A flexible antenna array for wireless microwave energy transmission

Abstract

The present invention provides a flexible antenna array for wireless microwave energy transmission, belonging to the field of communication technology, which includes a first dielectric substrate, a second dielectric substrate, a patch antenna array, a feeding interface, an equivalent ground plane, and a π-type decoupling network. By applying the printing technology of liquid metal and flexible materials, the present invention invents a liquid metal antenna operating at 5.8 GHz for microwave energy transmission. This liquid metal patch antenna will give full play to the advantages of liquid gallium-indium alloy composite materials and flexible dielectric substrates, such as repairability, flexibility, reconfigurability, anti-fatigue, and corrosion resistance, and is applied in integrated small electronic devices to realize the reception and transmission of electromagnetic waves and is used for long-distance wireless energy transmission.

Description

Technical Field

[0001] The present invention belongs to the field of communication technologies, and particularly relates to a flexible antenna array for wireless microwave energy transmission. Background Art

[0002] A microwave receiving antenna and a rectifying circuit are important components of a microwave energy transmission system. Especially as the receiving end, a new receiving antenna with high energy collection and conversion efficiency, convenient and fast laying method, easy conformal structure with load devices, and certain self-healing ability has important value for the popularization and application of microwave energy transmission. It has stronger flexibility compared with traditional reflector antennas and planar array antennas, and is an inevitable development trend in the future. As an important part of the microwave wireless energy transmission system, the performance of the receiving end directly affects the working state of the entire system, and is worthy of in-depth research.

[0003] Traditional antennas are fabricated by etching metal patterns on a rigid substrate. When the rigid substrate is extruded and bent by external forces, it is prone to deformation or even fracture. Therefore, the application of traditional antennas in multiple environments and complex scenarios is greatly limited. To make up for the deficiencies of traditional antennas and enhance their application in different scenarios, a new type of flexible antenna is designed, and flexible electronic products are integrated with the flexible antenna to meet the requirements of wireless connection in today's information society. A flexible antenna is an antenna printed on a flexible substrate, which has the advantages of being bendable, lightweight, and easy to conform to other devices, and is suitable for flexible electronic devices. The research on flexible electronic devices started in the 1960s with a fabric cloth as the substrate. To meet the requirements of properties such as thin, transparent, flexible, good ductility, insulating, and corrosion-resistant for flexible electronic devices, various flexible substrate materials have gradually emerged.

[0004] However, the energy reception ability of general flexible antennas is not prominent. Therefore, in this design, a π-type decoupling network is added as a parasitic structure to the flexible antenna array to enhance the energy reception ability of the antenna array. Summary of the Invention[[ID=!7]]

[0005] In view of the above deficiencies in the prior art, the present invention provides a flexible antenna array for wireless microwave energy transmission, which is a patch antenna array that is easy to conform to load devices and has certain self-adaptability, and a π-type decoupling network is added as a parasitic structure to enhance the energy reception ability of the antenna array.

[0006] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0007] This solution provides a flexible antenna array for wireless microwave energy transmission, including a first dielectric substrate, a second dielectric substrate, a patch antenna array, a feed interface, an equivalent ground plane, and a π-type decoupling network;

[0008] The patch antenna array is closely attached to the first dielectric substrate and in contact with the upper surface of the first dielectric substrate. The second dielectric substrate is located at a fixed distance below the first dielectric substrate. The equivalent ground plane is located below the second dielectric substrate. The feed interface penetrates through the equivalent ground plane, the first dielectric substrate, and the second dielectric substrate from the inside to be connected to the patch antenna array, and is in contact with the patch antenna array, the first dielectric substrate, the second dielectric substrate, and the equivalent ground plane at the same time. The left and right ends of the π-type decoupling network are respectively connected to the patch antenna array, and a section is led out at both ends of the π-type decoupling network (6) to form a π shape.

[0009] Further, both the first dielectric substrate and the second dielectric substrate are made of polycondensation polyimide.

[0010] Still further, the patch antenna array includes four independent single patch antennas. Each independent patch antenna is connected through a first transmission line, a second transmission line, and a third transmission line to form a patch antenna array, and is connected to the feed interface. Moreover, the first transmission line, the second transmission line, and the third transmission line all serve as impedance matching networks.

[0011] Still further, the thickness of the equivalent ground plane is less than the thickness of the second dielectric substrate, and the thickness of the equivalent ground plane is the same as the thickness of the patch antenna array.

[0012] Still further, the feed interface includes an inner core, a first outer ring, and a second outer ring;

[0013] The upper end of the inner core penetrates through the first dielectric substrate and the second dielectric substrate by means of a cylindrical hole to be connected to the patch antenna array and protrudes a part. The lower end of the inner core passes through the equivalent ground plane and protrudes a part. The first outer ring wraps the inner core, the periphery of the first outer ring is surrounded by the second outer ring, the upper end of the first outer ring extends beyond the equivalent ground plane, and the upper end of the second outer ring is lower than the equivalent ground plane.

[0014] Still further, the inner core, the first outer ring, and the second outer ring are all cylinders;

[0015] The inner diameter of the first outer ring is the same as the radius of the inner core. The length of the first outer ring is the sum of the thicknesses of the second dielectric substrate and the equivalent ground plane. The bottom center of the first outer ring is the same size as that of the inner core;

[0016] The bottom center of the second outer ring is the same size as the bottom centers of the inner core and the first outer ring. The inner diameter size of the second outer ring is the same as the outer diameter size of the first outer ring. The length of the second outer ring is the same as the length of the first outer ring.

[0017] Advantages of the present invention:

[0018] (1) The present invention invents a liquid metal antenna operating at 5.8 GHz for microwave energy transmission by applying the printing technology of liquid metal and flexible materials. This liquid metal patch antenna will give full play to the advantages of liquid gallium-indium alloy composite materials and flexible dielectric substrates, such as repairability, flexibility, reconfigurability, fatigue resistance, and corrosion resistance. It is applied in integrated small electronic devices to realize the reception and transmission of electromagnetic waves and is applied to long-distance wireless energy transmission. The purpose of the present invention is to design a patch antenna array with high gain, high efficiency, easy conformal with load devices, and certain self-adaptability, which operates at 5.8 GHz for microwave energy transmission, and a π-type decoupling network is added as a parasitic structure to enhance the energy reception ability of the antenna array.

[0019] (2) The present invention overcomes the disadvantage of low unit energy collection and conversion efficiency of traditional antennas. By continuously optimizing the connection method between antenna elements, the array obtains higher gain and efficiency, and can realize long-distance wireless energy transmission.

[0020] (3) The present invention overcomes the disadvantages of poor conformability of traditional antenna arrays, difficulty in resisting mechanical deformation, and poor environmental adaptability; the present invention uses flexible materials and liquid metal, enabling the antenna array to bend and twist according to different environments while maintaining its stable performance, with certain self-adaptability.

[0021] (4) In the present invention, the antenna array uses a π-type decoupling network as a parasitic structure of the antenna array, improving the energy reception ability of the antenna array.

[0022] (5) In the present invention, the antenna array is applied to the field of wireless energy transmission, with high gain and high efficiency, and can be applied to long-distance microwave wireless power transmission; the dielectric substrate of the antenna array is made of flexible materials, with good mechanical properties, can be well conformal with the load, and can be stretched, bent, twisted, and deformed while maintaining its stable performance; the patch antenna array is made by liquid metal printing, can withstand a large degree of deformation, has good conformability and certain self-adaptability. Description of the Drawings

[0023] Figure 1 It is a top view of the flexible antenna array in the present invention.

[0024] Figure 2 It is a top view of the patch antenna array without loading the π-type decoupling network in this embodiment.

[0025] Figure 3 It is a top view of the patch antenna array loaded with the π-type decoupling network in this embodiment.

[0026] Figure 4Side view of the first dielectric substrate and the second dielectric substrate in this embodiment.

[0027] Figure 5 Top view of the first dielectric substrate and the second dielectric substrate in this embodiment.

[0028] Figure 6 Schematic diagram of the feeding interface in this embodiment.

[0029] Figure 7 Physical diagram of the feeding interface in this embodiment.

[0030] Figure 8 Schematic diagram of the equivalent ground plane structure in this embodiment.

[0031] Figure 9 Schematic diagram of the connection between the equivalent ground plane and the feeding interface in this embodiment.

[0032] Figure 10 Cross-sectional view of the feeding interface, equivalent ground plane, and dielectric substrate in this embodiment.

[0033] Figure 11 Schematic diagram of the slotting of a single patch in this embodiment.

[0034] Figure 12 Schematic diagram of the slotting and the first transmission line of a single patch in this embodiment.

[0035] Figure 13 Schematic diagram of the intersection of the first transmission line, the second transmission line, and the third transmission line in this embodiment.

[0036] Figure 14 Schematic diagram of the structure and parameters of the π-type decoupling network in this embodiment.

[0037] Wherein, 1 - the first dielectric substrate, 2 - the second dielectric substrate, 3 - the patch antenna array, 301 - the first transmission line, 302 - the second transmission line, 303 - the third transmission line, 4 - the feeding interface, 401 - the inner core, 402 - the first outer ring, 403 - the second outer ring, 5 - the equivalent ground plane, 6 - the π-type decoupling network, 7 - the first cylindrical hole, 8 - the second cylindrical hole. Detailed implementation manners

[0038] The following describes the detailed implementation manners of the present invention to facilitate the understanding of the present invention by those skilled in the art of the present technology. However, it should be clear that the present invention is not limited to the scope of the detailed implementation manners. For those of ordinary skill in the art of the present technology, as long as various changes are within the spirit and scope of the present invention defined and determined by the appended claims, these changes are obvious, and all inventions made using the inventive concept of the present invention are within the scope of protection.

[0039] Embodiment

[0040] As shown in Figure 1 the figure, the present invention provides a flexible antenna array for wireless microwave energy transmission, which includes a first dielectric substrate 1, a second dielectric substrate 2, a patch antenna array 3, a feed interface 4, an equivalent ground plane 5, and a π-type decoupling network 6;

[0041] The patch antenna array 3 is closely attached to the first dielectric substrate 1 and contacts the upper surface of the first dielectric substrate 1. The second dielectric substrate 2 is located at a fixed distance below the first dielectric substrate 1. The equivalent ground plane 5 is located below the second dielectric substrate 2. The feed interface 4 penetrates through the equivalent ground plane 5, the first dielectric substrate 1, and the second dielectric substrate 2 from the inside to be connected to the patch antenna array 3, and at the same time contacts the patch antenna array 3, the first dielectric substrate 1, the second dielectric substrate 2, and the equivalent ground plane 5. The left and right ends of the π-type decoupling network 6 are respectively connected to the patch antenna array 3, and a section is led out at both ends of the π-type decoupling network 6 to form a π shape.

[0042] In this embodiment, the flexible antenna array includes a first dielectric substrate 1, a second dielectric substrate 2, a patch antenna array 3, a feed interface 4, an equivalent ground plane 5, and a π-type decoupling network 6. The dielectric substrates (the first dielectric substrate 1 and the second dielectric substrate 2) are used as the main supporting parts. The patch antenna array 3 is closely attached to the upper surface of the first dielectric substrate 1 and directly contacts the upper surface of the first dielectric substrate 1. A second dielectric substrate 2 is also placed at a certain distance below the first dielectric substrate 1, and an equivalent ground plane 5 is placed below the second dielectric substrate 2, which serves as an equivalent ground and also has the function of a metal reflector. The feed interface 4 penetrates through the equivalent ground plane 5, the first dielectric substrate 1, and the second dielectric substrate 2 from the inside to be connected to the patch antenna array 3, and at the same time contacts the patch antenna array 3, the dielectric substrates (the first dielectric substrate 1 and the second dielectric substrate 2), and the equivalent ground plane 5.

[0043] In this embodiment, both the first dielectric substrate 1 and the second dielectric substrate 2 are made of polyimide by condensation polymerization, which is a flexible material with good mechanical properties, resistant to bending, and easy to conform.

[0044] In this embodiment, the patch antenna array 3 includes four independent single patch antennas. Each independent patch antenna is connected through a first transmission line 301, a second transmission line 302, and a third transmission line 303 to form the patch antenna array 3, and is connected to the feed interface 4. The first transmission line 301, the second transmission line 302, and the third transmission line 301 all serve as impedance matching networks.

[0045] In this embodiment, the patch antenna array 3 is obtained by arranging and integrating individual patch antennas. The patch antenna array 3 is composed of four individual patch antennas. Each independent patch antenna is connected through each transmission line to form a patch antenna array and is connected to the feeding interface 4. Among them, the first transmission line 301, the second transmission line 302, and the third transmission line 303 can all be regarded as impedance matching networks, whose purpose is to achieve matching between each element and at the same time connect the patch antenna array 3 and the feeding interface 4.

[0046] In this embodiment, the thickness of the equivalent ground plane 5 is less than the thickness of the second dielectric substrate 2, and the thickness of the equivalent ground plane 5 is the same as the thickness of the patch antenna array 3.

[0047] In this embodiment, the equivalent ground plane 5 is essentially a very thin gallium indium alloy, which not only serves as an equivalent ground but also as a reflector. It is located on the lower side of the second dielectric substrate 2, and its thickness is much less than the thickness of the second dielectric substrate 2 and is approximately equal to the thickness of the patch antenna array 3.

[0048] In this embodiment, the feeding interface 4 includes an inner core 401, a first outer ring 402, and a second outer ring 403; the upper end of the inner core 401 penetrates through the first dielectric substrate 1 and the second dielectric substrate 2 through a cylindrical hole and is connected to the patch antenna array 3, and a part protrudes; the lower end of the inner core 401 passes through the equivalent ground plane 5 and a part protrudes; the first outer ring 402 wraps the inner core 401, the periphery of the first outer ring 402 is surrounded by the second outer ring 403, the upper end of the first outer ring 402 extends beyond the equivalent ground plane 5, and the upper end of the second outer ring 403 is lower than the equivalent ground plane 5.

[0049] In this embodiment, the inner core 401, the first outer ring 402, and the second outer ring 403 are all cylinders; the inner diameter of the first outer ring 402 is the same as the radius of the inner core 401; the length of the first outer ring 402 is the sum of the thicknesses of the second dielectric substrate 2 and the equivalent ground plane 5; the bottom center of the first outer ring 402 is the same size as that of the inner core 401; the bottom center of the second outer ring 403 is the same size as the bottom centers of the inner core 401 and the first outer ring 402, the inner diameter of the second outer ring 403 is the same size as the outer diameter of the first outer ring 402, and the length of the second outer ring 403 is the same as the length of the first outer ring 402.

[0050] In this embodiment, the feeding interface 4 is mainly composed of an inner core 401, a first outer ring 402, and a second outer ring 403. The inner core 401 is a small copper cylinder with a radius of 0.65 mm. The upper end of the inner core 401 penetrates through the first dielectric substrate 1 and the second dielectric substrate 2 by means of a cylindrical hole and is directly connected to the patch antenna array 3, protruding a part. The lower end of the inner core 401 also protrudes a part after passing through the equivalent ground plane 5.

[0051] In this embodiment, the first outer ring 402 is made of a section of circular cylinder made of the insulating material Teflon. Its inner diameter is the same as the radius of the inner core 401, and the outer diameter of the first outer ring 402 is increased by 1.43 mm on the basis of the inner diameter. The length of the first outer ring 402 is the sum of the thicknesses of the second dielectric substrate 2 and the equivalent ground plane 5. The first outer ring 402 wraps the inner core 401 (the centers of the bottom surfaces of the inner core 401 and the first outer ring 402 are the same).

[0052] In this embodiment, the second outer ring 403 is made of copper and is also a circular cylinder ring. The center of its bottom surface is the same as that of the inner core 401 and the first outer ring 402. The inner diameter of the second outer ring 403 is the outer diameter of the first outer ring 402, and the outer diameter of the second outer ring 403 is increased by 0.8 mm on the basis of the inner diameter. The length of the second outer ring 403 is the same as that of the first outer ring 402.

[0053] In this embodiment, the π-shaped decoupling network 6 is essentially a very thin layer of gallium indium alloy. It is respectively connected to the patch antennas on the left and right, and a section is led out at both ends to form a π shape. Its essence is to play a role in decoupling in the unit antenna, and in the antenna array, it serves as a parasitic structure, which can increase the energy reception ability of the antenna array.

[0054] In this embodiment, as Figures 1 - 5 shown, Figure 1 is a top view of the schematic structure of the antenna device, Figure 2 and Figure 3 is a top view of the patch antenna array 3, divided into whether to load the Π-shaped decoupling network, Figure 4 Figure 5 Explain the structures of the first dielectric substrate 1 and the second dielectric substrate 2. In the present invention, both the first dielectric substrate 1 and the second dielectric substrate 2 are made of a polycondensation type polyimide material, which is a deformable flexible material. The material of the patch antenna array 3 is gallium indium alloy, which is printed onto the upper surface of the first dielectric substrate 1 through a liquid metal printing technique and is used to receive electromagnetic waves with a frequency of 5.8 GHz in the environment. Figure 5 There is a cylindrical hole with a relatively small radius.

[0055] In this embodiment, as Figure 6 and Figure 7 shown, Figure 6 and Figure 7It is a schematic diagram of the feeding interface 4. The cylindrical inner core 401 penetrates through the first dielectric substrate 1, the second dielectric substrate 2, and the equivalent ground plane 5. The upper end extends 0.3 mm beyond the patch antenna array and can be regarded as being integrated with the patch antenna array 3. A part of its periphery is wrapped by the insulating first outer ring 402. The upper end of the first outer ring 402 extends 0.075 mm beyond the equivalent ground plane and is surrounded by the copper second outer ring 403. The upper end of the second outer ring 403 is 0.025 mm lower than the equivalent ground plane. This avoids the connection between the patch antenna array 3 (equivalent to the positive electrode) and the equivalent ground plane 5 (equivalent to the negative electrode) (separated by the inner core 401 in the middle), and at the same time provides that the feeding interface 4 can supply power to the subsequent load. The energy of the patch antenna array 3 is transmitted to the feeding interface 4 through the transmission line, and the feeding interface 4 is cascaded with the next-level structure (mostly a rectifier circuit) to transmit the obtained microwave energy to the next level.

[0056] In this embodiment, as Figure 8 and Figure 9 shown, Figure 8 and Figure 9 are the connection structure diagrams of the equivalent ground plane 5 and the feeding interface 4. The cooperation between the inner core 401 and the first outer ring 402, and the cooperation between the first outer ring 402 and the second outer ring 403 realize the connection between the feeding interface 4 and the entire antenna structure.

[0057] In this embodiment, a copper film with a relatively thin thickness is attached to the lower surface of the second dielectric substrate 2. As Figure 8 shown, its function is equivalent grounding, so it is named the equivalent ground plane 5. A first cylindrical hole 7 is made in the first dielectric substrate 1, and a second cylindrical hole 8 is made at the same center of the second dielectric substrate 2 and the equivalent ground plane 5. The depth of the first cylindrical hole 7 is the same as the height of the first dielectric substrate 1, and the depth of the second cylindrical hole 8 is the sum of the heights of the second dielectric substrate 2 and the equivalent ground plane 5. However, the radius of the second cylindrical hole 8 is larger than that of the first cylindrical hole 7. The radius of the first cylindrical hole 7 is the same as that of the inner core 401, which is 0.65 mm; the radius of the second cylindrical hole 8 is the same as that of the second outer ring 403, which is 2.88 mm, as Figure 10 shown.

[0058] In this embodiment, as Figures 11 - 13 shown, Figures 11 to 13It is the structure and parameters of the patch antenna array 3. In the patch antenna array 3, four rectangular patches resonate with the 5.8 GHz electromagnetic wave in the environment to generate electric field energy. By slotting a single patch, the operating frequency of the antenna is stabilized at 5.8 GHz, and at the same time, a transmission line is used to transmit the energy. The reason for choosing three widths of transmission lines is to achieve impedance matching between individual patch antennas and reduce the energy loss on the transmission line, so that more energy is transmitted to the rear-end load. Since the material of the antenna is liquid gallium-indium alloy, this patch antenna array has the characteristics of a certain liquid and has great advantages over traditional metal patch antenna arrays. The flow of the liquid metal can ensure that the antenna array remains stable in performance under large deformations, and at the same time, it can better adapt to environmental changes and has good self-adaptability. Figure 11 In it, the inner circle radius of the innermost ring of a single antenna is 11.34 mm, the radius difference between the inner and outer circles of this ring is 0.83 mm, the radius difference between the inner and outer circles of the middle ring is 1.8 mm, and the radius difference between the inner and outer circles of the outermost ring is 1.6 mm. Figure 12 In it, the length of the extended part of a single antenna is 4.95 mm, the length of the first transmission line 301 is 15.38 mm, the width is 1 mm, the length of the second transmission line 302 is 3 mm, the width is 1.2 mm, and the width of the π-type decoupling network 6 is 1 mm. Figure 13 In it, the length of the first transmission line 301 is 15.38 mm; the length of the second transmission line 302 is 3 mm; the length of the third transmission line 303 is 36.07 mm, and the width is 1.2 mm.

[0059] In this embodiment, as Figure 14 shown, the main function of the π-type decoupling network 6 is to act as a parasitic structure of the antenna array, so as to enhance the energy reception ability of the antenna array. Figure 14 In it, the length of the π-type decoupling network 6 is 33.6 mm, the width is 1.8 mm, and the width of the extended part is 1 mm.

[0060] The present invention has invented a liquid metal antenna operating at 5.8 GHZ for microwave energy transmission by applying the printing technology of liquid metal and flexible materials. This liquid metal patch antenna will give full play to the advantages of liquid gallium-indium alloy composite materials and flexible dielectric substrates, such as repairability, flexibility, reconfigurability, fatigue resistance, and corrosion resistance, and is applied in integrated small electronic devices to realize the reception and transmission of electromagnetic waves and is applied to long-distance wireless energy transmission. The purpose of the present invention is to design a patch antenna array with high gain, high efficiency, easy to conformal with load devices, and having a certain self-adaptability, operating at 5.8 GHz for microwave energy transmission, and adding a π-type decoupling network as a parasitic structure to enhance the energy reception ability of the antenna array.

Claims

1. A flexible antenna array for wireless microwave energy transmission, characterized in that, It includes a first dielectric substrate (1), a second dielectric substrate (2), a patch antenna array (3), a feeding interface (4), an equivalent ground plane (5), and a π-type decoupling network (6); The patch antenna array (3) is closely attached to the first dielectric substrate (1) and contacts the upper surface of the first dielectric substrate (1). The second dielectric substrate (2) is located at a fixed distance below the first dielectric substrate (1). The equivalent ground plane (5) is located below the second dielectric substrate (2). The feeding interface (4) penetrates through the equivalent ground plane (5), the first dielectric substrate (1), and the second dielectric substrate (2) from the inside to be connected to the patch antenna array (3), and simultaneously contacts the patch antenna array (3), the first dielectric substrate (1), the second dielectric substrate (2), and the equivalent ground plane (5). The left and right ends of the π-type decoupling network (6) are respectively connected to the patch antenna array (3), and a section is led out at both ends of the π-type decoupling network (6) to form a π shape; The feeding interface (4) includes an inner core (401), a first outer ring (402), and a second outer ring (403); The upper end of the inner core (401) penetrates through the first dielectric substrate (1) and the second dielectric substrate (2) through a cylindrical hole to be connected to the patch antenna array (3) and protrudes a part. The lower end of the inner core (401) passes through the equivalent ground plane (5) and protrudes a part. The first outer ring (402) wraps the inner core (401). The periphery of the first outer ring (402) is surrounded by the second outer ring (403). The upper end of the first outer ring (402) extends beyond the equivalent ground plane (5), and the upper end of the second outer ring (403) is lower than the equivalent ground plane (5).

2. The flexible antenna array for wireless microwave energy transmission according to claim 1, wherein Both the first dielectric substrate (1) and the second dielectric substrate (2) are made of polycondensation-type polyimide.

3. The flexible antenna array for wireless microwave energy transmission according to claim 1, characterized in that The patch antenna array (3) includes four independent single patch antennas. Each independent patch antenna is connected through a first transmission line (301), a second transmission line (302), and a third transmission line (303) to form the patch antenna array (3), and is connected to the feeding interface (4). The first transmission line (301), the second transmission line (302), and the third transmission line (303) all serve as impedance matching networks.

4. The flexible antenna array for wireless microwave energy transmission according to claim 1, wherein The thickness of the equivalent ground plane (5) is less than the thickness of the second dielectric substrate (2), and the thickness of the equivalent ground plane (5) is the same as the thickness of the patch antenna array (3).

5. The flexible antenna array for wireless microwave energy transmission according to claim 1, characterized in that, The inner core (401), the first outer ring (402), and the second outer ring (403) are all cylinders; The inner diameter of the first outer ring (402) is the same as the radius of the inner core (401). The length of the first outer ring (402) is the sum of the thicknesses of the second dielectric substrate (2) and the equivalent ground plane (5). The centers of the bottom surfaces of the first outer ring (402) and the inner core (401) are of the same size; The center of the bottom surface of the second outer ring (403) has the same size as the centers of the bottom surfaces of the inner core (401) and the first outer ring (402). The inner diameter of the second outer ring (403) is the same as the outer diameter of the first outer ring (402), and the length of the second outer ring (403) is the same as the length of the first outer ring (402).

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