Method and device for rounding and grooving a crystal bar

Abstract

The present application provides a method and a device for rounding and grooving a crystal bar. The method for rounding and grooving a crystal bar comprises the following steps: clamping the crystal bar, collecting data, drawing a two-dimensional contour map, grinding the crystal bar and processing. The device for rounding and grooving a crystal bar comprises a first chuck unit and a second chuck unit, a data collection mechanism, a data drawing mechanism, a grinding part and a grooving part. The method and the device for rounding and grooving a crystal bar provided by the present application perform rounding and grinding on the whole crystal bar and then grooving, which improves the processing efficiency, saves time, reduces the labor cost and increases the yield rate of products.

Description

Technical Field

[0001] This application relates to the technical field of crystal bar processing, and in particular to a method and device for rounding and grooving a crystal bar. Background Art

[0002] During the processing of semiconductor materials, in order to identify specific crystal orientations on a silicon single crystal bar or wafer, generally, after the single crystal bar is oriented and the outer circular surface is ground, the reference plane or Notch groove of the single crystal bar is processed.

[0003] Currently, the relatively mature technical methods for growing semiconductor-grade single crystal silicon bars are the zone melting method or the Czochralski method. During the single crystal growth process, due to the skew of the seed crystal placement and the changes in process conditions and thermal field temperature gradients during the single crystal growth process, the diameter of the single crystal silicon bar will have a large distribution difference along the axial direction, commonly known as a "gourd bar", and it is even more likely to cause the distortion of the single crystal silicon bar. In the case of the above situation, the commonly used method is to first cut the single crystal silicon bar into single crystal silicon segments of different lengths, and then perform the rounding and grooving processing on each single crystal silicon segment, resulting in low processing efficiency and wasting time and labor costs.

[0004] For the Notch groove processing of a single crystal silicon bar, it is necessary to detect the crystal orientation to determine the grooving position and then perform the Notch groove processing. Currently, the most effective and convenient method for detecting the crystal orientation is to use an X-ray orientation device in combination with the Bragg diffraction principle to find the crystal orientation. However, currently, all Notch groove detection methods only detect the position of a single point on the single crystal silicon bar or single crystal silicon block. Since the overall crystal orientation deviation of the single crystal silicon bar is not determined during the outer diameter rounding process of the single crystal silicon bar, after rounding a longer single crystal silicon bar or single crystal silicon block, the grooving position is not completely parallel to the rotation center during the rounding process of the single crystal silicon bar, resulting in deviations in the grooving positions at the head and tail of the single crystal silicon bar, and seriously, it will exceed the specifications required for the finished product, causing defective products to be produced. Summary of the Invention

[0005] This application provides a method and device for rounding and grooving a crystal bar to solve the problems existing in the prior art, perform grooving after overall rounding and grinding of the crystal bar, improve processing efficiency, save time, reduce labor costs, and increase the yield rate of products.

[0006] The ingot rounding and grooving method provided by this application includes the following steps: clamping the ingot, the first chuck unit is provided with a first clamping ball head, and the second chuck unit is provided with a second clamping ball head. Both the first clamping ball head and the second clamping ball head are rotatably arranged. Clamp the two ends of the ingot on the first clamping ball head and the second clamping ball head respectively; collect data, and the data collection mechanism moves along the positive direction of the axial direction of the ingot to collect the first axial data of the ingot and the first outer diameter data corresponding to the first axial data. Rotate the ingot 90° along the central axis of the ingot by the first clamping ball head and the second clamping ball head, and the data collection mechanism moves along the reverse direction of the axial direction of the ingot to collect the second axial data of the ingot and the second outer diameter data corresponding to the second axial data; draw a two-dimensional contour map. When it is judged that the clamping position of the ingot meets the processing requirements according to the first outer diameter data and the second outer diameter data, draw a two-dimensional contour map of the distance from the outer side of the ingot to the central axis of the ingot according to the first axial data, the first outer diameter data, the second axial data and the second outer diameter data; grind the ingot, set the distance between adjacent contour lines in the contour map as the single grinding amount of the grinding part, control the grinding part to move to the axial position of the ingot corresponding to the highest contour line of the contour map in turn, and preferentially perform roll grinding from the highest contour line until the overall outer diameter of the ingot along the axial direction is ground to the target outer diameter range; groove, determine the grooving line of the ingot, and calculate the angular velocity ω = αV / L that the ingot needs to rotate when grooving according to the rotation angle α of the ingot, the axial length L of the grooving line, and the axial moving speed V of the grooving part along the ingot, so that the grooving part can groove along the grooving line.

[0007] Optionally, it further includes: when it is judged that the clamping position of the ingot does not meet the processing requirements according to the first outer diameter data and the second outer diameter data, adjust the clamping position of the ingot to the position that meets the ingot processing requirements according to the calculated distance and angle through the jacking mechanism, and re-perform the step of collecting data.

[0008] Optionally, adjusting the clamping position of the ingot to the position that meets the ingot processing requirements through the jacking mechanism includes: respectively arranging a first jacking part and a second jacking part at both ends of the ingot along the axial direction, and controlling the first jacking part and the second jacking part to lift and lower cooperatively to adjust the ingot to the position that meets the calculated ingot processing requirements.

[0009] Optionally, collecting the first axial data of the ingot and the first outer diameter data corresponding to the first axial data by moving the data collection mechanism along the positive direction of the axial direction of the ingot includes: arranging a first probe and a second probe, so that the detection points of the first probe and the second probe on the ingot are located in the same plane as the central axis of the ingot, and installing both the first probe and the second probe on a movable bracket, and moving the bracket along the axial direction of the ingot.

[0010] The present application also provides a crystal bar rounding and grooving device, including: a first chuck unit and a second chuck unit, the second chuck unit is slidably arranged, a first clamping ball head is arranged on the first chuck unit, a second clamping ball head is arranged on the second chuck unit, the first clamping ball head and the second clamping ball head are used for clamping the two ends of the crystal bar respectively and can be rotatably arranged; a data acquisition mechanism, the data acquisition mechanism is used for acquiring the axial data of the crystal bar and the outer diameter data corresponding to the axial data; a data drawing mechanism, the data drawing mechanism is communicatively connected with the data acquisition mechanism to synthesize three-dimensional outer surface data of the crystal bar according to the axial data and the outer diameter data and draw a two-dimensional contour map according to the three-dimensional outer surface data; a grinding part, the grinding part abuts against the outer surface of the crystal bar and sequentially moves to the crystal bar corresponding to the highest contour line in the contour map to grind the crystal bar to grind the crystal bar to a target outer diameter range. A grooving part, the grooving part is used for grooving the crystal bar along the grooving line of the ground crystal bar.

[0011] Optionally, the data acquisition mechanism includes a first probe and a second probe, the detection points of the first probe and the second probe on the crystal bar and the rotation center lines of the first clamping ball head and the second clamping ball head are in the same plane, the first probe and the second probe are both installed on a movable support to move along the axial direction of the crystal bar.

[0012] Optionally, the crystal bar rounding and grooving device further includes a slide rail, and the second chuck unit is slidably arranged on the slide rail.

[0013] Optionally, the crystal bar rounding and grooving device further includes a lifting mechanism, the lifting mechanism includes a first lifting member and a second lifting member, the first lifting member and the second lifting member are used for abutting against the two ends of the crystal bar along the axial direction respectively, and adjusting the position of the crystal bar by cooperative lifting.

[0014] Optionally, both the first lifting member and the second lifting member include V-shaped clamping blocks for fitting on the crystal bar.

[0015] Optionally, the crystal bar rounding and grooving device further includes a rinser, the rinser includes a liquid outlet, the liquid outlet is arranged towards the crystal bar, so that the pressurized rinsing liquid sprayed from the liquid outlet rinses the crystal bar.

[0016] The crystal bar rounding and grooving method and device provided by the present application draw a two-dimensional contour map on a drawing software according to the collected outer diameter data and axial data of the crystal bar, and control the grinding method and single grinding amount of the grinding part according to the contour map, optimizing the processing method, which is very beneficial to the overall grinding process of the gourd bar and the twisted crystal bar. In addition, aiming at the problem of crystal orientation deviation of the crystal bar, a method for detecting the actual grooving position of the crystal bar and performing overall grooving is proposed, which effectively improves the processing efficiency of the crystal bar, reduces the loss of the crystal bar, and effectively increases the production capacity. Description of the Drawings

[0017] The preferred embodiments of the present application will be described in detail below with reference to the drawings to help understand the purpose and advantages of the present application, where:

[0018] Figure 1 It is a flowchart of the crystal bar rounding and grooving method provided by an alternative embodiment of the present application.

[0019] Figure 2 It is a schematic structural diagram of the crystal bar rounding and grooving device provided by an alternative embodiment of the present application.

[0020] Figure 3 It is a schematic structural diagram of the first probe and the second probe moving along the axial direction of the crystal bar to collect data provided by an alternative embodiment of the present application.

[0021] Figure 4 It is a schematic structural diagram of the lifting mechanism lifting the crystal bar provided by an alternative embodiment of the present application.

[0022] Figure 5 It is a grooving movement diagram of the grooving line and the corresponding grooving part on the crystal bar provided by an alternative embodiment of the present application.

[0023] Figure 6 It is a schematic structural diagram of the first clamping ball head provided by an alternative embodiment of the present application.

[0024] Description of the Reference Numerals:

[0025] 1 - First chuck unit, 10 - Second chuck unit, 11 - Slide rail, 12 - First clamping ball head, 13 - Angle encoding controller, 14 - Servo motor, 15 - Second clamping ball head;

[0026] 2 - Grinding mechanism, 20 - Grinding part, 21 - Grooving part;

[0027] 3 - Data acquisition mechanism, 30 - First probe, 31 - Second probe;

[0028] 4 - First lifting member, 40 - Second lifting member, 41 - Clamping block;

[0029] 5 - Crystal bar, 50 - Grooving line;

[0030] 6 - X - ray diffraction mechanism. Specific implementation manner

[0031] In this specification, the orientation terms such as up, down, left, right, front, back, front side, back side, top, bottom, etc., which are mentioned or may be mentioned, are defined with respect to the structures shown in the respective drawings. The terms "inner" and "outer" respectively refer to the directions towards or away from the geometric center of a specific component. They are relative concepts and thus may change accordingly depending on their different positions and usage states. Therefore, these or other orientation terms should not be construed as restrictive terms.

[0032] This application provides a method for rounding and grooving a crystal bar, which includes the following steps:

[0033] S1: Clamp the crystal bar. The first clamping unit is provided with a first clamping ball head, and the second clamping unit is provided with a second clamping ball head. Both the first clamping ball head and the second clamping ball head are rotatably arranged. The two ends of the crystal bar are respectively clamped on the first clamping ball head and the second clamping ball head. In this step, the feeding manipulator centering device places the crystal bar between the first clamping ball head and the second clamping ball head and clamps it to achieve the initial clamping of the crystal bar.

[0034] S2: Collect data. The data acquisition mechanism moves along the positive axial direction of the crystal bar to collect the first axial data of the crystal bar and the first outer diameter data corresponding to the first axial data. The first clamping ball head and the second clamping ball head rotate the crystal bar 90° along the central axis of the crystal bar, and the data acquisition mechanism moves along the reverse axial direction of the crystal bar to collect the second axial data of the crystal bar and the second outer diameter data corresponding to the second axial data. In this step, the data acquisition mechanism collects the outer diameter data of the crystal bar twice. Specifically, keep the crystal bar fixed, move the detection probe of the data acquisition mechanism along the axial direction of the crystal bar from the first clamping unit to the second clamping unit, and record the data of the outer diameter of the crystal bar from the center of rotation of the first clamping ball head and the second clamping ball head once, which is the first outer diameter data, and the overall axial length data of the crystal bar, which is the first axial data corresponding to the first outer diameter data. The first clamping ball head and the second clamping ball head control the crystal bar to rotate 90°, move the probe of the data acquisition mechanism along the reverse axial direction of the crystal bar, and record the data of the outer diameter of the crystal bar from the center of rotation of the first clamping ball head and the second clamping ball head once again, which is the second outer diameter data, and the overall axial length data of the crystal bar, which is the second axial data corresponding to the second outer diameter data.

[0035] S3: Draw a two-dimensional contour map. When it is determined that the clamping position of the ingot meets the processing requirements according to the first outer diameter data and the second outer diameter data, draw a two-dimensional contour map of the distance from the outer side surface of the ingot to the central axis of the ingot according to the first axial data, the first outer diameter data, the second axial data, and the second outer diameter data. In this step, transform the first outer diameter data and the second outer diameter data into the distances from the outer side surfaces corresponding to 0°, 90°, 180°, and 270° of the ingot circumference to the central axis of the ingot. Take the axial length data as the X-axis, the rotation angle data as the Y-axis, and the distance from the outer side surface of the ingot to the central axis of the ingot as the Z-axis. Synthesize the above data into a three-dimensional outer surface diagram of the ingot in drawing software including but not limited to Matlab, Origin, etc., and draw a two-dimensional contour map of the distance from the outer side surface of the ingot to the central axis of the ingot in the drawing software according to the synthesized three-dimensional outer surface diagram.

[0036] S4: Grind the ingot. Set the distance along the axis of a single contour line in the contour map as the single grinding amount of the grinding part. Control the grinding part to move sequentially to the axial position of the ingot corresponding to the highest contour line in the contour map, and preferably start grinding from the highest contour line until the overall outer diameter of the ingot along the axis is ground to the target outer diameter range. In this step, the distance along the axis of a single contour line is half of the single radial grinding amount of the grinding part. Optionally, this distance is set to 1 mm. According to the contour map, the controller controls the grinding part to process from the highest contour line to the target outer diameter range preferentially, and moves the grinding part to the axial position corresponding to the highest contour line for grinding. Continuously repeat the above steps, and the grinding part grinds the axial positions corresponding to the remaining highest contour lines in the contour map in sequence until the overall outer diameter of the ingot is ground to the target outer diameter range. The grinding part is in the form of a grinding wheel. For rough machining, the grinding wheel particle size is selected from #60 to #80 grinding wheels, preferably #80 grinding wheels. Then perform finish machining on the rough machined outer diameter. For finish machining, select grinding wheels from #120 to #200, preferably #170 grinding wheels for finish machining.

[0037] S5: Groove. Determine the grooving line of the ingot, and calculate the angular velocity ω that the ingot needs to rotate during grooving according to the rotation angle α of the ingot, the axial length of the grooving line, and the axial moving speed of the grooving part along the ingot, so that the grooving part can groove along the grooving line. After machining the outer diameter of the ingot to the specified outer diameter range, open a Notch groove on the ingot.

[0038] In this step, the method for determining the grooving line of the ingot is as follows: First, detect the grooving position at the head of the ingot, and detect the grooving position on the ingot near the first chuck unit. The detection position is at a distance of one ingot outer diameter length from the first chuck unit. According to the diffraction angle of the crystal orientation to be detected, fix the positions of the emitting end and the receiving end of the X-ray diffraction mechanism. Slowly rotate the ingot through the first clamping ball head and the second clamping ball head to find the position with the maximum diffraction intensity of the ingot, which is the first point of the grooving position of the ingot. Keep the ingot stationary, then move the entire X-ray diffraction mechanism to the second chuck unit. The detection position is at a distance of one ingot outer diameter length from the second chuck unit. Rotate the ingot through the first clamping ball head and the second clamping ball head to detect the grooving position at the tail of the ingot. The rotation angle of the ingot is controlled within the range of ±4°. Find the position with the maximum diffraction intensity of the ingot, which is the second point of the grooving position of the ingot. The straight line connecting the first point and the second point of the grooving position on the ingot is the grooving line of the ingot, and record the rotation angle α of the ingot relative to the initial position at this time.

[0039] In this step, the first clamping ball head is driven by a servo motor to rotate. The servo motor is communicatively connected to an angle encoding controller, and the rotation angle of the first clamping ball head is controlled by the angle encoding controller. The second clamping ball head rotates passively accordingly to achieve high-precision rotation of the ingot.

[0040] In this step, the grooving part can be a grooving grinding wheel. According to the rotation angle α of the ingot, the axial length L of the grooving line, and the axial moving speed V of the grooving grinding wheel along the ingot, calculate the angular velocity ω = αV / L required for the ingot to rotate during grooving, so that the grooving grinding wheel can groove along the grooving line. The angle of the grooving grinding wheel is adjusted according to the rotation angle α required for the ingot to rotate. The grooving angle of the grinding wheel is controlled by the shape of the grinding wheel. For different grooving position requirements, angle value compensation machining can be performed by controlling the rotation angle α of the ingot.

[0041] The ingot rounding and grooving method provided by the embodiment of the present application draws a two-dimensional contour map on the drawing software according to the collected outer diameter data and axial data of the ingot, and controls the grinding method and the single grinding amount of the grinding part according to the contour map, optimizing the processing method, which is very beneficial to the overall grinding process of the gourd-shaped ingot and the twisted ingot. In addition, aiming at the problem of crystal orientation deviation of the ingot, a method for detecting the actual grooving position of the ingot and performing overall grooving is proposed, which effectively improves the processing efficiency of the ingot, reduces the loss of the ingot, and effectively increases the production capacity.

[0042] As an alternative embodiment, it further includes: when it is determined that the clamping position of the ingot does not meet the processing requirements according to the first outer diameter data and the second outer diameter data, the clamping position of the ingot is adjusted to a position that meets the processing requirements of the ingot according to the calculated distance and angle by means of a lifting mechanism, and the step of collecting data is performed again. In this step, if the eccentricity data calculated from the first outer diameter data and the second outer diameter data exceeds a set value, usually set to 4 mm, it indicates that the current clamping position of the ingot does not meet the processing requirements and needs to be adjusted. As an alternative embodiment, adjusting the clamping position of the ingot to a position that meets the processing requirements of the ingot by means of a lifting mechanism includes: respectively arranging a first lifting member and a second lifting member at both axial ends of the ingot, and controlling the first lifting member and the second lifting member to lift cooperatively to adjust the ingot to a position that meets the calculated processing requirements of the ingot. Each of the first lifting member and the second lifting member is lifted and lowered under the drive of a lead screw driven by a servo motor, and the lifting and lowering of the first lifting member and the second lifting member are controlled by a coding controller to realize the cooperative lifting and lowering of the first lifting member and the second lifting member to adjust the position of the ingot.

[0043] As an alternative embodiment, the step of collecting the first axial data of the ingot and the first outer diameter data corresponding to the first axial data by the data collection mechanism moving along the positive direction of the axis of the ingot includes: arranging a first probe and a second probe, so that the detection points of the first probe and the second probe on the ingot are located in the same plane as the central axis of the ingot, and installing the first probe and the second probe on a movable bracket, and moving the bracket along the axis of the ingot. The first probe and the second probe in the application embodiment are both contact probes, and the first probe and the second probe are jointly arranged on a movable bracket, which has the advantages of compact structure and good synchronism.

[0044] The present application also provides an ingot rounding and grooving device, including: a first chuck unit 1, a second chuck unit 10, a data collection mechanism 3, a data plotting mechanism, a grinding unit 20, and a grooving unit 21.

[0045] The second chuck unit 10 is slidably arranged. The first chuck unit 1 is provided with a first clamping ball head 12, and the second chuck unit 10 is provided with a second clamping ball head 15. The first clamping ball head 12 and the second clamping ball head 15 are used to respectively clamp the two ends of the ingot 5 and are both rotatably arranged. The data acquisition mechanism 3 is used to acquire the axial data of the ingot 5 and the outer diameter data corresponding to the axial data. The data plotting mechanism is communicatively connected to the data acquisition mechanism 3 to synthesize the three-dimensional outer axial surface data of the ingot 5 according to the axial data and the outer diameter data and draw a two-dimensional contour map according to the three-dimensional outer axial surface data. The grinding part 20 can be a grinding head, and the grinding head abuts against the outer axial surface of the ingot 5 and sequentially moves to the position of the ingot 5 corresponding to the highest contour line in the contour map to grind the ingot 5 so as to grind the whole ingot 5 to the target outer diameter range. The grooving part 21 is used to groove the ingot 5 along the grooving line 50 of the ground ingot 5. As Figure 2 shown, the grinding part 20 and the grooving part 21 can be integrated on a grinding mechanism 2, which improves the compactness of the equipment.

[0046] The ingot rounding and grooving device provided by the embodiment of the present application clamps the ingot 5 according to the following method: The feeding manipulator centering device places the ingot 5 between the first clamping ball head 12 and the second clamping ball head 15 and clamps it to realize the initial clamping of the ingot 5.

[0047] The ingot rounding and grooving device provided by the embodiment of the present application acquires data according to the following method: The data acquisition mechanism 3 acquires the outer diameter data of the ingot 5 twice. Specifically, keeping the ingot 5 fixed, the detection probe of the data acquisition mechanism 3 is moved along the axial direction of the ingot 5 from the first chuck unit 1 to the second chuck unit 10, and the data of the outer diameter of the ingot 5 from the center of rotation of the first clamping ball head 12 and the second clamping ball head 15, i.e., the first outer diameter data, and the overall axial length data of the ingot 5, i.e., the first axial data corresponding to the first outer diameter data, are recorded. The first clamping ball head 12 and the second clamping ball head 15 control the ingot 5 to rotate 90°, the detection probe of the data acquisition mechanism 3 is moved in the reverse axial direction of the ingot 5, and the data of the outer diameter of the ingot 5 from the center of rotation of the first clamping ball head 12 and the second clamping ball head 15, i.e., the second outer diameter data, and the overall axial length data of the ingot 5, i.e., the second axial data corresponding to the second outer diameter data, are recorded again.

[0048] The crystal bar rounding and grooving device provided by the embodiment of the present application draws a two-dimensional contour map according to the following method: convert the first outer diameter data and the second outer diameter data into the distances from the outer side surfaces corresponding to 0°, 90°, 180°, and 270° of the crystal bar circumference to the central axis of the crystal bar. Take the axial length data as the X-axis, the rotation angle data as the Y-axis, and the distance from the outer side surface of the crystal bar to the central axis as the Z-axis. Synthesize the above data into a three-dimensional outer axis surface diagram of the crystal bar in drawing software including but not limited to Matlab, Origin, etc., and draw a two-dimensional contour map of the distance from the outer side surface of the crystal bar to the central axis of the crystal bar in the drawing software according to the synthesized three-dimensional outer axis surface diagram.

[0049] The crystal bar rounding and grooving device provided by the embodiment of the present application grinds the crystal bar 5 according to the following method: the distance of a single contour line along the axis is the single axial grinding amount of the grinding part 20. Optionally, this axial distance is set to 1 mm. According to the contour map, the controller controls the grinding part 20 to process from the highest contour line to the target outer diameter range preferentially, and moves the grinding part 20 to the axial position corresponding to the highest contour line for rolling grinding. Continuously repeat the above steps, and the grinding part 20 rolls and grinds the axial positions corresponding to the remaining highest contour lines in the contour map in turn until the overall outer diameter of the crystal bar 5 is ground to the target outer diameter range. The grinding part 20 is in the form of a grinding wheel. The particle size of the rough machining grinding wheel is selected from #60 to #80 grinding wheels, preferably #80 grinding wheels. Then, finish machining is performed on the rough machined outer diameter. The finish machining grinding wheel is selected from #120 to #200 grinding wheels, preferably #170 grinding wheels for finish machining.

[0050] After machining the outer diameter of the crystal bar 5 to the specified outer diameter range, a Notch groove is opened on the crystal bar 5.

[0051] The ingot rounding and grooving device provided by the embodiment of the present application determines the grooving line 50 according to the following method: First, detect the grooving position at the head of the ingot 5, and detect the grooving position on the ingot 5 close to the first chuck unit 1. The detection position is at a distance equal to the outer diameter length of one ingot 5 from the first chuck unit 1. According to the required diffraction angle of the crystal orientation to be detected, fix the positions of the emitting end and the receiving end of the X-ray diffraction mechanism 6. Slowly rotate the ingot 5 through the first clamping ball head 12 and the second clamping ball head 15 to find the position with the maximum diffraction intensity of the ingot 5, which is the first point of the grooving position of the ingot 5. Keep the ingot 5 stationary, then move the entire X-ray diffraction mechanism 6 to the second chuck unit 10. The detection position is at a distance equal to the outer diameter length of one ingot 5 from the second chuck unit 10. Rotate the ingot 5 through the first clamping ball head 12 and the second clamping ball head 15 to detect the grooving position at the tail of the ingot 5. The rotation angle of the ingot 5 is controlled within the range of ±4°. Find the position with the maximum diffraction intensity of the ingot 5, which is the second point of the grooving position of the ingot 5. The straight line connecting the first point and the second point of the grooving position on the ingot 5 is the grooving line 50 of the ingot 5, and record the rotation angle α of the ingot 5 relative to the initial position at this time.

[0052] Among them, the first clamping ball head 12 is driven to rotate by the servo motor 14. The servo motor 14 is communicatively connected with the angle encoding controller 13, and the rotation angle of the first clamping ball head 12 is controlled by the angle encoding controller 13. The second clamping ball head 15 rotates drivenly accordingly to achieve the high-precision rotation of the ingot 5.

[0053] The ingot rounding and grooving device provided by the embodiment of the present application determines the grooving of the ingot 5 according to the following method: The grooving part 21 can be a grooving grinding wheel. According to the rotation angle α of the ingot 5, the axial length L of the grooving line 50, and the axial moving speed V of the grooving grinding wheel along the ingot 5, calculate the angular velocity ω = αV / L required for the ingot 5 to rotate during grooving, so that the grooving grinding wheel can groove along the grooving line 50. The angle of the grooving grinding wheel is adjusted according to the rotation angle α required for the ingot 5 to rotate. The grooving angle of the grinding wheel is controlled by the shape of the grinding wheel. For different grooving position requirements, angle value compensation processing can be performed by controlling the rotation angle α of the ingot 5. Figure 5 The direction indicated by the arrow C in the figure is one embodiment of the rotation direction of the ingot 5 during the grooving process.

[0054] In the embodiment of the present application, the first clamping ball head 12 and the second clamping ball head 15 are different for different ingot 5 sizes. Optionally, for a 12-inch ingot 5, the outer diameters of the first clamping ball head 12 and the second clamping ball head 15 are 150 mm, and for an 8-inch ingot 5, the outer diameters of the first clamping ball head 12 and the second clamping ball head 15 are 100 mm.

[0055] The crystal bar rounding and grooving device provided by the embodiment of the present application draws a two-dimensional contour map on a drawing software according to the collected outer diameter data and axial data of the crystal bar 5, and controls the grinding method and the single grinding amount of the grinding part 20 according to the contour map, optimizing the processing method, which is very beneficial to the overall rolling and grinding of the gourd bar and the twisted crystal bar 5. In addition, aiming at the problem of crystal orientation deviation of the crystal bar 5, a method for detecting the actual grooving position of the crystal bar 5 and performing overall grooving is proposed, effectively improving the processing efficiency of the crystal bar 5, reducing the loss of the crystal bar 5, and effectively improving the production capacity.

[0056] As an alternative embodiment, the data acquisition mechanism 3 includes a first probe 30 and a second probe 31. The detection points of the first probe 30 and the second probe 31 on the crystal bar 5 and the rotation center lines of the first clamping ball head 12 and the second clamping ball head 15 are located in the same plane. The first probe 30 and the second probe 31 are both installed on a movable bracket and move along the axial direction of the crystal bar 5. The first probe 30 and the second probe 31 in the embodiment of the present application are both contact probes. The first probe 30 and the second probe 31 are jointly arranged on a movable bracket, having the advantages of compact structure and good synchronization. Figure 3 The direction shown by the arrow A in the figure is an alternative embodiment of the common movement of the first probe 30 and the second probe 31.

[0057] As an alternative embodiment, the crystal bar rounding and grooving device further includes a slide rail 11, and the second chuck unit 10 is slidably arranged on the slide rail 11. The first chuck unit 1 is a fixed chuck, and the second chuck unit 10 is movable. The second chuck unit 10 being slidably arranged on the slide rail 11 can adapt to crystal bars 5 of various lengths, improving the applicable range of the crystal bar rounding and grooving device. The second chuck unit 10 can be slidably arranged on the slide rail 11 through a slider, a sliding rod or a sliding frame.

[0058] As an alternative embodiment, the crystal bar rounding and grooving device further includes a lifting mechanism. The lifting mechanism includes a first lifting member 4 and a second lifting member 40. The first lifting member 4 and the second lifting member 40 are respectively used to abut against both ends of the crystal bar 5 along the axial direction, and adjust the position of the crystal bar 5 through coordinated lifting. Each of the first lifting member 4 and the second lifting member 40 is lifted and lowered under the drive of a lead screw driven by a servo motor. The servo motor corresponding to the first lifting member 4 and the servo motor corresponding to the second lifting member 40 are both communicatively connected to their respective encoding controllers, and the lifting heights of the first lifting member 4 and the second lifting member 40 are controlled by their respective encoding controllers to realize the coordinated lifting of the first lifting member 4 and the second lifting member 40 to adjust the position of the crystal bar 5. Figure 4 The direction shown by the arrow B in the figure is an embodiment of the first lifting member 4 and the second lifting member 40 adjusting the lifting of the crystal bar 5.

[0059] As an alternative embodiment, both the first lifting member 4 and the second lifting member 40 include clamping blocks 41 for fitting on the ingot 5. The clamping blocks 41 can be V-shaped resin blocks, and the inner walls of the V-shaped resin blocks are fitted on the outer side surface of the ingot 5, which can effectively prevent the ingot 5 from slipping off the side surfaces of the first lifting member 4 or the second lifting member 40, so as to better clamp the ingot 5. At the same time, the flexible surface of the resin protects the outer axial surface of the ingot 5, improving the yield rate of the ingot 5.

[0060] As an alternative embodiment, the ingot rounding and grooving device further includes a rinser, the rinser includes a liquid outlet, and the liquid outlet is arranged facing the ingot 5, so that the pressurized rinsing liquid ejected from the liquid outlet rinses the ingot 5. In the embodiment of the present application, the pressurized rinsing liquid can be rinsing water, and the temperature of the rinsing water is set to 25±3°C, and the water pressure is set within the range of 0.2 to 0.4 Mpa, so as to effectively rinse off the debris generated during grinding or grooving of the ingot 5.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the present application.

Claims

1. A method for rounding and grooving a crystal bar, characterized in that, Including the following steps: Clamp the crystal bar. The first chuck unit is provided with a first clamping ball head, and the second chuck unit is provided with a second clamping ball head. Both the first clamping ball head and the second clamping ball head are rotatably arranged. Clamp the two ends of the crystal bar on the first clamping ball head and the second clamping ball head respectively; Collect data. The data acquisition mechanism moves forward along the axial direction of the crystal bar to collect the first axial data of the crystal bar and the first outer diameter data corresponding to the first axial data. Rotate the crystal bar 90° along the central axis of the crystal bar by the first clamping ball head and the second clamping ball head. The data acquisition mechanism moves backward along the axial direction of the crystal bar to collect the second axial data of the crystal bar and the second outer diameter data corresponding to the second axial data; Draw a two-dimensional contour map. When it is judged that the clamping position of the crystal bar meets the processing requirements according to the first outer diameter data and the second outer diameter data, draw a two-dimensional contour map of the distance from the outer side of the crystal bar to the central axis of the crystal bar according to the first axial data, the first outer diameter data, the second axial data and the second outer diameter data; Grind the crystal bar. In the set contour map, the distance between adjacent contour lines is the single grinding amount of the grinding part. Control the grinding part to move to the axial position of the crystal bar corresponding to the highest contour line of the contour map in turn, and preferentially perform roll grinding from the highest contour line until the overall outer diameter of the crystal bar along the axis is ground to the target outer diameter range; Groove. Determine the grooving line of the crystal bar. According to the rotation angle α of the crystal bar, the axial length L of the grooving line and the axial moving speed V of the grooving part along the crystal bar, calculate the angular velocity ω = αV / L required for the crystal bar to rotate during grooving, so that the grooving part can groove along the grooving line.

2. The method for rounding and grooving a crystal bar according to claim 1, wherein It also includes: When it is judged that the clamping position of the crystal bar does not meet the processing requirements according to the first outer diameter data and the second outer diameter data, adjust the clamping position of the crystal bar to a position that meets the processing requirements of the crystal bar according to the calculated distance and angle through the lifting mechanism, and re-perform the step of collecting data.

3. The crystal bar rounding and grooving method according to claim 2, characterized in that, The adjusting the clamping position of the crystal bar to a position that meets the processing requirements of the crystal bar through the lifting mechanism includes: Set a first lifting piece and a second lifting piece at both ends of the crystal bar along the axis respectively. Control the first lifting piece and the second lifting piece to cooperate to lift and lower to adjust the crystal bar to a position calculated to meet the processing requirements of the crystal bar.

4. The crystal bar rounding and grooving method according to claim 1, characterized in that The collecting the first axial data of the crystal bar and the first outer diameter data corresponding to the first axial data by the data acquisition mechanism moving forward along the axial direction of the crystal bar includes: Set a first probe and a second probe, so that the detection points of the first probe and the second probe on the crystal bar are in the same plane as the central axis of the crystal bar. Install both the first probe and the second probe on a movable bracket, and make the bracket move along the axial direction of the crystal bar.

5. A crystal bar rounding and grooving device, characterized in that, Including: A first chuck unit and a second chuck unit. The second chuck unit is slidably arranged. The first chuck unit is provided with a first clamping ball head, and the second chuck unit is provided with a second clamping ball head. The first clamping ball head and the second clamping ball head are used to clamp the two ends of the crystal bar respectively and are both rotatably arranged; A data acquisition mechanism, which is used to acquire the axial data of the ingot and the outer diameter data corresponding to the axial data; A data plotting mechanism, which is communicatively connected to the data acquisition mechanism to synthesize the three-dimensional outer axial surface data of the ingot according to the axial data and the outer diameter data and plot a two-dimensional contour map according to the three-dimensional outer axial surface data; A grinding part, which abuts against the outer axial surface of the ingot and sequentially moves to the ingot corresponding to the highest contour line in the contour map to grind the ingot to grind the ingot to the target outer diameter range; A grooving part, which is used to groove the ingot along the grooving line of the ground ingot.

6. The ingot rounding and grooving device according to claim 5, characterized in that, The data acquisition mechanism includes a first probe and a second probe. The detection points of the first probe and the second probe on the ingot and the rotation center lines of the first clamping ball head and the second clamping ball head are in the same plane. Both the first probe and the second probe are installed on a movable bracket to move along the axial direction of the ingot.

7. The crystal bar rounding and grooving device according to claim 5, characterized in that, The ingot rounding and grooving device further includes a slide rail, and the second chuck unit is slidably arranged on the slide rail.

8. The crystal bar rounding and grooving device according to claim 5, characterized in that, The ingot rounding and grooving device further includes a lifting mechanism, which includes a first lifting member and a second lifting member. The first lifting member and the second lifting member are used to respectively abut against the two ends of the ingot along the axial direction to adjust the position of the ingot by coordinated lifting.

9. The crystal bar rounding and grooving device according to claim 8, wherein, Both the first lifting member and the second lifting member include V-shaped clamping blocks for fitting on the ingot.

10. The crystal bar rounding and grooving device according to any one of claims 5-9, characterized in that, The ingot rounding and grooving device further includes a flusher, which includes a liquid outlet, and the liquid outlet is arranged towards the ingot so that the pressurized flushing liquid sprayed from the liquid outlet flushes the ingot.

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