A drive component and related equipment

Abstract

This application provides a driving component and related equipment applicable to optical communication scenarios such as OXC, VOA, and WSS, or projection display fields. A first fixed structure, a second fixed structure, and a third fixed structure are fixed to a substrate. A rotating frame is connected to the first fixed structure via a first cantilever beam, and a first comb tooth is formed on the rotating frame. The first and second comb teeth are arranged alternately, with the second comb tooth formed on the second fixed structure. A rotating platform is located inside the rotating frame and is connected to the rotating frame via the second cantilever beam, with a third comb tooth formed on the rotating platform. The third and fourth comb teeth are arranged alternately, with the fourth comb tooth formed on the rotating structure. The rotating structure is connected to the third fixed structure via the third cantilever beam, and the rotating structure is fixed together with the rotating frame. The first and second comb teeth drive the rotating frame and the rotating structure to rotate around a first axis. The third and fourth comb teeth drive the rotating platform to rotate around a second axis.

Description

Technical Field

[0001] This application relates to the field of MEMS micromirrors, and more particularly to a driving component and related devices. Background Technology

[0002] Micro-Electro-Mechanical Systems (MEMS) micromirrors are devices used to deflect or modulate light, offering advantages such as small size, low cost, ease of integration, and high reliability. Currently, MEMS micromirrors are widely used in optical communication and projection display fields, with the main driving methods including electrostatic, magnetoelectric, piezoelectric, and thermoelectric approaches.

[0003] Electrostatically driven MEMS micromirrors utilize the potential difference applied to the driving structure to generate electrostatic force, thereby driving the micromirror to translate or twist. The driving structure of an electrostatically driven MEMS micromirror mainly includes a planar electrode structure and a driving comb structure. For example, the driving combs on both sides of the X-axis drive the micromirror to rotate around the X-axis via a hinge structure; similarly, the electrostatically driven combs on both sides of the Y-axis drive the micromirror to rotate around the Y-axis via a hinge structure. However, this driving structure cannot decouple the micromirror's rotation along the two axes, leading to crosstalk between the two axes. Summary of the Invention

[0004] This application provides a driving component and a driving array that can decouple the rotation of the rotating frame and rotating structure from the rotation of the rotating platform, thus avoiding crosstalk caused by the rotation of the driving component in two axes.

[0005] In a first aspect, this application provides a driving assembly. The driving assembly includes: a substrate, a rotating structure, a rotating frame, a rotating platform, a first fixed structure, a second fixed structure, a third fixed structure, a first cantilever beam, a second cantilever beam, and a third cantilever beam. The first, second, and third fixed structures are fixed to the substrate. The rotating frame is connected to the first fixed structure via the first cantilever beam, and a first comb tooth is formed on the rotating frame. The first and second comb teeth are arranged alternately, and the second comb tooth is formed on the second fixed structure. The rotating platform is located inside the rotating frame and is connected to the rotating frame via the second cantilever beam. A third comb tooth is formed on the rotating platform. The third and fourth comb teeth are arranged alternately, and the fourth comb tooth is formed on the rotating structure. The rotating structure is connected to the third fixed structure via the third cantilever beam, and the rotating structure is fixed together with the rotating frame. The first and second comb teeth are used to drive the rotating frame and the rotating structure to rotate about a first axis. The third and fourth comb teeth are used to drive the rotating platform to rotate about a second axis. The first axis is perpendicular to the second axis.

[0006] In this embodiment, when the rotating frame and rotating structure rotate together around the first axis and the rotating platform is not driven, the relative positions between the comb teeth on the rotating platform and the comb teeth on the rotating structure remain unchanged, and will not affect the rotation of the rotating platform around the second axis. Through this method, the rotation of the rotating frame and rotating structure can be decoupled from the rotation of the rotating platform, avoiding crosstalk caused by the rotation of the driving components in two axes.

[0007] In one possible implementation, the rotating structure and the rotating frame are electrically isolated, allowing different voltages to be applied to the third and fourth comb teeth to create a potential difference, thereby driving the rotating platform to rotate.

[0008] In one possible implementation, each side of the rotating frame is connected to a first fixed structure via a first cantilever beam, and each of the other two sides of the rotating frame has a row of first comb teeth. The two rows of first comb teeth are staggered with two rows of second comb teeth. The two rows of second comb teeth are formed on the second fixed structure. Each side of the rotating platform is connected to the rotating frame via a second cantilever beam, and each of the other two sides of the rotating platform has a row of third comb teeth. The two rows of third comb teeth are staggered with two rows of fourth comb teeth. The two rows of fourth comb teeth are formed on two rotating structures, and each of the two rotating structures is connected to a third fixed structure via a third cantilever beam. In this implementation, the aforementioned fixed structures, cantilever beams, and comb teeth are typically arranged in pairs and symmetrically, which firstly improves the overall stability of the drive assembly structure and ensures that the drive assembly can rotate in both directions when rotating around the first and second axes.

[0009] In one possible implementation, when the first comb teeth are parallel to the second comb teeth, one row of the first comb teeth is located above one row of the second comb teeth, and the other row of the first comb teeth is located below the other row of the second comb teeth. In this implementation, the torque directions of the two sets of comb teeth are the same, which is equivalent to increasing the rotational torque. Based on the same potential difference, a larger rotation angle of the rotating frame can be achieved.

[0010] In one possible implementation, when the third and fourth comb teeth are parallel, one row of third comb teeth is positioned above one row of fourth comb teeth, and the other row of third comb teeth is positioned below the other row of fourth comb teeth. In this implementation, the torque directions of the two sets of comb teeth are the same, which is equivalent to increasing the rotational torque. Based on the same potential difference, a larger rotation angle of the rotating platform can be achieved.

[0011] In one possible implementation, when the first comb tooth is parallel to the second comb tooth and the third comb tooth is parallel to the fourth comb tooth, the second comb tooth is located below the first comb tooth, and the fourth comb tooth is located below the third comb tooth. This provides a structure in which the comb teeth are distributed vertically and staggered, improving the feasibility of the solution.

[0012] In one possible implementation, a first fixed platform is fixed to the side of the third fixed structure away from the substrate, and a second fixed platform is fixed to the side of the rotating structure away from the substrate. The first fixed platform is connected to the second fixed platform via a third cantilever beam, and the third cantilever beam and the first cantilever beam are located in the same plane. The second fixed platform is electrically isolated from the rotating frame to avoid crosstalk between the voltage on the rotating frame and the voltage on the rotating platform. In this implementation, by designing the first and second fixed platforms, the third cantilever beam can be raised to the same plane as the first cantilever beam. Since the rotating frame and the rotating structure rotate together, having the third cantilever beam and the first cantilever beam in the same plane allows for better control of the center of gravity during rotation of the rotating frame and the rotating structure, resulting in higher operational stability.

[0013] In one possible implementation, the third fixing structure is electrically connected to the first fixing platform via a through-silicon via (TSV), and the rotating structure is electrically connected to the second fixing platform via a TSV, thereby improving the practicality of this solution.

[0014] In one possible implementation, when the first comb tooth is parallel to the second comb tooth and the third comb tooth is parallel to the fourth comb tooth, the second comb tooth is located above the first comb tooth, and the fourth comb tooth is located above the third comb tooth. Another structure is provided where the comb teeth are distributed vertically and staggered, improving the flexibility of this solution.

[0015] In one possible implementation, a third fixed platform is fixed to the side of the rotating structure closest to the substrate. The third fixed platform is connected to the third fixed structure via a third cantilever beam, which is located in the same plane as the first cantilever beam. The third fixed platform is electrically isolated from the rotating frame to avoid crosstalk between the voltage on the rotating frame and the voltage on the rotating platform. In this implementation, the third fixed platform can be designed to lower the third cantilever beam to the same plane as the first cantilever beam. Since the rotating frame and the rotating structure rotate together, having the third cantilever beam and the first cantilever beam in the same plane allows for better control of the center of gravity during rotation, resulting in higher operational stability.

[0016] In one possible implementation, the rotating structure is electrically connected to a third fixed platform via a TSV, which improves the practicality of the solution.

[0017] In one possible implementation, the first fixing structure is electrically connected to or grounded to the first electrode, the second fixing structure is electrically connected to the second electrode, and the third fixing structure is electrically connected to the third electrode. A potential difference exists between the first and second comb teeth to drive the rotating frame and the rotating platform to rotate together around the first axis, and a potential difference exists between the third and fourth comb teeth to drive the rotating platform to rotate around the second axis, thus enhancing the feasibility of this solution.

[0018] In one possible implementation, the second and third electrodes are located on the top surface of the substrate and are electrically isolated from it. The second electrode is electrically connected to the second fixed structure via wafer bonding, and the third electrode is electrically connected to the third fixed structure via wafer bonding. A specific implementation for applying voltage to each comb tooth is provided, further enhancing the feasibility of this solution.

[0019] In one possible implementation, the second and third electrodes are located on the bottom surface of the substrate. The second electrode is electrically connected to the second fixed structure via a TSV, and the third electrode is electrically connected to the third fixed structure via a TSV. In this implementation, since the top surface of the substrate may have cavities causing space constraints, the electrodes on the bottom surface of the substrate can be connected to external electrodes, facilitating wiring. Alternatively, the electrodes on the bottom surface of the substrate can be directly electrically interconnected to a printed circuit board or package via soldering, improving device integration.

[0020] In one possible implementation, the drive assembly further includes a covering structure that covers the rotating frame, rotating structure, and rotating platform. The second and third electrodes are located on the side of the covering structure away from the substrate. The second electrode is electrically connected to each second fixed structure via a TSV, and the third electrode is electrically connected to each third fixed structure via a TSV. In this implementation, the covering structure serves a dustproof function, preventing dust particles from falling into the drive assembly and reducing airflow between the inside and outside of the covering structure, thus increasing the overall structural damping and allowing the drive assembly to rotate to the required angle more quickly. Furthermore, since the top surface of the substrate may have cavities causing space constraints, the electrodes on the top surface of the covering structure can be electrically interconnected to a printed circuit board or package via wire bonding, simplifying the wiring process.

[0021] In one possible implementation, the substrate includes a cavity, and the rotating frame, rotating structure, and rotating platform are suspended above the cavity. By creating a cavity in the substrate to provide rotational space, a portion of the substrate's space is utilized, resulting in a more compact overall structure.

[0022] In one possible implementation, the depth of the cavity is greater than the maximum displacement of the rotating frame, rotating platform, and rotating structure in the direction perpendicular to the substrate during rotation. In other words, sufficient rotation space must be provided to avoid collisions with the substrate.

[0023] In one possible implementation, the drive assembly further includes a stop structure fixed within the cavity, the height of which is less than or equal to the depth of the cavity. This stop structure serves as a limiting mechanism to prevent the cantilever beam from breaking due to excessive displacement of the movable components connected to it in the event of a drop or external impact.

[0024] In one possible implementation, the drive assembly further includes a mass balancing structure disposed on the side of the rotating platform near the substrate. This mass balancing structure serves to balance the center of gravity of the overall drive assembly, reducing off-axis rotation and improving the stability of the drive assembly during rotation.

[0025] In one possible implementation, the first cantilever beam is a straight beam, an inclined beam, or a folded beam; the second cantilever beam is a straight beam, an inclined beam, or a folded beam; and the third cantilever beam is a straight beam, an inclined beam, or a folded beam. Straight beams have a simple manufacturing process but are susceptible to residual stress during processing. Folded beams have a complex manufacturing process but can release stress and have a greater tolerance for residual stress during processing.

[0026] In one possible implementation, the driving assembly further includes a reflective element and a support structure, wherein the support structure is disposed on the side of the rotating platform away from the substrate, and the reflective element is disposed on the support structure. By placing the driving assembly for rotating the reflective element in the space below the reflective element in this manner, the driving assembly naturally does not occupy space in the plane where the reflective element is located. Thus, the overall structure can be made more compact without sacrificing the size of the reflective element.

[0027] In one possible implementation, the surface of the reflective element is provided with a reflective film to enhance the reflection of incident light.

[0028] In one possible implementation, the first fixing structure is a fixed frame, and the rotating frame is located inside the fixed frame, providing a flexible deformation mode for the drive component of this application.

[0029] In one possible implementation, the materials of the first cantilever beam, the second cantilever beam, the third cantilever beam, the first comb tooth, the second comb tooth, the third comb tooth, the fourth comb tooth, the rotating frame, the rotating structure, the rotating platform, the first fixed structure, the second fixed structure, and the third fixed structure are any one of monocrystalline silicon, polycrystalline silicon, or amorphous silicon, which further improves the practicality of this solution.

[0030] Secondly, this application provides a drive array. The drive array includes an enclosure structure and a plurality of drive components as described in any embodiment of the first aspect. Each drive component is enclosed by the enclosure structure, and every two adjacent drive components are separated by the enclosure structure to prevent airflow disturbance to adjacent drive components during rotation. Simultaneously, the enclosure structure forms an electric field shield, which can reduce electrical crosstalk between adjacent drive components.

[0031] Thirdly, this application provides a drive control system, which includes a printed circuit board, a control chip, a connector, and a drive component as described in the first aspect. The drive component is packaged in a casing. The control chip, connector, and drive component are fixed on the printed circuit board. The control chip is connected to the drive component through the connector. The control chip is used to output control signals to the drive component to control the rotation of the drive component.

[0032] Fourthly, this application provides a drive control system, which includes a printed circuit board, a control chip, a connector, and a drive array as described in the second aspect. The control chip, connector, and drive array are fixed on the printed circuit board. The control chip is connected to the drive array through the connector. The control chip is used to output control signals to the drive array to control the rotation of at least one drive component in the drive array.

[0033] Fifthly, this application provides a projection display system, which includes an encoder, a controller, a light source, a beam shaping device, and a driving component as described in the first aspect above. The driving component includes a reflective element. The encoder converts the image to be projected into a control signal and outputs the control signal to the controller. The controller controls the light source to output at least one beam according to the control signal. The beam shaping device shapes the at least one beam and outputs the shaped beam to the driving component. The controller also controls the driving component to rotate according to the control signal to project the shaped beam from the at least one beam.

[0034] Sixthly, this application provides a projection display system comprising an encoder, a controller, a light source, a beam shaping device, and a drive array as described in the second aspect above, each drive component in the drive array including a reflective element. The encoder converts the image to be projected into a control signal and outputs the control signal to the controller. The controller controls the light source to output at least one beam according to the control signal. The beam shaping device shapes the at least one beam and outputs the shaped beam to the drive array. The controller further controls at least one drive component in the drive array to rotate according to the control signal to project the shaped beam.

[0035] In a seventh aspect, this application provides a head-up display (HUD) system, which includes a projection display system as described in the fifth or sixth aspect above, wherein a windshield reflects the light beam projected by the projection display system so that the human eye can see the projected image through the windshield.

[0036] Eighthly, this application provides a desktop display system, which includes a projection display system as described in the fifth or sixth aspect above.

[0037] Ninthly, this application provides an intelligent vehicle light that includes a projection display system as described in the fifth or sixth aspect above, which projects images around the vehicle.

[0038] In a tenth aspect, this application provides a vehicle that includes a head-up display system as described in the seventh aspect above; and / or intelligent vehicle lights as described in the ninth aspect.

[0039] In one aspect, this application provides an optical cross connect (OXC) system, which includes a controller, a first fiber array, a second fiber array, a first driver array, and a second driver array. The first and second driver arrays are driver arrays as described in the second aspect above, and the driver components in both the first and second driver arrays include reflective elements. The first fiber array is used to couple at least one optical path to the first driver array. The controller is used to control the rotation of at least one driver component in the first driver array to reflect at least one optical path to the second driver array. The controller is also used to control the rotation of at least one driver component in the second driver array to couple at least one optical path to the second fiber array.

[0040] In a twelfth aspect, this application provides a spatial light field manipulation device, which includes a controller and a drive array as described in the second aspect above. The drive components in the drive array all include reflective elements. The controller controls the rotation of multiple drive components in the drive array to reflect light incident on the drive array to different positions in space.

[0041] In this embodiment, when the rotating frame and rotating structure rotate together around the first axis and the rotating platform is not driven, the relative positions between the comb teeth on the rotating platform and the comb teeth on the rotating structure remain unchanged, and this does not affect the rotation of the rotating platform around the second axis. Through this method, the rotation of the rotating frame and rotating structure can be decoupled from the rotation of the rotating platform, avoiding crosstalk caused by the rotation of the driving component in two axes. Furthermore, by placing the driving structure for driving the mirror's rotation in the space below the mirror, since the driving structure and the mirror are on different planes, the driving structure naturally does not occupy space on the plane where the mirror is located. In this way, the overall structure of the driving component can be more compact without sacrificing the size of the mirror. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the first structure of the driving component in the embodiments of this application;

[0043] Figure 2(a) is a schematic diagram of the drive assembly rotating about the first axis;

[0044] Figure 2(b) is a schematic diagram of the drive assembly rotating about the second axis;

[0045] Figure 2(c) is a schematic diagram of the drive assembly rotating simultaneously around the first axis and the second axis;

[0046] Figure 3 This is a plan view of the structure of the driving component in an embodiment of this application;

[0047] Figure 4(a) is a front view of the second structure of the driving component in an embodiment of this application;

[0048] Figure 4(b) is a reverse view of the second structure of the driving component in an embodiment of this application;

[0049] Figure 5 This is a schematic diagram of a third structure of the driving component in an embodiment of this application;

[0050] Figure 6 This is a schematic diagram of the fourth structure of the driving component in the embodiments of this application;

[0051] Figure 7 This is a schematic diagram of the fifth structure of the driving component in the embodiments of this application;

[0052] Figure 8 This is a schematic diagram of the sixth structure of the driving component in the embodiments of this application;

[0053] Figure 9(a) is a schematic diagram of the seventh structure of the driving component in the embodiments of this application;

[0054] Figure 9(b) is a schematic diagram of the eighth structure of the driving component in the embodiments of this application.

[0055] Figure 10 This is a schematic diagram of the ninth structure of the driving component in the embodiments of this application;

[0056] Figure 11 This is a schematic diagram of the tenth structure of the driving component in the embodiments of this application;

[0057] Figure 12 This is a schematic diagram of the first embodiment of the comb teeth with applied voltage in this application;

[0058] Figure 13 This is a second schematic diagram of the comb teeth being subjected to a voltage in an embodiment of this application;

[0059] Figure 14 This is a third schematic diagram of the comb-tooth applied voltage in the embodiments of this application;

[0060] Figure 15 This is a schematic diagram of a substrate structure in one embodiment of this application;

[0061] Figure 16 This is a schematic diagram of the eleventh structure of the driving component in the embodiments of this application;

[0062] Figure 17 These are schematic diagrams of several cantilever beam structures in the embodiments of this application;

[0063] Figure 18 This is a schematic diagram of the drive array structure in an embodiment of this application;

[0064] Figure 19 This is a schematic diagram of a MEMS micromirror structure in an embodiment of this application;

[0065] Figure 20 This is a schematic diagram of a projection display system in one embodiment of this application;

[0066] Figure 21 This is a schematic diagram of the OXC system in one embodiment of this application;

[0067] Figure 22 This is a schematic diagram of a spatial light field modulation device in an embodiment of this application. Detailed Implementation

[0068] This application provides a drive component and related equipment that decouples the rotation of the rotating frame and rotating structure from the rotation of the rotating platform, avoiding crosstalk caused by the drive component rotating in two axes. The terms "first," "second," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0069] Figure 1 This is a schematic diagram of a first structural representation of the driving component in an embodiment of this application. For example... Figure 1 As shown, the drive assembly includes a first fixed structure 11, a second fixed structure 12, a third fixed structure 13, a first cantilever beam 21, a second cantilever beam 22, a third cantilever beam 23, a first comb tooth 31, a second comb tooth 32, a third comb tooth 33, a fourth comb tooth 34, a rotating frame 40, a rotating structure 50, and a rotating platform 60. The rotating frame 40 is connected to the first fixed structure 11 via the first cantilever beam 21, and the first comb tooth 31 is formed on the rotating frame 40. The second fixed structure 12 has the second comb tooth 32 formed on it, and the first comb tooth 31 and the second comb tooth 32 are arranged alternately. The rotating platform 60 is located inside the rotating frame 40, and the rotating platform 60 is connected to the rotating frame 40 via the second cantilever beam 22, and the third comb tooth is formed on the rotating platform 60. The rotating structure 50 is fixed together with and electrically isolated from the rotating frame 40. The rotating structure 50 is connected to the third fixed structure 13 via the third cantilever beam 23. A fourth comb tooth 34 is formed on the rotating structure 50, and the third comb tooth 33 and the fourth comb tooth 34 are arranged alternately. The first fixed structure 11, the second fixed structure 12, and the third fixed structure 13 are all fixed on the substrate. A structural diagram including the substrate will be provided in later embodiments. A support structure 70 is also provided on the rotating platform 60, which is used to fix the reflector. A structural diagram including the reflector will be provided in later embodiments. It should be noted that the above... Figure 1 The components of the driving assembly shown can be made of highly doped silicon materials, such as monocrystalline silicon, polycrystalline silicon, or amorphous silicon. Furthermore, the components of the driving assembly can be made of the same material or different materials.

[0070] The first comb teeth 31 and the second comb teeth 32 generate electrostatic force by applying different voltages, thereby driving the rotating frame 40 to rotate around the first axis. Furthermore, since the rotating frame 40 and the rotating structure 50 are fixed together, the rotating platform 60 is connected to the rotating frame 40 via the second cantilever beam 22. Therefore, the rotating structure 50 and the rotating platform 60 also rotate around the first axis along with the rotating frame 40. The third comb teeth 33 and the fourth comb teeth 34 generate electrostatic force by applying different voltages, thereby driving the rotating platform 60 to rotate around the second axis, wherein the first axis is perpendicular to the second axis. It should be understood that the first cantilever beam 21 and the third cantilever beam 23 are independent of each other and do not need to be fixed together one above the other. Moreover, both the first cantilever beam 21 and the third cantilever beam 23 are arranged along or parallel to the first axis, allowing the rotating frame 40 and the rotating structure 50 to rotate together around the first axis. The second cantilever beam 22 is arranged along or parallel to the second axis, allowing the rotating platform 60 to rotate around the second axis.

[0071] Down Figures 2(a)-2(c) Schematic diagrams of the drive assembly rotating about different axes are shown. Figure 2(a) shows a schematic diagram of the drive assembly rotating about the first axis. Figure 2(b) shows a schematic diagram of the drive assembly rotating about the second axis. Figure 2(c) shows a schematic diagram of the drive assembly rotating about both the first and second axes simultaneously.

[0072] With the above design, when the rotating frame 40 and rotating structure 50 rotate together around the first axis and the rotating platform 60 is not driven, the relative positions between the third comb tooth 33 on the rotating platform 60 and the fourth comb tooth 34 on the rotating structure 50 remain unchanged, and the rotation of the rotating platform 60 around the second axis is not affected. This achieves decoupling between the rotation of the rotating frame 40 and rotating structure 50 and the rotation of the rotating platform 60, avoiding crosstalk caused by the rotation of the drive components in two axes.

[0073] In one possible implementation, the aforementioned fixing structures, cantilever beams, and comb teeth are typically arranged in pairs and placed symmetrically. For example... Figure 1As shown, each side of the rotating frame 40 is connected to the first fixed structure 11 via a first cantilever beam 21, and each side of the rotating frame 40 has a row of first comb teeth 31. Each of the two second fixed structures 12 has a row of second comb teeth 32, with the two rows of first comb teeth 31 alternating with the two rows of second comb teeth 32. Each side of the rotating platform 60 is connected to the rotating frame 40 via a second cantilever beam 22, and each side of the rotating platform 60 has a row of third comb teeth 33. Two rows of fourth comb teeth 34 are formed on the two rotating structures 50, and each of the two rotating structures 50 is connected to the third fixed structure 13 via a third cantilever beam 23, with the two rows of third comb teeth 33 alternating with the two rows of fourth comb teeth 34. In another possible embodiment… Figure 3 This is a planar schematic diagram of the structure of the driving component in an embodiment of this application. Figure 3 As shown, the first fixing structure 11 can also be set inside the rotating frame 40.

[0074] It should be noted that one set of first comb teeth 31 and second comb teeth 32 is used to drive the rotating frame 40 and rotating structure 50 to rotate clockwise around the first axis, while another set of first comb teeth 31 and second comb teeth 32 is used to drive the rotating frame 40 and rotating structure 50 to rotate counterclockwise around the first axis. Similarly, one set of third comb teeth 33 and fourth comb teeth 34 is used to drive the rotating platform 60 to rotate clockwise around the second axis, while another set of third comb teeth 33 and fourth comb teeth 34 is used to drive the rotating platform 60 to rotate counterclockwise around the second axis. This symmetrical design improves the overall stability of the drive assembly. Of course, in practical applications, this symmetrical design may not be necessary. For example, in some scenarios, only unidirectional rotation around the first and second axes is required, which can reduce the area of ​​the drive structure and save costs.

[0075] Figure 4(a) is a front view of the second structure of the driving component in an embodiment of this application. Figure 4(b) is a back view of the second structure of the driving component in an embodiment of this application. (The last sentence appears to be incomplete and possibly refers to a different view.) Figure 1 The difference between the structures shown is that the driving structure shown in Figure 4(a) and Figure 4(b) includes four second fixing structures 12, which is equivalent to... Figure 1 Based on the structure shown, the two second fixing structures 12 are split into four. The rotating frame 40 adopts a cross-shaped structure as shown in Figure 4(a), with the four second fixing structures 12 located at the four corners of the outer side of the rotating frame 40. Correspondingly, the driving structure shown in Figures 4(a) and 4(b) includes four rows of first comb teeth 31 and four rows of second comb teeth 32, with the four rows of first comb teeth 31 and the four rows of second comb teeth 32 arranged alternately. It should be understood that the structures shown in Figures 4(a) and 4(b) are only based on the above... Figure 1This is a variation of the structure shown. In practical applications, the number of second fixing structures can be extended to 6 or 8, etc., and is not limited here. Furthermore, this application does not limit the number of first fixing structures 11 and third fixing structures 13. For example, multiple first fixing structures 11 can be arranged side-by-side on the same side of the rotating frame 40, each first fixing structure 11 connected to the rotating frame 40 via a first cantilever beam 21 to enhance the overall stability of the drive assembly. Similarly, multiple third fixing structures 13 can be arranged side-by-side on the same side of each rotating structure 50, each third fixing structure 13 connected to the rotating structure 50 via a third cantilever beam 23. Similarly, the same side of the rotating platform 60 can also be connected to the rotating frame 40 via multiple side-by-side second cantilever beams 22.

[0076] Figure 5 This is a schematic diagram of a third structure of the driving component in an embodiment of this application. For example... Figure 5 As shown, the first fixing structure 11, the second fixing structure 12, and the third fixing structure 13 are all fixed on the substrate 80. The difference from the aforementioned driving assembly is that... Figure 5 In the structure shown, the first fixed structure 11 is a fixed frame, and the rotating frame 40 is located inside the fixed frame, providing a flexible deformation mode for the drive component of this application.

[0077] Figure 6 This is a schematic diagram of the fourth structure of the driving component in an embodiment of this application. For example... Figure 6 As shown in Figure 4(a), a reflective element 90 is placed on the support structure 70. A reflective film can also be provided on the surface of the reflective element 90 to enhance the reflection of incident light. This reflective film can specifically be a metal thin film or a multilayer dielectric film, etc. The reflective element 90 can be of various shapes, such as circular, elliptical, or rectangular, and is not specifically limited here. The material of the reflective element 90 can be any of monocrystalline silicon, polycrystalline silicon, or amorphous silicon. It should be understood that... Figure 6 The structure shown can be considered a MEMS micromirror. The rotation of the rotating frame 40 or the rotating platform 60 will also drive the reflective element 90 to rotate together, thereby reflecting the incident light to different directions through the reflective element 90. It should be noted that in this application, the driving component used to drive the rotation of the reflective element is placed in the space below the reflective element. The driving component naturally does not occupy the space of the plane on which the reflective element is located. In this way, the overall structure can be made more compact without sacrificing the size of the reflective element.

[0078] Figure 7 This is a schematic diagram of the fifth structure of the driving component in an embodiment of this application. For example... Figure 7As shown, the drive assembly also includes a covering structure 100. The covering structure 100 covers the rotating frame 40, the rotating structure 50, and the rotating platform 60. Specifically, the covering structure 100 can fill around the support structure 70, thereby enclosing the reflective element 90. It should be understood that the covering structure 100 does not enclose the reflective surface of the reflective element 90, and a gap is left between the reflective element 90 and the covering structure 100 to allow the reflective element 90 to rotate normally. The material of the covering structure 100 can be any of monocrystalline silicon, polycrystalline silicon, or amorphous silicon. It should be noted that by designing this covering structure 100, it can serve a dustproof function, preventing dust particles from falling into the drive assembly, reducing airflow inside and outside the covering structure, increasing the damping of the overall structure, and allowing the drive assembly to rotate to the required angle more quickly.

[0079] It should be noted that in the driving assembly provided in this application, the rotating frame 40 and the rotating structure 50 are fixed together in a direction perpendicular to the substrate 80, i.e., one is on top of the other. The rotating frame 40 and the rotating structure 50 can be fixed together and electrically isolated by providing a layer of electrical insulating material. This electrical insulating material can be a dielectric material such as silicon oxide, silicon nitride, aluminum oxide, or aluminum nitride. Correspondingly, the first comb tooth 31 and the second comb tooth 32 are in a positional relationship of one on top of the other, and the third comb tooth 33 and the fourth comb tooth 34 are also in a positional relationship of one on top of the other. In practical applications, there can be various variations, which will be described below. It should be understood that this vertical positional relationship between the comb teeth is viewed from the perspective of the upper and lower comb teeth being in a parallel state.

[0080] As shown in Figure 4(a), the second comb tooth 32 is located below the first comb tooth 31, the fourth comb tooth 34 is located below the third comb tooth 33, and the rotating structure 50 is located below the rotating frame 40.

[0081] Figure 8 This is a schematic diagram of the sixth structure of the driving component in an embodiment of this application. For example... Figure 8 As shown, the second comb tooth 32 is located above the first comb tooth 31, the fourth comb tooth 34 is located above the third comb tooth 33, and the rotating structure 50 is located above the rotating frame 40.

[0082] Figure 9(a) is a schematic diagram of the seventh structure of the driving component in this application embodiment. As shown in Figure 9(a), one row of first comb teeth 31a is located above one row of second comb teeth 32a, and another row of first comb teeth 31b is located below the other row of second comb teeth 32b. In this implementation, the torque directions of the two sets of comb teeth are the same, which is equivalent to increasing the rotational torque. Based on the same potential difference, the rotation angle of the rotating frame can be larger. For example, there is a potential difference between the first comb teeth 31a and the second comb teeth 32a. The second comb teeth 32a will attract the first comb teeth 31a to rotate in a direction closer to itself, that is, clockwise rotation. Similarly, since the first comb teeth 31b are electrically connected to the rotating frame 40 through a through-silicon via (TSV), the first comb teeth 31b and the first comb teeth 31a are subjected to the same voltage. Furthermore, the second comb tooth 32b has the same applied voltage as the second comb tooth 32a. The second comb tooth 32b will attract the first comb tooth 31b to rotate towards itself, increasing the rotational torque. Of course, a similar design can also be used to make the rotating frame 40 rotate counterclockwise around the first axis and increase the rotational torque, which will not be elaborated here.

[0083] Figure 9(b) is a schematic diagram of the eighth structure of the driving component in this application embodiment. As shown in Figure 9(b), the third comb tooth 33 and the fourth comb tooth 44 can also adopt a design similar to that shown in Figure 9(a), that is, one row of third comb teeth 33a is located above one row of fourth comb teeth 34a, and the other row of third comb teeth 33b is located below the other row of fourth comb teeth 34b. Similarly, the torque directions of the two sets of comb teeth are the same, which is equivalent to increasing the rotational torque. Based on the same potential difference, the rotation angle of the rotating platform can be larger. For example, there is a potential difference between the third comb tooth 33a and the fourth comb tooth 34a. The fourth comb tooth 34a will attract the third comb tooth 33a to rotate in a direction closer to itself, that is, in a clockwise rotation direction. Similarly, since the third comb tooth 33b is electrically connected to the rotating platform 60 through TSV, the third comb tooth 33b and the third comb tooth 33a are loaded with the same voltage. Furthermore, the fourth comb tooth 34b has the same applied voltage as the fourth comb tooth 34a. The fourth comb tooth 34b will attract the third comb tooth 33b to rotate in a direction closer to itself, increasing the rotational torque. Of course, a similar design can also be used to make the rotating platform 60 rotate counterclockwise around the first axis and increase the rotational torque, which will not be elaborated here.

[0084] Figure 10 This is a schematic diagram of the ninth structure of the driving component in an embodiment of this application. For example... Figure 10 As shown above, Figure 5In a variation of the structure shown, a first fixed platform 131 is fixed to the side of the third fixed structure 13 away from the substrate 80. A second fixed platform 501 is fixed to the side of the rotating structure 50 away from the substrate 80. The first fixed platform 131 is connected to the second fixed platform 501 via a third cantilever beam 23. The third fixed structure 13 is electrically connected to the first fixed platform 131 via a TSV (Transient Voltage Supplier), and the rotating structure 50 is also electrically connected to the second fixed platform 501 via a TSV, ensuring that the voltage on the rotating structure 50 is consistent with the voltage applied to the third fixed structure 13. The TSV can be highly doped silicon, copper, tungsten, or other suitable materials, and its cross-sectional shape can be circular, rectangular, elliptical, etc. Correspondingly, an electrical isolation groove is provided between the second fixed platform 501 and the rotating frame 40 to prevent crosstalk between the voltage on the rotating frame 40 and the voltage on the rotating platform 50. It should be understood that by designing the first fixed platform 131 and the second fixed platform 501, the third cantilever beam 23 can be raised to the same plane as the first cantilever beam 21. Since the rotating frame 40 and the rotating structure 50 rotate together, the third cantilever beam 23 and the first cantilever beam 21 are on the same plane, which can better control the center of gravity of the rotating frame 40 and the rotating structure 50 when they rotate, resulting in higher working stability.

[0085] Figure 11 This is a schematic diagram of the tenth structure of the driving component in an embodiment of this application. For example... Figure 11 As shown above, Figure 8 In one variation of the structure shown, a third fixed platform 502 is fixed to the side of the rotating structure 50 near the substrate 80. The third fixed platform 502 is connected to the third fixed structure 13 via a third cantilever beam 23. The rotating structure 50 can be electrically connected to the third fixed platform 502 via a TSV (Transient Voltage Separator), ensuring that the voltage on the rotating structure 50 is consistent with the voltage applied to the third fixed structure 13. Correspondingly, an electrical isolation groove is provided between the third fixed platform 502 and the rotating frame 40 to prevent crosstalk between the voltage on the rotating frame 40 and the voltage on the rotating platform 50. It should be understood that by designing the third fixed platform 502, the third cantilever beam 23 can be lowered to the same plane as the first cantilever beam 21. Since the rotating frame 40 and the rotating structure 50 rotate together, having the third cantilever beam 23 and the first cantilever beam 21 on the same plane allows for better control of the center of gravity during rotation, resulting in higher operational stability.

[0086] The following section introduces several methods for applying voltage to each comb tooth in the drive assembly.

[0087] Figure 12 This is a first schematic diagram of the voltage applied to the comb teeth in an embodiment of this application. For example... Figure 12 As shown above, in the above Figure 5The structure shown is illustrated with only the substrate and electrodes. A cavity 805 can also be formed in the substrate 80. The rotating frame 40, rotating structure 50, and rotating platform 60 are all suspended above the cavity 805. The depth of the cavity 805 is greater than the maximum displacement of the rotating frame 40, rotating structure 50, and rotating platform 60 in the direction perpendicular to the substrate 80 during rotation. In other words, sufficient rotation space must be provided to avoid collisions with the substrate 80. Furthermore, by providing rotation space through the cavity 805 in the substrate 80, part of the substrate 80's space is utilized, making the overall structure more compact. Of course, in practical applications, the aforementioned fixing structures can also be raised on the substrate 80 to obtain sufficient space to support the rotation of the rotating frame 40, rotating structure 50, and rotating platform 60.

[0088] Electrodes 801, 802, bonding point 803, and wire 804 are all disposed on the same layer of the substrate 80, which can be referred to as the bonding wire layer in this application. An insulating layer is also disposed between the bonding wire layer and the substrate 80. Specifically, electrode 801 is electrically connected to the second fixing structure 12 via wafer bonding. Electrode 802 is electrically connected to the third fixing structure 13 via wafer bonding. It should be understood that the first fixing structure 11 can connect electrodes in a similar manner, or it can be grounded. Figure 12 The method of connecting the electrodes to the first fixed structure 11 will no longer be shown. Electrodes 801 and 802 can be connected to external electrodes via wires, and electrodes 801 located at different positions on the same side of the substrate can also be connected via wires.

[0089] Through the above method, the voltage applied to the second fixed structure 12 and the second comb tooth 32 is Vx. The voltage applied to the third fixed structure 13, the third cantilever beam 23, the rotating structure, and the fourth comb tooth is Vy. The voltage applied to the first fixed structure 11, the first cantilever beam 21, the rotating frame 40, the first comb tooth 31, the second cantilever beam 22, the rotating platform 60, and the third comb tooth 33 is Vr. The potential difference between the first comb tooth 31 and the second comb tooth 32 is |Vr-Vx|, and the potential difference between the third comb tooth 33 and the fourth comb tooth 34 is |Vr-Vy|. It should be noted that the voltage applied to the first comb tooth 31 and the third comb tooth 33 can be constant. According to actual needs, voltage is applied to the corresponding second comb tooth 32 to achieve clockwise or counterclockwise rotation of the rotating frame 40 around the first axis. Figure 1 Taking the structure shown as an example, voltage can be applied to one row of second comb teeth 32, while no voltage can be applied to the other row of second comb teeth 32. Similarly, voltage can also be applied to the corresponding fourth comb teeth 34 according to actual needs to achieve clockwise or counterclockwise rotation of the rotating platform 60 around the second axis.

[0090] Figure 13 This is a second schematic diagram illustrating the voltage applied to the comb teeth in an embodiment of this application. For example... Figure 13 As shown above, Figure 12 The difference in the structure shown is that electrodes are also provided on the bottom surface of substrate 80. These electrodes on the bottom surface of substrate 80 are electrically connected to the electrodes on the top surface of substrate 80 via TSVs. The electrodes on the bottom surface of substrate 80 can be conductive pads, solder balls, etc. Since the top surface of the substrate may have cavities causing space constraints, connecting external electrodes via the electrodes on the bottom surface of substrate 80 facilitates wiring. Alternatively, the electrodes on the bottom surface of substrate 80 can be directly electrically interconnected to a printed circuit board or package via soldering, improving device integration.

[0091] Figure 14 This is a third schematic diagram of the comb-tooth applied voltage in an embodiment of this application. For example... Figure 14 As shown above, Figure 12 The difference in the structure shown is that the top surface of the cladding structure 100 is also provided with an electrode. The electrode on the top surface of the cladding structure 100 is electrically connected to the electrode on the top surface of the substrate 80 via TSV. Since the top surface of the substrate may have a cavity, which may cause space constraints, the electrode on the top surface of the cladding structure 100 can be electrically interconnected with the printed circuit board or the package shell by wire bonding. Therefore, the wire bonding method is simpler.

[0092] Figure 15 This is a schematic diagram of a substrate structure in an embodiment of this application. For example... Figure 15 As shown, in one possible implementation, a stop structure 806 is also fixed in the cavity 805, wherein the height of the stop structure 806 is less than or equal to the depth of the cavity 805. The cross-section of the stop structure 806 can be circular, elliptical, rectangular, triangular, etc. The stop structure 806 serves as a limiter to prevent the cantilever beam from breaking due to excessive displacement of the rotating frame 40, rotating structure 50, and rotating platform 60 connected to the cantilever beam when the drive assembly is dropped or subjected to external impact. The material of the stop structure 806 can be any of monocrystalline silicon, polycrystalline silicon, or amorphous silicon. It should be understood that the stop structure 806 is preferably fixed at the center of the bottom of the cavity 805 or at a position close to the center of the bottom of the cavity 805 to avoid affecting the rotation of the rotating frame 40, rotating structure 50, and rotating platform 60.

[0093] Figure 16 This is a schematic diagram of the eleventh structure of the driving component in an embodiment of this application. For example... Figure 16As shown, a mass balancing structure 601 is fixed on the side of the rotating platform 60 near the substrate 80. The mass balancing structure 601 rotates together with the rotating platform 60. The mass balancing structure can be a cuboid or a cylinder, etc. The material of the mass balancing structure 60 can be any of monocrystalline silicon, polycrystalline silicon, or amorphous silicon. This mass balancing structure 60 serves to balance the center of gravity of the overall drive component, reduce off-axis rotation of the drive component, and improve the stability of the drive component during rotation.

[0094] Figure 17 These are schematic diagrams of several cantilever beam structures in the embodiments of this application. For example... Figure 17 As shown, the cantilever beams in the aforementioned drive assembly can adopt various different design methods. For example, they can be straight beam structures, double-inclined beam structures, symmetrical folding beam structures, or asymmetrical folding beam structures, etc., without specific limitations here. Among them, the manufacturing process of straight beams is simple, but they are easily affected by residual stress during manufacturing. The manufacturing process of folding beams is complex, but it can release stress and has a greater tolerance for residual stress during manufacturing.

[0095] The driver components provided in this application have been described above. Based on this, multiple driver components can be combined to form a driver array, which will be described below.

[0096] Figure 18 This is a schematic diagram of the drive array structure in an embodiment of this application. Figure 18 As shown, multiple driving components are arranged in the first and second axial directions to form a driving array. These driving components can share the same substrate 80. Each driving component is covered by a covering structure 100, and adjacent driving components are separated by the covering structure 100 to prevent airflow disturbance during rotation of the driving components. Simultaneously, the covering structure 100 forms an electric field shield, reducing electrical crosstalk between adjacent driving components. It should be understood that each driving component is independently controlled and can rotate its reflective element 90 to a suitable position according to actual needs.

[0097] It should be understood that the aforementioned driving components and driving arrays can be applied to optical communication fields such as optical crossconnect (OXC), optical attenuator (VOA), or wavelength selective switching (WSS), as well as to optical display modules required in fields such as light detection and ranging (LiDAR), head-up display (HUD), or augmented reality (AR). Several specific application scenarios are introduced below.

[0098] Figure 19 This is a schematic diagram of a drive control system in one embodiment of this application. Figure 19 As shown, the drive control system includes a drive component A1, a connector A2, a control chip A3, and a printed circuit board A4. The drive component A1, connector A2, and control chip A3 are fixed on the printed circuit board A4. The control chip A3 is connected to the drive component A1 via connector A2. The drive component A1 is specifically the drive component described in the above embodiment, and can be encapsulated by a transparent top casing. Specifically, the control chip A3 outputs control signals to the drive component A1 to control its rotation. It should be noted that... Figure 19 The drive control system shown can also be adopted as follows: Figure 18 The driving array shown replaces the driving component, and its operation is similar to that described in this embodiment, so it will not be repeated here.

[0099] Figure 20 This is a schematic diagram of a projection display system according to an embodiment of this application. Figure 20 As shown, the projection display system includes an encoder B1, a controller B2, a beam shaping device B3, a driving component B4, and a light source B5. The driving component B4 is the driving component described in the above embodiment, and it includes a reflective element. Specifically, the encoder B1 converts the image to be projected into a control signal and outputs the control signal to the controller B2. The controller B2 controls the light source B5 to output at least one beam according to the control signal. The beam shaping device B3 shapes the at least one beam and outputs the shaped beam to the driving component B4. The controller B2 also controls the driving component B4 to rotate according to the control signal to project the shaped beam onto the at least one beam, thereby forming a projected image. It should be noted that... Figure 20 The projection display system shown can also be used as follows: Figure 18The driving array shown replaces the driving component, and its operation is similar to that described in this embodiment, so it will not be repeated here.

[0100] Figure 21 This is a schematic diagram of one structure of the OXC system in an embodiment of this application. Figure 21 As shown, the OXC system includes a first fiber array C1, a first driver array C2, a second driver array C3, a second fiber array C4, and a controller C5. The first driver array C2 and the second driver array C3 can be as described above. Figure 18 The described drive arrays, specifically the first drive array C2 and the second drive array C3, both include reflective elements in their drive components. Specifically, the first fiber array C1 couples at least one optical path to at least one drive component in the first drive array C2. The controller C5 controls the rotation of at least one drive component in the first drive array C2 to reflect at least one optical path to at least one drive component in the second drive array C3. The controller C5 then controls the rotation of at least one drive component in the second drive array C3 to couple at least one optical path to the second fiber array C4. In this way, the optical path carrying the service can be switched between different ports.

[0101] Figure 22 This is a schematic diagram of a spatial light field manipulation device in an embodiment of this application. Figure 22 As shown, the spatial light field manipulation device includes a controller D1 and a drive array D2. The drive array D2 can be as described above. Figure 18 The driving array described herein includes reflective elements in its driving components. Specifically, controller D1 controls multiple driving components in driving array D2 to rotate to different angles, thereby reflecting the incident light to different positions in space and realizing the intensity and phase distribution of the reflected light in space.

[0102] It should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A driving component, characterized in that, include: A substrate, a rotating structure, a rotating frame, a rotating platform, a first fixed structure, a second fixed structure, a third fixed structure, a first cantilever beam, a second cantilever beam, and a third cantilever beam, wherein the first fixed structure, the second fixed structure, and the third fixed structure are fixed on the substrate; The rotating frame is connected to the first fixed structure via the first cantilever beam. A first comb tooth is formed on the rotating frame, and the first comb tooth and the second comb tooth are arranged alternately. The second comb tooth is formed on the second fixed structure. The rotating platform is located inside the rotating frame. The rotating platform is connected to the rotating frame via the second cantilever beam. A third comb tooth is formed on the rotating platform, and the third comb tooth and the fourth comb tooth are arranged alternately. The fourth comb tooth is formed on the rotating structure. The rotating structure is connected to the third fixed structure via the third cantilever beam. The rotating structure is fixed together with the rotating frame. The rotating structure and the rotating frame are electrically isolated. The first and second comb teeth are used to drive the rotating frame and the rotating structure to rotate around a first axis, and the third and fourth comb teeth are used to drive the rotating platform to rotate around a second axis, wherein the first axis is perpendicular to the second axis.

2. The driving component according to claim 1, characterized in that, The rotating frame is connected to the first fixed structure via a first cantilever beam on each of its two sides. The rotating frame has a row of first comb teeth on each of its other two sides. The two rows of first comb teeth are alternately arranged with two rows of second comb teeth. The two rows of second comb teeth are formed on the second fixed structure. The rotating platform is connected to the rotating frame via a second cantilever beam on each of its two sides. The rotating platform has a row of third comb teeth on each of its other two sides. The two rows of third comb teeth are alternately arranged with two rows of fourth comb teeth. The two rows of fourth comb teeth are formed on two rotating structures. Each of the two rotating structures is connected to the third fixed structure via a third cantilever beam.

3. The driving component according to claim 2, characterized in that, When the first comb teeth and the second comb teeth are parallel, one row of the first comb teeth is located above one row of the second comb teeth, and the other row of the first comb teeth is located below the other row of the second comb teeth.

4. The driving component according to claim 2 or 3, characterized in that, When the third comb teeth are parallel to the fourth comb teeth, one row of the third comb teeth is located above one row of the fourth comb teeth, and the other row of the third comb teeth is located below the other row of the fourth comb teeth.

5. The drive assembly according to any one of claims 1 to 4, characterized in that, When the first comb tooth is parallel to the second comb tooth and the third comb tooth is parallel to the fourth comb tooth, the second comb tooth is located below the first comb tooth, and the fourth comb tooth is located below the third comb tooth.

6. The driving component according to claim 5, characterized in that, A first fixed platform is fixed on the side of the third fixed structure away from the substrate, and a second fixed platform is fixed on the side of the rotating structure away from the substrate. The first fixed platform is connected to the second fixed platform through the third cantilever beam. The third cantilever beam and the first cantilever beam are located in the same plane, and the second fixed platform is electrically isolated from the rotating frame.

7. The driving component according to claim 6, characterized in that, The third fixing structure is electrically connected to the first fixing platform via a through-silicon via (TSV), and the rotating structure is electrically connected to the second fixing platform via a TSV.

8. The driving component according to claim 1 or 2, characterized in that, When the first comb tooth is parallel to the second comb tooth and the third comb tooth is parallel to the fourth comb tooth, the second comb tooth is located above the first comb tooth and the fourth comb tooth is located above the third comb tooth.

9. The driving component according to claim 8, characterized in that, A third fixed platform is fixed on the side of the rotating structure near the substrate. The third fixed platform is connected to the third fixed structure through the third cantilever beam. The third cantilever beam and the first cantilever beam are located on the same plane. The third fixed platform is electrically isolated from the rotating frame.

10. The driving component according to claim 9, characterized in that, The rotating structure is electrically connected to the third fixed platform via a TSV.

11. The drive assembly according to any one of claims 1 to 10, characterized in that, The first fixing structure is electrically connected to or grounded to the first electrode, the second fixing structure is electrically connected to the second electrode, the third fixing structure is electrically connected to the third electrode, there is a potential difference between the first comb tooth and the second comb tooth, and there is a potential difference between the third comb tooth and the fourth comb tooth.

12. The driving component according to claim 11, characterized in that, The second electrode and the third electrode are located on the top surface of the substrate and are electrically isolated from the top surface of the substrate. The second electrode is electrically connected to the second fixed structure via wafer bonding, and the third electrode is electrically connected to the third fixed structure via wafer bonding.

13. The driving component according to claim 11, characterized in that, The second electrode and the third electrode are located on the bottom surface of the substrate. The second electrode is electrically connected to the second fixed structure via a TSV, and the third electrode is electrically connected to the third fixed structure via a TSV.

14. The driving component according to claim 11, characterized in that, The drive assembly further includes a covering structure that covers the rotating frame, the rotating structure, and the rotating platform. The second electrode and the third electrode are located on the side of the covering structure away from the substrate. The second electrode is electrically connected to each of the second fixed structures via a TSV, and the third electrode is electrically connected to each of the third fixed structures via a TSV.

15. The drive assembly according to any one of claims 1 to 14, characterized in that, The substrate includes a cavity, and the rotating frame, the rotating structure, and the rotating platform are suspended above the cavity.

16. The driving component according to claim 15, characterized in that, The depth of the cavity is greater than the maximum displacement of the rotating frame, the rotating platform, and the rotating structure in the direction perpendicular to the substrate during rotation.

17. The drive assembly according to claim 15 or 16, characterized in that, The drive assembly also includes a stop structure, which is fixed in the cavity, and the height of the stop structure is less than or equal to the depth of the cavity.

18. The drive assembly according to any one of claims 1 to 17, characterized in that, The drive assembly also includes a mass balancing structure disposed on the side of the rotating platform close to the substrate.

19. The drive assembly according to any one of claims 1 to 18, characterized in that, The first cantilever beam is a straight beam structure, an inclined beam structure, or a folded beam structure; the second cantilever beam is a straight beam structure, an inclined beam structure, or a folded beam structure; and the third cantilever beam is a straight beam structure, an inclined beam structure, or a folded beam structure.

20. The drive assembly according to any one of claims 1 to 19, characterized in that, The driving assembly further includes a reflective element and a support structure, the support structure being disposed on the side of the rotating platform away from the substrate, and the reflective element being disposed on the support structure.

21. The driving component according to claim 20, characterized in that, The surface of the reflective element is provided with a reflective film.

22. The drive assembly according to any one of claims 1 to 21, characterized in that, The first fixed structure is a fixed frame, and the rotating frame is located inside the fixed frame.

23. The drive assembly according to any one of claims 1 to 22, characterized in that, The first cantilever beam, the second cantilever beam, the third cantilever beam, the first comb tooth, the second comb tooth, the third comb tooth, the fourth comb tooth, the rotating frame, the rotating structure, the rotating platform, the first fixed structure, the second fixed structure, and the third fixed structure are made of any one of monocrystalline silicon, polycrystalline silicon, or amorphous silicon.

24. A driving array, characterized in that, include: The encapsulation structure and a plurality of drive components as described in any one of claims 1 to 23, each of the drive components being encapsulated by the encapsulation structure and each pair of drive components being isolated from each other by the encapsulation structure.

25. A drive control system, characterized in that, include: The printed circuit board, the control chip, the connector, and the drive assembly as described in any one of claims 1 to 23, wherein the control chip, the connector, and the drive assembly are fixed on the printed circuit board, and the control chip is connected to the drive assembly via the connector; The control chip is used to output control signals to the drive component to control the rotation of the drive component.

26. A drive control system, characterized in that, include: The system comprises a printed circuit board, a control chip, a connector, and a drive array as described in claim 24, wherein the control chip, the connector, and the drive array are fixed on the printed circuit board, and the control chip is connected to the drive array via the connector. The control chip is used to output control signals to the drive array to control the rotation of at least one drive component in the drive array.

27. A projection display system, characterized in that, include: An encoder, a controller, a light source, a beam shaping device, and a drive assembly as described in any one of claims 1 to 23, the drive assembly comprising a reflective element; The encoder is used to convert the graphic to be projected into a control signal and output the control signal to the controller; The controller controls the light source to output at least one beam of light according to the control signal; The beam shaping device is used to shape the at least one beam and output the shaped beam to the driving component. The controller is also configured to control the rotation of the drive assembly according to the control signal in order to project at least one beam after beam shaping.

28. A projection display system, characterized in that, include: The encoder, controller, light source, beam shaping device, and drive array as claimed in claim 24, wherein each drive component in the drive array includes a reflective element; The encoder is used to convert the graphic to be projected into a control signal and output the control signal to the controller; The controller controls the light source to output at least one beam of light according to the control signal; The beam shaping device is used to shape the at least one beam and output the shaped beam to the drive array. The controller is also configured to control at least one drive component in the drive array to rotate according to the control signal, so as to project at least one beam after beam shaping.

29. An optical cross-connect (OXC) system, characterized in that, include: The controller, the first fiber array, the second fiber array, the first driving array and the second driving array, wherein the first driving array and the second driving array are the driving arrays as described in claim 24, and the driving components in the first driving array and the second driving array both include reflective elements; The first fiber array is used to couple at least one optical path to the first driving array; The controller is used to control at least one drive component in the first drive array to rotate so as to reflect the at least one path of light to the second drive array; The controller is also used to control the rotation of at least one drive component in the second drive array to couple the at least one optical path to the second fiber array.

30. A spatial light field modulation device, characterized in that, include: The controller and the drive array as claimed in claim 24, wherein the drive components in the drive array all include reflective elements; The controller is used to control the rotation of multiple drive components in the drive array so as to reflect the light incident on the drive array to different positions in space.

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