A rigid-flex board uncovering process processing method, processing equipment and rigid-flex board

Abstract

This invention discloses a method, equipment, and rigid-flex plate for removing and unfolding a rigid-flex plate. The rigid-flex plate to be unfolded includes a flexible core layer and a rigid layer covering the flexible core layer. The rigid-flex plate to be unfolded includes a rigid region and a flexible region, the flexible region including a scrap area and a retention area adjacent to the scrap area. The rigid-flex plate unfolding and unfolding process includes: forming a first-depth groove at the boundary between the retention area and the rigid region; forming a second-depth groove at the boundary between the scrap area and the retention area; forming a cutout at the boundary between the scrap area and the rigid region, and at the boundary of the scrap area away from the retention area; and separating the scrap area from the plate to be unfolded together. This invention separates the plate to be unfolded by peeling off the scrap area. This achieves the effect of opening the plate without the separation tool contacting the flexible core layer. It protects the flexible core layer from scratches, improves yield, reduces production losses, and lowers costs.

Description

Technical Field

[0001] The present invention relates to rigid-flex plate uncovering technology, and more particularly to a rigid-flex plate uncovering process, processing equipment, and rigid-flex plate. Background Technology

[0002] As electronic products continue to develop towards multi-functionality, miniaturization, lightweighting, and high performance, rigid-flex boards have experienced rapid development due to their convenient three-dimensional assembly characteristics.

[0003] However, the weak points in the quality of rigid-flex PCBs are concentrated in the rigid-flex interface area, especially in the conventional capping process, which combines mechanical capping with laser cutting. Mechanical capping typically involves manually opening the cap to a controlled depth, using a cutting tool to pry open the cover plate and the flexible core board. This not only carries the risk of accidentally damaging the flexible circuitry with the cutting tool, but also makes it difficult to detect during electrical testing. Open circuit problems can only be detected after the customer has installed the PCB and performed a reflow process, resulting in significant losses. Summary of the Invention

[0004] This invention provides a rigid-flex plate uncovering process, processing equipment, and rigid-flex plate to avoid scratching the flexible core layer, improve yield, reduce production losses, and lower costs.

[0005] In a first aspect, embodiments of the present invention provide a method for removing a rigid-flex plate, wherein the rigid-flex plate to be removed includes a flexible core layer and a rigid layer covering the flexible core layer. The rigid-flex plate to be removed includes at least two rigid regions and a flexible region located between the rigid regions. The flexible region includes a scrap area and a retention area adjacent to the scrap area. Both the retention area and the scrap area are adjacent to at least two of the rigid regions. The rigid layer of the retention area forms the plate to be removed. The method for removing the rigid-flex plate includes:

[0006] In the rigid flexible plate to be uncovered, a first depth groove is formed at the junction of the retention area and the rigid area;

[0007] Hollows are formed at the junction of the waste area and the rigid area, and at the boundary of the waste area away from the retention area;

[0008] When the rigid flexible plate to be uncovered has one side with the cover to be uncovered, a second depth groove is formed at the junction of the waste area and the retention area; when both sides of the rigid flexible plate to be uncovered have the cover to be uncovered, the cover to be uncovered and the waste area are connected in a one-to-one correspondence.

[0009] Separate the waste area from the cover plate to be removed;

[0010] The depth of the first deep groove is less than the thickness of the rigid layer, and the depth of the second deep groove is greater than the sum of the thickness of the flexible core layer and the thickness of the rigid layer.

[0011] Optionally, the cover plate to be opened is provided on both sides of the rigid flexible plate, and the first depth groove and the second depth groove are formed on both sides of the rigid flexible plate to be opened.

[0012] Optionally, in the reserved area, the rigid layer includes a stacked rigid core layer, a prepreg layer, and a gasket layer, wherein the first depth groove penetrates the rigid core layer and the prepreg layer, and partially penetrates the gasket layer.

[0013] Optionally, in the reserved area, the rigid layer includes a stacked rigid core layer, a prepreg layer, and a gasket layer, and the second depth groove penetrates at least one side of the rigid core layer, at least one side of the prepreg layer, at least one side of the gasket layer, and the flexible core layer.

[0014] Optionally, separating the waste area from the cover plate to be removed together includes inserting the tip of a pen into the second depth groove and rotating the handle of the pen toward the waste area until the cover plate to be removed is peeled off.

[0015] Optionally, forming the first depth groove includes milling the first depth groove at the junction of the reserved area and the rigid area using a milling cutter.

[0016] Optionally, forming the second depth groove includes milling the second depth groove at the boundary between the waste area and the retention area using a milling cutter.

[0017] Optionally, forming a cutout at the boundary between the waste area and the rigid area, and at the boundary of the waste area away from the retention area, includes milling through the boundary between the waste area and the rigid area, and at the boundary of the waste area away from the retention area.

[0018] Secondly, embodiments of the present invention also provide a rigid-flex plate uncovering process processing equipment, the processing equipment comprising:

[0019] One or more processors;

[0020] Storage device for storing one or more programs.

[0021] When the one or more programs are executed by the one or more processors, the one or more processors implement any of the above-described rigid-flex plate uncovering process methods.

[0022] Thirdly, embodiments of the present invention also provide a rigid-flex plate, which is manufactured by any of the above-described rigid-flex plate uncovering processes.

[0023] The rigid-flex plate peeling process in this embodiment of the invention includes: forming a first-depth groove at the boundary between the retaining area and the rigid area on the side of the rigid-flex plate to be peeled, where the plate is to be peeled; forming a hollow at the boundary between the scrap area and the rigid area, and at the boundary of the scrap area away from the retaining area; forming a second-depth groove at the boundary between the scrap area and the retaining area on the side of the rigid-flex plate to be peeled, where the plate is to be peeled; when both sides of the rigid-flex plate to be peeled have plates to be peeled, the plates to be peeled and the scrap areas are connected one-to-one; separating the scrap areas from the plates to be peeled together; wherein the depth of the first-depth groove is less than the thickness of the rigid layer, and the depth of the second-depth groove is greater than the sum of the thickness of the flexible core layer and the thickness of the rigid layer. By forming the first-depth groove, the second-depth groove, and the hollow, a component formed by connecting the plate to be peeled and the scrap area is created. By peeling off the scrap area, the plate to be peeled can be separated together. This achieves the effect of opening the plate to be peeled without the separation tool contacting the flexible core layer. It protects the flexible core board from scratches, improves yield, reduces production losses, and lowers costs. Attached Figure Description

[0024] Figure 1 This is a schematic cross-sectional view of a rigid flexible plate to be uncovered, provided in an embodiment of the present invention.

[0025] Figure 2 This is a top view of a rigid-flexible plate to be uncovered, provided in an embodiment of the present invention.

[0026] Figure 3 This is a flowchart illustrating the process steps of a rigid-flexible plate uncovering process provided in an embodiment of the present invention. Detailed Implementation

[0027] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0028] This invention provides a method for processing rigid-flex plate cover removal. Figure 1 This is a schematic cross-sectional view of a rigid flexible plate to be uncovered, provided in an embodiment of the present invention. Figure 2 This is a top view schematic diagram of a rigid-flexible plate to be uncovered according to an embodiment of the present invention, with reference to... Figure 1 and Figure 2The rigid-flex plate to be uncovered includes a flexible core layer 10 and a rigid layer 20 covering the flexible core layer 10. The rigid-flex plate to be uncovered includes at least two rigid regions 1 and a flexible region 2 located between the rigid regions 1. The flexible region 2 includes a waste area 21 and a retention area 22 adjacent to the waste area 21. Both the retention area 22 and the waste area 21 are adjacent to at least two rigid regions 1. The rigid layer 20 of the retention area 22 forms the cover plate 221 to be uncovered.

[0029] The rigid-flex plate to be uncovered can be a composite plate made of a flexible core board layer 10 and a rigid layer 20. The rigid layer 20 can be provided on one side of the flexible core board layer 10, or on both sides. From the perspective of area division, the rigid-flex plate can be divided into two rigid areas 1 and a flexible area 2 for bending. Before the uncovering process, both rigid areas 1 and flexible areas 2 have the same layered structure. After uncovering, the flexible areas 2 can be bent to allow the rigid areas 1 to be positioned opposite each other, achieving space saving. The flexible area 2 includes a waste area 21 and a retention area 22 adjacent to the waste area 21. The retention area 22 is equipped with circuitry for connecting the two rigid areas 1. The waste area 21 needs to be removed from the rigid-flex plate to be uncovered.

[0030] Figure 3 This is a flowchart illustrating the process steps of a rigid-flexible plate uncovering process according to an embodiment of the present invention. Figure 3 The processing methods for rigid-flex plate cover removal include:

[0031] S1: On the side of the rigid flexible plate to be uncovered with the cover plate 221, a first depth groove is formed at the junction of the retention area 22 and the rigid area 1.

[0032] By forming a first-depth groove, the bonding force between the retaining area 22 and the rigid layer 20 of the rigid area 1 can be reduced, preparing for subsequent unpacking. The depth of the first-depth groove is less than the thickness of the rigid layer 20, so the flexible core board layer 10 deep inside will not be damaged and open circuits will not be caused when forming the first-depth groove.

[0033] S2: A hollow is formed at the junction of the waste area 21 and the rigid area 1, and at the boundary of the waste area 21 away from the retention area 22.

[0034] By hollowing out the boundary between the waste area 21 and the retention area 22, the waste area 21 can be easily separated from the rigid flexible plate to be uncovered.

[0035] S3: On the side of the rigid flexible plate to be uncovered with the cover plate 221, a second depth groove 3 is formed at the junction of the waste area 21 and the retention area 22; when both sides of the rigid flexible plate to be uncovered have the cover plate 221 to be uncovered, the cover plate 221 to be uncovered and the waste area 21 are connected in a one-to-one correspondence.

[0036] By forming a second-depth groove 3, most of the layers in the layered structure of the waste area 21 and the retention area 22 can be separated, leaving only the connection between the cover plate 221 to be removed and the waste area 21. The depth of the second-depth groove 3 is greater than the sum of the thickness of the flexible core board layer 10 and the thickness of the rigid layer 20. This facilitates the removal of the cover plate 221 along with the waste area 21 during subsequent removal. When both sides of the flexible core board layer 10 are covered with the rigid layer 20, that is, when both sides of the rigid flexible plate to be removed are provided with cover plates 221, the rigid flexible plate to be removed has two waste areas 21. After forming the second-depth groove 3, each waste area 21 is connected to one cover plate 221 to be removed, which facilitates the subsequent removal operation.

[0037] S4: Separate the waste area 21 from the cover plate 221 to be removed.

[0038] The waste area 21 can be separated from the cover plate 221 to be removed in any way. For example, the waste area 21 can be peeled off using a pen knife.

[0039] In this embodiment of the invention, a component is formed by connecting the cover plate 221 to be removed and the waste area 21 through the formation of a first-depth groove, a second-depth groove 3, and a hollowed-out section. By peeling off the waste area 21, the cover plate 221 can be separated together. This achieves the effect of opening the cover plate without the separation tool contacting the flexible core board layer 10. This protects the flexible core board from scratches, improves the yield rate, reduces production losses, and lowers costs.

[0040] Optionally, both sides of the rigid flexible plate to be uncovered are provided with a cover plate 221 to be uncovered, and a first depth groove and a second depth groove 3 are formed on both sides of the rigid flexible plate to be uncovered.

[0041] The rigid flexible plate to be uncovered can be a structure with two rigid layers 20 sandwiched in the middle with a flexible core plate layer 10. Both sides of the rigid flexible plate to be uncovered have a cover plate 221 to be uncovered. Therefore, a first depth groove and a second depth groove 3 need to be formed on both sides of the rigid flexible plate to be uncovered to facilitate the subsequent uncovering operation.

[0042] Optionally, in the retention area 22, the rigid layer 20 includes a stacked rigid core layer 201, a prepreg layer 202, and a gasket layer 203, with a first depth groove penetrating the rigid core layer 201 and the prepreg layer 202, and partially penetrating the gasket layer 203.

[0043] To facilitate the separation of the rigid layer 20 within the retention area 22, i.e., the cover plate to be removed, a gasket layer 203 can be added to the rigid layer 20 within and near the retention area 22. Taking advantage of the gasket's easy-to-separate characteristic, the gasket layer 203 is attached to the flexible core board layer 10. The rigid core board layer 201 and the semi-cured sheet layer 202 are attached to the gasket. A first-depth groove penetrates the rigid core board layer 201 and the semi-cured sheet layer 202, and partially penetrates the gasket layer 203. This facilitates tearing apart the connections between the gasket layers 203, completing the removal of the cover.

[0044] Optionally, in the retention area 22, the rigid layer 20 includes a stacked rigid core layer 201, a semi-cured sheet layer 202, and a gasket layer 203, and the second depth groove 3 penetrates at least one side of the rigid core layer 201, at least one side of the semi-cured sheet layer 202, at least one side of the gasket layer 203, and the flexible core layer 10.

[0045] To facilitate the separation of the cover plate to be removed, the connection between the retention area 22 and the waste area 21, except for the connection between the waste area 21 and the cover plate to be removed 221, can be cut off, thereby forming a second depth groove 3.

[0046] Optionally, in the retention area 22, a protective film is attached to the flexible core layer 10, and the gasket layer 203 is attached to the protective film. The protective film is used to protect the exposed flexible core layer 10 from water and oxygen erosion.

[0047] Optionally, the flexible core layer 10 includes a flexible substrate, flexible circuit layers attached to both sides of the flexible substrate, and a cover film located on the side of the flexible circuit layer away from the flexible substrate.

[0048] Optionally, separating the waste area 21 from the cover plate 221 to be removed together includes inserting the tip of a pen into the second depth groove 3 and rotating the handle of the pen toward the waste area 21 until the cover plate 221 to be removed is peeled off.

[0049] One method is to use a pen or knife to insert into the second depth groove 3 and pry off the waste area 21 together with the cover plate 221 to be removed.

[0050] This allows the cover plate 221 to be peeled off without the scalpel contacting the flexible core board layer 10, thus protecting the flexible core board layer 10 from damage.

[0051] Optionally, forming a groove of the first depth includes milling a groove of the first depth at the boundary between the retention area 22 and the rigid area 1 using a milling cutter. Optionally, forming a groove of the second depth 3 includes milling a groove of the second depth 3 at the boundary between the scrap area 21 and the retention area 22 using a milling cutter. Optionally, forming a cutout at the boundary between the scrap area 21 and the rigid area 1, and at the boundary of the scrap area 21 away from the retention area 22 includes milling through the boundary between the scrap area 21 and the rigid area 1, and at the boundary of the scrap area 21 away from the retention area 22. The milling process allows for the formation of grooves with controllable depth. Furthermore, it avoids the problems associated with laser cutting, such as its high production capacity, high cost, and the risk of short circuits due to carbon black at the cutting edges.

[0052] This invention also provides a rigid-flex plate uncovering process processing equipment, the processing equipment including:

[0053] One or more processors;

[0054] Storage device for storing one or more programs.

[0055] When one or more programs are executed by one or more processors, the one or more processors implement any of the rigid-flex plate uncovering process methods described above.

[0056] Since the rigid-flex plate uncovering process equipment in this embodiment of the invention performs any of the rigid-flex plate uncovering process methods described above, it has the beneficial effects of the rigid-flex plate uncovering process method.

[0057] This invention also provides a rigid-flex plate, which is manufactured by any of the rigid-flex plate uncovering processes described above.

[0058] Since the rigid-flex plate in the embodiments of the present invention is made by any of the rigid-flex plate uncovering process methods described above, it has the same beneficial effects as the rigid-flex plate uncovering process methods.

[0059] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A rigid-flex board uncovering process processing method, characterized in that, The rigid-flex plate to be uncovered includes a flexible core plate layer and a rigid layer covering the flexible core plate layer. The rigid-flex plate to be uncovered includes at least two rigid regions and a flexible region located between the rigid regions. The flexible region includes a waste area and a retention area adjacent to the waste area. Both the retention area and the waste area are adjacent to at least two of the rigid regions. The rigid layer of the retention area forms the cover plate to be uncovered. The rigid-flex plate uncovering process includes: In the rigid flexible plate to be uncovered, a first depth groove is formed at the junction of the retention area and the rigid area; Hollows are formed at the junction of the waste area and the rigid area, and at the boundary of the waste area away from the retention area; When the rigid flexible plate to be uncovered has one side with the cover to be uncovered, a second depth groove is formed at the junction of the waste area and the retention area; when both sides of the rigid flexible plate to be uncovered have the cover to be uncovered, the cover to be uncovered and the waste area are connected in a one-to-one correspondence. Separate the waste area from the cover plate to be removed; The depth of the first deep groove is less than the thickness of the rigid layer, and the depth of the second deep groove is greater than the sum of the thickness of the flexible core layer and the thickness of the rigid layer.

2. The rigid-flex board uncovering process processing method according to claim 1, wherein, Both sides of the rigid flexible plate to be opened are provided with the cover plate to be opened, and both sides of the rigid flexible plate to be opened have the first depth groove and the second depth groove.

3. The rigid-flex board uncovering process processing method according to claim 1, wherein, In the reserved area, the rigid layer includes a stacked rigid core layer, a prepreg layer, and a gasket layer, and the first depth groove penetrates the rigid core layer and the prepreg layer, and partially penetrates the gasket layer.

4. The rigid-flex board uncovering process processing method according to claim 1, wherein, In the reserved area, the rigid layer includes a stacked rigid core layer, a prepreg layer, and a gasket layer, and the second depth groove penetrates at least one side of the rigid core layer, at least one side of the prepreg layer, at least one side of the gasket layer, and the flexible core layer.

5. The rigid-flex board uncovering process processing method according to claim 1, wherein, The step of separating the waste area from the cover plate to be removed includes inserting the tip of a pen into the second depth groove and rotating the handle of the pen toward the waste area until the cover plate to be removed is peeled off.

6. The rigid-flex board uncovering process processing method according to claim 1, wherein, Forming the first depth groove includes milling the first depth groove at the junction of the reserved area and the rigid area using a milling cutter.

7. The rigid-flex board uncovering process processing method according to claim 1, wherein, Forming the second depth groove includes milling the second depth groove at the boundary between the waste area and the retention area using a milling cutter.

8. The rigid-flex board uncovering process processing method according to claim 1, wherein, The process of forming a cutout at the boundary between the waste area and the rigid area, and at the boundary of the waste area away from the retention area, includes milling through the boundary between the waste area and the rigid area, and at the boundary of the waste area away from the retention area.

9. A rigid-flex board uncovering process processing apparatus characterized by, The processing equipment includes: One or more processors; Storage device for storing one or more programs. When the one or more programs are executed by the one or more processors, the one or more processors implement the rigid-flex plate uncovering process as described in any one of claims 1-8.

10. A rigid-flex board, characterized by, It is manufactured by the rigid-flex plate uncovering process described in any one of claims 1-8.

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