Camera module and its method for setting connector PINs

Abstract

The present application discloses a camera module and a method for setting the PIN pins of its connector. The camera module includes: a lens assembly, a circuit board, and a connector. The upper section of the circuit board is attached to the lens assembly so that electrical connection is established between the lens assembly and the circuit board; the connector is attached to the lower section of the circuit board, and the connector is electrically connected to the circuit board and the main board through the pin area respectively, and at least two protocols are used for setting the pin area connected to the lens assembly, so that the connector can be compatible with lens assemblies of different communication methods. Thus, it is preferably applicable to a 48-megapixel high-pixel and high-current module, and the connector is compatible with two communication protocols, C-PHY and D-PHY, to convert the exclusivity of the camera module into universality, thereby realizing the normalized design of the camera module; at the same time, by defining different pins of the connector, the connector can be compatible with multiple focusing methods of the lens assembly, thereby realizing the normalized processing of the camera module.

Description

Technical Field

[0001] The present invention relates to the field of optical imaging, and particularly to a camera module and a method for setting the connector PIN pins thereof. Background Art

[0002] With the rapid development of mobile devices, especially smart phones, people have higher and higher requirements for the pixels of the camera modules of mobile devices, and at the same time, the requirements for the transmission speed are also getting higher and higher. Therefore, the traditional parallel port (TTL interface) transmission is increasingly challenged. There are mainly two methods to improve the transmission speed of the traditional parallel port. One is to increase the output clock of the parallel port transmission, but this will make the EMC design of the system more and more difficult. The other method is to increase the number of transmission lines, but this does not conform to the trend of miniaturization of the terminal structure.

[0003] In 2003, companies such as ARM, Noki, ST, and TI established the MIPI Alliance, that is, the Mobile Industry Processor Interface Alliance, aiming to standardize the interfaces inside mobile phones, such as camera interfaces, display interfaces, radio frequency / baseband interfaces, etc., so as to reduce the complexity of mobile phone design and increase design flexibility. The camera module using the new MIPI interface has the advantages of fast speed, large data transmission volume, low power consumption, good anti-interference, etc. compared with the parallel port, so it has gradually attracted people's attention and favor.

[0004] There are different working groups (WorkGroups) under the MIPI Alliance, which respectively define a series of internal interface standards for mobile phones, such as the camera interface CSI (Camera Serial Interface), the display interface DSI (Display Serial Interface), the radio frequency interface DigRF, the microphone / speaker interface SLIMbus, etc. The unified interface standard can facilitate mobile phone manufacturers to flexibly select different chips and modules from the market according to their needs, and it is more convenient and faster to change the design and functions.

[0005] The interfaces of the above-mentioned chips and modules basically use the C-PHY or D-PHY communication protocol to transmit data. Both the C-PHY and D-PHY communication protocols can increase the bandwidth to improve the signal transmission ability and data volume. And when the chips and modules are installed in the mobile device, they are basically connected to the main board inside the mobile device through the connector. This leads to that when the manufacturer designs the chips and modules, the communication protocol of the chips and modules must be the same as the communication protocol of the connector pins, which further increases the design difficulty of the camera module. Summary of the Invention

[0006] One object of the present invention is to provide an imaging module and a method for setting the PIN pins of its connector. By defining at least two communication protocols for the pins of the connector simultaneously, the connector can be made to be compatible with imaging modules of multiple communication protocols, so as to convert the exclusivity of the imaging module into generality, thereby reducing the design difficulty of the imaging module.

[0007] One object of the present invention is to provide an imaging module and a method for setting the PIN pins of its connector. By adopting the D-PHY or C-PHY communication protocol for the pin area of the connector, the transmission speed of the imaging module can be increased, and the power consumption of the imaging module can also be reduced to a relatively low level.

[0008] One object of the present invention is to provide an imaging module and a method for setting the PIN pins of its connector. By defining different pins of the connector, the connector can be made to be compatible with multiple focusing methods of the imaging module, thereby realizing the normalization processing of the imaging module.

[0009] To achieve the above object, the technical solution adopted in the present application is: An imaging module, comprising:

[0010] A lens assembly;

[0011] A circuit board, the upper section of the circuit board is attached to the lens assembly so that the lens assembly is electrically connected to the circuit board;

[0012] A connector, the connector is attached to the lower section of the circuit board, the connector is provided with a pin area, the connector is electrically connected to the circuit board and the main board respectively through the pin area, and at least two protocols are used for setting the pin area connected to the lens assembly, so that the connector can be compatible with the lens assembly of different communication methods.

[0013] Preferably, the lens assembly includes a lens body and a photosensitive chip, the lens body is disposed on the photosensitive path of the photosensitive chip, the photosensitive chip is electrically connected to the pin area, and the connector is adapted to maintain the signal conduction between the lens body and the main board.

[0014] Preferably, the lens assembly further includes a driving device, the driving device is connected to the pin area, and the connector is adapted to maintain the signal conduction between the driving device and the main board, so that the driving device drives the lens body to focus.

[0015] Preferably, the pin area includes an actuator communication area, a chip signal connection area, and a circuit pin area. The actuator communication area is connected to the driving device, the chip signal connection area is connected to the photosensitive chip, and the circuit pin area is connected to the circuit board and the main board respectively.

[0016] Preferably, the connector is rectangular, the pin area is divided into two symmetric areas based on the midline, the actuator communication area is located in one area, and the chip signal connection area is located in the other area; the pins in the actuator communication area are used to transmit the focusing signal of the driving device, and the pins in the chip signal connection area are used to transmit the chip communication signal of the photosensitive chip, so that the pins with the same function are located in the same area.

[0017] Preferably, the connector adopts a MIPI serial interface, so that the PIN foot interface in the chip signal connection area adopts both D-PHY communication protocol and C-PHY communication protocol at the same time; meanwhile, the photosensitive chip adopts D-PHY communication protocol or C-PHY communication protocol.

[0018] Preferably, the chip signal connection area includes at least two groups of interfaces adopting D-PHY communication protocol and at least one group of interfaces adopting C-PHY communication protocol.

[0019] Preferably, one group of clock channels and at least one group of data channels are included in at least two groups of D-PHY communication protocol interfaces.

[0020] Preferably, the actuator communication area includes at least two groups of PIN foot interfaces, so that the connector can be compatible with different driving devices.

[0021] Preferably, the driving device is selected from at least one of an AF module and an OIS module.

[0022] Preferably, an extension section is provided at the lower section of the circuit board, and the connector is adhesively mounted on the back of the extension section.

[0023] Preferably, the extension section is a flexible circuit board.

[0024] A method for setting PIN feet of a connector, characterized by comprising the following steps:

[0025] S100: Select ten PIN foot interfaces in the pin area of the connector to form a chip signal connection area;

[0026] S200: Define the PIN foot interfaces selected in S100. Five groups of D interfaces can be obtained with two interfaces as a group, and three groups of C interfaces can be obtained with three interfaces as a group;

[0027] S300: Adopt D-PHY communication protocol for the D interfaces in S200 and C-PHY communication protocol for the C interfaces, so that D-PHY communication protocol and C-PHY communication protocol share PIN foot interfaces.

[0028] Preferably, it further includes the following steps:

[0029] S110: Re - select nine PIN - foot interfaces from the non - chip signal connection area of the connector in S100 as the actuator communication area;

[0030] S210: Group the actuator communication area selected in S110, including the O - group interfaces with five PIN - foot interfaces and the A - group interfaces with four PIN - foot interfaces.

[0031] Preferably, the O - group interfaces are suitable for connecting to the driving device in the OIS module; the A - group interfaces are suitable for connecting to the driving device in the AF module.

[0032] Preferably, the PIN - foot interfaces of the O - group adopt the SPI communication protocol.

[0033] Preferably, the connector includes at least one unconnected PIN - foot interface. Description of the Drawings

[0034] Figure 1 It is a schematic structural diagram of the camera module in the side - view direction of the present invention.

[0035] Figure 2 It is a schematic structural diagram of the camera module in the rear - view direction of the present invention.

[0036] Figure 3 It is a schematic structural diagram of the connector of the present invention.

[0037] Figure 4 It is an overall schematic diagram of the PIN - foot distribution of the connector of the present invention.

[0038] Figure 5 It is a schematic diagram of the PIN - foot distribution when the FF module adopts the D - PHY communication protocol in one embodiment of the present invention.

[0039] Figure 6 It is a schematic diagram of the PIN - foot distribution when the AF module adopts the D - PHY communication protocol in one embodiment of the present invention.

[0040] Figure 7 It is a schematic diagram of the PIN - foot distribution when the OIS module adopts the D - PHY communication protocol in one embodiment of the present invention.

[0041] Figure 8 It is a schematic diagram of the PIN - foot distribution when the FF module adopts the C - PHY communication protocol in one embodiment of the present invention.

[0042] Figure 9 It is a schematic diagram of the PIN - foot distribution when the AF module adopts the C - PHY communication protocol in one embodiment of the present invention.

[0043] Figure 10Schematic diagram of PIN - foot distribution of the OIS module adopting the C - PHY communication protocol in one embodiment of the present invention.

[0044] In the figure: lens assembly 100, lens body 110, photosensitive chip 120, driving device 130, bracket 140, circuit board 200, reinforcing plate 210, extension section 220, connector 300, PIN - foot interface 301, chip signal connection area 310, actuator communication area 320, double - sided tape 4. Detailed implementation manners

[0045] Next, in combination with the detailed implementation manners, the present application will be further described. It should be noted that, on the premise of no conflict, the following described embodiments or technical features can be arbitrarily combined to form new embodiments.

[0046] In the description of the present application, it should be noted that for orientation terms, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the indicated orientation and position relationships are based on the orientation or position relationships shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present application.

[0047] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects and do not necessarily describe a specific order or sequence.

[0048] According to the first aspect of the present application, a camera module is provided, such as Figures 1 to 4As shown, the camera module includes a lens assembly 100, a circuit board 200, and a connector 300. A reinforcing plate 210 is provided on the upper section of the circuit board 200. The lens assembly 100 is adhesively connected to the front surface of the reinforcing plate 210 so that the lens assembly 100 is electrically connected to the circuit board 200. At the same time, a double-sided adhesive 4 is attached to the back surface of the upper section of the circuit board 200, so that the circuit board 200 is attached to the upper end surface of the main board through the double-sided adhesive 4, thereby fixedly mounting the lens assembly 100 on the main board. The connector 300 is attached to the back surface of the lower section of the circuit board 200. The connector 300 is provided with a pin area. The connector 300 is electrically connected to the circuit board 200 and the main board respectively through the pin area, so that the lens assembly 100 communicates with the main board through the connector 300, and at least two protocols are used for setting the pin area connected to the lens assembly 100 at the same time, so that the connector 300 can be compatible with the lens assembly 100 including different communication methods. Thus, when designing the camera module, by integrating multiple communication methods into one, the normalized design of the camera module can be realized, and further the difficulty in designing the camera module can be reduced.

[0049] In some embodiments, as Figure 1 and Figure 2 shown, an extension section 220 is provided on the lower section of the circuit board 200. The extension section 220 is a flexible circuit board. The connector 300 is adhesively mounted on the back surface of the extension section 220. It is more convenient for the connector 300 to be attached through the flexible circuit board, so as to reduce the installation difficulty of the camera module.

[0050] In some embodiments, as Figure 1 shown, the lens assembly 100 includes a lens body 110, a photosensitive chip 120, and a bracket 140. The bracket 140 is adhesively mounted on the front surface of the circuit board 200, so that the lens body 110 is movably mounted at the end of the bracket 140. The photosensitive chip 120 is adhesively mounted at the bottom of the bracket 140, and the lens body 110 is located on the light-sensitive path of the photosensitive chip 120 to focus and enhance the reflected light of the object to be measured and then be received by the photosensitive chip 120. At the same time, the photosensitive chip 120 is electrically connected to the pin area, and the connector 300 is adapted to maintain the signal conduction between the photosensitive chip 120 and the main board, so that the photosensitive chip 120 converts the received optical signal into an electrical signal and sends it to the main board through the connector 300.

[0051] In some embodiments, as Figure 1As shown, the lens assembly 100 further includes a driving device 130. The driving device 130 is installed outside the bracket 140, and the driving device 130 is connected to the lens body 110. At the same time, the driving device 130 is also electrically connected to the pin area. The connector 300 is adapted to maintain signal communication between the driving device 130 and the main board, so that the main board issues a driving signal according to the received optical signal. The driving signal is sent to the driving device 130 through the connector 300, thereby driving the driving device to drive the lens body 110 to focus.

[0052] In some embodiments, as Figure 3 and Figure 4 shown, the connector 300 is rectangular. The pin area includes an actuator communication area 320, a chip signal connection area 310, and a line pin area. The actuator communication area 320 is used to connect to the driving device 130. The chip signal connection area 310 is used to connect to the photosensitive chip 120. The line pin area is used to electrically connect the connector 300 to the main board, so as to supply power for the normal operation of the connector 300 through the main board. The connector 300 divides the pin area into two symmetric areas based on the midline ( Figure 3 the dotted line in the figure). The chip signal connection area 310 is located in one area, and the actuator communication area 320 is located in the other area. The pins of the actuator communication area 320 are used to transmit the focusing signal of the driving device 130, and the pins of the chip signal connection area 310 are used to transmit the chip communication signal of the photosensitive chip 120, so that pins with the same function are located in the same area, thereby separately designing the chip signal connection area 310 and the actuator communication area 320 to ensure that there is no interference between the chip signal connection area 310 and the actuator communication area 320.

[0053] It can be understood that when the driving device 130 starts, its instantaneous current is relatively large. If the chip signal connection area 310 and the actuator communication area 320 are arranged on the same side, it is easy to interfere with the signal transmission of the chip signal connection area 310 when the driving device 130 starts, thereby affecting the shooting quality of the lens assembly 100. Therefore, it is more reasonable to separately design the chip signal connection area 310 and the actuator communication area 320 on both sides of the connector 300.

[0054] In some embodiments, as Figure 4As shown, the actuator communication area 320 includes multiple groups of PIN foot interfaces 301, enabling the connector 300 to be compatible with the driving devices 130 of different driving methods, and further realizing the normalized design of the camera module; the PIN foot interfaces 301 of the chip signal connection area 310 adopt at least the D-PHY communication protocol and the C-PHY communication protocol simultaneously, enabling the connector 300 to adapt to the photosensitive chip 120 adopting the D-PHY communication protocol or the C-PHY communication protocol, so as to ensure that the connector 300 can achieve the general design of signal communication with the photosensitive chip 120.

[0055] Among them, as Figure 3 shown, the connector 300 can adopt a common serial communication connector. The specific model of the connector 300 is BK13C06-32DP / 2-0.35V(865), which has thirty-six pin interfaces, including thirty-two PIN foot interfaces 301 symmetrically distributed on the long sides of both sides of the connector 300 and four power pin interfaces symmetrically distributed on the short sides of both sides of the connector 300. The thirty-two PIN foot interfaces 301 are specifically pins 1 to 32, and the four power pin interfaces are specifically two pins G1 and two pins G2.

[0056] It can be understood that the PIN foot interfaces 301 on the long sides of both sides of the connector 300 can conduct a maximum current of 300 mA. The current of the digital kernel power supply of the existing camera module generally exceeds 600 mA, and some can even reach 1 A. At the same time, during the movement of the driving device 130, the maximum current may also reach 1 A. Therefore, if the power pin interfaces of the connector 300 adopt the PIN foot interfaces 301 on the long sides of both sides, more PIN foot interfaces 301 need to be occupied, which will lead to the power pins occupying a larger space and making the required size of the connector 300 longer; while the connector 300 of the model BK13C06-32DP / 2-0.35V(865) adopted in this application has the characteristics of good conductivity and large current-carrying capacity for the fixed pads. A total of four power pin interfaces for connecting the power supply can be respectively set on the short sides of both sides to meet the design requirements, so that the technical solution of this application is preferably applicable to the 48-megapixel high-pixel large-current module.

[0057] Among them, the driving device 130 can be selected from an AF module or an OIS module. It can be understood that common camera modules can be divided into an AF module, an OIS module, and an FF module according to different focusing methods. Among them, the AF module and the OIS module have an autofocus function, and the FF module is a fixed-focus module.

[0058] It can be understood that both the CPHY and DPHY communication protocols are camera-based interfaces in MIPI. Among them, the D-PHY communication protocol interface belongs to the current-driven type and has a separate synchronous clock for synchronization. The receiving end samples data based on the clock. The C-PHY communication protocol interface belongs to the voltage-driven type and does not have a synchronous clock. Therefore, when the CPHY receives data, the clock recovery needs to be embedded in the data, and then the clock is used for data acquisition. The purpose of both communication protocol interfaces is to increase the bandwidth.

[0059] The difference between the D-PHY communication protocol interface and the C-PHY communication protocol interface lies in the different physical layer structures. From the circuit perspective, the C-PHY communication protocol interface is a three-wire system, and the amount of data to be transmitted is also larger. The D-PHY communication protocol interface mostly communicates in groups of two wires. Therefore, the signal transmission speed of the C-PHY communication protocol interface is also faster than that of the D-PHY communication protocol interface. However, both the D-PHY communication protocol interface and the C-PHY communication protocol interface are widely used in the camera field.

[0060] In some embodiments, the chip signal connection area 310 includes at least two groups of interfaces using the D-PHY communication protocol. One group of interfaces is used for the clock channel of the D-PHY communication protocol, and the other groups of interfaces are used for the data channels of the D-PHY communication protocol. The chip signal connection area 310 also includes at least one group of interfaces using the C-PHY communication protocol, and the C-PHY communication protocol and the D-PHY communication protocol share the interfaces.

[0061] Among them, in order to ensure the transmission speed of the camera module, the interfaces of the D-PHY communication protocol in this application are preferably five groups, and the interfaces of the C-PHY communication protocol are preferably three groups. Among the five groups of interfaces of the D-PHY communication protocol, there is one group of clock channel interfaces and four groups of data channel interfaces.

[0062] Among them, in order to further implement the normalized design of the camera module, the actuator communication area 320 of this application includes at least two groups of the PIN foot interfaces 301. One group of the PIN foot interfaces is used to connect the driving device 130 in the OIS module, and the other group of the PIN foot interfaces is used to connect the driving device 130 in the AF module. Since the FF module is a fixed-focus module, when the camera module is an FF module, only the power supply and communication interfaces required by the FF module need to be selected from the PIN feet in the non-actuator communication area 320 to achieve the installation of the FF module.

[0063] According to the second aspect of the present application, as Figures 4 to 10 shown, a method for setting the PIN feet of a connector is provided, including the following steps:

[0064] S100: Among the thirty-two pin interfaces 301 of the connector 300, select ten PIN foot interfaces 301 to form a chip signal connection area 310;

[0065] S200: Define the PIN foot interfaces selected in S100. These ten PIN foot interfaces 301 can be grouped into five groups of D interfaces with every two interfaces as a group, and at the same time, they can be grouped into three groups of C interfaces with every three interfaces as a group;

[0066] S300: Apply the D-PHY communication protocol to the D interfaces in S200 and the C-PHY communication protocol to the C interfaces, so that the D-PHY communication protocol and the C-PHY communication protocol share the PIN foot interfaces, so that when the lens assembly 100 is designed and installed, it can be compatible with the photosensitive chip 120 using the D-PHY communication protocol or the C-PHY communication protocol at the same time, thereby reducing the design and installation difficulty of the lens assembly 100.

[0067] In some embodiments, as Figure 4 shown, the following steps are further included:

[0068] S110: Among the PIN foot interfaces 301 of the connector 300 excluding the chip signal connection area 310 in S100, select at least nine PIN foot interfaces 301 again to obtain an actuator communication area 320;

[0069] S210: Group the actuator communication area 320 selected in S110 to obtain an O group interface including five PIN foot interfaces and an A group interface including four PIN foot interfaces; the O group interface is used to connect the driving device 130 in the OIS module, and the A group interface is used to connect the driving device 130 in the AF module, so that the actuator communication area 320 can be compatible with the focusing methods of the OIS module and the AF module at the same time, and further realize the normalized design of the lens assembly 100, so as to reduce the installation difficulty of the lens assembly 100.

[0070] Among them, the O group interface used to connect to the OIS module adopts the SPI communication protocol. The SPI protocol is also a commonly used communication protocol, which represents a high-speed synchronous serial port. It usually has a master device and one or more slave devices, and at least three interfaces are required. Compared with the communication protocols of other traditional OIS module interfaces, the SPI communication protocol interface only needs to occupy fewer PIN foot interfaces 301 for control and data transmission, greatly saving the required number of PIN foot interfaces 301, and at the same time saving space for the PCB in the module layout.

[0071] In some embodiments, as Figure 3 、 Figures 5 to 10As shown in the figure, the chip signal connection area 310 is located within the left area of the connector 300. The left area of the connector 300 includes pins 1 to 16 and two power pins G1. Select the PIN foot interfaces 301 of pins 4 to 12 and pin 14 to form the chip signal connection area 310. Specific symbol markings are made on the chip signal connection area 310. Among them, pins 4 / pin 6, pins 5 / pin 7, pins 8 / pin 10, pins 9 / pin 11, and pins 12 / pin 14 correspond to form five groups of D interfaces for defining the D-PHY communication protocol. Each group of D-PHY communication protocol interfaces is respectively marked as D3P / D3N, D2P / D2N, D1P / D1N, D4P / D4N, and CKP / CKN. Among them, the interface marked as CKP / CKN is the clock channel interface of the D-PHY communication protocol, and the remaining marked interfaces are the data channel interfaces of the D-PHY communication protocol; at the same time, pins 4 / pins 6 / pins 8, pins 5 / pins 7 / pins 9, and pins 10 / pins 12 / pins 14 correspond to form three groups of C interfaces for defining the C-PHY communication protocol. Each group of C-PHY communication protocol interfaces is respectively marked as 0A / 0B / 0C, 2A / 2B / 2C, and 1A / 1B / 1C. At this time, pin 11 has no connection in the C-PHY communication protocol and is marked as NC; thus, when both the D-PHY communication protocol and the C-PHY communication protocol are defined in the chip signal connection area 310, as Figure 4 shown, the markings of pins 4 to 12 and pin 14 are respectively D3P0A, D2P2A, D3N0B, D2N2B, D1P0C, D4P2C, D1N1A, D4N / NC, CKP1B, and CKN1C. By performing a compatibility setting of the D-PHY communication protocol and the C-PHY communication protocol on the PIN foot interfaces 301 of the chip signal connection area 310, the chip signal connection area 310 is changed from a dedicated design to a general design; at the same time, the line pins in the same group in each communication protocol are arranged adjacent to each other, making the pin distribution of each communication protocol concise and reasonable and realizing a general design on the line. Thus, when designing a camera module, the design difficulty of the camera module can be effectively reduced.

[0072] In some embodiments, such as Figure 3 、 Figures 5 to 10As shown, the actuator communication area 320 is located in the right area of the connector 300. The right area of the connector 300 includes pins 17 to 32 and two power pins G2. Select pins 24, 26, 28 to 32 and the two pins G2 to form the actuator communication area 320. Specific symbol markings are made for the actuator communication area 320 of the connector 300. Among them, pins 24, 26, 28 to 30 form the O-group interface for connecting the driving device 130 in the OIS module. Since the O-group interface uses the SPI communication protocol, each pin of the O-group interface is sequentially marked as SPI_CS, SPI_CLK, SPI_SDA, DRV_GND, and DRV_VDD. Here, SPI represents the protocol type, CS represents chip select, CLK represents serial communication clock, SDA represents serial communication data, DRV represents drive pulse, GND represents integrated circuit ground, and VDD represents power supply voltage.

[0073] Among them, pins 31, 32 and the two pins G2 form the A-group interface for connecting the driving device 130 in the AF module. The driving device 130 in the AF module commonly uses a voice coil motor. The voice coil motor can convert electrical energy into mechanical energy to drive the lens body 110 to perform linear or limited swing angle movement, so as to realize the focusing of the lens assembly 100. Therefore, the A-group interface includes two pairs of identical interfaces to respectively realize the linear and swing angle movements of the AF module; that is, each pin of the A-group interface is sequentially marked as VCMGND, VCMGND, VCMVDD, and VCMVDD. Here, VCMGND represents power supply ground, and VCMVDD represents power supply voltage.

[0074] Among them, since the FF module is a fixed focal length module, when the FF module is installed, the chip signal connection area 310 of the connector 300 can meet the communication requirements of the FF module. Therefore, only the power pins need to be selected from the pins of the connector 300 after removing the chip signal connection area 310 and the actuator communication area 320.

[0075] Among them, since the focusing method of the lens module 100 has been determined during design, when the camera module adopts an OIS module, the A-group interface has no connection; when the camera module adopts an AF module, the O-group interface has no connection; when the camera module adopts an FF module, both the A-group interface and the O-group interface have no connection. Therefore, pins 24, 26, 28 to 32 and two pins G2 in the entire actuator communication area 320 are comprehensively marked as NC / SPI_CS, NC / SPI_CLK, NC / SPI_SDA, DGND / DRV_GND, NC / DRV_VDD, VCMGND, VCMGND, VCMVDD, and VCMVDD in sequence. By uniformly and standardly defining and marking the actuator communication area 320, it can be ensured that when the lens module 100 is installed, the focusing type of the PIN foot interface can be quickly and accurately identified, so as to realize the connection of the driving device 130 in the lens module 100, reducing the installation difficulty of the lens module 100 and facilitating the subsequent maintenance of the lens module 100.

[0076] In some embodiments, the chip signal connection area 310 can also be located in the right region of the connector 300, and at the same time, the actuator communication area 320 is located in the left region of the connector 300. In this case, the symbol markings of the chip signal connection area 310 and the actuator communication area 320 remain unchanged, and only the positions of the pins need to be swapped.

[0077] In some embodiments, as Figures 4 to 10 shown, other pins of the connector 300 are marked and defined. Among them, pin 1 is used to connect the digital I / O power supply and is marked as DOVDD; pins 2, 3, 13, and 16 are used to isolate the MIPI signal from other power supplies and signals, so they are grounded in the digital circuit and marked as DGND; pin 15 is used to connect the clock circuit and is marked as MCLK; pins 17 and 13 are used to isolate and protect the clock MCLK to prevent crosstalk between the clock MCLK and the MIPI signal, so pin 17 also needs to be grounded and is marked as DGND; pin 21 is used to supply power to the photosensitive chip 120, and it can be selected to be unconnected or connected according to the type of the photosensitive chip 120, and is marked as NC / AVDD1.8V; pins 23 and 25 are both used to supply power to the lens module 100. Since the maximum instantaneous current of the high-pixel module is above 400 mA, in order to ensure the safety of the pins of the connector 300, two pins are required to supply power to the high-pixel module, so pins 23 and 25 are both marked as AVDD2.8V.

[0078] It can be understood that there are a total of six module situations for the camera module of the present application according to different communication interface protocols and different focusing methods, namely, the OIS module, AF module, and FF module using the D-PHY communication protocol, and the OIS module, AF module, and FF module using the C-PHY communication protocol. The specific definition of the PIN foot interface 301 of the connector 300 connected to each module is as follows Figures 5 to 10 As shown, it can be seen from the figure that there are unconnected PIN foot interfaces 301 in the connector 300 corresponding to each module, that is, the pins marked as NC.

[0079] The above describes the basic principle, main features, and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present application. Without departing from the spirit and scope of the present application, the present application will have various changes and improvements, and these changes and improvements all fall within the scope of the present application claimed. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. An imaging module, characterized in that, Comprising: A lens assembly; A circuit board, the upper section of the circuit board being attached to the lens assembly so that An electrical connection is established between the lens assembly and the circuit board; And A connector, the connector being attached to the lower section of the circuit board, the connector having a pin area, and the connector being electrically connected to the circuit board and the main board respectively through the pin area, and at least two protocols being used for the pin area connected to the lens assembly so that the connector can be compatible with lens assemblies of different communication methods; The lens assembly includes a lens body and a photosensitive chip, the lens body being disposed on the photosensitive path of the photosensitive chip, the photosensitive chip being electrically connected to the pin area, and the connector being adapted to maintain signal conduction between the lens body and the main board; The lens assembly further includes a driving device, the driving device being connected to the pin area, and the connector being adapted to maintain signal conduction between the driving device and the main board so that the driving device drives the lens body to focus; The pin area includes an actuator communication area and a chip signal connection area, the actuator communication area being connected to the driving device, and the chip signal connection area being connected to the photosensitive chip; The connector is rectangular, the pin area is divided into two symmetric areas based on the midline, the actuator communication area is located in one area, and the chip signal connection area is located in the other area; the pins of the actuator communication area are used to transmit the focusing signal of the driving device, and the pins of the chip signal connection area are used to transmit the chip communication signal of the photosensitive chip so that pins of the same function are located in the same area.

2. The camera module according to claim 1, wherein The connector adopts a MIPI serial interface so that the PIN foot interface of the chip signal connection area simultaneously adopts D-PHY communication protocol and C-PHY communication protocol; meanwhile, the photosensitive chip adopts D-PHY communication protocol or C-PHY communication protocol.

3. The camera module according to claim 2, wherein The chip signal connection area includes at least two groups of interfaces adopting D-PHY communication protocol and at least one group of interfaces adopting C-PHY communication protocol.

4. The imaging module according to claim 3, wherein Among the at least two groups of D-PHY communication protocol interfaces, there is one group of clock channels and at least one group of data channels.

5. The camera module according to claim 2, wherein The actuator communication area includes at least two groups of PIN foot interfaces so that the connector can be compatible with different driving devices.

6. The camera module according to claim 5, wherein The driving device is selected from at least one of an AF module and an OIS module.

7. The camera module according to any one of claims 1-6, characterized in that, The lower section of the circuit board is provided with an extension section, and the connector is attached and installed on the back of the extension section.

8. The imaging module according to claim 7, wherein The extension section is a flexible circuit board.

9. A method for setting PIN pins of a connector, applied to the camera module according to any one of claims 1-8, characterized in that, Including the following steps: S100: Select ten PIN foot interfaces in the pin area of the connector to form a chip signal connection area; S200: Define the PIN foot interfaces selected in S100, and five groups of D interfaces can be obtained with two interfaces in a group, and three groups of C interfaces can be obtained with three interfaces in a group; S300: Adopt D-PHY communication protocol for the D interfaces in S200 and C-PHY communication protocol for the C interfaces so that D-PHY communication protocol and C-PHY communication protocol share the PIN foot interfaces.

10. The method for setting the PIN of the connector according to claim 9, wherein, It further includes the following steps: S110: Select nine PIN foot interfaces again from the non-chip signal connection area of the connector in S100 as the actuator communication area; S210: Group the actuator communication area selected in S110, including the O group interfaces with five PIN foot interfaces and the A group interfaces with four PIN foot interfaces.

11. The method for setting PIN pins of the connector according to claim 10, characterized in that, The O group is suitable for connecting to the driving device in the OIS module; the A group is suitable for connecting to the driving device in the AF module.

12. The method for setting the PIN pins of the connector according to claim 11, wherein, The PIN foot interfaces of the O group adopt the SPI communication protocol.

13. The method for setting the PIN of the connector according to claim 10, wherein, The connector includes at least one unconnected PIN foot interface.

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