Laser processing apparatus, cleaning device, laser processing system, and laser processing method

Abstract

The application belongs to the technical field of laser processing, and discloses a laser processing equipment, a cleaning device, a laser processing system and a laser processing method. The laser processing equipment comprises a bearing assembly, the bearing assembly comprises a processing table for bearing a workpiece; and further comprises a processing assembly, the processing assembly comprises a processing part and a detection part moving synchronously with the processing part. The processing part and the detection part moving synchronously can detect the workpiece in real time after processing is completed, and the detection efficiency is improved. The laser processing system and the laser processing method realize automatic laser processing, detection, feeding and discharging. Dust is blown and cleaned through a dust cleaning part during processing and detection, waste or dust in the workpiece processing process is cleaned, the self-cleaning assembly is cleaned after detection, and processing and detection can be completed in one processing procedure, time is saved, and the efficiency of laser processing and detection is improved.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a laser processing equipment, a cleaning device, a laser processing system, and a laser processing method. Background Technology

[0002] With the development of 5G and high-frequency radio frequency (RF) technologies, the demand for low-temperature co-fired ceramic (LTCC) substrates, key components for RF front-ends, continues to rise. LTCC ceramic substrates utilize novel ceramic materials and microwave thick-film integration processes to achieve three-dimensional integration of RF microwave circuits and digital circuits, resulting in a high degree of integration of active and passive components. One of the key technologies in LTCC multilayer substrate co-firing technology is the green ceramic sheet processing and forming technology, which is divided into mechanical punching technology and laser drilling technology.

[0003] The processing and forming technology of raw ceramic tiles is increasingly trending towards small aperture, high precision and high wiring density. Mechanical punching technology is limited by its own process, and laser drilling technology is gradually becoming the mainstream technology. However, it cannot achieve real-time inspection of products. After laser processing, the product needs to be placed on another device for inspection, which results in low inspection efficiency and production efficiency. Summary of the Invention

[0004] One of the objectives of this invention is to provide a laser processing equipment that eliminates the need to transfer workpieces separately to a specially designed inspection station for inspection, thereby improving inspection efficiency and enhancing the overall processing capacity of laser processing, thus increasing production capacity.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A laser processing device, comprising:

[0007] A support assembly, the support assembly including a processing stage for supporting a workpiece;

[0008] The processing assembly includes a processing moving part;

[0009] The processing assembly further includes a processing section and a detection section. The processing section and the detection section are slidably connected to the processing moving section. The processing section is used to process the workpiece on the processing stage, and the detection section is used to detect the processed workpiece on the processing stage.

[0010] Preferably, the processing end of the processing unit and the detection end of the detection unit are arranged in the same direction.

[0011] The processing unit and the detection unit share the same processing carrier plate so that the processing unit and the detection unit move synchronously;

[0012] The supporting component includes at least two processing platforms, such that when one processing platform is in a processing or inspection state, the other processing platform is in a loading / unloading or idle state; when the processing unit processes one processing platform, the inspection unit is in an idle state.

[0013] Preferably, the processing end of the processing unit and the detection end of the detection unit are arranged in the same direction.

[0014] The processing unit and the detection unit each use independent processing carrier plates, so that the processing unit and the detection unit can move independently;

[0015] The support assembly includes at least two processing stages, such that when one processing stage is in a processing state, the other processing stage is in a detection state.

[0016] Preferably, the support assembly includes a support platform with at least two slides, and a processing platform is slidably connected to each slide.

[0017] Preferably, the system also includes a transfer assembly, which includes a fixed rail disposed above the processing platform. The fixed rail extends in the same direction as the processing moving part. The fixed rail is disposed on the side of the slide near the starting end, and the processing moving part is disposed on the side of the slide near the ending end. A clamping part capable of clamping the workpiece is slidably connected on the fixed rail.

[0018] Preferably, a self-cleaning component is also included, which is disposed above the slide rail and on the fixed rail, for cleaning the support platform during its movement;

[0019] The self-cleaning component includes a self-cleaning lifting element, and the output end of the self-cleaning lifting element is connected to a vacuuming element and / or a sweeping brush.

[0020] Preferably, the processing stage includes a fixture adsorption stage, which is disposed on the upper surface of the processing stage, and the upper surface of the fixture adsorption stage is provided with fixture adsorption holes in the circumferential direction.

[0021] The processing platform also includes a workpiece platform, which is embedded in the middle of the fixture adsorption platform and has workpiece adsorption holes.

[0022] Preferably, the processing assembly further includes a dust removal section, which is disposed at the processing end of the processing section to remove dust generated during processing.

[0023] The dust removal unit includes a dust removal pipe connected to a dust removal hood. The dust removal hood has a through laser passage located below the processing end of the processing unit. A first air outlet is provided inside the dust removal hood on the opposite side of the dust removal pipe. A second air outlet is provided below the first air outlet. The air outlet of the first air outlet faces the dust removal pipe. The air outlet of the second air outlet faces the dust removal pipe and is inclined towards the bottom side of the dust removal hood.

[0024] Preferably, the laser optical path assembly includes a laser section disposed at the light inlet of the laser optical path assembly, and the light outlet of the laser optical path assembly is connected to the processing section. The light outlet of the laser optical path assembly is provided with a lens protection section, which has a protective cavity. One end of the protective cavity is provided with a lens holder, and the protective cavity, opposite to the lens holder, is provided with an air knife cavity. The air knife cavity has a protrusion that is inserted into the protective cavity, and the protrusion has a through-hole light outlet. The lens fixed by the lens holder and the light outlet are concentrically arranged.

[0025] The laser optical path assembly also includes a positive pressure protection section, which is disposed between the laser section and the lens protection section.

[0026] A second objective of this invention is to provide a cleaning device for use in laser processing equipment, comprising:

[0027] The getter suction section is provided with a getter suction groove;

[0028] A waste suction pipe is connected to the waste suction tank to discharge waste material from the waste suction tank;

[0029] A getter baffle is provided, which is liftable and adjustable on the outside of the getter section to surround the getter groove in the middle of the getter baffle.

[0030] Preferably, the system also includes a baffle lifting component, the output end of which is connected to the suction baffle to lift the suction baffle.

[0031] Preferably, the device further includes an adsorption pipe and a workpiece support platform connected to the adsorption pipe. The workpiece support platform is provided with an adsorption groove for supporting the workpiece. The impurity removal part is provided on at least one side of the workpiece support platform. The impurity removal baffle is provided on the side of the workpiece support platform, and the impurity removal groove is located between the impurity removal baffle and the platform surface of the workpiece support platform.

[0032] Preferably, the system also includes a dust removal section, which is located at the top of the suction trough. The dust removal section includes a dust removal pipe connected to a dust removal hood. A first air outlet is located inside the dust removal hood on the opposite side of the dust removal pipe. A second air outlet is located below the first air outlet. The air outlet of the first air outlet faces the dust removal pipe. The air outlet of the second air outlet faces the dust removal pipe and is inclined towards the bottom side of the dust removal hood.

[0033] A third objective of this invention is to provide a laser processing system, comprising:

[0034] The support assembly includes at least two processing platforms.

[0035] The processing assembly includes a processing moving part;

[0036] The processing assembly further includes a processing unit and a detection unit that moves synchronously with the processing unit. The processing unit and the detection unit are slidably connected on the processing moving unit. The processing unit is used to process the workpiece on the processing stage, and the detection unit is used to detect the processed workpiece on the processing stage.

[0037] The laser processing system also includes a cleaning device and a self-cleaning component; the cleaning device is used to remove waste or dust during the workpiece processing; the self-cleaning component is used to clean the processing platform.

[0038] Preferably, the processing stage is disposed at the top of the impurity suction unit, which is used to remove waste material from the workpiece processing stage.

[0039] The impurity suction part is provided with an impurity suction groove;

[0040] A waste suction pipe is connected to the waste suction tank to discharge waste material from the waste suction tank;

[0041] A getter baffle is provided, which is liftably disposed on the outside of the getter section to surround the getter groove in the middle of the getter baffle;

[0042] An adsorption pipe and a workpiece support platform connected to the adsorption pipe, wherein the workpiece support platform is provided with an adsorption groove for adsorbing workpieces, and the impurity removal part is provided on at least one side of the workpiece support platform.

[0043] The processing platform is placed in the adsorption tank on the workpiece support platform, and the workpiece support platform is arranged to slide on the slide rail.

[0044] Preferably, the equipment also includes a feeding device, which is equipped with a feeding bin, and the clamping part on the laser processing equipment can transfer the workpiece in the feeding bin to the processing platform.

[0045] The unloading device is equipped with an unloading bin, and the clamping part can transfer the workpiece on the processing table to the unloading bin.

[0046] The fourth objective of this invention is to provide a laser processing method, comprising the following steps:

[0047] S1. The clamping part transfers a workpiece to a machining stage;

[0048] S2. Control the opening of the suction unit and the dust removal unit;

[0049] S3. The processing unit processes a workpiece on a processing platform, and the dust removal unit and the dust cleaning unit clean up waste or dust during the workpiece processing.

[0050] S4. The inspection unit inspects the processed workpiece on the processing platform.

[0051] S5. The clamping unit transfers the processed and inspected workpiece to the unloading device;

[0052] S6. The self-cleaning component cleans the processing platform;

[0053] Repeat steps S1-S6.

[0054] Preferably, the processing unit and the detection unit share the same processing carrier plate and maintain synchronous movement;

[0055] Step S3 also includes the detection unit being in an idle state;

[0056] Step S4 also includes the processing unit being in an idle state.

[0057] The fifth objective of this invention is to provide a laser processing method, characterized by comprising the following steps:

[0058] S1. The clamping part transfers a workpiece to a machining stage;

[0059] S2. Control the opening of the suction and dust removal sections on the two processing tables;

[0060] S3. The processing unit processes a workpiece on a processing platform, and the dust removal unit and the dust cleaning unit clean up the waste or dust during the processing of a workpiece.

[0061] S4. The clamping unit transfers another workpiece to another processing stage;

[0062] S5. The processing unit moves to another processing platform to process the workpiece on the other processing platform. The dust collection unit and the dust removal unit clean up the waste or dust during the processing of the other workpiece.

[0063] At the same time, the inspection department inspects a processed workpiece on the processing platform;

[0064] S6. The clamping part transfers a workpiece that has completed inspection to the unloading device; the self-cleaning component cleans the processing stage.

[0065] S7. The inspection unit inspects the processed workpiece on the other processing platform.

[0066] S8. The clamping part transfers the other workpiece that has completed the inspection to the unloading device; the self-cleaning component cleans the other processing platform.

[0067] Repeat steps S1-S8.

[0068] Preferably, the distance between the processing section and the detection section is variable;

[0069] Step S3 also includes the detection unit being in an idle state;

[0070] Step S7 also includes the processing unit being in an idle state.

[0071] The beneficial effects of this invention are:

[0072] 1. The synchronous motion of the processing and inspection units enables real-time inspection of the workpiece after processing, eliminating the need to transfer the workpiece separately to a specially designed inspection station. This improves inspection efficiency and enhances the overall processing capacity of laser processing, thereby increasing production capacity.

[0073] 2. In the cleaning device of this application, when it is necessary to remove waste, the suction baffle is raised to surround the waste in the middle of the suction section to prevent the waste from overflowing. Then, the waste surrounded in the middle is quickly sucked out by the suction trough, so as to quickly clean up the waste without polluting the surrounding environment, and at the same time remove the waste to prevent the waste from accumulating on the fixture.

[0074] 3. It enables automated loading and unloading, and allows for real-time dust removal during processing to facilitate subsequent inspection operations. Processing and inspection can be completed in one processing step, saving time and improving efficiency.

[0075] 4. After the laser processing device completes the workpiece processing, the self-cleaning lifting component in the self-cleaning assembly drives the dust collection component and the sweeping component to clean the processing table, so that a cleaner table surface is ready to process the next workpiece, thereby improving the processing quality.

[0076] 5. The dust removal unit is fixed to the processing end and moves together with the processing unit to achieve dust removal during processing, thereby improving the reliability of processing and inspection. The air blowing of the dust removal unit can not only clean the residue in the laser cutting groove, but also cool the laser processing head, thereby improving the quality of laser processing.

[0077] 6. The cleaning device and dust removal unit work together. The dust removal unit blows air onto the cleaning device and the workpiece, which can efficiently and promptly remove waste and dust, resulting in better cleaning effect and reducing the impact of waste and dust on laser processing. Attached Figure Description

[0078] Figure 1 This is a schematic diagram of the structure of the laser processing equipment of the present invention;

[0079] Figure 2 This is a schematic diagram of the processing components and laser optical path components in the laser processing equipment of the present invention;

[0080] Figure 3 This is a schematic diagram of the support component in the laser processing equipment of the present invention;

[0081] Figure 4 This is a schematic diagram of the processing stage in the laser processing equipment of the present invention;

[0082] Figure 5 This is a schematic diagram of the dust removal section in the laser processing equipment of the present invention;

[0083] Figure 6 This is a cross-sectional view of the dust removal section in the laser processing equipment of the present invention;

[0084] Figure 7 This is an exploded view of the lens protection part in the laser processing equipment of the present invention;

[0085] Figure 8 This is a schematic diagram of the transfer component and self-cleaning component in the laser processing equipment of the present invention;

[0086] Figure 9 This is a schematic diagram of the self-cleaning component in the laser processing equipment of the present invention;

[0087] Figure 10 This is a schematic diagram of a self-cleaning component in another embodiment of the laser processing equipment of the present invention;

[0088] Figure 11 This is a schematic diagram of the cleaning device of the present invention;

[0089] Figure 12 This is a schematic diagram showing the combination of the cleaning device with the processing platform and the dust removal unit in this invention;

[0090] Figure 13 This is a schematic diagram of the laser processing system of the present invention;

[0091] Figure 14 This is a schematic flowchart of the laser processing method of the present invention.

[0092] In the picture:

[0093] 10-Laser optical path assembly; 101-Laser section; 102-Positive pressure protection section; 103-Lens protection section; 1031-Lens mounting base; 1032-Air knife cavity; 1032a-Protrusion; 1032b-Light outlet; 1033-Protective cavity; 1034-Sealing gasket; 11-Processing assembly; 111-Processing section; 112-Detection section; 113-Processing moving section; 114-Processing carrier plate; 115-Dust cleaning section; 1151-Dust cleaning pipe; 1152-Dust cleaning hood; 1153-Laser passage; 1154-First air outlet; 1155-Second air outlet; 12-Self-cleaning assembly; 121-Self-cleaning lifting component; 122-Dust suction component; 123-Brush component; 124-Self-cleaning mounting base; 125-Reinforcing plate; 13-Bearing assembly; 1 31-Supporting platform; 132-Processing platform; 1321-Jig adsorption platform; 1322-Jig adsorption hole; 1323-Workpiece adsorption hole; 1324-Workpiece platform; 133-Supporting platform drive component; 134-Slide rail; 20-Transfer assembly; 201-Fixed rail; 202-Clamping part; 2021-Sliding seat; 2022-Clamping lifting component; 2023-Loading tray; 2024-Clamping component; 30-Pollution suction pipe; 31-Pollution suction baffle; 32-Pollution suction part; 33-Workpiece resting platform; 34-Baffle lifting component; 35-Pollution suction trough; 36-Adsorption pipe; 37-Adsorption trough; 40-Feeding device; 401-Feeding bin; 50-Unloading device; 501-Unloading bin; 502-Unqualified bin; 503-Dust removal device; 504-Static elimination device. Detailed Implementation

[0094] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0095] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0096] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0097] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0098] like Figure 1-10 As shown, this embodiment provides a laser processing device, including a support assembly 13, which includes a processing stage 132 for supporting workpieces; it also includes a processing assembly 11, which includes a processing section 111 and a detection section 112 that moves synchronously with the processing section 111. The processing assembly 11 also includes a processing moving section 113; the processing section 111 and the detection section 112 are slidably connected on the processing moving section 113, the processing section 111 is used to process the workpiece on the processing stage 132, and the detection section 112 is used to detect the workpiece on the processing stage 132.

[0099] The processing unit 111 and the inspection unit 112, which adopt synchronous motion, can inspect the workpiece in real time after processing, without having to transfer the workpiece to a specially set inspection station for inspection. This improves inspection efficiency and enhances the overall processing capacity of laser processing, thereby increasing production capacity.

[0100] This embodiment will be described in detail below, such as Figure 1 and 3 As shown, the laser processing equipment includes a support assembly 13, which includes at least two processing stages 132 for supporting workpieces. In this embodiment, the number of processing stages 132 can be multiple to improve processing efficiency. Specifically, as shown... Figure 4As shown, the processing stage 132 includes a fixture adsorption stage 1321, which is disposed on the upper surface of the processing stage 132. The upper surface of the fixture adsorption stage 1321 has circumferentially arranged fixture adsorption holes 1322. In this embodiment, a frame-type fixture (not shown in the figure) is used, which can be used to fix the workpiece. The fixture adsorption holes 1322 are used to adsorb and fix the workpiece, thus preventing the workpiece from moving during processing and affecting the processing quality. Furthermore, the processing stage 132 also includes a workpiece stage 1324, which is embedded in the middle of the fixture adsorption stage 1321. The workpiece stage 1324 has workpiece adsorption holes 1323. In this embodiment, the workpiece adsorption holes 1323 are evenly distributed on the workpiece stage 1324 to increase the adsorption area. The fixture adsorption holes 1322 on the fixture adsorption platform 1321 are evenly distributed on the sides of the workpiece carrier 1324, simultaneously fixing the workpiece and fixture through double adsorption, avoiding product quality problems caused by shaking. It should be noted that in this embodiment, both the fixture adsorption holes 1322 and the workpiece adsorption holes 1323 are connected to an external adsorption device. Further, as... Figure 3 As shown, the supporting assembly 13 also includes a supporting platform 131, which has at least two slide rails 134. In this embodiment, two slide rails 134 are provided. The processing platform 132 for fixing the workpiece slides into contact with the slide rails 134. It also includes a supporting platform drive 133, which provides power for the sliding of the supporting platform 131. The supporting platform drive 133 has a sealing structure on its exterior for dust prevention. The workpiece is conveyed through the slide rails 134 to facilitate removal from the processing area and easy loading and unloading.

[0101] The laser processing equipment also includes a processing assembly 11, which includes a processing moving part 113. In this embodiment, the processing moving part 113 is a moving shaft; in other embodiments, a conveyor belt or the like can be used instead. The processing moving part 113 is disposed above a slide rail 134, and the direction of the slide rail 134 is perpendicular to the extension direction of the processing moving part 113. The processing assembly 11 also includes a processing section 111 slidably connected to the processing moving part 113 and a detection section 112 that moves synchronously with the processing section 111. The processing section 111 is used to process workpieces placed on a processing stage 132. The processing section 111 and the detection section 112 can perform processing and detection simultaneously during the processing and detection movements. When the processing section 111 processes a workpiece on one processing stage 132, the detection section 112 can detect the workpiece processed on the other processing stage 132, without having to transfer the workpiece separately to a specially set detection station for detection, thus improving detection efficiency. Specifically, the spacing between any two adjacent processing tables 132 can be the same as the spacing between the processing end of the processing unit 111 and the detection end of the detection unit 112. The processing unit 111 and the detection unit 112 are integrally arranged to move synchronously to further improve detection efficiency. The detection unit 112 is used to detect the processed workpieces on the adjacent processing tables 132. Through their synchronous movement, the detection unit 112 can simultaneously detect the processed workpieces on the two adjacent processing tables 132 after the processing unit 111 has finished processing. The processing assembly 11 includes a processing carrier plate 114. The processing unit 111 and the detection unit 112 are mounted on the processing carrier plate 114. The processing carrier plate 114 is slidably connected to the processing moving part 113 so that the processing unit 111 and the detection unit 112 move synchronously and coaxially. In other embodiments, the processing unit 111 and the detection unit 112 can each use an independent processing carrier plate 114 so that the processing unit 111 and the detection unit 112 can move independently. Specifically, a processing carrier plate 114 is slidably connected to the processing moving part 113. In this embodiment, a sliding channel is provided on the processing carrier plate 114. The processing part 111 and the detection part 112 are slidably mounted on the sliding channel in the processing carrier plate 114. It can be understood that in this embodiment, a power component such as a cylinder is used to drive the processing part 111 and the detection part 112 to slide up and down along the sliding channel. In other embodiments, a motor can also be used. The processing end of the processing part 111 and the detection end of the detection part 112 are arranged in the same direction. In this embodiment, the processing part 111 is a galvanometer processing system, and the detection part 112 is a detection system composed of a line scan camera. The laser emission end of the galvanometer processing system and the lens end of the line scan camera are arranged in the same direction to save time between processing and detection, and to achieve rapid detection.

[0102] like Figure 2 , Figure 5 and Figure 6As shown, the processing assembly 11 also includes a dust removal unit 115. The dust removal unit 115 is disposed at the processing end of the processing unit 111 to remove dust generated during processing. In this embodiment, the dust removal unit 115 is fixed to the processing end by a mounting plate and moves together with the processing unit 111 to achieve dust removal during processing, thereby improving the reliability of processing and inspection. Specifically, the dust removal unit 115 includes a dust removal pipe 1151. It should be noted that in this embodiment, the dust removal pipe 1151 is connected to the processing end of the processing unit 111 by a mounting plate, and one end of the dust removal pipe 1151 is connected to an external wind power system to provide airflow to the dust removal unit 115. The dust removal unit 115 can use either blowing or suction to remove dust; in this embodiment, suction is used. The other end of the dust removal pipe 1151 is connected to a dust removal hood 1152. The dust removal hood 1152 has a through laser passage 1153 located below the processing end of the processing section 111. It should be noted that in this embodiment, the laser passage 1153 is coaxially arranged with the laser emission end of the galvanometer processing system, so that the laser from the galvanometer processing system can pass through the laser passage 1153 to process the workpiece located on the processing stage 132. The dust removal hood 1152 contains a first air outlet 1154 and a second air outlet 1155. The first air outlet 1154 is located on the opposite side of the dust removal pipe 1151, with its outlet facing the dust removal pipe 1151. The second air outlet 1155 is located on... The second air outlet 1155 is positioned below the first air outlet 1154, with its outlet facing the dust removal pipe 1151 and tilted towards the bottom of the dust removal hood 1152. It should be noted that the first air outlet 1154 and the second air outlet 1155 are connected to an external air inlet device. When the dust removal pipe 1151 is sucking air, the first air outlet 1154 and the second air outlet 1155 simultaneously discharge air, thereby forming an air curtain in the dust removal hood 1152, allowing air to enter the dust removal pipe 1151 from the bottom, preventing dust and smoke from overflowing from the top of the dust removal hood 1152. The air blowing in the dust removal part 115 can also clean the residue in the laser cutting groove and cool the laser processing head, thereby improving the quality of laser processing.

[0103] like Figure 2 and Figure 7As shown, the laser processing equipment also includes a laser optical path assembly 10. In this embodiment, the optical path is connected to each cavity of the laser optical path assembly 10 by sealed pipes. The laser optical path assembly 10 includes a laser section 101. It should be noted that the laser section 101 in this embodiment has a pair of horizontally parallel mirrors and a pair of vertically parallel mirrors at a 45° angle to the horizontal direction, which facilitates the horizontal or vertical movement of the processing section 111, making processing more convenient. The laser section 101 is located at the light-inlet end of the laser optical path assembly 10, and the light-outlet end of the laser optical path assembly 10 is connected to the processing section 111. The laser emitted from the laser section 101 is adjusted by the laser optical path assembly 10 to meet the processing standards before being processed by the galvanometer processing system.

[0104] Furthermore, the laser optical path assembly 10 is provided with a lens protection part 103 at the light output end. The lens protection part 103 has a protection cavity 1033. A lens fixing seat 1031 is provided at one end of the protection cavity 1033. It should be understood that the protection cavity 1033 is connected to an external gas supply device to deliver inert gas into the protection cavity 1033 to protect the lens, and the lens is installed on the lens fixing seat 1031. A wind knife cavity 1032 is provided on the protective cavity 1033 at the opposite end to the lens fixing seat 1031. Specifically, the wind knife cavity 1032 is provided with a protrusion 1032a. In this embodiment, the peripheral wall of the protrusion 1032a is inclined, forming a frustum structure. The top end of the frustum faces the lens fixing seat 1031. The protrusion 1032a is inserted into the protective cavity 1033. The protrusion 1032a is provided with a light outlet 1032b that runs through it along its longitudinal axis. The lens fixed by the lens fixing seat 1031 and the light outlet 1032b are concentrically arranged to avoid laser misalignment and interference. In this embodiment, a sealing gasket 1034 is also provided between the protective cavity 1033 and the lens fixing seat 1031, and between the air knife cavity 1032 and the protective cavity 1033. The sealing gasket 1034 seals the three together. By cooperating with the protrusion 1032a provided in the air knife cavity 1032, the gas is blown towards the protrusion 1032a and then directly blown onto the lens to form an air knife structure before being discharged from the protective cavity 1033. This allows the gas to fill the protective cavity 1033, forming an outward blowing protective structure to prevent dust from contaminating the protective lens.

[0105] Furthermore, such as Figure 2 As shown, the laser optical path assembly 10 also includes a positive pressure protection unit 102. It should be noted that the positive pressure protection unit 102 is connected to an external inert gas supply device. The positive pressure protection unit 102 is located between the laser unit 101 and the lens protection unit 103. This ensures that the cavity connected via a sealed pipe is always kept under positive pressure protection, effectively preventing dust contamination.

[0106] like Figure 1 and Figure 8As shown, the laser processing equipment also includes a transfer assembly 20 for transferring workpieces onto and off the processing stage 132. Specifically, the transfer assembly 20 includes a fixed rail 201, which is positioned above the processing stage 132. The fixed rail 201 extends in the same direction as the processing moving part 113. The fixed rail 201 is located on the side of the slide rail 134 near the starting end, and the processing moving part 113 is located on the side of the slide rail 134 near the ending end. A clamping part 202 capable of clamping the workpiece is slidably connected to the fixed rail 201. In this embodiment, the clamping part 202 includes a sliding seat 2021 slidably connected to the fixed rail 201. A clamping lifting member 2022 is mounted on the sliding seat 2021. In this embodiment, the clamping lifting member 2022 is a cylinder; in other embodiments, a motor may also be used. The output end of the clamping lifting component 2022 has a loading plate 2023, and the loading plate 2023 is provided with a number of clamping components 2024 for clamping workpieces. In this embodiment, the clamping component 2024 uses a vacuum adsorption head for adsorption and clamping to facilitate picking and placing. In other embodiments, a gripper can also be used for clamping, and the workpiece is transferred into and out of the processing platform 132.

[0107] like Figure 8 , Figure 9 , Figure 10 As shown, the laser processing equipment also includes a self-cleaning component 12, which is positioned above the slide rail 134. In this embodiment, the self-cleaning component 12 is mounted on the fixed rail 201 and is used to clean the support platform 131 during its movement. This allows for pre-cleaning before processing and post-cleaning after processing, resulting in a cleaner platform for the next workpiece and improved processing quality. Specifically, the self-cleaning component 12 includes a self-cleaning lifting component 121. In this embodiment, the self-cleaning lifting component 121 is a cylinder, but in other embodiments, a motor may also be used. The self-cleaning lifting component 121 and the clamping lifting component 2022 are located on opposite sides of the fixed rail 201 to prevent interference. Furthermore, the output end of the self-cleaning lifting component 121 is connected to a dust suction component 122 and / or a sweeping brush component 123. It should be noted that both the dust suction component 122 and the sweeping brush component 123 are provided in this embodiment. Specifically, the output end of the self-cleaning lifting component 121 is provided with a self-cleaning mounting base 124 at one end. A dust-collecting component 122 is mounted on the side of the self-cleaning mounting base 124, and a brush component 123 is mounted on the other end of the self-cleaning mounting base 124. The dust-collecting port of the dust-collecting component 122 and the brush component 123 are located on the same plane. In other embodiments, the brush component 123 is located at the dust-collecting port of the dust-collecting component 122. Furthermore, a reinforcing plate 125 is placed between its two ends on the self-cleaning mounting base 124 to strengthen the self-cleaning mounting base 124 and avoid the risk of breakage caused by long-term cleaning.

[0108] It should be noted that, in this embodiment, the processing moving part 113, the fixed rail 201, the slide rail 134, etc., of the laser processing equipment can be equipped with bellows covers to keep the workpieces susceptible to dust contamination in a strictly sealed environment. For example... Figure 10 As shown, the present invention also provides a cleaning device, which includes a suction part 32, on which a suction groove 35 is provided; a suction pipe 30 is also provided, which is connected to the suction groove 35 and is used to discharge waste in the suction groove 35; and a suction baffle 31 is provided, which is movably disposed on the outside of the suction part 32 to surround the suction groove 35 in the middle of the suction baffle 31.

[0109] The liftable suction baffle 31 allows for flexible operation. When waste needs to be removed, the suction baffle 31 can be raised to surround the waste in the middle of the suction section 32 to prevent the waste from overflowing. Then, the waste surrounded in the middle is quickly sucked out through the suction groove 35, so as to quickly clean up the waste and prevent it from polluting the surrounding environment. At the same time, the waste is removed to prevent it from accumulating at the working position.

[0110] The cleaning device is described in detail below, including a suction unit 32, which has a suction groove 35 and a suction pipe 30 connected thereto. In this embodiment, the suction unit 32 is a strip-shaped suction unit 32 with a suction groove 35. It can be understood that the suction pipe 30 is connected to an external suction device. A liftable suction baffle 31 is provided on the outside of the suction unit 32, which surrounds the suction groove 35 in the middle. Furthermore, a baffle lifting member 34 is also provided. The output end of the baffle lifting member 34 is connected to the suction baffle 31 to lift the suction baffle 31. In this embodiment, the baffle lifting member 34 is a cylinder, but in other embodiments, a motor can also be used, and there can be multiple of them. Furthermore, it also includes an adsorption pipe 36 and a workpiece resting platform 33 connected to the adsorption pipe 36. The workpiece resting platform 33 is provided with an adsorption groove 37, which is used to adsorb workpieces or fixtures. It is understood that the suction pipe 30 is connected to an external suction device. In other embodiments, the adsorption pipe 36 can be connected to the suction pipe 30, both connected to an external suction device, thus saving resources by reducing the number of external suction devices required. Furthermore, the suction part 32 is disposed on at least one side of the workpiece resting platform 33, giving at least one side of the workpiece resting platform 33 a suction groove 35; in this embodiment, suction grooves 35 are provided around the workpiece resting platform 33. A suction baffle 31 is disposed on the upper surface of the workpiece resting platform 33. In this embodiment, the workpiece can be placed in the adsorption groove 37 and fixed by the adsorption pipe 36. During processing, the suction baffle 31 rises, and the waste generated during processing is removed by the suction groove 35, preventing waste from spreading and polluting the environment. Simultaneously, it removes waste to prevent accumulation on the fixture. The dust removal also functions as a fixing function, reducing the need for dedicated fixing devices and achieving dust removal during fixing.

[0111] like Figure 11 and Figure 12As shown, the present invention also provides a laser processing system, which includes the above-mentioned laser processing equipment and the above-mentioned cleaning device. The processing stage 132 of the laser processing equipment is placed in the adsorption groove 37 of the workpiece support stage 33 on the cleaning device. The workpiece support stage 33 is mounted and slides on the slide rail 134. The adsorption groove 37 can adsorb and clamp the processing stage 132 to save separate fixing components. The adsorption pipe 36 of the cleaning device can be connected to the fixture adsorption hole 1322 and the workpiece adsorption hole 1323 to provide adsorption force for the adsorption fixture and the workpiece. Furthermore, during laser processing, the dust removal pipe 1151 draws air through the dust removal hood 1152 to remove production dust. Then, the waste is contained by the suction baffle 31 of the cleaning device, and the waste is discharged by the suction trough 35. This not only prevents dust from overflowing but also enables real-time dust removal during processing, facilitating subsequent inspection operations, saving time, and improving efficiency. In addition, the dust removal section 115 blows air onto the cleaning device and the workpiece, which can efficiently and promptly clean up waste and fumes, resulting in better cleaning effects and reducing the impact of waste and fumes on laser processing.

[0112] like Figure 13 As shown, the laser processing system further includes a loading device 40 and a unloading device 50. In this embodiment, the loading device 40, the unloading device 50, and the fixed rail 201 are coaxially arranged to facilitate material handling. The loading device 40 is provided with a loading bin 401, and the unloading device 50 is provided with a unloading bin 501. The clamping part 202 on the laser processing equipment can transfer the workpiece in the loading bin 401 to the processing platform 132 for processing. After processing, the clamping part 202 can transfer the workpiece on the processing platform 132 to the unloading bin 501 to achieve automated operation. Furthermore, the unloading device 50 also includes a defective bin 502, a dust removal device 503, and an antistatic device. In this embodiment, the antistatic device is an ion wind antistatic device, and the dust removal device 503 is a roller brush dust removal device 503. After processing and inspection, if the inspection result of the workpiece by the inspection department 112 is unqualified, it will be directly transferred to the unqualified warehouse 502; the qualified workpiece will be destaticated by the ion wind destatic device, and then the dust removal device 503 will remove the workpiece processing dust and transfer it to the unloading warehouse 501.

[0113] like Figure 14 As shown, the present invention also provides a laser processing method, utilizing the laser processing system described above.

[0114] S1. The clamping part 202 takes out a workpiece with a fixture from the loading bin 401 of the loading device 40 and places it on a processing platform 132 for fixation, wherein the fixture adsorption platform 1321 adsorbs the fixture, and the workpiece platform 1324 adsorbs the workpiece.

[0115] S2, the suction baffle 31 of the cleaning device is raised, the suction pipe 30 and the adsorption pipe 36 are both opened, the processing part 111 in the processing component 11 is lowered to a suitable position, and the dust removal part 115 is opened;

[0116] S3, the machining section 111 processes a workpiece on a machining platform 132, and the dust removal section 32 and the dust cleaning section 115 clean up waste or dust during the workpiece processing.

[0117] S4. The inspection unit 112 inspects the processed workpiece on a processing stage 132.

[0118] S5. The clamping part 202 transfers the workpiece that has been processed and inspected to the unloading device. In this step, if the workpiece is inspected by the inspection part 112 and is qualified, the workpiece is transported by the clamping part 202 to the ion wind static eliminator 504 of the unloading device 50 to remove static electricity. Then, the dust removal device 503 removes the workpiece processing dust and transfers it to the unloading bin 501.

[0119] If the workpiece is inspected by the inspection unit 112 and the inspection result is unqualified, the workpiece is transported to the unqualified bin 502 by the clamping unit 202.

[0120] S6. The self-cleaning component 12 cleans the processing table 132.

[0121] In this method, the processing unit 111 and the detection unit 112 share the same base plate and maintain synchronous movement; step S3 further includes that the detection unit 112 is in an idle state; step S4 further includes that the processing unit 111 is in an idle state.

[0122] This invention also provides another laser processing method, utilizing the laser processing system described above, comprising the following steps:

[0123] S1. The clamping part 202 takes out a workpiece with a fixture from the loading bin 401 of the loading device 40 and places it on a processing platform 132 for fixation, wherein the fixture adsorption platform 1321 adsorbs the fixture, and the workpiece platform 1324 adsorbs the workpiece.

[0124] S2. Control the opening of the suction unit 32 and the dust removal unit 115 on the two processing tables 132;

[0125] S3, the machining section 111 processes a workpiece on a machining platform 132, and the dust removal section 32 and the dust cleaning section 115 clean up the waste or dust during the processing of a workpiece.

[0126] S4. The clamping part 202 transfers another workpiece to another processing stage 132;

[0127] S5. The processing unit 111 moves to another processing platform 132 to process the workpiece on the other processing platform 132. The dust removal unit 32 and the dust cleaning unit 115 clean up the waste or dust during the processing of the other workpiece.

[0128] Meanwhile, the inspection unit 112 inspects a workpiece that has been processed on a processing stage 132;

[0129] S6. The clamping part 202 transfers a workpiece that has completed inspection to the unloading device; the self-cleaning component 12 cleans a processing table 132; in this step, if the workpiece is inspected by the inspection part 112 and is qualified, the workpiece is transported by the clamping part 202 to the ion wind static elimination device 504 of the unloading device 50 to eliminate static electricity, and then the dust removal device 503 removes the workpiece processing dust and transfers it to the unloading bin 501;

[0130] S7. The inspection unit 112 inspects another workpiece that has been processed on another processing stage 132;

[0131] S8, the clamping part 202 transfers another workpiece that has completed inspection to the unloading device; the self-cleaning component 12 cleans another processing table 132;

[0132] Repeat steps S1-S8.

[0133] In this method, the distance between the processing unit 111 and the detection unit 112 is variable; that is, the processing unit 111 and the detection unit 112 each use independent base plates so that the processing unit 111 and the detection unit 112 can move independently; step S3 also includes that the detection unit 112 is in an idle state; step S7 also includes that the processing unit 111 is in an idle state.

[0134] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A laser processing device, characterized in that, include: The support assembly (13) includes a processing stage (132) for carrying the workpiece; The processing assembly (11) includes a processing moving part (113). The processing assembly (11) further includes a processing section (111) and a detection section (112). The processing section (111) and the detection section (112) are slidably connected on the processing moving section (113). The processing section (111) is used to process the workpiece on the processing stage (132), and the detection section (112) is used to detect the processed workpiece on the processing stage (132). It also includes a cleaning device for use with the laser processing equipment, the cleaning device comprising: A getter suction section (32) is provided with a getter suction groove (35). A waste suction pipe (30) is connected to the waste suction tank (35) to discharge waste material in the waste suction tank (35); A getter baffle (31) is provided on the outside of the getter section (32) in a height-adjustable manner to surround the getter groove (35) in the middle of the getter baffle (31); The processing assembly (11) further includes a dust removal section (115), which is disposed at the processing end of the processing section (111) to remove dust generated during processing by the processing section (111); The dust removal unit (115) includes a dust removal pipe (1151), which is connected to a dust removal hood (1152). The dust removal hood (1152) has a through laser passage (1153) located below the processing end of the processing unit (111). A first air outlet (1154) is provided inside the dust removal hood (1152) on the opposite side of the dust removal pipe (1151). A second air outlet (1155) is provided below the first air outlet (1154). The air outlet of the first air outlet (1154) faces the dust removal pipe (1151). The air outlet of the second air outlet (1155) faces the dust removal pipe (1151) and is inclined towards the bottom side of the dust removal hood (1152). When the dust removal pipe (1151) is drawing air, the first air outlet (1154) and the second air outlet (1155) simultaneously discharge air.

2. The laser processing equipment according to claim 1, characterized in that, The processing end of the processing unit (111) and the detection end of the detection unit (112) are arranged in the same direction. The processing unit (111) and the detection unit (112) share the same processing carrier plate (114) so ​​that the processing unit (111) and the detection unit (112) move synchronously; The carrier component (13) includes at least two processing platforms (132) such that when one processing platform (132) is in a processing or inspection state, the other processing platform (132) is in a loading / unloading or idle state; when the processing unit (111) processes one of the processing platforms (132), the inspection unit (112) is in an idle state.

3. The laser processing equipment according to claim 1, characterized in that, The processing end of the processing unit (111) and the detection end of the detection unit (112) are arranged in the same direction. The processing unit (111) and the detection unit (112) each use an independent processing carrier plate (114) so ​​that the processing unit (111) and the detection unit (112) can move independently; The carrier component (13) includes at least two processing stages (132) such that when one processing stage (132) is in a processing state, the other processing stage (132) is in a detection state.

4. The laser processing equipment according to claim 1, characterized in that, The support component (13) includes a support platform (131), which has at least two slides (134), and each slide (134) has a processing platform (132) slidably connected to it.

5. The laser processing equipment according to claim 4, characterized in that, It also includes a transfer assembly (20), which includes a fixed rail (201) disposed above the processing table (132). The fixed rail (201) extends in the same direction as the processing moving part (113). The fixed rail (201) is disposed on the side of the slide (134) near the starting end. The processing moving part (113) is disposed on the side of the slide (134) near the ending end. A clamping part (202) capable of clamping the workpiece is slidably connected on the fixed rail (201).

6. The laser processing equipment according to claim 5, characterized in that, It also includes a self-cleaning component (12), which is disposed above the slide (134) and on the fixed rail (201) for cleaning the support platform (131) during its movement; The self-cleaning component (12) includes a self-cleaning lifting component (121), the output end of which is connected to a vacuuming component (122) and / or a sweeping brush component (123).

7. The laser processing equipment according to claim 1, characterized in that, The processing stage (132) includes a fixture adsorption stage (1321), which is disposed on the upper surface of the processing stage (132). The upper surface of the fixture adsorption stage (1321) is provided with fixture adsorption holes (1322) in the circumferential direction. The processing stage (132) also includes a workpiece stage (1324), which is embedded in the middle of the fixture adsorption stage (1321) and has a workpiece adsorption hole (1323).

8. The laser processing equipment according to any one of claims 1-7, characterized in that, A laser optical path assembly (10) includes a laser unit (101), which is disposed at the light input end of the laser optical path assembly (10). The light output end of the laser optical path assembly (10) is connected to the processing unit (111). A lens protection unit (103) is provided at the light output end of the laser optical path assembly (10). The lens protection unit (103) has a protective cavity (1033), and a lens holder is provided at one end of the protective cavity (1033). The lens holder (1031) has a protective cavity (1033) with an air knife cavity (1032) at the opposite end to the lens holder (1031). The air knife cavity (1032) has a protrusion (1032a) that is inserted into the protective cavity (1033). The protrusion (1032a) has a through light outlet (1032b). The lens fixed by the lens holder (1031) and the light outlet (1032b) are concentrically arranged. The laser optical path assembly (10) also includes a positive pressure protection section (102), which is disposed between the laser section (101) and the lens protection section (103).

9. The laser processing equipment according to claim 1, characterized in that, It also includes a baffle lifting component (34), the output end of which is connected to the suction baffle (31) so as to be able to lift the suction baffle (31).

10. The laser processing equipment according to claim 1, characterized in that, It also includes an adsorption pipe (36) and a workpiece support platform (33) connected to the adsorption pipe (36). The workpiece support platform (33) is provided with an adsorption groove (37) for supporting workpieces. The impurity removal part (32) is provided on at least one side of the workpiece support platform (33). The impurity removal baffle (31) is provided on the side of the workpiece support platform (33). The impurity removal groove (35) is located between the impurity removal baffle (31) and the table surface of the workpiece support platform (33).

11. The laser processing equipment according to claim 1, characterized in that, It also includes a dust removal section (115), which is located at the top of the suction groove (35). The dust removal section (115) includes a dust removal pipe (1151), which is connected to a dust removal hood (1152). A first air outlet (1154) is provided inside the dust removal hood (1152) on the opposite side of the dust removal pipe (1151). A second air outlet (1155) is provided below the first air outlet (1154). The air outlet of the first air outlet (1154) faces the dust removal pipe (1151). The air outlet of the second air outlet (1155) faces the dust removal pipe (1151) and is inclined towards the bottom side of the dust removal hood (1152).

12. A laser processing system, characterized in that, include: The support assembly (13) includes at least two processing stages (132). The processing assembly (11) includes a processing moving part (113). The processing assembly (11) further includes a processing section (111) and a detection section (112) that moves synchronously with the processing section (111). The processing section (111) and the detection section (112) are slidably connected on the processing moving section (113). The processing section (111) is used to process the workpiece on the processing stage (132), and the detection section (112) is used to detect the processed workpiece on the processing stage (132). The laser processing system also includes a cleaning device and a self-cleaning component (12); the cleaning device is used to clean up waste or dust during the workpiece processing; the self-cleaning component (12) is used to clean the processing stage (132). The cleaning device includes: A getter suction section (32) is provided with a getter suction groove (35). A waste suction pipe (30) is connected to the waste suction tank (35) to discharge waste material in the waste suction tank (35); A getter baffle (31) is provided on the outside of the getter section (32) in a height-adjustable manner to surround the getter groove (35) in the middle of the getter baffle (31); The processing assembly (11) further includes a dust removal section (115), which is disposed at the processing end of the processing section (111) to remove dust generated during processing by the processing section (111); The dust removal unit (115) includes a dust removal pipe (1151), which is connected to a dust removal hood (1152). The dust removal hood (1152) has a through laser passage (1153) located below the processing end of the processing unit (111). A first air outlet (1154) is provided inside the dust removal hood (1152) on the opposite side of the dust removal pipe (1151). A second air outlet (1155) is provided below the first air outlet (1154). The air outlet of the first air outlet (1154) faces the dust removal pipe (1151). The air outlet of the second air outlet (1155) faces the dust removal pipe (1151) and is inclined towards the bottom side of the dust removal hood (1152). When the dust removal pipe (1151) is drawing air, the first air outlet (1154) and the second air outlet (1155) simultaneously discharge air.

13. The laser processing system according to claim 12, characterized in that, The processing stage (132) is disposed at the top of the waste collection part (32), and the waste collection part (32) is used to collect the waste material during the processing of the workpiece on the processing stage (132); The adsorption pipe (36) and the workpiece support platform (33) connected to the adsorption pipe (36) are provided with an adsorption groove (37) for adsorbing workpieces. The impurity removal part (32) is provided on at least one side of the workpiece support platform (33). The processing platform (132) is placed in the adsorption groove (37) on the workpiece support platform (33), and the workpiece support platform (33) is arranged to slide on the slide rail (134).

14. The laser processing system according to claim 12, characterized in that, Also includes: The loading device (40) is provided with a loading bin (401), and the clamping part (202) on the laser processing equipment can transfer the workpiece in the loading bin (401) to the processing platform (132); The unloading device (50) is provided with an unloading bin (501), and the clamping part (202) can transfer the workpiece on the processing platform (132) to the unloading bin (501).

15. A laser processing method, characterized in that, Includes the following steps: S1. The clamping part (202) transfers a workpiece onto a processing stage (132); S2, control the opening of the suction unit (32) and the dust removal unit (115), and control the suction baffle (31) to rise; S3. The processing unit (111) processes a workpiece on a processing platform (132). The suction baffle (31) surrounds the waste generated during processing. The suction unit (32) and the dust removal unit (115) clean up the waste or dust generated during the workpiece processing. S4. The inspection unit (112) inspects the processed workpiece on the processing stage (132); S5, The clamping part (202) transfers the workpiece that has been processed and inspected to the unloading device; S6. The self-cleaning component (12) cleans the processing stage (132); Repeat steps S1-S6; The dust removal unit (115) includes a dust removal pipe (1151), which is connected to a dust removal hood (1152). The dust removal hood (1152) has a through laser passage (1153) located below the processing end of the processing unit (111). A first air outlet (1154) is provided inside the dust removal hood (1152) on the opposite side of the dust removal pipe (1151). A second air outlet (1155) is provided below the first air outlet (1154). The air outlet of the first air outlet (1154) faces the dust removal pipe (1151). The air outlet of the second air outlet (1155) faces the dust removal pipe (1151) and is inclined towards the bottom side of the dust removal hood (1152). When the dust removal pipe (1151) is drawing air, the first air outlet (1154) and the second air outlet (1155) simultaneously discharge air.

16. The laser processing method according to claim 15, characterized in that, include: The processing unit (111) and the detection unit (112) share the same processing carrier plate (114) and maintain synchronous movement; Step S3 also includes the detection unit (112) being in an idle state; Step S4 also includes the processing unit (111) being in an idle state.

17. A laser processing method, characterized in that, Includes the following steps: S1. The clamping part (202) transfers a workpiece onto a processing stage (132); S2, control the opening of the suction section (32) and the dust removal section (115) on the two processing tables (132), and control the suction baffle (31) to rise; S3. The processing unit (111) processes a workpiece on a processing platform (132), the dust collection baffle (31) surrounds the waste generated during processing, and the dust collection unit (32) and the dust removal unit (115) clean up the waste or smoke during the processing of a workpiece. S4. The clamping part (202) transfers another workpiece to another processing stage (132); S5. The processing unit (111) moves to another processing platform (132) to process the workpiece on the other processing platform (132). The dust collection unit (32) and the dust removal unit (115) clean up the waste or dust in the process of processing the other workpiece. At the same time, the inspection unit (112) inspects the processed workpiece on the processing stage (132); S6. The clamping part (202) transfers a workpiece that has completed inspection to the unloading device; the self-cleaning component (12) cleans the processing table (132); S7. The inspection unit (112) inspects the other processed workpiece on the other processing stage (132); S8. The clamping part (202) transfers another workpiece that has completed the inspection to the unloading device; the self-cleaning component (12) cleans the other processing stage (132); Repeat steps S1-S8; The dust removal unit (115) includes a dust removal pipe (1151), which is connected to a dust removal hood (1152). The dust removal hood (1152) has a through laser passage (1153) located below the processing end of the processing unit (111). A first air outlet (1154) is provided inside the dust removal hood (1152) on the opposite side of the dust removal pipe (1151). A second air outlet (1155) is provided below the first air outlet (1154). The air outlet of the first air outlet (1154) faces the dust removal pipe (1151). The air outlet of the second air outlet (1155) faces the dust removal pipe (1151) and is inclined towards the bottom side of the dust removal hood (1152). When the dust removal pipe (1151) is drawing air, the first air outlet (1154) and the second air outlet (1155) simultaneously discharge air.

18. The laser processing method according to claim 17, characterized in that, include: The distance between the processing unit (111) and the detection unit (112) is variable; Step S3 also includes the detection unit (112) being in an idle state; Step S7 also includes the processing unit (111) being in an idle state.

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