An electronic device

Abstract

The application provides an electronic device, relates to the technical field of electronic products, and aims to improve the heat dissipation efficiency of the electronic device and improve the heat experience of the electronic device. The electronic device comprises a first surface component, a heat generating device and a first heat transfer assembly. The first surface component comprises a first surface, and the first surface forms an outer surface of the electronic device. The heat generating device is located on the side of the first surface component opposite to the first surface. The first heat transfer assembly is located between the heat generating device and the first surface component. The heat generating device is in thermal conduction with the first surface component via the first heat transfer assembly. The first heat transfer assembly is provided with a heat insulation structure. The heat insulation structure overlaps the orthographic projection of the heat generating device on the first surface.

Description

[0001] This application claims priority to Chinese Patent Application No. 202111062755.0, filed with the State Intellectual Property Office of China on September 10, 2021, entitled "An Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0003] Currently, electronic devices such as mobile phones, laptops, and tablets are generating more and more heat as their functions increase and power consumption rises. Excessive heat not only affects the user's thermal experience but can also easily lead to overheating and damage to components. Therefore, improving heat dissipation efficiency and enhancing the user's thermal experience is an important research direction for electronic devices. Summary of the Invention

[0004] This application provides an electronic device to address the problem of how to improve the heat dissipation efficiency of electronic devices and enhance their thermal experience.

[0005] To achieve the above objectives, this application provides an electronic device including a first surface component, a heating element, and a first heat transfer component.

[0006] The first surface component includes a first surface that forms an outer surface of the electronic device.

[0007] The heating element is located on the side of the first surface component that faces away from the first surface.

[0008] The first heat transfer component is located between the heating device and the first surface component. The heating device is thermally connected to the first surface component through the first heat transfer component. The first heat transfer component is provided with a heat insulation structure, which has a heat insulation function. The orthographic projection of the heat insulation structure on the first surface overlaps with the orthographic projection of the heating device on the first surface.

[0009] In this way, by setting up a heat insulation structure, the speed at which heat from the heating device is transferred to the first surface component along the shortest branch path perpendicular to the first surface can be reduced. This results in two main effects: First, more heat emitted by the heating device is transferred along other heat transfer paths, increasing the heat transfer rate to other external surfaces of the electronic device. This achieves the goal of adjusting the heat transfer rate of multiple heat transfer paths, reducing the difference in heat transfer rates among them, and ensuring that heat from the heating device is evenly transferred to multiple external surfaces of the electronic device. This improves heat dissipation efficiency, prevents heat concentration, and enhances the user's thermal experience. Second, more heat emitted by the heating device is transferred along other branch paths located around the shortest branch path perpendicular to the first surface, increasing the heat transfer rate to other areas on the first surface surrounding the area directly opposite the heating device. This improves the uniformity of heat transfer to various areas on the first surface, further enhancing heat dissipation efficiency, preventing heat concentration, and improving the user's thermal experience.

[0010] In some possible implementations, the first heat transfer component includes a first thermally conductive element. The first thermally conductive element includes a first stacked structure, formed by alternating layers of first thermally conductive material and first adhesive layers, with a thermal insulation structure disposed within the first adhesive layers. This allows heat to diffuse better within the plane of the first thermally conductive material layer, transforming a point heat source into a surface heat source and improving the uniformity of heat transfer to different areas of the first surface. Simultaneously, the thermal insulation structure is disposed within the first adhesive layers, which can be multiple layers. The thermal insulation structure can be disposed within one of the first adhesive layers, or in multiple layers of the first adhesive layer, to suit different thermal insulation requirements in various scenarios.

[0011] In some possible implementations, the material of the first thermally conductive layer includes at least one of graphite, graphene, copper, and copper alloys. These materials have superior thermal conductivity, facilitating rapid and uniform heat diffusion.

[0012] In some possible implementations, the first adhesive layer is multi-layered, and the number of thermal insulation structures is also multiple, with each thermal insulation structure disposed within one of the multiple layers of the first adhesive layer. This results in a larger number of thermal insulation structures, making it suitable for scenarios with high thermal insulation requirements.

[0013] In some possible implementations, one end of the first stacked structure along the stacking direction of the first thermally conductive material layer and the first adhesive layer is formed by the first adhesive layer. In this way, the first thermally conductive component can be bonded to a structure such as a mid-frame or display module by means of the first adhesive layer, without the need for a separate fixing structure, which can save costs.

[0014] In some possible implementations, the first adhesive layer forming one end of the first stacked structure has a third surface, which forms an outer surface of the first stacked structure. The first stacked structure also includes a fourth surface opposite to the third surface. The first thermally conductive component further includes a first protective layer disposed on the fourth surface of the first stacked structure. The first protective layer serves to protect the first stacked structure, preventing the internal first thermally conductive material layer of the first thermally conductive component from cracking due to external forces during transportation or assembly.

[0015] In some possible implementations, the first surface component is a front cover.

[0016] In some possible implementations, the first heat transfer assembly also includes a middle frame. The middle frame is located between the first heat-conducting element and the heat-generating device, and is stacked with the first surface component, with a heat insulation structure disposed within the middle frame. The middle frame has a relatively large thickness and superior structural strength, providing better conditions for the placement of the heat insulation structure, and preventing deformation or breakage of the middle frame during the fabrication of the heat insulation structure.

[0017] In some possible implementations, the electronic device further includes a display module located between the first heat-conducting element and the first surface component. The display module includes a display panel and a support structure, and the first heat transfer component further includes the support structure, with a heat insulation structure disposed within the support structure. In this way, the heat insulation structure will not affect the display of the display panel.

[0018] In some possible implementations, the support structure includes a support layer, a first buffer layer, a flattening layer, and a protective layer, with the thermal insulation structure disposed within at least one of the support layer, the first buffer layer, the flattening layer, and the protective layer.

[0019] In some possible implementations, the first surface component is a back cover.

[0020] In some possible implementations, the electronic device further includes a circuit board and a circuit board support. Both the circuit board and the circuit board support are located between the heat-generating device and the first heat-conducting component, with the heat-generating device mounted on the circuit board and the circuit board support located on the side of the circuit board furthest from the heat-generating device. The first heat transfer assembly also includes the circuit board support, and a heat insulation structure is disposed within the circuit board support. In this way, the heat insulation structure will not interfere with the circuitry within the electronic device, and the circuit board support has high structural strength, preventing deformation or breakage of the circuit board support during the installation of the heat insulation structure.

[0021] In some possible implementations, the first heat transfer component further includes a second buffer layer. The second buffer layer is disposed between the first heat-conducting element and the first surface component, and the heat insulation structure is disposed within the second buffer layer. The second buffer layer is typically made of a soft, elastic material such as foam, which has low hardness, facilitating the installation of the heat insulation structure.

[0022] In some possible implementations, the thermal insulation structure includes at least one of thermal insulation pores, thermal insulation aerogel, asbestos, rock wool, ceramic fiber paper, glass fiber wool, silicate, and vacuum plate.

[0023] In some possible implementations, in the first heat transfer assembly, the component containing the heat insulation structure has a first portion. The orthographic projection of the first portion onto the first surface is a first projection, and the orthographic projection of the heating element onto the first surface is a second projection. The second projection is located within the first projection, and the distance from the edge of the second projection to the edge of the first projection is less than or equal to half the maximum width of the second projection. The heat insulation structure is disposed within the first portion. This concentrates the heat insulation structure within the area of ​​the component directly opposite the heating element, resulting in superior heat insulation performance.

[0024] In some possible implementations, the component containing the heat insulation structure also has a second part, which is the portion of the component other than the first part, and the second part does not have the heat insulation structure. In this way, the second part has better thermal conductivity, and a greater amount of heat from the heating element is conducted to other areas around the area of ​​the first surface directly opposite the heating element, resulting in better heat dissipation performance.

[0025] In some possible implementations, the electronic device further includes a second surface component, which comprises a second surface forming another outer surface of the electronic device. A heat-generating device is also located on the side of the second surface component opposite to the second surface, and the heat-generating device is thermally connected to the second surface component. In this way, by incorporating a heat-insulating structure within the first thermally conductive assembly, the heat transfer rate from the heat-generating device to the second surface can be increased, the heat on the second surface can be increased, and the heat distribution between the first and second surfaces can be made more uniform, thereby improving heat dissipation efficiency.

[0026] In some possible implementations, the electronic device further includes a second heat transfer component located between the heating element and the second surface component, with the heating element and the second surface component being thermally connected via the second heat transfer component. This allows heat conduction without direct contact between the heating element and the second surface component, improving the flexibility of the relative positioning between them.

[0027] In some possible implementations, the second heat transfer component includes a second thermally conductive element. The second thermally conductive element includes a second stacked structure formed by alternating layers of a second thermally conductive material and a second adhesive layer. This allows heat to diffuse better within the plane of the second thermally conductive material layer, transforming a point heat source into a surface heat source and improving the uniformity of heat transfer to different areas of the second surface.

[0028] In some possible implementations, the material of the second thermally conductive layer includes at least one of graphite and graphene. Graphite and graphene have high thermal conductivity and high thermal conductivity efficiency, which can increase the speed at which heat from the heat-generating device is transferred to the second surface component, further reduce the temperature difference between the first and second surfaces, and improve heat dissipation efficiency.

[0029] In some possible implementations, the first surface includes a first region, and the orthographic projection of the heating device onto the first surface is a second projection, with the first region overlapping the second projection. The second surface includes a second region, and the orthographic projection of the heating device onto the second surface is a third projection, with the second region overlapping the third projection. The heat transfer rate from the heating device to the first region is equal to or approximately equal to the heat transfer rate from the heating device to the second region. In this way, the temperature difference between the first and second surfaces is approximately zero, resulting in better temperature uniformity and heat dissipation performance.

[0030] In some possible implementations, the heat-generating device includes at least one of a SOC, CPU, CHG management chip, power management chip, RAM, and ROM. Attached Figure Description

[0031] Figure 1 Front perspective view of an electronic device provided in some embodiments of this application;

[0032] Figure 2 for Figure 1 A three-dimensional view of the rear side of the electronic device shown;

[0033] Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure of the electronic device shown at line AA;

[0034] Figure 4 for Figure 3 A magnified view of a portion of region I in the middle;

[0035] Figure 5 for Figure 4 A schematic diagram of a display module in the electronic device shown;

[0036] Figure 6 for Figure 4 A schematic diagram of a third heat-conducting medium in the electronic device shown;

[0037] Figure 7 A schematic diagram showing the relative positions of the third heat-conducting medium, the middle frame, and the display module in an electronic device provided in some embodiments of this application;

[0038] Figure 8 A cross-sectional structural schematic diagram of an electronic device provided in some embodiments of this application;

[0039] Figure 9 for Figure 4 or Figure 8 A schematic diagram of the structure of the second heat-conducting component in the electronic device shown;

[0040] Figure 10a A cross-sectional structural schematic diagram of an electronic device provided in some embodiments of this application;

[0041] Figure 10b A cross-sectional structural schematic diagram of an electronic device provided in some embodiments of this application;

[0042] Figure 11 for Figure 10a The front view of the inner frame of the electronic device shown;

[0043] Figure 12 for Figure 10a Front view of the first surface component within the electronic device shown;

[0044] Figure 13 A cross-sectional structural schematic diagram of an electronic device provided in some embodiments of this application;

[0045] Figure 14 A cross-sectional structural schematic diagram of an electronic device provided in some embodiments of this application;

[0046] Figure 15 for Figure 14 A schematic diagram of the cross-sectional structure of the electronic device shown at the BB line;

[0047] Figure 16 for Figure 14 A schematic diagram of another cross-sectional structure of the electronic device shown at the BB line;

[0048] Figure 17 A cross-sectional structural schematic diagram of an electronic device provided in some embodiments of this application;

[0049] Figure 18 A cross-sectional structural schematic diagram of an electronic device provided in some embodiments of this application;

[0050] Figure 19 A cross-sectional structural schematic diagram of an electronic device provided in some embodiments of this application;

[0051] Figure 20 for Figure 4 Another structural diagram of the display module in the electronic device shown;

[0052] Figure 21 for Figure 4 Another structural diagram of the display module in the electronic device shown;

[0053] Figure 22 for Figure 4Another structural diagram of the display module in the electronic device shown;

[0054] Figure 23 for Figure 4 Another structural diagram of the display module in the electronic device shown;

[0055] Figure 24 for Figure 4 A schematic diagram of another structure of the third heat-conducting medium in the electronic device shown;

[0056] Figure 25 for Figure 24 An exploded view of the first stacked structure within the third thermally conductive medium shown;

[0057] Figure 26 for Figure 4 Another exploded view of the first stacked structure within the third thermally conductive medium in the electronic device shown;

[0058] Figure 27 A front view of an electronic device provided for some embodiments of this application;

[0059] Figure 28 A front view of an electronic device provided for some embodiments of this application;

[0060] Figure 29 for Figure 4 The diagram shows the heat distribution of the first and second surfaces of the electronic device without a heat insulation structure.

[0061] Figure 30 for Figure 4 The diagram shows the heat distribution of the first and second surfaces of the electronic device when a heat insulation structure is provided and the heat transfer coefficient in the direction perpendicular to the first surface in the heat transfer path is 0.1.

[0062] Figure 31 for Figure 4 The diagram shows the heat distribution of the first and second surfaces of the electronic device when a heat insulation structure is provided and the heat transfer coefficient in the direction perpendicular to the first surface in the heat transfer path is 0.06.

[0063] Figure 32 for Figure 4 The diagram shows the heat distribution of the first and second surfaces of the electronic device when a heat insulation structure is provided and the heat transfer coefficient in the direction perpendicular to the first surface in the heat transfer path is 0.02.

[0064] Figure 33 The graphs showing the highest temperature of the first surface, the highest temperature of the second surface, and the temperature difference between the two in an electronic device provided in some embodiments of this application as a function of the heat transfer coefficient;

[0065] Figure 34 A cross-sectional structural schematic diagram of an electronic device provided in some embodiments of this application;

[0066] Figure 35 for Figure 34 A magnified view of a portion of region II in the electronic device shown;

[0067] Figure 36 This is a cross-sectional structural schematic diagram of an electronic device provided in some embodiments of this application. Detailed Implementation

[0068] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0069] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0070] In the description of this application, "and / or" is merely a way of describing the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0071] The heat generated by electronic devices originates from their internal electronic components. To reduce the temperature of these devices, forced convection (such as air cooling, water cooling, or oil cooling) can be used to expel the heat from the internal electronic components to the outside of the device. However, in portable electronic devices such as mobile phones and tablets, due to limited internal space, dedicated cooling equipment cannot be installed. Therefore, these electronic devices currently rely on heat conduction between their internal components to transfer the heat generated by the internal electronic components to the outer surface of the device. The heat from the outer surface then exchanges heat with the surrounding air to achieve the purpose of heat dissipation and cooling.

[0072] Using the above cooling method, the larger the area of ​​the outer surface to which heat is conducted, the larger the heat exchange area with the air, and the better the heat dissipation effect. Therefore, for internal electronic components, especially for high-heat-generating components such as system-on-chip (SOC), charging management chips, power management chips, random access memory (RAM), and read-only memory image (ROM), multiple heat transfer paths are often required to transfer heat to multiple outer surfaces of the electronic device. For example, the internal electronic components of a mobile phone often have two heat transfer paths: one to the screen side and one to the back cover side, to transfer heat to the front surface (i.e., the top surface) and the back surface (i.e., the bottom surface) of the phone, thereby increasing the heat exchange area with the outside air and improving heat dissipation efficiency.

[0073] When heat within an electronic device is transferred to multiple external surfaces via multiple heat transfer paths, the smaller the temperature difference between these surfaces, the more uniform the heat transfer and the better the heat dissipation. However, because the lengths of the heat transfer paths within electronic components often vary, and the thermal conductivity and thermal resistance of components along these paths typically differ, heat can be concentrated along a single heat transfer path to a specific external surface, or along several heat transfer paths to several external surfaces. For example, in a mobile phone, internal heat may be concentrated on the screen side to the top surface, or on the back cover side to the bottom surface. This results in uneven temperatures across the various external surfaces, lower heat dissipation efficiency, and the possibility of one or more surfaces becoming excessively hot to the touch, leading to a poor user experience.

[0074] To address the aforementioned issues, this application can reduce the thermal conductivity of a portion of a heat transfer path with higher efficiency, and / or increase the thermal conductivity of a portion of a heat transfer path with lower efficiency. Specifically, a thermal insulation structure can be provided on the heat transfer path with higher efficiency to reduce the heat transfer rate on that path, and / or a high thermal conductivity structure can be provided on the heat transfer path with lower efficiency to increase the heat transfer rate on that path. This allows more heat to be conducted along the less efficient heat transfer path to the outer surface of the electronic device, thereby uniformly or nearly uniformly transferring heat to multiple outer surfaces of the electronic device and improving its heat dissipation efficiency.

[0075] This eliminates the need to change the dimensions of the electronic device and its internal components, thus enabling the design of thinner and smaller electronic devices while ensuring the structural strength of the internal components.

[0076] Based on the above improvements, the embodiments of this application will be described in detail below with reference to the accompanying drawings. Before describing the embodiments of this application, the application scenarios of this application will be introduced first.

[0077] This application provides an electronic device, which can be a portable electronic device or other suitable electronic device. For example, the electronic device can be a mobile phone, smart screen (television), tablet personal computer, laptop computer, laptop computer, speaker, monitor, medical device, personal digital assistant (PDA), camera, personal computer, in-vehicle equipment, wearable device, etc. Wearable devices include, but are not limited to, wristbands, watches, augmented reality (AR) glasses, AR headsets, virtual reality (VR) glasses, or VR headsets.

[0078] Please see Figures 1-3 , Figure 1 This is a front perspective view of an electronic device 100 provided in some embodiments of this application. Figure 2 for Figure 1 The rear perspective view of the electronic device 100 shown. Figure 3 for Figure 1 The diagram shows a cross-sectional view of the electronic device 100 at line AA. It should be noted that "at line AA" refers to the plane containing line AA and the arrows at both ends of line AA. The same understanding should be applied to similar diagrams in the following text, and will not be repeated hereafter. In this embodiment, the electronic device 100 is a mobile phone. The electronic device 100 includes a first surface component 10 and a second surface component 20.

[0079] The first surface component 10 forms one outer surface of the electronic device 100, and the second surface component 20 forms another outer surface of the electronic device 100.

[0080] Specifically, the first surface component 10 has a first surface A, which forms an outer surface of the electronic device 100. The second surface component 20 has a second surface B, which forms another outer surface of the electronic device 100.

[0081] In some embodiments, please refer to Figures 1-3 The first surface A and the second surface B are two opposite outer surfaces of the electronic device 100. In some other embodiments, the first surface A and the second surface B may have other relative positional relationships, such as adjacent, intersecting, or perpendicular, etc., which are not specifically limited in this application embodiment.

[0082] In some embodiments, please refer to Figures 1-3 In this embodiment, the first surface component 10 is a front cover, and the second surface component 20 is a back cover. Thus, the first surface A is the top surface, and the second surface is the bottom surface. In other embodiments, the first surface component 10 may also be a back cover, and the second surface component 20 may be a front cover. When the electronic device 100 has a structure other than a mobile phone, the first surface component 10 and the second surface component 20 may also be other components, and this application does not specifically limit this. For ease of description, the following embodiments are all described based on the premise that the first surface component 10 is a front cover and the second surface component 20 is a back cover.

[0083] Please see Figure 3 The electronic device 100 also includes a heat-generating device 30. The heat-generating device 30 refers to a type of electronic device within the electronic device 100 that generates significant heat. Specifically, the heat-generating device 30 includes, but is not limited to, a system-on-chip (SOC), a central processing unit (CPU), a charge (CHG) management chip, a power management chip, RAM, and ROM.

[0084] In some embodiments, please refer to Figure 4 , Figure 4 for Figure 3 A partial enlarged view of region I. The electronic device 100 also includes a circuit board 60. A heat-generating device 30 is disposed on the circuit board 60. The heat-generating device 30 can be fixed inside the electronic device 100 by means of the circuit board 60, and the heat-generating device 30 can also be electrically connected to other electronic devices by means of the circuit board 60, thereby facilitating circuit layout and ensuring structural stability.

[0085] The circuit board 60 can be a printed circuit board (PCB), a flexible printed circuit board (FPC), or a rigid-flex PCB. The circuit board 60 can be a main board, a sub-board, or other types of circuit boards; this application does not specifically limit its application in this regard.

[0086] In some embodiments, please refer to Figure 4The circuit board 60 is located on the side of the heating device 30 away from the first surface member 10, and the circuit board 60 is located between the heating device 30 and the second surface member 20. In some other embodiments, the circuit board 60 may also be located between the heating device 30 and the first surface member 10, and the circuit board 60 may be located on the side of the heating device 30 away from the second surface member 20. For ease of description, the embodiments described below are all based on the premise that the circuit board 60 is located on the side of the heating device 30 away from the first surface member 10.

[0087] Within the electronic device 100, the heat-generating device 30 has at least two heat transfer paths, namely heat transfer path I1 and heat transfer path I2.

[0088] Heat transfer path 11: The heat generated by the heating device 30 when it is working is transferred to the first surface component 10, and heat is exchanged with the outside air on the first surface A of the first surface component 10.

[0089] Please continue reading. Figure 4 The electronic device 100 also includes a first heat transfer component 40. The first heat transfer component 40 is located in the heat transfer path I1. Specifically, the first heat transfer component 40 is located between the heating device 30 and the first surface component 10. The heating device 30 is thermally connected to the first surface component 10 via the first heat transfer component 40, so that the heat generated when the heating device 30 is working is transferred to the first surface component 10 via the first heat transfer component 40.

[0090] In some embodiments, please refer to Figure 4 The first heat transfer component 40 includes a middle frame 41. The middle frame 41 is stacked with the first surface component 10. It should be noted that the stacking arrangement described in this embodiment and the embodiments below can be interpreted as a contact stacking arrangement, that is, the two stacked components are in contact, or as a non-contact stacking arrangement, that is, the two stacked components are not in contact. Optionally, the stacking arrangement of the middle frame 41 and the first surface component 10 refers to a non-contact stacking arrangement. The middle frame 41 serves as the "support skeleton" of the electronic device 100, which can support and fix components such as the circuit board 60, the first surface component 10, and the second surface component 20. In order to ensure the support strength of the middle frame 41, the middle frame 41 can be made of hard metal materials such as stainless steel, aluminum alloy, and titanium alloy. Hard metal materials have high structural strength, which can ensure structural strength. At the same time, metal materials usually have a high thermal conductivity and excellent heat dissipation capacity, which can quickly conduct the heat of the heat-generating device 30 to the first surface component 10.

[0091] Please refer to the following for details. Figure 3 and Figure 4The middle frame 41 includes a middle plate 411 and a frame 412. The middle plate 411 is located between the first surface component 10 and the second surface component 20, and is stacked with the first surface component 10 and the second surface component 20. The frame 412 is disposed around the middle plate 411. In some embodiments, the frame 412 is disposed around the circumference of the middle plate 411. The frame 412 can be integrally formed with the middle plate 411, or it can be glued to the edge of the middle plate 411. The first surface component 10 and the second surface component 20 are both fixed to the frame 412. Specifically, the first surface component 10 and the second surface component 20 can be glued to the frame 412.

[0092] Based on the above embodiment, the middle frame 41 transfers the heat from the heating device 30 to the first surface component 10 via the middle plate 411. Specifically, the heat from the heating device 30 is transferred to the middle plate 411, and the heat transferred to the middle plate 411 is further transferred to the first surface component 10.

[0093] In some embodiments, please continue reading Figure 4 The first heat transfer component 40 also includes a first shielding cover 42. The first shielding cover 42 is disposed on the circuit board 60 and covers the heating element 30. The first shielding cover 42 is used to prevent the electronic components (including the heating element 30) on the circuit board 60 from interference by external electromagnetic waves. The material of the first shielding cover 42 is typically chosen to be conductive metal materials such as copper or copper alloys. These conductive metal materials have excellent electrical conductivity and shielding performance. Simultaneously, these conductive metal materials have a high thermal conductivity and excellent thermal conductivity, ensuring the heat transfer efficiency of the heat transfer path 1.

[0094] In some embodiments, please continue reading Figure 4 The first heat transfer component 40 further includes a first thermally conductive medium 43 and a second thermally conductive medium 44. The first thermally conductive medium 43 is disposed between the heating device 30 and the first shield 42, and is used to transfer the heat from the heating device 30 to the first shield 42. The second thermally conductive medium 44 is disposed between the first shield 42 and the middle frame 41, and is used to further transfer the heat from the first shield 42 to the middle frame 41.

[0095] The first thermally conductive medium 43 and the second thermally conductive medium 44 include, but are not limited to, thermally conductive gel, thermally conductive silicone grease, liquid metal, graphite, graphene, copper, copper alloy, etc. This application does not specifically limit them.

[0096] In some embodiments, please continue reading Figure 4 The first heat transfer component 40 also includes a display module 45. The display module 45 is disposed between the first surface component 10 and the middle frame 41. Heat from the middle frame 41 is transferred to the first surface component 10 via the display module 45.

[0097] Display module 45 is used to display videos and images. The videos and images displayed by display module 45 can be viewed by the user from the side facing the first surface A. To achieve this, on the one hand, the light-emitting surface of display module 45 faces the first surface component 10. On the other hand, the first surface component 10 is a light-transmitting structure. Specifically, the first surface component 10 can be a light-transmitting glass component or a light-transmitting plastic component. In this way, the first surface component 10 can avoid blocking the light of the images displayed by display module 45.

[0098] Please see Figure 5 , Figure 5 for Figure 4 This is a schematic diagram of a display module 45 in the electronic device 100 shown. The display module 45 includes a shielding layer 451, a support layer 452, a first buffer layer 453, a planarization layer 454, a protective layer 455, a display panel 456, a polarizer 457, and a transparent adhesive layer 458, which are sequentially stacked from one end near the middle frame 41 to the end near the first surface component 10. The term "stacked" indicates a contact-type stacked arrangement. Furthermore, the support layer 452, the first buffer layer 453, the planarization layer 454, and the protective layer 455 form a support structure for the display panel 456. The structure and function of each component of the display module 45 will be described below.

[0099] Display panel 456 is the core device within display module 45 used for displaying video and images. Display panel 456 can be a flexible or rigid display panel. For example, display panel 456 can be an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, a mini organic light-emitting diode (MLED) display panel, a microorganic light-emitting diode (MicroOLED) display panel, a quantum dot light-emitting diode (QLED) display panel, or a liquid crystal display (LCD). Figure 5In the illustrated embodiment, the display panel 456 is a self-emissive display panel. A self-emissive display panel does not require a backlight module to provide backlighting, which is beneficial for reducing the thickness of the electronic device 100. Specifically, the display panel 456 is an OLED display panel. OLED display panels are commonly used self-emissive display panels, are easy to implement, and have a smaller thickness, further contributing to the reduction of the thickness of the electronic device 100.

[0100] The protective layer 455, also known as the BP (back plate file) layer, is used to support and protect the display panel 456. Before the display module 45 is assembled, the protective layer 455 is fixed to the display panel 456, thereby improving the structural strength of the display panel 456 and preventing the display panel 456 from bending and being damaged during the assembly of the display module 45.

[0101] A polarizer 457 is disposed on the light-emitting surface of the display panel 456 to remove external reflected light and ensure the display effect of the display module 45.

[0102] The transparent adhesive layer 458 is used to adhere the polarizer 457 and the first surface component 10. Simultaneously, the transparent adhesive layer 458 allows image light emitted from the display panel 456 to pass through, preventing obstruction. In some embodiments, the transparent adhesive layer 458 is an optically clear adhesive (OCA).

[0103] A planarization layer 454 is disposed on the protective layer 455 to increase the surface flatness of the protective layer 455. Optionally, the material of the planarization layer 454 is a mesh adhesive.

[0104] The first buffer layer 453 is used to cushion and protect the display panel 456, absorbing point impacts and preventing mold marks and spark marks. Optionally, the material of the first buffer layer 453 includes, but is not limited to, foam.

[0105] The support layer 452 further serves to buffer and protect the display panel 456, preventing mold marks and bright spots. Optionally, the support layer 452 can be a polyimide film (PI).

[0106] The shielding layer 451 serves as electromagnetic shielding and anti-static, preventing electronic components on the side of the middle frame 41 away from the first surface component 10 from generating electromagnetic and electrostatic interference to the display panel 456. The material of the shielding layer 451 can be copper or a copper alloy. In addition, the shielding layer 451 also serves as a heat dissipation and protective layer.

[0107] The structure of this display module 45 is a common structure for display modules, with superior anti-interference performance and structural strength, while also being relatively thin, which is beneficial for achieving a thinner electronic device. Based on this, the heat transfer path from the middle frame 41 to the first surface component 10 is as follows: middle frame 41 → shielding layer 451 → support layer 452 → first buffer layer 453 → planarization layer 454 → protective layer 455 → display panel 456 → polarizer 457 → transparent adhesive layer 458 → first surface component 10. The heat transfer between adjacent structures is mainly through contact heat conduction, although a small amount of heat can also be transferred through thermal radiation.

[0108] It should be noted that the structure of the display module 45 can also have other forms, such as excluding at least one of the shielding layer 451, support layer 452, first buffer layer 453, planarization layer 454, protective layer 455, polarizer 457 and transparent adhesive layer 458, and / or adding other structural layers, which are not specifically limited here.

[0109] In some embodiments, please refer back to the reference. Figure 4 The first heat transfer component 40 also includes a first heat conduction element 46. The first heat conduction element 46 is disposed between the middle frame 41 and the display module 45, and is used to transfer heat from the middle frame 41 to the display module 45.

[0110] The material of the first heat-conducting component 46 includes, but is not limited to, thermal conductive gel, thermal conductive grease, liquid metal, graphite, graphene, copper, copper alloy, etc., and this application does not specifically limit it.

[0111] Please see Figure 6 , Figure 6 for Figure 4 This is a schematic diagram of a structure of the first heat-conducting element 46 in the electronic device 100 shown. The first heat-conducting element 46 includes a first stacked structure 461, which is formed by alternating layers of first thermally conductive material 461a and first adhesive layer 461b.

[0112] The material of the first thermally conductive material layer 461a includes, but is not limited to, at least one of graphite, graphene, copper, and copper alloys. The material of the first adhesive layer 461b includes, but is not limited to, at least one of double-sided adhesive and glue.

[0113] The first adhesive layer 461b has thermal conductivity, but its thermal conductivity is lower than that of the first thermally conductive material layer 461a. This allows heat to diffuse better within the plane containing the first thermally conductive material layer 461a, transforming a point heat source into a surface heat source and improving the uniformity of heat transfer to different areas of the first surface A.

[0114] As the number of layers of the first thermally conductive material layer 461a and the first adhesive layer 461b increases, the uniformity becomes better. At the same time, when the first thermally conductive material layer 461a is made of graphite or graphene with a high thermal conductivity, the ability of heat to diffuse within the plane where the first thermally conductive material layer 461a is located is better, which can further increase the heat uniformity of the first thermally conductive component 46.

[0115] Please continue reading. Figure 6 One end of the first stacked structure 461 along the stacking direction of the first thermally conductive material layer 461a and the first adhesive layer 461b is formed by the first adhesive layer 461b. In this way, the first stacked structure 461 can be bonded to the middle frame 41 by means of the first adhesive layer 461b forming this end of the first stacked structure 461.

[0116] In some other embodiments, please refer to Figure 7 , Figure 7 This is a schematic diagram showing the relative positions of the first heat-conducting element 46, the middle frame 41, and the display module 45 in an electronic device 100 provided in some embodiments of this application. The first stacking structure 461 is bonded to the display module 45 by means of a first adhesive layer 461b forming one end of the first stacking structure 461.

[0117] In some embodiments, please refer to Figure 6 or Figure 7 The first adhesive layer 461b forming one end of the first stacked structure 461 has a third surface C, which forms an outer surface of the first stacked structure 461. In addition, the first stacked structure 461 also has a fourth surface D opposite to the third surface C. The first thermally conductive element 46 further includes a first protective layer 462. The material of the first protective layer 462 includes, but is not limited to, polyethylene terephthalate (PET) and polypropylene (PP). The first protective layer 462 is disposed on the fourth surface D of the first stacked structure 461. The first protective layer 462 serves to protect the first stacked structure 461, preventing the internal first thermally conductive material layer 461a of the first thermally conductive element 46 from cracking due to external forces during transportation or assembly.

[0118] In some embodiments, please refer to Figure 6 or Figure 7 The area of ​​the first protective layer 462 and the area of ​​the first adhesive layer 461b on the third surface C are both larger than the area of ​​the first thermally conductive material layer 461a, thus forming an edge-sealing protective layer and an edge-sealing adhesive layer, respectively. This provides further protection for the first thermally conductive material layer 461a and reduces the risk of breakage.

[0119] According to the descriptions of the above embodiments, the first heat transfer component 40 may include a middle frame 41, a first shield 42, a first thermally conductive medium 43, a second thermally conductive medium 44, a display module 45, and a first thermally conductive element 46. The heat transfer path from the heating device 30 to the first surface component 10 via the first heat transfer component 40 is specifically as follows: heating device 30 → first thermally conductive medium 43 → first shield 42 → second thermally conductive medium 44 → middle frame 41 → first thermally conductive element 46 → display module 45 → first surface component 10. The heat transfer between adjacent components is mainly through contact heat conduction, although a small amount of heat may also be transferred through thermal radiation. In some embodiments, the first heat transfer component 40 may not include one or more of the middle frame 41, first shield 42, first thermally conductive medium 43, second thermally conductive medium 44, display module 45, and first thermally conductive element 46, and / or the first heat transfer component 40 may also include other layers; this application does not specifically limit this.

[0120] Heat transfer path two I2: Please refer to the following section. Figure 4 The heat generated by the heating device 30 during operation is transferred to the second surface component 20, and heat is exchanged with the outside air on the second surface B of the second surface component 20.

[0121] In some embodiments, please continue reading Figure 4 The electronic device 100 also includes a second heat transfer component 50. The second heat transfer component 50 is located in the heat transfer path I2. Specifically, the second heat transfer component 50 is located between the heating device 30 and the second surface component 20. The heating device 30 is thermally connected to the second surface component 20 via the second heat transfer component 50, so that the heat generated when the heating device 30 is working is transferred to the second surface component 20 via the second heat transfer component 50.

[0122] In some other embodiments, the electronic device 100 may omit the second heat transfer component 50, allowing the heating element 30 to directly contact the second surface component 20 for heat conduction. The following embodiments are based on the premise that the electronic device 100 includes the second heat transfer component 50, and the heating element 30 transfers heat to the second surface component 20 via the second heat transfer component 50. This should not be considered a specific limitation of this application.

[0123] In some embodiments, please continue reading Figure 4 The second heat transfer component 50 includes a circuit board 60. Heat from the heating device 30 is transferred to the second surface component 20 via the circuit board 60. Specifically, heat from the heating device 30 can be transferred to the circuit board 60, and the heat transferred to the circuit board 60 can be further transferred to the second surface component 20.

[0124] In some embodiments, please continue reading Figure 4The second heat transfer component 50 also includes a second shielding cover 51. The second shielding cover 51 is disposed on the circuit board 60 and covers the surface of the circuit board 60 opposite to the heat-generating device 30. The second shielding cover 51 is used to prevent electronic devices on the surface of the circuit board 60 opposite to the heat-generating device 30 from interference by external electromagnetic waves. The material of the second shielding cover 51 is typically chosen to be conductive metal materials such as copper or copper alloys. These conductive metal materials have excellent electrical conductivity and shielding performance, and at the same time, they have a high thermal conductivity and excellent heat transfer capacity, which can ensure the heat transfer efficiency of the second heat transfer path L2.

[0125] In some embodiments, please continue reading Figure 4 The second heat transfer assembly 50 also includes a circuit board support 52. The circuit board support 52 is located between the circuit board 60 and the second surface component 20, and is situated on the side of the second shield 51 furthest from the circuit board 60. The circuit board support 52 protects the circuit board 60, enabling it to operate normally even under conditions of impact, deformation, and high temperature. Heat transferred to the second shield 51 can be transferred to the second surface component 20 via the circuit board support 52.

[0126] In some embodiments, please refer to Figure 8 , Figure 8 This is a cross-sectional structural schematic diagram of an electronic device 100 provided in some embodiments of this application. The electronic device 100 shown in this embodiment is... Figure 4 The difference in the electronic device 100 shown is that, in this embodiment, the second heat transfer component 50 further includes a third heat-conducting medium 55 and a fourth heat-conducting medium 56. The third heat-conducting medium 55 is disposed between the area where the heat-generating device 30 is located on the circuit board 60 and the second shield 51, and is used to transfer heat from the area where the heat-generating device 30 is located on the circuit board 60 to the second shield 51. The fourth heat-conducting medium 56 is disposed between the second shield 51 and the circuit board support 52, and further transfers heat from the second shield 51 to the circuit board support 52.

[0127] The third thermal conductive medium 55 and the fourth thermal conductive medium 56 include, but are not limited to, thermal conductive gel, thermal conductive grease, liquid metal, graphite, graphene, copper, copper alloy, etc., and this application does not specifically limit them.

[0128] In some embodiments, please refer to Figure 4 or Figure 8 The second heat transfer assembly 50 further includes a second heat-conducting element 53. The second heat-conducting element 53 is disposed between the circuit board support 52 and the second surface component 20. The second heat-conducting element 53 is used to transfer heat from the circuit board support 52 to the second surface component 20.

[0129] In some embodiments, the structure of the second heat-conducting element 53 is similar to that of the first heat-conducting element 46. For details, please refer to [link / reference needed]. Figure 9 , Figure 9 for Figure 4 or Figure 8 The diagram shows the structure of the second heat-conducting element 53 in the electronic device 100. The second heat-conducting element 53 includes a second stacked structure 531, which is formed by alternating layers of second heat-conducting material 531a and second adhesive layer 531b.

[0130] The material of the second thermally conductive material layer 531a includes, but is not limited to, at least one of graphite, graphene, copper, and copper alloys. The material of the second adhesive layer 531b includes, but is not limited to, at least one of double-sided adhesive and glue.

[0131] The second adhesive layer 531b has thermal conductivity, but its thermal conductivity is lower than that of the second thermally conductive material layer 531a. This allows heat from the second thermally conductive material layer 531a to diffuse better within the plane it lies in, transforming a point heat source into a surface heat source and improving the uniformity of heat transfer to different areas of the second surface B.

[0132] As the number of layers of the second thermally conductive material layer 531a and the second adhesive layer 531b increases, the uniformity becomes better. At the same time, when the second thermally conductive material layer 531a is made of graphite or graphene with a high thermal conductivity, the ability of heat to diffuse within the plane where the second thermally conductive material layer 531a is located is better, which can further increase the heat uniformity of the second thermally conductive component 53.

[0133] Please continue reading. Figure 9 One end of the second stacked structure 531 along the stacking direction of the second thermally conductive material layer 531a and the second adhesive layer 531b is formed by the second adhesive layer 531b. In this way, the second stacked structure 531 can be bonded to the circuit board support 52 or the second surface member 20 by means of the second adhesive layer 531b forming this end of the second stacked structure 531.

[0134] In some embodiments, please continue reading Figure 9The second adhesive layer 531b forming one end of the second stacked structure 531 has a fifth surface E, which forms an outer surface of the second stacked structure 531. In addition, the second stacked structure 531 also has a sixth surface F opposite to the fifth surface E. The second heat-conducting element 53 further includes a second protective layer 532. The material of the second protective layer 532 includes, but is not limited to, polyethylene terephthalate (PET) and polypropylene (PP). The second protective layer 532 is disposed on the sixth surface F of the second stacked structure 531. The second protective layer 532 serves to protect the second stacked structure 531, preventing the internal second heat-conducting material layer 531a of the second heat-conducting element 53 from cracking due to external forces during transportation or assembly.

[0135] In some embodiments, please continue reading Figure 9 The area of ​​the second protective layer 532 and the area of ​​the second adhesive layer 531b on the fifth surface E are both larger than the area of ​​the second thermally conductive material layer 531a, thus forming an edge-sealing protective layer and an edge-sealing adhesive layer, respectively. This provides further protection for the second thermally conductive material layer 531a and reduces the risk of breakage.

[0136] In some embodiments, please continue reading Figure 4 or Figure 8 The second heat transfer assembly 50 further includes a second buffer layer 54. The second buffer layer 54 is disposed between the second heat-conducting element 53 and the second surface component 20, and serves to cushion and protect the circuit board 60 and electronic devices connected to the circuit board, absorbing impacts. Optionally, the material of the second buffer layer 54 may include, but is not limited to, foam.

[0137] According to the descriptions of the above embodiments, the second heat transfer component 50 may include a circuit board 60, a second shield 51, a circuit board support 52, a third thermally conductive medium 55, a fourth thermally conductive medium 56, a second thermally conductive element 53, and a second buffer layer 54. The heat transfer path from the heating device 30 to the second surface component 20 via the second heat transfer component 50 is specifically as follows: heating device 30 → circuit board 60 → third thermally conductive medium 55 → second shield 51 → fourth thermally conductive medium 56 → circuit board support 52 → second thermally conductive element 53 → second buffer layer 54 → second surface component 20. The heat transfer between adjacent components is mainly through contact heat conduction, although a small amount of heat may also be transferred through thermal radiation. In some embodiments, the second heat transfer component 50 may not include one or more of the circuit board 60, second shield 51, circuit board support 52, third thermally conductive medium 55, fourth thermally conductive medium 56, second thermally conductive element 53, and second buffer layer 54, and / or the second heat transfer component 50 may also include other layers; this application does not specifically limit this.

[0138] The above describes two heat transfer paths, L1 and L2, for the heat-generating device 30 within the electronic device 100. It should be noted that, in addition to these two heat transfer paths, the heat-generating device 30 may also have heat transfer paths 3, 4, 5, etc., but this application does not make any specific limitations on these.

[0139] In some embodiments, please refer to Figure 10a , Figure 10a This is a cross-sectional structural schematic diagram of an electronic device 100 provided in some embodiments of this application. The electronic device 100 shown in this embodiment is... Figure 4 The difference in the illustrated electronic device 100 is that, in this embodiment, a heat insulation structure 70 is provided within the first heat transfer component 40 in the heat transfer path L1. Optionally, the heat insulation structure 70 is disposed within the middle frame 41 of the first heat transfer component 40. The heat insulation structure 70 has a heat insulation function.

[0140] The orthographic projection of the heat insulation structure 70 on the first surface A overlaps with the orthographic projection of the heating device 30 on the first surface A. "Overlapping" includes four meanings: overlap, partial overlap with the whole, whole overlap with a part, and partial overlap with a part. Among these, "overlap" means that the two have equal areas and coincident edge contours.

[0141] When the entire orthographic projection of the heat insulation structure 70 on the first surface A overlaps with a portion of the orthographic projection of the heating device 30 on the first surface A, or when a portion of the orthographic projection of the heat insulation structure 70 on the first surface A overlaps with a portion of the orthographic projection of the heating device 30 on the first surface A, the number of heat insulation structures 70 arranged in the plane parallel to the middle frame 41 can be one or more. Figure 10a Only one example of the thermal insulation structure 70 being arranged in a plane parallel to the middle frame 41 is given.

[0142] In some other embodiments, please refer to Figure 10b , Figure 10b This is a cross-sectional structural diagram of an electronic device 100 provided in some embodiments of this application. In this embodiment, multiple heat insulation structures 70 are arranged in a plane parallel to the middle frame 41. These multiple heat insulation structures 70 can be arranged in a row or in an array. These multiple heat insulation structures 70 are used to block heat generated by the same heat-generating device 30. That is, the entire orthographic projection of the multiple heat insulation structures 70 on the first surface A overlaps with multiple portions of the orthographic projection of the heat-generating device 30 on the first surface A, or, portions of the orthographic projection of the multiple heat insulation structures 70 on the first surface A overlap with multiple portions of the orthographic projection of the heat-generating device 30 on the first surface A.

[0143] For ease of description, the following embodiments are all based on the premise that the number of thermal insulation structures 70 arranged in a plane parallel to the middle frame 41 is one.

[0144] In this way, by setting the heat insulation structure 70, the speed at which the heat from the heating device 30 is transferred to the first surface component 10 along the shortest branch path perpendicular to the first surface A in the heat transfer path L1 can be reduced.

[0145] Therefore, on the one hand, more heat emitted by the heating device 30 is transferred along other heat transfer paths of the heating device 30 (such as heat transfer path two L2), thereby increasing the heat transfer rate to other external surfaces of the electronic device 100 (such as the second surface B). This achieves the purpose of adjusting the heat transfer rate of multiple heat transfer paths, reducing the difference in heat transfer rate among multiple heat transfer paths, and making the heat from the heating device 30 evenly transferred to multiple external surfaces of the electronic device. This improves heat dissipation efficiency, avoids heat concentration, and enhances the user's thermal experience.

[0146] On the other hand, it allows more heat emitted by the heating device 30 to be transferred along other branch paths around the shortest branch path in the heat transfer path L1, thereby increasing the heat transfer rate to other areas around the area on the first surface A that is directly opposite the heating device 30. This improves the uniformity of heat transfer to each area on the first surface A, thereby further improving heat dissipation efficiency, avoiding heat concentration, and improving the user's thermal experience.

[0147] The shape of the heat insulation structure 70 in the cross section parallel to the first surface A can be square, circular, elliptical, triangular, rhomboid, irregular, etc., and is not specifically limited in the embodiments of this application.

[0148] To ensure that the heat insulation structure 70 is positioned on the component directly opposite the heating element 30, effectively isolating the heat generated by the heating element 30, in some embodiments, the component containing the heat insulation structure 70 in the first heat transfer assembly 40 has a first portion. The orthographic projection of the first portion onto the first surface A is a first projection, and the orthographic projection of the heating element 30 onto the first surface A is a second projection. The second projection is located within the first projection, and the distance from the edge of the second projection to the edge of the first projection is less than or equal to a preset threshold value equal to the maximum width of the second projection. The heat insulation structure is positioned within the first portion. This preset threshold value can be, for example, 1 / 4, 1 / 3, or 1 / 2 times, or other values ​​that effectively conduct heat from the heating element. In this way, the heat insulation structure 70 can be positioned on the component directly opposite the heating element 30, effectively isolating the heat generated by the heating element 30.

[0149] The following example uses the component containing the thermal insulation structure 70, the middle frame 41, to illustrate the above implementation method in detail. Please refer to... Figure 11and Figure 12 , Figure 11 for Figure 10a The front view of the inner frame 41 of the electronic device 100 is shown. Figure 12 for Figure 10a The diagram shows a front view of the first surface component 10 within the electronic device 100. In this embodiment, the middle frame 41 is the component containing the heat insulation structure 70, and the middle frame 41 has a first portion K1. The orthographic projection of the first portion K1 onto the first surface A is... Figure 12 The first projection T1 in (see Figure 12 The orthographic projection of the heating element 30 on the first surface A is... Figure 12 The second projection T2 in the diagram. Please refer to it carefully. Figure 12 The second projection T2 is located within the first projection T1. The distance D from the edge of the second projection T2 to the edge of the first projection T1 is less than or equal to a preset threshold of the maximum width of the second projection T2. ​​The heat insulation structure 70 is disposed within the first part K1. This preset threshold can be, for example, 1 / 4, 1 / 3, or 1 / 2 times, or other values ​​that effectively conduct heat from the heating device.

[0150] It should be noted that the above embodiments are only based on the fact that the component where the heat insulation structure 70 is located is the middle frame 41. The same applies when the component where the heat insulation structure 70 is located is the support structure in the display module 45 or the first adhesive layer 461b in the first heat-conducting component 46, which will not be described in detail here.

[0151] Based on the above embodiments, the component where the heat insulation structure 70 is located also has a second part, which is the part of the component where the heat insulation structure 70 is located other than the first part, and the second part is not provided with the heat insulation structure 70. In this way, the second part has better thermal conductivity, and more heat from the heating device 30 is conducted to other areas around the area of ​​the first surface A directly opposite the heating device 30, resulting in better heat dissipation performance.

[0152] The following example, using the component containing the thermal insulation structure 70 as the middle frame 41, further illustrates the above implementation method. Please refer to [link to previous text]. Figure 11 The middle frame 41 also has a second part K2, which is the part of the middle frame 41 other than the first part K1. The second part K2 is not provided with a heat insulation structure 70.

[0153] It should be noted that the above embodiments are only based on the fact that the component where the heat insulation structure 70 is located is the middle frame 41. The same applies when the component where the heat insulation structure 70 is located is the support structure in the display module 45 or the first adhesive layer 461b in the first heat-conducting component 46, which will not be described in detail here.

[0154] In some embodiments, please refer back to the reference. Figure 10aThe first surface A has a first region A1. The orthographic projection of the heating device 30 onto the first surface A is a second projection, and the first region A1 overlaps with the second projection. The second surface B has a second region B1. The orthographic projection of the heating device 30 onto the second surface B is a third projection, and the second region B1 overlaps with the third projection. The heat transfer rate from the heating device 30 to the first region A1 is equal to the heat transfer rate from the heating device 30 to the second region B1. In this way, the speed at which the heat generated by the heating device 30 during operation is transferred to the first surface A is equal to or approximately equal to the speed at which the heat is transferred to the second surface B. This improves the heat uniformity between the first surface A and the second surface B, increases heat dissipation efficiency, avoids heat concentration, and enhances the user's thermal experience.

[0155] The thermal insulation structure 70 is a structure with relatively low heat transfer efficiency, but it is not limited to a structure that does not transfer heat at all. It is sufficient that the heat transfer efficiency of the thermal insulation structure 70 is lower than that of the component in which it is located. For example, in... Figure 10a In the embodiment shown, the component where the heat insulation structure 70 is located is the middle frame 41. The heat insulation structure 70 refers to a structure whose heat transfer efficiency is lower than that of the middle frame 41.

[0156] The thermal insulation structure 70 includes, but is not limited to, one or more of the following: thermal insulation pores, thermal insulation aerogel, asbestos, rock wool, ceramic fiber paper, glass fiber wool, silicate, and vacuum board.

[0157] exist Figure 10a In the illustrated embodiment, the heat insulation structure 70 is a heat insulation pore, which is filled with air. Air is inexpensive and easy to implement. Of course, the heat insulation pore can also be filled with gases such as nitrogen, oxygen, or carbon dioxide; this application does not specifically limit this. Gases have low thermal conductivity, which can achieve better heat insulation effect, and are also inexpensive and easy to implement.

[0158] In some other embodiments, please refer to Figure 13 , Figure 13 This is a cross-sectional structural schematic diagram of an electronic device 100 provided in some embodiments of this application. The electronic device 100 shown in this embodiment is... Figure 10a The difference in the electronic device 100 shown is that, in this embodiment, the thermal insulation structure 70 is formed of at least one solid thermal insulation medium selected from thermal insulation aerogel, asbestos, rock wool, ceramic fiber paper, glass fiber wool, silicate, and vacuum plate. Compared to the gaseous thermal insulation medium in the thermal insulation pores, the thermal conductivity of various solid thermal insulation media differs significantly, which can meet the thermal insulation requirements of various different scenarios.

[0159] In some other embodiments, please refer to Figure 14 , Figure 14This is a cross-sectional structural schematic diagram of an electronic device 100 provided in some embodiments of this application. The electronic device 100 shown in this embodiment is... Figure 10a The difference in the electronic device 100 shown is that, in this embodiment, the heat insulation structure 70 includes a solid heat insulation medium and a gaseous heat insulation medium. The solid heat insulation medium includes, but is not limited to, at least one of heat insulation aerogel, asbestos, rock wool, ceramic fiber paper, glass fiber wool, silicate, and vacuum plate, while the gaseous heat insulation medium includes, but is not limited to, air, nitrogen, oxygen, carbon dioxide, etc.

[0160] Please see Figure 15 , Figure 15 for Figure 14 The schematic diagram of the cross-sectional structure of the electronic device 100 at the BB line is shown. In this embodiment, the solid heat insulation medium is arranged in a grid pattern, and the gaseous heat insulation medium is located between two adjacent grids.

[0161] In some other embodiments, please refer to Figure 16 , Figure 16 for Figure 14 The diagram shows another cross-sectional structure of the electronic device 100 at the BB line. In this embodiment, the solid thermal insulation medium is arranged in a grid pattern, and the gaseous thermal insulation medium is located within the grid.

[0162] It should be noted that the solid insulation medium and the gaseous insulation medium can be arranged in other ways within the insulation structure 70, and this application does not make specific limitations on this.

[0163] In other embodiments, the thermal insulation structure 70 may further include a liquid thermal insulation medium, which may be filled in the inner hole of the component or packaged in a separate container and installed inside the component. This application does not impose specific limitations in this regard.

[0164] The heat insulation structure 70 can be embedded inside the component, that is, the end of the heat insulation structure 70 near the heat-generating device 30, the end away from the heat-generating device 30, and the surrounding area are all covered by the material of the component.

[0165] For examples, please refer to Figure 10a When the heat insulation structure 70 is set inside the middle frame 41, the component where the heat insulation structure 70 is located is the middle frame 41. The heat insulation structure 70 is embedded inside the middle frame 41, that is, the end of the heat insulation structure 70 near the heating device 30, the end away from the heating device 30, and the surrounding area are all wrapped by the material of the middle frame 41.

[0166] Therefore, since the heat insulation structure 70 is not exposed on the surface of the component it is located on, it can ensure the consistency of the appearance material and shape of the component. At the same time, when the component where the heat insulation structure 70 is located is fixed to other surrounding components by adhesive, it can increase the bonding area and ensure the fixing strength. Moreover, given that the thickness of the component where the heat insulation structure 70 is located is fixed, embedding the heat insulation structure 70 into the interior of the component can reduce the height occupied by the heat insulation structure 70 inside the component and ensure the structural strength of the component.

[0167] In some other embodiments, please refer to Figure 17 , Figure 17 This is a cross-sectional structural schematic diagram of an electronic device 100 provided in some embodiments of this application. The electronic device 100 shown in this embodiment is similar to... Figure 10a The difference in the illustrated electronic device 100 is that, in this embodiment, the heat insulation structure 70 penetrates both the surface of the component near the heat-generating device 30 and the surface away from the heat-generating device 30. That is, one end of the heat insulation structure 70 near the heat-generating device 30 is located on the surface of the component near the heat-generating device 30, and the other end of the heat insulation structure 70 away from the heat-generating device 30 is located on the surface of the component away from the heat-generating device 30. Thus, when the heat insulation structure 70 is a heat-insulating vent, the heat-insulating vent is a through hole; it can also be considered as a recessed portion extending from the surface of the component near the heat-generating device 30 to the surface away from the heat-generating device 30, penetrating the surface of the component away from the heat-generating device 30; or it can be considered as a recessed portion extending from the surface of the component away from the heat-generating device 30 to the surface near the heat-generating device 30, penetrating the surface of the component near the heat-generating device 30. Given a fixed thickness of the component, setting a larger height for the thermal insulation structure 70 can improve thermal insulation performance while reducing manufacturing difficulty and cost.

[0168] In some other embodiments, please refer to Figure 18 , Figure 18 This is a cross-sectional structural schematic diagram of an electronic device 100 provided in some embodiments of this application. The electronic device 100 shown in this embodiment is similar to... Figure 10aThe difference in the illustrated electronic device 100 is that, in this embodiment, the heat insulation structure 70 penetrates the surface of the component near the heat-generating device 30, but does not penetrate the surface of the component away from the heat-generating device 30. That is, one end of the heat insulation structure 70 near the heat-generating device 30 is located on the surface of the component near the heat-generating device 30, while the other end of the heat insulation structure 70 away from the heat-generating device 30 is covered by the material of the component. When the heat insulation structure 70 is a heat insulation vent, it is a blind vent, or it can be considered a recessed portion extending from the surface of the component near the heat-generating device 30 towards the surface away from the heat-generating device 30. This ensures the heat insulation performance of the heat insulation structure 70, while maintaining the consistency of the shape and forming material of the surface of the component away from the heat-generating device 30, ensuring adhesion performance, and reducing manufacturing difficulty and cost.

[0169] In some other embodiments, please refer to Figure 19 , Figure 19 This is a cross-sectional structural schematic diagram of an electronic device 100 provided in some embodiments of this application. The electronic device 100 shown in this embodiment is similar to... Figure 10a The difference in the illustrated electronic device 100 is that, in this embodiment, the heat insulation structure 70 does not penetrate the surface of the component near the heat-generating device 30, but penetrates the surface of the component away from the heat-generating device 30. That is, the end of the heat insulation structure 70 away from the heat-generating device 30 is located on the surface of the component near the heat-generating device 30, and this end is covered by the material of the component. When the heat insulation structure 70 is a heat insulation vent, it is a blind vent, or it can be considered a recessed portion extending from the surface of the component away from the heat-generating device 30 towards the surface near the heat-generating device 30. This ensures the heat insulation performance of the heat insulation structure 70, while maintaining the consistency of the shape and forming material of the surface of the component near the heat-generating device 30, ensuring adhesion performance, and reducing manufacturing difficulty and cost.

[0170] It should be noted that the above descriptions of the placement of the thermal insulation structure 70 within the component are based on the premise that the thermal insulation structure 70 is an insulating vent. When the thermal insulation structure 70 is a solid or liquid insulating medium, it can also be placed in the same various ways, which will not be elaborated here. It should be noted that when the thermal insulation structure 70 is a liquid insulating medium, and at least one end of the thermal insulation structure 70 forms the outer surface of the component, the thermal insulation structure 70 must be encapsulated in a container before being installed into the component.

[0171] The accompanying drawings of the above embodiments are all based on the premise that the heat insulation structure 70 is disposed within the middle frame 41. The middle frame 41 has a large thickness and superior structural strength, providing better conditions for the placement of the heat insulation structure 70. Furthermore, the middle frame 41 will not deform or break during the processing of the heat insulation structure 70. Of course, the heat insulation structure 70 can also be disposed within other structural components in the heat transfer path L1.

[0172] For an example, please refer to Figure 20 , Figure 20 for Figure 4 This is another schematic diagram of the display module 45 in the electronic device 100. In this embodiment, the heat insulation structure 70 is disposed within the support layer 452 of the display module 45. Thus, the heat insulation structure 70 will not affect the display on the display panel 456.

[0173] For another example, please refer to Figure 21 , Figure 21 for Figure 4 This is another schematic diagram of the display module 45 in the electronic device 100 shown. In this embodiment, the heat insulation structure 70 is disposed within the buffer layer 453 of the display module 45. In this way, the heat insulation structure 70 will not affect the display of the display panel 456, and the buffer layer 453 is usually made of soft elastic materials such as foam, thus facilitating the processing of the heat insulation structure 70.

[0174] For another example, please refer to Figure 22 , Figure 22 for Figure 4 This is another schematic diagram of the display module 45 in the electronic device 100. In this embodiment, the heat insulation structure 70 is disposed within the planar layer 454 of the display module 45. Thus, the heat insulation structure 70 will not affect the display on the display panel 456.

[0175] For another example, please refer to Figure 23 , Figure 23 for Figure 4 This is another schematic diagram of the display module 45 in the electronic device 100. In this embodiment, the heat insulation structure 70 is disposed within the protective layer 455 of the display module 45. Thus, the heat insulation structure 70 will not affect the display on the display panel 456.

[0176] For another example, please refer to Figure 24 and Figure 25 , Figure 24 for Figure 4 This is a schematic diagram of another structure of the first heat-conducting element 46 in the electronic device 100 shown. Figure 25 for Figure 24An exploded view of the first stacked structure 461 within the first thermally conductive element 46 is shown. In this embodiment, the heat insulation structure 70 is disposed within the first adhesive layer 461b of the first thermally conductive element 46. This not only allows more heat emitted by the heating device 30 to be transferred along other branch paths around the shortest branch path in the heat transfer path L1, but also allows the heat to diffuse more evenly within the first thermally conductive material layer 461a of the first thermally conductive element 46, so that the heat can be transferred to other larger areas on the first surface A located around the area directly opposite the heating device 30, thereby further improving the heat uniformity transferred to various areas on the first surface A. The first thermally conductive material layer 461a does not need to be made of expensive graphene. This reduces costs while ensuring uniform heat distribution. Specifically, for the same thickness / shape, the cost of forming the first thermally conductive material layer 461a with inexpensive graphite and providing the heat insulation structure 70 within the first adhesive layer 461b is approximately half the cost of forming the first thermally conductive material layer 461a with graphene without providing the heat insulation structure 70.

[0177] In the above embodiments, the number of first adhesive layers 461b within the first heat-conducting element 46 can be multiple, where multiple layers refer to two or more layers. Based on this, the number of heat-insulating structures 70 can be one or more. When there is only one heat-insulating structure 70, it is disposed within one layer of the multiple first adhesive layers 461b; when there are multiple heat-insulating structures 70, they are respectively disposed within multiple layers of the multiple first adhesive layers 461b. Specifically, the number of heat-insulating structures 70 within the first heat-conducting element 46 can be selected according to the specific application scenario and the temperature difference between the first surface A and the second surface B, thereby achieving the purpose of adjusting the heat uniformity between the first surface A and the second surface B, as well as between different areas on the first surface A. Figure 24 and Figure 25 Only one example of a thermal insulation structure 70 is given, and this single thermal insulation structure 70 is disposed within a first adhesive layer 461b. Please refer to [link / reference]. Figure 26 , Figure 26 for Figure 4 This is another exploded view of the first stacked structure within the first heat-conducting element 46 of the electronic device 100 shown. In this embodiment, there are multiple heat insulation structures 70, and the multiple heat insulation structures 70 are respectively disposed within the multilayer first adhesive layer 461b.

[0178] Based on the above description, the heat insulation structure 70 can be disposed within at least one of the following: the middle frame 41, the support layer 452, the buffer layer 453, the flattening layer 454, the protective layer 455 of the display module 45, and the first adhesive layer 461b of the first heat-conducting element 46. Furthermore, the quantity, size, structure, and location of the heat insulation structure 70 disposed within the support layer 452, buffer layer 453, flattening layer 454, protective layer 455, the first adhesive layer 461b of the first heat-conducting element 46, or the first protective layer 462 of the display module 45 can be implemented with reference to the quantity, size, structure, and location of the heat insulation structure 70 disposed within the middle frame 41, and will not be elaborated upon here.

[0179] It should be noted that, in addition to being disposed within the middle frame 41, the support layer 452, buffer layer 453, flattening layer 454, protective layer 455, and the first adhesive layer 461b of the first thermal conductive element 46 of the display module 45, the heat insulation structure 70 can also be disposed within at least one of these layers, provided that it does not affect or approximately does not affect the function of the first shielding cover 42, the display panel 456, the polarizer 457, the transparent adhesive layer 458 in the display module 45, and the first thermally conductive material layer 461a and the first protective layer 462 of the first thermal conductive element 46. This application embodiment does not limit this.

[0180] It should be noted that the foregoing embodiments only describe the heat dissipation of a single heat-generating device 30. Within the electronic device 100, there can be multiple heat-generating devices 30. When there are multiple heat-generating devices 30, these devices can be multiple of a SOC, CPU, CHG management chip, power management chip, RAM, or ROM. Furthermore, when there are multiple heat-generating devices 30, each device 30 can utilize the aforementioned heat insulation structure 70 to improve heat dissipation efficiency. Based on this, the same heat insulation structure 70 can be used for two or more heat-generating devices 30 to improve heat dissipation efficiency and reduce structural complexity.

[0181] For an example, please refer to Figure 27 , Figure 27 This is a front view of an electronic device 100 provided in some embodiments of this application. In this embodiment, there are two heating devices 30, which share a single heat insulation structure 70. This reduces the structural complexity of the component where the heat insulation structure 70 is located.

[0182] For another example, please refer to Figure 28 , Figure 28This is a front view of an electronic device 100 provided in some embodiments of this application. In this embodiment, there are three heating elements 30. Two of the three heating elements 30 are close together and share a heat insulation structure 70, while the third heating element 30, which is farther away from the two heating elements 30, corresponds to a separate heat insulation structure 70. This reduces the structural complexity of the component where the heat insulation structure 70 is located while ensuring the structural strength of the component.

[0183] Based on the descriptions of the above embodiments, the following simulation experiment verifies the influence of the heat insulation structure 70 on the heat uniformity of the first surface A and the second surface B.

[0184] Specifically, this simulation experiment is in Figure 4 Based on the illustrated electronic device 100, a heat transfer coefficient in the heat transfer path L1 is gradually reduced by setting a heat insulation structure 70 within the first adhesive layer 461b of the first heat-conducting element 46 in the heat transfer path L1, and by adjusting the number of heat insulation structures 70 set within the first adhesive layer 461b. The temperature distribution diagrams of the first surface A and the second surface B of the simulated electronic device 100 under various heat transfer coefficients are shown below. Figures 29-32 .

[0185] For details, please refer to Figure 29 , Figure 29 for Figure 4 The diagram shows the heat distribution of the first surface A and the second surface B of the electronic device 100 without the heat insulation structure 70. Specifically, Figure 29 (a) in the diagram is the heat distribution diagram of the first surface A. Figure 29 (b) in the figure is the heat distribution diagram of the second surface B. In this embodiment, the heat transfer coefficient along the direction perpendicular to the first surface A in the heat transfer path L1 is 1. The highest temperature of the first surface A is 40.8℃, and the highest temperature of the second surface B is 38.4℃, with a temperature difference of 2.4℃. The uniformity of heat distribution is poor, the heat dissipation efficiency is low, and it also affects the user's thermal experience.

[0186] Please see Figure 30 , Figure 30 for Figure 4 The diagram shows the heat distribution of the first surface A and the second surface B in the electronic device 100 with a heat insulation structure 70 and a heat transfer coefficient of 0.1 along the direction perpendicular to the first surface A in the heat transfer path L1. Specifically, Figure 30 (a) in the diagram is the heat distribution diagram of the first surface A. Figure 30(b) in the diagram shows the heat distribution of the second surface B. In this embodiment, the highest temperature of the first surface A is 40.5°C, and the highest temperature of the second surface B is 39°C, with a temperature difference of 1.5°C. This optimizes the uniformity of heat distribution, improves heat dissipation efficiency to a certain extent, and enhances the user's thermal experience.

[0187] Please see Figure 31 , Figure 31 for Figure 4 The diagram shows the heat distribution of the first surface A and the second surface B in the electronic device 100 with a heat insulation structure 70 and a heat transfer coefficient of 0.06 along the direction perpendicular to the first surface A in the heat transfer path L1. Specifically, Figure 31 (a) in the diagram is the heat distribution diagram of the first surface A. Figure 31 (b) in the diagram shows the heat distribution of the second surface B. In this embodiment, the highest temperature of the first surface A is 40.3°C, and the highest temperature of the second surface B is 39°C, with a temperature difference of 1.3°C. This further optimizes the uniformity of heat distribution, improves heat dissipation efficiency, and enhances the user's thermal experience.

[0188] Please see Figure 32 , Figure 32 for Figure 4 The diagram shows the heat distribution of the first surface A and the second surface B in the electronic device 100 with a heat insulation structure 70 and a heat transfer coefficient of 0.02 along the direction perpendicular to the first surface A in the heat transfer path L1. Specifically, Figure 32 (a) in the diagram is the heat distribution diagram of the first surface A. Figure 32 (b) in the diagram shows the heat distribution of the second surface B. In this embodiment, the highest temperature of the first surface A is 39.8°C, and the highest temperature of the second surface B is 39.3°C, with a temperature difference of 0.5°C. This further optimizes the uniformity of heat distribution, improves heat dissipation efficiency, and enhances the user's thermal experience.

[0189] according to Figures 29-32 As shown in the simulation diagram, by setting the heat insulation structure 70 in the heat transfer path L1, the heat distribution uniformity of the first surface A and the second surface B can be improved, the heat dissipation efficiency can be increased, and the user's thermal experience can be enhanced.

[0190] Please see Figure 33 , Figure 33 The graphs showing the highest temperature of the first surface A, the highest temperature of the second surface B, and the temperature difference between the two in the electronic device 100 provided in some embodiments of this application, are as a function of the heat transfer coefficient. Figure 33 The horizontal axis represents the logarithm of the heat transfer coefficient; the left vertical axis represents the temperature difference in °C; and the right vertical axis represents the highest temperature in °C. Figure 33It can be seen that, within a certain range, as the number of insulation structures 70 increases, the heat transfer coefficient along the direction perpendicular to the first surface A in the heat transfer path L1 gradually decreases, the temperature difference between the first surface A and the second surface B decreases, and the heat distribution uniformity becomes better. Based on this, an appropriate number of insulation structures 70 can be selected to minimize the temperature difference between the first surface A and the second surface B, thereby improving the heat distribution uniformity of the first surface A and the second surface B.

[0191] The above describes how the heat uniformity of the first surface A and the second surface B can be improved by setting a heat insulation structure 70 in heat transfer path L1. Based on this, at least one component in heat transfer path L2 can be replaced with a component with a higher thermal conductivity. For example, the material of the second thermally conductive material layer within the second thermally conductive element 53 in heat transfer path L2 can be replaced with at least one of graphite and graphene, which have higher thermal conductivity. This can increase the heat transfer rate of heat transfer path L2, thereby further reducing the difference between the heat transfer rates of heat transfer path L1 and heat transfer path L2, resulting in more uniform heat transfer to the first surface A and the second surface B.

[0192] Please see Figure 34 and Figure 35 , Figure 34 This is a cross-sectional structural schematic diagram of an electronic device 100 provided in some embodiments of this application. Figure 35 for Figure 34 This is a partial enlarged view of region II in the electronic device 100 shown. In this embodiment, the electronic device 100 is also a mobile phone. The first surface component 10 is a back cover, and the second surface component 20 is a front cover. The first surface component 10 has a first surface A, and the second surface component 20 has a second surface B. The first surface A is the bottom surface, and the second surface A is the top surface. Within the electronic device 100, the heat-generating device 30 has at least two heat transfer paths, which are heat transfer path three L3 and heat transfer path four L4 as described below.

[0193] Heat transfer path 3 L3: The heat generated by the heating device 30 when it is working is transferred to the first surface component 10, and heat is exchanged with the outside air on the first surface A of the first surface component 10.

[0194] In some embodiments, a first thermally conductive component 40 is provided between the heating device 30 and the first surface component 10. The first thermally conductive component 40 includes a circuit board 60, a second shield 51, a circuit board support 52, a first thermally conductive element 46, and a second buffer layer 54. The heat transfer path from the heating device 30 to the first surface component 10 via the first thermally conductive component 40 is as follows: heating device 30 → circuit board 60 → third thermally conductive medium 55 → second shield 51 → fourth thermally conductive medium 56 → circuit board support 52 → first thermally conductive element 46 → second buffer layer 54 → first surface component 10. The heat transfer between adjacent components is mainly through contact heat conduction, although a small amount of heat can also be transferred through thermal radiation. In some embodiments, the first thermally conductive component 40 may not include one or more of the circuit board 60, second shield 51, circuit board support 52, third thermally conductive medium 55, fourth thermally conductive medium 56, first thermally conductive element 46, and second buffer layer 54, and / or the first thermally conductive component 40 may also include other layers. This application does not specifically limit this.

[0195] In the above embodiments, the structure of the first heat-conducting element 46 can be the same as... Figure 6 or Figure 7 The structure of the first heat-conducting component 46 shown is the same, and will not be described in detail here.

[0196] Heat transfer path 4 L4: The heat generated by the heating device 30 when it is working is transferred to the second surface component 20, and heat is exchanged with the outside air on the second surface B of the second surface component 20.

[0197] In some embodiments, the heating device 30 is in direct contact with the second surface component 20 for heat conduction.

[0198] In other embodiments, please refer to Figure 35 A second heat transfer assembly 50 is provided between the heating device 30 and the second surface component 20. The second heat transfer assembly 50 includes a middle frame 41, a first shield 42, a first thermally conductive medium 43, a second thermally conductive medium 44, a display module 45, and a second thermally conductive element 53. The heat transfer path from the heating device 30 to the second surface component 20 via the second heat transfer assembly 50 is as follows: heating device 30 → first thermally conductive medium 43 → first shield 42 → second thermally conductive medium 44 → middle frame 41 → second thermally conductive element 53 → display module 45 → second surface component 20. The heat transfer between adjacent components is mainly through contact heat conduction, although a small amount of heat can also be transferred through thermal radiation. In some embodiments, the second heat transfer assembly 50 may not include one or more of the middle frame 41, first shield 42, first thermally conductive medium 43, second thermally conductive medium 44, display module 45, and second thermally conductive element 53, and / or the second heat transfer assembly 50 may also include other layers. This application does not specifically limit this.

[0199] In the above embodiments, the second heat-conducting element 53 can be connected with... Figure 9 The second heat-conducting component 53 shown has the same structural form, and will not be described in detail here.

[0200] Please continue reading. Figure 35 A heat insulation structure 70 is provided within the first heat transfer component 40 in heat transfer path L3. Optionally, the heat insulation structure 70 is disposed within the circuit board support 52 in the first heat transfer component 40. The heat insulation structure 70 has a heat insulation function. The orthographic projection of the heat insulation structure 70 on the first surface A overlaps with the orthographic projection of the heating device 30 on the first surface A.

[0201] In this way, by setting the heat insulation structure 70, the speed at which the heat from the heating device 30 is transferred to the first surface component 10 along the shortest branch path perpendicular to the first surface A in the heat transfer path three L3 can be reduced.

[0202] Therefore, on the one hand, more heat emitted by the heating device 30 is transferred along other heat transfer paths of the heating device 30 (such as heat transfer path four L4), thereby increasing the heat transfer rate to other external surfaces of the electronic device 100 (such as the second surface B). This achieves the purpose of adjusting the heat transfer rate of multiple heat transfer paths, reducing the difference in heat transfer rate among multiple heat transfer paths, and making the heat from the heating device 30 evenly transferred to multiple external surfaces of the electronic device. This improves heat dissipation efficiency, avoids heat concentration, and enhances the user's thermal experience.

[0203] On the other hand, more heat emitted by the heating device 30 is transferred along other branch paths around the shortest branch path in the heat transfer path three L3, thereby increasing the heat transfer rate to other areas around the area on the first surface A that is directly opposite the heating device 30. This improves the heat uniformity transferred to each area on the first surface A, thereby further improving the heat dissipation efficiency, avoiding heat concentration, and improving the user's thermal experience.

[0204] Figure 35 Taking the example of the heat insulation structure 70 being installed on the circuit board support 52, the heat insulation structure 70 will not interfere with the circuitry within the electronic device 100. Furthermore, the circuit board support 52 has high structural strength, preventing deformation or breakage during the installation of the heat insulation structure 70. In addition, the heat insulation structure 70 can also be installed in other components within the heat transfer path L3.

[0205] For an example, please refer to Figure 36 , Figure 36This is a cross-sectional structural diagram of an electronic device 100 provided in some embodiments of this application. In this embodiment, the heat insulation structure 70 is disposed within the second buffer layer 54. The second buffer layer 54 is typically made of a soft, elastic material such as foam, which has low hardness, facilitating the placement of the heat insulation structure 70.

[0206] In other embodiments, the heat insulation structure 70 may also be disposed within the first adhesive layer 461b in the first heat-conducting element 46.

[0207] Based on the above description, the heat insulation structure 70 can be disposed within the circuit board support 52, the second buffer layer 54, and the first adhesive layer 461b of the first thermal conductive element 46. Furthermore, there can be multiple heat insulation structures 70, each disposed within multiple of the first adhesive layers 461b of the circuit board support 52, the second buffer layer 54, and the first thermal conductive element 46. When there are multiple first adhesive layers 461b in the first thermal conductive element 46, the multiple heat insulation structures 70 can also be disposed within multiple layers of first adhesive layers 461b in the first thermal conductive element 46.

[0208] It should be noted that the quantity, size, structure and position of the heat insulation structure 70 when it is disposed in the circuit board support 52, the second buffer layer 54 and the first adhesive layer 461b of the first heat-conducting component 46 can be implemented with reference to the quantity, size, structure and position of the heat insulation structure 70 when it is disposed in the middle frame 41 in the foregoing embodiment, and will not be repeated here.

[0209] The above describes how the heat uniformity of the first surface A and the second surface B can be improved by setting a heat insulation structure 70 in heat transfer path three L3. Based on this, at least one component in heat transfer path four L4 can be replaced with a component with a higher thermal conductivity. For example, the material of the second thermally conductive material layer within the second thermally conductive element 53 in heat transfer path four L4 can be replaced with at least one of graphite and graphene, which have higher thermal conductivity. This can increase the heat transfer rate of heat transfer path four L4, thereby further reducing the difference between the heat transfer rates of heat transfer path three L3 and heat transfer path four L4, resulting in more uniform heat transfer to the first surface A and the second surface B.

[0210] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0211] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, comprising: include: A first surface component, the first surface component including a first surface, the first surface forming an outer surface of the electronic device; A heating element, wherein the heating element is located on the side of the first surface component opposite to the first surface; A first heat transfer component is located between the heating device and the first surface component. The heating device is thermally connected to the first surface component via the first heat transfer component. The first heat transfer component contains a heat insulation structure, and the orthographic projection of the heat insulation structure onto the first surface overlaps with the orthographic projection of the heating device onto the first surface. The first heat transfer component includes a first thermally conductive element; the first thermally conductive element includes a first stacked structure, the first stacked structure being formed by alternating layers of a first thermally conductive material and a first adhesive layer, and the heat insulation structure being disposed within the first adhesive layer; In the first heat transfer assembly, the component containing the heat insulation structure has a first part, the orthographic projection of the first part onto the first surface is a first projection, the orthographic projection of the heating device onto the first surface is a second projection, the second projection is located within the first projection, the distance from the edge of the second projection to the edge of the first projection is less than or equal to 1 / 2 times the maximum width of the second projection, and the heat insulation structure is disposed within the first part.

2. The electronic device of claim 1, wherein, The material of the first thermally conductive layer includes at least one of graphite, graphene, copper, and copper alloys.

3. The electronic device of claim 2, wherein, The first adhesive layer consists of multiple layers, and the heat insulation structure consists of multiple layers, with each heat insulation structure disposed within the multiple layers of the first adhesive layer.

4. The electronic device of claim 1, wherein, The first stacked structure is formed by the first adhesive layer at one end along the stacking direction of the first thermally conductive material layer and the first adhesive layer.

5. The electronic device according to claim 4, characterized in that, The first adhesive layer forming one end of the first stacked structure has a third surface, the third surface forming an outer surface of the first stacked structure, and the first stacked structure further includes a fourth surface, the fourth surface being opposite to the third surface; The first heat-conducting component further includes a first protective layer, which is disposed on the fourth surface of the first stacked structure.

6. The electronic device according to any one of claims 1-5, characterized in that, The first surface component is a front cover plate.

7. The electronic device according to claim 6, characterized in that, The first heat transfer component also includes a middle frame; The middle frame is located between the first heat-conducting component and the heat-generating device, and the middle frame is stacked with the first surface component. The heat insulation structure is disposed inside the middle frame.

8. The electronic device according to claim 6, characterized in that, The electronic device further includes a display module located between the first heat-conducting component and the first surface component. The display module includes a display panel and a support structure. The first heat transfer component also includes the support structure, and the heat insulation structure is disposed within the support structure.

9. The electronic device according to claim 8, characterized in that, The support structure includes a support layer, a first buffer layer, a flattening layer, and a protective layer, and the heat insulation structure is disposed within at least one of the support layer, the first buffer layer, the flattening layer, and the protective layer.

10. The electronic device according to any one of claims 1-5, characterized in that, The first surface component is a back cover.

11. The electronic device according to claim 10, characterized in that, The electronic device also includes a circuit board and a circuit board support; Both the circuit board and the circuit board support are located between the heating device and the first heat-conducting component, and the heating device is disposed on the circuit board, while the circuit board support is disposed on the side of the circuit board away from the heating device. The first heat transfer component also includes a circuit board support, and the heat insulation structure is disposed within the circuit board support.

12. The electronic device according to claim 10, characterized in that, The first heat transfer component also includes a second buffer layer; The second buffer layer is disposed between the first heat-conducting component and the first surface component, and the heat insulation structure is disposed within the second buffer layer.

13. The electronic device according to any one of claims 1-5, characterized in that, The thermal insulation structure includes at least one of the following: thermal insulation pores, thermal insulation aerogel, asbestos, rock wool, ceramic fiber paper, glass fiber cotton, silicate, and vacuum plate.

14. The electronic device according to any one of claims 1-5, characterized in that, The component containing the heat insulation structure also has a second part, which is the part of the component containing the heat insulation structure other than the first part, and the second part is not provided with the heat insulation structure.

15. The electronic device according to any one of claims 1-5, characterized in that, Also includes: A second surface component, the second surface component including a second surface, the second surface forming another outer surface of the electronic device; The heating element is also located on the side of the second surface component that is opposite to the second surface, and the heating element is thermally connected to the second surface component.

16. The electronic device according to claim 15, characterized in that, Also includes: The second heat transfer component is located between the heating device and the second surface component, and the heating device is thermally connected to the second surface component via the second heat transfer component.

17. The electronic device according to claim 16, characterized in that, The second heat transfer component includes a second heat-conducting element; The second thermal conductive component includes a second stacked structure, which is formed by alternating layers of a second thermally conductive material and a second adhesive layer.

18. The electronic device according to claim 17, characterized in that, The material of the second thermally conductive layer includes at least one of graphite and graphene.

19. The electronic device according to claim 15, characterized in that, The first surface includes a first region, and the orthographic projection of the heating device on the first surface is a second projection, wherein the first region overlaps with the second projection; The second surface includes a second region, and the orthographic projection of the heating device on the second surface is a third projection, the second region overlapping with the third projection; The heat transfer rate from the heating device to the first region is equal to the heat transfer rate from the heating device to the second region.

20. The electronic device according to any one of claims 1-5, characterized in that, The heat-generating device includes at least one of SOC, CPU, CHG management chip, power management chip, RAM, and ROM.

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