Substrate lifting device and film forming apparatus

Abstract

A substrate lifting device and a film forming device capable of being favorably applied to a plurality of kinds of substrates are provided. A substrate lifting device lifts a substrate in a state in which the substrate is placed on the front ends of a plurality of support pins provided so as to penetrate through through holes of a substrate carrier, characterized in that the plurality of support pins include: a first support pin group including a plurality of first support pins (411A); and a second support pin group including a plurality of second support pins (411B), the first support pin group and the second support pin group being independently lifted from each other.

Description

Technical Field

[0001] This invention relates to a substrate lifting device and a film forming device. Background Technology

[0002] In film-forming apparatuses such as vacuum evaporation devices, a substrate is moved while held on a substrate carrier, and various treatments, such as film formation, are performed on the substrate. In the apparatus disclosed in Patent Document 1, a substrate lifting device is provided that raises and lowers the substrate while it is placed on the front end of a plurality of support pins that are provided through through holes in the substrate carrier. By raising and lowering the substrate using this substrate lifting device, the substrate can be placed on the substrate carrier or peeled off from the substrate carrier.

[0003] [Existing Technical Documents]

[0004] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2015-46517 Summary of the Invention

[0006] [The problem the invention aims to solve]

[0007] In the aforementioned substrate lifting device, it is desirable to be applicable to multiple types of substrates in order to improve versatility. However, the appropriate contact position of the support pin relative to the substrate sometimes varies depending on the substrate. In the device of reference 1, since all the support pins are raised and lowered simultaneously, it is difficult to properly support the substrate according to the type of substrate and the type of device formed on the substrate.

[0008] The purpose of this invention is to provide a substrate lifting device and a film forming device that can appropriately support multiple types of substrates.

[0009] [Solution to the problem]

[0010] In one aspect of the present invention, a substrate lifting device lifts and lowers a substrate with a substrate placed at the front end of a plurality of support pins provided through through holes in a substrate carrier, characterized in that...

[0011] The plurality of support pins includes: a first support pin group comprising a plurality of first support pins; and a second support pin group comprising a plurality of second support pins.

[0012] The first support pin group and the second support pin group rise and fall independently of each other.

[0013] [Invention Effects]

[0014] According to the present invention, it is possible to appropriately support a variety of substrates. Attached Figure Description

[0015] Figure 1 This is a schematic structural diagram of a film-forming apparatus according to an embodiment of the present invention.

[0016] Figure 2 This is a schematic structural diagram of the substrate lifting device according to an embodiment of the present invention.

[0017] Figure 3 This is a schematic structural diagram of the substrate lifting device according to an embodiment of the present invention.

[0018] Figure 4 This is a schematic structural diagram of the substrate lifting device according to an embodiment of the present invention.

[0019] Figure 5 This is a schematic structural diagram of the substrate lifting device according to an embodiment of the present invention.

[0020] Figure 6 This is a schematic structural diagram of the substrate lifting device according to an embodiment of the present invention.

[0021] Figure 7 This is a top view of a substrate being lifted and lowered using a substrate lifting device according to an embodiment of the present invention.

[0022] Figure 8 This is a top view of the substrate carrier according to an embodiment of the present invention.

[0023] Figure 9 This is a schematic cross-sectional view of the substrate carrier according to an embodiment of the present invention.

[0024] Figure 10 This is a main structural diagram of the lifting mechanism according to an embodiment of the present invention.

[0025] Figure 11 This is a schematic structural diagram of the film-forming processing chamber according to an embodiment of the present invention.

[0026] Figure 12 This is an explanatory diagram of an organic EL display device according to an embodiment of the present invention.

[0027] [Explanation of Labels in the Attached Image]

[0028] 100…Substrate carrier; 110, 110X, 110Y…Clamping member; 200…Substrate; 410…Plate; 411…Support pin; 420A…Ball screw mechanism Detailed Implementation

[0029] Hereinafter, with reference to the accompanying drawings, embodiments are described in detail illustratively. However, unless otherwise specified, the dimensions, materials, shapes, and relative arrangements of the structural components described in these embodiments are not intended to limit the scope of the invention.

[0030] (Example)

[0031] <Film Forming Device>

[0032] Reference Figure 1 This section explains the overall structure of the film-forming apparatus in this embodiment. Figure 1 This is a schematic structural diagram of a film-forming apparatus according to an embodiment of the present invention. In this embodiment, a film-forming apparatus referred to as a series-type apparatus will be described as an example. In a series-type film-forming apparatus, multiple chambers are arranged in an array, and a substrate, a substrate carrier, and a mask are sequentially conveyed into each chamber, where various processes are performed. Conveyor rollers and linear motors are used for conveying. In each chamber, a vacuum atmosphere or an inactive gas atmosphere can be formed in each chamber or in each of several adjacent chambers.

[0033] exist Figure 1 In the diagram, only the representative chambers from multiple chambers undergoing treatment are indicated by the reference numeral R; other chambers are omitted using black dots. Furthermore, Figure 1 In the diagram, thin solid arrows indicate the transport sequence of the substrate carrier 100, dashed arrows indicate the transport sequence of the substrate 200, and thick solid arrows indicate the transport sequence of the mask M. The operation of the devices in each chamber is controlled by a control unit C, such as a computer. Regarding the control unit C, it can be provided separately for each device, or a shared control unit C can be provided for multiple devices. Generally, the control of various operations by the control unit is well-known technology; therefore, a description of the specific structure of the control unit C is omitted.

[0034] First, substrate carrier 100 and substrate 200 are conveyed to substrate placement chamber R1, where substrate 200 is held above substrate carrier 100. Substrate carrier 100 and substrate 200 held by substrate carrier 100 are then conveyed to flipping chamber R2. In flipping chamber R2, substrate carrier 100 and substrate 200 are rotated 180° together to hold substrate 200 below substrate carrier 100. Mask M is conveyed to flipping chamber R2 via a path different from that of substrate carrier 100. In flipping chamber R2, substrate carrier 100, with substrate 200 held below, is placed on mask M. Furthermore, substrate 200 held by substrate carrier 100, along with mask M conveyed to flipping chamber R2, is conveyed to film deposition chamber R3. It should be noted that the rotation of substrate carrier 100, its engagement with mask M, and its placement on mask M can be performed in different chambers. Next, in the film-forming chamber R3, after a thin film is formed on the surface of the substrate 200 via a mask M having an opening at the desired film-forming location, the substrate carrier 100 and the like are conveyed to the mask delivery chamber R4. It should be noted that, typically, multiple film-forming chambers R3 are provided as shown in the figure to enable the formation of thin films from different materials. Therefore, generally, with a single transport of the substrate 200, the film-forming process is performed in a specific film-forming chamber R3 at a particular location.

[0035] After film formation, the substrate 200, held by the substrate carrier 100, is lifted from the mask M in the mask delivery chamber R4. The mask M, having been used a predetermined number of times, is delivered from the mask delivery chamber R4 to the outside of the apparatus. The substrate 200 held by the substrate carrier 100 and the reused mask M are transferred from the mask delivery chamber R4 to the relay chamber R5. The mask M in the relay chamber R5 is transferred towards the flipping chamber R2. After the substrate carrier 100 and substrate 200 in the relay chamber R5 are flipped in the flipping chamber (not shown), they are transferred to the substrate peeling chamber R6.

[0036] Then, in the substrate peeling chamber R6, the substrate 200 is peeled off from the substrate carrier 100. The substrate carrier 100 is then sent to the outside of the film forming apparatus or transferred back to the substrate placement chamber R1. Moreover, the substrate 200 peeled off from the substrate carrier 100 is taken out to the outside.

[0037] <Substrate Lifting Device>

[0038] Regarding the structure of the substrate lifting device provided in the substrate placement chamber R1 and the operation of placing the substrate 200 onto the substrate carrier 100, please refer to... Figures 2-6 The substrate lifting device includes a carrier transfer chamber 300, a lifting mechanism, and a clamping member rotation mechanism 500 that serves as a clamping member drive component. In this embodiment, the substrate lifting device includes a first lifting mechanism 400A, a second lifting mechanism 400B, and a third lifting mechanism 400C as lifting mechanisms. These lifting mechanisms all have the function of lifting the substrate 200, and can adopt the same structure except for their configuration and shape. Therefore, in Figures 2-6 In order to facilitate understanding of the structure of each part, the first lifting mechanism 400A is shown representatively, while the second lifting mechanism 400B and the third lifting mechanism 400C are omitted.

[0039] The carrier transfer chamber 300 includes an opening 311 through which the substrate carrier 100 passes, a carrier gate valve 312 capable of opening and closing the opening 311, an opening 321 through which the substrate 200 passes, and a substrate gate valve 322 capable of opening and closing the opening 321. It should be noted that the opening 311 and the carrier gate valve 312 are respectively located in... Figure 2 The inner and near-front sides of the paper surface. Furthermore, although not shown in the figure, the opening 311 and the carrier gate valve 312 are also provided on the right side of the carrier transfer chamber 300. Thus, the substrate carrier 100 enters the carrier transfer chamber 300 from the inner side of the paper surface and is discharged outward of the carrier transfer chamber 300 towards the near-front side of the paper surface.

[0040] Additionally, a carrier support member 330 is provided in the carrier transfer chamber 300 to support the substrate carrier 100 when the substrate 200 is placed onto the substrate carrier 100. This carrier support member 330 supports the outer periphery of the substrate carrier 100 in a manner that avoids obstructing the movement of the support pins provided with the lifting mechanism. Alternatively, an opening may be provided in the carrier support member 330 in the area through which the support pins pass. Furthermore, although in Figure 2 The details are omitted, but a transfer roller for transferring the substrate carrier 100 can be provided in the substrate placement chamber R1 (carrier transfer chamber 300). In this case, when the substrate 200 is placed onto the substrate carrier 100, the transfer roller can support the substrate carrier 100.

[0041] Furthermore, a photographing component (camera, etc.) 350 is provided in the carrier transfer chamber 300. Only one photographing component 350 is shown in each figure, but multiple photographing components 350 are typically provided. The photographing component 350 photographs the positional relationship between the substrate carrier 100 and the substrate 200, thereby allowing adjustment (alignment) of the position of the substrate 200 relative to the substrate carrier 100. Moreover, the photographing component 350 can also function as a discrimination mechanism to distinguish the type of substrate carrier 100 or substrate 200. For example, various marks are pre-assigned according to the type of substrate carrier 100, and the type of substrate carrier 100 can be distinguished by the marks photographed by the photographing component 350. The photographing component 350 used for alignment and the photographing component 350 used as a discrimination component can be separately provided, or one of the photographing components 350, which are typically provided for alignment, can also be used as a discrimination component.

[0042] In this embodiment, only a support pin is inserted into the lifting mechanism in the carrier transfer chamber 300, and only a press-in pin 511 is inserted into the clamping member rotation mechanism 500. This prevents lubricant, abrasive powder, and other contaminants from entering the carrier transfer chamber 300. It should be noted that the structure can be configured such that the entire substrate lifting device is housed in the substrate mounting chamber R1, or the carrier transfer chamber 300 can be configured to correspond to the substrate mounting chamber R1. In the latter case, most of the structure of the lifting mechanism (excluding the support pin) and most of the structure of the clamping member rotation mechanism 500 (excluding the press-in pin 511) are disposed outside the substrate mounting chamber R1.

[0043] The first lifting mechanism 400A includes a plurality of first support pins 411A, a first plate 410A supporting the plurality of first support pins 411A, and a ball screw mechanism 420A as a first lifting component for raising and lowering the first plate 410A. The ball screw mechanism 420A includes a motor 421A, a screw shaft 422A that rotates via the motor 421A, a nut portion 423A that moves up and down along the screw shaft 422A in conjunction with the rotation of the screw shaft 422A, and a support column 424A fixed to the nut portion 423A and moving up and down together with the nut portion 423A. The plurality of balls circulate infinitely between the inner circumferential surface of the nut portion 423A and the outer circumferential surface of the screw shaft 422A. Furthermore, the first plate 410A is supported on the support column 424A.

[0044] In this embodiment, a ball screw mechanism is shown as the lifting component for raising and lowering the plate. However, other known technologies such as rack and pinion can also be used as the lifting component.

[0045] Furthermore, the substrate lifting device includes an alignment mechanism 430A as an alignment component. The alignment mechanism 430A adjusts the position of the substrate 200 relative to the substrate carrier 100 by moving a plurality of first support pins 411A vertically relative to the lifting direction of the substrate 200. It should be noted that in this embodiment, the lifting direction of the substrate 200 is vertical. Therefore, the alignment mechanism 430A can move the plurality of first support pins 411A horizontally. Specifically, the alignment mechanism 430A includes a first track 431A extending in the left-right direction (hereinafter referred to as the "X-axis direction") and a second track 432A extending vertically relative to the first track 431A (hereinafter referred to as the "Y-axis direction"). It should be noted that both the X-axis direction and the Y-axis direction are perpendicular to the vertical direction. The second track 432A can reciprocate along the first track 431A.

[0046] Furthermore, the alignment mechanism 430A includes a base 433A for mounting the first lifting mechanism 400A. This base 433A is capable of reciprocating along the second track 432A. The alignment mechanism 430A also includes a first shaft portion 434A fixed to the base 433A and extending along the X-axis, and a second shaft portion 436A fixed to the base 433A and extending along the Y-axis. Additionally, the alignment mechanism 430A includes a moving mechanism 435A for moving the first shaft portion 434A along the X-axis and a moving mechanism (not shown) for moving the second shaft portion 436A along the Y-axis. Various known technologies, such as ball screw mechanisms and rack and pinion mechanisms, can be employed for these moving mechanisms.

[0047] By using the alignment mechanism 430A configured as described above, the first lifting mechanism 400A and the base 433A can move together along the X-axis and Y-axis directions, thereby enabling the plurality of first support pins 411A to move horizontally. This allows the substrate 200, which is placed on the plurality of first support pins 411A, to be moved and adjusted horizontally, and the position of the substrate 200 relative to the substrate carrier 100 can be adjusted. It should be noted that in the substrate lifting device of this embodiment, the second lifting mechanism 400B and the third lifting mechanism 400C can also be moved along the X-axis and Y-axis directions by the alignment mechanism. Regarding the second lifting mechanism 400B and the third lifting mechanism 400C, all lifting mechanisms can be moved simultaneously by placing them on the base 433A provided with the alignment mechanism 430A. Furthermore, alignment mechanisms can be provided for the second lifting mechanism 400B and the third lifting mechanism 400C respectively.

[0048] The clamping member rotation mechanism 500 includes multiple press-in pins 511, a clamping member plate 510 supporting the multiple press-in pins 511, and a ball screw mechanism 520 for raising and lowering the clamping member plate 510. The ball screw mechanism 520 includes a motor 521, a screw shaft 522 rotated by the motor 521, a nut portion 523 that moves up and down along the screw shaft 522 as the screw shaft 522 rotates, and a support column 524 fixed to the nut portion 523 and moving up and down together with the nut portion 523. Multiple balls circulate infinitely between the inner circumferential surface of the nut portion 523 and the outer circumferential surface of the screw shaft 522. Furthermore, the clamping member plate 510 is supported on the support column 524. It should be noted that although a ball screw mechanism is shown as the lifting component for raising and lowering the clamping member plate 510, other known technologies such as rack and pinion mechanisms can also be used as the lifting component.

[0049] This describes the operation of holding the substrate 200 on the substrate carrier 100 using the substrate lifting device configured as described above. First, by actuating the carrier gate valve 312, the opening 311 is opened, allowing the substrate carrier 100 to be fed into the carrier transfer chamber 300. The substrate carrier 100 fed into the carrier transfer chamber 300 is supported on the carrier support member 330 (see reference). Figure 3 It should be noted that, for ease of understanding the structure of each part, in Figure 3 In the following figures, the opening 311 and the gate valve 312 for the carrier are omitted.

[0050] The substrate carrier 100 is provided with a plurality of clamping members 110 for holding the substrate 200 on the substrate carrier 100. The clamping members 110 are rotatably disposed on the substrate carrier 100 in a state where a force is applied in the direction in which the substrate 200 is held by the substrate carrier 100, i.e., a first rotational direction. It should be noted that, in Figure 3In the middle, the left clamping member 110 is rotatably disposed on the substrate carrier 100 in a state where a force is applied in the clockwise direction, and the right clamping member 110 is rotatably disposed on the substrate carrier 100 in a state where a force is applied in the counterclockwise direction.

[0051] After the substrate carrier 100 is supported by the carrier support member 330, the opening 321 is opened by the action of the substrate gate valve 322, allowing the substrate 200 to be fed into the carrier transfer chamber 300. The substrate 200 is fed into the carrier transfer chamber 300 by a transfer robot. It should be noted that, in Figure 4 The image shows only a portion of the hand 250 that supports the substrate 200 in the transfer robot. This hand 250 is typically configured in a comb-like shape to avoid obstructing the movement of support pins such as the first support pin 411A.

[0052] Additionally, via the first lifting mechanism 400A, multiple first support pins 411A rise together with the first plate 410A to a predetermined position. It should be noted that the multiple first support pins 411A are configured to pass through multiple through holes provided in the substrate carrier 100, and the front ends of the multiple first support pins 411A move to a position above the upper surface of the substrate carrier 100 and below the lower surface of the fed substrate 200. Furthermore, via the clamping member rotation mechanism 500, multiple pressing pins 511 rise together with the clamping member plate 510, and the front ends of each pressing pin 511 press into the corresponding clamping member 110. As a result, the clamping member 110 rotates in a second rotation direction opposite to the first rotation direction, becoming a state in which the substrate 200 can be placed on the substrate carrier 100 from above (see reference). Figure 4 ).

[0053] It should be noted that the sequence of the feeding action of the substrate 200 into the carrier transfer chamber 300, the rising action of the first plate 410A based on the first lifting mechanism 400A, and the rising action of the clamping plate 510 based on the clamping rotating mechanism 500 is not particularly limited and can be performed simultaneously.

[0054] The substrate 200 is placed at the front end of multiple first support pins 411A. After the hand 250 of the transfer robot retracts, the first plate 410A is lowered to a predetermined position by the first lifting mechanism 400A. Thus, the substrate 200 is brought into a state that is sufficiently close to the substrate carrier 100 (see reference). Figure 5 ).

[0055] In this state, the alignment mechanism 430A adjusts the position of the substrate 200 relative to the substrate carrier 100 by moving the substrate 200 in the X-axis and Y-axis directions. Then, the first plate 410A is further lowered by the first lifting mechanism 400A, and the front ends of the plurality of first support pins 411A move downward relative to the lower surface of the substrate carrier 100. During this process, the substrate 200 is placed on the substrate carrier 100. It should be noted that the substrate carrier 100 is provided with a plurality of adsorption pads 130 (see reference). Figure 9 The substrate 200 is then placed on a plurality of adsorption pads 130. It should be noted that if the substrate 200 is simply placed on the substrate carrier 100, the adsorption based on the adsorption pads 130 may sometimes be insufficient. Therefore, a process is usually performed to make the adsorption based on the adsorption pads 130 more reliable by pressing the substrate 200 downward.

[0056] After the substrate 200 is placed on the substrate carrier 100, the clamping plate 510 is lowered by the clamping member rotation mechanism 500. As a result, the press-in pin 511 separates from the clamping member 110, and the clamping member 110 rotates in the first rotation direction, clamping the substrate 200 into the substrate carrier 100. Thus, the substrate 200 is held on the substrate carrier 100 (see reference 100). Figure 6 As described above, after holding the substrates 200 on the substrate carrier 100, they are sent out from the carrier transfer chamber 300 and transferred to the flipping chamber R2.

[0057] <Substrate peeling operation>

[0058] The substrate lifting device configured as described above is also provided in the substrate peeling chamber R6. Hereinafter, the operation of peeling the substrate 200 from the substrate carrier 100 using the substrate lifting device configured as described above will be described. First, with the first plate 410A and the clamping plate 510 in a standby state below, the substrate carrier 100 holding the substrate 200 is fed into the carrier transfer chamber 300 and supported on the carrier support member 330.

[0059] Then, via the clamping member rotation mechanism 500, multiple pressing pins 511 rise together with the clamping member plate 510, and the front end of each pressing pin 511 presses in the corresponding clamping member 110. As a result, the clamping member rotates in a second rotation direction opposite to the first rotation direction, becoming capable of peeling the substrate 200 from the substrate carrier 100. Then, via the first lifting mechanism 400A, multiple first support pins 411A rise together with the first plate 410A to a predetermined position. During this process, the substrate 200 is pressed in by the multiple first support pins 411A, peeled from the substrate carrier 100, and rises to the predetermined position.

[0060] Then, the substrate 200 is delivered from the carrier transfer chamber 300 by a transfer robot. Moreover, after the plurality of first support pins 411A descend together with the first plate 410A, the substrate carrier 100 is delivered from the carrier transfer chamber 300 to the outside of the film forming apparatus, or is delivered again to the substrate placement chamber R1.

[0061] <Substrate and Substrate Carrier>

[0062] The substrate lifting device of this embodiment can be well applied to two types of first substrates 200X and second substrates 200Y. Hereinafter, refer to... Figures 7-9 This describes the first substrate 200X and the second substrate 200Y, and two types of first substrate carriers 100X and second substrate carriers 100Y used for these substrates respectively.

[0063] In addition to glass, any material can be selected as the substrate, such as semiconductors (e.g., silicon), polymer films, or metals. Moreover, for example, silicon wafers or substrates with polyimide films laminated on glass substrates can also be used.

[0064] The first substrate 200X is cut along the cutting lines 211X and 212X (represented by dashed lines) in the figure through subsequent processes. In the case of a display, the portion enclosed by the dashed lines in the figure becomes the image display area, corresponding to the display element area. The second substrate 200Y is cut along the cutting lines 211Y, 212Y, 213Y, and 214Y (represented by dashed lines) in the figure through subsequent processes. In the case of a display, the portion enclosed by the dashed lines in the figure becomes the image display area, corresponding to the display element area.

[0065] As described above, the first substrate carrier 100X and the second substrate carrier 100Y are respectively provided with multiple clamping members 110X and 110Y. The number and configuration of the clamping members 110X and 110Y can be appropriately set according to the size and weight of the substrate carrier and the substrate.

[0066] The first substrate carrier 100X has a defined area in the center of the first substrate carrier 100X. Figure 8 A plurality of through holes 121X are provided within the area enclosed by the dashed line in (a), and a plurality of through holes 122X are provided along the outer periphery of the first substrate carrier 100X. With the first substrate 200X held in place by the first substrate carrier 100X, the plurality of through holes 121X are provided along the cut lines 211X and 212X in the first substrate 200X, and are located at... Figure 7The area enclosed by the dashed line in (a) is arranged outside the region. Furthermore, with the first substrate 200X held on the first substrate carrier 100X, a plurality of through holes 122X are provided along the outer periphery of the first substrate 200X and positioned at... Figure 7 The area outside the area enclosed by the dashed line in (a) is set in a way that is not visible.

[0067] Multiple through holes 121X and 122X are used for the purpose of allowing the support pin 411 to pass through and for mounting the adsorption pad 130. The configuration of the through holes used for allowing the support pin 411 to pass through and the through holes used for mounting the adsorption pad 130 can be appropriately set, such as by alternating their arrangement. The diameter of the through holes used for allowing the support pin 411 to pass through and the diameter of the through holes used for mounting the adsorption pad 130 can be set to be the same or different. Here, the multiple through holes 121X used for allowing the support pin 411 to pass through are referred to as "first through holes". Furthermore, the multiple through holes 122X used for allowing the support pin 411 to pass through are referred to as "third through holes".

[0068] The second substrate carrier 100Y has a defined area in the center of the second substrate carrier 100Y. Figure 8 The second substrate carrier 100Y has multiple through holes 121Y within the area enclosed by the dashed line in (b) and multiple through holes 122Y along the outer periphery of the second substrate carrier 100Y. With the second substrate 200Y held in place by the second substrate carrier 100Y, the multiple through holes 121Y are provided along the cut lines 211Y, 212Y, 213Y, and 214Y in the second substrate 200Y, and are located at... Figure 7 The area enclosed by the dashed line in (b) is arranged outside the region. Furthermore, with the second substrate 200Y held on the second substrate carrier 100Y, a plurality of through holes 122Y are provided along the outer periphery of the second substrate 200Y and positioned at... Figure 7 The area outside the area enclosed by the dashed line in (b) is set in a way that is not visible.

[0069] Multiple through holes 121Y and 122Y are used for the purpose of allowing the support pin 411 to pass through and for mounting the adsorption pad 130. The configuration of the through holes used for allowing the support pin 411 to pass through and the through holes used for mounting the adsorption pad 130 can be appropriately set, such as by alternating their arrangement. The diameter of the through holes used for allowing the support pin 411 to pass through and the diameter of the through holes used for mounting the adsorption pad 130 can be set to be the same or different. Here, the multiple through holes 121Y used for allowing the support pin 411 to pass through are referred to as "second through holes." Furthermore, the multiple through holes 122Y used for allowing the support pin 411 to pass through are referred to as "third through holes."

[0070] The third through hole provided on the first substrate carrier 100X has the same configuration as the third through hole provided on the second substrate carrier 100Y.

[0071] Reference Figure 9 The substrate carrier 100 will be described in more detail below. It should be noted that... Figure 9 yes Figure 8 Sectional view AA in (b). For example... Figure 9 As shown, a through hole is used for the support pin 411 to pass through (in Figure 9 In the diagram, the diameter of the through hole 121Y of the second substrate carrier 100Y is set to be larger than the outer diameter of the support pin 411. Therefore, the support pin 411 can pass through the through hole, and during alignment, the support pin 411 can move horizontally relative to the substrate carrier. It should be noted that a position deviation prevention member 411a, made of an elastic material such as rubber, is provided at the front end of the support pin 411 to suppress position deviation of the substrate 200.

[0072] Additionally, the adsorption pad 130 is mounted on the substrate carrier with its through-hole inserted into it. Figure 9 The second substrate carrier 100Y is shown in the image. The adsorption pad 130 includes: a metal pad body 131 with a flange 131a; an adhesive member 132 disposed at the front end of the pad body 131 via an adhesive layer (not shown); and a fixing member 133 for fixing the pad body 131 to a through hole. It should be noted that the flange 131a and the fixing member 133 are integrated by a known method. Furthermore, the fixing member 133 and the substrate carrier can be fixed by known techniques such as bolts. As the material of the adhesive member 132, fluororubber that does not contain silicon-oxygen bonds is preferably used to suppress the generation of venting gases that would adversely affect the manufacturing process under vacuum. Similarly, the material constituting the adhesive layer is preferably a known adhesive or double-sided tape that does not release venting gas components. In order to manage the amount of protrusion from the surface of the substrate carrier, the adhesive member 132 can be adjusted in the vertical direction within a certain range as shown in the figure using spacers (not shown). Although also affected by the size of the components constituting the adsorption pad 130 and the compression characteristics of the adhesive component 132, the aforementioned protrusion is less than the thickness of the substrate 200. The diameter of the through hole for the adsorption pad is larger than the outer diameter of the insertion portion of the pad body 131 into the through hole, and the pad body 131 is allowed to swing to a certain extent in addition to vertical movement.

[0073] Furthermore, the clamping member 110 is disposed on the substrate carrier 100 in a manner that allows it to rotate about the shaft portion 110a. Figure 9The second substrate carrier 100Y is located in the middle. Furthermore, the clamping member 110 is forced in the first rotational direction by a spring 110b, which serves as a force-applying member. As described above, when pressed in by the press-in pin 511, the clamping member 110 rotates in the second rotational direction against the force of the spring 110b; when the press-in pin 511 is disengaged, it rotates in the first rotational direction by the force of the spring 110b. It should be noted that... Figure 9 In the diagram, solid lines represent the state of the clamping member 110 rotating in the second rotation direction via the press-in pin 511, while dashed lines represent the state of the clamping member 110 rotating in the first rotation direction after the press-in pin 511 is removed. The clamping member 110 rotates about a shaft portion 110a along the film-forming surface of the substrate. Therefore, when the clamping member 110 is pressed in by the press-in pin 511, the clamping member 110 can retract from above the substrate holding area of ​​the substrate carrier 100. In this way, with a simple structure, the path for placing the substrate 200 onto the substrate carrier 100 can be ensured.

[0074] <Lifting Mechanism>

[0075] Reference Figure 10 The lifting mechanism of this embodiment will be described in more detail below. Figure 10 In addition to the overall top view of the lifting mechanism (a top view showing the first lifting mechanism 400A, the second lifting mechanism 400B, and the third lifting mechanism 400C assembled), top views of each individual lifting mechanism are also shown.

[0076] The first lifting mechanism 400A includes a first plate 410A that supports a plurality of first support pins 411A and a ball screw mechanism 420A as a first lifting component for lifting the first plate 410A (see reference). Figures 2-6 The plurality of first support pins 411A are configured to pass through the plurality of first through holes (through holes 121X) provided in the first substrate carrier 100X respectively.

[0077] The second lifting mechanism 400B includes a second plate 410B that supports a plurality of second support pins 411B and a second lifting member that lifts and lowers the second plate 410B. As described above, the second lifting member can adopt the same structure as the first lifting member, and is not specifically shown in the figure. The plurality of second support pins 411B are configured to pass through a plurality of second through holes (through holes 121Y) provided on the second substrate carrier 100Y.

[0078] The first lifting component (ball screw mechanism 420A) and the second lifting component are independently controlled by the control unit C. That is, the plurality of first support pins 411A supported on the first plate 410A and the plurality of second support pins 411B supported on the second plate 410B are configured to lift independently. Therefore, it can be said that the plurality of support pins 411 provided in the substrate lifting device of this embodiment includes a group of plurality of first support pins 411A and a group of plurality of second support pins 411B configured to lift independently of each other.

[0079] The third lifting mechanism 400C includes a third plate 410C that supports a plurality of third support pins 411C and a third lifting member that lifts and lowers the third plate 410C. As described above, the third lifting member can adopt the same structure as the first lifting member, and is not specifically shown in the figure. The plurality of third support pins 411C are configured to pass through both the plurality of third through holes (through holes 122X) provided in the first substrate carrier 100X and the plurality of third through holes (through holes 122Y) provided in the second substrate carrier 100Y.

[0080] Regarding the third lifting component, it can also be controlled independently of the first and second lifting components via the control unit C. Therefore, it can be said that the plurality of support pins 411 includes a group of third support pins 411C that are configured to rise and fall independently of the group of the plurality of first support pins 411A and the group of the plurality of second support pins 411B.

[0081] When performing film deposition on the first substrate 200X, using the first substrate carrier 100X, the control unit C controls the synchronous lifting and lowering of multiple first support pins 411A and multiple third support pins 411C via the first lifting member and the third lifting member. At this time, the multiple second support pins 411B do not lift or lower. Furthermore, when performing film deposition on the second substrate 200Y, using the second substrate carrier 100Y, the control unit C controls the synchronous lifting and lowering of multiple second support pins 411B and multiple third support pins 411C via the second lifting member and the third lifting member. At this time, the multiple first support pins 411A do not lift or lower. Thus, the substrate lifting device of this embodiment can be switched between a mode that synchronizes the multiple first support pins 411A with the multiple third support pins 411C and a mode that synchronizes the multiple second support pins 411B with the multiple third support pins 411C.

[0082] In this embodiment, as described above, the type of substrate carrier 100 is determined by the imaging component 350, which serves as a determination component. The control unit C determines, based on the determination result of the determination component, which of the plurality of first support pins 411A and the plurality of second support pins 411B should be raised or lowered, and controls the movement according to the aforementioned mode.

[0083] Here, as Figure 10As shown, each lifting mechanism is configured such that a second plate 410B is arranged at the top vertically, a first plate 410A is arranged in the center, and a third plate 410C is arranged at the bottom. An opening 412B is provided on the top second plate 410B to avoid obstructing the movement of the plurality of first support pins 411A supported on the first plate 410A. It should be noted that the plurality of third support pins 411C supported on the third plate 410C move outwards from the outer periphery of the first plate 410A and the second plate 410B, and are therefore not obstructed by these plates. An opening 412A for arranging a second lifting component is provided on the center first plate 410A. Furthermore, an opening 412C for arranging the first lifting component (ball screw mechanism 420A) and the second lifting component is provided on the bottom third plate 410C.

[0084] It should be noted that, as another embodiment of the substrate carrier 200, the substrate carrier 200 may also have multiple first through holes (through holes 121X) through which multiple first support pins 411A pass and multiple second through holes (through holes 121Y) through which multiple second support pins 411B pass. In this case, based on the type of substrate 100 and the type of mask M used, the control unit C determines which of the first support pins 411A and the second support pins 411B should be raised or lowered.

[0085] <Film-forming chamber>

[0086] Reference Figure 11 The film-forming process in the film-forming chamber R3 will be described in more detail below. An evaporation source 600, serving as a film-forming source, is provided within the film-forming chamber R3. The substrates 200, held on the substrate carrier 100, are supported in a downward-facing position within the film-forming chamber R3. Furthermore, a mask M is disposed on the underside of the substrate 200, positioned relative to the substrate 200. The mask M has openings at positions corresponding to the locations where a thin film is formed on the substrate 200. Thus, a film is formed on the substrate 200 held on the substrate carrier 100 via the mask M.

[0087] In this embodiment, film formation (evaporation) based on vacuum evaporation is performed. Specifically, the film-forming material is evaporated or sublimated from an evaporation source 600, which serves as the film-forming source, and deposited onto a substrate 200 to form a thin film on the substrate 200. Regarding the evaporation source 600, since it is known technology, its detailed description is omitted. For example, the evaporation source 600 may be composed of a container such as a crucible for holding the film-forming material and a heating device for heating the container. It should be noted that the film-forming source is not limited to the evaporation source 600; the film-forming source may also be a sputtering cathode used for film formation by sputtering.

[0088] <Manufacturing Methods of Electronic Devices>

[0089] Next, an example of a method for manufacturing an electronic device using the film-forming apparatus of this embodiment will be described. Hereinafter, the structure of an organic EL display device will be shown as an example of an electronic device, illustrating a method for manufacturing an organic EL display device.

[0090] First, let me explain the manufactured organic EL display device. Figure 12 (a) represents an overall view of the organic EL display device 700. Figure 12 (b) represents the cross-sectional structure of a pixel.

[0091] like Figure 12 As shown in (a), in the display area 701 of the organic EL display device 700, a plurality of pixels 702, each having a plurality of light-emitting elements, are arranged in a matrix. Each light-emitting element has a structure having an organic layer held by a pair of electrodes, as detailed below. It should be noted that a pixel, as used here, refers to the smallest unit in the display area 701 capable of displaying a desired color. In the case of the organic EL display device of this embodiment, the pixel 702 is constituted by a combination of a first light-emitting element 702R, a second light-emitting element 702G, and a third light-emitting element 702B that exhibit different light emission. The pixel 702 is mostly composed of a combination of red, green, and blue light-emitting elements, but it can also be a combination of yellow, cyan, and white light-emitting elements, as long as there is at least one color, there is no particular limitation.

[0092] Figure 12 (b) is Figure 12 A partial cross-sectional view at line BB in (a). Pixel 702 is composed of multiple light-emitting elements, each of which has a first electrode (anode) 704, a hole transport layer 705, any one of light-emitting layers 706R, 706G, and 706B, an electron transport layer 707, and a second electrode (cathode) 708 on substrate 703. The hole transport layer 705, light-emitting layers 706R, 706G, 706B, and electron transport layer 707 are equivalent to organic layers. Furthermore, in this embodiment, light-emitting layer 706R is a red-emitting organic EL layer, light-emitting layer 706G is a green-emitting organic EL layer, and light-emitting layer 706B is a blue-emitting organic EL layer. Light-emitting layers 706R, 706G, and 706B are respectively formed with patterns corresponding to the red, green, and blue light-emitting elements (sometimes referred to as organic EL elements).

[0093] Furthermore, the first electrode 704 is formed separately according to each light-emitting element. The hole transport layer 705, the electron transport layer 707, and the second electrode 708 can be formed in a shared manner among multiple light-emitting elements 702R, 702G, and 702B, or they can be formed separately for each light-emitting element. It should be noted that an insulating layer 709 is provided between the first electrode 704 and the second electrode 708 to prevent short circuits due to impurities. In addition, a protective layer 710 is provided to protect the organic EL element from moisture or oxygen to prevent degradation of the organic EL layer.

[0094] exist Figure 12 In (b), the hole transport layer 705 and the electron transport layer 707 are represented by a single layer, but depending on the structure of the organic EL display element, they can also be formed by multiple layers having a hole blocking layer and an electron blocking layer. Furthermore, a hole injection layer can also be formed between the first electrode 704 and the hole transport layer 705, and this hole injection layer has a band structure that allows for smooth injection of holes from the first electrode 704 to the hole transport layer 705. Similarly, an electron injection layer can also be formed between the second electrode 708 and the electron transport layer 707.

[0095] Next, we will give a specific example of how to manufacture an organic EL display device.

[0096] First, a substrate (mother glass) 703 is prepared, which has a circuit (not shown) for driving an organic EL display device and a first electrode 704.

[0097] Acrylic resin is spin-coated onto a substrate 703 on which the first electrode 704 is formed. An insulating layer 709 is formed by patterning the acrylic resin using photolithography to create an opening in the portion where the first electrode 704 is formed. This opening corresponds to the light-emitting area where the light-emitting element actually emits light.

[0098] A substrate 703 patterned with an insulating layer 709 is placed onto a substrate carrier provided with adhesive members. The substrate 703 is held in place by the adhesive members. After being fed into and flipped in a first organic material film-forming apparatus, a hole transport layer 705 is formed as a common layer on the first electrode 704 of the display area. The hole transport layer 705 is formed by vacuum evaporation. In fact, the hole transport layer 705 is formed to a size larger than the display area 701, so a high-precision mask is not required.

[0099] Next, the substrate 703, with the hole transport layer 705 already formed, is fed into the second organic material film-forming apparatus. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light-emitting layer 706R is formed on the portion of the substrate 703 where the red element is arranged.

[0100] Similar to the deposition of the light-emitting layer 706R, a green light-emitting layer 706G is deposited using a third organic material film-forming apparatus, and a blue light-emitting layer 706B is deposited using a fourth organic material film-forming apparatus. After the deposition of the light-emitting layers 706R, 706G, and 706B is completed, an electron transport layer 707 is deposited integrally in the display area 701 using a fifth film-forming apparatus. The electron transport layer 707 is formed as a shared layer across the three-color light-emitting layers 706R, 706G, and 706B.

[0101] The second electrode 708 is formed by moving a substrate on which an electron transport layer 707 has been formed using a metallic vapor deposition material film forming apparatus.

[0102] Then, the protective film 710 is moved to the plasma CVD apparatus to complete the film formation process on the substrate 703. After flipping, the adhesive members are peeled off from the substrate 703, thereby separating the substrate 703 from the substrate carrier. Then, the organic EL display device 700 is completed by cutting.

[0103] From the moment the substrate 703 with the insulating layer 709 patterned is fed into the film-forming apparatus until the film formation of the protective layer 710 is completed, if exposed to an atmosphere containing moisture or oxygen, the light-emitting layer made of organic EL material may deteriorate due to moisture or oxygen. Therefore, in this embodiment, the substrate is fed into and out of the film-forming apparatus under a vacuum atmosphere or an inactive gas atmosphere.

[0104] <Advantages of the substrate lifting device and film forming device in this embodiment>

[0105] According to the substrate lifting device of this embodiment, since the group of multiple first support pins 411A and the group of multiple second support pins 411B can be lifted and lowered independently, it can be well applied to two types of substrates (first substrate 200X and second substrate 200Y). That is, the first substrate 200X is lifted and lowered by the multiple first support pins 411A, and the second substrate 200Y is lifted and lowered by the multiple second support pins 411B, so that the contact position of the support pin relative to the substrate can be made to an appropriate position corresponding to the substrate. For example, when the substrate is used in a display as in this embodiment, the support pin can be contacted at a position that avoids the image display section (display element area), which can suppress the degradation of image quality.

[0106] It should be noted that, although this embodiment describes a substrate lifting device applicable to two types of substrates as an example, it can also be configured to be applicable to three or more types of substrates. Even in such a case, it is sufficient to prepare substrate carriers corresponding to multiple types of substrates and to set multiple lifting mechanisms such that support pins respectively abut against the positions corresponding to each substrate.

[0107] (other)

[0108] In the case of a large substrate 200, if the substrate 200 is supported vertically downwards, the substrate 200 will flex downwards near its center due to its own weight. Therefore, when the substrate 200 is supported by multiple support pins, it is preferable to arrange the support pins such that their positions follow the flexural shape of the substrate 200 in order to distribute the load evenly to each support pin. Therefore, for example, it is preferable to... Figure 2 As shown by the thick dashed line in the figure, multiple support pins 411AX of different heights are arranged in a manner that gradually increases in height from the center toward the ends.

Claims

1. A substrate lifting device, wherein a substrate is placed on the front end of a plurality of support pins arranged through through holes in a substrate carrier, and the substrate is lifted or lowered, characterized in that, The plurality of support pins includes: a first support pin group comprising a plurality of first support pins; and a second support pin group comprising a plurality of second support pins. The first support pin group and the second support pin group move up and down independently. The substrate lifting device includes a discrimination component for determining the type of the substrate carrier, and determines which of the plurality of first support pins and the plurality of second support pins to lift based on the discrimination result of the discrimination component.

2. The substrate lifting device according to claim 1, characterized in that, The substrate lifting device includes: A first plate, the first plate supporting the plurality of first support pins; A second plate, the second plate supporting the plurality of second support pins; A first lifting component, which causes the first plate to rise or fall; and The second lifting component causes the second plate to rise or fall.

3. The substrate lifting device according to claim 2, characterized in that, The plurality of first support pins are configured to pass through the plurality of first through holes provided in the first substrate carrier. The plurality of second support pins are configured to pass through the plurality of second through holes provided in the second substrate carrier, and the configuration of the through holes in the second substrate carrier is different from that in the first substrate carrier.

4. The substrate lifting device according to claim 3, characterized in that, The plurality of first through holes are provided on the first substrate carrier in such a manner as to cut along the cut line of the first substrate held on the first substrate carrier in a subsequent process. The plurality of second through holes are provided on the second substrate carrier in such a manner as to cut the second substrate held on the second substrate carrier in a subsequent process.

5. The substrate lifting device according to any one of claims 2 to 4, characterized in that, The plurality of support pins includes a plurality of groups of third support pins, the plurality of groups of third support pins being configured to move independently of the plurality of groups of first support pins and the plurality of groups of second support pins, and, The substrate lifting device includes: A third plate, which supports the plurality of third support pins; and A third lifting component, which causes the third plate to rise or fall. The substrate lifting device is configured to switch between a mode in which the plurality of first support pins are synchronized with the plurality of third support pins via the first lifting component and the third lifting component, and a mode in which the plurality of second support pins are synchronized with the plurality of third support pins via the second lifting component and the third lifting component.

6. The substrate lifting device according to claim 5, characterized in that, The plurality of first support pins are configured to pass through the plurality of first through holes provided in the first substrate carrier. The plurality of second support pins are configured to pass through the plurality of second through holes provided in the second substrate carrier. The plurality of third support pins are configured to pass through both the plurality of third through holes provided in the first substrate carrier and the plurality of third through holes provided in the second substrate carrier.

7. The substrate lifting device according to claim 6, characterized in that, The plurality of third through holes are disposed on the first substrate carrier in such a manner as to be along the outer periphery of the first substrate carrier held on the first substrate carrier, and are disposed on the second substrate carrier in such a manner as to be along the outer periphery of the second substrate carrier held on the second substrate carrier.

8. The substrate lifting device according to any one of claims 1 to 4, characterized in that, The substrate carrier includes a clamping member that is rotatably disposed on the substrate carrier while applying force to the substrate held on the substrate carrier in the clamping direction, i.e., the first rotational direction.

9. The substrate lifting device according to claim 8, characterized in that, The substrate lifting device includes a clamping member driving component that rotates the clamping member in a second rotation direction opposite to the first rotation direction.

10. The substrate lifting device according to any one of claims 1 to 4, characterized in that, The substrate lifting device includes an alignment component that adjusts the position of the substrate relative to the substrate carrier by moving the plurality of support pins in a vertical direction relative to the lifting direction of the substrate.

11. The substrate lifting device according to any one of claims 1 to 4, characterized in that, The plurality of support pins are arranged such that the position supporting the substrate is low at the center of the substrate and gradually rises toward the ends of the substrate.

12. A film-forming apparatus, characterized in that, have: The substrate lifting device according to any one of claims 1 to 11; and A film-forming source for forming a thin film on a substrate held by the substrate carrier.

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