit board, control device, and vehicle

Abstract

The utility model discloses a kind of flexible circuit board, control equipment and vehicle. Among them, the flexible circuit board includes: multiple ports, different ports are connected with different electronic control units;Multiple conductive layers, multiple conductive layers are stacked, and at least one conductive layer is provided with via hole;Multiple wires, different wires are used to connect two different ports, and any wire is disposed in the same conductive layer in multiple conductive layers, or using via hole, disposed in different conductive layers in multiple conductive layers.The utility model solves the technical problem that the wire connecting different electronic control units occupies more space in the related art.

Description

Technical Field

[0001] This utility model relates to the fields of vehicles and electronic control, and more specifically, to a flexible circuit board, control equipment, and vehicle. Background Technology

[0002] With the development of vehicle intelligence and vehicle electronic and electrical technologies, electronic control units (ECUs) used to control different functions are becoming increasingly diverse. These ECUs control various aspects of the vehicle, from powertrain and safety controls to infotainment systems. Efficient connectivity and communication between ECUs have become crucial for realizing vehicle intelligence. Existing connectivity technologies are facing multiple challenges, which are hindering further improvements in the performance of intelligent vehicles.

[0003] In related technologies, the connection between different electronic controllers is usually achieved by traditional wiring harnesses. Typically, a layer of plastic is wrapped around the outside of the multi-strand cable to protect the wiring harness. However, with the increasing number of electronic control units installed inside vehicles, such wiring harnesses are large in size and weight, requiring a large amount of assembly space. This leads to the drawback of the large space occupied by the connection between different electronic control units. Utility Model Content

[0004] This utility model provides a flexible circuit board, control equipment, and vehicle to at least solve the technical problem in the related art that the wires connecting different electronic control units occupy a lot of space.

[0005] According to one aspect of the present invention, a flexible circuit board is provided, comprising: multiple ports, different ports being connected to different electronic control units; multiple conductive layers, the multiple conductive layers being stacked, at least one conductive layer having a via; and multiple wires, different wires being used to connect two different ports, any one wire being deployed in the same conductive layer among the multiple conductive layers, or deployed in different conductive layers among the multiple conductive layers using vias.

[0006] Optionally, the conductive layer is provided with multiple vias, and the multiple vias are arranged symmetrically along the center line of the flexible circuit board.

[0007] Optionally, if vias are provided on both adjacent conductive layers, the projection positions of the vias on the two adjacent conductive layers coincide.

[0008] Optionally, the placement of any conductor can be determined based on the type of data transmitted by the conductor or the current transmitted by the conductor.

[0009] Optionally, the cross-sectional area of ​​the wires deployed in different conductive layers is different, and the wires deployed in different conductive layers are used to carry different amounts of current.

[0010] Optionally, the flexible circuit board further includes: at least one insulating layer disposed between two adjacent conductive layers to isolate electrical transmission between the two adjacent conductive layers.

[0011] According to another aspect of the present invention, a control device is also provided, comprising: a plurality of electronic control units disposed inside a metal housing; and the aforementioned flexible circuit board.

[0012] Optionally, the flexible circuit board is attached to the inner wall of the metal housing to dissipate heat through the metal housing.

[0013] Optionally, the flexible circuit board is bent along the inner wall of the metal housing in a U-shape.

[0014] Optionally, the control device further includes: a fixing device, the first end of which is located in the non-conductive area of ​​the flexible circuit board, and the second end of which is connected to a preset device for fixing the preset device in a preset position of the control device.

[0015] According to another aspect of the present invention, a vehicle is also provided, including: the aforementioned flexible circuit board or the aforementioned control device.

[0016] Optionally, the flexible circuit board or control device can be attached to the vehicle frame.

[0017] In this embodiment of the invention, the flexible circuit board includes: multiple ports, each connected to a different electronic control unit; multiple conductive layers, stacked on top of each other, with at least one conductive layer having a via; and multiple wires, each used to connect two different ports. Any single wire can be deployed on the same conductive layer or, using vias, on different conductive layers. It is noteworthy that by employing multi-layer stacking and via connections, deploying wires on the same conductive layer or on different conductive layers, not only can the number of wires deployed on the same conductive layer be reduced, but the vias can also achieve seamless transmission between different conductive layers to meet the transmission requirements between different electronic control units. This improves space utilization and reduces space occupation, thereby solving the technical problem in related technologies where wires connecting different electronic control units occupy a large amount of space. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0019] Figure 1This is a schematic diagram of an optional flexible circuit board according to an embodiment of the present utility model;

[0020] Figure 2 This is a schematic diagram of an optional flexible circuit board according to an embodiment of the present utility model;

[0021] Figure 3 This is a schematic diagram of an optional flexible circuit board according to an embodiment of the present utility model;

[0022] Figure 4 This is a schematic diagram of an optional multiple wire connection for four electronic control units according to an embodiment of the present invention. Detailed Implementation

[0023] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0024] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, including a series of systems, products, or devices is not necessarily limited to those explicitly listed, but may include other units not explicitly listed or inherent to these products or devices.

[0025] This application provides a flexible circuit board, a control device, and a vehicle. The flexible circuit board can be used to provide information transmission functions for preset application scenarios. These preset application scenarios can include the following scenarios in the vehicle field: autonomous driving scenarios for commuting, artificial intelligence (AI) assisted driving scenarios for private vehicles, automatic parking assistance (APA) scenarios (such as memory parking for self-owned parking spaces in garages, intelligent parking for designated parking spaces in parking lots, etc.), and navigation-guided pilot (NGP) scenarios in urban or highway areas. Furthermore, the preset application scenarios may also include, but are not limited to: information transmission scenarios for intelligent driving trucks or unmanned trucks in the logistics and transportation field, information transmission scenarios for autonomous agricultural vehicles in the agricultural field, information transmission scenarios for unmanned aerial vehicles (UAVs), and information transmission scenarios for intelligent robots (such as cleaning robots, service robots, delivery robots, etc.).

[0026] When the aforementioned preset application scenario is a scenario in a field other than the vehicle field, those skilled in the art should understand that the vehicle in the aforementioned flexible circuit board can be replaced with other objects (such as agricultural equipment, drones, robots, etc.), and correspondingly, the flexible circuit board can be replaced with a flexible circuit board related to other objects. Based on this, this application embodiment takes the vehicle field as an example to illustrate the specific implementation of the aforementioned flexible circuit board.

[0027] Figure 1 This is a schematic diagram of a flexible circuit board according to an embodiment of the present utility model, as shown below. Figure 1 As shown, the flexible circuit board includes: multiple ports 101, with different ports connected to different electronic control units 102; multiple conductive layers 103, which are stacked and at least one conductive layer has a via 104; and multiple wires 105, with different wires used to connect two different ports. Any wire can be deployed on the same conductive layer among the multiple conductive layers, or deployed on different conductive layers among the multiple conductive layers using vias. Figure 1 (The example shown is a flexible circuit board consisting of 3 ports, 3 wires, and 3 conductive layers.)

[0028] The aforementioned Flexible Printed Circuit Board (FPC) can be a circuit board that uses a flexible substrate (such as polyimide, polyester film, etc., for example only) as a base, and forms circuit traces on the substrate through printing technology to achieve the connection of electronic components. The flexible circuit board is bendable. The FPC can include, but is not limited to, conductive layers, insulating layers, ports, wires, and vias. The structure of the conductive layer FPC is not limited here and can be determined as needed. The conductive layer can be used for signal and power transmission, while the insulating layer can be used to protect the conductive layer from short circuits and electromagnetic interference. Ports can be connectors or pads, used to establish physical and electrical connections with electronic control units. The conductive layer is usually made of copper foil and is the main path for signal and power transmission on the flexible circuit board. A via can be a connection point that runs through different conductive layers of the flexible circuit board, allowing wires to move vertically between different layers, thereby constructing complex circuit networks. For example, a wire may start in the top conductive layer, use a via to reach the bottom conductive layer, and continue its path.

[0029] In electric vehicles, FPCs can be used in battery management systems to connect battery cells, enabling real-time monitoring and control of battery status, thus improving battery safety and efficiency. In smart vehicles, FPCs can also connect to various sensors (such as temperature, humidity, and pressure sensors) and actuators (such as motors and valves), supporting functions such as autonomous driving and vehicle health monitoring. FPCs can also be used to connect door controls, seat adjustments, and interior lighting, leveraging their flexibility to improve interior layout and enhance the driving experience. In in-vehicle infotainment systems, FPCs can support signal transmission between multimedia devices, navigation systems, and communication modules, enabling smooth entertainment and information processing. FPCs can also be used for circuit connections for safety functions such as airbags and seatbelt pretensioners, ensuring rapid response in emergencies and protecting occupant safety.

[0030] The aforementioned ports refer to interfaces used for physical connections and information exchange. Ports can be metallized holes or pads on edges or at specific locations. Ports can be categorized in various ways, including but not limited to power ports, signal ports, ground ports, and test ports; the type of port can be configured as needed. Ports can be used to transmit signals, data, and power. Through ports, flexible circuit boards can connect to external connectors or wires. In particular, the aforementioned ports can refer to connection points used for communication with electronic control units (ECUs). Ports enable electrical connections between flexible circuit boards and ECUs or other components. In electric vehicle applications, ports may need to withstand high currents or high-frequency signals, and ports must possess heat resistance and high conductivity.

[0031] The aforementioned Electronic Control Unit (ECU) can be used to perform control tasks. Different ECUs can control different tasks, such as drive motor control, battery management, entertainment systems, and driver assistance systems; this is not a limitation here. ECUs can process data from sensors through software algorithms to control actuator actions, realizing vehicle automation and intelligent functions. ECUs can be divided into different types, such as powertrain ECUs, chassis ECUs, and body ECUs; the type of ECU is not limited here and can be determined as needed. Each ECU focuses on the control of a specific system or function. With the development of vehicle networking and autonomous driving technologies, the number and complexity of ECUs used inside vehicles are constantly increasing. ECUs, through control logic, ensure that various vehicle control systems operate as expected, improving driving safety, comfort, and efficiency. Using flexible circuit boards as the connection medium between ECUs enables signal transmission paths at different levels, reducing the weight and space occupied by the required connecting wires.

[0032] In one optional embodiment, the flexible circuit board may include multiple ports, each connected to a different electronic control unit (ECU) to enable communication and data exchange between the ECUs. The connection between the port and the ECU can be wireless, such as via Bluetooth, Wireless Fidelity (Wi-Fi), or a proprietary wireless protocol; this is merely an example and can be determined as needed. Specifically, dynamic pairing and network management technologies can be used to automatically identify and establish a wireless connection between the ECU and the port. Furthermore, the parameters of the wireless connection, such as data transmission frequency, power control, and signal encryption, can be adjusted according to the ECU's location and functional requirements to ensure the stability and security of the connection.

[0033] In another alternative embodiment, the ports and electronic control units can also be connected by soldering. For example, the ECU interface can be soldered to the ports on the FPC using reflow soldering, manual soldering, or automated soldering machines to form an electrical connection. The connection and communication between multiple ports and different ECUs not only improves space utilization and reduces overall weight, but also enhances signal transmission quality and power distribution efficiency.

[0034] In another alternative embodiment, the port can also be connected to the electronic control unit via a pluggable connector. During the FPC design phase, pluggable connector receptacles can be designed for each port location to ensure compatibility with standard plugs on the ECU. Pluggable connectors offer flexibility and maintainability in connections suitable for situations requiring frequent ECU replacements, but may increase some additional cost and space requirements.

[0035] The aforementioned conductive layer can be a metal layer that carries signals and electricity. The material of the conductive layer can be copper, silver, aluminum, etc.; the material is not limited here and can be determined as needed. According to different functions, conductive layers can be divided into signal layers, ground layers, and power layers, etc.; the function of the conductive layer is not limited here. Signal layers can be used for routing and signal transmission. In signal layers, signals can be transmitted from one component to another circuit component; for example, two different electronic control units can be connected by wires. Ground and power layers can be used to provide power and ground references, contributing to signal integrity. Conductive layers not only provide pathways for electricity and signals but can also form multi-layer channels through interlayer interconnections. Multiple conductive layers connected vertically can form three-dimensional signal channels, increasing the complexity and functionality of flexible circuit boards.

[0036] The vias described above can be filled with conductive material to connect different conductive layers. Vias can include, but are not limited to, blind vias, buried vias, and through-hole vias; the type of via is not limited here and can be determined as needed. Vias ensure the integrity of interlayer electrical connections, allowing for circuit layout planning within limited space, while also contributing to improved heat dissipation and electromagnetic compatibility. Vias enhance the continuous transmission of signals and power between layers. Using vias, wiring can be routed between different conductive layers, improving circuit layout and signal paths. Via technology makes wiring possible within limited space, improving the space utilization and design flexibility of flexible circuit boards. Vias allow signals and power to cross multiple conductive layers vertically, thereby achieving interlayer electrical connections.

[0037] In one optional embodiment, the flexible circuit board may include multiple stacked conductive layers, at least one of which has a via. Specifically, multiple conductive layers can be stacked using lamination techniques, such as with a laminating agent, to form a multilayer structure. Then, holes are drilled at fixed points in the conductive layers using laser drilling to obtain conductive layers with vias. Vias, such as blind vias or through-holes, can be provided in intermediate conductive layers; this is not limited and can be determined as needed. Vias can also be omitted in conductive layers that do not need to connect with other conductive layers; this is not limited and can be determined as needed. Vias can be provided in intermediate conductive layers to allow adjacent conductive layers to connect, i.e., vias form connection points between different conductive layers. Vias enable effective connections between conductive layers in the flexible circuit board, facilitating the integration of electronic control systems. Alternatively, vias can be provided in each conductive layer so that the vias pass through each conductive layer, achieving connectivity between the various conductive layers.

[0038] In another alternative embodiment, holes can be drilled using metallized via technology, and metallization can be formed on the hole walls. Then, during the lamination process, conductive layers of the metallized vias are stacked to establish electrical connections. The vertical stacking of conductive layers allows for interlayer connections in the conductive path and enables multiple conductive layers to perform different circuit functions, such as power supply, grounding, and signal transmission.

[0039] The aforementioned wires can be wire harnesses used for signal and power transmission. In flexible circuit boards, wires can be conductive patterns formed by laser cutting or chemical etching, or embedded metal wires. Wires can be used to establish electrical connections, transmitting signals from one port to another, thereby enabling ECUs connected to different ports to communicate. In multiple stacked conductive layers, wires can be directly deployed on the same conductive layer, or they can pass through different conductive layers using vias. Based on the characteristics of the signals they carry, wires can be classified as high-speed signal lines, low-speed signal lines, power lines, ground lines, etc., without limiting the type of wire here. High-speed signal lines require special attention to signal integrity, such as impedance matching and inter-layer delay; power lines and ground lines require attention to wire width and material thickness to ensure sufficient current carrying capacity. Wires are the physical carriers of signals and power on flexible circuit boards, and the layout of the wires can affect the performance and reliability of the flexible circuit board. By optimizing the wire layout, signal interference can be reduced, signal speed and stability can be improved, thereby achieving lightweight and intelligent wiring in electric vehicles.

[0040] In one alternative embodiment, the flexible circuit board may include multiple conductors, with different conductors used to connect two different ports. Independent conductors can be used for each signal type and power requirement, depending on the connection needs. For example, high-speed signal conductors may require special impedance control, while high-current conductors may require wider and thicker conductors to ensure a connection path from one port to another. The conductors and ports can be connected by soldering. Alternatively, the conductors and ports can be connected by crimping, forming an electrical contact by pressing the end of the conductor into a pre-defined port. Alternatively, the conductors and ports can be connected using a spring-loaded connector, utilizing the elasticity and conductivity of a spring or flexible metal sheet to connect the conductor to the port. The spring-loaded connector can be a clamping type; when the conductor is inserted, the spring sheet deforms under pressure, ensuring electrical contact between the conductor and the port.

[0041] Furthermore, any conductor in a flexible circuit board can be deployed on the same conductive layer among multiple conductive layers, or deployed on different conductive layers among multiple conductive layers using vias. In other words, in a flexible circuit board, conductor deployment is not limited to a single layer; it can also be achieved by deploying conductors on multiple conductive layers or by using via technology to span different conductive layers. Conductors can be deployed on the same conductive layer using laser forming.

[0042] In another alternative embodiment, in-layer repeat routing technology can be used to overlap and redirect conductors multiple times on the same conductive layer of the FPC. By designing the routing path, complex wiring of a single layer of conductors can be achieved without frequently using vias to switch between layers. Alternatively, the thickness of the conductor can be locally increased, i.e., more metal material can be deposited at specific locations on the conductive layer, allowing the conductor to cross other conductors and reducing the need for interlayer vias.

[0043] In another alternative embodiment, vias—vertical connection points—can be created between conductive layers using conventional drilling or laser-formed via technology. Conductors pass through these vias, jumping from one conductive layer to another, enabling the transmission of signals and power between layers. This increases wiring density and flexibility, effectively reduces signal interference, and improves signal quality. Alternatively, blind or buried via technology can be used to achieve more compact and high-density interlayer connections. This connection method eliminates the need for vias on the flexible circuit board surface, saving valuable surface space. By combining multiple conductive layers with vias, the flexible circuit board can integrate and transmit signals. This design overcomes the limitation of signal transmission paths in traditional single-layer conductive layers, achieving three-dimensional signal distribution, reducing the size and weight of the flexible circuit board, and simultaneously improving signal integrity and circuit reliability.

[0044] In this embodiment of the invention, the flexible circuit board includes: multiple ports, each connected to a different electronic control unit; multiple conductive layers, stacked on top of each other, with at least one conductive layer having a via; and multiple wires, each used to connect two different ports. Any single wire can be deployed on the same conductive layer or, using vias, on different conductive layers. It is noteworthy that by employing multi-layer stacking and via connections, different signals or currents can be carried by each conductive layer. Furthermore, when cross-layer connections are required, wires can be deployed on different conductive layers, and vias can be used to exchange signals or currents between different conductive layers, thereby improving space utilization and reducing the space occupied by connections. This solves the technical problem in related technologies where wires connecting different electronic control units occupy a large amount of space.

[0045] The flexible circuit board of this invention can be applied to vehicles to connect the electronic control units (ECUs) inside the vehicle. For example, signals are transmitted from ECU1 and ECU2 to the central controller, but the physical path between them is blocked by other vehicle components. In traditional wiring harnesses, this might mean having to detour, increasing the length and weight of the harness. However, with the flexible circuit board layout of this invention, the flexible circuit board can fit the vehicle's internal structure without occupying extra space. For example, in small areas such as behind the dashboard, inside the door, or under the seats, the FPC can be tightly laid out without affecting other functional components inside the vehicle. The wires of ECU1, located in the front of the vehicle and connected to the central controller, can be deployed on the first conductive layer, while the wires of ECU2, which is farther away, can be deployed on different conductive layers using vias, achieving cross-layer transmission, avoiding mutual interference of long-distance signal lines, and improving the overall space utilization of the vehicle interior.

[0046] Optionally, the conductive layer is provided with multiple vias, and the multiple vias are arranged symmetrically along the center line of the flexible circuit board.

[0047] The symmetrical arrangement of vias mentioned above refers to the distribution of vias on the flexible circuit board following a symmetrical principle. For example, if the circuit board is folded along a certain axis, the positions of the vias should overlap. This design helps balance the electrical characteristics on both sides of the flexible circuit board, reduces electromagnetic interference, and enhances the overall strength of the flexible circuit board. In addition, the position and symmetrical arrangement of the vias ensure the structural stability of the flexible circuit board when bent, avoiding the degradation of electrical performance caused by stress.

[0048] In one alternative embodiment, multiple vias can be provided on the conductive layer. Multiple vias can be created on the conductive layer using blind via or buried via technology. Alternatively, stacked via technology can be used along the centerline of the battery module connection points, with vias stacked from the top conductive layer to the bottom conductive layer to form high-density connection points, and the stacked vias are symmetrical along the centerline.

[0049] In another alternative embodiment, vias on each conductive layer are symmetrically arranged along the centerline of the flexible circuit board. The centerline can be either the horizontal or vertical axis, and is not limited here; it can be determined as needed. The positions of the vias can be determined using an optical positioning system or positioning marks. This symmetrical arrangement of vias along the centerline not only improves the internal layout of the flexible circuit board, making it more compact, but also reduces manufacturing difficulty and increases production efficiency. This design is particularly important in fields such as automotive electronics and aerospace, as it can adapt to various vibrations and deformations encountered by equipment during operation, ensuring uninterrupted transmission of critical signals.

[0050] Multiple sets of symmetrically arranged vias can be placed along the centerline of the FPC. Each set of vias includes at least one through-hole (for power and ground connections) and multiple blind vias (for connections between conductive layers). The symmetrical arrangement of these vias can reduce stress. When applied to vehicles, they can improve structural stability and electrical performance under vehicle vibration and movement conditions, ensuring stable communication between electronic control units.

[0051] like Figure 2 As shown, a case is illustrated where a wire 206 is deployed on conductive layers 202 and 204. A via 200 is provided on conductive layer 202, and the wire 206 is deployed on different conductive layers 202 and 204 through the via 200.

[0052] Optionally, if vias are provided on both adjacent conductive layers, the projection positions of the vias on the two adjacent conductive layers coincide.

[0053] In one optional embodiment, when vias are provided on two adjacent conductive layers, the vias are aligned in the vertical direction of these two adjacent conductive layers, or the projection positions of the vias on the conductive layers coincide. This helps to form a continuous electrical connection channel, ensuring seamless signal transmission between different layers. Vias can be simultaneously drilled into adjacent conductive layers using laser drilling, thereby ensuring that the vias are positioned consistently on adjacent conductive layers.

[0054] Alternatively, interlayer alignment or lamination techniques can be used to ensure that all vias coincide in their projection positions on adjacent conductive layers. For example, if a via on the top layer is located at a specific coordinate, then a via on the bottom layer should also be located at the same coordinate to facilitate the passage of conductors between layers. Coincidence of via positions on adjacent conductive layers eliminates obstacles to signal transmission between layers, significantly improving the electrical performance of flexible circuit boards. This design is particularly beneficial for high-speed signal transmission, reducing signal delay and reflection, and improving signal quality.

[0055] The flexible circuit board of this invention can be applied to vehicles. In the drive motor controller of electric vehicles, the FPC design using vertical projection coincident via technology not only solves the problems of flexible circuit board thickness and space utilization, but also significantly improves the efficiency and reliability of control signal and power transmission. This design strategy provides important support for the miniaturization, high performance, and cost control of electric vehicle control systems.

[0056] Optionally, the placement of any conductor can be determined based on the type of data transmitted by the conductor or the current transmitted by the conductor.

[0057] The placement of conductors directly affects not only the quality of signal transmission and system performance, but also the long-term stability and space optimization of flexible circuit boards. The placement of conductors should be determined based on the type of data or current characteristics they transmit.

[0058] In one alternative embodiment, the deployment of conductors can be based on the nature of the signal, such as data type (e.g., digital or analog signal) and current magnitude (high or low current, etc.). For data requiring high-speed transmission, conductors can be deployed in the same conductive layer to avoid electromagnetic interference. For low-speed data transmission, conductors can be deployed on different conductive layers. For conductors carrying high currents, such as those connecting to a motor controller, vias are used to distribute them across multiple conductive layers to increase the conductive area and reduce thermal stress. For low-current applications, such as input / output signal lines for a microcontroller, conductors can be deployed on a thinner conductive layer to save costs.

[0059] In another alternative embodiment, the placement of the conductors can be determined based on the current. For example, conductors with high current requirements are placed in the conductive layer near the heat sink to improve heat dissipation. Conductors with low current requirements are placed in the conductive layer away from the heat source to reduce the impact of temperature on the signal.

[0060] This deployment strategy, based on data type and current magnitude, effectively reduces crosstalk between signals, improving signal quality and circuit stability. Particularly in vehicle electronic systems, this design ensures that sensitive sensor signals and powerful drive currents are transmitted along their respective adaptation paths, avoiding signal distortion and electrical faults, and enhancing the overall system reliability and performance.

[0061] The flexible circuit board of this invention can be applied to vehicles, primarily transmitting high-speed data signals such as high-definition video signals, instrument readings, and driver operation commands between the instrument panel and the central processing unit. Because these signals are highly sensitive to electromagnetic interference, a conductive layer within the FPC is deployed, ensuring that the conductors of this conductive layer are kept as far away as possible from high-voltage and high-current lines to reduce interference. This conductive layer can be placed as close as possible to the surface of the FPC for direct connection to the interfaces of the instrument panel and the central processing unit. Simultaneously, the conductors are deployed in the center or outermost layer of the FPC to avoid crossing with other conductors and causing potential signal quality problems.

[0062] Optionally, the cross-sectional area of ​​the wires deployed in different conductive layers is different, and the wires deployed in different conductive layers are used to carry different amounts of current.

[0063] In one alternative embodiment, the cross-sectional area of ​​the conductor is proportional to the magnitude of the current it carries; larger currents require conductors with larger cross-sectional areas to reduce resistance and heat generation. For example, the cross-sectional area of ​​a high-current conductor used to drive a motor will be larger than that of a low-current conductor used for signal transmission. By deploying conductors with different cross-sectional areas, flexible circuit boards can meet the needs of different circuits.

[0064] In another alternative embodiment, thicker wires can be used for high-current conductors to reduce resistance and heat generation. Standard copper foil wires can be used for low-current conductors, prioritizing cost control.

[0065] This design not only improves circuit efficiency and reduces energy loss, but also enhances the space utilization of the flexible circuit board by rationally allocating the positions of the wires in different conductive layers, thereby reducing the overall thickness and weight. In high-power applications such as electric vehicles and industrial automation equipment, this design can effectively manage current distribution, avoid localized overheating, and extend the service life of the flexible circuit board and related components.

[0066] The flexible circuit board of this invention can be applied to vehicles, for example, for the connection between the battery and the Battery Management System (BMS). The connection between the battery and the BMS needs to carry a large current to ensure efficient energy conversion during battery charging and discharging. Therefore, thicker wires than those used for signal transmission can be used, and a conductive layer can be deployed near the center or bottom of the FPC to utilize the vehicle's natural heat dissipation.

[0067] Specifically, the following methods can be used to select conductor widths based on current: First, determine the current, temperature rise, copper thickness, and trace location. Then, use preset formulas, rules of thumb, or tables to initially estimate the conductor width. Further, add design margins, check voltage drop, and verify with tools to design the trace layout. For example, the cross-sectional area of ​​the conductor can be calculated using the line width and thickness. Typically, empirically, it is estimated that approximately 10-15 mil of line width is needed for each 1A of current in the outer layer, while the inner layer trace is usually twice the width of the outer layer. For example, if the outer layer conductor width is 10 mil, the inner layer conductor width is 20 mil; these values ​​are for illustrative purposes only.

[0068] Optionally, the flexible circuit board further includes: at least one insulating layer disposed between two adjacent conductive layers to isolate electrical transmission between the two adjacent conductive layers.

[0069] The aforementioned insulating layer can be a non-conductive material layer used to isolate conductive layers. The insulating layer can be made of polyimide, polyester, or other polymers to ensure the electrical insulation, heat resistance, and stability of the flexible circuit board. The insulating layer prevents short circuits between conductive layers, protects signals and power from interference, and provides physical support, enhancing the structural stability and durability of the flexible circuit board. The insulating layer can also be used to achieve interlayer separation and insulation of vias.

[0070] In one optional embodiment, the flexible circuit board further includes at least one insulating layer between two adjacent conductive layers, which can be used to isolate electrical transmission between the two adjacent conductive layers. The insulating layer between adjacent conductive layers prevents contact between the upper and lower conductive layers, allowing wires deployed on adjacent conductive layers to be connected vias, thus avoiding signal interference between wires deployed on different conductive layers. The insulating layer effectively prevents electrical interference and short circuits through physical isolation, which is particularly important when the flexible circuit board is bent or subjected to pressure in confined spaces.

[0071] When flexible printed circuit boards (FPCs) are used inside electric vehicle battery packs, the presence of at least one insulating layer within the multi-layer FPC effectively isolates adjacent conductive layers, ensuring normal transmission of electrical signals and system safety. This not only improves the internal circuit layout of the battery pack but also enhances the performance and reliability of the entire battery management system.

[0072] like Figure 3 As shown, the flexible circuit board includes three superimposed conductive layers 300, 302 and 304, and the thicknesses of these three conductive layers 300, 302 and 304 are different.

[0073] like Figure 4 As shown, Figure 4 This is a schematic diagram of an optional multiple wire connection for four electronic control units according to an embodiment of the present invention. Figure 4 In the diagram, multiple wires 4021-4026 connect to four electronic control units 4001-4004 via ports (not shown). The conductive layers are not shown. The arched intersection 408 represents a wire crossing where both wires remain on the same conductive layer. The cross intersection represents a via 404, indicating that the wires are deployed on different conductive layers using vias.

[0074] exist Figure 4In this configuration, electronic control unit 4001 and electronic control unit 4002 are connected via wire 4021 in the first conductive layer to transmit data. Electronic control unit 4001 and electronic control unit 4003 are connected via wire 4022 in the first conductive layer to transmit data. Electronic control unit 4002 and electronic control unit 4003 are connected via wire 4023 in the first conductive layer to transmit data.

[0075] A wire 4024 connecting electronic control unit 4001 and electronic control unit 4004 is deployed on two conductive layers. The wire 4024 passes through a via to connect electronic control unit 4001 and electronic control unit 4004.

[0076] The wire 4025 connecting the electronic control unit 4002 and the electronic control unit 4004 is also deployed on the two conductive layers. The wire 4025 passes through the via and connects the electronic control unit 4002 and the electronic control unit 4004.

[0077] A wire 4026 connecting the electronic control unit 4003 and the electronic control unit 4004 is deployed on two conductive layers. The wire 4026 passes through a via to connect the electronic control unit 4003 and the electronic control unit 4004.

[0078] According to another aspect of the present invention, a control device is also provided, comprising: a plurality of electronic control units disposed inside a metal housing; and the aforementioned flexible circuit board.

[0079] The electronic control unit and the flexible circuit board, as well as their structure and connection relationships, can be defined as described in the above embodiments.

[0080] The aforementioned metal casing refers to the outer metal encapsulation structure. The material of the metal casing can be copper, silver, gold, etc., and is not limited here; it can be determined according to requirements. The metal casing protects internal electronic components from external environmental influences such as vibration, shock, electromagnetic interference, and temperature changes. In addition to providing physical protection, the metal casing also has a heat dissipation function, helping the ECU or flexible circuit board maintain a safe temperature under high loads. In electric vehicles, the durability and heat dissipation efficiency of the metal casing are crucial to the reliability of the ECU.

[0081] In one alternative embodiment, the control device may include multiple electronic control units (ECUs) and a flexible circuit board. The multiple ECUs may be housed inside a metal housing. The ECUs may or may not be in contact with the metal housing. The flexible circuit board may include the structure described in the above embodiments. By encapsulating multiple ECUs within a single metal housing, not only are the ECUs protected from damage by the external environment, but the thermal conductivity of the metal housing also effectively dissipates heat.

[0082] In another alternative embodiment, the flexible circuit board (FPC) can be located inside or partially outside the metal housing to enhance the deployment flexibility of the control device. The FPC can be serpentine or S-shaped to adapt to the spatial layout of the control device and reduce the use of direct-connect wires; the FPC can utilize vias to switch between multiple conductive layers, enabling vertical and horizontal signal transmission.

[0083] This design solves the challenges of heat dissipation and space layout in traditional control equipment, especially in high-temperature, high-vibration industrial environments or vehicle cabins. The heat dissipation function of the metal casing and the space utilization of the flexible circuit board jointly improve the overall performance and lifespan of the control equipment. In addition, the metal casing also has an electromagnetic shielding effect, further enhancing the control equipment's anti-interference capability.

[0084] The control device of this embodiment can be applied to vehicles. The domain controller used in the vehicle can be a highly integrated electronic control unit (ECU) cluster, which integrates multiple ECUs with specific functions into a single metal housing, responsible for handling complex data processing and coordinated control tasks. In such a structure, the FPC can act as a bridge between the various ECUs to enable communication and power supply between them.

[0085] Optionally, the flexible circuit board is attached to the inner wall of the metal housing to dissipate heat through the metal housing.

[0086] The aforementioned bonding refers to a process of tightly bonding using adhesives or hot pressing. Bonding installation reduces space requirements, allowing for a more rational vehicle interior layout and improving assembly efficiency and space utilization. By directly bonding to the metal shell, the FPC can utilize the shell's metal material as a heat dissipation path, improving its thermal performance and extending its lifespan. Furthermore, the frame or body structure provides physical protection for the FPC, reducing the impact of vibration and shock on the conductive layers and improving the overall reliability and safety of the electrical system.

[0087] In one alternative embodiment, the flexible circuit board (FPC) can be tightly attached to the inner wall of the metal housing using thermally conductive adhesive or double-sided tape. This allows heat generated by the FPC during operation to be transferred to the metal housing and dissipated into the air through its surface. Alternatively, vacuum technology can be used to press the FPC firmly against the metal housing, removing air and increasing the contact area and heat conduction. For example, thermoforming can be employed. By directly attaching the flexible circuit board to the inner wall of the metal housing, the control device fully utilizes the heat dissipation potential of the metal housing, effectively reducing the temperature of the flexible circuit board and extending the lifespan of the control device. This design not only reduces the need for additional heat dissipation components and simplifies the device structure but also improves heat dissipation efficiency. This is especially crucial in high-power electronic devices such as high-performance computers and electric vehicle battery management systems, where this heat dissipation method is essential for maintaining normal operation. Furthermore, the electromagnetic shielding properties of the metal housing are fully utilized, reducing the impact of external electromagnetic interference on the internal circuitry.

[0088] In another alternative embodiment, a high thermal conductivity material, such as thermally conductive adhesive or a thermal pad, can be added between the FPC and the metal housing to enhance heat conduction efficiency. A thermal pad made of silicone or copper foil with high thermal conductivity is placed at the contact surface between the FPC and the inner wall of the metal housing, forming an efficient heat conduction path. It is crucial to ensure that the thermally conductive material adheres tightly to the FPC and the housing to reduce thermal resistance.

[0089] The control device of this embodiment can be applied to a vehicle. In order to save interior space, the flexible circuit board can be attached to the inner wall of the metal housing to dissipate heat through the metal housing.

[0090] Optionally, the flexible circuit board is bent along the inner wall of the metal housing in a U-shape.

[0091] The aforementioned bending refers to the ability of flexible circuit boards to be folded, bent, or twisted during assembly to adapt to three-dimensional spatial conditions. The flexibility of flexible circuit boards allows them to be bent in various ways without affecting circuit functionality. This bending capability enables the arrangement of flexible circuit boards in confined or irregular spaces, improving the space utilization and design flexibility within the vehicle.

[0092] In one alternative embodiment, a portion of the flexible circuit board can be bent along two opposing inner walls of the metal housing by thermoforming or bending. Specifically, the U-shape can consist of two vertical segments and one horizontal segment, with the vertical segments bent along the inner walls of the metal housing and the horizontal segment conforming to the bottom or top of the metal housing. This U-shaped flexible circuit board design not only improves space utilization within the metal housing, but the U-shaped structure also enhances the strength of the flexible circuit board, reducing the risk of damage in vibration environments.

[0093] In another alternative embodiment, fine grooves or textures can be machined into the inner wall of the metal housing to increase the surface area, thereby increasing the contact area between the metal housing and the FPC and improving the effectiveness of the heat conduction path. Furthermore, increasing the contact area between the flexible circuit board and the metal housing also improves heat dissipation efficiency.

[0094] The control device of this embodiment can be applied to a vehicle. By bending the flexible circuit board along the inner wall of the metal housing into a U-shape to fit the metal housing, space can be saved and heat dissipation equipment can be saved, so as to dissipate heat by means of the metal housing.

[0095] Optionally, the control device further includes: a fixing device, the first end of which is located in the non-conductive area of ​​the flexible circuit board, and the second end of which is connected to a preset device for fixing the preset device in a preset position of the control device.

[0096] The aforementioned fixing device refers to a device used to secure a pre-installed device to a control device, thereby utilizing the available space on the flexible circuit board to save interior space. The fixing device can be any component used for fixing, such as screws, clips, buckles, or adhesives; there is no limitation on the fixing device, and it can be determined according to needs. The fixing device can prevent displacement or damage to the pre-installed device due to vibration or impact. In electric vehicles, the fixing device can also improve space layout, contributing to lightweight design and improved assembly efficiency. With the fixing device, the pre-installed device can be directly mounted on top of the FPC without worrying about the space occupied by wires or physical damage to the wires.

[0097] The aforementioned pre-installed devices can be non-electronic control unit equipment or structural components within the vehicle, depending on the location of the FPC and the available space above it. For example, for vehicle control equipment, pre-installed devices can be interior trim components such as seats, dashboards, trim panels, and floor mats. Utilizing the flexibility of the FPC, they can be installed close to these interior trim components, ensuring both the appearance and comfort of the interior while guaranteeing the transmission of electronic signals. Pre-installed devices can also be structural components such as frame reinforcement beams, sound insulation materials, and heat insulation covers. The FPC can be laid along uneven surfaces of the frame or body, utilizing its conformability to directly install or cover structural components without affecting the overall vehicle structure. Furthermore, pre-installed devices can also be sensors or actuators such as temperature sensors, pressure sensors, motors, and pumps. These devices can be directly installed above the FPC and communicate with the ECU or other control systems via the FPC's wiring, without requiring additional wiring channels. The pre-installed devices described here are merely examples and can be determined according to specific needs.

[0098] In one optional embodiment, the fixing device is made of a non-conductive material and can connect the flexible circuit board and the preset device using screws, clips, buckles, or adhesives to fix the preset device in a spare position within the control device. The first end of the fixing device can be located in a non-conductive area of ​​the flexible circuit board, such as an insulating layer or a blank edge of the flexible circuit board. The second end of the fixing device can be connected to the preset device. Thus, the preset device can be fixed in a preset position within the control device. Introducing the fixing device allows for more flexible integration and fixing of various preset devices, such as sensors, antennas, and cameras, within the control device. This not only simplifies the assembly process of the preset devices but also ensures precise positioning and secure connection of these devices within the control device. Furthermore, fixing the preset device with the fixing device fully utilizes the spare space above the flexible circuit board, placing the preset device in that space, thereby improving space utilization.

[0099] According to another aspect of the present invention, a vehicle is also provided, including: the above-described flexible circuit board or the above-described control device.

[0100] The internal structure and connection relationships of the flexible circuit board and control device can be defined as described in the above embodiments.

[0101] Optionally, the flexible circuit board or control device is attached to the vehicle frame.

[0102] The aforementioned frame is the vehicle's structure. The frame can be made of metal materials (such as steel or aluminum) and is used to support the body, engine, suspension system, seats, and other components. The frame not only provides structural strength for the vehicle but also serves as a mounting platform for flexible circuit boards and control equipment. The frame can also act as a radiator and support structure, helping to secure and protect the FPC (Flexible Printed Circuit), while utilizing its structural characteristics to assist in heat dissipation and improve thermal management efficiency.

[0103] In one alternative embodiment, the flexible circuit board or control device can be attached to the vehicle frame via adhesive bonding, magnetic attachment, or embedded mounting. This utilizes the structural strength and heat dissipation capabilities of the vehicle frame to provide robust support and efficient cooling for the flexible circuit board or control device. Attaching the flexible circuit board or control device to the vehicle frame not only saves interior space but also utilizes the frame's natural heat dissipation pathways, reducing reliance on additional cooling equipment and lowering vehicle cost and weight. In extreme weather or under high-load operating conditions, the structural strength of the frame also provides additional protection for the flexible circuit board or control device, reducing damage caused by vibration or impact.

[0104] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties. Furthermore, the collection, use and processing of the relevant data must comply with the relevant laws, regulations and standards of the relevant countries and regions, and corresponding operation portals are provided for users to choose to authorize or refuse.

[0105] In the above embodiments of this utility model, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0106] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A flexible circuit board, characterized in that, include: Multiple ports, with different ports connected to different electronic control units; Multiple conductive layers are stacked together, and at least one conductive layer has a via. Multiple wires, different wires are used to connect two different ports, any one wire is deployed in the same conductive layer among the multiple conductive layers, or deployed in different conductive layers among the multiple conductive layers using the via.

2. The flexible circuit board according to claim 1, characterized in that, The conductive layer has a plurality of vias, and the plurality of vias are arranged symmetrically along the center line of the flexible circuit board.

3. The flexible circuit board according to claim 2, characterized in that, When the vias are provided on two adjacent conductive layers, the projection positions of the vias on the two adjacent conductive layers coincide.

4. The flexible circuit board according to claim 3, characterized in that, The placement of any conductor is determined based on the type of data transmitted by the conductor or the current transmitted by the conductor.

5. The flexible circuit board according to claim 4, characterized in that, The cross-sectional areas of the wires deployed in different conductive layers are different, and the wires deployed in different conductive layers are used to carry currents of different magnitudes.

6. The flexible circuit board according to claim 5, characterized in that, The flexible circuit board also includes: At least one insulating layer is disposed between two adjacent conductive layers to isolate electrical transmission between the two adjacent conductive layers.

7. A control device, characterized in that, include: Multiple electronic control units are housed inside a metal casing; The flexible circuit board according to any one of claims 1 to 6.

8. The control device according to claim 7, characterized in that, The flexible circuit board is attached to the inner wall of the metal casing to dissipate heat through the metal casing.

9. The control device according to claim 8, characterized in that, The flexible circuit board is bent along the inner wall of the metal housing, forming a U-shape.

10. The control device according to claim 9, characterized in that, Also includes: A fixing device, wherein the first end of the fixing device is disposed in the non-conductive area of ​​the flexible circuit board, and the second end of the fixing device is connected to a preset device for fixing the preset device at a preset position of the control device.

11. A vehicle, characterized in that, include: The flexible circuit board according to any one of claims 1 to 6 or the control device according to any one of claims 7 to 10.

12. The vehicle according to claim 11, characterized in that, The flexible circuit board or the control device is attached to the vehicle frame.

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