Heat generating structure and electronic atomization device

Abstract

The application relates to a heating structure and an electronic atomization device. The heating structure comprises a heating element, a first electrode assembly and a second electrode assembly. An axial end of the heating element is provided with a hollow cavity. One of the first electrode assembly and the second electrode assembly at least partially extends into the hollow cavity and is connected with the heating element, and the other is arranged at an end of the heating element away from the hollow cavity in the axial direction. The heating element is an electric conductor, and the heating element can electrically conduct the first electrode assembly and the second electrode assembly. In the above-mentioned heating structure, the heating element itself can heat after being electrified, so as to heat the aerosol generating substrate sleeved on the heating element. Unlike the traditional heating element, a groove penetrating in the thickness direction is not needed to form a U-shaped current path. The mechanical strength of the heating element is good, and the heating element is not easy to break. In addition, the hollow cavity is arranged at the axial end of the heating element, so as to reduce the power consumption of the heating element.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of atomization, in particular to a heating structure and an electronic atomization device. BACKGROUND

[0002] An aerosol is a colloidal dispersion system formed by dispersing and suspending small particles of solid or liquid in a gaseous medium. Since the aerosol can be absorbed by the human body through the respiratory system, it provides a new type of alternative absorption method for users. For example, an atomization device that can bake and heat a herbal or paste aerosol generating substrate to generate an aerosol is applied in different fields to deliver an aerosol for inhalation to users, replacing conventional product forms and absorption methods.

[0003] Generally, an aerosol generating substrate is atomized into an aerosol by a heating element in an electronic atomization device. In the related art, an integrated heating element can generate heat by itself to heat the atomized aerosol, and a groove is formed on the heating element to form an electric current that makes the heating element heat. However, the groove directly formed on the heating element is disposed in the thickness direction of the heating element, so that the mechanical strength of the heating element is low, and the heating element is prone to breakage. SUMMARY

[0004] Therefore, it is necessary to provide a heating structure and an electronic atomization device to solve the problem of low mechanical strength of the heating element.

[0005] A heating structure includes a heating element, a first electrode assembly, and a second electrode assembly. An axial end of the heating element is provided with a hollow cavity.

[0006] One of the first electrode assembly and the second electrode assembly at least partially extends into the hollow cavity and is connected to the heating element, and the other is arranged at an end of the heating element away from the hollow cavity in the axial direction.

[0007] The heating element is an electrically conductive body, and the heating element can electrically connect the first electrode assembly and the second electrode assembly.

[0008] In the heating structure, the heating element itself serves as an electrically conductive element that can generate heat after being electrified to heat the aerosol generating substrate sleeved on the heating element. One of the first electrode assembly and the second electrode assembly is connected to the hollow cavity at one axial end of the heating element, and the other is connected to the other axial end of the heating element. In this way, the first electrode assembly and the second electrode assembly are arranged at opposite axial ends of the heating element, so that when the first electrode assembly and the second electrode assembly are electrified in the circuit, an electric current can flow from one of the first electrode assembly and the second electrode assembly to the other along the axial direction of the heating element. In this way, by arranging the first electrode assembly and the second electrode assembly at the two axial ends of the heating element, a linear current path is formed, and there is no need to open a groove through the thickness direction of the heating element to form a U-shaped current path, so that the mechanical strength of the heating element is better and it is not easy to break.

[0009] In addition, the hollow cavity is opened at one axial end of the heating element to reduce the power consumption of the heating element. In addition, the hollow cavity is opened at one axial end of the heating element, which can significantly reduce the heat capacity of the heating part, thereby significantly improving the heating rate, reducing the waiting time, and improving the experience of consumers.

[0010] In one of the embodiments, the heating element includes an open end and a closed end arranged opposite along the axial direction of the heating element, and the open end has an opening communicating with the hollow cavity.

[0011] At least part of one of the first electrode assembly and the second electrode assembly is arranged on the outer peripheral surface of the closed end, and at least part of the other is arranged in the hollow cavity.

[0012] In one of the embodiments, the first electrode assembly includes a first electrode layer, and the second electrode assembly includes a second electrode. The first electrode layer is at least partially arranged on the outer peripheral surface of the closed end, and the second electrode is at least partially arranged in the hollow cavity and connected to the inner wall of the hollow cavity.

[0013] In one of the embodiments, the second electrode is connected to the bottom wall of the hollow cavity.

[0014] In one of the embodiments, the second electrode is arranged at the open end, the first electrode layer includes a first segment and a second segment, the first segment is arranged at the closed end, and the second segment is connected to the first segment and extends to the side where the open end is located.

[0015] In one of the embodiments, the heating structure further includes an insulating layer arranged between the second segment and the heating element.

[0016] In one of the embodiments, the first electrode assembly further includes a first electrode arranged at the open end and connected to the second segment.

[0017] In one embodiment, the heating element is configured as a rod-shaped structure, and the closed end is configured as a sharp structure.

[0018] In one embodiment, the heating structure further includes a mounting member disposed on the outer periphery of the heating element at a position corresponding to the hollow cavity.

[0019] In one embodiment, the heating element comprises ceramic material and metal material, wherein the volume percentage of the metal material is 30%-65% and the volume percentage of the ceramic material is 35%-75%.

[0020] In one embodiment, the metallic material includes at least one selected from nickel, iron, cobalt, copper, titanium, aluminum, and stainless steel; and / or

[0021] The ceramic material includes at least one of alumina, zirconium oxide, silicon oxide, yttrium oxide, lanthanum oxide, cerium oxide, magnesium oxide, manganese oxide, and titanium oxide.

[0022] In one embodiment, the resistivity of the heating element is in the range of 4 × 10⁻⁶. -6 Ω·m-8×10 -4 Ω·m.

[0023] In one embodiment, the temperature coefficient of resistance of the heating element is greater than 600 ppm / ℃.

[0024] An electronic atomizing device includes the aforementioned heating structure. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the heating structure in one embodiment of this application.

[0026] Explanation of reference numerals in the attached drawings: 100, heating structure; 10, heating element; 12, open end; 14, closed end; 20, hollow cavity; 21, opening; 30, first electrode assembly; 32, first electrode layer; 321, first segment; 323, second segment; 34, first electrode; 50, second electrode assembly; 52, second electrode; 70, insulating layer. Detailed Implementation

[0027] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0028] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0031] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0032] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0033] See Figure 1 In one embodiment of this application, a heating structure 100 is provided, including a heating element 10, a first electrode assembly 30, and a second electrode assembly 50. A hollow cavity 20 is formed at one axial end of the heating element 10. At least part of the first electrode assembly 30 and the second electrode assembly 50 extends into the hollow cavity 20 and is electrically connected to the heating element 10. The other is located at the end of the heating element 10 away from the hollow cavity 20 in its own axial direction. The heating element 10 is a conductive element and can electrically conduct the first electrode assembly 30 and the second electrode assembly 50 to form a current flowing from one of the first electrode assembly 30 and the second electrode assembly 50 to the other in the heating element 10 along its own axial direction.

[0034] In this way, the heating element 10 itself acts as a conductive element, generating heat when energized to heat and atomize the aerosol matrix mounted on it. Furthermore, one of the first electrode assembly 30 and the second electrode assembly 50 extends into the hollow cavity 20 at one axial end of the heating element 10 and connects to it, while the other is connected to the other axial end of the heating element 10. Thus, with the first electrode assembly 30 and the second electrode assembly 50 positioned at opposite ends of the heating element 10's axial direction, when the first electrode assembly 30 and the second electrode assembly 50 are connected to the circuit and energized, a current can be formed on the heating element 10, flowing from one of the first electrode assembly 30 to the other along the axial direction. By positioning the first electrode assembly 30 and the second electrode assembly 50 at opposite ends of the heating element 10's axial direction, a straight current path is formed, eliminating the need for a U-shaped current path formed by creating a groove penetrating the thickness direction, as is common in conventional heating elements 10. This results in better mechanical strength for the heating element 10, making it less prone to breakage.

[0035] Furthermore, a hollow cavity 20 is formed at one end of the heating element 10 along its axial direction to reduce the power consumption of the heating element 10. In addition, forming a hollow cavity 20 at one end of the heating element 10 along its axial direction can significantly reduce the heat capacity of the heating part, thereby significantly improving the heating rate, reducing waiting time, and enhancing the consumer experience.

[0036] In some embodiments, the heating element 10 includes an open end 12 and a closed end 14 disposed opposite to each other along its own axial direction. The open end 12 has an opening 21 communicating with the hollow cavity 20. At least a portion of one of the first electrode assembly 30 and the second electrode assembly 50 is disposed on the outer peripheral surface of the closed end 14 to connect with the closed end 14, and at least a portion of the other is disposed in the hollow cavity 20 to connect with the open end 12 where the hollow cavity 20 is located. In this way, the first electrode assembly 30 and the second electrode assembly 50 are respectively disposed at opposite ends of the heating element 10 along its axial direction, so that an axially flowing current is formed in the heating element 10.

[0037] Furthermore, the first electrode assembly 30 includes a first electrode layer 32, and the second electrode assembly 50 includes a second electrode 52. The first electrode layer 32 is at least partially disposed on the outer peripheral surface of the closed end 14, and the second electrode 52 extends at least partially into the hollow cavity 20 and is connected to the inner wall of the hollow cavity 20. Thus, the first electrode layer 32 is connected to the closed end 14, and the second electrode 52 extends into the hollow cavity 20 and is connected to the open end 12 of the hollow cavity 20, thereby forming a current between the open end 12 and the closed end 14. Moreover, by directly connecting the second electrode 52 inside the hollow cavity 20, it is not necessary to first set an electrode layer on the outer surface of the open end 12 before connecting the electrode, which facilitates manufacturing.

[0038] Optionally, the second electrode 52 is connected to the bottom wall of the hollow cavity 20, thus avoiding the second electrode 52 being connected to the side wall of the hollow cavity 20, which would cause the side wall of the hollow cavity 20 to have excessively high temperature due to high resistance, and ensuring a uniform distribution of the temperature field.

[0039] In some embodiments, the second electrode 52 is disposed at the open end 12, and the first electrode layer 32 includes a first segment 321 and a second segment 323. The first segment 321 is disposed at the closed end 14, and the second segment 323 is connected to the first segment 321 and extends towards the side where the open end 12 is located. In this way, the first electrode layer 32 is connected to the closed end 14 through the first segment 321, and the first electrode layer 32 is extended to the open end 12 through the second segment 323, so that both the first electrode layer 32 and the second electrode 52 are located at the open end 12, which facilitates the connection of the heating structure 100 to the circuit of the electronic heating device. Optionally, the heating element 10 is constructed as a rod-shaped structure, and the closed end 14 is constructed as a sharp structure to facilitate the insertion of the aerosol examination matrix into the closed end 14.

[0040] Furthermore, the heating structure 100 also includes an insulating layer 70, which is disposed between the second segment 323 and the heating element 10 to prevent a short circuit between the second segment 323 and the heating element 10, thereby affecting the flow path of current to the closed end 14. Optionally, in the direction near the opening 21, the insulating layer 70 protrudes from the second segment 323 to provide effective insulation for the second segment 323.

[0041] Furthermore, the first electrode assembly 30 also includes a first electrode 34, which is located at the open end 12 and connected to the second segment 323. The first electrode 34 serves as a connection structure for the first electrode layer 32 to connect with the external circuit. Both the first electrode 34 and the second electrode 52 are located at the open end 12, which facilitates the connection of the first electrode 34 and the second electrode 52 with the external circuit and does not affect the insertion of the aerosol generation matrix into the heating element from the closed end 14.

[0042] In some embodiments, the heating structure 100 further includes a mounting member, which is sleeved on the outer periphery of the open end 12, so as to use the mounting member as the mounting base of the heating structure 100 to install the heating component 100 in the electronic atomizing device.

[0043] In some embodiments, the heating element 10 comprises ceramic and metallic materials. The volume percentage of the metallic material in the heating element 10 is 30%-65%, and the volume percentage of the ceramic material is 35%-75%. The metallic material acts as a conductor, exhibiting low resistivity and a high temperature coefficient of resistance (TCR), while the ceramic material regulates resistance and enhances strength. Furthermore, the metallic and ceramic phases exhibit good high-temperature chemical compatibility and high sintering activity, allowing for densification sintering of the cermet at atmospheric pressure and relatively low sintering temperatures. During the entire sintering process, no chemical reaction or high-temperature chemical diffusion occurs between the metallic and ceramic phases. Therefore, the resistivity of the heating element 10 made of cermet is strongly correlated with the volume ratio between the metallic and ceramic phases. The resistivity of the heating element 10 can be adjusted by regulating the volume ratio of the metallic to the ceramic phases, thereby meeting different heating requirements.

[0044] In addition, metal materials have high toughness, so the metal-ceramic heating element 10 combines the toughness of metal and the high strength of ceramic in terms of mechanical properties, which makes the heating element 10 have very high mechanical strength and high fracture resistance.

[0045] Furthermore, the metallic material includes at least one of nickel, iron, cobalt, copper, titanium, aluminum, and stainless steel, and / or the ceramic material includes at least one of alumina, zirconium oxide, silicon oxide, yttrium oxide, lanthanum oxide, cerium oxide, magnesium oxide, manganese oxide, and titanium oxide. The raw materials for the heating element 10 are widely available and inexpensive, resulting in low material costs. In addition, due to its high sintering activity and good processing performance, the process for preparing the metal-ceramic heating element 10 is simple, and the manufacturing cost is also low.

[0046] Optionally, appropriate types and amounts of elements can be selected to dope and replace ceramic materials, with the aim of appropriately improving the structural stability of the ceramic phase and enhancing its mechanical properties. For example, doping zirconium oxide with yttrium can improve the phase structural stability of zirconium oxide, while doping alumina with zirconium can improve the toughness of alumina. Understandably, the type and amount of doping elements are set according to requirements and are not limited here.

[0047] In some embodiments, the resistivity of the heating element 10 is in the range of 4 × 10⁻⁶. -6 Ω·m-8×10 -4 With a resistivity of Ω·m, it fills the current application range of conventional heating resistors, meets the resistivity requirements of electronic atomization devices for heating structures of 100, and can realize heating and self-temperature control functions.

[0048] Furthermore, the temperature coefficient of resistance of the heating element 10 is greater than 600ppm / ℃, which means that the temperature coefficient of resistance of the heating element 10 is relatively large, enabling precise temperature control and improving the atomization effect.

[0049] For the heating structure 100 in any of the above embodiments, the specific preparation method includes the following steps: (1) Mixing: Mix the metal material, ceramic material and the mixing agent in a uniform manner according to the required proportion; (2) Molding: Prepare the blank by injection molding, or by extrusion or dry pressing; (3) Sintering: Place the shaped blank in an atmosphere furnace or vacuum furnace for debinding and sintering; (4) Finishing of sintered body: Perform simple machining and finishing on the sintered metal-ceramic heating element 10 to form a quasi-hollow cylinder with an outer diameter that meets the requirements (one end is not connected and is used to process the needle tip); (5) According to the arrangement of the positive and negative electrodes, in the above quasi-hollow An insulating coating and an electrode layer are prepared on the outer surface of the cylinder. The hollow cylinder is then sharpened. Specifically, an insulating layer 70 is first coated on the outer surface of the open end 12 of the quasi-hollow cylinder. Then, the closed end 14 of the quasi-hollow cylinder is sharpened, and the insulating layer 70 of the closed end 14 is removed. Finally, a first electrode layer 32 is coated on the sharpened closed end 14 and the insulating layer 70 to complete the coating of the insulating layer 70 and the electrode layer. (6) Preparation of positive and negative electrodes and mounting parts: Electrodes and mounting parts are prepared by brazing in an atmosphere furnace or a vacuum furnace. (7) Preparation of glaze layer: A protective glaze layer is prepared by sintering on the surface of the heating element 10 in an atmosphere furnace or a vacuum furnace. Depending on the specific circumstances, the mounting parts may also be completed after the glaze layer preparation is completed.

[0050] It is understandable that the heating structure 100 prepared by the above preparation method has a resistivity of 4×10-6Ω·m~8×10-4Ω·m and a resistance temperature coefficient greater than 600ppm / ℃.

[0051] The following examples illustrate the above preparation method from the aspects of the volume ratio of metal and ceramic materials, the selection of material composition of metal and ceramic materials, the particle size of metal and ceramic materials, and the vacuum degree and temperature of sintering.

[0052] Example 1:

[0053] 1) Mix 35% by volume of 430L stainless steel powder (metal material) with a particle size of -10μm and 65% by volume of zirconium oxide powder (ceramic material) with a particle size of -1μm, then add an appropriate amount of dispersant triethanolamine (TEA), and wet mill in a ball mill for 40h to obtain mixed powder.

[0054] 2) Place the mixture in a vacuum drying oven at 60℃ to dry;

[0055] 3) Add 3.0% by mass of PVB solution to the dried mixture as a molding binder, and mix thoroughly;

[0056] 4) Pour the above mixture into a mortar and grind it evenly to form granulated powder;

[0057] 5) Pour the above granulated powder into a dry pressing mold and press the powder into the target shape under a molding pressure of 200MPa;

[0058] 6) Place the formed green body in a vacuum drying oven at 60°C and dry for 4 hours;

[0059] 7) Place the dried green body into a vacuum furnace for sintering. The vacuum degree is 10-3 Pa, the sintering temperature is 1350℃, and the sintering time is 120 min.

[0060] 8) The above sintered body is simply machined by a centerless mill to obtain a quasi-hollow cylinder (one end is not connected, used to machine the sharp closed end 16), so that its outer diameter meets the requirements.

[0061] 9) An insulating layer 70 is prepared on the outer surface of the quasi-hollow cylinder with an opening 21 using the "impregnation coating-vacuum sintering" method;

[0062] 10) The end of the cylinder away from the opening 21 is sharpened, and a first electrode layer 32 is further prepared on the insulating layer 70 on the outer surface of the heating element 10. One end of the first electrode layer 32 is connected to the heating element 10 through the closed end 16, and the other end extends toward the side where the opening 21 is located and is above the insulating layer 70, but does not exceed the insulating layer 70.

[0063] 11) The electrodes and mounting parts are brazed together in an atmosphere furnace or a vacuum furnace. The first electrode 34 is connected to the first electrode layer 32, and the second electrode 52 is welded to the bottom wall of the hollow cavity 20.

[0064] 12) Glaze preparation; a protective glaze layer is prepared by sintering on the surface of the heating element 10 in an atmosphere furnace or a vacuum furnace. Depending on the specific circumstances, the mounting component may also be installed and fixed after the glaze layer preparation is completed.

[0065] The heating element 10 prepared according to the above process has a resistance of 0.8Ω and a temperature coefficient of resistance (TCR) of 1320ppm / ℃.

[0066] Example 2

[0067] 1) Mix 316L stainless steel powder (metallic material) with a particle size of -10μm at a volume percentage of 35% and zirconium oxide powder (ceramic material) with a particle size of -1μm at a volume percentage of 65%, then add an appropriate amount of dispersant triethanolamine (TEA), and wet mill in a ball mill for 40h to obtain mixed powder.

[0068] 2) Place the mixture in a vacuum drying oven at 60℃ to dry;

[0069] 3) Add 3.0% by weight of paraffin molding binder to the dried mixture and stir thoroughly.

[0070] 4) The above mixture is pressed into the target shape using an injection molding machine under a molding pressure of 10MPa, and then demolded;

[0071] 5) Soak the unmolded green body in paraffin extract for 2 hours to remove most of the paraffin.

[0072] 6) Place the extracted green body into a vacuum furnace for sintering. The vacuum degree is 10-3 Pa, the sintering temperature is 1350℃, and the sintering time is 120 min.

[0073] 7) The above sintered body is simply machined by a centerless mill to obtain a semi-hollow cylinder, so that its outer diameter meets the requirements.

[0074] 8) The above sintered body is simply machined by a centerless mill to obtain a quasi-hollow cylinder (one end is not connected, used to machine the sharp closed end 16), so that its outer diameter meets the requirements.

[0075] 9) An insulating layer 70 is prepared on the outer surface of the quasi-hollow cylinder with an opening 21 using the "impregnation coating-vacuum sintering" method;

[0076] 10) The end of the cylinder away from the opening 21 is sharpened, and a first electrode layer 32 is further prepared on the insulating layer 70 on the outer surface of the heating element 10. One end of the first electrode layer 32 is connected to the heating element 10 through the closed end 16, and the other end extends toward the side where the opening 21 is located and is above the insulating layer 70, but does not exceed the insulating layer 70.

[0077] 11) The electrodes and mounting parts are brazed together in an atmosphere furnace or a vacuum furnace. The first electrode 34 is connected to the first electrode layer 32, and the second electrode 52 is welded to the bottom wall of the hollow cavity 20.

[0078] 12) Glaze preparation; a protective glaze layer is prepared by sintering on the surface of the heating element 10 in an atmosphere furnace or a vacuum furnace. Depending on the specific circumstances, the base fixing can also be installed after the glaze layer preparation is completed. The installation sequence of the mounting parts is not limited here.

[0079] The heating element 10 prepared according to the above process has a resistance of 0.82Ω and a temperature coefficient of resistance (TCR) of 1300ppm / ℃.

[0080] It can be seen from the above 1-2 embodiments that:

[0081] (1) Densification sintering of the heating element 10 can be achieved at a relatively low vacuum level and sintering temperature. Moreover, during the entire sintering process, no chemical reaction or high-temperature chemical diffusion occurs between the metal phase and the ceramic phase, which results in good high-temperature chemical compatibility and high sintering activity between the metal phase and the ceramic phase materials.

[0082] (2) The raw materials for the heating structure 100 are widely available and inexpensive, so the material cost of the heating structure 100 is low. In addition, because the metal phase and ceramic phase have high sintering activity and good processing performance, the process for preparing the heating structure 100 is simple and the manufacturing cost is also low.

[0083] (3) The heating structure 100 obtained by the above preparation method can meet the requirements that the resistivity of the heating element 10 is 4×10-6Ω·m~8×10-4Ω·m and the temperature coefficient of resistance (TCR) is greater than 600ppm / ℃, and can realize the functions of heating structure 100 heating and precise temperature control.

[0084] (4) Because the metal mass percentage in the heating element 10 is relatively high and the metal has high toughness, the heating element 10 has both the toughness of metal and the high strength of ceramic in terms of mechanical properties, so that the heating element 10 can have high bending strength.

[0085] (5) The high metal content in the heating element 10 and the stable resistivity of the metal, which is not affected by the stoichiometry and sintering atmosphere, make the heating element 10 highly reproducible in preparation and have high resistivity stability.

[0086] (6) The heating element 10 does not need to be grooved, which ensures the mechanical strength of the heating element 10 and prevents the heating element 10 from breaking. At the same time, the heating element 10, which does not need to be grooved, is easy to process and form, reducing the processing difficulty and manufacturing cost.

[0087] In summary, the above-described method for preparing the heating structure 100 enables the heating element 10 to have a resistivity of 4 × 10⁻⁶. -6 Ω·m~8×10 -4 With a resistance temperature coefficient greater than 600ppm / ℃, the heating element 10 fills the current application range of conventional heating resistors and can meet the requirements of some specific heating non-combustible aerosol forming devices for a heating structure with a resistivity of 100 Ω·m, thus achieving heating and precise temperature control functions.

[0088] In one embodiment of this application, an electronic atomizing device is also provided, including the heating structure 100 described in any of the above embodiments. The heating structure 100 includes a heating element 10, a first electrode assembly 30, and a second electrode assembly 50. A hollow cavity 20 is formed at one axial end of the heating element 10. At least part of the first electrode assembly 30 and the second electrode assembly 50 extends into the hollow cavity 20 and is electrically connected to the heating element 10. The other electrode assembly is located at the end of the heating element 10 away from the hollow cavity 20 in its own axial direction. The heating element 10 is a conductive element, and a current is formed in the heating element 10 flowing along its own axial direction from one of the first electrode assembly 30 and the second electrode assembly 50 to the other.

[0089] In this way, the heating element 10 itself acts as a conductive element, generating heat when energized to heat and atomize the aerosol matrix mounted on it. Furthermore, one of the first electrode assembly 30 and the second electrode assembly 50 extends into the hollow cavity 20 at one axial end of the heating element 10 and connects to it, while the other is connected to the other axial end of the heating element 10. Thus, with the first electrode assembly 30 and the second electrode assembly 50 positioned at opposite ends of the heating element 10's axial direction, when the first electrode assembly 30 and the second electrode assembly 50 are connected to the circuit and energized, a current can be formed on the heating element 10, flowing from one of the first electrode assembly 30 to the other along the axial direction. By positioning the first electrode assembly 30 and the second electrode assembly 50 at opposite ends of the heating element 10's axial direction, a straight current path is formed, eliminating the need for a U-shaped current path formed by creating a groove penetrating the thickness direction, as is common in conventional heating elements 10. This results in better mechanical strength for the heating element 10, making it less prone to breakage.

[0090] Furthermore, a hollow cavity 20 is formed at one end of the heating element 10 along its axial direction to reduce the power consumption of the heating element 10. In addition, forming a hollow cavity 20 at one end of the heating element 10 along its axial direction can significantly reduce the heat capacity of the heating part, thereby significantly improving the heating rate, reducing waiting time, and enhancing the consumer experience.

[0091] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A heating structure, characterized in that, The heating structure includes a heating element, a first electrode assembly, and a second electrode assembly. One axial end of the heating element has a hollow cavity, and the axial end of the heating element away from the hollow cavity is a closed end. The first electrode assembly is disposed on the outer peripheral surface of the heating element. The first electrode assembly includes a first electrode layer, which includes a first segment and a second segment. The first segment is disposed at the closed end, and the second segment is connected to the first segment and extends toward the end where the hollow cavity is located. The second electrode assembly extends at least partially into the hollow cavity and is connected to the heating element; and, An insulating layer is disposed between the second segment and the heating element; The heating element is a conductor, and it is capable of electrically connecting the first electrode assembly and the second electrode assembly.

2. The heating structure according to claim 1, characterized in that, The heating element has an open end at one end where the hollow cavity is located, and the open end has an opening that communicates with the hollow cavity; The second electrode assembly is disposed within the hollow cavity, at least partially through the opening.

3. The heating structure according to claim 2, characterized in that, The second electrode assembly includes a second electrode that extends at least partially into the hollow cavity and is connected to the inner wall of the hollow cavity.

4. The heating structure according to claim 3, characterized in that, The second electrode is connected to the bottom wall of the hollow cavity.

5. The heating structure according to claim 1, characterized in that, The first electrode assembly further includes a first electrode, which is disposed at the open end and connected to the second segment.

6. The heating structure according to claim 1, characterized in that, The heating element is constructed as a rod-shaped structure, and the closed end is constructed as a sharp structure.

7. The heating structure according to claim 1, characterized in that, The heating structure also includes a mounting component, which is located on the outer periphery of the heating element corresponding to the hollow cavity.

8. The heating structure according to any one of claims 1-7, characterized in that, The heating element comprises ceramic and metal materials, wherein the volume percentage of the metal material is 30%-65% and the volume percentage of the ceramic material is 35%-75%.

9. The heating structure according to claim 8, characterized in that, The metallic material includes at least one of nickel, iron, cobalt, copper, titanium, aluminum, and stainless steel; and / or The ceramic material includes at least one of alumina, zirconium oxide, silicon oxide, yttrium oxide, lanthanum oxide, cerium oxide, magnesium oxide, manganese oxide, and titanium oxide.

10. The heating structure according to claim 8, characterized in that, The resistivity range of the heating element is 4×10⁻⁶. -6 Ω▪m-8×10 -4 Ω▪m.

11. The heating structure according to claim 8, characterized in that, The temperature coefficient of resistance of the heating element is greater than 600 ppm / ℃.

12. An electronic atomizing device, characterized in that, The heating structure includes any one of claims 1-11.

Images