Wireless communication device

Abstract

A wireless communication system can include an electronic device having a wireless communication module. The wireless communication module can include an antenna radiating element on a first surface, a ground ring surrounding the antenna radiating element on the first surface, and a radio mounted to a second surface. The wireless communication module can be incorporated into a system package that also includes other components. Encapsulation material can cover the wireless communication module and the other components. Shielding material can cover the encapsulation material and be coupled to the ground ring. An opening in the shielding material can be aligned with the antenna radiating element. If desired, the wireless communication system can include external equipment having a wireless communication module that is communicatively coupled to the wireless communication module to transfer firmware test, debug, recovery, and / or other data.

Description

[0001] This application claims priority to U.S. Patent Application No. 17 / 544,262, filed December 7, 2021, and U.S. Provisional Patent Application No. 63 / 242,868, filed September 10, 2021, the entire contents of which are incorporated herein by reference. Background Technology

[0002] This invention relates generally to electronic devices, including electronic devices having wireless circuitry.

[0003] Electronic devices sometimes have wired connectors for wired connection to external equipment. In other cases, some wired connectors can be bulky and take up too much space within the electronic device. It may be desirable to provide a wireless circuitry as an alternative to the wired connector.

[0004] To meet consumer demand for small-form-factor electronic devices, manufacturers have been relentlessly striving to achieve wireless circuits with compact structures. Because antennas in wireless circuits can interfere with each other and with other components in wireless communication devices, care must be taken when incorporating antennas into electronic devices to ensure the wireless circuits exhibit satisfactory performance. There is a desire to provide improved wireless circuits for electronic devices. Summary of the Invention

[0005] Electronic devices may include wireless circuitry. This wireless circuitry can be implemented in a wireless communication module, which includes an antenna radiating element and a radio frequency integrated circuit coupled to the antenna radiating element. As an example, the antenna radiating element may be a patch element formed on the surface of a module substrate and surrounded by a ground ring on that surface. The patch element may be separated from the ground ring by a distance configured to generate a wave of (far-field) radio frequency signals. As another example, the radio frequency integrated circuit may be mounted on an opposite surface of the module substrate. If desired, multiple antenna signal feed terminals may be coupled to the patch element to transmit radio frequency signals with different polarizations.

[0006] The electronic device may have a display on a first side and a housing wall on a second side opposite the first side. The housing wall may have a flange portion along the peripheral edge of the electronic device. The flange portion may have a recess in a corner area of ​​the electronic device. A wireless communication module may be mounted in the electronic device to align an antenna radiating element with the recess and enable the antenna element to transmit radio frequency signals through the housing wall. A patch element may be separated from the dielectric housing wall by a distance configured to form a wave of the radio frequency signal.

[0007] Wireless communication modules can be incorporated into a system-in-package (SIP) by mounting them onto a packaging substrate. Components such as integrated circuits implementing control circuitry can also be mounted onto the packaging substrate. The wireless communication module and other components can be covered with packaging material to form a fully encapsulated SIP. Conductive shielding material can cover the packaging material and short-circuit to a ground loop. The opening defined by the conductive shielding material can be aligned with antenna elements.

[0008] Electronic devices can communicate wirelessly with external equipment, which may also include wireless communication modules (e.g., wireless communication modules of the same type as those in the electronic device). If needed, the external equipment can use the wireless communication link to assist in testing, debugging, configuring, restoring, and / or otherwise updating the firmware of the electronic device. The carrier and alignment structure of the external equipment can help align the wireless communication modules with each other. Attached Figure Description

[0009] Figure 1 It is a block diagram of an exemplary wireless communication system based on some implementation schemes.

[0010] Figure 2 It is a block diagram of an exemplary wireless circuit based on some implementation schemes.

[0011] Figure 3 This is a cross-sectional view of an exemplary wireless communication module based on some implementation schemes.

[0012] Figure 4 It is based on some implementation plans. Figure 3 A top-down view of the wireless communication module.

[0013] Figure 5 It is based on some implementation plans. Figure 1 A perspective view of an exemplary electronic device in a wireless communication system.

[0014] Figure 6 It is a cross-sectional view of an exemplary peripheral portion of an electronic device including a wireless communication module according to some implementation schemes.

[0015] Figure 7 It is based on some implementation plans for use Figure 6 A perspective view of an illustrative corner area of ​​the casing wall of an electronic device.

[0016] Figure 8 This is a cross-sectional view of a wireless communication module mounted on a packaging substrate according to some implementation schemes.

[0017] Figure 9 This is a plan view of an exemplary electronic device having a wireless communication module incorporated in a system-in-package according to some implementation schemes.

[0018] Figure 10 It is a device with a wireless communication module according to some implementation schemes. Figure 1 A plan view of an exemplary external device in an exemplary wireless communication system.

[0019] Figure 11 It is based on some implementation plans for use Figure 10 A top-down view of an illustrative electronic device carrier for external equipment.

[0020] Figure 12 This is a diagram illustrating the alignment between two wireless communication modules according to some implementation schemes.

[0021] Figure 13 This is a diagram of two exemplary wireless communication modules that are communicatively coupled to each other via an intervening structure, according to some implementation schemes. Detailed Implementation

[0022] Figure 1 An exemplary system, such as wireless communication system 8, is shown, which includes one or more electronic devices, such as electronic devices 10-1 and 10-2, and any other electronic devices. The electronic devices in system 8 can each be: computing devices, such as laptop computers, desktop computers, computer monitors containing embedded computers, tablet computers, cellular phones, media players, or other handheld or portable electronic devices; smaller devices, such as wristwatches, pendant devices, headphones or handsets, devices embedded in glasses; or other equipment worn on a user's head; or other wearable or micro-devices, televisions, computer monitors without embedded computers, gaming devices, navigation devices, embedded systems (such as systems in which electronic equipment with displays is installed in kiosks or automobiles), voice-controlled speakers connected to the wireless internet, home entertainment devices, remote control devices, game controllers, peripheral user input devices, wireless base stations or access points, wireless power devices, firmware testing, debugging, or recovery devices, equipment that implements the functions of two or more of these devices; or other electronic equipment.

[0023] like Figure 1 As shown in the functional block diagram, exemplary device 10-1 may include components located on or within an electronic device housing, such as housing 12. Housing 12 (sometimes referred to as a shell) may be formed of plastic, glass, ceramic, fiber composite material, metal (e.g., stainless steel, aluminum, metal alloys, etc.), other suitable materials, or combinations thereof. In some cases, part or all of housing 12 may be formed of dielectric or other low-conductivity materials (e.g., glass, ceramic, plastic, sapphire, etc.). In other cases, housing 12, or at least some of the structures constituting housing 12, may be formed of metallic elements.

[0024] Device 10-1 may include control circuitry 14. Control circuitry 14 may include storage devices, such as storage circuitry 16. Storage circuitry 16 may include hard disk drive storage devices, non-volatile memory (e.g., flash memory configured to form a solid-state drive or other electrically programmable read-only memory), volatile memory (e.g., static random access memory or dynamic random access memory), etc. Storage circuitry 16 may include storage devices and / or removable storage media integrated within device 10-1.

[0025] Control circuitry 14 may include processing circuitry, such as processing circuitry 18. Processing circuitry 18 may be used to control the operation of device 10-1. Processing circuitry 18 may include one or more processors, microprocessors, microcontrollers, digital signal processors, host processors, baseband processor integrated circuits, application-specific integrated circuits, central processing units (CPUs), etc. Control circuitry 14 may be configured to perform operations in device 10-1 using hardware (e.g., dedicated hardware or circuitry), firmware, and / or software. Software code for performing operations in device 10-1 may be stored on storage circuitry 16 (e.g., storage circuitry 16 may include a non-transitory (tangible) computer-readable storage medium storing software code). This software code may sometimes be referred to as program instructions, software, firmware, data, commands, or code. The software code stored on storage circuitry 16 may be executed by processing circuitry 18.

[0026] Control circuitry 14 can be used to run software on device 10-1, such as satellite navigation applications, internet browsing applications, Voice over Internet Protocol (VoIP) telephone calling applications, email applications, media playback applications, operating system functions, etc. To support interaction with external equipment, control circuitry 14 can be used to implement communication protocols. Communication protocols that can be implemented using control circuitry 14 include Internet Protocol, Wireless Local Area Network (WLAN) protocols (e.g., IEEE 802.11 protocol—sometimes referred to as...). ), such as Protocols such as those used for other short-range wireless communication links, including wireless personal area network (WPAN) protocols, IEEE 802.11ad protocols (e.g., ultra-wideband protocols), cellular phone protocols (e.g., 3G protocols, 4G (LTE) protocols, 3GPP fifth-generation (5G) new radio (NR) protocols, etc.), antenna diversity protocols, satellite navigation system protocols (e.g., Global Positioning System (GPS) protocols, Global Navigation Satellite System (GLONASS) protocols, etc.), antenna-based spatial ranging protocols (e.g., radio detection and ranging (RADAR) protocols or other desired distance detection protocols for signals transmitted at millimeter-wave and centimeter-wave frequencies), or any other desired communication protocol. Each communication protocol may be associated with a corresponding radio access technology (RAT), which specifies the physical connection method used to implement the protocol.

[0027] Device 10-1 may include input-output circuitry 20. Input-output circuitry 20 may include input-output devices 22. Input-output devices 22 may be used to allow data to be supplied to device 10-1 and to allow data to be supplied from device 10-1 to external devices. Input-output devices 22 may include user interface devices, data port devices, and other input-output components. For example, input-output devices 22 may include touch sensors, displays (e.g., touch-sensitive displays and / or force-sensitive displays), light-emitting components such as displays without touch sensor capability, buttons (mechanical, capacitive, optical, etc.), scroll wheels, touchpads, keypads, keyboards, microphones, cameras, buttons, speakers, status indicators, audio jacks and other audio port components, digital data port devices, motion sensors (accelerometers, gyroscopes, and / or compasses for detecting motion), capacitive sensors, proximity sensors, magnetic sensors, force sensors (e.g., force sensors coupled to displays to detect pressure applied to the displays), temperature sensors, etc. In some configurations, keyboards, headphones, monitors, pointing devices such as touchpads, mice and joysticks, and other input-output devices can be coupled to device 10-1 using wired or wireless connections.

[0028] Input-output circuitry 20 may include wireless circuitry 24 to support wireless communication and / or radio-based spatial ranging operations. Wireless circuitry 24 may include one or more antennas 30. Wireless circuitry 24 may also include one or more radio components 26. Each radio component 26 may include circuitry for operating signals at a baseband frequency (e.g., baseband processor circuitry), signal generator circuitry, modulation / demodulation circuitry (e.g., one or more modems), radio frequency transceiver circuitry (e.g., radio frequency transmitter circuitry, radio frequency receiver circuitry, mixer circuitry for downconverting radio frequency signals to a baseband frequency or an intermediate frequency between radio frequency and baseband and / or upconverting signals at a baseband frequency or intermediate frequency to radio frequency), amplifier circuitry (e.g., one or more power amplifiers and / or one or more low-noise amplifiers (LNAs)), analog-to-digital converter (ADC) circuitry, digital-to-analog converter (DAC) circuitry, control paths, power paths, signal paths (e.g., radio frequency transmission lines, intermediate frequency transmission lines, baseband signal lines, etc.), switching circuitry, filter circuitry, and / or any other circuitry that uses antenna 30 to transmit and / or receive radio frequency signals. Each component of radio component 26 can be mounted on a corresponding substrate or integrated into a corresponding integrated circuit, chip, package (e.g., system-in-package), or system-on-a-chip (SoC). If desired, components of multiple radio components 26 can share a single substrate, integrated circuit, chip, package, or SoC.

[0029] Antenna 30 can be formed using any desired antenna structure. For example, antenna 30 may include an antenna with a resonant element, formed from a loop antenna structure, patch antenna structure, inverted F-shaped antenna structure, slot antenna structure, planar inverted F-shaped antenna structure, helical antenna structure, monopole antenna, dipole, a combination of these designs, etc. Adjustable filter circuits, switching circuits, impedance matching circuits, and / or other antenna tuning components can be used to adjust the frequency response and wireless performance of antenna 30 over time. Wireless circuit 24 may include any desired number of antennas 30.

[0030] The transceiver circuitry in radio component 26 may use one or more antennas 30 to transmit radio frequency (RF) signals (e.g., antennas 30 may transmit RF signals for the transceiver circuitry). As used herein, the term "transmit RF signals" means the transmission and / or reception of RF signals (e.g., for performing one-way and / or two-way wireless communication with external wireless communication equipment). Antenna 30 may transmit RF signals by radiating them into free space (or through an intermediary device structure such as a dielectric overlay). Alternatively or otherwise, antenna 30 may receive RF signals from free space (e.g., through an intermediary device structure such as a dielectric overlay). The transmission and reception of RF signals by antenna 30 each involve the excitation or resonance of antenna currents on antenna radiating elements in the antenna by RF signals within the antenna's operating frequency band.

[0031] Radio component 26 can use antenna 30 to transmit and / or receive radio frequency signals in different frequency bands of radio frequency (sometimes referred to herein as communication bands or simply "bands"). The frequency bands processed by radio component 26 may include wireless local area network (WLAN) bands (e.g., (IEEE 802.11) or other WLAN communication bands) such as the 2.4 GHz WLAN band (e.g., 2400 MHz to 2480 MHz), the 5 GHz WLAN band (e.g., 5180 MHz to 5825 MHz), 6E band (e.g., 5925MHz to 7125MHz) and / or others Frequency bands (e.g., 1875MHz to 5160MHz); Wireless Personal Area Network (WPAN) frequency bands such as 2.4GHz Frequency bands or other WPAN communication bands; cellular telephone bands (e.g., bands from about 600 MHz to about 5 GHz, 3G bands, 4G LTE bands, 5G New Radio Frequency Range 1 (FR1) band below 10 GHz, 5G New Radio Frequency Range 2 (FR2) band between 20 GHz and 60 GHz, etc.); other centimeter or millimeter wave bands between 10 GHz and 300 GHz; near field communication (NFC) bands (e.g., 13.56 MHz); satellite navigation bands (e.g., GPS bands from 1565 MHz to 1610 MHz, Global Navigation Satellite System (GLONASS) bands, BeiDou Navigation Satellite System (BDS) bands, etc.); ultra-wideband (UWB) bands operating under the IEEE 802.15.4 protocol and / or other ultra-wideband communication protocols; communication bands under the 3GPP wireless communication standard family; communication bands under the IEEE 802.XX standard family, and / or any other desired bands of interest.

[0032] Each radio component 26 can transmit and / or receive radio frequency signals according to a corresponding radio access technology (RAT) that determines the physical connection method for the components in the corresponding radio component. If desired, one or more radio components 26 can implement multiple RATs. As an example only, the radio components 26 in device 10-1 may include a UWB radio component for transmitting UWB signals using one or more antennas 30, a Bluetooth (BT) radio component for transmitting BT signals using one or more antennas 30, a Wi-Fi radio component for transmitting WLAN signals using one or more antennas 30, a cellular radio component for transmitting cellular telephone signals using one or more antennas 30 (e.g., in the 4G band, 5G FR1 band, and / or 5G FR2 band), and an NFC radio component for transmitting NFC signals using one or more antennas 30. This example is merely illustrative, and in general, radio components 26 may include any desired combination of radio components to cover any desired combination of RATs.

[0033] Wireless circuit 24 may include wireless power circuitry such as wireless power (receiving) circuitry 32 and coil structures such as one or more coils 34. Device 10-1 may use wireless power circuitry 32 and coils 34 to receive wirelessly transmitted power (e.g., wireless charging signals) from a wireless power adapter (e.g., a wireless power transmission device).

[0034] The wireless power adapter allows AC current to pass through the wireless power transmitting coil to generate a time-varying electromagnetic (e.g., magnetic) field, which is received as wireless power (wireless charging signal) by coil 34 in device 10-1. Wireless power circuit 32 may include converter circuitry, such as a rectifier circuitry, which generates a DC voltage from the wireless charging signal to power device 10-1. The DC voltage generated by the rectifier circuitry in wireless power circuit 32 can be used to charge energy storage devices (e.g., batteries) and / or to power other components in device 10-1.

[0035] Although for clarity, in Figure 1 In the example, control circuitry 14 is shown as separate from wireless circuitry 24, but wireless circuitry 24 may include processing circuitry (e.g., one or more processors) and / or storage circuitry, which forms part of processing circuitry 18 and storage circuitry forms part of storage circuitry 16 of control circuitry 14 (e.g., portions of control circuitry 14 may be implemented on wireless circuitry 24).

[0036] Radio device 26 may use antenna 30 to transmit and / or receive radio frequency signals to transmit wireless communication data between device 10-1 and one or more other external wireless communication equipment or devices. Figure 1In an exemplary example, system 8 includes electronic device 10-2 (sometimes referred to herein as external equipment 10-2 or electronic equipment 10-2), which may have one or more of the same elements described above in conjunction with electronic device 10-1. Specifically, as Figure 1 As shown, electronic device 10-2 may include a wireless circuit such as wireless circuit 54, which has one or more wireless components such as wireless component 56 and one or more antennas such as antenna 60.

[0037] Devices 10-1 and 10-2 can be communicatively coupled via one or more communication links 66 through their respective wireless circuits. Wireless communication data can be transmitted bidirectionally or unidirectionally between devices 10-1 and 10-2. As an example, devices 10-1 and 10-2 can form a half-duplex communication link or a full-duplex communication link.

[0038] The configuration of device 10-2 as a firmware update device (e.g., a device configured to perform firmware testing, debugging, recovery, and / or other functions related to the firmware of device 10-1) is described herein as an illustrative example. Device 10-2 may be or implement other devices or equipment with additional functions if desired.

[0039] In some of these configurations of device 10-2, the wireless communication data being transmitted with device 10-1 may include data encoded into corresponding data packets, such as wireless data associated with software applications running on device 10-1, wireless data associated with software updates of device 10-1, wireless data associated with testing, debugging and / or repairing device 10-1, wireless data associated with resetting or restoring device 10-1 to default or factory settings, wireless data associated with telephone calls, messages, streaming media content or internet browsing, and so on.

[0040] In some of these configurations of device 10-2, the wireless circuit 54 in device 10-2 may include a wireless power (transmit) circuit 62 and a coil structure such as one or more coils 64. Configured in this way, device 10-2 can use the wireless power circuit 62 and the coils 64 to transmit wireless power (signals) to device 10-1.

[0041] In some of these exemplary configurations of device 10-2, device 10-2 may include a support structure 42 or other structure such as a platform, carrier, or docking station, to which the wireless circuitry and other components of device 10-2 (e.g., control circuitry, input-output devices, etc.) are mounted, and these structures are configured to receive device 10-1. As an example, support structure 42 may be formed of plastic, glass, ceramic, fiber composite material, metal, other suitable materials, or combinations thereof.

[0042] Figure 1 The examples provided are merely illustrative. System 8 may include any suitable number of electronic devices or apparatuses (e.g., having elements similar to those in devices 10-1 and / or 10-2) if desired. Device 10-1 or device 10-2 may be communicatively coupled to one or more of these other electronic devices or apparatuses as a substitute for or complement to coupling with each other, or may sometimes operate in isolation. Devices 10-1 and 10-2 may include any other suitable elements if desired, or the coupling may be omitted. Figure 1 One or more elements described.

[0043] Figure 2 yes Figure 1 Functional block diagram of wireless circuit 24. (See attached diagram.) Figure 2 As shown, each radio component 26 can be coupled to one or more antennas 30 via one or more radio frequency transmission lines 70. As an illustrative example, each radio frequency transmission line 36 may include conductors such as signal conductor 72 and conductors such as signal conductor 74. The corresponding antenna 30 may include an antenna feed section such as an antenna feed section 76 having a ground antenna feed terminal 78 coupled to conductor 72 and an antenna feed terminal 80 coupled to conductor 74. If desired, the transmission line 70 may include additional signal conductors coupled to additional antenna feed terminals.

[0044] If necessary, one or more radio frequency transmission lines 70 may be shared between radio component 26 and / or antenna 30. A radio frequency front-end (RFFE) module may be inserted onto one or more RF transmission lines 70. The RFFE module may include a substrate, integrated circuit, chip, or package separate from radio component 26, and may include filter circuitry, switching circuitry, amplifier circuitry, impedance matching circuitry, RF coupler circuitry, and / or any other desired RF circuitry for operating on RF signals transmitted through RF transmission lines 70.

[0045] Although Figure 2 The device 10-1 is described. Figure 1 One or more radio components 26 and one or more antennas 30 in the system 8, but other electronic devices such as devices 10-2 in system 8 and other devices may include one or more radio components and antennas configured in the same manner.

[0046] In some exemplary configurations, electronic devices may include high-data-rate wired connectors. These wired connectors can be bulky and occupy excessive internal space, and require external input-output ports, which reduces the security of the electronic device. Therefore, it is desirable to provide wireless circuits capable of establishing high-data-rate wireless communication links.

[0047] However, providing wireless circuits operating at relatively high frequencies, such as one or more frequencies at about 60 GHz (e.g., greater than 10 GHz), thereby allowing high data rate data transmission, can present significant challenges. For example, providing wireless circuits at these frequencies in a compact manner to save space can be challenging; other components in each wireless device (e.g., other parts of the wireless circuit, conductive elements, housing structure, etc.) can potentially interfere with the operation of the wireless circuits used to establish these wireless communication links; misalignment between communication devices (e.g., corresponding wireless circuits) and intervening structures between corresponding wireless circuits can degrade the wireless communication link. Thus, considering one or more of these problems, System 8 ( Figure 1 One or more of the electronic devices in the device may have improved wireless circuitry.

[0048] Figure 3 It can be used in one or more devices (e.g., Figure 1 The cross-sectional view of an exemplary wireless communication module, such as wireless communication module 82, is shown for the wireless circuitry of a device in System 8. The configuration of wireless communication module 82, which operates at one or more frequencies between 10 GHz and 300 GHz (e.g., in the 60 GHz band), to transmit firmware test data, firmware debug data, firmware repair data, firmware recovery data, and / or device configuration data, is described herein as an exemplary example. If desired, wireless communication module 82 can operate at any suitable frequency (e.g., covering one or more suitable frequency bands) and can transmit any suitable type of data for the desired function.

[0049] like Figure 3 As shown, module 82 may include a substrate, such as substrate 84. Substrate 84 may include multiple layers 86, and therefore may be referred to as a multilayer substrate. Some of the layers 86 may be formed of one or more non-conductive materials (e.g., dielectric materials), some of the layers 86 may be conductive materials (e.g., metallic materials), and some of the layers 86 may be formed of other materials (e.g., semiconductor materials).

[0050] Substrate 84 has opposing first and second surfaces (e.g., Figure 3The antenna radiating element (e.g., conductive (metallic) patch element 90) may be disposed on a first surface of substrate 84. Antenna grounding structures such as conductive ground layer 92 (sometimes referred to as ground ring 92) may also be disposed on the first surface of substrate 84. Ground layer 92 may surround patch element 90 and be separated from patch element 90 by dielectric gap 91. Other antenna grounding structures such as antenna ground layer 94 may be embedded in substrate 84. Conductive structures in substrate 84 such as conductive via 96 may couple (e.g., electrically short-circuit) ground layer 92 at the first surface to the embedded ground layer 94. One or more additional intervening conductive ground layers 98 may also be coupled (e.g., electrically short-circuit) to via 96. In this configuration, the antenna's conductive grounding structures (e.g., ground layers 92, 94, and 98 and via 96) may surround and define a cavity for patch element 90.

[0051] Module 82 may include radio components 88, such as radio frequency integrated circuits or radio components that implement surface mount elements 90 (e.g., Figure 1 The integrated circuit forming the radio component 88 may include a combination of radio components 26 and 88. Figure 1 The radio component 26 describes one or more elements. The radio component 88 may be mounted to a second side of the substrate 84. The radio component 88 may provide antenna signals to antenna elements (e.g., patch element 90, ground structure, etc.) along one or more signal paths 104. As an example, the signal path 104 may form a transmission line structure (e.g., signal conductor path, ground conductor path, etc.) coupled to the antenna radiating element and the antenna ground. Figure 3 As shown, the antenna may include one or more positive antenna feed terminals, such as terminals 102-1 and 102-2, coupled to patch element 90. Radio component 88 may provide antenna signals along a first signal conductor formed by signal paths 104 and 100-1 coupled to terminal 102-1. Radio component 88 may provide antenna signals along a second signal conductor formed by signal paths 104 and 100-2 coupled to terminal 102-2. Radio component 88 may provide one or more ground conductors coupled to an antenna ground structure on module 82.

[0052] If desired, module 82 may include input-output structures on the second surface of substrate 84, such as input-output pads, input-output ports, input-output pins, etc. Radio component 88 may be coupled to signal path 104 via these input-output structures on the second surface (e.g., via solder). These input-output structures allow module 82 (e.g., radio component 88 in module 82) to interface with other components in an electronic device. As an example, module 82 and control circuitry in a device may be mounted to a shared package substrate. In this example, the control circuitry may be coupled to radio component 88 via one or more signal paths to transmit data for wireless communication. These signal paths may include metal wiring layers in the shared package substrate, a first set of input-output structures connecting the package substrate to module 82, metal wiring layers in substrate 84, and a second set of input-output structures coupling radio component 88 to metal wiring layers in substrate 84.

[0053] Figure 4 yes Figure 3 A top-down view of the wireless communication module 82. (See attached image.) Figure 4 As shown, patch element 90 may have a rectangular profile (e.g., a square profile). Therefore, the rectangle may have two main (central) vertical axes 106 and 108. Antenna feed terminal 102-1 may be positioned along axis 106. Antenna feed terminal 102-2 may be positioned along axis 108. Configured in this way, patch element 90 can be used to transmit radio frequency (RF) signals with multiple polarizations. As an example, the RF signal transmitted using terminal 102-1 may have a first linear polarization, while the RF signal transmitted using terminal 102-2 may have a second linear polarization (orthogonal to the first linear polarization).

[0054] These configurations of the patch element 90 are merely illustrative. The patch element 90 may have any suitable shape or profile if desired. One or more antenna feed terminals may be coupled to the patch element 90 at one or more suitable locations if desired. The patch element 90 may transmit single-polarized RF signals or RF signals with different circular polarizations if desired.

[0055] like Figure 4As shown, the ground layer 92 can be separated from the surface mount element 90 by a dielectric gap 91 (e.g., an air gap or a gap filled with a non-conductive material). The dielectric gap 91 can extend all the way around the periphery of the surface mount element 90. In other words, the ground layer 92 can surround the surface mount element 90 along each peripheral edge of the surface mount element 90 and can have edges extending parallel to the respective peripheral edges of the surface mount element 90. If desired, the distances separating the ground layer 92 and the opposite edges of the surface mount element 90 can be the same. Specifically, distances 110-1 and 110-2, as well as the corresponding distances between the surface mount element 90 and the ground layer 92 at other peripheral edges, can be the same. If desired, one or more of these distances can be different from each other.

[0056] The spacing (e.g., distances 110-1 and 110-2) between the patch element 90 formed by the dielectric gap 91 and the ground layer 92 can be configured to allow sufficient space to form a wave. This allows the radio frequency signal transmitted by the patch element 90 to have far-field characteristics (e.g., exhibiting plane waves, mutually supporting orthogonal electric and magnetic fields). These distances can be based on the effective operating wavelength of the patch element 90 (e.g., the operating wavelength adjusted by taking into account the dielectric properties of the material surrounding the patch element 90) to allow the radio frequency signal to exhibit far-field characteristics.

[0057] like Figure 4 As shown, module 84 can have a rectangular profile with rounded corners. The rounded corners of module 84 help to accommodate module 84 in narrow spaces. Ground layer 92 can have an inner edge defining the edge of gap 91 (e.g., for proper spacing from surface mount element 90). The inner edge of ground layer 92 can also have a rectangular profile with rounded corners to help maintain proper spacing from surface mount element 90. Ground layer 92 can extend from the inner edge to the outer edge at the peripheral edge of module 82. This helps to improve the manufacturing process of module 82. Figure 4 In the example, the rectangular outline of module 82 may have a geometric center, and the outline of patch element 90 may have a geometric center offset from the geometric center of module 82. Other configurations of module 82 may be used if needed.

[0058] In some configurations described herein as illustrative examples, device 10-1 may be a portable device, such as a watch device (e.g., a smartwatch). Other configurations may be available for device 10-1 if desired. Figure 5 This is a perspective view of an exemplary portable electronic device that can realize device 10-1. Figure 5In the example, device 10-1 includes a display, such as display 112. Display 112 may be mounted to a housing, such as housing 12. Housing 12 may be formed using a one-piece configuration, in which a portion or all of housing 12 is machined or molded into a single structure, or it may be formed using multiple structures (e.g., an internal frame structure, one or more structures forming the outer housing surface, etc.). Housing 12 may have metallic sidewalls, such as sidewall 12W, or sidewalls formed of other materials. Examples of metallic materials that may be used to form sidewall 12W include stainless steel, aluminum, silver, gold, metal alloys, or any other desired conductive material. Sidewall 12W may sometimes be referred to herein as housing sidewall 12W or conductive housing sidewall 12W.

[0059] Display 112 may be formed (e.g., mounted thereon) on the front side (front face) of device 10-1. Housing 12 may have a rear housing wall, such as rear housing wall 12R, on the rear side (rear face) of device 10-1 opposite the front face of device 10-1. Conductive housing sidewalls 12W may surround the periphery of device 10-1 (e.g., conductive housing sidewalls 12W may extend around the peripheral edge of device 10). Rear housing wall 12R may be formed of a conductive and / or insulating material. Examples of dielectric materials that may be used to form rear housing wall 12R include plastics, glass, sapphire, ceramics such as zirconium oxide, wood, polymers, combinations of these materials, or any other desired dielectric.

[0060] The rear housing wall 12R and / or display 112 may extend across some or all of the length (e.g., parallel to the x-axis) and width (e.g., parallel to the y-axis) of device 10-1. The conductive housing sidewall 12W may extend across some or all of the height (e.g., parallel to the Z-axis) of device 10-1. The conductive housing sidewall 12W and / or rear housing wall 12R may form one or more outer surfaces of device 10-1 (e.g., user-visible surfaces of device 10-1), and / or may be achieved using internal structures that do not form outer surfaces of device 10-1 (e.g., user-invisible conductive or dielectric housing structures of device 10, such as conductive structures covered with layers such as thin cosmetic layers, protective coatings, and / or other coatings that may contain dielectric materials such as glass, ceramics, or plastics, or other structures that form outer surfaces of device 10 and / or conceal housing walls 12R and / or 12W from the user's perspective).

[0061] Display 112 may include an array of display pixels formed from liquid crystal display (LCD) components, an electrophoretic display pixel array, a plasma display pixel array, an organic light-emitting diode (OLED) display pixel array, an electrowetting display pixel array, or display pixels based on other display technologies. A display cover layer may be used to protect display 112. The display cover layer may be formed of a transparent material such as glass, plastic, sapphire or other crystalline insulating materials, ceramic, or other transparent materials. For example, the display cover layer may extend across substantially the entire length and width of device 10-1.

[0062] Device 10-1 may include buttons such as button 114. Any suitable number of buttons may be present in device 10-1. Buttons may be located in openings in housing 12 (e.g., openings in the conductive housing sidewall 12W or rear housing wall 12R). Buttons may be rotary buttons, sliding buttons, buttons actuated by pressing a movable button member, etc. The button member used for the button (e.g., button 114) may be formed of metal, glass, plastic, or other materials.

[0063] If needed, device 10-1 can be coupled to a strap such as strap 116. Strap 116 can be used to hold device 10-1 on a user's wrist (as an example). Strap 116 may sometimes be referred to herein as wristband 116. Figure 5 In the example, the wristband 116 is attached to the opposite side of device 10-1. The conductive housing sidewall 12W and / or rear housing wall 12R include attachment structures (e.g., lugs or other attachment mechanisms configuring housing 12 to receive the wristband 116) for securing the wristband 116 to housing 12. A configuration excluding the strap may also be used for device 10-1.

[0064] Figure 6 It is an electronic device 10-1 ( Figure 5 A partial cross-sectional side view of the device 10-1 shows how an antenna in the wireless communication module can be mounted within the device 10-1 to transmit radio frequency signals through the rear housing wall 12R. (See attached image.) Figure 6 As shown, the display 112 can form the front of the device 10, while the rear housing wall 12R forms the back of the device 10-1. Figure 6 In the example, the rear housing wall 12R is formed of a dielectric material such as glass, sapphire, ceramic or plastic such as zirconium oxide. This is merely illustrative, and if desired, the rear housing wall 12R may also include conductive portions (e.g., a conductive frame surrounding one or more dielectric windows in the rear housing wall 12R, a conductive cosmetic layer, etc.).

[0065] Display 112 may include a display overlay 120 on display module 122. Display module 122 may, for example, form an active area or portion of display 112 for displaying images and / or receiving touch sensor input. Lateral portions of display 112 excluding display module 122 (e.g., portions of display 112 formed by display overlay 120 but not having the lower portion of display module 122) may sometimes be referred to herein as inactive areas or portions of display 112.

[0066] Display module 112 may include conductive components (sometimes referred to herein as conductive display structures) for forming portions of an antenna radiating through the front of device 10-1 (e.g., an antenna with radiating elements, such as radiating slot elements defined by display module 122 and / or conductive housing sidewalls 12W). The conductive display structure in display module 122 may, for example, have a planar shape (e.g., a planar rectangular shape, a planar circular shape, etc.) and may be formed of metal and / or other conductive materials that carry antenna current for the forward-facing antenna in device 10-1. The conductive display structure may include the frame of display module 122, pixel circuitry, touch sensor electrodes, embedded near-field communication antennas, etc.

[0067] The display cover 120 may be formed of an optically transparent dielectric such as glass, sapphire, ceramic, or plastic. The display module 122 may display images (e.g., emit image light) through the display cover 120 for user viewing and / or collect touch or force sensor input through the display cover 120. If desired, portions of the display cover 120 may be provided with opaque masking layers (e.g., ink masking layers) and / or pigments to obscure the interior of the device 10-1 from the user's view.

[0068] Substrates such as one or more rigid printed circuit boards, one or more flexible printed circuit boards, or one or more packaging substrates may be located inside device 10-1. Figure 6 In the example, the substrate 126 of the system package 124 (e.g., a system-in-package (SIP)) may be disposed within the device 10-1. System components such as component 128 (e.g., implementing...) Figure 1 One or more integrated circuits, such as control circuit 14 or other circuits, input-output circuit 20, etc., may be mounted on substrate 126.

[0069] It may be desirable to remove wired connector structures from electronic devices to provide a seamless external device surface, improve device water resistance, and optimize available internal space by removing bulky connector components. As an example, electronic devices may include wired connector ports for accommodating firmware testing, debugging, and / or recovery, or for other functions. It may be desirable to remove these wired ports and connectors.

[0070] To maintain the functionality of wired connectors, it may be desirable to provide wireless circuits with one or more of the same functionality. In the example above, it may be desirable to provide a wireless device for transmitting firmware for testing, debugging, and / or restoring electronic equipment. To maintain and / or improve existing applications of wired connections with wireless connectivity, the wireless connection can use high data rates to transmit data in a bidirectional wireless communication link. The wireless communication link can be established between wireless circuits across distances less than 10 inches, less than 5 inches, less than 4 inches, less than 2 inches, less than 1 inch, etc., or across distances greater than 1 inch, greater than 2 inches, greater than 5 inches, etc. As an example, the wireless communication link can use high data transmission rate operations to transmit data at speeds of 100 kilobits per second or higher, 1 megabit per second (Mbps) or higher, 100 Mbps or higher, 500 Mbps or higher, 1 gigabits per second or higher, etc., to satisfactorily replace some wired connections (e.g., wired connections used for transmitting debugging, testing, restoring, and / or other data).

[0071] The examples of removing and / or replacing wired connections used for transmitting debugging, testing, and / or recovery data are merely illustrative. If desired, it may be desirable to similarly remove and / or replace other wired connections, such as USB wired connections or wired connections based on other protocols, or wired connections transmitting other types of signals wirelessly (e.g., high data rate, bidirectional, and / or near-field wireless connections).

[0072] Given the limited internal space of the device, including additional wireless circuitry (e.g., antennas and radio components) to achieve these wireless connections may require compact and well-integrated antenna elements. (Still referencing...) Figure 6 It has an antenna and such as antenna module 82 ( Figure 3 and Figure 4 The antenna module of the radio component can be integrated into the system package 124.

[0073] Antenna radiating element 90 may be disposed on the side of antenna module 82 facing the rear housing wall 12R to transmit radio frequency signal 134 through the rear housing wall 12R. To aid in wave formation during the transmission of radio frequency signal through the rear housing wall 12R, an opening such as opening 132 (sometimes referred to herein as a cavity or recess) may overlap with antenna element 90. By providing a gap (e.g., the height of opening 132) between antenna element 90 and rear housing wall 12R, wave formation can occur, allowing the transmission of radio frequency signals for the far-field region (e.g., signals with far-field characteristics such as plane waves, mutually supporting orthogonal electric and magnetic fields, etc.). The gap provided by opening 132 may be based on the effective operating wavelength of patch element 90 (e.g., an operating wavelength adjusted by taking into account the dielectric properties of the material surrounding patch element 90) to allow the radio frequency signal to exhibit far-field characteristics.

[0074] The rear housing wall 12R may define one or more sides of the opening 132. Adjacent components, such as component 130, may help define one or more sides of the opening 132 if desired. In some exemplary examples, component 130 may include conductive structures such as additional antenna radiating elements (e.g., rearward-facing antenna radiating elements on the rear housing wall 12R). Additional antenna radiating elements may help define the peripheral boundary of the opening 132 if desired. Other conductive or non-conductive components may help define the boundary of the opening 132 if desired.

[0075] Figure 7 yes Figure 6 A perspective view of the corner area of ​​the rear outer shell wall 12R. (See image.) Figure 7 As shown, the rear housing wall 12R may have a flange portion, such as flange 140, projecting from the lower surface 138 of the housing wall 12R. The lower surface 138 may be an inner surface of the rear housing wall 12R, and the opposing surface of surface 138 may be an outer surface of the rear housing wall 12R defining the rear side of the device 10-1. Flange 140 may be a portion of the rear housing wall 12R coupled (e.g., attached) to the sidewall 12W. Flange 140 may extend along at least two peripheral sides of the device 10-1, such as... Figure 7 As shown, and can extend along all four peripheral sides of device 10-1 (e.g., around the perimeter of device 10-1). Figure 7 As shown, the two portions of the flange 140 extending along the two peripheral sides of the device 10-1 can be connected at the corner of the rear housing wall 12R.

[0076] exist Figure 7 In the example, with Figure 6The opening 132 aligned with the antenna element 90 can be formed by a recess in a flange 140 along one of the peripheral sides of the device 10-1. Specifically, the opening 132 can be formed in a corner region of the flange 140. This allows the antenna element 90 to be placed near a corner of the device 10-1 to avoid interference from other components within the device 10-1 and to provide a compact implementation.

[0077] The opening 132 may have a peripheral side (boundary) defined by surfaces 142, 144, and 146 of the flange 140. Figure 7 In the example, the recess 132 is shown extending from the top surface of the flange 140 to a bottom surface 148 coplanar with the surface 138. However, this is merely illustrative. If desired, the bottom surface 148 of the recess 132 may still protrude relative to the surface 138. Typically, the depth of the recess 132 (e.g., the location of the bottom surface 148) and the width and length of the recess 132 (e.g., the locations of surfaces 142, 144, and 146) can be configured to allow wave formation within the opening 132 to help the radio frequency signal transmitted by the antenna element 90 exhibit far-field characteristics.

[0078] Figure 7 The configuration shown is merely illustrative. Although different portions of the rear housing wall 12R are shown as having flat surfaces, this is only illustrative. If desired, one or more of these surfaces (e.g., surfaces 138, 142, 144, 146, 148, etc.) may be curved surfaces. Although the opening 132 (and therefore the antenna element 90) is shown as formed in the corner region of the flange 14 in the rear housing wall 12R, the opening 132 (and therefore the antenna element 90) may alternatively be provided in other suitable locations if desired.

[0079] Figure 8 This is a cross-sectional view of an exemplary system package (e.g., a system-in-package (SIP)) such as a system package 124 containing a wireless communication module 82. Figure 8 As shown, the system package 124 may include a package substrate 126. The bottom surface of substrate 84 may be mounted to the top surface of package substrate 126. Specifically, input-output structures on the bottom surface of substrate 84 may be electrically connected to input-output structures on the top surface of substrate 126 via solder, such as solder balls 156. In this way, (signal) wiring layers in substrate 126 may be electrically connected to (signal) wiring layers in substrate 84, thereby connecting to radio components 88. Radio components 88 may be coupled to input-output structures on the bottom surface of substrate 84 via solder (e.g., solder balls or microbumps 152) and may be connected to wiring layers in substrate 126 via wiring layers in substrate 84.

[0080] Encapsulation material or encapsulant 158 ​​can be used to encapsulate the wireless communication module 82 and other components mounted to the encapsulation substrate 124. In this way, encapsulation material 158 can surround the substrate 84, solders 152 and 156, radio components 88, and other components in the system package 124, thereby protecting them from contamination and weathering. Encapsulation material 158 can also be formed along the top surface of the substrate 84 (e.g., above the antenna element 90).

[0081] A conductive (electromagnetic) shielding layer, such as shielding layer 160, can be deposited (e.g., by sputtering) to cover one or more sides and / or surfaces of the encapsulation material 158 and substrate 126, thereby shielding components in the system package 124 from potential electromagnetic interference. An opening in the encapsulation material 158 may be formed along the top surface of substrate 84 to expose a portion of the antenna ground ring 92 (or contact pads connected to the ground ring 92). The conductive shielding layer 160 may be electrically connected (shorted) to the ground ring 92 at the opening in the encapsulation material 158. The conductive shielding layer 160 may define an opening that overlaps with or aligns with the antenna element 90 (e.g., by removing a portion of the conductive shielding layer 160). Therefore, the antenna element 90 can transmit radio frequency signals without interference from the conductive shielding material 160.

[0082] Figure 9 This is a plan view of an exemplary electronic device, such as device 10-1, having a system package 124 containing a wireless communication module. Figure 9 As shown, the system package 124 can extend substantially across the rectangular outline of the device 10-1 (e.g., from one sidewall 12W to the opposite sidewall 12W). Figure 9 In the example, the wireless communication module and antenna element 90 may be mounted in the corner area of ​​the system package 124 (e.g., in the corner area of ​​device 10-1).

[0083] If needed, different functional systems in device 10-1 (e.g., control circuitry, power management circuitry, other radio components, etc.) can be incorporated into system package 124 to form a system-in-package. Specifically, packaging material (e.g., packaging material 158) can be formed on the entire functional surface of system package 124 (e.g., on one or more surfaces of a package substrate on which components are mounted). Similarly, in addition to forming the openings for antenna element 90, conductive shielding layer 160 can extend across the entire system package 124. Openings in shielding layer 160 can expose packaging material 158, beneath which antenna element 90 is disposed.

[0084] Electronic devices such as device 10-1 can wirelessly communicate with one or more exemplary electronic devices (e.g., equipment external to device 10-1). In some exemplary configurations described herein as illustrative examples, device 10-1 can wirelessly communicate with device 10-2. In these exemplary configurations, device 10-2 can implement firmware testing, debugging, and / or recovery equipment, which is configured to operate on the firmware of device 10-1 and is therefore sometimes referred to as external test equipment. Device 10-2 can serve other functionalities and interact with device 10-1 in any desired manner, if desired.

[0085] Figure 10 and Figure 11 This is a diagram showing different exemplary parts of device 10-2. Figure 10 This is a plan view of an exemplary docking station, such as docking station 170, configured to wirelessly communicate with one or more devices, such as device 10-1. Specifically, docking station 170 may be configured to perform firmware testing, debugging, and / or recovery or other functions of device 10-1 via a wireless link.

[0086] Specifically, device 10-2 may include a support structure 172, which may be a platform on which other functional components of a docking station 170, such as control circuits, wireless circuits, and other circuits, are mounted. Figure 10 As shown, device 10-2 may include, for example, a wireless communication module 82-2 (e.g., with...). Figure 3 and Figure 4 The wireless communication module 82 in the middle has the same wireless communication module (wireless circuit). In Figure 10 In an exemplary configuration, the wireless communication module 82-2 may have a top surface (e.g., in the +z direction) and a corresponding antenna element (e.g., Figure 3 and Figure 4 The antenna element 90 is disposed on the top surface. In other words, the antenna element is configured to transmit radio frequency signals out of the page in the +z direction. The radio components of the antenna element (e.g., Figure 3 The radio component 88 in the wireless communication module 82-2 can be mounted on the opposite bottom surface (e.g., in the -z direction).

[0087] To establish a more efficient communication link with other devices, the wireless communication module 82-2 can be mounted on a support plate 174. The support plate 174 can be positioned above a support structure 172 and can be configured to raise the wireless communication module 82-2 (in the +z direction) an appropriate distance above the support structure 172. This helps to provide an appropriate distance between the wireless communication module 82-2 and the corresponding wireless circuit communicating with it. An alignment plate 176 can overlap with the support plate 174 and can include an opening 180. Specifically, the wireless communication module 82-2 can be located within the opening 180 in the alignment plate 176. The alignment plate 176 can fix the relative position of the wireless communication module 82 in the xy plane to properly align the wireless circuit communicating with the wireless communication module 82-2. Alignment and attachment structures 178, such as screws, can hold the alignment plate 176 (and the support plate 174) to the support structure 172.

[0088] The wireless communication module 82-2 may have an input-output structure coupled to the flexible printed circuit 182 (e.g., via solder). The flexible printed circuit 182 can connect the wireless communication module 82-2 to other circuitry on the printed circuit board 184. If desired, control circuitry for controlling the operation of the device 10-2 (e.g., testing, debugging, and / or recovery operations of the firmware of device 10-1) can be mounted on the printed circuit board 184 and coupled to the wireless communication module 82-2. If desired, the printed circuit board 184 may include an input-output port to which control circuitry not mounted on the printed circuit board 184 is coupled for connection to the wireless communication module 82-2. In some exemplary configurations, additional wireless circuitry such as a coil and wireless power circuitry such as coil 64 and wireless power circuitry 62 may be provided at locations such as position 188. Figure 1 The wireless power (transmit) circuits are installed on the support structure 172. When device 10-2 communicates wirelessly with device 10-1 using module 82-2, the wireless power (transmit) coil 64 configured at position 188 can be aligned with the corresponding wireless power (receive) coil 34.

[0089] While the support plate 174 and alignment plate 176 help fix the position of the wireless communication module 82-2 relative to the support structure 172 to properly establish a satisfactory communication link between the docking station 170 and the device 10-1, the device 10-1 can also be fixed in place relative to the docking station 170. Therefore, the device 10-2 may also include a device carrier, such as... Figure 11 The carrier 190 in the middle.

[0090] Figure 11This is a top-down view of a device carrier 190 configured to receive device 10-1 and placed on top of a docking station 170. When placed on top of the docking station 170, the carrier 190 provides proper alignment between the functional circuitry of device 10-1 and the docking station 170 (e.g., wireless communication module 82-2, wireless power circuitry, etc.). Specifically, the carrier 190 may include a carrier platform 192 having an opening (e.g., opening 194) configured to receive device 10-1. The carrier platform 192 may include surfaces and other mechanisms that hold device 10-1 in a suitable position within the opening 194 on the carrier platform 192. The opening 194 may be configured such that when device 10-1 is in the opening 194 and the carrier 190 is placed on the docking station 170, the wireless communication module 82-1 in device 10-1 can be aligned with the wireless communication module 82-1 (e.g., corresponding antenna radiating elements in the module are aligned and overlap each other).

[0091] To properly position the carrier 190 on the docking station 170, the carrier platform 192 may include an alignment structure 196 configured to align with... Figure 10 The corresponding alignment structure 186 on the support structure 172 is aligned. As an example, the support structure 172 may include alignment pins or posts 186, and a corresponding opening 196 is configured to receive the alignment structure 186. In this way, the carrier 190, and therefore the device 10-1 in the carrier 190, can be fixedly mounted above and on top of the support structure 172. Configured in this way, the wireless communication module 82-1 on the wireless device 10-1 can overlap with the wireless communication module 82-2 in a fixed and predictable manner. Therefore, the wireless communication module 82-2 can establish a robust and reliable wireless link with the wireless communication module 82-1 to transmit firmware test data, debug data, recovery data, and / or other suitable data.

[0092] Figure 12 and Figure 13 This diagram illustrates an exemplary alignment configuration between wireless communication modules 82-1 and 82-2. The configuration in which devices 10-1 and 10-2 include the same type of wireless communication modules is described herein as an exemplary example. If desired, devices 10-1 and 10-2 may include different types of wireless communication modules that communicate with each other.

[0093] like Figure 12 As shown in the top-down view, when device 10-1 is aligned with device 10-2 (e.g., when device 10-1 in carrier 190 is mounted to docking station 170), wireless communication modules 82-1 and 82-2 can be aligned in an orthogonal orientation. Specifically, wireless communication module 82 ( Figure 4The communication module 82-1 in device 10-1 can extend along axis 200, while the communication module 82-2 in device 10-2 can extend along axis 202. Axis 200 can be perpendicular to axis 202 (when one axis is projected onto the plane of another axis). Module 82-1 can be configured to overlap with module 82-2, for example, antenna 90-1 on wireless communication module 82-1 overlaps with and faces antenna 90-2 on module 82-2.

[0094] exist Figure 12 In the exemplary configuration, wireless communication modules 82-1 and 82-2 can transmit radio frequency signals to each other with multiple polarizations. As an example, each antenna element 90 (antenna elements 90-1 and 90-2) can be coupled to a first port and a second port, each port being associated with transmitting radio frequency signals with different polarizations. Furthermore, the first port can be configured to receive radio frequency signals, while the second port can be configured to transmit radio frequency signals.

[0095] In this configuration, wireless communication modules 82-1 and 82-2 can be oriented perpendicularly to each other to receive signals transmitted by the other module. As an example, both wireless communication modules 82-1 and 82-2 can be configured to transmit radio frequency signals with a first polarization associated with the elongated dimension (length) of the module and receive radio frequency signals with a second polarization associated with the shorter dimension (width) of the module. Thus, when the length of module 82-1 is aligned with the width of module 82-2, as... Figure 12 As shown, module 82-2 can receive radio frequency signals from module 82-1 because they are aligned to transmit radio frequency signals of the same polarization. Similarly, when the length of module 82-2 is aligned with the width of module 82-1, as... Figure 12 As shown, module 82-1 can receive radio frequency signals from module 82-2 because they are aligned to transmit radio frequency signals of the same polarization.

[0096] like Figure 13 As shown in the side view, overlapping antenna elements 90-1 and 90-2 can transmit radio frequency signals 66 on one or more structures 204. As an example, structure 204 may include one or more air gaps, housing structures, support structures, other intervening dielectric materials, etc. (See attached image for more details.) Figure 6As described, one or more air gaps may be provided along the communication channel between antenna elements 90-1 and 90-2 (e.g., in the housing wall 12R of device 10-1) to allow for the appropriate generation of far-field (plane) waves. If desired, other dielectric materials (besides air) may also be provided along the communication channel between antenna elements 90-1 and 90-2 to modify the radio frequency characteristics of the communication channel (e.g., one or more dielectric materials mounted to antenna element 90-2 at device 10-2). Although antenna elements 90-1 and 90-2 may be separated by distances less than 15 cm, less than 10 cm, less than 5 cm, less than 3 cm, less than 1 cm, greater than 1 cm, greater than 2 cm, greater than 3 cm, etc. (approximately a few centimeters or tens of centimeters) during communication, radio frequency signals with frequencies greater than 10 GHz transmitted by antenna elements 90-1 and 90-2 can exhibit far-field characteristics.

[0097] Figure 12 and Figure 13 The configuration shown is merely illustrative. Antenna elements 90-1 and 90-2 can transmit radio frequency signals in other suitable ways if needed. In some illustrative configurations, antenna elements 90-1 and 90-2 may not need to be aligned with their geometric centers along the z-axis. In other words, when viewed from the z-direction, there may be some offset (partial overlap) between the profiles of antenna element 90-1 and antenna element 90-2 along the xy-plane. These offsets can be used to provide manufacturing and / or placement tolerances, since perfect alignment (complete overlap along the z-axis) is not required.

[0098] Device 10 (e.g., one or more of devices 10-1, 10-2, and other devices in System 8) may collect and / or use personally identifiable information. It is well known that the use of personally identifiable information should comply with privacy policies and practices generally recognized as meeting or exceeding industry or governmental requirements for protecting user privacy. Specifically, personally identifiable information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use, and the nature of authorized use should be clearly explained to the user.

[0099] According to one embodiment, an electronic device having opposing first and second sides is provided, the electronic device comprising: a housing having a housing portion on the first side; a display mounted to the housing on the second side; a system package substrate in the housing; and a wireless communication module mounted to the system package substrate, the wireless communication module comprising: a module substrate mounted to the system package substrate, and an antenna radiating element on the module substrate, the antenna radiating element being configured to transmit radio frequency signals through the housing portion at a frequency greater than 10 GHz.

[0100] According to another embodiment, the wireless communication module includes a radio frequency integrated circuit that is mounted to the module substrate and coupled to the system package substrate through the module substrate.

[0101] According to another embodiment, the electronic device includes an integrated circuit for control circuitry, which is coupled to the radio frequency integrated circuitry and mounted to the system package substrate.

[0102] According to another embodiment, the electronic device includes encapsulation material disposed on the system encapsulation substrate and around the wireless communication module.

[0103] According to another embodiment, the electronic device includes a conductive shielding material disposed on the encapsulation material, the conductive shielding material defining an opening aligned with the antenna radiating element.

[0104] According to another embodiment, the wireless communication module includes an antenna grounding structure on the module substrate coupled to the conductive shielding material.

[0105] According to another embodiment, the antenna radiating element is disposed on a first surface of the module substrate, and the radio frequency integrated circuit is mounted to a second surface of the module substrate opposite to the first surface.

[0106] According to another embodiment, the wireless communication module includes an antenna grounding ring surrounding the antenna radiating element on the first surface, an antenna grounding layer embedded in the module substrate, and a conductive via in the module substrate that couples the antenna grounding ring to the antenna grounding layer.

[0107] According to another embodiment, the housing includes peripheral sidewalls extending along the periphery of the electronic device, and the system packaging substrate extends between the peripheral sidewalls and has peripheral edges extending along the periphery of the electronic device.

[0108] According to one embodiment, a watch device having a first surface and a second surface is provided, the watch device including: a display on the first surface; a housing wall on the second surface; and a wireless communication module including: a substrate having opposing first and second surfaces; an antenna element disposed on the first surface of the substrate and configured to face the housing wall, the antenna element being aligned with a recess in the housing wall and configured to transmit radio frequency signals through a portion of the housing wall and the recess; and a radio component mounted to the substrate and coupled to the antenna element.

[0109] According to another embodiment, the watch device includes a substrate of a system package, and the second surface of the substrate of the wireless communication module is mounted to the substrate of the system package.

[0110] According to another embodiment, the watch device includes: an encapsulation material for the system package, the encapsulation material overlapping the substrate of the system package and the wireless communication module; and a shielding material for the system package, the shielding material overlapping the substrate of the system package and the wireless communication module, the shielding material defining an opening overlapping the antenna element.

[0111] According to another embodiment, the wireless communication module includes a grounding ring surrounding the antenna element on the surface, and the radio component includes a radio frequency integrated circuit mounted to the second surface of the substrate.

[0112] According to another embodiment, multiple sides of the recess are defined by the outer shell wall.

[0113] According to another embodiment, the outer casing wall has a first inner surface and a flange portion that rises above the first inner surface to a second inner surface, and the recess is formed along the second inner surface on the flange portion.

[0114] According to another embodiment, the housing wall has a first peripheral edge and a second peripheral edge that extend along the periphery of the watch device and connect at a corner region of the housing wall, and the wireless communication module overlaps with the corner region of the housing wall.

[0115] According to another embodiment, the outer shell wall is formed of a ceramic material.

[0116] According to one embodiment, a wireless communication module is provided, the wireless communication module comprising: a substrate having a first surface and a second surface and a peripheral edge extending between the first surface and the second surface; an antenna radiating element on the first surface; an antenna grounding structure on the first surface surrounding the antenna radiating element and extending to the peripheral edge of the substrate; a radio frequency integrated circuit mounted to the second surface and coupled to the antenna radiating element; and an input-output structure at the second surface.

[0117] According to another embodiment, the radio frequency integrated circuit is configured to control the antenna radiating element to transmit radio frequency signals associated with firmware data at a frequency greater than 10 GHz.

[0118] According to another embodiment, the antenna radiating element includes a patch antenna element, the radio frequency integrated circuit is coupled at the patch antenna element to a first positive antenna feed terminal and a second positive antenna feed terminal, and the radio frequency integrated circuit is configured to control the antenna radiating element to form a half-duplex communication link with an external wireless communication device.

[0119] The foregoing description is merely illustrative and various modifications can be made to the described implementation scheme. The described implementation scheme can be implemented independently or in any combination.

Claims

1. An electronic device having opposing first and second sides, the electronic device comprising: A housing having a housing portion on the first side; A display mounted to the housing on the second side; The system packaging substrate within the housing; as well as A wireless communication module mounted on the system packaging substrate, the wireless communication module comprising: Module substrate mounted to the system packaging substrate; and The conductive patch on the module substrate is configured to transmit radio frequency signals through the housing portion; Encapsulation material, the encapsulation material being disposed on the system packaging substrate and around the wireless communication module; and A conductive shielding material is disposed on the encapsulation material, the conductive shielding material defining an opening aligned with the conductive patch.

2. The electronic device of claim 1, wherein the wireless communication module includes a radio frequency integrated circuit, the radio frequency integrated circuit being mounted on the module substrate and coupled to the system package substrate through the module substrate.

3. The electronic device according to claim 2, further comprising: An integrated circuit for control circuitry, wherein the integrated circuit for control circuitry is coupled to the radio frequency integrated circuit and mounted on the system package substrate.

4. The electronic device according to claim 1, wherein the wireless communication module includes an antenna grounding structure located on the module substrate and coupled to the conductive shielding material.

5. The electronic device of claim 2, wherein the conductive patch is disposed on a first surface of the module substrate, and the radio frequency integrated circuit is mounted to a second surface of the module substrate opposite to the first surface.

6. The electronic device of claim 5, wherein the wireless communication module includes an antenna grounding ring surrounding the conductive patch on the first surface, an antenna grounding layer embedded in the module substrate, and a conductive via in the module substrate coupling the antenna grounding ring to the antenna grounding layer.

7. The electronic device of claim 1, wherein the housing includes a peripheral sidewall extending along the periphery of the electronic device, and the system package substrate extends between the peripheral sidewalls and has a peripheral edge extending along the periphery of the electronic device.

8. An electronic device, the electronic device comprising: monitor; Housing, to which the display is mounted; as well as The wireless communication module includes: A substrate having opposing first and second surfaces; An antenna element disposed on the first surface of the substrate and configured to transmit radio frequency signals through a portion of the housing; and A radio component, said radio component being mounted to the substrate and coupled to the antenna element; and A system substrate, wherein the second surface of the substrate of the wireless communication module is mounted to the system substrate; and The encapsulation material on the system substrate encapsulates the wireless communication module and overlaps with the antenna element.

9. The electronic device according to claim 8, further comprising: The shielding material on the encapsulation material overlaps with the system substrate, wherein the shielding material defines an opening that overlaps with the antenna element.

10. The electronic device of claim 8, wherein the wireless communication module includes a grounding ring surrounding the antenna element on the first surface, and the radio component includes a radio frequency integrated circuit mounted to the second surface of the substrate of the wireless communication module.

11. The electronic device of claim 8, wherein the antenna element is aligned with a recess in the housing wall of the housing, and wherein the antenna element is configured to transmit the radio frequency signal through the encapsulation material and the recess in the housing wall.

12. The electronic device of claim 11, wherein the housing wall has a first inner surface and a flange portion rising above the first inner surface to a second inner surface, and the recess is located along the second inner surface in the flange portion.

13. The electronic device of claim 8, wherein the housing has a first sidewall and a second sidewall extending along the periphery of the electronic device and connected at a corner region of the housing, and the wireless communication module overlaps with the corner region of the housing.

14. The electronic device of claim 8, wherein the portion of the housing is formed of a ceramic material.

15. A system package, the system package comprising: The wireless communication module includes: A substrate having a first surface and a second surface and a peripheral edge extending between the first surface and the second surface; Antenna radiating element on the first surface; An antenna grounding structure on the first surface, the antenna grounding structure surrounding the antenna radiating element and extending to the peripheral edge of the substrate; Radio frequency integrated circuit, the radio frequency integrated circuit being mounted on the second surface and coupled to the antenna radiating element; and The input-output structure at the second surface; and An encapsulation material that encapsulates the wireless communication module and overlaps with the antenna radiating element.

16. The system package of claim 15, wherein the radio frequency integrated circuit is configured to control the antenna radiating element to transmit radio frequency signals associated with firmware data at a frequency greater than 10 GHz.

17. The system package of claim 15, wherein the antenna radiating element comprises a patch antenna element, the radio frequency integrated circuit is coupled at the patch antenna element to a first positive antenna feed terminal and a second positive antenna feed terminal, and the radio frequency integrated circuit is configured to control the antenna radiating element to form a half-duplex communication link with an external wireless communication device.

18. The system package of claim 15, wherein the antenna grounding structure includes an antenna grounding ring.

19. The system package of claim 18, wherein the wireless communication module further comprises: Antenna grounding layer embedded in the substrate; as well as The conductive via in the substrate couples the ring to the antenna ground layer.

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