A method and device for calibrating digital channels of integrated circuit test system under high temperature

Abstract

The present invention discloses a method and device for calibrating a digital channel of an integrated circuit test system at high temperature, wherein the calibration method comprises: controlling the temperature applied by a heating and temperature control device to a test fixture, and controlling the temperature on the test fixture to a set temperature; sending an excitation signal to the integrated circuit test system, and simultaneously collecting an electrical signal emitted by one of the digital channels of the integrated circuit test system; comparing the electrical signal emitted by one of the digital channels of the integrated circuit test system with a pre-calibrated electrical signal, and when the comparison deviation is within a set range, calibrating the electrical parameters in the integrated circuit test system at the set temperature; otherwise, collecting and comparing the electrical signal emitted by another digital channel of the integrated circuit test system using a channel switching device, until the calibration of all digital channels in the integrated circuit test system at the set temperature is completed. The present invention can effectively ensure the accuracy and reliability of the digital integrated circuit test results.

Description

Technical Field

[0001] The present invention belongs to the technical field of digital integrated circuits, and more specifically, relates to a method and device for calibrating a digital channel of an integrated circuit test system at high temperature. Background Art

[0002] The performance and quality of digital integrated circuits used in weapons and equipment or key model missions are mainly guaranteed by integrated circuit testing systems. Therefore, integrated circuit testing systems, as support equipment for modern weapons and equipment, play a vital role in their accurate measurement.

[0003] Currently, high-temperature testing of digital integrated circuits is one of the most common secondary screening processes for digital integrated circuits. However, the current calibration of integrated circuits is only performed at room temperature, which cannot ensure that the values ​​of the integrated circuit test system are accurate and stable when tested in a high-temperature environment. In particular, in a high-temperature environment, it is easy to generate errors such as thermoelectric potential and noise at the signal contact end, which directly affects the test results of digital integrated circuits in a high-temperature environment.

[0004] Therefore, simulating the actual test conditions of digital integrated circuits in a high-temperature environment by a simulation integrated circuit test system, and proposing a calibration method for the integrated circuit test system in a high-temperature test environment based on this device and test requirements, is an important means to ensure the accuracy and reliability of digital integrated circuit test results. Summary of the invention

[0005] In view of the defects of the prior art, the object of the present invention is to provide a method and device for calibrating digital channels of an integrated circuit test system under high temperature, which can effectively ensure the accuracy and reliability of digital integrated circuit test results.

[0006] To achieve the above object, in a first aspect, the present invention provides a method for calibrating a digital channel of an integrated circuit test system at high temperature, comprising the following steps:

[0007] (1) sending a temperature control signal to a heating and temperature control device to control the temperature applied by the heating and temperature control device to the test fixture, thereby controlling the temperature on the test fixture to a set temperature;

[0008] The test fixture is used to clamp the digital integrated circuit to be tested, and complete the electrical connection between the digital integrated circuit to be tested and the integrated circuit test system; the heating and temperature control device includes a heating component and a high-temperature test head, and the high-temperature test head includes a plurality of interface pins, each interface pin is connected to each interface of the test fixture, and the interface pin adopts a double-pin structure, and the pin A in each double pin is used to transfer the heat output by the heating component, and is also used to transfer the electrical signal sent by the digital integrated circuit to the integrated circuit test system, and the pin B in each double pin is used to measure the heat temperature of the heating component;

[0009] (2) sending an excitation signal to the integrated circuit test system, and simultaneously collecting an electrical signal sent by one of the digital channels of the integrated circuit test system and transmitted to the digital integrated circuit to be tested via the test fixture and the high-temperature test head in sequence, wherein the electrical signal is a DC voltage signal or a DC current signal;

[0010] (3) comparing the electrical signal emitted by one of the digital channels of the integrated circuit test system with a pre-calibrated electrical signal; when the comparison deviation is within a set range, calibrating the electrical parameters in the integrated circuit test system at the set temperature; otherwise, collecting and comparing the electrical signal emitted by another digital channel of the integrated circuit test system using a channel switching device until the calibration of all digital channels in the integrated circuit test system at the set temperature is completed.

[0011] In one of the embodiments, in the high temperature test head, the pin A in each double pin is made of a heat conductive material, and the pin B in each double pin is made of a platinum resistor.

[0012] In one of the embodiments, in the heating and temperature control device, the heating component includes a current source and a plurality of heating wires, and the pin A in each double pin is electrically connected to the current source through a heating wire.

[0013] In one embodiment, the calibration method includes performing a DC voltage calibration of a pressure-applying and current-measuring integrated circuit test system, and performing a DC current calibration of a current-applying and pressure-measuring integrated circuit test system.

[0014] In one embodiment, when performing DC voltage calibration for pressure measurement on an integrated circuit test system, step (2) is specifically as follows:

[0015] An excitation voltage signal is sent to the integrated circuit test system to control the integrated circuit test system to output a voltage signal, and at the same time, a current signal emitted by one of the digital channels of the integrated circuit test system is collected and transmitted to the digital integrated circuit to be tested via a test fixture and a high-temperature test head in sequence.

[0016] In one embodiment, when performing DC current calibration for current addition and voltage measurement on an integrated circuit test system, step (2) is specifically as follows:

[0017] An excitation current signal is sent to the integrated circuit test system to control the integrated circuit test system to output a current signal, and at the same time, a voltage signal emitted by one of the digital channels of the integrated circuit test system is collected and transmitted to the digital integrated circuit to be tested via a test fixture and a high-temperature test head in sequence.

[0018] In a second aspect, the present invention provides an integrated circuit digital channel calibration device in a high temperature test environment, comprising:

[0019] A temperature control module is used to send a temperature control signal to a heating and temperature control device, control the temperature applied by the heating and temperature control device to a test fixture, and control the temperature on the test fixture to a set temperature; wherein the test fixture is used to clamp a digital integrated circuit to be tested, and complete the electrical connection between the digital integrated circuit to be tested and an integrated circuit test system; the heating and temperature control device includes a heating component and a high-temperature test head, the high-temperature test head includes a plurality of interface pins, each interface pin is connected to each interface of the test fixture, and the interface pin adopts a double-pin structure, the pin A in each double pin is used to transfer the heat output by the heating component, and is also used to transfer the electrical signal sent by the digital integrated circuit to be tested to the integrated circuit test system, and the pin B in each double pin is used to measure the heat temperature of the heating component;

[0020] An acquisition module is used to send an excitation signal to the integrated circuit test system, and at the same time acquire an electrical signal sent by one of the digital channels of the integrated circuit test system and transmitted to the digital integrated circuit to be tested via the test fixture and the high-temperature test head in sequence, wherein the electrical signal is a DC voltage signal or a DC current signal;

[0021] The calibration module is used to compare the electrical signal emitted by one of the digital channels of the integrated circuit test system with a pre-calibrated electrical signal. When the comparison deviation is within a set range, the electrical parameters in the integrated circuit test system at the set temperature are calibrated; otherwise, the electrical signal emitted by another digital channel of the integrated circuit test system is collected and compared by using a channel switching device until the calibration of all digital channels in the integrated circuit test system at the set temperature is completed.

[0022] The present invention provides a method and device for calibrating a digital channel of an integrated circuit test system under high temperature. A high-temperature test head is designed as a transmission interface for a DC signal, which can effectively ensure signal transmission between the integrated circuit test system and an integrated circuit test system calibration device. The high-temperature test head controls the temperature of the test head through a heating and temperature control device, thereby being able to regulate the temperature of the DC signal during transmission. In addition, the high-temperature test head is fixedly connected to a test fixture and can directly transfer the temperature to the test fixture, thereby ensuring that the temperature of the test fixture can also be controlled by a heating and temperature control device that is stable and accurate, thereby effectively simulating the actual working conditions of a digital integrated circuit under a high-temperature test environment, ensuring that the calibration data results can truly reflect the test conditions of the integrated circuit test system, and improving the accuracy and reliability of the test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of a digital channel calibration device for an integrated circuit test system under high temperature provided by an embodiment of the present invention;

[0024] Figure 2It is a structural schematic diagram of a digital integrated circuit for high temperature testing provided by an embodiment of the present invention;

[0025] Figure 3 is a schematic diagram of the appearance of a heating temperature control device provided by an embodiment of the present invention;

[0026] Figure 4 It is a structural schematic diagram of a heating temperature control device provided by an embodiment of the present invention;

[0027] Figure 5 is a flow chart of a digital channel calibration method for an integrated circuit test system under high temperature provided by an embodiment of the present invention;

[0028] Figure 6 It is a schematic diagram of direct current signal transmission in a high temperature test environment provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0030] In order to solve the problem that traditional integrated circuit test systems cannot guarantee the accuracy and reliability of digital integrated circuit test results in a high temperature environment, the present invention provides a digital channel calibration method for an integrated circuit test system under high temperature, which is mainly aimed at calibrating the voltage and current parameters of the digital channel of the integrated circuit test system under a high temperature test environment.

[0031] When calibrating the digital channel of the integrated circuit test system under high temperature environment, it is necessary to first determine the location where the temperature is applied. The difference in the temperature application point will directly affect the temperature during calibration, resulting in failure to correctly reflect the impact of high temperature on the test results. Figure 2 The position where the temperature is applied is designed on the test fixture, which is used to clamp the digital integrated circuit to be tested and complete the electrical connection between the integrated circuit test system and the digital integrated circuit to be tested.

[0032] In addition, the temperature application device (heating and temperature control device) provided by the present invention adopts a heating component and a high-temperature test head, wherein the interface of the high-temperature test head is designed in the form of a chip pin, and its interface is designed to be pluggable, with a 6-pin, 8-pin, etc. form similar to commonly used chips, and can be adapted to different types of test fixtures.

[0033] After the interface of the heating and temperature control device is designed in the form of chip pins, it can simulate the actual test conditions of the digital integrated circuit under high temperature environment of the integrated circuit test system, and can always keep the test temperature stable without being affected by the environment. The temperature is directly transferred to the test fixture through the high temperature test head, so as to calibrate the digital channel of the integrated circuit test system. Figure 1 shown.

[0034] The design of the high-temperature test head simulates the packaging of digital integrated circuits and fixes them to the test fixture in the form of pins, which can adapt to more integrated circuit test systems and enhance the applicability of the calibration device. The pins are directly connected to the heating and temperature control device and are made of heat-conducting materials, which can effectively conduct the heat output by the heating and temperature control device. When the temperature is set, the heating and temperature control device heats the pins, and the temperature will cover the high-temperature test head and the test fixture connected to it, so that the temperature of the entire calibration environment is stable. The appearance of the heating and temperature control device is as follows: Figure 3 shown.

[0035] At the same time, in order to ensure accurate temperature control, the fixture temperature needs to be measured and monitored in real time, so the interface pin is designed as a double pin. One uses a platinum resistor for temperature monitoring and measurement, and the other is used for heating and DC signal transmission. The double pins are bridged above the heating wire to ensure that heat is quickly transferred to the pins in the most efficient way. The double pin corresponds to an interface of the test fixture. The temperature data collected by the platinum resistor can be used to adjust the feedback signal of the temperature output, and at the same time, it can ensure that the temperature is accurate and stable during signal transmission. All heating pins are connected together, and each pin interface is set with a heating wire. This design can achieve the effect of thermal averaging, speed up the heating time, and avoid the impact of uneven temperature on signal quality and calibration stability. The system structure of the heating and temperature control device is as follows: Figure 4 shown.

[0036] After setting the ambient temperature, the calibration device can be used to calibrate the DC voltage of the pressure-measurement mode or the DC current of the current-measurement mode according to the calibration method of the digital integrated circuit test system. During calibration, since each pin corresponds to a different digital channel and there is only one calibration channel, the channel switching device is required to switch the channel corresponding to each pin, complete the calibration of each digital channel in the integrated circuit test system in turn, and record the current temperature and DC parameter test results.

[0037] From the above analysis, we can see that if Figure 5 As shown, the digital channel calibration method of the integrated circuit test system under high temperature provided by the present invention is applied to the calibration device of the integrated circuit test system, and may include the following steps:

[0038] S10, sending a temperature control signal to the heating and temperature control device to control the temperature applied by the heating and temperature control device to the test fixture, so as to control the temperature of the test fixture to a set temperature.

[0039] Among them, the heating and temperature control device includes a heating component and a high-temperature test head. The high-temperature test head includes multiple interface pins, each interface pin is connected to each interface of the test fixture, and the interface pin adopts a double-pin structure. Pin A in each double pin is used to transfer the heat output by the heating component, and is also used to transfer the electrical signal sent by the digital integrated circuit to be tested to the integrated circuit test system. Pin B in each double pin is used to measure the heat temperature of the heating component.

[0040] S20, sending an excitation signal to the integrated circuit test system, and at the same time collecting an electrical signal sent by one of the digital channels of the integrated circuit test system and transmitted to the digital integrated circuit to be tested via the test fixture and the high-temperature test head in sequence, such as Figure 6 As shown, the electrical signal is a DC voltage signal or a DC current signal.

[0041] Specifically, in the pressure-measurement calibration mode, an excitation voltage signal is sent to the integrated circuit test system, and the integrated circuit test system sequentially outputs voltage signals to each interface in the test fixture through the loading board (test interface circuit board) and the high-temperature test head, and collects the current signal at the high-temperature test head. In the current-measurement calibration mode, an excitation current signal is sent to the integrated circuit test system, and the integrated circuit test system sequentially outputs current signals to each interface in the test fixture through the loading board and the high-temperature test head, and collects the voltage signal at the high-temperature test head.

[0042] S30, compare the electrical signal emitted by one of the digital channels of the integrated circuit test system with the pre-calibrated electrical signal. When the comparison deviation is within the set range, calibrate the electrical parameters in the integrated circuit test system at the set temperature; otherwise, use the channel switching device to collect and compare the electrical signal emitted by another digital channel of the integrated circuit test system until the calibration of all digital channels in the integrated circuit test system at the set temperature is completed.

[0043] Specifically, in the pressure-measured current calibration mode, the collected current signal is compared with the preset calibrated current signal. When the comparison deviation is not within the preset range, the voltage signal in the integrated circuit test system is calibrated, thereby realizing the pressure-measured current calibration process under the set temperature environment. In the pressure-measured current calibration mode, the collected voltage signal is compared with the preset calibrated voltage signal. When the comparison deviation is not within the preset range, the current signal in the integrated circuit test system is calibrated, thereby realizing the pressure-measured current calibration process under the set temperature environment.

[0044] In this embodiment, the method of calibrating the current signal and the voltage signal is as follows: the calibrated current signal and the voltage signal are measured by instruments traceable to the superior measurement unit. Because the measurement end of the traceable instrument is in direct contact with the port of the test system, the state of the calibrated current and voltage signals is consistent with the collected current and voltage signals, that is, the thermoelectric potential and noise are the same, which can effectively avoid the influence of errors on the calibration results.

[0045] The present embodiment provides a method for calibrating the digital channels of an integrated circuit test system under high temperature, and designs a high-temperature test head as a transmission interface for DC signals, which can effectively ensure the signal transmission between the integrated circuit test system and the integrated circuit test system calibration device. The high-temperature test head controls the temperature of the test head through a heating and temperature control device, thereby being able to adjust the temperature of the DC signal during transmission; in addition, the high-temperature test head is fixedly connected to the test fixture, and can directly transfer the temperature to the test fixture, thereby ensuring that the temperature of the test fixture can also be controlled by a stable and accurate heating and temperature control device, thereby effectively simulating the actual working conditions under the high-temperature test environment of the digital integrated circuit, ensuring that the calibration data results can truly reflect the test conditions of the integrated circuit test system, and improving the accuracy and reliability of the test results.

[0046] The present invention also provides a digital channel calibration device for an integrated circuit test system under high temperature, comprising a temperature control module, an acquisition module and a calibration module, wherein:

[0047] The temperature control module is used to send a temperature control signal to the heating and temperature control device to control the temperature applied by the heating and temperature control device to the test fixture, so as to control the temperature on the test fixture at a set temperature.

[0048] Among them, the test fixture is used to clamp the digital integrated circuit to be tested and complete the electrical connection between the digital integrated circuit to be tested and the integrated circuit test system; the heating and temperature control device includes a heating component and a high-temperature test head, the high-temperature test head includes a plurality of interface pins, each interface pin is connected to each interface of the test fixture, and the interface pin adopts a double-pin structure, pin A in each double pin is used to transfer the heat output by the heating component, and is also used to transfer the electrical signal sent by the digital integrated circuit to be tested to the integrated circuit test system, and pin B in each double pin is used to measure the heat temperature of the heating component.

[0049] The acquisition module is used to send an excitation signal to the integrated circuit test system, and at the same time collect the electrical signal emitted by one of the digital channels of the integrated circuit test system, which is transmitted to the digital integrated circuit to be tested via the test fixture and the high-temperature test head in sequence. The electrical signal is a DC voltage signal or a DC current signal.

[0050] The calibration module is used to compare the electrical signal emitted by one of the digital channels of the integrated circuit test system with the pre-calibrated electrical signal. When the comparison deviation is within the set range, the electrical parameters in the integrated circuit test system at the set temperature are calibrated; otherwise, the channel switching device is used to collect and compare the electrical signal emitted by another digital channel of the integrated circuit test system until the calibration of all digital channels in the integrated circuit test system at the set temperature is completed.

[0051] Specifically, the functions of each module provided in this embodiment can be found in the detailed description in the aforementioned method embodiment, and will not be described in detail in this embodiment.

[0052] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for calibrating digital channels of an integrated circuit test system at high temperature, characterized in that: The steps include: (1) sending a temperature control signal to a heating and temperature control device to control the temperature applied by the heating and temperature control device to the test fixture, thereby controlling the temperature on the test fixture to a set temperature; The test fixture is used to clamp the digital integrated circuit to be tested, and complete the electrical connection between the digital integrated circuit to be tested and the integrated circuit test system; the heating and temperature control device includes a heating component and a high-temperature test head, and the high-temperature test head includes a plurality of interface pins, each interface pin is connected to each interface of the test fixture, and the interface pin adopts a double-pin structure, and the pin A in each double pin is used to transfer the heat output by the heating component, and is also used to transfer the electrical signal sent by the digital integrated circuit to the integrated circuit test system, and the pin B in each double pin is used to measure the heat temperature of the heating component; (2) sending an excitation signal to the integrated circuit test system, and simultaneously collecting an electrical signal sent by one of the digital channels of the integrated circuit test system and transmitted to the digital integrated circuit to be tested via the test fixture and the high-temperature test head in sequence, wherein the electrical signal is a DC voltage signal or a DC current signal; (3) comparing the electrical signal emitted by one of the digital channels of the integrated circuit test system with a pre-calibrated electrical signal; when the comparison deviation is within a set range, calibrating the electrical parameters in the integrated circuit test system at the set temperature; otherwise, collecting and comparing the electrical signal emitted by another digital channel of the integrated circuit test system using a channel switching device until the calibration of all digital channels in the integrated circuit test system at the set temperature is completed.

2. The high temperature integrated circuit test system digital channel calibration method according to claim 1, characterized in that: In the high temperature test head, the pin A in each double pin is made of heat conductive material, and the pin B in each double pin is made of platinum resistance.

3. The high temperature integrated circuit test system digital channel calibration method according to claim 1, characterized in that: In the heating and temperature control device, the heating component includes a current source and a plurality of heating wires, and the pin A in each double pin is electrically connected to the current source through a heating wire.

4. The high temperature integrated circuit test system digital channel calibration method according to claim 1, characterized in that: The calibration method includes performing a DC voltage calibration of adding pressure to measure current and performing a DC current calibration of adding current to measure pressure on the integrated circuit test system.

5. The high temperature integrated circuit test system digital channel calibration method according to claim 1, characterized in that: When performing DC voltage calibration for pressure measurement on an integrated circuit test system, step (2) is specifically as follows: An excitation voltage signal is sent to the integrated circuit test system to control the integrated circuit test system to output a voltage signal, and at the same time, a current signal emitted by one of the digital channels of the integrated circuit test system is collected and transmitted to the digital integrated circuit to be tested via a test fixture and a high-temperature test head in sequence.

6. The high temperature integrated circuit test system digital channel calibration method according to claim 1, characterized in that: When the integrated circuit test system is calibrated for direct current by adding current and measuring voltage, step (2) is specifically as follows: An excitation current signal is sent to the integrated circuit test system to control the integrated circuit test system to output a current signal, and at the same time, a voltage signal emitted by one of the digital channels of the integrated circuit test system is collected and transmitted to the digital integrated circuit to be tested via a test fixture and a high-temperature test head in sequence.

7. An integrated circuit digital channel calibration device in a high temperature test environment, characterized in that: include: A temperature control module is used to send a temperature control signal to a heating and temperature control device, control the temperature applied by the heating and temperature control device to a test fixture, and control the temperature on the test fixture to a set temperature; wherein the test fixture is used to clamp a digital integrated circuit to be tested, and complete the electrical connection between the digital integrated circuit to be tested and an integrated circuit test system; the heating and temperature control device includes a heating component and a high-temperature test head, the high-temperature test head includes a plurality of interface pins, each interface pin is connected to each interface of the test fixture, and the interface pin adopts a double-pin structure, the pin A in each double pin is used to transfer the heat output by the heating component, and is also used to transfer the electrical signal sent by the digital integrated circuit to be tested to the integrated circuit test system, and the pin B in each double pin is used to measure the heat temperature of the heating component; An acquisition module is used to send an excitation signal to the integrated circuit test system, and at the same time acquire an electrical signal sent by one of the digital channels of the integrated circuit test system and transmitted to the digital integrated circuit to be tested via the test fixture and the high-temperature test head in sequence, wherein the electrical signal is a DC voltage signal or a DC current signal; The calibration module is used to compare the electrical signal emitted by one of the digital channels of the integrated circuit test system with a pre-calibrated electrical signal. When the comparison deviation is within a set range, the electrical parameters in the integrated circuit test system at the set temperature are calibrated; otherwise, the electrical signal emitted by another digital channel of the integrated circuit test system is collected and compared by using a channel switching device until the calibration of all digital channels in the integrated circuit test system at the set temperature is completed.

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