An optical module

Abstract

The optical module provided by this application includes a circuit board with mounting holes, an optical emission sub-module, and an optical fiber connector. The optical emission sub-module includes an emission base, a laser, a translation prism, an optical fiber array fixing member, and an optical fiber array. The emission base includes a first mounting surface, a second mounting surface protruding from the first mounting surface, and a third mounting surface protruding from the second mounting surface. One end of the first mounting surface is provided with an opening, and the opening is larger than the dimension of the first mounting surface in the front-back direction. The laser is disposed on the third mounting surface, and the translation prism is disposed on the second mounting surface. One ends of the laser and the translation prism are located on the back side of the circuit board through the mounting holes. One end of the optical fiber array is embedded in the optical fiber array fixing member on the first mounting surface, and the other end passes through the opening and is coupled to the optical fiber connector. By adopting a special structural design and a reasonable assembly process, the overall assembly of the optical module is greatly simplified, the production efficiency and the maintenance efficiency are greatly improved, and it is more suitable for mass production.

Description

Technical Field

[0001] This application relates to the field of optical fiber communication technologies, and in particular, to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technologies have become increasingly important. In optical communication technologies, an optical module is a tool for realizing the mutual conversion of optical and electrical signals, and is one of the key components in optical communication devices. Moreover, with the development requirements of optical communication technologies, the transmission rate of optical modules has been continuously increasing.

[0003] With the increase in communication rates, the rate requirements for optical modules are also getting higher and higher. In recent years, in particular, 800G optical modules have gradually been introduced to the market. To achieve the transmission rate of an 8×100G single module, it is necessary to integrate 8 optical transmitters, 8 optical receivers, as well as 8 optical outputs and 8 optical inputs in the QSFP-DD or OSFP package. Implementing the required functions in such a narrow space poses great challenges in terms of high-frequency performance, optical performance, heat dissipation characteristics, structural complexity, producibility, and so on. Summary of the Invention

[0004] Embodiments of this application provide an optical module to address various problems such as the optical performance, heat dissipation characteristics, structural complexity, and producibility of a high-transmission-rate optical module in a narrow space.

[0005] An optical module provided by this application includes:

[0006] A circuit board, on which mounting holes are provided;

[0007] An optical emission sub-module, electrically connected to the circuit board and used for emitting optical signals;

[0008] An optical fiber connector, connected to the optical emission sub-module through an optical fiber array;

[0009] Wherein, the optical emission sub-module includes:

[0010] An emission base, including a first mounting surface, a second mounting surface, and a third mounting surface. The first mounting surface is recessed from the second mounting surface, and the second mounting surface is recessed from the third mounting surface; an opening is provided at one end of the first mounting surface facing the optical fiber connector, and the dimension of the opening in the front-rear direction is greater than the dimension of the first mounting surface in the front-rear direction;

[0011] A laser, disposed on the third mounting surface and located on the back side of the circuit board through the mounting hole, and used for generating multiple laser beams;

[0012] A translation prism is disposed on the second mounting surface. One end thereof is located on the back side of the circuit board through the mounting hole, and the other end is located on the front side of the circuit board, for reflecting the laser beam located on the back side of the circuit board to the front side of the circuit board;

[0013] An optical fiber array fixing member is disposed on the first mounting surface and located on the front side of the circuit board;

[0014] An optical fiber array, one end of which is embedded in the optical fiber array fixing member, and the other end passes through the opening of the emission base and is correspondingly coupled and connected to the optical fiber connector, for transmitting the laser beam reflected by the translation prism to the optical fiber connector.

[0015] The optical module provided by the present application includes a circuit board, an optical emission sub-module and an optical fiber connector. The circuit board is provided with a mounting hole. The optical emission sub-module is electrically connected to the circuit board. The optical fiber connector is connected to the optical emission sub-module through an optical fiber array to emit the optical signal emitted by the optical emission sub-module. Among them, the optical emission sub-module includes an emission base and a laser, a translation prism, an optical fiber array fixing member and an optical fiber array disposed on the emission base. The emission base includes a first mounting surface, a second mounting surface and a third mounting surface. The first mounting surface is recessed from the second mounting surface, and the second mounting surface is recessed from the third mounting surface. One end of the first mounting surface facing the optical fiber connector is provided with an opening, and the dimension in the front-back direction of the opening is greater than the dimension in the front-back direction of the first mounting surface. The laser is disposed on the third mounting surface and is located on the back side of the circuit board through the mounting hole to be connected to the high-frequency signal line on the back surface of the circuit board, which can reduce the length of the high-frequency transmission line. The translation prism is disposed on the second mounting surface. One end thereof is located on the back side of the circuit board through the mounting hole, and the other end is located on the front side of the circuit board, for reflecting the laser beam on the back side of the circuit board to the front side of the circuit board. The optical fiber array fixing member is disposed on the first mounting surface and located on the front side of the circuit board. One end of the optical fiber array is embedded in the optical fiber array fixing member, and the other end passes through the opening of the emission base and is correspondingly coupled and connected to the optical fiber connector, for transmitting the laser beam reflected by the translation prism to the optical fiber connector through the optical fiber array. In the present application, the laser and the translation prism are embedded in the mounting hole on the circuit board, and the laser beam emitted by the laser is correspondingly transmitted to the optical fiber connector through the optical fiber array. To facilitate the placement of the optical fiber array, the width dimension on the left side of the emission base is greater than the width dimension on the right side. That is, through a special structural design and a reasonable assembly process, the high-frequency performance, optical performance, heat dissipation characteristics, structural complexity, producibility and other functions required for an 8×100G optical module can be achieved in a narrow space, greatly simplifying the overall assembly of the module, greatly improving the production efficiency and maintenance efficiency, and being more suitable for mass production. Description of the Drawings

[0016] Figure 1 It is a schematic diagram of the connection relationship of an optical communication terminal;

[0017] Figure 2 It is a schematic structural diagram of an optical network unit;

[0018] Figure 3 It is a schematic structural diagram of an optical module provided by an embodiment of the present application;

[0019] Figure 4 It is a schematic exploded view of an optical module provided by an embodiment of the present application;

[0020] Figure 5 It is an assembly schematic diagram of a circuit board, an optical emission sub-module, an optical reception sub-module and an optical fiber connector in an optical module provided by an embodiment of the present application;

[0021] Figure 6 It is a schematic structural diagram of a circuit board in an optical module provided by an embodiment of the present application;

[0022] Figure 7 It is a schematic flipped view of an optical emission sub-module in an optical module provided by an embodiment of the present application;

[0023] Figure 8 It is a partial assembly schematic diagram of an optical emission sub-module and a circuit board in an optical module provided by an embodiment of the present application from another angle;

[0024] Figure 9 It is a cross-sectional view of an emission optical path in an optical module provided by an embodiment of the present application;

[0025] Figure 10 It is a schematic structural diagram of an emission base in an optical module provided by an embodiment of the present application;

[0026] Figure 11 It is a cross-sectional view of high-frequency signal line connection of an optical emission sub-module in an optical module provided by an embodiment of the present application;

[0027] Figure 12 It is a schematic diagram of high-frequency signal connection of an optical emission sub-module in an optical module provided by an embodiment of the present application;

[0028] Figure 13 It is a schematic diagram of a heat dissipation channel of an optical module provided by an embodiment of the present application;

[0029] Figure 14 It is a cross-sectional view of a monitoring optical path of a photodetector in an optical module provided by an embodiment of the present application;

[0030] Figure 15 It is a side view of a monitoring optical path of a photodetector in an optical module provided by an embodiment of the present application;

[0031] Figure 16It is a schematic assembly diagram of a circuit board and an optical receiving sub-module in an optical module provided by an embodiment of the present application;

[0032] Figure 17 It is a cross-sectional view of a receiving optical path in an optical module provided by an embodiment of the present application. Detailed implementation manners

[0033] For the convenience of explaining the technical solutions of the application, some concepts involved in the present application will be described first below.

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0035] One of the core links in optical fiber communication is the mutual conversion between optical and electrical signals. Optical fiber communication uses optical signals carrying information to transmit in information transmission devices such as optical fibers / optical waveguides. The passive transmission characteristics of light in optical fibers / optical waveguides can be used to achieve low-cost and low-loss information transmission; while information processing devices such as computers use electrical signals. In order to establish an information connection between information transmission devices such as optical fibers / optical waveguides and information processing devices such as computers, it is necessary to achieve the mutual conversion between electrical signals and optical signals.

[0036] The optical module realizes the above-mentioned mutual conversion function between optical and electrical signals in the field of optical fiber communication technology. The mutual conversion between optical and electrical signals is the core function of the optical module. The optical module realizes the electrical connection with the external host computer through the gold fingers on its internal circuit board. The main electrical connections include power supply, I2C signal, data signal, and grounding, etc.; the electrical connection method realized by using gold fingers has become the mainstream connection method in the optical module industry. Based on this, the definitions of the pins on the gold fingers have formed a variety of industry protocols / specifications.

[0037] Figure 1 It is a schematic diagram of the connection relationship of an optical communication terminal. As Figure 1 shown, the connection of the optical communication terminal mainly includes the mutual connection between the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103;

[0038] One end of the optical fiber 101 is connected to the remote server, one end of the network cable 103 is connected to the local information processing device, and the connection between the local information processing device and the remote server is completed by the connection of the optical fiber 101 and the network cable 103; while the connection between the optical fiber 101 and the network cable 103 is completed by the optical network terminal 100 with the optical module 200.

[0039] The optical port of the optical module 200 is externally connected to the optical fiber 101, establishing a two-way optical signal connection with the optical fiber 101; the electrical port of the optical module 200 is externally connected to the optical network terminal 100, establishing a two-way electrical signal connection with the optical network terminal 100; the mutual conversion between optical signals and electrical signals is realized inside the optical module, so as to establish an information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.

[0040] The optical network terminal has an optical module interface 102 for connecting to the optical module 200 and establishing a two-way electrical signal connection with the optical module 200; the optical network terminal has a network cable interface 104 for connecting to the network cable 103 and establishing a two-way electrical signal connection with the network cable 103; a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. Specifically, the optical network terminal transmits the signal from the optical module to the network cable and transmits the signal from the network cable to the optical module. The optical network terminal monitors the operation of the optical module as the host computer of the optical module.

[0041] Thus, the remote server establishes a two-way signal transmission channel with the local information processing device through the optical fiber, optical module, optical network terminal and network cable.

[0042] Common information processing devices include routers, switches, electronic computers, etc.; the optical network terminal is the host computer of the optical module, providing data signals to the optical module and receiving data signals from the optical module. Common host computers of optical modules also include optical line terminals, etc.

[0043] Figure 2 It is a schematic diagram of the optical network terminal structure. As Figure 2 shown, there is a circuit board 105 in the optical network terminal 100, and a cage 106 is arranged on the surface of the circuit board 105; an electrical connector is arranged inside the cage 106 for connecting to the electrical port of the optical module such as a gold finger; a radiator 107 is arranged on the cage 106, and the radiator 107 has convex parts such as fins for increasing the heat dissipation area.

[0044] The optical module 200 is inserted into the optical network terminal. Specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

[0045] The cage 106 is located on the circuit board, wrapping the electrical connector on the circuit board in the cage, so that there is an electrical connector inside the cage; the optical module is inserted into the cage, and the cage fixes the optical module. The heat generated by the optical module is conducted to the cage 106 and then diffused through the radiator 107 on the cage.

[0046] Figure 3A schematic structural diagram of an optical module provided by an embodiment of the present application Figure 4 A schematic exploded structural diagram of the optical module provided by an embodiment of the present application. As Figure 3 , Figure 4 shown, the optical module 200 provided by the embodiment of the present application includes an upper housing 201, a lower housing 202, a circuit board 300, an optical emission sub-module 400, an optical reception sub-module, and an optical fiber connector.

[0047] The upper housing 201 covers the lower housing 202 to form a wrapped cavity with two openings; the outer contour of the wrapped cavity generally presents a rectangular body. Specifically, the lower housing includes a main board and two side boards located on both sides of the main board and perpendicular to the main board; the upper housing includes a third housing, and the third housing covers the two side boards of the upper housing to form the wrapped cavity; the upper housing may further include two side walls located on both sides of the third housing and perpendicular to the third housing, and the two side walls are combined with the two side boards to realize the upper housing covering the lower housing.

[0048] The two openings may specifically be two openings at both ends in the same direction (204, 205), or two openings in different directions; one of the openings is an electrical port 204, and the gold fingers of the circuit board extend out from the electrical port 204 and are inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect the optical emission sub-module 400 and the optical reception sub-module inside the optical module; optoelectronic devices such as the circuit board 300, the optical emission sub-module 400, the optical reception sub-module, and the optical fiber connector are located in the wrapped cavity.

[0049] Adopting the assembly method of combining the upper housing and the lower housing facilitates the installation of devices such as the circuit board 300, the optical emission sub-module 400, the optical reception sub-module, and the optical fiber connector into the housing, and the upper housing and the lower housing form the outermost packaging and protection housing of the optical module; the upper housing and the lower housing generally adopt metal materials, which is beneficial to realizing electromagnetic shielding and heat dissipation; generally, the housing of the optical module will not be made into an integral part, so that when assembling devices such as the circuit board, positioning components, heat dissipation, and electromagnetic shielding components cannot be installed, and it is not conducive to production automation.

[0050] The optical module provided by the present application further includes an unlocking component, and the unlocking component is located on the outer wall of the wrapped cavity / the lower housing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.

[0051] The unlocking component has an engaging component that matches the upper computer cage; pulling the end of the unlocking component can cause the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is fixed in the cage of the upper computer by the engaging component of the unlocking component; by pulling the unlocking component, the engaging component of the unlocking component moves accordingly, thereby changing the connection relationship between the engaging component and the upper computer to release the engaging relationship between the optical module and the upper computer, so that the optical module can be withdrawn from the cage of the upper computer.

[0052] The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, transistors, MOS transistors), and chips (such as MCUs, laser driver chips, limiting amplifier chips, clock data recovery CDRs, power management chips, data processing chips DSP), etc. The circuit board connects the electrical components in the optical module together according to the circuit design through the circuit traces to achieve electrical functions such as power supply, electrical signal transmission, and grounding.

[0053] The circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a bearing function. For example, the rigid circuit board can stably bear the chip; when the optical transceiver device is located on the circuit board, the rigid circuit board can also provide a stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage. Specifically, metal pins / gold fingers are formed on the surface of one end of the rigid circuit board for connection with the electrical connector; these are not easily achieved by flexible circuit boards.

[0054] Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards; flexible circuit boards are generally used in cooperation with rigid circuit boards. For example, a flexible circuit board can be used to connect between the rigid circuit board and the optical transceiver device.

[0055] Figure 5 It is an assembly schematic diagram of the circuit board, optical emission sub-module, optical reception sub-module, and optical fiber connector in the optical module provided by the embodiment of the present application. As Figure 5As shown in the figure, the optical module provided by the embodiment of the present application includes an optical emission sub-module 400, a first optical reception sub-module 500, a second optical reception sub-module 600, and an optical fiber connector 700. The optical emission sub-module 400 adopts a bottom-up (flip-chip) optical transmitter structure, so that the bottom surface of the optical emission sub-module 400 is in contact connection with the upper housing 201, greatly improving the heat dissipation characteristics of the optical emission sub-module 400. The emission light beam emitted by the optical emission sub-module 400 is transmitted to the optical fiber connector 700 through the optical fiber array to realize the emission of light. The first optical reception sub-module 500 and the second optical reception sub-module 600 can be arranged on both sides of the optical emission sub-module 400, that is, the first optical reception sub-module 500 and the second optical reception sub-module 600 are located on the same surface of the circuit board 300. The light beam transmitted by the external optical fiber is transmitted to the first optical reception sub-module 500 and the second optical reception sub-module 600 through the optical fiber connector 700 to realize the reception of multiple light beams.

[0056] For an 800G optical module, to achieve the transmission rate of the 800G optical module, 8 optical transmitters and 8 optical receivers need to be integrated in the QSFP-DD or OSFP package. Therefore, the optical emission sub-module 400 includes 8 optical transmitters to realize the emission of 8 emission light beams. The first optical reception sub-module 500 includes 4 optical receivers to realize the reception of 4 reception light beams. The second optical reception sub-module 600 includes 4 optical receivers to realize the reception of 4 reception light beams.

[0057] Figure 6 It is a schematic structural diagram of the circuit board in the optical module provided by the embodiment of the present application. As Figure 6 shown, mounting holes 320 are provided on the circuit board 300, and the laser component of the optical emission sub-module 400 is embedded in the mounting holes 320, so that the laser component passes through the mounting holes 320 and is located on the lower surface (back surface) of the circuit board 300. In this way, the optical emission sub-module 400 is reversely assembled on the circuit board 300, so that the height of the wire bonding surface of the laser component is the same as the back surface of the circuit board 300 during assembly, so that the connection wire bonding between the back surface of the circuit board 300 and the laser component is the shortest, so as to ensure excellent high-frequency transmission performance.

[0058] Figure 7 It is a schematic diagram of the flip structure of the optical emission sub-module in the optical module provided by the embodiment of the present application. As Figure 7As shown in the figure, the optical emission sub-module 400 provided by the present application may include an emission base 410, a laser 420, a collimating lens 430, a translation prism 440, a lens array 450, an optical isolator 460, a fiber array fixture 470, and a fiber array 4710 disposed on the emission base 410. The bottom surface (the surface facing away from the mounting surface) of the emission base 410 faces the upper housing 201, and the mounting surface of the emission base 410 faces the circuit board 300. The laser 420, the collimating lens 430, the translation prism 440, the lens array 450, the optical isolator 460, and the fiber array fixture 470 are all mounted on the mounting surface of the emission base 410.

[0059] A laser beam emitted by the laser 420 is converted into a collimated beam by the collimating lens 430. The collimated beam is reflected by the translation prism 440 from the back side of the circuit board 300 to the front side of the circuit board 300. The laser beam reflected by the translation prism 440 is converted into a converging beam by the lens array 450. The converging beam directly passes through the optical isolator 460 and converges to the fiber array 4710 in the fiber array fixture 470. The beam is coupled to the fiber optic connector via the fiber array 4710 to achieve the emission of one optical signal.

[0060] For optical modules with high transmission rates, such as 8×100G optical modules, to achieve the transmission rate of the 8×100G optical module, 8 optical transmitters and 8 optical receivers need to be integrated in the QSFP-DD or OSFP package. Therefore, the optical emission sub-module 400 includes 8 optical transmitters to achieve the emission of 8 optical emission beams; the first optical reception sub-module 500 includes 4 optical receivers to achieve the reception of 4 received beams; the second optical reception sub-module 600 includes 4 optical receivers to achieve the reception of 4 received beams.

[0061] Based on this, the optical emission sub-module 400 may further include an emission base 410, multiple lasers 420, a collimating lens 430, a translation prism 440, a lens array 450, an optical isolator 460, and a fiber array fixture 470. The bottom surface of the emission base 410 faces the upper housing 201, and the mounting surface of the emission base 410 faces the circuit board 300. The laser 420, the collimating lens 430, the translation prism 440, the lens array 450, the optical isolator 460, and the fiber array fixture 470 are all mounted on the mounting surface of the emission base 410, and the mounting heights of the laser 420 and the collimating lens 430 are higher than the mounting height of the translation prism 440, and the mounting height of the translation prism 440 is higher than the mounting heights of the lens array 450, the optical isolator 460, and the fiber array fixture 470.

[0062] In the embodiment of the present application, the light emitting submodule 400 includes 8 lasers 420, 8 collimating lenses 430 and a translation prism 440. The lasers 420 and the collimating lenses 430 are arranged in a one-to-one correspondence. Each laser 420 emits a laser beam, and each collimating lens 430 converts a laser beam into a collimated beam. The collimated beam emitted by each collimating lens 430 is transmitted to the translation prism 440, and the collimated beam is reflected by the translation prism 440 to change the transmission direction of the laser beam.

[0063] Figure 8 This is a schematic diagram of the partial assembly of the circuit board and the light emitting submodule in the optical module provided in the embodiment of the present application. Figure 8 As shown, the transmitting base 410 of the optical transmitting submodule 400 is installed on the front side of the circuit board 300, and the multiple lasers 420 and the multiple collimating lenses 430 installed on the transmitting base 410 are located on the back side of the circuit board 300 through the mounting hole 320; one end of the translation prism 440 is located on the back side of the circuit board 300 through the mounting hole 320, and the other end of the translation prism 440 is fixed on the mounting surface of the transmitting base 410, and is located on the front side of the circuit board 300; the lens array 450, the optical isolator 460 and the optical fiber array fixing member 470 are fixed on the mounting surface of the transmitting base 410, and are located on the front side of the circuit board 300.

[0064] Multiple lasers 420 emit laser beams respectively, which are parallel to the back side of the circuit board 300; multiple collimating lenses 430 convert the laser beams emitted by the lasers 420 into collimated beams, and the multiple collimated beams are transmitted to the translation prism 440, which reflects the laser beams located on the back side of the circuit board 300 to the front side of the circuit board 300.

[0065] The function of the translation prism 440 is to translate the eight light beams upward by a certain distance so that all subsequent optical devices are located on the positive side of the circuit board 300 and maintain an appropriate gap with the circuit board 300. This avoids position conflicts between the optical devices and the circuit board 300, thereby reducing the hole area of ​​the circuit board 300 as much as possible, increasing the layout area of ​​the electronic devices on the circuit board 300, and making the wiring of the circuit board 300 easier.

[0066] Figure 9 This is a cross-sectional view of the emission light path in the optical module provided in the embodiment of the present application. Figure 9As shown, the translation prism 440 includes a first mirror 4410 and a second mirror 4420. The first mirror 4410 faces the collimating lens 430 and is located on the back side of the circuit board 300, and is configured to reflect the collimated light beam parallel to the back side of the circuit board 300 into a collimated light beam perpendicular to the circuit board 300. The second mirror 4420 faces the first mirror 4410 and is located on the front side of the circuit board 300, and is configured to reflect the collimated light beam perpendicular to the circuit board 300 into a collimated light beam parallel to the front side of the circuit board 300.

[0067] The lens array 450 is disposed on the mounting surface of the emission base 410, and the width dimension of the lens array 450 in the front-back direction can be the same as the width dimension of the translation prism 440 in the front-back direction. In this way, the laser light beam reflected to the front side of the circuit board 300 by the translation prism 440 enters the lens array 450, and each light beam is converted into a converging light beam by the corresponding lens in the lens array 450. The converging light beam is transmitted into the optical fiber array fixture 470 and is transmitted to the optical fiber connector 700 through the corresponding optical fiber of the optical fiber array fixture 470, so as to realize the emission of multiple light beams.

[0068] In the embodiment of the present application, the lens array 450 includes 8 converging lenses, and the optical fiber array fixture 470 includes 8 V-grooves. These 8 V-grooves are arranged side by side in the front-back direction. Each V-groove is embedded with one optical fiber of the optical fiber array 4710, and the optical fiber embedded in the V-groove is arranged in one-to-one correspondence with the converging lens. In this way, the converging light beam emitted from the converging lens in the lens array 450 enters the optical fiber array 4710 in the optical fiber array fixture 470. The optical fiber array 4710 is connected to the corresponding optical fiber interface of the optical fiber connector 700. In this way, the converging light beam entering the optical fiber array 4710 is transmitted to the optical fiber connector 700 through the corresponding optical fiber, thereby realizing the emission of multiple light beams.

[0069] To facilitate converging the converging light beam output by the lens array 450 into the optical fiber array 4710 in the optical fiber array fixture 470, the incident light surface of each optical fiber in the optical fiber array 4710 can be flush with the incident light surface of the optical fiber array fixture 470; alternatively, the incident light surface of each optical fiber in the optical fiber array 4710 can protrude from the incident light surface of the optical fiber array fixture 470 to reduce the distance between the lens array 450 and the optical fiber.

[0070] There is a gap between the light-emitting surface of the lens array 450 and the light-incident surface of the fiber optic array 4710. When the light beam output by the lens array 450 is transmitted to the light-incident surface of the fiber optic array 4710, reflection occurs due to the propagation of light at the interface of different media, that is, reflection occurs when the light beam is transmitted to the light-incident surface of the fiber optic array 4710. The reflected light beam may return to the laser 420 along the original path, affecting the light-emitting performance of the laser 420. To avoid this problem, the optical isolator 460 is disposed between the lens array 450 and the fiber optic array fixture 470. The light beam emitted by the lens array 450 passes through the optical isolator 460 and enters the fiber optic array 4710. The light beam is reflected at the light-incident surface of the fiber optic array 4710, and the optical isolator 460 can isolate the reflected light beam and prevent the reflected light beam from returning to the laser 420 along the original path.

[0071] In this way, the laser 420 located in the mounting hole 320 of the circuit board 300 emits a laser beam parallel to the back surface of the circuit board 300. The laser beam is converted into a collimated beam by the collimating lens 430 located in the mounting hole 320. The collimated beam is reflected by the translation prism 440 located in the mounting hole 320 to the front side of the circuit board 300 for the collimated beam parallel to the back side of the circuit board 300, forming a reflected beam parallel to the front surface of the circuit board 300. The reflected beam enters the corresponding converging lens in the lens array 450, and the reflected beam is converted into a converging beam by the converging lens. The converging beam passes through the optical isolator 460 and enters the fiber optic array 4710 in the fiber optic array fixture 470, and the multi-channel laser beams are respectively transmitted to the fiber optic connector 700 via the fiber optic array 4710, realizing the emission of multi-channel light beams.

[0072] In the embodiment of the present application, by adopting the layout method of optical path translation, the excessive bending of the fiber optic bundle is avoided, and at the same time, the position conflict area between the entire light emission sub-module 400 and the circuit board 300 can be reduced, achieving the purpose of reducing the hole digging of the circuit board 300, so as to facilitate high-frequency circuit wiring and increase the layout area of electronic components.

[0073] Figure 10 It is a schematic structural diagram of the emission base in the optical module provided by the embodiment of the present application. As Figure 10 shown, the emission base 410 includes a first mounting surface 4110, a second mounting surface 4120, and a third mounting surface 4130. The first mounting surface 4110 is recessed from the second mounting surface 4120, and the second mounting surface 4120 is recessed from the third mounting surface 4130, that is, the dimension of the third mounting surface 4130 from the back surface of the circuit board 300 is smaller than the dimension of the second mounting surface 4120 from the back surface of the circuit board 300, and the dimension of the second mounting surface 4120 from the back surface of the circuit board 300 is smaller than the dimension of the first mounting surface 4110 from the back surface of the circuit board 300, so that the first mounting surface 4110, the second mounting surface 4120, and the third mounting surface 4130 form a stepped surface.

[0074] The first mounting surface 4110, the second mounting surface 4120, and the third mounting surface 4130 are all parallel to the front surface of the circuit board 300. Baffles can be provided at the front and rear ends of the third mounting surface 4130. The baffles face the circuit board 300 and are in contact with the front surface of the circuit board 300. The front and rear ends of the second mounting surface 4120 are open to facilitate fixing the translation prism 440 on the second mounting surface 4120. The front, rear, and left ends of the first mounting surface 4110 are open to facilitate fixing the lens array 450, the optical isolator 460, and the optical fiber array fixture 470 on the first mounting surface 4110.

[0075] The laser 420 is disposed on a laser substrate, and the laser substrate is disposed on the third mounting surface 4130. The collimating lens 430 is disposed on the third mounting surface 4130 and is located in the light-emitting direction of the laser 420.

[0076] In the embodiment of the present application, 8 lasers 420 and 8 collimating lenses 430 are provided on the third mounting surface 4130 of the emission base 410. The 8 lasers 420 are respectively disposed on 8 laser substrates, and the 8 laser substrates are arranged side by side along the front-rear direction of the emission base 410, so that the 8 lasers 420 emit 8 beams of light.

[0077] The left-right dimensions of the 8 laser substrates provided on the third mounting surface 4130 can be the same, so that the distances of the 8 collimating lenses 430 from the left end surface of the third mounting surface 4130 are the same, thereby arranging the 8 lasers 420 and the 8 collimating lenses 430 side by side on the third mounting surface 4130.

[0078] The left-right dimensions of the 8 laser substrates provided on the third mounting surface 4130 may also be different. The laser substrate close to the rear side edge of the third mounting surface 4130 has a smaller distance from the right end surface of the third mounting surface 4130, and the laser substrate adjacent to this laser substrate has a larger distance from the right end surface of the third mounting surface 4130. Thus, the 8 laser 4 substrates are fixedly spaced on the third mounting surface 4130 in the setting manner of short, long, short, long, short, long, short, long. The distances of the collimating lenses 430 disposed in the light-emitting direction of the lasers 420 from the left end surface of the third mounting surface 4130 are also different. In this way, by optimizing the design of the laser substrates, the spacing of the multi-channel collimated light can be reduced to reduce the overall assembly size of the emission base 410, especially the width dimension of the emission base 410 in the front-rear direction, so as not to conflict with the optical receiving sub-module during assembly.

[0079] A translation prism 440 is disposed on the second mounting surface 4120 that is recessed from the third mounting surface 4130. The translation prism 440 is vertically fixed to the second mounting surface 4120, and the first mirror 4410 of the translation prism 440 is away from the second mounting surface 4120 and close to the laser 420 on the third mounting surface 4130. The second mirror 4420 of the translation prism 440 is close to the second mounting surface 4120 and is located directly on the side of the circuit board 300. In this way, the laser beam located on the back side of the circuit board 300 is reflected to the front side of the circuit board 300 through the translation prism 440.

[0080] A lens array 450, an optical isolator 460, and an optical fiber array fixture 470 are disposed on the first mounting surface 4110 that is recessed from the second mounting surface 4120. The light incident surface of the lens array 450 corresponds to the second mirror 4420 in the translation prism 440, and the laser beam reflected by the second mirror 4420 is incident into the corresponding converging lens of the lens array 450. The light incident surface of the optical isolator 460 corresponds to the light exit surface of the lens array 450, and the converging beam converted by the converging lens directly passes through the optical isolator 460. The light incident surface of the optical fiber array 4710 embedded in the optical fiber array fixture 470 corresponds to the light exit surface of the optical isolator 460, and the converging beam passing through the optical isolator 460 is converged into the corresponding optical fiber of the optical fiber array 4710 to transmit the beam to the optical fiber connector 700 through the optical fiber.

[0081] In the embodiment of the present application, the laser 420, the collimating lens 430, the translation prism 440, the lens array 450, the optical isolator 460, and the optical fiber array fixture 470 are fixed on the emission base 410 through the first mounting surface 4110, the second mounting surface 4120, and the third mounting surface 4130 that are arranged in a stepped manner to form different mounting height differences. The laser 420, the collimating lens 430, and the translation prism 440 with relatively high mounting heights are arranged on the back side of the circuit board 300 through the mounting holes 320 of the circuit board 300, and the lens array 450, the optical isolator 460, and the optical fiber array fixture 470 with relatively low mounting heights are arranged on the front side of the circuit board 300. In this way, the size of the overlapping area in space between the optical emission sub-module 400 and the circuit board 300 can be reduced.

[0082] When assembling the optical emission sub-module 400, the laser 420 can be first installed on the laser substrate, then the laser substrate is fixed on the third mounting surface 4130, then the collimating lens 430 is fixed on the third mounting surface 4130 according to the light emission direction of the laser 420, then the translation prism 440 is fixed on the second mounting surface 4120, and finally the lens array 450, the optical isolator 460, and the optical fiber array fixture 470 are independently fixed on the first mounting surface 4110 according to the light emission direction.

[0083] To reduce the assembly workload, an integrated optical component can also be adopted. The lens array 450, optical isolator 460, fiber array fixture 470, internal optical fiber and fiber optic connector 700 are assembled into a pre-assembled part, and then this pre-assembled part is directly fixed on the first mounting surface 4110 of the emission base 410. Then, the laser 420 is installed on the laser substrate, and the laser substrate is fixed on the third mounting surface 4130. Then, the collimating lens 430 is fixed on the third mounting surface 4130 in the light-emitting direction of the laser 420. Finally, the translation prism 440 is fixed on the second mounting surface 4120 in the light-emitting direction.

[0084] After the laser 420, collimating lens 430, translation prism 440, lens array 450, optical isolator 460 and fiber array fixture 470 are fixedly installed on the emission base 410, the emission base 410 is reversely installed on the front side of the circuit board 300, that is, the bottom surface of the emission base 410 faces the upper housing 201. After the first mounting surface 4110, second mounting surface 4120 and third mounting surface of the emission base 410 face the front side of the circuit board 300, the emission base 410 is fixed on the front side of the circuit board 300.

[0085] To fix the emission base 410 on the front side of the circuit board 300, two first support blocks 480 are arranged at one end of the first mounting surface 4110 of the emission base 410 away from the second mounting surface 4120. The first support block 480 extends from the first mounting surface 4110 towards the front side of the circuit board 300. The left end surface of the first support block 480 is flush with the left end surface of the emission base 410, and there is a gap between the two first support blocks 480. The optical fiber in the fiber array fixture 470 is placed in this gap. A first positioning pin 4810 is arranged on the side surface of the first support block 480 facing away from the first mounting surface 4110, and a positioning hole is arranged on the circuit board 300, and this positioning hole is arranged corresponding to the first positioning pin 4810.

[0086] In the embodiment of the present application, the width dimension of the first mounting surface 4110 of the emission base 410 in the front-back direction, the width dimension of the second mounting surface 4120 in the front-back direction and the width dimension of the third mounting surface 4130 in the front-back direction are the same, so that it is convenient to process the emission base 410. The width dimensions of the lens array 450, optical isolator 460 and fiber array fixture 470 mounted on the first mounting surface 4110 in the front-back direction can all be smaller than the width dimension of the first mounting surface 4110 in the front-back direction, or they can also be slightly larger than the width dimension of the first mounting surface 4110 in the front-back direction.

[0087] Since the optical fiber array 4710 is arranged side by side within the optical fiber array fixture 470 and there are gaps between adjacent optical fibers of the optical fiber array 4710, in order to be able to dispose the optical fiber array 4710 on the first mounting surface 4110, it is necessary to appropriately increase the width dimension of the first mounting surface 4110 in the front - rear direction where the optical fiber array 4710 is located, such that the width dimension of the first mounting surface 4110 in the front - rear direction where the optical fiber array 4710 is located is greater than the width dimension of the optical fiber array 4710 in the front - rear direction.

[0088] The optical fiber array 4710 embedded in the optical fiber array fixture 470 passes through the opening between the two first support blocks 480 and then is connected to the optical fiber connector 700. In order for the optical fiber array 4710 to pass through the opening of the first mounting surface 4110, the width dimension between the two first support blocks 480 is greater than the width dimension of the first mounting surface 4110 in the front - rear direction, that is, the width dimension of the opening between the two first support blocks 480 is greater than the width dimension of the first mounting surface 4110 in the front - rear direction.

[0089] When the width dimension of the opening between the two first support blocks 480 is greater than the width dimension of the first mounting surface 4110 in the front - rear direction, the width dimensions on the left and right sides of the first mounting surface 4110 are not the same, and the width dimension on the left side is greater than the width dimension on the right side.

[0090] A second support block 490 is provided at one end of the third mounting surface 4130 of the transmitting base 410 away from the optical fiber connector 700. The height dimension of the second support block 490 in the up - down direction can be greater than the height dimension of the third mounting surface 4130 in the up - down direction, that is, the side surface of the second support block 490 facing the circuit board 300 protrudes from the third mounting surface 4130. A second positioning pin is provided on the side surface of the second support block 490 facing the circuit board 300, and the second positioning pin is arranged corresponding to the positioning hole on the circuit board 300.

[0091] When the transmitting base 410 is reversely mounted on the front surface of the circuit board 300, one end of the first support block 480 is in contact with the front surface of the circuit board 300, and the first positioning pin 4810 on the first support block 480 is inserted into the corresponding positioning hole on the circuit board 300; the side surface of the second support block 490 is in contact with the front surface of the circuit board 300, and the second positioning pin 4910 on the second support block 490 is inserted into the corresponding positioning hole on the circuit board 300, thereby fixing the transmitting base 410 on the circuit board 300, and embedding the laser 420, the collimating lens 430 provided on the third mounting surface 4130 and the translation prism 440 provided on the second mounting surface 4120 into the mounting holes 320 on the circuit board 300, such that the wire - bonding surface height of the laser 420 is flush with the back surface of the circuit board 300, so as to make the high - frequency wire - bonding of the laser 420 the shortest, in order to ensure excellent high - frequency transmission performance.

[0092] The light emitting submodule 400 in the optical module provided by the embodiment of the present application is assembled in reverse, so that the wire bonding surface height of the laser 420 is the same as the back of the circuit board 300 during assembly, so that the connection wire bonding between the two is the shortest to ensure excellent high-frequency transmission performance. The unique layout of optical components can reduce the size of the entire light emitting submodule 400, and at the same time reduce the digging of the circuit board 300, so as to facilitate high-frequency line wiring and increase the layout area of ​​electronic components. By optimizing the design of the laser substrate, the spacing of multi-path collimated light can be reduced to reduce the geometric dimensions of the entire light emitting submodule 400, especially the width, so that there is no conflict with the light receiving submodule during assembly. In order to reduce the assembly workload, the lens array 450, the optical isolator 460 and the optical fiber array fixture 470, the internal optical fiber and the optical fiber connector 700 can be integrated and assembled in an integrated manner.

[0093] Figure 11 This is a cross-sectional view of the high-frequency signal line connection of the optical transmission submodule in the optical module provided in the embodiment of the present application. Figure 11 As shown, a DSP chip 310 is disposed on the front side of the circuit board 300. The DSP chip 310 is used for processing high-frequency signals and transmitting high-frequency signals to the laser 420 of the optical transmission submodule 400 to provide high-frequency signals for the laser 420. In order to transmit the high-frequency signal of the DSP chip 310 to the laser 420, a high-frequency signal via hole 330 is disposed under the Tx output pad of the DSP chip 310. The high-frequency signal via hole 330 runs through the front side and the back side of the circuit board 300. A high-frequency signal line is disposed in the high-frequency signal via hole 330. The high-frequency signal line passes through the high-frequency signal via hole 330 and is electrically connected to the Tx output pad of the DSP chip 310 to transmit the high-frequency signal.

[0094] Since the bonding surface height of the laser 420 in the optical transmission submodule 400 is flush with the back of the circuit board 300, the high-frequency signal line passes through the high-frequency signal via hole 330 and is laid along the back of the circuit board 300 to be electrically connected to the laser 420 through bonding, that is, one end of the high-frequency signal line is electrically connected to the Tx output pad of the DSP chip 310, and the other end is electrically connected to the laser 420. The high-frequency signal transmitted from the gold finger end of the circuit board 300 is processed by the DSP chip 310 and then transmitted to the laser 420 via the high-frequency signal line to drive the laser 420 to emit a laser beam.

[0095] The DSP chip 310 located on the front side of the circuit board 300 transmits the high-frequency signal on the circuit board 300 from the front side of the circuit board 300 to the back side of the circuit board 300 through the high-frequency signal line connected to its Tx output pad, so as to transmit the high-frequency signal to the laser 420 located on the back side of the circuit board 300, thereby realizing the wire bonding connection between the optical transmission sub-module 400 and the circuit board 300.

[0096] Figure 12 This is a schematic diagram of the high-frequency signal connection of the optical emission sub-module in the optical module provided by the embodiment of the present application. As Figure 12 shown, multiple high-frequency signal vias 330 on the circuit board 300 are arranged on the right side of the mounting hole 320, and each high-frequency signal via 330 is connected to the laser 420 in a one-to-one correspondence, so that the high-frequency signal line passing through each high-frequency signal via 330 is connected to the laser 420, and the high-frequency signal transmitted by the circuit board 300 is transmitted to the laser 420 to meet the high-frequency signal required by the optical emission sub-module 400.

[0097] The DC signal required by the optical emission sub-module 400 can be led from the left side of the mounting hole 320 on the circuit board 300 by wire bonding. After the laser 420 receives the DC signal transmitted by the current line, it can emit light. After the high-frequency signal line is transmitted to the laser 420, the laser 420 modulates the high-frequency signal into the light beam, so that the laser 420 generates a signal light.

[0098] The current line for transmitting the DC signal can also be connected to the laser 420 from the upper side and the lower side of the mounting hole 320, that is, the current line connecting the laser 420 and the high-frequency signal line are located on different sides of the mounting hole 320. This not only avoids the interference between the high-frequency signal and the DC signal, but also makes the routing of the DC signal shorter and avoids overcrowding of the wiring in the circuit board 300.

[0099] Figure 13 This is a schematic diagram of the heat dissipation channel of the optical module provided by the embodiment of the present application. As Figure 13 shown, after the optical emission sub-module 400 is reversely installed on the front side of the circuit board 300, the bottom surface of the optical emission sub-module 400 facing away from the circuit board 300 faces the upper housing 201; after the laser 420 in the optical emission sub-module 400 is signal-connected to the DSP chip 310 on the front side of the circuit board 300 through the high-frequency signal line, the laser 420 generates a laser beam under the drive of the high-frequency signal transmitted by the circuit board 300. In this way, the laser 420 will generate heat, and the luminous performance of the laser 420 is affected by temperature. Therefore, the laser 420 needs to work at a certain fixed temperature, and it is necessary to dissipate the heat of the laser 420 to ensure the working temperature of the laser 420.

[0100] Since the laser 420 is fixed on the emission base 410, the heat generated by the laser 420 will be transmitted to the emission base 410 to reduce the temperature of the laser 420. To improve the heat dissipation performance of the optical module, the emission base 410 can be made of tungsten copper or other metals with good thermal conductivity, and the mass and the bottom area of the emission base 410 can be appropriately increased. In this way, the heat generated by the laser 420 during operation can be transmitted to the upper housing 201 through the emission base 410, effectively improving the heat dissipation effect of the laser 420.

[0101] To ensure that the laser operates at a fixed temperature, a thermoelectric cooler 401 is provided between the laser substrate and the third mounting surface 4130 of the emission base 410. The thermoelectric cooler 401 is used for temperature control. When the thermoelectric cooler 401 cools, a large amount of heat is generated. If its heat dissipation channel is not good, it will lead to a decrease in the cooling efficiency of the thermoelectric cooler 401 and further cause the generation of more heat, thus forming a vicious cycle. Therefore, in this application, the mass of the emission base 410 and the contact area between the emission base 410 and the upper housing 201 are increased. In this way, the heat generated by the laser 420 is transmitted to the laser substrate, the laser substrate transmits the heat to the thermoelectric cooler 401, the thermoelectric cooler 401 transmits the heat to the emission base 410, and the emission base 410 transmits the heat to the upper housing 201, thereby transmitting the heat generated by the laser 420 to the outside of the optical module.

[0102] To facilitate the transmission of the heat of the emission base 410 to the upper housing 201, a heat-conducting gasket can be provided between the bottom of the emission base 410 and the inner side surface of the upper housing 201. The heat conductivity of the heat-conducting gasket is greater than that of the emission base 410. In this way, the heat of the emission base 410 is transmitted to the heat-conducting gasket, and the heat-conducting gasket transmits the heat to the upper housing 201 to effectively improve the heat dissipation effect.

[0103] In the embodiment of this application, in addition to the laser 420 and the thermoelectric cooler 401, the main heat source of the optical module is also the DSP chip 310. The side of the DSP chip 310 facing away from the circuit board 300 is in contact with the upper housing 201. In this way, the heat generated by the operation of the DSP chip 310 is transmitted to the upper housing 201 to transmit the heat generated by the DSP chip 310 to the outside of the optical module.

[0104] To facilitate the transmission of the heat of the DSP chip 310 to the upper housing 201, a heat-conducting gasket can be provided between the DSP chip 310 and the inner side surface of the upper housing 201. The heat conductivity of the heat-conducting gasket is greater than that of the DSP chip 310. In this way, the heat generated by the DSP chip 310 is transmitted to the heat-conducting gasket, and the heat-conducting gasket transmits the heat to the upper housing 201 to effectively improve the heat dissipation effect.

[0105] Figure 14 It is a cross-sectional view of the monitoring optical path of the photodetector in the optical module provided by the embodiment of this application. Figure 15 It is a side view of the monitoring optical path of the photodetector in the optical module provided by the embodiment of this application. As Figure 14 、 Figure 15As shown, the laser 420 emits a laser beam under the drive of a high-frequency signal. To monitor the emission optical power of the laser 420, a photodetector 340 is provided on the back surface of the circuit board 300. The photodetector 340 is disposed on the left edge of the mounting hole 320 on the circuit board 300, and the photosensitive surface of the photodetector 340 faces the light-emitting direction of the laser 420, and is used to detect the luminous power of the laser 420.

[0106] In the embodiment of the present application, by utilizing the light-transmitting characteristic of the reflecting surface of the first reflecting mirror 4410 of the translation prism 440, a small part of the collimated beam leaks through the first reflecting mirror 4410 and enters the photosensitive surface of the photodetector 340, so that the photodetector 340 receives a part of the beam and performs power detection on it, thereby obtaining the emission optical power of the laser 420.

[0107] Specifically, the first reflecting mirror 4410 of the translation prism 440 faces the light-emitting direction of the laser 420, and is used to divide the laser beam generated by the laser into two beams of light. One beam of light is reflected by the first reflecting mirror 4410 to the second reflecting mirror 4420 to reflect the laser beam from the back side of the circuit board 300 to the front side of the circuit board 300, and the other beam of light directly passes through the first reflecting mirror 4410 and enters the photosensitive surface of the photodetector 340, and the laser beam emitted from the light-emitting surface of the laser 420 is received through the photosensitive surface.

[0108] The side surface of the photodetector 340 facing the back surface of the circuit board 300 can be assembled on the back surface of the circuit board 300 by surface mount technology (SMT), so as to fixedly mount the photodetector 340 on the back surface of the circuit board 300. Since the photodetector 340 receives parallel light with a certain area, the assembly position accuracy requirement of the photodetector 340 is low, and the assembly is easier. As long as the transmission range of the first reflecting mirror 4410 in the translation prism 440 is aligned with the photosensitive surface of the photodetector 340, the photodetector 340 can detect the luminous optical power of the laser 420 according to the received beam.

[0109] When the photodetector 340 is disposed on the back surface of the circuit board 300, the central axis of the photosensitive surface in the photodetector 340 is coincided with the central axis of the laser 420, and the photosensitive surface of the photodetector 340 can be flush with the inner side wall of the mounting hole 320 to facilitate the fixing of the photodetector 340; or the photosensitive surface of the photodetector 340 can protrude from the inner side wall of the mounting hole 320 to reduce the distance between the photosensitive surface and the first reflecting mirror 4410, so that the photosensitive surface of the photodetector 340 can receive most of the laser beam passing through the first reflecting mirror 4410, thereby improving the accurate value of the forward optical power detection of the laser 420.

[0110] When the optical detector 340 is fixed on the back surface of the circuit board 300, an anode is provided on the side surface of the optical detector 340 connected to the back surface of the circuit board 300. The anode can be directly welded or conductively fixed on the ground metal layer on the circuit board 300 by means of conductive adhesive, etc. A cathode is provided on the side surface of the optical detector 340 facing away from the back surface of the circuit board 300. The cathode is electrically connected to the circuit board 300 by wire bonding, thereby realizing the electrical connection between the optical detector 340 and the circuit board 300.

[0111] Figure 16 This is a schematic assembly diagram of the circuit board and the optical receiving sub-module in the optical module provided by the embodiment of the present application. As Figure 16 shown, for an 8×100G optical module, the optical module provided by the embodiment of the present application includes two optical receiving sub-modules. The first optical receiving sub-module 500 and the second optical receiving sub-module 600 can be symmetrically arranged on both sides of the mounting hole 320 on the circuit board 300, that is, the first optical receiving sub-module 500 is arranged on the front side of the mounting hole 320 on the circuit board 300, and the second optical receiving sub-module 600 is arranged on the rear side of the mounting hole 320 on the circuit board 300. The first optical receiving sub-module 500 and the second optical receiving sub-module 600 are respectively connected to the optical interfaces of the optical fiber connector 700 through the optical fiber array. In this way, the external light beam received by the optical fiber connector 700 is transmitted to the first optical receiving sub-module 500 through the optical fiber array to realize the reception of four light beams; the external light beam received by the optical fiber connector 700 is transmitted to the second optical receiving sub-module 600 through the optical fiber array to realize the reception of another four light beams.

[0112] Specifically, the optical receiving sub-module includes a total of two groups of 4×100G optical receiving components. Each group of 4×100G optical receiving components includes 1 four-way corner V-groove, 4 optical fibers embedded in the corner V-groove, 4 detectors 350 and 1 limiting amplifier 360. In the optical module, these two groups of optical receiving components form a symmetrical structure, which is more convenient for high-frequency signal wiring, and at the same time avoids position conflicts between components, making the overall structure compact and facilitating installation.

[0113] Figure 17 This is a cross-sectional view of the receiving optical path in the optical module provided by the embodiment of the present application. As Figure 17As shown, the structures of the first optical receiving sub-module 500 and the second optical receiving sub-module 600 are the same. The second optical receiving sub-module 600 includes a corner V-groove 610 and multiple optical fibers 620 embedded in the corner V-groove 610. The corner V-groove 610 is fixed on the front surface of the circuit board 300. The multiple optical fibers 620 are arranged side by side in the corner V-groove 610 in the front-back direction. That is, there are 4 V-grooves arranged side by side in the corner V-groove 610, and each V-groove is embedded with an optical fiber 620, and the optical fiber 620 is placed at the bottom of the V-groove facing the circuit board 300. One end of the corner V-groove 610 facing away from the optical fiber connector 700 is set as an inclined surface, and the distance between its side surface facing away from the circuit board 300 and the circuit board 300 gradually decreases, and this inclined surface is a reflecting surface. This reflecting surface is arranged directly above the detector 350 on the circuit board 300. In this way, when the light beam transmitted through the optical fiber 620 reaches the reflecting surface of the corner V-groove 610, it is reflected, changing the transmission direction of the light beam in the optical fiber 620, reflecting the received light beam parallel to the circuit board 300 into a light beam perpendicular to the circuit board 300, so as to inject the received light beam into the detector 350 on the circuit board 300, realizing the reception of light.

[0114] The DSP chip 310 on the circuit board 300 is connected to the detector 350 arranged on the front surface of the circuit board 300 through a signal line. The high-frequency signal received by the detector 350 is transmitted to the DSP chip 310 through the high-frequency signal line connecting the detector 350 and the DSP chip 310 for processing, and then transmitted to the communication system through the gold finger. This is beneficial to the installation, coupling and circuit connection of the optical components required for the receiving signal of the optical receiving sub-module.

[0115] A limiting amplifier 360 can also be arranged on the circuit board 300. One end of the limiting amplifier 360 is connected to the detector 350 through a signal line, and the other end is connected to the DSP chip 310 through a signal line. The high-frequency signal received by the detector 350 is amplified by the limiting amplifier and then transmitted to the DSP chip 310 through the high-frequency signal line connecting the limiting amplifier 360 and the DSP chip 310 for processing. After being processed by the DSP chip 310, the high-frequency signal is then transmitted to the communication system through the gold finger.

[0116] In an embodiment of the present application, the fiber array fixture 470 in the optical emission sub-module 400, the four-way corner V-groove in the first optical reception sub-module 500, the four-way corner V-groove in the second optical reception sub-module 600, and the fiber optic connector 700 can be an integrated multi-channel fiber array assembly. The fiber optic connector 700 can be a single-row 16-core or two-row 12-core MPO connector. The fiber connection end of the fiber array fixture 470 in the optical emission sub-module 400 is an 8-channel fiber array. These 8-channel fiber arrays are respectively and correspondingly connected to the 8-core interfaces of the fiber optic connector 700 through 8 optical fibers, so that 8 optical emission signals are respectively transmitted to the fiber optic connector 700 through 8 optical fibers. The four-way corner V-groove in the first optical reception sub-module 500 is internally provided with 4-channel fiber arrays. These 4-channel fiber arrays are respectively and correspondingly connected to the 4-core interfaces of the fiber optic connector 700 through 4 optical fibers, so that 4 optical reception signals are respectively transmitted to the first optical reception sub-module 500 through 4 optical fibers. The four-way corner V-groove in the second optical reception sub-module 600 is internally provided with 4-channel fiber arrays. These 4-channel fiber arrays are respectively and correspondingly connected to the 4-core interfaces of the fiber optic connector 700 through 4 optical fibers, so that 4 optical reception signals are respectively transmitted to the second optical reception sub-module 600 through 4 optical fibers.

[0117] When the fiber array fixture 470, the optical isolator 460, the lens array 450 in the optical emission sub-module 400, the four-way corner V-groove in the first optical reception sub-module 500, the four-way corner V-groove in the second optical reception sub-module 600, and the fiber optic connector 700 are an integrated multi-channel fiber array assembly, the integrated multi-channel fiber array assembly can be directly placed on the circuit board 300, and then the four-way corner V-groove of the first optical reception sub-module 500 and the four-way corner V-groove of the second optical reception sub-module 600 are fixed at corresponding positions on the circuit board 300, so that the detectors provided on the circuit board 300 are located directly below the reflecting surfaces of the four-way corner V-grooves, thereby realizing the assembly of the first optical reception sub-module 500 and the second optical reception sub-module 600. Then, the fiber array fixture 470, the optical isolator 460, and the lens array 450 in the optical emission sub-module 400 are fixedly installed on the first installation surface 4110 of the emission base 410, and then the laser 420, the collimating lens 430, and the translation prism 440 of the optical emission sub-module 400 are fixedly installed on the third installation surface 4130 and the second installation surface 4120 of the emission base 410, and then the emission base 410 is fixed on the circuit board 300, thereby realizing the assembly of the optical emission sub-module 400.

[0118] The optical module provided in the embodiment of the present application adopts a single-chip circuit board to simplify the installation difficulty; the optical path translation is used to reduce the hole digging area of ​​the circuit board, which is easier to layout; an integrated optical fiber array is used, including a multi-channel optical fiber connector, a multi-channel forward input optical fiber array fixture, two sets of symmetrically placed angled V-grooves, a lens array, an optical isolator, etc., to reduce the assembly workload; the optical emission sub-module adopts a bottom-up (flip-chip) assembly structure to reduce the overall geometric size of the optical emission sub-module and greatly improve the heat dissipation characteristics of the optical emission sub-module; the laser of the optical emission sub-module adopts a new spacing setting to greatly reduce the spacing between the lasers and the width of the optical emission sub-module, and the laser, collimating lens and translation prism of the optical emission sub-module are placed on the back side of the circuit board through the mounting holes on the circuit board to ensure that the high-frequency transmission line length is the shortest; an independent optical emission sub-module structure is used to facilitate production and maintenance; an innovative optical power detection design is used to realize direct detection of the forward light output power of the laser, and the detection value is more real and accurate.

[0119] The optical module provided in the present application achieves high-frequency signal integrity while maximally improving the heat dissipation effect of the optical transmission submodule through a unique structural design and arrangement, and greatly reduces the number of optical components and the assembly workload by adopting integrated optical components, that is, the high-frequency performance, optical performance, heat dissipation characteristics, structural complexity, manufacturability and other functions required for a high-transmission rate optical module are achieved in a small space. By adopting a special structural design and a reasonable assembly process, the overall assembly of the module is greatly simplified, the production efficiency and maintenance efficiency are greatly improved, and it is more suitable for mass production.

[0120] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, characterized in that, Comprising: A circuit board, on which mounting holes are provided; An optical emission sub-module, electrically connected to the circuit board, for emitting optical signals; An optical fiber connector, connected to the optical emission sub-module through an optical fiber array; Wherein, the optical emission sub-module includes: An emission base, including a first mounting surface, a second mounting surface and a third mounting surface, the first mounting surface is recessed from the second mounting surface, and the second mounting surface is recessed from the third mounting surface; one end of the first mounting surface facing the optical fiber connector is provided with an opening, and the dimension in the front-back direction of the opening is greater than the dimension in the front-back direction of the first mounting surface; A laser, disposed on the third mounting surface, located on the back side of the circuit board through the mounting hole, for generating a laser beam; A translation prism, disposed on the second mounting surface, one end of which is located on the back side of the circuit board through the mounting hole and the other end is located on the front side of the circuit board, for reflecting the laser beam located on the back side of the circuit board to the front side of the circuit board; An optical fiber array fixing member, disposed on the first mounting surface, located on the front side of the circuit board; An optical fiber array, one end of which is embedded in the optical fiber array fixing member, and the other end passes through the opening of the emission base and is correspondingly coupled to the optical fiber connector, for transmitting the laser beam reflected by the translation prism to the optical fiber connector.

2. The optical module according to claim 1, wherein First support blocks are symmetrically arranged at one end of the first mounting surface where the opening is located, the distance between the first support blocks in the front-back direction is greater than the width dimension of the first mounting surface in the front-back direction, and the optical fiber arrays are arranged side by side in the front-back direction between the first support blocks; The side surface of the first support block facing the circuit board is in contact connection with the front surface of the circuit board.

3. The optical module according to claim 2, wherein A second support block is disposed at one end of the emission base facing away from the optical fiber connector, and the side surface of the second support block facing the circuit board protrudes from the third mounting surface; The side surface of the second support block facing the circuit board is in contact connection with the front surface of the circuit board.

4. The optical module according to claim 1, characterized in that The translation prism includes a first reflecting mirror and a second reflecting mirror, the first reflecting mirror faces the light-emitting direction of the laser, for reflecting the laser beam generated by the laser to the front side of the circuit board; The second reflecting mirror faces the light-emitting direction of the first reflecting mirror, for reflecting the laser beam reflected by the first reflecting mirror to the optical fiber array again.

5. The optical module according to claim 1, characterized in that, The optical emission sub-module further includes a lens array, the lens array is disposed on the first mounting surface, between the translation prism and the optical fiber array fixing member, for converting the laser beam reflected by the translation prism into a converging beam.

6. The optical module according to claim 5, wherein The lens array, the optical fiber array fixing member, the optical fiber array and the optical fiber connector are an integrated component.

7. The optical module according to claim 5, characterized in that, It further includes a plurality of optical reception sub-modules, the optical reception sub-module includes a corner V-groove and an optical fiber array embedded in the corner V-groove, and the optical fiber array is connected to the optical fiber connector; A reflecting surface is disposed at one end of the corner V-groove facing away from the optical fiber connector, and the distance between the reflecting surface and the circuit board gradually decreases.

8. The optical module according to claim 7, wherein, A plurality of detectors are further disposed on the circuit board, and the detectors are located directly below the reflecting surface.

9. The optical module according to claim 7, wherein The lens array, the optical fiber array fixture, the corner V-groove, the optical fiber array and the optical fiber connector are an integrated component.

10. The optical module according to claim 1, wherein The optical fiber connector is a single-row 16-core or two-row 12-core MPO connector.

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