Optical Cone Bracket for ICMOS Coupling, Coupled ICMOS, and Coupling Method

Abstract

The present invention discloses a light cone bracket for ICMOS coupling, the ICMOS after coupling, and a coupling method. The upper part of the light cone bracket has a wedge-shaped boss for transitional fit with corresponding grooves on the light cone, and its upper surface is adhesively bonded to the lower surface of the image intensifier cover plate; the lower frame sleeve structure is used for transitional fit with the chip ceramic frame on the circuit board with a photosensitive chip, and the lower surface of the light cone bracket is adhesively bonded to the upper surface of the chip ceramic frame. The ICMOS after coupling includes a light cone type image intensifier, epoxy resin glue, a light cone bracket, a circuit board with a photosensitive chip, and a coupling liquid; the anode output surface of the light cone type image intensifier has the conical shape of the light cone, and the size of the conical surface is consistent with the chip photosensitive surface on the circuit board with a photosensitive chip to be coupled therewith; the epoxy resin glue is used for adhesively bonding the upper surface of the light cone bracket and the lower surface of the image intensifier cover plate, and the lower surface of the light cone bracket and the chip ceramic frame surface. The present invention avoids the problems of light loss and interference caused by adding the light cone bracket.

Description

Technical Field

[0001] The present invention belongs to the technical field of digital low-light devices; specifically, it relates to a light cone bracket for ICMOS coupling, the coupled ICMOS, and a coupling method. Background Art

[0002] ICMOS (intensified low-light camera) is an important imaging device in the field of digital low-light technology and has significant applications in military, scientific research, and other fields. ICMOS mainly consists of two major parts: a light cone-shaped image intensifier (light cone type) and a readout circuit (with a photosensitive chip). The two are optically coupled in the middle.

[0003] According to the different sizes of the chip photosensitive surfaces of different circuit boards (with photosensitive chips), the sizes of the surfaces on the image intensifier (light cone type) to be coupled with the CMOS are also different.

[0004] Currently, there is no dedicated device and method for ICMOS coupling. In many cases, a light cone bracket is added between the anode end of the image intensifier and the CMOS, resulting in a secondary indirect coupling of three optical devices (the first is that the anode end of the image intensifier is first coupled with the large surface of the light cone, and the second is that the small surface of the light cone is coupled with the CMOS photosensitive surface), as Figure 6 shown. While the light cone bracket completes the structural connection, it must also ensure optical coupling and connect the optical path from the anode end of the image intensifier to the CMOS chip photosensitive surface. The coupled ICMOS is required to have dimensional consistency and performance stability and be able to fit exactly into the housing.

[0005] In summary, the following problems still exist:

[0006] (1) Adding another light cone between the anode end of the image intensifier and the CMOS results in a secondary indirect coupling of three optical devices. Compared with the direct coupling of the current image intensifier (light cone type) and the circuit board (with photosensitive chip), the additional light cone bracket brings problems such as large light loss and light interference, which significantly affect the imaging effect of ICMOS.

[0007] (2) In the existing coupling methods that do not use devices such as light cone brackets for connection and fixation, only the viscosity of the coupling liquid itself is used to stick the image intensifier, light cone, and CMOS. Since the viscosity of the coupling liquid itself is small, the coupled ICMOS is prone to disconnection and detachment.

[0008] (3) In the existing coupling methods that use light cone brackets, there is a lack of mating structures such as wedge-shaped bosses between the light cone bracket and the light cone. As shown in the appendix Figure 7 shown, the connection is not firm after gluing. Summary of the Invention

[0009] The object of the present invention is to overcome the deficiencies of the prior art and provide a light cone bracket for ICMOS coupling, the coupled ICMOS, and a coupling method. The technical problems to be solved by the present invention are as follows:

[0010] (1) Complete the coupling connection between the light cone and the photosensitive chip;

[0011] (2) Ensure the imaging quality of the finished ICMOS product after coupling;

[0012] (3) Ensure the connection stability between the light cone and the photosensitive chip;

[0013] The technical solution adopted by the present invention is as follows:

[0014] According to the first aspect, the present invention provides a light cone bracket for enhancing the coupling of ICMOS for a low-light-level camera. The light cone bracket is mainly composed of upper and lower parts. There are several wedge-shaped bosses on the upper part of the light cone bracket, which are used for transition fit with the corresponding grooves on the light cone. The upper surface of the light cone bracket is adhesively bonded to the lower surface of the image intensifier cover plate. The lower part of the light cone bracket is a frame sleeve structure, which is in transition fit with the chip ceramic frame on the circuit board with the photosensitive chip. The lower surface of the light cone bracket is adhesively bonded to the upper surface of the chip ceramic frame. The image intensifier cover plate is located at the bottom of the light cone type image intensifier.

[0015] According to the second aspect, the present invention provides a coupled enhanced low-light-level camera ICMOS, including a light cone type image intensifier, epoxy resin glue, a light cone bracket, a circuit board with a photosensitive chip, and a coupling liquid. The anode output surface of the light cone type image intensifier has a light cone form, that is, two or four pairs of opposite surfaces of the original columnar structure at the output end are each cut off a wedge shape to make it conical. The size of the conical surface is basically the same as the photosensitive surface of the chip on the circuit board with the photosensitive chip to be coupled with it, and it extends a certain distance out of the image intensifier cover plate. The epoxy resin glue is used for adhesively bonding the upper surface of the light cone bracket and the lower surface of the image intensifier cover plate, and the lower surface of the light cone bracket and the chip ceramic frame surface. The upper part of the light cone bracket is in transition fit with the corresponding groove of the light cone, and its upper surface is adhesively bonded to the lower surface of the image intensifier cover plate. The lower part of the light cone bracket is a frame sleeve structure, which is in transition fit with the chip ceramic frame, and its lower surface is adhesively bonded to the upper surface of the chip ceramic frame. The circuit board with the photosensitive chip has removed the chip glass window. It is required that the distance from the photosensitive surface of the chip to the upper surface of the chip ceramic frame after window removal is not greater than 1 mm, and the flatness of the upper surface of the chip ceramic frame is not greater than 0.8 mm. When coupling, a small drop of coupling liquid is dropped between the anode output surface of the light cone and the photosensitive surface of the chip, and then the two surfaces are naturally fitted.

[0016] According to the third aspect, the present invention provides a coupling method for the light cone bracket of the enhanced low-light-level camera ICMOS, including the following steps:

[0017] First step, before coupling, clean and dry the photocone bracket. Use a cotton swab dipped in alcohol to wipe and clean the anode output surface of the photocone and the photosensitive surface of the chip. Prepare the epoxy resin glue and coupling liquid.

[0018] Second step, when observing that the consistency of the epoxy resin glue is appropriate, evenly apply the glue on the lower surface of the image intensifier cover plate and the upper surface of the photocone bracket respectively. After placing the photocone with the anode output surface facing up (inverted) properly, slowly press the upper surface of the photocone bracket towards the lower surface of the intensifier cover plate, and at the same time, pay attention to the cooperation between the wedge-shaped boss of the photocone bracket and the corresponding groove on the side of the photocone, and make appropriate fine adjustments to make it a transitional fit.

[0019] Third step, add appropriate weights to the well-fitted components and send them into the oven for heating together to quickly cure the epoxy resin glue.

[0020] Fourth step, after the above components are cured and bonded, take them out of the oven. Evenly apply epoxy resin glue with appropriate consistency on the upper surface of the chip ceramic frame of the circuit board with the photosensitive chip and the lower surface of the photocone bracket respectively. Then drop a small drop of coupling liquid on the photosensitive surface of the chip. Next, slowly put the photocone bracket on the chip ceramic frame and gently rotate it slightly to make the anode output surface of the photocone and the photosensitive surface of the chip fit naturally.

[0021] Fifth step, add appropriate weights to the just-coupled components and send them into the oven for heating together to quickly cure the epoxy resin glue.

[0022] Sixth step, after the coupled components are cured and bonded, take them out of the oven and clean them with a heat gun, thus completing the ICMOS coupling process.

[0023] Furthermore, before cleaning the photocone bracket and wiping the anode output surface of the photocone in the first step, the corresponding photocone-type image intensifier and photocone bracket should be selected according to different models of the coupling chips, and then the subsequent coupling steps should be carried out.

[0024] The present invention has the following beneficial effects compared with the prior art:

[0025] 1. Solve the problem of large light loss in the previous secondary indirect coupling. It has been verified by experiments that the ICMOS imaging effect of the directly-coupled intensified low-light camera is improved by 9.7% - 12% compared with that of the secondary indirect coupling.

[0026] 2. Solve the problem of large ICMOS length dimension after the previous secondary indirect coupling. The height of the ICMOS of the directly-coupled intensified low-light camera is reduced by 5 mm - 8 mm compared with that of the secondary indirect coupling.

[0027] 3. The problem that the image intensifier and the circuit board with a photosensitive chip would become loose or fall off after the previous secondary indirect coupling is solved. Now, a transition fit is carried out between the wedge-shaped convex platform of the light cone bracket and the corresponding groove on the light cone. At the same time, the lower surface of the image intensifier cover plate and the upper surface of the light cone bracket are adhesively bonded, ensuring the stability of the coupling. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present invention will be further described in detail below with reference to the accompanying drawings;

[0029] Figure 1 It is a schematic diagram of a well-coupled ICMOS structure;

[0030] Figure 2 It is a three-dimensional view of a well-coupled ICMOS;

[0031] Figure 3 It is a schematic diagram of the light cone tube structure;

[0032] Figure 4 It is a schematic diagram of the light cone bracket structure;

[0033] Figure 5 It is a schematic diagram of the circuit board with a light strip and a photosensitive chip structure;

[0034] Figure 6 It is a schematic diagram of the secondary indirect coupling structure;

[0035] Figure 7 It is a schematic diagram of the light cone bracket structure without a wedge-shaped convex platform;

[0036] In the figure: 1 - light cone type image intensifier, 11 - light cone, 12 - image intensifier cover plate; 2 - epoxy resin adhesive; 3 - light cone bracket, 31 - wedge-shaped convex platform; 4 - circuit board with a photosensitive chip, 41 - chip ceramic frame. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0037] A light cone bracket for ICMOS coupling of an intensified low-light-level camera. The light cone bracket 3 is mainly composed of two upper and lower parts; there are several wedge-shaped convex platforms 31 on the upper part of the light cone bracket 3, and the wedge-shaped convex platforms 31 are used for transition fit with the corresponding grooves on the light cone. The upper surface of the light cone bracket 3 and the lower surface of the image intensifier cover plate 12 are adhesively bonded; the lower part of the light cone bracket 3 is a frame sleeve structure, and the frame sleeve structure and the chip ceramic frame 41 located on the circuit board 4 with a photosensitive chip are in transition fit. The lower surface of the light cone bracket 3 and the upper surface of the chip ceramic frame 41 are adhesively bonded. The image intensifier cover plate 12 is located at the bottom of the light cone type image intensifier 1. The specific structure of the light cone bracket is as Figure 4 shown.

[0038] An enhanced low-light camera ICMOS after coupling, comprising an optical cone image intensifier 1, epoxy resin glue 2, an optical cone bracket 3, a circuit board with a photosensitive chip 4, and a coupling liquid. The specific structure is as shown in Figure 1 and Figure 2 shown; the anode output surface of the optical cone image intensifier 1 has the form of an optical cone 11, that is, a wedge is cut off from two or four pairs of opposite surfaces of the original columnar structure at the output end, making it conical. The size of the conical surface is basically the same as the photosensitive surface of the chip on the circuit board 4 with a photosensitive chip to be coupled with it, and it extends a certain distance out of the image intensifier cover plate 12. The specific structure is as shown in Figure 3 shown; the epoxy resin glue 2 is used for gluing the upper surface of the optical cone bracket 3 and the lower surface of the image intensifier cover plate 12, and the lower surface of the optical cone bracket 3 and the surface of the chip ceramic frame 41. The specific used parts are as shown in Figure 1 shown in; the upper part of the optical cone bracket 3 is in transitional fit with the corresponding groove of the optical cone, and its upper surface is glued to the lower surface of the image intensifier cover plate 12; the lower part of the optical cone bracket 3 is a frame sleeve structure, in transitional fit with the chip ceramic frame, and its lower surface is glued to the upper surface of the chip ceramic frame 41; the circuit board 4 with a photosensitive chip has removed the chip glass window. After removing the window, the distance from the photosensitive surface of the chip to the upper surface of the chip ceramic frame 41 should not be greater than 1 mm, and the flatness of the upper surface of the chip ceramic frame 41 should not be greater than 0.8 mm. When coupling, a small drop of coupling liquid is dropped between the anode output surface of the optical cone 11 and the photosensitive surface of the chip, and then the two surfaces are naturally fitted. The specific structure is as shown in Figure 5 shown.

[0039] A coupling method for the optical cone bracket of an enhanced low-light camera ICMOS coupling, comprising the following steps:

[0040] The first step, before coupling, the optical cone bracket 3 needs to be cleaned and dried. The anode output surface of the optical cone 11 and the photosensitive surface of the chip need to be wiped clean with a cotton swab dipped in alcohol, and the epoxy resin glue and the coupling liquid are configured well;

[0041] The second step, when observing that the consistency of the epoxy resin glue is appropriate, the glue is evenly applied to the lower surface of the image intensifier cover plate 12 and the upper surface of the optical cone bracket 3 respectively. After placing the anode output surface of the optical cone 11 facing up (inverted), the upper surface of the optical cone bracket 3 is slowly pressed towards the lower surface of the image intensifier cover plate 12, and at the same time, pay attention to the cooperation between the wedge-shaped boss 31 of the optical cone bracket 3 and the corresponding groove on the side of the optical cone 11, and make appropriate fine adjustments to make it in transitional fit;

[0042] The third step, apply appropriate weights to the assembled parts and send them into the oven for heating together to quickly cure the epoxy resin glue;

[0043] Step 4: After the above components are cured and bonded, take them out of the oven. Apply epoxy resin glue with appropriate consistency evenly on the upper surface of the chip ceramic frame 41 of the circuit board 4 with a photosensitive chip and on the lower surface of the optical cone bracket 3. Then, drip a small drop of coupling liquid on the photosensitive surface of the chip. Next, slowly put the optical cone bracket 3 onto the chip ceramic frame 41 and gently rotate it slightly to adjust so that the anode output surface of the optical cone 11 and the photosensitive surface of the chip are naturally fitted together;

[0044] Step 5: Add appropriate weights to the just-coupled components and send them into the oven for heating together to quickly cure the epoxy resin glue;

[0045] Step 6: After the coupled components are cured and bonded, take them out of the oven and clean them with a heat gun, thus completing the ICMOS coupling process.

[0046] Before the first step of cleaning the optical cone bracket 3 and wiping the anode output surface of the optical cone 11, the corresponding optical cone image intensifier 1 and optical cone bracket 3 should be selected according to different models of the coupling chips, and then the subsequent coupling steps are carried out.

[0047] It should be noted that the words expressing positions and directions described in this application are all illustrated with the attached drawings as examples, but can be changed according to needs, and all the changes made are included in the protection scope of this application. The attached drawings of this application are only used to illustrate the relative position relationship and do not represent the actual proportion.

Claims

1. An optical cone bracket for enhancing ICMOS coupling of a low-light camera, characterized in that, The light cone bracket (3) consists of two upper and lower parts; several wedge-shaped bosses (31) are provided on the upper part of the light cone bracket (3), and the wedge-shaped bosses (31) are used for transitional fit with corresponding grooves on the light cone (11). The upper surface of the light cone bracket (3) is adhesively bonded to the lower surface of the image intensifier cover plate (12); the lower part of the light cone bracket (3) is a frame sleeve structure, which is used for transitional fit with the chip ceramic frame (41) on the circuit board (4) with a photosensitive chip, and the lower surface of the light cone bracket (3) is adhesively bonded to the upper surface of the chip ceramic frame (41); The light cone (11) is located on the anode output surface of the light cone type image intensifier (1) and is conical in shape, and the size of its conical surface is consistent with the chip photosensitive surface on the circuit board (4) with a photosensitive chip to be coupled thereto; The image intensifier cover plate (12) is located at the bottom of the light cone type image intensifier (1).

2. An enhanced low-light camera ICMOS after coupling, characterized in that, It includes a light cone bracket for ICMOS coupling of an intensified low-light-level camera as described in claim 1. The coupled intensified low-light-level camera ICMOS includes a light cone type image intensifier (1), epoxy resin adhesive (2), a light cone bracket (3), a circuit board (4) with a photosensitive chip, and a coupling liquid; the light cone type image intensifier (1) extends a certain distance out of the image intensifier cover plate (12); the epoxy resin adhesive (2) is used for adhesively bonding the upper surface of the light cone bracket (3) and the lower surface of the image intensifier cover plate (12), and the lower surface of the light cone bracket (3) and the surface of the chip ceramic frame (41); The light cone bracket (3) is used to realize the coupling between the light cone type image intensifier (1) and the circuit board (4) with a photosensitive chip.

3. The enhanced low-light camera ICMOS after coupling according to claim 2, characterized in that The circuit board (4) with a photosensitive chip has had its chip glass window removed, and the distance from the chip photosensitive surface to the upper surface of the chip ceramic frame (41) after window removal is not greater than 1 mm.

4. The enhanced low-light camera ICMOS after coupling according to claim 2, characterized in that, The flatness of the upper surface of the chip ceramic frame (41) is not greater than 0.8 mm.

5. The enhanced low-light camera ICMOS after coupling according to claim 2, characterized in that, When coupling, a small drop of coupling liquid is dropped between the anode output surface of the light cone (11) and the chip photosensitive surface, and then the two surfaces are naturally fitted together.

6. The coupled intensified low-light-level camera ICMOS according to any one of claims 2-5, characterized in that Two or four pairs of opposite surfaces of the original columnar structure of the anode output surface of the light cone type image intensifier (1) are each cut off a wedge shape to make it conical in shape.

7. A coupling method for an enhanced low-light camera ICMOS after coupling as described in any one of claims 2-6, characterized in that, It includes the following steps: The first step is to clean and dry the light cone bracket (3) before coupling. The anode output surface of the light cone (11) and the chip photosensitive surface need to be wiped clean with a cotton swab dipped in alcohol, and the epoxy resin adhesive and the coupling liquid are prepared well; The second step is when observing that the consistency of the epoxy resin adhesive is appropriate, apply the adhesive evenly on the lower surface of the image intensifier cover plate (12) and the upper surface of the light cone bracket (3). After placing the light cone (11) with the anode output surface facing up (inverted), slowly press the upper surface of the light cone bracket (3) towards the lower surface of the image intensifier cover plate (12), and at the same time pay attention to the cooperation between the wedge-shaped bosses (31) of the light cone bracket (3) and the corresponding grooves on the side of the light cone (11), and make appropriate fine adjustments to enable transitional fit; The third step is to add appropriate weights to the assembled components and send them into an oven for heating to quickly cure the epoxy resin adhesive; Fourth step, after the above components are cured and bonded, take them out of the oven, evenly apply epoxy resin glue with appropriate consistency on the upper surface of the chip ceramic frame (41) of the circuit board (4) with a photosensitive chip and the lower surface of the light cone support (3), then drop a small drop of coupling liquid on the photosensitive surface of the chip, and then slowly put the light cone support (3) on the chip ceramic frame (41), and gently rotate it slightly to adjust so that the anode output surface of the light cone (11) and the photosensitive surface of the chip are naturally fitted; Fifth step, apply appropriate weights to the just-coupled components and send them into the oven for heating together to quickly cure the epoxy resin glue; Sixth step, after the coupled components are cured and bonded, take them out of the oven and clean them with a heat gun, thus completing the ICMOS coupling process.

8. The coupling method according to claim 7, wherein In the first step, before cleaning the light cone support (3) and wiping the anode output surface of the light cone (11), select the corresponding light cone image intensifier (1) and light cone support (3) according to different models of the coupling chips, and then carry out the subsequent coupling steps.

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