Sensor package structure and method of manufacturing the same

Abstract

A sensor package structure and a manufacturing method thereof are disclosed. The sensor package structure includes a substrate, a sensing chip, and a cover. The sensing chip is disposed on the substrate and electrically coupled to the substrate. The cover is disposed on the substrate along a mounting direction, such that the sensing chip is located within a space surrounded by the cover. The cover includes a light-transmissive sheet, a light-blocking film, and a light-blocking support. The light-blocking film is annular and disposed on an inner surface of the light-transmissive sheet, such that the inner surface is divided into a light-transmissive region located inside the light-blocking film and a shaped region located outside the light-blocking film. The light-blocking support is formed on the shaped region without a gap and disposed on the substrate, but does not cover the light-blocking film. Accordingly, the light-blocking film facilitates the light-blocking support to be accurately shaped on the shaped region, and avoids light passing through to reduce the generation of glare.

Description

Technical Field

[0001] This application relates to a packaging structure, and more particularly to a sensor packaging structure and its manufacturing method. Background Technology

[0002] Existing sensor packaging structures involve attaching a glass plate to a sensing chip via an adhesive layer, with the adhesive layer surrounding the sensing area of ​​the sensing chip. However, since some light passing through the glass plate may be reflected by the adhesive layer, this can affect the sensing area of ​​the sensing chip (e.g., glare).

[0003] Therefore, the applicant believes that the above-mentioned defects can be improved. So, the applicant has devoted himself to research and applied scientific principles, and finally proposed a design that is reasonable and effectively improves the above-mentioned defects. Summary of the Invention

[0004] The present application provides a sensor packaging structure and its manufacturing method, which can effectively improve the defects that may occur in existing sensor packaging structures.

[0005] This application discloses a sensor packaging structure, comprising: a substrate; a sensing chip disposed on the substrate and electrically coupled to the substrate; and a cover disposed on the substrate such that the sensing chip is located within the space enclosed by the cover; wherein the cover includes: a light-transmitting sheet having an outer surface and an inner surface; a light-shielding film, which is annular and disposed on the inner surface such that the inner surface is divided into a light-transmitting area located inside the light-shielding film and a forming area located outside the light-shielding film; and an opaque support formed without gaps on the forming area and disposed on the substrate; wherein the light-shielding film is not embedded in the opaque support.

[0006] Optionally, the sensor packaging structure includes multiple wires that electrically couple the substrate and the sensing chip, and at least 90% of the volume of each wire is located within a projection space formed by the light-shielding film projecting onto the substrate.

[0007] Optionally, the opaque support has an inner side and an outer side, with the outer side of the opaque support being coplanar with the outer side of the light-transmitting sheet and coplanar with the outer edge of the substrate.

[0008] Optionally, the distance between the inner and outer sides of the opaque support gradually decreases in the direction away from the light-transmitting sheet, so that a portion of each wire is located within a projection space formed by the orthographic projection of the inner side onto the substrate.

[0009] Optionally, the top surface of the sensing chip has a sensing area, and the sensing area is located within a projection area formed by the projection of the light-transmitting area toward the top surface.

[0010] Optionally, the cover is disposed on the substrate along an installation direction, and the area of ​​any cross-section of the opaque bracket perpendicular to the installation direction is not greater than the area of ​​the formed area.

[0011] This application also discloses a method for manufacturing a sensor packaging structure, comprising: performing a demarcation step: forming a plurality of light-shielding films spaced apart on the inner surface of a light-transmitting layer, so that the inner surface of the light-transmitting layer is divided into a plurality of light-transmitting areas located inside the plurality of light-shielding films and a forming area located outside the plurality of light-shielding films; performing a molding step: pressing a mold against the plurality of light-shielding films without gaps, and molding an opaque support layer on the forming area of ​​the light-transmitting layer; performing a pre-cutting step: cutting the light-transmitting layer and the opaque support layer to form a plurality of covers; performing a packaging step: mounting a plurality of covers on a substrate layer carrying a plurality of sensing chips, such that each cover encapsulates a sensing chip therein, and each light-transmitting area faces a sensing chip; and performing a cutting step: cutting the substrate layer to form a plurality of sensor packaging structures.

[0012] Optionally, during the molding process, multiple light-shielding films are completely pressed against the mold and elastically deformed, thus connecting with each other without gaps, so that none of the multiple light-shielding films are embedded in the opaque support layer.

[0013] This application also discloses a method for manufacturing a sensor packaging structure, comprising: performing a demarcation step: forming a plurality of light-shielding films spaced apart on the inner surface of a light-transmitting layer, so that the inner surface of the light-transmitting layer is divided into a plurality of light-transmitting areas located inside the plurality of light-shielding films and a forming area located outside the plurality of light-shielding films; performing a molding step: pressing a mold against the plurality of light-shielding films without gaps, and molding an opaque support layer on the forming area of ​​the light-transmitting layer; performing a packaging step: mounting the opaque support layer on a substrate layer carrying a plurality of sensing chips, such that each light-transmitting area faces a sensing chip; and performing a cutting step: cutting the light-transmitting layer, the opaque support layer, and the substrate layer to form a plurality of sensor packaging structures.

[0014] Optionally, during the molding process, multiple light-shielding films are completely pressed against the mold and elastically deformed, thus connecting with each other without gaps, so that none of the multiple light-shielding films are embedded in the opaque support layer.

[0015] In summary, the sensor packaging structure and manufacturing method disclosed in this application, by forming the light-shielding film on the inner surface of the light-transmitting sheet, accurately divides the light-transmitting area on the inner surface and effectively prevents light from passing through the light-shielding film, thereby reducing glare. Furthermore, the light-shielding film also blocks light from flowing into the light-transmitting area during the forming process of the opaque bracket, thereby facilitating the precise forming of the opaque bracket onto the forming area.

[0016] To further understand the features and technical content of this application, please refer to the following detailed description and drawings of this application. However, these descriptions and drawings are only used to illustrate this application and are not intended to limit the scope of protection of this application in any way. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 1 of this application.

[0018] Figure 2 for Figure 1 A top-down view.

[0019] Figure 3 for Figure 2 A schematic cross-sectional view along section line III-III.

[0020] Figure 4 This is a schematic diagram illustrating the demarcation steps of the manufacturing method for the sensor packaging structure according to Embodiment 1 of this application.

[0021] Figure 5A This is a schematic diagram (I) of the molding steps in the manufacturing method of the sensor packaging structure of Embodiment 1 of this application.

[0022] Figure 5B This is a schematic diagram (II) of the molding steps in the manufacturing method of the sensor packaging structure of Embodiment 1 of this application.

[0023] Figure 6 This is a schematic diagram of the pre-cutting step in the manufacturing method of the sensor packaging structure according to Embodiment 1 of this application.

[0024] Figure 7 This is a schematic diagram of the packaging steps in the manufacturing method of the sensor packaging structure according to Embodiment 1 of this application.

[0025] Figure 8 This is a schematic diagram of the cutting steps in the manufacturing method of the sensor packaging structure according to Embodiment 1 of this application.

[0026] Figure 9 This is a schematic diagram of the packaging steps in the manufacturing method of the sensor packaging structure according to Embodiment 2 of this application.

[0027] Figure 10This is a schematic diagram of the cutting steps in the manufacturing method of the sensor packaging structure of Embodiment 2 of this application. Detailed Implementation

[0028] The following specific embodiments illustrate the implementation of the "sensor packaging structure and manufacturing method thereof" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings of this application are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.

[0029] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0030] [Example 1]

[0031] Please see Figures 1 to 8 As shown, this is an embodiment of the present application. This embodiment discloses a sensor packaging structure 100 and its manufacturing method. For the sake of explaining this embodiment, the structure of each component of the sensor packaging structure 100 and their connection relationship will be described first, and then the manufacturing method of the sensor packaging structure 100 will be described.

[0032] like Figures 1 to 3 As shown, the sensor packaging structure 100 in this embodiment includes a substrate 1, a sensing chip 2 disposed on the substrate 1, multiple wires 3 electrically coupled to the sensing chip 2 and the substrate 1, and a cover 4 disposed on the substrate 1.

[0033] It should be noted that although the sensor packaging structure 100 is described in this embodiment as including the above-mentioned components, the sensor packaging structure 100 can also be adjusted and changed according to design requirements. For example, in other embodiments not shown in this application, the sensor packaging structure 100 may omit multiple of the wires 3, and the sensing chip 2 may be fixed and electrically coupled to the substrate 1 by flip-chip method.

[0034] like Figure 2 and Figure 3As shown, the substrate 1 in this embodiment is a square or rectangular printed circuit board (PCB), but this application is not limited to this. The substrate 1 has a chip fixing area 111 approximately at the center of its upper surface 11, and a plurality of first solder pads 112 are formed on its upper surface 11 outside the chip fixing area 111. In this embodiment, the plurality of first solder pads 112 are generally arranged in a ring, but this application is not limited to this. For example, in other embodiments not shown in this application, the plurality of first solder pads 112 may also be arranged in two columns on opposite sides of the chip fixing area 111.

[0035] In addition, the substrate 1 may also have a plurality of solder balls (not shown) on its lower surface 12, and the sensor package structure 100 can be soldered and fixed to an electronic component by the plurality of solder balls, so that the sensor package structure 100 can be electrically connected to the electronic component.

[0036] In this embodiment, the sensing chip 2 is described as an image sensing chip, but this application is not limited thereto. The sensing chip 2 is fixed to the chip fixing area 111 of the substrate 1; that is, the sensing chip 2 is located inside the plurality of first bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a plurality of second bonding pads 212 located outside the sensing area 211.

[0037] In this embodiment, the number and position of the plurality of second solder pads 212 of the sensing chip 2 correspond to the number and position of the plurality of first solder pads 112 of the substrate 1, respectively. Furthermore, one end of the plurality of wires 3 is connected to the plurality of first solder pads 112, and the other end of the plurality of wires 3 is connected to the plurality of second solder pads 212, so that the substrate 1 can be electrically coupled to the sensing chip 2 through the plurality of wires 3.

[0038] In this embodiment, the cover 4 is disposed on the substrate 1 along a mounting direction D (perpendicular to the substrate 1) so that the sensing chip 2 (and the plurality of wires 3) are located within the space enclosed by the cover 4. That is, the cover 4 and the substrate 1 together enclose a closed space E for placing the sensing chip 2 (and the plurality of wires 3) therein.

[0039] More specifically, the cover 4 includes a light-transmitting sheet 41, a light-blocking film 42, and an opaque support 43. In this embodiment, the light-transmitting sheet 41 is described as a transparent flat glass, and it has an outer surface 411 and an inner surface 412, but this application is not limited to this. For example, in other embodiments not illustrated in this application, the light-transmitting sheet 41 may also be made of a light-transmitting plastic material.

[0040] The light-shielding film 42 is annular and opaque, and is disposed on the inner surface 412 of the light-transmitting sheet 41, such that the inner surface 412 is divided into a light-transmitting area 4121 located inside the light-shielding film 42 and a formed area 4122 located outside the light-shielding film 42. Furthermore, the opaque support 43 is formed without gaps on the formed area 4122 of the light-transmitting sheet 41 (that is, the light-shielding film 42 is not embedded in the opaque support 43), and the opaque support 43 is disposed on the substrate 1 (outside the plurality of first solder pads 112).

[0041] Accordingly, in this embodiment, the sensor packaging structure 100 forms a light-shielding film 42 on the inner surface 412 of the light-transmitting sheet 41, thereby accurately dividing the light-transmitting area 4121 on the inner surface 412 and effectively preventing light from passing through the light-shielding film 42, thus reducing glare. Furthermore, the light-shielding film 42 also blocks light from flowing into the light-transmitting area 4121 during the forming process of the opaque support 43, thereby facilitating the precise forming of the opaque support 43 onto the forming area 4122.

[0042] Furthermore, the relationship between the cover 4 and the sensing chip 2 and the plurality of wires 3 preferably meets the following conditions, but this application is not limited thereto. Specifically, the thickness of the light-shielding film 42 is less than the thickness of the light-transmitting sheet 41 and not greater than 40 micrometers (μm). The sensing area 211 of the sensing chip 2 is located within a projection area formed by the orthographic projection of the light-transmitting area 4121 toward the top surface 21. Moreover, at least 90% of the volume of each wire 3 is located within a projection space formed by the orthographic projection of the light-shielding film 42 toward the substrate 1.

[0043] From another perspective, the opaque support 43 has an inner side 431 and an outer side 432, and the outer side 432 of the opaque support 43 is coplanar with the outer side 413 of the light-transmitting sheet 41 and coplanar with the outer edge 13 of the substrate 1. The distance between the inner side 431 and the outer side 432 of the opaque support 43 gradually decreases in the direction away from the light-transmitting sheet 41 (that is, the area of ​​any cross-section of the opaque support 43 perpendicular to the mounting direction D is not greater than the area of ​​the formed region 4122), so that a portion of each of the conductive lines 3 is located within a projection space formed by the orthographic projection of the inner side 431 toward the substrate 1.

[0044] The above is a description of the sensor packaging structure 100 of this embodiment. The manufacturing method of the sensor packaging structure 100 will be described below. It should be noted that although the sensor packaging structure 100 is manufactured using the method described below in this embodiment, this application is not limited thereto. For example, in other embodiments not shown in this application, the sensor packaging structure 100 may also be manufactured by adjusting the steps in the method described below or by other methods.

[0045] like Figures 4 to 8 As shown, in this embodiment, the manufacturing method of the sensor packaging structure 100 preferably includes the following steps in sequence: a demarcation step S110, a molding step S120, a pre-cutting step S130, a packaging step S140, and a cutting step S150, but this application is not limited to this. For example, in other embodiments not shown in this application, the order of the above-mentioned multiple steps S110 to S150 can be adjusted or added or removed according to design requirements.

[0046] like Figure 4 As shown, the demarcation step S110 is performed by forming a plurality of light-shielding films 42 arranged at intervals on the inner surface of a light-transmitting layer L41, so that the inner surface of the light-transmitting layer L41 is divided into a plurality of light-transmitting regions 4121 located inside the plurality of light-shielding films 42 and a forming region 4122 located outside the plurality of light-shielding films 42.

[0047] like Figure 5A and Figure 5BAs shown, the molding step S120 is performed by pressing a mold 200 against a plurality of light-shielding films 42 without gaps, and molding an opaque support layer L43 on the forming area 4122 of the light-transmitting layer L41. The plurality of light-shielding films 42 (which are elastic) are completely pressed against and elastically deformed by the mold 200, thus connecting them without gaps. This ensures that none of the light-shielding films 42 are embedded within the opaque support layer L43, and that during the forming process, the opaque support layer L43 cannot flow through the gapless interface between the mold 200 and any of the light-shielding films 42 to the corresponding light-transmitting area 4121.

[0048] More specifically, such as Figure 5A As shown, molten plastic or colloid (not shown in the figure) flows along the channels of the mold 200 (e.g., marked on the...). Figure 5A Multiple arrows within the mold 200 flow onto the forming area 4122 of the light-transmitting layer L41, then solidify and remove the mold 200, thereby forming a shape on the forming area 4122 of the light-transmitting layer L41 as shown in the image. Figure 5B The opaque support layer L43 shown is illustrated.

[0049] like Figure 5B and Figure 6 As shown, the pre-cutting step S130 is performed by cutting the light-transmitting layer L41 and the opaque support layer L43 to form a plurality of covers 4. Specifically, the light-transmitting layer L41 is cut into a plurality of light-transmitting sheets 41, and the opaque support layer L43 is cut into a plurality of opaque supports 43. Each light-transmitting sheet 41 has a light-shielding film 42 and an opaque support 43 formed on its inner surface 412, thus collectively constituting a cover 4.

[0050] like Figure 7 As shown, the encapsulation step S140 is performed by mounting a plurality of covers 4 on a substrate layer L1 carrying a plurality of sensing chips 2, such that each cover 4 encloses one sensing chip 2 therein, and each light-transmitting area 4121 faces one sensing chip 2. Each sensing chip 2 may be electrically coupled to the substrate layer L1 via a plurality of wires 3, and the plurality of sensing chips 2 are not electrically coupled to each other.

[0051] Therefore, since the multiple covers 4 are installed one by one to the corresponding parts of the substrate layer L1 in this embodiment, the corresponding installation position between any one cover 4 and the substrate layer L1 can have high accuracy, thereby meeting the requirements of high-specification products.

[0052] like Figure 7and Figure 8 As shown, the cutting step S150 is performed: the substrate layer L1 is cut to form a plurality of sensor package structures 100. The substrate layer L1 is cut into a plurality of substrates 1, and each substrate 1 is provided with a sensing chip 2, a plurality of corresponding wires 3, and a cover 4, which together constitute a sensor package structure 100.

[0053] [Example 2]

[0054] Please see Figure 9 and Figure 10 As shown, this is Embodiment Two of this application. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments (such as the sensor packaging structure, the demarcation step, and the molding step) will not be repeated. The differences between this embodiment and Embodiment One described above are roughly as follows:

[0055] The manufacturing method of the sensor packaging structure 100 in this embodiment does not have the pre-cutting step S130 of the first embodiment; that is, in this embodiment, the manufacturing method of the sensor packaging structure 100 performs a packaging step S240 and a cutting step S250 after the molding step, which is further explained below.

[0056] like Figure 9 As shown, the packaging step S240 is performed by mounting the opaque support layer L43 on a substrate layer L1 that carries a plurality of sensing chips 2, such that each light-transmitting area 4121 faces one of the sensing chips 2. Each sensing chip 2 may be electrically coupled to the substrate layer L1 via a plurality of wires 3, and the plurality of sensing chips 2 are not electrically coupled to each other.

[0057] Furthermore, since the opaque support layer L43 is directly mounted on the substrate layer L1 in an uncut state in this embodiment, the pre-cutting step S130 in the above embodiment can be omitted, thereby effectively shortening the production time of the sensor packaging structure 100 and reducing its production cost.

[0058] like Figure 9 and Figure 10As shown, the cutting step S250 is performed: the light-transmitting layer L41, the opaque support layer L43, and the substrate layer L1 are cut to form multiple sensor packaging structures 100. Specifically, the light-transmitting layer L41 is cut into multiple light-transmitting sheets 41, and the opaque support layer L43 is cut into multiple opaque supports 43. Each light-transmitting sheet 41 has a light-shielding film 42 and an opaque support 43, which together constitute a cover 4. Furthermore, the substrate layer L1 is cut into multiple substrates 1, and each substrate 1 has a sensing chip 2, corresponding multiple wires 3, and a cover 4, which together constitute a sensor packaging structure 100.

[0059] [Technical Effects of the Embodiments in this Application]

[0060] In summary, the sensor packaging structure and manufacturing method disclosed in this application, by forming the light-shielding film on the inner surface of the light-transmitting sheet, accurately divides the light-transmitting area on the inner surface and effectively prevents light from passing through the light-shielding film, thereby reducing glare. Furthermore, the light-shielding film also blocks light from flowing into the light-transmitting area during the forming process of the opaque bracket, thereby facilitating the precise forming of the opaque bracket on the forming area.

[0061] Furthermore, in the sensor packaging structure and manufacturing method disclosed in the embodiments of this application, the plurality of light-shielding films are elastic and are completely pressed and elastically deformed by the mold, so that they are connected to each other without gaps, so that the opaque support layer cannot pass through the gapless interface between the mold and any of the light-shielding films during the forming process, thereby avoiding flow to the corresponding light-transmitting area.

[0062] The content disclosed above is only an optional and feasible embodiment of this application, and is not intended to limit the patent scope of this application. Therefore, all equivalent technical changes made using the content of this application specification and drawings are included in the patent scope of this application.

Claims

1. A sensor package structure, characterized by, The sensor package structure comprises: a substrate; a sensing chip disposed on the substrate and electrically coupled to the substrate; and a cover disposed on the substrate so that the sensing chip is located in a space surrounded by the cover; wherein the cover comprises: a light-transmissive sheet having an outer surface and an inner surface; a light-blocking film in the form of a ring capable of being pressed and elastically deformed, the light-blocking film being formed on the inner surface so that the inner surface is divided into a light-transmissive region on the inner side of the light-blocking film and a shaped region on the outer side of the light-blocking film; and a light-impermeable support formed without gaps on the shaped region and disposed on the substrate; wherein the light-blocking film is not embedded in the light-impermeable support.

2. The sensor package structure according to claim 1, wherein The sensor package structure comprises a plurality of wires electrically coupled to the substrate and the sensing chip, and at least 90% of the volume of each wire is located in a projection space formed by the normal projection of the light-blocking film towards the substrate.

3. The sensor package structure according to claim 2, wherein The light-impermeable support has an inner side and an outer side, and the outer side of the light-impermeable support is coplanar with the outer side of the light-transmissive sheet and coplanar with the outer edge of the substrate.

4. The sensor package structure according to claim 3, wherein The distance between the inner side and the outer side of the light-impermeable support is tapered away from the light-transmissive sheet, so that each wire is partially located in a projection space formed by the normal projection of the inner side towards the substrate.

5. The sensor package structure of claim 1, wherein The top surface of the sensing chip has a sensing region, and the sensing region is located in a projection region formed by the normal projection of the light-transmissive region towards the top surface.

6. The sensor package structure of claim 1, wherein The cover is disposed on the substrate along an installation direction, and any cross section of the light-impermeable support perpendicular to the installation direction has an area not greater than that of the shaped region.

7. A method of manufacturing a sensor package structure, characterized by, The manufacturing method of the sensor package structure comprises: implementing a demarcation step: forming a plurality of light-blocking films arranged with gaps on the inner surface of a light-transmissive layer, so that the inner surface of the light-transmissive layer is divided into a plurality of light-transmissive regions on the inner side of the light-blocking films and a shaped region on the outer side of the light-blocking films; implementing a molding step: pressing a mold without gaps on the light-blocking films and molding a light-impermeable support layer on the shaped region of the light-transmissive layer; implementing a pre-cutting step: cutting the light-transmissive layer and the light-impermeable support layer to form a plurality of covers; implementing a packaging step: installing a plurality of the covers on a substrate layer carrying a plurality of sensing chips, so that each cover covers one sensing chip therein, and each light-transmissive region faces one sensing chip; and implementing a cutting step: cutting the substrate layer to form a plurality of sensor package structures.

8. The method of manufacturing a sensor package structure according to claim 7, wherein In the molding step, the light-blocking films are completely pressed and elastically deformed by the mold, so that they are connected without gaps, and none of the light-blocking films is embedded in the light-impermeable support layer.

9. A method of manufacturing a sensor package structure, characterized by, The manufacturing method of the sensor package structure comprises: Implementing a demarcating step: forming a plurality of light-shielding films in a spaced-apart manner on an inner surface of a light-transmissive layer, so as to divide the inner surface of the light-transmissive layer into a plurality of light-transmissive regions inside the light-shielding films and a forming region outside the light-shielding films; Implementing a molding step: pressing a mold against the light-shielding films without a gap and molding a non-light-transmissive support layer on the forming region of the light-transmissive layer; Implementing a packaging step: mounting the non-light-transmissive support layer on a substrate layer carrying a plurality of sensing chips, so that each light-transmissive region faces a sensing chip; and Implementing a cutting step: cutting the light-transmissive layer, the non-light-transmissive support layer, and the substrate layer to form a plurality of sensor packaging structures.

10. The method of manufacturing a sensor package structure according to claim 9, wherein In the molding step, the light-shielding films are completely pressed by the mold and elastically deformed, so as to be connected to each other without a gap, so that the light-shielding films are not embedded in the non-light-transmissive support layer.

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