Connector and method for connecting a circuit board with at least one conductor
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MD ELEKTRONIK GMBH
- Filing Date
- 2022-08-23
- Publication Date
- 2026-05-22
AI Technical Summary
Existing technologies have problems such as numerous components and large structural space occupation when connecting circuit boards and conductors, and the manufacturing process is complicated.
A connector with a fastening mechanism, a recess, and pads is used. It is fixed to the circuit board by the fastening mechanism, and the conductor is directly introduced into the recess and connected to the pads. Reliable electrical connection is achieved by utilizing heat. The connector is made of a non-thermal-conducting material to control heat input.
It enables a compact, space-saving connection between the circuit board and the conductor, reduces processing steps and supports automated production, and ensures the reliability and stability of the connection.
Smart Images

Figure CN115732950B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a connector and method for connecting a circuit board to at least one conductor, and a circuit board for directly connecting at least one conductor. Background Technology
[0002] When establishing connections between conductors and circuit boards, existing connection techniques often involve multiple and / or bulky components.
[0003] Publication WO 02 / 084808 A1 describes a circuit board connector for receiving cable ends, configured to be secured on a circuit board. The circuit board connector has a through-hole into which the cable end is inserted and through which an inner conductor passes, wherein the inner conductor is soldered externally to a microstrip conductor on the circuit board.
[0004] Publication EP 2 690 712 A2 describes a connection device for connecting a high-frequency coaxial cable to a circuit board. The circuit board includes a cut-out area and a pair of through-holes, a portion of the edge of which is cut out in the cut-out area, and the through-holes are designed on both sides of the cut-out area. The cut-out area is formed at a predetermined location on the outer periphery of the circuit board and includes an opening that opens outwards, while the through-holes include openings with circular shapes. The cut-out area is the space in which a central body and a high-frequency coaxial cable are arranged and soldered, while the through-holes are the spaces in which an auxiliary body for inserting and soldering solder blocks is placed.
[0005] Publication US 2007 / 054510 A1 describes systems and methods for connecting coaxial cables to conductors on a circuit board. In particular, this publication describes an apparatus for connecting coaxial cables to a circuit board, wherein the apparatus includes a connector comprising a conductive element having a receiving portion that receives an end of the coaxial cable for connecting the coaxial cable to a conductor on the circuit board. The apparatus also includes a shield that is directly connected to the connector and the circuit board to prevent passive radiation.
[0006] Publication US 2021 / 0006012 A1 describes a circuit board connector with a mounting interface configured for surface mounting onto a circuit board, wherein the circuit board connector is capable of having a recess for accommodating complementary connectors for connecting multiple metal wires.
[0007] In summary, existing systems have significant structural space on the circuit board, which is usually accompanied by additional necessary components and increased processing overhead. Summary of the Invention
[0008] Therefore, the object of the present invention is to provide an apparatus and method for connecting a circuit board and at least one conductor, wherein an optimal connection is established with few components and installation steps and in a minimal structural space, preferably the connection is established automatically.
[0009] The above-mentioned objectives are achieved by the connector according to the invention, the circuit board according to the invention, and the method according to the invention. Other advantageous design aspects of the invention can be derived from the invention, the description, and the drawings.
[0010] The aforementioned objective is achieved in particular by a connector for connecting at least one conductor of a circuit board and wires, the circuit board having at least one pad, the connector having a fastening mechanism and a recess, the connector being fastened to the circuit board by means of the fastening mechanism, the recess being constructed on a first side of the connector and extending at least through a second side arranged transversely to the first side, wherein, in the mounted state of the connector on the circuit board, at least one pad can be arranged in the recess on the first side, and the recess forms a first opening on the second side, into which at least one conductor can be inserted, and a second opening is constructed on a third side opposite to the first side, wherein heat can be provided via the second opening for connecting at least one conductor to at least one pad.
[0011] A connector is a forming aid used to establish a continuous and conductive connection between a circuit board and at least one conductor. Here, the connection is a direct connection, i.e., without an interface or plug system. The advantages of a direct connection are that it saves components and provides less structural space. Furthermore, the connection can be set up in fewer steps and automatically. For a reliable connection between the circuit board and the connector, the necessary compression can be ensured in automated production by a pick-and-place automated device. The circuit board acts as a primary solder library during connection, and forming aids are only required on the circuit board side. The wires to be connected, or at least one freely positioned conductor, do not necessarily need to be pre-treated. This saves time and enables processing in confined spaces.
[0012] Preferably, the connector is configured to connect multiple conductors side-by-side to corresponding pads, wherein the first opening has a width suitable for accommodating the multiple conductors side-by-side. The multiple conductors can include more than five, and particularly more than ten. Through the shape of the connector, and especially through the width of the first opening, the multiple conductors can be densely connected to the circuit board adjacent to each other. This enables a compact, space-saving structure for the connector and the entire connection.
[0013] Preferably, in the installed state, at least one side of the first opening is formed by a circuit board. This allows the introduced conductor to be arranged as close as possible to the circuit board, i.e., only solder pads exist between the conductor and the circuit board. Therefore, space-saving connections requiring minimal structural space can be achieved.
[0014] Preferably, the fastening mechanism includes pins or pins that can be inserted into corresponding openings on the circuit board. Pins or pins, or similar fastening mechanisms, provide readily perceptible visual and / or tactile feedback to installers and the placement system of automated devices, thus facilitating the arrangement of the connector on the circuit board. Furthermore, the orientation of the connector on the circuit board can be predetermined through this arrangement and multiple fastening mechanisms. Pins or pins can provide a simple and secure, durable, or detachable connection.
[0015] Preferably, the connector has an adhesive surface on a first side. The adhesive surface can additionally or alternatively form a fastening mechanism. The adhesive surface can be applied to the connector and / or circuit board via adhesive points. The adhesive surface ensures the fastening of the connector on the circuit board.
[0016] Preferably, in the installed state, the height of the first opening corresponds to the diameter of at least one conductor. In the installed state, the inserted conductor essentially fills the entire height of the opening or gap, thus making the connector only the required height. This essentially means that there must also be space for the solder pads and that an insertion aid can be provided at the outer edge of the first opening. The height of the first opening allows the connector to be designed to be very flat, thus requiring only a small structural space.
[0017] Preferably, the first opening has at least one guide device. The guide device facilitates the introduction of the conductor into the first opening. Because the diameter of the introduced conductor is typically only a fraction of a millimeter, for example, in the range of 0.1 to 0.9 mm, the guide device is highly advantageous.
[0018] Preferably, the first opening has at least one orientation mechanism. The orientation mechanism facilitates the orientation and arrangement of the conductors within the connector. This ensures a consistent arrangement of the conductors within the connector or on the pads.
[0019] Preferably, the connector further has a third opening configured on a third side, through which media can be delivered to at least one conductor and at least one pad. Preferably, the third opening is spaced apart from the second opening and forms an additional channel to a recess in the connector, wherein the recess forms a cavity in the installed state. The third opening enables heat transfer applications independent of the second opening.
[0020] Preferably, the third opening forms or has a reservoir for the dielectric. Preferably, the reservoir is filled with a specific amount of dielectric before the connector is placed on the circuit board. Preferably, the dielectric exists in a solid form in the connector's reservoir at room temperature, i.e., without significant heat transfer, such as during soldering. The advantage of the reservoir at the connector is that the dielectric does not need to be supplied externally at the connector during conductor connection or soldering. Therefore, the process flow can be designed simply.
[0021] Preferably, the connector is made of a non-thermally conductive material. If the connector is made of a non-thermally conductive material, heat transfer during soldering is provided only to the conductor and pads via the second opening. This enables directional heat input at the connector. Directional heat input ensures reliable soldering and saves energy by preventing unwanted heat diffusion.
[0022] The aforementioned objective is further achieved, in particular, by a circuit board having at least one pad and a connector, thereby enabling the circuit board to be directly connected to at least one conductor of a wire. This direct connection eliminates the need for interfaces or plug-in systems, resulting in fewer components and space savings. Here, the connector provides protection for the connection surface between the conductor and the pad based on its housing-like frame structure.
[0023] The aforementioned problem is also addressed in particular by a method for connecting a circuit board having at least one pad to at least one conductor of a wire, wherein the method comprises the following steps: placing a connector at a predetermined position on the circuit board, wherein a fastening mechanism of the connector engages with the circuit board and at least one pad is arranged in a recess of the connector; introducing at least one conductor into a first opening at the connector, wherein the introduction movement is preferably oriented along the plane of the circuit board so that the introduced conductor contacts the pad inside the connector; and introducing heat through a second opening at the connector, thereby connecting the introduced conductor to the contacted pad.
[0024] This method enables a reliable electrical connection between at least one conductor and the circuit board in a few steps, preventing contact failures over time. The step can be performed manually or automatically, allowing for efficient production.
[0025] Preferably, in the step of introducing at least one conductor, the introduced conductor is at least partially pressed into the pad. Pressing the conductor at least partially into the pad enhances the fixation of the conductor in the connector due to the adhesive properties of the pad, wherein the pad is preferably formed of solder paste. Thus, the introduced conductor remains fixed in the connector even with small (stretching) movements at the wire before it is permanently secured to the circuit board by soldering or similar means.
[0026] Preferably, the method further comprises the step of: introducing a dielectric medium that supports the connection between at least one pad and at least one introduced conductor, wherein the introduction is preferably achieved via a third opening at the connector. Preferably, the introduction of the dielectric medium is passively achieved at a second opening during heat input. Because heat transported via the second opening can also extend from the inside to the third opening via the void, the dielectric medium can be liquefied by heat and can reach the pad and the introduced conductor in the void by gravity. The dielectric medium supports the connection between the pad and the conductor due to its chemical properties, thereby enabling the establishment of a reliable connection. Attached Figure Description
[0027] The embodiments are described below with reference to the accompanying drawings. Here are shown:
[0028] Figure 1 This is a perspective view of an embodiment of the connector;
[0029] Figure 2 This is a perspective view of an embodiment of a circuit board having a connector fastened thereto and wires inserted into the connector;
[0030] Figure 3 yes Figure 2 The illustrated cross-sectional view; and
[0031] Figure 4 This is a perspective view of a second embodiment of the connector. Detailed Implementation
[0032] The embodiments are described in detail below with reference to the accompanying drawings.
[0033] Figure 1 A first embodiment of connector 1 is shown. Connector 1 is suitable for directly securing at least one conductor 32 to circuit board 20 and making electrical contact. The concept of "direct" means that no plug-in or interface system is used. Connector 1 is secured to circuit board 20 for its application. In principle, it is possible for connector 1 to be arranged not only on the upper side 22 of circuit board 20 but also on the lower side. Securing can be done manually or automatically / mechanically. For securing, connector 1 has a securing mechanism 2. Figure 1 In this embodiment, the fastening mechanism 2 includes two pins or latches adapted to be inserted into corresponding openings or recesses on the circuit board 20 and to form a permanent connection. In alternative embodiments, the fastening mechanism 2 may also include only one or more fastening mechanisms 2. Preferably, the fastening mechanism 2 enables the directional arrangement of the connector 1 on the circuit board 20. The fastening mechanism 2 may have additional clamping or stopping elements or be designed to be form-fitting or mushroom-shaped. For example, in... Figure 1The pin shown can have a mushroom shape at its free end. In addition, as an addition to or replacement of the fastening mechanism 2 described above, the connector 1 can be fastened to the first side 11 of the connector 1 on the circuit board 20 by means of an adhesive surface.
[0034] Connector 1 forms a frame structure. Connector 1 is particularly capable of being placed onto a surface or suitable object using its recess 10 and framing the surface or object on multiple sides. Framing restricts and defines the passage to the surface or object. Furthermore, the surface or object is protected from unwanted external influences by connector 1. In the illustrated embodiment, one or more pads 24 on circuit board 20 are objects, which are framed by circuit board 20 and connector 1 after connector 1 is placed onto circuit board 20 (see...). Figure 2 and Figure 3 Circuit board 20 can also be called a PCB or printed circuit board. Pad 24 is a conductive contact surface. Electrical connections between conductor 32 and printed circuits on circuit board 20 can be established through pad 24.
[0035] Access to pads 24 or more pads 24 from the outside using conductor 32 can or should be achieved via a first opening 4. The first opening 4 is part of a recess 10 at connector 1. A portion of the recess 10 is constrained by circuit board 20, thereby forming the first opening 4. Preferably, the first opening 4 has a height H substantially corresponding to the diameter D of conductor 32, which should be introduced into connector 1. This description substantially includes tolerances, such as the presence of pads 24 in addition to conductor 32 (see...). Figure 3 Furthermore, the outer edge of the first opening 4 can have a slightly higher height, which is then reduced by at least one insertion aid 5. The slightly higher height at the side edges, combined with at least one insertion aid 5 preferably configured as an insertion ramp, facilitates the insertion of the conductor 32 into the connector 1. Additional insertion aids 5 or insertion ramps can also be formed at other side edges of the first opening 4, particularly at the circuit board 20.
[0036] Preferably, at least one conductor 30 to be connected to the circuit board 20 via connector 1 comprises a single-core conductor 30 having a conductor 32. In alternative embodiments, multi-core conductors can also be connected to the circuit board 20 via connector 1. Preferably, the conductor 32 comprises the core of the conductor 30, stranded wire, or metal wire. The conductor 32 is exposed in a portion of the conductor end, especially after pre-assembly including conductor insulation or shielding / outer conductor and dielectric stripping. Connector 1 is particularly configured to reliably connect very thin stranded wires to the circuit board 20 because no additional mating system is required. Preferably, the width B of the first opening 4 matches the number of pads 24 on the circuit board 20, thereby matching the maximum number of conductors 32 to be connected. In a preferred embodiment, the width B of the first opening 4 is chosen such that the conductors 30 to be connected to the circuit board 20 are arranged densely together, while each conductor 32 is arranged spaced apart from each other on a separate pad 24 in connector 1 (see Figure 2 The conductor 30 may also include a coaxial conductor, wherein the outer conductor shield is connected to the outside of the circuit board 20. Preferably, the stripped edge of the conductor 30 is located at or aligned with the edge of the circuit board 20.
[0037] Preferably, at least one pad 24 comprises solder paste or the like. When the conductor 32 is introduced into the connector 1, the conductor 32 comes into direct contact with the pad 24. The conductor 32 is at least partially pressed into the pad 24 during introduction. The paste-like substance on the pad 24 causes the introduced conductor 32 to be held at the pad 24 by friction or adhesion. The introduced conductor 32 is pre-fixed to the connector 1 by the pad 24. Preferably, at least one pad 24 is applied before the connector 1 is arranged on the circuit board 20. The number or arrangement of the at least one pad 24 is given by a predetermined path on the circuit board 20. The at least one pad 24 can be pre-treated or surface-treated, thereby providing a reservoir for soldering the pad 24 and the conductor 32. Preferably, after the conductor 32 is introduced into the connector 1, the conductor 32 is positioned as parallel as possible to the circuit board 20 at the center of the associated pad 24.
[0038] To ensure a durable connection and electrical connection between conductor 32 and circuit board 20, conductor 32 is preferably soldered to pad 24. Preferably, conductor 32 is pre-treated or surface-treated, such as tin-plated, for soldering. Furthermore, heat is introduced into connector 1 via a second opening 6 for soldering. The second opening 6 is designed to extend substantially beyond the width B of the first opening 4, thereby enabling heat to be directed to each conductor 32 or introduced over a large area to all introduced conductors 32. Heat can be delivered directly or indirectly, for example, via vibration (such as laser or infrared waves). If connector 1 is made of a non-thermally conductive material, the second opening 6 forms the only location capable of introducing heat for soldering conductors 32 into connector 1. Especially in multi-row connections, connector 1 can be made of a thermally conductive material to facilitate heat transfer over a large area and create a reliable connection.
[0039] Furthermore, the medium can be supplied to the connector 1 via the third opening 8. The medium can support soldering and / or pretreatment of the pads 24 and / or conductors 32. The third opening 8 can particularly include a solder library in which the medium can be stored. The solder library can be the third opening 8 itself or a separate storage device. In a preferred embodiment, the medium exists in a solid form in the third opening 8 prior to soldering. During soldering, the medium liquefies due to the heat generated in the connector 1 and gradually moves within the connector 1 to the soldering position.
[0040] Figure 4 A second embodiment of connector 100 is shown. This second embodiment of connector 100 particularly includes an orientation mechanism 110 for orienting or guiding at least one conductor 32 into connector 100. Preferably, the orientation mechanism 110 comprises a semi-arch 112 or a slat with an open, curved / bent profile. The semi-arch 112 or profile allows each conductor 32 to be positioned in a specific location and evenly spaced apart from each other within connector 100. Preferably, the orientation mechanism 110 is designed integrated with connector 100. In an alternative embodiment, the orientation mechanism 110 can be fastened to connector 100 as a separate component. Preferably, the number of semi-arches 112 corresponds to the number of pads 24 in connector 100 on circuit board 20.
[0041] Preferably, connector 1 is made of a non-conductive material, especially plastic.
[0042] List of reference numerals
[0043] 1 Connector
[0044] 2 Fastening mechanism
[0045] 4 First opening
[0046] 5. Import auxiliary devices
[0047] 6. Second opening
[0048] 8 Third opening
[0049] 10. Empty space
[0050] 11 First side
[0051] 12 Second side
[0052] 13 Third side
[0053] 20 circuit boards
[0054] 22 upper side
[0055] 24 pads
[0056] 30 wires
[0057] 32 conductors
[0058] 100 connector
[0059] 110 Targeted Agency
[0060] 112 Semi-arch
[0061] B width
[0062] D diameter
[0063] H height
[0064] X, Y, and Z axis directions.
Claims
1. A circuit board (20) having at least one pad (24) and a connector (1, 100) for directly connecting the circuit board (20) to at least one conductor (32) of a wire (30), the connector having: a) Fastening mechanism (2), by means of which the connector (1, 100) is fastened to the circuit board (20); b) A gap (10) is constructed at a first side (11) of the connector (1, 100), and the gap extends at least through a second side (12) arranged transversely to the first side (11), wherein, In the mounted state where the connectors (1, 100) are mounted on the circuit board (20), at least one of the pads (24) is arranged in the recess (10) on the first side (11), and the recess (10) forms a first opening (4) on the second side (12). At least one conductor (32) is inserted into the first opening, the conductor including the core of the wire (30), stranded wire, or metal wire; and in the mounted state, the height (H) of the first opening (4) corresponds to the diameter (D) of at least one conductor (32), and the stripped edge of the wire (30) is located at or aligned with the edge of the circuit board (20). c) A second opening (6) is constructed on a third side (13) opposite to the first side (11), wherein heat can be provided via the second opening (6) for connecting at least one of the conductors (32) to at least one of the pads (24).
2. The circuit board according to claim 1, wherein, The connector (1, 100) is configured to connect a plurality of the conductors (32) side by side with a corresponding plurality of the pads (24), wherein the first opening (4) has a width (B) suitable for accommodating the plurality of conductors (32) side by side.
3. The circuit board according to claim 1 or 2, wherein, In the installed state, at least one side of the first opening (4) is formed by the circuit board (20).
4. The circuit board according to claim 1 or 2, wherein, The fastening mechanism (2) includes a pin or pin that can be inserted into a corresponding opening at the circuit board (20).
5. The circuit board according to claim 1 or 2, wherein, The connectors (1, 100) have an adhesive surface on the first side (11).
6. The circuit board according to claim 1 or 2, wherein, The first opening (4) has at least one importing aid (5).
7. The circuit board according to claim 1 or 2, wherein, The first opening (4) has at least one orientation mechanism (110).
8. The circuit board according to claim 1 or 2, further comprising a third opening (8), said third opening being constructed at said third side (13), wherein, The medium can be delivered to at least one of the conductors (32) and at least one of the pads (24) via the third opening (8).
9. The circuit board according to claim 8, wherein, The third opening (8) has or forms a storage reservoir for the medium.
10. The circuit board according to claim 1 or 2, wherein, The connectors (1, 100) are made of a non-thermal conductive material.
11. A method for connecting a circuit board (20) to at least one conductor (32) of a wire (30), the circuit board having at least one pad (24) and a connector (1, 100), wherein, The method comprises the following steps: a) The connectors (1, 100) are arranged at a predetermined position on the circuit board (20), wherein the fastening mechanism (2) of the connectors (1, 100) engages with the circuit board (20), and at least one of the pads (24) is arranged in the empty portion (10) of the connectors (1, 100); b) Inserting at least one of the conductors (32) into a first opening (4) at the connector (1, 100), the conductor comprising the core of the wire (30), stranded wire or metal wire, wherein, in the mounted state of the connector (1, 100) on the circuit board (20), the height (H) of the first opening (4) corresponds to the diameter (D) of at least one of the conductors (32), the stripped edge of the wire (30) is located at or aligned with the edge of the circuit board (20), and the insertion movement is oriented along the plane (XY) of the circuit board so that the inserted conductor (32) contacts the pad (24) inside the connector (1, 100); c) Heat is introduced through the second opening (6) at the connector (1, 100) to connect the introduced conductor (32) to the contacted pad (24).
12. The method according to claim 11, wherein, In the step of introducing at least one of the conductors (32), the introduced conductor (32) is pressed into the pad (24) at least partially.
13. The method according to claim 11 or 12, further comprising the step of: introducing a medium that supports a connection between at least one of the pads (24) and at least one introduced conductor (32), wherein, The introduction is achieved via the third opening (8) at the connector (1, 100).