Wafer transport device
By designing a wafer transfer device that controls the mechanical fingers through linear movement and rotation mechanisms, the problem of cross-contamination in multiple chambers was solved, wafer yield and transfer efficiency were improved, and dry and wet separation was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
- Filing Date
- 2022-11-28
- Publication Date
- 2026-06-02
AI Technical Summary
Traditional wafer transfer devices are prone to cross-contamination between multiple chambers, resulting in low wafer yield.
A wafer transfer device comprising a linear motion mechanism, a rotation mechanism, and a mechanical finger mechanism was designed. The mechanical finger is independently controlled through linear motion and rotation, avoiding the transfer of the same mechanical finger between different chambers. Multiple telescopic drive components are connected one-to-one with the mechanical finger to achieve dry and wet separation.
This effectively avoids cross-contamination between multiple chambers, improves wafer yield and transfer efficiency, and enables dry and wet wafer transfer.
Smart Images
Figure CN115763331B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wafer manufacturing equipment technology, and in particular to a wafer transport device. Background Technology
[0002] In the semiconductor wafer manufacturing process, wafers need to be processed in multiple chambers. Different processes are performed in different chambers, and different chemicals are used for different processes. Some chambers process the wafers under humid conditions, while others dry the wafers. The problem with traditional wafer transport devices is that using mechanical fingers to feed the wafers into or out of different chambers can easily lead to cross-contamination between the multiple chambers, resulting in low wafer yield. Summary of the Invention
[0003] The purpose of this invention is to provide a wafer transport device to solve, to a certain extent, the technical problems of cross-contamination between multiple chambers and low wafer yield in the prior art.
[0004] This invention provides a wafer transfer device, comprising: a linear motion mechanism, a rotation mechanism, and a mechanical finger mechanism; the rotation mechanism includes a rotation support base, a rotation drive assembly, and a rotation connector, the rotation support base being connected to the linear motion mechanism, the rotation drive assembly being connected to the rotation support base, and the rotation drive assembly being driven by the rotation connector; the mechanical finger mechanism includes a base and multiple telescopic finger structures; each telescopic finger structure includes a mechanical finger and a telescopic drive assembly, the base being connected to the rotation connector, the telescopic drive assembly being connected to the base, and the multiple telescopic drive assemblies being driven by a corresponding multiple mechanical fingers; the direction in which the linear motion mechanism drives the rotation support base is different from the direction in which the telescopic drive assembly drives the mechanical fingers.
[0005] The linear movement mechanism can drive the rotary support to reciprocate linearly along the first direction, thereby driving the entire rotary support to move accordingly, and in turn driving the mechanical finger mechanism to move accordingly; the rotary drive component can drive the rotary connector to rotate, thereby driving the base to rotate, and in turn driving the entire mechanical finger mechanism to rotate; the multiple telescopic drive components can drive multiple corresponding mechanical fingers to reciprocate linearly along the second direction. The first direction and the second direction are different (preferably, the first direction and the second direction are perpendicular). That is, the wafer transfer device provided in this embodiment can simultaneously realize the movement, rotation angle and movement of the mechanical finger in the first direction and in the second direction, which can quickly enable the corresponding mechanical finger to reach the target chamber, thereby sending the wafer into the chamber or taking the wafer out of the chamber. Multiple telescopic drive components are connected one-to-one with multiple robotic fingers, so that each robotic finger can be driven by an independent telescopic drive component. The multiple telescopic finger structure can achieve the following: multiple robotic fingers can correspond to multiple chambers, avoiding the same robotic finger from transferring wafers between different chambers, thereby avoiding cross-contamination between different chambers, improving wafer yield, and improving wafer transfer efficiency; or, multiple robotic fingers can achieve dry and wet separation, for example, some robotic fingers are corresponding to the transfer of wet wafers, and some robotic fingers are corresponding to the transfer of dry wafers.
[0006] Furthermore, the linear motion mechanism includes a motion drive assembly, a guide rail base plate and a cable chain base plate arranged at relatively intervals; the cable chain base plate is provided with a cable chain, and the guide rail base plate is provided with a guide rail; the rotation mechanism also includes an adapter box connected to one side of the rotation support base, the adapter box being connected to the cable chain, the rotation support base being slidably mounted on the guide rail via a support base slider, and the motion drive assembly being drively connected to the slider; in the length direction of the guide rail, both ends of the guide rail are provided with moving part limiting members.
[0007] Furthermore, the rotating support base has an installation cavity, and the rotating drive assembly is installed in the installation cavity; the rotating connector includes a rotating connecting cylinder rotatably disposed in the installation cavity, and the rotating mechanism also includes a conduit sheath rotatably disposed in the installation cavity; one end of the rotating connecting cylinder is connected to the base, and the other end of the rotating connecting cylinder is connected to the conduit sheath; the rotating drive assembly is drively connected to the rotating connecting cylinder.
[0008] Furthermore, a bearing housing is fixed within the mounting cavity; the rotating connector further includes a bearing, a rotating sleeve, an inner bearing ring retainer, and an outer bearing ring retainer; the bearing is installed within the bearing housing, the rotating sleeve is fitted over the conduit sheath, and the bearing is fitted over the rotating sleeve; the inner bearing ring retainer is fitted over the end of the conduit sheath furthest from the rotating connector, one end of the rotating sleeve is connected to the inner bearing ring retainer, and the other end of the rotating sleeve is fixedly connected to the rotating connector; the outer bearing ring retainer is fitted over the rotating sleeve and connected to the bearing housing; the rotating drive assembly is drively connected to the inner bearing ring retainer.
[0009] Furthermore, the rotating mechanism also includes a rotating part limiting member; the rotating part limiting member is connected to the rotating connecting cylinder to limit the rotation angle of the rotating connecting cylinder.
[0010] Furthermore, the telescopic drive assembly includes a telescopic motor, a telescopic drive wheel, a telescopic timing belt, and a telescopic driven wheel; the telescopic motor is connected to the telescopic drive wheel, the telescopic driven wheel is spaced apart from the telescopic drive wheel along the length of the base, and the telescopic timing belt connects the telescopic drive wheel and the telescopic driven wheel; the mechanical finger includes a transmission plate, a support plate, a telescopic slider, and a telescopic slide rail; the support plate is connected to the transmission plate, the telescopic slider is connected to the support plate, and the telescopic slider slides on the telescopic slide rail; the telescopic slider is connected to the telescopic timing belt.
[0011] Furthermore, the two retractable finger structures form a group, wherein one retractable finger structure is a first retractable finger structure and the other retractable finger structure is a second retractable finger structure; the second retractable finger structure is disposed inside the first retractable finger structure, and the transmission plate of the second retractable finger structure can be located below the transmission plate of the first retractable finger structure;
[0012] The second telescopic finger structure also includes an intermediate plate; in the second telescopic finger structure, one end of the intermediate plate is connected to the support plate, and the other end is connected to the telescopic slider and the telescopic timing belt respectively; a gap is formed between the intermediate plate and the base, and the telescopic drive timing belt of the first telescopic structure passes through the gap.
[0013] Furthermore, the mechanical finger also includes a finger connecting plate connected between the transmission plate and the support plate, and the finger connecting plate is provided at an angle with the transmission plate and the support plate respectively; in the thickness direction of the base, multiple transmission plates can overlap.
[0014] Furthermore, the front end of the transfer plate is provided with a through hole, and the transfer plate is connected to the finger connecting plate through a pressure plate. The pressure plate is provided with an air nozzle. The wafer transfer device also includes a vacuum section and a back-blowing section, both of which are connected to the rotating support base. The vacuum section and the back-blowing section are both connected to the air nozzle, and the air nozzle is connected to the through hole through a connecting pipe.
[0015] Furthermore, the wafer transfer device also includes a flow guide tube, one end of which is connected to a rotating support base; the upper side of the base is provided with an upper groove for mounting the telescopic finger structure, the upper opening of the upper groove is covered with a flow guide plate, and the flow guide plate is provided with a flow guide hole; the flow guide tube is connected to the flow guide hole through a flow guide connecting pipe.
[0016] Furthermore, the wafer transfer device also includes a scanning sensor mounted on the base to scan the number of wafers and the number of wafer layers.
[0017] It should be understood that both the foregoing general description and the following detailed description are for illustrative purposes and do not necessarily limit the scope of this disclosure. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate the subject matter of this disclosure. Furthermore, the specification and drawings serve to explain the principles of this disclosure. Attached Figure Description
[0018] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0019] Figure 1 This is a top view of a wafer transport device according to an embodiment of the present invention;
[0020] Figure 2 for Figure 1 A side view of the wafer transport device shown from a first perspective;
[0021] Figure 3 for Figure 1 A side view of the wafer transport device shown from a second perspective;
[0022] Figure 4 for Figure 1 A cross-sectional view of the rotating mechanism and the mechanical finger mechanism in the wafer transfer device shown;
[0023] Figure 5 for Figure 1 A schematic diagram of the rotating mechanism in the wafer transfer device shown;
[0024] Figure 6 for Figure 1 A schematic diagram of the mechanical finger mechanism in the wafer transfer device shown;
[0025] Figure 7 for Figure 1 The diagram shows the internal structure of the mechanical finger mechanism in the wafer transfer device.
[0026] Icons: 1-Linear movement mechanism; 2-Rotation mechanism; 3-Mechanical finger mechanism; 4-Vacuum section; 5-Backflush section; 6-Guide tube; 7-Guide connecting pipe; 8-Scanning sensor;
[0027] 101-Guide rail base plate; 102-Drag chain base plate; 103-Guide rail; 104-Drag chain; 105-Moving part limit block; 106-Moving part position detection element;
[0028] 201-Adapter box; 202-Support base slider; 203-Mounting cavity; 204-Rotating connecting cylinder; 205-Conduit sheath; 206-Rotating part base; 207-Rotating part connecting plate; 208-Rotating part support frame; 209-Bearing housing; 210-Base plate; 211-Bearing; 212-Rotating sleeve; 213-Bearing inner ring sleeve; 214-Bearing outer ring sleeve; 215-Rotating part motor; 216-Rotating part drive wheel; 217-Rotating part driven wheel; 218-Rotating part synchronous belt; 219-Rotating part limit block; 220-Rotating part position detection element; 221-Detection pad;
[0029] 301-Base; 302-Telescopic motor; 303-Telescopic drive wheel; 304-Telescopic driven wheel; 305-Telescopic synchronous belt; 306-Transmission plate; 307-Support plate; 308-Telescopic slider; 309-Telescopic slide rail; 310-Slider pad; 311-Pressure block; 312-Telescopic limit block; 313-Telescopic position detection element; 314-Intermediate plate; 315-Finger connecting plate; 316-Through hole; 317-Pressure plate; 318-Upper groove; 319-Lower groove; 320-Guide plate; 321-Guide hole; 322-Lower cover plate; 323-Connecting hole; 324-Finger protective cover; 325-Air nozzle; 326-Telescopic drag chain; 327-Driven wheel connecting plate; 328-Driven wheel shaft; 31-First telescopic finger structure; 32-Second telescopic finger structure. Detailed Implementation
[0030] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0031] The components of the embodiments of the invention described and shown in the accompanying drawings can typically be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.
[0032] Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0033] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0034] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0035] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0036] like Figures 1 to 7As shown, this embodiment of the invention provides a wafer transfer device, including: a linear motion mechanism 1, a rotation mechanism 2, and a mechanical finger mechanism 3; the rotation mechanism 2 includes a rotation support base, a rotation drive assembly, and a rotation connector, the rotation support base is connected to the linear motion mechanism 1, the rotation drive assembly is connected to the rotation support base, and the rotation drive assembly is driven by the rotation connector; the mechanical finger mechanism 3 includes a base 301 and multiple telescopic finger structures; each telescopic finger structure includes a mechanical finger and a telescopic drive assembly, the base 301 is connected to the rotation connector, the telescopic drive assembly is connected to the base 301, and the multiple telescopic drive assemblies are driven by the multiple mechanical fingers in a one-to-one correspondence; the direction in which the linear motion mechanism 1 drives the rotation support base is different from the direction in which the telescopic drive assembly drives the mechanical fingers.
[0037] In this embodiment, the linear movement mechanism 1 can drive the rotary support to reciprocate linearly along the first direction, thereby driving the entire rotary support to move accordingly, and in turn driving the mechanical finger mechanism 3 to move accordingly; the rotary drive component can drive the rotary connector to rotate, thereby driving the base 301 to rotate, and in turn driving the entire mechanical finger mechanism 3 to rotate; the multiple telescopic drive components can drive multiple corresponding mechanical fingers to reciprocate linearly along the second direction. The first direction and the second direction are different (preferably, the first direction and the second direction are perpendicular). That is, the wafer transfer device provided in this embodiment can simultaneously realize the movement, rotation angle and movement of the mechanical finger in the first direction and in the second direction, so that the corresponding mechanical finger can quickly reach the target chamber, thereby sending the wafer into the chamber or taking the wafer out of the chamber. Multiple telescopic drive components are connected one-to-one with multiple robotic fingers, so that each robotic finger can be driven by an independent telescopic drive component. The multiple telescopic finger structure can achieve the following: multiple robotic fingers can correspond to multiple chambers, avoiding the same robotic finger from transferring wafers between different chambers, thereby avoiding cross-contamination between different chambers, improving wafer yield, and improving wafer transfer efficiency; or, multiple robotic fingers can achieve dry and wet separation, for example, some robotic fingers are corresponding to the transfer of wet wafers, and some robotic fingers are corresponding to the transfer of dry wafers.
[0038] like Figures 1 to 3 As shown, based on the above embodiments, the linear motion mechanism 1 further includes a motion drive assembly, a guide rail base plate 101 and a cable chain base plate 102 arranged at relatively intervals; a cable chain 104 is provided on the cable chain base plate 102, and a guide rail 103 is provided on the guide rail base plate 101; the rotation mechanism 2 also includes an adapter box 201 connected to one side of the rotation support seat, the adapter box 201 is connected to the cable chain 104, the rotation support seat is slidably mounted on the guide rail 103 through the support seat slider 202, and the motion drive assembly is connected to the slider in a transmission connection; in the length direction of the guide rail 103, both ends of the guide rail 103 are provided with moving part limiting members.
[0039] In this embodiment, the guide rail base plate 101 and the cable chain base plate 102 are spaced apart along the length of the rotating support base. The guide rail base plate 101 is located on one side of the rotating support base, and the cable chain base plate 102 is located on the other side. It is easy to understand that the length directions of the guide rail base plate 101 and the cable chain base plate 102 can be the same as the width direction of the rotating support base. The cable chain 104 is connected to the rotating support assembly via an adapter box 201. The cable chain 104 can move with the rotating support base, providing protection for communication or power lines. Along the length of the guide rail 103, moving limiters are provided at both ends of the guide rail 103 to limit the movement position of the rotating support base.
[0040] The moving part limiting component can be a moving part limiting block 105 that can contact the support base slider 202, or a moving part position detection element 106 (e.g., a limit switch or position sensor) that is communicatively connected to the controller of the wafer transfer device. The moving part position detection element is used to detect the position of the support base slider 202. When the moving part position detection element detects that the support base slider 202 has reached the set position, the controller can control the moving drive component to stop working, thereby preventing the support base slider 202 from moving excessively. Optionally, both the moving part limiting block 105 is provided on the guide rail 103 to achieve hard limiting of the support base slider 202, and the moving part position detection element 106 is provided on the guide rail 103 to achieve soft limiting of the support base slider 202.
[0041] The structure of the mobile drive component can be varied, such as: motor pulley conveyor mechanism, motor gear rack conveyor mechanism, etc.
[0042] As an alternative, such as Figure 1 and Figure 2 As shown, the moving drive assembly includes a motor and a lead screw. The support base slider 202 has a threaded through hole and is sleeved on the lead screw, thus forming a lead screw mechanism. The movement of this moving drive assembly is smooth. Specifically, the lead screw can be located below the guide rail 103. The support base slider 202 includes a sliding part that slides on the guide rail 103 and a nut part that is connected to the lead screw.
[0043] like Figure 4 As shown, based on the above embodiment, a mounting cavity 203 is further formed in the rotating support base, and the rotating drive assembly is installed in the mounting cavity 203; the rotating connector includes a rotating connecting cylinder 204 rotatably disposed in the mounting cavity 203, and the rotating mechanism 2 also includes a conduit sleeve 205 rotatably disposed in the mounting cavity 203; one end of the rotating connecting cylinder 204 is connected to the base 301, and the other end of the rotating connecting cylinder 204 is connected to the conduit sleeve 205; the rotating drive assembly is drively connected to the rotating connecting cylinder 204.
[0044] In this embodiment, wires or pipes can pass through the conduit sleeve 205. The rotating connecting cylinder 204 is rotatably connected to the rotating support base, and the conduit sleeve 205 is connected to the rotating connecting cylinder (for example, by bolts or screws), thus rotating together with the rotating connecting cylinder. The conduit sleeve 205 can protect the wiring or pipes inside the conduit sleeve 205.
[0045] Specifically, the rotating support base may include a rotating base 206, a rotating connecting plate 207 connected to the rotating base 206, and a rotating support frame connected to the rotating connecting plate 207; the support base slider 202 is connected to one side of the bottom of the rotating support frame 208, and the adapter box 201 is connected to the other side of the rotating support frame 208; a rotating adjustment block may be provided on the rotating connecting plate 207 to adapt to the assembly requirements between the rotating connecting plate 207 and the rotating support frame 208.
[0046] Optionally, the inner diameter of the connecting portion of the rotating connecting cylinder 204 near the conduit sleeve 205 is larger than the inner diameter of the conduit sleeve 205, and the bottom of the rotating connecting cylinder 204 near the conduit sleeve 205 is provided with a perforation. The inner diameter of the perforation is adapted to the outer diameter of the conduit sleeve 205. One end of the conduit sleeve 205 extends into the rotating connecting cylinder 204 through the perforation. The edge of this end of the conduit sleeve 205 is provided with a stepped structure, which can overlap the edge of the perforation.
[0047] As an alternative, such as Figure 4 As shown, a mounting cavity 203 is formed within the rotating base 206, within which the bearing housing 209 and the base plate 210 can be fixed. The rotating connector also includes a bearing 211, a rotating sleeve 212, an inner bearing ring sleeve 213, and an outer bearing ring sleeve 214. The bearing 211 is installed within the bearing housing 209, the rotating sleeve 212 is fitted over the tubing sheath 205, and the bearing 211 is fitted over the rotating sleeve 212. The inner bearing ring sleeve 213 is fitted over the tubing sheath 205 away from the rotating connector. One end of the connecting cylinder 204 and one end of the rotating sleeve 212 are connected to the inner ring pressure sleeve 213 of the bearing, while the other end of the rotating sleeve 212 is fixedly connected to the rotating connecting cylinder 204. The outer ring pressure sleeve 214 of the bearing is sleeved outside the rotating sleeve 212 and is connected to the bearing seat 209. The rotation drive assembly is connected to the inner ring pressure sleeve 213 of the bearing to drive the inner ring pressure sleeve 213 to rotate, thereby driving the rotating sleeve 212 to rotate, and further driving the rotating connecting cylinder 204 to rotate. This structure makes the internal structure of the rotating support compact, small in size, and occupies little space.
[0048] The rotary drive assembly includes a rotary motor 215 and a rotary transmission structure, which can be a gear transmission structure, a chain transmission structure, etc.
[0049] As an alternative, such as Figure 4 As shown, the rotating part transmission structure includes a rotating part drive wheel 216, a rotating part driven wheel 217, and a rotating part synchronous belt 218. The rotating part motor 215 is fixedly connected to the base plate 210 and located on one side of the rotating connecting cylinder 204. The rotating part drive wheel 216 is coaxially fixed to the power output shaft of the rotating part motor 215, and the rotating part driven wheel 217 is coaxially fixed to the inner pressure ring of the bearing 211. One end of the rotating part synchronous belt 218 is sleeved on the rotating part drive wheel 216, and the other end is sleeved on the rotating part driven wheel 217. This arrangement makes the rotating part drive assembly simple and compact in structure.
[0050] like Figure 2 As shown, based on the above embodiment, the rotating mechanism 2 further includes a rotating part limiting member; the rotating part limiting member is connected to the rotating connecting cylinder 204 to limit the rotation angle of the rotating connecting cylinder 204.
[0051] In this embodiment, a rotation limiting member is provided in the rotating support base to limit the rotation angle of the rotating connecting cylinder 204. For example, it can prevent the rotating drive assembly from driving the rotating connecting cylinder 204 to rotate to 360 degrees, thereby preventing the lines and pipes in the conduit sheath 205 from breaking due to torsion.
[0052] The rotation limiting component can be a rotation limiting block 219. It is understood that a mating component (e.g., mating block, mating plate, or mating bracket) capable of contacting the rotation limiting block 219 can be provided within the mounting cavity. The rotation limiting component can also be a rotation position detection element 220 (e.g., a limit switch or angle sensor) communicatively connected to the controller of the wafer transfer device. The rotation position detection element 220 is used to detect the position of the rotating connecting cylinder (its position can be obtained by detecting the rotation angle of the rotating connecting cylinder 204). When the rotating connecting cylinder rotates to a set angle, the controller can control the rotating motor to stop working, thereby preventing the rotating connecting cylinder 204 from over-rotating. Optionally, a rotation limiting block 219 can be provided outside the rotating connecting cylinder 204 to achieve hard limiting, and a detection pad 221 can be provided on the bearing seat 209, with the rotation position detection element 220 fixed on the detection pad 221 to achieve soft limiting.
[0053] Based on the above embodiments, the telescopic drive assembly can further be a motor screw and nut mechanism, an electric telescopic rod mechanism, or a motor gear and rack mechanism, etc.
[0054] As an alternative, such as Figures 1 to 4 , Figure 6 and Figure 7 As shown, the telescopic drive assembly includes a telescopic motor 302, a telescopic drive wheel 303, a telescopic timing belt 305, and a telescopic driven wheel 304. The telescopic motor 302 is connected to the telescopic drive wheel 303, and the telescopic driven wheel 304 is spaced apart from the telescopic drive wheel 303 along the length of the base 301. The telescopic timing belt 305 connects the telescopic drive wheel 303 and the telescopic driven wheel 304. This telescopic drive assembly has a simple, compact structure and is easy to control.
[0055] Specifically, such as Figure 7 As shown, the telescopic motor 302 is connected to the base 301 via a telescopic motor connecting plate. The telescopic drive wheel 303 is coaxially fixed with the power output shaft of the telescopic motor 302. A driven wheel connecting plate 327 is provided on the base 301, and a driven wheel shaft 328 (which can be an idler wheel shaft) is provided on the driven wheel connecting plate 327. The telescopic driven wheel 304 is connected to the driven wheel shaft 328.
[0056] like Figures 1 to 4 , Figure 6 and Figure 7 As shown, the robotic finger includes a transmission plate 306, a support plate 307, a telescopic slider 308, and a telescopic rail 309. The support plate 307 is connected to the transmission plate 306, and the telescopic slider 308 is connected to the support plate 307. The telescopic slider 308 slides on the telescopic rail 309. The telescopic slider 308 is connected to the telescopic timing belt 305. A telescopic cable chain 326 can be provided to connect to the telescopic slider 308 to protect the wiring.
[0057] In this embodiment, the telescopic motor 302 drives the telescopic synchronous belt 305 to move, thereby driving the telescopic slider 308 to move on the telescopic slide rail 309; the telescopic slider 308 drives the support plate 307 to move, the support plate 307 drives the transmission plate 306 to move, and the transmission plate 306 is used to transport wafers.
[0058] The mechanical finger may also include a slider pad 310, which is connected to the telescopic slider 308, and the support plate 307 is connected to the slider pad 310. By connecting the pressure block 311 to the slider pad 310, the telescopic synchronous belt 305 is clamped and fixed between the slider pad 310 and the pressure block 311.
[0059] Optionally, along the length of the telescopic slide rail 309, both ends of the telescopic slide rail 309 are provided with telescopic limiting members, which can limit the movement position of the telescopic slider 308. The telescopic limiting member can be a telescopic limiting block 312 that can contact the telescopic slider, or it can be a telescopic position detection element 313 (e.g., a limit switch or position sensor) that communicates with the controller of the wafer transfer device. The telescopic position detection element 313 is used to detect the position of the telescopic slider and can be connected to the telescopic slider 308 via a telescopic baffle (direct or indirect connection) to cooperate with the telescopic detection element. Optionally, both hard and soft limiting can be achieved by providing the telescopic position detection element 313 on the telescopic slide rail 309.
[0060] The positions of the multiple retractable finger structures can be set on the base 301 as needed.
[0061] As an alternative, such as Figure 7 As shown, two telescopic finger structures form a group, wherein one telescopic finger structure is the first telescopic finger structure 31 and the other telescopic finger structure is the second telescopic finger structure 32; the second telescopic finger structure 32 is disposed inside the first telescopic finger structure 31 (on the side closer to the base 301), and the transmission plate 306 of the second telescopic finger structure 32 can be located below the transmission plate 306 of the first telescopic finger structure 31; the second telescopic finger structure 32 also includes an intermediate plate 314, in which one end of the intermediate plate 314 is connected to the support plate 307, and the other end is connected to the telescopic slider and the telescopic timing belt respectively, and a gap is formed between the intermediate plate 314 and the base 301, through which the telescopic timing belt 305 of the first telescopic finger structure 31 passes.
[0062] In this embodiment, the second telescopic finger structure 32 is located inside the first telescopic finger structure 31. Furthermore, in the thickness direction of the base 301, the first transmission plate corresponding to the first telescopic finger structure 31 (i.e., the transmission plate 306 in the first telescopic finger structure) can overlap with the second transmission plate corresponding to the second telescopic finger structure 32 (i.e., the transmission plate 306 in the second telescopic finger structure). This allows the mechanical finger mechanism 3 to have a neat and compact structure, facilitating storage. One end of the intermediate plate 314 is connected to the support plate 307, and the other end is connected to the telescopic slider 308 and the telescopic timing belt 305, respectively. That is, the telescopic timing belt 305 in the second telescopic finger structure 32 is located on the side of the intermediate plate 314 away from the first telescopic finger structure 31.
[0063] The intermediate plate 314 can be arranged in a "door" shape, or optionally, in a "Z" shape.
[0064] Optionally, in the first telescopic drive assembly (the telescopic drive assembly in the first telescopic finger structure), the telescopic motor 302 is located at the first end of the base 301, and the telescopic driven wheel 304 is located at the second end of the base 301; while in the second telescopic drive assembly (the telescopic drive assembly in the second telescopic finger structure), the telescopic motor 302 is located at the first end of the base 301, and the telescopic driven wheel 304 is located at the second end of the base 301. This makes the components on the base 301 compact and small in size.
[0065] like Figure 7 As shown, based on the above embodiments, the mechanical finger further includes a finger connecting plate 315 connected between the transmission plate 306 and the support plate 307. The finger connecting plate 315 is provided with an angle between it and the transmission plate 306 and the support plate 307 respectively (specifically, one end of the finger connecting plate 315 is connected to the transmission plate 306, and the other end is connected to the support plate 307, and an angle is formed between the finger connecting plate 315 and the transmission plate 306, and an angle is formed between the finger connecting plate 315 and the support plate 307); in the thickness direction of the base 301, multiple transmission plates 306 can overlap.
[0066] In this embodiment, the transmission plates 306 in the multiple telescopic finger structures can overlap in the thickness direction of the base 301. That is, the multiple transmission plates 306 can be arranged sequentially and spaced apart from top to bottom (in the thickness direction of the base 301) to form a multi-layer transmission plate structure, which can further make the mechanical finger mechanism 3 structure neat, compact and easy to store.
[0067] The number of retractable finger structures can be set as needed. Taking four retractable finger structures, divided into two groups (each group including a first and a second retractable finger structure), as an example: the first and second groups of retractable finger structures are symmetrically arranged on the base 301. The telescopic synchronous belts 305 in the first and second groups of retractable finger structures are adjacent to each other. The two transmission plates 306 in the second group of retractable finger structures are inserted between the two transmission plates 306 in the second group of retractable finger structures. The above is merely an example and not a limitation on the retractable finger structure.
[0068] like Figure 7As shown, based on the above embodiment, the front end of the transfer plate 306 is provided with a through hole 316, and the transfer plate 306 is connected to the finger connecting plate 315 through a pressure plate 317. The pressure plate 317 is provided with an air nozzle 325. The wafer transfer device also includes a vacuum section 4 and a back-blowing section 5, both of which are connected to the rotating support base (specifically, the vacuum section and the back-blowing section can be connected to both sides of the rotating base respectively). The vacuum section 4 and the back-blowing section 5 are both connected to the air nozzle 325, and the air nozzle 325 is connected to the through hole 316 through a connecting pipe.
[0069] In this embodiment, the vacuum unit 4 operates to draw air from the vicinity of the through hole 316 via the air nozzle 325 and the connecting pipe, thereby enabling the wafer to be adsorbed onto the through hole 316 of the transfer plate 306. The backflush unit 5 operates to blow air into the air nozzle and the connecting pipe between the air nozzle and the through hole, thereby backflushing the pipe and cleaning any material inside, preventing blockage.
[0070] It is understandable that the connecting pipe between the vacuum section 4 and the air nozzle 325, and the connecting pipe between the backflush section 5 and the air nozzle 325, can pass through the conduit sheath 205, the rotating connecting cylinder 204, and the base 301.
[0071] Specifically, each transmission plate 306 is connected to a pressure plate 317, and each pressure plate 317 is connected to an air nozzle 325, meaning one air nozzle 325 corresponds to one through hole 316. The vacuum section 4 may include multiple vacuum section connecting pipes corresponding one-to-one with the multiple air nozzles 325. Each vacuum section connecting pipe may be equipped with a vacuum section control valve and a vacuum section pressure sensor. The vacuum section connecting pipe can be connected to an external vacuum pumping device, and the vacuum section control valve can control the opening and closing of the vacuum section connecting pipe. The backflush section 5 may include multiple backflush section connecting pipes corresponding one-to-one with the multiple air nozzles 325. Each backflush section connecting pipe may be equipped with a backflush section control valve, and the backflush section connecting pipe can be connected to an external air supply device. The backflush section control valve controls the opening and closing of the backflush section connecting pipe.
[0072] like Figures 1 to 3As shown, in the above embodiment, the wafer transfer device further includes a flow guide tube 6, which is connected to a rotating support base. The upper side of the base 301 is provided with an upper groove 318 for mounting a telescopic finger structure. The upper opening of the upper groove 318 is covered by a flow guide plate 320. The flow guide plate 320 is provided with a flow guide hole 321. The flow guide tube 6 is connected to the flow guide hole 321 via a flow guide connecting pipe 7 (specifically, the intermediate connecting pipe can pass through the conduit sheath, the rotating connecting cylinder, and the base to connect with the through hole). In this embodiment, liquid dripping from the transfer plate 306 onto the flow guide plate can flow into the flow guide connecting pipe 7 through the flow guide hole 321 on the flow guide plate 320, then into the flow guide tube 6, and finally flow out from the end of the flow guide tube furthest from the flow guide connecting pipe, thereby timely discharging the liquid dripping onto the mechanical finger mechanism 3 and protecting the components.
[0073] The rotating connecting cylinder 204 can be directly connected to the outer wall of the base 301.
[0074] As an alternative, such as Figure 4 As shown, the lower side of the base 301 is provided with a lower groove 319, and the base 301 also includes a lower cover plate 322 disposed at the lower opening of the lower groove 319; the rotating connecting cylinder 204 passes through the lower cover plate 322 and connects to the upper bottom of the lower groove 319. The upper bottom of the lower groove 319 is provided with a connecting hole 323, which communicates with the rotating connecting cylinder 204. Pipes and wires passing through the conduit sheath and the rotating connecting cylinder can pass through the connecting hole to connect with the structure on the base. The outer wall of the rotating connecting cylinder 204 is provided with an annular groove, and the lower cover plate 322 is provided with a through hole through which the rotating connecting cylinder 204 passes. The edge of the through hole can be locked in the annular groove, which can realize the positioning of the rotating connecting plate and the base.
[0075] Specifically, in order to avoid interfering with the sliding of the mechanical finger, the support plate 307 is arranged in a U-shape, and the guide plate 320 is arranged between the support plate 307 in the first group of telescopic finger structures and the support plate 307 in the second group of telescopic finger structures. In order to protect the mechanical finger, finger guards 324 are provided on both sides of the base 301 in the width direction.
[0076] like Figure 6 As shown, based on the above embodiments, the wafer transfer device further includes a scanning sensor 8 disposed on the base 301 to scan the number of wafers and wafer layers, thereby improving the efficiency of wafer pick-and-place.
[0077] The scanning sensor 8 can be a conventional device that can scan the number of wafers and the layers.
[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention. Numerous specific details are set forth in the specification provided herein. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification. Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features included in other embodiments but not others, combinations of features from different embodiments are meant to be within the scope of the present invention and form different embodiments.
Claims
1. A wafer transport device, characterized in that, include: Linear movement mechanism (1), rotary mechanism (2), mechanical finger mechanism (3), vacuum section (4), backflush section (5), and flow guiding structure; The rotating mechanism (2) includes a rotating support base, a rotating drive assembly and a rotating connector. The rotating support base is connected to the linear motion mechanism (1), the rotating drive assembly is connected to the rotating support base, and the rotating drive assembly is connected to the rotating connector in a transmission manner. The mechanical finger mechanism (3) includes a base (301) and multiple telescopic finger structures; the telescopic finger structure includes mechanical fingers and telescopic drive components, the base (301) is connected to the rotating connector, the telescopic drive components are connected to the base (301), and the multiple telescopic drive components are connected to the multiple mechanical fingers in a one-to-one transmission connection. The linear motion mechanism (1) drives the rotary support in a different direction than the telescopic drive assembly drives the mechanical finger. The mechanical finger includes a transmission plate (306), the front end of which is provided with a through hole (316). The transmission plate (306) is connected to a finger connecting plate (315) through a pressure plate (317). An air nozzle (325) is provided on the pressure plate (317). The vacuum section (4) and the back-blowing section (5) are both connected to the air nozzle (325). The air nozzle (325) is connected to the through hole (316) through a connecting pipe. The flow guiding structure includes a flow guiding pipe (6), a flow guiding plate (320), and a flow guiding connecting pipe (7); the flow guiding pipe (6) is connected to the rotating support base, and the upper side of the base (301) is provided with an upper groove (318) for installing the telescopic finger structure. The upper opening of the upper groove (318) is covered by the flow guiding plate (320), and the flow guiding plate (320) is provided with a flow guiding hole (321). The flow guiding pipe (6) is connected to the flow guiding hole (321) through the flow guiding connecting pipe (7) for collecting the liquid dripping from the transmission plate (306) and discharging it in a centralized manner.
2. The wafer transport device according to claim 1, characterized in that, The linear movement mechanism (1) includes a movement drive assembly, a guide rail base plate (101) and a drag chain base plate (102) arranged at relative intervals; a drag chain (104) is provided on the drag chain base plate (102), and a guide rail (103) is provided on the guide rail base plate (101); the rotation mechanism (2) also includes an adapter box (201) connected to one side of the rotation support seat, the adapter box (201) is connected to the drag chain (104), the rotation support seat is slidably mounted on the guide rail (103) through a support seat slider (202), and the movement drive assembly is connected to the slider in a transmission connection; in the length direction of the guide rail (103), both ends of the guide rail (103) are provided with movement limiting members.
3. The wafer transport device according to claim 1, characterized in that, The rotating support base has an installation cavity (203) formed therein, and the rotating drive assembly is installed in the installation cavity (203); the rotating connector includes a rotating connecting cylinder (204) rotatably disposed in the installation cavity (203), and the rotating mechanism (2) also includes a conduit sheath (205) rotatably disposed in the installation cavity (203); one end of the rotating connecting cylinder (204) is connected to the base (301), and the other end of the rotating connecting cylinder (204) is connected to the conduit sheath (205); the rotating drive assembly is drivenly connected to the rotating connecting cylinder (204).
4. The wafer transport device according to claim 3, characterized in that, A bearing housing (209) is fixed inside the mounting cavity (203); the rotating connector also includes a bearing (211), a rotating sleeve (212), an inner bearing ring sleeve (213), and an outer bearing ring sleeve (214); the bearing (211) is installed inside the bearing housing (209), the rotating sleeve (212) is fitted outside the conduit sheath (205), and the bearing (211) is fitted outside the rotating sleeve (212); the inner bearing ring sleeve (213) is fitted outside the conduit sheath (205). The end of the conduit sheath (205) away from the rotating connecting cylinder (204) is connected to the inner ring pressure sleeve (213) of the bearing, and the other end of the rotating sleeve (212) is fixedly connected to the rotating connecting cylinder (204); the outer ring pressure sleeve (214) of the bearing is sleeved outside the rotating sleeve (212) and connected to the bearing seat (209); the rotating drive assembly is drivenly connected to the inner ring pressure sleeve (213) of the bearing.
5. The wafer transport device according to claim 4, characterized in that, The rotating mechanism (2) further includes a rotating part limiting member; the rotating part limiting member is connected to the rotating connecting cylinder (204) to limit the rotation angle of the rotating connecting cylinder (204).
6. The wafer transport device according to claim 3, characterized in that, The telescopic drive assembly includes a telescopic motor (302), a telescopic drive wheel (303), a telescopic timing belt (305), and a telescopic driven wheel (304); the telescopic motor (302) is connected to the telescopic drive wheel (303), the telescopic driven wheel (304) is spaced apart from the telescopic drive wheel (303) in the length direction of the base (301), and the telescopic timing belt (305) is connected between the telescopic drive wheel (303) and the telescopic driven wheel (304); The mechanical finger includes a support plate (307), a telescopic slider (308), and a telescopic slide rail (309); the support plate (307) is connected to the transmission plate (306), the telescopic slider (308) is connected to the support plate (307), and the telescopic slider (308) slides on the telescopic slide rail (309); the telescopic slider (308) is connected to the telescopic synchronous belt (305).
7. The wafer transport device according to claim 6, characterized in that, Two of the retractable finger structures form a group, wherein one of the retractable finger structures is a first retractable finger structure (31) and the other retractable finger structure is a second retractable finger structure (32); the second retractable finger structure (32) is disposed inside the first retractable finger structure (31), and the transmission plate (306) of the second retractable finger structure (32) can be located below the transmission plate (306) of the first retractable finger structure (31); The second telescopic finger structure (32) further includes an intermediate plate (314); in the second telescopic finger structure (32), one end of the intermediate plate (314) is connected to the support plate (307), and the other end is connected to the telescopic slider (308) and the telescopic timing belt (305) respectively; a gap is formed between the intermediate plate (314) and the base (301), and the telescopic timing belt (305) of the first telescopic finger structure (31) passes through the gap.
8. The wafer transport device according to claim 7, characterized in that, The finger connecting plate (315) is provided with an angle between itself and the transmission plate (306) and the support plate (307); in the thickness direction of the base (301), multiple transmission plates (306) can overlap.