Circuit board, manufacturing method thereof, and display device

Abstract

The present application provides a circuit board, a method for preparing the circuit board, and a display panel, relating to the field of display technology. The circuit board includes a drive circuit, which includes a crystal oscillator module, a signal input terminal, a signal output terminal, a power line, a ground line, and a switch module. The crystal oscillator module includes a first pin, a ground pin, a third pin, and a fourth pin. The first pin is electrically connected to the signal input terminal, the ground pin is electrically connected to the ground line, the third pin is electrically connected to the signal output terminal, and the fourth pin is electrically connected to the first terminal of the switch module. The crystal oscillator module includes either an active crystal oscillator or a passive crystal oscillator. In this way, the same circuit board can be compatible with the drive circuits of both active and passive crystal oscillators, reducing the cost of selecting drive circuit boards for both active and passive crystal oscillators.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a circuit board and a manufacturing method thereof, and a display device. Background Art

[0002] With the diversification of foldable display technology, the demand for foldable display products to be used with styluses is increasing. Whether a display product supports stylus functionality is related to its circuit board. This circuit board includes the driver circuit for the stylus, and a crystal oscillator is an essential component of this driver circuit. Crystal oscillators come in two types: active and passive. Active and passive crystal oscillators differ in price and performance, and are used in different types of display devices.

[0003] In the related art, different circuit boards must be designed for driving circuits equipped with active crystal oscillators and passive crystal oscillators. This results in high design and manufacturing costs for the circuit boards, and the application range of the same circuit board in display devices is limited. Summary of the Invention

[0004] The embodiments of the present application provide a circuit board, a circuit board manufacturing method, and a display panel, which enable a passive crystal oscillator drive circuit and an active crystal oscillator drive circuit to be simultaneously on the same circuit board, thereby reducing the cost of the circuit board and increasing its application range. The embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, a circuit board is provided, comprising a substrate and a driving circuit located on the substrate, wherein the driving circuit comprises a crystal oscillator module, a signal input terminal, a signal output terminal, a power line, a ground line, and a switch module;

[0006] The crystal oscillator module includes a first pin, a second pin, a third pin and a fourth pin;

[0007] The first pin is electrically connected to the signal input end, the second pin is electrically connected to the ground line, the third pin is electrically connected to the signal output end, and the fourth pin is electrically connected to the first end of the switch module;

[0008] The crystal oscillator module includes one of an active crystal oscillator and a passive crystal oscillator;

[0009] In the case where the crystal oscillator module includes the passive crystal oscillator, the second end of the switch module is electrically connected to the ground line;

[0010] In the case where the crystal oscillator module includes the active crystal oscillator, the second end of the switch module is electrically connected to the power line.

[0011] In some embodiments of the present application, when the crystal oscillator module includes the passive crystal oscillator, the driving circuit further includes a first filtering module and a second filtering module;

[0012] The first filtering module is electrically connected to the first pin, and the second filtering module is electrically connected to the third pin.

[0013] In some embodiments of the present application, the first filtering module includes a first capacitor, and the second filtering module includes a second capacitor;

[0014] A first end of the first capacitor is electrically connected to the first pin, and a second end of the first capacitor is electrically connected to the ground line;

[0015] A first end of the second capacitor is electrically connected to the third pin, and a second end of the second capacitor is electrically connected to the ground line.

[0016] In some embodiments of the present application, when the crystal oscillator module includes an active crystal oscillator, the driving circuit further includes a voltage stabilizing module, and the voltage stabilizing module is electrically connected to the power line through the switch module;

[0017] The voltage stabilizing module is configured to stabilize the voltage of the power line input signal.

[0018] In some embodiments of the present application, the voltage stabilizing module includes a third capacitor;

[0019] A first end of the third capacitor is electrically connected to the first end of the switch module, and a second end of the third capacitor is electrically connected to the ground line.

[0020] In some embodiments of the present application, when the crystal oscillator module includes a passive crystal oscillator, the switch module includes a first resistor; a first end of the first resistor is electrically connected to the fourth pin, and a second end of the first resistor is electrically connected to the ground line;

[0021] In the case where the crystal oscillator module includes an active crystal oscillator, the switch module includes a second resistor;

[0022] A first end of the second resistor is electrically connected to the fourth pin, and a second end of the second resistor is electrically connected to the power line.

[0023] In some embodiments of the present application, the first resistor includes a 0-ohm resistor, and the second resistor includes a 0-ohm resistor.

[0024] In some embodiments of the present application, the circuit board further includes:

[0025] A first conductive layer, located on one side of the substrate, including the power line;

[0026] a second conductive layer, located on a side of the first conductive layer away from the substrate, and comprising the ground line;

[0027] A third conductive layer is located on a side of the second conductive layer away from the substrate, and the first conductive layer, the second conductive layer and the third conductive layer are insulated from each other; the third conductive layer includes a plurality of conductive pad groups; the conductive pad group includes a crystal oscillator conductive pad group, and the orthographic projection area of the crystal oscillator conductive pad group on the substrate is larger than the orthographic projection area of each other conductive pad group on the substrate; the crystal oscillator conductive pad group includes a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad, the first conductive pad is electrically connected to the first pin, the second conductive pad is electrically connected to the second pin, the third conductive pad is electrically connected to the third pin, and the fourth conductive pad is electrically connected to the fourth pin; the second conductive pad is also electrically connected to the ground wire.

[0028] In some embodiments of the present application, the conductive pad group further includes a first conductive pad group, and the first conductive pad group is located on a side of the third conductive pad away from the second conductive pad;

[0029] The first conductive pad group includes two conductive pads, one of the two conductive pads is electrically connected to the third conductive pad, and the other conductive pad is electrically connected to the ground line.

[0030] In some embodiments of the present application, the conductive pad group further includes a second conductive pad group and a third conductive pad group, the second conductive pad group is located on a side of the third conductive pad group away from the crystal oscillator conductive pad group; the orthographic projection of the second conductive pad group on the substrate overlaps with the orthographic projection of the power line on the substrate;

[0031] The second conductive pad group and the third conductive pad group each include two conductive pads, one of the conductive pads in the second conductive pad group is electrically connected to the power line, and the other conductive pad in the second conductive pad group is electrically connected to the fourth conductive pad;

[0032] One of the conducting pads in the third conducting pad group is electrically connected to the ground line, and another conducting pad in the second conducting pad group is electrically connected to the fourth conducting pad.

[0033] In some embodiments of the present application, the conductive pad group also includes a fourth conductive pad group, which is located on a side of the first conductive pad away from the second conductive pad. The fourth conductive pad group includes two conductive pads, one of the conductive pads in the fourth conductive pad group is electrically connected to the first conductive pad, and the other conductive pad in the fourth conductive pad group is electrically connected to the ground line.

[0034] In some embodiments of the present application, when the crystal oscillator module includes the passive crystal oscillator, the driving circuit includes a first capacitor, a second capacitor, and a first resistor, the first conductive pad group is electrically connected to the second capacitor, the third conductive pad group is electrically connected to the first resistor, and the fourth conductive pad group is electrically connected to the first capacitor;

[0035] In the case where the crystal oscillator module includes the active crystal oscillator, the driving circuit includes a third capacitor and a second resistor, the second conductive pad group is electrically connected to the second resistor, and the third conductive pad group is electrically connected to the third capacitor;

[0036] The third capacitor and the first resistor share the third conductive pad set, and the third conductive pad set is electrically connected to one of the third capacitor and the first resistor.

[0037] In some embodiments of the present application, the conductive pad group further includes a fifth conductive pad group, and the fifth conductive pad group is located on a side of the fourth conductive pad group away from the crystal oscillator conductive pad group;

[0038] The fifth conducting pad group includes two conducting pads, one of which is electrically connected to the fourth conducting pad, and the other is electrically connected to the ground line.

[0039] In some embodiments of the present application, when the crystal oscillator module includes the passive crystal oscillator, the driving circuit includes a first capacitor, a second capacitor, and a first resistor, the first conductive pad group is electrically connected to the second capacitor, the third conductive pad group is electrically connected to the first resistor, and the fourth conductive pad group is electrically connected to the first capacitor;

[0040] In the case where the crystal oscillator module includes the active crystal oscillator, the driving circuit includes a third capacitor and a second resistor, the second conductive pad group is electrically connected to the second resistor, and the fifth conductive pad group is electrically connected to the third capacitor.

[0041] In some embodiments of the present application, the circuit board further includes a first protective layer, the first protective layer is located between the third conductive layer and each component, and the first protective layer includes a plurality of openings;

[0042] In the case where the crystal oscillator module includes the passive crystal oscillator, an area defined by an orthographic projection of the outer contour of the opening on the substrate overlaps with the orthographic projections of the crystal oscillator conductive pad group, the first conductive pad group, the third conductive pad group, and the fourth conductive pad group on the substrate, respectively;

[0043] When the crystal oscillator module includes the active crystal oscillator, the area defined by the orthographic projection of the outer contour of the opening on the substrate overlaps with the orthographic projections of the crystal oscillator conductive pad group, the second conductive pad group, and the third conductive pad group on the substrate.

[0044] In some embodiments of the present application, the circuit board further includes a second protective layer, which is located on a side of the third conductive layer and each component away from the substrate;

[0045] In the case where the crystal oscillator module includes the passive crystal oscillator, the second protective layer covers the components and the second conductive pad group;

[0046] In the case where the crystal oscillator module includes the active crystal oscillator, the second protective layer covers the components, the first conductive pad group, and the fourth conductive pad group.

[0047] In some embodiments of the present application, the circuit board further includes a first protective layer, the first protective layer is located between the third conductive layer and each component, and the first protective layer includes a plurality of openings;

[0048] In the case where the crystal oscillator module includes the passive crystal oscillator, an area defined by an orthographic projection of the outer contour of the opening on the substrate overlaps with the orthographic projections of the crystal oscillator conductive pad group, the first conductive pad group, the third conductive pad group, and the fourth conductive pad group on the substrate, respectively;

[0049] When the crystal oscillator module includes the active crystal oscillator, the area defined by the orthographic projection of the outer contour of the opening on the substrate overlaps with the orthographic projections of the crystal oscillator conductive pad group, the second conductive pad group, and the fifth conductive pad group on the substrate.

[0050] In some embodiments of the present application, the circuit board further includes a second protective layer, which is located on a side of the third conductive layer and each component away from the substrate;

[0051] In the case where the crystal oscillator module includes the passive crystal oscillator, the second protective layer covers the components, the second conductive pad group and the fifth conductive pad group;

[0052] In the case where the crystal oscillator module includes the active crystal oscillator, the second protective layer covers the components, the first conductive pad group, the third conductive pad group, and the fourth conductive pad group.

[0053] In a second aspect, an embodiment of the present application provides a display device comprising the circuit board described in any one of the first aspects.

[0054] In a third aspect, an embodiment of the present application provides a method for preparing a circuit board, which is applied to prepare the circuit board as described in any one of the first aspects, the method comprising:

[0055] providing a substrate for the circuit board;

[0056] forming a first conductive layer located on one side of the substrate, comprising a power line;

[0057] forming a second conductive layer located on a side of the first conductive layer away from the substrate, comprising a ground line;

[0058] A third conductive layer is formed, located on a side of the second conductive layer away from the substrate, and includes a plurality of conductive pad groups; the conductive pad groups include a crystal oscillator conductive pad group, the orthographic projection area of the crystal oscillator conductive pad group on the substrate being larger than the orthographic projection areas of the other conductive pad groups on the substrate; the crystal oscillator conductive pad group includes a first conductive pad, a second conductive pad, a third conductive pad, and a fourth conductive pad, the first conductive pad being electrically connected to the first pin, the second conductive pad being electrically connected to the second pin, the third conductive pad being electrically connected to the third pin, and the fourth conductive pad being electrically connected to the fourth pin; the first conductive layer, the second conductive layer, and the third conductive layer are insulated from each other;

[0059] The components are electrically connected to the conductive pad groups.

[0060] An embodiment of the present application provides a circuit board, a preparation method thereof, and a display device. The circuit board includes a substrate and a driving circuit located on the substrate, the driving circuit including a crystal oscillator module, a signal input end, a signal output end, a power line, a ground line, and a switch module; the crystal oscillator module includes a first pin, a second pin, a third pin, and a fourth pin; the first pin is electrically connected to the signal input end, the second pin is electrically connected to the ground line, the third pin is electrically connected to the signal output end, and the fourth pin is electrically connected to the first end of the switch module; the crystal oscillator module includes one of an active crystal oscillator and a passive crystal oscillator; when the crystal oscillator module includes a passive crystal oscillator, the second end of the switch module is electrically connected to the ground line; when the crystal oscillator module includes an active crystal oscillator, the second end of the switch module is electrically connected to the power line; in this way, the driving circuit of the passive crystal oscillator and the driving circuit of the active crystal oscillator can be arranged on the same circuit board, reducing the design and preparation costs of the circuit board and increasing its application range. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0062] Figure 1 A circuit diagram of a passive crystal oscillator drive circuit in a related art provided in an embodiment of the present application;

[0063] Figure 2 A circuit diagram of an active crystal oscillator driving circuit in a related art provided in an embodiment of the present application;

[0064] Figure 3 A circuit diagram of a driving circuit provided in an embodiment of the present application;

[0065] Figure 4 A circuit diagram of a driving circuit provided in an embodiment of the present application, including a passive crystal oscillator;

[0066] Figure 5 A circuit diagram of a driving circuit provided in an embodiment of the present application, including an active crystal oscillator;

[0067] Figure 6 A schematic diagram of a top view of a circuit board before any components are installed, provided in an embodiment of the present application;

[0068] Figure 7 A schematic diagram of a top view of another circuit board before any components are installed, provided in an embodiment of the present application;

[0069] Figure 8 A flowchart of a method for preparing a circuit board provided in an embodiment of the present application;

[0070] Figure 9 For Figure 6 A schematic diagram of a top view of a passive crystal oscillator installed on a circuit board is shown;

[0071] Figure 10 For Figure 9 A schematic diagram of a top view of the circuit board after a second protective layer is provided;

[0072] Figure 11 For Figure 6 The schematic diagram of the top view of the circuit board with an active crystal oscillator is shown;

[0073] Figure 12 For Figure 11 A schematic diagram of a top view of the circuit board after a second protective layer is provided;

[0074] Figure 13 For Figure 7 The schematic diagram of the top view of the circuit board after the passive crystal oscillator and the first protective layer are set;

[0075] Figure 14 For Figure 7 The diagram shows a top view of the structure after an active crystal oscillator and a first protective layer are provided on the circuit board. DETAILED DESCRIPTION

[0076] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0077] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present application. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0078] In addition, it should be noted that when introducing elements of the present application and embodiments thereof, the articles "a", "an", "the" and "said" are intended to indicate the presence of one or more elements; unless otherwise specified, "plurality" means two or more; the terms "comprising", "including", "containing" and "having" are intended to be inclusive and indicate that there may be additional elements in addition to the listed elements; the terms "first", "second", "third", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance and formation order.

[0079] In this specification, "electrically connected" includes components connected together via an element having some electrical function. There are no particular limitations on the "element having some electrical function" as long as it enables the transfer of electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0080] The polygons in this specification are not in the strict sense, and may be approximate triangles, rectangles, trapezoids, pentagons or hexagons, etc. There may be some small deformations caused by tolerances, and there may be chamfers, rounded corners, arc edges and deformations.

[0081] With the diversification of foldable display technology, the demand for foldable display products to be used with styluses is increasing. Whether a display product supports stylus functionality is related to its circuit board. This circuit board includes the driver circuit for the stylus, and a crystal oscillator is an essential component of this driver circuit. Crystal oscillators come in two types: active and passive. Active and passive crystal oscillators differ in price and performance, and are used in different types of display devices.

[0082] In the related art, different circuit boards must be designed for driving circuits equipped with active crystal oscillators and passive crystal oscillators. This results in high design and manufacturing costs for the circuit boards, and the application range of the same circuit board in display devices is limited.

[0083] The embodiment of the present application provides an equivalent circuit diagram of a driving circuit of a passive crystal oscillator in the related art, with reference to Figure 1 As shown, the driving circuit includes: a passive crystal oscillator X1, a first capacitor C1, a second capacitor C2, a signal input terminal 101 and a signal output terminal 102.

[0084] The passive crystal oscillator X1 in the figure includes four pins, wherein pins 2 and 4 are grounded, pin 1 is an input pin, and pin 1 is electrically connected to the signal input terminal 101; pin 3 is an output pin, and pin 3 is electrically connected to the signal output terminal 102.

[0085] Pin 1 is electrically connected to the first capacitor C1, and pin 2 is electrically connected to the second capacitor C2. The first capacitor C1 and the second capacitor C2 jointly play a filtering role and can keep the frequency of the alternating voltage signal applied between the input pin and the output pin of the passive crystal oscillator X1 within a certain range.

[0086] The signal inputted by the signal input terminal 101 may be an alternating voltage signal of an external circuit. After the alternating voltage signal is inputted into the passive crystal oscillator X1 , the passive crystal oscillator X1 can generate a more stable resonant single-frequency signal, which is transmitted to the signal output terminal 102 through the output pin.

[0087] The signal input terminal 101 (XTAL / CLK_EN) and the signal output terminal 102 (XTAL / CLK_IN) are named for the passive crystal oscillator's driving circuit. Since the passive crystal oscillator X1 is a non-polar component with two valid pins, it needs the help of a clock circuit to generate an oscillation signal and cannot oscillate on its own. Therefore, the passive crystal oscillator's driving circuit needs to be provided with an interface with the clock circuit, which is called an external crystal oscillator interface (XTAL). Among them, the above-mentioned signal input terminal 101 (XTAL / CLK_EN) is electrically connected to the clock circuit to receive the constant signal (CLK signal) transmitted from the clock circuit, and the signal output terminal 102 (XTAL / CLK_IN) is electrically connected to the target application circuit of the passive crystal oscillator driving circuit. Exemplarily, the signal output terminal 102 (XTAL / CLK_IN) can be electrically connected to the driver chip of the display device. It should be noted that the passive crystal oscillator X1 is non-directional, and pins 1 and 3 can be interchanged.

[0088] The embodiment of the present application provides an equivalent circuit diagram of a driving circuit of an active crystal oscillator in the related art, referring to Figure 2 As shown, the driving circuit includes: an active crystal oscillator X2, a third capacitor C3, a signal input terminal 101, a signal output terminal 102 and a power line (CLK_VDD).

[0089] The active crystal oscillator X2 in the figure includes four pins, among which the input pin 1 (IN) is electrically connected to the signal input terminal 101, the ground pin 2 (GND) is grounded, the output pin 3 (OUT) is electrically connected to the signal output terminal 102, and the power pin 4 (VDD) is electrically connected to the power line 103.

[0090] The active crystal oscillator X2 is a complete resonant oscillator that requires power but does not require any other input signals to output a stable and high-quality oscillation signal. Figure 2 In the figure, since the active crystal oscillator X2 does not need to input other signals, the input pin 1 (IN) is also called the empty pin (Not Connected, NC), which does not affect the output of the active crystal oscillator X2 signal.

[0091] The existing passive crystal oscillator X1 and active crystal oscillator X2 have different driving circuits. When manufacturing circuit boards, corresponding circuit boards need to be manufactured separately. The two circuit boards are not compatible or shareable, and the design and preparation costs are high.

[0092] Based on this, an embodiment of the present application provides a circuit board, such as Figure 3 As shown, the circuit board includes a substrate and a driving circuit located on the substrate, and the driving circuit includes a crystal oscillator module X, a signal input terminal 101, a signal output terminal 102, a power line 103, a ground line 104 and a switch module S;

[0093] The crystal oscillator module X includes a first pin 1, a second pin 2, a third pin 3 and a fourth pin 4;

[0094] The first pin 1 is electrically connected to the signal input terminal 101, the second pin 2 is electrically connected to the ground line 104, the third pin 3 is electrically connected to the signal output terminal 102, and the fourth pin 4 is electrically connected to the first end of the switch module S;

[0095] The crystal oscillator module X includes one of an active crystal oscillator X2 and a passive crystal oscillator X1;

[0096] In the case where the crystal oscillator module X includes a passive crystal oscillator X1, the second end of the switch module S is electrically connected to the ground line 104;

[0097] When the crystal oscillator module X includes the active crystal oscillator X2 , the second end of the switch module S is electrically connected to the power line 103 .

[0098] In some embodiments, the substrate of the above-mentioned circuit board may be a flexible substrate. In this case, the circuit board may be a flexible printed circuit (FPC), wherein the material of the flexible substrate may include polyimide, methyl methacrylate, polycarbonate, etc.; in other embodiments, the substrate of the above-mentioned circuit board may be a rigid substrate, and the material of the rigid substrate may include glass or silicon material.

[0099] In an exemplary embodiment, the switch module S may include components with a switch function. For example, the switch module S may include any one of an electronic switch, a 0-ohm resistor, and a transistor.

[0100] In the circuit board provided in the embodiment of the present application, whether the crystal oscillator module X is electrically connected to the power line 103 (for example, the VDD line) is controlled by the switch module S. When the crystal oscillator module X includes an active crystal oscillator X2, and the active crystal oscillator X2 is electrically connected to the power line 103 through the switch module S, the drive circuit on the circuit board is an active drive circuit; when the crystal oscillator module X includes a passive crystal oscillator X1, and the passive crystal oscillator X1 is not electrically connected to the power line 103 through the switch module S, the drive circuit on the circuit board is a passive drive circuit.

[0101] The following describes two cases where the circuit board includes an active crystal oscillator X2 or a passive crystal oscillator X1:

[0102] First, when the driving circuit provided on the circuit board is a driving circuit of the passive crystal oscillator X1, the configuration on the circuit board is as follows:

[0103] When the crystal oscillator module X includes a passive crystal oscillator X1, the first pin 1 is electrically connected to the signal input terminal 101, and the signal input terminal 101 is electrically connected to the external circuit, so that the signal of the external circuit can be input; the second pin 2 is electrically connected to the ground wire 104, and the third pin 3 is electrically connected to the signal output terminal 102; the fourth pin 4 is electrically connected to the first end of the switch module S; and the second end of the switch module S is electrically connected to the ground wire 104.

[0104] Second, when the driving circuit provided on the circuit board is a driving circuit of the passive crystal oscillator X1, the configuration on the circuit board is as follows:

[0105] When the crystal oscillator module X includes an active crystal oscillator X2, the first pin 1 is electrically connected to the signal input terminal 101, and the signal input terminal 101 is disconnected from the external circuit; the second pin 2 is electrically connected to the ground line 104, and the third pin 3 is electrically connected to the signal output terminal 102; the fourth pin 4 is electrically connected to the first terminal of the switch module S; and the second terminal of the switch module S is electrically connected to the power line 103. In this case, the first pin 1 is not connected.

[0106] In an exemplary embodiment, the switch module S may include two parallel switching devices, wherein the first ends of the two switching devices are electrically connected to the fourth pin 4 of the crystal oscillator module X, the second end of one switching device is electrically connected to the ground line 104, and the second end of the other switching device is electrically connected to the power line 103.

[0107] Exemplarily, when the crystal oscillator module X includes a passive crystal oscillator X1, the first ends of the two switching devices are electrically connected to the fourth pin 4 of the crystal oscillator module X, the second end of one switching device is electrically connected to the ground line 104, and the second end of the other switching device is disconnected from the power line 103;

[0108] Exemplarily, when the crystal oscillator module X includes an active crystal oscillator X2, the first ends of the two switching devices are electrically connected to the fourth pin 4 of the crystal oscillator module X, the second end of one switching device is disconnected from the ground line 104, and the second end of the other switching device is electrically connected to the power line 103.

[0109] A circuit board provided in an embodiment of the present application includes a substrate and a drive circuit located on the substrate. The drive circuit includes a crystal oscillator module X, a signal input terminal 101, a signal output terminal 102, a power line 103, a ground line 104, and a switch module S. The crystal oscillator module X includes a first pin 1, a second pin 2, a third pin 3, and a fourth pin 4. The first pin 1 is electrically connected to the signal input terminal 101, the second pin 2 is electrically connected to the ground line 104, the third pin 3 is electrically connected to the signal output terminal 102, and the fourth pin 4 is electrically connected to a first end of the switch module S. The crystal oscillator module X includes either an active crystal oscillator X2 or a passive crystal oscillator X1. When the crystal oscillator module X includes the passive crystal oscillator X1, the second end of the switch module S is electrically connected to the ground line 104. When the crystal oscillator module X includes the active crystal oscillator X2, the second end of the switch module S is electrically connected to the power line 103. In this way, the drive circuit of the passive crystal oscillator and the drive circuit of the active crystal oscillator can be provided on the same circuit board, reducing the design and preparation costs of the circuit board and expanding its application range.

[0110] In some embodiments of the present application, when the crystal oscillator module X includes a passive crystal oscillator X1, the driving circuit further includes a first filtering module and a second filtering module;

[0111] The first filtering module is electrically connected to the first pin 101 , and the second filtering module is electrically connected to the third pin 102 .

[0112] The passive crystal oscillator X1 needs to work in a resonant state, and the voltage signal applied to both ends of the input pin and the output pin needs to be kept at a certain frequency. By setting the first filtering module and the second filtering module, the voltage signal applied to the two effective pins of the crystal oscillator module X (the first pin 101 and the third pin 102) can be kept within a certain range of frequency, thereby filtering out noise signals.

[0113] In an exemplary embodiment, the first filtering module and the second filtering module may respectively include a capacitor, wherein the above two capacitors can be called matching capacitors. In practical applications, the frequency of the alternating voltage signal in the input passive crystal oscillator X1 can be adjusted by adjusting the capacitance value of the matching capacitor.

[0114] In an embodiment of the present application, when the crystal oscillator module X includes a passive crystal oscillator X1, the driving circuit is provided to further include a first filtering module and a second filtering module; the first filtering module is electrically connected to the first pin 101, and the second filtering module is electrically connected to the third pin 102; in this way, a signal with a relatively stable frequency can be provided at both ends of the input pin and the output pin of the passive crystal oscillator X1, thereby achieving stable resonance of the passive crystal oscillator X1, thereby ensuring the normal operation of the driving circuit of the passive crystal oscillator X1 of the circuit board.

[0115] In some embodiments of the present application, the first filtering module includes a first capacitor C1, and the second filtering module includes a second capacitor C2;

[0116] A first end of the first capacitor C1 is electrically connected to the first pin 1 , and a second end of the first capacitor C2 is electrically connected to the ground line 104 (GND);

[0117] A first end of the second capacitor C2 is electrically connected to the third pin 3 , and a second end of the second capacitor C2 is electrically connected to the ground line 104 .

[0118] The capacitance values of the first capacitor C1 and the second capacitor C2 are not limited here, and can be specifically determined according to the resonant frequency of the passive crystal oscillator X1. For example, for a passive crystal oscillator X1 with a resonant frequency of 16 MHz, the capacitance value of the first capacitor can be set to 6-10 pF, for example, 8 pF; the capacitance value of the second capacitor can be set to 6-10 pF, for example, 8 pF.

[0119] Exemplarily, the capacitance values of the first capacitor C1 and the second capacitor C2 may be set to be the same.

[0120] The withstand voltage of the first capacitor C1 and the second capacitor C2 is not limited here and can be determined according to the design of the driving circuit. The maximum instantaneous voltage that can be withstood between the capacitor electrodes is called the withstand voltage of the capacitor.

[0121] For example, the withstand voltage of the first capacitor C1 may be in the range of 4-8V, such as 5V, 5.5V, 6V, 6.3V, 6.5V, 7V, 7.5V, 7.8V, or 8V.

[0122] For example, the withstand voltage of the second capacitor C2 may be in the range of 4-8V, such as 5V, 5.5V, 6V, 6.3V, 6.5V, 7V, 7.5V, 7.8V, or 8V.

[0123] In an embodiment of the present application, a first filtering module is provided including a first capacitor C1, and a second filtering module includes a second capacitor C2; a first end of the first capacitor C1 is electrically connected to the first pin 1, and a second end of the first capacitor C2 is electrically connected to the ground wire 104; a first end of the second capacitor C2 is electrically connected to the third pin 3, and a second end of the second capacitor C3 is electrically connected to the ground wire; in this way, a signal with a relatively stable frequency can be provided at both ends of the input pin and the output pin of the passive crystal oscillator X1, thereby achieving stable resonance of the passive crystal oscillator X1, thereby ensuring the normal operation of the driving circuit of the passive crystal oscillator X1 on the circuit board.

[0124] In some embodiments of the present application, when the crystal oscillator module X includes an active crystal oscillator X2, the driving circuit further includes a voltage stabilizing module, which is electrically connected to the power line 103 through the switch module S; the voltage stabilizing module is configured to stabilize the voltage of the input signal of the power line 103.

[0125] The active crystal oscillator X2 needs to work in a powered state. In order to prevent the voltage fluctuation of the input signal of the power line 103 from affecting the active crystal oscillator X2, a voltage stabilizing module is provided to be electrically connected to the power line 103 through the switch module S.

[0126] When the voltage of the signal input by the power line 103 is higher than the voltage required by the active crystal oscillator X2, the voltage stabilizing module stores excess electricity to keep the voltage of the active crystal oscillator X2 unchanged; when the voltage of the signal input by the power line 103 is lower than the voltage required by the active crystal oscillator X2, the voltage stabilizing module releases electricity to the active crystal oscillator X2; this can prevent the voltage of the active crystal oscillator X2 from changing to a certain extent with the fluctuation of the voltage of the signal input by the power line 103.

[0127] For example, the voltage stabilization module may include a capacitor, and the capacitor is used to stabilize the voltage of the input signal of the power line 103 .

[0128] In the embodiment of the present application, when the crystal oscillator module X includes the active crystal oscillator X2, the driving circuit is configured to also include a voltage stabilizing module, and the voltage stabilizing module is electrically connected to the power line 103 through the switch module S; the voltage stabilizing module is configured to stabilize the voltage of the input signal of the power line 103; in this way, a relatively stable power supply signal can be provided to the active crystal oscillator X2, thereby achieving stable operation of the active crystal oscillator X2.

[0129] In some embodiments of the present application, the voltage stabilizing module includes a third capacitor C3 ; a first end of the third capacitor C3 is electrically connected to a first end of the switch module S, and a second end of the third capacitor C3 is electrically connected to the ground line 104 .

[0130] When the voltage of the input signal of the power line 103 is higher than the voltage required by the active crystal oscillator X2, the power line 103 charges the third capacitor C3 to keep the voltage of the active crystal oscillator X2 stable; when the voltage of the input signal of the power line 103 is lower than the voltage required by the active crystal oscillator X2, the third capacitor C3 discharges to the active crystal oscillator X2; this can make the voltage of the active crystal oscillator X2 not change with the fluctuation of the voltage of the input signal of the power line 103 to a certain extent.

[0131] The withstand voltage and capacitance of the third capacitor C3 are not limited here.

[0132] For example, the capacitance value of the third capacitor C3 may be in the range of 0.05-0.2 μF, for example, 0.08 μF, 0.1 μF, 0.15 μF, or 0.18 μF.

[0133] The withstand voltage of the third capacitor C2 can be in the range of 4-8V, for example, 5V, 5.5V, 6V, 6.3V, 6.5V, 7V, 7.5V, 7.8V, and 8V. In the embodiment of the present application, a voltage stabilization module is provided including a third capacitor C3; a first end of the third capacitor C3 is electrically connected to the fourth pin 103, and a second end of the third capacitor C3 is electrically connected to the ground line 104; the third capacitor C3 provides a relatively stable power supply signal to the active crystal oscillator X2, thereby achieving stable operation of the active crystal oscillator X2.

[0134] In some embodiments of the present application, Figure 5 As shown, in the case where the crystal oscillator module X includes a passive crystal oscillator X1, the switch module S includes a first resistor R1; a first end of the first resistor R1 is electrically connected to the fourth pin 4, and a second end of the first resistor R1 is electrically connected to the ground line 104;

[0135] like Figure 4 As shown, in the case where the crystal oscillator module X includes an active crystal oscillator X2, the switch module S includes a second resistor R2; a first end of the second resistor R2 is electrically connected to the fourth pin 4, and a second end of the second resistor R2 is electrically connected to the power line 103;

[0136] In an exemplary embodiment, when the crystal oscillator module X includes a passive crystal oscillator X1, the fourth pin 4 is electrically connected to the ground line 104 through the first resistor R1, and the second resistor R2 is disconnected; when the crystal oscillator module X includes an active crystal oscillator X2, the fourth pin 4 is electrically connected to the power line 103 through the second resistor R2, and the first resistor R1 is disconnected.

[0137] In practical applications, the first resistor R1 may be disconnected from electrical connection by not welding it, and the second resistor R2 may be disconnected from electrical connection by not welding it.

[0138] In some embodiments of the present application, the first resistor includes a 0-ohm resistor, and the second resistor includes a 0-ohm resistor.

[0139] Among them, the 0 ohm resistor does not mean that the resistance value is 0. The 0 ohm resistor is actually a resistor with a very small resistance value. The 0 ohm resistor can control the conduction or disconnection between the driving circuit on the circuit board and the power line (such as the VDD line), thereby helping to set the driving circuit on the circuit board to the driving circuit of the active crystal oscillator X2 or the driving circuit of the passive crystal oscillator X1, so that the driving circuit of the active crystal oscillator X2 or the driving circuit of the passive crystal oscillator X1 can be set on the same circuit board, reducing the design and preparation cost of the circuit board and increasing its application range.

[0140] In some embodiments of the present application, Figure 6 or Figure 7 As shown, the circuit board also includes:

[0141] The first conductive layer D1 is located on one side of the substrate and includes a power line 103;

[0142] The second conductive layer D2 is located on a side of the first conductive layer D1 away from the substrate and includes a ground line 104;

[0143] The third conductive layer D3 is located on the side of the second conductive layer D2 away from the substrate, and is insulated between the first conductive layer D1, the second conductive layer D2 and the third conductive layer D3; the third conductive layer D3 includes multiple conductive pad groups; the conductive pad group includes a crystal oscillator conductive pad group, and the orthographic projection area of the crystal oscillator conductive pad group on the substrate is larger than the orthographic projection area of each other conductive pad group on the substrate; the crystal oscillator conductive pad group includes a first conductive pad S1, a second conductive pad S2, a third conductive pad S3 and a fourth conductive pad S4, the first conductive pad S1 is electrically connected to the first pin 1, the second conductive pad S2 is electrically connected to the second pin 2, the third conductive pad S3 is electrically connected to the third pin 3, and the fourth conductive pad S4 is electrically connected to the fourth pin 4; the second conductive pad S2 is also electrically connected to the ground line 104.

[0144] It should be noted that in Figure 6 and Figure 7 In the figure, only part of the ground line 104 is drawn. The other segments of the ground line 104 can be determined according to the design of the wiring in the circuit board and are not limited here. Figure 6 and Figure 7 In order to clearly show the electrical connection relationship between the conductive pad groups, the crystal oscillator module X and other components are not drawn.

[0145] The materials of the first conductive layer D1 , the second conductive layer D2 and the third conductive layer D3 are not limited here.

[0146] Illustratively, the materials of the first conductive layer D1 , the second conductive layer D2 , and the third conductive layer D3 may all include metal, for example, at least one of aluminum, copper, molybdenum, titanium, and tin.

[0147] For example, the conductive pad includes a pad that can be electrically connected to the pins of the component. The process of connecting the pins of the component to the pad is called mounting, or SMT (Surface Mount Technology). The specific process of mounting can be referred to in the relevant art and will not be repeated here.

[0148] The first conductive layer D1, the second conductive layer D2 and the third conductive layer D3 can be electrically connected through vias. For example, the circles in the conductive pads in the figure represent vias. For example, the conductive pad S32 is electrically connected to the power line 103 through the via, and the conductive pad S12 is electrically connected to the ground line 104 through the via.

[0149] In other embodiments, the positions of the first conductive layer D1 and the second conductive layer D2 can be interchanged. For example, the first conductive layer D1 can also be located on the side of the second conductive layer D2 away from the substrate. In this case, the position of the via needs to be appropriately adjusted to ensure that the conductive pad is matched with the corresponding trace.

[0150] In the third conductive layer D3 , one conductive pad group is electrically connected to one component, and one conductive pad group may include multiple conductive pads.

[0151] It should be noted that if Figure 6 or Figure 7 As shown, the third conductive layer D3 also includes multiple connecting traces, and the conductive pad groups can be electrically connected through the connecting traces located in the third conductive layer D3; of course, in other embodiments, the conductive pad groups can also be electrically connected together by designing vias, which can be determined according to the design space of the circuit board.

[0152] The crystal oscillator conductive pad group includes four conductive pads, and the arrangement shape of the four conductive pads is determined according to the shape of the crystal oscillator module X. For example, for a rectangular crystal oscillator module X, the orthographic projections of the four conductive pads in the crystal oscillator conductive pad group on the substrate are all located within the orthographic projection of the crystal oscillator module X on the substrate.

[0153] The arrangement positions of the four conductive pads included in the above-mentioned crystal oscillator conductive pad group can be arranged according to the positions of the pins of the crystal oscillator module X. For example, the first conductive pad S1, the second conductive pad S2, the third conductive pad S3 and the fourth conductive pad S4 can be arranged in a counterclockwise direction, or the first conductive pad S1, the second conductive pad S2, the third conductive pad S3 and the fourth conductive pad S4 can be arranged in a clockwise direction.

[0154] Since the orthographic projection area of the crystal oscillator module X on the substrate is larger than the orthographic projection area of other components on the substrate, the orthographic projection area of the crystal oscillator conductive pad group on the substrate is larger than the orthographic projection area of other conductive pad groups on the substrate. Therefore, the other conductive pad groups on the circuit board can be arranged around the crystal oscillator conductive pad group to save layout space as much as possible.

[0155] The shapes of the four conductive pads of the crystal oscillator conductive pad group are determined according to the specific process and the shape of the pins of the crystal oscillator module X, including but not limited to rectangles; the areas of the four conductive pads of the crystal oscillator conductive pad group are determined according to the specific process and the area of the pins of the crystal oscillator module X, and the embodiments of the present application do not make specific limitations on this.

[0156] In an exemplary embodiment, the conductive pad may include a pad.

[0157] In addition, the circuit board also includes a lead of the signal input terminal 101 and a lead of the signal output terminal 102. The embodiment of the present application does not specifically limit the position of the conductive layer where the lead of the signal input terminal 101 and the lead of the signal output terminal 102 are located. For example, Figure 6 Schematic diagram showing a signal output terminal 102 having a lead wire located on the third conductive layer D3;

[0158] In some embodiments, the leads of the signal input terminal 101 and the leads of the signal output terminal 102 may be located in the third conductive layer D3, or, in other embodiments, the leads of the signal input terminal 101 and the leads of the signal output terminal 102 may be located in the first conductive layer D1, or, in yet other embodiments, the leads of the signal input terminal 101 and the leads of the signal output terminal 102 may be located in the second conductive layer D2.

[0159] The lead of the signal input line 101 is electrically connected to the first conductive pad S1 , and the lead of the signal output end 102 is electrically connected to the third conductive pad S3 .

[0160] In an embodiment of the present application, the crystal oscillator conductive pad group can be electrically connected to the passive crystal oscillator X1, and can also be electrically connected to the active crystal oscillator X2, so that the same circuit board can be compatible with the driving circuits of the active crystal oscillator X2 and the passive crystal oscillator X1, thereby reducing the cost of selecting the driving circuit boards of the active crystal oscillator X2 and the passive crystal oscillator X1, and can better meet the display products' requirements for driving circuit boards with different performance and prices.

[0161] In some embodiments of the present application, the conductive pad group further includes a first conductive pad group G1 , and the first conductive pad group G1 is located on a side of the third conductive pad S3 away from the second conductive pad S2 ;

[0162] The first conducting pad group G1 includes two conducting pads, one of the two conducting pads (eg, conducting pad S11 ) is electrically connected to the third conducting pad S3 , and the other conducting pad (eg, conducting pad S12 ) is electrically connected to the ground line 104 .

[0163] Since the conductive pad S11 in the first conductive pad group is electrically connected to the third conductive pad S3 , the first conductive pad group is located near the third conductive pad S3 , which can reduce the design space of the circuit board and thus reduce the size of the circuit board.

[0164] Illustratively, the first conductive pad group G1 may be located on a side of the third conductive pad S3 away from the second conductive pad S2 ; or, the first conductive pad group G1 may be located on a side of the third conductive pad S3 away from the fourth conductive pad S4 .

[0165] The conductive pad S12 is electrically connected to the ground wire 104. A via can be set in the insulating layer at the conductive pad S12 to electrically connect it to the ground wire 104 located in the second conductive layer D2. Alternatively, a via can be set at other positions to electrically connect it to the ground wire 104 located in the second conductive layer D2. The conductive pad S12 is electrically connected to the ground wire 104 through connecting traces and vias.

[0166] The minimum distance between the first conductive pad group G1 and the crystal oscillator conductive pad group can be determined according to the process. For example, the minimum distance between the first conductive pad group G1 and the crystal oscillator conductive pad group can be in the range of 0.2-0.5mm, and for example, the minimum distance value can be 0.4mm. The minimum distance between the conductive pad S11 and the conductive pad S12 of the first conductive pad group G1 can be determined according to the process. For example, the minimum distance between the conductive pad S11 and the conductive pad S12 can be in the range of 0.1-0.3mm, and for example, the minimum distance value can be 0.2mm. The minimum distance between any two of the second conductive pad group G2, the third conductive pad group G3, the fourth conductive pad group G4, and the fifth conductive pad group G5, as well as the minimum distance between two adjacent conductive pads in the same conductive pad group, are similar to the above-mentioned cases and will not be described in detail later.

[0167] When the crystal oscillator module X includes a passive crystal oscillator X1, the first conductive pad group G1 is electrically connected to the second capacitor C2. When the crystal oscillator module X includes an active crystal oscillator X2, the first conductive pad group G1 is not electrically connected to the second capacitor C2. This allows the same circuit board to be compatible with the drive circuits of the active crystal oscillator X2 and the passive crystal oscillator X1, thereby reducing the area of the circuit board and lowering the cost of the circuit board.

[0168] In some embodiments of the present application, Figure 6 and Figure 7 As shown, the conductive pad group further includes a second conductive pad group G2 and a third conductive pad group G3. The second conductive pad group G2 is located on a side of the third conductive pad group G3 away from the crystal oscillator conductive pad group. The orthographic projection of the second conductive pad group G2 on the substrate overlaps with the orthographic projection of the power line 103 on the substrate.

[0169] The second conductive pad group G2 and the third conductive pad group G3 each include two conductive pads, one conductive pad (e.g., conductive pad S22) in the second conductive pad group G2 is electrically connected to the power line 103, and the other conductive pad (e.g., conductive pad S21) in the second conductive pad group G2 is electrically connected to the fourth conductive pad S4;

[0170] One conducting pad (eg, conducting pad S32 ) in the third conducting pad group G3 is electrically connected to the ground line 104 , and another conducting pad (eg, conducting pad S31 ) in the second conducting pad group G2 is electrically connected to the fourth conducting pad S4 .

[0171] In an exemplary embodiment, since the conductive pad S21 in the second conductive pad group G2 is electrically connected to the fourth conductive pad S4, the second conductive pad group G2 can be positioned near the fourth conductive pad S4 of the crystal oscillator conductive pad group. This reduces the design space of the circuit board. Specifically, the second conductive pad group G2 can be positioned on a side of the fourth conductive pad S4 that is away from the third conductive pad S3; alternatively, the second conductive pad group G2 can be positioned on a side of the fourth conductive pad S4 that is away from the first conductive pad S1.

[0172] In addition, considering that the conductive pad S22 in the second conductive pad group G2 is electrically connected to the power line 103, in order to take into account the design positions of the two conductive pads in the second conductive pad group G2 and to reasonably utilize the design space of each conductive pattern as much as possible, the second conductive pad group G2 is arranged on a side of the third conductive pad group G3 away from the crystal oscillator conductive pad group; the orthographic projection of the second conductive pad group G2 on the substrate overlaps with the orthographic projection of the power line 103 on the substrate.

[0173] It should be noted that the above-mentioned overlap means at least partial overlap.

[0174] like Figure 6 or Figure 7 As shown in FIG. 1 , the circle drawn at the location of the conductive pad S22 represents the via hole Via located between the conductive pad S22 and the power line 103 .

[0175] Since the conductive pad S21 in the second conductive pad group G2 and the conductive pad S31 in the third conductive pad group G3 are both electrically connected to the fourth conductive pad S4, as shown in FIG. Figure 6 and Figure 7 As shown, the conducting pad S21 can be electrically connected to the fourth conducting pad S4 through the conducting pad S31.

[0176] In the case where the circuit board does not include the fifth conductive pad group G5, as shown in FIG. Figure 7 As shown, the conductive pad S32 in the third conductive pad group G3 is electrically connected to the ground line 104 through the ground via Via-GND; in the case where the circuit board includes the fifth conductive pad group G5, as shown Figure 6 As shown, the conducting pad S32 in the third conducting pad group G3 is electrically connected to the ground line 104 through the conducting pad S52 in the fifth conducting pad group G5 .

[0177] It should be noted again that in the top view of the circuit board provided in the embodiment of the present application, only part of the line segments of the ground line 104 are drawn, and the remaining line segments can be arranged according to actual conditions and are not limited here. Figure 7 In the embodiment, the orthographic projection of the ground via hole Via-GND on the substrate may be arranged to overlap with the orthographic projection of the ground line 104 on the substrate; for example, in Figure 6In the embodiment, the orthographic projection of the conductive pad S52 in the fifth conductive pad group G5 on the substrate may be arranged to overlap with the orthographic projection of the ground line 104 on the substrate.

[0178] In the embodiment of the present application, when the crystal oscillator module X includes a passive crystal oscillator X1, the second conductive pad group G2 is not electrically connected to the second resistor R2, and the third conductive pad group G3 is electrically connected to the first resistor R1; when the crystal oscillator module X includes an active crystal oscillator X2, the second conductive pad group G2 is electrically connected to the second resistor R2, and the third conductive pad group G3 is not electrically connected to the first resistor R1. This allows the same circuit board to be compatible with the driving circuits of the active crystal oscillator X2 and the passive crystal oscillator X1, thereby reducing the area of the circuit board and lowering the cost of the circuit board.

[0179] In some embodiments of the present application, Figure 6 or Figure 7 As shown, the conductive pad group also includes a fourth conductive pad group G4, which is located on a side of the first conductive pad S1 away from the second conductive pad S2. The fourth conductive pad group G4 includes two conductive pads, one conductive pad in the fourth conductive pad group G4 (for example, conductive pad S41) is electrically connected to the first conductive pad S1, and the other conductive pad in the fourth conductive pad group G4 (for example, conductive pad S42) is electrically connected to the ground line 104.

[0180] It should be noted that the conductive pads in the fourth conductive pad group G4 (eg, conductive pad S42) can be electrically connected to the ground line 104 through vias (at the positions marked with circles on the conductive pad S42). Figure 6 or Figure 7 The two different circuit board designs (circuit board substrates) shown here illustrate the electrical connections between the conductive pads and components when the driver circuit is set up on the circuit board:

[0181] The first one: Figure 7 Take the circuit board structure shown as an example:

[0182] In some embodiments of the present application, Figure 13 As shown, in the case where the crystal oscillator module X includes a passive crystal oscillator X1, the crystal oscillator conductive pad group is electrically connected to the passive crystal oscillator X1, the driving circuit includes a first capacitor C1, a second capacitor C2 and a first resistor R1, the first conductive pad group G1 is electrically connected to the second capacitor C2, the third conductive pad group G3 is electrically connected to the first resistor R1, and the fourth conductive pad group G4 is electrically connected to the first capacitor C1;

[0183] In the case where the crystal oscillator module X includes an active crystal oscillator X2, as Figure 14 As shown, the crystal oscillator conductive pad group is electrically connected to the active crystal oscillator X2, the driving circuit further includes a third capacitor C3 and a second resistor R2, the second conductive pad group G2 is electrically connected to the second resistor R2, and the third conductive pad group G3 is electrically connected to the third capacitor C3;

[0184] The third capacitor C3 in the active crystal oscillator X2 driving circuit and the first resistor R1 in the passive crystal oscillator X1 driving circuit share the third conductive pad group G3 , and the third conductive pad group G3 is electrically connected to one of the third capacitor C3 or the first resistor R1 .

[0185] in, Figure 13 For Figure 7 A top view of the circuit board after components in the driving circuit of the passive crystal oscillator X1 are arranged; Figure 14 For Figure 7 The circuit board shown is a top view of the structure after the components in the driving circuit of the active crystal oscillator X2 are arranged.

[0186] It should be noted that before setting up the components of the drive circuit, Figure 6 He Ru Figure 7 The structure of the circuit board shown can be called a circuit base plate. It can be understood that Figure 13 The circuit board of the passive crystal oscillator X1 driver circuit is set as shown in Figure 14 The circuit board with the active crystal oscillator X2 driving circuit shown in FIG can share the same Figure 7 The circuit board shown in .

[0187] When the crystal oscillator module X includes a passive crystal oscillator X1, the specific circuit and electrical connection method of the driving circuit of the passive crystal oscillator X1 can be referred to the description in the previous text; when the crystal oscillator module X includes an active crystal oscillator X2, the specific circuit and electrical connection method of the driving circuit of the active crystal oscillator X2 can be referred to the description in the previous text, and no further details will be given here.

[0188] In the circuit board provided in the embodiment of the present application, by sharing the third conductive pad group G3 with the third capacitor C3 in the active crystal oscillator X2 drive circuit and the first resistor R1 in the passive crystal oscillator X1 drive circuit, one less conductive pad group can be designed, which greatly reduces the design space of the circuit board and thus reduces the design size of the circuit board.

[0189] The second type: Figure 6 Take the structure of the circuit board shown as an example:

[0190] In some embodiments of the present application, Figure 6 As shown, the conductive pad group further includes a fifth conductive pad group G5, and the fifth conductive pad group G5 is located on a side of the fourth conductive pad group G4 away from the crystal oscillator conductive pad group;

[0191] The fifth conducting pad group G5 includes two conducting pads, one of which (eg, the conducting pad S51 ) is electrically connected to the fourth conducting pad S4 , and the other (eg, the conducting pad S52 ) is electrically connected to the ground line 104 .

[0192] It should be noted that, in actual applications, the location of the fifth conductive pad group G5 can be adjusted based on the areas where the second conductive pad group G2, the third conductive pad group G3, and the fourth conductive pad group G4 are located to rationally utilize space. For example, the fifth conductive pad group G5 can also be located on a side of the fourth conductive pad S4 away from the first conductive pad S1.

[0193] like Figure 6 As shown, the conducting pad S52 in the fifth conducting pad group G5 can be electrically connected to the ground line 104 through the via Via-GND.

[0194] In some embodiments of the present application, Figure 9 As shown, in the case where the crystal oscillator module X includes a passive crystal oscillator X1, the crystal oscillator conductive pad group is electrically connected to the passive crystal oscillator X1, the driving circuit further includes a first capacitor C1, a second capacitor C2 and a first resistor R1, the first conductive pad group G1 is electrically connected to the second capacitor C2, the third conductive pad group G3 is electrically connected to the first resistor R1, and the fourth conductive pad group G4 is electrically connected to the first capacitor C1; Figure 9 The circuit board shown is Figure 6 The top view of the circuit board after the components of the passive crystal oscillator X1 driving circuit are set;

[0195] In the case where the crystal oscillator module X includes an active crystal oscillator X2, as Figure 10 As shown, the crystal oscillator conductive pad group is electrically connected to the active crystal oscillator X2, the driving circuit further includes a third capacitor C3 and a second resistor R2, the second conductive pad group G2 is electrically connected to the second resistor R2, and the fifth conductive pad group G5 is electrically connected to the third capacitor C3. Figure 10 The circuit board shown is Figure 6 The circuit board shown is a top view of the structure after the components of the active crystal oscillator X2 driving circuit are arranged on it.

[0196] like Figure 9 The circuit board of the passive crystal oscillator X1 driver circuit is set as shown in Figure 10 The circuit board with the active crystal oscillator X2 driving circuit shown in FIG can share the same Figure 6 In this way, the driving circuit of the passive crystal oscillator X1 and the driving circuit of the active crystal oscillator X2 can be arranged on the same circuit board, which reduces the design and preparation costs of the circuit board and increases its application range.

[0197] For Figure 7 In some embodiments of the present application, the fifth conductive pad group G5 is not provided on the circuit board. Figure 13 and Figure 14As shown, the circuit board further includes a first protective layer B1, which is located between the third conductive layer D3 and the components, and includes a plurality of openings (not marked);

[0198] like Figure 13 As shown, in the case where the crystal oscillator module X includes the passive crystal oscillator X1, the area defined by the orthographic projection of the outer contour of the opening on the substrate overlaps with the orthographic projections of the crystal oscillator conductive pad group, the first conductive pad group G1, the third conductive pad group G3, and the fourth conductive pad group G4 on the substrate respectively; in this way, each opening exposes the crystal oscillator conductive pad group (electrically connected to the passive crystal oscillator X1), the first conductive pad group G1 (electrically connected to the second capacitor C2), the third conductive pad group G3 (electrically connected to the first resistor R1), and the fourth conductive pad group G4 (electrically connected to the first capacitor C1); this facilitates the electrical connection of the crystal oscillator conductive pad group, the first conductive pad group G1, the third conductive pad group G3, and the fourth conductive pad group G4 to their corresponding components, respectively.

[0199] like Figure 14 As shown, when the crystal oscillator module X includes an active crystal oscillator X2, the areas defined by the orthographic projections of the opening's outer contours on the substrate overlap with the orthographic projections of the crystal oscillator conductive pad group, the second conductive pad group G2, and the third conductive pad group G3 on the substrate. This allows each opening to expose the crystal oscillator conductive pad group (electrically connected to the active crystal oscillator X2), the second conductive pad group G2 (electrically connected to the second resistor R2), and the third conductive pad group G3 (electrically connected to the third capacitor C3).

[0200] The material of the first protective layer B1 includes a solder resist insulating protective material. Specifically, the material of the first protective layer includes solder resist ink (Photo Solder Resist, PSR). The first protective layer is also called a PSR layer.

[0201] In actual applications, the first protective layer B1 is formed before the components are mounted (before soldering). Multiple openings in the first protective layer B1 expose the corresponding conductive pad groups for electrical connection with the components. The first protective layer B1 can protect the components and wires in the circuit board. In this way, the reliability risk of the circuit board is low.

[0202] For Figure 7 In the circuit board without the fifth conductive pad group G5, in some embodiments of the present application, the circuit board further includes a second protective layer B2, which is located on the side of the third conductive layer D3 and the components away from the substrate. It can be understood that the second protective layer B2 is formed after the components are mounted; at this time, the second protective layer B2 can cover the components and the conductive pattern.

[0203] In the case where the crystal oscillator module X includes the passive crystal oscillator X1, no components are provided on the second conductive pad G2, and the second protective layer B2 covers the components and the second conductive pad group G2;

[0204] When the crystal oscillator module X includes the active crystal oscillator X2 , no components are provided on the first conductive pad group G1 and the fourth conductive pad group G4 , and the second protective layer B2 covers the components, the first conductive pad group G1 and the fourth conductive pad group G4 .

[0205] In an exemplary embodiment, the material of the second protective layer B2 may be resin or adhesive.

[0206] Illustratively, the material of the second protective layer B2 includes insulating sealant. The use of insulating sealant can prevent water vapor, gas, etc. from corroding the circuit board to a certain extent.

[0207] The second protection layer B2 focuses on protecting the exposed conductive pads that are not electrically connected to any components.

[0208] When the thickness of the second protective layer B2 is relatively thin, due to the influence of the protruding components on the leveling property of the material of the second protective layer B2, the material of the second protective layer B2 may aggregate (for example, insulating sealant aggregates), which will reduce the protective effect. Therefore, in actual applications, the second protective layer B2 may include two sub-layers, and the two sub-layers are prepared in two steps (i.e., two coatings). In this way, it can be ensured that the conductive pads that have not been punched are completely covered, thereby improving the reliability of the circuit board.

[0209] It should be noted that for Figure 7 For a circuit board without the fifth conductive pad group G5, only the first protective layer B1 may be provided; or only the second protective layer B2 may be provided; or both the first protective layer B1 and the second protective layer B2 may be provided, which can be determined according to the requirements of the use environment of the circuit board.

[0210] In the circuit board provided in the embodiment of the present application, by providing the first protective layer B1 or the second protective layer B2, various components and conductive patterns in the circuit board can be protected, thereby improving the reliability of the circuit board and extending the service life of the circuit board.

[0211] For Figure 6 In some embodiments of the present application, the circuit board further includes a first protective layer B1, which is located between the third conductive layer D3 and each component, and includes a plurality of openings; the embodiments of the present application do not provide a circuit board based on the fifth conductive pad group G5. Figure 6 The top view of the circuit board after the first protective layer B1 is set is shown in the figure. The position relationship of the film layers here can be referenced as shown in the figure. Figure 13 or Figure 14The top view of the structure is shown.

[0212] When the crystal oscillator module X includes a passive crystal oscillator X1, the area defined by the orthographic projection of the outer contour of the opening on the substrate overlaps with the orthographic projections of the crystal oscillator conductive pad group, the first conductive pad group G1, the third conductive pad group G3, and the fourth conductive pad group G4 on the substrate. In this way, each opening exposes the crystal oscillator conductive pad group (electrically connected to the passive crystal oscillator X1), the first conductive pad group G1 (electrically connected to the second capacitor C2), the third conductive pad group G3 (electrically connected to the first resistor R1), and the fourth conductive pad group G4 (electrically connected to the first capacitor C1), thereby facilitating electrical connection of the crystal oscillator conductive pad group, the first conductive pad group G1, the third conductive pad group G3, and the fourth conductive pad group G4 to their corresponding components.

[0213] When the crystal oscillator module X includes an active crystal oscillator X2, the areas defined by the orthographic projections of the opening's outer contours on the substrate overlap with the orthographic projections of the crystal oscillator conductive pad group, the second conductive pad group G2, and the fifth conductive pad group G5 on the substrate. This allows each opening to expose the crystal oscillator conductive pad group (electrically connected to the active crystal oscillator X2), the second conductive pad group G2 (electrically connected to the second resistor R2), and the fifth conductive pad group G5 (electrically connected to the third capacitor C3). This facilitates electrical connection of the crystal oscillator conductive pad group, the second conductive pad group G2, and the fifth conductive pad group G5 to their corresponding components.

[0214] For Figure 6 A circuit board having a fifth conductive pad group G5 is provided in some embodiments of the present application, such as Figure 10 and Figure 12 As shown, the circuit board further includes a second protective layer B2, which is located on the side of the third conductive layer D3 and the components away from the substrate. It can be understood that the second protective layer B2 is formed after the components are mounted. At this time, the second protective layer B2 can cover the components and the conductive pattern.

[0215] like Figure 10 As shown, in the case where the crystal oscillator module X includes a passive crystal oscillator X1, the second protective layer B2 covers the components, the second conductive pad group G2 and the fifth conductive pad group G5;

[0216] like Figure 12 As shown, when the crystal oscillator module X includes an active crystal oscillator X2 , the second protection layer B2 covers various components, the first conductive pad group G1 , the third conductive pad group G3 and the fourth conductive pad group G4 .

[0217] In an exemplary embodiment, the material of the second protective layer B2 may be resin or adhesive.

[0218] Illustratively, the material of the second protective layer B2 includes insulating sealant. The use of insulating sealant can prevent water vapor, gas, etc. from corroding the circuit board to a certain extent.

[0219] The second protection layer B2 focuses on protecting the exposed conductive pads that are not electrically connected to any components.

[0220] When the thickness of the second protective layer B2 is relatively thin, due to the influence of the protruding components on the leveling property of the material of the second protective layer B2, the material of the second protective layer B2 may aggregate (for example, insulating sealant aggregates), which will reduce the protective effect. Therefore, in actual applications, the second protective layer B2 may include two sub-layers, and the two sub-layers are prepared in two steps (i.e., two coatings). In this way, it can be ensured that the conductive pads that have not been punched are completely covered, thereby improving the reliability of the circuit board.

[0221] It should be noted that for Figure 6 The circuit board provided with the fifth conductive pad group G5 may be provided with only the first protective layer B1; or, may be provided with only the second protective layer B2; or, may be provided with both the first protective layer B1 and the second protective layer B2, which may be determined according to the requirements of the use environment of the circuit board.

[0222] In the circuit board provided in the embodiment of the present application, Figure 6 and Figure 7 As shown, the second conductive layer D2 also includes multiple marking pattern groups, and except for the crystal oscillator conductive pad group, each of the other conductive pad groups is provided with a marking pattern group on the periphery. Taking the first conductive pad group G1 as an example, the outer sides of the two conductive pads of the first conductive pad group G1 are provided with a marking pattern M1 and a marking pattern M2 respectively. It should be noted that Figure 6 and Figure 7 The shapes of the marking pattern M1 and the marking pattern M2 are merely exemplary shapes. The specific shapes of the marking patterns are not limited here and can be adjusted according to the design space.

[0223] Of course, the circuit board may also include other structures and components. Here, only the structures and components related to the invention are introduced. For other structures and components included, please refer to the introduction in the relevant technology.

[0224] An embodiment of the present application provides a display device, comprising the circuit board as described above.

[0225] In an exemplary embodiment, the display device includes a circuit board and a display panel.

[0226] The display device provided in the embodiments of the present application may be an OLED (Organic Light Emitting Diode) display device, wherein the OLED display device may include a glass-based OLED display device and a silicon-based OLED display device. Of course, the display device may also be an LCD (Liquid Crystal Display) display device.

[0227] In addition, the display device can be a display device such as a monitor, as well as any product or component with a display function such as a television, a digital camera, a mobile phone, a tablet computer, etc. that includes these display devices.

[0228] An embodiment of the present application provides a display device, comprising a circuit board, the circuit board including a drive circuit, the drive circuit including a crystal oscillator module X, a signal input terminal 101, a signal output terminal 102, a power line 103, a ground line 104, and a switch module S. The crystal oscillator module X includes a first pin 1, a second pin 2, a third pin 3, and a fourth pin 4. The first pin 1 is electrically connected to the signal input terminal 101, the second pin 2 is electrically connected to the ground line 104, the third pin 3 is electrically connected to the signal output terminal 102, and the fourth pin 4 is electrically connected to a first end of the switch module S. The crystal oscillator module X includes either an active crystal oscillator X2 or a passive crystal oscillator X1. When the crystal oscillator module X includes the passive crystal oscillator X1, the second end of the switch module S is electrically connected to the ground line 104. When the crystal oscillator module X includes the active crystal oscillator X2, the second end of the switch module S is electrically connected to the power line 103. In this way, the drive circuit of the passive crystal oscillator and the drive circuit of the active crystal oscillator can be provided on the same circuit board, reducing the design and preparation costs of the circuit board and expanding its application range.

[0229] The embodiment of the present application provides a method for preparing a circuit board, such as Figure 8 As shown, the method is applied to prepare the circuit board as described above, and includes:

[0230] S801, providing a substrate for a circuit board;

[0231] For a flexible circuit board, the substrate includes a flexible substrate, and for example, the material of the flexible substrate includes polyimide or polyester film; or for a rigid circuit board, the substrate includes a rigid substrate, and for example, the material of the rigid substrate includes silicon material, etc.

[0232] S802, forming a first conductive layer D1, located on one side of the substrate, including a power line 103;

[0233] The material of the first conductive layer D1 includes metal materials. For example, the metal materials include copper, aluminum, nickel, gold, silver, and alloys.

[0234] The thickness of the first conductive layer D1 is determined according to the specific process.

[0235] After forming the first conductive layer D1 , the process further includes forming a first insulating layer and opening holes in the first insulating layer.

[0236] S803 , forming a second conductive layer D2 located on a side of the first conductive layer D1 away from the substrate, including a ground line 104 ;

[0237] The material of the second conductive layer D2 includes metal materials. For example, the metal materials include copper, aluminum, nickel, gold, silver, and alloys.

[0238] The thickness of the second conductive layer D2 is determined according to the specific process.

[0239] After forming the second conductive layer D2, the process further includes forming a second insulating layer and opening holes in the second insulating layer.

[0240] S804. Form a third conductive layer D4, which is located on a side of the second conductive layer D2 away from the substrate, and includes a plurality of conductive pad groups; the conductive pad groups include a crystal oscillator conductive pad group, and the orthographic projection area of the crystal oscillator conductive pad group on the substrate is larger than the orthographic projection areas of the other conductive pad groups on the substrate; the crystal oscillator conductive pad group includes a first conductive pad S1, a second conductive pad S2, a third conductive pad S3, and a fourth conductive pad S4, wherein the first conductive pad S1 is electrically connected to the first pin 1, the second conductive pad S2 is electrically connected to the second pin 2, the third conductive pad S3 is electrically connected to the third pin 3, and the fourth conductive pad S4 is electrically connected to the fourth pin 4; the first conductive layer D1, the second conductive layer D2, and the third conductive layer D3 are insulated from each other;

[0241] The material of the third conductive layer D3 includes metal materials. For example, the metal materials include copper, aluminum, nickel, gold, silver, and alloys.

[0242] The thickness of the third conductive layer D3 is determined according to the specific process.

[0243] S805 , electrically connecting the components and the conductive pad groups together.

[0244] In an exemplary embodiment, the components and the conductive pad groups may be electrically connected together through a welding process.

[0245] In an exemplary embodiment, after forming the third conductive layer D4 in step S804 and before electrically connecting the components to the conductive pad groups in step S805, the method further includes:

[0246] S806: Determine whether the circuit board needs to use a driving circuit of the active crystal oscillator X2 or a driving circuit of the passive crystal oscillator X1;

[0247] Step S805, electrically connecting the components and the conductive pad groups, includes:

[0248] S8051. According to the determined type of the driving circuit, electrically connect the corresponding components and the conductive pad group.

[0249] The types of driving circuits include a driving circuit using an active crystal oscillator X2 or a driving circuit using a passive crystal oscillator X1. The components included in the driving circuit of the active crystal oscillator X2 and the components included in the driving circuit of the passive crystal oscillator X1 can be referred to the description above and will not be repeated here.

[0250] In addition, in actual applications, in order to shorten the production cycle of the circuit board, it can be determined according to step S806 whether the circuit board needs to use the driving circuit of the active crystal oscillator X2 or the driving circuit of the passive crystal oscillator X1, and it can be determined whether a protective layer (such as the first protective layer B1 described above) is formed before the component is struck or whether a protective layer (such as the second protective layer B2 described above) is formed after the component is struck.

[0251] Of course, the first protective layer B1 and the second protective layer B2 may also be provided at the same time.

[0252] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A circuit board, characterized in that: It includes a substrate and a driving circuit located on the substrate, wherein the driving circuit includes a crystal oscillator module, a signal input terminal, a signal output terminal, a power line, a ground line and a switch module; The crystal oscillator module includes a first pin, a second pin, a third pin and a fourth pin; The first pin is electrically connected to the signal input end, the second pin is electrically connected to the ground line, the third pin is electrically connected to the signal output end, and the fourth pin is electrically connected to the first end of the switch module; The crystal oscillator module includes one of an active crystal oscillator and a passive crystal oscillator; In the case where the crystal oscillator module includes the passive crystal oscillator, the second end of the switch module is electrically connected to the ground line; In the case where the crystal oscillator module includes the active crystal oscillator, the second end of the switch module is electrically connected to the power line; The circuit board also includes: A first conductive layer, located on one side of the substrate, including the power line; a second conductive layer, located on a side of the first conductive layer away from the substrate, and comprising the ground line; A third conductive layer is located on a side of the second conductive layer away from the substrate, and the first conductive layer, the second conductive layer and the third conductive layer are insulated from each other; the third conductive layer includes a plurality of conductive pad groups; the conductive pad group includes a crystal oscillator conductive pad group, and the orthographic projection area of the crystal oscillator conductive pad group on the substrate is larger than the orthographic projection area of each other conductive pad group on the substrate; the crystal oscillator conductive pad group includes a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad, the first conductive pad is electrically connected to the first pin, the second conductive pad is electrically connected to the second pin, the third conductive pad is electrically connected to the third pin, and the fourth conductive pad is electrically connected to the fourth pin; the second conductive pad is also electrically connected to the ground wire.

2. The circuit board according to claim 1, wherein: In the case where the crystal oscillator module includes the passive crystal oscillator, the driving circuit further includes a first filtering module and a second filtering module; The first filtering module is electrically connected to the first pin, and the second filtering module is electrically connected to the third pin.

3. The circuit board according to claim 2, wherein: The first filtering module includes a first capacitor, and the second filtering module includes a second capacitor; A first end of the first capacitor is electrically connected to the first pin, and a second end of the first capacitor is electrically connected to the ground line; A first end of the second capacitor is electrically connected to the third pin, and a second end of the second capacitor is electrically connected to the ground line.

4. The circuit board according to claim 1, wherein: In the case where the crystal oscillator module includes an active crystal oscillator, the driving circuit further includes a voltage stabilizing module, and the voltage stabilizing module is electrically connected to the power line through the switch module; The voltage stabilizing module is configured to stabilize the voltage of the power line input signal.

5. The circuit board according to claim 4, characterized in that The voltage stabilizing module includes a third capacitor; A first end of the third capacitor is electrically connected to the first end of the switch module, and a second end of the third capacitor is electrically connected to the ground line.

6. The circuit board according to claim 1, wherein: In the case where the crystal oscillator module includes a passive crystal oscillator, the switch module includes a first resistor; a first end of the first resistor is electrically connected to the fourth pin, and a second end of the first resistor is electrically connected to the ground line; In the case where the crystal oscillator module includes an active crystal oscillator, the switch module includes a second resistor; A first end of the second resistor is electrically connected to the fourth pin, and a second end of the second resistor is electrically connected to the power line.

7. The circuit board according to claim 6, wherein: The first resistor includes a 0-ohm resistor, and the second resistor includes a 0-ohm resistor.

8. The circuit board according to claim 1, wherein: The conductive pad group further includes a first conductive pad group, and the first conductive pad group is located on a side of the third conductive pad away from the second conductive pad; The first conductive pad group includes two conductive pads, one of the two conductive pads is electrically connected to the third conductive pad, and the other conductive pad is electrically connected to the ground line.

9. The circuit board according to claim 8, wherein: The conductive pad group further includes a second conductive pad group and a third conductive pad group, wherein the second conductive pad group is located on a side of the third conductive pad group away from the crystal oscillator conductive pad group; an orthographic projection of the second conductive pad group on the substrate overlaps with an orthographic projection of the power line on the substrate; The second conductive pad group and the third conductive pad group each include two conductive pads, one of the conductive pads in the second conductive pad group is electrically connected to the power line, and the other conductive pad in the second conductive pad group is electrically connected to the fourth conductive pad; One of the conducting pads in the third conducting pad group is electrically connected to the ground line, and another conducting pad in the second conducting pad group is electrically connected to the fourth conducting pad.

10. The circuit board according to claim 9, wherein: The conductive pad group also includes a fourth conductive pad group, which is located on a side of the first conductive pad away from the second conductive pad. The fourth conductive pad group includes two conductive pads, one of the conductive pads in the fourth conductive pad group is electrically connected to the first conductive pad, and the other conductive pad in the fourth conductive pad group is electrically connected to the ground line.

11. The circuit board according to claim 10, wherein: In the case where the crystal oscillator module includes the passive crystal oscillator, the driving circuit includes a first capacitor, a second capacitor, and a first resistor, the first conductive pad group is electrically connected to the second capacitor, the third conductive pad group is electrically connected to the first resistor, and the fourth conductive pad group is electrically connected to the first capacitor; In the case where the crystal oscillator module includes the active crystal oscillator, the driving circuit includes a third capacitor and a second resistor, the second conductive pad group is electrically connected to the second resistor, and the third conductive pad group is electrically connected to the third capacitor; The third capacitor and the first resistor share the third conductive pad set, and the third conductive pad set is electrically connected to one of the third capacitor and the first resistor.

12. The circuit board according to claim 10, wherein: The conductive pad group further includes a fifth conductive pad group, and the fifth conductive pad group is located on a side of the fourth conductive pad group away from the crystal oscillator conductive pad group; The fifth conducting pad group includes two conducting pads, one of which is electrically connected to the fourth conducting pad, and the other is electrically connected to the ground line.

13. The circuit board according to claim 12, wherein: In the case where the crystal oscillator module includes the passive crystal oscillator, the driving circuit includes a first capacitor, a second capacitor, and a first resistor, the first conductive pad group is electrically connected to the second capacitor, the third conductive pad group is electrically connected to the first resistor, and the fourth conductive pad group is electrically connected to the first capacitor; In the case where the crystal oscillator module includes the active crystal oscillator, the driving circuit includes a third capacitor and a second resistor, the second conductive pad group is electrically connected to the second resistor, and the fifth conductive pad group is electrically connected to the third capacitor.

14. The circuit board according to claim 11, wherein: The circuit board further includes a first protective layer, the first protective layer is located between the third conductive layer and each component, and the first protective layer includes a plurality of openings; In the case where the crystal oscillator module includes the passive crystal oscillator, an area defined by an orthographic projection of the outer contour of the opening on the substrate overlaps with the orthographic projections of the crystal oscillator conductive pad group, the first conductive pad group, the third conductive pad group, and the fourth conductive pad group on the substrate, respectively; When the crystal oscillator module includes the active crystal oscillator, the area defined by the orthographic projection of the outer contour of the opening on the substrate overlaps with the orthographic projections of the crystal oscillator conductive pad group, the second conductive pad group, and the third conductive pad group on the substrate.

15. The circuit board according to claim 11, wherein: The circuit board further includes a second protective layer, which is located on a side of the third conductive layer and each component away from the substrate; In the case where the crystal oscillator module includes the passive crystal oscillator, the second protective layer covers the components and the second conductive pad group; In the case where the crystal oscillator module includes the active crystal oscillator, the second protective layer covers the components, the first conductive pad group, and the fourth conductive pad group.

16. The circuit board according to claim 13, wherein: The circuit board further includes a first protective layer, the first protective layer is located between the third conductive layer and each component, and the first protective layer includes a plurality of openings; In the case where the crystal oscillator module includes the passive crystal oscillator, an area defined by an orthographic projection of the outer contour of the opening on the substrate overlaps with the orthographic projections of the crystal oscillator conductive pad group, the first conductive pad group, the third conductive pad group, and the fourth conductive pad group on the substrate, respectively; When the crystal oscillator module includes the active crystal oscillator, the area defined by the orthographic projection of the outer contour of the opening on the substrate overlaps with the orthographic projections of the crystal oscillator conductive pad group, the second conductive pad group, and the fifth conductive pad group on the substrate.

17. The circuit board according to claim 13, wherein: The circuit board further includes a second protective layer, which is located on a side of the third conductive layer and each component away from the substrate; In the case where the crystal oscillator module includes the passive crystal oscillator, the second protective layer covers the components, the second conductive pad group and the fifth conductive pad group; In the case where the crystal oscillator module includes the active crystal oscillator, the second protective layer covers the components, the first conductive pad group, the third conductive pad group, and the fourth conductive pad group.

18. A display device, characterized in that: A circuit board comprising the circuit board according to any one of claims 1 to 17.

19. A method for preparing a circuit board, characterized in that: Applied to preparing a circuit board according to any one of claims 8 to 17, the method comprises: providing a substrate for the circuit board; forming a first conductive layer located on one side of the substrate, comprising a power line; forming a second conductive layer located on a side of the first conductive layer away from the substrate, comprising a ground line; A third conductive layer is formed, located on a side of the second conductive layer away from the substrate, and includes a plurality of conductive pad groups; the conductive pad groups include a crystal oscillator conductive pad group, the orthographic projection area of the crystal oscillator conductive pad group on the substrate being larger than the orthographic projection areas of the other conductive pad groups on the substrate; the crystal oscillator conductive pad group includes a first conductive pad, a second conductive pad, a third conductive pad, and a fourth conductive pad, the first conductive pad being electrically connected to the first pin, the second conductive pad being electrically connected to the second pin, the third conductive pad being electrically connected to the third pin, and the fourth conductive pad being electrically connected to the fourth pin; the first conductive layer, the second conductive layer, and the third conductive layer are insulated from each other; The components are electrically connected to the conductive pad groups.

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